JP2008074408A - Plastic sheet and carrier tape - Google Patents
Plastic sheet and carrier tape Download PDFInfo
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- JP2008074408A JP2008074408A JP2006252134A JP2006252134A JP2008074408A JP 2008074408 A JP2008074408 A JP 2008074408A JP 2006252134 A JP2006252134 A JP 2006252134A JP 2006252134 A JP2006252134 A JP 2006252134A JP 2008074408 A JP2008074408 A JP 2008074408A
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本発明は、基材層と、該基材層の少なくとも片面に導電層を積層した、帯電防止性を有し、機械的強度、成形加工性等に優れた電子部品包装用プラスチックシート、及び、そのプラスチックシートから圧空成形、真空成形、真空圧空成形、プレス成形等熱成形により成形されたキャリアテープに関する。 The present invention comprises a base material layer, a plastic sheet for packaging electronic parts having an antistatic property and a superior mechanical strength, molding processability, and the like, wherein a conductive layer is laminated on at least one surface of the base material layer, and The present invention relates to a carrier tape molded from the plastic sheet by thermoforming such as pressure forming, vacuum forming, vacuum pressure forming, press forming.
ＩＣやコンデンサー等の電子部品の生産の合理化、少量多品種生産に対応して、その表面実装化が進んでおり、高密度、高精度実装、生産性、高速化を兼ね備えた実装設備が求められ、電子部品を包装、保管、搬送し、さらに、回路基板に実装するために整列させ、取り出しに適した包装形態としてキャリアテープが注目を集めている。
最近、コスト低減の面からキャリアテープ成形用のプラスチックシートに対して薄肉化が求められるとともに、薄肉化したプラスチックシートから成形されたキャリアテープが破断や変形等を生じることなく、そのポケット部に収納した電子部品を保護して、保管できることが要求されている。
又、電子部品を回路基板に実装する速度を高める要求に対応して、電子部品を収納したキャリアテープが装着機のテープフィーダでピッチ送りされ、移載ヘッドで収納された電子部品をピックアップして取り出す搬送工程において、該キャリアテープの詰まり、変形、折り曲げ、破断等が極力少ないことが求められている。
In response to rationalization of the production of electronic parts such as ICs and capacitors, and small volume, multi-product production, surface mounting is progressing, and mounting equipment that combines high density, high precision mounting, productivity, and high speed is required. The carrier tape is attracting attention as a packaging form suitable for packaging, storing and transporting electronic components, and aligning them for mounting on a circuit board and taking them out.
Recently, from the viewpoint of cost reduction, it is required to reduce the thickness of the plastic sheet for carrier tape molding, and the carrier tape molded from the thinned plastic sheet can be stored in the pocket without causing breakage or deformation. It is required to protect and store stored electronic components.
Also, in response to the demand to increase the speed of mounting electronic components on the circuit board, the carrier tape containing the electronic components is pitch-fed by the tape feeder of the mounting machine, and the electronic components stored by the transfer head are picked up. In the carrying-out process, the carrier tape is required to have as little clogging, deformation, bending, and breakage as possible.
電子部品の分野では、プラスチックシートは、薄肉化しても破断や割れ等が生じることなく、又、プラスチックシートから成形されたキャリアテープが変形、破断しないための機械的強度が求められる。
又、キャリアテープの包装容器であるポケットの肉厚が均一であり、そのポケットコーナー部がきちんと成形されていること、プラスチックシートをテープ状にスリット加工するときや、穴打抜き加工するときにその端面にヒゲ、バリの発生がなく、良好な成型加工性と打抜き加工性を有する必要がある。
さらに、プラスチックシートは、キャリアテープに熱成形加工するとき切断や割れがないこと、穴打抜き加工をするとき切断、クラックの発生等の事故を生じないことが必要である。すなわち、プラスチックシートは、ある一定水準の機械的強度、耐衝撃性、耐折曲強度及び、成型加工性を有する必要がある。
In the field of electronic components, a plastic sheet is required to have mechanical strength so that it does not break or break even when it is thinned, and the carrier tape molded from the plastic sheet does not deform or break.
Also, the thickness of the pocket, which is a packaging container for carrier tape, is uniform, and the pocket corners are properly molded, and the end face of the plastic sheet when slitting into a tape or punching holes In addition, there is no need to have beards or burrs, and it is necessary to have good moldability and punchability.
Furthermore, the plastic sheet needs to be free from cutting and cracking when thermoformed on the carrier tape, and to be free from accidents such as cutting and cracking when punching holes. That is, the plastic sheet needs to have a certain level of mechanical strength, impact resistance, bending strength, and moldability.
従来、ＡＢＳ樹脂やポリスチレン系樹脂にカーボンブラックを分散したシートから成形されるキャリアテープが使用されてきたが、このキャリアテープは、帯電防止効果は良好であるが、機械的強度が不充分であり、さらに、変形し、折曲り、破断等が発生し易いという欠点があった。
又、ＡＢＳ樹脂やポリスチレン系樹脂の基材層の両面に、耐衝撃性ポリスチレン樹脂にカーボンブラックを分散した導電層を積層した、薄肉のキャリアテープにおいても同様の更なる機械的強度が求められている。
これらの問題を解決するため、例えば、特許文献１には、メタクリル酸メチル重合体若しくはエチレンとメタクリル酸メチル共重合体を含有するポリスチレン系樹脂からなるシート基材の片面若しくは両面に、カーボンブラックを含むポリスチレン系樹脂を積層した導電性複合プラスチックシートが提案されているが、そのシートより成形されるキャリアテープは、搬送において変形等が発生する場合がある。
Conventionally, a carrier tape formed from a sheet in which carbon black is dispersed in ABS resin or polystyrene resin has been used. This carrier tape has a good antistatic effect, but has insufficient mechanical strength. Furthermore, there is a drawback that deformation, bending, breakage and the like are likely to occur.
In addition, similar mechanical strength is required for a thin carrier tape in which conductive layers in which carbon black is dispersed in impact-resistant polystyrene resin are laminated on both surfaces of a base material layer of ABS resin or polystyrene resin. Yes.
In order to solve these problems, for example, Patent Document 1 discloses that carbon black is applied to one or both sides of a sheet base material made of a methyl methacrylate polymer or a polystyrene-based resin containing ethylene and a methyl methacrylate copolymer. A conductive composite plastic sheet laminated with a polystyrene-based resin has been proposed. However, a carrier tape formed from the sheet may be deformed during conveyance.
本発明は、特定の樹脂組成物からなる基材層の表面に導電層を積層して、帯電防止性を有し、機械的強度に優れたプラスチックシート、及び、薄肉であっても、そのポケットに収納した電子部品を包装して保管し、回路基板に実装するときに、変形等がないキャリアテープを提供することを目的とする。 The present invention provides a plastic sheet having an antistatic property and excellent mechanical strength by laminating a conductive layer on the surface of a base material layer made of a specific resin composition, and a pocket even if it is thin. It is an object of the present invention to provide a carrier tape that is not deformed or the like when packaging and storing electronic components housed in a package and mounting the circuit board on a circuit board.
本発明は、ＡＢＳ樹脂１００重量部に対し、ＡＳ樹脂及び／又はＭＳ樹脂を１〜２０重量部含む樹脂組成物を基材層とし、該基材層の少なくとも片面に導電層を積層したことを特徴とする電子部品放送用プラスチックシートである。
さらに、本発明は、ＡＢＳ樹脂１００重量部に対し、ＡＳ樹脂及び／又はＭＳ樹脂を１〜２０重量部含む樹脂組成物を基材層とし、該基材層の少なくとも片面に導電層を積層したプラスチックシートから成形されたことを特徴とするキャリアテープである。
In the present invention, a resin composition containing 1 to 20 parts by weight of AS resin and / or MS resin is used as a base layer with respect to 100 parts by weight of ABS resin, and a conductive layer is laminated on at least one side of the base layer. This is a plastic sheet for broadcasting electronic parts.
Furthermore, in the present invention, a resin composition containing 1 to 20 parts by weight of AS resin and / or MS resin is used as a base layer with respect to 100 parts by weight of ABS resin, and a conductive layer is laminated on at least one side of the base layer. A carrier tape formed from a plastic sheet.
本発明のプラスチックシートは、機械的強度、耐衝撃性、成形加工性に優れ、薄肉化しても、その成形品であるキャリアテープは、剛性が大きく、そのポケットに収納したＩＣ又は電子部品を保護して保管でき、回路基板に高速で実装するとき、高い速度でキャリアテープを変形させず搬送することができる。
さらに、穴打抜き加工においてヒゲ、バリの発生が少なく、切断、クラックの発生がなく、キャリアテープの熱成形においてシールに割れ等の発生がなく、ポケットを肉厚が均一で、そのコーナー部がきちんと成形されたキャリアテープを成形できる。
The plastic sheet of the present invention is excellent in mechanical strength, impact resistance and molding processability. Even if it is thinned, the carrier tape, which is a molded product, has high rigidity and protects ICs or electronic parts stored in the pockets. When mounting on a circuit board at a high speed, the carrier tape can be transported at a high speed without being deformed.
In addition, there are few whiskers and burrs in the hole punching process, no cutting and cracking, no cracks in the seal in thermoforming of the carrier tape, uniform pocket thickness, and the corners are neat. A molded carrier tape can be formed.
以下、本発明を更に詳細に説明する。
本発明のプラスチックシートの基材層は、ＡＢＳ樹脂１００重量部に対し、ＡＳ樹脂及び／またはＭＳ樹脂を１〜２０重量部含む樹脂組成物からなる。
ＡＢＳ樹脂はアクリロニトリル−ブタジエン−スチレンの３成分を主体とした共重合体を主成分とするものをいう。
ＡＳ樹脂は、アクリロニトリル−スチレンの２成分を主体とした共重合体を主成分とするものをいう。ＭＳ樹脂は、メタクリレート−スチレンの２成分を主体とした共重合体を主成分とするものをいう。
ＡＳ樹脂及び／又はＭＳ樹脂が、ＡＢＳ樹脂１００重量部に対し１重量部未満の場合、高い機械的強度を有するプラスチックシートが得られず、薄肉化したシートから成形されたキャリアテープは、変形し、折曲り、破断等が発生しやすくなる。
ＡＳ樹脂及び／又はＭＳ樹脂がＡＢＳ樹脂１００重量部に対し、２０重量部を超える場合は、高い耐衝撃性を有するプラスチックシートが得られず、スリット加工や穴打抜き加工時にヒゲ、バリの発生があり、割れ等が発生し易くなる。又、シートから成形されたキャリアテープは、収納したＩＣ又は電子部品を保管、搬送時に破断や割れ等が発生し易くなる。
Hereinafter, the present invention will be described in more detail.
The base material layer of the plastic sheet of this invention consists of a resin composition which contains 1-20 weight part of AS resin and / or MS resin with respect to 100 weight part of ABS resin.
The ABS resin is a resin mainly composed of a copolymer mainly composed of three components of acrylonitrile-butadiene-styrene.
The AS resin refers to a resin mainly composed of a copolymer mainly composed of two components of acrylonitrile-styrene. The MS resin is a resin mainly composed of a copolymer mainly composed of two components of methacrylate-styrene.
When AS resin and / or MS resin is less than 1 part by weight with respect to 100 parts by weight of ABS resin, a plastic sheet having high mechanical strength cannot be obtained, and the carrier tape formed from the thinned sheet is deformed. , Bending, breaking, etc. are likely to occur.
When AS resin and / or MS resin exceeds 20 parts by weight with respect to 100 parts by weight of ABS resin, a plastic sheet having high impact resistance cannot be obtained, and whiskers and burrs are generated during slitting and hole punching. Yes, cracks and the like are likely to occur. In addition, the carrier tape formed from the sheet is likely to be broken or cracked during storage and transportation of the stored IC or electronic component.
表面の導電層となる導電性組成物に添加されるカーボンブラックは、アセチレンブラック、ファーネスブラック、ケッチェンブラック等が好ましく用いられる。又、添加量は、表面導電層に使用される樹脂１００重量部に対して、１〜３０重量部、好ましくは５〜２５重量部である。カーボンブラックの添加量が、１重量部未満では表面導電層の表面抵抗が上昇するためＩＣ製品包装容器としての性能を損ない、３０重量部を超えると樹脂との均一な分散性が低下し、導電性組成物の押出加工が困難となり、機械的強度が低下する。プラスチックシートの表面抵抗値は、１０３〜１０１０Ωであることが好ましい。 As the carbon black added to the conductive composition serving as the conductive layer on the surface, acetylene black, furnace black, ketjen black, or the like is preferably used. Moreover, the addition amount is 1 to 30 parts by weight, preferably 5 to 25 parts by weight with respect to 100 parts by weight of the resin used for the surface conductive layer. If the amount of carbon black added is less than 1 part by weight, the surface resistance of the surface conductive layer increases, so that the performance as an IC product packaging container is impaired. The extruding process of the adhesive composition becomes difficult and the mechanical strength is lowered. The surface resistance value of the plastic sheet is preferably 10 3 to 10 10 Ω.
導電層に使用される樹脂としては、ＡＢＳ樹脂、ポリスチレン系樹脂等が好ましく、ポリスチレン系樹脂が、他の樹脂に比べカーボンブラックを多量に添加しても流動性に著しい低下がないこと、寸法安定性に優れる等の利点を有する。
プラスチックシートは、通常、厚みの大部分を占める基材層に機械的強度、耐衝撃性、耐折曲強等の物性を持たせることができ、導電層に基材層に要求される物性をそれほど強く要求されなくても良い場合がある。
本発明の樹脂組成物及び導電性組成物に対して、必要に応じて組成物の流動特性、及び成形品の力学特性を改善するために、滑剤、可塑剤、加工助剤、補強助剤等の各種の添加剤や他の樹脂成分を添加することができる。
As the resin used for the conductive layer, ABS resin, polystyrene resin, etc. are preferable, and the polystyrene resin has no significant decrease in fluidity even when a large amount of carbon black is added compared to other resins. It has advantages such as excellent properties.
Plastic sheets usually have physical properties such as mechanical strength, impact resistance, and bending strength in the base material layer that occupies most of the thickness, and the physical properties required of the base material layer in the conductive layer. There are cases where it is not necessary to be so strongly demanded.
For the resin composition and conductive composition of the present invention, a lubricant, a plasticizer, a processing aid, a reinforcing aid, etc., in order to improve the flow properties of the composition and the mechanical properties of the molded product as necessary. These various additives and other resin components can be added.
なお、本発明における、基材層となる樹脂組成物は、圧空成形、真空成形、押出成形、射出成形等の公知の方法により、電子部品の容器、例えば、マガジン、トレー等に用いることができる。 In the present invention, the resin composition to be the base material layer can be used for containers of electronic parts, for example, magazines, trays, and the like by known methods such as pressure forming, vacuum forming, extrusion forming, injection molding and the like. .
プラスチックシートは、基材層及び導電層となる原材料を、押出機等によりシート又はフィルム状に成形した後、熱ラミネート法、ドライラミネート法、押出ラミネート法等により積層して得ることが可能であり、フィードブロック法、マルチマニホールド法等の公知の共押出法により一体成形して得ることも可能である。
得られた基材層の少なくとも片面に、導電性塗料を塗工して導電層を得ることもできる。樹脂分としては、特に制限はなく、一般的なもの、例えば、ポリウレタン、アクリル樹脂等が用いられる。
The plastic sheet can be obtained by forming the raw material to be the base layer and the conductive layer into a sheet or film shape by an extruder or the like and then laminating by a heat laminating method, dry laminating method, extrusion laminating method, etc. It is also possible to obtain by integral molding by a known coextrusion method such as a feed block method or a multi-manifold method.
A conductive layer can also be obtained by applying a conductive paint on at least one side of the obtained base material layer. There is no restriction | limiting in particular as a resin part, For example, a general thing, for example, a polyurethane, an acrylic resin, etc. are used.
プラスチックシートの基材層の厚さは、キャリアテープに用いる場合、装填する電子部品の大きさ及び重量に応じ適宜変更可能であるが、一般に０．１〜０．５ｍｍである。０．１ｍｍ未満ではシートを成形して得られるキャリアテープとしての剛性等の機械的強度が不足し、０．５ｍｍを超えると機械的強度が過剰であり経済的でなく、熱成形による成形が困難となる場合がある。
導電層の厚さは、３〜５０μｍが好ましい。５０μｍを超えてもそれに相応した効果の向上が得られず、経済的でなく、３μｍ未満では充分な帯電防止効果が得られない。
When used for a carrier tape, the thickness of the base layer of the plastic sheet can be appropriately changed according to the size and weight of the electronic component to be loaded, but is generally 0.1 to 0.5 mm. If it is less than 0.1 mm, the mechanical strength such as rigidity as a carrier tape obtained by molding the sheet is insufficient, and if it exceeds 0.5 mm, the mechanical strength is excessive and not economical, and it is difficult to form by thermoforming. It may become.
The thickness of the conductive layer is preferably 3 to 50 μm. If the thickness exceeds 50 μm, the corresponding effect cannot be improved, and it is not economical, and if it is less than 3 μm, a sufficient antistatic effect cannot be obtained.
キャリアテープは、通常、プラスチックシートを、搬送するための送り穴を打抜き加工し、輻射ヒータ加熱、熱風加熱、又は熱板接触加熱して所定の形状、寸法のポケットを真空成形、圧空成形、真空・圧空成形、又はプレス成形した後、幅が８〜５６ｍｍのサイズの所定のテープ状にスリット加工して製造される。 Carrier tape is usually formed by punching a feed hole for transporting a plastic sheet and heating a radiation heater, hot air, or hot plate to heat a pocket of a predetermined shape and size, vacuum forming, pressure forming, vacuum -After pressure forming or press forming, it is manufactured by slitting into a predetermined tape shape having a width of 8 to 56 mm.
ポケットに電子部品が収納した後、蓋体であるカバーテープでシールして密閉されたキャリアテープは、リールに巻き取られた状態で保管される。
電子部品を回路基板に実装するときに、例えば、装着機のテープフィーダにキャリアテープを巻き取ったリールを設置し、テープフィーダのスプロケット部材の搬送爪をキャリアテープの送り穴に係合させ、スプロケット部材を間欠回転させることにより、キャリアテープは順々に送り出されながらカバーテープが剥離される。そして、電子部品はテープフィーダの移載ヘッドで吸着、ピックアップされ、回路基板に配置され、実装される。
キャリアテープを搬送するとき、特にキャリアテープ厚みが薄い場合、キャリアテープは真直ぐに押出されず、変形し、折曲ったり、破断等が生じ易くなる。
After the electronic component is stored in the pocket, the carrier tape sealed and sealed with a cover tape as a lid is stored in a state of being wound around a reel.
When mounting electronic components on a circuit board, for example, a reel on which a carrier tape is wound is installed on a tape feeder of a mounting machine, and a transport claw of a sprocket member of the tape feeder is engaged with a feed hole of a carrier tape to By intermittently rotating the member, the cover tape is peeled off while the carrier tape is sequentially fed out. Then, the electronic component is sucked and picked up by the transfer head of the tape feeder, placed on the circuit board, and mounted.
When transporting the carrier tape, particularly when the thickness of the carrier tape is thin, the carrier tape is not extruded straight, and is likely to be deformed, bent, broken or the like.
以下に本発明の構成を実施例により具体的に説明するが、本発明はこれらに限定されるものでない。 The configuration of the present invention will be specifically described below with reference to examples, but the present invention is not limited thereto.
実施例１
基材層の原料であるＡＢＳ樹脂（商品名「ＥＴ−７０」、日本エイアンドエル（株）製）１００重量部とＡＳ樹脂（商品名「２００ＰＣ」、日本エイアンドエル（株）製）１０重量部、及び導電層の原料であるポリスチレン樹脂（商品名「Ｈ４３０」、日本ポリスチレン（株）製）１００重量部とカーボンブラック２０重量部を、Ｔダイを用いフィードブロック法により共押出し成形し、厚さ０．２０ｍｍの基材層の両面に、厚さが各々２５μｍの導電層を積層し、薄肉化された総厚さ０．２５ｍｍ、幅６４０ｍｍのシートを得た。
Example 1
100 parts by weight of ABS resin (trade name “ET-70”, manufactured by Nippon A & L Co., Ltd.) and 10 parts by weight of AS resin (trade name “200PC”, manufactured by Nippon A & L Co., Ltd.), which are raw materials for the base material layer, and 100 parts by weight of polystyrene resin (trade name “H430”, manufactured by Nippon Polystyrene Co., Ltd.), which is a raw material for the conductive layer, and 20 parts by weight of carbon black were coextruded by a feed block method using a T-die, and the thickness was adjusted to 0. A conductive layer having a thickness of 25 μm was laminated on both surfaces of a 20 mm base material layer to obtain a thinned sheet having a total thickness of 0.25 mm and a width of 640 mm.
得られたシートを、熱風温度が４００℃で熱風加熱し、真空成形して、幅１６ｍｍ、ポケットの形状が７．４×７．４ｍｍ、深さ１．２ｍｍ、ポケットのピッチ１２ｍｍ、送り穴径１．５ｍｍ、そのピッチ４ｍｍのキャリアテープを成形した。 The obtained sheet was heated with hot air at a temperature of 400 ° C. and vacuum-formed. The width was 16 mm, the pocket shape was 7.4 × 7.4 mm, the depth was 1.2 mm, the pocket pitch was 12 mm, and the feed hole diameter. A carrier tape having a thickness of 1.5 mm and a pitch of 4 mm was formed.
シートの送り穴打抜き加工、スリット加工時に、クラックや切断等の発生はなかった。また、スリット、打抜き面にはヒゲ、バリの発生は少なかった。
シートの曲げ弾性率は、２２００ＭＰａ（測定方法はＩＳＯ １７８による。）であリ、表面抵抗値は２×１０５Ω（測定方法はＪＩＳ Ｋ６９９１よる。）であった。
キャリアテープに真空成形されたポケットの肉厚は均一であり、そのコーナー部がきちんと成形された状態であり、テープの成形の際にテープの割れもなくシートの成形加工性及び切削加工性は良好であった。
キャリアテープをリールに巻き取るとき、変形、折曲がり、破断等の発生は認められなかった。
There were no cracks or cuts during sheet punching and slitting. In addition, there were few whiskers and burrs on the slit and punched surfaces.
The sheet had a flexural modulus of 2200 MPa (measurement method according to ISO 178) and a surface resistance value of 2 × 10 5 Ω (measurement method according to JIS K6991).
The thickness of the pockets vacuum-formed on the carrier tape is uniform, the corners of the pocket are properly formed, and there is no cracking of the tape when forming the tape. Met.
When the carrier tape was wound around the reel, no deformation, bending, breakage, etc. were observed.
比較例１
基材層の原料がＡＳ樹脂を用いなかった以外は、実施例1と同様にして同じ幅、厚みのシート及び同じ形状、寸法のキャリアテープを得た。
シートの曲げ弾性率は、１８６０ＭＰａ（測定方法はＩＳＯ １７８による。）であリ、表面抵抗値は２×１０５Ω（測定方法はＪＩＳ Ｋ６９９１よる。）であった。
キャリアテープに真空成形されたポケットの肉厚は均一であり、そのコーナー部がきちんと成形された状態であり、テープの成形の際にテープの割れもなくシートの成形加工性及び切削加工性は良好であった。
しかし、実施例1と同じ条件でキャリアテープをリールに巻き取るとき、変形が発生した。
Comparative Example 1
A sheet having the same width and thickness and a carrier tape having the same shape and dimensions were obtained in the same manner as in Example 1 except that the AS resin was not used as the base material.
The sheet had a flexural modulus of 1860 MPa (measurement method according to ISO 178) and a surface resistance value of 2 × 10 5 Ω (measurement method according to JIS K6991).
The thickness of the pockets vacuum-formed on the carrier tape is uniform, the corners of the pocket are properly formed, and there is no cracking of the tape when forming the tape. Met.
However, deformation occurred when the carrier tape was wound around the reel under the same conditions as in Example 1.
本発明のプラスチックシートは、帯電防止性を有し、機械強度、耐衝撃性、成形加工性に優れているため、このプラスチックシートから成形される薄肉のキャリアテープは、変形、折曲がり、破断等の事故は発生することがない。このキャリアテープは、そのコストが低減され、電子部品を収納して、保管し、搬送でき、回路基板に実装するときに用いることができる。 Since the plastic sheet of the present invention has antistatic properties and is excellent in mechanical strength, impact resistance, and molding processability, a thin carrier tape molded from this plastic sheet is deformed, bent, broken, etc. The accident never happens. This carrier tape is reduced in cost, can store, store and transport electronic components, and can be used when mounted on a circuit board.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006252134A JP2008074408A (en) | 2006-09-19 | 2006-09-19 | Plastic sheet and carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006252134A JP2008074408A (en) | 2006-09-19 | 2006-09-19 | Plastic sheet and carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008074408A true JP2008074408A (en) | 2008-04-03 |
| JP2008074408A5 JP2008074408A5 (en) | 2009-11-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006252134A Pending JP2008074408A (en) | 2006-09-19 | 2006-09-19 | Plastic sheet and carrier tape |
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| Country | Link |
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| JP (1) | JP2008074408A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011104901A (en) * | 2009-11-18 | 2011-06-02 | Daicel Pack Systems Ltd | Laminated sheet and molding |
| CN105820453A (en) * | 2016-03-31 | 2016-08-03 | 广东帝通新材料股份有限公司 | Transparent anti-static electronic carrier tape sheet and preparation method |
| CN108395638A (en) * | 2018-02-24 | 2018-08-14 | 金发科技股份有限公司 | A kind of effective resin combination of IC packagings of transparent antistatic |
| WO2022149420A1 (en) * | 2021-01-08 | 2022-07-14 | デンカ株式会社 | Sheet for packaging electronic part |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10329278A (en) * | 1997-06-03 | 1998-12-15 | Denki Kagaku Kogyo Kk | Conductive composite plastic sheet |
| JP2002292805A (en) * | 2001-03-30 | 2002-10-09 | Daicel Polymer Ltd | Conductive resin sheet |
| JP2006182439A (en) * | 2004-12-28 | 2006-07-13 | Daicel Polymer Ltd | Resin sheet for electronic part and formed product for electronic part packaging |
-
2006
- 2006-09-19 JP JP2006252134A patent/JP2008074408A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10329278A (en) * | 1997-06-03 | 1998-12-15 | Denki Kagaku Kogyo Kk | Conductive composite plastic sheet |
| JP2002292805A (en) * | 2001-03-30 | 2002-10-09 | Daicel Polymer Ltd | Conductive resin sheet |
| JP2006182439A (en) * | 2004-12-28 | 2006-07-13 | Daicel Polymer Ltd | Resin sheet for electronic part and formed product for electronic part packaging |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011104901A (en) * | 2009-11-18 | 2011-06-02 | Daicel Pack Systems Ltd | Laminated sheet and molding |
| CN105820453A (en) * | 2016-03-31 | 2016-08-03 | 广东帝通新材料股份有限公司 | Transparent anti-static electronic carrier tape sheet and preparation method |
| CN108395638A (en) * | 2018-02-24 | 2018-08-14 | 金发科技股份有限公司 | A kind of effective resin combination of IC packagings of transparent antistatic |
| WO2022149420A1 (en) * | 2021-01-08 | 2022-07-14 | デンカ株式会社 | Sheet for packaging electronic part |
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