JP2008074408A5 - - Google Patents

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Publication number
JP2008074408A5
JP2008074408A5 JP2006252134A JP2006252134A JP2008074408A5 JP 2008074408 A5 JP2008074408 A5 JP 2008074408A5 JP 2006252134 A JP2006252134 A JP 2006252134A JP 2006252134 A JP2006252134 A JP 2006252134A JP 2008074408 A5 JP2008074408 A5 JP 2008074408A5
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Japan
Prior art keywords
resin
parts
conductive layer
forming
weight
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Pending
Application number
JP2006252134A
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Japanese (ja)
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JP2008074408A (en
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Priority to JP2006252134A priority Critical patent/JP2008074408A/en
Priority claimed from JP2006252134A external-priority patent/JP2008074408A/en
Publication of JP2008074408A publication Critical patent/JP2008074408A/en
Publication of JP2008074408A5 publication Critical patent/JP2008074408A5/ja
Pending legal-status Critical Current

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Claims (7)

ABS樹脂１００重量部に対し、AS樹脂及び/又はMS樹脂を１〜２０重量部含む樹脂組成物を基材層とし、該基材層の少なくとも片面に導電層を積層したことを特徴とする電子部品を包装するキャリアテープ形成用プラスチックシート。 An electronic device characterized in that a resin composition containing 1 to 20 parts by weight of AS resin and / or MS resin with respect to 100 parts by weight of ABS resin is used as a base material layer, and a conductive layer is laminated on at least one surface of the base material layer. Plastic sheet for forming carrier tape that wraps parts . 上記基材層の厚さが０．１〜０．５mmであり、該基材層の両面に導電層を有し、該導電層の厚さがそれぞれ３〜５０μｍの範囲内にあることを特徴とする請求項第1項記載の電子部品を包装するキャリアテープ形成用プラスチックシート。   The thickness of the base material layer is 0.1 to 0.5 mm, the conductive layer is provided on both sides of the base material layer, and the thickness of the conductive layer is in the range of 3 to 50 μm. A plastic sheet for forming a carrier tape for packaging the electronic component according to claim 1. 上記導電層がポリスチレン系樹脂とカーボンブラックとからなり、該導電層には該導電層を形成するポリスチレン系樹脂１００重量部に対して１〜３０重量部のカーボンブラックを含有することを特徴とする請求項第1項または第２項記載の電子部品を包装するキャリアテープ形成用プラスチックシート。   The conductive layer is made of polystyrene resin and carbon black, and the conductive layer contains 1 to 30 parts by weight of carbon black with respect to 100 parts by weight of the polystyrene resin forming the conductive layer. A plastic sheet for forming a carrier tape for packaging the electronic component according to claim 1 or 2. ABS樹脂１００重量部に対し、AS樹脂及び/又はMS樹脂を１〜２０重量部含む樹脂組成物を基材層とし、該基材層の少なくとも片面に導電層を積層したプラスチックシートから形成されたことを特徴とするキャリアテープ。   A resin composition containing 1 to 20 parts by weight of AS resin and / or MS resin with respect to 100 parts by weight of ABS resin was used as a base material layer, and formed from a plastic sheet in which a conductive layer was laminated on at least one side of the base material layer. Carrier tape characterized by that. ABS樹脂１００重量部に対し、AS樹脂及び/又はMS樹脂を１〜２０重量部含む樹脂組成物を基材層とし、該基材層の少なくとも片面に導電層を積層したプラスチックシートを、加熱して、真空成形、圧空成形、真空・圧空成形又はプレス成形してポケットを形成されてなることを特徴とする請求項第４項記載のキャリアテープ。   A plastic sheet having a resin composition containing 1 to 20 parts by weight of AS resin and / or MS resin with respect to 100 parts by weight of ABS resin as a base layer, and a conductive layer laminated on at least one side of the base layer is heated. The carrier tape according to claim 4, wherein the pocket is formed by vacuum forming, pressure forming, vacuum / pressure forming or press forming. 上記キャリアテープは、基材層の厚さが０．１〜０．５mmであり、該基材層の両面に導電層を有し、該導電層の厚さがそれぞれ３〜５０μｍの範囲内にあるプラスチックシートを加熱して、真空成形、圧空成形、真空・圧空成形又はプレス成形してポケットを形成されてなることを特徴とする請求項第４項または第５項記載のキャリアテープ。   The carrier tape has a base material layer thickness of 0.1 to 0.5 mm, and has conductive layers on both sides of the base material layer, and the thickness of the conductive layer is in the range of 3 to 50 μm. 6. A carrier tape according to claim 4, wherein a pocket is formed by heating a plastic sheet and vacuum forming, pressure forming, vacuum / pressure forming or press forming. 上記導電層がポリスチレン系樹脂とカーボンブラックとからなり、該導電層は該導電層を形成するポリスチレン系樹脂１００重量部に対して１〜３０重量部のカーボンブラックを含有することを特徴とする請求項第４項乃至６項のいずかの項記載のキャリアテープ。   The conductive layer is made of a polystyrene-based resin and carbon black, and the conductive layer contains 1 to 30 parts by weight of carbon black with respect to 100 parts by weight of the polystyrene-based resin forming the conductive layer. Item 6. The carrier tape according to any one of Items 4 to 6.
JP2006252134A 2006-09-19 2006-09-19 Plastic sheet and carrier tape Pending JP2008074408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006252134A JP2008074408A (en) 2006-09-19 2006-09-19 Plastic sheet and carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006252134A JP2008074408A (en) 2006-09-19 2006-09-19 Plastic sheet and carrier tape

Publications (2)

Publication Number Publication Date
JP2008074408A JP2008074408A (en) 2008-04-03
JP2008074408A5 true JP2008074408A5 (en) 2009-11-26

Family

ID=39346884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006252134A Pending JP2008074408A (en) 2006-09-19 2006-09-19 Plastic sheet and carrier tape

Country Status (1)

Country Link
JP (1) JP2008074408A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011104901A (en) * 2009-11-18 2011-06-02 Daicel Pack Systems Ltd Laminated sheet and molding
CN105820453B (en) * 2016-03-31 2019-05-17 广东帝通新材料股份有限公司 Transparent antistatic electronic carrier tape sheet material and preparation method
CN108395638B (en) * 2018-02-24 2021-04-13 金发科技股份有限公司 Transparent antistatic resin composition for IC packaging tube
US20240059053A1 (en) * 2021-01-08 2024-02-22 Denka Company Limited Sheet for packaging electronic part

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3807815B2 (en) * 1997-06-03 2006-08-09 電気化学工業株式会社 Conductive composite plastic sheet
JP2002292805A (en) * 2001-03-30 2002-10-09 Daicel Polymer Ltd Conductive resin sheet
JP2006182439A (en) * 2004-12-28 2006-07-13 Daicel Polymer Ltd Resin sheet for electronic part and formed product for electronic part packaging

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