JP2002367437A - Conductive sheet of superior slit performance - Google Patents
Conductive sheet of superior slit performanceInfo
- Publication number
- JP2002367437A JP2002367437A JP2001172118A JP2001172118A JP2002367437A JP 2002367437 A JP2002367437 A JP 2002367437A JP 2001172118 A JP2001172118 A JP 2001172118A JP 2001172118 A JP2001172118 A JP 2001172118A JP 2002367437 A JP2002367437 A JP 2002367437A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- sheet according
- electronic component
- resin
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Non-Insulated Conductors (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は複層のシートに関
し、該シートは電子部品の包装容器に好適に用いられ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layer sheet, and the sheet is suitably used for packaging containers for electronic components.
【０００２】[0002]
【従来の技術】ＩＣをはじめとした電子部品はインジェ
クショントレー、真空成形トレー、マガジン、キャリア
テープ（エンボスキャリアテープともいう）などにより
包装される。これらの包装容器には静電気によるＩＣ等
の電子部品の破壊を防止するために導電性を有するシー
トが用いられることが多い（例えば、特願平７−１０６
８４、特願平７−８７０００）。2. Description of the Related Art Electronic components such as ICs are packaged in injection trays, vacuum forming trays, magazines, carrier tapes (also referred to as embossed carrier tapes), and the like. In these packaging containers, a conductive sheet is often used to prevent the destruction of electronic components such as ICs due to static electricity (for example, Japanese Patent Application No. 7-106).
84, Japanese Patent Application No. 7-87000).
【０００３】[0003]
【発明が解決しようとする課題】これらのシートはその
用途に応じてスリットされ使用に供されるが、本発明は
その際に切断面に生じる毛羽やバリ等を著しく低減した
シートを提供するものである。These sheets are slit according to the purpose of use, and the sheets are provided for use. The present invention provides a sheet in which fluff and burrs generated on a cut surface are significantly reduced. It is.
【０００４】[0004]
【課題を解決するための手段】すなわち本発明は衝撃強
度が１７〜３１ＫＪ／ｍ、引張強度が４０〜５５ＭＰ
ａ、ゴム含有量が１６〜１９重量％のＡＢＳ系樹脂の基
材層と、その少なくとも片面に導電層を有するシートで
ある。以下更に本発明の詳細を説明する。That is, the present invention has an impact strength of 17 to 31 KJ / m and a tensile strength of 40 to 55 MP.
a) A sheet having a base layer of an ABS resin having a rubber content of 16 to 19% by weight and a conductive layer on at least one surface thereof. Hereinafter, the present invention will be described in more detail.
【０００５】[0005]
【発明の実施の形態】シートを電子部品の包装用に用い
るとき、その用途に応じてシートはスリットされる。こ
こでスリットとは必要な大きさ、幅にシートを裁断する
ことをいう。この際に裁断面から毛羽やバリ等の裁断滓
が多く発生し、それらはスリットした裁断面や表面に付
着し、更には収納物である電子部品に付着し後の工程で
問題を引き起こすこととなる。スリット性に優れるシー
トとは、スリット時に毛羽やバリ等の裁断滓の発生の少
ないシートをいう。スリット性はスリットしたシートの
ロールの側面をネルで拭き取った時の汚れ度合いにより
判定される。DESCRIPTION OF THE PREFERRED EMBODIMENTS When a sheet is used for packaging electronic parts, the sheet is slit according to the use. Here, the slit means to cut the sheet to a required size and width. At this time, many cut residues such as fluff and burrs are generated from the cut surface, and they adhere to the slit cut surface and the surface, and furthermore, adhere to the electronic components as storage, causing a problem in a later process. Become. The sheet having excellent slitting properties means a sheet in which cutting residues such as fluff and burrs are less generated at the time of slitting. The slitting property is determined by the degree of dirt when the side surface of the roll of the slit sheet is wiped off with a flannel.
【０００６】本発明のシートはＡＢＳ系樹脂の基材層
と、その少なくとも片面に導電層を有しスリット性に優
れるものである。ＡＢＳ系樹脂としてはその衝撃強度が
１７〜３１ＫＪ／ｍ、引張強度が４０〜５５ＭＰａでゴ
ム含有量が１６〜１９重量％の範囲にあり、好ましくは
２２０℃におけるＭＦＲが５〜１３ｇ／１０ｍｉｎのも
のを用いるとスリット性を向上させることができる。ス
リット性が向上する理由は定かではないがＡＢＳ系樹脂
がこの範囲にあるとシートがスリット時にスリット刃で
押し切られる様に切断され、その際にシートの撓みが少
なく刃の入り方が均一となり、更に刃とシートとのずり
が生じにくくなるためにスリット性が向上すると考えら
れる。The sheet of the present invention has an ABS resin base layer and a conductive layer on at least one side thereof and has excellent slit properties. ABS resin having an impact strength of 17 to 31 KJ / m, a tensile strength of 40 to 55 MPa and a rubber content of 16 to 19% by weight, preferably having an MFR at 220 ° C. of 5 to 13 g / 10 min. By using, the slit property can be improved. The reason why the slitting property is improved is not clear, but if the ABS resin is in this range, the sheet is cut so as to be pushed off by the slit blade at the time of slitting, and at that time the bending of the sheet is small and the way of entering the blade becomes uniform, Furthermore, it is considered that the slitting property is improved because the slip between the blade and the sheet hardly occurs.
【０００７】ＡＢＳ系樹脂の基材層は本発明においては
ＡＢＳ系樹脂からのみなる基材層を意味すると共に、Ａ
ＢＳ系樹脂を主成分としてそれにスリット性を低下させ
ない範囲内でその他の成分を少量添加したものも意味す
る。基材層はＡＢＳ系樹脂のみからなるものが好まし
い。ここでＡＢＳ系樹脂のみからなるとは通常市販され
ているＡＢＳ系樹脂に含有されている程度の少量の添加
剤等までをも排除するものではないが、それ以外のカー
ボンブラック、無機フィラー等は実質的に含まない事が
好ましい。In the present invention, the base layer made of ABS resin means a base layer made of only ABS resin.
It also means a resin containing a BS resin as a main component and a small amount of other components added thereto within a range that does not lower the slitting property. The base material layer is preferably made of only an ABS resin. Here, the term "consisting only of the ABS resin" does not exclude even a small amount of additives or the like contained in a commercially available ABS resin, but other carbon blacks and inorganic fillers are substantially not included. It is preferably not included.
【０００８】導電層は導電性のある層であり、その表面
抵抗値が１０2〜１０10Ωであることが好ましい。抵抗
値がこの範囲よりも高いと静電気による電子部品の破壊
を抑制することが困難となり、抵抗値がこの範囲よりも
低いと外部から静電気等による電気の流入を容易にし電
子部品が破壊してしまう可能性がある。導電層としては
例えば導電性塗料による塗工層や、熱可塑性樹脂に導電
性フィラーを練りこんだものが挙げられるが、中でも、
ポリスチレン系樹脂とカーボンブラックを含有する、あ
るいは更にオレフィン系樹脂を含有する導電層が成形性
等において好ましい。ここでポリスチレン系樹脂とは、
スチレンの単独重合体あるいは共重合体であって、例え
ば一般用ポリスチレン又は共役ジエン重合体成分を含有
する耐衝撃性ポリスチレン及びこれらのブレンド物を指
す。オレフィン系樹脂とはオレフィン系炭化水素の単独
重合体あるいは共重合体であって、例えばエチレン及び
プロピレンのホモポリマー、エチレン又はプロピレンを
主成分とする共重合体、更にこれらのブレンド物が挙げ
られる。共重合体としては、例えばエチレン−エチルア
クリレート共重合体、エチレン−酢酸ビニル共重合体、
エチレン−α−オレフィン共重合体樹脂があり、エチレ
ンと共重合するα−オレフィンとしては、プロピレン、
ブテン−１、ペンテン−１、ヘキセン−１等がある。ま
た導電層には滑剤、可塑剤、加工助剤などの各種添加剤
や無機フィラーを添加することができる。The conductive layer is a conductive layer, and preferably has a surface resistance of 10 2 to 10 10 Ω. If the resistance value is higher than this range, it is difficult to suppress the destruction of the electronic components due to static electricity. If the resistance value is lower than this range, the flow of electricity from the outside due to static electricity or the like is facilitated and the electronic components are destroyed. there is a possibility. Examples of the conductive layer include a coating layer made of a conductive paint, and a material obtained by kneading a conductive filler in a thermoplastic resin.
A conductive layer containing a polystyrene-based resin and carbon black, or further containing an olefin-based resin is preferable in terms of moldability and the like. Here, the polystyrene resin is
It refers to a homopolymer or a copolymer of styrene, for example, general-purpose polystyrene or impact-resistant polystyrene containing a conjugated diene polymer component, and a blend thereof. The olefin-based resin is a homopolymer or a copolymer of an olefin-based hydrocarbon, for example, a homopolymer of ethylene and propylene, a copolymer containing ethylene or propylene as a main component, and a blend thereof. As the copolymer, for example, ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate copolymer,
There is an ethylene-α-olefin copolymer resin, α-olefin copolymerized with ethylene, propylene,
Butene-1, pentene-1, hexene-1 and the like. In addition, various additives such as a lubricant, a plasticizer, and a processing aid, and an inorganic filler can be added to the conductive layer.
【０００９】カーボンブラックは、ファーネスブラッ
ク、チャンネルブラック、アセチレンブラック等であ
り、好ましくは比表面積が大きく、樹脂への添加量が少
量で高度の導電性が得られるもの、例えば、ケッチェン
ブラック、アセチレンブラックが望ましい。その添加量
はポリスチレン系樹脂あるいはポリスチレン系樹脂とオ
レフィン系樹脂の合計に対して５〜５０重量％が好まし
い。５重量％未満では静電気による電子部品の破壊を防
止するために十分な表面抵抗値が得られず５０重量部を
超えると流動性が低下するとともに得られるシートの機
械的強度も低下してしまう。The carbon black is, for example, furnace black, channel black, acetylene black, etc., preferably those having a large specific surface area and a high degree of conductivity obtained by adding a small amount to a resin, for example, Ketjen black, acetylene Black is preferred. The addition amount is preferably from 5 to 50% by weight based on the polystyrene resin or the total of the polystyrene resin and the olefin resin. If the amount is less than 5% by weight, a sufficient surface resistance value for preventing destruction of the electronic component due to static electricity cannot be obtained. If the amount exceeds 50 parts by weight, the fluidity decreases and the mechanical strength of the obtained sheet also decreases.
【００１０】シートの幅方向における巻き硬度の差を５
５０以下好ましくは５００以下とするとスリット性を向
上させることができる。ここで巻き硬度の差とはパロテ
スター（ＰＥＲＣＥＱ社製）で巻き硬度の測定を行なっ
た最大、最小の差のことである。巻き硬度の差を５５０
以下とするとスリットする際に裁断面から発生する毛羽
やバリ等の裁断滓の発生を著しく低減できる。巻き硬度
の差を５５０以下とするには、自動厚み調整ダイによる
シートの幅方向における厚みムラを抑える方法、金属ロ
ールによるバンク成形、シートの巻き取り部でよう動を
かける方法などが挙げられる。シートの幅方向の特定の
場所に他より厚い部分があると、その部分がコブとなり
巻き硬度のバラツキを生じ、その差が５５０以下とはな
らない。The difference in winding hardness in the sheet width direction is 5
When it is 50 or less, preferably 500 or less, the slitting property can be improved. Here, the difference in the winding hardness is the maximum and minimum difference obtained by measuring the winding hardness with a Palotester (manufactured by PERCEQ). 550 difference in winding hardness
When the following is set, the generation of cutting residues such as fluff and burrs generated from the cut surface when slitting can be significantly reduced. In order to reduce the difference in winding hardness to 550 or less, a method of suppressing thickness unevenness in the width direction of the sheet using an automatic thickness adjusting die, a method of forming a bank with a metal roll, and a method of moving the sheet at a winding portion are used. If there is a portion thicker than the other portion at a specific position in the width direction of the sheet, the portion becomes bumpy, causing variations in winding hardness, and the difference does not become 550 or less.
【００１１】本発明のシートの全体の肉厚は０．１〜
３．０ｍｍであり、多層共押出法により導電層を積層し
た場合、全体の肉厚に占める導電層の肉厚は２％〜８０
％であることが好ましい。全体の肉厚が０．１ｍｍ未満
ではシートを成形して得られる包装容器としての強度が
不足し、３．０ｍｍを超えると圧空成形、真空成形、熱
版成形等の成形が困難となる。また表面層の肉厚が２％
未満ではシートを成形して得られる包装容器の表面抵抗
値が著しく高くなり十分な静電気抑制効果が得られず、
８０％を超えると圧空成形、真空成形、熱板成形等の成
形性が低下してしまう。一方、コーティング、印刷、熱
ラミネート法、ドライラミネート法、押出ラミネート法
により導電層を積層した場合、全体の肉厚に占める導電
層の肉厚は３０％以下であることが好ましい。The total thickness of the sheet of the present invention is 0.1 to
When the conductive layers are laminated by a multilayer co-extrusion method, the thickness of the conductive layer occupying 2% to 80% of the total thickness is 3.0 mm.
%. If the total thickness is less than 0.1 mm, the strength as a packaging container obtained by molding a sheet is insufficient, and if it exceeds 3.0 mm, molding such as air pressure molding, vacuum molding, hot plate molding becomes difficult. The thickness of the surface layer is 2%
If it is less than 1, the surface resistance value of the packaging container obtained by molding the sheet becomes extremely high, and a sufficient static electricity suppressing effect cannot be obtained,
If it exceeds 80%, moldability such as pressure forming, vacuum forming, hot plate forming and the like will be reduced. On the other hand, when the conductive layers are laminated by coating, printing, heat laminating, dry laminating, or extrusion laminating, the thickness of the conductive layer in the total thickness is preferably 30% or less.
【００１２】シートは基材層に導電層を積層することに
より得ることができる、その方法としては、例えばコー
ティング、印刷、熱ラミネート法、ドライラミネート
法、押出ラミネート法、共押出法が挙げられるが、より
安価に製造するにはマルチマニホールドダイやフィード
ブロックを用いた多層共押出法により一括して積層シー
トを得ることが好ましい。The sheet can be obtained by laminating a conductive layer on a substrate layer. Examples of the method include coating, printing, heat laminating, dry laminating, extrusion laminating, and co-extrusion. In order to manufacture at a lower cost, it is preferable to collectively obtain a laminated sheet by a multilayer coextrusion method using a multi-manifold die or a feed block.
【００１３】（用途）シートは成形して電子部品包装容
器として好適に用いることが出来る。電子部品包装容器
とは電子部品の包装容器であるが、例えば真空成形、圧
空成形、熱板成形等の公知の方法によりトレー、マガジ
ンチューブ、キャリアテープ（エンボスキャリアテー
プ）等の電子部品包装容器として用いることが出来る
が、特にキャリアテープ、トレーに好適に用いられる。
電子部品包装容器に電子部品を収納することにより電子
部品包装体となる。この場合容器には必要に応じ蓋がさ
れる。例えばキャリアテープについては、電子部品を収
納した後にカバーテープによる蓋が施される。電子部品
包装体にはこのようなものも含む。(Use) The sheet can be molded and used suitably as a packaging container for electronic parts. The electronic component packaging container is a packaging container for electronic components. For example, the electronic component packaging container such as a tray, a magazine tube, and a carrier tape (embossed carrier tape) is formed by a known method such as vacuum forming, air forming, and hot plate forming. Although it can be used, it is particularly suitably used for carrier tapes and trays.
An electronic component package is obtained by storing the electronic component in the electronic component packaging container. In this case, the container is covered if necessary. For example, a carrier tape is covered with a cover tape after storing electronic components. The electronic component package also includes such a component.
【００１４】電子部品としては特に限定されず、例え
ば、ＩＣ、抵抗、コンデンサ、インダクタ、トランジス
タ、ダイオード、ＬＥＤ（発光ダイオード）、液晶、圧
電素子レジスター、フィルター、水晶発振子、水晶振動
子、コネクター、スイッチ、ボリュウム、リレー等があ
る。ＩＣの形式にも特に限定されず、例えばＳＯＰ、Ｈ
ＥＭＴ、ＳＱＦＰ、ＢＧＡ、ＣＳＰ、ＳＯＪ、ＱＦＰ、
ＰＬＣＣ等がある。The electronic components are not particularly limited. For example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element registers, filters, crystal oscillators, crystal oscillators, connectors, There are switches, volumes, relays, etc. The format of the IC is not particularly limited. For example, SOP, H
EMT, SQFP, BGA, CSP, SOJ, QFP,
PLCC and the like.
【００１５】[0015]
【実施例】以下本発明を実施例によりさらに詳細に説明
する。 実施例１ 基材層用として衝撃強度が２２．１ＫＪ／ｍ、引張強度
が４５．９ＭＰａでゴム含有量が１７．２重量％、２２
０℃におけるＭＦＲが８．０ｇ／１０ｍｉｎのＡＢＳ系
樹脂（電気化学工業社製）を用い、導電層用としてポリ
スチレン系樹脂（ＨＩ−Ｅ４ 東洋スチレン社）１００
重量部に対して２０重量％のカーボンブラック（デンカ
ブラック粒状 電気化学工業社製）からなる導電性樹脂
コンパウンドを使用し、φ６５ｍｍ押出機（Ｌ／Ｄ＝２
８）、φ４０ｍｍ押出機（Ｌ／Ｄ＝２６）及び５００ｍ
ｍ幅のＴダイを用いたフィードブロック法により全体の
肉厚が３００μｍ、導電層の肉厚が両側３０μｍとなる
ような３層シートを得た。このシートをスリッタ−で２
４ｍｍ幅にスリットした。なお、ABS樹脂の引張強度は
ＡＳＴＭ法Ｄ−６３８、衝撃強度はＡＳＴＭ法Ｄ−２５
６に従い、２２０℃におけるＭＦＲはＪＩＳ-Ｋ-６８７
４に従って測定した。The present invention will be described in more detail with reference to the following examples. Example 1 For a substrate layer, the impact strength was 22.1 KJ / m, the tensile strength was 45.9 MPa, the rubber content was 17.2% by weight, and 22.
An ABS resin (manufactured by Denki Kagaku Kogyo KK) having an MFR of 8.0 g / 10 min at 0 ° C. is used, and a polystyrene resin (HI-E4 Toyo Styrene Co., Ltd.) 100 is used for the conductive layer.
Using a conductive resin compound composed of 20% by weight of carbon black (Denka Black Granules, manufactured by Denki Kagaku Kogyo Co., Ltd.) with respect to parts by weight, a φ65 mm extruder (L / D = 2
8), φ40mm extruder (L / D = 26) and 500m
A three-layer sheet having a total thickness of 300 μm and a thickness of the conductive layer of 30 μm on both sides was obtained by a feed block method using an m-width T-die. Slit this sheet 2
It was slit to a width of 4 mm. The tensile strength of the ABS resin is ASTM method D-638, and the impact strength is ASTM method D-25.
According to No. 6, the MFR at 220 ° C. is JIS-K-687.
Measured according to 4.
【００１６】比較例１ 基材層用として衝撃強度が６．０ＫＪ／ｍ、引張強度が
５６ＭＰａでゴム含有量が９．６重量％、２２０℃にお
けるＭＦＲが２０．０ｇ／１０ｍｉｎのＡＢＳ系樹脂を
用いた以外は実施例１と同様に行った。Comparative Example 1 An ABS resin having an impact strength of 6.0 KJ / m, a tensile strength of 56 MPa, a rubber content of 9.6% by weight, and a MFR at 220 ° C. of 20.0 g / 10 min was used as a base material layer. Except having used, it carried out similarly to Example 1.
【００１７】比較例２ 基材層用としてポリスチレン系樹脂（ＨＩ−Ｅ４ 東洋
スチレン社）を用いた以外は実施例１と同様に行った。
以上の作製したシートに対して次に示す評価を行なっ
た。 （表面抵抗値）三菱油化社ロレスターＭＣＰテスターを
用いて、端子間を１０ｍｍとし、シートを幅方向に等間
隔に１０箇所、表裏各２列計４０箇所の表面抵抗値を測
定し、対数平均値を表面固有抵抗値とした。 （スリット性）スリットしたシートのロールの側面をネ
ルで拭き取った時の汚れ度合いを判定した。汚れが殆ど
ないものをスリット性○とし、少ない場合を△、汚れが
多い場合を×とした。 （巻き硬度の差）ＰＥＲＣＥＱ社パロテスターを用い
て、シートの幅方向に等間隔に１３点のシート巻き硬さ
を測定し、最大値と最大値の差を巻き硬度の差とした。
上記の評価項目の結果を表１に示す。Comparative Example 2 The procedure of Example 1 was repeated except that a polystyrene resin (HI-E4, Toyo Styrene Co.) was used for the substrate layer.
The following evaluations were performed on the sheets manufactured as described above. (Surface resistance value) Using a Mitsubishi Loka Co. Lorester MCP tester, measure the surface resistance value of 10 places at equal intervals in the width direction of the sheet, 40 places in each of two rows on the front and back sides using a Lorester MCP tester, and logarithmic averaging The value was defined as the surface resistivity. (Slit property) The degree of contamination when the side surface of the roll of the slit sheet was wiped off with a flannel was determined. A sample having almost no dirt was evaluated as slit-good, a case with little dirt was evaluated as x, and a case with much dirt was evaluated as x. (Difference in winding hardness) Using a PARCEQ Palotester, 13 points of winding hardness of the sheet were measured at equal intervals in the width direction of the sheet, and the difference between the maximum value and the maximum value was defined as the difference in winding hardness.
Table 1 shows the results of the above evaluation items.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【発明の効果】衝撃強度が１７〜３１ＫＪ／ｍ、引張強
度が４０〜５５ＭＰａ、ゴム含有量が１６〜１９重量％
のＡＢＳ系樹脂の基材層と、その少なくとも片面に導電
層を有する優れるシートは、スリットする際の切断面の
毛羽等を著しく減少させ、半導体包装に適するキャリア
テープ用導電シートを得ることが可能となる。The impact strength is 17 to 31 KJ / m, the tensile strength is 40 to 55 MPa, and the rubber content is 16 to 19% by weight.
An excellent sheet having an ABS resin base layer and a conductive layer on at least one side thereof significantly reduces fluff and the like on a cut surface when slitting, and can provide a conductive sheet for a carrier tape suitable for semiconductor packaging. Becomes
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｋ 3/04 Ｃ０８Ｌ 25/04 Ｃ０８Ｌ 25/04 Ｂ６５Ｄ 85/38 Ｄ Ｆターム(参考） 3E086 AD05 AD09 BA04 BA15 BA35 BB35 BB85 CA31 3E096 BA08 CA06 CA11 DB08 EA02X FA03 GA01 4F100 AA37B AK12B AK74A AL05B AR00B BA02 EH17 GB16 GB41 JA20 JG01B JG03 JK02A JK06A 4J002 BB00X BB02X BB05X BB06X BB07X BB11X BC02W BN14W DA036 FD116 GF00 GQ00 GQ02 5G307 GA02 GC02 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08K 3/04 C08L 25/04 C08L 25/04 B65D 85/38 DF term (Reference) 3E086 AD05 AD09 AD04 BA04 BA15 BA35 BB35 BB85 CA31 3E096 BA08 CA06 CA11 DB08 EA02X FA03 GA01 4F100 AA37B AK12B AK74A AL05B AR00B BA02 EH17 GB16 GB41 JA20 JG01B JG03 JK02A JK06A 4J002 BB00G BB05X02BB06X02 BB05X BB06X02
Claims (8)
が４０〜５５ＭＰａ、ゴム含有量が１６〜１９重量％の
ＡＢＳ系樹脂の基材層と、その少なくとも片面に導電層
を有する優れるシート。1. An excellent sheet having an ABS resin base layer having an impact strength of 17 to 31 KJ / m, a tensile strength of 40 to 55 MPa, a rubber content of 16 to 19% by weight, and a conductive layer on at least one surface thereof. .
含有する、あるいは更にオレフィン系樹脂を含有する導
電層である請求項１のシート。2. The sheet according to claim 1, which is a conductive layer containing a polystyrene resin and carbon black or further containing an olefin resin.
求項１または２のシート。 １．表面層の固有抵抗値が１０2〜１０10Ωである。 ２．シートの幅方向における巻き硬度の差が５５０以下
である。3. The sheet according to claim 1, which has at least one of the following requirements. 1. Resistivity of the surface layer is 10 2 ~10 10 Ω. 2. The difference in winding hardness in the width direction of the sheet is 550 or less.
１乃至請求項３のいずれか一に記載のシート。4. The sheet according to claim 1, wherein the base material layer comprises only an ABS resin.
４のいずれか一に記載のシート。5. The sheet according to claim 1, which is for an electronic component packaging container.
のシートからなる電子部品包装容器。6. An electronic component packaging container comprising the sheet according to any one of claims 1 to 5.
のシートからなる電子部品包装体。7. An electronic component package comprising the sheet according to any one of claims 1 to 5.
のシートからなるキャリアテープおよびトレー。8. A carrier tape and a tray comprising the sheet according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001172118A JP3992456B2 (en) | 2001-06-07 | 2001-06-07 | Conductive sheet with excellent slit property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001172118A JP3992456B2 (en) | 2001-06-07 | 2001-06-07 | Conductive sheet with excellent slit property |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002367437A true JP2002367437A (en) | 2002-12-20 |
| JP3992456B2 JP3992456B2 (en) | 2007-10-17 |
Family
ID=19013792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001172118A Expired - Fee Related JP3992456B2 (en) | 2001-06-07 | 2001-06-07 | Conductive sheet with excellent slit property |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3992456B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004084239A1 (en) * | 2003-03-21 | 2004-09-30 | Kwang Suck Suh | Allowance method for point to ground resistance on tray |
| WO2006030871A1 (en) * | 2004-09-16 | 2006-03-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Composite sheet |
| JPWO2006028064A1 (en) * | 2004-09-07 | 2008-05-08 | 電気化学工業株式会社 | Conductive composite sheet |
| WO2012046807A1 (en) * | 2010-10-07 | 2012-04-12 | 電気化学工業株式会社 | Surface conductive multilayered sheet |
| JP2012236387A (en) * | 2011-05-13 | 2012-12-06 | Gunze Ltd | Film manufacturing apparatus |
| WO2014007135A1 (en) * | 2012-07-02 | 2014-01-09 | 住友ベークライト株式会社 | Base sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component carrier |
-
2001
- 2001-06-07 JP JP2001172118A patent/JP3992456B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004084239A1 (en) * | 2003-03-21 | 2004-09-30 | Kwang Suck Suh | Allowance method for point to ground resistance on tray |
| JPWO2006028064A1 (en) * | 2004-09-07 | 2008-05-08 | 電気化学工業株式会社 | Conductive composite sheet |
| JP5154081B2 (en) * | 2004-09-16 | 2013-02-27 | 電気化学工業株式会社 | Composite sheet |
| JPWO2006030871A1 (en) * | 2004-09-16 | 2008-05-15 | 電気化学工業株式会社 | Composite sheet |
| WO2006030871A1 (en) * | 2004-09-16 | 2006-03-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Composite sheet |
| TWI402166B (en) * | 2004-09-16 | 2013-07-21 | Denki Kagaku Kogyo Kk | Composite sheet |
| WO2012046807A1 (en) * | 2010-10-07 | 2012-04-12 | 電気化学工業株式会社 | Surface conductive multilayered sheet |
| CN103153614A (en) * | 2010-10-07 | 2013-06-12 | 电气化学工业株式会社 | Surface conductive multilayered sheet |
| JPWO2012046807A1 (en) * | 2010-10-07 | 2014-02-24 | 電気化学工業株式会社 | Surface conductive multilayer sheet |
| CN103153614B (en) * | 2010-10-07 | 2015-04-29 | 电气化学工业株式会社 | Surface conductive multilayered sheet |
| JP5856968B2 (en) * | 2010-10-07 | 2016-02-10 | デンカ株式会社 | Surface conductive multilayer sheet |
| JP2012236387A (en) * | 2011-05-13 | 2012-12-06 | Gunze Ltd | Film manufacturing apparatus |
| WO2014007135A1 (en) * | 2012-07-02 | 2014-01-09 | 住友ベークライト株式会社 | Base sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3992456B2 (en) | 2007-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6686167B2 (en) | Surface conductive laminated sheet and electronic component packaging container | |
| WO2005102860A1 (en) | Cover tape, and carrier tape system for packing electronic component | |
| JP3998956B2 (en) | Conductive sheet and container for transporting electronic components | |
| JP3992456B2 (en) | Conductive sheet with excellent slit property | |
| JP4307302B2 (en) | Cover tape and carrier tape system | |
| JP4476887B2 (en) | Sheet | |
| JPH09174769A (en) | Conductive composite plastic sheet for packaging electronic component and vessel | |
| JP4163620B2 (en) | Multi-layer sheet for packaging electronic parts | |
| JPH11198310A (en) | Multilayered film or sheet made of olefinic resin | |
| JP3270386B2 (en) | Surface conductive polyolefin sheet | |
| JP3756049B2 (en) | Sheet | |
| JP3642579B2 (en) | Conductive composite plastic sheet and molded product | |
| JP2008273998A (en) | Formed article for conveying electronic component | |
| JP3983014B2 (en) | Sheet with excellent slit properties | |
| JP3324683B2 (en) | Conductive composite plastic sheet | |
| WO2022044922A1 (en) | Cover tape and electronic component package | |
| JP3240047B2 (en) | Resin composition for heat sealing, cover film | |
| JP4141570B2 (en) | Surface conductive polyolefin sheet | |
| JP2000103020A (en) | Multilayered film or sheet made of olefin resin and preparation thereof | |
| WO2022044921A1 (en) | Cover tape and electronic-component package | |
| WO2022044919A1 (en) | Cover tape and electronic component package | |
| JP2005306460A (en) | Cover tape and electronic part packaging carrier tape system | |
| JP3231119B2 (en) | Heat resistant conductive carrier tape | |
| JP4194767B2 (en) | Sheet | |
| JP4360111B2 (en) | Surface conductive composite plastic sheet and electronic component transport container |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050328 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060214 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060417 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070508 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070627 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070724 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070724 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 3992456 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100803 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110803 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110803 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120803 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120803 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130803 Year of fee payment: 6 |
|
| LAPS | Cancellation because of no payment of annual fees |