JPH09174769A - Conductive composite plastic sheet for packaging electronic component and vessel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a plastic sheet for packaging an electronic component and a vessel. SOLUTION: This conductive composite plastic sheet for packaging an electronic component comprises a base material layer made of a thermoplastic resin, and surface layers of a conductive resin composition laminated on both side surfaces of the base material layer, wherein its surface specific resistance value is 10<2> to 10<10> Ω and the surface glossiness is 30% or less. The vessel is obtaid by thermally molding it.

Description

Detailed Description of the Invention

[0001]

The present invention has a low surface gloss, and
When used as a packaging container for electronic components such as C, the present invention relates to a conductive composite plastic sheet for packaging electronic components and a container for packaging electronic components in which an inspection error due to reflection or the like does not occur in the optical inspection process of the contents. .

[0002]

2. Description of the Related Art Conventionally, injection trays, vacuum forming trays, magazines, embossed carrier tapes, etc. have been used as packaging forms for ICs and electronic parts using ICs. These packaging containers prevent ICs from being destroyed by static electricity. In order to achieve this, various methods for adjusting the surface resistivity to 10 ² to 10 ¹⁰ Ω have been applied. Typical examples thereof include a method of applying an antistatic agent or a conductive coating on the surface of the packaging container, and a method of dispersing a conductive filler such as metal fine powder, carbon black or carbon fiber in a resin. Among these, the method of dispersing carbon black is widely used because it is easy to obtain a stable surface specific resistance value, the influence of environment such as humidity and temperature and the deterioration of conductivity due to abrasion are small, and the cost is excellent. It is commonly used.

Conventionally, the resin in which carbon black has been kneaded has deteriorated mechanical properties, and is formed into a sheet by an extruder or the like, which is then secondary formed into a packaging container by a method such as vacuum forming, pressure forming, hot plate forming and the like. Molding processing is also difficult at the time of molding, and there is a problem in using it as a packaging container obtained by secondary molding a sheet such as a vacuum forming tray or an embossed carrier tape. As a method for improving these problems, the inventors of the present invention have disclosed in JP-A-57-205145 and JP-A-62.
-18261 etc. have been proposed.

On the other hand, in recent years, with higher integration of ICs and narrower lead pitches, there is a growing need to inspect lead bending before mounting. As a countermeasure against this, optical inspection including image inspection by a CCD camera or the like is performed. An inspection is to be conducted. At the time of this optical inspection, reflection from the container in which the IC or the like is packaged causes an inspection error, and therefore it is strongly desired to reduce the glossiness of the surface.

[0005]

DISCLOSURE OF THE INVENTION The present invention solves the above drawbacks by (a) polystyrene resin, AB
At least one selected from (b) polystyrene resin, ABS resin or polyphenylene ether resin on both sides of the base material layer made of at least one thermoplastic resin selected from S resin or polyphenylene ether resin. 5 to 50 parts by weight of carbon black and an average particle size of 0.5 to 60 μ per 100 parts by weight of the thermoplastic resin
It is a plastic sheet in which a surface layer made of a conductive resin composition containing 0.1 to 40 parts by weight of an inorganic filler of m is laminated, and has a surface specific resistance value of 10 ² to 10 ¹⁰ Ω and a surface glossiness. It is an object of the present invention to provide a conductive composite plastic sheet for packaging electronic parts having a content of 30% or less and a container for packaging electronic parts formed by molding the sheet.

[0006]

That is, the first aspect of the present invention
Of the present invention, (a) both sides of a base material layer made of a thermoplastic resin composed of at least one kind selected from polystyrene-based resin, ABS-based resin or polyphenylene ether-based resin, (b) polystyrene-based resin and ABS-based resin. Alternatively, 5 to 50 parts by weight of carbon black and 0.1 to 40 parts by weight of an inorganic filler having an average particle size of 0.5 to 60 μm are included with respect to 100 parts by weight of at least one kind of thermoplastic resin selected from polyphenylene ether resins. Which is a plastic sheet in which a surface layer made of a conductive resin composition is laminated, and which has a surface specific resistance value of 10 ² to 10 ¹⁰ Ω and a surface glossiness of 30% or less. It is a conductive composite plastic sheet for packaging.

A second aspect of the present invention is that (a) both sides of a base layer made of a thermoplastic resin made of at least one selected from polystyrene resin, ABS resin or polyphenylene ether resin, (b) ) An inorganic filler having 5 to 50 parts by weight of carbon black and an average particle size of 0.5 to 60 μm with respect to 100 parts by weight of at least one kind of thermoplastic resin selected from polystyrene resin, ABS resin or polyphenylene ether resin. A container formed by thermoforming a plastic sheet in which a surface layer made of a conductive resin composition containing 0.1 to 40 parts by weight is laminated, and the surface resistivity of the container is 10 ² to 10 ¹⁰ Ω. In addition, it is a container for packaging electronic parts, which has a surface gloss of 30% or less.

A third invention of the present invention is that the inorganic filler is at least one selected from silicates, carbonates, sulfates and oxides, and the electronic part package of the first invention is characterized. It is a conductive composite plastic sheet for. A fourth invention of the present invention is the container for packaging electronic parts according to the second invention, wherein the inorganic filler is at least one selected from silicates, carbonates, sulfates and oxides. is there.

Hereinafter, the present invention will be described in more detail. In the present invention, at least one thermoplastic resin selected from polystyrene-based resins, ABS-based resins, and polyphenylene ether-based resins is used in the resin composition constituting the base material layer and the surface layer. The polystyrene-based resin refers to a general polystyrene resin or an impact-resistant polystyrene resin and a material containing a mixture thereof as a main component. The ABS resin is a resin containing a copolymer mainly composed of three components of acrylonitrile-butadiene-styrene as a main component. Further, the polyphenylene ether-based resin refers to a resin containing polyphenylene ether resin and the polystyrene-based resin as main components, and the content of the polyphenylene ether resin in 100 parts by weight of the total amount of the polyphenylene ether resin and the polystyrene-based resin is It is preferably 28 to 86 parts by weight, and when it is less than 28 parts by weight, sufficient mechanical properties as a polyphenylene ether resin cannot be obtained, and when it exceeds 86 parts by weight, fluidity is lowered and molding process becomes difficult. As the polyphenylene ether resin, US Pat.
Homopolymers or copolymers described in 383435 are shown.

The carbon black contained in the conductive resin composition in the present invention is furnace black, channel black, acetylene black, etc., and preferably has a large specific surface area and a small amount added to the resin provides high conductivity. Is what you get. For example, C. F. (Super
Conductive Furnace), E.C. C.
F. (Electric Conductive Fu
rnace), Ketjen Black (Lion-AKZ)
O brand) and acetylene black. The amount of carbon black added is such that the surface resistivity of the surface layer can be 10 ² to 10 ¹⁰ Ω when laminated on the base material layer. 5 to 50 parts by weight of carbon black is preferable to 100 parts by weight of the thermoplastic resin. 5 added
If the amount is less than 50 parts by weight, sufficient conductivity cannot be obtained and the surface resistivity increases, and if it exceeds 50 parts by weight, the uniform dispersibility with the resin is deteriorated, the molding processability is remarkably lowered, and the mechanical strength and other properties are improved. The value drops. The surface resistivity is 10
^If it exceeds ¹⁰ Ω, a sufficient antistatic effect cannot be obtained, and 10 ²
If it is less than Ω, the power generation capability is too good and the IC may be destroyed.

The type of the inorganic filler used in the present invention is not particularly limited as long as it is usually used by dispersing it in a thermoplastic resin, but talc is a typical example.
Mica and other silicates, calcium carbonate and other carbonates, barium sulfate and other sulfates, and silica, alumina and other oxides And mixtures thereof. The average particle size of the inorganic filler is preferably 0.5 to 60 μm,
The inorganic filler is 0.1 per 100 parts by weight of the thermoplastic resin.
Add ~ 40 parts by weight. If the average particle size exceeds 60 μm or if the addition amount exceeds 40 parts by weight, characteristic values such as moldability and mechanical strength when the obtained sheet is molded into a packaging container remarkably decreases, and the average particle size Is less than 0.5 μm or the addition amount is less than 0.1 parts by weight, the surface glossiness is not sufficiently low and the desired performance cannot be obtained. The surface glossiness of the sheet surface layer is, for example, Mode manufactured by Horiba Ltd.
It can be measured with an lIG-310 gloss meter. The surface glossiness is preferably 30% or less.

The resin composition constituting the base material layer and the surface layer of the present invention may have, if necessary, flow properties of the resin composition and mechanical properties such as mechanical strength of the obtained sheet and a packaging container formed with the sheet. In order to improve the properties, it is possible to add various additives such as processing aids such as lubricants, plasticizers and antioxidants, synthetic rubber fine particles, reinforcing materials such as olefin resins and other resin components.

In order to manufacture the plastic sheet of the present invention, first, all or part of the raw material of the conductive resin composition is kneaded and pelletized by a known method such as a Banbury mixer or an extruder. When kneading the conductive resin composition, it is also possible to knead the raw materials all at once, for example, polystyrene-based resin and carbon black, polystyrene-based resin and inorganic filler are kneaded separately, and finally pelletized. It is also possible to knead and pelletize the mixture step by step such as kneading the mixture all at once, and further use the pellets obtained by kneading separately when mixing them into a sheet by an extruder. It is also possible.

In order to produce the plastic sheet of the present invention, the base material layer and the surface layer are separately formed into a sheet or a film by an extruder, and then heat laminating method, dry laminating method, extrusion laminating method or the like is used. It is also possible to laminate the base material layer and the surface layer collectively by a multi-layer coextrusion method using a feed block, a multi-manifold die or the like to obtain a laminated plastic sheet.

The total thickness of the plastic sheet and container of the present invention is 0.1 to 3.0 mm. In the sheet and the container, the ratio of the surface layer to the total thickness is 2% or more on each side and 80% or less on both sides. Further, if the total thickness is less than 0.1 mm, the strength as a packaging container obtained by molding a sheet is insufficient, and 3.0
If it exceeds mm, forming by pressure forming, vacuum forming, hot plate forming, etc. becomes difficult. 2% even if the surface layer is on one side
If it is less than 80%, the surface resistivity of the sheet or the packaging container obtained by molding the sheet will be remarkably high and a sufficient antistatic effect cannot be obtained. If both surface layers exceed 80%, they will be laminated on the base material. As a result, the molding effect and the mechanical properties such as mechanical strength at the time of molding into a packaging container decrease.

The electronic component packaging container referred to in the present invention is an IC
A vacuum forming tray for packaging, a magazine, an embossed carrier tape, an electronic component using an IC, a vacuum forming tray for packaging electronic equipment, etc., to obtain the packaging container from a sheet, pressure forming, vacuum forming, hot plate It is possible to use a known thermoforming method such as molding.

[0017]

The present invention will be described in more detail with reference to the following examples. Example 1 The raw materials shown in Table 1 were used, and the raw material composition ratios shown in Table 2 were weighed and uniformly mixed with a high-speed mixer.
The mixture was kneaded using a 5 mm vent type twin screw extruder and pelletized by a strand cut method to obtain a conductive resin composition.
Next, the thicknesses of the conductive resin composition layers on both sides are almost equal by the combination of the base material layer and the conductive resin composition layer to be the surface layer shown in Table 4 and the ratio to the total thickness of the base material layer. A conductive composite plastic sheet having a total thickness of 0.3 mm is formed by a feed block method using a φ65 mm extruder (L / D = 28), a φ40 mm extruder (L / D = 26) and a 500 mm width T die. Obtained. Further, the obtained sheet is vacuum-formed and QFP 14 mm × 24 mm-64 pin
A vacuum forming tray for IC packaging and the same embossed carrier tape were obtained. The evaluation results are shown in Tables 5 and 6.

Examples 2 to 5 The same procedure as in Example 1 was carried out except that the constitution of the conductive composite plastic sheet was changed as shown in Tables 2 and 4. The evaluation results are shown in Tables 5 and 6. Comparative Examples 1 to 4 The same procedure was performed as in Example 1 except that the configurations of the conductive composite plastic sheet were changed as shown in Tables 3 and 4. The evaluation results are shown in Tables 5 and 6.

Regarding the plastic sheets of the respective examples, the surface specific resistance value was good, the surface glossiness was low,
Moreover, it had suitable thermoformability as a sheet for packaging electronic parts. Further, the vacuum forming tray and the embossed carrier tape also had good surface resistivity and low surface gloss. The sheet samples of Comparative Example 1 and Comparative Example 4 had high surface gloss, and the vacuum forming tray and the embossed carrier tape also had high surface gloss and were not practical. On the other hand, the plastic sheets of Comparative Example 2 and Comparative Example 3 had low surface gloss, but did not have suitable thermoformability as a sheet for packaging electronic parts, and formed into a vacuum forming tray or an embossed carrier tape. Was impossible.

Each evaluation was performed by the following method. (1) Surface specific resistance value The distance between the electrodes was set to 10 mm by using a Lorester surface resistance meter (manufactured by Mitsubishi Yuka Co., Ltd.), and a sheet sample was measured at any 10 points on the surface, and a vacuum forming tray and an embossed carrier tape were also measured. Was measured at 10 points in the center of the inner bottom surface of the pocket and the logarithmic average value of each was taken as the surface resistivity value. (2) Strength at Break, Tensile Elastic Modulus Using a sheet sample, a No. 4 type test piece was measured at a pulling speed of 10 mm / min in accordance with JIS-K-7127. (3) Surface Glossiness With a surface gloss meter Model IG-310 manufactured by HORIBA, Ltd., a sheet sample has an arbitrary surface gloss of 10
The points are measured, and for vacuum forming trays and embossed carrier tapes, the central portion 10 on the inner bottom surface of the pocket portion is measured.
The points were measured and the average value of each was used as the surface glossiness. (4) IC lead bending inspection test Using a vacuum forming tray and an embossed carrier tape, 100 QFP 14 mm x 24 mm-in this pocket part.
Insert a 64-pin IC and bend the IC lead bend to the CCD
It was tested by image recognition inspection, and those with no inspection error were marked with ◯, and those with inspection error were marked with x.

[0021]

[Table 1]

[0022]

[Table 2]

[0023]

[Table 3]

[0024]

[Table 4] (Note)% in the above table indicates the ratio of the thickness of the base material layer to the total thickness of the sheet.

[0025]

[Table 5]

[0026]

[Table 6]

[0027]

As described above, according to the present invention, when the surface glossiness is low and it is used as a packaging container for electronic parts such as IC, in the process of optical inspection of its contents,
It is possible to obtain a conductive composite plastic sheet for electronic component packaging and an electronic component packaging container that are free from inspection errors due to reflection or the like.

Claims (4)

[Claims] 1. A base material layer comprising (a) a thermoplastic resin comprising at least one selected from a polystyrene resin, an ABS resin or a polyphenylene ether resin, and (b) a polystyrene resin or an ABS resin. At least 1 selected from resin or polyphenylene ether resin
A surface layer made of a conductive resin composition containing 5 to 50 parts by weight of carbon black and 0.1 to 40 parts by weight of an inorganic filler having an average particle size of 0.5 to 60 μm per 100 parts by weight of a thermoplastic resin of various kinds. It is a laminated plastic sheet,
A conductive composite plastic sheet for packaging electronic parts, which has a surface specific resistance of 10 ² to 10 ¹⁰ Ω and a surface gloss of 30% or less. 2. (a) Polystyrene resin, ABS resin
Small amount selected from oil or polyphenylene ether resin
Both base material layers made of at least one type of thermoplastic resin
(B) polystyrene-based resin, ABS-based resin or
At least 1 selected from rephenylene ether resins
Carbon black for 100 parts by weight of thermoplastic resin
5 to 50 parts by weight and average particle size of 0.5 to 60 μm
Conductive resin composition containing 0.1 to 40 parts by weight of machine filler
Thermoforming a plastic sheet laminated with a surface layer consisting of
The container has a surface resistivity value of 10
^Two-10^TenΩ and the surface glossiness is 30% or less
A container for packaging electronic parts, characterized by being present. 3. The conductive composite plastic sheet for packaging electronic parts according to claim 1, wherein the inorganic filler is at least one selected from silicates, carbonates, sulfates and oxides. 4. The container for packaging electronic parts according to claim 2, wherein the inorganic filler is at least one selected from silicates, carbonates, sulfates and oxides.