JP2006212851A - Thermoplastic resin laminated sheet and its molded product - Google Patents
Thermoplastic resin laminated sheet and its molded product Download PDFInfo
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Abstract
Description
本発明は、真空成形等の熱成形によって、ＩＣやＩＣを用いた電子機器部品等の包装に用いられる容器に成形される熱可塑性樹脂シート及びその成形体に関する。 The present invention relates to a thermoplastic resin sheet molded into a container used for packaging of an IC or an electronic device part using the IC by thermoforming such as vacuum forming, and a molded body thereof.
従来からＩＣやＩＣを用いた電子機器部品の包装形態として、熱可塑性樹脂からなるシートを、真空成形等の熱成形によって、複数の電子機器部品を整列して収納できるトレーやキャリアテープ等の容器に成形され、その表面が帯電防止処理されたものが用いられている。このような用途に用いられる熱可塑性樹脂シートとして、ポリスチレン系樹脂からなる基材層の表面に、カーボンブラックを含有する導電性のポリスチレン系樹脂組成物を積層した積層シートが知られている（例えば特許文献１、２）。
これらのシートには、（１）真空成形等の手段によって、該シートを成形型の複雑な形状に正確に成形することができること（賦形性）、（２）成形により得られた容器が、ＩＣ等の内容物を十分に保護するだけの剛性や耐衝撃性を有すること、（３）ＩＣ等の内容物を、静電気障害から保護する為に十分な表面導電性を有すること（帯電防止性）が要求される。
Conventionally, as a packaging form of ICs and electronic device parts using ICs, containers such as trays and carrier tapes that can store a plurality of electronic device parts aligned by thermoforming such as vacuum forming of thermoplastic resin sheets The one whose surface is antistatic treated is used. As a thermoplastic resin sheet used for such applications, a laminate sheet is known in which a conductive polystyrene resin composition containing carbon black is laminated on the surface of a base material layer made of polystyrene resin (for example, Patent Documents 1 and 2).
In these sheets, (1) the sheet can be accurately formed into a complicated shape of a forming die by means such as vacuum forming (shape forming property), and (2) a container obtained by forming, It must have sufficient rigidity and impact resistance to sufficiently protect the contents such as IC, and (3) it must have sufficient surface conductivity to protect the contents such as IC from static electricity damage (antistatic properties). ) Is required.
近年ＩＣ等の継続的な小型化により、このような容器には極めて高い寸法精度が要求されるようになってきており、そのような要求に応えるために、前記のシートを真空成形する際には、成形温度を上げて成形することが必要となるが、そうするとシートを加熱した際にシートが垂れ下がるいわゆるドローダウンと呼ばれる現象が大きくなり、ブリッジの発生といったような成形不良が起こることがあった。
一方で、低い成形温度で良好な賦形性を得る方法として、成形金型とプラグ型を用いて成形する方法があるが、このような方法では、金型やプラグ型の取り付けに手間がかかるため生産効率が低下する。
On the other hand, as a method for obtaining good formability at a low molding temperature, there is a method of molding using a molding die and a plug die, but in such a method, it takes time to attach the die and the plug die. Therefore, production efficiency is reduced.
本発明は、かかる欠点を解決するものであり、前記のようなプラグ型を用いた成形を行わなくても、ドローダウンが問題とならず、肉厚分布が良好な成形品を得る事が可能であり、機械的強度、剛性、耐衝撃性に優れ、且つ静電気障害を十分抑制できる容器が得られる熱可塑性樹脂積層シート及びその成形体を提供することを課題とする。 The present invention solves such drawbacks, and it is possible to obtain a molded product having a good thickness distribution without causing a problem of drawdown without molding using the plug mold as described above. It is an object of the present invention to provide a thermoplastic resin laminated sheet and a molded body thereof that can provide a container that is excellent in mechanical strength, rigidity, and impact resistance and that can sufficiently suppress electrostatic damage.
即ち本発明の第１の発明は、 ポリスチレン系樹脂（Ａ）１００質量部に対して、スチレン−共役ジエンブロック共重合体系樹脂（Ｂ）を２〜３０質量部含有してなる樹脂組成物からなる基材層の両面に、導電性樹脂組成物からなる表皮層が形成されていて、総厚に対する表皮層の厚みが３〜３０％である熱可塑性樹脂積層シートである。
第２の発明は、スチレン−共役ジエンブロック共重合体系樹脂（Ｂ）中の共役ジエン含有量が１０〜３０質量％であり、重量平均分子量（Ｍｗ）が５万〜２０万であり、スチレン−共役ジエンブロック共重合体系樹脂（Ｂ）のブロック率が７０〜１００質量％である第１の発明に記載のシートである。
第３の発明は、表皮層が、ポリスチレン系樹脂（Ａ）１００質量部に、カーボンブラック（Ｃ）５〜５０質量部を含有し、ポリスチレン系樹脂（Ａ）とカーボンブラック（Ｃ）の合計量１００質量部に対し、エチレン・アクリル酸エチル共重合体（Ｄ）を１〜３０質量部、及びポリエチレン樹脂（Ｅ）を１〜３０質量部を含有した導電性樹脂組成物からなり、かつその表面固有抵抗値が１０２〜１０１０Ωである第１又は第２の発明に記載のシートである。そして第４の発明は、第１〜３のいずれか１の発明のシートからなる成形体である。
That is, 1st invention of this invention consists of a resin composition formed by containing 2-30 mass parts of styrene-conjugated diene block copolymer resin (B) with respect to 100 mass parts of polystyrene-type resin (A). It is a thermoplastic resin laminated sheet in which a skin layer made of a conductive resin composition is formed on both surfaces of a base material layer, and the thickness of the skin layer with respect to the total thickness is 3 to 30%.
In the second invention, the conjugated diene content in the styrene-conjugated diene block copolymer resin (B) is 10 to 30% by mass, the weight average molecular weight (Mw) is 50,000 to 200,000, and styrene- It is a sheet | seat as described in 1st invention whose block rate of conjugated diene block copolymerization type | system | group resin (B) is 70-100 mass%.
In the third invention, the skin layer contains 5 to 50 parts by mass of carbon black (C) in 100 parts by mass of polystyrene resin (A), and the total amount of polystyrene resin (A) and carbon black (C). It consists of a conductive resin composition containing 1 to 30 parts by mass of ethylene / ethyl acrylate copolymer (D) and 1 to 30 parts by mass of polyethylene resin (E) with respect to 100 parts by mass, and its surface The sheet according to the first or second invention, wherein the specific resistance value is 10 2 to 10 10 Ω. And 4th invention is a molded object which consists of a sheet | seat of any one of 1st-3rd invention.
本発明の導電性易成形シートは、熱成形する際にプラグ型を用いた成形を行わなくても、ドローダウンが問題とならず、肉厚分布が良好な成形品を得る事が可能であり、熱成形によって得られた成形体は、機械的強度、剛性、耐衝撃性に優れ、且つ静電気障害を十分抑制でき、且つ電子部品等との接触・摩耗が原因となるカーボンブラックの脱離が抑制された容器として用いることができる。 The conductive easily molded sheet of the present invention does not cause a problem of drawdown without performing molding using a plug mold during thermoforming, and it is possible to obtain a molded product having a good thickness distribution. The molded body obtained by thermoforming is excellent in mechanical strength, rigidity, and impact resistance, can sufficiently suppress static electricity damage, and is free from detachment of carbon black due to contact and wear with electronic components. It can be used as a suppressed container.
以下、本発明を更に詳細に説明する。
本発明で使用するポリスチレン系樹脂（Ａ）とは、スチレン、ｏ―メチルスチレン、ｐ―メチルスチレン、ｐ−ｔｅｒｔ―ブチルスチレン、１，３―ジメチルスチレン、α―メチルスチレン、ビニルナフタレン、ビニルアントラセン、１，１―ジフェニルエチレン等の芳香族ビニル化合物を単量体とする一般にGPPSと呼ばれる樹脂、及び一般に耐衝撃性ポリスチレン樹脂（HIPS）といわれるゴム変成された樹脂も含まれる。これらポリスチレン系樹脂は、単独で用いることもできるし２種以上を併用してもよい。
Hereinafter, the present invention will be described in more detail.
The polystyrene resin (A) used in the present invention is styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene. Further, a resin generally called GPPS having an aromatic vinyl compound such as 1,1-diphenylethylene as a monomer and a rubber-modified resin generally called an impact-resistant polystyrene resin (HIPS) are also included. These polystyrene resins can be used alone or in combination of two or more.
本発明で使用するスチレン−共役ジエンブロック共重合体（Ｂ）は、スチレン及びブタジエン等の共役ジエンをリチウム系等のアニオン触媒を用いて共重合した樹脂であって、その分子構造としてはリニア（直鎖状）型、星（ラジアルテレブロック）型、又はテーパー型等が挙げられる。これらのうち、十分な剛性やシートの熱成形の際の良好な延伸性が得られるという点でテーパー型が好ましい。又、該共重合体中のジエン含有量は、１０〜３０質量％であり、更に好ましくは１５〜２８質量％である。この範囲のもの用いることで、剛性と耐衝撃性のいずれも良好なシートを得ることができる。また、この樹脂の重量平均分子量は、良好なシートを得るという観点から５〜２０万のものが好ましい。又、ブロック率は、７０〜１００質量％以上のものが好ましく、さらに好ましくは７５質量％以上である。ブロック率が７０質量％未満であると十分な剛性と耐衝撃性が得られない恐れがある。 The styrene-conjugated diene block copolymer (B) used in the present invention is a resin obtained by copolymerizing a conjugated diene such as styrene and butadiene using an anion catalyst such as lithium, and the molecular structure thereof is linear ( A linear type, a star (radial teleblock) type, a tapered type, and the like can be given. Of these, the taper type is preferable in that sufficient rigidity and good stretchability during thermoforming of the sheet can be obtained. The diene content in the copolymer is 10 to 30% by mass, more preferably 15 to 28% by mass. By using a material in this range, a sheet having good rigidity and impact resistance can be obtained. The weight average molecular weight of this resin is preferably from 50,000 to 200,000 from the viewpoint of obtaining a good sheet. The block ratio is preferably 70 to 100% by mass or more, and more preferably 75% by mass or more. If the block ratio is less than 70% by mass, sufficient rigidity and impact resistance may not be obtained.
本発明の積層シートの基材層は、ポリスチレン系樹脂（Ａ）１００質量部に対して、前記のスチレン−共役ジエンブロック共重合体（Ｂ）を２〜３０質量部含有した樹脂組成物からなる。その含有量が２質量部未満では成形性を改善する上で十分な効果が得られず、３０質量部を超えると剛性が損なわれる。又、この基材層を構成する樹脂組成物は、本発明の効果を阻害しない範囲で、顔料、各種フィラー、酸化防止剤、滑剤等の添加剤を添加することができる。 The base material layer of the laminated sheet of the present invention comprises a resin composition containing 2 to 30 parts by mass of the styrene-conjugated diene block copolymer (B) with respect to 100 parts by mass of the polystyrene resin (A). . If the content is less than 2 parts by mass, a sufficient effect for improving the moldability cannot be obtained, and if it exceeds 30 parts by mass, the rigidity is impaired. Moreover, the resin composition which comprises this base material layer can add additives, such as a pigment, various fillers, antioxidant, a lubricant, in the range which does not inhibit the effect of this invention.
本発明の表皮層は、前記基材層の両面に、熱可塑性樹脂にカーボンブラック等の導電性にフィラーを添加した導電性樹脂組成物の層を形成した層であるが、その熱可塑性樹脂として、ポリスチレン系樹脂（Ａ）を主成分としたものを用いると、基材層と良好な接着性が得られるので好ましい。更に、本発明においては、この表皮層としてポリスチレン系樹脂（Ａ）１００質量部に、カーボンブラック５〜５０質量部を含有し、ポリスチレン系樹脂（Ａ）とカーボンブラック（Ｃ）の合計量１００質量部に対し、エチレン・アクリル酸エチル共重合体（Ｄ）を１〜３０質量部、及びエチレン系樹脂（Ｅ）を１〜３０質量部を含有した導電性樹脂組成物からなることが好ましい。かつその表面固有抵抗値が１０２〜１０１０Ωであることが好ましい。 The skin layer of the present invention is a layer in which a layer of a conductive resin composition in which a filler such as carbon black is added to a thermoplastic resin is formed on both surfaces of the base material layer. It is preferable to use a polystyrene resin (A) as a main component because good adhesion to the base material layer can be obtained. Furthermore, in this invention, 5-50 mass parts of carbon black is contained in 100 mass parts of polystyrene-type resin (A) as this skin layer, and the total amount of polystyrene-type resin (A) and carbon black (C) is 100 masses. It is preferable to consist of a conductive resin composition containing 1 to 30 parts by mass of the ethylene / ethyl acrylate copolymer (D) and 1 to 30 parts by mass of the ethylene-based resin (E) with respect to parts. And it is preferable that the surface specific resistance value is 10 < 2 > -10 < 10 > (omega | ohm).
前記のカーボンブラックの種類としては、ファーネスブラック、チャンネルブラック、アセチレンブラック等を用いることができ、好ましくは比表面積が大きく、樹脂への添加量が少量で高度の導電性が得られるものが好ましい。例えばS.C.F.(Super Conductive Furnace)、E,C,F(Electric Conductive Furnace)、ケッチェンブラック（ライオンーAKZO社製商品名）及びアセチレンブラック等が挙げられる。カーボンブラックの添加量は、表面固有抵抗値が１０２〜１０１０Ωとすることのできる添加量であり、かつポリスチレン系樹脂（Ａ）１００質量部に対し、カーボンブラック（Ｃ）を５〜５０質量部含有が好ましい。添加量が５質量部未満では十分な導電性が得られない恐れがあり、また５０質量部を超えると樹脂との均一分散性が不十分となり、シートの押出し成形加工が困難となる恐れがある。また、表面固有抵抗値１０１０Ωを超えると十分な帯電防止効果が得られない場合があり、逆に１０２Ω未満では、導電性が高すぎて電磁誘導や静電誘導などにより起電力が生じ電子部品を破壊する恐れがある。 As the kind of carbon black, furnace black, channel black, acetylene black and the like can be used, and those having a large specific surface area and a high conductivity with a small amount added to the resin are preferable. Examples thereof include SCF (Super Conductive Furnace), E, C, F (Electric Conductive Furnace), Ketjen Black (product name of Lion-AKZO), and acetylene black. The amount of carbon black added is such that the surface resistivity can be 10 2 to 10 10 Ω, and 5 to 50 carbon black (C) is added to 100 parts by mass of the polystyrene resin (A). The content by mass is preferred. If the amount added is less than 5 parts by mass, sufficient conductivity may not be obtained, and if it exceeds 50 parts by mass, the uniform dispersibility with the resin may be insufficient, and the sheet may be difficult to extrude. . If the surface resistivity exceeds 10 10 Ω, a sufficient antistatic effect may not be obtained. Conversely, if the surface resistivity is less than 10 2 Ω, the conductivity is too high and electromotive force is generated by electromagnetic induction or electrostatic induction. This may damage the electronic components.
本発明の表皮層樹脂組成物に用いるエチレン・アクリル酸エチル共重合体（Ｄ）は、メルトフローインデックス（JIS-K-7210に準じて測定）が１８０℃、荷重２．１６Ｋｇの条件で、１ｇ/１０分以上、２０ｇ/１０分以下であっ、て、該樹脂中のアクリル酸エチル共重合体含有率は１０〜３０質量％のものが好ましい。アクリル酸エチル共重合体含有率が１０質量％未満であると、カーボンブラック（Ｂ）の十分な分散が得られない場合が有り、３０質量％を超えると相溶性の低下によって機械的強度が不十分となる恐れがある。 The ethylene / ethyl acrylate copolymer (D) used in the skin layer resin composition of the present invention has a melt flow index (measured in accordance with JIS-K-7210) of 180 ° C. and a load of 2.16 kg. / 10 minutes or more and 20 g / 10 minutes or less, and the ethyl acrylate copolymer content in the resin is preferably 10 to 30% by mass. When the ethyl acrylate copolymer content is less than 10% by mass, sufficient dispersion of the carbon black (B) may not be obtained. When the content exceeds 30% by mass, the mechanical strength is deteriorated due to a decrease in compatibility. May be enough.
本発明の表皮層樹脂組成物で使用するポリエチレン樹脂（Ｅ）は、低密度ポリエチレン樹脂、高密度ポリエチレン樹脂、直鎖状低密度ポリエチレン樹脂のいずれか１つ以上の樹脂である。且つこれらの樹脂のメルトフローインデックス（JIS-K-7210に準じて測定）は、１９０℃、荷重２．１６Ｋｇの条件で、０．１ｇ/１０分以上、２０ｇ/１０分以下であり、この数値範囲内のものを用いることで、表皮層樹脂組成物中でのカーボンブラック（Ｂ）の良好な分散性が得られる。本発明で使用するポリエチレン樹脂（Ｅ）の添加量は、ポリスチレン系樹脂（Ａ）とカーボンブラック（Ｃ）の混合物１００質量部に対し１〜３０質量部が好ましく、更に好ましくは３〜２８質量部である。添加量が１質量部未満ではその効果が不十分となる場合があり、３０質量部を超えると、カーボンブラック等の脱離の抑制効果が不十分となる恐れがある。さらに、本発明の導電性樹脂組成物には、必要に応じて流動特性を改善するための滑剤、可塑剤、加工助剤、成形品の力学特性を改善するための補助剤のどの各種添加剤及び他の樹脂成分を添加することが可能である。 The polyethylene resin (E) used in the skin layer resin composition of the present invention is one or more of a low density polyethylene resin, a high density polyethylene resin, and a linear low density polyethylene resin. The melt flow index (measured according to JIS-K-7210) of these resins is 0.1 g / 10 min or more and 20 g / 10 min or less under the conditions of 190 ° C. and load 2.16 Kg. By using those within the range, good dispersibility of the carbon black (B) in the skin layer resin composition can be obtained. The addition amount of the polyethylene resin (E) used in the present invention is preferably 1 to 30 parts by mass, more preferably 3 to 28 parts by mass with respect to 100 parts by mass of the mixture of the polystyrene resin (A) and carbon black (C). It is. If the addition amount is less than 1 part by mass, the effect may be insufficient. If the addition amount exceeds 30 parts by mass, the effect of suppressing the elimination of carbon black or the like may be insufficient. Furthermore, the conductive resin composition of the present invention includes various additives such as a lubricant, a plasticizer, a processing aid, and an auxiliary agent for improving the mechanical properties of a molded product, as necessary. And other resin components can be added.
本発明の導電性樹脂組成物は、十分な成形加工性を維持するために、表面固有抵抗値が１０２〜１０１０Ωとなるようにカーボンブラック（Ｂ）を充墳することが好ましいが、その場合においても、良好な表皮層を得る為には、メルトフローインデックス（JIS-K-7210に準じて測定）が、２００℃、荷重５Ｋｇの条件で、０．１ｇ/１０分以上であることが必要である。本発明において、樹脂等の各種原材料を混練、ペレット化するにはバンバリーミキサー、押出機等の公知の方法を用いることが可能である。 The conductive resin composition of the present invention is preferably filled with carbon black (B) so that the surface resistivity is 10 2 to 10 10 Ω in order to maintain sufficient moldability. Even in that case, in order to obtain a good skin layer, the melt flow index (measured according to JIS-K-7210) must be at least 0.1 g / 10 min at 200 ° C. and a load of 5 kg. is required. In the present invention, known methods such as a Banbury mixer and an extruder can be used to knead and pelletize various raw materials such as resins.
本発明の積層シートの基本構成は、前記基材層の両面に表皮層を形成した３層構成であり、積層シートの総厚に対する表皮層の厚みは３〜３０％の範囲で、好ましくは３〜２０％ある。３％未満だと導電性を維持する上で不十分であり、３０％を超えると成形性が不良となる。 The basic structure of the laminated sheet of the present invention is a three-layer structure in which skin layers are formed on both surfaces of the base material layer, and the thickness of the skin layer is 3 to 30% of the total thickness of the laminated sheet, preferably 3 There is ~ 20%. If it is less than 3%, it is insufficient for maintaining the conductivity, and if it exceeds 30%, the moldability becomes poor.
本発明の積層シートを製造する方法は特に限定されるものではなく、従来の積層シートの製造方法、例えば共押出による方法、予め製膜した表皮層のシートを基材層シートの押出と同時に熱ラミする方法、別々に押出したシートをラミネートする方法等で製造することが出来る。前記の共押出する方法では、フィードブロック方式やマルチマニホールド方式等、通常用いられる方法で積層シートを得る事ができる。 The method for producing the laminated sheet of the present invention is not particularly limited, and a conventional laminated sheet producing method, for example, a method by co-extrusion, a pre-formed skin layer sheet is heated simultaneously with the extrusion of the base material layer sheet. It can be produced by a method of laminating or a method of laminating separately extruded sheets. In the co-extrusion method, a laminated sheet can be obtained by a commonly used method such as a feed block method or a multi-manifold method.
以下、本発明を実施例によりさらに詳細に説明する。
（実施例１〜７）
表１に示す原料組成割合にて原料を各々計量し、高速混合により均一に混合した後、Φ４５ｍｍベント式二軸押出機をもちいて混練し、ストランドカット法によりペレット化した。次にペレット化した樹脂組成物を、Φ６５ｍｍ押出機(L/D=28)を用い５００幅のＴダイにより、厚さ０．７ｍｍのシート状に成形したものを評価用のサンプルとした。評価結果を表３に示した。各実施例において熱成形が良好な導電性シートが得られた。
Hereinafter, the present invention will be described in more detail with reference to examples.
(Examples 1-7)
The raw materials were weighed at the raw material composition ratios shown in Table 1 and uniformly mixed by high speed mixing, then kneaded using a Φ45 mm bent twin screw extruder, and pelletized by the strand cut method. Next, the pelletized resin composition was molded into a 0.7 mm thick sheet using a Φ65 mm extruder (L / D = 28) by a 500-width T-die, and used as a sample for evaluation. The evaluation results are shown in Table 3. In each example, a conductive sheet with good thermoforming was obtained.
（比較例１〜４）
実施例１と同様にして、使用する原料を、表２に示す原料を各々計量し、高速混合により均一に混合した後、Φ４５ｍｍベント式二軸押出機をもちいて混練し、ストランドカット法によりペレット化した。次にペレット化した樹脂組成物を、サンプルΦ６５ｍｍ押出機(L/D=28)を用い５００幅のＴダイにより、厚さ０．７ｍｍのシート状に成形したものを評価用のサンプルとした。評価結果を表４に示した。各比較例においては熱成形が良好な導電性シートは得られなかった。
(Comparative Examples 1-4)
In the same manner as in Example 1, the raw materials shown in Table 2 were weighed and mixed uniformly by high speed mixing, then kneaded using a Φ45 mm vent type twin screw extruder, and pelletized by the strand cutting method. Turned into. Next, the pelletized resin composition was molded into a 0.7 mm thick sheet using a sample Φ65 mm extruder (L / D = 28) by a 500-width T die, and used as a sample for evaluation. The evaluation results are shown in Table 4. In each comparative example, a conductive sheet with good thermoforming was not obtained.
（評価方法）
尚、表３及び表４煮染め下各種評価は、以下に示す方法によって行った。
（１）表面固有抵抗
ローレスター表面抵抗計（三菱化学社製）により電極間を１０ｍｍとしサンプル中任意の１０点を測定し、その対数平均値を表面固有抵抗値とした。
（２）成形不良の有無
各シートを単発成形機（浅野研究所社製）にて、下記のカップ形状４個と角錐台形状２個を有する容器（３６０×２６０ｍｍ）を成形し（ｎ＝１０）、その成形品の不良の発生が１０個中いくつ発生したかで評価した。
カップ形状：フランジ径：４０ｍｍ、底部径：３０、高さ：４５ｍｍ
角錐台形状：フランジ部：４０×８０ｍｍ、底部：３０×７０ｍｍ、高さ：４５ｍｍ
（３）深絞り適正
各シートを単発成形機（浅野研究所社製）にて、内径９５ｍｍ、高さ９５ｍｍの雌型のみを用いて成形し（ｎ＝１０）、１０個の成形品のすべてが、形状が良好で側部や底部での破れ等がないものを「良好」とし、１個でも何らかの異常が認められたものを「不良」とした。
(Evaluation methods)
Table 3 and Table 4 Various evaluations under boiled dyeing were performed by the following methods.
(1) Surface specific resistance A 10-mm gap between the electrodes was measured with a Lorester surface resistance meter (manufactured by Mitsubishi Chemical Corporation), and any 10 points in the sample were measured. The logarithmic average value was defined as the surface specific resistance value.
(2) Presence / absence of molding failure Each sheet is molded with a single molding machine (manufactured by Asano Laboratories) into a container (360 × 260 mm) having the following four cup shapes and two pyramid shapes (n = 10). ), The number of occurrences of defects in the molded product was evaluated.
Cup shape: Flange diameter: 40 mm, bottom diameter: 30, height: 45 mm
Pyramidal frustum shape: flange: 40 x 80 mm, bottom: 30 x 70 mm, height: 45 mm
(3) Appropriate deep drawing Each sheet is molded with a single molding machine (manufactured by Asano Laboratories) using only a female mold having an inner diameter of 95 mm and a height of 95 mm (n = 10). However, those having a good shape and having no tear at the side or bottom were defined as “good”, and those having any abnormality were regarded as “bad”.
Claims (4)
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| JP2011006611A (en) * | 2009-06-26 | 2011-01-13 | Taihei Kagaku Seihin Kk | Electroconductive resin composition, electroconductive sheet, and static interference-protected molding |
| CN104175671A (en) * | 2014-08-13 | 2014-12-03 | 福建师范大学 | Preparation method of low-temperature and tearing resistant thin film of three-layer composite structure |
| WO2018084129A1 (en) * | 2016-11-01 | 2018-05-11 | デンカ株式会社 | Surface-conductive laminated sheet and electronic component packaging container |
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