JP3276818B2 - Conductive composite plastic sheet and container - Google Patents
Conductive composite plastic sheet and containerInfo
- Publication number
- JP3276818B2 JP3276818B2 JP23996395A JP23996395A JP3276818B2 JP 3276818 B2 JP3276818 B2 JP 3276818B2 JP 23996395 A JP23996395 A JP 23996395A JP 23996395 A JP23996395 A JP 23996395A JP 3276818 B2 JP3276818 B2 JP 3276818B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sheet
- conductive
- composite plastic
- plastic sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims description 17
- 239000002985 plastic film Substances 0.000 title claims description 16
- 229920005989 resin Polymers 0.000 claims description 69
- 239000011347 resin Substances 0.000 claims description 69
- 239000011342 resin composition Substances 0.000 claims description 26
- 239000006229 carbon black Substances 0.000 claims description 23
- 229920001955 polyphenylene ether Polymers 0.000 claims description 21
- 238000004806 packaging method and process Methods 0.000 claims description 20
- 229920005992 thermoplastic resin Polymers 0.000 claims description 17
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 13
- 239000004711 α-olefin Substances 0.000 claims description 13
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229920005990 polystyrene resin Polymers 0.000 claims description 9
- 238000007666 vacuum forming Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 238000011109 contamination Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 241000872198 Serjania polyphylla Species 0.000 claims 1
- 238000000034 method Methods 0.000 description 22
- 239000004793 Polystyrene Substances 0.000 description 9
- 229920002223 polystyrene Polymers 0.000 description 9
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 8
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000005299 abrasion Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- 101100160821 Bacillus subtilis (strain 168) yxdJ gene Proteins 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ等との接触時の摩
耗によるカーボンブラック等の脱離が原因となるＩＣ等
の汚染を著しく減少させた半導体包装に適する導電性複
合プラスチックシート及び該シートを成形してなる導電
性プラスチック容器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive composite plastic sheet suitable for semiconductor packaging, in which contamination of an IC or the like caused by detachment of carbon black or the like due to abrasion at the time of contact with the IC or the like is remarkably reduced. The present invention relates to a conductive plastic container formed by molding a sheet.
【０００２】[0002]
【従来の技術】従来からＩＣやＩＣを用いた電子部品の
包装形態としてインジェクショントレー、真空成形トレ
ー、マガジン、エンボスキャリアテープなどが使用され
ており、これらの包装容器には静電気によるＩＣ等の破
壊を防止するために（１）包装容器の表面に帯電防止剤
を塗布する方法、（２）導電性塗料を塗布する方法、
（３）帯電防止剤を分散させる方法、（４）導電性フィ
ラーを分散させる方法等が実施されている。2. Description of the Related Art Injection trays, vacuum forming trays, magazines, embossed carrier tapes, and the like have conventionally been used as packaging forms for ICs and electronic components using ICs. (1) a method of applying an antistatic agent to the surface of a packaging container, (2) a method of applying a conductive paint,
(3) A method of dispersing an antistatic agent, (4) A method of dispersing a conductive filler, and the like have been implemented.
【０００３】しかしながら、（１）の方法は、塗布直後
は十分な帯電防止効果を示すが、長時間の使用により、
水分による流出、摩耗による帯電防止剤の脱離が生じ易
く安定した性能が得られない。また表面固有抵抗値も１
０9〜１０12Ω程度であり厳しい帯電防止効果を要求さ
れるＩＣの包装には不適当である。（２）の方法は、製
造時において塗布が不均一となり易くまた摩耗による剥
がれ落ちのため帯電防止効果を失いＩＣを破壊すると共
にＩＣのリード部を汚染するという欠点がある。（３）
の方法は、帯電防止剤を多量に添加する必要があるため
樹脂の物性を低下させ、また表面固有抵抗値が湿度によ
り大きく影響され安定した性能が得られない。（４）の
方法の導電性フィラーとしては（ａ）金属微粉末、
（ｂ）カーボンファイバー、（ｃ）カーボンブラックな
どが挙げられる。この内（ａ）金属微粉末及び（ｂ）カ
ーボンファイバーは少量の添加で十分な導電性が得られ
るが成形性が著しく低下し、また均一に分散させること
が難しくかつ成形品の表面に樹脂成分のみのスキン層が
出来易く安定した表面固有抵抗値が得られにくい。[0003] However, the method (1) shows a sufficient antistatic effect immediately after coating, but the method (1),
The antistatic agent is likely to be detached due to outflow due to moisture and abrasion, and stable performance cannot be obtained. The surface resistivity is also 1
0 is unsuitable for 9 to 10 12 Omega about a and packaging of IC that requires strict antistatic effect. The method (2) has the drawbacks that the coating tends to be non-uniform at the time of manufacture, and the anti-static effect is lost due to peeling off due to abrasion, thereby destroying the IC and contaminating the IC lead. (3)
In the method (1), it is necessary to add a large amount of an antistatic agent, so that the physical properties of the resin are deteriorated, and the surface specific resistance value is greatly affected by humidity, so that stable performance cannot be obtained. As the conductive filler in the method (4), (a) metal fine powder,
(B) carbon fiber, (c) carbon black and the like. Among them, (a) fine metal powder and (b) carbon fiber can obtain sufficient conductivity by adding a small amount, but the moldability is significantly reduced, it is difficult to disperse uniformly, and the resin component is present on the surface of the molded product. Only a skin layer is easily formed, and it is difficult to obtain a stable surface specific resistance value.
【０００４】これらに対し（ｃ）カーボンブラックは、
混練条件等の検討により均一に分散させることが可能で
あり、安定した表面固有抵抗値が得られ易いことから一
般的に使用されているが、カーボンブラックを多量に添
加する必要が有るため流動性や成形性が低下する現象が
ある。On the other hand, (c) carbon black is
It is generally used because it can be uniformly dispersed by examining the kneading conditions, etc., and it is easy to obtain a stable surface specific resistance value. And a phenomenon that the moldability decreases.
【０００５】従来、カーボンブラックを分散させる樹脂
としては、一般用としてポリ塩化ビニル系樹脂、ポリプ
ロピレン系樹脂、ポリエチレンテレフタレート系樹脂、
ポリスチレン系樹脂及びＡＢＳ系樹脂が、また１００℃
以上での耐熱用としてポリフェニレンエーテル系樹脂、
ポリカーボネート樹脂などが用いられている。これらの
樹脂のなか一般用としてはポリスチレン系樹脂が、また
耐熱用においてはポリフェニレンエーテル系樹脂が、他
の樹脂に比べカーボンブラックを多量に添加しても流動
性や成形性の著しい低下がなく、さらにコストの面でも
優れている。更にこれら導電化した樹脂から得られるシ
ートの成形性や機械的強度、更に該シートを成形て得ら
れる包装容器の機械的強度を改善する方法として、特開
昭５７−２０５１４５、特開昭６２−１８２６１等が提
案されている。しかしながらこれらの樹脂にカーボンブ
ラックを多量に添加した組成物の成形品は、摩耗により
成形品の表面から、カーボンブラックが脱離し易いとい
う欠点があった。Conventionally, as resins for dispersing carbon black, polyvinyl chloride resins, polypropylene resins, polyethylene terephthalate resins for general use,
Polystyrene resin and ABS resin, 100 ℃
Polyphenylene ether resin for heat resistance above,
Polycarbonate resin and the like are used. Among these resins, polystyrene resins are used for general purposes, and polyphenylene ether resins are used for heat resistance. It is also excellent in cost. Further, as a method for improving the moldability and mechanical strength of a sheet obtained from these conductive resins, and further improving the mechanical strength of a packaging container obtained by molding the sheet, JP-A-57-205145 and JP-A-62-205 18261 and the like have been proposed. However, molded articles of the composition obtained by adding a large amount of carbon black to these resins have a disadvantage that carbon black is easily detached from the surface of the molded article due to abrasion.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、かかる欠点
を解決するものであり、ポリフェニレンエーテル系樹
脂、ポリスチレン系樹脂又はＡＢＳ系樹脂から選ばれた
少なくとも１種類の熱可塑性樹脂からなるシート基材の
両面にポリフェニレンエーテル系樹脂、ポリスチレン系
樹脂又はＡＢＳ系樹脂から選ばれた少なくとも１種類の
熱可塑性樹脂及びカーボンブラックからなる導電性樹脂
組成物を積層したシートにおいて、該導電性樹脂組成物
にエチレン−α−オレフィン共重合体樹脂を含有させる
ことにより、ＩＣ等との接触時の摩耗によるカーボンブ
ラック等の脱離が原因となるＩＣ等の汚染を著しく減少
させた導電性複合プラスチックシート及び該シートを成
形してなる導電性プラスチック容器を提供することを目
的とするものである。SUMMARY OF THE INVENTION The present invention solves the above-mentioned drawbacks and provides a sheet substrate made of at least one kind of thermoplastic resin selected from polyphenylene ether resin, polystyrene resin and ABS resin. A sheet in which at least one type of thermoplastic resin selected from a polyphenylene ether-based resin, a polystyrene-based resin or an ABS-based resin and a carbon black are laminated on both surfaces of the conductive resin composition, A conductive composite plastic sheet and a sheet, which contain an α-olefin copolymer resin to significantly reduce contamination of ICs and the like caused by detachment of carbon black and the like due to abrasion at the time of contact with the ICs and the like; It is an object to provide a conductive plastic container formed by molding
【０００７】[0007]
【課題を解決するための手段】すなわち、本発明の第１
の発明は、ポリフェニレンエーテル系樹脂、ポリスチレ
ン系樹脂又はＡＢＳ系樹脂から選ばれた少なくとも１種
類の熱可塑性樹脂からなるシート基材の両面に、（Ａ）
ポリフェニレンエーテル系樹脂、ポリスチレン系樹脂又
はＡＢＳ系樹脂から選ばれた少なくとも１種類の熱可塑
性樹脂、（Ｂ）カーボンブラック、（Ｃ）エチレン−α
−オレフィン共重合体樹脂からなる導電性樹脂組成物を
積層したシートにおいて、（イ）前記導電性樹脂組成物
が（Ａ）熱可塑性樹脂１００重量部に対し（Ｂ）カーボ
ンブラック５〜５０重量部を含有し、かつ、前記（Ａ）
熱可塑性樹脂と（Ｂ）カーボンブラックの合計量１００
重量部に対し、ＪＩＳ−Ｋ−７２１５によるデユロメー
タＡ型表面硬度が９０以下の（Ｃ）エチレン−α−オレ
フィン共重合体樹脂１〜３０重量部を含有してなり、か
つ、（ロ）導電性樹脂組成物を積層したシートの表面固
有抵抗値が１０2 〜１０10Ωの導電性複合プラスチック
シートである。本発明の第２の発明は、第１の発明の導
電性複合プラスチックシートを圧空成形、真空成形、熱
板成形などにより成形した導電性プラスチック容器であ
る。That is, the first aspect of the present invention is as follows.
The invention of (1) relates to a sheet substrate made of at least one kind of thermoplastic resin selected from polyphenylene ether-based resin, polystyrene-based resin and ABS-based resin,
At least one thermoplastic resin selected from polyphenylene ether-based resins, polystyrene-based resins, and ABS-based resins, (B) carbon black, (C) ethylene-α
-In a sheet in which a conductive resin composition comprising an olefin copolymer resin is laminated, (A) the conductive resin composition is (A) 100 parts by weight of a thermoplastic resin and (B) 5 to 50 parts by weight of carbon black. And (A)
Total amount of thermoplastic resin and carbon black (B) 100
(C) 1 to 30 parts by weight of an ethylene-α-olefin copolymer resin having a durometer A type surface hardness of 90 or less based on JIS-K-7215, and (b) conductivity This is a conductive composite plastic sheet having a sheet having a resin composition laminated thereon and having a surface specific resistance of 10 2 to 10 10 Ω. A second invention of the present invention is a conductive plastic container obtained by forming the conductive composite plastic sheet of the first invention by air pressure forming, vacuum forming, hot plate forming or the like.
【０００８】以下、本発明を更に詳細に説明する。本発
明においては、基材シート及び導電性樹脂組成物にそれ
ぞれポリフェニレンエーテル系樹脂、ポリスチレン系樹
脂又はＡＢＳ系樹脂から選ばれた少なくとも１種類の熱
可塑性樹脂が使用される。該ポリフェニレンエーテル系
樹脂とはポリフェニレンエーテル樹脂とポリスチレン系
樹脂を主成分とする樹脂をいい、ポリフェニレンエーテ
ル樹脂とポリスチレン系樹脂の合計量１００重量部中の
ポリフェニレンエーテル樹脂の含有量は２８〜８６重量
部が好ましく、２８重量部未満ではポリフェニレンエー
テル系樹脂としての十分な力学特性が得られず、８６重
量部を越えると流動性の低下により成形加工が困難とな
る。該ポリフェニレンエーテル樹脂とは米国特許３３８
３４３５号に記載されているホモポリマー或いは共重合
体が示される。Hereinafter, the present invention will be described in more detail. In the present invention, at least one kind of thermoplastic resin selected from polyphenylene ether-based resin, polystyrene-based resin and ABS-based resin is used for the base sheet and the conductive resin composition, respectively. The polyphenylene ether-based resin refers to a resin having a polyphenylene ether resin and a polystyrene-based resin as main components, and the content of the polyphenylene ether resin in the total amount of 100 parts by weight of the polyphenylene ether resin and the polystyrene-based resin is 28 to 86 parts by weight. If the amount is less than 28 parts by weight, sufficient mechanical properties as a polyphenylene ether-based resin cannot be obtained. If the amount exceeds 86 parts by weight, the fluidity is reduced and molding processing becomes difficult. The polyphenylene ether resin is described in US Pat.
The homopolymer or copolymer described in No. 3435 is shown.
【０００９】本発明で使用するポリスチレン系樹脂とは
一般のポリスチレン樹脂又は耐衝撃性ポリスチレン樹脂
及びこれらの混合物を主成分とするものをいう。ＡＢＳ
系樹脂とはアクリルニトリル−ブタジエン−スチレンの
三成分を主体とした共重合体を主成分とするものをい
う。The polystyrene resin used in the present invention refers to a resin mainly composed of a general polystyrene resin or impact-resistant polystyrene resin and a mixture thereof. ABS
The term "based resin" means a resin mainly composed of a copolymer mainly composed of three components of acrylonitrile-butadiene-styrene.
【００１０】本発明で導電性樹脂組成物中に含有する
（Ｂ）カーボンブラックは、ファーネスブラック、チャ
ンネルブラック、アセチレンブラック等であり、好まし
くは比表面積が大きく、樹脂への添加量が少量で高度の
導電性が得られるものである。例えばＳ．Ｃ．Ｆ．（Ｓ
ｕｐｅｒ Ｃｏｎｄｕｃｔｉｖｅ Ｆｕｒｎａｃｅ）、
Ｅ．Ｃ．Ｆ．（Ｅｌｅｃｔｒｉｃ Ｃｏｎｄｕｃｔｉｖ
ｅ Ｆｕｒｎａｃｅ）、ケッチェンブラック（ライオン
−ＡＫＺＯ社製商品名）及びアセチレンブラックであ
る。カーボンブラックの添加量は、基材シートに積層し
た状態で表面固有抵抗値を１０2 〜１０10Ωとすること
のできる添加量であり、かつ（Ａ）熱可塑性樹脂１００
重量部に対し（Ｂ）カーボンブラック５〜５０重量部が
好ましい。添加量が５重量部未満では十分な導電性が得
られず表面固有抵抗値が上昇してしまい、５０重量部を
越えると樹脂との均一分散性の悪化、成形加工性の著し
い低下、機械的強度等の特性値が低下してしまう。ま
た、表面固有抵抗値が１０10Ωを越えると十分な帯電防
止効果が得られず、１０2 Ω未満では、発電能が良すぎ
てＩＣを破壊する恐れがある。The carbon black (B) contained in the conductive resin composition of the present invention is furnace black, channel black, acetylene black or the like, and preferably has a large specific surface area and a small amount of addition to the resin. Is obtained. For example, C. F. (S
upper Conductive Furnace),
E. FIG. C. F. (Electric Conductiv
e Furnace), Ketjen Black (trade name, manufactured by Lion-AKZO) and acetylene black. The amount of carbon black added is such that the surface specific resistance value can be set to 10 2 to 10 10 Ω in a state of being laminated on the base sheet, and (A) the thermoplastic resin 100
(B) 5 to 50 parts by weight of carbon black is preferred based on parts by weight. If the added amount is less than 5 parts by weight, sufficient conductivity cannot be obtained and the surface resistivity increases, and if it exceeds 50 parts by weight, the uniform dispersibility with the resin deteriorates, the moldability decreases significantly, Characteristic values such as strength are reduced. On the other hand, if the surface specific resistance exceeds 10 10 Ω, a sufficient antistatic effect cannot be obtained. If the surface specific resistance is less than 10 2 Ω, the power generation capability is so good that the IC may be broken.
【００１１】本発明で使用する（Ｃ）エチレン−α−オ
レフィン共重合体樹脂は、エチレンとα−オレフィンを
共重合した樹脂をいい、エチレンと共重合するα−オレ
フィンとしては、プロピレン、ブテンー１、ペンテンー
１、ヘキセンー１等があり、例えば、三井石油化学社、
「タフマーＰ」及び「タフマーＡ」等である。エチレン
−α−オレフィン共重合体樹脂はＪＩＳ−Ｋ−７２１５
で言うデユロメータＡ型表面硬度が９０以下のものが好
ましく、メルトフローインデックス（ＪＩＳＫ−７２１
０に準じ測定）は、１９０℃、荷重２．１６ｋｇの条件
で０．１ｇ／１０分以上であり、この数値未満ではポリ
フェニレンエーテル系樹脂、ポリスチレン系樹脂、ＡＢ
Ｓ系樹脂との混練が困難となり、良好な組成物が得られ
ない。エチレン−α−オレフィン共重合体樹脂の添加量
は、熱可塑性樹脂とカーボンブラックの合計量１００重
量部に対して、１〜３０重量部が好ましく、特に好まし
くは３〜２５重量部である。添加量が１重量部未満では
その効果が不十分であり、３０重量部を越えるとポリフ
ェニレンエーテル系樹脂、ポリスチレン系樹脂、ＡＢＳ
系樹脂中に均一に分散させることが困難となる。The ethylene-α-olefin copolymer resin (C) used in the present invention refers to a resin obtained by copolymerizing ethylene and α-olefin, and the α-olefin copolymerized with ethylene includes propylene, butene-1 Pentene-1, hexene-1 and the like. For example, Mitsui Petrochemical Co., Ltd.
"Tuffmer P" and "Tuffmer A". The ethylene-α-olefin copolymer resin is JIS-K-7215
It is preferable that the surface hardness of the durometer A type referred to in the above is 90 or less, and the melt flow index (JISK-721) is used.
0 is 0.1 g / 10 min or more under the conditions of 190 ° C. and a load of 2.16 kg. If the value is less than this value, polyphenylene ether resin, polystyrene resin, AB
Kneading with the S-based resin becomes difficult, and a good composition cannot be obtained. The addition amount of the ethylene-α-olefin copolymer resin is preferably 1 to 30 parts by weight, particularly preferably 3 to 25 parts by weight, based on 100 parts by weight of the total amount of the thermoplastic resin and carbon black. If the amount is less than 1 part by weight, the effect is insufficient, and if it exceeds 30 parts by weight, polyphenylene ether-based resin, polystyrene-based resin, ABS
It becomes difficult to uniformly disperse it in the system resin.
【００１２】本発明における導電性樹脂組成物は十分な
成形加工性を維持するために、該導電性樹脂組成物を積
層したシートの表面固有抵抗値が１０2 〜１０10Ωとな
るようにカーボンブラックを充填した場合、メルトフロ
ーインディックス（ＪＩＳ−Ｋ−７２１０に準じて測
定）が、ポリフェニレンエーテル系樹脂の場合、２３０
℃、荷重１０ｋｇの条件で、ポリスチレン系樹脂の場
合、２００℃、荷重５ｋｇの条件で、ＡＢＳ系樹脂の場
合、２２０℃、荷重１０ｋｇの条件で、それぞれ、０．
１ｇ／１０分以上であることが好ましい。更に、シート
基材の熱可塑性樹脂及び導電性樹脂組成物には、必要に
応じて組成物の流動特性及び成形品の力学特性を改善す
るために、滑剤、可塑剤、加工助剤及び補強剤（樹脂改
質剤）など各種添加剤や他の樹脂成分を添加することが
可能である。The conductive resin composition of the present invention is used in such a manner that a sheet laminated with the conductive resin composition has a surface specific resistance of 10 2 to 10 10 Ω in order to maintain sufficient moldability. When filled with black, the melt flow index (measured according to JIS-K-7210) is 230 when the polyphenylene ether resin is used.
0 ° C., a load of 10 kg, a polystyrene resin at 200 ° C., a load of 5 kg, and an ABS resin at a temperature of 220 ° C., a load of 10 kg.
It is preferably at least 1 g / 10 minutes. Further, the thermoplastic resin and the conductive resin composition of the sheet base may include a lubricant, a plasticizer, a processing aid and a reinforcing agent, if necessary, in order to improve the flow characteristics of the composition and the mechanical properties of the molded product. Various additives such as (resin modifier) and other resin components can be added.
【００１３】本発明の導電性複合プラスチックシートを
製造するには、まず前記導電性樹脂組成物の原料全部又
は一部をバンバリーミキサー、押出機等の公知の方法を
用いて混練、ペレット化し、得られた導電性樹脂組成物
を基材シートとなる熱可塑性樹脂と共に押出機等公知の
方法によってシートとする。導電性樹脂組成物の混練に
際しては、原料を一括して混練することも可能である
し、また例えば、スチレン系樹脂とカーボンブラック、
スチレン系樹脂とエチレン−α−オレフィン共重合体樹
脂を別々に混練し、その混練物を最後に一括して混練す
るといった様に段階的に混練することも可能である。更
に、別々に混練して得られたペレットを押出機によって
シートとする際に同時に混練したり、例えばエチレン−
α−オレフィン共重合体樹脂以外を予め混練し、押出機
によってシートとする際にこれを加えることも可能であ
る。In order to produce the conductive composite plastic sheet of the present invention, first, all or a part of the raw material of the conductive resin composition is kneaded and pelletized by using a known method such as a Banbury mixer or an extruder. The obtained conductive resin composition is formed into a sheet by a known method such as an extruder together with a thermoplastic resin serving as a base sheet. When kneading the conductive resin composition, it is also possible to knead the raw materials collectively, for example, a styrene resin and carbon black,
It is also possible to knead the styrene-based resin and the ethylene-α-olefin copolymer resin separately and to knead them stepwise, for example, to knead the kneaded material at once. Furthermore, when the pellets obtained by separately kneading are formed into a sheet by an extruder, they are kneaded at the same time, for example, ethylene-
It is also possible to knead a material other than the α-olefin copolymer resin in advance and add it when forming a sheet with an extruder.
【００１４】基材シートに導電性樹脂組成物を積層する
方法としては、それぞれを別々に押出機によりシート若
しくはフィルム状に成形した後、熱ラミネート法、ドラ
イラミネート法、押出ラミネート法等により段階的に積
層する事も可能であるし、またフィードブロック、マル
チマニホールドダイ等を使用した多層共押出法により一
括して積層したシートを得ることも可能である。As a method of laminating the conductive resin composition on the base sheet, each of them is separately formed into a sheet or film by an extruder, and then stepwise formed by a heat laminating method, a dry laminating method, an extrusion laminating method or the like. It is also possible to obtain sheets which are collectively laminated by a multilayer coextrusion method using a feed block, a multi-manifold die or the like.
【００１５】本発明のシートの全体の肉厚は０．１〜
３．０ｍｍであり、且つ導電性樹脂組成物層は、基材シ
ートの両面に積層することが必要でる。全体の肉厚に占
める導電性樹脂組成物の厚さの割合は片側それぞれが２
％以上であり両面あわせて８０％以下であることが好ま
しい。全体の肉厚が０．１ｍｍ未満ではシートを成形し
て得られる包装容器としての強度が不足し、３．０ｍｍ
を越えると圧空成形、真空成形、熱板成形などの成形が
困難となる。又、導電性樹脂組成物層がシートの片側に
しかないか若しくは、その全体の肉厚に占める割合が片
面２％未満ではシートを成形して得られる包装容器の表
面固有抵抗値が著しく高くなり十分な静電気防止効果が
得られず、両面あわせて８０％を越えると複合プラスチ
ックシートとしての機械的強度等の特性が低下してしま
う。The total thickness of the sheet of the present invention is 0.1 to
It is 3.0 mm, and the conductive resin composition layer needs to be laminated on both sides of the base sheet. The ratio of the thickness of the conductive resin composition to the total thickness is 2 on each side.
% Or more, and preferably 80% or less on both surfaces. If the total thickness is less than 0.1 mm, the strength as a packaging container obtained by forming a sheet is insufficient, and the thickness is 3.0 mm.
If it exceeds 300, it will be difficult to form such as compressed air forming, vacuum forming, hot plate forming and the like. If the conductive resin composition layer is only on one side of the sheet, or if the proportion of the total thickness is less than 2% on one side, the surface specific resistance value of the packaging container obtained by molding the sheet becomes extremely high, so that it is sufficient. If the combined plastic sheet does not have a sufficient antistatic effect and exceeds 80% on both surfaces, the properties such as the mechanical strength of the composite plastic sheet deteriorate.
【００１６】本発明の導電性複合プラスチックシート
は、半導体包装用として好適であり、さらに、圧空成
形、真空成形、熱板成形など公知のシート成形法により
得られる導電性複合プラスチック容器は、半導体包装用
容器として用いられる。このプラスチック容器とは具体
的にはＩＣを包装する真空成形トレー、マガジン、エン
ボスキャリアテープ及びＩＣを用いた電子部品、電子機
器を包装する真空成形トレー等のことである。The conductive composite plastic sheet of the present invention is suitable for semiconductor packaging. Further, the conductive composite plastic container obtained by a known sheet forming method such as pressure forming, vacuum forming, hot plate forming, etc. Used as a container for The plastic container specifically refers to a vacuum-formed tray for packaging ICs, a magazine, an embossed carrier tape, an electronic component using ICs, a vacuum-formed tray for packaging electronic devices, and the like.
【００１７】[0017]
【実施例】以下、本発明を実施例によりさらに詳細に説
明する。 実施例１〜４ 表１に示す原料を使用し、表２に示す原料組成割合にて
各々計量し、高速混合機により均一混合した後、φ４５
ｍｍベント式二軸押出機を用いて混練し、ストランドカ
ット法によりペレット化し導電性樹脂組成物を得た。次
に表４に示す基材シートと導電性樹脂組成物層との組み
合わせで全体の肉厚に占める基材シートの比率にて行っ
た。各の導電性樹脂組成物を基材シートの両側がほぼ同
じ肉厚となる様にφ６５ｍｍ押出機（Ｌ／Ｄ＝２８）、
φ４０ｍｍ押出機（Ｌ／Ｄ＝２６）及び５００ｍｍ幅の
Ｔダイを用いたフィードブロック法により積層し全体の
肉厚が３００μｍのシートを得た。更に、得られたシー
トを真空成形しＱＦＰ１４ｍｍ×２０ｍｍ／６４ｐｉｎ
のＩＣ包装用真空成形トレー及び同エンボスキャリアテ
ープを得た。評価結果を表５及び表６に示す。各実施例
において、カーボンブラックの脱落は無く良好であっ
た。The present invention will be described in more detail with reference to the following examples. Examples 1-4 Using the raw materials shown in Table 1, each was weighed at the raw material composition ratio shown in Table 2, and uniformly mixed by a high-speed mixer.
The mixture was kneaded using a mm vent type twin screw extruder, and pelletized by a strand cut method to obtain a conductive resin composition. Next, the combination of the base sheet and the conductive resin composition layer shown in Table 4 was carried out at a ratio of the base sheet to the total thickness. Each conductive resin composition is extruded with a φ65 mm extruder (L / D = 28) so that both sides of the base sheet have substantially the same thickness.
The sheets were laminated by a feed block method using a φ40 mm extruder (L / D = 26) and a T die having a width of 500 mm to obtain a sheet having a total thickness of 300 μm. Further, the obtained sheet is vacuum formed and QFP 14 mm × 20 mm / 64 pin
Of a vacuum forming tray for IC packaging and the same embossed carrier tape. The evaluation results are shown in Tables 5 and 6. In each of the examples, the carbon black did not fall off and was good.
【００１８】比較例１〜４ 実施例と同様にして表３に示す原料組成割合にて各々計
量し、高速混合機により均一に混合した後、φ４５ｍｍ
ベント式二軸押出機を用いて混練し、ストランドカット
法によりペレット化し導電性樹脂組成物を得た。次に、
表４に示す基材シートとの組み合わせと全体の肉厚に占
める基材シートの比率にて、実施例と同様に全体の肉厚
が３００μｍシートを得た。更に、得られた複合シート
を真空成形し実施例と同様のＩＣ包装用真空成形トレー
及びエンボスキャリアテープを得た。評価結果を表５及
び表６に示す。Comparative Examples 1 to 4 In the same manner as in the examples, the raw material composition ratios shown in Table 3 were measured and uniformly mixed by a high-speed mixer.
The mixture was kneaded using a vented twin-screw extruder and pelletized by a strand cut method to obtain a conductive resin composition. next,
With the combination with the base sheet shown in Table 4 and the ratio of the base sheet to the total thickness, a sheet having a total thickness of 300 μm was obtained in the same manner as in the example. Further, the obtained composite sheet was vacuum formed to obtain the same vacuum forming tray and embossed carrier tape for IC packaging as in the examples. The evaluation results are shown in Tables 5 and 6.
【００１９】尚、各評価は次に示す方法によって行っ
た。 （１）表面固有抵抗 ロレスター表面抵抗計（三菱油化社製）により、電極間
を１０ｍｍとし、シートサンプルについてはその表面中
任意の１０点を測定し、又真空成形トレー及びエンボス
キャリアテープについてはそのポケット部の内側底面の
中央部１０点を測定しそれぞれその対数平均値を表面固
有抵抗値とした。 （２）破断点強度、引張弾性率 シートサンプルについてＪＩＳ−Ｋ−７１１３に準拠
し、２号形試験片を引張速度１０ｍｍ／ｍｉｎで測定し
た。Each evaluation was performed by the following methods. (1) Surface specific resistance The distance between the electrodes was 10 mm using a Lorester surface resistance meter (manufactured by Mitsubishi Yuka), and any 10 points on the surface of the sheet sample were measured. For the vacuum forming tray and embossed carrier tape, The central 10 points on the inner bottom surface of the pocket were measured, and the logarithmic average value of each was taken as the surface resistivity. (2) Break Point Strength and Tensile Elasticity The No. 2 test piece was measured at a tensile speed of 10 mm / min according to JIS-K-7113 for the sheet sample.
【００２０】（３）カーボン脱落の有無 シートサンプルについてはその表面にＱＦＰ１４ｍｍ×
２０ｍｍ／６４ｐｉｎのＩＣを１００ｇの荷重で押し付
け、ストローク１５ｍｍで１００回往復させ、その後Ｉ
Ｃのリード部をマイクロスコープで観察した。真空成形
トレー及びエンボスキャリアテープについてはそのポケ
ット部に同ＩＣを装着しストローク３０ｍｍで毎分４０
０往復の速度で２０万回平面方向に振動させ、その後Ｉ
Ｃリード部をマイクロスコープで観察した。評価は共に
リード部へのカーボンブラック等黒色の付着物の有無で
評価した。 （４）ＭＦＩ 各実施例及び比較例の導電性樹脂組成物についてＪＩＳ
−Ｋ−７２１０に準拠し測定を行った。(3) Presence or absence of carbon detachment The sheet sample has a QFP of 14 mm ×
A 20 mm / 64 pin IC is pressed with a load of 100 g and reciprocated 100 times with a stroke of 15 mm.
The lead part of C was observed with a microscope. For the vacuum forming tray and embossed carrier tape, the same IC is mounted in the pocket portion and the stroke is 30 mm and the speed is 40 min / min.
Vibration in the plane direction 200,000 times at a speed of 0 reciprocations.
The C lead was observed with a microscope. The evaluation was based on the presence or absence of black deposits such as carbon black on the lead portions. (4) MFI JIS for conductive resin compositions of Examples and Comparative Examples
The measurement was performed according to -K-7210.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【表２】 [Table 2]
【００２３】[0023]
【表３】 [Table 3]
【００２４】[0024]
【表４】 [Table 4]
【００２５】[0025]
【表５】 [Table 5]
【００２６】[0026]
【表６】 [Table 6]
【００２７】[0027]
【発明の効果】以上説明したとおり、ポリフェニレンエ
ーテル系樹脂、ポリスチレン系樹脂又はＡＢＳ系樹脂か
ら選ばれた少なくとも１種類の熱可塑性樹脂からなるシ
ート基材の両面にポリフェニレンエーテル系樹脂、ポリ
スチレン系樹脂又はＡＢＳ系樹脂から選ばれた少なくと
も１種類の熱可塑性樹脂及びカーボンブラックからなる
導電性樹脂組成物を積層したシートにおいて、該導電性
樹脂組成物に、更に、エチレン−α−オレフィン共重合
体樹脂を含有させることにより、ＩＣ等との接触時の摩
耗によるカーボンブラックの脱離が原因となるＩＣ等の
汚染を著しく減少させた導電性複合プラスチックシート
及び該シートを成形してなる導電性プラスチック容器を
得ることが可能となる。As described above, a polyphenylene ether-based resin, a polystyrene-based resin, or a polyphenylene ether-based resin is provided on both surfaces of a sheet substrate made of at least one kind of thermoplastic resin selected from a polyphenylene ether-based resin, a polystyrene-based resin, and an ABS-based resin. In a sheet in which a conductive resin composition comprising at least one kind of thermoplastic resin selected from ABS resin and carbon black is laminated, the conductive resin composition further comprises an ethylene-α-olefin copolymer resin. By containing the conductive composite plastic sheet and the conductive plastic container formed by molding the conductive composite plastic sheet, the contamination of the IC and the like caused by the detachment of carbon black due to the abrasion at the time of contact with the IC and the like is remarkably reduced. It is possible to obtain.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−299923（ＪＰ，Ａ) 特開 昭57−205145（ＪＰ，Ａ) 特開 平６−305084（ＪＰ，Ａ) 特開 平７−21834（ＪＰ，Ａ) 特開 昭58−31749（ＪＰ，Ａ) 特開 昭60−125656（ＪＰ，Ａ) 特公 昭59−5213（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.7，ＤＢ名) B32B 1/00 - 35/00 B65D 65/40 B65D 85/86 - 85/90 H01B 1/20 - 1/24 ＷＰＩ／Ｌ（ＱＵＥＳＴＥＬ)──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-63-299923 (JP, A) JP-A-57-205145 (JP, A) JP-A-6-305084 (JP, A) JP-A-7-205 21834 (JP, A) JP-A-58-31749 (JP, A) JP-A-60-125656 (JP, A) JP-B-59-5213 (JP, B1) (58) Fields investigated (Int. 7 , DB name) B32B 1/00-35/00 B65D 65/40 B65D 85/86-85/90 H01B 1/20-1/24 WPI / L (QUESTEL)
Claims (5)
レン系樹脂又はＡＢＳ系樹脂から選ばれた少なくとも１
種類の熱可塑性樹脂からなるシート基材の両面に、
（Ａ）ポリフェニレンエーテル系樹脂の熱可塑性樹脂、
（Ｂ）カーボンブラック、（Ｃ）エチレン−α−オレフ
ィン共重合体樹脂からなる導電性樹脂組成物を積層した
シートにおいて、（イ）前記導電性樹脂組成物が（Ａ）
熱可塑性樹脂１００重量部に対し（Ｂ）カーボンブラッ
ク５〜５０重量部を含有し、かつ、前記（Ａ）熱可塑性
樹脂と（Ｂ）カーボンブラックの合計量１００重量部に
対し、（Ｃ）エチレン−α−オレフィン共重合体樹脂１
〜３０重量部を含有してなり、かつ、（ロ）導電性樹脂
組成物を積層したシートの表面固有抵抗値が１０２〜１
０１０Ωであり、 かつ、半導体との接触時の摩擦によるカーボン脱落によ
る半導体の汚染の無いことを特徴とする半導体包装用の
導電性複合プラスチックシート。At least one selected from a polyphenylene ether resin, a polystyrene resin and an ABS resin.
On both sides of a sheet substrate made of various types of thermoplastic resin,
(A) a thermoplastic resin of a polyphenylene ether-based resin,
In a sheet in which a conductive resin composition comprising (B) carbon black and (C) an ethylene-α-olefin copolymer resin is laminated, (A) the conductive resin composition is (A)
(B) 5 to 50 parts by weight of carbon black with respect to 100 parts by weight of the thermoplastic resin, and (C) ethylene with respect to 100 parts by weight of the total amount of (A) the thermoplastic resin and (B) carbon black -Α-olefin copolymer resin 1
And (b) a sheet laminated with the conductive resin composition has a surface specific resistance of 102 to 1 part by weight.
A conductive composite plastic sheet for semiconductor packaging, characterized by having a resistance of 010Ω and no contamination of the semiconductor due to carbon falling off due to friction at the time of contact with the semiconductor.
ＪＩＳ−Ｋ−７２１５によるデユロメータＡ型表面硬度
が９０以下である請求項１の半導体包装用の導電性複合
プラスチックシート。2. The conductive composite plastic sheet for semiconductor packaging according to claim 1, wherein the ethylene-α-olefin copolymer resin has a Durometer A type surface hardness of 90 or less according to JIS-K-7215.
導電性複合プラスチックシートからなる半導体包装容
器。3. A semiconductor packaging container comprising the conductive composite plastic sheet for semiconductor packaging according to claim 1.
導電性複合プラスチックシートからなるＩＣ包装用真空
成形トレー。4. A vacuum forming tray for IC packaging, comprising the conductive composite plastic sheet for semiconductor packaging according to claim 1.
導電性複合プラスチックシートからなるＩＣ包装用エン
ボスキャリアテープ。5. An embossed carrier tape for IC packaging comprising the conductive composite plastic sheet for semiconductor packaging according to claim 1 or 2.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23996395A JP3276818B2 (en) | 1995-09-19 | 1995-09-19 | Conductive composite plastic sheet and container |
| US08/579,579 US5747164A (en) | 1995-09-19 | 1995-12-26 | Conductive composite plastic sheet and container |
| SG1995002389A SG75748A1 (en) | 1995-09-19 | 1995-12-28 | Conductive composite plastic sheet and container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23996395A JP3276818B2 (en) | 1995-09-19 | 1995-09-19 | Conductive composite plastic sheet and container |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001396627A Division JP3801504B2 (en) | 2001-12-27 | 2001-12-27 | Conductive composite plastic sheet and container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0976422A JPH0976422A (en) | 1997-03-25 |
| JP3276818B2 true JP3276818B2 (en) | 2002-04-22 |
Family
ID=17052446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23996395A Expired - Fee Related JP3276818B2 (en) | 1995-09-19 | 1995-09-19 | Conductive composite plastic sheet and container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3276818B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4533564B2 (en) * | 2001-08-20 | 2010-09-01 | 日本ポリプロ株式会社 | Molding |
| DE602005027583D1 (en) | 2004-09-07 | 2011-06-01 | Denki Kagaku Kogyo Kk | CONDUCTIVE COMPOSITE FILMS |
| US8999470B2 (en) | 2010-03-24 | 2015-04-07 | Denki Kagaku Kogyo Kabushiki Kaisha | Surface conductive laminated sheet and electronic part packaging container |
| MY193213A (en) | 2016-11-01 | 2022-09-26 | Denka Company Ltd | Surface-conductive laminated sheet and electronic component packaging container |
| EP4043212A4 (en) | 2020-03-19 | 2023-07-19 | Denka Company Limited | Layered sheet, container, carrier tape, and electronic component packaging body |
| WO2022030096A1 (en) | 2020-08-05 | 2022-02-10 | デンカ株式会社 | Resin sheet, container, carrier tape, and electronic component packaging body |
-
1995
- 1995-09-19 JP JP23996395A patent/JP3276818B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0976422A (en) | 1997-03-25 |
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