MY193213A - Surface-conductive laminated sheet and electronic component packaging container - Google Patents

Surface-conductive laminated sheet and electronic component packaging container

Info

Publication number
MY193213A
MY193213A MYPI2019002255A MYPI2019002255A MY193213A MY 193213 A MY193213 A MY 193213A MY PI2019002255 A MYPI2019002255 A MY PI2019002255A MY PI2019002255 A MYPI2019002255 A MY PI2019002255A MY 193213 A MY193213 A MY 193213A
Authority
MY
Malaysia
Prior art keywords
laminated sheet
conductive laminated
conductive
electronic component
packaging container
Prior art date
Application number
MYPI2019002255A
Inventor
Yuko Fukuda
Yusuke Masuda
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of MY193213A publication Critical patent/MY193213A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for

Abstract

[Problem] To provide a surface-conductive laminated sheet that has excellent strength and that can suppress the crushing or the deformation of carrier tape even when a pickup nozzle comes into contact with the carrier tape when mounting electronic components; and an electronic component packaging container, particularly carrier tape or a tray for conveying electronic components, formed by molding the surface-conductive laminated sheet. [Solution] A surface-conductive laminated sheet comprising: a sheet substrate layer; and surface layers laminated onto both surfaces of the sheet substrate layer; wherein the substrate layer comprises a polystyrene-based resin having a conjugated diene content of 3.0 to 8.2 mass%, the surface layer comprises a conductive resin composition containing a polystyrene- based resin having a conjugated diene content of 2.0 to 7.4 mass% and a conductive filler, and the surface-conductive laminated sheet has a Martens hardness of 50 to 130 N/mm2
MYPI2019002255A 2016-11-01 2017-10-31 Surface-conductive laminated sheet and electronic component packaging container MY193213A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016214012 2016-11-01
PCT/JP2017/039258 WO2018084129A1 (en) 2016-11-01 2017-10-31 Surface-conductive laminated sheet and electronic component packaging container

Publications (1)

Publication Number Publication Date
MY193213A true MY193213A (en) 2022-09-26

Family

ID=62075830

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002255A MY193213A (en) 2016-11-01 2017-10-31 Surface-conductive laminated sheet and electronic component packaging container

Country Status (8)

Country Link
JP (2) JP6686167B2 (en)
KR (1) KR102564612B1 (en)
CN (1) CN110139755B (en)
MY (1) MY193213A (en)
PH (1) PH12019500955A1 (en)
SG (1) SG11201903634WA (en)
TW (1) TWI738905B (en)
WO (1) WO2018084129A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11701874B2 (en) 2019-04-26 2023-07-18 Denka Company Limited Layered sheet, electronic component packaging container, and electronic component packaging
EP4043212A4 (en) * 2020-03-19 2023-07-19 Denka Company Limited Layered sheet, container, carrier tape, and electronic component packaging body
WO2023189186A1 (en) * 2022-03-28 2023-10-05 デンカ株式会社 Resin sheet, container, carrier tape, and electronic component packaging
WO2023189190A1 (en) * 2022-03-28 2023-10-05 デンカ株式会社 Resin sheet, container, carrier tape, and electronic component packaging

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3276818B2 (en) 1995-09-19 2002-04-22 電気化学工業株式会社 Conductive composite plastic sheet and container
JP3209394B2 (en) 1995-09-19 2001-09-17 電気化学工業株式会社 Conductive composite plastic sheet and container
JP3381488B2 (en) * 1995-11-06 2003-02-24 三菱化学株式会社 Thermoplastic elastomer composition and composite molded article
JP3190241B2 (en) 1995-12-21 2001-07-23 電気化学工業株式会社 Conductive composite plastic sheets and containers for packaging electronic components
JP4321986B2 (en) * 2001-06-22 2009-08-26 電気化学工業株式会社 Conductive resin composition
US20040115381A1 (en) * 2002-12-12 2004-06-17 Chevron Phillips Chemical Company, Lp Method for manufacturing articles with materials containing tapered polymers
JP2004276479A (en) * 2003-03-18 2004-10-07 Sumitomo Bakelite Co Ltd Surface-conductive composite plastic sheet and container for transporting electronic component
US20050250897A1 (en) * 2004-03-03 2005-11-10 Chi Lin Technology Co., Ltd. Conductive plastic composition
EP1787804B1 (en) * 2004-09-07 2011-04-20 Denki Kagaku Kogyo Kabushiki Kaisha Conductive composite sheeting
JP5154081B2 (en) * 2004-09-16 2013-02-27 電気化学工業株式会社 Composite sheet
JP2006150729A (en) * 2004-11-29 2006-06-15 Dainippon Ink & Chem Inc Conductive sheet and molding
JP2006212851A (en) * 2005-02-02 2006-08-17 Denki Kagaku Kogyo Kk Thermoplastic resin laminated sheet and its molded product
JP2006231542A (en) * 2005-02-22 2006-09-07 Dainippon Ink & Chem Inc Antistatic laminated sheet and its molded product
KR20100136544A (en) * 2008-04-10 2010-12-28 월드 프로퍼티즈 인코퍼레이티드 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
SG189310A1 (en) * 2010-10-07 2013-05-31 Denki Kagaku Kogyo Kk Electronic component packaging sheet, and formed article thereof
SG192127A1 (en) * 2011-01-28 2013-08-30 Denki Kagaku Kogyo Kk Laminated sheet for packaging electronic component and molded body thereof
CN104960292B (en) * 2015-06-17 2017-01-25 浙江洁美电子科技股份有限公司 Packaging tape for carrier belt for electronic components and production method of packaging tape

Also Published As

Publication number Publication date
CN110139755B (en) 2021-04-09
TWI738905B (en) 2021-09-11
WO2018084129A1 (en) 2018-05-11
SG11201903634WA (en) 2019-05-30
JP6686167B2 (en) 2020-04-22
JPWO2018084129A1 (en) 2019-09-19
KR20190078599A (en) 2019-07-04
JP2020114675A (en) 2020-07-30
PH12019500955A1 (en) 2019-12-02
KR102564612B1 (en) 2023-08-07
TW201829197A (en) 2018-08-16
CN110139755A (en) 2019-08-16

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