SG11201903634WA - Surface-conductive laminated sheet and electronic component packaging container - Google Patents

Surface-conductive laminated sheet and electronic component packaging container

Info

Publication number
SG11201903634WA
SG11201903634WA SG11201903634WA SG11201903634WA SG11201903634WA SG 11201903634W A SG11201903634W A SG 11201903634WA SG 11201903634W A SG11201903634W A SG 11201903634WA SG 11201903634W A SG11201903634W A SG 11201903634WA SG 11201903634W A SG11201903634W A SG 11201903634WA
Authority
SG
Singapore
Prior art keywords
electronic component
packaging container
laminated sheet
component packaging
conductive laminated
Prior art date
Application number
SG11201903634WA
Inventor
Yuko Fukuda
Yusuke Masuda
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of SG11201903634WA publication Critical patent/SG11201903634WA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/025Electric or magnetic properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/107Ceramic
    • B32B2264/108Carbon, e.g. graphite particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00Packaging equipment or accessories not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
SG11201903634WA 2016-11-01 2017-10-31 Surface-conductive laminated sheet and electronic component packaging container SG11201903634WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016214012 2016-11-01
PCT/JP2017/039258 WO2018084129A1 (en) 2016-11-01 2017-10-31 Surface-conductive laminated sheet and electronic component packaging container

Publications (1)

Publication Number Publication Date
SG11201903634WA true SG11201903634WA (en) 2019-05-30

Family

ID=62075830

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903634WA SG11201903634WA (en) 2016-11-01 2017-10-31 Surface-conductive laminated sheet and electronic component packaging container

Country Status (8)

Country Link
JP (2) JP6686167B2 (en)
KR (1) KR102564612B1 (en)
CN (1) CN110139755B (en)
MY (1) MY193213A (en)
PH (1) PH12019500955A1 (en)
SG (1) SG11201903634WA (en)
TW (1) TWI738905B (en)
WO (1) WO2018084129A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220005474A (en) 2019-04-26 2022-01-13 덴카 주식회사 Laminated sheet and electronic component packaging container and electronic component packaging body
EP4043212A4 (en) * 2020-03-19 2023-07-19 Denka Company Limited Layered sheet, container, carrier tape, and electronic component packaging body
KR20210143024A (en) * 2020-05-19 2021-11-26 한화솔루션 주식회사 Multi-layered molded article with excellent adhesiveness and electrical conductivity, and electronic products transported thereby
WO2023189190A1 (en) * 2022-03-28 2023-10-05 デンカ株式会社 Resin sheet, container, carrier tape, and electronic component packaging
WO2023189186A1 (en) * 2022-03-28 2023-10-05 デンカ株式会社 Resin sheet, container, carrier tape, and electronic component packaging

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209394B2 (en) 1995-09-19 2001-09-17 電気化学工業株式会社 Conductive composite plastic sheet and container
JP3276818B2 (en) 1995-09-19 2002-04-22 電気化学工業株式会社 Conductive composite plastic sheet and container
JP3381488B2 (en) * 1995-11-06 2003-02-24 三菱化学株式会社 Thermoplastic elastomer composition and composite molded article
JP3190241B2 (en) 1995-12-21 2001-07-23 電気化学工業株式会社 Conductive composite plastic sheets and containers for packaging electronic components
JP4321986B2 (en) * 2001-06-22 2009-08-26 電気化学工業株式会社 Conductive resin composition
US20040115381A1 (en) * 2002-12-12 2004-06-17 Chevron Phillips Chemical Company, Lp Method for manufacturing articles with materials containing tapered polymers
JP2004276479A (en) * 2003-03-18 2004-10-07 Sumitomo Bakelite Co Ltd Surface-conductive composite plastic sheet and container for transporting electronic component
US20050250897A1 (en) * 2004-03-03 2005-11-10 Chi Lin Technology Co., Ltd. Conductive plastic composition
DE602005027583D1 (en) * 2004-09-07 2011-06-01 Denki Kagaku Kogyo Kk CONDUCTIVE COMPOSITE FILMS
WO2006030871A1 (en) * 2004-09-16 2006-03-23 Denki Kagaku Kogyo Kabushiki Kaisha Composite sheet
JP2006150729A (en) * 2004-11-29 2006-06-15 Dainippon Ink & Chem Inc Conductive sheet and molding
JP2006212851A (en) * 2005-02-02 2006-08-17 Denki Kagaku Kogyo Kk Thermoplastic resin laminated sheet and its molded product
JP2006231542A (en) * 2005-02-22 2006-09-07 Dainippon Ink & Chem Inc Antistatic laminated sheet and its molded product
JP2011517112A (en) * 2008-04-10 2011-05-26 ワールド・プロパティーズ・インコーポレイテッド CIRCUIT MATERIAL WITH IMPROVED BONDING, ITS MANUFACTURING METHOD AND PRODUCT
SG189310A1 (en) * 2010-10-07 2013-05-31 Denki Kagaku Kogyo Kk Electronic component packaging sheet, and formed article thereof
KR101908154B1 (en) * 2011-01-28 2018-10-15 덴카 주식회사 Laminated sheet for packaging electronic component and molded body thereof
CN104960292B (en) * 2015-06-17 2017-01-25 浙江洁美电子科技股份有限公司 Packaging tape for carrier belt for electronic components and production method of packaging tape

Also Published As

Publication number Publication date
WO2018084129A1 (en) 2018-05-11
CN110139755A (en) 2019-08-16
KR20190078599A (en) 2019-07-04
JPWO2018084129A1 (en) 2019-09-19
TWI738905B (en) 2021-09-11
CN110139755B (en) 2021-04-09
JP2020114675A (en) 2020-07-30
KR102564612B1 (en) 2023-08-07
MY193213A (en) 2022-09-26
JP6686167B2 (en) 2020-04-22
TW201829197A (en) 2018-08-16
PH12019500955A1 (en) 2019-12-02

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