TWI402166B - Composite sheet - Google Patents
Composite sheet Download PDFInfo
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- TWI402166B TWI402166B TW94132153A TW94132153A TWI402166B TW I402166 B TWI402166 B TW I402166B TW 94132153 A TW94132153 A TW 94132153A TW 94132153 A TW94132153 A TW 94132153A TW I402166 B TWI402166 B TW I402166B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
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- Laminated Bodies (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
Description
本發明有關由樹脂組成物所成之複合薄片,該複合薄片例如適合各種電子零件包裝用。The present invention relates to a composite sheet composed of a resin composition which is suitable, for example, for packaging various electronic parts.
電子機械或汽車等各種工業用品之中間製品的包裝容器係使用薄片加熱成形所得之真空成形托盤、壓紋變搬運膠帶等。此等包裝容器用薄片提案使用聚苯乙烯系樹脂或ABS系樹脂層合聚苯乙烯系樹脂之薄片(例如參閱專利文獻1~3)。托盤、壓紋變搬運膠帶係藉由擠壓成形等所得之薄片以真空成形、熱壓成形等,習知的各種成形方法所成形,ABS系樹脂與聚苯乙烯系樹脂之接著性差,依使用的方法其基材層與表皮層的層間產生剝離的問題。A packaging container for an intermediate product of various industrial articles such as an electronic machine or an automobile is a vacuum formed tray obtained by heat-forming a sheet, an embossed transfer tape, or the like. For the sheet for packaging containers, a sheet of a polystyrene resin or an ABS resin laminated polystyrene resin is used (see, for example, Patent Documents 1 to 3). The tray and the embossed transfer tape are formed by various molding methods such as vacuum forming and hot press forming by a sheet obtained by extrusion molding, etc., and the adhesion between the ABS resin and the polystyrene resin is poor. The method causes a problem of peeling between the layers of the substrate layer and the skin layer.
又,於托盤的成形其外周或依情形其內部;於壓紋搬運膠之所謂飛輪孔或中央孔之孔穴,又,沖取加工時其端面多少產生毛邊,此等的包裝容器於使用步驟因毛邊脫落成為污染。近年,所包裝的電子零件急劇小型化,對減低由該毛邊脫落所產生的污染要求越嚴格。Moreover, the outer circumference of the tray is formed or the inside thereof according to the situation; the so-called flywheel hole or the hole of the central hole of the embossed conveyance glue, and the end face of the central processing hole is somewhat burred during the processing, and the packaging container is used in the use step. The burrs fall off and become polluted. In recent years, the packaged electronic components have been rapidly miniaturized, and the stricter requirements for reducing the pollution caused by the burrs are caused.
專利文獻1:日本特開昭57-205145號公報專利文獻2:日本特開平9-076425號公報專利文獻3:日本特開平9-076422號公報Japanese Patent Laid-Open Publication No. Hei 9-076425 (Patent Document No. Hei 9-076425)
本發明係為解決相關的問題點,提供圖謀同時改善薄片的各層間的接著性防止剝離,於托盤或壓紋搬運膠帶的製造步驟中減少因進行沖取加工所產生的毛邊,減低對內容物之電子零件等的污染之複合薄片。The present invention solves the related problems and provides a plan to simultaneously improve the adhesion between the layers of the sheet to prevent peeling, reduce the burrs generated by the punching process in the manufacturing step of the tray or the embossed conveyance tape, and reduce the content to the contents. A contaminated composite sheet of electronic parts or the like.
本發明係為解決上述的課題,具有下述之要旨。The present invention has the following gist in order to solve the above problems.
(1)於ABS系樹脂為主成分的基材層的至少一面上層合以聚苯乙烯系樹脂及碳黑為主成分的表皮層為特徵之複合薄片。(1) A composite sheet characterized by a skin layer containing a polystyrene resin and carbon black as a main component is laminated on at least one surface of a base material layer mainly composed of an ABS resin.
(2)ABS系樹脂,為含有5~23質量%的二烯系橡膠為特徵之上述(1)之複合薄片。(2) The ABS resin is the composite sheet of the above (1) characterized by containing 5 to 23% by mass of a diene rubber.
(3)由ABS系樹脂,以含有5~23質量%的二烯系橡膠、55~80質量%的芳香族乙烯單體、及15~27質量%的氰化乙烯單體為主成份之AB係樹脂所成為特徵之上述(1)之複合薄片。(3) ABS-based resin containing AB of 23 to 23% by mass of diene rubber, 55 to 80% by mass of aromatic vinyl monomer, and 15 to 27% by mass of vinyl cyanide monomer as main components A composite sheet of the above (1) which is characterized by a resin.
(4)ABS系樹脂,係由40~60質量%的二烯系橡膠、25~45質量%的芳香族乙烯單體、及5~25質量%的氰化乙烯單體為主成分的接枝共聚物15~60質量份,與由芳香族乙烯單體60~85質量%及氰化乙烯單體15~40質量%為主成分之二元乙烯共聚物40~85質量份所成為特徵之上述(1)或(2)之複合薄片。(4) ABS-based resin, which is a graft of 40 to 60% by mass of a diene rubber, 25 to 45% by mass of an aromatic vinyl monomer, and 5 to 25% by mass of a vinyl cyanide monomer as a main component. The copolymer is characterized by having 15 to 60 parts by mass of the copolymer and 40 to 85 parts by mass of a divalent ethylene copolymer containing 60 to 85% by mass of the aromatic vinyl monomer and 15 to 40% by mass of the vinyl cyanide monomer as a main component. A composite sheet of (1) or (2).
(5)由5~30質量%的二烯系橡膠、40~80質量%的芳香族乙烯單體、10~40質量%的氰化乙烯單體為主成分之ABS系樹脂100質量份,與至少一種選自苯乙烯-丁二烯-丁烯-苯乙烯嵌段共聚合樹脂、苯乙烯-二烯嵌段共聚物樹脂,於苯乙烯-二烯嵌段共聚物加氫之樹脂及於聚烯烴以苯乙烯接枝共聚合之樹脂的熱可塑性樹脂1~20質量份所成之基材層的至少一面上層合以聚苯乙烯樹脂及碳黑為主成分之表皮層為特徵之上述(1)之複合薄片。(5) 100 parts by mass of ABS resin containing 5 to 30% by mass of a diene rubber, 40 to 80% by mass of an aromatic vinyl monomer, and 10 to 40% by mass of a vinyl cyanide monomer as a main component, and At least one selected from the group consisting of styrene-butadiene-butene-styrene block copolymerized resin, styrene-diene block copolymer resin, and resin for hydrogenation of styrene-diene block copolymer The olefin is characterized by laminating at least one side of a base layer of a thermoplastic resin having a styrene graft copolymerized resin of 1 to 20 parts by mass, and a skin layer containing a polystyrene resin and carbon black as a main component. a composite sheet.
(6)ABS系樹脂為由40~60質量%的二烯系橡膠、25~45質量%的芳香族乙烯單體、及5~25質量%的氰化乙烯單體為主成分的接枝共聚物15~60質量份,與由60~85質量%的芳香族乙烯單體及15~40質量%的氰化乙烯單體為主成分之40~85質量份的二元乙烯共聚物所成為特徵之上述(5)之複合薄片。(6) ABS-based resin is a graft copolymerization of 40 to 60% by mass of a diene rubber, 25 to 45% by mass of an aromatic vinyl monomer, and 5 to 25% by mass of a vinyl cyanide monomer as a main component. 15 to 60 parts by mass, which is characterized by 40 to 85 parts by mass of a diethylene copolymer containing 60 to 85% by mass of an aromatic vinyl monomer and 15 to 40% by mass of a vinyl cyanide monomer as a main component. The composite sheet of the above (5).
(7)使用上述(1)~(6)中任一項的複合薄片之容器。(7) A container using the composite sheet according to any one of the above (1) to (6).
(8)使用上述(1)~(6)中任一項的複合薄片之壓紋搬運膠帶。(8) An embossed conveyance tape using the composite sheet according to any one of the above (1) to (6).
(9)使用上述(1)~(6)中任一項的複合薄片之包裝體。(9) A package of the composite sheet according to any one of the above (1) to (6).
本發明的複合薄片,適於必要靜電處置之電子零件等的包裝,於使用本發明的複合薄片製造托盤或壓紋搬運膠帶的步驟,表皮層與基材層無剝離,又,此時沖取毛邊產生少,由該毛邊脫落所產生的污染可減少。The composite sheet of the present invention is suitable for packaging of electronic parts or the like which are required to be electrostatically treated, and the step of manufacturing the tray or the embossed carrying tape by using the composite sheet of the present invention, the peeling of the skin layer and the substrate layer, and at this time, punching The generation of burrs is small, and the pollution caused by the detachment of the burrs can be reduced.
於本發明的複合薄片基材層所用的ABS系樹脂,係二烯系橡膠-芳香族乙烯單體-氰化乙烯單體的三維共聚物為主成分者,意義係代表以丙烯腈-丁二烯-苯乙烯的三維共聚物為主成分之樹脂或樹脂組成物。其具體例可舉丙烯腈-丁二烯-苯乙烯三維共聚物、丙烯腈-丁二烯-苯乙烯三維共聚物與丙烯腈-苯乙烯二維共聚物的混合物、於丙烯腈-苯乙烯二維共聚物將聚丁二烯聚合物合金化者。本發明以使用其中之丙烯腈-丁二烯-苯乙烯三維共聚物為理想,更以使用丙烯腈-丁二烯-苯乙烯三維共聚物與丙烯腈-苯乙烯二維共聚物的混合物為更理想。The ABS-based resin used in the composite sheet base material layer of the present invention is a three-dimensional copolymer of a diene rubber-aromatic vinyl monomer-cyanide vinyl monomer as a main component, and the meaning is represented by acrylonitrile-butadiene. A three-dimensional copolymer of an ene-styrene is a resin or a resin composition of a main component. Specific examples thereof include a mixture of an acrylonitrile-butadiene-styrene three-dimensional copolymer, an acrylonitrile-butadiene-styrene three-dimensional copolymer and an acrylonitrile-styrene two-dimensional copolymer, and an acrylonitrile-styrene II. The dimensional copolymer alloys the polybutadiene polymer. The invention is ideal for using the acrylonitrile-butadiene-styrene three-dimensional copolymer therein, and more preferably using a mixture of the acrylonitrile-butadiene-styrene three-dimensional copolymer and the acrylonitrile-styrene two-dimensional copolymer. ideal.
上述丙烯腈-丁二烯-苯乙烯三維共聚物,例如與聚丁二烯或苯乙烯-丁二烯共聚物等的二烯系橡膠的存在下,藉由苯乙烯等的芳香族乙烯單體、或丙烯腈等的氰化乙烯單體的接枝共聚而得。The above acrylonitrile-butadiene-styrene three-dimensional copolymer, for example, in the presence of a diene rubber such as a polybutadiene or a styrene-butadiene copolymer, an aromatic vinyl monomer such as styrene Or graft copolymerization of a vinyl cyanide monomer such as acrylonitrile.
ABS系樹脂,使用丙烯腈-丁二烯-苯乙烯三維共聚物與丙烯腈-苯乙烯二維共聚物的混合物時,丙烯腈-丁二烯-苯乙烯三維共聚物與丙烯腈-苯乙烯二維共聚物以使用40~60質量%的二烯系橡膠、理想為40~55質量%,25~45質量%的芳香族乙烯單體、理想為30~40質量%,及5~25質量%的氰化乙烯單體、理想為5~20質量%、更理想為5~18質量%為主成分的接枝共聚物為佳,又,二元乙烯共聚物以使用芳香族乙烯單體60~85質量%、理想為65~80質量%,氰化乙烯單體15~40質量%、理想為20~35質量%為主成分之共聚物為佳。丙烯腈-丁二烯-苯乙烯三維共聚物與丙烯腈-苯乙烯二維共聚物的混合物的混合比例,理想為丙烯腈-丁二烯-苯乙烯三維共聚物15~60質量份與丙烯腈-苯乙烯二維共聚物40~85質量份,更理想為丙烯腈-丁二烯-苯乙烯三維共聚物30~45質量份與丙烯腈-苯乙烯二維共聚物55~70質量份。丙烯腈-丁二烯-苯乙烯三維共聚物的接枝率理想為30~90%,更理想為30~60%。ABS resin, a mixture of acrylonitrile-butadiene-styrene three-dimensional copolymer and acrylonitrile-styrene two-dimensional copolymer, acrylonitrile-butadiene-styrene three-dimensional copolymer and acrylonitrile-styrene The copolymer is used in an amount of 40 to 60% by mass of a diene rubber, preferably 40 to 55% by mass, and 25 to 45% by mass of an aromatic vinyl monomer, preferably 30 to 40% by mass, and 5 to 25% by mass. The vinyl cyanide monomer, preferably 5 to 20% by mass, more preferably 5 to 18% by mass, of the graft copolymer is preferred, and the ethylene-based copolymer is an aromatic vinyl monomer 60~ A copolymer of 85 mass%, preferably 65 to 80 mass%, and a vinyl cyanide monomer of 15 to 40% by mass, preferably 20 to 35 mass%, is preferred. a mixing ratio of a mixture of an acrylonitrile-butadiene-styrene three-dimensional copolymer and an acrylonitrile-styrene two-dimensional copolymer, preferably an acrylonitrile-butadiene-styrene three-dimensional copolymer of 15 to 60 parts by mass and acrylonitrile The styrene two-dimensional copolymer is 40 to 85 parts by mass, more preferably 30 to 45 parts by mass of the acrylonitrile-butadiene-styrene three-dimensional copolymer and 55 to 70 parts by mass of the acrylonitrile-styrene two-dimensional copolymer. The graft ratio of the acrylonitrile-butadiene-styrene three-dimensional copolymer is desirably 30 to 90%, more preferably 30 to 60%.
ABS系樹脂中的二烯系橡膠含量理想為5~30質量%,更理想為5~23質量%,再理想8~20質量%。二烯系橡膠的含量未達5質量%時強度降低,超過30質量%時毛邊產生較多。The content of the diene rubber in the ABS resin is preferably 5 to 30% by mass, more preferably 5 to 23% by mass, still more preferably 8 to 20% by mass. When the content of the diene rubber is less than 5% by mass, the strength is lowered, and when it exceeds 30% by mass, the burrs are generated in a large amount.
ABS系中的氰化乙烯單體含量為10~40質量%,理想為15~27質量%,再理想為20~25質量%。氰化乙烯單體的含量少於該範圍時剛性降低,超過該範圍時與層合之聚苯乙烯系樹脂的層間容易產生剝離。又,ABS系中殘餘成分之芳香族乙烯單體含量理想為40~80質量%,更理想為55~80質量%,特別理想為使用65~72質量%的範圍。The content of the vinyl cyanide monomer in the ABS system is 10 to 40% by mass, preferably 15 to 27% by mass, and more preferably 20 to 25% by mass. When the content of the vinyl cyanide monomer is less than the above range, the rigidity is lowered. When the content exceeds this range, peeling easily occurs between the layers of the laminated polystyrene resin. Further, the content of the aromatic vinyl monomer of the residual component in the ABS system is preferably 40 to 80% by mass, more preferably 55 to 80% by mass, and particularly preferably 65 to 72% by mass.
本發明的表皮層使用之聚苯乙烯系樹脂,以苯乙烯、o-甲基苯乙烯、p-甲基苯乙烯、p-tert-丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、萘乙烯、蒽乙烯、1,1-二苯基伸乙基等的芳香族乙烯化合物為單體之聚合物為主成分之樹脂,或,耐衝擊性聚苯乙烯樹脂為理想。耐衝擊性聚苯乙烯樹脂,係以丁二烯為主成分之橡膠接枝聚合之聚苯乙烯樹脂。此等聚苯乙烯樹脂及耐衝擊性聚苯乙烯樹脂分別單獨使用亦可,併用亦可。The polystyrene resin used in the skin layer of the present invention is styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, An aromatic vinyl compound such as α-methylstyrene, naphthaleneethylene, nonylethylene or 1,1-diphenylethylidene is a resin containing a monomer as a main component, or an impact-resistant polystyrene resin is ideal. The impact-resistant polystyrene resin is a rubber graft-polymerized polystyrene resin containing butadiene as a main component. These polystyrene resins and impact-resistant polystyrene resins may be used singly or in combination.
表皮層配合之碳黑,為爐法碳黑、槽法碳黑、乙炔碳黑等,理想為比表面積大,對樹脂的添加量少可得到高度導電性者。例如S.C.F.(Super Conductive Furnace)、E.C.F(Electric Cconductive Furnace)、ketjin black(日本Lion-AkZO公司製品),乙炔碳黑等。其添加量,以表面固有電阻值可成為理想的102 ~101 0 Ω之添加量,且對表皮層的組成物的合計量100質量%而言碳黑以1~50質量%為理想。添加量低於1質量%不能得到充分的導電性,表面固有電阻上升,超過50質量%時與樹脂的均勻分散性惡化,成形加工性顯著降低,機械強度等的特性值下降。The carbon black to be blended in the skin layer is a furnace black, a channel black, or an acetylene black. It is preferably a large specific surface area, and a small amount of the resin is added to obtain a high conductivity. For example, SCF (Super Conductive Furnace), ECF (Electric Cconductive Furnace), ketjin black (product of Japan Lion-AkZO Co., Ltd.), acetylene black or the like. The addition amount to the value of surface resistivity of an ideal addition amount of 10 2 ~ 10 1 0 Ω, the quality of the skin layer 100 and the total amount of the composition in terms of% by mass of carbon black 1 to 50% of over. When the amount is less than 1% by mass, sufficient conductivity is not obtained, and the surface specific resistance is increased. When the amount is more than 50% by mass, the uniform dispersibility of the resin is deteriorated, the moldability is remarkably lowered, and the characteristic value such as mechanical strength is lowered.
本發明的複合薄片,基材層(A)的至少一面上層合表皮層(B)。具體的可為表皮層(B)/基材層(A)、表皮層(B)/基材層(A)/表皮層(B)的構成。特別是,複合薄片的兩面其為抑制靜電的產生,以表皮層(B)/基材層(A)/表皮層(B)的構成為理想。In the composite sheet of the present invention, the skin layer (B) is laminated on at least one surface of the base material layer (A). Specifically, it may be a structure of the skin layer (B) / base material layer (A), skin layer (B) / base material layer (A) / skin layer (B). In particular, both sides of the composite sheet are intended to suppress the generation of static electricity, and it is preferable to have a configuration of the skin layer (B) / the substrate layer (A) / the skin layer (B).
本發明複合薄片全體的厚度以0.1~3.0 mm為理想,以0.15~2.0 mm為更理想。特別是全體的厚度為0.15~0.6 mm者可適合使用二次成形之電子零件包裝用薄片使用之壓紋搬運膠帶。又,全體厚度為0.5 mm~2.0 mm者可適合使用二次成形之電子零件、機械零件等收納之包裝用托盤。基材層(A)的厚度佔全體厚度以40%~98%為理想。又表皮層(B)的厚度佔全體厚度以2~30%為理想。The thickness of the entire composite sheet of the present invention is preferably 0.1 to 3.0 mm, more preferably 0.15 to 2.0 mm. In particular, the entire thickness of 0.15 to 0.6 mm can be suitably used for the embossed transfer tape used for the secondary formed electronic component packaging sheet. In addition, the entire packaging thickness of 0.5 mm to 2.0 mm can be suitably used for packaging trays for electronic components and mechanical parts that are secondarily formed. The thickness of the base material layer (A) is preferably 40% to 98% of the total thickness. Further, the thickness of the skin layer (B) is preferably 2 to 30% of the total thickness.
基材層在不損及流動性的程度,可添加少量,理想為對ABS系樹脂成分而言為0.1~30質量份的範圍。藉由添加碳黑薄片成形包裝容器時可解決因薄片的厚度變薄成形品的角落變透明的問題。添加於基材層之碳黑無特別的限制可使用習知的爐法碳黑、槽法碳黑、乙炔碳黑等。The base material layer may be added in a small amount, and is preferably in a range of 0.1 to 30 parts by mass based on the ABS resin component. When the packaging container is formed by adding a carbon black sheet, the problem that the corner of the molded article becomes thin due to the thickness of the sheet can be solved. The carbon black added to the substrate layer is not particularly limited, and conventional furnace carbon black, channel black, acetylene black, or the like can be used.
基材層及/或表皮層,除上述的樹脂成分以外可添加其他樹脂成分作為改質劑,又依必要可添加滑劑、可塑劑、加工助劑等的各種添加劑。上述的其他樹脂成分可適合使用至少一種選自苯乙烯-丁二烯-丁烯-苯乙烯嵌段共聚物(以下以SBBS稱之),苯乙烯-二烯嵌段共聚樹脂、於苯乙烯-二烯嵌段共聚樹脂加氫之樹脂、及於聚烯烴以苯乙烯接枝共聚之樹脂所成群的熱可塑性樹脂。In addition to the above-mentioned resin component, the base material layer and/or the skin layer may be added with other resin components as a modifier, and various additives such as a slip agent, a plasticizer, and a processing aid may be added as necessary. The above other resin component may suitably be at least one selected from the group consisting of styrene-butadiene-butylene-styrene block copolymer (hereinafter referred to as SBBS), styrene-diene block copolymer resin, and styrene- A resin in which a diene block copolymer resin is hydrogenated, and a thermoplastic resin in which a polyolefin is graft-copolymerized with styrene.
此等樹脂可單獨添加,亦可同時使用複數。添加此等的熱可塑性樹脂,可圖提高衝擊強度,同時可提高與表皮層的接著性抑制層間剝離或抑制自薄片端面產生的毛邊或粉。添加量,相對於100質量份聚苯乙烯系樹脂與ABS系樹脂的合計量而言以1~20質量份為理想,更理想為3~15質量份。These resins may be added singly or in combination. By adding such a thermoplastic resin, it is possible to improve the impact strength, and at the same time, it is possible to improve the adhesion between the interlayer and the skin layer, and to suppress the peeling of the interlayer or the generation of burrs or powder generated from the end faces of the sheet. The amount of addition is preferably from 1 to 20 parts by mass, more preferably from 3 to 15 parts by mass, per 100 parts by mass of the total amount of the polystyrene resin and the ABS resin.
苯乙烯-丁二烯-丁烯-苯乙烯嵌段共聚物係以具有以下的(1)、(2)及(3)的化學式所示之重複單元之共聚物。又,於(1)、(2)及(3)的化學式,a、b、c為正整數。The styrene-butadiene-butene-styrene block copolymer is a copolymer having repeating units represented by the following chemical formulas (1), (2) and (3). Further, in the chemical formulas of (1), (2) and (3), a, b, and c are positive integers.
苯乙烯-丁二烯-丁烯-苯乙烯嵌段共聚物,具上述構造者該物之製造方法無特別限制。例如其製造方法於「新規苯乙烯系熱可性彈性體(SBBS)的構造與性能」(日人榮秀司等,第9次聚合物材料專題,125~126頁2000年)、日本特開64-38402號公報、日本特開60-220147號公報、日本特開63-5402號公報、日本特開63-4841號公報、日本特開61-33132號公報、日本特開63-5401號公報、日本特開61-28507號公報、日本特開61-57524號公報等2己有報告。苯乙烯-丁二烯-丁烯-苯乙烯嵌段共聚物可原樣使用市售者。苯乙烯-丁二烯-丁烯-苯乙烯嵌段共聚物中的苯乙烯含量以10~80質量%為理想,以20~70質量%為更理想。又,該共聚物的溶融指數(190℃,2.16 kfg)以1~9 g/10 min者為合適,2~6 g/10 min者為更適合使用。The styrene-butadiene-butene-styrene block copolymer, which has the above-described constitution, is not particularly limited. For example, its manufacturing method is based on the structure and performance of the new styrene-based thermal elastomer (SBBS) (Japanese Ren Xiu Si, et al., 9th Polymer Materials, 125~126, 2000), Japan Special 64 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. 6-35, 401, Japanese Unexamined Patent Publication No. Hei 61-28507, and JP-A-61-57524, and the like. The styrene-butadiene-butene-styrene block copolymer can be used as it is in the market. The styrene content in the styrene-butadiene-butene-styrene block copolymer is preferably from 10 to 80% by mass, more preferably from 20 to 70% by mass. Further, the copolymer has a melt index (190 ° C, 2.16 kfg) of 1 to 9 g/10 min, and 2 to 6 g/10 min is more suitable.
苯乙烯-丁二烯嵌段共聚物樹脂或於苯乙烯-丁二烯嵌段共聚物加氫之樹脂的二烯以丁二烯或異戊二烯為理想。苯乙烯-丁二烯嵌段共聚物樹脂或於苯乙烯-丁二烯嵌段共聚物加氫之樹脂的苯乙烯含量以10~80質量%為理想,以20~70質量%為更理想。聚烯烴以苯乙烯接枝嵌段共聚之樹脂的聚烯烴為乙烯、丙烯的均質聚合物或共聚物,特別以聚乙烯、聚丙烯、或乙烯-醋酸乙烯共聚物為理想。The styrene-butadiene block copolymer resin or the diene of the resin hydrogenated in the styrene-butadiene block copolymer is preferably made of butadiene or isoprene. The styrene content of the styrene-butadiene block copolymer resin or the resin hydrogenated in the styrene-butadiene block copolymer is preferably 10 to 80% by mass, more preferably 20 to 70% by mass. The polyolefin of the polyolefin styrene graft block copolymerized resin is a homogeneous polymer or copolymer of ethylene or propylene, and particularly preferably polyethylene, polypropylene, or ethylene-vinyl acetate copolymer.
表皮層使用之聚苯乙烯系樹脂,可添加苯乙烯-丁二烯-丁烯-苯乙烯嵌段(SBBS)共聚物、苯乙烯-丁二烯嵌段共聚物樹脂、於苯乙烯-丁二烯嵌段共聚物加氫之樹脂、聚烯烴以苯乙烯接枝嵌段共聚之樹脂、以乙烯、丙烯為主成分之均質聚合物或共聚物為代表的聚烯烴系樹脂、聚酯系樹脂、ABS系樹脂等以外的其他樹脂成分作為改質劑。更因應必要可添加滑劑、可塑劑、加工助劑等的各種添加劑。a polystyrene resin used for the skin layer, a styrene-butadiene-butene-styrene block (SBBS) copolymer, a styrene-butadiene block copolymer resin, and a styrene-butadiene resin may be added. a resin in which an alkylene block copolymer is hydrogenated, a resin in which a polyolefin is grafted with a styrene graft block, a polyolefin resin represented by a homogeneous polymer or copolymer mainly composed of ethylene or propylene, a polyester resin, A resin component other than the ABS resin or the like is used as a modifier. Various additives such as a slip agent, a plasticizer, and a processing aid can be added as necessary.
烯烴系樹脂的代表例,可舉聚乙烯樹脂、聚丙烯樹脂、乙烯-α-烯烴樹脂、乙烯-醋酸乙烯共聚物樹脂、乙烯-乙基丙烯酸酯共聚物樹脂等。聚酯系樹脂的代表例可舉聚對苯二甲酸乙二醇酯樹脂、聚對苯二甲酸丁二醇酯樹脂等。Representative examples of the olefin resin include a polyethylene resin, a polypropylene resin, an ethylene-α-olefin resin, an ethylene-vinyl acetate copolymer resin, and an ethylene-ethyl acrylate copolymer resin. Representative examples of the polyester resin include a polyethylene terephthalate resin and a polybutylene terephthalate resin.
本發明複合薄膜,可由使用習知的擠壓機、軋壓機成形等製造。層合薄片的各層的方法,各自由分別的擠壓機成形為薄片或薄膜狀後,藉由熱層合法、乾式層合法、擠壓層合法等可階段層合。又,可於預先成形之薄片的基材層上藉擠壓塗覆等方法層合其他層。更廉價的製造係使用多岐管模頭或注料區之多層擠壓法一次得到層合薄膜為理想。The composite film of the present invention can be produced by using a conventional extruder, a roll press molding or the like. The method of laminating the respective layers of the sheet, each formed into a sheet or a film shape by a separate extruder, may be laminated in stages by thermal lamination, dry lamination, extrusion lamination, and the like. Further, the other layers may be laminated on the base material layer of the previously formed sheet by extrusion coating or the like. A more inexpensive manufacturing process is desirable for obtaining a laminated film at a time using a multi-tube die or a multi-layer extrusion process in the injection zone.
藉由上述薄片使用習知的真空成形、壓空成形、熱壓成形的薄片成形方法,可得到自由形狀的電子零件包裝容器。該容器,自容器的端面的污染少,機械強度極優,特別適合使用於包裝電子零件之托盤或搬運膠帶。A free-form electronic component packaging container can be obtained by the above-described sheet forming method using vacuum forming, pressure forming, and hot press forming. The container has less pollution from the end surface of the container and is excellent in mechanical strength, and is particularly suitable for use in a tray for packaging electronic parts or a handling tape.
以下以實施例更詳細說明本發明。The invention will now be described in more detail by way of examples.
表面層,係由70重量份聚苯乙烯樹脂、20質量份碳黑及10質量份乙烯-乙基丙烯酸酯所成原料藉高速混合機混合均勻。所得之混合物使用45 mm的雙軸擠壓機混練,以單股切斷法顆粒化。The surface layer was uniformly mixed by a high-speed mixer from 70 parts by weight of a polystyrene resin, 20 parts by mass of carbon black, and 10 parts by mass of ethylene-ethyl acrylate. Use of the resulting mixture The 45 mm twin-screw extruder was kneaded and pelletized by a single strand cutting method.
一方面如表1所示組成的丙烯酸-丁二烯-苯乙烯三維共聚物(接枝共聚物)、丙烯腈-苯乙烯二維共聚物(AS)、及依必要使用SBBS,如表2所示比例藉混合機混合均勻作為基材層的樹脂組成物。使用該基材層用樹脂組成物及上述表皮層用膠粒,使用65 mm擠壓機(L/D=28),40 mm(L/D=26)擠壓機2部與注料區及T模,成形為表皮層:基材層:表皮層的厚度比例為1:8:1全體厚度為0.3 mm的3層薄片。On the one hand, the acrylic-butadiene-styrene three-dimensional copolymer (graft copolymer), the acrylonitrile-styrene two-dimensional copolymer (AS), and the SBBS as necessary, as shown in Table 1, The ratio is shown to be a resin composition which is uniformly mixed as a base material layer by a mixer. The resin composition for the base material layer and the rubber particles for the skin layer are used. 65 mm extruder (L/D=28), 40 mm (L/D=26) extruder 2 parts and injection zone and T-die, formed into skin layer: base material layer: thickness ratio of skin layer is 1:8:1 3 layers with a total thickness of 0.3 mm Sheet.
各實施例的評價結果如表3所示。評價依以下的方法實施。The evaluation results of the respective examples are shown in Table 3. The evaluation was carried out in the following manner.
(1)耐折強度:JIS-P-8115(2001年)為依據,荷重500 g,角度135度進行評價。(1) Folding strength: Based on JIS-P-8115 (2001), the load was evaluated at a load of 500 g and an angle of 135 degrees.
(2)拉伸強度:JIS-K-7127(1999年)為依據,以4號進行評價。(2) Tensile strength: Based on JIS-K-7127 (1999), it was evaluated on the 4th.
(3)表面電阻值:使用Mega-ohm meter Model-800(est 公司製)測定薄片方向3點,以其對數平均值為固有表面電阻值。(3) Surface resistance value: Three points in the sheet direction were measured using a Mega-ohm meter Model-800 (manufactured by EST Co., Ltd.), and the logarithmic mean value was an intrinsic surface resistance value.
(4)DuPont衝擊強度:使用DuPont衝擊試驗機/日本東洋精機公司製,求300 g、500 g或1 kg荷重之50%破壞高度,由該時的荷重計算能量值。計算依JIS-k-7211為準進行。(4) DuPont impact strength: Using a DuPont impact tester/manufactured by Toyo Seiki Co., Ltd., a breaking height of 50% of a load of 300 g, 500 g or 1 kg was calculated, and the energy value was calculated from the load at that time. The calculation is based on JIS-k-7211.
(5)成形性:以EDG公司製壓空壓紋膠帶成形機成形24 mm寬之壓紋搬運膠帶。賦形性良好者為5,賦形性不良者為1分為5段進行評價。(5) Formability: An embossed transfer tape of 24 mm width was formed by an EWG vacuum embossing tape forming machine. Those with good formability were 5, and those with poor formability were evaluated by 1 for 5 segments.
(6)沖取毛邊率:將EDG公司成形機成形之壓紋搬運膠帶的飛輪孔以測定顯微鏡(日本Mitutoyo公司製)觀察。無毛邊的狀態為0%,計算飛輪孔中所佔的毛邊面積的比例。(6) Flushing rate: The flywheel hole of the embossed conveyance tape formed by the EDG molding machine was observed with a measuring microscope (manufactured by Mitutoyo Co., Ltd., Japan). The state without burrs is 0%, and the proportion of the area of the burrs occupied by the flywheel holes is calculated.
(7)耐剝離性:對EDG公司成形機成形之24 mm壓紋搬運膠帶,覆蓋膠帶熱封部份以16 mm間隔單邊60處,合計120處的表面以刀片賦予輕傷,之後以平均值約1.0 N之熱封強度的條件熱封。該樣品以約200 mm/min的速度以90°剝離,附著於覆蓋膠帶之薄片表層材料數以長度別0.2 mm以下為S,0.2~1 mm為M,1 mm以上為L作整理。又,覆蓋膠帶使用Denka thermo film ALS-AS(日本電氣化學工業公司製)。(7) Peeling resistance: For the 24 mm embossed handling tape formed by EDG molding machine, the heat-sealed portion of the cover tape is unilaterally 60 at 16 mm intervals. The total surface of 120 is slightly injured by the blade, and then averaged. The condition is heat sealed with a heat seal strength of about 1.0 N. The sample was peeled at 90° at a speed of about 200 mm/min, and the number of surface materials of the sheet attached to the cover tape was S of 0.2 mm or less, M of 0.2 to 1 mm, and L of 1 mm or more. Further, Denka thermo film ALS-AS (manufactured by Nippon Denki Chemical Co., Ltd.) was used as the cover tape.
各實施例表面層所使用的樹脂如下。The resins used in the surface layers of the respective examples are as follows.
聚苯乙烯樹脂:Toyo Styrol HI-SQ(日本東洋苯乙烯!公司製)碳黑:Denka Black粒狀(日本電氣化學工業公司製)乙烯-乙基丙烯酸酯共聚物DPDJ-6169(日本Unica公司製)SBBS:Toughtec P-2000(旭化成Chemicals公司製)實施例1~6係比實施例7~11的任一者沖取毛邊性及耐剝離性優。Polystyrene resin: Toyo Styrol HI-SQ (manufactured by Toyo Styrene Co., Ltd.) Carbon black: Denka Black granular (manufactured by Nippon Denki Chemical Co., Ltd.) ethylene-ethyl acrylate copolymer DPDJ-6169 (manufactured by Unica, Japan) SBBS: Toughtec P-2000 (manufactured by Asahi Kasei Chemicals Co., Ltd.) Examples 1 to 6 are superior in burrability and peeling resistance to any of Examples 7 to 11.
又,於表1、表2及表3,以下的記號分別表示如下的意義。Further, in Tables 1, 2, and 3, the following symbols respectively show the following meanings.
接枝共聚物:丙烯腈-丁二烯-苯乙烯三維共聚物AS:丙烯腈-苯乙烯二維共聚物AN:丙烯腈單體St:苯乙烯單體Bd:丁二烯單體A~E:表示同種的聚合物而種類不同者SBBS:苯乙烯-丁二烯-伸丁基-苯乙烯嵌段共聚物樹脂MD:機械方向TD:橫方向Graft copolymer: acrylonitrile-butadiene-styrene three-dimensional copolymer AS: acrylonitrile-styrene two-dimensional copolymer AN: acrylonitrile monomer St: styrene monomer Bd: butadiene monomer A~E : SBBS: styrene-butadiene-tert-butyl-styrene block copolymer resin MD: mechanical direction TD: transverse direction
由本發明複合薄片加熱成形所得之真空成形托盤、壓變搬運膠帶等,係適合電子機械或汽車等廣泛的領域相關之中間製品等的包裝容器使用。The vacuum-molded tray, the pressure-change conveyance tape, and the like which are obtained by heating and molding the composite sheet of the present invention are suitable for use in a packaging container such as an intermediate product such as an electronic machine or an automobile.
又,引用2004年9月16日申請之日本專利申請2004-269346號、2004年9月16日申請之日本專利申請2004-269347號、及2004年9月16日申請之日本專利申請2004-269348號的說明書、申請專利範圍、圖面及摘要的全內容,納入本發明的說明書的揭示。Japanese Patent Application No. 2004-269346, filed on Sep. 16, 2004, and Japanese Patent Application No. 2004-269347, filed on Sep. 16, 2004, and Japanese Patent Application No. 2004-269348, filed on Sep. The entire contents of the specification, the scope of the patent application, the drawings and the abstract are incorporated herein by reference.
Claims (5)
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JP2004269346 | 2004-09-16 | ||
JP2004269348 | 2004-09-16 | ||
JP2004269347 | 2004-09-16 |
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TW200616791A TW200616791A (en) | 2006-06-01 |
TWI402166B true TWI402166B (en) | 2013-07-21 |
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Application Number | Title | Priority Date | Filing Date |
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TW94132153A TWI402166B (en) | 2004-09-16 | 2005-09-16 | Composite sheet |
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JP (1) | JP5154081B2 (en) |
MY (1) | MY146592A (en) |
TW (1) | TWI402166B (en) |
WO (1) | WO2006030871A1 (en) |
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CN102821951B (en) * | 2010-03-24 | 2016-01-27 | 电化株式会社 | Surface conductivity laminated sheet and electronic component packing container |
JP5573321B2 (en) * | 2010-04-14 | 2014-08-20 | ユーエムジー・エービーエス株式会社 | Polystyrene resin coating resin composition and coated molded article |
JP5615632B2 (en) * | 2010-09-01 | 2014-10-29 | 電気化学工業株式会社 | Surface conductive laminate sheet |
US20130251970A1 (en) | 2010-10-07 | 2013-09-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Surface conductive multilayered sheet |
EP2666630B1 (en) | 2011-01-17 | 2015-03-04 | Denki Kagaku Kogyo Kabushiki Kaisha | Multilayer styrenic resin sheet |
JP2014009337A (en) * | 2012-07-02 | 2014-01-20 | Sumitomo Bakelite Co Ltd | Substrate sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component transportation body |
SG11201903634WA (en) * | 2016-11-01 | 2019-05-30 | Denka Company Ltd | Surface-conductive laminated sheet and electronic component packaging container |
KR20230128363A (en) | 2021-01-08 | 2023-09-04 | 덴카 주식회사 | Sheets for Electronic Components Packaging |
US20240059053A1 (en) | 2021-01-08 | 2024-02-22 | Denka Company Limited | Sheet for packaging electronic part |
WO2024185571A1 (en) * | 2023-03-06 | 2024-09-12 | デンカ株式会社 | Sheet having base material layer containing abs-based resin |
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JP2002256125A (en) * | 2001-02-28 | 2002-09-11 | Daicel Chem Ind Ltd | Conductive resin composition |
JP2002284957A (en) * | 2001-03-23 | 2002-10-03 | Denki Kagaku Kogyo Kk | Rubber-modified styrene-based resin composition and sheetlike product thereof |
JP2002367437A (en) * | 2001-06-07 | 2002-12-20 | Denki Kagaku Kogyo Kk | Conductive sheet of superior slit performance |
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JPH06262715A (en) * | 1993-03-16 | 1994-09-20 | Denki Kagaku Kogyo Kk | Synthetic resin composite |
JPH07144386A (en) * | 1993-09-28 | 1995-06-06 | Denki Kagaku Kogyo Kk | Synthetic resin composite body |
JP3209394B2 (en) * | 1995-09-19 | 2001-09-17 | 電気化学工業株式会社 | Conductive composite plastic sheet and container |
JP3865508B2 (en) * | 1998-09-07 | 2007-01-10 | 電気化学工業株式会社 | Co-extrusion molded product |
JP3983014B2 (en) * | 2001-05-22 | 2007-09-26 | 電気化学工業株式会社 | Sheet with excellent slit properties |
JP2004276479A (en) * | 2003-03-18 | 2004-10-07 | Sumitomo Bakelite Co Ltd | Surface-conductive composite plastic sheet and container for transporting electronic component |
JP4360111B2 (en) * | 2003-03-28 | 2009-11-11 | 住友ベークライト株式会社 | Surface conductive composite plastic sheet and electronic component transport container |
JP4713065B2 (en) * | 2003-06-18 | 2011-06-29 | 電気化学工業株式会社 | Sheet using ABS resin for base material layer |
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2005
- 2005-09-15 JP JP2006535207A patent/JP5154081B2/en active Active
- 2005-09-15 WO PCT/JP2005/017066 patent/WO2006030871A1/en active Application Filing
- 2005-09-16 TW TW94132153A patent/TWI402166B/en active
- 2005-09-16 MY MYPI20054357A patent/MY146592A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002256125A (en) * | 2001-02-28 | 2002-09-11 | Daicel Chem Ind Ltd | Conductive resin composition |
JP2002284957A (en) * | 2001-03-23 | 2002-10-03 | Denki Kagaku Kogyo Kk | Rubber-modified styrene-based resin composition and sheetlike product thereof |
JP2002367437A (en) * | 2001-06-07 | 2002-12-20 | Denki Kagaku Kogyo Kk | Conductive sheet of superior slit performance |
Also Published As
Publication number | Publication date |
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JPWO2006030871A1 (en) | 2008-05-15 |
JP5154081B2 (en) | 2013-02-27 |
MY146592A (en) | 2012-08-30 |
TW200616791A (en) | 2006-06-01 |
WO2006030871A1 (en) | 2006-03-23 |
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