JP2008273998A - Formed article for conveying electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a formed article such as a tray, tape, etc., for conveying electronic components, hardly getting a damage on its surface, excellent in abrasion resistance and scratch resistance, also markedly excellent in static prevention (surface electroconductivity) and excellent in mechanical characteristics including break property, etc. <P>SOLUTION: This resin consists of (a) 100 to 10 pts.wt. potassium ionomer and (b) 0 pt.wt. to 90 pts.wt. thermoplastic resin. Alternatively, the molded article for conveying the electronic components, obtained by molding the resin composition (A), and the formed article for conveying the electronic components, obtained by forming a laminated material obtained by making the resin or the resin composition (A) as a surface layer and laminating the same on a substrate layer consisting of (B) a thermoplastic resin are provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a molded article for conveying an electronic component, and more specifically, it is composed of a specific ionomer or a resin composition containing the ionomer, and has excellent surface abrasion resistance, abrasion resistance, and antistatic properties, so The present invention relates to a molded article for conveying electronic parts such as trays and tapes, which is remarkably excellent in protecting parts.

  Conventionally, a plastic resin tray such as an injection tray or a vacuum forming tray, or a tape such as an embossed carrier tape or a cover tape is often used as a storage container for electronic parts using an IC chip or an LSI chip. It has been.

  And as a synthetic resin material constituting these molded bodies such as trays, carbon black used as an electrically conductive filler is added in large quantities because it is relatively inexpensive and has no crystallinity, so it has excellent dimensional stability during molding. Styrenic resins such as polystyrene are often used from the standpoint that there is no significant decrease in fluidity and moldability, and especially high impact polystyrene (HIPS) due to excellent mechanical properties including crack resistance and moldability. And resin compositions thereof are preferred.

  Incidentally, Patent Document 1 discloses an invention of a container for transporting an electronic component made of a transparent polystyrene resin composition containing HIPS, which is free from burrs and fluffing at the time of sheet punching and slitting and has excellent moldability. .

  In addition, laminated materials in which the above HIPS or the like is used as a base material layer and a polyolefin resin layer such as polyethylene (PE) or polypropylene (PP) is laminated on one or both sides thereof are widely used. Compared to those, it has advantages such as excellent surface abrasion resistance and wear resistance, and good compatibility with general-purpose kneaded antistatic agents.

JP 2006-131893 A

However, the container made of the styrene-based resin is not necessarily sufficient in abrasion resistance and scratch resistance, and has a defect that it is inferior in antifouling property such as prevention of dust adhesion due to static electricity.
Furthermore, styrene resins generally have a slightly lower compatibility with general-purpose kneaded antistatic agents than polyolefin resins such as polyethylene.
In addition, the laminated material in which polyethylene (PE), polypropylene (PP), etc. are laminated on one or both sides using a styrene resin such as HIPS as a base material layer is more resistant to abrasion than the styrene resin alone. The compatibility with the antistatic agent and the like is also good, but the antistatic agent is kneaded into the kneading and the lamination is troublesome and the cost is increased.
In recent years, along with the advancement of integration of LSIs, etc. and the miniaturization of electronic parts due to the miniaturization of chips, the surface of the transport trays has also been improved in surface abrasion resistance and further improvement in antistatic properties, etc. The demand for improving the protection performance of housed electronic components has become stronger.

The inventors of the present invention have made extensive studies to improve the performance of the molding material resin in order to develop a molded article for transporting electronic components in which the above properties are improved and the increase in manufacturing cost is suppressed as much as possible. It was.
As a result, the inventors have found that a specific ionomer or a resin composition containing the ionomer as a molding material can solve the above-mentioned problems, and based on this finding, the present invention has been completed.

Therefore, the object of the present invention is to prevent the surface from being scratched, to be excellent in wear resistance and scratch resistance, to be remarkably excellent in antistatic property (surface conductivity) and to have excellent mechanical properties including cracking properties, etc. Another object of the present invention is to provide a molded article for conveying electronic parts such as trays and tapes, which uses a specific ionomer excellent in moldability such as slitting property or a resin composition containing the specific ionomer as a molding material.
Another object of the present invention is to provide a molded article for conveying an electronic component comprising a laminate obtained by laminating the specific ionomer or a resin composition containing the same as a surface layer on a thermoplastic resin substrate layer. .

  According to this invention, the molded object for electronic component conveyance formed by shape | molding the resin or resin composition (A) which consists of potassium ionomer (a) 100-10 weight part and a thermoplastic resin (b) 0-90 weight part. Is provided.

The molded article for conveying an electronic component according to the first aspect of the present invention is characterized in that a potassium ionomer or a resin composition containing the ionomer is used as a material resin. Conventionally used polystyrene resins such as HIPS are generally used. Compared to molded products such as trays and tapes molded as a raw material resin, it not only has excellent surface scratch resistance, wear resistance, and antistatic properties, but also has excellent mechanical properties including cracking properties. It is an effective feature that it maintains a formability equivalent to or higher than the above.
Therefore, the treatment such as kneading of the antistatic agent is not required as in the case of the conventional HIPS resin.

  According to the second aspect of the invention, for transporting electronic parts, the laminate is formed by laminating the resin or resin composition (A) as a surface layer and laminating the resin or resin composition (A) on a base material layer made of a thermoplastic resin (B). A shaped body is provided.

  The thermoplastic resin (B) is preferably made of a high impact styrene resin.

The molded article for conveying an electronic component of the present invention is formed by molding a potassium ionomer or a resin composition containing the ionomer, or using the ionomer or the ionomer-containing resin composition as a surface layer, and a thermoplastic resin such as HIPS as a base material layer. Since the laminate is molded, the surface has excellent scratch resistance and wear resistance, and even when no kneading-type antistatic agent is blended, it is significantly more antistatic (conductive) than conventional products. Excellent.
However, it is excellent in mechanical properties including crackability and the like, and in molding, retains moldability and slitting properties equivalent to or higher than those of HIPS and the like.

Hereinafter, preferred embodiments of the present invention will be described in detail and specifically.
As described above, the present invention is formed by molding a potassium ionomer or a resin composition containing potassium ionomer (first embodiment), or using the potassium ionomer or potassium ionomer-containing resin composition as a surface layer, and heat such as HIPS. The present invention relates to a molded article for transporting electronic components, which is formed by molding a laminate having a plastic resin as a base material layer (second aspect).
In the present invention, the molded article for transporting electronic components is a molded body that contains, holds, or places electronic components used to transport electronic components such as IC chips, LSI chips, and precision electronic components using them. Specifically, it holds at least one recess for accommodating an electronic component by injection or vacuum forming, usually a tray-shaped molded body provided with a plurality of predetermined intervals, or holds an electronic component by vacuum forming or the like. Examples thereof include a tape-shaped molded body in which irregularities or protrusions for placement are provided at predetermined intervals.

In the present invention, the potassium ionomer which is a constituent resin or resin component of the molded article for conveying an electronic component is a base polymer composed of a copolymer of ethylene and an unsaturated carboxylic acid, or, optionally, another polar group. A part or all of the carboxyl groups of the base polymer copolymerized with the monomer is neutralized with potassium ions.
Such a base polymer can be obtained by radical copolymerization of component monomers at, for example, high temperature and high pressure.

Examples of the unsaturated carboxylic acid (monomer) include acrylic acid, methacrylic acid, fumaric acid, maleic anhydride, monomethyl maleate, and monoethyl maleate. Acrylic acid or methacrylic acid is particularly preferable.
The polar monomer that can be a copolymerization component includes vinyl esters such as vinyl acetate and vinyl pyropionate, methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, and n-hexyl acrylate. And unsaturated carboxylic acid esters such as isooctyl acrylate, methyl methacrylate, dimethyl maleate and diethyl maleate, carbon monoxide, and the like. Unsaturated carboxylic acid esters are particularly suitable copolymerization components.

  As said potassium ionomer, when it is shape | molded, for example as a tray, a tape, etc., in order to make the surface non-electricity resistance (conductivity, antistatic property) highly expressed, unsaturated carboxylic acid content is 10-30. 1% by weight, preferably 15 to 25% by weight, and the other polar group monomer content of 0 to 40% by weight of an ethylene-unsaturated carboxylic acid copolymer neutralized with potassium ions, the potassium It is preferable to use those having a degree of neutralization by ions of 60% or more, preferably 70% or more.

In addition, in order to obtain a more excellent antifouling performance including surface non-electric resistance by reducing the amount of potassium ions, potassium ionomers of two or more ethylene / unsaturated carboxylic acid copolymers having different average acid contents May be used.
For example, two or more types of copolymers having an average acid content of 10 to 30% by weight, preferably 11 to 20% by weight, wherein the difference in acid content between the highest acid content and the lowest acid content is 1% by weight or more, Preferably, a mixed potassium ionomer having an ethylene / unsaturated carboxylic acid copolymer of 2 to 20% by weight different in degree of neutralization with potassium ions of 60% or more, preferably 70% or more can be used. Considering various properties, the use of such a mixed potassium ionomer is more preferable.

The ethylene / unsaturated carboxylic acid copolymer as the base polymer of the potassium ionomer is copolymerized with a polar monomer as described above in a proportion of 40% by weight or less, preferably 30% by weight or less. Also good.
As potassium ionomer, the melt flow rate at 190 ° C. and 2160 g load (according to JIS K7210) is 0.1 to 100 g / 10 min, especially in consideration of processability and miscibility when other components are blended. It is preferable to use 0.2-50 g / 10 min.

  In the present invention, as the resin material for molding, in addition to the potassium ionomer, a resin composition obtained by blending up to 90 parts by weight of a thermoplastic resin with 10 parts by weight or more of the potassium ionomer can also be used.

As such a thermoplastic resin, it can select from the polymeric material used as a base material layer of the molded object (2nd aspect) of the laminated body aspect mentioned later.
Among these, olefin polymers, especially ethylene homopolymers, copolymers of ethylene and α-olefins having 3 or more carbon atoms, copolymerization of ethylene with unsaturated esters such as vinyl acetate and unsaturated carboxylic esters. It is preferable to use an ethylene polymer selected from a coalescence or the like, or a propylene polymer such as polypropylene.

  Examples of the unsaturated carboxylic acid ester in the ethylene / unsaturated carboxylic acid ester copolymer include an ester of an unsaturated carboxylic acid such as acrylic acid or methacrylic acid and an aliphatic alcohol having 1 to 20 carbon atoms. More specifically, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, (meth ) S-butyl acrylate, i-butyl (meth) acrylate, n-hexyl (meth) acrylate, i-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, etc. Can be illustrated.

An appropriate blending amount of the thermoplastic resin is 90 parts by weight or less (0 to 90 parts by weight) with respect to 100 parts by weight of the total amount of the potassium ionomer and the thermoplastic resin. That is, the blending amount of the potassium ionomer is 10 parts by weight. That's it.
When the blending amount of the potassium ionomer is less than 10 parts by weight with respect to 100 parts by weight of the total amount of the potassium ionomer and the thermoplastic resin, the effects such as the antistatic property aimed at by the present invention are not sufficiently exhibited.

In order to further improve the non-chargeability of the ionomer or the ionomer-containing resin composition, a polyhydroxy compound having two or more alcoholic hydroxyl groups can be blended.
Specifically, polyethylene glycol of various molecular weights, polypropylene glycol, polyoxyalkylene glycols such as polyoxyethylene / polyoxypropylene glycol, polyhydric alcohols such as glycerin, hexanetriol, pentaerythritol, sorbitol, and ethylene oxide adducts thereof, Examples include adducts of polyvalent amines and alkylene oxides.
The effective blending ratio of the polyhydroxy compound is 20% by weight or less, preferably 15% by weight or less, more preferably less than 10% by weight based on the potassium ionomer.

  In the molded article for transporting electronic parts of the present invention, as a molding material, an aspect (second aspect) of using a laminate in which potassium ionomer or a resin composition containing it as a surface layer and a thermoplastic resin as a base material layer is used. In this case, the thermoplastic resin used for the base material layer is particularly limited as long as the thermoplastic resin can be laminated on the surface layer resin or the resin composition and has strength and workability capable of forming a molded body such as a tray or a tape. It can be used without any problems.

For such a base material layer, as a particularly suitable thermoplastic resin, specifically, a homopolymer of ethylene or a copolymer of ethylene and an α-olefin having 3 to 12 carbon atoms, such as high pressure polyethylene, High density polyethylene, linear low density polyethylene, especially linear low density polyethylene having a density of 940 kg / m ³ or less, ultra low density polyethylene, etc., polyolefins having 3 or more carbon atoms, such as polypropylene, poly-1-butene, Copolymers of ethylene and polar monomers such as poly-4-methyl-1-pentene, such as ethylene / vinyl acetate copolymers, ethylene and unsaturated carboxylic acids such as acrylic acid, methacrylic acid, monoethyl maleate, maleic anhydride Copolymers with acids or the like, or ionomers such as Na, Li, Zn or Mg, etc. Bonic acid esters such as copolymers with methyl acrylate, ethyl acrylate, isobutyl acrylate, nbutyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, glycidyl methacrylate, dimethyl maleate, etc. A copolymer of an unsaturated carboxylic acid and an unsaturated carboxylic acid ester as described above or an ionomer such as Na, Li, Zn or Mg, a copolymer of ethylene and carbon monoxide and optionally an unsaturated carboxylic acid ester or vinyl acetate. Polymers, such as olefin elastomer polymers such as polyolefin elastomers, polystyrene, styrene polymers such as rubber-reinforced styrene resins such as high impact polystyrene and ABS resin, polyethylene terephthalate, polytrimethylene terephthalate, La terephthalate, can be exemplified polyethylene terephthalate cyclohexanedimethanol copolymerized polyethylene terephthalate, polyesters such as polyester elastomers, polycarbonate, polymethyl methacrylate or the like mixtures of two or more of these.

  Among these, styrene polymers such as high impact polystyrene (HIPS: high impact styrenic resin), ABS resin, rubber reinforced styrene resin are preferable, and polyolefins such as polyethylene and polypropylene are also preferable. Used.

The potassium ionomer or ionomer resin composition layer (A) or the base material layer (B), which is a molding material for a molded article such as the tray or tape of the present invention, further contains various additives as necessary. be able to.
Examples of such additives include antioxidants, light stabilizers, ultraviolet absorbers, pigments, dyes, lubricants, anti-blocking agents, inorganic fillers, and the like.
In particular, it is preferable to add carbon black such as furnace black, channel black, and acetylene black as an inorganic filler to the potassium ionomer or the resin composition from the viewpoint of further improving the conductivity.

  In the second embodiment of the present invention in which the potassium ionomer (resin composition) (A) is a surface layer and the thermoplastic resin (B) is a base material layer, the laminated structure is formed only on one side of the base material layer. In addition to the layer configuration in which potassium ionomer (resin composition) (A) is disposed, ((A) surface layer / (B) substrate layer), potassium ionomer (resin composition) (A) is disposed on both surfaces of the substrate layer. ((A) surface layer / (B) base material layer / (A) surface layer) A three-layer structure is also preferably used.

In the molded article for transporting electronic parts of the present invention, the thickness of the constituent resin layer is not particularly limited, and may be appropriately set according to the use mode. For example, in a tray-shaped or tape-shaped molded body, In the case of a single layer material, about 0.2 to 3.0 mm. 2.0 mm / base layer (B) about 0.1-3.0 mm, double-sided laminated structure ((A) surface layer / (B) base layer / (A) surface layer), layer (A) 0.01- It is preferably about 1.0 mm / layer (B) 0.1 to 3.0 mm / layer (A) 0.01 to 1.0 mm.
In the case of the laminate, the proportion of the potassium ionomer or the potassium ionomer-containing resin composition layer in the total thickness is preferably about 5 to 50% in the case of a single area layer and about 5 to 50% in the case of double-sided lamination.

As a method of molding the molded body of the present invention from the resin material, a molding method usually used for this type of molded body can be used without any particular limitation.
For example, when forming a tray, the resin monolayer or laminate sheet formed by extrusion or coextrusion may be formed into a tray shape by vacuum forming, pressure forming, plug forming, press forming or the like. Moreover, in the case of a single layer body, it can also be molded directly from a material resin by injection molding.
Further, in the case of a laminate, in addition to the coextrusion, the (A) layer / (B) layer and the (B) layer / (A) layer may be joined using an adhesive resin, or a coating layer. Etc. may be further interposed.
In the tape-shaped molded body, vacuum molding is preferably used because it is easy to form shapes such as irregularities and protrusions for holding (fixing) the electronic component.

Further, in the molded article of the present invention, at least the electronic component is accommodated, the surface specific resistance value on the surface on the contact side is 10 ¹² Ω or less, and the surface has 23 ° C. and 50% relative humidity. It is preferable that the 10% decay time (time until decay to 500 V) at an applied voltage of +5000 V measured in an atmosphere is 15 seconds or less, more preferably 10 seconds or less.

  The present invention will be specifically described by the following examples, but the present invention is not limited to these examples.

[Example 1]
Potassium ionomer (1) (50 parts by weight of an ethylene / methacrylic acid copolymer having a methacrylic acid content of 17.5 wt% and MFR of 60 g / 10 min., And an ethylene / methacrylic acid copolymer having a methacrylic acid content of 5.0 wt% and an MFR of 33 g / 10 min.) Press sheet (clamping force 50 TON, hot platen 400 × 400 mm, daylight) made from potassium ionomer (potassium neutralization degree 80 mol%, MFR = 0.4 g / 10 min.) Of resin composition comprising 50 parts by weight of coal Using a press molding machine (TBDM50-2 machine manufactured by Toho Machinery Co., Ltd.) of 200 mm, stroke 150 mm, heater capacity 4.5 kw × 2 surfaces, ram diameter 180 mm, hot plate temperature 160 ° C., initial pressure time 4 min. Initial pressure 3 MPa, curing time 4 min., Curing pressure 10 Pa, cooling temperature 20 ° C., cooling time 4 m n., a press sheet) having a thickness of 2mm was prepared with cooling pressure 15 MPa, 23 ° C., was evaluated following evaluation items 1) to 3) in the measurement conditions of 50% RH.
"Evaluation item"
1) Wear area Using a wear tester manufactured by Toyo Seiki Co., Ltd., sliding piece; cotton canvas No. 10, reciprocating speed 60 times / min. , Number of reciprocations: 100 times, load: 430 g, test piece size: 8 × 28 mm
2) Saturation electrification, half-life STATIC HONESTMER manufactured by Shishido Shokai, test conditions: ASTM D4238 compliant 3) Surface resistivity MITSUBISHI CHEMICAL CO., LTD. HIRESTA-UP used, applied voltage 500 V test conditions; JIS K6911 compliant Indicated.

[Comparative Example 1]
Items 1) to 3 above for press sheet samples prepared using linear low density polyethylene (LLDPE: manufactured by Prime Polymer Co., Ltd., Evolue SP2320, MFR = 1.9 g / 10 min., Density = 919 kg / m ³ ). ) Was evaluated.
The results are shown in Table 1.

[Example 2]
Potassium ionomer (2) (ethylene ion / methacrylic acid copolymer having a methacrylic acid content of 14.6 wt%, potassium ionomer having a potassium ion density of 1.47 mmol / g, MFR of 1.0 g / 10 min. And 20 parts by weight of a metallocene low density polyethylene ( MPE (1): Inflation film produced by Prime Polymer Co., Ltd., Evolue SP2020; potassium ionomer resin composition comprising 80 parts by weight of MFR = 1.9 g / 10 min., density = 920 kg / m ³ ) Using a 30 mmφ inflation molding machine (screw; full flight type, L / D = 28, CR = 3.0, die; spiral die, lip clearance 1.0), a blending temperature of the above ionomer and polyethylene is molding temperature 180 ℃ A film having a thickness of 50 μm produced under the conditions of a screw rotation number of 45 min ⁻¹ and a blow ratio of 2.55) was evaluated for its triboelectric charging property and surface resistivity under the measurement conditions of 23 ° C. and 50% RH.
The evaluation of “triboelectric chargeability” was evaluated by visually confirming the presence or absence of adhesion when the film surface was lightly rubbed with a cotton cloth for 3 seconds and brought close to the shaving node to 1 cm.
○: No adhesion ×: Adhesion The results are shown in Table 2.

[Comparative Example 2]
An inflation film sample produced using the same metallocene low density polyethylene (mPE (1)) used in Example 2 was evaluated in the same manner as in Example 2.
The results are shown in Table 2.

[Example 3]
Potassium ionomer (3) (ethylene ion / methacrylic acid copolymer with a methacrylic acid content of 14.6 wt%, potassium ion density 1.47 mmol / g, MFR 1.0 g / 10 min. Ionomer 20 parts by weight and metallocene low density polyethylene (mPE) (2): Cast polymer (40 mmφ) manufactured by Prime Polymer Co., Ltd., Evolue SP2540; potassium ionomer resin composition comprising 80 parts by weight of MFR = 3.8 g / 10 min., Density = 924 kg / m ³ ) Cast molding machine (screw; full flight type, L / D = 32, CR = 3.75, die; straight manifold type die, die width = 470 mm, no deckle, cooling; air knife, roll cooling temperature = 20 ° C.) Used, molding temperature 220 ° C, screw times A film having a thickness of 30 μm prepared under the conditions of a rotation number of 100 min. ⁻¹ and a line speed of 25 min. ⁻¹ ) was evaluated for surface resistivity under measurement conditions of 23 ° C. and 50% RH.
The results are shown in Table 3.

[Comparative Example 3]
A cast film sample produced using the same metallocene low-density polyethylene (mPE (2)) as used in Example 3 was evaluated in the same manner as in Example 3.
The results are shown in Table 3.

[Example 4]
In Example 3, as the potassium ionomer, potassium ionomer (4) (an ethyleneomer having a methacrylic acid content of 14.6 wt%, a potassium ion density of 1.47 mmol / g, an ionomer having an MFR of 1.0 g / 10 min., 20 weight) Parts and polypropylene homopolymer (PP: manufactured by Prime Polymer Co., Ltd., PP; F107DV; MFR = 7.0 g / 10 min., Density = 910 kg / m ³ ), 80 parts by weight of potassium ionomer resin composition) Used a cast film produced in the same manner as in Example 3, and the surface resistivity was evaluated under the measurement conditions of 23 ° C. and 50% RH in the same manner as in Example 3.
The results are shown in Table 4.

[Comparative Example 4]
A cast film sample produced using the same polypropylene homopolymer (PP) as used in Example 4 was evaluated in the same manner as in Example 3.
The results are shown in Table 4.

Claims (3)

  A molded article for transporting electronic parts, formed by molding a resin or resin composition (A) comprising 100 to 10 parts by weight of potassium ionomer (a) and 0 to 90 parts by weight of a thermoplastic resin (b).   A molded body for transporting electronic parts, formed by molding a laminate in which the resin or the resin composition (A) is used as a surface layer and the resin or resin composition (A) is laminated on a base material layer made of a thermoplastic resin (B).   The molded object for electronic component conveyance in which the thermoplastic resin (B) of Claim 2 consists of high impact-resistant styrene resin.