JP2003292760A - Resin composition, and molding and sheet therefrom - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a resin composition using a polycarbonate-based resin, and to provide a molding and a sheet by using the same. <P>SOLUTION: The resin composition contains the polycarbonate-based resin, carbon black and an ABS-based resin both in less amounts than that of the above resin, or the resin composition contains the polycarbonate resin, 5-50 wt.% carbon black and ≤45 wt.% ABS-based resin. The molding and the sheet obtained by using the resin composition are provided. The sheet having an exposed substrate layer and a surface layer obtained by using the resin composition on at least one surface of it, is used suitably as a sheet for packing an electronic part. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a resin composition, a molded article and a sheet using the resin composition, and the sheet can be suitably used for a packaging container for electronic parts, particularly a sheet for carrier tape.

[0002]

2. Description of the Related Art Injection trays, vacuum forming trays, magazines, carrier tapes (also called embossed carrier tapes), etc. are used as packaging forms for electronic parts including ICs and electronic parts using ICs.
A thermoplastic resin is used for these packaging containers, but one in which a conductive filler is dispersed on the surface is used in order to prevent destruction of electronic components such as ICs due to static electricity. Carbon black is widely used as the conductive filler. Various types of thermoplastic resins are used. Polycarbonate resin is one of them. Regarding a resin composition using a polycarbonate resin, or a molded article such as a sheet using the resin composition, for example, U
SP4,599,262, JP-A-7-21834, JP-A-10-329279, WO01 / 30
569A1 and the like.

[0003]

DISCLOSURE OF THE INVENTION The present invention provides a resin composition using a polycarbonate resin, a molded article and a sheet using the resin composition.

[0004]

DISCLOSURE OF THE INVENTION The present invention relates to a polycarbonate-based resin, carbon black less than that, and ABS.
A resin composition containing a base resin, and a molded article and a sheet using the resin composition. A sheet having a base material layer and a surface layer using the resin composition on at least one surface thereof can be suitably used as a sheet for packaging electronic parts.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.

The resin composition of the present invention comprises a polycarbonate resin, and less carbon black and an ABS resin, preferably a polycarbonate resin, and 5 to 50% by weight thereof. It contains carbon black and 45% by weight or less of an ABS resin. The term "contains" includes not only the case where it is made of a polycarbonate resin, carbon black and an ABS resin, but also the case where it contains them as the main components and also other components within the range not impairing the object of the present invention.

As the polycarbonate resin, aromatic polycarbonate resin, aliphatic polycarbonate resin,
Aromatic-aliphatic polycarbonates are listed, which are usually classified as engineering plastics, and those obtained by general polycondensation of bisphenol A and phosgene or polycondensation of bisphenol A and carbonic acid ester can also be used. A commercially available product can be used.

The ABS resin is a resin containing a copolymer mainly composed of acrylonitrile-butadiene-styrene as a main component, and a commercially available product can be used.
For example, a copolymer obtained by block- or graft-polymerizing one or more monomers of an aromatic vinyl monomer and a vinyl cyanide monomer with a diene rubber, and a blend with the copolymer. To be The diene rubber mentioned here is polybutadiene, polyisoprene, acrylonitrile-butadiene copolymer, styrene-butadiene copolymer or the like, and styrene or α is used as the aromatic vinyl monomer.
-Methyl styrene, various alkyl-substituted styrenes, and the like. Examples of vinyl cyanide monomers include acrylonitrile, methacrylonitrile, and various halogen-substituted acrylonitriles. Specific examples of the above copolymers and blends with the copolymers include acrylonitrile-butadiene-styrene terpolymers and acrylonitrile-styrene binary copolymers obtained by polymerizing polybutadiene into a polymer alloy.

The ratio of acrylonitrile to styrene in the ABS resin is 15% by weight of acrylonitrile based on the compatibility with the polycarbonate resin, the surface condition of the sheet using the resin composition and the impact strength, with the total amount being 100. The above is preferable. The content of the diene rubber is preferably 30 parts by weight or less based on 100 parts by weight of the total amount of acrylonitrile and styrene.

The amount of ABS resin added should be smaller than that of polycarbonate resin. It is preferably 45% by weight or less. When the ABS resin is added to the polycarbonate resin, the softening temperature can be lowered even in a small amount, but it is desirable that the softening temperature is 1% by weight or more, preferably 3% by weight or more. When the amount of ABS resin is large, the impact strength of the resin composition tends to decrease.

Commercially available carbon black can be used. For example, furnace black, channel black, acetylene black, etc. can be used. Those with a large specific surface area and high conductivity obtained with a small amount added to the resin, for example, Ketjen Black,
Acetylene black is preferred. Both powdery and granular form can be used. The amount of carbon black added is smaller than that of the polycarbonate resin, and is preferably in the range of 5 to 50% by weight. In order to prevent the destruction of electronic components, one method is to reduce the surface specific resistance value in order to release the generated static electricity. For that purpose, it is advisable to increase the amount of carbon black added. However, if the amount of carbon black added is increased, the fluidity tends to decrease.
When a sheet is manufactured, it may be difficult to laminate the surface layer of the resin composition on the base material layer, and the mechanical strength of the obtained sheet also decreases.

A molded article for packaging electronic parts,
When used as a carrier tape, electronic parts due to static electricity
Surface resistance of the resin composition
Is 10 ²-10^TenIt is preferably Ω.

Other resin components such as, for example,
A thermoplastic resin, a polyethylene terephthalate resin, a polybutylene terephthalate resin, or the like, and various additives such as a lubricant, a plasticizer, and a processing aid can be added.

The method for producing the resin composition is not particularly limited, but it can be obtained, for example, by kneading and pelletizing all or a part of the raw materials using a known method such as an extruder or a Banbury mixer. When kneading, it is possible to knead the raw materials all at once, or knead half of the polycarbonate-based resin and carbon black, and add the remaining raw materials to the kneaded product and knead in stages. It is also possible to do so.

The resin composition can be used as a molded product. Sheets are a suitable example. At least the sheet having the surface layer containing the resin composition on the side in contact with the electronic component can be suitably used as a sheet for packaging an electronic component, or as an electronic component package or a carrier tape. This sheet can be formed not only as a single-layer sheet having only the surface layer but also as multiple layers. The surface layer / base material layer or the surface layer / base material layer / surface layer is a preferable multilayer sheet structure. Another layer may be provided between the surface layer and the base material layer.

The surface resistivity of the surface layer is 10 ² to 10 ^10.
It is preferably Ω. If the surface resistivity is large, it becomes difficult to suppress the destruction of electronic components due to the generated static electricity.

It is possible to use various resins for the base material layer of the multi-layer sheet, but in particular, ABS resin and / or
Alternatively, a base material layer containing a polystyrene resin is preferable. The inclusion here means not only the case where it is composed only of ABS resin and / or polystyrene resin,
It means a case where they are the main components and also other components are contained within a range not impairing the object of the present invention.

The polystyrene resin is a resin obtained by polymerizing styrene as a main component, and includes, for example, general-purpose polystyrene resin, high-impact polystyrene resin and a mixture thereof.

ABS-based resin and / or polystyrene-based resin is used for the base material layer, and 1 to 5 relative to the base material layer.
It is also possible to add the polycarbonate resin in the range of 0% by weight. The mechanical strength can be further improved by adding the polycarbonate resin.

It is possible to add a small amount of carbon black to the base material layer as long as the fluidity is not impaired. By adding carbon black, it is possible to further improve the mechanical strength and it is possible to solve the problem that the sheet thickness becomes thin when the sheet is molded into a packaging container and the corners of the molded product become transparent. . The carbon black contained in the base material layer is not particularly limited, and carbon black that can be uniformly dispersed in the base material resin is preferable. The amount of carbon black added to the base material layer may be in the range that does not impair the fluidity as described above, and is preferably 0.1 to 10 parts by weight.

For the base material layer, polyethylene resin, polypropylene resin, ethylene-propylene copolymer (eg ethylene-ethyl acrylate resin, ethylene-vinyl acetate copolymer resin, ethylene-α-olefin copolymer resin, etc.), etc. Other resin components such as polyester resin such as olefin resin, polyethylene terephthalate resin and pobutylene terephthalate resin can be added, and various additives such as lubricants, plasticizers and processing aids can be added as necessary. Can be added.

The method for producing the sheet is not particularly limited, but the sheet can be obtained by a known method using an extruder, calender molding or the like. As a method for laminating the surface layer of the resin composition on the base material layer, each is formed into a sheet or film by a separate extruder and then laminated stepwise by a heat laminating method, a dry laminating method, an extrusion laminating method or the like. It is possible to It is also possible to laminate a surface layer on the base material layer of a preformed sheet by a method such as extrusion coating. In order to manufacture at low cost, it is preferable to obtain a laminated sheet at once by a multi-layer coextrusion method using a multi-manifold die or a feed block.

The total thickness of the sheet used for packaging electronic parts is preferably 0.1 to 3.0 mm. In the multi-layered sheet, it is preferable that the surface layer has a ratio of the total thickness in the range of 2 to 80%. The strength as a packaging container obtained by molding a sheet decreases as the overall thickness decreases. On the contrary, as it becomes thicker, it becomes more difficult to form it by pressure forming, vacuum forming, hot plate forming, or the like. As the thickness of the surface layer becomes smaller, the surface specific resistance value of the packaging container obtained by molding the sheet becomes higher, and it becomes difficult to obtain the effect of suppressing static electricity. As the proportion of the surface layer increases, the formability of pressure forming, vacuum forming, hot plate forming, etc. tends to decrease.

The sheet is an electronic component such as an IC or I
It can be used for injection trays, vacuum forming trays, magazines, carrier tapes, etc. as a packaging material for electronic parts using C, and is particularly preferably used for carrier tapes. The electronic component package is a package container in the packaging form such as a carrier tape (embossed carrier tape) in which electronic components are stored. Carrier tapes include those which are covered with a film after housing electronic components.

The electronic component is not particularly limited, and for example, I
C, resistance, capacitor, inductor, transistor, diode, LED (light emitting diode), liquid crystal, piezoelectric element register, filter, crystal oscillator, crystal oscillator, connector, switch, volume, relay, etc. I
The form of C is not particularly limited, and may be, for example, SOP or HEM.
T, SQFP, BGA, CSP, SOJ, QFP, PL
There are CC etc.

[0026]

EXAMPLES The present invention will now be described in more detail with reference to examples. (1) Single-layer sheet Example 1 Polycarbonate-based resin (Panlite L-1225,
Teijin Chemicals Co., Ltd., on the other hand, 12% by weight of carbon black (Ketjen Black EC, Lion AKZO) and 30% by weight of ABS resin (Denka ABS GR-1000, Denki Kagaku Kogyo Co., Ltd.) are used in a φ50 mm bent twin-screw extruder. Was kneaded and pelletized in advance to obtain a resin composition.
ABS as the resin for the base material layer using the resin composition as the surface layer
System resin (Techno ABS YT-346, Techno Polymer Co., Ltd.) is used, φ65 mm extruder (L / D = 28), φ
40mm extruder (L / D = 26) and T of 500mm width
The total thickness is 3 by the feed block method using a die.
00μm, 3 so that the thickness of the surface layer is 30μm on both sides
A layered sheet was obtained.

Example 2 The resin composition was a polycarbonate resin (Panlite L
-1225, Teijin Chemicals Co., Ltd., 20% by weight of acetylene black (Denka Black granules, Denki Kagaku Kogyo) as carbon black, and ABS resin (Denka ABS GR)
-3000, Denki Kagaku Kogyo Co., Ltd.) 10% by weight φ50 mm
The resin composition was obtained by previously kneading and pelletizing with a vent type twin-screw extruder. The resin composition is used as a surface layer and an ABS resin (Techno ABS YT-34) is used as a resin for a base material layer.
6. A mixture of 5% by weight of a polycarbonate resin (Panlite L-1225, Teijin Chemicals Ltd.) was added to Techno Polymer Co., Ltd., and a φ65 mm extruder (L / D = 2) was used.
8) and two φ40mm extruders (L / D = 26) and 6
Using a 50 mm wide three-kind three-layer multi-manifold die, a three-layer sheet having a total thickness of 500 μm and a surface layer of the resin composition of 40 μm on both sides was obtained.

Comparative Example 1 The resin composition is a polycarbonate resin (Panlite L
-1225, Teijin Kasei Co., Ltd. and carbon black (Ketjen Black EC, Lion AKZO)
12% by weight was previously kneaded and pelletized by a φ50 mm bent type twin-screw extruder to obtain a resin composition. A sheet having a total wall thickness of 300 μm was obtained in the same manner as in Example 1 except that the resin composition was used. The following evaluation was performed on the above-prepared sheet. The results are shown in the table.

(Evaluation method) Surface specific resistance value Using a Lorester MCP tester manufactured by Mitsubishi Petrochemical Co., Ltd., the distance between the terminals was set to 10 mm, the sheet resistance was 10 at equal intervals in the width direction, and 40 in total in two rows on each side. The value was measured and the logarithmic average value was made into the surface specific resistance value. Tensile Properties According to JIS-K-7127, a No. 4 test piece was used to perform a tensile test with an Instron type tensile tester at a tensile speed of 10 mm / min. Evaluation of carbon desorption property The film-formed sheet was fixed on a vibration table, and 19 mm ×
Install a 25mm frame, and inside it, QFP 14mm x 20m
After delivering an m-64 pin IC and vibrating it in the plane direction at a stroke of 30 mm at a speed of 480 reciprocations per minute for 800,000 times, the presence or absence of adhered matter on the lead portion of the IC was determined. The state where there was almost no deposit was ⊚, the case where there was deposit was ◯, and the case where there was a lot of deposit was marked x. Formability After slitting the obtained sheet to a width of 24 mm, Ao = 12, Bo = 1 with a heating and pressure molding machine manufactured by EGD
6. Using a mold for embossed carrier tape with Ko = 5.5, a molding test was carried out at a mold temperature of 60 ° C. and a heater temperature of 260 ° C. A good molded product was obtained, ⊚, good molding The product for which no product was obtained was marked with x.

[0030]

[Table 1]

[0031]

EFFECTS OF THE INVENTION A sheet using a resin composition significantly reduces the contamination of electronic parts caused by the abrasion between the electronic parts and the sheet, has good moldability, and is compatible with high-speed packaging and mounting. It has excellent mechanical strength.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B65D 65/40 B65D 65/40 D 4F207 73/02 73/02 M 4J002 85/86 C08J 5/00 CFD C08J 5/00 CFD C08K 3/04 C08K 3/04 C08L 55:02 // (C08L 69/00 B29K 69:00 55:02) B29L 7:00 B29K 69:00 B65D 85/38 S B29L 7:00 F term (reference) 3E067 AA11 AB41 AC04 BA26A BA34A BB14A BB25A BC04A CA21 EA06 EB27 EC08 FA01 FC01 GD04 GD10 3E086 AB02 AC07 AD09 BA04 BA35 BB35 BB54 BB85 BB90 CA31 DA08 3E096 AA06 BA08 CA11 CC01 DA14 DB06 DC01 EA02X EA11X FA07 FA20 FA40 GA01 4F071 AA50 AA77 AB03 AF13 AF15 AF36 AF38 AH04 AH05 AH12 BB04 BB06 BC01 BC02 4F100 AA37A AA37B AA37H AK01B AK12B AK45A AK45B AK74A AK74B AL05A AL05B BA02 CA21A CA 21B GB15 JG01 JG03 JG04 JL06 YY00 4F207 AA13 AA28 AB18 AG01 AH54 KA01 KA17 KL64 4J002 BN152 CG001 DA036 FD10 GG00 GG01 GG02 GQ00

Claims (12)

[Claims] 1. A resin composition containing a polycarbonate-based resin, carbon black and an ABS-based resin in a smaller amount. 2. A resin composition comprising a polycarbonate resin, and 5 to 50% by weight of carbon black and 45% by weight or less of an ABS resin. 3. A molded product using the resin composition according to claim 1. 4. A sheet using the resin composition according to claim 1. 5. The sheet according to claim 4, which has a base material layer and a surface layer using a resin composition on at least one surface thereof. 6. The sheet according to claim 5, wherein the base material layer contains an ABS resin and / or a polystyrene resin. 7. The sheet according to claim 6, wherein the base material layer further contains a polycarbonate resin in an amount of 1 to 50% by weight based on the base material layer. 8. The sheet according to claim 5, wherein the base material layer contains carbon black in an amount of 0.1 to 10% by weight based on the base material layer. 9. The surface resistivity of the surface layer is from 10 ² to 10 ^10.
The sheet according to any one of claims 4 to 8, which is Ω. 10. The sheet according to claim 4, which is manufactured by a coextrusion method using a multi-manifold die or a feed block. 11. A sheet for packaging electronic parts, which uses the sheet according to any one of claims 4 to 10. 12. An electronic parts packaging container, a carrier tape or an electronic parts packaging body, which uses the sheet according to any one of claims 4 to 11.