TW201412209A - Method and apparatus for recycling metal from printed circuit board waste - Google Patents
Method and apparatus for recycling metal from printed circuit board waste Download PDFInfo
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- TW201412209A TW201412209A TW101133504A TW101133504A TW201412209A TW 201412209 A TW201412209 A TW 201412209A TW 101133504 A TW101133504 A TW 101133504A TW 101133504 A TW101133504 A TW 101133504A TW 201412209 A TW201412209 A TW 201412209A
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- 238000004064 recycling Methods 0.000 title claims abstract description 58
- 239000002699 waste material Substances 0.000 title claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000002245 particle Substances 0.000 claims abstract description 115
- 239000000203 mixture Substances 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000010419 fine particle Substances 0.000 claims description 20
- 238000007781 pre-processing Methods 0.000 claims description 19
- 239000011362 coarse particle Substances 0.000 claims description 14
- 238000010298 pulverizing process Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 5
- 239000002893 slag Substances 0.000 claims description 5
- 239000008187 granular material Substances 0.000 description 5
- 238000003912 environmental pollution Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000010793 electronic waste Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
Description
本發明係一種回收廢棄印刷電路之處理方法及其裝置，特別是一種回收廢棄印刷電路之濕式處理方法及其裝置。The present invention relates to a method and apparatus for recycling waste printed circuits, and more particularly to a wet processing method and apparatus for recycling waste printed circuits.
近年來隨著電子資訊產業蓬勃發展，電子商品不斷推陳出新，不僅使得電子產品淘汰週期越來越短，亦造成許多電子廢棄物，而其中又以廢棄印刷電路板為大宗，然印刷電路板內含有錫、鉛、銅等重金屬，任意丟棄容易造成環境汙染。In recent years, with the rapid development of the electronic information industry, electronic products continue to be innovated, which not only makes the electronic product elimination cycle shorter and shorter, but also causes a lot of electronic waste, and among them, the waste printed circuit board is a large part, but the printed circuit board contains Heavy metals such as tin, lead and copper are easily discarded due to environmental pollution.
為解決此一問題，廢棄印刷電路板之回收再利用已為趨勢。根據國內外技術能力分析:廢棄印刷電路板及其邊料僅需水洗或烘乾等簡單處理後，即可通過TCLP測試標準，亦可再利用於人造木材與建築材料上，且該等金屬不乏可再循環利用之有價金屬，若能善加處理印刷電路板，不但可減少環境負擔，亦可透過回收印刷電路取得電路板內之金屬，得到可觀之回收價值。In order to solve this problem, recycling and recycling of discarded printed circuit boards has become a trend. According to the technical ability analysis at home and abroad: the waste printed circuit board and its edge materials can be passed through the TCLP test standard after being simply washed or dried, and can be reused on artificial wood and building materials, and there is no shortage of such metals. Recyclable metals, if they can handle printed circuit boards, can not only reduce the environmental burden, but also recover the printed circuit to obtain the metal in the circuit board, which can obtain considerable recovery value.
一般印刷電路板所含金屬部分為10%~20%，目前相關產業中已研發出如酸洗、溶蝕、焚化或裂解等方法回收廢棄印刷電路板中的金屬材料，惟上述方法在回收廢棄印刷電路板時，仍有以下問題:Generally, the printed circuit board contains 10% to 20% of the metal part. At present, the related industries have developed methods such as pickling, etching, incineration or cracking to recover the metal materials in the waste printed circuit board, but the above method is in recycling waste printing. When the board is used, there are still the following problems:
- 酸洗法：係為利用硫酸等腐蝕性化學藥劑，將印刷電路板中金屬與玻璃纖維等物質分解，然該化學藥劑需要經常替換，不僅提高成本亦容易造成二次汙染。The pickling method is to use a corrosive chemical agent such as sulfuric acid to decompose a metal such as a glass fiber or the like in a printed circuit board, and the chemical agent needs to be replaced frequently, which not only increases the cost but also causes secondary pollution.
- 溶蝕法：係為將印刷電路板進行溶蝕，透過溶蝕將印刷電路板內含有之金屬取出，然印刷電路板中間層內之金屬仍無法完全溶出，使得溶蝕後之電路板上仍然夾雜金屬成份，且容易造成再次公害汙染。The dissolution method is to dissolve the printed circuit board and remove the metal contained in the printed circuit board through the dissolution. However, the metal in the middle layer of the printed circuit board is still not completely dissolved, so that the metal plate is still trapped on the circuit board after the dissolution. And it is easy to cause pollution pollution again.
- 焚化法：係為將印刷電路板直接以火化方式將金屬與玻璃纖維製成混合物，經混合物冷卻後再取得金屬，然過程中因燃燒印刷電路板而釋放有毒氣體且回收物僅為低階混合金屬，該金屬必須再次冶煉方可使用。Incineration method: the mixture of metal and glass fiber is directly cremation in a printed circuit board, and the mixture is cooled to obtain metal. In the process, the toxic gas is released by burning the printed circuit board and the recyclate is only low-order mixing. Metal, the metal must be re-smelted before it can be used.
- 裂解法：係為於利用高溫將印刷電路板進行分解進而取得有價金屬，然裂解法設備昂貴及資源化效益不佳等問題。The cleavage method is a problem in which the printed circuit board is decomposed by high temperature to obtain a valuable metal, and the cracking method equipment is expensive and the resource utilization efficiency is not good.
有鑑於此，如何能達到達到最大回收效能且減少汙染風險，已成為業界亟欲解決之問題。In view of this, how to achieve maximum recovery efficiency and reduce the risk of pollution has become an issue that the industry is eager to solve.
為克服上述缺點，本發明提供一種回收廢棄印刷電路板金屬方法，包含以下步驟:提供一廢棄印刷電路板；第一前處理步驟，將廢棄電路板進行破碎、粗碎及細碎至粒徑為0.5mm~1.8mm之電路板顆粒，電路板顆粒依粒徑大小及其密度可分為低密度細粒徑、低密度粗粒徑、高密度粗粒徑及高密度細粒徑；第二前處理步驟，將電路板顆粒混入粒徑為0.025mm~2mm及濃度為20%~28%之混渣物料，形成第一混合物；分層步驟，利用搖床對第一混合物進行搖動及水流擾動，使得第一混合物形成高密度粗粒徑電路板顆粒在下、低密度細粒徑電路板顆粒在上、以及低密度粗粒徑與高密度細粒徑之電路板顆粒處於相互混雜狀態之第二混合物；分選步驟，利用橫向坡度調節範圍為0~12度之搖床對第二混合物施加縱向搖晃作用，同時利用水流對第二混合物進行橫向衝擊，其中因低密度細粒徑電路板顆粒承受較大之水流橫向衝擊，使得低密度細粒徑之電路板顆粒及高密度細粒徑之電路板顆粒被分離至搖床之不同位置；回收步驟，將分佈於不同位置之電路板顆粒依密度及粒徑大小分別回收。In order to overcome the above disadvantages, the present invention provides a method for recycling a waste printed circuit board metal, comprising the steps of: providing a waste printed circuit board; the first pre-processing step of crushing, coarsely breaking and finely breaking the waste circuit board to a particle size of 0.5 Mm~1.8mm circuit board particles, circuit board particles can be divided into low density fine particle size, low density coarse particle size, high density coarse particle size and high density fine particle size according to particle size and density; second pretreatment In the step, the circuit board particles are mixed into the slag material having a particle diameter of 0.025 mm 2 mm and a concentration of 20% to 28% to form a first mixture; and the layering step uses a shaker to shake the first mixture and disturb the water flow, so that The first mixture forms a high-density coarse-grained circuit board particle on the lower, low-density fine-grained circuit board particles, and the second mixture of the low-density coarse-grained-size and high-density-fine-grained circuit board particles in a state of being intermixed; In the sorting step, a longitudinal shaking effect is applied to the second mixture by using a shaker having a lateral slope adjustment range of 0 to 12 degrees, and the second mixture is laterally impacted by the water flow, wherein the low density is fine The particle size circuit board particles are subjected to a large lateral impact of the water flow, so that the low-density fine-grained circuit board particles and the high-density fine-grained circuit board particles are separated into different positions of the shaker; the recycling step is distributed in different positions. The circuit board particles are separately recovered according to the density and the particle size.
因此，本發明之其一目的在於提供一種回收廢棄印刷電路板金屬方法，由於本方法包含第一前處理步驟、第二前處理步驟、分層步驟、分選步驟及回收步驟，相較於其他現有回收廢棄印刷電路板中的金屬材料方法，本發明為利用搖床進行搖晃及水流衝擊作用將電路板顆粒依據密度及粒徑大小進行分類回收，故無需焚化或利用腐蝕性化學物品，不僅降低原料成本，更進一步減少對環境的汙染。Accordingly, it is an object of the present invention to provide a method of recycling a waste printed circuit board metal, since the method includes a first pre-processing step, a second pre-processing step, a layering step, a sorting step, and a recycling step, as compared to the other The present invention relates to a method for recycling metal materials in a waste printed circuit board. The present invention uses a shaker for shaking and water flow impact to classify and recycle circuit board particles according to density and particle size, so that it is not necessary to incinerate or utilize corrosive chemicals, thereby not only reducing Raw material costs further reduce environmental pollution.
本發明之其二目的在於提供一種回收廢棄印刷電路板金屬方法，由於本發明係將電路板顆粒依據粒徑大小及密度進行分層步驟及分選步驟分類再回收，進而提升電子廢料回收之效能。The second object of the present invention is to provide a method for recycling the metal of the waste printed circuit board. The present invention improves the efficiency of electronic waste recycling by classifying and recycling the circuit board particles according to the particle size and density of the layering step and the sorting step. .
本發明亦提供一種回收廢棄印刷電路板金屬設備，包含粉碎設備、搖床設備及回收設備。其中粉碎設備用以將廢棄電路板進行破碎、粗碎及細碎至粒徑為0.5mm~1.8mm之電路板顆粒，電路板顆粒依粒徑大小及密度可分為低密度細粒徑、低密度粗粒徑、高密度粗粒徑及高密度細粒徑；搖床設備上供有一水流，電路板顆粒藉由水流之擾動而形成高密度粗粒徑之電路板顆粒在下、低密度細粒徑之電路板顆粒在上、以及低密度粗粒徑之電路板顆粒與高密度細粒徑之電路板顆粒處於相互混雜狀態之混合物，因低密度細粒徑之電路板顆粒承受水流的橫向衝擊較高密度細粒徑電路板顆粒大，故低密度細粒徑電路板顆粒及高密度細粒徑之電路板顆粒被分離至搖床設備之不同位置上；回收設備用以將搖床設備上位於不同位置之電路板顆粒分別回收。The invention also provides a metal device for recycling waste printed circuit boards, comprising a pulverizing device, a shaker device and a recycling device. The pulverizing equipment is used for crushing, coarsely crushing and finely breaking the waste circuit board to circuit board particles with a particle diameter of 0.5 mm to 1.8 mm, and the circuit board particles can be classified into low density fine particle size and low density according to particle size and density. Crude particle size, high-density coarse particle size and high-density fine particle size; a water flow is provided on the shaker device, and the circuit board particles are formed by high-density coarse-grained circuit board particles under the disturbance of water flow in the lower and lower density fine particle diameter. The circuit board particles on the upper, and the low-density coarse-grained circuit board particles and the high-density fine-grained circuit board particles are in a mixed state, because the low-density fine-grained circuit board particles are subjected to the lateral impact of the water flow. The high-density fine-grained circuit board has large particles, so the low-density fine-grained circuit board particles and the high-density fine-grained circuit board particles are separated into different positions of the shaker device; the recycling device is used to place the shaker device on The board particles in different positions are separately recovered.
因此，本發明之其三目的在於提供一種回收廢棄印刷電路板金屬設備，由於本設備包含粉碎設備、搖床設備及回收設備，相較於其他現有回收廢棄印刷電路板中的金屬材料設備，本發明係利用搖床進行搖晃及水流衝擊作用將電路板顆粒依據密度及粒徑大小進行分類回收，故無需焚化或利用腐蝕性化學物品，不僅降低原料成本，更進一步減少對環境的汙染。Accordingly, a third object of the present invention is to provide a metal device for recycling waste printed circuit boards, which comprises a pulverizing device, a shaker device and a recycling device, compared to other metal materials in existing waste printed circuit boards. The invention utilizes a shaker for shaking and water flow impact to classify and recycle circuit board particles according to density and particle size, so that it is not necessary to incinerate or utilize corrosive chemicals, thereby not only reducing raw material costs, but also further reducing environmental pollution.
本發明之其四目的在於提供一種回收廢棄印刷電路板金屬設備，由於本發明將電路板顆粒依據粒徑大小及密度進行分層步驟及分選步驟分類再回收，其回收過程細膩，進而提升電子廢料回收之效能。The fourth object of the present invention is to provide a metal device for recycling waste printed circuit boards. Since the present invention classifies and recycles the circuit board particles according to the particle size and density, the recycling process is fine, and the electronic process is improved. The effectiveness of waste recycling.
本發明主要係揭露一種回收廢棄印刷電路板金屬方法及設備，其中所提及之粉碎或回收等相關步驟，已為相關技術領域具有通常知識者所能明瞭，故以下文中之說明，不再作完整描述。同時，以下文中所對照之圖式，係表達與本發明特徵有關之結構示意，並未亦不需要依據實際尺寸完整繪製，合先敘明。The invention mainly discloses a method and a device for recycling the waste printed circuit board metal, wherein the related steps of pulverization or recycling mentioned in the related art have been known to those skilled in the relevant art, so the following description will not be made. Full description. At the same time, the drawings in the following texts express the structural schematics related to the features of the present invention, and do not need to be completely drawn according to the actual size, which is described first.
請參考圖1，為本發明所提出之一種回收廢棄印刷電路板金屬方法流程圖，該方法1包含提供一廢棄印刷電路板之步驟110、第一前處理步驟120、第二前處理步驟130、分層步驟140、分選步驟150及回收步驟160。請參考圖1A係為本發明提出之回收廢棄印刷電路板金屬方法1中第一前處理步驟120的流程圖。在第一前處理步驟120中，廢棄印刷電路板係依序被破碎成粒徑為50mm~80mm左右之電路板顆粒、被粗碎成粒徑為5mm~12mm之電路板顆粒，及被細碎成粒徑為0.5mm~1.8mm之電路板顆粒，且這些電路板顆粒依照密度及粒徑大小可分為:低密度細粒徑、低密度粗粒徑、高密度粗粒徑及高密度細粒徑。請參考圖1B，為本發明所提出之回收廢棄印刷電路板金屬方法1中第二前處理步驟130的流程圖。在第二前處理步驟130中，係提供前述經過第一前處理步驟120之電路板顆粒，並混入粒徑為0.025mm~2mm而濃度係為20%~28%之混渣物料，並形成第一混合物。Please refer to FIG. 1 , which is a flowchart of a method for recycling metal of a waste printed circuit board according to the present invention. The method 1 includes a step 110 of providing a discarded printed circuit board, a first pre-processing step 120, and a second pre-processing step 130. The layering step 140, the sorting step 150, and the recycling step 160. Please refer to FIG. 1A , which is a flowchart of a first pre-processing step 120 in the method 1 for recycling a waste printed circuit board according to the present invention. In the first pre-processing step 120, the discarded printed circuit board is sequentially crushed into circuit board particles having a particle diameter of about 50 mm to 80 mm, and is roughly crushed into circuit board particles having a particle diameter of 5 mm to 12 mm, and is finely crushed into The particle size of the board is 0.5mm~1.8mm, and the particle size of these boards can be divided into: low density fine particle size, low density coarse particle size, high density coarse particle size and high density fine particle. path. Please refer to FIG. 1B , which is a flowchart of a second pre-processing step 130 in the method 1 for recycling the waste printed circuit board metal according to the present invention. In the second pre-processing step 130, the circuit board particles passing through the first pre-processing step 120 are provided, and the slag material having a particle diameter of 0.025 mm 2 mm and a concentration system of 20% to 28% is mixed and formed into a first a mixture.
請參考圖1C，為本發明提出之回收廢棄印刷電路板金屬方法1中分層步驟140的流程圖。在分層步驟140中，係利用一搖床對經過第二前處理步驟130之第一混合物施加搖動作用進而造成第一混合物結構鬆散，因相同密度條件下，細粒有較大的壓強，因此細粒穿越粗粒間隙累積在較下層，然高密度細粒又較低密度細粒有更大的壓強，故形成高密度粗粒徑之電路板顆粒在下、低密度細粒徑之電路板顆粒在上、以及低密度粗粒徑與高密度細粒徑之電路板顆粒處於相互混雜狀態之第二混合物。Please refer to FIG. 1C, which is a flow chart of the layering step 140 in the method 1 for recycling the waste printed circuit board metal proposed by the present invention. In the layering step 140, a shaking action is applied to the first mixture passing through the second pre-processing step 130 by using a shaker to cause the first mixture to be loosely structured, and the fine particles have a large pressure under the same density condition. The fine particles pass through the coarse grain gap and accumulate in the lower layer. However, the high-density fine particles and the lower-density fine particles have a larger pressure, so that the high-density coarse-grained circuit board particles are formed in the lower and lower-density fine-grained circuit board particles. The second mixture of the upper and the low-density coarse-grained and high-density fine-grained circuit board particles in a state of being mixed with each other.
請參考圖1D，為本發明提出之回收廢棄印刷電路板金屬方法1中分選步驟150的流程圖。在該分選步驟150中，係利用搖床進行不對稱縱向搖動，使所提供之第二混合物斷續向前移動，而水流對第二混合物施加一橫向衝擊，其中低密度細粒徑之電路板顆粒承受水流之橫向衝擊較高密度細粒徑之電路板顆粒所承受水流之橫向衝擊較大，進而讓第二混合物依其密度與粒徑大小在搖床之床面上呈扇形分布，從而達到分離效果，而大密度電路板顆粒具有較大的縱向移動速度和較小的横向移動速度，其速度方向偏離搖動方向的傾角小，另小密度電路板顆粒具有較大的横向移動速度和較小的縱向移動速度，其合成速度方向偏離搖動方向的傾角大，趨於尾渣端。大密度粗粒及小密度细粒则界於上述兩者之間。而搖床之橫向坡度調節範圍為0~12度。最後，回收步驟160，係將分佈於不同位置之電路板顆粒依密度及粒徑分別回收，達到廢棄印刷電路板金屬回收再利用之目的。Please refer to FIG. 1D , which is a flow chart of the sorting step 150 in the method 1 for recycling the waste printed circuit board metal according to the present invention. In the sorting step 150, the asymmetric longitudinal shaking is performed by using a shaker to intermittently move the supplied second mixture, and the water flow applies a lateral impact to the second mixture, wherein the low-density fine-grained circuit The slab is subjected to the lateral impact of the water flow, and the high-density fine-grained circuit board particles have a large lateral impact on the water flow, and the second mixture is distributed in a fan shape on the bed surface of the shaker according to its density and particle size. The separation effect is achieved, while the large-density circuit board particles have a large longitudinal moving speed and a small lateral moving speed, the inclination direction of the speed direction is smaller than the shaking direction, and the small-density circuit board particles have a large lateral moving speed and The small longitudinal moving speed, the direction of the synthetic speed deviates from the shaking direction, and tends to the tail end. Large-density coarse particles and small-density fine particles are bounded between the above two. The lateral slope of the shaker can be adjusted from 0 to 12 degrees. Finally, in the recycling step 160, the particles of the circuit board distributed in different positions are separately recovered according to the density and the particle size, so as to achieve the purpose of recycling and recycling the discarded printed circuit board metal.
請參考圖2，為本發明提出之一種回收廢棄印刷電路板金屬設備示意圖。如圖2所示，本發明所提出之回收廢棄印刷電路板金屬設備2包含有一粉碎設備220、一搖床設備230及一回收設備240。粉碎設備220係利用物理粉碎原理，將所提供之一廢棄印刷電路板破碎至粒徑為50mm~80mm左右之電路板顆粒、之後再將其粗碎至粒徑為5mm~12mm之電路板顆粒，以及在將其細碎至粒徑為0.5mm~1.8mm之電路板顆粒，且電路板顆粒依照密度及粒徑大小可分為:低密度細粒徑、低密度粗粒徑、高密度粗粒徑及高密度細粒徑。Please refer to FIG. 2 , which is a schematic diagram of a metal device for recycling a waste printed circuit board according to the present invention. As shown in FIG. 2, the recycling waste printed circuit board metal device 2 of the present invention comprises a pulverizing device 220, a shaker device 230 and a recycling device 240. The pulverizing apparatus 220 utilizes the principle of physical pulverization, and breaks one of the discarded printed circuit boards to a board particle having a particle diameter of about 50 mm to 80 mm, and then coarsely pulverizes it to a board particle having a particle diameter of 5 mm to 12 mm. And it is finely divided into circuit board particles with a particle diameter of 0.5 mm to 1.8 mm, and the circuit board particles can be classified according to density and particle size: low density fine particle diameter, low density coarse particle diameter, high density coarse particle diameter. And high density fine particle size.
請參考圖3，係為本發明提出之一種回收廢棄印刷電路板金屬設備之搖床設備230的側視圖。如圖3所示，搖床設備230係備有一水流供應裝置2303，其利用搖晃及水流作用進行物料分離及分選過程，其橫向坡度調節範圍為0~12度。操作上，係藉由搖床設備230將電路板顆粒與混渣物料所形成之第一混合物進行搖動，因第一混合物結構鬆散，於相同密度條件下，細粒有較大的壓強，因此細粒穿越粗粒間隙累積在較下層，然高密度細粒又較低密度細粒有更大的壓強，故形成高密度粗粒徑之電路板顆粒在下、低密度細粒徑之電路板顆粒在上、以及低密度粗粒徑與高密度細粒徑之電路板顆粒處於相互混雜狀態之第二混合物。另外，搖床裝置230對第二混合物進行不對稱縱向搖動，而水流則對第二混合物進行橫向衝擊，使得其中低密度細粒徑之電路板顆粒承受水流之橫向衝擊較高密度細粒徑之電路板顆粒所承受水流之該橫向衝擊較大，進而達第二混合物依其密度與粒徑大小在床面上呈扇形分布，從而達到分離效果，而大密度電路板顆粒具有較大的縱向移動速度和較小的横向移動速度，其速度方向偏離搖動方向的傾角小，另小密度電路板顆粒具有較大的横向移動速度和較小的縱向移動速度，其合成速度方向偏離搖動方向的傾角大，趨於尾渣端。大密度粗粒及小密度细粒则界於上述兩者之間。Please refer to FIG. 3, which is a side view of a shaker apparatus 230 for recycling waste printed circuit board metal equipment according to the present invention. As shown in FIG. 3, the shaker device 230 is provided with a water flow supply device 2303, which performs the material separation and sorting process by shaking and water flow, and the lateral slope adjustment range is 0 to 12 degrees. In operation, the first mixture formed by the circuit board particles and the slag material is shaken by the shaker device 230. Because the first mixture has a loose structure, the fine particles have a large pressure under the same density condition, so The granules pass through the coarse intergranular space and accumulate in the lower layer. However, the high density fine granules and the lower density granules have a larger pressure, so that the high-density coarse-grained circuit board granules are formed in the lower and lower-density fine-grained circuit board granules. The upper, and the low-density coarse particle size and the high-density fine-grained circuit board particles are in a second mixture in a state of being intermixed. In addition, the shaker device 230 performs asymmetric longitudinal shaking of the second mixture, and the water flow laterally impacts the second mixture, so that the low-density fine-grained circuit board particles are subjected to lateral impact of the water flow and the higher density fine particle diameter The lateral impact of the water flow on the board particles is large, and the second mixture is distributed in a fan shape on the bed surface according to its density and particle size, thereby achieving separation effect, and the large density circuit board particles have large longitudinal movement. The speed and the small lateral moving speed have a small inclination angle of the speed direction away from the shaking direction, and the small-density circuit board particles have a large lateral moving speed and a small longitudinal moving speed, and the synthetic speed direction has a large inclination angle from the shaking direction. , tends to the tail end. Large-density coarse particles and small-density fine particles are bounded between the above two.
為進一步說明，請參考圖3，本發明提出一種回收廢棄印刷電路板金屬設備之搖床設備230包含有：傳動部2301、床體2302、水流供應裝置2303及調坡器2304。床體2302與傳動部2301連接，傳動部2301係利用電動機通過皮帶傳動曲軸旋轉而帶動床體2302隨之進行縱向及橫向運動，或其他具有相同功能之方法對床體2302進行傳動；床體2302係藉由傳動部2301及水流供應裝置2303對電路板顆粒縱向搖動及橫向水流衝擊，使得電路板顆粒依照不同密度及粒徑大小分散於床體2302不同位子上。為增加水流沖動之效果，於床體2302下設有兩個以上與床體2302連接之調坡器2304，用以調整床體2302之傾斜程度，其係利用油壓、電動等具有相同功能之可調高支撐裝置，在此並不特別加以限制。For further explanation, referring to FIG. 3, the present invention provides a shaker apparatus 230 for recycling a waste printed circuit board metal device, comprising: a transmission portion 2301, a bed body 2302, a water flow supply device 2303, and a ridge adjuster 2304. The bed body 2302 is connected to the transmission portion 2301. The transmission portion 2301 is driven by the motor to drive the crankshaft to rotate the belt body 2302 to perform longitudinal and lateral movement, or other methods having the same function to drive the bed body 2302; the bed body 2302 The longitudinal movement of the circuit board particles and the lateral water flow impact by the transmission portion 2301 and the water flow supply device 2303 cause the circuit board particles to be dispersed in different positions of the bed 2302 according to different densities and particle sizes. In order to increase the effect of the water flow impulse, two or more slope adjusters 2304 connected to the bed body 2302 are arranged under the bed body 2302 to adjust the inclination degree of the bed body 2302, which uses the same function as the oil pressure and the electric motor. The adjustable height support device is not particularly limited herein.
以上所述僅為本發明之較佳實施方式及其實施例，並非用以限定本發明之權利範圍；同時以上的描述，對於相關技術領域之專門人士應可明瞭及實施，因此其他未脫離本發明所揭示之精神下所完成的等效改變或修飾，均應包含在申請專利範圍中。The above description is only the preferred embodiment of the present invention and its embodiments, and is not intended to limit the scope of the present invention. The above description should be understood and implemented by those skilled in the relevant art, so that the other Equivalent changes or modifications made by the spirit of the invention should be included in the scope of the patent application.
1．．．回收廢棄印刷電路板金屬方法1. . . Recycling waste printed circuit board metal method
110．．．提供一廢棄印刷電路板之步驟110. . . Provide a step to discard printed circuit boards
120．．．第一前處理步驟120. . . First pre-processing step
130．．．第二前處理步驟130. . . Second pre-processing step
140．．．分層步驟140. . . Layering step
150．．．分選步驟150. . . Sorting step
160．．．回收步驟160. . . Recovery step
2．．．回收廢棄印刷電路板金屬設備2. . . Recycling waste printed circuit board metal equipment
220．．．粉碎設備220. . . Crushing equipment
230．．．搖床設備230. . . Shaker equipment
2301．．．傳動部2301. . . Transmission department
2302．．．床體2302. . . Bed body
2303．．．水流供應裝置2303. . . Water flow supply device
2304．．．調坡器2304. . . Ridge adjuster
240．．．回收設備240. . . Recycling equipment
圖1為本發明提出之一種回收廢棄印刷電路板金屬方法之流程圖。1 is a flow chart of a method for recycling metal of a waste printed circuit board according to the present invention.
圖1A為本發明提出之回收廢棄印刷電路板金屬方法之第一前處理步驟流程圖。1A is a flow chart showing the first pre-processing steps of the method for recycling the waste printed circuit board metal according to the present invention.
圖1B為本發明提出之回收廢棄印刷電路板金屬方法之第二前處理步驟流程圖。FIG. 1B is a flow chart showing a second pre-processing step of the method for recycling the waste printed circuit board metal according to the present invention.
圖1C為本發明提出之回收廢棄印刷電路板金屬方法之分層步驟流程圖。1C is a flow chart showing the layering steps of the method for recycling the waste printed circuit board metal according to the present invention.
圖1D為本發明提出之回收廢棄印刷電路板金屬方法之分選步驟流程圖1D is a flow chart of the sorting steps of the method for recycling waste printed circuit board metal according to the present invention
圖2為本發明提出之一種回收廢棄印刷電路板金屬設備之示意圖。2 is a schematic view of a metal device for recycling a waste printed circuit board according to the present invention.
圖3為本發明提出之回收廢棄印刷電路板金屬設備之搖床設備的側視圖。3 is a side view of a shaker apparatus for recycling a waste printed circuit board metal device according to the present invention.
1．．．回收廢棄印刷電路板金屬方法1. . . Recycling waste printed circuit board metal method
110．．．提供廢棄印刷電路板步驟110. . . Provide waste printed circuit board steps
120．．．第一前處理步驟120. . . First pre-processing step
130．．．第二前處理步驟130. . . Second pre-processing step
140．．．分層步驟140. . . Layering step
150．．．分選步驟150. . . Sorting step
160．．．回收步驟160. . . Recovery step
Claims (5)
提供一廢棄印刷電路板；
對該廢棄印刷電路板進行一第一前處理步驟，係將該廢棄印刷電路板進行破碎、粗碎及細碎之處理，俾該廢棄印刷電路碎裂成複數個電路板顆粒，該等電路板顆粒粒徑係為0.5mm~1.8mm，該等電路板顆粒由低密度細粒徑、低密度粗粒徑、高密度粗粒徑及高密度細粒徑之電路板顆粒所組成；
對該等電路板顆粒進行一第二前處理步驟，係將該等電路板顆粒混入一混渣物料，形成一第一混合物，該混渣物料的粒徑係為0.025mm~2mm，濃度係為20%~28%；
利用一搖床對該第一混合物進行一分層步驟，係利用該搖床對該第一混合物施加一搖動作用，同時利用該搖床上一水流對該第一混合物施加水流擾動作用，俾該第一混合物中該等高密度粗粒徑之電路板顆粒在下、該等低密度細粒徑之電路板顆粒在上、以及該等低密度粗粒徑與該等高密度細粒徑之電路板顆粒處於相互混雜狀態之一第二混合物；
對該第二混合物進行一分選步驟，係利用該搖床對該第二混合物施加一縱向搖晃作用，同時利用該水流對該第二混合物施加一橫向衝擊，其中該等低密度細粒徑之電路板顆粒承受之該水流之該橫向衝擊較該等高密度細粒徑之電路板顆粒所承受之該水流之該橫向衝擊較大，俾該等低密度細粒徑之電路板顆粒及該等高密度細粒徑之電路板顆粒被分離至該搖床之不同位置，該搖床之橫向坡度調節範圍為0~12度；以及
進行一回收步驟，係將分佈於不同位置之該等電路板顆粒依密度及粒徑分別回收。A method of recycling a discarded printed circuit board metal, comprising the steps of:
Providing a discarded printed circuit board;
Performing a first pre-processing step on the discarded printed circuit board, the waste printed circuit board is subjected to crushing, coarse crushing and fine crushing, and the waste printed circuit is broken into a plurality of circuit board particles, and the circuit board particles are The particle size is 0.5 mm to 1.8 mm, and the circuit board particles are composed of low-density fine particle diameter, low-density coarse particle diameter, high-density coarse particle diameter and high-density fine-grained circuit board particles;
Performing a second pre-processing step on the board particles, the board particles are mixed into a slag material to form a first mixture, the particle size of the slag material is 0.025 mm~2 mm, and the concentration is 20%~28%;
Performing a layering step on the first mixture by using a shaker, applying a rocking action to the first mixture by using the shaker, and applying a water flow disturbance to the first mixture by using a water flow on the shaker, The high-density coarse-grained circuit board particles in the mixture, the low-density fine-grained circuit board particles, and the low-density coarse-grained particles and the high-density fine-grained circuit board particles a second mixture in a state of being intermixed;
Performing a sorting step on the second mixture by applying a longitudinal shaking effect to the second mixture by using the shaker, and applying a lateral impact to the second mixture by the water flow, wherein the low-density fine-grained The lateral impact of the water flow experienced by the circuit board particles is greater than the lateral impact of the high-density fine-grained circuit board particles, and the low-density fine-grained circuit board particles and the like The high-density fine-grained circuit board particles are separated into different positions of the shaker, the lateral slope of the shaker is adjusted to a range of 0 to 12 degrees; and a recovery step is performed to distribute the boards at different positions The particles are recovered separately according to density and particle size.
一粉碎設備，用以將一廢棄印刷電路板進行破碎、粗碎及細碎之處理，俾該廢棄印刷電路板碎裂成粒徑係為0.5mm~1.8mm之複數個電路板顆粒，該等電路板顆粒由低密度細粒徑、低密度粗粒徑、高密度粗粒徑及高密度細粒徑之電路板顆粒組成；
一搖床設備，其上具有一水流供應裝置，其中該等電路板顆粒藉由該水流供應裝置所供應之一水流之擾動而形成該等高密度粗粒徑之電路板顆粒在下、該等低密度細粒徑之電路板顆粒在上、以及該等低密度粗粒徑之電路板顆粒與該等高密度細粒徑之電路板顆粒處於相互混雜狀態之一混合物，且其中該等低密度細粒徑之電路板顆粒承受該水流的橫向衝擊大於該等高密度細粒徑電路板顆粒所承受該水流的橫向衝擊，進而該等低密度細粒徑電路板顆粒及該等高密度細粒徑之電路板顆粒被分離至該搖床設備之不同位置；及
一回收設備，用以將該搖床設備上位於不同位置之該等電路板顆粒分別回收。A metal device for recycling waste printed circuit boards, including:
a pulverizing device for crushing, coarsely pulverizing and finely pulverizing a waste printed circuit board, and smashing the discarded printed circuit board into a plurality of circuit board particles having a particle diameter of 0.5 mm to 1.8 mm, and the circuits The plate particles are composed of low-density fine particle diameter, low-density coarse particle diameter, high-density coarse particle diameter and high-density fine-grained circuit board particles;
a shaker device having a water flow supply device thereon, wherein the circuit board particles are formed by the disturbance of a water flow supplied by the water flow supply device to form the high-density coarse-grained circuit board particles under the lower And the low-density coarse-grained circuit board particles and the high-density fine-grained circuit board particles are in a mixed state, and wherein the low-density is fine The lateral impact of the particle size of the circuit board particles subjected to the water flow is greater than the lateral impact of the water flow of the high-density fine-grained circuit board particles, and the low-density fine-grained circuit board particles and the high-density fine particle diameter The circuit board particles are separated into different locations of the shaker apparatus; and a recycling apparatus for recovering the circuit board particles at different locations on the shaker apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101133504A TWI449478B (en) | 2012-09-13 | 2012-09-13 | Method and apparatus for recycling metal from printed circuit board waste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101133504A TWI449478B (en) | 2012-09-13 | 2012-09-13 | Method and apparatus for recycling metal from printed circuit board waste |
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| TW201412209A true TW201412209A (en) | 2014-03-16 |
| TWI449478B TWI449478B (en) | 2014-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101133504A TWI449478B (en) | 2012-09-13 | 2012-09-13 | Method and apparatus for recycling metal from printed circuit board waste |
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| TW (1) | TWI449478B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639473B (en) * | 2015-11-25 | 2018-11-01 | 厄帖諾回收有限責任公司 | Automatic component segregator enabled with a smart transistor testing kit(s) |
| TWI796107B (en) * | 2022-01-20 | 2023-03-11 | 菖鼎科技股份有限公司 | Recycling methods of waste printed circuit boards |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2654236Y (en) * | 2003-11-04 | 2004-11-10 | 苏州科技学院 | Composite dry method electronic waste object assorting machine |
| CN101585042B (en) * | 2009-05-31 | 2012-09-05 | 中国矿业大学 | Aqueous medium physical recovering art for valuable components in waste circuit board and device thereof |
| CN101642765B (en) * | 2009-09-04 | 2012-07-04 | 北京航空航天大学 | Recycling method of discarded circuit board |
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- 2012-09-13 TW TW101133504A patent/TWI449478B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639473B (en) * | 2015-11-25 | 2018-11-01 | 厄帖諾回收有限責任公司 | Automatic component segregator enabled with a smart transistor testing kit(s) |
| TWI796107B (en) * | 2022-01-20 | 2023-03-11 | 菖鼎科技股份有限公司 | Recycling methods of waste printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI449478B (en) | 2014-08-11 |
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