TWI542417B - A resourced processing system of waste of metalliferous pcb - Google Patents

A resourced processing system of waste of metalliferous pcb Download PDF

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TWI542417B
TWI542417B TW103122248A TW103122248A TWI542417B TW I542417 B TWI542417 B TW I542417B TW 103122248 A TW103122248 A TW 103122248A TW 103122248 A TW103122248 A TW 103122248A TW I542417 B TWI542417 B TW I542417B
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magnetic
metal
printed circuit
circuit board
waste
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TW103122248A
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TW201600186A (en
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施百鴻
呂東璇
王偉哲
陳崇智
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呂東璇
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

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Description

含金屬的印刷電路板廢料之資源化處理方法 Recycling method for metal-containing printed circuit board waste

本發明是有關於一種資源化處理方法,特別是一種含金屬的印刷電路板廢料之資源化處理方法。 The invention relates to a resource processing method, in particular to a resource processing method for a metal-containing printed circuit board waste.

印刷電路板(PCB)已大量地使用於各項電器產品中,而該印刷電路板主要材質為玻纖環氧樹脂板,而一般玻纖環氧樹脂板係利用環氧樹脂進行銅箔及玻璃纖維布間之黏合處理,以形成外表為裸銅之夾層板,故基板之主要組成為銅箔、玻璃纖維布及環氧樹脂,而基板經內層處理(貼膜、曝光、蝕刻、黑棕化)、壓合、鑽孔、電鍍(一次銅電鍍、二次銅電鍍)、外層處理(貼膜、曝光、顯影、蝕刻、去膜)、噴錫、鍍金及成型等處理程序,將其它金屬電鍍於基板之銅箔層面,以形成所須之線路而生產為印刷電路板成品。 Printed circuit boards (PCBs) have been widely used in various electrical products, and the printed circuit boards are mainly made of glass fiber epoxy resin sheets, while general glass fiber epoxy resin sheets are made of epoxy resin for copper foil and glass. The bonding between the fiber cloths is to form a sandwich plate whose appearance is bare copper, so the main components of the substrate are copper foil, glass fiber cloth and epoxy resin, and the substrate is treated by the inner layer (filming, exposure, etching, black browning). ), pressing, drilling, electroplating (primary copper plating, secondary copper plating), outer layer processing (filming, exposure, development, etching, film removal), spray tin, gold plating and molding processes, etc., electroplating other metals The copper foil layer of the substrate is produced as a finished printed circuit board by forming the required wiring.

但令人擔憂的是,除了印刷版在製造或使用過程中,因為鑽孔、裁切而形成廢料外,以及當電器產品一旦報廢成為廢棄品時,若未將該廢料予以回收,或回收處理不當時,其內部的廢棄印刷電路板上所含的錫、銅等重金屬,以及印刷電路板中屬於鹵化物的環氧樹脂,更是容易造成環境的第二次公害。 However, it is worrying that, in addition to the printing plate, during the manufacturing or use, the waste is formed by drilling and cutting, and when the electrical product is scrapped into waste, if the waste is not recycled, or recycled In the meantime, the heavy metals such as tin and copper contained in the internal waste printed circuit board and the epoxy resin which is a halide in the printed circuit board are more likely to cause the second pollution of the environment.

因此,如何將廢棄之印刷電路板有效進行回收與再生資源化,以及如何分離含於其玻纖環氧樹脂板內之金屬,以及如何減少玻璃纖維樹脂中之金屬溶出,以成眾所努力之目標。 Therefore, how to effectively recycle and recycle recycled printed circuit boards, how to separate the metal contained in the glass epoxy resin board, and how to reduce the metal dissolution in the glass fiber resin, in order to achieve the public's efforts aims.

因此,本發明之目的,是在提供一種含金屬的印刷電路板廢料之資源化處理方法,進而將原本屬於廢棄物之印刷電路板,有效轉成可再利用之資源。 Accordingly, it is an object of the present invention to provide a resource processing method for a metal-containing printed circuit board waste, and to efficiently convert a printed circuit board which is originally a waste into a reusable resource.

於是,本發明一種含金屬的印刷電路板廢料之資源化處理方法,其包含有集收步驟、破碎步驟、磁選步驟、磨粉步驟及分選步驟等;其中,該集收步驟係將印刷電路板收集後,以便該破碎步驟將該印刷電路板破碎而得到一粒料後,而後該磁選步驟再將該粒料透過該磁選機篩選出含磁性金屬之著磁性粒料,與未含磁性金屬之非著磁性粒料,該研磨步驟再針對非著磁性粒料進行研磨動作,以使該粒料研磨成粉粒料,至於該分選步驟則具備有一分選機,以將該粉粒料輸入該分選機內,以依照該粉屑之比重而篩分金屬粉屑與廢玻纖樹脂粉,使該金屬粉屑與廢玻纖樹脂粉等資源物,進行後續處理與運用;再者,為減少該廢玻纖樹脂粉部分物質溶出,可接續有一改質步驟,以加入一添加劑進行混拌,以使該廢玻纖樹脂粉可形成一細粒料,以供後續利用。 Therefore, the present invention provides a method for recycling a metal-containing printed circuit board waste, comprising a collecting step, a crushing step, a magnetic separating step, a milling step, a sorting step, and the like; wherein the collecting step is a printed circuit After the plate is collected, the crushing step is used to break the printed circuit board to obtain a pellet, and then the magnetic separation step passes the pellet through the magnetic separator to select magnetic particles containing magnetic metal, and the magnetic metal is not contained. Instead of magnetic pellets, the grinding step is followed by a grinding action on the non-magnetic pellets to grind the pellets into powder pellets, and the sorting step is provided with a sorting machine for the pellets Input into the sorting machine, according to the specific gravity of the dust, sieving the metal dust and the waste glass fiber resin powder, and making the metal powder and the waste glass fiber resin powder and other resources for subsequent processing and application; In order to reduce the dissolution of the waste glass fiber resin, a modification step may be followed by adding an additive to mix, so that the waste glass fiber resin powder can form a fine pellet for subsequent use.

圖1是本發明第一較佳實施例之流程圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart of a first preferred embodiment of the present invention.

圖2是本發明第二較佳實施例之流程圖。 Figure 2 is a flow chart of a second preferred embodiment of the present invention.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的明白。 The above and other technical contents, features, and advantages of the present invention will become apparent from the Detailed Description of the <RTIgt;

參閱圖1,本發明第一較佳實施例,本實施例含金屬的印刷電路板廢料之資源化處理方法,其包含有一集收步驟、破碎步驟、磁選步驟、磨粉步驟及分選步驟等;其中,該集收步驟係備具有不含電子零組件之廢印刷電路板,例如報廢電器設備拆下來後已去除電子零件之印刷電路板,或者生產過程中裁切或鑽孔印刷電路板所產生之邊屑等,皆可做為該集收步驟中所欲集收之印刷電路板廢料;另,該破碎步驟則將該印刷電路板進行破碎成一粒料,而其破碎粒徑最佳是控制在5-15mm之粒料。 Referring to FIG. 1, a first embodiment of the present invention, a method for recycling a metal-containing printed circuit board waste, comprising a collecting step, a crushing step, a magnetic separating step, a milling step, a sorting step, and the like Wherein, the collection step is provided with a waste printed circuit board containing no electronic components, such as a printed circuit board from which electronic components have been removed after the scrapped electrical equipment is removed, or a printed circuit board is cut or drilled during production. The generated edge chips and the like can be used as the printed circuit board waste collected in the collection step; in addition, the crushing step breaks the printed circuit board into a pellet, and the crushed particle size is optimal. Control the pellets in 5-15mm.

仍續前述,該磁選步驟則具備有一磁選機(圖中未示),以將該粒料透過該磁選機之磁力篩選出含磁性金屬之著磁性粒料(例如鐵),與未含磁性金屬之非著磁性粒料(例如玻纖樹脂、銅等);而後,該研磨步驟就可針對該非著磁性粒料進行研磨動作,以便將該非著磁性粒料研磨成一粉粒料,而該粉粒料最佳之粒徑是控制在0.5-2mm間;最後,該分選 步驟,其具備有一分選機(圖中未示),以將該粉粒料輸入該分選機內,以依照該粉粒料之比重而篩分出金屬粉屑(主成分為銅)與廢玻纖樹脂粉(內含環氧樹脂);是以,藉由該破碎步驟與磁選步驟,以便將該具有磁性之金屬物質予以磁選分離後,再針對非著磁性粒料進行研磨與分選時,將可達到增加該分選步驟中之金屬粉屑與廢玻纖樹脂粉分選效果,尤其是使該金屬粉屑所含之銅成分更純,增加資源化之效益。 Continuing with the foregoing, the magnetic separation step is provided with a magnetic separator (not shown) for filtering the magnetic material (such as iron) containing magnetic metal through the magnetic force of the magnetic separator, and the magnetic metal is not included. Non-magnetic pellets (such as glass fiber resin, copper, etc.); then, the grinding step can perform a grinding action on the non-magnetic pellets to grind the non-magnetic pellets into a powder pellet, and the pellets The optimum particle size is controlled between 0.5-2mm; finally, the sorting a step of providing a sorting machine (not shown) for inputting the powder pellet into the sorting machine to sieve metal dust (main component is copper) according to the specific gravity of the powder pellet Waste glass fiber resin powder (containing epoxy resin); that is, by the crushing step and the magnetic separation step, the magnetic metal material is magnetically separated and then ground and sorted for non-magnetic particles When the separation of the metal powder and the waste glass fiber resin powder in the sorting step is increased, the copper component contained in the metal powder is more pure, and the resource utilization benefit is increased.

參閱圖2,本發明第二較佳實施例,本實施例仍包含有集收步驟、破碎步驟、磁選步驟、磨粉步驟及分選步驟;其中,該分選步驟中所得之廢玻纖樹脂粉再進行一改質步驟,該改質步驟係備具有一添加劑,同時於本實施例中,該添加劑成分包含有15~45重量百分比的SiO2,20~50重量百分比的CaO,7.5~30重量百分比的Al2O3,1~5重量百分比的Fe2O3,以透過該廢玻纖樹脂粉與該添加劑攪拌後,凝結固化成細粒料,以使該細粒料中所含之銅溶出料可有效降低,當然改質後之細粒料亦可當作混凝土之細骨材之資源化使用,以使該廢玻纖樹脂粉與添加劑所混拌而成之細粒料,能有效減少該廢玻纖樹脂粉中之銅溶出,避免後續造成環境二度汙染外,更可使得該廢玻纖樹脂粉運用範圍更廣。 Referring to FIG. 2, in the second preferred embodiment of the present invention, the embodiment further includes a collecting step, a crushing step, a magnetic separating step, a milling step and a sorting step; wherein the waste glass fiber resin obtained in the sorting step The powder is further subjected to a upgrading step, the upgrading step is provided with an additive, and in the embodiment, the additive component comprises 15 to 45 weight percent of SiO 2 , 20 to 50 weight percent of CaO, 7.5 to 30 a weight percentage of Al 2 O 3 , 1 to 5 weight percent of Fe 2 O 3 , after being stirred by the waste glass fiber resin powder and the additive, coagulated and solidified into fine particles to make the fine particles contain The copper-soluble material can be effectively reduced. Of course, the fine-grained material after the modification can also be used as a resource for the fine aggregate of concrete, so that the waste glass fiber resin powder and the additive can be mixed into fine particles. The copper dissolution in the waste glass fiber resin powder is effectively reduced to avoid the second-degree pollution of the environment, and the waste glass fiber resin powder can be used in a wider range.

歸納前述,本發明含金屬的印刷電路板廢料之資源化處理方法,其藉由集收之印刷電路板廢料,先經由破碎步驟破碎成粒料後,再由該磁選步驟將該粒料磁選出含磁性 金屬之著磁性粒料與未含磁性金屬之非著磁性粒料,而後針對該未著磁性粒料進行研磨成一粉粒料,之後該粉粒料再依比重而篩分出金屬粉屑(銅)與廢玻纖樹脂粉,使該金屬粉屑與該廢玻纖樹脂粉可供後續利用,進而有效達到資源化之效果外;再者,該廢玻纖樹脂粉更可接續有一改質步驟,以加入一添加劑進行混拌,以使該廢玻纖樹脂粉可形成細粒料,促使該廢玻纖樹脂粉所溶出銅物質溶出料降低,促使該廢玻纖樹脂粉之應用領域更廣,有效達到資源化之目的。 In summary, the resource processing method for the metal-containing printed circuit board waste of the present invention is obtained by collecting the printed circuit board waste, first breaking into pellets through a crushing step, and then magnetically selecting the pellets by the magnetic separation step. Magnetic The magnetic particles of the metal and the non-magnetic particles not containing the magnetic metal are then ground to the powder pellets, and then the powder particles are sieved to remove the metal powder according to the specific gravity (copper) And the waste glass fiber resin powder, the metal powder scrap and the waste glass fiber resin powder can be used for subsequent use, thereby effectively achieving the effect of resource utilization; further, the waste glass fiber resin powder can be further modified. Mixing with an additive to make the waste glass fiber resin powder form fine particles, and promoting the dissolution of the copper material dissolved in the waste glass fiber resin powder, thereby promoting the application field of the waste glass fiber resin powder , effectively achieve the purpose of resource.

惟以上所述者,僅為說明本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the description of the invention. All should remain within the scope of the invention patent.

Claims (5)

一種含金屬的印刷電路板廢料之資源化處理方法,其包含有:一集收步驟,其備具有不含電子零組件之印刷電路板;一破碎步驟,其將該印刷電路板進行破碎,進而得到一粒料;一磁選步驟,其具備有一磁選機,以將該粒料透過該磁選機篩選出含磁性金屬之著磁性粒料,與未含磁性金屬之非著磁性粒料;一磨粉步驟,針對非著磁性粒料進行研磨動作,以使該非著磁性粒料研磨成一粉粒料;及一分選步驟,其具備有一分選機,以將該粉粒料輸入該分選機內,以依照該粉屑之比重而篩分出金屬粉屑與廢玻纖樹脂粉,以分別供後續處理與利用。 A method for recycling a metal-containing printed circuit board waste, comprising: a collecting step, comprising: a printed circuit board without an electronic component; and a crushing step, the printed circuit board is broken, and further Obtaining a pellet; a magnetic separation step, comprising a magnetic separator, wherein the pellet is filtered through the magnetic separator to select a magnetic pellet containing magnetic metal, and a non-magnetic pellet containing no magnetic metal; a step of performing a grinding operation on the non-magnetic pellets to grind the non-magnetic pellets into a powder pellet; and a sorting step having a sorting machine for inputting the powder pellets into the sorting machine The metal powder waste and the waste glass fiber resin powder are sieved according to the specific gravity of the dust to be separately processed and utilized. 根據申請專利範圍第1項所述含金屬的印刷電路板廢料之資源化處理方法,其中,針對該廢玻纖樹脂粉再進行一改質步驟,該改質步驟係備具有一添加劑,以透過該廢玻纖樹脂粉與該添加劑混合攪拌後,凝結固化成一細粒料。 The method for recycling a metal-containing printed circuit board waste according to the first aspect of the invention, wherein the waste glass fiber resin powder is further subjected to a upgrading step, the modifying step being provided with an additive for transmitting After the waste glass fiber resin powder is mixed with the additive, it is coagulated and solidified into a fine pellet. 根據申請專利範圍第2項所述含金屬的印刷電路板廢料之資源化處理方法,該添加劑成分包含有15~45重量百分比的SiO2,20~50重量百分比的CaO,7.5~30重量百分比的Al2O3,1~5重量百分比的Fe2O3According to the resource processing method of the metal-containing printed circuit board waste according to claim 2, the additive component comprises 15 to 45 weight percent of SiO 2 , 20 to 50 weight percent of CaO, and 7.5 to 30 weight percent. Al 2 O 3 , 1 to 5 weight percent Fe 2 O 3 . 根據申請專利範圍第1項所述含金屬的印刷電路板廢料之資源化處理方法,其中,該破碎步驟所述該粒料最佳之破碎粒徑為5-15mm。 The method for recycling a metal-containing printed circuit board waste according to claim 1, wherein the pellet has an optimum crushing particle size of 5-15 mm. 根據申請專利範圍第1項所述含金屬的印刷電路板廢料之資源化處理方法,其中,該磨粉步驟所述之最佳研磨粒徑該粉粒料最佳研磨粒徑為0.5-2mm。 The method for recycling a metal-containing printed circuit board waste according to claim 1, wherein the optimum grinding particle size of the powdering step is 0.5-2 mm.
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