TW201408479A - Laminated board, and method for manufacturing laminated board - Google Patents

Abstract

The invention relates to a laminated board comprising an insulating layer (11) and a metal layer (12). The insulating layer (11) comprises a fibrous substrate (110) and a resin layer (112) impregnated or laminated in the fibrous substrate (110). The metal layer (12) is provided on the insulating layer (11). A hole (113) is formed on the insulating layer (11), and an end portion (111A) of a single fiber (111) constituting the fibrous substrate (110) is exposed from the inner wall of the hole (113) so that the end portion (111A) of the exposed single fiber (111) is melted to be deformed and enlarge the diameter.

Description

Method for manufacturing laminated board and laminated board

The present invention relates to a method of manufacturing a laminated board and a laminated board.

A conventional printed circuit board is used in a conventional electronic device or the like. The printed wiring board is manufactured, for example, as follows.

First, a resin varnish is contained in a fiber base material such as a glass fiber cloth, and dried to obtain a prepreg. A prepreg is prepared in one piece or a plurality of sheets are stacked, and a metal foil such as a copper foil is laminated, and then a metal foil laminate is formed by heat and pressure molding. Further, an electric circuit is formed on the metal foil laminate to form an inner layer circuit board. Then, a prepreg or a resin layer as described above is superposed on the surface of the inner layer circuit board, and a metal foil such as a copper foil is further laminated, and then subjected to heat and pressure molding. Then, a circuit pattern is formed on the metal foil.

In order to electrically couple the circuit patterns formed by sandwiching the prepreg, it is necessary to form holes such as through holes and via holes in the prepreg (hereinafter referred to as "through holes, etc."), and inside the holes. Set the conductor film.

Since a plurality of through holes or the like are formed in the prepreg, insulation reliability between the through holes and the like is required. In particular, the interval between the through holes and the like tends to be narrow in recent years, and along with this phenomenon, it is a big problem to improve the insulation reliability between the through holes and the like.

The reason why the insulation reliability between the through holes and the like is impaired is considered as follows. There is a void in the fiberglass cloth known as "hollow". If in the hollow A through hole or the like is formed in a place where it exists, and a through hole or the like communicates with the cavity. When a conductive film is formed in the through hole or the like, the metal ions constituting the conductive film are moved into the insulating resin layer through the voids existing in the glass fiber cloth, and the insulation reliability between the through holes and the like is lowered.

Therefore, as disclosed in Patent Document 1, there has been proposed a method of reducing voids in a glass cloth.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-149574

However, in recent years, higher insulation reliability is required, and the method disclosed in Patent Document 1 has been difficult to satisfy such a requirement.

The laminated board according to the present invention includes: an insulating layer comprising: a fibrous base material obtained by weaving a yarn bundled by a plurality of individual fibers; and a resin layer containing the fibrous base material; And a metal layer provided on the insulating layer; wherein a hole is formed in the insulating layer; an end portion of the single fiber constituting the fiber base material is exposed on an inner wall of the hole; and the exposed end portion of the single fiber is performed Melt deformation and increase diameter.

Here, the laminated board of the present invention may be a printed wiring board, or may be an inner layer circuit board or the like included in the printed wiring board.

According to the invention, the end portion of the single fiber is melt-deformed so that the end portion of the single fiber of the fiber base material is expanded. Therefore, even if a void occurs at the end of the single fiber, the cavity is still collapsed by being melt-deformed in such a manner that the end portion is expanded. Therefore, even if a metal-containing conductive film is formed inside the pores, it is possible to suppress metal ions from entering the inside of the insulating layer through the voids.

In addition, since the diameter of the single fiber exposed at the inner wall of the hole is expanded, when the metal-containing conductive film is formed inside the hole, metal ions can be prevented from entering the gap between the single fiber and the resin layer.

Furthermore, the present invention can also provide a method of manufacturing the above laminated sheet.

In a method of manufacturing a laminated board, the laminated board is provided with an insulating layer and a metal layer; the insulating layer has a fibrous base material woven from a bundle of a plurality of bundled single fibers, and contains a fiber a resin layer in the substrate; the metal layer is disposed on the insulating layer; and includes: forming a hole in the insulating layer; the step of forming the hole is to form the hole by using a laser, and is inside the hole The exposed fiber fiber end portion of the fiber substrate is melt-deformed, and the end portion of the single fiber exposed on the inner wall of the hole is expanded.

According to the present invention, it is possible to provide a laminated board and a method for producing a laminated board which can improve the insulation reliability between the holes when the metal-containing conductive film is formed inside the hole.

1‧‧‧Laminated board (printed wiring board)

5‧‧‧ Manufacturing equipment

10‧‧‧ Inner board

11‧‧‧Insulation

12, 30~33, 121~123‧‧‧ metal layer

20‧‧‧Interlayer insulation (stacked layer)

21, 113‧‧‧ hole

34‧‧‧Intermediate hole

40‧‧‧Metal laminate with foil

50‧‧‧ space

51‧‧‧Processing platform

52‧‧‧Protective materials

53‧‧‧ spacer components

54‧‧‧ 接接部件

55‧‧‧Laser mask

110‧‧‧Fiber substrate

111‧‧‧Single fiber

111A‧‧‧Single fiber ends

112‧‧‧ resin layer

400‧‧‧Metal laminate

511‧‧‧Adsorption holes

531‧‧‧through hole

532, 542‧‧ ‧ openings

B, D‧‧‧ photoresist layer

C‧‧‧Foil layer

The above objects and other objects, features and advantages are preferably as described below. The embodiment and the following drawings shown below can be more clearly understood.

Fig. 1 is a cross-sectional view showing a laminated board according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of the essential part of the laminate.

3(A) and (B) are cross-sectional views of essential parts of a laminated board.

4(A) to (E) are cross-sectional views showing a manufacturing step of a laminated board.

5(A) to (C) are cross-sectional views showing a manufacturing step of the laminated board.

6(A) to (D) are cross-sectional views showing a manufacturing step of a laminate.

7(A) to (C) are cross-sectional views showing a manufacturing step of a laminated board.

Fig. 8 is a cross-sectional view showing a manufacturing step of the laminated board.

Figure 9 is a diagram of a manufacturing apparatus.

Fig. 10 (A) to (H) are diagrams showing the results of the examples.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

The outline of this embodiment will be described with reference to Figs. 1 to 9 .

The laminated board 1 of this embodiment is a printed wiring board.

As shown in FIGS. 1 to 3, the printed wiring board 1 includes an insulating layer 11 and a metal layer 12. The insulating layer 11 has a fiber base material 110 woven from a single fiber, and a resin layer 112 that is wetted in the fiber base material 110. The metal layer 12 is disposed on the insulating layer 11. A hole 113 is formed in the insulating layer 11, and an end portion 111A of the single fiber 111 constituting the fiber base material 110 is exposed on the inner wall of the hole 113, and the exposed end portion 111A of the single fiber 111 is melt-deformed to expand the diameter.

Next, the laminated board (printed wiring board) 1 of the present embodiment will be described in detail.

The printed wiring board 1 is provided with an inner layer circuit board 10 as shown in FIG. An interlayer insulating layer (stack layer) 20 placed on the front and back surfaces of the inner layer circuit board 10, and a metal layer 30 provided on the interlayer insulating layer 20.

The inner layer circuit board 10 includes the insulating layer (core layer) 11 and a metal layer 12 provided on the front and back surfaces of the insulating layer 11.

As shown in FIG. 2, the insulating layer 11 includes a fiber base material 110 and a resin layer 112 which is contained in the fiber base material 110. Further, here, the insulating layer 11 composed of a single layer of a prepreg is formed, but the insulating layer 11 may be formed by stacking a plurality of layers of the prepreg. The thickness of the insulating layer 11 is usually 10 μm or more and 600 μm or less.

The fibrous base material 110 is not particularly limited, and may be, for example, any synthetic fiber such as glass fiber, linaloamine, polyester, aromatic polyester, fluororesin, or a yarn of any single fiber bundle such as carbon fiber or mineral fiber. Weaving a woven fabric. Among them, a glass fiber woven fabric (glass fiber cloth) made of glass fiber is preferred from the viewpoint of low thermal expansion property, high rigidity, and excellent dimensional stability.

The glass constituting the glass fiber cloth may be, for example, E glass, C glass, A glass, S glass, D glass, NE glass, T glass, UT glass, L glass, H glass, quartz glass or the like. One type or more of these glass systems can be used. Among them, quartz glass is preferred. The end portion 111A exposed inside the hole 113 can be easily melt-deformed by using a glass fiber cloth of quartz glass. In addition to this, the coefficient of thermal expansion of the insulating layer 11 can be reduced.

Here, the "glass fiber cloth of quartz glass" means that SiO ₂ is contained in an amount of 99.9 wt% or more.

The fiber base material 110 is obtained by weaving a yarn (warp yarn and weft yarn) bundled by a plurality of individual fibers 111 composed of the above materials. For example, the fibrous base material 110 is formed by plain weaving of warp and weft.

The number of single fibers per one yarn is not particularly limited, but is preferably 20 or more. Again The number of implants of the yarn and the weft yarn is not particularly limited, and is preferably, for example, 40 or more warps of warp yarns and 30 or more and 25 mm of weft yarns. Further, the single fiber diameter (portion in the resin layer 112) is preferably 3 to 9 μm.

The resin layer 112 is thermosetting and contains a thermosetting resin. The thermosetting resin is not particularly limited, and for example, an epoxy resin, a melamine resin, a urea resin, a cyanate resin, a phenol resin, a bis-xenylene diimide compound, or a benzo can be used. Any one or more of the ring resins and the like. Among them, epoxy resin or cyanate resin is preferred.

The epoxy resin can be, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol E epoxy resin, bisphenol M epoxy resin, bisphenol P Bisphenol type epoxy resin such as epoxy resin, bisphenol Z type epoxy resin; phenolic epoxy resin such as phenolic novolac type epoxy resin and cresol novolac type epoxy resin; biphenyl type epoxy resin, An alkane-type epoxy resin such as a phenol aralkyl type epoxy resin having a benzene skeleton; a naphthol type epoxy resin, a naphthalene glycol type epoxy resin, a bifunctional to tetrafunctional epoxy type naphthalene resin, Naphthalene epoxy resin, naphthalene epoxy resin, naphthalene aryl epoxy resin, etc.; naphthalene epoxy resin, phenoxy epoxy resin, dicyclopentadiene epoxy Resin, ene oxide epoxy resin, adamantane epoxy resin, bismuth epoxy resin, containing three Epoxy resin such as epoxy resin of skeleton. One type of these may be used alone or two or more types may be used in combination. These prepolymers can also be used in combination.

The type of the cyanate resin is not particularly limited, and examples thereof include a novolac type cyanate resin, a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, and a tetramethylbisphenol F type cyanate. A bisphenol type cyanate resin such as a resin; a naphthalene type cyanate resin, a dicyclopentadiene type cyanate resin, a fluorene type cyanate resin, or the like. Among these, a phenol novolac type cyanate resin is preferred from the viewpoint of low thermal expansion property. Further, one type or two or more types of other cyanate resins may be used in combination. These prepolymers can also be used in combination.

The content of the thermosetting resin in the resin layer 112 is not particularly limited, but is preferably 20% by mass or more and 80% by mass or less based on the entire resin layer 112. More preferably, it is 30 mass% or more and 70 mass% or less. Moreover, in order to improve the wettability to the fiber base material 110, it is preferable to use a liquid epoxy resin such as a liquid bisphenol A type epoxy resin or a bisphenol F type epoxy resin. Further, when a solid bisphenol A type epoxy resin or a bisphenol F type epoxy resin is used in combination, the adhesion to the conductor can be improved.

Further, the resin layer 112 may also contain a filler. The filler may be any inorganic filler or organic filler.

The inorganic filler may be, for example, talc, calcined clay, uncalcined clay, mica, glass, etc.; oxides such as titanium oxide, aluminum oxide, bauxite, cerium oxide, molten cerium oxide; calcium carbonate, carbonic acid Carbonate such as magnesium or hydrotalcite; hydroxide such as aluminum hydroxide, magnesium hydroxide or calcium hydroxide; sulfate or sulfite such as barium sulfate, calcium sulfate or calcium sulfite; zinc borate, barium metaborate and aluminum borate Boric acid such as calcium borate or sodium borate; nitride such as aluminum nitride, boron nitride, tantalum nitride or carbon nitride; titanate such as barium titanate or barium titanate. One type of these may be used alone or two or more types may be used in combination.

Among these, from the viewpoint of excellent low thermal expansion property, cerium oxide and more preferably molten cerium oxide (particularly spherical sulphur dioxide) are preferred. The shape is a crushed shape or a spherical shape. In order to ensure the wettability to the fibrous base material and to lower the melt viscosity of the thermosetting resin composition, it is preferred to use spherical cerium oxide or the like, and it is possible to use a blending purpose. .

On the other hand, the organic filler may be, for example, a fluororesin, an arylamine resin fiber, a core-shell rubber particle, a crosslinked acrylonitrile butadiene rubber particle, a crosslinked styrene butadiene rubber particle, or an acrylic rubber particle. , polyoxygenated particles, and the like. One type of these may be used alone or two or more types may be used in combination.

The content of the filler in the resin layer 112 is 20% by mass or more and 80% by mass or less.

Further, the resin composition constituting the resin layer 112 preferably contains a coupling agent. The coupling agent enhances the wettability of the interface between the thermosetting resin and the filler, and uniformly fixes the thermosetting resin and the filler to the fibrous base material 110, thereby improving heat resistance, particularly after moisture absorption. Solder heat resistance.

As the coupling agent, any one which is usually used may be used, and particularly preferably an epoxy decane coupling agent, a cationic decane coupling agent, an amino decane coupling agent, a titanate coupling agent, and a polyoxygenated oil type coupling agent are used. One or more coupling agents are selected. Thereby, the wettability of the interface with the filler can be improved, and the heat resistance can be further improved.

A thermosetting resin composition can further use a phenolic hardener. The phenolic hardener may be, for example, a phenolic phenol resin, an alkylphenol phenol resin, a bisphenol A phenol resin, a dicyclopentadiene type phenol resin, a phenol aralkyl (XYLOK) type phenol resin, a terpene modified phenol. A known person such as a resin or a polyvinyl phenol may be used alone or in combination of two or more.

A thermosetting resin composition may also be used as a curing catalyst. A well-known thing can be used for a hardening catalyst system. For example: zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt (II) acetoacetate, cobalt (III) and other organic metal salts; triethylamine, tributylamine, dinitrogen a tertiary amine such as heterobicyclo[2,2,2]octane; 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, Imidazoles such as 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxyimidazole, 2-phenyl-4,5-dihydroxyimidazole; triphenylphosphine, tris(p-toluene) Phosphate, bisphenol A, nonylphenol An phenol compound; an organic acid such as acetic acid, benzoic acid, salicylic acid, p-toluenesulfonic acid, or the like, or a mixture thereof. The sclerosing catalyst may be used singly or in combination of the above-mentioned derivatives, or may be used in combination of two or more kinds thereof.

The content of the hardening catalyst is not particularly limited, and is preferably a resin layer. The composition of 112 is preferably 0.05% by mass or more, more preferably 0.2% by mass or more.

The resin layer 112 may also be used in combination, for example, a phenoxy resin, a polyimide resin, a polyamide amide resin, a polyamide resin, a polyphenylene ether resin, a polyether oxime resin, a polyester resin, a polyethylene resin, Thermoplastic resin such as polystyrene resin; polystyrene thermoplastic elastomer such as styrene-butadiene copolymer or styrene-isoprene copolymer; polyolefin-based thermoplastic elastomer, polyimide Thermoplastic elastomers such as elastomers and polyester elastomers; diene elasticity such as polybutadiene, epoxy modified polybutadiene, acrylic modified polybutadiene, methacrylic modified polybutadiene body. One type of these may be used alone or two or more types may be used in combination.

Among them, a heat-resistant polymer resin such as a phenoxy resin, a polyimide resin, a polyamide amide resin, a polyamide resin, a polyphenylene ether resin, or a polyether oxime resin is preferable. Thereby, the thickness of the prepreg can be made uniform, and when it is used as a wiring board, it is excellent in heat resistance and fine wiring insulation. In addition, the composition constituting the insulating layer may be added as needed, for example, a pigment, a dye, an antifoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, and ion trapping. Additives other than the above components such as a dose.

The resin composition constituting the resin layer 112 is formed into a varnish, and the insulating layer 11 can be obtained by being contained in the fiber base material 110. Further, the resin composition may be formed into a film shape and laminated on the fiber base material 110 by heating to be contained in the fiber base material 110.

The metal layer 12 is an inner layer circuit layer, and as shown in FIG. 1, is composed of a plurality of metal layers 121 to 123. The metal layers 121 to 123 are sequentially laminated.

The metal constituting the metal layer 12 is, for example, copper.

Here, a hole 113 is formed in the inner layer circuit board 10. The hole 113 penetrates the insulating layer 11 and the metal layer 121 provided on the insulating layer 11 as shown in FIGS. 1 and 3. Figure 3 The enlarged view of the periphery of the hole 113 of Fig. 1 is omitted, and the metal layers 122 and 123 are omitted. Further, the holes 113 are formed in plural numbers, and for example, the interval between the holes 113 is 100 μm or more and 500 μm or less. Further, the diameter of the hole 113 is, for example, 50 μm or more and 150 μm or less. In particular, from the viewpoint of melt-deforming the end portion 111A of the single fiber, it is preferably 80 μm or more and 120 μm or less.

The hole 113 has a shape (push-out shape) which is inclined to the inner surface of the inner layer circuit board 10 in the thickness direction. For example, the diameter of one opening of the hole 113 can be made smaller than the other opening so that the diameter is opened from one of the openings. The shape may be continuously reduced in diameter toward the other opening, or may be reduced in diameter from one of the opening sides toward the other opening side, and then expanded in diameter toward the other opening side. In this case, the maximum and minimum opening diameters are preferably within the diameter of the above-mentioned hole 113.

The end portion 111A of the plurality of individual fibers 111 of the fibrous base material 110 is exposed on the inner wall of the hole 113. The diameter of each end portion 111A is larger than the portion where the single fiber 111 is buried in the resin layer 112, and has an expanded diameter. More specifically, the end portion 111A is a portion of the single fiber 111 which is melt-deformed and then resolidified. The end portion 111A extends along the inner wall of the hole 113 and is enlarged to have a flat shape. The end portion 111A is in direct contact with the inner wall of the hole 113 to form, for example, a slightly rounded shape.

Accordingly, the end portion 111A is melt-deformed and expanded in diameter, that is, the collapsed shape is formed by the end portion 111A, and the void can be collapsed even if a void occurs in the end portion 111A. Therefore, even if the metal layers 122 and 123 are formed inside the holes 113, it is possible to suppress metal ions from entering the inside of the insulating layer 11 through the voids. Thereby, the insulation reliability between the holes 113 can be improved.

That is, there is no void at the end portion 111A. In other words, even if a void (void) exists inside the single fiber 111, a void communicating with the cavity is not formed in the end portion 111A.

Further, although it has been described in the [Prior Art], it is conventionally considered to improve the insulation reliability, and it is considered to reduce the number of voids in the single fibers constituting the fiber substrate. Therefore, it is necessary to use special The manufacturing method produces a fibrous substrate.

On the other hand, in the present embodiment, the end portion 111A of the single fiber 111 exposed in the hole 113 can be melt-deformed, so that the insulation reliability can be improved without using a fiber substrate manufactured by a special manufacturing method. Thereby, the cost of the printed wiring board can be reduced.

Further, since the diameter of the end portion 111A is larger than the portion in which the single fiber 111 is buried in the resin layer 112, the metal ions are less likely to enter the boundary portion between the portion where the single fiber 111 is buried in the resin layer 112 and the resin layer 112. Thereby, the insulation reliability (CAF (Conductive Anodic Filament)] between the holes 113 can be improved.

In addition, as shown in FIG. 3(A), the end portions 111A of the adjacent single fibers 111 may not be in contact with each other, or may be as shown in FIG. 3(B), and the end portions 111A of the adjacent single fibers 111 are adjacent. They are welded to each other and connected. As shown in FIG. 3(B), by welding the end portions 111A of the adjacent single fibers 111 to each other, it is possible to more surely prevent metal ions from entering between the portion of the single fiber 111 buried in the resin layer 112 and the resin layer 112. The boundary part. From this point of view, it is particularly preferable that all of the end portions 111A of the single fibers exposed inside the holes 113 are welded to each other.

Further, the strength of the fiber base material 110 can be improved by fusing the end portions 111A of the adjacent single fibers 111 to each other.

3(B) is a state in which the end portions 111A of the adjacent single fibers 111 are welded to each other along the through-direction of the holes 113, and more preferably, the single fibers 111 are adjacent to each other in the orthogonal direction of the through-hole direction of the holes 113. The end portions 111A are also welded to each other. This embodiment is adopted in the embodiment described later.

Further, the protruding portion size S1 of the end portion 111A from the inner wall of the hole 113 (the thickness in the direction orthogonal to the lamination direction of the laminated plate 1) is, for example, 2 to 5 μm.

Further, as shown in FIG. 1, the metal layers 122, 123 are provided so as to cover the inner wall of the hole 113. The metal layers 122, 123 cover the inner wall of the hole 113 and are also covered The end portion 111A of the single fiber 111 exposed on the inner wall of the hole 113 is formed. In the present embodiment, the metal layers 122 and 123 are covered with the entire end portion 111A of the single fiber 111 exposed on the inner wall of the hole 113. The metal layers 122 and 123 are provided on the inner wall of the hole 113, and the metal layers 121 to 123 which are provided on the surface of the insulating layer 11 and constitute a circuit layer, and the metal layer 121 which is provided on the back surface of the insulating layer 11 and constitute a circuit layer. 123 forms a conduction.

As described above, the interlayer insulating layer 20 is provided on the front and back surfaces of the inner layer circuit board 10. This interlayer insulating layer 20 is composed of the same resin composition as the resin layer 112 of the inner layer circuit board 10. However, in the present embodiment, the interlayer insulating layer 20 does not contain a fibrous base material, and is composed only of a resin layer.

The interlayer insulating layer 20 is coated with the metal layer 12 of the inner layer circuit board 10.

The metal layer 30 is a circuit layer provided on the outer layer of the interlayer insulating layer 20. The metal layer 30 is laminated, for example, by the metal layers 31 to 33. The metal constituting the metal layer 30 is, for example, copper.

A hole 21 is formed in the interlayer insulating layer 20. A metal layer 123 is exposed on the bottom surface of the hole 21. An electric conductor (via 34) integrated with the metal layer 33 is buried in the inside of the hole 21. The via hole 34 is in contact with the metal layer 123 to form a conduction between the metal layer 12 and the metal layer 30.

Next, a method of manufacturing such a printed wiring board 1 will be described.

First, an outline of a method of manufacturing the printed wiring board 1 will be described.

The method of manufacturing the printed wiring board 1 of the present embodiment includes the step of forming the holes 113 in the insulating layer 11. The above-described step of forming the hole 113 is such that the hole 113 is formed by laser, and the end portion of the single fiber 111 of the fibrous base material 110 exposed inside the hole 113 is melt-deformed, and the single fiber exposed on the inner wall of the hole 113 is formed. The end of 111 is expanded.

Next, a method of manufacturing the printed wiring board 1 will be described in detail with reference to FIGS. 4 to 7. Bright.

First, as shown in FIG. 4(A), a metal laminate 40 having a carrier foil is prepared. The metal laminated plate 40 with a foil has an insulating layer 11, a metal layer 121 provided on the front and back surfaces of the insulating layer 11, and a carrier foil A covered with the metal layer 121. Here, the metal layer 121 is, for example, a copper foil, for example, a thickness of 1 μm to 5 μm.

Next, as shown in FIG. 4(B), the carrier foil A is peeled off from the metal layer 121 to form a metal laminate 400.

Then, as shown in FIG. 4(C), a metal layer 121 and a hole 113 penetrating the insulating layer 11 are formed. At this time, the hole 113 is formed by a laser such as a gaseous laser such as a carbon dioxide gas or an excimer or a solid-state laser such as YAG. In particular, from the viewpoint of melt-deforming the end portion of the single fiber 111, a carbon dioxide gas laser is preferably used.

The apparatus 5 for forming the hole 113 can use the apparatus 5 shown in FIG. The apparatus 5 is provided with a processing platform 51 that holds the metal laminate 400, a protective material 52 that protects the processing platform 51 from laser irradiation, and a space for forming a space 50 between the processing platform 51 and the metal laminate 400. The spacer member 53 and the urging member 54 that is attached to the spacer member 53 and fixed to the metal laminate 400 are provided.

The processing platform 51 is formed flat on the upper surface thereof. A plurality of adsorption holes 511 penetrating the front and back of the processing platform 51 are formed on the processing platform 51. The lower end portions of the adsorption holes 511 are connected to a suction source (for example, a vacuum pump) (not shown). By applying suction by the suction source, the protective material 52, the spacer member 53, the metal laminate 400, and the urging member 54 can be adsorbed and held on the processing stage 51 via the adsorption holes 511.

The spacer member 53 is a flat member having a certain thickness. The opening portion 532 is formed to penetrate the front and back of the spacer member 53.

Therefore, as shown in FIG. 9, the metal laminate board 400 is protected by the spacer member 53. Holding on the processing platform 51, a space facing the back surface of the metal laminate 400 can be formed between the processing platform 51 and the metal laminate 400.

In the state in which the space is formed, the metal laminated plate 400 is irradiated with a laser to form a through hole, so that the heat generated by the laser irradiation can be easily dissipated through the space, and the metal laminated plate 400 can be suppressed. damage. Thereby, excessive heat energy can be prevented from being applied to the end portion of the single fiber exposed inside the hole 113, and the end portion of the single fiber can be prevented from being blown. That is, the end portion of the single fiber can be melt-deformed.

In addition to the opening 532, the spacer member 53 has a through hole 531 for absorbing the metal laminate 400 or the urging member 54 through the spacer member 53, and the through hole 531 is formed to penetrate the space. The front and back of the object member 53.

The material of the protective material 52 can be used as long as it can protect the processing platform 51 from laser irradiation, and is preferably made of a metal such as copper from the viewpoint of durability and the like. The thickness of the protective material 52 can be, for example, 5 μm or more and 35 μm or less.

The upper surface of the protective material 52 is preferably roughened. By forming a roughened surface thereon, the laser light can be scattered by the above (the reflectance of the laser light can be reduced). Therefore, it is possible to suppress damage to the back side of the metal laminate 400 due to the reflected light from the above.

The urging member 54 is a flat member, and the opening 542 is passed through the front and back of the urging member 54. Further, the manufacturing apparatus 5 has a laser mask 55. In the laser mask 55, a laser passage hole (not shown) corresponding to the hole 113 is formed. Therefore, the laser light irradiated from the laser light source (not shown) is irradiated onto the metal laminate 400 through the laser penetration hole of the laser mask 55 and the opening 542 of the urging member 54. Hole 113.

Using the device 5, a hole penetrating the metal layer 121 is formed by a carbon dioxide gas laser. In this case, for example, the pulse width is 3 μs to 15 μs, the energy is 5 mJ or more and 20 mJ or less, and the number of shots is 1 or more and 3 or less. Then, using a carbon dioxide gas laser to form a connection The hole of the metal layer 121 penetrates the hole of the insulating layer 11. For example, the pulse width is 3 μs to 100 μs, the energy is 3 mJ or more and 10 mJ or less, and the number of hair is 1 or more and 15 or less.

Accordingly, by appropriately setting the pulse width, energy, and number of shots of the laser, and appropriately setting the aperture and the thickness of the insulating layer, and more appropriately selecting the material of the fibrous base material, the exposed end portion 111A inside the hole 113 can be melt-deformed. And expand the diameter.

Further, in the conventional printed wiring board, the end portion of the single fiber exposed inside the hole formed in the insulating layer is not melt-deformed or expanded. Since it has not been conceived to melt-deform and expand the ends of the single fibers, the use of lasers to form the holes causes the single fibers to burn out. Therefore, the end portion of the single fiber has the same diameter as the single fiber portion in the resin layer.

Then, a catalyst core is applied to the metal layer 121. In the present embodiment, the catalyst core is provided on the entire surface of the metal layer 121 and on the inner wall surface of the hole 113. The catalyst core is not particularly limited, and for example, a noble metal ion or a palladium colloid can be used. Then, an electroless plating layer is formed by using the catalyst core as a core. However, before the electroless plating treatment, for example, a slag removal by a chemical solution may be performed on the surface of the metal layer 121 or the hole 113. Glue treatment. The desmear treatment is not particularly limited, and for example, a wet method using an oxidizing agent solution having an organic decomposition action, and a strong active species (plasma, radical, etc.) having direct oxidation effect on the object can be used. A known method such as a dry method such as a plasma method for removing an organic residue. The desmear treatment of the wet method can be carried out, for example, by performing a swelling treatment on the surface of the resin, followed by etching by alkali treatment, followed by a neutralization treatment or the like.

Next, as shown in FIG. 4(D), a metal layer 122 belonging to a thin electroless plating layer is formed on the inner wall of the metal layer 121 and the hole 113 to which the catalyst core is applied by electroless plating. The metal layer 122 is a metal layer 121 on the surface side of the insulating layer 11, and The metal layer 121 on the back side of the edge layer 11 is electrically coupled. As the electroless plating, for example, copper sulfate, formaldehyde, a neutralizing agent, sodium hydroxide or the like can be used. Further, after electroless plating, it is preferred to carry out heat treatment at 100 to 250 ° C to stabilize the plating film. From the viewpoint of forming a film capable of suppressing oxidation, heat treatment at 120 to 180 ° C is preferred. Further, the average thickness of the electroless plated layer is sufficient as long as the thickness of the plating described below can be performed, and for example, about 0.1 to 1 μm is sufficient. Further, the inside of the hole 113 may be filled with a conductive paste or an insulating paste, or may be filled with a circuit pattern.

Next, as shown in FIG. 4(E), a photoresist layer B having a predetermined opening pattern is formed on the metal layer 122. The opening pattern corresponds to a circuit layer pattern of the inner layer circuit board. Therefore, the photoresist layer B is designed to cover the state of the non-circuit forming region on the metal layer 122. The photoresist layer B is not particularly limited, and a known material can be used. When the photoresist layer B is formed, for example, a photosensitive dry film is laminated on the metal layer 122, and the non-circuit formation region is exposed to light to be cured, and the unexposed portion is dissolved and removed by the developer. Further, the remaining hardened photosensitive dry film becomes the photoresist layer B. The thickness of the photoresist layer B is preferably set to be equal to or thicker than the thickness of the subsequently plated conductor (metal layer 123).

Next, as shown in FIG. 5(A), the metal layer 123 is formed by plating treatment at least inside the opening pattern of the photoresist layer B. In the present embodiment, the metal layer 123 may be continuously designed along the upper surface of the insulating layer 11, the inner wall of the hole 113, and the lower surface thereof. The plating is not particularly limited, and a known method for a conventional printed wiring board can be used. For example, a method in which a current flows in the plating solution in a state of being immersed in a plating solution such as copper sulfate can be used. The thickness of the metal layer 123 is not particularly limited as long as it can be used as a circuit conductor. For example, it is preferably in the range of 1 to 100 μm, more preferably in the range of 5 to 50 μm. The metal layer 123 may be a single layer or a multilayer structure. The material of the metal layer 123 is not particularly limited, and for example, copper, a copper alloy, a 42 alloy, nickel, iron, chromium, tungsten, gold, or solder can be used.

Next, as shown in FIG. 5(B), the photoresist layer B is removed using an alkaline stripper, sulfuric acid, or a commercially available photoresist stripper.

Next, as shown in FIG. 5(C), the metal layers 121 and 122 other than the region formed by the metal layer 123 are removed. The method of removing the metal layers 121 and 122 is, for example, soft etching (rapid etching) or the like. Thereby, a pattern of a conductive circuit composed of a metal layer 121 to 123 laminated can be formed. The inner layer circuit board 10 can be obtained as described above.

Next, the metal layer 123 of the inner layer circuit board 10 is subjected to a roughening process. Here, "roughening treatment" means applying a chemical liquid treatment and a plasma treatment to the surface of a conductor circuit. As the roughening treatment, for example, a blackening treatment by redox or a chemical liquid treatment using a known sulfuric acid-hydrogen peroxide-based roughening liquid can be used. Thereby, the adhesion between the metal layer 123 and the interlayer insulating layer 20 can be improved.

Then, as shown in FIG. 6(A), an interlayer insulating layer 20 and a metal layer 31 having a carrier foil layer C (very thin copper foil with a carrier foil) are disposed on the front side and the back side of the inner layer circuit board 10, respectively. . Next, as shown in FIG. 6(B), a multilayer laminated plate is formed by subjecting the stacked laminates to heat and pressure treatment. Next, as shown in FIG. 6(C), the carrier foil layer C is peeled off.

Next, as shown in FIG. 6(D), a part of the interlayer insulating layer 20 and the metal layer 31 is removed to form the holes 21. A part of the surface of the metal layer 123 is exposed on the bottom surface of the hole 21. The method of forming the hole 21 is not particularly limited, and for example, a solid-state laser such as a carbon dioxide gas or an excimer or a solid-state laser such as YAG can be used, and a blind via hole having a pore diameter of 100 μm or less can be formed.

Next, as shown in FIG. 7(A), a thin electroless plating layer (metal layer 32) is formed on the metal layer 31 to which the catalyst core is applied, on the inner wall of the hole 21, and on the metal layer 123. The electroless plating layer is formed in the same manner as the electroless plating layer described above. Moreover, the catalyst core is also the same as described above. Before the electroless plating, as described above, it is also possible to carry out the use of the chemical solution. The slag is removed and the slag is treated. Further, the thickness of the metal layer 32 is sufficient as long as the thickness of the plating described below can be performed, and it is sufficient to be about 0.1 to 1 μm. Moreover, the inside of the hole 21 (blind via hole) may be filled with a conductive paste or an insulating paste, or may be filled in a circuit pattern plating.

Next, as shown in FIG. 7(B), a photoresist layer D having an opening pattern corresponding to the conductor circuit pattern is formed on the metal layer 32. The photoresist layer D can be used in the same manner as the photoresist layer B described above. The thickness of the photoresist layer D is preferably set to be equal to or thicker than the thickness of the subsequently plated metal layer 33.

Next, as shown in FIG. 7(C), a metal layer 33 belonging to a plating layer is formed inside the opening pattern of the photoresist layer D. Here, the metal layer 33 and the via hole 34 are integrally formed by plating. The metal layer 33 is formed by electroplating, and the same method as the metal layer 123 described above can be used. The thickness of the metal layer 33 is preferably a circuit conductor, and is preferably in the range of, for example, 1 to 100 μm, more preferably 5 to 50 μm.

Next, as shown in FIG. 8, peeling of the photoresist layer D is performed similarly to the above-mentioned photoresist layer B. Next, similar to the metal layers 121 and 122, the metal layers 31 and 32 are removed by soft etching (rapid etching). Thereby, a conductive circuit pattern can be formed. According to the above, the printed wiring board 1 can be obtained.

Further, the present invention is not limited to the above-described embodiments, and variations, improvements, and the like within the scope of the object of the present invention are encompassed by the present invention.

For example, in the above embodiment, the single fiber end portion 111A exposed in the hole 113 of the inner layer circuit board 10 is melt-deformed and expanded, but this is not limited thereto. For example, the interlayer insulating layer 20 may be formed of a resin layer and a fiber substrate similar to those of the inner layer circuit board 10, and the end portions of the single fibers exposed in the inner wall of the hole 21 of the interlayer insulating layer 20 may be melt-deformed. It becomes a single fiber diameter larger in diameter than in the resin layer. Accordingly, the insulation reliability between the holes 21 can be improved.

For example, the pulse width is set to be 3 μs to 15 μs, and the energy is 5 mJ or more and 20 mJ or less. Number: 1 or more and 3 or less. Then, a hole penetrating the insulating layer and the fibrous base material is formed by using a carbon dioxide gas laser. For example, the pulse width is set to 3 μs to 100 μs, the energy is 3 mJ or more and 10 mJ or less, and the number of shots is 1 or more and 15 or less.

Accordingly, by appropriately setting the pulse width, energy, and number of shots of the laser, and appropriately setting the aperture and the thickness of the insulating layer, and more appropriately selecting the material of the fiber base material, the exposed end portion of the hole can be melted and expanded. path.

Furthermore, in this case, the printed wiring board may not have the inner layer circuit board 10, but may be provided with an interlayer insulating layer provided with a fibrous base material and a resin layer moistened in the fibrous base material, and on the interlayer insulating layer. The metal layer is formed by alternating layers.

Further, in the above embodiment, the laminated board of the present invention is a printed wiring board, but it is not limited thereto, and may be, for example, an inner layer circuit board.

Further, in the above embodiment, when the hole 113 is formed, the metal layer is directly irradiated with a laser to form the hole 113 (direct processing), but the method of manufacturing the hole 113 is not limited thereto. The metal layer at the position where the hole 113 is to be formed may be removed by etching or the like in advance, and then the hole 113 may be formed by a conformal treatment of irradiating the insulating layer with a laser.

(Example)

Next, an embodiment of the present invention will be described.

(Example 1)

8.5 parts by weight of an epoxy resin naphthalene modified cresol novolac epoxy resin (manufactured by DIC Corporation, HP-5000), and a biphenyl aralkyl type phenol resin (Minghe Chemical Co., Ltd., MEH7851-4H) 8.5 of a phenol curing agent. 17 parts by weight of phenolic novolac type cyanate resin (Primaset PT-30, manufactured by LONZA Co., Ltd.), spherical molten cerium oxide (SO-25R, manufactured by Admatech Co., Ltd., average particle diameter: 0.5 μm), 65.5 parts by weight, Further, 0.5 part by weight of epoxy decane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) was mixed and dissolved in methyl ethyl ketone. Then, use high speed A resin varnish was prepared by stirring the stirring device and adjusting it to a non-volatile content of 70% by weight.

The resin varnish was moistened with a glass woven fabric (base weight: 77 g/m ² , thickness: 77 μm, quartz glass woven fabric manufactured by Shin-Etsu Co., Ltd., trade name: SQF2116C), and dried by a heating furnace at 150 ° C for 2 minutes. The varnish in the prepreg has a solid content of about 50% by weight of the prepreg.

Two sheets of the above prepreg were superposed, and the ultra-thin copper foil (metal layer 121) having the carrier foil A was superposed, and subjected to heat and pressure molding at a pressure of 3 MPa and a temperature of 220 ° C for 2 hours to obtain an insulating layer 11 having a thickness of 0.20 mm. A metal laminate 400 having a copper foil (metal layer 121) on both sides (Fig. 4(A)).

(printed wiring board)

The carrier foil A of the metal laminate 400 is peeled off (see FIG. 4(B)), and as shown in FIG. 4(C), a through-hole of 75 μm in diameter is opened from the top of the metal layer 121 by a carbon dioxide gas laser. Hole 113). The apparatus uses the apparatus 5 shown in FIG. The spacing between the holes 113 is a 300 μm pitch. The irradiation conditions of the carbon dioxide gas laser are as follows.

First, a hole 113 penetrating the metal layer 121 and the insulating layer 11 is formed by a carbon dioxide gas laser. The irradiation conditions of the carbon dioxide gas laser were pulse width: 10 μs, energy: 8 mJ, and number of hairs: 4 rounds.

As shown in Fig. 10(A), the inside of the hole 113 thus formed was observed by SEM. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded and connected to each other. Also, it was confirmed that there was no void at the end.

Then, it was immersed in an aqueous solution of potassium permanganate 60 g/L and sodium hydroxide 45 g/L for 2 minutes at a liquid temperature of 80 ° C to carry out desmear treatment.

Then, it was immersed in a palladium solution (manufactured by Uemura Kogyo Co., Ltd., MAT-2B/MAT-2A) at a liquid temperature of 55 ° C for 5 minutes, and a catalyst was used, and THRU-CUP PEA-6A manufactured by Uemura Industrial Co., Ltd. was used, depending on the liquid temperature. After immersion at 36 ° C for 15 minutes, an electroless plating layer (metal layer 122) of 0.7 μm was formed (Fig. 4(D)).

On the surface of the electroless plating layer, a UV-sensitive dry film (SUNFORT UFG-255, manufactured by Asahi Kasei Corporation) having a thickness of 25 μm was bonded to the surface of the electroless plating layer, and the minimum line width/line 20/20 μm was drawn. A patterned glass mask (manufactured by Topic Co., Ltd.) was subjected to alignment, and exposure was performed by an exposure apparatus (Ono EV-0800), and development was carried out using an aqueous solution of sodium carbonate to form a photoresist mask (photoresist layer B). Figure 4 (E)). Next, an electroless plating layer was used as a power supply layer electrode, and electrolytic copper plating (81-HL manufactured by Okuno Pharmaceutical Co., Ltd.) was carried out for 3 minutes at 3 A/dm ² to form a copper wiring pattern (metal layer 123) having a thickness of about 20 μm. 5(A)). Next, the photoresist mask (photoresist layer B) was peeled off using a stripper and a monoethanolamine solution (R-100, manufactured by Mitsubishi Gas Chemical Co., Ltd.) (Fig. 5(B)). Then, the electroless plating layer (metal layer 122) belonging to the power supply layer and the underlying copper foil (metal layer 121) (2 μm) were subjected to rapid etching (CPE-800, manufactured by Mitsubishi Gas Chemical Co., Ltd., liquid temperature: 30 ° C, spray) The pressure of 0.23 MPa) was removed by a 180-second treatment to form a pattern of L/S = 20/20 μm (pattern etching), and the inner layer circuit board 10 was obtained (Fig. 5 (C)).

Then, similarly to the above-described embodiment, the interlayer insulating layer 20 and the metal layer 31 (the extremely thin metal foil with the carrier foil) having the carrier foil C are disposed on the front side and the back side of the inner layer circuit board 10, respectively, and are implemented. Pressurized heat treatment. The thickness of the interlayer insulating layer 20 is 45 μm, and the thickness of the metal layer 31 is 3 μm.

Further, in the peeling carrier foil C similar to the above-described embodiment, the hole 21 is formed by the carbon dioxide gas laser (Fig. 6(D)). The diameter of the hole 21 is 80 μm. Then, it was immersed in an aqueous solution of potassium permanganate 60 g/L and sodium hydroxide 45 g/L at a liquid temperature of 80 ° C for 2 minutes to carry out degumming. deal with.

Then, it was immersed in a palladium solution (manufactured by Uemura Kogyo Co., Ltd., MAT-2B/MAT-2A) at a liquid temperature of 55 ° C for 5 minutes, and a catalyst was used, and THRU-CUP PEA-6A was used. After immersion at a temperature of 36 ° C for 15 minutes, an electroless plating layer (metal layer 32) of 0.5 μm was formed (Fig. 7(A)).

On the surface of the electroless plating layer, a UV-sensitive dry film (SUNFORT UFG-255, manufactured by Asahi Kasei Corporation) having a thickness of 25 μm was bonded to the surface of the electroless plating layer, and the minimum line width/line 20/20 μm was drawn. A patterned glass mask (manufactured by Topic Co., Ltd.) was subjected to alignment, and exposure was performed by an exposure apparatus (Ono Tester EV-0800), and development was performed using an aqueous solution of sodium carbonate to form a photoresist mask (photoresist layer D) ( Figure 7 (B)). Next, an electroless plating layer was used as a power supply layer electrode, and electrolytic copper plating (81-HL manufactured by Okuno Pharmaceutical Co., Ltd.) was carried out for 3 minutes at 3 A/dm ² to form a copper wiring pattern (metal layer 33) having a thickness of about 20 μm (Fig. 7(C)). Next, the photoresist mask (photoresist layer D) was peeled off using a stripper and a monoethanolamine solution (R-100, manufactured by Mitsubishi Gas Chemical Co., Ltd.) (Fig. 8). Then, the electroless plating layer (metal layer 32) and the underlying copper foil (metal layer 31) (2 μm) belonging to the power supply layer were subjected to rapid etching (CPE-800, manufactured by Mitsubishi Gas Chemical Co., Ltd., liquid temperature: 30 ° C, spray) The pressure was 0.23 MPa) and the removal was performed for 180 seconds to form a pattern of L/S = 20/20 μm (pattern etching) (Fig. 1).

(Example 2)

When the hole 113 is formed in the metal laminate 400, the irradiation conditions of the carbon dioxide gas laser are as follows. Other matters are the same as in the first embodiment.

Irradiation conditions: pulse width: 10μs, energy: 8mJ, hair number: 6 rounds

Fig. 10(B) shows the inside of the hole 113 thus formed by SEM observation. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded to each other and connection. Also, it was confirmed that there was no void at the end.

(Example 3)

When the hole 113 is formed in the metal laminate 400, the irradiation conditions of the carbon dioxide gas laser are as follows. Other matters are the same as in the first embodiment.

Irradiation conditions: pulse width: 10μs, energy: 10mJ, hair number: 2 rounds

Fig. 10(C) shows the inside of the hole 113 thus formed by SEM observation. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded and connected to each other. Also, it was confirmed that there was no void at the end.

(Example 4)

When the hole 113 is formed in the metal laminate 400, the irradiation conditions of the carbon dioxide gas laser are as follows. Other matters are the same as in the first embodiment.

Irradiation conditions: pulse width: 10μs, energy: 10mJ, hair number: 4 rounds

Fig. 10(D) shows the inside of the hole 113 thus formed by SEM observation. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded and connected to each other. Also, it was confirmed that there was no void at the end.

(Example 5)

When the hole 113 is formed in the metal laminate 400, the irradiation conditions of the carbon dioxide gas laser are as follows. Other matters are the same as in the first embodiment.

Irradiation conditions: pulse width: 10μs, energy: 10mJ, hair number: 6 rounds

Fig. 10(E) shows the inside of the hole 113 thus formed by SEM observation. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded to each other and connection. Also, it was confirmed that there was no void at the end.

(Example 6)

When the hole 113 is formed in the metal laminate 400, the irradiation conditions of the carbon dioxide gas laser are as follows. Other matters are the same as in the first embodiment.

In this embodiment, the laser system performs laser irradiation twice from the first trigger and the second trigger.

First triggering conditions: pulse width: 10μs, energy: 10mJ, number of hair: 6 rounds

The second triggering irradiation condition: pulse width: 97 μs, energy: 10 mJ, number of hairs: 2 rounds

Fig. 10(F) shows the inside of the hole 113 thus formed by SEM observation. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded and connected to each other. Also, it was confirmed that there was no void at the end.

(Example 7)

When the hole 113 is formed in the metal laminate 400, the irradiation conditions of the carbon dioxide gas laser are as follows. Other matters are the same as in the first embodiment.

In this embodiment, the laser system performs laser irradiation twice from the first trigger and the second trigger.

First triggering conditions: pulse width 10μs, energy: 10mJ, hair number: 2 rounds

The second triggering irradiation condition: pulse width 97μs, energy: 10mJ, hair number: 4 rounds

Fig. 10(G) shows the inside of the hole 113 thus formed by SEM observation. It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded and connected to each other. Also, it was confirmed that there was no void at the end.

(Example 8)

The glass woven fabric in the metal laminate 400 was set to have a basis weight of 104 g/m ² and a thickness of 92 μm, and a T-glass woven fabric manufactured by Nitto Denko Co., Ltd. (composition SiO ₂ : 62 to 65 wt %, Al ₂ O ₃ : 20) ~25wt%, MgO: 10~15wt%, trade name: WTX-116E). Other matters are the same as in the first embodiment.

The inside of the hole 113 thus formed is observed by SEM as shown in Fig. 10(H). It is known that the ends of the single fibers are melt-deformed and expanded in diameter. Here, it is known that the adjacent end portions are welded and connected to each other. Also, it was confirmed that there was no void at the end.

(Comparative Example 1)

When a hole is formed in the metal laminate 400, the device uses a separator member 53 and a protective member 52. The metal laminate 400 is placed on the processing platform 51 such that the lower surface of the metal laminate 400 is in full contact with the processing platform 51. Further, the irradiation conditions of the carbonic acid laser were pulse width: 10 μs, energy: 3 mJ, and number of hairs: three.

Other matters are the same as in the eighth embodiment.

As a result of observing the inside of the pores, the ends of the single fibers were blown and there was no melt deformation. The end diameter of the single fiber is the same as the other parts. Further, it was found that there was a cavity at the end of the single fiber.

(Evaluation)

The insulation reliability evaluation of the printed wiring boards obtained in Examples 1 to 8 and Comparative Example 1 was carried out.

The evaluation method is as follows.

Using a pattern of 100 μm between walls, 10 V was applied in an environment of 130 ° C / 85%, and a sample after 200 hours was taken out from the test tank, and the resistance value under normal temperature and normal humidity was measured.

Examples 1 to 8 have high resistance values and high insulation reliability. In contrast, Comparative Example 1 phase Below the examples 1 to 8, the resistance value is low and the insulation reliability is low.

The present application claims priority on the basis of Japanese Patent Application No. 2012-189452, filed on Aug. 30, 2012, the entire disclosure of which is incorporated herein by reference.

10‧‧‧ Inner board

11‧‧‧Insulation

110‧‧‧Fiber substrate

111‧‧‧Single fiber

111A‧‧‧Single fiber ends

112‧‧‧ resin layer

113‧‧‧ hole

121‧‧‧metal layer

Claims (14)

A laminated board comprising: an insulating layer comprising: a fibrous base material woven from a yarn bundled by a plurality of bundled single fibers; and a resin layer contained in the fibrous base material; and a metal layer Provided on the insulating layer; wherein a hole is formed in the insulating layer; an end portion of the single fiber constituting the fiber base material is exposed on an inner wall of the hole; and the exposed end portion of the single fiber is melt-deformed and expanded . The laminate according to claim 1, wherein an end portion of the plurality of single fibers is exposed on an inner wall of the hole, and adjacent end portions of the single fibers are welded to each other. The laminate according to the first aspect of the invention, wherein the end portion of the single fiber exposed on the inner wall of the hole forms a hole communicating with a void existing in the inside of the single fiber. The laminated board of claim 1, wherein the fibrous base material is a glass fiber cloth. The laminated board of claim 4, wherein the glass fiber cloth is made of quartz glass. The laminate according to claim 1, wherein a conductive film covering the end portion of the single fiber is formed inside the hole; and the laminated plate is a printed wiring board. The laminated board according to claim 6, wherein the insulating layer is a core layer; the hole penetrates the through hole of the insulating layer and the metal layer; and the stacked layer is provided on the front and back surfaces of the core layer. A method for producing a laminated board is a method for manufacturing a laminated board having the following layers: An insulating layer comprising: a fibrous base material woven from a bundle of a plurality of bundled single fibers; and a resin layer contained in the fibrous base material; and a metal layer disposed on the insulating layer; The method includes the steps of forming a hole in the insulating layer; the step of forming the hole is to form the hole by using a laser, and melt-deforming a single fiber end portion of the fiber substrate exposed inside the hole, and The end of the single fiber exposed at the inner wall of the hole is expanded. The method for producing a laminate according to the eighth aspect of the invention, wherein the end portion of the plurality of single fibers is exposed on an inner wall of the hole, and the adjacent end portions of the single fibers are welded to each other. The method for producing a laminate according to the eighth aspect of the invention, wherein the end portion of the single fiber exposed on the inner wall of the hole forms a hole communicating with a void existing in the inside of the single fiber. The method for producing a laminate according to the eighth aspect of the invention, wherein the fiber substrate is a glass fiber cloth. The method for producing a laminate according to the eleventh aspect of the invention, wherein the glass fiber cloth is made of quartz glass. The method for producing a laminate according to the eighth aspect of the invention, wherein a conductive film covering the end portion of the single fiber is formed inside the hole; and the laminated plate is a printed wiring board. The method for manufacturing a laminated board according to claim 13, wherein the insulating layer is a core layer; and the hole penetrates the through hole of the insulating layer and the metal layer; A stacked layer is provided on the front and back of the core layer.