JPH0846321A - Perforation processing of printed board and method of mounting component - Google Patents

Abstract

PURPOSE:To bore a hole, to which the leads of a component are connected, simply in a printed board. CONSTITUTION:In a method of perforating a printed board 1A formed by laminating a conductor foil 4 on the surface of a plate 3 consisting of an insulating material, a blind hole 8 is formed in the back of a perforating position on the foil 4 by removing the insulating material and perforating and burring processing of the foil 8 are performed by pressing the foil 4 from the side of the surface of the foil 4 to the side of the hole 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of drilling a printed circuit board for forming a hole for soldering a lead of an electronic component and a method of mounting a component in the hole.

[0002]

2. Description of the Related Art As shown in FIG. 7, a printed circuit board 1 generally has a sectional structure of a copper foil (conductor foil) 2, an insulating plate (a plate made of an insulating material) 3, and a copper foil 4. When forming the hole 8A for soldering the lead of the electronic component to the printed circuit board 1, by forming the blind hole 8 in the copper foil 2 and the insulating plate 3 and then plating the blind hole 8 with a conductor film. A hole 8A is formed which is electrically connected to the front and back copper foils 2 and 4 and whose inner surface is covered with a conductor.

As a method of forming such a hole 8A,
A processing method described in JP-A-4-37494 is known. As shown in order in FIG. 6, this processing method is performed by drilling a window hole 8a in the copper foil 2 on the front surface side and then irradiating the insulating plate 3 with laser light through the window hole 8a to form the blind hole 8a. Then, the blind holes 8 are plated as shown in FIG. 7 to form the holes 8A.

By the way, as a material of the insulating plate 3, glass epoxy resin is generally often used. As shown in FIG. 6, about 40 to 60 glass fibers 6 having a diameter of several microns are bundled, the bundles are assembled in a mesh shape, and the epoxy resin 5 is filled in the gap and condensed to form the glass fiber. is there. When the blind hole 8 is opened by irradiating the insulating plate 3 made of glass epoxy resin with laser light,
Due to the difference in melting point between the glass fiber 6 and the resin 5, unevenness is easily formed on the melting surface. Therefore, in the processing method described in the above publication, the output of the laser light is adjusted and the laser light is intermittently irradiated to form the blind hole 8 with less unevenness, thereby eliminating the adverse effect on the subsequent plating process. I am trying.

[0005]

However, when the conductor layer is formed on the inner surface of the blind hole by plating as described above, it is necessary to change the output of the laser beam each time the laser beam is intermittently irradiated. Adjustment of is complicated and a high-performance laser device is required. Further, there is a problem that the manufacturing process is complicated because the plating process is required.

In consideration of the above circumstances, the present invention does not require a plating process, and even when a blind hole is processed by irradiating a laser beam, it does not require complicated adjustment or a high-performance device for boring a printed circuit board. It is an object of the present invention to provide a method and a method for mounting a component in the hole.

[0007]

According to a first aspect of the present invention, there is provided a method for forming a hole in a printed circuit board, wherein a conductor foil is laminated on a surface of a plate made of an insulating material. By forming a blind hole by removing the insulating material, by pressing the conductor foil from the surface side of the conductor foil to the blind hole side, the conductor foil is perforated and burred. To do.

According to a second aspect of the present invention, there is provided a method of boring a printed circuit board according to the first aspect, wherein the blind hole is formed by irradiating a plate made of the insulating material with laser light. To do.

A third aspect of the present invention is the method for boring a printed circuit board according to the first or second aspect, wherein the plate made of the insulating material is a resin in which glass fibers are mixed. And

A fourth aspect of the present invention is the method for boring a printed circuit board according to any one of the first to third aspects, wherein the conductor foil is laminated on the front and back surfaces of a plate made of the insulating material. Open a window hole in the conductor foil of, to form the blind hole by irradiating the window hole with laser light,
It is characterized in that the other conductor foil is pressed from the front surface side of the conductor foil toward the blind hole side to perforate and burring the conductor foil.

According to a fifth aspect of the present invention, after carrying out the method for boring a printed circuit board according to any one of the first to fourth aspects, a lead of an electronic component is inserted into the burred hole, It is characterized in that the lead is soldered to a hole subjected to a burring process.

According to a sixth aspect of the present invention, in the component mounting method according to the fifth aspect, after the cream solder is injected into the blind hole side, the lead of the electronic component is inserted into the burring hole, and the state is maintained. The cream solder is heated to melt and solidify the cream solder to solder the leads.

According to a seventh aspect of the present invention, there is provided the component mounting method according to the fifth aspect, wherein the lead of the electronic component is inserted into the hole subjected to the burring process and immersed in a solder melting bath to perform soldering. It is characterized by doing.

[0014]

According to the invention of claim 1, since the holes are formed by pressing after removing the insulating material behind the conductor foil, the burring holes can be easily formed. Therefore, it is possible to securely and firmly mount the component by inserting the lead of the component into the burred hole and soldering.

According to the second aspect of the present invention, since the blind hole is formed by irradiating the laser beam, the blind hole can be instantly formed.

According to the third aspect of the invention, due to the difference in melting point and hardness between the glass fiber and the resin, when the blind hole is formed by laser beam irradiation or the like, the inner surface of the blind hole is likely to have irregularities. Does not require any special drilling, as it can be a rough hole that merely serves as a cavity.

According to the fourth aspect of the present invention, even when the conductor foil is provided on both front and back surfaces of the plate made of an insulating material, the same processing can be performed except that a window hole is drilled in one conductor foil.

According to the fifth aspect of the invention, the lead of the electronic component is inserted into the hole subjected to the burring process and soldered, so that the component can be mounted securely and firmly.

According to the sixth aspect of the invention, since the soldering is performed using the cream solder, the components can be easily mounted.

According to the seventh aspect of the invention, the solder is immersed in the solder melting tank for soldering, which is suitable for automation of mass production.

[0021]

An embodiment of the present invention will be described below with reference to the drawings.

1 to 5 are process diagrams of one embodiment of the present invention. The printed circuit board 1A targeted here is one in which the copper foil 4 is laminated only on one surface of the insulating plate 3.

At the time of processing, first, as shown in FIG. 1, a blind hole 8 is formed by irradiating a laser beam 50 on the insulating plate 3 behind the copper foil 4 at the planned drilling position. In this case, since the glass fiber 6 and the epoxy resin 5 have different melting points, a slight unevenness is formed on the inner surface. However, as shown in FIG. 2, the laser light is exposed so that the back surface of the copper foil 4 is exposed in a predetermined size. And the blind hole 8 is formed.

Next, as shown in FIG. 3, the copper foil 4 is pressed from its surface side to the blind hole 8 side, whereby the copper foil 4 is perforated and burred. Reference numeral 11 is a hole 11 that has been burred. This hole 11
The size is such that the leads 22 of the component 20 shown in FIG. 5 can pass through.

Then, as shown in FIG. 4, the cream solder 13 is injected into the blind hole 8 by printing or a dispenser, and the leads 22 of the electronic component 20 are burred from the copper foil 4 side as shown in FIG. It is inserted into the processed hole 11, and in that state, the cream solder 13 is melted and solidified to solder the leads 22. 13A indicates solidified solder.

According to the method of this embodiment, since the blind hole 8 is formed behind the copper foil 4 by the laser beam and the hole is processed by pressing, the hole 1 by the burring process is performed.
1 can be easily formed. Therefore, the hole to which the lead 22 of the component 20 is soldered can be formed without plating. Therefore, the blind hole 8 may be simply formed as a cavity, and is formed by irradiating laser light. To do this, just make a rough hole with one shot.

Therefore, even if the insulating plate 3 is made of glass epoxy resin, it is not necessary to use a specially high-performance laser device, and the plating process is not necessary, so that the cost can be reduced. Moreover, since the soldering is performed using the cream solder 13, the components can be mounted easily, reliably and firmly.

In the above embodiment, the copper foil 4 is provided on only one side.
However, the present invention can be applied to the case where the copper foils 2 and 4 are provided on both surfaces as shown in FIG. In that case, a window hole may be formed in one of the copper foils with a drill, and the window hole may be irradiated with a laser beam to form a blind hole, and then the same treatment as described above may be performed. In the case of a printed circuit board having conductor foils on both sides, the conductor foils on the front and back can be made conductive by soldering, and thus can be used as through holes.

As another example of solder, a printed circuit board may be dipped in a solder melting bath for soldering. In that case, mass production is possible.

[0030]

As described above, according to the invention of claim 1, the hole for soldering the lead of the component is formed by punching and burring the conductor foil by pressing, not by plating. can do. Therefore, the blind hole behind the conductor foil may be simply formed as a cavity, and even when it is formed by irradiating with laser light, it is only necessary to make a rough hole with one shot, and special adjustment and high performance are required. There is no need to use the laser device of. Further, since the plating process is unnecessary, the process can be simplified and the cost can be reduced.

According to the second aspect of the invention, the blind hole can be easily formed by irradiating the laser beam. Moreover, since the blind hole may simply be a hole that is roughly processed as a cavity, it can be processed by irradiating with one shot of laser light, and it is not necessary to use a special high-performance laser device, and the cost can be reduced.

According to the third aspect of the present invention, even when a plate made of an insulating material made of glass fiber and resin is used, there is no need for special processing such as adjusting the output of laser light, and the lead of the component can be easily obtained. It is possible to form a hole for soldering.

According to the fourth aspect of the present invention, even if there are conductor foils on both front and back surfaces, almost the same processing can be performed and the same effect can be obtained.

According to the fifth aspect of the invention, the component can be mounted surely and firmly in the burring hole. In particular, in the case of a printed circuit board having conductor foils on both sides, since the conductor foils on the front and back can be made conductive by soldering, they can be used as through holes.

According to the invention of claim 6, soldering can be easily performed.

According to the invention of claim 7, a large amount of soldering can be performed and automation can be coped with.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state where a first step of an embodiment of the present invention is being performed.

FIG. 2 is a cross-sectional view showing a state where the first step of the embodiment of the present invention has been completed.

FIG. 3 is a cross-sectional view showing a state where the second step of the embodiment of the present invention has been completed.

FIG. 4 is a cross-sectional view showing a state where a third step of one embodiment of the present invention has been carried out.

FIG. 5 is a cross-sectional view showing a state where a fourth step of the embodiment of the present invention has been performed.

FIG. 6 is a cross-sectional view used to describe a conventional blind hole forming method.

FIG. 7 is a cross-sectional view showing a state in which a hole wall of a conventional blind hole is plated.

[Explanation of symbols]

 1A Printed circuit board 3 Insulation plate (plate made of insulating material) 4 Copper foil (conductor foil) 5 Epoxy resin 6 Glass fiber 8 Blind hole 11 Burring hole 13 Cream solder 13A Solidified solder 20 Parts 22 Lead

─────────────────────────────────────────────────── ───Continued from the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H05K 1/18 A 8718-4E

Claims (7)

[Claims] 1. A conductor foil 4 is provided on the surface of a plate 3 made of an insulating material.
In the method for forming a hole in the printed circuit board 1A, the blind holes 8 are formed by removing the insulating material behind the positions where the conductor foil 4 is to be formed, and the conductor foil 4 is connected to the conductor foil 4. By pressing from the front surface side to the blind hole 8 side, the conductor foil 4
A method for boring a printed circuit board, which comprises boring and burring on a substrate. 2. The method for boring a printed circuit board according to claim 1, wherein the blind hole 8 is formed by irradiating the plate 3 made of the insulating material with a laser beam 50. How to make a hole in a substrate. 3. The method for punching a printed circuit board according to claim 1, wherein the plate 3 made of the insulating material is
A method of punching a printed circuit board, characterized in that glass fiber 6 is mixed in resin 5. 4. The method for punching a printed circuit board according to claim 1, wherein the conductor foil is laminated on the front and back surfaces of a plate made of the insulating material, and one of the conductor foils has a window. Form a blind hole by making a hole and irradiating the window hole with laser light, and pressing the other conductor foil from the surface side of the conductor foil to the blind hole side to form a hole in the conductor foil. A method for forming a hole in a printed circuit board, which comprises performing an opening and a burring process. 5. After performing the method for boring a printed circuit board according to any one of claims 1 to 4, a lead 22 of an electronic component 20 is inserted into the hole 11 subjected to the burring process, and the lead is inserted. 22. A component mounting method characterized in that 22 is soldered to the burring hole 11. 6. The component mounting method according to claim 5, wherein
After the cream solder 13 is injected into the blind hole 8 side, the leads 22 of the electronic component 20 are inserted into the burring holes 11, and in that state, the cream solder 13 is inserted.
The component mounting method is characterized in that the cream solder 13 is melted and solidified by heating the solder, and the leads 22 are soldered. 7. The component mounting method according to claim 5, wherein
A component mounting method characterized in that the leads 22 of the electronic component 20 are inserted into the burring-processed holes 11 and immersed in a solder melting bath for soldering.