TW201405747A - Flip chip bonding apparatus - Google Patents

Abstract

The present invention relates to a flip chip bonding apparatus, which is able to improve the accuracy and reliability of a transfer process for transferring a welding head used in a flip chip bonding step to a predetermined position on the xy plane. The bonding apparatus is used to minimize the transfer operation of the transfer line for transferring each welding head, and reduce the position error problem caused by heat generation. Specifically, the present invention relates to a flip chip bonding apparatus that can reduce the movement frequency and movement distance of the welding head in a specific axial direction, and reduce the thermal expansion and vibration generated due to the transfer of the welding head, and raise UPH of the bonding apparatus while ensuring adequate time for flattening the welding flux.

Description

Flip chip soldering device

The present invention relates to a flip chip bonding apparatus.

A flip chip bonding apparatus for soldering a flip chip to a solder substrate or the like may have at least one solder joint. Each weld head is transferred to a predetermined position of the welding device to grip or weld the chip.

In general, the process of soldering a flip chip to a solder substrate should be performed very accurately, and a plurality of mounting regions for fixing the chip are prepared on the solder substrate. At the same time, the mounting area of the flip chip and the solder substrate should ensure accurate electrical connection, and the chip should be mounted and soldered at the correct position (pattern) of the mounting area to reduce the defect rate.

The welding head used in this welding process can be conveyed to a predetermined position on the xy plane through a gantry type conveying device which is assembled to intersect in the x-axis and y-axis directions.

Specifically, the soldering tip is mounted on the first transporting line and can be transported in the longitudinal direction of the first transporting line, and both ends of the first transporting line are permeable to the movable portion and parallel to the pair of the first transporting line. The second transmission line is attached. The moving portion can be transported in the longitudinal direction of the second transport line.

Therefore, the welding heads are respectively arranged to be parallel or perpendicular. The feed line is delivered to a predetermined location on the xy plane within the workspace.

The working portion having the welding head and the moving portion connected to the conveying line may be driven by an electromagnet or a ball screw.

The working part or the moving part can accelerate the high-speed transmission through the electromagnet or the ball screw. When the high-speed transfer process is repeated, the components constituting each of the transfer lines generate heat, and the thermal expansion of the specific component due to the heat, the work part or The accuracy of the transfer position of the moving portion is lowered.

For example, the moving portion for attaching the first transfer line to the second transfer line is a portion in which heat generated in the transfer process through the second transfer line is most transferred, and the moving portion due to the generated heat is thermally expanded. Problems can cause positional errors at both ends of the first transmission line.

Similarly, the working portion mounted on the first conveying line also generates thermal expansion due to heat generated in the moving portion conveying process transmitted through the mounting portion along the second conveying line, and the same problem as described above can occur.

Depending on the trend of chip size reduction, positional errors of the moving parts caused by problems such as thermal expansion of the components may cause welding position errors, which may cause welding defects.

In particular, due to thermal expansion or vibration generated at the working portion or the transfer portion provided on each of the transfer lines, information on the precise position of the flip chip and the mounting area of the solder substrate may not be obtained, and thus, the defect rate increases. The reliability and accuracy of the welding process are reduced.

Therefore, it is important to minimize the number of movements and the moving distance of the welding head in the x-axis or y-axis direction during the entire welding process, and to set the assembly to reduce the number of movements and the moving distance of the welding head in a specific axial direction. important.

That is, in the process of transferring the soldering tip, when the soldering process is performed, it is preferable to omit the driving of the working portion or the conveying portion or to minimize the driving of the working portion or the conveying portion, and even if the driving of any of the components is omitted. Or when the driving of any of the components is minimized, when the components for the welding process are disposed adjacent to each other in order to improve the space utilization ratio, interference between different components due to movement of the welding head or the like should be minimized, And there are situations in which a spatial area in which a particular operational component needs to be operated should be ensured.

Therefore, there is a need for a method of reducing the number of movements and moving distances of the welding head in a particular axial direction, setting components between successive processes, and reducing interference between the working spaces.

The present invention provides a flip chip bonding apparatus. In one aspect, the flip chip bonding apparatus can include: a flip-chip unit for picking up the chip from the wafer and flipping the upper side of the chip downward; and a working portion having a solder for grasping the chip flipped by the flip-chip unit a head, wherein the welding head is capable of rotating the crucible in the z-axis direction with respect to the z-axis; a flux impregnation unit for impregnating the bottom surface of the chip grasped by the soldering tip into a flux; a first visible unit, Photographing a bottom surface image of a chip impregnated by a flux dipping unit; a second viewing unit for capturing a top surface image of a solder substrate; a chip to be mounted on the solder substrate; and a flip chip soldering portion for As a result of the inspection by the first visual unit and the second visual unit, the chip is soldered on the solder substrate at the corrected position; a first transfer line for mounting the working portion, the working portion being transported along the y-axis direction; and a pair of second a transmission line, the pair of second transmission lines are disposed in parallel along an x-axis direction perpendicular to the first transmission line, and the moving portion for mounting the both ends of the first transmission line is perpendicular to the conveying direction of the first transmission line The moving portion is conveyed in the x-axis direction, wherein the flux dipping unit and the first visible unit are disposed on the same axis parallel to the first transfer line.

Wherein the flip-chip unit, the flux dipping unit and the first visible unit may be disposed in pairs at positions symmetrical with respect to the y-axis, and the first transfer line having the working portion is mounted on the second transfer line such that a pair of first transfer The wires can be driven independently.

Wherein the flip chip unit and the flux dipping unit may be disposed on the same axis parallel to the second transfer line.

Wherein the flip chip unit, the flux dipping unit, and the first visible unit may be disposed on the same axis parallel to the first transfer line.

In order to reduce the moving distance in the x-axis direction when the soldering tip is moved from the flip chip unit to the solder substrate, the flip chip unit, the flux dipping unit, and the first visible unit may be sequentially disposed in the y-axis direction.

Wherein the chip passes through the first visible unit while being grasped by the soldering tip, and the first visible unit inspects the chip by capturing an image of the bottom surface of the chip.

Wherein when the size of the chip is larger than the field of view of the first visible unit, the soldering tip can be rotated at a predetermined angle so that the first visible unit can capture the two edges of the chip without moving in the x-axis direction.

Wherein the bottom surface image of the chip is continuously photographed for inspection when the soldering head is rotated above the first visible unit while rotating at a predetermined angle.

The device flip chip soldering apparatus may further include a control unit for controlling the driving tool of the working part and the moving part, and the working part and the moving part respectively have a driving tool, so that the working part and the moving part are along the first conveying line and The second transfer line is conveyed, wherein the control portion drives the drive tool of the work portion to stop the drive tool of the moving portion when the work portion is transferred from the flux dipping unit to the first visual unit or is transported over the first visual unit.

The device flip chip soldering apparatus may further include a control unit for controlling the driving tool of the working part and the moving part, and the working part and the moving part respectively have a driving tool, so that the working part and the moving part are along the first conveying line The second transfer line conveys, wherein the control portion stops the driving tool of the moving portion when the welding head of the working portion is transferred from the flip-chip unit to the first visible unit or from the flux dipping unit over the first visible unit.

The control unit drives the driving tool of the working part to make the work The portion can be transported at a uniform rate as it is transferred from the flux impregnation unit to the first visual unit or over the first visual unit.

Wherein during a welding cycle, the number of driving of the moving part is less than the number of driving of the working part, and during one welding cycle, the welding head of the working part is along the flip-chip unit, the flux dipping unit, the first visible unit, and the flip chip The weld is delivered.

Wherein the trajectory on the xy plane of the welding cycle may be formed in a triangular or rectangular shape, and at least one side of the triangle or rectangle forming the trajectory is parallel to the first transmission line or the second transmission line, and the working portion of the welding portion in the welding cycle The soldering tip is transferred along the flip chip unit, the flux dipping unit, the first visible unit, and the flip chip soldering portion.

Wherein the soldering tip may sequentially pass through the flip chip unit, the flux dipping unit, the first visible unit, and the flip chip soldering portion when the soldering tip is transported along a triangular or rectangular edge forming the track, parallel to the edge of the first transfer line.

In the process of one welding cycle, the number of driving of the moving part may be two or three times, during which the welding head of the working part is welded along the flipping unit, the flux dipping unit, the first visible unit and the flip chip Passed by the ministry.

The control unit controls the driving tool of the working portion such that the working portion is driven at a constant speed when the working portion passes through the flux dipping unit and the first visible unit, and the working portion is decelerated when being transferred to the flip chip bonding portion.

In another aspect, a flip chip bonding apparatus can include: a flip-chip unit for flipping a chip to invert a top surface and a bottom surface of the chip; a first driving portion for driving the flip-chip unit; a portion disposed to be transported to a predetermined position on the xy plane, having a soldering tip for picking up the chip, the top surface and the bottom surface of the chip being inverted by the flip-chip unit; a flux dipping unit including for impregnating a flux receiver of the solder of the chip, a flux scraper for flattening the solder, and a second driving portion for sliding the solder receiver; a first visible unit for capturing the chip; and a second visible unit For photographing a solder substrate, a chip to be mounted on the solder substrate; and a flip chip soldering portion for mounting the chip on the solder substrate, wherein in order to reduce the number of movements or moving distance of the solder joint in the x-axis direction, first The visible unit and the flux impregnation unit are respectively disposed on an axis parallel to the y-axis direction.

In another aspect, a flip chip bonding apparatus can include: a flip-chip unit for flipping a chip to invert a top surface and a bottom surface of the chip; a first driving portion for driving the flip-chip unit; a portion disposed to be transported to a predetermined position on the xy plane, having a soldering tip for picking up the chip, the top and bottom surfaces of the chip being inverted by the flip-chip unit, and a flux dipping unit including for impregnating a flux receiver of the solder of the chip, a flux scraper for flattening the solder, and a second driving portion for sliding the flux receiver; a first visible unit for photographing the core a second visible unit for photographing a solder substrate on which a chip is to be mounted; and a flip chip soldering portion for mounting the chip on the solder substrate, wherein the solder joint is moved in the x-axis direction The number of times or the moving distance, the first visible unit, the flux impregnating unit, and the flip-chip unit are respectively disposed on the same axis parallel to the y-axis direction.

The flux receiver is slidable forward and backward relative to the flux scraper.

Wherein a recess for accommodating the flux is provided at the flux receiver, and the recess and the first visible unit are respectively disposed on the same axis parallel to the y-axis direction.

Wherein, when the flux receiver moves forward, a first space and a second space are respectively provided on the top and bottom of the flux receiver, and the welding head can enter the first space.

Wherein the weld head can enter the first space when the flux receiver moves backwards for flattening the flux.

The first driving portion may be disposed in the second space.

Wherein the first driving portion may include a casing disposed in the second space, and a cable connected to the flip-chip unit and a vacuum line are disposed in the casing.

Wherein the flux impregnation unit may include a main body having a second driving portion and a mounting unit for mounting the flux scraper on the main body, and when the flux receiver moves forward, the flux receiver protrudes toward the outside of the main body Out.

Wherein the flux receiver and the first driving portion of the flip-chip unit are disposed to overlap at least some regions on the xy plane when the solder receiver protrudes toward the outside of the body.

Wherein the mounting unit may include a rail member for mounting the flux receiver, a first support member hingedly coupled to the rail member, supporting the upper portion of the flux scraper, and a first portion of the front side hingedly coupled to the first support member to support the flux scraper Two support parts.

Wherein a locking projection is provided at the second support member, and a locking step is provided at the rail member in combination with the locking projection.

The mounting unit may include a first elastic member disposed between the first supporting member and the rail member, and a second elastic member disposed between the second supporting member and the first supporting member, and the first elastic member is The second resilient member provides spring force to the flux scraper from different directions.

Wherein the first viewing unit captures an image while the welding head is moving along the same axis parallel to the y-axis direction.

Where the welding head is moving along the same axis parallel to the y-axis direction, the following steps are performed, namely, grabbing the chip, immersing the chip in the flux, and photographing the chip.

The flip chip bonding apparatus may further include: a first transfer line for transporting the solder joint in the y-axis direction and for transmitting in the x-axis direction A second transfer line of the soldering tip, wherein the first transfer line and the second transfer line have a shelf structure that overlaps.

The flip chip bonding apparatus may further include: a vacuum generator for supplying adsorption pressure to the flip unit; and a pressure control device for controlling the flow rate of the inflow air of the flip unit, thereby controlling the adsorption pressure of the flip unit It is equal to or similar to the adsorption force of air flowing in from the outside; and a pressure sensor is disposed between the flip-chip unit and the pressure control device to sense whether the chip is grasped.

1‧‧‧Flip chip soldering device

11‧‧‧Transmission line

12‧‧‧ Aligning the visual unit

13(1)‧‧‧Transmission line

13(2)‧‧‧Transmission line

100‧‧‧Whip feeder

101‧‧‧ wafer loading department

113‧‧‧rails

114‧‧‧Pre-aligned unit

120‧‧‧Guide parts

200(1)‧‧‧ third partial frame

200 (2) ‧ ‧ frame

210(1)‧‧‧Flip unit

210(2)‧‧‧Flip unit

400(1)‧‧‧Solder impregnating unit

400(2)‧‧‧ flux impregnating unit

410(1)‧‧‧Solder Receiver

410(2)‧‧‧Solder Receiver

420(1)‧‧‧Solder scraper

420(2)‧‧‧Solder scraper

500‧‧‧Flip Chip Soldering Department

510‧‧‧welding station

910(1)‧‧‧ first visual unit

910(2)‧‧‧ first visual unit

1100(1)‧‧‧First transmission line

1100(2)‧‧‧First transmission line

1110(1)‧‧‧Working Department

1110(2)‧‧‧Working Department

1120(1)‧‧‧welding head

1120(2)‧‧‧welding head

1130(1)‧‧‧Second visual unit

1130(2)‧‧‧Second visual unit

1300(1)‧‧‧second transmission line

1300(2)‧‧‧second transmission line

1310a (1) ‧ ‧ Moving Department

1310b(1)‧‧‧moving department

1310a (2) ‧ ‧ Department of Movement

1310b(2)‧‧‧moving department

W‧‧‧ wafer

Fc‧‧‧chip

Bs‧‧‧Welded substrate

1 is a view showing a flip chip bonding apparatus according to the present invention; FIG. 2 is a view showing a flip chip bonding apparatus according to another embodiment of the present invention; and FIG. 3 is an enlargement around a working portion; Figure 4 is a view showing two exemplary transport trajectories of the soldering tip of the flip chip bonding apparatus according to the present invention; and Fig. 5 is a view showing the soldering head of the flip chip soldering apparatus according to the present invention. 2 views of an exemplary transfer trajectory; Fig. 6 is a view showing two other exemplary transfer trajectories of a soldering tip of a flip chip bonding apparatus according to the present invention; and Fig. 7 is a view showing flipping according to the present invention Block diagram of a chip soldering apparatus; Fig. 8 is a view showing a flip chip bonding apparatus according to an embodiment of the present invention 9 is a side view showing a main portion of a flip chip bonding apparatus according to an embodiment of the present invention; and FIG. 10 is a plan view showing a main portion of a flip chip bonding apparatus according to an embodiment of the present invention; 11 is a detailed view showing a portion A of FIG. 10; FIG. 12 is a side view showing a main portion of a flip chip bonding apparatus according to an embodiment of the present invention; and FIG. 13 is a view showing implementation according to the present invention. FIG. 14 is a perspective view showing a flux dipping unit constituting a flip chip bonding apparatus according to an embodiment of the present invention; FIG. 15 is a perspective view showing an operation state of a flip chip bonding apparatus according to an embodiment of the present invention; A side view showing a flux immersion unit constituting a flip chip bonding apparatus according to an embodiment of the present invention; and Fig. 16 is a view showing an operation state of a main portion of a flux immersion unit constituting a flip chip bonding apparatus according to an embodiment of the present invention. FIG. 17 and FIG. 17 are block diagrams showing a flip-chip unit constituting a flip-chip bonding apparatus according to an embodiment of the present invention.

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The advantages and features of the present invention and the method of its implementation will be clarified by the following embodiments described with reference to the drawings. However, the invention may be embodied in different forms. The invention should not be construed as being limited to the embodiments shown. Rather, these embodiments are provided so that the description will be thorough and complete, and the scope of the invention is fully conveyed by those skilled in the art. Furthermore, the invention is only limited by the scope of the patent application. Throughout the drawings, the same reference numerals indicate the same elements.

The flip chip bonding apparatus 1 according to the present invention is a device which forms a separate solder bump on a pad which is an input and output terminal of a chip, and flips the chip to a solder bump Solder directly onto a circuit pattern such as a carrier bonding substrate or a circuit tape.

The "first drawing" is a view showing the flip chip bonding apparatus 1 according to the present invention. A schematic view of a flip chip bonding apparatus 1 according to the present invention is depicted.

In the specification and the drawings described below, the horizontal direction refers to the x-axis direction, and the vertical direction refers to the y-axis direction. Further, it can be explained that the x-axis direction is parallel to the moving portion conveying direction of the second conveying line described below, and the y-axis direction is parallel to the conveying direction of the working portion of the first conveying line described below.

Specifically, the flip chip bonding apparatus 1 includes: a flip-chip unit 210 for picking up the chip from the wafer, flipping the upper side of the chip downward (so that the top surface and the bottom surface of the chip are reversed); the working portion 1110, along the z The axial direction transport 幷 rotates about the z-axis and has a grip for flipping by the flip-chip unit 210 a solder joint 1120 of the chip; a flux impregnation unit 400 for immersing the bottom surface of the chip grabbed by the solder joint 1120; and a first visible unit 910 for photographing (through the photographing inspection) the bottom of the chip impregnated by the flux impregnation unit 400 a surface image; a flip chip soldering portion 500 for soldering the chip to the solder substrate, the position of the chip being corrected by the soldering head 1120 according to the inspection result by the first visible unit 910; the first transmission line 1100, for The mounting work portion 传送 transmits the working portion in the y-axis direction; and a pair of second transfer lines 1300 each having a moving portion 1310 connected to both ends of the first transfer line 1100, and in order to be perpendicular to the first transfer line 1100 The moving portion 1310 is conveyed in the x-axis direction of the conveying direction, the pair of second conveying lines 1300 are disposed to be parallel to each other in the x-axis direction perpendicular to the first conveying line 1100, and the flux dipping unit 400 and the first visible unit 910 are disposed at On the same axis parallel to the first transfer line 1100.

In the embodiment described below with reference to "FIG. 1", the flip-chip unit 210, the flux dipping unit 400 and the first visible unit 910 are disposed in pairs at positions symmetrical with respect to the y-axis, having the first transfer of the working portion 1110. The wires 1100 are mounted in pairs on the second transfer line so as to be driven independently.

However, it should be explained that the flip-chip unit 210, the flux dipping unit 400, and the first visible unit 910 are disposed in pairs at positions symmetrical with respect to the y-axis, depending on the type of the device, and have the first transfer line 1100 of the working portion 1110. The number can be increased or decreased, and there is no limit.

The flip chip bonding apparatus 1 according to the present invention can be mounted on The bonding head 1120(1) or 1120(2) on the working portion 1110(1) or 1110(2) is transferred to a predetermined position on the xy plane. Since the welding head 1120(1) or 1120(2) may be a structure that can be raised or lowered in the z-axis direction or rotated in the θ direction with respect to the z-axis in the process of welding or gripping (adsorbing) the chip, according to the present invention The flip chip bonding apparatus 1 can be configured to transfer the bonding head 1120(1) or 1120(2) mounted on the working portion 1110(1) or 1110(2) to a predetermined position in the xyz space.

Further, the working portions 1110(1) and 1110(2) are each assembled with the visual unit (second visual unit 1130) described below.

The flip chip bonding apparatus 1 according to the present invention can perform an operation of discarding a single flip chip fc from each wafer w supplied from the wafer supplier 100 and flipping a single flip chip to form bumps. The electrode (solder bump) has a soldered surface facing down.

When the wafer feeder 100 stacks a plurality of wafers w, the wafer feeder 100 can wait for operation, and the wafers in the wafer feeder 100 can be sequentially supplied into the flip chip supply portion 200.

When the wafer is exposed through a wafer on-loader 101, the wafer feeder 100 has a structure supporting each wafer.

The wafer feeder 100 can have a guiding member 120 for guiding the wafer to the flip chip supply 200. The guiding member 120 has a function of guiding wafer transfer by a separate driving tool (not shown) Out) transfer.

The flip chip supply portion 200 separates a plurality of chips constituting the wafer w into individual chips, and flips each chip to provide a flip chip fc (in the present specification, the flip chip is a chip whose top surface and bottom surface are reversed) For each of the soldering tips 1120(1) and 1120(2), the wafer is supplied by the wafer feeder 100.

When the wafer w is in a state of being diced, the wafer w having a plurality of chips (or flip chips) may be in a state in which the tape is attached to the bottom. In addition, each of the flip chip fc may be in a state in which the bottom surface of the chip having the bump electrode (solder bump) or the contact point is disposed upward.

The flip chip supply portion 200 may include an ejector (not shown) and a flip-chip unit 210(1) or 210(2) for discharging each chip from the wafer w, the flip-chip unit 210(1) or 210( 2) For flipping the chip separated by the ejector touch 幷, so that the soldering head 1120(1) or 1120(2) can grab the flip chip.

The flip-chip unit 210(1) or 210(2) may have a gripper structure capable of performing a pick-up operation through adsorption and a rotating operation for reversing the top surface and the bottom surface of the chip. The direction of rotation or the like of the flip-chip unit 210 may vary differently.

Briefly, an ejector (not shown) is disposed under the wafer w, and each chip constituting the wafer w is permeable to the blower of the ejector. Separating from the wafer w, and flipping each of the separated chips through the flip-chip unit 210(1) or 210(2) disposed above the wafer w, thereby having a bump electrode (solder bump) or a chip of the contact point The bottom is facing down.

The flip chip fc flipped by the flip-chip unit 210(1) or 210(2) is picked up by the soldering head 1120(1) or 1120(2) as a working unit waiting above the flip chip.

In the flip chip bonding apparatus 1 shown in FIG. 1, a pair of bonding heads 1120 (1) and 1120 (2) are provided in the working portions 1110 (1) and 1110 (2), respectively.

Further, a pair of second visible units 1130(1) and 1130(2) may be disposed at the working portions 1110(1) and 1110(2) together with the bonding heads 1120(1) and 1120(2).

Since the flip-chip unit 210 grabs the crucible rotating chip so that the soldering surface of the chip faces downward and the top surface faces upward, the soldering head 1120(1) or 1120(2) can grasp the top surface of the chip facing upward, and maintain the middle The bottom surface of the chip which exposes the bump electrode (solder bump) or the like is in a downwardly grasped state.

The soldering head 1120(1) or 1120(2) can grab the flip chip of the soldering object from the flip chip supply 200 and the soldering head 1120(1) or 1120(2) is attached to the working portion 1110(1) or At 1110 (2), it is transferred to the flux dipping unit 400 and the flip chip bonding portion 500.

In the transmission path along the first and second transmission lines 1100 and 1300 After the gripping step, the immersing step, the photographing step (inspection step), and the soldering step, the soldering head 1120(1) or 1120(2) can be driven to pass the first and second transfer lines 1100 and 1300 to the specific The chip is loaded back to the flip chip supply unit 200.

The working portions 1110(1) and 1110(2) are respectively mounted on a pair of first transmission lines 1100(1) and 1100(2), and the pair of first transmission lines 1100(1) and 1100(2) are at y The working portions 1110(1) and 1110(2) are transmitted in the axial direction, and both ends of the first transmission line 1100(1) or 1100(2) are respectively attached to the pair of second transmission lines 1300(1) and 1300 (2), the pair of second transmission lines 1300 (1) and 1300 (2) can be respectively transmitted through the moving portions 1310a (1), 1310a (2), 1310b (1), and 1310b (2) in the x-axis direction The first transmission lines 1100(1) and 1100(2) are transmitted.

Specifically, both ends of the first transmission line 1100(1) or 1100(2) disposed on the left side among the first transmission lines 1100(1) and 1100(2) shown in FIG. 1 are respectively The moving portions 1310a(1) and 1310a(2) are restricted to attach the moving portions 1310a(1) and 1310a(2) such that the moving portions 1310a(1) and 1310a(2) are along the second transfer line 1300(1) And the longitudinal direction (x-axis direction) of 1300 (2) is transmitted.

The first transmission lines 1100(1) and 1100(2) and the second transmission lines 1300(1) and 1300(2) each have an overlapping gantry structure, and the gantry structure can be configured to move the working portion 1110(1) And 1110 (2) independently transmitted to The predetermined number of positions on the xy plane, the number of the first transmission lines 1100(1) and 1100(2) may be increased or decreased.

The first and second transfer lines 1100 and 1300 transfer the soldering head 1120 (1) or 1120 (2) of the flip chip from the flip chip supply portion 200 to the side of the flux immersion unit 400.

The flux impregnation units 400 (1) and 400 (2) shown in "Fig. 1" may correspond to the number of the working portions 1110 (1) and 1110 (2) or the welding heads 1120 (1) and 1120 (2). For the settings.

The flux impregnation unit 400(1) or 400(2) can provide flux for soldering through the bottom surface of the impregnated flip chip.

The flux impregnation unit 400(1) or 400(2) may have a flux receiver 410(1) or 410(2) containing a flux and a flux blade 420(1) or 420(2) in a flip chip After being immersed in the flux, a flux scraper is used to flatten the surface of the flux.

After the soldering head 1120(1) or 1120(2) picks up the flip chip and transmits it to the solder receiver 410 through the first and second transmission lines 1100 and 1300, the soldering head 1120(1) or 1120 can be passed through. (2) The impregnation process is carried out.

The soldering head 1120(1) or 1120(2) may be configured to be in the flip chip supply portion 200, the flux dipping unit 400, the first visible unit 910(1) or 910(2) described below, and the flip chip bonding portion 500. one of the Or multiple rises or falls in the z-axis direction.

That is, in the embodiment shown in FIG. 1, the soldering head 1120(1) or 1120(2) itself can be provided with a rising or falling function or the soldering head 1120(1) or 1120 can be mounted thereon. The working portion 1110(1) or 1110(2) of (2) provides a method of raising or lowering the function to achieve the rise or fall of the welding head 1120(1) or 1120(2) in the z-axis direction.

In the embodiment shown in FIG. 1, since the welding head 1120(1) or 1120(2) may have a structure that can be raised or lowered, if the welding head 1120(1) or 1120(2) passes through the first The second transfer lines 1100 and 1300 are transferred over the flux immersion unit 400 to impregnate the bottom surface of the flip chip, so the solder joints 1120(1) and 1120(2) can perform their respective operations.

The soldering head 1120(1) or 1120(2) of the flip chip that has completed the flux impregnation can be transferred to the flip chip bonding portion 500 described below through the first and second transfer lines 1100 and 1300.

The flip chip supply unit 200 performs a process of grasping, rotating, and grasping the flip chip, and the flux dipping unit 400 performs a step of dipping, dipping, and ascending. That is, since the physical position changes continuously despite the precise control of each step, the flip chip may be in a state of being skewed or pushed from the initial position.

Because it is impossible to completely prevent physical errors, it needs to be welded This error is corrected or eliminated in the process. The reason is that since the size of the bump electrode (solder bump) or the contact point on the bottom surface of the flip chip is extremely small, accurate soldering cannot be ensured even when the position of the flip chip is extremely small.

Therefore, the flip chip bonding apparatus 1 according to the present invention may include a visible unit for photographing a flip chip or a solder substrate on which a flip chip is soldered. The visual unit can include first and second visual units 910 and 1130 for capturing at least one image.

The flip chip bonding apparatus 1 shown in FIG. 1 can have two types of visible units, namely first and second visible units 910 and 1130.

The flip chip bonding apparatus 1 may have a pair of first visible units 910(1) and 910(2), and a pair of first visible units 910(1) and 910(2) are disposed in an upward viewing direction to capture the flux The bottom surface of the flip chip impregnated by the dipping unit 400.

In the embodiment shown in FIG. 1, in order to capture the bottom surface of the impregnated flip chip, the first visible unit 910(1) or 910(2) is disposed therein through the solder joint 1120(1) or 1120. (2) The flip chip is passed through the path of the flux impregnation unit 400.

That is, the first visible unit 910(1) or 910(2) may be disposed under the conveying path of the welding head 1120(1) or 1120(2) to photograph in the upward viewing direction.

The first visual unit 910(1) or 910(2) can obtain the position information of the transferred flip chip by photographing the bottom surface of the flip chip grabbed by the soldering head 1120(1) or 1120(2).

The first visual unit 910(1) or 910(2) can capture an area of at least two points of the transferred flip chip bottom surface. Because although the position of each flip chip can be grasped from an image obtained by taking one point (one shot taken), if two or more points are taken, a further corrected image can be extracted. In this case, in order to grasp the degree of skew (or rotation) along with the displacement of the flip chip in a specific direction, it is necessary to take an area of two or more dots.

The flip chip in which the bottom surface is immersed in the flux by the flux impregnation unit 400 (1) is transferred to the flip chip bonding portion 500.

The flip chip bonding portion 500 may include a soldering stage 510 for fixing a soldering substrate (a soldering substrate of a soldering object) bs that is transferred from a solder substrate loading portion (not shown) along the rail 113.

The alignment visible unit 12 provided in the independently disposed pre-alignment unit 114 can perform a pre-alignment process on the solder substrate bs transferred to the soldering station 510, that is, the entire inspection is performed for each soldering position.

The solder substrate bs transferred from the solder substrate loading portion (not shown) along the rail 113 is transported in the x-axis direction shown in FIG. 1 and aligned with the transport line 11 through which the visible unit 12 can pass through the gantry structure. And 13 transferred to The predetermined position on the xy plane. The position information of the conveyed welding substrate can be previously collected by a photographing method, and the position information is used as reference data in a welding process performed on the welding table.

Although the solder substrate bs should be properly placed on the soldering region sp of the soldering station 510, the soldering substrate may be displaced from the soldering region sp in the transferring process, or the soldering substrate may be placed in the soldering region sp in a skewed state, so soldering The substrate is offset from the soldering region sp.

If the solder substrate is displaced from the solder region sp, the correctness of the flip chip immersed in the solder cannot be ensured in the soldering process, so that electrical connection failure may occur.

As described above, the flip chip bonding apparatus 1 according to the present invention may include the second visible in order to allow the soldering process to take into account the positional shift of the flip chip which may occur in the process of picking up the flip chip or immersing the flip chip Units 1130(1) and 1130(2), and second visible units 1130(1) and 1130(2) are collected from the bottom surface of the flip chip by including the first visible units 910(1) and 910(2) The position information of the flip chip is the same in the same manner to accurately determine the placement position of the solder substrate bs. The second viewing units 1130(1) and 1130(2), together with the welding heads 1120(1) and 1120(2), can be attached to the working portions 1110(1) and 1110(2), respectively. Therefore, since the soldering heads 1120(1) and 1120(2) are transmitted together with the working portions 1110(1) and 1110(2), the second visible units 1130(1) and 1130(2) are transmitted through the first The first and second transmission lines 1100 and 1300 are transmitted to predetermined positions on the xy plane.

In order to solder the flip chip impregnated by the flux impregnation unit 400, the second visible unit 1130(1) or 1130(2) may be disposed in a downward viewing direction to capture a solder substrate disposed in the soldering region sp of the soldering station .

The second visible unit 1130(1) or 1130(2) can reflect the positional error of the solder substrate in the soldering process by confirming the alignment of the solder substrate bs disposed on the soldering station 510.

Therefore, the first visible unit 910(1) or 910(2) captures the bottom surface of the flip chip to obtain an image for determining the position error of the flip chip to be soldered, and the second visible unit 1130(1) Or 1130(2) may obtain an image for determining the position of the solder substrate when the solder substrate is placed in the soldering region sp of the soldering station, that is, in the soldering position of the chip.

Further, in addition to the solder substrate, the second visible unit 1130(1) or 1130(2) can be used to obtain an image for determining a defect in the soldering process by photographing the soldered solder substrate.

In this case, the occurrence of defects can be confirmed by determining the position of the chip with respect to the solder substrate. The control portion of the flip chip bonding apparatus 1 according to the present invention can be used to accurately image according to images taken through the first visible unit 910(1) or 910(2) and the second visible unit 1130(1) or 1130(2). Control the work unit (welding head 1120 or second visible unit 1130) or weld The position of the pick-up.

Further, by arranging the soldering tip into a rotatable 幷-rotating solder joint 1120(1) or 1120(2) to correct the soldering direction (theta direction) of the chip, it is possible to eliminate, for example, skew (rotation) of the chip or the solder substrate. Error.

Thus, the flip chip bonding apparatus 1 according to the present invention can transmit the bonding head 1120(1) or 1120(2), the visible unit, etc. to the xy plane through the first and second transfer lines of the overlapping gantry structure. Position, and when the z-axis direction ascending and descending function is provided in a work unit such as a soldering tip, the flip chip bonding apparatus 1 can transfer the work unit to a predetermined position in the xyz space. Such a transmission line structure causes problems such as a positional error due to thermal expansion or a distortion of a transmission line due to a positional error as described above.

The heat generated by the driving tool for driving the working portion 1110(1) or 1110(2) or the moving portion 1310a(1) or 1310a(2) generates the working portion 1110(1) or 1110(2) or the moving portion 1310a. (1), 1310a (2), 1310b (1) or 1310b (2) position error. That is, due to the working portion 1110(1) or 1110(2) on which the soldering tip 1120(1) or 1120(2) is mounted and the two ends of the first transmission line 1100(1) or 1100(2) are connected A positional error caused by thermal expansion generated by the moving portion 1310a (1), 1310a (2), 1310b (1), or 1310b (2) may result in mounting at the working portion Position error of the soldering head 1120(1) or 1120(2) on the 1110(1) or 1110(2) on the xy plane, the working portion 1110(1) or 1110(2) is mounted on the first transmission line 1100 (1) ) or 1100(2) is transferable.

The position sensor mounted in the working portion 1110 (1) or 1110 (2) (1110) and the moving portion 1310 measures the working portion 1110 by sensing a linear scale (not shown) provided on each of the conveying lines ( 1) or 1110 (2) (1110) and the position of the moving portion 1310a (1), 1310a (2), 1310b (1) or 1310b (2), but because it is arranged to drive the working portion 1110 (1) or 1110 ( 2) (1110) and the heat generated by the driving tool of the moving portion 1310 causes the working portion 1110 (1) or 1110 (2) (1110) and the moving portion 1310 to thermally expand, and the position of the position sensor changes according to thermal expansion. Therefore, it is impossible to accurately sense the position of the welding head 1120(1) or 1120(2) provided in the working portion 1110(1) or 1110(2).

Therefore, the positional error of the working portion 1110(1) or 1110(2) or the moving portion caused by thermal expansion hinders the precision of the flip chip bonding process.

Therefore, as a method of improving the accuracy of the flip chip bonding process, the flip chip bonding apparatus 1 according to the present invention proposes a method of minimizing the amount of thermal expansion.

Finally, the method of minimizing the transfer process or the transfer distance of the working portion 1110(1) or 1110(2) or the moving portion 1310a(1), 1310a(2), 1310b(1) or 1310b(2) can be thermally expanded. Most Small.

In particular, although the positional error of the welding head 1120(1) or 1120(2) is minimized, the working portion 1110(1) or 1110(2) or the moving portions 1310a(1), 1310a(2), 1310b may be used. The transfer process or transfer distance of (1) or 1310b(2) is minimized, but because of the thermal expansion of the tool driven by the working portion 1110(1) or 1110(2) for driving the working portion 1110(1) or 1110(2) The resulting positional error may be relatively larger than the positional error caused by the thermal expansion of the moving part driving tool for driving the moving portions 1310a(1), 1310a(2), 1310b(1) or 1310b(2), so it is more important It is to minimize the movement of the moving part.

The moving portion mounted on the second transport line (located on the second transport line due to the weight or the like of the first transport line 1100(1) or 1100(2) compared to the working portion 1110(1) or 1110(2) The two ends of the first transfer line 1100(1) or 1100(2) are mounted in a limited state. A larger driving force is required, so the amount of heat generated by the driving force is large.

In contrast, since the working portion 1110(1) or 1110(2) mounted on the first transfer line 1100(1) or 1100(2) is attached with the soldering head 1120(1) or 1120(2) and the second visible unit Therefore, the working portion 1110(1) or 1110(2) does not require a large driving force, and thus a problem such as a positional error caused by heat is often not generated.

Therefore, the flip chip bonding apparatus 1 according to the present invention can be equipped The movement of the moving portion 1310a(1), 1310a(2), 1310b(1) or 1310b(2) is minimized, and both ends of the first transmission line 1100(1) or 1100(2) are restricted, thereby The first transfer line 1100(1) or 1100(2) parallel to the y-axis is transmitted in the x-axis direction.

As described above, the flip chip bonding operation of the flip chip bonding apparatus 1 according to the present invention can be divided into a flip chip which is rotated by the flip chip supply portion through the bonding head 1120 (1) or 1120 (2), a squeezing process of inverting the top surface and the bottom surface of the flip chip, impregnation of the flip chip by the soldering head 1120 (1) or 1120 (2) through the flux dipping unit, and impregnation by the solder for photographing The photographing process of the bottom surface image of the unit-impregnated flip chip, the position of the flip chip in which the photographing process is completed, and the soldering process of soldering the flip chip to the flip chip soldering portion. The position for performing these processes may be the flip-chip unit 210(1) or 210(2) of the flip chip supply portion, the flux dipping unit 400(1) or 400(2), the first visible unit 910(1) or 910 (2) and flip chip soldering portion 500.

As shown in "FIG. 1", in the flip chip bonding apparatus 1 according to the present invention, in order to minimize the movement of the moving portion, the flux dipping unit and the first visible unit are disposed in parallel to the first transfer line 1100 ( 1) or 1100 (2) (perpendicular to the second transfer line) on the same axis.

If the flux impregnation unit and the first visible unit are disposed parallel to the first transfer line 1100(1) or 1100(2), then the flux will be dipped In the process of transferring the element-impregnated flip chip to the first visible unit, it is not necessary to transfer or drive the moving portion.

Therefore, since it is not necessary to transport or drive the moving portion, when the above-described immersion and photographing processes are performed during the flip chip bonding work, the moving portion can prevent the generation of additional heat, and the time for cooling the moving portion can be ensured.

Further, since the working portion 1110(1) or 1110(2) of the flip chip bonding apparatus 1 according to the present invention and the acceleration above the moving portion up to several meters per second are accelerated, when the working portion 1110(1) or 1110 is 2) a change in the conveying direction of the working portion 1110 (1) or 1110 (2) in the process of carrying out the gripping position, the immersing position, the photographing position, and the welding position of the grasping, immersing, photographing, and welding processes as described above. At the time, due to the transfer inertia of the working portion 1110(1) or 1110(2), precise control of the position of the welding head 1120(1) or 1120(2) cannot be ensured.

If the positions of the gripping position, the immersing position, the photographing position, and the welding position in the x-axis direction are different from each other, for transferring the working portion 1110(1) or 1110 in the x-axis direction in the flip chip bonding work for soldering a flip chip. (2) That is, the number of times the moving portion of the welding head 1120 (1) or 1120 (2) is conveyed in the x-axis direction may be four times.

However, as shown in FIG. 1, only the working portion 1110(1) or 1110(2) can be transported along the y-axis direction along the first transfer line 1100(1) or 1100(2), and the first Transmission line 1100 (1) or 1100 (2) The combined moving portion is stopped, and the number of times of transporting the moving portion in the x-axis direction can be reduced to three times by the method of disposing the flux dipping unit and the first visible unit for transmitting the first transfer line 1100 (1). Or 1100(2) is conveyed below the path of the soldering tip 1120(1) or 1120(2) mounted on the working portion 1110(1) or 1110(2).

Since the time for cooling the heat generated in the driving process of the moving portion can be ensured when the number of times of movement of the moving portion in the x-axis direction is reduced once, the accuracy can be maintained by suppressing thermal deformation of the moving portion driving tool.

Of course, in order to minimize the number of transmissions and the number of changes in the direction of the moving portion, the positional error of the working portion 1110(1) or 1110(2) or the welding head 1120(1) or 1120(2) is minimized, and the flux is impregnated. The unit and the first visible unit may be disposed on the same axis parallel to the first transfer line 1100(1) or 1100(2) (perpendicular to the second transfer line).

In the embodiment shown in "Fig. 1", the flip chip supply portion and the flux dipping unit may be disposed on the same axis parallel to the second transfer line (perpendicular to the first transfer line).

If the flip chip supply portion and the solder dipping unit are disposed on the same axis parallel to the second transfer line, the soldering tip 1120(1) or 1120(2) can be supplied from the flip chip by transmitting or driving the second transfer line. Transfer to the flux impregnation unit, while the transfer of the working part 1110(1) or 1110(2) or The drive stops.

Although in comparison with the operating unit, in the transfer work section 1110 (1) The amount of heat generated in the process of 1110 (2) may not be large, but in order to minimize the number of transfers and the number of changes in the direction of the working portion 1110 (1) or 1110 (2), the flip chip supply portion and the flux impregnation The unit may be disposed on the same axis parallel to the second transfer line, in which case the working portion 1110(1) or 1110(2) is used in the soldering cycle for soldering a flip chip in the following manner. The number of times of transmission in the axial direction can be reduced to three times by disposing the flip chip supply portion and the flux dipping unit on the working portion 1110 (1) or 1110 (2) for transmission through the second transfer line. Below the path of the weld head 1120(1) or 1120(2).

The "second drawing" is a view showing a flip chip bonding apparatus 1 according to another embodiment of the present invention. Parts that overlap with the components described with reference to "Fig. 1" will be omitted.

As described above, the moving portion mounted on the second conveying line (in the second portion) due to the weight or the like of the first conveying line 1100(1) or 1100(2) as compared with the working portion 1110(1) or 1110(2) The first transmission line 1100(1) or 1100(2) on the transmission line is installed in a limited state) requires a larger driving force, and since the amount of heat generated by the driving force is large, it is necessary to make the number of transmissions or The transfer distance is minimized.

In the embodiment shown in "Fig. 2", in order to reduce When the flip-chip unit moves to the solder substrate 500, the flip-chip soldering portion moves in the x-axis direction, and the flip-chip unit 210, the solder dipping unit 400, and the first visible unit 910 may be disposed in a row on the y-axis.

As shown in FIG. 2, the flip chip supply portion, the flux dipping unit, and the first visible unit constituting the flip chip bonding apparatus 1 may be disposed in parallel to the first transfer line 1100(1) or 1100(2). On the same axis. That is to say, the process of operating or conveying the moving portion can be omitted in the processes of grasping, immersing, and photographing the flip chip.

Specifically, the flip chip supply portion includes a pair of flip-chip units for rotating the chip discharged from the wafer separation to reverse the top surface and the bottom surface, so that the soldering tip can be grasped The chip is mounted, which means that the flip-chip unit is disposed along with the flux impregnation unit and the first visible unit on the same axis parallel to the first transfer line 1100(1) or 1100(2).

Further, the flux dipping unit may be disposed between the flip chip unit and the first visible unit, so that the soldering head 1120(1) or 1120(2) performing the flip chip bonding process may be transported in one direction.

Therefore, in the case of the flip chip bonding apparatus 1 shown in FIG. 2, only the working portion 1110(1) or 1110(2) is along the y-axis along the first transfer line 1100(1) or 1100(2). The movement is transmitted in the direction, and the moving portion combined with the first conveying line 1100 (1) or 1100 (2) is stopped, and the number of times of transmission in the x-axis direction of the moving portion is reduced to two by the following method, A flip chip supply portion, a flux immersion unit, and a first visible unit that are sequentially parallel to the first transfer line 1100 (1) or 1100 (2) are disposed for transporting through the second transfer line to be mounted on the work portion 1110 (1) ) or 1110 (2) below the path of the solder joint 1120 (1) or 1120 (2).

Further, as shown in FIG. 1 and FIG. 2, in the working space, the flip chip unit, the flux immersion unit, and the first visible unit of the flip chip supply unit are provided in pairs. In addition, since the soldering heads 1120(1) or 1120(2) are also disposed in pairs, the process blank period can be minimized in the flip chip bonding work.

Further, in the workspace, the flip chip unit of the flip chip supply portion, the flux dipping unit, and the first visible unit are disposed in pairs, and because the pair of flip-chip units, the flux dipping unit, and the first visible unit are disposed in the first a corresponding position in the direction of the transmission line 1100 (1) or 1100 (2) (ie, disposed at the same height in the y-axis direction or at the same coordinate on the y-axis) and disposed on the second transmission line Symmetrical position in the direction (symmetric with respect to the center of the second transmission line in the y-axis direction or at the same distance from the center of the second transmission line), so that the control variable of the flip chip bonding apparatus can be simplified, and the control variable can be improved The handling of the flip chip soldering device.

If the pair of flip-chip units, the flux impregnation unit, and the first visible unit are disposed at symmetrical positions in the direction of the second transfer line, the flip-chip unit, the flux dipping unit, and the first visible unit may be spaced apart from each other by a predetermined distance Off, although the first transfer lines 1100(1) and 1100(2) respectively having the working portion 1110(1) or 1110(2) having the soldering tip 1120(1) or 1120(2) are close to each other, Physical interference is mitigated to some extent.

"3rd picture" is an enlarged view of the work area. As shown in FIG. 3, the second visible unit and the bonding head 1120(1) can be mounted on the working portion 1110(1) in parallel with the first transmission line 1100(1). This is done in order to obtain the soldering region sp of the solder substrate of the flip chip soldering portion earlier than the soldering tip 1120 (1), thereby making it easy to take.

The working portion 1110(1) having the welding head 1120(1) is mounted on the first transfer line 1100(1) and is transportable along the longitudinal direction (y-axis direction) of the first transfer line 1100(1). As described above, the first visible unit 910(1) can capture the bottom surface of the flip chip that is picked up by the soldering head 1120(1), and even when shooting a bottom surface image of a flip chip, Take at least two points.

However, when the entire image of a single flip chip is outside the field of view of the first viewable unit 910(1), it is not possible to take two or more points to obtain the positional information of the transferred flip chip.

In order to solve this problem, the soldering tip 1120(1) of the flip chip bonding apparatus 1 according to the present invention has a rotation function, and the first visible unit 910(1) can be configured to continuously photograph the conveyance by the bonding head 1120(1). Different parts of the flip chip.

That is, as shown in FIG. 3, while the flip chip is being grasped by the bonding head 1120(1), the bonding head 1120(1) may be configured to transmit through the first viewing unit 910 while rotating at a predetermined angle. (1) Above.

For example, when the entire image of the inspection target chip is outside the field of view of the first visible unit 910, the bottom surface image of the chip can be photographed and inspected while the soldering head 1120 is rotated at a predetermined angle, so that the first visible unit 910 can It is not necessary to take the two edges of the chip without moving in the x-axis direction.

Specifically, the soldering tip 1120(1) can pass through the first visible unit 910(1) while rotating at a predetermined angle, thereby absorbing the flip chip through the soldering tip 1120(1) while transmitting the first visible Unit 910(1) continuously captures two points of the two edges of the chip.

Specifically, the soldering tip 1120(1) can be rotated so that at each shooting time point of the first visible unit, both flip flops of the flip chip can be viewed while the flip chip is being grasped. The field is moved by the capture enthalpy, preferably, the flip chip is rotatable such that the y-axis direction of the first transmission line is parallel to the axis passing through the two corners of the flip chip.

The two images for inspection can be obtained from a flip chip by the following method, when the first vertex region p1(fc) of the rotated flip chip is captured in the field of view of the first visible unit The first image is taken, and the second image is taken when the second vertex region p2(fc) of the flip chip is captured in the field of view of the first visible unit.

In the process of capturing the first image and the second image, the working portion 1110(1) may transmit at a predetermined speed or photograph the shooting working portion 1110(1) when the transfer is stopped.

However, from the viewpoint of the efficiency of the soldering work (UPH, etc.), the inspection is performed by photographing in a process of transporting a flip chip at a predetermined speed (for example, at a uniform speed), in the process of immersing the flip chip in the flux. It is more advantageous to check by shooting and transfer the flip chip to the first visible unit when the transmission is stopped.

When the soldering tip immerses the flip chip at the solder dipping unit, and the immersed flip chip decelerates or stops at the first visible unit for inspection by shooting, if the load applied to the driving tool (such as the motor) is large , depending on the interruption and change of speed, the device may generate vibration. However, if the soldering tip immerses the flip chip at the solder dipping unit, and the immersed flip chip is transported at a constant speed to be inspected by shooting at the first visible unit, no application to the driving tool occurs ( For example, the load of the motor, and the device does not generate vibration, so it is advantageous from the viewpoint of the overall efficiency of the welding work.

Then, since the welding head unit needs to be stopped in the welding area, the speed should be gradually reduced, which will be described below with reference to "Fig. 7".

The image taken in this way is used as the positional information of the flip chip, and the skew position can be corrected in the soldering process of the flip chip soldering portion. Wait.

If the photographing by the first visible unit 910(1) is completed, the soldering tip 1120(1) can rotate the grabbed flip chip again in the soldering direction of the flip chip soldering portion.

Fig. 4 is a view showing two exemplary transport trajectories of the soldering tip of the flip chip bonding apparatus 1 according to the present invention.

The flip-chip units 201(1) and 210(2), the flux impregnation units 400(1) and 400(2), and the first visual units 910(1) and 910(2) are disposed in pairs in a symmetric position in the x-axis direction. Where the welding head provided at each working portion is used, through the flip-chip unit 201 (1) or 210 (2), the flux dipping unit 400 (1) or 400 (2), and the first visible unit 910 (1) Or 910 (2) after the steps of grasping, immersing, and photographing the flip chip, the flip chip soldering portion 500 can be used to solder the flip chip to the solder substrate.

Therefore, each movement trajectory of the welding head on the xy plane may have a pattern that is symmetrical with respect to the y-axis. Further, as described above, the work of soldering a flip chip can be divided into four detailed processes, and these processes are performed at different positions on the xy plane, if the solder joint is assumed to be along the position for performing these processes. If the shortest path is transmitted, the track of the soldering tip may have a rectangular shape. In this case, the flip chip bonding apparatus 1 according to the present invention will weld the flux dipping unit 400(1) or 400(2) and the first because the thermal expansion (especially the moving portion) is minimized. A viewing unit 910(1) or 910(2) is disposed in parallel with the first conveying line (y-axis), so the conveying trajectory of the welding head may have a section parallel to the first conveying line (y-axis).

In the embodiments shown in "Fig. 4(a)" and "Fig. 4(b)", the transfer trajectory of the welding head of one duty cycle has a rectangular shape, and the moving portion is along the first step when performing a duty cycle The second transmission line is transmitted three times. That is, if the process of grabbing the flip chip is the starting point of the work, the coordinates of the flip chip bonding head in the x-axis direction are changed as x2->x3->x3->x1. However, since the x-axis coordinate x3 of the welding head is all the same during the immersion and photographing processes, the number of movements of the moving portion in the x-axis direction is reduced from four times to three times during one duty cycle, thereby ensuring cooling. The amount of heat generated by the continuous driving or transport of the moving part driving tool. Further, since the problem of shaking or vibration caused by changing the direction of the welding head is solved, it is advantageous to perform position correction for an accurate photographing process and transmission photographing, and it is easy to simultaneously perform the welding head transfer process and the photographing process.

On the contrary, the position of the working portion along the first conveying line reflects the position in the y-axis direction, as shown in "4th (a)" and "4th (b)", it can be understood that the y-axis direction The position changed four times like y2->y1->y3->y4.

The two shown in Figure 4(a) and Figure 4(b) Each of the tracks shows that the track changes depending on the position of the flip-chip unit constituting the flip chip supply portion.

Further, since the welding position of the flip chip bonding portion 500 will be constantly changed on the solder substrate, the transfer trajectory for soldering each flip chip will continuously change depending on the bonding position on the flip chip bonding portion 500.

Fig. 5 is a view showing two other exemplary transport trajectories of the soldering tip of the flip chip bonding apparatus 1 according to the present invention. The portion overlapping with the portion described with reference to "Fig. 4" will be omitted.

Specifically, the transfer trajectory shown in the "Fig. 5(a)" may be the transfer trajectory of the soldering tip of the flip chip bonding apparatus 1 shown in Fig. 1, and the "Fig. 5(b)" The transfer trajectory shown may be the transfer trajectory of the soldering tip of the flip chip bonding apparatus 1 shown in "Fig. 2".

Although the transport track shown in "5th (a)" has a rectangular shape like the transfer track shown in "Fig. 4", the transfer track shown in "5th (a)" shows the next. An example is described in which the number of transmissions of the moving portion in the x-axis direction is three times, and the number of transmissions of the working portion in the y-axis direction is also reduced to three times.

Therefore, since the number of times of movement of the moving portion and the working portion in the x-axis direction and the number of times of transmission in the y-axis direction are reduced once, the moving portion driving due to the continuous driving of the moving portion and the working portion can be cooled. The heat of the tool prevents positional errors because the thermal deformation of the driving tool of the moving portion and the working portion can be prevented. Further, the vibration and shaking applied to the welding head or the like when the moving portion and the working portion are transferred can be reduced to some extent.

The transfer trajectory of the soldering tip shown in the "Fig. 5(b)" has a triangular shape. Since the flip-chip unit 210(1) or 210(2), the flux dipping unit 400(1) or 400(2), and the first visible unit 910(1) or 910(2) are disposed in parallel with the first transfer line, operation is performed The number of transmissions of the unit in the x-axis direction is reduced to two.

Another embodiment of the embodiment shown in the application "Fig. 2" is described. Refer to the diagram shown in "5(b)".

In order to reduce the x-axis direction transport path or the number of transfers between the working portion 1110(1) or 1110(2) and the solder substrate, the flip-chip unit 210(1) or 210(2), the flux dipping unit 400(1) or 400(2) and the first visual unit 910(1) or 910(2) are arranged in a row in the y-axis direction.

As will be described in further detail, the present invention includes a flip-chip unit 210(1) or 210(2), a working portion 1110(1) or 1110 (2) disposed in pairs at a position symmetrical with respect to the y-axis direction of the flip chip bonding portion. a flux impregnation unit 400(1) or 400(2), a first visible unit 910(1) or 910(2), and a first transfer line 1100(1) or 1100(2) so that flip chip soldering can be shared The portion 500, and the working portions 1110(1) and 1110(2) are poured through the half and half shared solder substrate on the flip chip soldering portion. Load chip soldering work.

That is, as shown in "Fig. 1" and "Fig. 2", the left side working portion 1110(1) among the working portions is such that the left side flip unit 210(1) and the left side flux impregnating unit 400 (1) ), the left first visible unit 910 (1) and the left half of the solder substrate (hereinafter referred to as the "first region" of the solder substrate) are transported in a loop, while the right working portion 1110 (2) is flipped on the right side. The unit 210 (2), the right flux impregnating unit 400 (2), the right first visible unit 910 (2), and the transport path of the right half of the solder substrate (hereinafter referred to as the "second region" of the solder substrate) are cyclically transferred, Each welding head 1120(1) and 1120(2) performs a welding operation.

Therefore, if near the middle of the first region of the solder substrate (relative to the length of the solder substrate in the x-axis direction, about a quarter of the distance from the left end of the solder substrate), the left flip-chip unit 210 (1) The left flux impregnation unit 400(1) and the left first visible unit 910(1) are disposed in a row on the y-axis, and an effect of minimizing the x-axis transmission path of the left working portion 1100(1) can be obtained. In the same manner, in the vicinity of the middle of the second region of the solder substrate (about three-quarters of the length from the left end of the solder substrate with respect to the length of the solder substrate in the x-axis direction), the right flip unit 210 (2) The right flux impregnation unit 400 (2) and the right first visual unit 910 (2) may be disposed in a row on the y-axis.

In this case, although the welding cycle is not separately shown in xy The transfer track on the plane, that is, the solder joint 1120(1) or 1120(2) of the working portion along the flip-chip unit 210(1) or 210(2), the flux dipping unit 400(1) or 400(2), A visual unit 910(1) or 910(2) and a flip chip soldering portion 500 pass, but the transport path may exhibit a triangle or straight edge that is much smaller than the transport path shown in FIG. 5(b) (straight section).

Therefore, since the transfer or driving of the moving portion is stopped when the welding head is in the gripping, immersing or photographing process, sufficient cooling time can be ensured, and the problem of positional error due to thermal expansion of the moving portion can be greatly alleviated. . In this case, the number of transmissions in the y-axis direction is not changed, four times.

However, since a relatively large driving force is not required to drive the moving portion, only a small amount of heat is generated by the driving moving portion. Therefore, since the result of the positional error due to heat is negligible, the practical benefit obtained by reducing the number of transmissions of the moving portion in the x-axis direction twice or once is large.

Summarizing "Fig. 4" and "Fig. 5", the trajectory of the welding cycle on the xy plane is formed into a triangle or a rectangle, wherein the welding head of the working portion is along the flip chip supply portion, the flux impregnation unit 400 (1) or 400 ( 2), the first visible unit 910 (1) or 910 (2) and the flux impregnation unit 400 (1) or 400 (2) are transferred, and at least one side of a triangle or a rectangle forming the trajectory may be coupled to the first transmission line or The second transfer line is parallel.

It can be determined that the welding head sequentially passes through the flux impregnation unit 400(1) or 400(2) and the first visual unit 910 when the welding head is conveyed along a triangular or rectangular edge forming a track parallel to the first conveying line. 1) or 910(2), or sequentially through the flip chip supply, flux impregnation unit 400(1) or 400(2), and first visual unit 910(1) or 910(2).

The position of at least one of the vertices forming the trajectory of the triangle or the vertex of the rectangle may be changed in each welding cycle, and the position at which the position of the apex changes may correspond to the flip chip bonding portion 500.

The fact that at least one side of the triangle or rectangle in which the trajectory of the welding head is formed is parallel to the first conveying line or the second conveying line means that there is a section in which the working unit or the operating unit does not operate as described above.

Fig. 6 is a view showing still another example of the conveyance trajectory of the welding head of the flip chip bonding apparatus according to the present invention. The portions overlapping with the portions described with reference to "Fig. 4" and "Fig. 5" will be omitted.

The control portion of the flip chip bonding apparatus according to the present invention can drive the driving tool of the working portion such that the working portion can be transferred from the flux impregnation unit 400(1) or 400(2) to the first visual unit 910(1) or When the 910(2) is transmitted over the first visual unit 910(1) or 910(2), the working portion is transmitted at a constant speed. As described above, although the first visible unit 910(1) or 910(2) can photograph the bottom of the flip chip passing over the first visible unit 910(1) or 910(2) when the soldering head is stopped by the moving portion Surface, but for welding The efficiency of the work can be performed simultaneously with the transfer process of the transfer soldering head and the photographing process of the first visible unit 910(1) or 910(2).

That is, the first visible unit 910(1) or 910(2) can perform the photographing process while the welding head is being conveyed without stopping.

Because the second section B in "6th (a)" and "6th (b)" is to transfer the welding head from the flux impregnation unit 400(1) or 400(2) to the first visual unit 910 ( 1) or 910 (2), so as described above, the welding head can be conveyed at a constant speed.

However, the welding work at the weld head 1120 should be performed while the weld head is stopped. Therefore, in "Fig. 6(a)" and "Fig. 6(b)", the working portion should be decelerated in the third segment C after the second segment B in the y-axis direction. Of course, although the working portion can be suddenly stopped at the flip chip bonding portion and continue to be driven at a constant speed, in order to minimize the shock applied to the bonding head, the method of gradually reducing the speed of the working portion can be controlled, and Not suddenly stopped working.

In "6th (a)" and "6th (b)", since the stopped moving part should be transported along the x-axis direction as far as |x3-x1| or |x2-x1|, the working part should The stop state is accelerated and transmitted, 幷 decelerated and stopped again at the flip chip soldering.

That is, since the working portion and the moving portion have different speed change rates in the third segment C, respectively, unlike the fourth segment D, The trajectory of the welding head may be a curve, not a straight line, and the trajectory of the welding head may have a shape of a line that curves outward from the entire conveying trajectory.

That is, in the third section C, although the initial speed of the working portion is faster, the speed is decreased, and since the speed of the moving portion shows a pattern which increases from a zero state to a certain degree and then decreases, the welding head The trajectory can be formed as a curved trajectory.

The first section A in which the welding head is transferred from the flip-chip unit 210(1) or 210(2) to the flux impregnation unit 400(1) or 400(2) may be configured to drive only the moving portion and the working portion is stopped, or configured The driving unit is driven only and the moving unit is stopped, as described above.

Further, in the embodiment shown in "Fig. 6(b)", After changing the direction in the fourth section D, since the solder dipping unit 400(1) or 400(2) and the soldering tip are disposed in a row at the flip-chip unit 210(1) or 210(2), the soldering tip can be The first section A is accelerated at a constant speed, which is the conveying speed of the welding head in the photographing process.

Fig. 7 is a block diagram showing the flip chip bonding apparatus 1 according to the present invention. The flip chip bonding apparatus 1 according to the present invention may include: a soldering head 1120(1) or 1120(2) for grasping, transferring, and soldering a flip chip; a first transfer line 1100 and a second transfer line 1300, The welding head 1120(1) or 1120(2) is transported along the predetermined conveying path by mounting the welding head 1120(1) or 1120(2); the first visual unit 910 and the second visible sheet a member 1130 for photographing a flip chip or a flip chip soldering substrate grasped by the bonding head 1120 (1) or 1120 (2); a flip chip bonding portion 500 for arranging the solder substrate; and a control portion for Control the soldering head 1120 (1) or 1120 (2), the transmitting portion 600, and the first visual unit 910 and the second visual unit 1130, and correct the flip chip according to the images captured by the first visual unit 910 and the second visual unit 1130. The error of the welding position, 幷 control welding work.

Here, according to the comparison information or algorithm stored in the memory 860 of the control unit, the processing device 810 of the control unit compares or processes the image of the chip or the solder substrate captured by the first visible unit 910 and the second visible unit 1130, and generates The control signal for accurately soldering the chip, and the soldering tip 1120(1) or 1120(2) or the flip chip soldering portion 500 can be precisely controlled.

Depending on the positional error and direction error of the captured flip chip or the placed solder substrate, the distance, angle or direction that should be corrected during the soldering process can be some examples of control signals.

Further, the flip chip bonding apparatus 1 according to the present invention may further include the wafer supplier 100, the flip chip supply portion 200, the flux dipping unit 400, and the flip chip bonding portion 500 as described above, and the solder for releasing the soldering a solder substrate release portion of the substrate, and each component receives a control signal transmitted from the control portion 800 of the flip chip bonding apparatus 1 The status information of the components is made such that the welding process can be continuous without predetermined disturbances or interruptions.

Therefore, each component should be understood to include the concept of the required sensor and drive unit, and the sensing information or status information provided by the component is stored or updated in the memory 860 of the control unit. The processing unit 810 of the portion generates a new control signal.

The welding head 1120(1) or 1120(2) is mounted on the working portion 1110(1) or 1110(2), and the working portion 1110(1) or 1110(2) is mounted on the first conveying line 1100(1) or 1100 ( 2) Up, whereby the working portion 1110(1) or 1110(2) can be transferred, and both ends of the first transfer line 1100(1) or 1100(2) are attached to the second transfer line by the moving portion.

The working portion 1110(1) or 1110(2) of the first transmission line 1100(1) or 1100(2) and the moving portion of the second transmission line as described with reference to "Fig. 1" and "Fig. 2" Do not have a driving tool, and when the working portion 1110 (1) or 1110 (2) or the welding head 1120 (1) or 1120 (2) is transferred from the flux impregnation unit to the first visual unit or when transported over the first visual unit The control unit for controlling the driving tool can drive the driving tool of the working portion 1110(1) or 1110(2) and stop the driving tool of the moving portion.

In this case, the flux impregnation unit and the first visible unit may be disposed on the same axis parallel to the first transfer line 1100(1) or 1100(2).

The working portion 1110(1) or 1110(2) and the moving portion respectively have means for transmitting the working portion 1110(1) or 1110(2) on the first transfer line 1100(1) or 1100(2) and the second transfer line, and a driving tool for the moving portion, and for controlling the working portion 1110(1) or 1110 when the working portion 1110(1) or 1110(2) is transferred from the flux impregnation unit to the first visual unit or transmitted over the first visual unit (2) The control unit of the driving tool of the moving unit can drive the driving tool of the working unit 1110(1) or 1110(2) and stop the driving tool of the moving unit. Therefore, during the soldering cycle, the soldering head 1120(1) or 1120(2) of the working portion 1110(1) or 1110(2) is along the flip chip supply portion, the flux dipping unit, the first visible unit, and the flip chip During the transfer of the chip soldering portion, the number of times of driving of the moving portion may be less than the number of driving of the working portion 1110 (1) or 1110 (2).

Although the embodiment shown in FIG. 8 and subsequent figures is the same as the embodiment described above with reference to FIG. 2, the flip-chip unit 210, the flux dipping unit 400, and the first visible unit 910 are disposed parallel to y. The first transfer line of the shaft is identical in parallel, but the welding device can be configured such that a position for performing the following steps is included on the track transported in one direction by the weld head, the step being to grab the flip chip The step of immersing the flip chip in the flux and inspecting the gripping position, or the welding device can be configured to reciprocally transfer the solder joint as needed to change the direction of the transport path on the line.

Therefore, the embodiment shown in "Fig. 8" and the subsequent figures is the latter case. In the portions described with reference to "Fig. 8" and the following other figures, the portions overlapping with the portions described with reference to "Fig. 1" to "Fig. 7" will be omitted.

The implementation forces shown in "Fig. 1" to "Fig. 7" focus on the method of driving the number of times of moving the working portion or moving portion of the welding head on the xy plane, changing the driving direction. The number of times, or the positional error of the working part or the moving part, is minimized, and the implementation force described below is a specific embodiment of a method which, in addition to minimizing the distance and number of times the welding head is conveyed, Reducing the distance between the components of the welding device increases the space utilization and solves the problem of interference between components caused by reducing the distance.

In the flip chip bonding apparatus shown in FIG. 8 and subsequent figures, in order to reduce the number of movements or distances of the soldering head in the x-axis direction, the first visible unit and the flux dipping unit may be disposed on the y-axis. The first visible unit, the flux impregnation unit, and the flip-chip unit may be disposed on the same axis parallel to the y-axis direction on the same axis in which the directions are parallel, or in order to reduce the number or distance of movement of the bonding head in the x-axis direction.

The working portion 1110(1) or 1110(2) of the embodiment shown in "Fig. 8" and "Fig. 9" may include: a welding head 1120(1) or 1120(2) for grasping a top surface thereof And the bottom surface through the flip-chip unit 210 (1) Or 210(2) flipped chip fc; and second visible unit 1130(1) or 1130(2) arranged to be spaced apart from solder joint 1120(1) or 1120(2) by a predetermined distance d in one direction.

Further, the flip chip bonding apparatus 1 includes at least one alignment information providing portion including a reference mark FM, and the alignment information providing portion can be given to the working portion 1110(1) or 1110 (2) The second visual unit 1130(1) or 1130(2) provided in the ) provides positional information of the fiducial marker.

Meanwhile, the working portion 1110(1) or 1110(2) is disposed above the flip-chip unit 210(1) or 210(2) and at the flux dipping unit 400(1) or 400(2), the first visible unit 910 ( 1) or 910 (2) and the rise and fall of the welded portion 500, and the working portion 1110 (1) or 1110 (2) at the welded portion 500, the first visible unit 910 (1) or 910 (2), the flux impregnating unit A translational movement between 400(1) or 400(2) and flip-chip unit 210(1) or 210(2).

Specifically, as shown in FIG. 8, the working portion 1110(1) or 1110(2) is assembled along the first transfer line 1100(1) or 1100(2) in the y-axis direction and along the second The transfer line 1300(1) or 1300(2) moves in the x-axis direction.

Further, the soldering head 1120(1) or 1120(2) and the second visible unit 1130(1) or 1130(2) are disposed at the working portion 1110(1) or 1110 (2), so that when the working portion 1110 (1) or 1110 (2) is transferred, the welding head 1120 (1) or 1120 (2) and the second visible unit 1130 (1) or 1130 (2) with the work portion 1110(1) or 1110(2) are transmitted together to a predetermined position on the xy plane.

Further, the flip chip supply portion 200, the flux dipping unit 400(1) or 400(2), the flip-chip unit 210(1) or 210(2), and the soldering portion 500 may be disposed by the first transfer line 1100(1) Or 1100 (2) and the second transmission line 1300 (1) or 1300 (2) formed in the space on the xy plane.

Referring to "Fig. 8", the flip-chip unit 210(1) or 210(2), the flux dipping unit 400(1) or 400(2), the working portion 1110(1) or 1110(2), and the first visual unit 910 (1) or 910(2) may have the same structure arranged in pairs at positions symmetrical with respect to the y-axis, and the working portions 1110(1) or 1110(2) may be respectively mounted on second transmission lines parallel to each other On 1300 (1) or 1300 (2), so as to move along the y axis. Hereinafter, for convenience of explanation, only one welding head 1120 (1), one flip-chip unit 210 (1), one flux impregnation unit 400 (1), and one first visible unit 910 (1) will be described.

Referring to FIG. 9, the soldering tip 1120(1) may include: an adsorption head 1121 for grasping a chip by directly providing a vacuum adsorption force to the chip; and a connecting member 415 for connecting the adsorption head 1121 to the soldering tip The main body of 1120(1) provides a vacuum adsorption force to the adsorption head 1121. The adsorption head 1121 can be configured to rotate the grasped chip fc clockwise or counterclockwise with respect to the z-axis. because Thus, the adsorption head 1121 can correct the position of the chip θ (theta) under the control of the control unit.

The second viewing unit 1130(1) can be assembled to be spaced apart from the welding head 1120(1) of the working portion 1110(1) by a predetermined distance d in one direction. The second visible unit 1130(1) may be disposed to place the lens surface of the second visible unit 1130(1) at a position higher than the adsorption surface of the adsorption head 1121 of the soldering tip 1120(1), so that when the soldering head 1120 ( 1) Spatial interference with the second visible unit 1130(1) is not generated when the chip is grasped or the chip fc is immersed in the flux f.

The second visual unit 1130(1) can acquire position information of the reference mark FM from the above-described alignment information providing portion, acquire position information of each chip fc from the wafer w, and acquire the position information on the welding substrate bs from the welding portion 500. Information on the reference soldering position of the chip fc is mounted.

The position information acquired through the second visual unit 1130(1) or 1130(2) is transmitted to the control unit, and the control unit can move the welding head 1120(1) or 1120(2) by calculating the position information. The position of the chip is corrected for x-axis, y-axis, and θ(theta).

Further, the first visible unit 910 for photographing the adsorption head 1121 of the bonding head 1120(1) or 1120(2) and the chip fc in the upward viewing direction from the bottom of the bonding head 1120(1) or 1120(2) ( 1) or 910 (2) can be set on the moving path of the working part 1110 (1) or 1110 (2), work The portion 1110(1) or 1110(2) moves back and forth between the flux impregnation unit 400(1) or 400(2) and the welded portion 500.

The first visual unit 910(1) or 910(2) is a camera for acquiring position information of a chip fc to be used by the soldering head 1120(1) or 1120(2), in particular, the first visual unit 910(1) or 910(2) can record whether the center of the adsorption head 1121 of the soldering head 1120(1) or 1120(2) is aligned with the center of the chip fc, and the soldering head 1120(1) or 1120(2) is adsorbed. The distance at which the center of the head 1121 is offset from the center of the chip fc, the angle at which the chip fc is offset from the adsorption head 1121 of the bonding head 1120(1) or 1120(2), and the alignment state of the bump formed at the chip fc Wait.

Meanwhile, the first visible unit 910(1) or 910(2) may be disposed under the conveying path of the welding head 1120(1) or 1120(2) to photograph in the upward viewing direction, and as described above, first The visual unit 910(1) or 910(2) can acquire the positional information of the transferred chip fc by photographing the bottom surface of the chip fc grasped by the bonding head 1120(1) or 1120(2).

Further, although the first visual unit 910(1) or 910(2) can transmit only one point of the bottom surface of the transferred chip fc, the skew (rotation) degree of the chip and the specificity are determined according to the initial input position information of the chip. Displacement in the direction, but preferably by extracting regions of two or more points to extract a more accurate image.

In addition, if the chip is in the first visual unit 910(1) or 910 In the field of view (FOV) of (2), the position of the chip can be obtained from an image obtained by taking two points (shot photographing) at a time. However, when the chip does not conform to the field of view (FOV) of the first visual unit 910(1) or 910(2), two points can be taken by taking two photographs. As described above, the chip fc whose bottom surface is immersed in the flux by the flux impregnation unit 400(1) or 400(2) is transferred to the welded portion 500 while being grasped by the bonding head 1120(1), and may be at the welded portion 500. A solder substrate on which the chip fc is mounted is prepared.

Meanwhile, the control portion controls the flip-chip unit 210(1) or 210(2), the soldering head 1120(1) or 1120(2), and the flux dipping unit 400(1) or 400(2), and in particular, the control portion may be The position information acquired by the first visible unit 910(1) or 910(2), the second visible unit 1130(1) or 1130(2), and the alignment visible unit 12, and the chip is continuously corrected by the soldering portion 500 relative to the soldering The position of the reference welding position (mounting area) of the substrate bs.

That is, the control unit may perform the chip fc according to the position information acquired through the first visual unit 910(1) or 910(2), the second visual unit 1130(1) or 1130(2), and the alignment visual unit 12. The position information is subjected to x-axis correction, y-axis correction, and θ(theta) correction.

In addition, the control unit may obtain the information according to the at least one alignment information providing unit acquired through the second visual unit 1130(1) or 1130(2). The position information is calculated as each device constituting the flip chip bonding apparatus 1 (for example, the flip-chip unit 210 (1), the soldering head 1120 (1), the solder dipping unit 400 (1), the soldering portion 500, and the flip chip The skewness (error value) of the device caused by the heat supply deformation of the supply portion 200, the wafer feeder 100, and the first and second transfer lines), and the reference welding region of the solder substrate bs is accurately calculated when the soldering operation is performed. The position 幷 adjusts the reference coordinates of the soldering tip 1120(1) to correct the position of the chip fc.

At the same time, as described above, the welding head 1120(1) is arranged to be transportable to a predetermined position on the xy plane, which may be conveyed along the gantry structure for this purpose. At this point, vibration is generated due to the rapid repeated transfer of the welding head 1120(1), and even the gantry driving motor for driving the gantry is overloaded, so that thermal deformation can be generated. The vibration and thermal deformation as described above may affect the accuracy and reliability of the welding process, and preferably, the number of transmissions and/or the transmission distance of the welding head 1120(1) in a specific axial direction is reduced, in particular, preferably reduced The number of transfers in the x-axis direction.

Similar to the above embodiment, in the embodiment shown in FIG. 10 and FIG. 11, the flux impregnation unit 400(1) or 400(2) and the first visual unit 910(1) or 910(2) ) may be respectively disposed on a specific axis L parallel to the first transfer line (y-axis direction) of the working portion 1110 (1) or 1110 (2), and the flip-chip unit 210, the flux dipping unit 400 (1) or 400 (2) and the first visual unit 910(1) or 910(2) may be respectively disposed at On a specific axis L parallel to the y-axis direction. With this configuration, the number of times the welding head 1120(1) is conveyed in the x-axis direction can be reduced once or twice.

Since the number of transmissions in the x-axis direction is reduced, the overload of the gantry driving portion can be prevented, and thermal deformation caused by the overload can be suppressed, and the vibration generated in the device can be reduced.

Referring to "Fig. 8" to "Fig. 10", the first visible unit 910 (1), the flux impregnation unit 400 (1), and the flip-chip unit 210 (1) may be disposed to be spaced apart from each other by a predetermined distance in the y-axis direction. .

The first visual unit 910(1) photographs the chip fc to confirm the position information of the chip and the state of applying the flux, and after the photographing is completed, the soldering head 1120(1) can transfer the chip fc to the soldering portion 500.

Wherein, if the first visible unit 910(1) and the flux impregnation unit 400(1) are not respectively disposed on a specific axis L parallel to the y-axis direction, the solder joint should be transferred at least once in the x-axis direction, thereby After the fc is immersed in the flux, the solder joint is photographed by the first visible unit 910(1), and this x-axis direction transport causes thermal deformation or vibration as described above.

Further, when the first visible unit 910(1), the flux impregnation unit 400(1), and the flip-chip unit 210 are not respectively disposed on a specific axis L parallel to the y-axis direction, in order to receive from the flip-chip unit 210(1) The chip fc immerses the bump formed on the bottom surface of the chip fc in the solder and is shot by the first visible unit 910(1) after the chip fc is immersed in the solder The joint, the weld head should be conveyed at least nine times in the x-axis direction, and such x-axis direction transport causes thermal deformation or vibration as described above.

To this end, in the flip chip bonding apparatus 1 according to the present invention, the first visible unit 910(1) and the flux impregnation unit 400(1) are respectively disposed on a specific axis L parallel to the y-axis direction, and the transmission is reduced by x. The number of transmissions in the axial direction effectively prevents thermal deformation and vibration of the welding device 1.

Further, the first visible unit 910 (1), the flux impregnation unit 400 (1), and the flip-chip unit 210 (1) are respectively disposed on a specific axis L parallel to the y-axis direction, and the transmission can be reduced by the number of transmissions in the x-axis direction. The thermal deformation and vibration of the flip chip bonding apparatus 1 are effectively prevented.

Further, a recess 410a for accommodating the flux f is provided at the flux receiver 410 of the flux impregnation unit 400(1), and when the flux receiver 410 is slid forward for flux impregnation, the recess 410a is The first visible unit 910(1) may be respectively disposed on a specific axis L parallel to the y-axis direction.

Here, referring to FIG. 10, the flux scraper (b1ade) 412 may be disposed in the x-axis direction at a predetermined distance from a specific axis L parallel to the y-axis direction. Only when the flux receiver 410 is slid forward, the recess 410a for providing the flux-impregnated working space and the first visible unit 910(1) may be respectively disposed on a specific axis L parallel to the y-axis direction.

In the flip chip bonding apparatus 1 having such a structure, In the process of transporting the bonding head 1120(1) along the specific axis L parallel to the y-axis direction, the first visible unit 910(1) can capture an image without transmitting or stopping the operation in the x-axis direction.

Further, in the flip chip bonding apparatus 1 having such a structure, the following process can be performed in the process of transferring the bonding head 1120 (1) along a specific axis L parallel to the y-axis direction, that is, the chip is grabbed, the chip is taken Immerse in the flux and shoot the chip.

That is, since each process can be sequentially performed in the process of transporting the bonding head 1120(1) in the y-axis direction without being transmitted in the x-axis direction, thermal deformation and vibration of the welding device 1 can be effectively prevented. .

Further, the flip chip bonding apparatus 1 relating to an embodiment of the present invention can reduce the transmission distance in a specific axial direction, for example, can reduce the transmission distance in the y-axis direction. As described above, the first visible unit 910(1), the flux impregnation unit 400(1), and the flip-chip unit 210(1) are disposed to be spaced apart from each other by a predetermined distance in the y-axis direction, and in order to reduce the y-axis direction. The conveyance distance, the first visible unit 910(1), the flux impregnation unit 400(1), and the flip-chip unit 210(1) may be disposed close to each other.

Hereinafter, the following structure will be described in detail with reference to the accompanying drawings, in order to reduce the conveying distance of the welding head 1120 (1) in the y-axis direction, this structure is used for the flux impregnation unit 400 (1) and the flip-chip unit 210 (1) ) set to be close to each other.

The flux impregnating unit 400(1) may include a flux receiver 410 that accommodates the flux f for impregnating the chip fc, a flux blade 412 for flattening the flux f, and a second driving portion for sliding the moving flux receiver 410. 413.

That is, the flux impregnation unit 400(1) has a structure in which the flux receiver 410 is slidably moved for flux impregnation to flatten the flux.

For reference, the prior art flux impregnation unit 400(1) has the problem that since the flux receiver 410 is engaged with the flux scraper 412 using a knob in order to flatten the flux on the flux receiver 410, The height of the knob creates interference during operation. Although the flux impregnation work is not performed, the flux impregnation unit 400(1) should continuously perform the work of flattening the flux in real time due to a special working environment such as the flow state of the flux. However, as described above, in order to check whether or not an error 幷 correction skew value is generated in the set value of the welding head 1120(1), the welding head is at the first visible unit 910(1), the second visible unit 1130(1), and the correction unit 700. (1) moving back and forth between, at this point, because interference occurs between the flux impregnation unit 400(1) and the knob, and the flux impregnation unit 400(1) should be combined with the first visual unit 910(1) and the correction unit The 700(1) is spaced apart so that there is no interference, so there is a limit to the setting.

In addition, due to the driving part of the flip-chip unit 210 (1) (including Due to various electrical components and vacuum lines, it is difficult to arrange the flip-chip unit 210(1) and the flux impregnation unit 400(1) to be close to each other. In the present invention, the flux impregnation unit 400(1), the first visible unit 910(1), and the correction unit 700(1) may be disposed to be placed close to each other to the maximum extent, while the welding head 1120(1) performs the correction work without Interference is generated at the flux impregnation unit 400(1), and by disposing the flip-chip unit 210(1) and the flux impregnation unit 400(1) close to each other, the weld head 1120(1) can be reduced in the y-axis direction. The moving distance thus reduces the overall UPH.

Referring to "Fig. 14" and "Fig. 15", the flux impregnation unit 400 (1) includes a main body 414 having a second driving portion 413 and a mounting unit 420 for mounting the flux scraper 412 on the main body 414, and In an embodiment, the body 414 can include a lower outer casing 415 disposed on the mounting surface and an upper outer casing 416 attached to the lower outer casing 415. The flux receiver 410 is slidably movable through the space generated by the lower casing 415 and the upper casing 416, and the mounting unit 420 may be disposed at the upper casing 416 or the lower casing 415.

At this point, the flux receiver 410 can move forward and backward relative to the flux scraper 412. The flux receiver 410 may protrude toward the outside of the body 414 as the flux receiver 410 moves forward.

That is, when the flux receiver 410 is slid forward for flux immersion, the flux receiver 410 protrudes toward the outside of the body 414, and when the flux receiver 410 is slid forward and backward for flattening the flux, The flux receiver 410 can be inserted into the body 414.

Wherein, when the solder receiver 410 protrudes toward the outside of the body 414, the flux receiver 410 and the first driving portion 211(1) of the flip-chip unit 210(1) may be disposed to overlap at least some regions on the xy plane.

Referring to FIG. 15, when the flux receiver 410 is slid forward, the first space S1 and the second space S2 may be respectively provided at the top and bottom of the flux receiver 410.

In this regard, referring to FIG. 12, the first driving portion 211(1) of the flip-chip unit 210(1) may be disposed in the second space S2, including the housing 213 (1) disposed in the second space. A cable and a vacuum line connected to the flip-chip unit 210(1) may be disposed in the outer casing 213(1). That is, since a plurality of full-length elements and vacuum lines associated with the flip-chip unit 210(1) are disposed within a single housing 213(1), the single housing 213(1) is to be formed in the solder receiver In the second space S2 below 410, the dead space of the welding device 1 can be reduced, and space utilization is improved.

As described above, when the flux receiver 410 is slid forward for flux immersion, the recess 410a, the first visible unit 910(1), and the flip-chip unit 210(1) may be respectively disposed at specific axes parallel to the y-axis direction. L, and the flux scraper 412 may be disposed to be spaced apart from the specific axis L parallel to the y-axis direction by a predetermined distance in the x-axis direction.

In addition, through the first driving portion of the flip-chip unit 210 (1) 211 (1) is disposed in the second space S2 formed under the flux receiver 410, and the flip-chip unit 210 (1) and the flux dipping unit 400 (1) are disposed close to each other in the y-axis direction, and the flux dipping unit 400 (1) And the flip-chip unit 210(1) can be assembled such that the flip-chip unit 210(1) and the recess 410a of the solder receiver 410 can be disposed on a specific axis L parallel to the y-axis direction.

Therefore, with the above configuration, the number of transmissions in the x-axis direction can be reduced, and the moving distance in the y-axis direction can be reduced, and the space utilization ratio of the flip chip bonding apparatus 1 can be improved.

Meanwhile, referring to "Fig. 12" and "Fig. 16", when the flux receiver 410 is slid forward, so that the chip fc is flux immersed, the first space S1 is provided above and below the flux receiver 410, respectively. In the second space S2, the welding head 1120(1) can enter the first space S1.

In addition, the weld head 1120(1) can enter the first space S1 as the flux receiver 410 moves backwards. If the flux receiver 410 is slid forward and backward, the flux can be flattened.

Meanwhile, if it is assumed that the flux scraper 412 is moved instead of the slide moving flux receiver 410, the first space disappears when the flux scraper 412 is slidably moved to the concave portion 410a of the flux receiver 410 for flattening the flux. In such a configuration, the solder joint 1120(1) does not enter the solder receiver 410 until the flux scraper 412 has finished solder flattening. If the entry time point of the soldering tip 1120(1) is interfered with the solder blade 412 like this With restrictions, the UPH of the entire device will be affected. Furthermore, in order to avoid interference between the welding head 1120(1) and the flux scraper 412, the time for flattening should be reduced.

Therefore, because if the flux receiver 410 of the flux impregnation unit 400(1) has a sliding movement structure, the welding head 1120(1) can enter the first space S1 in the case where the flux is impregnated or the flux is flattened, so the welding is eliminated. The waiting time for the head 1120(1) to enter can ensure sufficient time for the flux to flatten, and at the same time, the UPH of the entire device can be increased.

Meanwhile, the mounting unit 420 may include a rail member 421 for mounting the dip plate 410, a first support member 422 or 424 hingedly connected with the rail member 421, and an upper portion of the support solder scraper 412, and a hinged connection with the first support member 422 The second support member 423 supporting the front side of the flux scraper 412 is h2.

In an embodiment, the first support member 422 or 424 is hingedly coupled with the rail member 421, h1, and may include a first support member 424 for applying a lower portion of the protrusion 412a of the flux scraper 412 and hinged with the second support member 423. The first support member 422 of the upper portion of the h2 is connected. At this point, a portion of the lower member 424 can be inserted into the second support member 423.

Meanwhile, the mounting unit 420 may perform a function of applying a specific adhesion force (pressure) for flattening the flux between the pressing member flux blade 412 and the flux receiver 410. To this end, the mounting unit 420 can include A first elastic member 425 disposed between the first support member 422 or 424 and the rail portion 421 and a second elastic member 426 disposed between the second support member 423 and the first support member 422 or 424.

In an embodiment, the first elastic member 425 may be disposed between the first support member 422 of the upper portion of the first support members 422 and 424 and the lower first support member 424, and the second elastic member 426 may be disposed at the upper portion. Between the first support member 422 and the second support member 423.

In addition, when the second support member 423 is mounted on the rail member 421, the first elastic member 425 and the second elastic member 426 can provide elastic force to the flux scraper 412 from different directions. In one embodiment, the first elastic member 425 can be Providing an elastic force in the z-axis direction, the second elastic member 426 can provide an elastic force in the x-axis direction.

Since the elastic force in different directions is provided, a constant pressure can be maintained in the flux scraper 412 and the flux receiver 410 to ensure the reliability of the flux flattening process.

At the same time, a latching projection 423a is provided at the second support member 423, and a locking step 421a coupled with the locking projection 423a may be provided at the rail member 421. At this point, the locking step 421a can be located on one side of the body 414. Since the joint portions (423a and 421a) of the mounting unit 420 are not provided on the main body 414 but on one side as described above, it is possible to prevent the joint with the welding head 1120(1) from being dried. Disturb.

Meanwhile, referring to "Fig. 12" and "Fig. 16", as described above, the flux receiver 410 can be slid forward from the flux scraper 412 so that the flux is impregnated, and the crucible is moved forward and backward with respect to the flux scraper 412 so that the flux is fluxed. Flatten.

At this point, when the flux receiver 410 is slid forward from the flux scraper 412, the flux receiver 410 moves in a direction away from the second driving portion 413, and when the flux receiver 410 slides backward from the flux scraper 412, The flux receiver 410 moves in a direction approaching the second driving portion 413.

Referring to "Fig. 12", a bump pattern 11 having a predetermined pitch P is provided on the chip fc, and a concave portion 410a containing the flux f may be disposed at the solder receiver 410 of the flux dipping unit 400(1). As described above, the flux receiver 410 is movable forward and backward relative to the flux scraper 412. If the flux receiver 410 is slid forward from the flux blade 412 so as to be flux immersed (see "Fig. 16(a))), in order to apply the flux f on the bump pattern 11, the soldering head 1120 of the chip fc is grasped (1) The recess 410a of the flux receiver 410 can be lifted. Then, if flux coating or immersion is performed on any of the chips fc, the flux receiver 410 is slid forward and backward with respect to the flux squeegee 412 to flatten the flux (see "Fig. 16(b))).

Meanwhile, the flux dipping unit 400 (1) having a structure capable of sliding the moving flux receiver 410 has a flattening of the flux of the solder receiver 410 The effect is that the flux can be applied uniformly.

Specifically, referring to FIG. 12, if the flux f is immersed on any one of the chips fc, the pattern of the concave portion 31 corresponding to the bump pattern 11 having the predetermined pitch P is formed at the flux f included in the concave portion 410a. . Such a pattern of the recess 31 may be referred to as a first impregnation area.

In this case, if the flux application to the next chip is performed on the concave portion 31, the bump of the next chip may not be uniformly applied with an appropriate amount of the flux f due to the concave portion 31. That is, even after the sliding movement of the flux receiver 410 is completed to flatten the flux, the recess 31 may not be uniformly flattened. Specifically, although the flux can be flattened by the sliding movement of the solder receiver 410, depending on the amount or state of the flux or the adhesion of the flux blade and the solder receiver, only one flattening operation may not cause all the recesses. 31 evenly flattened.

The flux receiver can be controlled to slide the solder receiver to slide a little more distance than the pitch P of the bump pattern (e.g., half the pitch of the bump pattern), or to slide the solder receiver to slide a little less the distance Therefore, the concave portion 31 of the first impregnation region corresponding to the flux impregnation of the previous chip fc may not overlap with the concave portion 31 of the second impregnation region corresponding to the flux impregnation of the next chip.

Because of the sliding movement structure of the flux receiver 410, the area other than the concave portion 31 formed by the bump 11 of the previous chip fc (flat In the region), the flux immersion of the next chip is performed, so that the uncertainty generated in the flattening process can be eliminated, and therefore, the reliability of the flux immersing process which is continuously performed on a plurality of chips can be improved.

Meanwhile, referring to "Fig. 12" and "17th", the flip chip bonding apparatus 1 may additionally include a pressure control device 215, so that it is easy to sense whether or not the chip fc is grasped.

For example, the pressure control device 215 can be coupled to the flip-chip unit 210(1), and the pressure control device 215 can be easily sensed to capture the chip fc.

Further, the flip chip bonding apparatus 1 may additionally include a pressure sensor 214 disposed between the bonding head 1120(1) and the pressure control device 215.

As described above, when the chip fc is grasped, the soldering head 1120 (1) and the flip-chip unit 210 (1) perform the grabbing function, and it is important to correctly sense whether or not the chip fc is actually captured. Further, since the adsorption and unloading of the chip fc is completed in a relatively short time, it is very important to determine whether or not the chip fc is actually captured or unloaded in this process.

Hereinafter, an example of the flip-chip unit 210(1) will be described for convenience of explanation.

Referring to FIG. 17, a pressure sensor 214 for sensing the adsorption pressure is provided between the flip unit 210 (1) and a piab (vacuum pump) 216 as a vacuum generator, and a piab (vacuum pump) 216 is flipped. Unit 210(1) A suction pressure is provided, and a pressure control device 215 may be disposed between the flip-chip unit 210(1) and the piab 216 that supplies the adsorption pressure to the flip-chip unit 210(1).

At this point, in order to correctly sense whether or not the chip fc is grasped, the pressure control device 215 will flip the unit 210(1) and the pressure control device 215 before the chip fc is grasped to the flip-chip unit 210(1). The adsorption force is controlled to be less than the adsorption force between the pressure control device 215 and the piab 216, and when the chip 10 is grasped to the flip-chip unit 210(1), the pressure control device 215 will flip the unit 210(1) with the pressure The adsorption force between the control devices 215 is controlled to be equal to the adsorption force between the pressure control device 215 and the piab 216.

In other words, in order to control the adsorption pressure of the flip-chip unit 210(1) to be equal to or similar to the adsorption pressure of the air flowing in from the outside, the pressure control device 215 controls the flow rate of the inflowing air of the flip-chip unit 210(1).

Specifically, the vacuum line between the piab 216 and the flip-chip unit 210(1) can be divided into a vacuum line between the flip-chip unit 210(1) and the pressure control device 215 and a pressure control device through the pressure control device 215. Vacuum line between 215 and piab216. The pressure control device 215 is preferably disposed such that the length between the flip-chip unit 210(1) and the pressure control device 215 is formed to be less than the length between the pressure control device 215 and the piab 216, and the pressure sensor 214 is preferably configured. At the vacuum line between the flip-chip unit 210(1) and the pressure control device 215.

When the piab 216 takes in air in the vacuum line, adsorption of the chip fc is achieved.

When the pressure control device 215 is not present in the prior art, since the vacuum pressure formed by the piab 216 when the chip 10 is not grasped is much smaller than the pressure (for example, atmospheric pressure) of the air taken in by the flip-chip unit 210 (1), The pressure difference in the vacuum line between the state of grasping the chip fc and the state of the unloading chip fc is small, and thus it is difficult to determine whether or not the chip fc is correctly grasped.

Regardless of whether or not the chip fc is grasped, the adsorption pressure applied to the vacuum line between the pressure control device 215 and the piab 216 by the pressure control device 215 is equal to the adsorption pressure of the prior art, and between the flip-chip unit 210(1) and the pressure control device 215 The adsorption pressure can be maintained similar to the pressure of the air taken in by the flip-chip unit 210 (1) (e.g., atmospheric pressure). At this point, since the suction pressure between the flip-chip unit 210(1) and the pressure control device 215 is maintained to be similar to the pressure of the air taken in by the flip-chip unit 210(1) when the chip fc is grasped or unloaded, Therefore, the pressure sensor 214 can easily sense the difference between the adsorption pressures of the flip-chip unit 210(1) and the pressure control device 215. That is, in the prior art, since the pressure of the inflowing air is significantly smaller than the vacuum pressure formed, it is difficult to determine whether or not the chip is grasped. However, in the present invention, since the pressure control device 215 is used, the vacuum pressure is formed to be similar to the pressure of the inflowing air, so although the pressure of the inflowing air is small, it is easy to further determine the pressure difference, and thus it is easy to determine whether to grasp or The chip fc is unloaded.

Thus, the pressure sensor 214 is disposed between the flip-chip unit 210(1) and the pressure control device to sense whether the chip has been grasped.

The use of piab 216 without the use of pressure control device 215 to form a vacuum pressure similar to the pressure of the inflowing air is undesirable because a large amount of time is required to form a vacuum state, and vacuum is readily formed using pressure control device 215.

According to the flip chip bonding apparatus of the present invention, positional errors due to thermal expansion of the components due to heat generated in the driving portion of each of the transmission lines can be minimized.

Further, according to the flip chip bonding apparatus of the present invention, by minimizing the movement of the driving tool which generates a large amount of heat, the time for cooling the constituent members which become overheated due to the generated heat can be secured.

Further, according to the flip chip bonding apparatus of the present invention, by minimizing the sudden acceleration to the high speed and minimizing the number of changes in the welding head direction, the impact or the like applied by the vibration or inertia of the welding head can be minimized.

Further, according to the flip chip bonding apparatus of the present invention, since the positional error due to thermal expansion of the assembly due to heat generated in the driving portion of each of the transmission lines can be minimized, the products produced in the semiconductor manufacturing process can be produced. Minimize defects.

Specifically, the flip chip bonding apparatus according to the present invention, Since the number of movements and the moving distance of the bonding head in a specific axial direction can be reduced, the flip chip bonding apparatus according to an embodiment of the present invention can reduce thermal expansion and vibration due to the transfer of the bonding head.

Further, according to the flip chip bonding apparatus of the present invention, space utilization can be improved, interference due to transfer of components between adjacent workspaces, and component parts disposed in adjacent workspaces can be reduced. distance.

Therefore, according to the flip chip bonding apparatus of the present invention, the UPH of the apparatus can be improved while ensuring a sufficient flux flattening time.

Although the present invention has been described with reference to the specific exemplary embodiments, the invention is not limited to the embodiments, but the invention is limited only by the scope of the appended patent application. It will be appreciated that those skilled in the art can change or modify these embodiments without departing from the scope and spirit of the invention.

1‧‧‧Flip chip soldering device

11‧‧‧Transmission line

12‧‧‧ Aligning the visual unit

13(1)‧‧‧Transmission line

13(2)‧‧‧Transmission line

31‧‧‧ recess

100‧‧‧Whip feeder

101‧‧‧ wafer loading department

113‧‧‧rails

114‧‧‧Pre-aligned unit

120‧‧‧Guide parts

200‧‧‧Flip Chip Supply Department

200(1)‧‧‧ third partial frame

200 (2) ‧ ‧ frame

210(1)‧‧‧Flip unit

210(2)‧‧‧Flip unit

211(1)‧‧‧First Drive Department

211(2)‧‧‧ first partial frame

213(1)‧‧‧ Shell

214‧‧‧pressure sensor

215‧‧‧ Pressure Control Devices

215(1)‧‧‧ first partial frame

216‧‧ piab (vacuum pump)

300‧‧ ‧ frame

300(1)‧‧‧ first partial frame

400‧‧‧Solder impregnating unit

400(1)‧‧‧Solder impregnating unit

400(2)‧‧‧ flux impregnating unit

410‧‧‧Solder Receiver

410(1)‧‧‧Solder Receiver

410(2)‧‧‧Solder Receiver

410a‧‧‧ recess

411‧‧‧ second partial frame

412‧‧‧Solder scraper

412a‧‧‧Protruding

413‧‧‧Second drive department

414‧‧‧ Subject

415‧‧‧ lower casing

416‧‧‧Upper casing

420‧‧‧Installation unit

420(1)‧‧‧Solder scraper

420(2)‧‧‧Solder scraper

421‧‧‧ Track Department

421a‧‧‧Lock stairs

422‧‧‧First support member

423‧‧‧Second support parts

423a‧‧‧Locking projection

424‧‧‧First support member

425‧‧‧First elastic part

426‧‧‧Second elastic parts

500‧‧‧Flip Chip Soldering Department

510‧‧‧welding station

520‧‧‧ first partial frame

700(1)‧‧‧Correction unit

700(2)‧‧‧ third partial frame

810‧‧‧Processing unit

860‧‧‧ memory

910‧‧‧First visual unit

910(1)‧‧‧ first visual unit

910(2)‧‧‧ first visual unit

1100‧‧‧First transmission line

1100(1)‧‧‧First transmission line

1100(2)‧‧‧First transmission line

1110‧‧‧Working Department

1110(1)‧‧‧Working Department

1110(2)‧‧‧Working Department

1120‧‧‧welding head

1120(1)‧‧‧welding head

1120(2)‧‧‧welding head

1121(1)‧‧‧Adsorption head

1125(1)‧‧‧ first partial frame

1130‧‧‧Second visual unit

1130(1)‧‧‧Second visual unit

1130(2)‧‧‧Second visual unit

1300‧‧‧second transmission line

1300(1)‧‧‧second transmission line

1300(2)‧‧‧second transmission line

1310a (1) ‧ ‧ Moving Department

1310b(1)‧‧‧moving department

1310a (2) ‧ ‧ Department of Movement

1310b(2)‧‧‧moving department

A‧‧‧ first section

B‧‧‧Second section

C‧‧‧third section

D‧‧‧Fourth Section

P‧‧‧ spacing

D‧‧‧distance

f‧‧‧Solder

W‧‧‧ wafer

Fc‧‧‧chip

Bs‧‧‧Welded substrate

Sp‧‧‧ welding area

P1(fc)‧‧‧first vertex area

P2(fc)‧‧‧second vertex area

Claims (33)

A flip chip bonding apparatus comprising: a flip-chip unit for picking up a chip from a wafer and flipping the upper side of the chip downward; a working portion having a chip for grasping the chip flipped by the flip-chip unit a welding head, wherein the welding head is capable of rotating the crucible in the z-axis direction with respect to the z-axis; a flux impregnation unit for impregnating the bottom surface of the chip grasped by the bonding head into the flux; a first visible unit, For photographing a bottom surface image of the chip impregnated by the flux dipping unit; a second visible unit for photographing a top surface image of the solder substrate, the chip to be mounted on the solder substrate; a flip chip soldering portion, And a method for soldering a chip on the solder substrate at a modified position according to a result of the inspection by the first visible unit and the second visible unit; a first transfer line for mounting the working portion, transmitting the y-axis direction a working portion; and a pair of second transfer lines disposed in parallel with the x-axis direction perpendicular to the first transfer line for mounting a moving portion connected to both ends of the first transfer line and the first pass The moving portion is conveyed in the x-axis direction perpendicular to the conveying direction of the feed line, wherein the flux dipping unit and the first visible unit are disposed on the same axis parallel to the first transfer line. The device of claim 1, wherein the flip-chip unit, the flux impregnating unit, and the first visual unit are disposed in pairs at positions symmetrical with respect to the y-axis, and have the first transfer of the working portion The wire is mounted on the second transfer line such that a pair of the first transfer lines can be driven independently. The device of claim 1, wherein the flip chip unit and the flux dipping unit are disposed on a same axis parallel to the second transfer line. The device of claim 1, wherein the flip-chip unit, the flux dipping unit, and the first visible unit are disposed on a same axis parallel to the first transfer line. The apparatus of claim 1, wherein the flip-chip unit, the flux dipping unit, and the first visible portion are reduced in order to reduce a moving distance in the x-axis direction when the soldering head moves from the flip-chip unit to the solder substrate The units are sequentially placed in the y-axis direction. The device of claim 1, wherein the chip passes over the first visual unit while being grasped by the soldering tip, and the first visual unit inspects the chip by capturing an image of a bottom surface of the chip. The device of claim 6, wherein when the size of the chip is greater than the field of view of the first viewable unit, the weld head is rotated at a predetermined angle such that the first viewable unit is movable in the x-axis direction The two edges of the chip were taken under the conditions. The device of claim 7, wherein the bottom surface image of the chip is continuously photographed for inspection when the soldering tip is rotated over the first viewing unit while rotating at a predetermined angle. The device of claim 1, further comprising a control unit for controlling a driving tool of the working portion and the moving portion, the working portion and the moving portion respectively having a driving tool, wherein the working portion and the working portion The moving portion is transportable along the first transfer line and the second transfer line, wherein the control portion drives the work portion when the work portion is transferred from the flux immersion unit to the first view unit or is transferred over the first view unit The driving tool of the working portion stops the driving tool of the moving portion. The device of claim 1, further comprising a control unit for controlling a driving tool of the working portion and the moving portion, the working portion and the moving portion respectively having a driving tool, wherein the working portion and the working portion The moving portion is transportable along the first transfer line and the second transfer line, wherein the solder joint at the working portion is transferred from the flip-chip unit to the first visible unit or from the solder dipping unit at the first visible unit When the upper portion is transported, the control unit stops the driving tool of the moving portion. The device of claim 9, wherein the control portion drives the driving tool of the working portion such that the working portion can be transferred from the flux impregnation unit to the first visual unit or transmitted over the first visual unit The work department transmits at a constant speed. The device of claim 9 or 10, wherein the number of driving of the moving portion is less than the number of driving of the working portion during one welding cycle, and the welding head edge of the working portion during the one welding cycle The flip chip unit, the flux dipping unit, the first visible unit, and the flip chip soldering portion are transferred. The apparatus of claim 1, wherein the trajectory on the xy plane of the welding cycle is formed in a triangular or rectangular shape, and the triangle forming the trajectory or at least one side of the rectangle is parallel to the first transmission line or The second transfer line is transferred along the flip chip unit, the flux dipping unit, the first visible unit, and the flip chip soldering portion during the soldering cycle. The device of claim 13, wherein the soldering tip sequentially passes through the flip-chip unit when the soldering tip is transported along the triangle forming the track or the side of the rectangle parallel to the first transfer line a flux dipping unit, the first visible unit, and the flip chip soldering portion. The device of claim 9, wherein the number of driving of the moving portion is two or three times during one welding cycle, and the welding head of the working portion is along the flipping unit during the one welding cycle The flux dipping unit, the first visible unit, and the flip chip soldering portion are transferred. The device of claim 9, wherein the control unit controls the driving tool of the working portion such that the working portion is driven at a constant speed when passing through the flux dipping unit and the first visible unit, and is transferred to the inverted portion The working portion is decelerated when the chip soldering portion is mounted. A flip chip soldering device comprising: a flip-chip unit for flipping a chip to invert a top surface and a bottom surface of the chip; a first driving portion for driving the flip-chip unit; a working portion disposed to be capable of being transported to a predetermined position on the xy plane, having a soldering tip for gripping the chip, the top surface and the bottom surface of the chip being inverted by the flip-chip unit; a solder dipping unit a flux receiver for containing flux for impregnating the chip, a flux blade for flattening the flux, and a second driving portion for slidingly moving the flux receiver; a first visual unit for Shooting the chip; a second viewing unit for photographing a solder substrate on which the chip is to be mounted; and a flip chip soldering portion for mounting the chip on the solder substrate, wherein the soldering is reduced The number of movements or the moving distance of the head in the x-axis direction, the first visible unit and the flux dipping unit are respectively disposed on an axis parallel to the y-axis direction. A flip chip soldering apparatus comprising: a flip-chip unit for flipping a chip to invert a top surface and a bottom surface of the chip; a first driving portion for driving the flip-chip unit; and a working portion Provided to be capable of being transported to a predetermined position on the xy plane, having a soldering tip for gripping the chip, the top surface and the bottom surface of the chip being inverted by the flip-chip unit; a flux dipping unit, including a flux receiver for accommodating the flux of the chip, a flux blade for flattening the flux, and a second driving portion for slidingly moving the flux receiver; a first visible unit for photographing the chip; a second visible unit for photographing a solder substrate on which the chip is to be mounted; and a flip chip soldering portion for mounting on the solder substrate In the chip, in order to reduce the number of movements or the moving distance of the welding head in the x-axis direction, the first visible unit, the flux impregnation unit, and the flip-chip unit are respectively disposed on the same axis parallel to the y-axis direction. The device of claim 17 or 18, wherein the flux receiver is slid forward and backward relative to the flux scraper. A device according to claim 19, wherein a recess for accommodating the flux is provided at the flux receiver, and the recess and the first visible unit are respectively disposed on the same axis parallel to the y-axis direction. The device of claim 19, wherein when the flux receiver moves forward, a first space and a second space are respectively provided on the top and bottom of the flux receiver, and the welding head is Enter the first space. The apparatus of claim 21, wherein the solder joint enters the first space when the flux receiver is slidably moved rearward for flattening the flux. The device of claim 21, wherein the first driving portion is disposed in the second space. The device of claim 23, wherein the first driving portion comprises a casing disposed in the second space, and a cable connected to the flip-chip unit and a vacuum line are disposed in the casing. The device of claim 19, wherein the flux impregnation unit comprises a body having a second driving portion and a mounting unit for mounting the flux blade on the body, and when the flux receiver slides forward The flux receiver protrudes toward the outside of the body when moving. The device of claim 25, wherein the flux receiver and the first driving portion of the flip-chip unit are disposed to overlap at least some regions on the xy plane when the flux receiver protrudes toward the exterior of the body. The device of claim 25, wherein the mounting unit includes a rail member for mounting the flux receiver, a first support member hingedly coupled to the rail member and supporting an upper portion of the flux scraper, and the first The support member is hingedly coupled to a second support member that supports the front side of the flux scraper. The device of claim 27, wherein a locking projection is provided at the second support member, and a locking step is provided at the rail member in combination with the locking projection. The device of claim 27, wherein the mounting unit comprises a first elastic member disposed between the first support member and the rail member and disposed between the second support member and the first support member a second elastic member, and the first elastic member and the second elastic member provide an elastic force to the flux scraper from different directions. The device of claim 17, wherein the first visual unit captures an image while the welding head is moving along the same axis parallel to the y-axis direction. The apparatus of claim 18, wherein when the welding head is moving along the same axis parallel to the y-axis direction, the process of gripping the chip, immersing the chip in the flux, and photographing the chip is performed. The apparatus of claim 17 or 18, further comprising: a first transfer line for transporting the solder joint in the y-axis direction and a second transfer line for transporting the solder joint in the x-axis direction, The first transmission line and the second transmission line have a shelf structure that overlaps. The apparatus of claim 17 or 18, further comprising: a vacuum generator for supplying adsorption pressure to the flip-chip unit; and a pressure control device for controlling a flow rate of the inflowing air of the flip-chip unit, thereby The adsorption pressure of the flip-chip unit is controlled to be equal to or similar to the adsorption force of air flowing in from the outside; and a pressure sensor disposed between the flip-chip unit and the pressure control device to sense whether the liquid is captured chip.