TW201404914A - Film-forming apparatus and delivery tray used in film-forming apparatus - Google Patents

Film-forming apparatus and delivery tray used in film-forming apparatus Download PDF

Info

Publication number
TW201404914A
TW201404914A TW102112355A TW102112355A TW201404914A TW 201404914 A TW201404914 A TW 201404914A TW 102112355 A TW102112355 A TW 102112355A TW 102112355 A TW102112355 A TW 102112355A TW 201404914 A TW201404914 A TW 201404914A
Authority
TW
Taiwan
Prior art keywords
substrate
film forming
forming apparatus
transport
tray
Prior art date
Application number
TW102112355A
Other languages
Chinese (zh)
Inventor
Itsushi Iio
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW201404914A publication Critical patent/TW201404914A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00Roller-ways
    • B65G13/02Roller-ways having driven rollers
    • B65G13/06Roller driving means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a film-forming apparatus which can realize the simplification of a driving mechanism, reduce the risk of particles attaching to the substrate and suppress the quality loss of a film-forming substrate. Said film-forming apparatus (100) has a delivery device (10) provided with a plurality of delivery rollers (11) to carry out delivery of the substrate (101), and has a simple structure. Furthermore, the delivery rollers (11) are installed at the lower end side of the substrate (101). Thereby, the probability of particle attaching to the substrate (101) arranged closer to the top than the delivery rollers is smaller, even if the rotation of the delivery rollers (11) is accompanied by the production of particles. In addition, the film-forming apparatus is constructed to have driven rollers (12, 13) that are abutted against the wall face of a groove part (30) formed at the top end part of the delivery tray (20) to form rotation, and it can restrain the position of the delivery tray (20) from the top and can stably and smoothly carry out delivery of the delivery tray (20) and the substrate (101).

Description

成膜裝置及成膜裝置用搬送托盤 Film transfer device and film transfer device transfer tray

本發明係有關一種成膜裝置及成膜裝置用搬送托盤。 The present invention relates to a film forming apparatus and a transport tray for a film forming apparatus.

例如對基板等對象物進行成膜之成膜裝置中,基板搭載(保持)於托盤上而被搬送。基板在複數個真空腔室間移動,並被實施成膜等處理。近幾年,伴隨太陽能電池及液晶顯示面板等的大型化,基板亦被大型化。在能夠應對被大型化之基板的成膜裝置中,已知有以縱姿勢搬送基板及托盤之裝置(例如參閱專利文獻1)。 For example, in a film forming apparatus that forms an object such as a substrate, the substrate is mounted (held) on a tray and transported. The substrate is moved between a plurality of vacuum chambers and processed into a film or the like. In recent years, as the size of solar cells and liquid crystal display panels has increased, the number of substrates has also increased. In a film forming apparatus that can cope with a large-sized substrate, a device that transports a substrate and a tray in a vertical position is known (for example, see Patent Document 1).

專利文獻1所記載之裝置中,驅動齒輪設置於真空腔室的上部側,與該驅動齒輪嚙合之齒條形成於托盤的上端側。藉由使真空腔室側的驅動齒輪旋轉來使托盤在水平方向上移動。基板與托盤一同在真空腔室內移動。 In the apparatus described in Patent Document 1, the drive gear is provided on the upper side of the vacuum chamber, and the rack meshing with the drive gear is formed on the upper end side of the tray. The tray is moved in the horizontal direction by rotating the drive gear on the vacuum chamber side. The substrate moves with the tray within the vacuum chamber.

(先前技術文獻) (previous technical literature) (專利文獻) (Patent Literature)

專利文獻1:日本特開平1-268870號公報 Patent Document 1: Japanese Patent Laid-Open No. 1-268870

然而,上述專利文獻1所記載之技術中,採用齒條小齒輪方式的驅動機構之結構複雜,因此要求簡單化。而且,上述習知技術中,齒條小齒輪方式的驅動機構比基板更靠上方而配置,因此有在驅動機構產生之粒子落下時附著於基板,使成膜的品質下降之可能性。 However, in the technique described in Patent Document 1, the structure of the drive mechanism using the rack and pinion type is complicated, and therefore the request is simplified. Further, in the above-described conventional technique, since the drive mechanism of the rack and pinion type is disposed above the substrate, there is a possibility that the film is adhered to the substrate when the particles generated by the drive mechanism are dropped, and the quality of the film formation is lowered.

本發明係為了解決這種課題而完成者,其目的為提供一種能夠實現驅動機構的簡單化,並且降低粒子附著於基板之風險,抑制成膜基板的品質下降之成膜裝置及成膜裝置用搬送托盤。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a film forming apparatus and a film forming apparatus which are capable of simplifying the driving mechanism and reducing the risk of particles adhering to the substrate and suppressing deterioration of the quality of the film forming substrate. Transfer the tray.

本發明提供一種成膜裝置,是對基板進行成膜處理的成膜裝置,其特徵為具備:真空容器,其能夠容納基板;及搬送手段,其在真空容器內,在與板厚方向交叉之搬送方向上對搬送托盤進行搬送,前述搬送托盤以按基板的板厚方向成為水平方向之方式使基板直立之狀態、或以從直立之狀態傾斜之狀態保持基板,搬送手段具有:複數個搬送輥,其配置於基板的下端側,繞著沿著板厚方向延伸之第1軸線旋轉,並對搬送托盤進行搬送;及複數個從動輥,其配置於基板的上端側,繞著沿著與板厚方向及搬送方向交叉之方向延伸之第2軸線旋轉,搬送托盤的上端面形成有沿著搬送方向連續之槽部,從動輥抵接於槽部內的壁面且伴隨搬送托盤的移動而旋轉。 The present invention provides a film forming apparatus which is a film forming apparatus which performs a film forming process on a substrate, and is characterized in that it includes a vacuum container capable of accommodating a substrate, and a conveying means that intersects the thickness direction in the vacuum container. The transport tray is transported in a transport direction, and the transport tray holds the substrate in a state in which the substrate is erected so that the thickness direction of the substrate is horizontal, or in a state of being inclined from an upright state, and the transport means includes a plurality of transport rollers And disposed on the lower end side of the substrate, rotates around the first axis extending along the thickness direction, and transports the transfer tray; and a plurality of driven rollers are disposed on the upper end side of the substrate, and are arranged along the The second axis extending in the direction in which the thickness direction and the transport direction intersect each other is rotated, and the upper end surface of the transport tray is formed with a groove portion continuous along the transport direction, and the driven roller abuts against the wall surface in the groove portion and rotates with the movement of the transport tray .

依這種成膜裝置,其為具有具備對基板進行搬送之複數個搬送輥之搬送裝置之結構,因此能夠設為簡單之結構的裝置。例如與習知之齒條小齒輪方式的驅動機構進行比較,能夠設為簡單之結構。而且,成膜裝置中,搬送輥配置於基板的下端側,因此即使伴隨搬送輥的旋轉而產生粒子,粒子附著於比搬送輥更靠上方而配置之基板之可能性亦較低。藉此,能夠降低粒子附著於基板之風險,抑制成膜基板的品質下降。而且,構成為從動輥抵接於形成在搬送托盤的上端部之槽部內的壁面並旋轉,因此能夠從上方限制搬送托盤的位置,並且能夠穩定且順暢地對搬送托盤及基板進行搬送。 According to such a film forming apparatus, since it has a structure which has a conveying apparatus which has a plurality of conveying rollers which convey the board|substrate, it is set as the simple structure. For example, it can be set as a simple structure in comparison with a conventional rack and pinion type drive mechanism. Further, in the film forming apparatus, since the conveying roller is disposed on the lower end side of the substrate, even if particles are generated in association with the rotation of the conveying roller, the possibility that the particles adhere to the substrate disposed above the conveying roller is also low. Thereby, the risk of the particles adhering to the substrate can be reduced, and the deterioration of the quality of the film formation substrate can be suppressed. In addition, since the driven roller is in contact with the wall surface formed in the groove portion of the upper end portion of the transport tray, the position of the transport tray can be restricted from above, and the transport tray and the substrate can be transported stably and smoothly.

亦可為搬送托盤的下端面設置有朝搬送方向延伸且能夠與搬送輥的周面抵接之軌道部之結構。若搬送托盤的下端面設置有軌道部,則能夠使搬送托盤的行進穩定化。 The lower end surface of the transport tray may be provided with a rail portion that extends in the transport direction and that can abut against the circumferential surface of the transport roller. When the rail portion is provided on the lower end surface of the transport tray, the travel of the transport tray can be stabilized.

在此,複數個從動輥具備:第1從動輥,其與槽部內的一對壁面的一方抵接;及第2從動輥,其與槽部內的一對壁面的另一方抵接,第1從動輥及第2從動輥在搬送方向上交替配置為較佳。該結構的成膜裝置中,第1從動輥僅與搬送托盤的槽部內的一對壁面的一方抵接,第2從動輥僅與搬送托盤的槽部內的一對壁面的另一方抵接。藉此,第1從動輥及第2從動輥始終分別朝不同方向旋轉,因此能夠防止從動輥的旋轉方向朝反方向轉換。因此,能夠減小搬送托盤20被搬送時的摩擦阻力,所以能夠實現搬送托盤的順暢的搬送。 Here, the plurality of driven rollers include: a first driven roller that abuts against one of a pair of wall surfaces in the groove portion; and a second driven roller that abuts against the other of the pair of wall surfaces in the groove portion, It is preferable that the first driven roller and the second driven roller are alternately arranged in the transport direction. In the film forming apparatus of the above configuration, the first driven roller abuts only one of the pair of wall surfaces in the groove portion of the transfer tray, and the second driven roller abuts only the other of the pair of wall surfaces in the groove portion of the transfer tray. . Thereby, since the first driven roller and the second driven roller are always rotated in different directions, it is possible to prevent the rotation direction of the driven roller from being reversed in the reverse direction. Therefore, the frictional resistance when the transport tray 20 is transported can be reduced, so that the transport of the transport tray can be smoothly performed.

而且,在板厚方向上,第1從動輥的周面最靠一對壁面的一側的位置與第2從動輥的周面最靠一對壁面的另一側的位置的距離,比槽部的一對壁面間的距離小為較佳。依該結構的成膜裝置,容許搬送托盤相對於從動輥之位置偏離,能夠穩定且順暢地對搬送托盤及基板進行搬送,進而,減輕從動輥與槽部壁面的摩擦阻力,較易提高搬送速度。 Further, in the thickness direction, the distance from the position on the side of the pair of wall surfaces of the first driven roller to the position on the other side of the pair of wall surfaces of the second driven roller is the ratio The distance between the pair of wall faces of the groove portion is preferably small. According to the film forming apparatus of the above configuration, the position of the transfer tray relative to the driven roller is allowed to deviate, and the transfer tray and the substrate can be stably and smoothly conveyed, and the frictional resistance between the driven roller and the groove wall surface can be reduced, which is easy to increase. Transfer speed.

而且,搬送輥具有一對凸緣部,前述一對凸緣部配置成朝該搬送輥的徑向外側突出,並且在第1軸線方向上對峙且夾持搬送托盤的兩側為較佳。依該結構的成膜裝置,配置成從板厚方向的兩側夾持搬送托盤的下端部之一對凸緣部形成於搬送輥,因此能夠使搬送托盤相對於搬送輥之位置穩定。藉此,能夠使搬送托盤及基板的姿勢穩定並順暢地搬送。 Further, the transport roller has a pair of flange portions, and the pair of flange portions are disposed to protrude outward in the radial direction of the transport roller, and are preferably opposed to each other in the first axial direction and sandwiching both sides of the transport tray. According to the film forming apparatus of this configuration, since one of the lower end portions of the transport tray is sandwiched between the both sides in the thickness direction and the flange portion is formed on the transport roller, the position of the transport tray with respect to the transport roller can be stabilized. Thereby, the posture of the transfer tray and the substrate can be stably and smoothly conveyed.

成膜裝置可為具備閘閥部,前述閘閥部具備能夠密封真空容器的搬送托盤所通過的開口部的閥體,並且閘閥部上設置有從動輥之結構。該結構的成膜裝置中,閘閥部內配置有從動輥,因此能夠使搬送托盤及基板的姿勢穩定並順暢地搬送。 The film forming apparatus may include a gate valve portion, and the gate valve portion includes a valve body through which an opening portion through which the transfer tray of the vacuum container can pass, and a gate roller portion is provided with a driven roller. In the film forming apparatus of this configuration, since the driven roller is disposed in the gate valve portion, the posture of the transfer tray and the substrate can be stably and smoothly conveyed.

本發明提供一種成膜裝置用搬送托盤,是在與板厚方向交叉之方向上搬送時,能以按基板的板厚方向成為水平方向之方式使基板直立之狀態、或以從直立之狀態傾斜之狀態保持基板的成膜裝置用搬送托盤,其特徵為具備:保持基板的上端部的上端部保持部;保持基板的下端部的下 端部保持部;及連結上端部保持部及下端部保持部的連結部,上端部保持部的上端面形成有在搬送方向上連續之槽部。 The present invention provides a transporting tray for a film forming apparatus which is capable of erecting a substrate in a horizontal direction in a direction in which the thickness direction of the substrate is horizontal, or tilting from an upright state, when transporting in a direction intersecting the thickness direction of the substrate In the state of the present invention, the transfer tray for a film forming apparatus of the substrate is provided, comprising: an upper end holding portion that holds an upper end portion of the substrate; and a lower end portion of the holding substrate The end holding portion; and a connecting portion that connects the upper end holding portion and the lower end portion holding portion, and the upper end surface of the upper end portion holding portion is formed with a groove portion continuous in the conveying direction.

這種成膜裝置用搬送托盤能夠適用於上述成膜裝置。該成膜裝置用搬送托盤在上端部保持部的上端面形成有在搬送方向上連續之槽部,因此能夠將上述成膜裝置的從動輥配置於槽部。伴隨搬送托盤的搬送,槽部壁面與從動輥抵接,從動輥旋轉。從動輥在基板搬送時能夠適宜地引導搬送托盤的搬送方向。 Such a film forming apparatus transfer tray can be applied to the above film forming apparatus. In the transporting tray for a film forming apparatus, a groove portion continuous in the transport direction is formed on the upper end surface of the upper end portion holding portion. Therefore, the driven roller of the film forming apparatus can be disposed in the groove portion. With the conveyance of the conveyance tray, the groove wall surface abuts against the driven roller, and the driven roller rotates. The driven roller can appropriately guide the conveyance direction of the conveyance tray at the time of substrate conveyance.

槽部在搬送方向上的端部形成有以該槽部的寬度朝向端部擴展之方式形成之傾斜部為較佳。該結構的成膜裝置用搬送托盤中,從動輥進入槽部時的入口側端部的寬度較寬,越進入搬送方向的內側越窄,因此能夠減輕位置偏離的影響而順暢地搬送。即便產生搬送托盤相對於從動輥之位置偏離,亦能夠防止從動輥的碰撞並進行搬送。 It is preferable that the end portion of the groove portion in the conveying direction is formed with an inclined portion formed so that the width of the groove portion expands toward the end portion. In the transporting tray for a film forming apparatus of this configuration, the width of the inlet side end portion when the driven roller enters the groove portion is wide, and the inside is narrower toward the inside in the conveying direction. Therefore, the effect of the positional deviation can be reduced and the conveying can be smoothly performed. Even if the position of the transfer tray is deviated from the driven roller, collision of the driven roller can be prevented and transported.

可為下端部保持部的下端面設置有朝搬送方向延伸之軌道部之結構。若搬送托盤的下端面設置有軌道部,則能夠使搬送托盤的行進穩定化。 The lower end surface of the lower end holding portion may be provided with a rail portion extending in the conveying direction. When the rail portion is provided on the lower end surface of the transport tray, the travel of the transport tray can be stabilized.

本發明能夠提供一種成膜裝置,其能夠實現驅動機構的簡單化,並且降低粒子附著於基板之風險,抑制成膜基板的品質下降。 The present invention can provide a film forming apparatus which can simplify the driving mechanism and reduce the risk of particles adhering to the substrate and suppress deterioration of the quality of the film forming substrate.

而且,本發明能夠提供一種成膜裝置用搬送托盤,其 能夠適用於上述成膜裝置,能夠實現成膜裝置的驅動機構的簡單化,並且降低粒子附著於基板之風險,抑制成膜基板的品質下降。 Moreover, the present invention can provide a transport tray for a film forming apparatus, which The film forming apparatus can be applied to the above, and the driving mechanism of the film forming apparatus can be simplified, and the risk of particles adhering to the substrate can be reduced, and the quality of the film forming substrate can be suppressed from deteriorating.

10‧‧‧搬送裝置 10‧‧‧Transporting device

11‧‧‧搬送輥 11‧‧‧Transport roller

11a‧‧‧凸緣部 11a‧‧‧Flange

11b‧‧‧周面 11b‧‧‧Week

12、13‧‧‧從動輥 12, 13‧‧‧ driven roller

14‧‧‧旋轉軸 14‧‧‧Rotary axis

20‧‧‧搬送托盤 20‧‧‧Transport tray

21‧‧‧上端部保持部 21‧‧‧Upper Department Keeping Department

22‧‧‧下端部保持部 22‧‧‧Bottom keeping department

23‧‧‧側端部保持部(連結部) 23‧‧‧ Side end holding part (connection part)

26‧‧‧軌道部 26‧‧‧ Track Department

30‧‧‧導引槽 30‧‧‧ guiding slot

32、33‧‧‧導引板 32, 33‧‧‧ guide board

32a、33a‧‧‧壁面(槽部內的壁面) 32a, 33a‧‧‧ wall (wall in the groove)

51‧‧‧頂板 51‧‧‧ top board

52‧‧‧底板 52‧‧‧floor

53‧‧‧正面壁 53‧‧‧ positive wall

54‧‧‧背面壁 54‧‧‧Back wall

55‧‧‧入側壁 55‧‧‧ into the side wall

56‧‧‧出側壁 56‧‧‧Out of the side wall

100‧‧‧成膜裝置 100‧‧‧ film forming device

101‧‧‧基板 101‧‧‧Substrate

121、125‧‧‧過渡腔室(真空容器) 121, 125‧‧‧Transition chamber (vacuum container)

122、124‧‧‧緩衝腔室(真空容器) 122, 124‧‧‧ buffer chamber (vacuum container)

123‧‧‧成膜腔室(真空容器) 123‧‧‧ filming chamber (vacuum container)

140‧‧‧蒸鍍裝置 140‧‧‧Vapor deposition unit

第1圖係表示本發明的實施形態之成膜裝置之概略側視圖。 Fig. 1 is a schematic side view showing a film forming apparatus according to an embodiment of the present invention.

第2圖係從側方表示腔室內之截面圖。 Fig. 2 is a cross-sectional view showing the chamber from the side.

第3圖係從搬送方向的前方表示成膜腔室內之截面圖。 Fig. 3 is a cross-sectional view showing the inside of the film forming chamber from the front in the conveying direction.

第4圖係表示搬送托盤的上端部之截面圖。 Fig. 4 is a cross-sectional view showing the upper end portion of the transfer tray.

第5圖係表示搬送托盤的下端部之截面圖。 Fig. 5 is a cross-sectional view showing the lower end portion of the transfer tray.

第6圖係表示搬送托盤的上端部之俯視圖。 Fig. 6 is a plan view showing the upper end portion of the transport tray.

第7圖係表示形成於搬送托盤的上端部之傾斜部之俯視圖。 Fig. 7 is a plan view showing an inclined portion formed at an upper end portion of the transfer tray.

參閱附圖對本發明之成膜裝置進行說明。另外,“上”、“下”等表示方向之詞基於附圖所示之狀態,係為了便於理解而使用者。而且,第1圖~第7圖中為了便於說明還示出XYZ直角座標系。 The film forming apparatus of the present invention will be described with reference to the drawings. In addition, the words "upper", "lower", etc., which indicate directions, are based on the state shown in the drawings, and are used for convenience of understanding. Further, in the first to seventh figures, an XYZ rectangular coordinate system is also shown for convenience of explanation.

(成膜裝置) (film forming device)

第1圖係表示本發明的實施形態之成膜裝置100之概 略側視圖。第1圖中,從基板101(參閱第2圖)的搬送方向Y的側方表示。第1圖示出之成膜裝置100係用於對基板101(例如玻璃基板)實施成膜等處理者。成膜裝置100為進行基於例如RPD法(反應性離子鍍膜法)之成膜之裝置。成膜裝置100具備生成等離子體之等離子槍(140),使用生成之等離子體,對成膜材料進行離子化,使成膜材料的粒子附著於基板101的表面,藉此進行成膜。 Fig. 1 is a view showing a film forming apparatus 100 according to an embodiment of the present invention. Slightly side view. In the first drawing, the side of the transport direction Y of the substrate 101 (see FIG. 2) is shown. The film forming apparatus 100 shown in Fig. 1 is for performing processing such as film formation on the substrate 101 (for example, a glass substrate). The film forming apparatus 100 is a device that performs film formation based on, for example, the RPD method (reactive ion plating method). The film forming apparatus 100 includes a plasma gun (140) that generates plasma, and ionizes the film forming material using the generated plasma, and adheres particles of the film forming material to the surface of the substrate 101 to form a film.

成膜裝置100能夠適用於例如製造太陽能電池之太陽能電池製造裝置、製造液晶顯示元件之液晶顯示元件製造裝置、及製造平面輸入元件(觸控面板)之平面輸入元件製造裝置等。 The film forming apparatus 100 can be applied to, for example, a solar cell manufacturing apparatus for manufacturing a solar cell, a liquid crystal display element manufacturing apparatus for manufacturing a liquid crystal display element, and a planar input element manufacturing apparatus for manufacturing a planar input element (touch panel).

成膜裝置100具備過渡腔室121、緩衝腔室122、成膜腔室(成膜室)123、緩衝腔室124及過渡腔室125。該等腔室121~125依此順序排列配置。所有腔室121~125由真空容器構成,腔室121~125的出入口設置有開閉閘131~136。成膜裝置100可為排列有複數個緩衝腔室122、124、成膜腔室123之結構。 The film forming apparatus 100 includes a transition chamber 121, a buffer chamber 122, a film forming chamber (film forming chamber) 123, a buffer chamber 124, and a transition chamber 125. The chambers 121 to 125 are arranged in this order. All of the chambers 121 to 125 are constituted by vacuum vessels, and the opening and closing gates 131 to 136 are provided at the entrances and exits of the chambers 121 to 125. The film forming apparatus 100 may have a structure in which a plurality of buffer chambers 122, 124 and a film forming chamber 123 are arranged.

各真空腔室121~125內連接有用於將內部設為適當壓力之真空泵(未圖示)。而且,各真空腔室121~125內設置有複數個(例如2個)用於監視腔室內的壓力之真空儀(未圖示)。各腔室121~125連通有與真空泵連接之真空排氣管,該真空排氣管上設置有真空儀。 A vacuum pump (not shown) for setting the inside to an appropriate pressure is connected to each of the vacuum chambers 121 to 125. Further, a plurality of (for example, two) vacuum gauges (not shown) for monitoring the pressure in the chamber are provided in each of the vacuum chambers 121 to 125. Each of the chambers 121 to 125 is connected to a vacuum exhaust pipe connected to a vacuum pump, and a vacuum gauge is disposed on the vacuum exhaust pipe.

如第2圖所示,成膜裝置100設置有用於搬送保持基 板101用之搬送托盤20之搬送裝置10。搬送裝置10為在真空腔室121~125內以使基板101及搬送托盤20直立之狀態搬送之裝置(詳細內容容後敘述)。 As shown in FIG. 2, the film forming apparatus 100 is provided with a transport holding base. The plate 101 is used to transport the transfer device 10 of the tray 20. The conveying device 10 is a device that conveys the substrate 101 and the transfer tray 20 in a state in which the substrate 101 and the transfer tray 20 are erected in the vacuum chambers 121 to 125 (details will be described later).

接著,參閱第1圖,對各種真空腔室121~125進行說明。過渡腔室121為如下腔室:開放設置於入口側之開閉閘131,藉此開放在大氣中,導入要處理之基板101及保持該基板101之搬送托盤20。過渡腔室121的出口側經由開閉閘132與緩衝腔室122的入口側連接。 Next, various vacuum chambers 121 to 125 will be described with reference to Fig. 1 . The transition chamber 121 is a chamber that opens and closes the opening and closing gate 131 provided on the inlet side, thereby opening the atmosphere and introducing the substrate 101 to be processed and the transfer tray 20 holding the substrate 101. The outlet side of the transition chamber 121 is connected to the inlet side of the buffer chamber 122 via the opening and closing gate 132.

緩衝腔室122為如下的壓力調整用腔室:開放設置於入口側之開閉閘132,藉此與過渡腔室121連通,導入通過過渡腔室121之基板101。緩衝腔室122的出口側經由開閉閘133與成膜腔室123的入口側連接。而且,緩衝腔室122設置有用於對基板101進行加熱之加熱器(未圖示)。該加熱器為了對基板101的成膜面(被成膜之面)進行加熱,是與成膜面對峙配置。本實施形態中,基板101以直立狀態配置,因此成膜面沿著上下方向配置。緩衝腔室122中,基板溫度加熱成為例如200℃左右。緩衝腔室122設置於成膜腔室123的前段,作為對基板101進行加熱之加熱用腔室發揮作用。 The buffer chamber 122 is a pressure adjustment chamber that opens and closes the opening and closing gate 132 provided on the inlet side, thereby communicating with the transition chamber 121 and introducing the substrate 101 passing through the transition chamber 121. The outlet side of the buffer chamber 122 is connected to the inlet side of the film forming chamber 123 via the opening and closing gate 133. Further, the buffer chamber 122 is provided with a heater (not shown) for heating the substrate 101. In order to heat the film formation surface (surface to be formed) of the substrate 101, the heater is disposed to face the film formation. In the present embodiment, since the substrate 101 is placed in an upright state, the film formation surface is arranged in the vertical direction. In the buffer chamber 122, the substrate temperature is heated to, for example, about 200 °C. The buffer chamber 122 is provided in the front stage of the film forming chamber 123, and functions as a heating chamber for heating the substrate 101.

作為加熱器,能夠使用例如燈式加熱器。燈式加熱器呈棒狀,朝上下方向Z延伸。燈式加熱器在緩衝腔室122內設置有複數個(例如12個),並且在搬送方向Y上隔著既定的間隔而配置。加熱器的熱傳熱至基板101,對基板101進行加熱。 As the heater, for example, a lamp heater can be used. The lamp heater has a rod shape and extends in the up and down direction Z. The lamp heater is provided in plural (for example, twelve) in the buffer chamber 122, and is disposed at a predetermined interval in the transport direction Y. The heat of the heater is transferred to the substrate 101 to heat the substrate 101.

成膜腔室123為如下處理腔室:開放設置於入口側之開閉閘133,藉此與緩衝腔室122連通,導入通過緩衝腔室122之基板101及搬送托盤20,在基板101形成薄膜層。成膜腔室123的出口側經由開閉閘134與緩衝腔室124的入口側連接。如第3圖所示,成膜腔室123設置有用於在基板101形成成膜材料(薄膜層)之蒸鍍裝置140。蒸鍍裝置140由保持成膜材料之主爐缸、及將等離子射束照射於主爐缸之等離子槍等構成。而且,成膜腔室123設置有用於對基板101進行加熱之加熱器。該加熱器設置成例如從基板101的背面101f(成膜面101e相反側的面)側對基板101進行加熱。成膜腔室123中,基板溫度維持在例如200℃左右。 The film forming chamber 123 is a processing chamber that opens and closes the opening and closing gate 133 provided on the inlet side, thereby communicating with the buffer chamber 122, introducing the substrate 101 and the transfer tray 20 that pass through the buffer chamber 122, and forming a thin film layer on the substrate 101. . The outlet side of the film forming chamber 123 is connected to the inlet side of the buffer chamber 124 via the opening and closing gate 134. As shown in FIG. 3, the film forming chamber 123 is provided with a vapor deposition device 140 for forming a film forming material (thin film layer) on the substrate 101. The vapor deposition device 140 is composed of a main hearth that holds a film forming material, a plasma gun that irradiates a plasma beam to the main hearth, and the like. Further, the film forming chamber 123 is provided with a heater for heating the substrate 101. This heater is provided, for example, to heat the substrate 101 from the side of the back surface 101f of the substrate 101 (the surface on the opposite side to the film formation surface 101e). In the film forming chamber 123, the substrate temperature is maintained at, for example, about 200 °C.

第1圖所示之緩衝腔室124為如下的壓力調整用腔室:開放設置於入口側之開閉閘134,藉此與成膜腔室123連通,導入藉由成膜腔室123而成膜之基板101及保持前述基板之搬送托盤20。緩衝腔室124的出口側經由開閉閘135與過渡腔室125的入口側連接。而且,緩衝腔室124設置有用於對基板101進行冷卻的冷卻板(未圖示)。該冷卻板為了對基板101的成膜面進行冷卻,是與基板101的成膜面對峙配置。可為具備從基板101的背面101f側對基板101進行冷卻之冷卻板之結構。緩衝腔室124中,基板溫度被冷卻成例如120℃左右。緩衝腔室124設置於成膜腔室123的後段,並作為對基板101進行冷卻之冷卻用腔室發揮作用。另外,可為緩衝腔室124內 未設置冷卻手段之結構。亦可為在從真空腔室出來之後之大氣壓力環境下,藉由大氣對基板101進行冷卻(空冷)之結構。 The buffer chamber 124 shown in Fig. 1 is a pressure adjusting chamber that opens and closes the opening and closing gate 134 provided on the inlet side, thereby communicating with the film forming chamber 123, and introducing the film forming chamber 123 into a film. The substrate 101 and the transfer tray 20 holding the substrate. The outlet side of the buffer chamber 124 is connected to the inlet side of the transition chamber 125 via an opening and closing gate 135. Further, the buffer chamber 124 is provided with a cooling plate (not shown) for cooling the substrate 101. In order to cool the film formation surface of the substrate 101, the cooling plate is disposed to face the film formation of the substrate 101. It may be configured to include a cooling plate that cools the substrate 101 from the side of the back surface 101f of the substrate 101. In the buffer chamber 124, the substrate temperature is cooled to, for example, about 120 °C. The buffer chamber 124 is provided in the rear stage of the film forming chamber 123, and functions as a cooling chamber for cooling the substrate 101. In addition, it can be in the buffer chamber 124 The structure of the cooling means is not provided. It is also possible to cool the substrate 101 by air (air cooling) under an atmospheric pressure environment after exiting from the vacuum chamber.

冷卻板係作為對基板101進行冷卻之冷卻手段發揮作用者。冷卻板例如由銅板形成,呈板狀,並以與基板101對峙之方式配置。冷卻板設置有可供冷卻水流通之冷卻管(未圖示)。基板101的熱傳熱至冷卻板,傳遞至冷卻板之熱傳熱至冷卻管,冷卻管藉由在管內流過之冷卻水而冷卻。藉此,冷卻板被冷卻而冷卻基板101。 The cooling plate functions as a cooling means for cooling the substrate 101. The cooling plate is formed, for example, of a copper plate, and has a plate shape, and is disposed to face the substrate 101. The cooling plate is provided with a cooling pipe (not shown) through which cooling water can flow. The heat of the substrate 101 is transferred to the cooling plate, and the heat transferred to the cooling plate is transferred to the cooling pipe, and the cooling pipe is cooled by the cooling water flowing through the pipe. Thereby, the cooling plate is cooled to cool the substrate 101.

過渡腔室125為如下腔室:開放設置於入口側之開閉閘135,藉此與緩衝腔室124連通,導入通過緩衝腔室124之基板101。過渡腔室125的出口側設置有開閉閘136,使開閉閘136開放,藉此過渡腔室125開放在大氣中。過渡腔室125中,藉由大氣開放進行空冷,在基板101被搬送至腔室外之時刻冷卻成100℃以下。 The transition chamber 125 is a chamber that opens and closes the opening and closing gate 135 on the inlet side, thereby communicating with the buffer chamber 124 and introducing the substrate 101 through the buffer chamber 124. An opening and closing gate 136 is provided on the outlet side of the transition chamber 125 to open the opening and closing gate 136, whereby the transition chamber 125 is opened in the atmosphere. The transition chamber 125 is air-cooled by opening the atmosphere, and is cooled to 100 ° C or lower when the substrate 101 is transported to the outside of the chamber.

(搬送托盤) (transport tray)

接著,參閱第2圖~第7圖,對本實施形態的成膜裝置100中使用之搬送托盤20進行說明。搬送托盤20在以使基板101直立之狀態搬送時是保持基板101。使基板101直立之狀態係指基板101的板厚方向X成為水平方向之狀態。此時,基板101的成膜面沿著上下方向Z配置。另外,可為以從基板101直立之狀態傾斜之狀態保持基板101之結構。基板101的板厚方向X可為大致水平的方 向,亦可從水平方向傾斜。板厚方向X為與上下方向Z正交且與基板101的搬送方向Y正交之方向。 Next, the transfer tray 20 used in the film forming apparatus 100 of the present embodiment will be described with reference to FIGS. 2 to 7 . The transport tray 20 holds the substrate 101 when the substrate 101 is transported in an upright state. The state in which the substrate 101 is erected means a state in which the thickness direction X of the substrate 101 is in the horizontal direction. At this time, the film formation surface of the substrate 101 is arranged along the vertical direction Z. In addition, the structure of the substrate 101 can be maintained in a state of being inclined from the state in which the substrate 101 is erected. The plate thickness direction X of the substrate 101 can be a substantially horizontal square It can also be tilted from the horizontal direction. The plate thickness direction X is a direction orthogonal to the vertical direction Z and orthogonal to the conveyance direction Y of the substrate 101.

如第2圖所示,搬送托盤20作為保持基板101的端部之矩形框體而形成。搬送托盤20具備:保持基板101的上端部101a的上端部保持部21;保持基板101的下端部101b的下端部保持部22;及保持基板101的側端部101c的一對側端部保持部23。本實施形態的搬送托盤20構成為保持1個基板101。搬送托盤20可為能夠保持複數個(例如2片)基板101之結構。搬送托盤係可保持基板101的邊緣部的全周者,亦可為保持基板101的邊緣部的局部者。上端部保持部21、下端部保持部22、側端部保持部23的材質能夠使用例如不銹鋼。 As shown in FIG. 2, the transport tray 20 is formed as a rectangular frame that holds the end of the substrate 101. The transport tray 20 includes an upper end portion holding portion 21 that holds the upper end portion 101a of the substrate 101, a lower end portion holding portion 22 that holds the lower end portion 101b of the substrate 101, and a pair of side end portion holding portions that hold the side end portion 101c of the substrate 101. twenty three. The transfer tray 20 of the present embodiment is configured to hold one substrate 101. The transfer tray 20 may be configured to hold a plurality of (for example, two) substrates 101. The transport tray can hold the entire circumference of the edge portion of the substrate 101, or can be a part of the edge portion of the substrate 101. For the material of the upper end holding portion 21, the lower end portion holding portion 22, and the side end portion holding portion 23, for example, stainless steel can be used.

(上端部保持部) (upper end holding portion)

上端部保持部21沿著基板101的上端部101a配置。如第4圖所示,上端部保持部21具備:支撐基板101的支撐板21a;及用於相對於支撐板21a保持基板101的基板按壓構件21b。 The upper end holding portion 21 is disposed along the upper end portion 101a of the substrate 101. As shown in FIG. 4, the upper end holding portion 21 includes a support plate 21a that supports the substrate 101, and a substrate pressing member 21b that holds the substrate 101 with respect to the support plate 21a.

支撐板21a從基板101的成膜面101e的相反側支撐基板101的上端部101a。基板按壓構件21b藉由從成膜面101e側按壓基板101的上端部101a來保持基板101。基板101的上端部101a從板厚方向X的兩側被支撐板21a及基板按壓構件21b夾持。上端部保持部21為能夠防止基板101的位置偏離之結構即可。 The support plate 21a supports the upper end portion 101a of the substrate 101 from the side opposite to the film formation surface 101e of the substrate 101. The substrate pressing member 21b holds the substrate 101 by pressing the upper end portion 101a of the substrate 101 from the side of the film formation surface 101e. The upper end portion 101a of the substrate 101 is sandwiched by the support plate 21a and the substrate pressing member 21b from both sides in the thickness direction X. The upper end holding portion 21 may be configured to prevent the position of the substrate 101 from being deviated.

(導引槽) (guide groove)

如第4圖、第6圖、第7圖所示,上端部保持部21的頂面(上端面)21c形成有用於規定搬送托盤20的搬送方向(Y方向)的導引槽30。導引槽30構成為後述從動輥12、13(導引輥)能夠進入。導引槽30在Y方向上遍及上端部保持部21的整個長度而形成。導引槽30以向下方凹陷之方式形成。導引槽30可例如藉由對上端部保持部21的頂面21c進行切削而形成,亦可藉由組裝複數個構件而形成。 As shown in FIG. 4, FIG. 6, and FIG. 7, the top surface (upper end surface) 21c of the upper end holding portion 21 is formed with a guide groove 30 for defining the conveyance direction (Y direction) of the conveyance tray 20. The guide groove 30 is configured to be able to enter the driven rollers 12 and 13 (guide rollers) which will be described later. The guide groove 30 is formed over the entire length of the upper end holding portion 21 in the Y direction. The guide groove 30 is formed to be recessed downward. The guide groove 30 can be formed, for example, by cutting the top surface 21c of the upper end holding portion 21, or by assembling a plurality of members.

上端部保持部21具有從支撐基板101之支撐板21a向上方突出之一對導引板32、33。一對導引板32、33在X方向上對峙配置。一對導引板32、33的相對峙之壁面32a、33a為導引槽30內的一對壁面。一對導引板32、33例如藉由螺栓34固定於主體31。另外,第6圖及第7圖中,省略螺栓34的圖示。 The upper end holding portion 21 has a pair of guide plates 32, 33 that protrude upward from the support plate 21a of the support substrate 101. The pair of guide plates 32, 33 are disposed opposite each other in the X direction. The opposing wall faces 32a, 33a of the pair of guide plates 32, 33 are a pair of wall faces in the guide groove 30. The pair of guide plates 32, 33 are fixed to the main body 31 by, for example, bolts 34. In addition, in FIGS. 6 and 7, the illustration of the bolt 34 is omitted.

(傾斜部) (inclined part)

第7圖係表示形成於搬送托盤20的上端部之傾斜部之俯視圖。如第7圖所示,上端部保持部21的導引槽30內形成有傾斜部32b、33b。傾斜部32b、33b形成於一對導引板32、33的Y方向的端部。傾斜部32b、33b以導引槽30的寬度朝Y方向的端部擴展之方式形成。傾斜部32b、33b以導引槽30的寬度朝Y方向的中央變窄之方式 形成。導引板32、33的相對峙的壁面32a、33a形成為在傾斜部32b、33b以外平行。 Fig. 7 is a plan view showing an inclined portion formed at an upper end portion of the transport tray 20. As shown in Fig. 7, inclined portions 32b and 33b are formed in the guide groove 30 of the upper end holding portion 21. The inclined portions 32b and 33b are formed at the ends of the pair of guide plates 32 and 33 in the Y direction. The inclined portions 32b and 33b are formed such that the width of the guide groove 30 expands toward the end in the Y direction. The inclined portions 32b and 33b are narrowed in such a manner that the width of the guide groove 30 is narrowed toward the center in the Y direction. form. The opposite side walls 32a, 33a of the guide sheets 32, 33 are formed to be parallel to the outside of the inclined portions 32b, 33b.

(下端部保持部) (lower end holding portion)

如第2圖所示,下端部保持部22沿著基板101的下端部101b配置。下端部保持部22與上端部保持部21在上下方向(Z方向)上對峙配置。如第5圖所示,下端部保持部22具備:支撐基板101的支撐板22a;及用於相對於支撐板22a保持基板101的基板按壓構件22b。 As shown in FIG. 2, the lower end holding portion 22 is disposed along the lower end portion 101b of the substrate 101. The lower end holding portion 22 and the upper end holding portion 21 are disposed to face each other in the vertical direction (Z direction). As shown in FIG. 5, the lower end holding portion 22 includes a support plate 22a for supporting the substrate 101, and a substrate pressing member 22b for holding the substrate 101 with respect to the support plate 22a.

支撐板22a從基板101的成膜面101e的相反側支撐基板101的下端部101b。基板按壓構件22b藉由從成膜面101e側按壓基板101的下端部101b來保持基板101。基板101的下端部101b從板厚方向X的兩側被支撐板22a及基板按壓構件22b夾持。下端部保持部22為能夠防止基板101的位置偏離之結構即可。 The support plate 22a supports the lower end portion 101b of the substrate 101 from the opposite side of the film formation surface 101e of the substrate 101. The substrate pressing member 22b holds the substrate 101 by pressing the lower end portion 101b of the substrate 101 from the side of the film formation surface 101e. The lower end portion 101b of the substrate 101 is sandwiched by the support plate 22a and the substrate pressing member 22b from both sides in the thickness direction X. The lower end holding portion 22 may be configured to prevent the position of the substrate 101 from being deviated.

下端部保持部22的下端面設置有朝搬送方向Y延伸且能夠與搬送輥11的周面11b抵接之軌道部26。軌道部26遍及搬送托盤20的長邊方向Y的整個長度直線形成。搬送托盤20設置有軌道部26,因此能夠使搬送托盤20的搬送穩定化。軌道部26的材質能夠使用例如不銹鋼。 The lower end surface of the lower end holding portion 22 is provided with a rail portion 26 that extends in the transport direction Y and that can abut against the circumferential surface 11b of the transport roller 11. The rail portion 26 is formed linearly over the entire length of the longitudinal direction Y of the transport tray 20. Since the conveyance tray 20 is provided with the rail part 26, the conveyance of the conveyance tray 20 can be stabilized. For the material of the rail portion 26, for example, stainless steel can be used.

(側端部保持部) (side end holding portion)

側端部保持部23(連結部)沿著基板101的側端部101c配置。與上端部保持部21及下端部保持部22相 同,側端部保持部23例如具備:支撐基板101的支撐板;及用於相對於支撐板保持基板101的基板按壓構件。側端部保持部23為能夠防止基板101的位置偏離或變形之結構即可。另外,一對側端部保持部23將上端部保持部21及下端部保持部22的Y方向的端部彼此連結,並形成矩形的框體。上端部保持部21、下端部保持部22及側端部保持部23可為一體成形者,亦可為連接分體的構件者。 The side end portion holding portion 23 (connection portion) is disposed along the side end portion 101c of the substrate 101. With the upper end holding portion 21 and the lower end holding portion 22 The side end portion holding portion 23 includes, for example, a support plate that supports the substrate 101 and a substrate pressing member that holds the substrate 101 with respect to the support plate. The side end portion holding portion 23 may be configured to prevent the position of the substrate 101 from being displaced or deformed. Further, the pair of side end holding portions 23 connect the end portions of the upper end portion holding portion 21 and the lower end portion holding portion 22 in the Y direction to each other to form a rectangular frame body. The upper end holding portion 21, the lower end portion holding portion 22, and the side end portion holding portion 23 may be integrally formed or may be connected to separate members.

如第2圖~第5圖所示,搬送托盤20形成有使基板101的背面101f(成膜面101e的相反側的面)露出之開口部25。開口部25例如被上端部保持部21、下端部保持部22及一對側端部保持部23包圍而形成。搬送托盤20上形成有開口部25,因此能夠使基板101的加熱效率及冷卻效率提高。 As shown in FIGS. 2 to 5, the transport tray 20 is formed with an opening 25 for exposing the back surface 101f of the substrate 101 (the surface on the opposite side to the film formation surface 101e). The opening portion 25 is formed, for example, by being surrounded by the upper end portion holding portion 21, the lower end portion holding portion 22, and the pair of side end portion holding portions 23. Since the opening portion 25 is formed in the transfer tray 20, the heating efficiency and the cooling efficiency of the substrate 101 can be improved.

(真空腔室) (vacuum chamber)

接著,參閱第2圖及第3圖,對真空腔室121~125進行說明。真空腔室121~125呈箱型,且具備頂板51、底板52、正面壁53(參閱第1圖)、背面壁54、入側壁55及出側壁56。頂板51及底板52為在上下方向Z上對峙配置之壁體。入側壁55及出側壁56為在搬送方向Y上對峙配置之壁體。入側壁55為作為基板101及搬送托盤20被搬入真空腔室121~125內之側之入口側壁體。出側壁56為作為基板101及搬送托盤20向真空腔室121~ 125外被搬出之側之出口側壁體。正面壁53及背面壁54係在基板101的板厚方向X上對峙配置之壁體。另外,第3圖中,省略正面壁53的圖示。 Next, the vacuum chambers 121 to 125 will be described with reference to FIGS. 2 and 3. The vacuum chambers 121 to 125 are box-shaped and include a top plate 51, a bottom plate 52, a front wall 53 (see FIG. 1), a rear wall 54, an inlet side wall 55, and an exit side wall 56. The top plate 51 and the bottom plate 52 are wall bodies that are disposed opposite to each other in the vertical direction Z. The entrance side wall 55 and the exit side wall 56 are wall bodies which are disposed opposite to each other in the conveyance direction Y. The inlet side wall 55 is an inlet side wall body that is carried into the side of the vacuum chambers 121 to 125 as the substrate 101 and the transfer tray 20. The exit side wall 56 serves as the substrate 101 and the transfer tray 20 to the vacuum chamber 121~ The exit side wall body of the side that is carried out on the outside of 125. The front wall 53 and the back wall 54 are wall bodies which are disposed opposite to each other in the thickness direction X of the substrate 101. In addition, in FIG. 3, illustration of the front wall 53 is abbreviate|omitted.

入側壁55上形成有用於將搬送托盤20及基板101搬入真空腔室121~125內之入口(開口部)55a。出側壁56上形成有用於將搬送托盤20及基板101向真空腔室121~125外搬出之出口(開口部)56a。 An inlet (opening) 55a for carrying the transfer tray 20 and the substrate 101 into the vacuum chambers 121 to 125 is formed in the inlet side wall 55. An outlet (opening) 56a for carrying out the transfer tray 20 and the substrate 101 to the outside of the vacuum chambers 121 to 125 is formed in the exit side wall 56.

第3圖中示出成膜腔室123的截面。成膜腔室123藉由以背面壁54朝外方(朝基板101的相反側)突出之方式配置來形成有凹部54a。該凹部54a內配置有上述蒸鍍裝置140。成膜腔室123中,藉由等離子槍生成等離子體,對保持於主爐缸之成膜材料進行加熱而使其蒸發。成膜材料蒸發而被離子化,成膜材料的粒子向凹部54a內擴散。向凹部54a內擴散之成膜材料的粒子朝向基板101飛行,並附著於基板101的表面(成膜面101e)。 The cross section of the film forming chamber 123 is shown in Fig. 3. The film forming chamber 123 is formed with a concave portion 54a by being disposed such that the back surface wall 54 protrudes outward (to the opposite side of the substrate 101). The vapor deposition device 140 is disposed in the recess 54a. In the film forming chamber 123, plasma is generated by a plasma gun, and the film forming material held in the main hearth is heated and evaporated. The film forming material is evaporated and ionized, and the particles of the film forming material diffuse into the concave portion 54a. The particles of the film formation material diffused into the concave portion 54a fly toward the substrate 101 and adhere to the surface of the substrate 101 (film formation surface 101e).

頂板51及底板52在搬送方向Y的一方端部與入側壁55接合,在搬送方向Y的另一方端部與出側壁56接合。正面壁53及背面壁54在搬送方向Y的一方端部與入側壁55接合,在搬送方向Y的另一方端部與出側壁56接合。頂板51及底板52在正面側與正面壁53接合,在背面側與背面壁54接合。該些壁體51~56例如藉由焊接結合成一體。另外,為了進行成膜腔室123內的維修,可為對局部壁體(例如,正面壁53)進行絞鏈結合而開閉自如的結構。 The top plate 51 and the bottom plate 52 are joined to the inlet side wall 55 at one end portion of the conveying direction Y, and joined to the outlet side wall 56 at the other end portion of the conveying direction Y. The front wall 53 and the rear wall 54 are joined to the inlet side wall 55 at one end of the conveying direction Y, and joined to the outlet side wall 56 at the other end of the conveying direction Y. The top plate 51 and the bottom plate 52 are joined to the front wall 53 on the front side and joined to the back wall 54 on the back side. The wall bodies 51 to 56 are integrally joined by welding, for example. Further, in order to perform maintenance in the film forming chamber 123, a structure in which a local wall body (for example, the front wall 53) is hinge-bonded and opened and closed can be used.

(搬送裝置) (transport device)

接著,對搬送基板101之搬送裝置10進行說明。如第2圖及第3圖所示,搬送裝置10具備:搬送輥配置於基板101的下端側的複數個搬送輥11;及配置於基板101的上端側的複數個從動輥12、13。 Next, the conveying device 10 that transports the substrate 101 will be described. As shown in FIG. 2 and FIG. 3, the transport apparatus 10 includes a plurality of transport rollers 11 in which the transport rollers are disposed on the lower end side of the substrate 101, and a plurality of driven rollers 12 and 13 disposed on the upper end side of the substrate 101.

如第2圖、第3圖及第5圖所示,複數個搬送輥11在搬送方向Y上以既定的間隔配置。如第5圖所示,搬送輥11固定於朝X方向延伸之旋轉軸14。旋轉軸14藉由一對軸承62被支撐為能夠旋轉。底板52上固定有用於支撐一對軸承62之支撐部61。 As shown in FIG. 2, FIG. 3, and FIG. 5, a plurality of conveyance rollers 11 are arranged at a predetermined interval in the conveyance direction Y. As shown in Fig. 5, the conveying roller 11 is fixed to a rotating shaft 14 that extends in the X direction. The rotating shaft 14 is supported to be rotatable by a pair of bearings 62. A support portion 61 for supporting a pair of bearings 62 is fixed to the bottom plate 52.

如第3圖所示,真空腔室121~125的背面壁54上形成有用於插通旋轉軸14之開口部54b。開口部54b上設置有軸封裝置15,前述軸封裝置能夠旋轉地支撐旋轉軸14,並密封真空腔室內與外部環境之間。軸封裝置15能夠使用例如磁性流體軸承。旋轉軸14貫穿背面壁54並從真空腔室121~125的內部延伸至外部。另外,旋轉軸14可構成為一體物,亦可係藉由在軸線方向上連結複數個構件而構成者。 As shown in FIG. 3, the back wall 54 of the vacuum chambers 121 to 125 is formed with an opening portion 54b through which the rotating shaft 14 is inserted. The opening portion 54b is provided with a shaft sealing device 15 that rotatably supports the rotating shaft 14 and seals between the vacuum chamber and the external environment. The shaft sealing device 15 can use, for example, a magnetic fluid bearing. The rotating shaft 14 penetrates the back wall 54 and extends from the inside of the vacuum chambers 121 to 125 to the outside. Further, the rotating shaft 14 may be formed as a single body or may be formed by connecting a plurality of members in the axial direction.

真空腔室121~125的外部設置有用於驅動旋轉軸14旋轉之驅動源(例如電動馬達)16。由驅動源16輸出之驅動力藉由具有搬送帶輪17及環狀搬送帶18之動力傳遞機構向複數個旋轉軸14傳遞。旋轉軸14的配置於真空腔室121~125外部之端部上安裝有複數個搬送帶輪17。設 置於在搬送方向Y上鄰接之旋轉軸14之搬送帶輪17上架設有環狀搬送帶18。與此相同,驅動源16的輸出軸上安裝有搬送帶輪17,輸出軸的搬送帶輪17及安裝於鄰接之旋轉軸14的搬送帶輪17上架設有環狀搬送帶18。藉此,能夠分配由驅動源16輸出之驅動力而驅動複數個旋轉軸14旋轉。另外,動力傳遞機構不限定於具備環狀搬送帶18及搬送帶輪17者,亦可為其他動力傳遞機構。可為例如具備鏈條及鏈輪者,亦可為具備其他動力傳遞軸等者。 A drive source (for example, an electric motor) 16 for driving the rotation of the rotary shaft 14 is provided outside the vacuum chambers 121 to 125. The driving force output from the drive source 16 is transmitted to the plurality of rotating shafts 14 by the power transmission mechanism having the conveying pulley 17 and the endless conveying belt 18. A plurality of transport pulleys 17 are attached to the end portions of the rotary shaft 14 disposed outside the vacuum chambers 121 to 125. Assume An endless conveyor belt 18 is placed on the transport pulley 17 that is placed adjacent to the rotary shaft 14 in the transport direction Y. Similarly, the conveyance pulley 17 is attached to the output shaft of the drive source 16, and the conveyance pulley 17 of the output shaft and the conveyance pulley 17 attached to the adjacent rotary shaft 14 are provided with the endless conveyance belt 18. Thereby, the driving force output from the drive source 16 can be distributed to drive the plurality of rotation shafts 14 to rotate. Further, the power transmission mechanism is not limited to the one having the endless conveyance belt 18 and the conveyance pulley 17, and may be another power transmission mechanism. For example, a chain and a sprocket may be provided, and other power transmission shafts may be provided.

而且,如第5圖所示,搬送輥11具有一對凸緣部11a,前述一對凸緣部配置成朝該搬送輥11的徑向外側突出,並且在旋轉軸14的軸線方向(X方向)上對峙且夾持搬送托盤20的下端部保持部22(軌道部26)的兩側。凸緣部11a與搬送托盤20的軌道部26的側面(在X方向上對峙之面)抵接而限制搬送托盤20的位置。 Further, as shown in Fig. 5, the conveying roller 11 has a pair of flange portions 11a which are arranged to protrude outward in the radial direction of the conveying roller 11, and in the axial direction of the rotary shaft 14 (X direction) The upper side of the lower end holding portion 22 (the rail portion 26) of the transport tray 20 is gripped and held. The flange portion 11a abuts against the side surface of the rail portion 26 of the transport tray 20 (the surface facing the crucible in the X direction) and restricts the position of the transport tray 20.

接著,對從動輥12、13進行說明。從動輥12、13在搬送方向Y上以既定的間隔配置。如第4圖所示,從動輥12(13)能夠旋轉地支撐於朝Z方向延伸之固定軸71上。另外,第4圖中,僅示出第1從動輥12,但第2從動輥13亦為相同結構。從動輥12、13能夠使用滾動軸承。如第2圖及第3圖所示,固定軸71被固定在頂板51之支撐構件72支撐。支撐構件72朝搬送方向Y延伸,並支撐複數個固定軸71。從動輥12、13不限定於滾動軸承,可為其他旋轉體。為了無衝擊地順暢進行與搬送托盤 20的接觸時的旋轉,從動輥12、13的旋轉慣性較小為較佳。 Next, the driven rollers 12 and 13 will be described. The driven rollers 12 and 13 are arranged at a predetermined interval in the transport direction Y. As shown in Fig. 4, the driven roller 12 (13) is rotatably supported by a fixed shaft 71 extending in the Z direction. In addition, in the fourth drawing, only the first driven roller 12 is shown, but the second driven roller 13 has the same configuration. The driven rollers 12, 13 can use rolling bearings. As shown in FIGS. 2 and 3, the fixed shaft 71 is supported by the support member 72 fixed to the top plate 51. The support member 72 extends in the conveying direction Y and supports a plurality of fixed shafts 71. The driven rollers 12 and 13 are not limited to the rolling bearing, and may be other rotating bodies. Smooth and unloaded pallets The rotation at the time of contact of 20 is preferable because the rotational inertia of the driven rollers 12 and 13 is small.

如第6圖所示,從動輥12、13具有配置於在X方向上不同之位置之第1從動輥12及第2從動輥13。若從Z方向觀察,從動輥12、13交錯配置。第1從動輥12配置在能夠與配置於X方向的一側之導引板32的壁面32a抵接之位置。第2從動輥13配置在能夠與配置於X方向的另一側的導引板33的壁面33a抵接的位置。從動輥12、13未與驅動裝置連結。當與搬送托盤20的壁面32a、33a接觸時,從動輥12、13隨著與其周面抵接之搬送托盤20的壁面32a、33a的移動而旋轉。 As shown in Fig. 6, the driven rollers 12 and 13 have the first driven roller 12 and the second driven roller 13 disposed at positions different in the X direction. When viewed in the Z direction, the driven rollers 12 and 13 are alternately arranged. The first driven roller 12 is disposed at a position that can abut against the wall surface 32a of the guide plate 32 disposed on one side in the X direction. The second driven roller 13 is disposed at a position that can abut against the wall surface 33a of the guide plate 33 disposed on the other side in the X direction. The driven rollers 12 and 13 are not coupled to the driving device. When the wall surfaces 32a and 33a of the transport tray 20 come into contact with each other, the driven rollers 12 and 13 rotate in accordance with the movement of the wall surfaces 32a and 33a of the transport tray 20 that abuts on the circumferential surface thereof.

第1從動輥12的旋轉中心O12配置於軸線L12上,第2從動輥13的旋轉中心O13配置於軸線L13上。軸線L12、L13配置於在X方向上不同之位置。 The rotation center O 12 of the first driven roller 12 is disposed on the axis L 12 , and the rotation center O 13 of the second driven roller 13 is disposed on the axis L 13 . The axes L 12 and L 13 are disposed at positions different in the X direction.

第1從動輥12與導引板32的壁面32a抵接,並伴隨搬送托盤20的移動而旋轉。第2從動輥13與導引板33的壁面33a抵接,並伴隨搬送托盤20的移動而旋轉。第1從動輥12及第2從動輥13在搬送方向Y上交替配置。第1從動輥12及第2從動輥13可係並非在搬送方向Y上交替配置者。例如可在搬送方向Y上,配置兩個第1從動輥12之後,再配置兩個第2從動輥13。 The first driven roller 12 abuts against the wall surface 32a of the guide plate 32, and rotates in accordance with the movement of the transport tray 20. The second driven roller 13 abuts against the wall surface 33a of the guide plate 33, and rotates in accordance with the movement of the transport tray 20. The first driven roller 12 and the second driven roller 13 are alternately arranged in the transport direction Y. The first driven roller 12 and the second driven roller 13 may not be alternately arranged in the transport direction Y. For example, after the two first driven rollers 12 are disposed in the transport direction Y, the two second driven rollers 13 are disposed.

第1從動輥12及第2從動輥13的外徑比導引槽30的寬度W30小。第1從動輥12與導引板33之間形成有既定間隙d1。第2從動輥13與導引板32之間形成有既定間 隙d2The outer diameters of the first driven roller 12 and the second driven roller 13 are smaller than the width W 30 of the guide groove 30. A predetermined gap d 1 is formed between the first driven roller 12 and the guide plate 33. A predetermined gap d 2 is formed between the second driven roller 13 and the guide plate 32.

而且,在X方向上,第1從動輥12的周面最靠壁面32a側(槽部的一對壁面的一側)之位置與第2從動輥13的周面最靠壁面33a側(槽部的一對壁面的另一側)之位置的距離W1,比導引槽30的一對導引板32、33間(槽部的一對壁面間)的距離W30小。 In the X direction, the position of the circumferential surface of the first driven roller 12 closest to the wall surface 32a (the side of the pair of wall surfaces of the groove portion) and the circumferential surface of the second driven roller 13 are closest to the wall surface 33a side ( W from the other side of the position of the pair of wall surfaces of the groove portions) of 1, than the guide grooves 30 of the pair of guide plates 32 and 33 between (the groove between the pair of wall portions) 30 a small distance W.

接著,對本實施形態的成膜裝置100的作用進行說明。首先,基板101被導入過渡腔室121內。過渡腔室121內藉由關閉開閉閘131、132被設為密封狀態,並被減壓至既定壓力。基板101在過渡腔室121內搬送,並被導入鄰接之緩衝腔室122內。 Next, the operation of the film forming apparatus 100 of the present embodiment will be described. First, the substrate 101 is introduced into the transition chamber 121. The opening and closing gates 131 and 132 are closed in the transition chamber 121 in a sealed state, and are depressurized to a predetermined pressure. The substrate 101 is transported in the transition chamber 121 and introduced into the adjacent buffer chamber 122.

成膜裝置100在導入有基板101之緩衝腔室122內對基板101進行加熱。例如在導入基板101之前,緩衝腔室122內被加熱至既定溫度。 The film forming apparatus 100 heats the substrate 101 in the buffer chamber 122 into which the substrate 101 is introduced. For example, before the substrate 101 is introduced, the inside of the buffer chamber 122 is heated to a predetermined temperature.

基板101被導入緩衝腔室122內。緩衝腔室122內藉由關閉開閉閘132、133被設為密封狀態,並被減壓至既定壓力(與成膜腔室123相同的壓力)。在基板101被加熱至適於成膜之溫度之後,基板101在緩衝腔室122內搬送,並被導入鄰接之成膜腔室123內。 The substrate 101 is introduced into the buffer chamber 122. The inside of the buffer chamber 122 is closed by closing the shutters 132 and 133, and is decompressed to a predetermined pressure (the same pressure as the film forming chamber 123). After the substrate 101 is heated to a temperature suitable for film formation, the substrate 101 is transported in the buffer chamber 122 and introduced into the adjacent film forming chamber 123.

在導入基板101之前,成膜腔室123內設為適合於成膜的減壓狀態。一旦基板101被導入成膜腔室123內,則開閉閘133、134被關閉而設為密封狀態。而且,成膜腔室123內藉由加熱器被加熱,成為維持基板溫度之狀態。另外,在基板101上進行成膜處理,在基板101上形成金 屬膜(薄膜層)。 Before the introduction of the substrate 101, the inside of the film forming chamber 123 is set to a reduced pressure state suitable for film formation. When the substrate 101 is introduced into the film forming chamber 123, the opening and closing gates 133 and 134 are closed and placed in a sealed state. Further, the inside of the film forming chamber 123 is heated by the heater to maintain the temperature of the substrate. Further, a film formation process is performed on the substrate 101 to form gold on the substrate 101. Is a membrane (film layer).

成膜裝置100在導入有基板101之緩衝腔室124內對基板101進行冷卻。例如在導入基板101之前,緩衝腔室124內被冷卻至既定溫度。另外,可不在緩衝腔室124內執行冷卻。 The film forming apparatus 100 cools the substrate 101 in the buffer chamber 124 into which the substrate 101 is introduced. For example, before the substrate 101 is introduced, the inside of the buffer chamber 124 is cooled to a predetermined temperature. Additionally, cooling may not be performed within the buffer chamber 124.

基板101被導入緩衝腔室124內。緩衝腔室124內藉由關閉開閉閘134、135而被設為密封狀態,並被減壓至既定壓力。基板101被冷卻之後,基板101在緩衝腔室124內搬送,並被導入鄰接之過渡腔室125內。 The substrate 101 is introduced into the buffer chamber 124. The inside of the buffer chamber 124 is closed by closing the opening and closing gates 134 and 135, and is depressurized to a predetermined pressure. After the substrate 101 is cooled, the substrate 101 is transported in the buffer chamber 124 and introduced into the adjacent transition chamber 125.

開放開閉閘136,過渡腔室125內大氣開放,藉此冷卻基板101。基板101被冷卻之後,基板101在過渡腔室125內搬送,並向過渡腔室125外導出。 The opening and closing gate 136 is opened, and the atmosphere in the transition chamber 125 is opened, thereby cooling the substrate 101. After the substrate 101 is cooled, the substrate 101 is transported in the transition chamber 125 and is led out to the transition chamber 125.

成膜裝置100中,由驅動源16輸出之驅動力利用搬送帶輪17及環狀搬送帶18被傳遞,藉此搬送輥11旋轉。藉由驅動搬送輥11旋轉,對保持基板101之搬送托盤20進行10搬送。搬送托盤20藉由在搬送方向Y上配置之複數個搬送輥11而驅動,在各真空腔室121~125內移動。 In the film forming apparatus 100, the driving force output from the drive source 16 is transmitted by the transport pulley 17 and the endless conveyance belt 18, whereby the conveyance roller 11 rotates. The conveyance tray 20 holding the substrate 101 is transported by 10 by the rotation of the drive conveyance roller 11. The conveyance tray 20 is driven by a plurality of conveyance rollers 11 arranged in the conveyance direction Y, and moves in each of the vacuum chambers 121 to 125.

成膜裝置100中,在與導引板32、33接觸時,配置於真空腔室121~125的上部側之從動輥12、13伴隨搬送托盤20的搬送而旋轉。此時,第1從動輥12僅與其中一方的導引板32抵接而旋轉。亦即,第1從動輥12朝相同方向旋轉。第2從動輥13僅與另一方的導引板33抵接而旋轉。亦即,第2從動輥13朝相同方向旋轉。相同的從 動輥12、13僅朝相同方向旋轉,藉此不阻礙基板搬送而穩定地引導搬送托盤20。 In the film forming apparatus 100, when the guide sheets 32 and 33 are in contact with each other, the driven rolls 12 and 13 disposed on the upper side of the vacuum chambers 121 to 125 are rotated by the conveyance of the transfer tray 20. At this time, the first driven roller 12 rotates only by abutting against one of the guide plates 32. That is, the first driven roller 12 rotates in the same direction. The second driven roller 13 rotates only in contact with the other guide plate 33. That is, the second driven roller 13 rotates in the same direction. The same from The moving rollers 12 and 13 rotate only in the same direction, thereby stably guiding the transport tray 20 without hindering the substrate conveyance.

第1從動輥12與導引槽30的壁面32a抵接,第2從動輥13與導引槽30的壁面33a抵接,藉此能夠使直立狀態的搬送托盤20及基板101的姿勢穩定。 The first driven roller 12 is in contact with the wall surface 32a of the guide groove 30, and the second driven roller 13 abuts against the wall surface 33a of the guide groove 30, whereby the posture of the transport tray 20 and the substrate 101 in the upright state can be stabilized. .

這種成膜裝置100中,具備對基板101及搬送托盤20進行搬送之複數個搬送輥11,因此能夠設為簡單結構之裝置。與習知之齒條小齒輪方式的驅動機構比較,能夠設為簡單之結構。而且,成膜裝置100中,搬送輥11配置於真空腔室121~125的底板52側(比基板101的下端更靠下方),因此即使伴隨搬送輥11的旋轉而產生粒子,亦會降低粒子附著於比搬送輥11更靠上方配置之基板101的可能性。藉此,能夠降低粒子附著於基板101之風險,抑制成膜基板的品質下降。 Since the film forming apparatus 100 includes a plurality of transport rollers 11 that transport the substrate 101 and the transport tray 20, it is possible to provide a device having a simple structure. Compared with the conventional rack and pinion type drive mechanism, it can be set as a simple structure. Further, in the film forming apparatus 100, the transport roller 11 is disposed on the bottom plate 52 side of the vacuum chambers 121 to 125 (below the lower end of the substrate 101). Therefore, even if particles are generated in association with the rotation of the transport roller 11, the particles are lowered. It is likely to adhere to the substrate 101 disposed above the conveyance roller 11 . Thereby, the risk of the particles adhering to the substrate 101 can be reduced, and the deterioration of the quality of the film formation substrate can be suppressed.

搬送輥11上形成有凸緣部11a,因此能夠使搬送托盤20相對於搬送輥11之位置穩定。藉此,能夠使搬送托盤20及基板101的姿勢穩定,並順暢地搬送。搬送輥11上設置有凸緣部11a,因此無需在基板101的下部側設置用於規定X方向上的位置的側輥或其他導引輥。因此,能夠設為簡單之結構。 Since the flange portion 11a is formed in the conveyance roller 11, the position of the conveyance tray 20 with respect to the conveyance roller 11 can be stabilized. Thereby, the postures of the transport tray 20 and the substrate 101 can be stabilized and can be smoothly transported. Since the flange portion 11a is provided on the conveying roller 11, it is not necessary to provide a side roller or another guide roller for defining a position in the X direction on the lower side of the substrate 101. Therefore, it can be set as a simple structure.

成膜裝置100為從動輥12、13與形成於搬送托盤20的上端部之一對導引板32、33抵接而旋轉之結構,因此能夠從上方限制搬送托盤20的位置,防止搬送托盤20的傾倒。藉此,能夠穩定且順暢地對搬送托盤20及基板 101進行搬送。 The film forming apparatus 100 is configured such that the driven rollers 12 and 13 are rotated by abutting against the guide sheets 32 and 33 at one of the upper end portions of the transport tray 20, so that the position of the transport tray 20 can be restricted from above and the transport tray can be prevented. 20 dumping. Thereby, the transport tray 20 and the substrate can be stably and smoothly 101 carries on the transfer.

而且,構成為從動輥12、13配置於導引槽30內,從動輥12、13會與未成膜之部份抵接。通過成膜腔室123之後的搬送托盤20的外面側附著有成膜材料,因此若輥與搬送托盤20的外面碰撞,則成膜材料剝離而產生粒子。本實施形態中,從動輥12、13與導引槽30內的壁面32a、33a抵接,因此能夠抑制粒子的產生。 Further, the driven rollers 12 and 13 are disposed in the guide groove 30, and the driven rollers 12 and 13 are in contact with the unformed portion. Since the film forming material adheres to the outer surface side of the transfer tray 20 after the film forming chamber 123, if the roll collides with the outer surface of the transfer tray 20, the film forming material is peeled off to generate particles. In the present embodiment, since the driven rollers 12 and 13 abut against the wall faces 32a and 33a in the guide groove 30, generation of particles can be suppressed.

複數個從動輥12、13具備:與一方的導引板32抵接的第1從動輥12;及與另一方的導引板33抵接的第2從動輥13,第1從動輥12及第2從動輥13在搬送方向Y上交替配置,因此搬送中的搬送托盤20與第1從動輥12及第2從動輥13交替抵接。藉此,能夠進一步使搬送托盤20及基板101的姿勢穩定而順暢地搬送。藉此,能夠實現搬送速度的提高。從動輥12、13在旋轉時,始終分別朝不同方向旋轉,因此從動輥12、13的旋轉方向不會朝逆旋轉轉換,能夠減小搬送托盤20被搬送時的摩擦阻力。因此,能夠實現搬送托盤20的順暢的搬送。 The plurality of driven rollers 12 and 13 include a first driven roller 12 that is in contact with one of the guide plates 32, and a second driven roller 13 that is in contact with the other guide plate 33, and the first driven roller 13 Since the roller 12 and the second driven roller 13 are alternately arranged in the transport direction Y, the transport tray 20 during transport alternately abuts the first driven roller 12 and the second driven roller 13 . Thereby, the postures of the transport tray 20 and the substrate 101 can be further stably and smoothly conveyed. Thereby, the conveyance speed can be improved. Since the driven rollers 12 and 13 are always rotated in different directions at the time of rotation, the rotational directions of the driven rollers 12 and 13 are not reversely rotated, and the frictional resistance when the transport tray 20 is transported can be reduced. Therefore, smooth conveyance of the conveyance tray 20 can be achieved.

成膜裝置100中,在X方向上,第1從動輥12的周面最靠壁面32a側的位置與第2從動輥13的周面最靠壁面33a側的位置的距離W1,比導引槽30的一對壁面32a、33a間的距離W30小。藉此,容許搬送托盤20相對於從動輥12、13之位置偏離,能夠穩定且順暢地對搬送托盤20及基板101進行搬送。進而,能夠減輕從動輥12、13與導引槽30的壁面32a、33a之間的摩擦阻力,提 高搬送速度。 W closest distance side of the wall surface 33a of 100, in the X direction, the circumferential surface of the first driven roller 12 closest to the side wall 32a of the deposition apparatus and the second circumferential surface position of a driven roller 13, than The distance W 30 between the pair of wall faces 32a, 33a of the guide groove 30 is small. Thereby, the position of the conveyance tray 20 with respect to the driven rollers 12 and 13 is allowed to be shifted, and the conveyance tray 20 and the board|substrate 101 can be conveyed stably and smoothly. Further, the frictional resistance between the driven rollers 12 and 13 and the wall faces 32a and 33a of the guide groove 30 can be reduced, and the conveyance speed can be increased.

本實施形態的搬送托盤20在上端面21c形成有在搬送方向Y上連續之導引槽,因此能夠將成膜裝置100的從動輥12、13配置於導引槽30內。伴隨基板搬送,導引槽30的壁面32a、33a與從動輥12、13抵接,從動輥12、13旋轉,因此能夠適宜地引導搬送托盤20的搬送。 Since the transport tray 20 of the present embodiment has the guide grooves continuous in the transport direction Y on the upper end surface 21c, the driven rollers 12 and 13 of the film forming apparatus 100 can be disposed in the guide grooves 30. With the substrate conveyance, the wall surfaces 32a and 33a of the guide groove 30 abut against the driven rollers 12 and 13, and the driven rollers 12 and 13 rotate. Therefore, the conveyance of the transport tray 20 can be appropriately guided.

而且,搬送托盤20的導引槽30上形成有傾斜部32b、33b,因此能夠使從動輥12、13進入導引槽30時的入口側端部的寬度較寬,越進入搬送方向的內側越窄。藉此,即使產生搬送托盤20相對於從動輥12、13之位置偏離,亦能夠防止從動輥12、13的碰撞並進行搬送。 Further, since the inclined portions 32b and 33b are formed in the guide groove 30 of the transport tray 20, the width of the inlet-side end portion when the driven rollers 12 and 13 enter the guide groove 30 can be wide, and the inside of the transport direction can be entered. The narrower. Thereby, even if the position of the conveyance tray 20 with respect to the driven rollers 12 and 13 is shifted, collision of the driven rollers 12 and 13 can be prevented and conveyed.

以上,依據其實施形態對本發明進行了具體說明,但本發明不限定於上述實施形態。本發明的成膜裝置不限定於離子鍍膜法,可適用其他成膜法(例如濺鍍法等)。 The present invention has been specifically described above based on the embodiments thereof, but the present invention is not limited to the above embodiments. The film forming apparatus of the present invention is not limited to the ion plating method, and other film forming methods (for example, sputtering methods) can be applied.

本發明的成膜裝置及成膜裝置用搬送托盤不限定於使基板直立而搬送者,亦可為使基板傾斜而搬送者。例如可為藉由使上述成膜裝置及搬送托盤傾斜來搬送傾斜的基板之結構。可係例如搬送輥的周面以與旋轉軸線交叉之方式形成者。亦可為使用使基板傾斜而支撐之搬送托盤來搬送基板之成膜裝置。使基板傾斜時的傾斜角度能夠相對於鉛垂方向設為0°~15°左右。 The film forming apparatus and the film forming apparatus transfer tray of the present invention are not limited to being carried by the substrate upright, and may be transported by tilting the substrate. For example, it is possible to transport the inclined substrate by tilting the film forming apparatus and the transfer tray. For example, the circumferential surface of the conveying roller may be formed to intersect the rotation axis. It is also possible to use a film forming apparatus that transports a substrate by using a transfer tray that supports the substrate to be tilted. The inclination angle when the substrate is inclined can be set to about 0 to 15 degrees with respect to the vertical direction.

而且,成膜裝置可為具有在其筐體內具備密封真空容器的開口部之閥體之閘閥部,該閘閥部的筐體內具備從動輥之結構。以往,在真空容器間配置的閘閥部的筐體內的 空間較小,因此無法設置搬送手段。本發明的成膜裝置中,能夠在閘閥部的筐體內設置從動輥並適宜地引導搬送托盤及基板的搬送方向。 Further, the film forming apparatus may be a gate valve portion having a valve body having an opening for sealing the vacuum container in the casing, and the casing of the gate valve portion is provided with a driven roller. In the past, in the housing of the gate valve portion disposed between the vacuum containers The space is small, so the transfer method cannot be set. In the film forming apparatus of the present invention, the driven roller can be provided in the casing of the gate valve portion, and the transport direction of the transport tray and the substrate can be appropriately guided.

而且,藉由使從動輥的外徑小徑化,能夠使搬送托盤20的厚度變薄。藉此,能夠抑制搬送托盤20所通過之開口部的大小。 Moreover, the thickness of the transfer tray 20 can be made thinner by reducing the outer diameter of the driven roller. Thereby, the size of the opening part through which the conveyance tray 20 passes can be suppressed.

10‧‧‧搬送裝置 10‧‧‧Transporting device

11‧‧‧搬送輥 11‧‧‧Transport roller

12‧‧‧從動輥 12‧‧‧ driven roller

13‧‧‧從動輥 13‧‧‧ driven roller

14‧‧‧旋轉軸 14‧‧‧Rotary axis

15‧‧‧軸封裝置 15‧‧‧ shaft sealing device

16‧‧‧驅動源 16‧‧‧Drive source

17‧‧‧搬送帶輪 17‧‧‧Transportation pulley

18‧‧‧環狀搬送帶 18‧‧‧Circular conveyor belt

21‧‧‧上端部保持部 21‧‧‧Upper Department Keeping Department

21a‧‧‧支撐板 21a‧‧‧Support board

21b‧‧‧基板按壓構件 21b‧‧‧Substrate pressing member

22‧‧‧下端部保持部 22‧‧‧Bottom keeping department

22a‧‧‧支撐板 22a‧‧‧Support plate

22b‧‧‧基板按壓構件 22b‧‧‧Substrate pressing member

23‧‧‧側端部保持部(連結部) 23‧‧‧ Side end holding part (connection part)

25‧‧‧開口部 25‧‧‧ openings

30‧‧‧導引槽 30‧‧‧ guiding slot

51‧‧‧頂板 51‧‧‧ top board

52‧‧‧底板 52‧‧‧floor

54‧‧‧背面壁 54‧‧‧Back wall

54a‧‧‧凹部 54a‧‧‧ recess

54b‧‧‧開口部 54b‧‧‧ openings

61‧‧‧支撐部 61‧‧‧Support

62‧‧‧一對軸承 62‧‧‧A pair of bearings

71‧‧‧固定軸 71‧‧‧Fixed shaft

72‧‧‧支撐構件 72‧‧‧Support members

100‧‧‧成膜裝置 100‧‧‧ film forming device

101‧‧‧基板 101‧‧‧Substrate

101e‧‧‧成膜面 101e‧‧‧film formation

101f‧‧‧背面 101f‧‧‧back

140‧‧‧蒸鍍裝置 140‧‧‧Vapor deposition unit

123‧‧‧成膜腔室(真空容器) 123‧‧‧ filming chamber (vacuum container)

Claims (9)

一種成膜裝置,是對基板進行成膜處理的成膜裝置,其特徵為具備:真空容器,其能夠容納前述基板;及搬送手段,其在前述真空容器內,在與前述板厚方向交叉之搬送方向上對搬送托盤進行搬送,前述搬送托盤以按前述基板的板厚方向成為水平方向之方式使前述基板直立之狀態、或以從直立之狀態傾斜之狀態保持前述基板,前述搬送手段具有:複數個搬送輥,其配置於前述基板的下端側,繞著沿著前述板厚方向延伸之第1軸線旋轉,並對前述搬送托盤進行搬送;及複數個從動輥,其配置於前述基板的上端側,繞著沿著與前述板厚方向及前述搬送方向交叉之方向延伸之第2軸線旋轉,前述搬送托盤的上端面形成有沿著前述搬送方向連續之槽部,前述從動輥抵接於前述槽部內的壁面且伴隨前述搬送托盤的移動而旋轉。 A film forming apparatus which is a film forming apparatus for performing a film forming process on a substrate, comprising: a vacuum container capable of accommodating the substrate; and a conveying means that intersects the thickness direction in the vacuum container The transport tray is transported in the transport direction, and the transport tray holds the substrate in a state in which the substrate is erected so that the thickness direction of the substrate is horizontal, or in a state of being inclined from an upright state. The transport means includes: a plurality of conveying rollers disposed on a lower end side of the substrate, rotating around a first axis extending in the thickness direction, and conveying the transfer tray; and a plurality of driven rollers disposed on the substrate The upper end side rotates around a second axis extending in a direction intersecting the thickness direction and the conveyance direction, and an upper end surface of the transfer tray is formed with a groove portion continuous along the conveyance direction, and the driven roller abuts The wall surface in the groove portion rotates in accordance with the movement of the transfer tray. 如申請專利範圍第1項所述之成膜裝置,其中,前述搬送托盤的下端面設置有朝前述搬送方向延伸且能夠抵接於前述搬送輥的周面之軌道部。 The film forming apparatus according to the first aspect of the invention, wherein the lower end surface of the transport tray is provided with a rail portion that extends in the transport direction and is capable of abutting against a circumferential surface of the transport roller. 如申請專利範圍第2項所述之成膜裝置,其中,前述複數個從動輥具備:與前述槽部內的一對壁面的 一方抵接的第1從動輥;及與前述槽部內的一對壁面的另一方抵接的第2從動輥;前述第1從動輥及前述第2從動輥在前述搬送方向上交替配置。 The film forming apparatus according to claim 2, wherein the plurality of driven rollers are provided with a pair of wall surfaces in the groove portion a first driven roller that abuts one; and a second driven roller that abuts against the other of the pair of wall surfaces in the groove portion; the first driven roller and the second driven roller alternate in the transport direction Configuration. 如申請專利範圍第3項所述之成膜裝置,其中,在前述板厚方向上,前述第1從動輥的周面最靠前述一對壁面的一側的位置與前述第2從動輥的周面最靠前述一對壁面的另一側的位置的距離,比前述槽部的一對壁面間的距離小。 The film forming apparatus according to the third aspect of the invention, wherein the circumferential surface of the first driven roller is located at a position closest to a side of the pair of wall surfaces and the second driven roller The distance between the circumferential surface and the other side of the pair of wall surfaces is smaller than the distance between the pair of wall surfaces of the groove portion. 如申請專利範圍第1~4項中任一項所述之成膜裝置,其中,前述搬送輥具有一對凸緣部,前述一對凸緣部配置成朝該搬送輥的徑向外側突出,並且在前述第1軸線方向上對峙且夾持前述搬送托盤的兩側。 The film forming apparatus according to any one of the first to fourth aspect, wherein the conveying roller has a pair of flange portions, and the pair of flange portions are disposed to protrude outward in a radial direction of the conveying roller. And facing each other in the first axial direction and sandwiching both sides of the transport tray. 如申請專利範圍第1~4項中任一項所述之成膜裝置,其中,前述成膜裝置具備閘閥部,前述閘閥部具備能夠密封前述真空容器的前述搬送托盤所通過之開口部的閥體,前述閘閥部上設置有前述從動輥。 The film forming apparatus according to any one of the first aspect of the present invention, wherein the film forming apparatus includes a gate valve portion, and the gate valve portion includes a valve that can seal an opening through which the transfer tray of the vacuum container passes The body of the gate valve portion is provided with the driven roller. 一種成膜裝置用搬送托盤,是在與前述板厚方向交叉之搬送方向上搬送時,能以按基板的板厚方向成為水平方向之方式使前述基板直立之狀態、或以從直立之狀態傾斜之狀態保持前述基板的成膜裝置用搬送托盤,其特徵 為具備:保持前述基板的上端部的上端部保持部;保持前述基板的下端部的下端部保持部;及連結前述上端部保持部及下端部保持部的連結部,前述上端部保持部的上端面形成有在搬送方向上連續之槽部。 In the transporting tray for a film forming apparatus, when the paper is conveyed in the transport direction intersecting the thickness direction, the substrate can be erected in a horizontal direction in the thickness direction of the substrate, or can be inclined from an upright state. In the state of holding the transfer tray for the film forming apparatus of the substrate, the characteristics thereof An upper end portion holding portion that holds an upper end portion of the substrate, a lower end portion holding portion that holds a lower end portion of the substrate, and a connecting portion that connects the upper end portion holding portion and the lower end portion holding portion, and the upper end portion holding portion The end surface is formed with a groove portion continuous in the conveying direction. 如申請專利範圍第7項所述之成膜裝置用搬送托盤,其中,前述槽部在前述搬送方向上的端部形成有傾斜部,前述傾斜部以該槽部的寬度朝向前述端部擴展之方式形成。 The transport tray for a film forming apparatus according to claim 7, wherein the groove portion has an inclined portion formed at an end portion in the transport direction, and the inclined portion is expanded toward the end portion by a width of the groove portion. The way is formed. 如申請專利範圍第7或8項所述之成膜裝置用搬送托盤,其中,前述下端部保持部的下端面設置有朝前述搬送方向延伸之軌道部。 The transfer tray for a film forming apparatus according to the seventh aspect of the invention, wherein the lower end surface of the lower end holding portion is provided with a rail portion extending in the transport direction.
TW102112355A 2012-07-05 2013-04-08 Film-forming apparatus and delivery tray used in film-forming apparatus TW201404914A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012151666A JP2014015633A (en) 2012-07-05 2012-07-05 Film deposition apparatus, and transport tray for film deposition apparatus

Publications (1)

Publication Number Publication Date
TW201404914A true TW201404914A (en) 2014-02-01

Family

ID=49928498

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102112355A TW201404914A (en) 2012-07-05 2013-04-08 Film-forming apparatus and delivery tray used in film-forming apparatus

Country Status (4)

Country Link
JP (1) JP2014015633A (en)
KR (1) KR101511179B1 (en)
CN (1) CN103526156A (en)
TW (1) TW201404914A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10460978B2 (en) * 2017-03-08 2019-10-29 Lam Research Corporation Boltless substrate support assembly
CN110257793A (en) * 2019-07-04 2019-09-20 深圳市捷佳伟创新能源装备股份有限公司 Tilt the filming equipment of conveying tray
JP7041702B2 (en) * 2020-03-05 2022-03-24 キヤノントッキ株式会社 Board holder, board processing device and film forming device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100567681B1 (en) * 2003-01-06 2006-04-07 이근종 Guiding rail for drawer
JP4331707B2 (en) * 2004-12-16 2009-09-16 三星モバイルディスプレイ株式會社 Alignment system, vertical tray transfer device, and vapor deposition device equipped with the same
KR100639004B1 (en) * 2005-01-05 2006-10-26 삼성에스디아이 주식회사 Device for sensing and transfering of tray
JP2006191039A (en) * 2005-01-05 2006-07-20 Samsung Sdi Co Ltd Tray transfer device
CN101641272B (en) * 2007-04-16 2011-11-16 株式会社爱发科 Conveyor, and film-forming apparatus and maintenance method thereof
KR101288599B1 (en) * 2007-05-29 2013-07-22 엘지디스플레이 주식회사 Apparatus for transferring substrates
JP2011074423A (en) * 2009-09-29 2011-04-14 Hitachi High-Technologies Corp Apparatus and method for manufacturing organic el device, and film deposition apparatus and film deposition method
JP5639431B2 (en) * 2010-09-30 2014-12-10 キヤノントッキ株式会社 Deposition equipment
JP5631159B2 (en) * 2010-11-09 2014-11-26 キヤノン株式会社 Sheet conveying apparatus and image forming apparatus

Also Published As

Publication number Publication date
KR20140005761A (en) 2014-01-15
JP2014015633A (en) 2014-01-30
CN103526156A (en) 2014-01-22
KR101511179B1 (en) 2015-04-10

Similar Documents

Publication Publication Date Title
TWI425587B (en) Conveyer, and film forming apparatus and maintenance method thereof
TWI653698B (en) Substrate processing system,vacuum rotation module for the same and method of depositing a layer stack in the same
JP5945553B2 (en) Coating apparatus and coating method
TWI444496B (en) Vacuum processing device
JP2002203884A (en) Apparatus for processing substrate and transfer chamber
TW200844021A (en) Conveying device
JP2009105081A (en) Substrate processing apparatus
JPS63299136A (en) Apparatus for treating substrates almost continuously
TW201404914A (en) Film-forming apparatus and delivery tray used in film-forming apparatus
JP2010518604A (en) Glass sheet semiconductor coating system and method and resulting product
TW201415572A (en) Substrate conveying tray for filming device and external open/close driving apparatus
WO2011026295A1 (en) Vacuum substrate conveying system
JP2002057203A (en) Substrate processing device
TW201832312A (en) Transfer module, substrate processing system having transfer chamber, and substrate processing method using substrate transfer system
JP2013174020A (en) Sputtering apparatus
US20200002807A1 (en) Vacuum processing apparatus
TWI648866B (en) Film forming device, film forming method, and manufacturing method of solar cell
JP5089906B2 (en) Vertical chemical vapor deposition system
CN103283011B (en) Film formation device
KR101188863B1 (en) Substrate Transfering Apparatus for Chamber System and Chamber System thereof
JP2004331349A (en) In-line type vacuum processing device
KR20140113289A (en) Substrate carrying tray and film forming apparatus
JP6055229B2 (en) To-be-processed object conveyance mechanism and vacuum processing apparatus
JP2008202146A (en) Vertical type chemical vapor deposition system, and film deposition method using the system
JP4478376B2 (en) Vertical chemical vapor deposition apparatus and film forming method using the apparatus