CN103526156A - Film forming apparatus and carrier tray for the same - Google Patents

Film forming apparatus and carrier tray for the same Download PDF

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Publication number
CN103526156A
CN103526156A CN201310263451.XA CN201310263451A CN103526156A CN 103526156 A CN103526156 A CN 103526156A CN 201310263451 A CN201310263451 A CN 201310263451A CN 103526156 A CN103526156 A CN 103526156A
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China
Prior art keywords
substrate
delivery tray
deposition system
film deposition
driven roll
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CN201310263451.XA
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Chinese (zh)
Inventor
饭尾逸史
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Publication of CN103526156A publication Critical patent/CN103526156A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00Roller-ways
    • B65G13/02Roller-ways having driven rollers
    • B65G13/06Roller driving means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention provides a film forming apparatus and carrier tray for the same. The film forming apparatus may achieve simplification of a driving mechanism, decrease a risk that particles adheres to a substrate, and suppress the decrease in the quality of the film forming substrate. The film forming apparatus (100) comprises a conveying device (10). The conveying device (10) comprises multiple conveying rollers (11) for conveying a substrate (101). Therefore, a simple structure is provided. In addition, the conveying rollers (11) are arranged at a bottom side of the substrate (101). Thus, even though particles are generated by the rotation of the conveying rollers (11), a probability of attaching the particles to the substrate (101) configured higher than the conveying rollers (11). Further, driven rollers (12, 13) rotated by being abutted against a wall surface of a groove portion (30) formed on the top portion of a conveying tray (20) is configured. The position of the conveying tray (20) can be restricted from top and the conveying tray (20) and the substrate (101) can be conveyed stably and smoothly.

Description

Film deposition system and film deposition system delivery tray
Technical field
The application advocates the right of priority of No. 2012-151666th, Japanese patent application based on July 5th, 2012 application.The full content of its application is by reference to being applied in this specification sheets.
The present invention relates to a kind of film deposition system and film deposition system delivery tray.
Background technology
Such as the objects such as substrate being carried out in the film deposition system of film forming, substrate carries (maintenance) on pallet and is transmitted.Substrate moves between a plurality of vacuum chambers, and is implemented the processing such as film forming.In recent years, follow the maximization of solar cell and display panels etc., substrate is also maximized.In can tackling the film deposition system of the substrate being maximized, the known device (for example referring to Patent Document 1) that has the posture of indulging transmission substrate and pallet.
In the device that patent documentation 1 is recorded, driving gear is arranged at the upper side of vacuum chamber, is formed in the upper end side of pallet with the rack-shaped of this driving gear engagement.By making the driving gear of vacuum chamber side rotate to make pallet to move in the horizontal direction.Substrate and pallet one coexist, and vacuum chamber is interior to be moved.
Patent documentation 1: Japanese kokai publication hei 1-268870 communique
Yet, in the technology that above-mentioned patent documentation 1 is recorded, adopt the complex structure of the driving mechanism of rack pinion mode, therefore require to simplify.And in above-mentioned conventional art, the driving mechanism of rack pinion mode is more closer to the top and configure than substrate, the particle therefore producing at driving mechanism is attached to substrate while falling, and has the possibility that the quality of film forming is declined.
Summary of the invention
The present invention completes in order to solve this problem, and its object is to provide a kind of simplification that can realize driving mechanism, and reduces the risk that particle is attached to substrate, suppresses film deposition system and the film deposition system delivery tray of the quality decline of substrate for film deposition.
The invention provides a kind of film deposition system, it carries out film forming processing to substrate, and wherein, described film deposition system possesses: vacuum vessel, and it can hold substrate; And transporting mechanism, on its delivery direction in vacuum vessel, the delivery tray that keeps described substrate being intersected in the thickness of slab direction with described substrate, transmit, and described delivery tray so that the thickness of slab direction of substrate become horizontal direction or become the mode of the direction tilting from horizontal direction, so that the upright state of substrate or the state that tilts with the state from upright keep substrate, transporting mechanism has: a plurality of transfer rollers, it is disposed at the lower end side of substrate, around the 1st axis rotation of extending along thickness of slab direction, and delivery tray is transmitted; And a plurality of driven rolls, it is disposed at the upper end side of substrate, the 2nd axis rotation of extending around the direction along intersecting with thickness of slab direction and delivery direction, the upper surface of delivery tray is formed with along the continuous slot part of delivery direction, the wall butt in driven roll and slot part and follow the movement of delivery tray and rotate.
According to this film deposition system, it is the structure with the transport unit that possesses a plurality of transfer rollers that substrate is transmitted, and therefore can be made as the device of simple structure.For example compare with the transporting mechanism of rack pinion mode in the past, can be made as simple structure.And in film deposition system, transfer roller is disposed at the lower end side of substrate, even if therefore follow the rotation of transfer roller, produce particle, it is also lower that particle is attached to possibility more closer to the top than transfer roller and substrate that configure.Thus, can reduce the risk that particle is attached to substrate, the quality that suppresses substrate for film deposition declines.And, be configured to driven roll and rotate with being formed at the wall butt in the slot part of upper end of delivery tray, therefore can limit from top the position of delivery tray, can stablize and transmit swimmingly delivery tray and substrate.
Also the lower surface that can be delivery tray be provided with to delivery direction extend and can with the structure of the orbit portion of the side face butt of transfer roller.If the lower surface of delivery tray is provided with orbit portion, can make the driving stability of delivery tray.
At this, preferred a plurality of driven rolls possess: the 1st driven roll, a side butt of 1 pair of wall in itself and slot part; And the 2nd driven roll, opposite side butt, the 1st driven roll and the 2nd driven roll alternately configured on delivery direction of 1 pair of wall in itself and slot part.In the film deposition system of this structure, the 1st driven roll only with the slot part of delivery tray in a side butt of 1 pair of wall, the 2nd driven roll only with the slot part of delivery tray in the opposite side butt of 1 pair of wall.Thus, the 1st driven roll and the 2nd driven roll, all the time respectively to different directions rotation, therefore can prevent that the sense of rotation of driven roll is to conversion in the other direction.Therefore, the friction resistance in the time of can reducing delivery tray 20 and be transmitted, so can realize the transmission smoothly of delivery tray.
And preferably, in thickness of slab direction, the side face of the 1st driven roll leans on the distance of the position of a side of 1 pair of wall and the position of the opposite side that the side face of the 2nd driven roll leans on 1 pair of wall most less than the distance between 1 pair of wall of slot part most.According to the film deposition system of this structure, allow that delivery tray is with respect to the position deviation of driven roll, can stablize and transmit swimmingly delivery tray and substrate, and then, alleviate the friction resistance of driven roll and slot part wall, more easily improve transfer rate.
And preferably transfer roller has 1 pair of flange part, described 1 pair of flange part is configured to the radial outside of this transfer roller outstanding, and on the 1st axis direction the both sides of opposed and clamping delivery tray.According to the film deposition system of this structure, be configured to be formed at transfer roller from 1 pair of flange part of the bottom of the sandwich delivery tray of thickness of slab direction, therefore can make delivery tray with respect to the position stability of transfer roller.Thus, can make the stable posture of delivery tray and substrate and transmit swimmingly.
Film deposition system can be possesses gate valve portion, and described gate valve portion possesses the valve body of the peristome that passes through of delivery tray that can sealed vacuum container, and in gate valve portion, is provided with the structure of driven roll.In the film deposition system of this structure, in gate valve portion, dispose driven roll, therefore can make the stable posture of delivery tray and substrate and transmit swimmingly.
The invention provides a kind of film deposition system delivery tray, its mode that becomes horizontal direction with the thickness of slab direction by substrate or become the direction tilting from horizontal direction by substrate with upright state or the state that tilts with the state from upright when the direction of intersecting with thickness of slab direction transmits, can keep substrate, described film deposition system possesses with delivery tray: upper end maintaining part, and it keeps the upper end of substrate; Bottom maintaining part, it keeps the bottom of substrate; And linking part, it links upper end maintaining part and bottom maintaining part, and the upper surface of upper end maintaining part is formed with slot part continuous on delivery direction.
This film deposition system can be applicable to above-mentioned film deposition system with delivery tray.This film deposition system is formed with slot part continuous on delivery direction with delivery tray in the upper surface of upper end maintaining part, therefore the driven roll of above-mentioned film deposition system can be disposed to slot part.Follow the transmission of delivery tray, slot part wall and driven roll butt, driven roll rotation.Driven roll can guide aptly the delivery direction of delivery tray when substrate transmits.
Preferably the end of slot part on delivery direction is formed with the rake that the mode expanded towards end with the width of this slot part forms.The film deposition system of this structure is with in delivery tray, the wider width of inlet side end when driven roll enters slot part, and the inner side that more enters delivery direction more narrows down, and therefore can alleviate the impact of position deviation and transmits swimmingly.Even if produce delivery tray with respect to the position deviation of driven roll, also can prevent the collision of driven roll and transmit.
The lower surface that can be bottom maintaining part is provided with the structure of the orbit portion extending to delivery direction.If the lower surface of delivery tray is provided with orbit portion, can make the driving stability of delivery tray.
Invention effect
The present invention can provide a kind of film deposition system, and it can realize the simplification of driving mechanism, and reduces the risk that particle is attached to substrate, and the quality that suppresses substrate for film deposition declines.
And the present invention can provide a kind of film deposition system delivery tray, it can be applicable to above-mentioned film deposition system, can be embodied as the simplification of the driving mechanism of film device, and reduces the risk that particle is attached to substrate, and the quality that suppresses substrate for film deposition declines.
Accompanying drawing explanation
Fig. 1 means the summary side-view of the film deposition system that embodiments of the present invention are related.
Fig. 2 represents the sectional view in chamber from side.
Fig. 3 represents the sectional view in film forming chamber from the place ahead of delivery direction.
Fig. 4 means the sectional view of the upper end of delivery tray.
Fig. 5 means the sectional view of the bottom of delivery tray.
Fig. 6 means the vertical view of the upper end of delivery tray.
Fig. 7 means the vertical view of the rake of the upper end that is formed at delivery tray.
In figure: 10-transport unit, 11-transfer roller, 11a-flange part, 11b-side face, 12, 13-driven roll, 14-turning axle, 20-delivery tray, 21-upper end maintaining part, 22-bottom maintaining part, 23-side end maintaining part (linking part), 26-orbit portion, 30-guide path, 32, 33-guide plate, 32a, 33a-wall (wall in slot part), 51-top board, 52-base plate, 53-face wall, 54-back face wall, 55-enters sidewall, 56-goes out sidewall, 100-film deposition system, 101-substrate, 121, 125-transition chamber thereof (vacuum vessel), 122, 124-buffer chamber (vacuum vessel), 123-film forming chamber (vacuum vessel), 140-evaporation coating device.
Embodiment
With reference to accompanying drawing, film deposition system involved in the present invention is described.In addition, " on ", D score etc. represent direction base in state shown in the drawings, for the ease of understanding, use.And, XYZ rectangular coordinate system is also shown in Fig. 1~Fig. 7 for convenience of explanation.
(film deposition system)
Fig. 1 means the summary side-view of the related film deposition system of embodiments of the present invention 100.In Fig. 1, substrate 101(is shown with reference to figure 2) the side of delivery direction Y.Film deposition system 100 shown in Fig. 1 be for to substrate 101(such as glass substrate) implement the device that film forming etc. is processed.Film deposition system 100 is for carrying out the device of the film forming based on for example RPD method (reactive plasma vapour deposition method).Film deposition system 100 possesses the plasma gun (140) that generates plasma body, uses the plasma body generating, and film forming material is carried out to ionization, makes the particle of film forming material be attached to the surface of substrate 101, carries out thus film forming.
Film deposition system 100 can be applicable to such as the solar cell manufacturing installation of manufacturing solar cell, manufacture the liquid crystal display device manufacturing installation of liquid crystal display device and the plane input element manufacturing installation of manufacture plane input element (contact panel) etc.
Film deposition system 100 possesses transition chamber thereof 121, buffer chamber 122, film forming chamber (filming chamber) 123, buffer chamber 124 and transition chamber thereof 125.These chambers 121~125 are arranged in order configuration.All chambers 121~125 consist of vacuum vessel, and the setup of entrances and exits of chamber 121~125 has the lock 131~136 of switching.Film deposition system 100 can be the structure that is arranged with a plurality of buffer chamber 122,124, film forming chamber 123.
On each vacuum chamber 121~125, be connected with for inside being made as to the vacuum pump (not shown) of suitable pressure.And, in each vacuum chamber 121~125, be provided with a plurality of (for example 2) for monitoring the vacuscope (not shown) of the pressure in chamber.Each chamber 121~125 is communicated with the Vacuum exhaust tube being connected with vacuum pump, on this Vacuum exhaust tube, is provided with vacuscope.
As shown in Figure 2, film deposition system 100 is provided with for transmitting the transport unit 10 of the delivery tray 20 that keeps substrate 101.Transport unit 10 is in vacuum chamber 121~125 so that the device (detailed content is carried out aftermentioned) that the upright state of substrate 101 and delivery tray 20 transmits.
Then,, with reference to figure 1, various vacuum chambers 121~125 are described.Transition chamber thereof 121 is for as lower chambers: open the switching lock 131 that is arranged at inlet side, be opened in thus in atmosphere, import processed substrate 101 and keep the delivery tray 20 of this substrate 101.The outlet side of transition chamber thereof 121 is connected with the inlet side of buffer chamber 122 through opening and closing lock 132.
Buffer chamber 122 is as overdraft adjustment chamber: open the switching lock 132 that is arranged at inlet side, be communicated with thus with transition chamber thereof 121, import by the substrate 101 after transition chamber thereof 121.The outlet side of buffer chamber 122 is connected with the inlet side of film forming chamber 123 through opening and closing lock 133.And buffer chamber 122 is provided with the well heater (not shown) for substrate 101 is heated.This well heater heats the film forming face of substrate 101 (by the face of film forming), and with film forming face arranged opposite.In present embodiment, substrate 101 is with erectility configuration, so film forming face configures along above-below direction.In buffer chamber 122, substrate temperature is heated as for example 200 ℃ of left and right.Buffer chamber 122 is arranged at the prime of film forming chamber 123, as the heating that substrate 101 is heated, with chamber, plays a role.
As well heater, can use for example lamp formula well heater.Lamp formula well heater is bar-shaped, and direction Z extends up and down.Lamp formula well heater is provided with in buffer chamber 122 a plurality of (for example 12), and across predetermined interval, configures on delivery direction Y.The heat of well heater conducts heat to substrate 101, and substrate 101 is heated.
Film forming chamber 123 is following treatment chamber: open the switching lock 133 that is arranged at inlet side, be communicated with thus with buffer chamber 122, import by substrate 101 and delivery tray 20 after buffer chamber 122, at substrate 101 film forming thin film layers.The outlet side of film forming chamber 123 is connected with the inlet side of buffer chamber 124 through opening and closing lock 134.As shown in Figure 3, film forming chamber 123 be provided with at substrate 101 by the evaporation coating device 140 of film forming material (thin film layer) film forming.Evaporation coating device 140 is by being held in the main cupola well of mould material and plasma beam being irradiated in plasma gun of main cupola well etc. and formed.And film forming chamber 123 is provided with the well heater for substrate 101 is heated.This well heater is for example arranged to from the face of the back side 101f(film forming face 101e opposition side of substrate 101) side heats substrate 101.In film forming chamber 123, substrate temperature maintains for example 200 ℃ of left and right.
Buffer chamber shown in Fig. 1 124 for as overdraft adjustment chamber: open the switching lock 134 that is arranged at inlet side, be communicated with thus with film forming chamber 123, importing is by the substrate 101 after film forming chamber 123 film forming and keep the delivery tray 20 of described substrate.The outlet side of buffer chamber 124 is connected with the inlet side of transition chamber thereof 125 through opening and closing lock 135.And buffer chamber 124 is provided with for substrate 101 is carried out to cooling cooling plate (not shown).This cooling plate carries out cooling to the film forming face of substrate 101, and with the film forming face arranged opposite of substrate 101.Also can be the back side 101f side possessing from substrate 101 and substrate 101 is carried out to the structure of cooling cooling plate.In buffer chamber 124, substrate temperature is cooled to for example 120 ℃ of left and right.Buffer chamber 124 is arranged at the rear class of film forming chamber 123, and as substrate 101 being carried out to cooling coolingly play a role with chamber.In addition, also can be the structure that cooling body is not set in buffer chamber 124.Also can be under the atmospheric pressure environment after out from vacuum chamber, by atmosphere, substrate 101 is carried out the structure of cooling (air cooling).
Cooling plate plays a role as substrate 101 is carried out to cooling cooling body.Cooling plate is for example formed by copper coin, is tabular, and to configure with the opposed mode of substrate 101.Cooling plate is provided with the cooling tube (not shown) that makes water coolant circulation.The heat of substrate 101 conducts heat to cooling plate, and the heat that is passed to cooling plate conducts heat to cooling tube, and cooling tube is by the water quench flowing through in pipe.Thus, cooling plate is cooled and cooling base 101.
Transition chamber thereof 125 is as lower chambers: open the switching lock 135 that is arranged at inlet side, be communicated with thus with buffer chamber 124, import by the substrate 101 after buffer chamber 124.The outlet side of transition chamber thereof 125 is provided with and opens and closes lock 136, opens and opens and closes lock 136, and transition chamber thereof 125 is opened in atmosphere thus.In transition chamber thereof 125, by atmosphere opening, carry out air cooling, the moment being transferred into outside chamber at substrate 101 is cooled to below 100 ℃.
(delivery tray)
Then,, with reference to figure 2~Fig. 7, the delivery tray 20 using in the film deposition system 100 of present embodiment is described.When so that the upright state of substrate 101 while transmitting, delivery tray 20 keeps substrates 101.Make the upright state of substrate 101 refer to that the thickness of slab direction X of substrate 101 becomes the state of horizontal direction.Now, the film forming face of substrate 101 configures along above-below direction Z.In addition, also can be the structure that keeps substrate 101 with the state from the upright state inclination of substrate 101.The thickness of slab direction X of substrate 101 both can be the direction of approximate horizontal, also can tilt from horizontal direction.Thickness of slab direction X be with above-below direction Z quadrature and with the direction of the delivery direction Y quadrature of substrate 101.
As shown in Figure 2, delivery tray 20 forms as the framework of the rectangle of the end of maintenance substrate 101.Delivery tray 20 possesses: upper end maintaining part 21, and it keeps the upper end 101a of substrate 101; Bottom maintaining part 22, it keeps the bottom 101b of substrate 101; And 1 pair of side end maintaining part 23, it keeps the side end 101c of substrate 101.The delivery tray 20 of present embodiment is configured to and keeps 1 substrate 101.Delivery tray 20 also can be the structure that can keep a plurality of (for example 2) substrate 101.Delivery tray can keep the complete cycle of the edge part of substrate 101, also can keep the part of the edge part of substrate 101.As the material of upper end maintaining part 21, bottom maintaining part 22, side end maintaining part 23, can use for example stainless steel.
(upper end maintaining part)
Upper end maintaining part 21 is along the upper end 101a configuration of substrate 101.As shown in Figure 4, upper end maintaining part 21 possesses: supporting plate 21a, its supporting substrates 101; And substrate pressing component 21b, it is for keeping substrate 101 with respect to supporting plate 21a.
Supporting plate 21a is from the upper end 101a of the opposition side supporting substrates 101 of the film forming face 101e of substrate 101.Substrate pressing component 21b keeps substrate 101 by press the upper end 101a of substrate 101 from film forming face 101e side.The upper end 101a of substrate 101 is supported plate 21a and substrate pressing component 21b clamping from the both sides of thickness of slab direction X.Upper end maintaining part 21 is for preventing the structure of the position deviation of substrate 101.
(guide path)
As shown in Fig. 4, Fig. 6, Fig. 7, the end face of upper end maintaining part 21 (upper surface) 21c is formed with the guide path 30 for the delivery direction (Y-direction) of regulation delivery tray 20.Guide path 30 is configured to driven roll 12 described later, 13(guide roller) can enter.Guide path 30 spreads all in the Y direction the whole length of upper end maintaining part 21 and forms.Guide path 30 forms in the mode caving in downwards.Guide path 30 can for example be cut and be formed by the end face 21c to upper end maintaining part 21, also can form by assembling a plurality of parts.
Upper end maintaining part 21 has 1 pair of guide plate 32,33 of giving prominence to upward from the supporting plate 21a of supporting substrates 101.1 pair of guide plate 32,33 arranged opposite on directions X.Opposed wall 32a, the 33a of 1 pair of guide plate 32,33 is 1 pair of wall in guide path 30.1 pair of guide plate 32,33 is for example fixed on main body 31 by bolt 34.In addition, in Fig. 6 and Fig. 7, omit the diagram of bolt 34.
(rake)
Fig. 7 means the vertical view of the rake of the upper end that is formed at delivery tray 20.As shown in Figure 7, in the guide path 30 of upper end maintaining part 21, be formed with rake 32b, 33b.Rake 32b, 33b are formed at the end of the Y-direction of 1 pair of guide plate 32,33.Rake 32b, 33b with the width of guide path 30 towards the end of Y-direction and the mode of expanding form.The mode that rake 32b, 33b narrow down towards the central authorities of Y-direction with the width of guide path 30 forms.Opposed wall 32a, the 33a of guide plate 32,33 form except rake 32b, 33b parallel.
(bottom maintaining part)
As shown in Figure 2, bottom maintaining part 22 is along the bottom 101b configuration of substrate 101.Bottom maintaining part 22 and upper end maintaining part 21 are in the upper arranged opposite of above-below direction (Z direction).As shown in Figure 5, bottom maintaining part 22 possesses: supporting plate 22a, its supporting substrates 101; And substrate pressing component 22b, it is for keeping substrate 101 with respect to supporting plate 22a.
Supporting plate 22a is from the bottom 101b of the opposition side supporting substrates 101 of the film forming face 101e of substrate 101.Substrate pressing component 22b keeps substrate 101 by press the bottom 101b of substrate 101 from film forming face 101e side.The bottom 101b of substrate 101 is supported plate 22a and substrate pressing component 22b clamping from the both sides of thickness of slab direction X.Bottom maintaining part 22 is for preventing the structure of the position deviation of substrate 101.
The lower surface of bottom maintaining part 22 be provided with to delivery direction Y extend and can with the orbit portion 26 of the side face 11b butt of transfer roller 11.The whole length straight line that orbit portion 26 spreads all over the long side direction Y of delivery tray 20 forms.Delivery tray 20 is provided with orbit portion 26, therefore can make the transmission stabilization of delivery tray 20.As the material of orbit portion 26, can use for example stainless steel.
(side end maintaining part)
Side end maintaining part 23(linking part) the side end 101c along substrate 101 configures.Identical with upper end maintaining part 21 and bottom maintaining part 22, side end maintaining part 23 for example possesses: supporting plate, its supporting substrates 101; And substrate pressing component, it is for keeping substrate 101 with respect to supporting plate.Side end maintaining part 23 is for can prevent the position deviation of substrate 101 or the structure of distortion.In addition, the end of the Y-direction of 23 pairs of upper end maintaining parts 21 of 1 pair of side end maintaining part and bottom maintaining part 22 links each other, and forms the framework of rectangle.Upper end maintaining part 21, bottom maintaining part 22 and side end maintaining part 23 can be one of the forming, and the parts that also can be connection split form.
As shown in Fig. 2~Fig. 5, delivery tray 20 is formed with the face of the opposition side of the back side 101f(film forming face 101e that makes substrate 101) peristome 25 that exposes.Peristome 25 is for example surrounded and forms by upper end maintaining part 21, bottom maintaining part 22 and 1 pair of side end maintaining part 23.On delivery tray 20, be formed with peristome 25, therefore can make the heating efficiency of substrate 101 and cooling efficiency improve.
(vacuum chamber)
Then,, with reference to figure 2 and Fig. 3, vacuum chamber 121~125 is described.Vacuum chamber 121~125 is box, and possesses top board 51, base plate 52, face wall 53(with reference to figure 1), back face wall 54, enter sidewall 55 and go out sidewall 56.Top board 51 and base plate 52 are wall bodies of arranged opposite on above-below direction Z.Enter sidewall 55 and go out the wall body that sidewall 56 is arranged opposite on delivery direction Y.Entering sidewall 55 is that the side that substrate 101 and delivery tray 20 are moved in vacuum chamber 121~125 is inlet side wall body.Going out sidewall 56 is that the side that substrate 101 and delivery tray 20 are taken out of outside vacuum chamber 121~125 is outlet side wall body.Face wall 53 and back face wall 54 are wall bodies of arranged opposite on the thickness of slab direction X of substrate 101.In addition, in Fig. 3, omit the diagram of face wall 53.
Enter on sidewall 55 and be formed with for delivery tray 20 and substrate 101 are moved into entrance (peristome) 55a in vacuum chamber 121~125.Go out outlet (peristome) 56a being formed with on sidewall 56 for delivery tray 20 and substrate 101 are taken out of outside vacuum chamber 121~125.
The cross section of the chamber of film forming shown in Fig. 3 123.Film forming chamber 123 configures to be formed with recess 54a in the outstanding mode of back face wall 54Xiang foreign side (to the opposition side with substrate 101).In this recess 54a, dispose above-mentioned evaporation coating device 140.In film forming chamber 123, by plasma gun, generate plasma body, to being held in the film forming material of main cupola well, heating and make its evaporation.Film forming material evaporates and is ionized, and the particle of film forming material is to recess 54a internal diffusion.To the particle of the film forming material of recess 54a internal diffusion, towards substrate 101 flights, and be attached to the surface (film forming face 101e) of substrate 101.
Top board 51 and base plate 52, in the end of a side of delivery direction Y, engage with entering sidewall 55, in the end of the opposite side of delivery direction Y, and go out sidewall 56 and engage.Face wall 53 and back face wall 54, in the end of a side of delivery direction Y, engage with entering sidewall 55, in the end of the opposite side of delivery direction Y, and go out sidewall 56 and engage.Top board 51 and base plate 52 engage with face wall 53 in face side, and side engages with back face wall 54 overleaf.These wall bodies 51~56 are for example integral by solder bond.In addition, in order to carry out the maintenance in film forming chamber 123, local wall body (for example, face wall 53) can be carried out hinge in conjunction with and be made as switching structure freely.
(transport unit)
Then, to transmitting the transport unit 10 of substrate 101, describe.As shown in Figures 2 and 3, transport unit 10 possesses: a plurality of transfer rollers 11, are disposed at the lower end side of substrate 101; And a plurality of driven rolls 12,13, be disposed at the upper end side of substrate 101.
As shown in Fig. 2, Fig. 3 and Fig. 5, a plurality of transfer rollers 11 arranged spaced to be scheduled on delivery direction Y.As shown in Figure 5, transfer roller 11 is fixed on the turning axle 14 extending to directions X.Turning axle 14 is supported to and can be rotated by 1 pair of bearing 62.On base plate 52, be fixed with for supporting the support 61 of 1 pair of bearing 62.
As shown in Figure 3, in the back face wall 54 of vacuum chamber 121~125, be formed with for inserting the peristome 54b of logical turning axle 14.On peristome 54b, be provided with gland seal device 15, described gland seal device supports turning axle 14 for rotating, and in sealed vacuum chamber and between outside atmosphere.As gland seal device 15, can use for example magnetic fluid bearing.Turning axle 14 runs through back face wall 54 and extends outward from the inside of vacuum chamber 121~125.In addition, turning axle 14 can be the axle forming as one thing, also can be the axle forming by link a plurality of parts on axis direction.
The outer setting of vacuum chamber 121~125 is useful on the drive source (for example electro-motor) 16 that rotarilys actuate turning axle 14.From the motivating force of drive source 16 outputs, by thering is the Poewr transmission mechanism of transmission belt wheel 17 and endless conveyor belt 18, to a plurality of turning axles 14, transmit.A plurality of transmission belt wheels 17 are installed on the end that is disposed at vacuum chamber 121~125 outsides of turning axle 14.The added endless conveyor belt 18 that is provided with of transmission belt wheel 17 arranging on the turning axle 14 of adjacency on delivery direction Y.Identical therewith, on the output shaft of drive source 16, be provided with and transmit belt wheel 17, the transmission belt wheel 17 of output shaft and be installed on the added endless conveyor belt 18 that is provided with of transmission belt wheel 17 of the turning axle 14 of adjacency.Thus, can distribute the motivating force of being exported by drive source 16 and a plurality of turning axles 14 are rotarilyd actuate.In addition, Poewr transmission mechanism is not limited to the mechanism that possesses endless conveyor belt 18 and transmit belt wheel 17, also can be other Poewr transmission mechanisms.Can be the mechanism that for example possesses chain and sprocket wheel, also can be the mechanism that possesses other power transmission shafts etc.
And, as shown in Figure 5, transfer roller 11 has 1 couple of flange part 11a, and described 1 pair of flange part is configured to the radial outside of this transfer roller 11 outstanding, and at the bottom maintaining part 22(orbit portion 26 of the upper opposed and clamping delivery tray 20 of the axis direction (directions X) of turning axle 14) both sides.The side of the orbit portion 26 of flange part 11a and delivery tray 20 (opposed face on directions X) butt and the position of limiting delivery tray 20.
Then, driven roll 12,13 is described.Driven roll 12,13 arranged spaced to be scheduled on delivery direction Y.As shown in Figure 4, driven roll 12(13) can be supported on rotatably on the stationary shaft 71 extending to Z direction.In addition, in Fig. 4, the 1st driven roll 12 is only shown, but the 2nd driven roll 13 is also same structure.As driven roll 12,13, can use rolling bearing.As shown in Figures 2 and 3, stationary shaft 71 is supported in the support unit 72 being fixed on top board 51.Support unit 72 extends to delivery direction Y, and supports a plurality of stationary shaft 71.Driven roll 12,13 is not limited to rolling bearing, can be other rotatoies.For the rotation when with the contacting of delivery tray 20 is without impacting smooth and easy carrying out, preferably the rotatory inertia of driven roll 12,13 is less.
As shown in Figure 6, driven roll 12,13 has the 1st driven roll 12 and the 2nd driven roll 13 that is disposed at positions different on directions X.If observe from Z direction, driven roll 12,13 is interconnected.The 1st driven roll 12 be configured in can with the position of wall 32a butt of guide plate 32 that is disposed at a side of directions X.The 2nd driven roll 13 be configured in can with the position of wall 33a butt of guide plate 33 that is disposed at the opposite side of directions X.Driven roll 12,13 does not link with drive unit.When wall 32a, 33a with delivery tray 20 contact, driven roll 12,13 rotates along with the movement of wall 32a, the 33a of the delivery tray 20 with its side face butt.
The rotation center O of the 1st driven roll 12 12be disposed at axis L 12upper, the rotation center O of the 2nd driven roll 13 13be disposed at axis L 13on.Axis L 12, L 13be disposed at positions different on directions X.
The wall 32a butt of the 1st driven roll 12 and guide plate 32, and follow the movement of delivery tray 20 and rotate.The wall 33a butt of the 2nd driven roll 13 and guide plate 33, and follow the movement of delivery tray 20 and rotate.The 1st driven roll 12 and the 2nd driven roll 13 alternately configured on delivery direction Y.The 1st driven roll 12 and the 2nd driven roll 13 can be the not roller of alternately configured on delivery direction Y.For example can, on delivery direction Y, after configuring 2 the 1st driven rolls 12, then configure 2 the 2nd driven rolls 13.
The external diameter of the 1st driven roll 12 and the 2nd driven roll 13 is than the width W of guide path 30 30little.Between the 1st driven roll 12 and guide plate 33, be formed with predetermined gap d 1.Between the 2nd driven roll 13 and guide plate 32, be formed with predetermined gap d 2.
And on directions X, the side face of the 1st driven roll 12 leans on the position of wall 32a side (side of 1 pair of wall of slot part) and the side face of the 2nd driven roll 13 to lean on the distance W of the position of wall 33a side (opposite side of 1 pair of wall of slot part) most most 1than the distance W of 32,33 of 1 pair of guide plates of guide path 30 (between 1 pair of wall of slot part) 30little.
Then, the effect of the film deposition system 100 of present embodiment is described.First, substrate 101 imports in transition chamber thereof 121.In transition chamber thereof 121, by closing switching lock 131,132, be set as sealed state, and be depressurized to predetermined pressure.Substrate 101 is in the interior transmission of transition chamber thereof 121, and imports in the buffer chamber 122 of adjacency.
Film deposition system 100 has in importing that the buffer chamber 122 of substrate 101 is interior to be heated substrate 101.For example, before importing substrate 101, in buffer chamber 122, be heated to predetermined temperature.
Substrate 101 imports in buffer chamber 122.In buffer chamber 122, by closing switching lock 132,133, be set as sealed state, and be depressurized to predetermined pressure (pressure identical with film forming chamber 123).After substrate 101 is heated to the temperature that is suitable for film forming, substrate 101 is in the interior transmission of buffer chamber 122, and imports in the film forming chamber 123 of adjacency.
Before importing substrate 101, in film forming chamber 123, be made as the decompression state that is suitable for film forming.If substrate 101 imports in film forming chamber 123, open and close lock 133,134 and be closed and be made as sealed state.And, in film forming chamber 123, by heater heats, become the state that maintains substrate temperature.In addition, on substrate 101, carry out film forming processing, film forming metal film (thin film layer) on substrate 101.
Film deposition system 100 has in importing that the buffer chamber 124 of substrate 101 is interior carries out cooling to substrate 101.For example, before importing substrate 101, in buffer chamber 124, be cooled to predetermined temperature.In addition, can be not cooling in the interior execution of buffer chamber 124.
Substrate 101 imports in buffer chamber 124.In buffer chamber 124, by closing switching lock 134,135, be set as sealed state, and be depressurized to predetermined pressure.After substrate 101 is cooled, substrate 101 is transmitted in buffer chamber 124, and imports in the transition chamber thereof 125 of adjacency.
Open and open and close lock 136, transition chamber thereof 125 is interior to atmosphere opening, and cooling base 101 thus.After substrate 101 is cooled, substrate 101 is in the interior transmission of transition chamber thereof 125, and to the outer derivation of transition chamber thereof 125.
In film deposition system 100, the motivating force utilization of being exported by drive source 16 transmits belt wheel 17 and endless conveyor belt 18 and transmits transfer roller 11 rotations thus.By rotariling actuate transfer roller 11, to keeping the delivery tray 20 of substrate 101 to transmit.Delivery tray 20 drives by a plurality of transfer rollers 11 that configure on delivery direction Y, in the interior movement of each vacuum chamber 121~125.
In film deposition system 100, when contacting with guide plate 32,33, the driven roll 12,13 that is disposed at the upper side of vacuum chamber 121~125 is followed the transmission of delivery tray 20 and rotates.Now, the 1st driven roll 12 only rotates with guide plate 32 butts of a side.That is, the 1st driven roll 12 rotates to equidirectional.The 2nd driven roll 13 only rotates with guide plate 33 butts of opposite side.That is, the 2nd driven roll 13 rotates to equidirectional.Identical driven roll 12,13 is only to equidirectional rotation, do not hinder thus substrate and transmits and stably guide delivery tray 20.
The wall 32a butt of the 1st driven roll 12 and guide path 30, the wall 33a butt of the 2nd driven roll 13 and guide path 30, can make the delivery tray 20 of erectility and the stable posture of substrate 101 thus.
In this film deposition system 100, possess a plurality of transfer rollers 11 that substrate 101 and delivery tray 20 are transmitted, therefore can be made as the device of simple structure.Driving mechanism comparison with rack pinion mode in the past, can be made as simple structure.And, in film deposition system 100, transfer roller 11 is disposed at base plate 52 sides (than the lower end of substrate 101 more on the lower) of vacuum chamber 121~125, even if therefore follow the rotation of transfer roller 11, produce particle, also reduce particle and be attached to possibility more closer to the top than transfer roller 11 and substrate 101 that configure.Thus, can reduce the risk that particle is attached to substrate 101, the quality that suppresses substrate for film deposition declines.
On transfer roller 11, be formed with flange part 11a, therefore can make delivery tray 20 with respect to the position stability of transfer roller 11.Thus, can make the stable posture of delivery tray 20 and substrate 101, and transmit swimmingly.On transfer roller 11, be provided with flange part 11a, therefore without the lower side at substrate 101, be provided for side roller or other guide rollers of the position on regulation directions X.Therefore, can be made as simple structure.
Film deposition system 100 is for driven roll 12,13 and be formed at the structure that 1 pair of guide plate, 32,33 butts of the upper end of delivery tray 20 rotate, and therefore can from top, limit the position of delivery tray 20, prevents toppling over of delivery tray 20.Thus, can stablize and transmit swimmingly delivery tray 20 and substrate 101.
And, be configured to driven roll 12,13 and be disposed in guide path 30, the part butt of driven roll 12,13 and not film forming.Exterior side by the delivery tray 20 after film forming chamber 123 is attached with film forming material, if therefore roller contacts with the outside of delivery tray 20, film forming material is peeled off, and produces particle.In present embodiment, driven roll 12,13 contacts with wall 32a, 33a in guide path 30, therefore can suppress the generation of particle.
A plurality of driven rolls 12,13 possess: the 1st driven roll 12, guide plate 32 butts of itself and a side; And the 2nd driven roll 13, guide plate 33 butts of itself and opposite side, the 1st driven roll 12 and the 2nd driven roll 13 alternately configured on delivery direction Y, the delivery tray 20 in therefore transmitting replaces butt with the 1st driven roll 12 and the 2nd driven roll 13.Thus, can further make the stable posture of delivery tray 20 and substrate 101 and transmit swimmingly.Thus, can realize the raising of transfer rate.Driven roll 12,13 when rotated, all the time respectively to different directions rotation, so can not change to reverse rotation by the sense of rotation of driven roll 12,13, the friction resistance in the time of can reducing delivery tray 20 and be transmitted.Therefore, can realize the transmission smoothly of delivery tray 20.
In film deposition system 100, on directions X, the side face of the 1st driven roll 12 leans on the position of wall 32a side and the side face of the 2nd driven roll 13 to lean on the distance W of the position of wall 33a side most most 1than the distance W between 1 couple of wall 32a, 33a of guide path 30 30little.Thus, allow that delivery tray 20 is with respect to the position deviation of driven roll 12,13, can stablize and transmit swimmingly delivery tray 20 and substrate 101.And then, can alleviate the friction resistance between driven roll 12,13 and wall 32a, the 33a of guide path 30, improve transfer rate.
The delivery tray 20 of present embodiment is formed with guide path continuous on delivery direction Y at upper surface 21c, therefore the driven roll of film deposition system 100 12,13 can be disposed in guide path 30.Follow substrate to transmit, wall 32a, the 33a of guide path 30 and driven roll 12,13 butts, driven roll 12,13 rotations, therefore can guide the transmission of delivery tray 20 aptly.
And, on the guide path 30 of delivery tray 20, be formed with rake 32b, 33b, the wider width of the inlet side end in the time of therefore can making driven roll 12,13 enter guide path 30, the inner side that more enters delivery direction more narrows down.Thus, even if produce delivery tray 20 with respect to the position deviation of driven roll 12,13, also can prevent the collision of driven roll 12,13 and transmit.
Above, according to its embodiment, the present invention is illustrated, but the present invention is not limited to above-mentioned embodiment.Film deposition system of the present invention is not limited to ion plating method, and applicable other become embrane methods (such as sputtering method etc.).
Film deposition system of the present invention and film deposition system are not limited to substrate are uprightly transmitted with delivery tray, also can make substrate tilt and transmit.For example can be by making above-mentioned film deposition system and delivery tray tilt to transmit the structure of the substrate of inclination.Also film deposition system and film deposition system delivery tray that the side face that can be transfer roller for example forms in the mode of intersecting with rotation.Also the delivery tray that can be the supporting with substrate is tilted transmits the film deposition system of substrate.Angle of inclination when substrate is tilted can be made as 0 °~15 ° left and right with respect to vertical.
And film deposition system can be the gate valve portion of the valve body with the peristome that possesses sealed vacuum container in its framework, in the framework of this gate valve portion, possesses the structure of driven roll.In the past, the space in the framework of the gate valve portion configuring between vacuum vessel was less, therefore transporting mechanism cannot be set.In film deposition system of the present invention, driven roll is set in the framework of gate valve portion and also can guides aptly the delivery direction of delivery tray and substrate.
And, can be by the external diameter path of driven roll being made to the thickness attenuation of delivery tray 20.The size that can suppress thus, the peristome that delivery tray 20 passes through.

Claims (9)

1. a film deposition system, it carries out film forming processing to substrate, and wherein, described film deposition system possesses:
Vacuum vessel, it can hold described substrate; And
Transporting mechanism, on its delivery direction in described vacuum vessel, the delivery tray that keeps described substrate being intersected in the thickness of slab direction with described substrate, transmit, and described delivery tray so that the thickness of slab direction of described substrate become horizontal direction or become the mode of the direction tilting from horizontal direction, so that the upright state of described substrate or so that the state that described substrate tilts from upright state keeps described substrate
Described transporting mechanism has:
A plurality of transfer rollers, it is disposed at the lower end side of described substrate, around the 1st axis rotation of extending along described thickness of slab direction, and described delivery tray is transmitted; And
A plurality of driven rolls, it is disposed at the upper end side of described substrate, the 2nd axis rotation of extending around the direction along intersecting with described thickness of slab direction and described delivery direction,
The upper surface of described delivery tray is formed with along the continuous slot part of described delivery direction,
Wall butt in described driven roll and described slot part and follow the movement of described delivery tray and rotate.
2. film deposition system according to claim 1, wherein,
The lower surface of described delivery tray be provided with to described delivery direction extend and can with the orbit portion of the side face butt of described transfer roller.
3. film deposition system according to claim 2, wherein,
Described a plurality of driven roll possesses: the 1st driven roll, a wall butt in 1 pair of wall in itself and described slot part; And
The 2nd driven roll, another wall butt in 1 pair of wall in itself and described slot part;
Described the 1st driven roll and described the 2nd driven roll alternately configured on described delivery direction.
4. film deposition system according to claim 3, wherein,
In described thickness of slab direction, in the side face of described the 1st driven roll by the position of a side surface side in described 1 pair of wall and the side face of described the 2nd driven roll, the distance by the position of another side surface side in described 1 pair of wall is less than the distance between 1 pair of wall of described slot part.
5. according to the film deposition system described in any one in claim 1~4, wherein,
Described transfer roller has 1 pair of flange part, and described 1 pair of flange part is configured to the radial outside of this transfer roller outstanding, and opposed and clamp the both sides of described delivery tray on described the 1st axis direction.
6. according to the film deposition system described in any one in claim 1~4, wherein,
Described film deposition system possesses gate valve portion, and described gate valve portion possesses the valve body that can seal the peristome that the described delivery tray of described vacuum vessel passes through,
In described gate valve portion, be provided with described driven roll.
7. a film deposition system delivery tray, its mode that becomes horizontal direction with the thickness of slab direction by substrate or become the direction tilting from horizontal direction by described substrate with upright state or the state that tilts with the state from upright when the delivery direction intersecting with described thickness of slab direction transmits, can keep described substrate, wherein, described film deposition system possesses with delivery tray:
Upper end maintaining part, it keeps the upper end of described substrate;
Bottom maintaining part, it keeps the bottom of described substrate; And
Linking part, it links described upper end maintaining part and bottom maintaining part,
The upper surface of described upper end maintaining part is formed with slot part continuous on delivery direction.
8. film deposition system delivery tray according to claim 7, wherein,
The end of described slot part on described delivery direction is formed with rake, and described rake forms towards the mode of described end extended with the width of this slot part.
9. according to the film deposition system delivery tray described in claim 7 or 8, wherein,
The lower surface of described bottom maintaining part is provided with the orbit portion extending to described delivery direction.
CN201310263451.XA 2012-07-05 2013-06-27 Film forming apparatus and carrier tray for the same Pending CN103526156A (en)

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TW201404914A (en) 2014-02-01

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Application publication date: 20140122