CN208240622U - For loading and unloading the load lock chamber and array base plate processing system of carried base board - Google Patents
For loading and unloading the load lock chamber and array base plate processing system of carried base board Download PDFInfo
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- CN208240622U CN208240622U CN201590001521.7U CN201590001521U CN208240622U CN 208240622 U CN208240622 U CN 208240622U CN 201590001521 U CN201590001521 U CN 201590001521U CN 208240622 U CN208240622 U CN 208240622U
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- 238000011068 loading method Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 310
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000000151 deposition Methods 0.000 claims abstract description 27
- 230000032258 transport Effects 0.000 claims description 51
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000008021 deposition Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 description 33
- 230000033001 locomotion Effects 0.000 description 12
- 238000005477 sputtering target Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012857 repacking Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
It is used to load and unload the load lock chamber and array base plate processing system of carried base board according to the utility model, provides a kind of for handling the in-line base plate processing system (100) of the substrate being oriented substantially vertically (131).The array base plate processing system includes: the first processing chamber housing (110), and first processing chamber housing has the first processing region (116) and is suitable for depositing first material layer on the substrate；Second processing chamber (120), the second processing chamber have second processing region (126) and are suitable for depositing second material layer on the substrate；And load lock chamber (130), the load lock chamber are suitable for loading and unload the substrate from the in-line base plate processing system.The load lock chamber is arranged between first processing chamber housing and the second processing chamber.
Description
Technical field
The utility model relates to locking cavities, the method for processing system and operation processing system.Particularly, the utility model
It is related to: for substrate to be loaded into in-line base plate processing system to or unloaded from in-line base plate processing system the latch well of carried base board
Room；The in-line base plate processing system of substrate is handled including at least the first processing chamber housing and second processing chamber；With for by base
Plate is loaded into in-line base plate processing system or unloads from in-line base plate processing system the locking cavity of carried base board.
Background technique
In multiple technologies application, multiple layers of identical material or different materials are deposited on base with a series of depositing operation
On plate.For example, in thin film transistor (TFT) (Thin Film Transistor；TFT it) in metallization process, is deposited by sputtering technology
Two or three of metal.Such as etching or structuring technique can before various depositing operations, between or provide later.Example
Such as, can deposit with " material one ", " material two " and be " material one " sequence multilayer lamination structure (stack).
Such technique can also be used for the manufacture such as such as electrochemical appliance of hull cell (TFB).Due to the difference in different process
Rate, deposit thickness and etch-rate or structuring rate are coated, the processing time in processing chamber housing may significant changes.
In order to deposit multilayer lamination structure, multiple processing chamber housing structures can be provided.It is, for example, possible to use in-line deposit cavities
Room arrangement and cluster deposition chambers arrangement.Cluster arrangement may include that center carries chamber and is connected to the one of the chamber
A little processing chamber housings or deposition chambers.
In-line processing system may include some subsequent processing chambers, and in these subsequent processing chambers, technique is at one
It connects in one chamber and carries out, so that multiple substrates can be handled continuously or quasi-continuously.However, when this in-line processing system
When system is being safeguarded, for example, in order to replace sputtering target, it is often necessary to stop the entire production line.This is likely to result in undesirable length
Downtime and technique whole efficiency loss.On the other hand, cluster tool allows different circulation time.However, removing
Fortune chamber may occupy sizable space and may be extremely complex.For example, in general, complexity may be equipped in carrying chamber
And expensive conveyer system.
Accordingly, it has been required to a kind of improved processing system and the method for operating the processing system, in improved processing
Substrate production is maximized while the complexity, cost and land occupation of processing system in the method for system and the operation processing system
Area is minimized.
Utility model content
In view of above, according on one side, provide a kind of for handling the in-line base for the substrate being oriented substantially vertically
Plate processing system.The array base plate processing system includes: the first processing chamber housing, and first processing chamber housing has the first processing
Region and be suitable for deposit first material layer on the substrate；Second processing chamber, the second processing chamber have second
Processing region and it is suitable for depositing second material layer on the substrate；And load lock chamber, the load lock chamber are suitable
In loading and unloading the substrate from the in-line base plate processing system, wherein the load lock chamber is in first processing
Between chamber and the second processing chamber.
Additionally, it is provided a kind of load lock chamber, the load lock chamber is used to substrate being loaded into in-line substrate
Processing system, which is neutralized, unloads the substrate from the in-line base plate processing system.The load lock chamber is suitable for being arranged in institute
It states between the first processing chamber housing of in-line base plate processing system and second processing chamber, so that the substrate can be along first straight line
Transportation route is moved in first processing chamber housing and is moved to the second processing chamber along second straight line transportation route
In.
Further it is provided that a kind of method for operating in-line base plate processing system, the array base plate processing system includes the
One processing chamber housing, second processing chamber and load lock chamber, wherein the load lock chamber is in first processing chamber housing
Between the second processing chamber.The described method includes: transporting first substrate from the load lock chamber to described
In one processing chamber housing and on the first substrate deposition materials layer；Via the load lock chamber by the first substrate
Transport in the second processing chamber and deposit on the first substrate another material layer, or by the first substrate
It transports the load lock chamber and transports the second substrate in the second processing chamber, and in second base
Deposition materials layer on plate.
The utility model further aspect, advantages and features can from the appended claims, the description and the appended drawings it is aobvious and
It is clear to.
Detailed description of the invention
Above mentioned reality will be more fully described in the description below to exemplary embodiment with reference to the following drawings
Some embodiments in mode are applied, in the accompanying drawings:
Fig. 1 shows that there are two the straight of processing chamber housing and locking cavity according to the tool of embodiment described herein
The schematic top view of column base plate processing system；
Fig. 2 and Fig. 3 show the schematic side elevationals according to the in-line base plate processing system of embodiment described herein
Figure；
Fig. 4 to Fig. 7 is shown according to the in-line base plate processing system of further embodiment described herein
Schematic elevational view；
It includes the in-line base for swinging station (swing station) that Fig. 8, which is shown according to embodiment described herein,
The schematic top view of plate processing system；
Fig. 9 shows that there are four the straight of processing chamber housing and locking cavity according to the tool of embodiment described herein
The schematic top view of column base plate processing system；
Figure 10 shows the schematic top view of the in-line base plate processing system according to embodiment described herein；With
And
Figure 11 schematically shows the side of the in-line base plate processing system of operation according to embodiment described herein
Method.
In order to help to understand, as far as possible using the same or similar member shared between same reference numerals attached drawing
Part.The element and feature for imagining an embodiment can be beneficially incorporated other embodiments described herein.It shall yet further be noted that
Attached drawing illustrates only the illustrative embodiments of the utility model, and is therefore not construed as the limit to the scope of the utility model
System.
Specific embodiment
In recent years, to the hope sustainable growth of pollution less during vacuum technology.For example, when producing display,
It is decreased to the acceptance of particle contamination, and there are also the quality of expectations of customer to have improved for quality standard.For example following
In the case of can pollute: the processing chamber housing in in-line base plate processing system is not evacuated to vacuum suitably；In-line processing substrate system
Transportation system or component in system generate particle during substrate processing process；Substrate to be processed introduces the particles into rarefied
In in-line base plate processing system etc..
During operation there are multiple possible particle contamination sources in depositing system, this affects product quality.Straight
It is the mode for reducing contamination of products risk that the cleaning and replacement of component in column base plate processing system and continuous vacuum pump, which are inhaled,.
Even so, still expectation substrate treatment process is executed in a manner of possible most quick and most efficient.The cleaning of processing chamber housing and
Replacement process spends the time for maintenance, this time is then not used to the production time.
Embodiment described herein is related to a kind of changing for the high production processing of substrate for being oriented substantially vertically
Into in-line base plate processing system.Term " substrate " as used herein should cover the substrate of such as glass substrate.Substrate allusion quotation
It is type with 1.4m2With above, typically 5m2With the large-area substrates of dimensions above.For example, 1.43m may be implemented2(the 5th
Generation) and above (such as 5.5m2(the 8.5th generation), 9m2Substrate size (the 10th generation) or more greatly).As used herein for retouching
State substrate orientation term " being oriented substantially vertically " be understood to mean that substrate can have in in-line base plate processing system
Some deviation for being vertically oriented (that is, 90 ° orientation), to allow in the case where substrate has several years inclined situation (that is, substrate is base
In the case where being vertically oriented on this) stablize transport substrate.
According to the in-line base plate processing system of embodiment described herein base can be handled under the conditions of high vacuum
Plate.In order to improve productivity ratio and avoid the high vacuum section pumping for being necessary for each substrate, especially in-line base plate processing system
Empty whole system can use one or more locking cavities for substrate.
It is for substrate to be loaded or inserted into in-line base according to the task of the locking cavity of embodiment described herein
Plate processing system, which is neutralized, to be unloaded substrate or is released to outside in-line base plate processing system.Locking cavity is alternatively referred to as compound lock
With lock out chamber or hereinafter referred to as load lock chamber.Substrate can from processing chamber housing or from the arrangement of processing chamber housing with
And transport from loading depot (for example, swinging module (swing module)) into load lock chamber, the loading depot is for filling
Carry the substrate to be coated.
In embodiment herein, in-line base plate processing system can be modular.For example, load lock chamber can
It is separated with processing chamber housing, so that load lock chamber can be replaced, or can be with according to embodiment described herein
The existing in-line base plate processing system of load lock chamber repacking.
Load lock chamber, which can be arranged in, to be inserted into substrate or to the greatest extent may be used after being loaded into in-line base plate processing system
Sufficient and sufficiently low transitional pressure rapidly can be evacuated to according to the processing pressure in processing chamber housing, and from straight
Ventilation reaches atmospheric pressure as quickly as possible before the unloading of column base plate processing system or releasing substrate.For example, in substrate from processing
Before chamber transports in load-lock, load lock chamber can be evacuated.By substrate from the loading for being used to load substrate
Before station is transported in load lock chamber, load lock chamber can divulge information.Similarly, substrate is being loaded into from loading depot
After in load lock chamber, load lock chamber can be evacuated.
According to embodiment herein, load lock chamber may include mentioning for substrate received in load lock chamber
For the double track structure or more rail structures of two positions or multiple positions.Load lock chamber may be adapted to for example by vacuum system
(such as vacuum pump) forms pressure difference between load lock chambers chamber interior and load lock chambers outdoor.Outside load lock chambers room
It portion for example can be at atmosheric pressure.
In-line base plate processing system according to embodiment herein may include three chamber types arrangement, three chamber
Formula arrangement includes the first processing chamber housing, second processing chamber and is arranged in negative between the first processing chamber housing and second processing chamber
Carry locking cavity.However, in-line base plate processing system may include with more than three chamber according to embodiment herein
The multi-cavity cell-type of (for example, such as four chambers, five chambers, six chambers or more chamber) is arranged.It is including being more than four
In the embodiment of a chamber, at least one load lock chamber can be arranged in the first processing chamber housing and second processing chamber it
Between.Optionally, processing chamber housing in addition can be arranged with the first processing chamber housing and/or second processing chamber array respectively.
According to embodiment herein, in-line base plate processing system can be arranged for example with five chamber types, described five
Chamber type arrangement includes three processing chamber housings, the first load-lock being arranged between the first processing chamber housing and second processing chamber
Chamber, and the second load lock chamber being arranged between second processing chamber and third processing chamber housing.
According to embodiment herein, in the three chamber types arrangement of in-line base plate processing system, load lock chamber
It can be coupled with the first processing chamber housing and second processing chamber array.For example, the first processing chamber housing and load lock chamber is straight
Column arrangement can provide the transportation route of the first generally straight line, and the transportation route extends to from first from load lock chamber
Chamber is managed, to transport substrate from load lock chamber to the first processing chamber housing.By second processing chamber and load lock chambers
Array arrangement in room can provide the transportation route of the second generally straight line, and the transportation route extends to the from load lock chamber
Two processing chamber housings, to transport substrate from load lock chamber to second processing chamber.
According to embodiment herein, the transport road of the first generally transportation route of straight line and the second generally straight line
Diameter can be with it is each other in a straight line.This arrangement maximizing array processing substrate of processing chamber housing and load lock chamber
The yield of system.For example, if the processing chamber housing shutdown in processing chamber housing is safeguarded that another processing chamber housing can be just
Often operation；Or if the first technique of a processing chamber housing in processing chamber housing than the second technique in another processing chamber housing
It takes more time, then more than one base can be handled in another processing chamber housing before the completion of the first technique
Plate.Array base plate processing system described herein allows the very efficient and multi-functional processing to substrate.
As described briefly above, arrange that load lock chamber allows between the first processing chamber housing and second processing chamber
With multiple independent process sequences handle substrate (one by one) in the first processing chamber housing of in-line base plate processing system,
It, can be in the second processing chamber of in-line base plate processing system with the single work of long period simultaneously at the same time in section
The one or more substrates of skill processing.
According to embodiment herein, load lock chamber may include load lock chamber door, the load-lock
Chamber door is adapted to allow for that substrate is loaded into load lock chamber neutralization from load lock chamber with substantially vertical orientation
Unloading.Load lock chamber door can be made of light material (including such as aluminium and/or carbon fiber).
In the embodiment being described herein, the first processing chamber housing may include being suitable for depositing the first material on substrate
First processing region of layer, and second processing chamber may include the second processing suitable for the depositing second material layer on substrate
Region.
According to embodiment herein, in the first processing chamber housing and it is deposited on substrate in second processing chamber respectively
First material layer and second material layer may include different materials.For example, first material layer may include molybdenum, second material layer
It may include aluminium.In further embodiment herein, respectively in the first processing chamber housing and in second processing chamber
The first material layer and second material layer being deposited on substrate may include identical material.
According to embodiment herein, for the sedimentary stacked structure on substrate, substrate can be in the first processing chamber
It is recycled between room and second processing chamber.For example, substrate can with from the first processing chamber housing material layer, at second
It manages another material layer of chamber and is coated with the another material layer from the first processing chamber housing.Deposition parameter can be in different coatings
It keeps constant or changes during technique.
According to the embodiment that this paper can be combined with other embodiments herein, sedimentary origin may be provided as sputtering
Target, such as rotatable sputter target.According to the implementation of in-line base plate processing system, can provide DC sputtering, pulsed sputter or
Intermediate frequency (MF) sputtering.According to further embodiment described herein, can for example with from 5kHz to 100kHz, for example
Frequency in the range of from 30kHz to 50kHz provides MF sputtering.
Fig. 1 shows processing chamber housing 110,120 and a load there are two the tools according to embodiment described herein
The schematic top view of the in-line base plate processing system 100 of locking cavity 130.First processing chamber housing 110 may include for
One or more sputtering targets 111 of depositing materials on substrates in first processing region 116.Second processing chamber 120 can wrap
It includes for one or more sputtering targets 121 in the same substrate in second processing region 126 or deposition materials on different substrate.
Isolating valve (such as vacuum valve 119,129) is arranged between load lock chamber 130 and the first processing chamber housing 110 and negative
It carries between locking cavity 130 and second processing chamber 120.
Isolating valve can be positioned with load lock chamber and processing chamber housing array, and opening can be converted to from closed state
State (vice versa) is so that substrate is moved upwardly through in the side indicated by arrow 138.Vacuum valve 119 be can control to allow
Substrate is movable into and out the first processing chamber housing 110 from load lock chamber 130.Also controllable vacuum valve 129 with allow substrate from
Load lock chamber 130 is movable into and out second processing chamber 120.
According to embodiment described herein, in-line base plate processing system may be adapted to have more than two processing chamber
Room.For example, in-line base plate processing system may include the either side for being arranged in the first processing chamber housing and second processing chamber
On other processing chamber housing.
As being briefly mentioned above, according to embodiment herein, load lock chamber be may be used to provide from atmosphere
Condition is to lower pressure (for example, such as from atmospheric pressure to from 10-3Millibar is to 10-7Millibar is (for example, from 10-3Millibar is to 10-6
Millibar or from 10-3Millibar is to 10-4Millibar) in the range of any numerical value) transition.According to embodiment herein, load
Locking cavity may be adapted to be transmitted to processing chamber housing and do not interfere the vacuum condition in processing chamber housing substantially substrate.According to this
The load lock chamber of the embodiment of described in the text, which can be, can be evacuated to vacuum, and may include relevant device, all
Such as one or more vacuum pumps 135.
According to embodiment described herein, load lock chamber can have one or more substrate loading/unloadings
Opening, to receive the substrate optionally conveyed by substrate carrier support, in atmospheric conditions；Or by substrate (optionally by
Substrate carrier support) it is released under atmospheric conditions.The term substrate being used below can refer to substrate and/or by substrate carrier branch
Both substrates of support.
According to embodiment herein, loading/uninstalling opening 133 can be closed and be beaten by load lock chamber door 134
It opens.In the embodiment being described herein, opens load lock chamber door 134 and provide to inside load lock chamber 130
Access.According to embodiment herein, load lock chamber door 134 can be arranged in the side of load lock chamber 130
On.
Load lock chamber, which can have, is suitably connected to one or more vacuum chambers (such as one or more processing chambers
Room) one or more substrates transmit opening.According to embodiment herein, load lock chamber 130 can have difference
The first substrate transmission opening 137 and the second substrate for being suitably connected to the first processing chamber housing 110 and second processing chamber 120 pass
Send opening 139.
According to embodiment herein, substrate can or do not have carrier or be attached to carrier in the case where transported
It is defeated by in-line base plate processing system, to be handled.Array base plate processing system 100 shown in Fig. 1 includes being attached to
The substrate 131 of substrate carrier 132.In the embodiment being described herein, linear transport path is construed as in-line road
Diameter, on this path, substrate, substrate carrier (being specifically that there is substrate to be attached to the substrate carrier on substrate carrier) can be
Without being transported in the case where rotary plate/carrier to make the lateral position change of substrate/carrier or make substrate/carrier lateral displacement
It is defeated.On the other hand, straight line path may include the deviation of directivity of transportation route and straight line.
In-line base plate processing system 100 is shown for transporting the substrate 131 for being attached to substrate carrier 132 to the first processing
The transportation route 114 of the generally straight line of the first of chamber 110.In-line base plate processing system 100 includes for that will be attached to substrate
The substrate 131 of carrier 132 transports the transportation route 124 of the second of second processing chamber 120 the generally straight line.
First transportation route and the second transportation route can be arranged with load lock chamber and processing chamber housing array.For example, the
One straight line transportation route 114 can be from the internal stretch of load lock chamber 130 into the first processing chamber housing 110.According to herein
In embodiment, the first transportation route 114 can from the internal stretch of load lock chamber 130 pass through first substrate transmission open
Mouth 137 enters the first processing chamber housing 110.Second straight line transportation route 124 can from the internal stretch of load lock chamber 130 to
In second processing chamber 120.According to embodiment herein, the second transportation route 124 can be from load lock chamber 130
Internal stretch pass through the second substrate transmission opening 139 enter second processing chambers 120.
According to embodiment herein, loading/uninstalling opening 133 and load lock chamber door 134 may be adapted to allow
Substrate 131 (optionally including substrate carrier 132) is being substantially perpendicular to substrate in in-line base plate processing system generally
The load lock chamber that in-line base plate processing system is loaded on the direction of the transportation route of straight line is neutralized from in-line processing substrate
It is unloaded in the load lock chamber of system.For example, substrate can be substantially perpendicular to first straight line transportation route 114 and second
It is loaded into load lock chamber and/or from load lock chamber on the direction at least one of linear transport path 124
Unloading.
According to embodiment described herein, load lock chamber door may be adapted to select as follows: by substrate together with base
Onboard body is loaded into together in in-line base plate processing system；And by substrate together with substrate carrier from in-line processing substrate system
It is unloaded on system.For example, load lock chamber door may include transportation system according to embodiment herein, such as carrier is transported
Defeated driving.Carrier transport driving may be adapted to for substrate (optionally being supported by substrate carrier) being loaded on load lock chamber door
It is unloaded from load lock chamber door with by substrate (optionally being supported by substrate carrier).According to embodiment herein, mention
Help substrate efficiently and being simply loaded into in-line processing substrate for the load lock chamber door with carrier transport driving
It is unloaded in system or from in-line base plate processing system.
In the embodiment being described herein, substrate (optionally including substrate carrier) can be by inclining at an angle
Tiltedly it is loaded into the load lock chambers in the load lock chamber of in-line base plate processing system and/or from in-line base plate processing system
It is unloaded on room.For example, substrate can be displaced to vertical position from horizontal position in order to which substrate to be loaded into load lock chamber
It sets.According to embodiment herein, substrate (optionally including substrate carrier) for example can be in water with substantially 0 ° of angle
Prosposition is set, and can be increased to the vertical position of substantially 90 ° of angle, to be loaded into load lock chamber.Substrate
(optionally including substrate carrier) can be for example to be loaded into phase in load lock chamber with substrate (optionally including substrate carrier)
Anti- mode is unloaded from load lock chamber.
According to embodiment herein, substrate 131 (optionally including substrate carrier 132) is being loaded into load lock chambers
When in room, it can be transported between first straight line transportation route 114 and second straight line transportation route 124 by lateral movement device.?
In embodiment described herein, i.e., processed substrate surface is adjustable to the same side of in-line base plate processing system.
Processing substrate tool (for example, such as sputtering target) may be arranged at relative to the same of the first transportation route and the second transportation route
Side.According to embodiment herein, processing substrate tool can be for example laterally in transportation route arranged alongside in respective handling
In chamber.
In the embodiment being described herein, the first processing chamber housing and second processing chamber may include vacuum plant.
For example, the first processing chamber housing 110 may include vacuum pump 112 and second processing chamber 120 may include vacuum pump 122, with
Just each processing chamber housing is evacuated.In further embodiment herein, each processing of in-line base plate processing system
Chamber can respectively include more than one vacuum pump.
In embodiment herein, in-line base plate processing system may include transportation system, so as to along the first fortune
Defeated path and substrate is transported along the second transportation route.For example, in-line base plate processing system may include eccentric board carrying
It drives (substrate handling drive).During the transport along transportation route, substrate can be supported on substrate load
In body.Substrate can be attached to substrate carrier.In further embodiment herein, substrate can be in no carrier
In the case where pass through in-line base plate processing system.According to embodiment herein, transportation system, which can be configured as, at least to exist
Substrate and/or substrate carrier are transported along transportation route between load lock chamber, the first processing chamber housing and second processing chamber.
According to embodiment herein, transportation system may include for along the first transportation route and/or along
Two transportation routes are the device of substrate guiding.Device for being oriented to for substrate may include one or more tracks (usual cloth
Set bottom and/or the top in load lock chamber and processing chamber housing；Condition is that substrate is being transported by in-line processing substrate system
It is vertically-aligned or at least inclined during system).Device for being oriented to for substrate may include magnetic guidance system, institute
The top of substrate of substantially vertical alignment can be arranged in by stating magnetic guidance system.However, it is possible in conjunction with the utility model and
Use any other transportation system.
Fig. 2 shows the schematic side elevations according to the in-line base plate processing system 200 of embodiment described herein.
All features described about Fig. 1 are also applied for embodiment shown in Figure 2.For example, as described in above with respect to Fig. 1,
In-line base plate processing system 200 includes the first processing chamber housing 110, second processing chamber 120 and is arranged in the first processing chamber housing
Load lock chamber 130 between 110 and second processing chamber 120.Isolating valve can be arranged in load lock chamber
130, between the first processing chamber housing 110 and second processing chamber 120.In embodiment shown in figure 2, illustrate only negative
Carry the vacuum valve 129 between locking cavity 130 and second processing chamber 120.Fig. 2's includes the negative of load lock chamber door 234
Carrying locking cavity 130 can be applied in combination with any other embodiment described herein.
According to embodiment herein, load lock chamber door 234 can be configured as laterally to be moved together with carrier
Dynamic (referring to Fig. 1).The lateral movement direction of the instruction load lock chamber door 234 of arrow 238.According to embodiment herein,
Load lock chamber door 234 can be parallel to first straight line transportation route 114 and second straight line transportation route 124 (referring to figure
At least one of 1) moved on direction.The load lock chamber door 234 of load lock chamber 130 can be configured as across
The side of one processing chamber housing 110 is slided, in order to provide for substrate to be loaded into load lock chamber 130 and/or from load
Loading/the uninstalling opening 133 unloaded on locking cavity.Similarly, according to embodiment herein, load lock chamber door
234 may be adapted to the side sliding of across second processing chamber 120, in order to provide for substrate to be loaded into load lock chamber
Loading/the uninstalling opening 133 unloaded in 130 and/or from load lock chamber.
According to embodiment herein, load lock chamber door support system 250 can permit load lock chamber door
It slides the side of 234 side and/or across second processing chamber 120 easily across the first processing chamber housing 110.It retouches herein
In the embodiment stated, it can be opened and closed and being slided across the first processing chamber housing or second processing chamber to load substrate
The load lock chamber door unloaded into load lock chamber or from load lock chamber provides the advantage that load lock chambers
Room door support system can have very small occupied area.
In the embodiment being described herein, load lock chamber door support system 250 can for example including one or
Multiple guide rails.One or more guide rails can be arranged in the outside of the first processing chamber housing and/or second processing chamber.According to
Embodiment herein, the first processing chamber housing may include two guide rails.First guide rail can be arranged in the first processing chamber housing
Upper area in, for example, such as along the top edge of the first processing chamber housing.
Second guide rail can be arranged in the lower area of the first processing chamber housing, for example, such as along the first processing chamber housing
Lower edge.Similarly, second processing chamber may include two guide rails.First guide rail can be arranged in second processing chamber
Upper area in, for example, such as along the top edge of second processing chamber.Second guide rail can be arranged in second processing chamber
In the lower area of room, for example, such as along the lower edge of second processing chamber.
Fig. 3 shows the in-line base plate processing system 300 according to embodiment herein.The institute described about Fig. 1
There is feature to be also applied for embodiment shown in Fig. 3.For example, in-line base plate processing system 300 includes the first processing chamber housing
110, second processing chamber 120 and the load lock chambers being arranged between the first processing chamber housing 110 and second processing chamber 120
Room 130.Vacuum valve 119,129 can be arranged in load lock chamber 130, the first processing chamber housing 110 and second processing chamber
Between room 120.The load lock chamber 130 including load lock chamber door 334 of Fig. 3 can with it is described herein any other
Embodiment is applied in combination.
According to embodiment herein, load lock chamber door 334 may be adapted to transport perpendicular to first straight line
It is moved on the direction of at least one of defeated path 114 and second straight line transportation route 124 (referring to Fig. 1).It is described herein
Embodiment in, load lock chamber door 334 may be adapted to can be in the loadlock for being parallel to in-line base plate processing system 300
Determine to move on the direction of the vertical axes 339 of chamber 130.Arrow 338 in Fig. 3 indicate load lock chamber door 334 to moving up
It moves direction and moves down direction.
According to embodiment herein, load lock chamber door support system 350 can permit load lock chamber door
334 easily move up and move down, to open and close loading/uninstalling opening 133 of load lock chamber 130.
For example, load lock chamber door support system 350 may include one or more tracks.Load lock chamber door support system
350 may include hydraulic, the pneumatic and/or mechanism based on spring of the movement for assistant load locking cavity door 334.
Fig. 4 to Fig. 7 is shown according to the in-line base plate processing system of further embodiment described herein
Schematic elevational view.All features described about Fig. 1 are also applied for embodiment shown in Fig. 4 to Fig. 7.Fig. 4's is straight
Column base plate processing system 400 shows load lock chamber 130, and the load lock chamber includes load lock chamber door 434, institute
Load lock chamber door is stated to be suitable for the load lock chamber 130 away and towards in-line base plate processing system 400 and tilt.Arrow
438 show the movement of the load lock chamber door according to embodiment herein.For example, load lock chamber door 434 can be with
It is opened by the way that the vertical axes 339 far from load lock chamber 130 are mobile, in order to provide arriving inside load lock chamber 130
Channel.
Load lock chamber door 434 can be closed by the movement of vertical axes 339 towards load lock chamber 130.Root
According to embodiment herein, load lock chamber door 434 can be by outwardly and upwardly moving relative to load lock chamber 130
It moves and opens, and closed and inwardly and downwardly being moved towards load lock chamber 130.
In the embodiment being described herein, load lock chamber door 434 can be supported by load lock chamber door is
System 450 is attached to load lock chamber 130.For example, load lock chamber door support system 450 may include one or more
Hinge and/or selected from any one or more of following list element: movement for assistant load locking cavity door 434
Hydraulic, the pneumatic and mechanism based on spring.
According to embodiment herein, load lock chamber door support system, which can permit load lock chamber door, to be had
Relative to motion range of the load lock chamber from 0 ° to 180 °.For example, load lock chamber door may be considered that relative to
It is to close, and load lock chamber door may be considered that relative to load at the position that substantially 0 ° of load lock chamber
It is open at the position that substantially 90 ° of locking cavity.
The embodiment according to shown in Fig. 4, load lock chamber door 434 are outside by relative load locking cavity 130
And move up and open and closed and inwardly and downwardly being moved towards load lock chamber 130, load lock chamber
Door 434 can provide big quantity space easily substrate to be loaded into the loading chamber of in-line base plate processing system or from array
It is unloaded on the loading chamber of base plate processing system.
Fig. 5 shows another in-line base plate processing system 500 according to embodiment herein.Load lock chamber door
534 may be adapted to the load lock chamber away and towards in-line base plate processing system 500 and tilt.Arrow 538 shows basis
The moving direction of the load lock chamber door of embodiment herein.Similar to the embodiment described above with respect to Fig. 4,
Load lock chamber door 534 can be opened by the way that the vertical axes 339 far from load lock chamber 130 are mobile, to provide to negative
Carry the channel inside locking cavity 130.Load lock chamber door 534 can pass through the vertical axes towards load lock chamber 130
339 move and close.
The embodiment according to shown in Fig. 5, load lock chamber door 534 can be by relative to load lock chambers
130 outwardly and downwardly move and open, and are closed and upwardly and inwardly moving towards load lock chamber 130.It is unlimited
It is formed on embodiment shown in Fig. 5, it is to close that load lock chamber door, which may be considered that when in substantially vertical orientation,
It closes, and load lock chamber door may be considered that when in substantially horizontally orientation be completely open.
According to embodiment described herein, load lock chamber door 534 can be supported by load lock chamber door is
System 550 is attached to load lock chamber 130.For example, load lock chamber door support system 550 may include one or more
Hinge and/or selected from any one or more of following list element: movement for assistant load locking cavity door 534
Hydraulic, the pneumatic or mechanism based on spring.According to embodiment herein, load lock chamber door support system be can permit
The motion range that load lock chamber door has relative to load lock chamber from 0 ° to 180 °.For example, load lock chamber
It is to close, and load lock chamber door can that door, which may be considered that at the position relative to substantially 0 ° of load lock chamber,
To be considered being open at the position relative to substantially 90 ° of load lock chamber.
The embodiment according to shown in Fig. 5, load lock chamber door 534 by relative to load lock chamber 130 to
It outside and moves down and opens, load lock chamber door 534 can be by utilizing the gravity for acting on load lock chamber door 534
It influences and easier and faster opens.
Fig. 6 shows another in-line base plate processing system 600 according to embodiment herein.The embodiment of Fig. 6
It can be similar to the in-line base plate processing system of Fig. 5, the difference is that the load lock chamber door of in-line base plate processing system 600
Support system 650 may be adapted to substrate 131 (optionally being supported by substrate carrier 132) together with load lock chamber door 634 1
It rises and is loaded into load lock chamber 130 or is unloaded from load lock chamber.
Load lock chamber door 634 is shown using arrow 638 (optionally to be supported by substrate carrier 132) together with substrate 131
Moving direction between " loaded " position and unloading position together.According to embodiment herein, embodiment party shown in Fig. 6
The load lock chamber door of formula can have identical as the load lock chamber door for referring to embodiment shown in Fig. 5 and describing
Motion range.
Fig. 7 shows another in-line base plate processing system 700 according to embodiment herein.Load lock chamber door
734 may be adapted to that first straight line transportation route 114 and second straight line transportation route 124 can be substantially perpendicular to (referring to figure
At least one of 1) moved on direction.Arrow 738 is shown according to the load lock chamber door of embodiment herein
Moving direction.
Load lock chamber 130 can be configured as by by load lock chamber door 734 far from load lock chamber 130
It moves and opens and closed and moving load lock chamber door 734 towards load lock chamber 130.According in Fig. 7
The embodiment shown, load lock chamber door 734 can by along substantially horizontal path far from load lock chamber
130 move up in substantially vertical taking.Similarly, in order to close load lock chamber 130, for example, by substrate
It is loaded into load lock chamber 130 or after unloading carried base board from load lock chamber, load lock chamber door 734 can be along
Substantially horizontal path is moved up towards load lock chamber 130 in substantially vertical taking.
In the embodiment being described herein, load lock chamber door may be adapted to substrate (optionally together with substrate
Carrier is together) it is loaded into in-line base plate processing system, and by substrate (together optionally together with substrate carrier) from in-line substrate
It is unloaded in processing system.For example, load lock chamber door may include transport driving, such as carrier transport driving.
Carrier transport driving may be adapted to the substrate for being alternatively coupled to substrate carrier being loaded into load lock chamber door
Above and by the substrate for being alternatively coupled to substrate carrier unloaded from load lock chamber door.According to embodiment herein,
There is provided, there is the load lock chamber door of carrier transport driving to facilitate substrate is efficient and simply be loaded at in-line substrate
It is unloaded in reason system or from in-line base plate processing system.
According to embodiment described herein, load lock chamber door 734 can be by load lock chamber door support system
750 supports.For example, load lock chamber door support system 750 may include one or more tracks, such as guide rail.For example, one
A or multiple tracks 751 can be arranged in the top area of load lock chamber 130, and far from load lock chamber 130
Extend essentially outward.Load lock chamber door 734 may be adapted to move along one or more tracks 751.
According to embodiment other herein, load lock chamber support system 750 may include being arranged in load-lock
One or more tracks 752 in the bottom section of chamber 130.One or more tracks may be located remotely from load lock chamber 130
Extend essentially outward.Load lock chamber door 734 may be adapted to move along one or more tracks 752.
In the further embodiment being described herein, load lock chamber support system 750 may include cloth
It sets one or more tracks 751 in the top area of load lock chamber 130 and is arranged in the bottom of load lock chamber 130
One or more tracks 752 in portion region.With being arranged in the top area and bottom section of load lock chamber 130
The mobile accuracy of load lock chamber door can be improved in one or more tracks.
Fig. 8 shows another in-line base plate processing system 800 according to embodiment herein.It is described about Fig. 1
All features be also applied for embodiment shown in Fig. 8.According to embodiment described herein, in-line processing substrate system
System includes swinging station, and swings station is suitable for being supported substrate (substrate is optionally supported on substrate carrier) and by base
Basically horizontal position is transmitted to substantially vertical position to plate (optionally including substrate carrier).
For example, array base plate processing system 800 shown in Fig. 8 includes swinging station, for example, such as swinging module 860.Base
Plate 131 and substrate carrier 132 and load lock chamber door 834 are shown at the horizontal position supported by swing module 860
It sets.According to embodiment herein, substrate 131, substrate carrier 132 and load lock chamber door can be made by swinging module 860
834 are in substantially vertical position, so that substrate 131 is loaded into load lock chamber 130 together with substrate carrier 132
In.
Load lock chamber door 834 may be at closing load lock chamber 130 together with loading substrate 131 and substrate load
On body 132 to the position in load lock chamber 130.It can be by substrate 131 and substrate carrier 132 respectively from load lock chamber
It is inside transmitted in the first processing chamber housing 110 and/or second processing chamber 120 of in-line base plate processing system.Using swing station with
In-line processing substrate system can be reduced by moving together substrate (optionally being supported by substrate carrier) together with load lock chamber door
The complexity and the total cost of ownership of system.
Fig. 9 shows 910,920,940,950 and of processing chamber housing there are four the tools according to embodiment described herein
The schematic top view of the in-line base plate processing system 900 of one load lock chamber 930.First processing chamber housing 910 can wrap
It includes for one or more sputtering targets 911 in the first processing region 916 in depositing materials on substrates.Second processing chamber
920 may include for splashing in second processing region 926 in the one or more of identical or different depositing materials on substrates
Shoot at the target 921.Third processing chamber housing 940 may include in third processing region 946 at one of depositing materials on substrates
Or multiple sputtering targets 941.Fourth process chamber 950 may include for depositing material on substrate in fourth process region 956
One or more sputtering targets 951 of material.
According to embodiment herein, load lock chamber 930 can be arranged in the first processing chamber housing 910 and second
Between processing chamber housing 920 and between third processing chamber housing 940 and fourth process chamber 950.
One or more isolating valves (such as vacuum valve 919,929,943,953) can be arranged in load lock chamber 930
Between processing chamber housing 910,920,940,950.Vacuum valve can with load lock chamber 930 and respective handling chamber 910,920,
940, each of 950 in-line positioning, and opening state (vice versa) can be converted to from closed state so that substrate
Pass through in the direction movement indicated by arrow 938.Vacuum valve 919,929,953,943 can be controlled to allow substrate from load
Locking cavity 930 is movable into and out respective handling chamber 910,920,940,950.
Similarly with the load lock chamber that is described about Fig. 1, the load lock chamber of embodiment shown in Fig. 9
930 may be adapted to provide the transition from atmospheric conditions to lower pressure.According to the load-lock of embodiment described herein
Chamber can be vacuum-pumping, and may include relevant device, such as one or more vacuum pumps 935.
According to embodiment herein, array base plate processing system 900 shown in Fig. 9 may include one or more
Substrate loading/uninstalling opening 933.For example, load lock chamber can include that substrate is loaded/unloaded in every side of load lock chamber
It carries opening and includes load lock chamber door in every side of load lock chamber.In embodiment herein, loadlock
Determining chamber 930 may include load lock chamber door 934.Load lock chamber door 934 can be opened and closed, to allow negative
It carries and forms vacuum in locking cavity 930.
According to embodiment herein, load lock chamber door 934 can be arranged in in-line base plate processing system 900
On side.Any of load lock chamber door variant shown in the embodiment that Fig. 2 describes into Fig. 8 or these loads
Any combination of locking cavity door variant is applicable to the in-line base plate processing system 900 of Fig. 9.
Load lock chamber, which can have, is suitably connected to one or more vacuum chambers (such as one or more processing chambers
Room) one or more substrates transmit opening.According to embodiment herein, load lock chamber 930 can have first
Substrate transmission opening 937, the second substrate transmission opening 939, third substrate transmission opening 949 and tetrabasal transmission opening 957,
Each substrate transmission opening is suitable for being connected to respective handling chamber.In the embodiment being described herein, substrate transmission is opened
Mouth is suitable for transmitting the substrate being oriented substantially vertically and can have shape of slit.Slit can be opened by means of vacuum valve and
It closes.
According to embodiment herein, substrate can or in the case where there is no carrier or be attached to carrier and by
It is transported by in-line base plate processing system, to be handled.Embodiment party with being shown in Fig. 1 and being described in more detail above
Similarly, array base plate processing system 900 shown in Fig. 9 includes the substrate 931 for being attached to substrate carrier 932 to formula.
In-line base plate processing system 900 shows the transportation route of four generally straight lines.The transport of first generally straight line
Path 914 is arranged between load lock chamber 930 and the first processing chamber housing 910, to be attached to the base of substrate carrier 932
Plate 931 is transported to the first processing chamber housing 910.The transportation route 924 of second generally straight line is arranged in load lock chamber and the
Between two processing chamber housings 920, so that the substrate 931 for being attached to substrate carrier 932 is transported second processing chamber 920.Third
The transportation route 944 of generally straight line is arranged between load lock chamber 930 and third processing chamber housing 940, to be attached
Substrate 931 to substrate carrier 932 transports third processing chamber housing 910.The transportation route 954 of straight line is arranged on the fourth-largest body
Between load lock chamber 930 and fourth process chamber 950, to transport the substrate 931 for being attached to substrate carrier 932 to
Four processing chamber housings 950.Each generally the transportation route of straight line can pass through corresponding transmission from the internal stretch of load lock chamber
Opening enters respective handling chamber.
Similarly with embodiment shown in Fig. 1, loading/uninstalling opening 933 of embodiment shown in Fig. 9 and negative
Carrying locking cavity door 934 may be adapted to that substrate 931 (optionally including substrate carrier 932) is allowed to exist being substantially perpendicular to substrate
It is loaded on the direction of at least one of the transportation route of substantial straight line in in-line base plate processing system at in-line substrate
The load lock chamber neutralization of reason system is unloaded from the load lock chamber of in-line base plate processing system.For example, substrate can be with
It is being substantially perpendicular to first straight line transportation route 914, second straight line transportation route 924, third linear transport path 944 and
It is loaded into load lock chamber on the direction at least one of four linear transport paths 954 and/or from load lock chamber
Upper unloading.
According to embodiment herein, substrate 931 (optionally including substrate carrier 932) is being loaded into load lock chambers
When room 930, it can be transported between first straight line transportation route 914 and second straight line transportation route 924 by means of being displaced sideways, and
It is transported between third linear transport path 944 and the 4th linear transport path 954 by means of being displaced sideways.It is described herein
Embodiment in, base (can be optionally included along the lateral moving substrate 931 in linear transport path by the first transportation system
Onboard body 932).First transportation system can be for example including bias transport driving, such as eccentric carrier transport driving.
In the embodiment being described herein, load lock chamber 930 may include the second transportation system.For example, the
Two transportation systems may include conveyer system 970, and the conveyer system is suitable in first straight line transportation route 914 and third straight line
(vice versa) passes between transportation route 944 and/or between first straight line transportation route 114 and the 4th linear transport path 954
Send substrate 931 (optionally including substrate carrier 932).According to embodiment herein, conveyer system may be adapted to basic
On perpendicular to substrate mobile on the direction in any of linear transport path.For example, conveyer system 970 can be by substrate 931
(optionally being supported by substrate carrier 932) is transmitted to third linear transport path 944 from first straight line transportation route 914.Transmission
Direction is in Fig. 9 with the instruction of arrow 971.
Figure 10 schematically show according to the tool of embodiment described herein there are two processing chamber housing 1010,
1020 and a load lock chamber 1030 in-line base plate processing system 1000 top view.Similar to straight shown in Fig. 1
Column base plate processing system, the first processing chamber housing 1010 may include for depositing material on substrate in the first processing region 1016
One or more sputtering targets 1011 of material.Second processing chamber 1020 may include in second processing region 1026 in phase
One or more sputtering targets 1021 of same or different depositing materials on substrates.According to embodiment herein, load-lock
Chamber 1030 is arranged between the first processing chamber housing 1010 and second processing chamber 1020.
Similar to array base plate processing system shown in Fig. 1, in-line base plate processing system 1000 may include: one or
Multiple isolating valves, one or more of isolation valve arrangements are between load lock chamber and processing chamber housing；One or more bases
Plate transmission opening, one or more of substrate transmission openings are arranged between load lock chamber and each processing chamber housing；
And one or more vacuum pumps, one or more of vacuum pumps are arranged to load lock chamber and processing chamber housing pumping
It is empty.In-line base plate processing system 1000 includes two linear transport paths.First straight line transportation route 1014 is arranged in loadlock
Determine between chamber 1030 and the first processing chamber housing 1010, so that the substrate transport of substrate carrier will be attached to the first processing chamber
Room 1010.Second straight line transportation route 1024 is arranged between load lock chamber 1030 and second processing chamber 1020, so as to
The substrate transport of substrate carrier will be attached to second processing chamber 1020.
The embodiment according to shown in Figure 10, the first substrate 1031 supported by substrate carrier 1032 can be along
One straight line transportation route 1014 is transmitted from load lock chamber 1030, thus in the processing region of the first processing chamber housing 1010
It is handled in 1016.The substrate 1031 supported by substrate carrier 1032 is travelled to and fro between into the first processing from load lock chamber 1030
The moving direction that chamber 1010 transmits can be described as being arranged essentially parallel to first straight line transport with the instruction of arrow 1038
At least one of path 1014 and second straight line transportation route 1024.
Because the separate load lock chamber 1030 that load lock chamber door 1034 presses the instruction of arrow 1071 is mobile, load
Locking cavity door 1034 can be opened.Load lock chamber door 1034 may include transportation system, for example, such as carrier transport is driven
Dynamic 1070, the new substrate 1041 supported by substrate carrier 1042 to be loaded on load lock chamber door 1034 and will be by
The processed substrate 1052 that substrate carrier 1051 supports is unloaded from load lock chamber door 1034.
By the substrate 1041 supported by substrate carrier 1042 be loaded into the moving direction on load lock chamber door 1034 with
Arrow 1091 indicates, and can be described as being arranged essentially parallel to first straight line transportation route 1014 and second straight line transport road
At least one of diameter 1024.The substrate 1051 supported by substrate carrier 1052 is unloaded from load lock chamber door 1034
Moving direction can be described as being arranged essentially parallel to first straight line transportation route 1014 and second with the instruction of arrow 1081
At least one of linear transport path 1024.According to embodiment herein, the moving direction of substrate can also with Figure 10
Shown on the contrary direction that indicates in embodiment.
According to embodiment herein, load lock chamber door 1034 can be together with the substrate one supported by substrate carrier
It rises and is turned off and on.Load lock chamber door 1034 is closed and the moving direction of opening is with the instruction of arrow 1071, and can
To be described as moving toward and away from load lock chamber 1030.According to embodiment herein, load lock chamber
Door 1034 is suitable for can be together with substrate carrier perpendicular to first straight line transportation route 1016 and second straight line transportation route
It is moved at least one of 1026 direction.For example, in the embodiment being shown in FIG. 10, load lock chamber door
1034 can be together with the substrate 1041 supported by substrate carrier 1042 and towards the opening of load lock chamber 1,030 1033
It is mobile, to close load lock chamber 1030.
Load lock chamber 1030 can be evacuated, and the substrate 1041 supported by substrate carrier 1042 can be along
Two transportation routes 1024 and the second processing region 1026 for being transmitted to such as second processing chamber 1020.Shown in Figure 10
Embodiment and the load lock chamber door 1034 described can be with any other embodiment described herein (for example, such as
Array substrate processing chamber 900 shown in Fig. 9) combination.
Figure 11 schematically shows the side of the in-line base plate processing system of operation according to embodiment described herein
Method 1100.In-line base plate processing system includes the first processing chamber housing, second processing chamber and load lock chamber, wherein loadlock
Chamber is determined between the first processing chamber housing and second processing chamber.Method includes: to transport first substrate from load lock chamber
Into the first processing chamber housing and on the first substrate deposition materials layer 1110；And via load lock chamber by first substrate
Another material layer 1120 is transported in second processing chamber and deposited on the first substrate, or first substrate is transported negative
It carries locking cavity and transports the second substrate in second processing chamber, and the deposition materials layer 1130 in the second substrate.
According to embodiment herein, method can further comprise executing service procedure in the first processing chamber housing
1140.Service procedure can be for example including the pollution for replacing the first processing chamber housing of one or more sputtering targets and/or removal.
According to embodiment herein, method can further comprise in the transporting direction for being substantially perpendicular to first substrate
Direction on first substrate and/or the second substrate are loaded into 1150 in in-line base plate processing system.The transporter of first substrate
To the straight line path for being first substrate from load lock chamber and being transported to the first processing chamber housing.
In the embodiment being described herein, the method for the in-line base plate processing system of operation as shown in Figure 1 for example may be used
With include in substantially vertical orientation by first substrate and first substrate carrier load into load lock chamber 130.It closes
It closes load lock chamber door 134 and evacuates load lock chamber 130 by means of vacuum pump 135.It can be according to a processing chamber housing
In processing range (for example, relative to processing range in the first processing chamber housing 110) load lock chamber 130 was evacuated to
Cross pressure.First substrate and first substrate carrier can be transported from load lock chamber to first along the first transportation route 114
In processing chamber housing 110, on the surface that first material layer is deposited on first substrate in the first processing chamber housing 110.
Then, first substrate can be transported and returns in load lock chamber 130 and enters second processing chamber 120
In.In second processing chamber 120, another material layer can be deposited at the top of first material layer.When by first substrate from negative
Locking cavity 130 is carried to transport to the first processing chamber housing 110, transport back load lock chamber 130 and enter second processing chamber
When 120, first substrate can advance along first straight line transportation route 114 and along second straight line transportation route 124.According to
Embodiment herein, first straight line transportation route 114 and second straight line transportation route 124 can each other it is in alignment simultaneously
And it is formed from the first processing chamber housing 110 and extends through the single straight line that load lock chamber 130 enters second processing chamber 120
Transportation route.Load lock chamber 130 can be made to divulge information, and load lock chamber door 134 can be opened.
It can be in substantially vertical orientation by the second substrate and the second substrate carrier load to load lock chamber 130
In.When the second substrate and Second support to be loaded into load lock chamber 130, load lock chamber door 134 can be closed
And evacuate load lock chamber 130.It can be according to the processing range in the first processing chamber housing 110 by load lock chamber 130
It is evacuated to transitional pressure.The second substrate and the second substrate carrier can be transported from load lock chamber along the first transportation route 114
It is defeated into the first processing chamber housing 110, on the surface that first material layer is deposited on the second substrate in the first processing chamber housing 110.?
It, can be by the second substrate and the second substrate carrier when first substrate and first substrate carrier are still in second processing chamber 120
It transports from the first processing chamber housing 110 to load lock chamber 130.
Then, load lock chamber 130 can be made to divulge information, and by the second substrate and the second substrate carrier from load lock chambers
It is unloaded on room 130.For example, third substrate and third substrate carrier can be loaded into loadlock in substantially vertical orientation
Determine in chamber 130 and transport into the first processing chamber housing 110, as above with respect to the second substrate and Second support and described in.
First material layer can be deposited on the surface of third substrate.Meanwhile it can be by first substrate and first substrate carrier from second
Processing chamber housing 120 transports load lock chamber 130, then unloads from load lock chamber 130, and can be by the 4th base
Plate and tetrabasal carrier load into load lock chamber and transport in second processing chamber 120.First material layer can
To be deposited on the surface of tetrabasal in second processing chamber 120.
The multiple substrates being optionally supported on substrate carrier can cycle through in-line processing substrate as described herein
The first chamber and second chamber of system.Substrate enters the first processing chamber housing and/or second processing chamber by load lock chamber
In movement can be it is synchronous to optimize the occupancy to the first processing chamber housing independently of the occupancy to second processing chamber.Root
It can avoid that there are the multiple processing chamber housings arranged one by one according to the in-line base plate processing system of embodiment herein
Conventional in-line base plate processing system in it is possible that any bottleneck.
Although the special characteristic of the various embodiments of the utility model may be shown in some drawings without at it
He shows in attached drawing, but this is used for the purpose of conveniently.Any feature of one attached drawing is in combination with any of any other attached drawing
Feature and quote and/or be claimed.
This written description uses examples to disclose the utility model, including optimal mode；And also make appointing for this field
What technical staff can practice described theme, including manufacturing and using any device or system and executing any covered
Method.Although various particular implementations have been disclosed in foregoing teachings, those skilled in the art will recognize that, right is wanted
Book is asked to be intended to allow equally effective modification.In particular, the feature of embodiment described above not having to be mutually exclusive can be each other
Combination.Scope of patent protection be defined by the claims, and may include those skilled in the art be contemplated that it is such
Modification and other examples.These other examples be intended within the scope of the claims, as long as they have not with the word of claim
As long as the different structural element of face language or they include being wanted with the literal language of claim without the equivalent structure of essence difference
Element.
Claims (20)
1. a kind of for handling the in-line base plate processing system (100) of the substrate being oriented substantially vertically (131), it is characterised in that
First processing chamber housing (110), first processing chamber housing have the first processing region (116) and are suitable in the substrate
Upper deposition first material layer；
Second processing chamber (120), the second processing chamber have second processing region (126) and are suitable in the substrate
Upper depositing second material layer；And
Load lock chamber (130), the load lock chamber is suitable for loading from the in-line base plate processing system and unloading institute
Substrate is stated,
Wherein the load lock chamber is between first processing chamber housing and the second processing chamber.
2. array base plate processing system (100) as described in claim 1, wherein the load lock chamber is suitable for the base
Plate transports in first processing region and along second straight line transportation route along first straight line transportation route (114)
(124) it transports in the second processing region.
3. array base plate processing system (100) as claimed in claim 2, wherein the load lock chamber be adapted to allow for it is described
Substrate fills on the direction perpendicular at least one of the first straight line transportation route and the second straight line transportation route
The in-line base plate processing system is downloaded to neutralize from the in-line base plate processing system unloading.
4. a kind of load lock chamber (130), the load lock chamber is used to substrate (131) being loaded into in-line processing substrate
It is unloaded in system (100) or from the in-line base plate processing system, the array base plate processing system is substantially perpendicular for handling
The substrate (131) being directly orientated, the load lock chamber (130) are suitable for being arranged at the first of the in-line base plate processing system
It manages between chamber (110) and second processing chamber (120), so that the substrate can be moved along first straight line transportation route (114)
It moves in first processing chamber housing and is moved in the second processing chamber along second straight line transportation route (124).
5. load lock chamber (130) as claimed in claim 4 further comprises that the first transmission opening (137) and second pass
It send opening (139), the first transmission opening and the second transmission opening are adapted to allow for the substrate straight along described first
Line transportation route is moved in first processing chamber housing and is moved at described second along the second straight line transportation route
It manages in chamber.
6. load lock chamber (130) as claimed in claim 4 further comprises load lock chamber door (134), described negative
Carry locking cavity door be adapted to allow for the substrate be loaded into substantially vertical orientation in the load lock chamber and from
It is unloaded in the load lock chamber.
7. load lock chamber (130) as claimed in claim 5 further comprises load lock chamber door (134), described negative
Carry locking cavity door be adapted to allow for the substrate be loaded into substantially vertical orientation in the load lock chamber and from
It is unloaded in the load lock chamber.
8. load lock chamber (130) as claimed in claim 6, wherein be further adapted for can for the load lock chamber door
It is moved on the direction for being parallel at least one of the first straight line transportation route and the second straight line transportation route.
9. load lock chamber (130) as claimed in claim 7, wherein be further adapted for can for the load lock chamber door
It is moved on the direction for being parallel at least one of the first straight line transportation route and the second straight line transportation route.
10. the load lock chamber (130) as described in any one of claim 6 to 9, wherein the load lock chamber door is suitable
In can be on the direction perpendicular at least one of the first straight line transportation route and the second straight line transportation route
It is mobile.
11. the load lock chamber (130) as described in any one of claim 6 to 9, wherein the load lock chamber door is suitable
In can be on the direction perpendicular at least one of the first straight line transportation route and the second straight line transportation route
It is mobile, and wherein the load lock chamber door is suitable for transport together with substrate carrier perpendicular to the first straight line
It is moved on the direction of at least one of defeated path and the second straight line transportation route.
12. the load lock chamber (130) as described in any one of claim 6 to 9, wherein the load lock chamber door is suitable
In can be moved on the direction of vertical axes for being parallel to the load lock chamber.
13. load lock chamber (130) as claimed in claim 10, wherein the load lock chamber door is suitable for put down
Row is moved on the direction of the vertical axes of the load lock chamber.
14. load lock chamber (130) as claimed in claim 11, wherein the load lock chamber door is suitable for put down
Row is moved on the direction of the vertical axes of the load lock chamber.
15. the load lock chamber (130) as described in any one of claim 6 to 9, wherein the load lock chamber door is suitable
It is tilted in far from the load lock chamber and towards the load lock chamber.
16. load lock chamber (130) as claimed in claim 10, wherein the load lock chamber door is suitable for far from described
It load lock chamber and is tilted towards the load lock chamber.
17. load lock chamber (130) as claimed in claim 11, wherein the load lock chamber door is suitable for far from described
It load lock chamber and is tilted towards the load lock chamber.
18. load lock chamber (130) as claimed in claim 15, wherein the load lock chamber door is suitable for together with described
Substrate is tilted far from the load lock chamber and towards the load lock chamber together.
19. load lock chamber (130) as claimed in claim 15, wherein the load lock chamber door is further adapted for connecting
It is tilted together far from the load lock chamber and towards the load lock chamber with swing station.
20. a kind of for handling the in-line base plate processing system (130) of the substrate being oriented substantially vertically (131), feature exists
In
First processing chamber housing (110), first processing chamber housing have the first processing region (116) and are suitable in the substrate
Upper deposition first material layer；
Second processing chamber (120), the second processing chamber have second processing region (126) and are suitable in the substrate
Upper depositing second material layer；And
Load lock chamber (130), the load lock chamber are suitable in substantially vertical orientation from the in-line substrate
Processing system loads and unloads the substrate,
Wherein the load lock chamber is between first processing chamber housing and the second processing chamber, so that the substrate
Along first straight line transportation route (114) first processing region can be transported and along second straight line transportation route
(124) the second processing region is transported.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2015/061414 WO2016188550A1 (en) | 2015-05-22 | 2015-05-22 | Lock chamber, inline substrate processing system and method of operating an inline substrate processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240622U true CN208240622U (en) | 2018-12-14 |
Family
ID=53274522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201590001521.7U Active CN208240622U (en) | 2015-05-22 | 2015-05-22 | For loading and unloading the load lock chamber and array base plate processing system of carried base board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208240622U (en) |
| WO (1) | WO2016188550A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114127909A (en) * | 2019-07-25 | 2022-03-01 | 应用材料公司 | System and method for vapor plating an OLED layer stack in a vertical orientation |
| CN114144872A (en) * | 2019-07-25 | 2022-03-04 | 应用材料公司 | System and method for vapor plating an OLED layer stack in a vertical orientation |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102540963B1 (en) * | 2017-12-27 | 2023-06-07 | 삼성전자주식회사 | Method of forming a micropattern and substrate processing apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3215643B2 (en) * | 1997-01-31 | 2001-10-09 | ワイエイシイ株式会社 | Plasma processing equipment |
| US20080209758A9 (en) * | 2005-06-27 | 2008-09-04 | Dominique Thifault | Pocket ventilator |
| EP2489759B1 (en) * | 2011-02-21 | 2014-12-10 | Applied Materials, Inc. | System for utilization improvement of process chambers and method of operating thereof |
-
2015
- 2015-05-22 CN CN201590001521.7U patent/CN208240622U/en active Active
- 2015-05-22 WO PCT/EP2015/061414 patent/WO2016188550A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114127909A (en) * | 2019-07-25 | 2022-03-01 | 应用材料公司 | System and method for vapor plating an OLED layer stack in a vertical orientation |
| CN114144872A (en) * | 2019-07-25 | 2022-03-04 | 应用材料公司 | System and method for vapor plating an OLED layer stack in a vertical orientation |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016188550A1 (en) | 2016-12-01 |
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