TW201401354A - Sheet cutting apparatus, chip manufacturing apparatus, sheet cutting method, chip manufacturing method, and sheet cutting program - Google Patents

Abstract

Provided is a sheet cutting apparatus that is capable of suppressing damage to a wafer. The sheet cutting apparatus cuts a sheet attached to an attached member (e.g., semiconductor wafer) by a laser beam along a periphery of the attached member. It is preferable that the sheet is cut at a vicinity of an edge of an attached part between the sheet and the attached member. Further, it is preferable that the attached member is a semiconductor wafer and the sheet is cut by the laser beam which does not give thermal influence on the semiconductor wafer.

Description

Sheet cutting device, wafer manufacturing equipment, sheet cutting method, wafer manufacturing method, and sheet cutting program

According to the patent law, the present application claims priority to Japanese Patent Application No. 2012-96494, filed on Apr. 20, 2012, the disclosure of which is hereby incorporated by reference.

The present invention relates to a sheet cutting apparatus, a wafer manufacturing apparatus, a sheet cutting method, a wafer manufacturing method, and a sheet cutting program.

Wafer manufacturing includes a process of polishing a semiconductor wafer (hereinafter referred to as a wafer) and a process of cutting a wafer. When the wafer is polished, a protective tape (such as a backside grinding (BG) tape) for protecting the front surface (circuit surface) of the wafer, and a wafer inner protective tape for protecting the back surface of the wafer ( LC tape) adheres to prevent the wafer surface from being contaminated by the slurry. Furthermore, when the wafer is cut after grinding, a dicing tape is adhered to the back surface of the wafer to prevent the singulated wafer from scattering. The protective tape, the wafer inner surface protective tape, the dicing tape, and the like are collectively referred to as sheets in the following.

When the wafer is ground, the sheet protecting the surface of the wafer is cut along the periphery of the wafer to prevent the sheet from moving and peeling, which may result in contamination of the surface of the wafer or as occurs in wafers and sheets. The damage of the adhesive end. At this time, the sheet is preferably cut at a position very close to the periphery of the wafer.

For example, according to the sheet cutting method disclosed in Japanese Laid-Open Patent Publication No. 2007-288010, an image of the shape of the periphery of the wafer is taken, and the cutter blade is controlled according to the image. The material is cut into the sheet.

Since the sheet cutting method by the cutter blade is used to cut the sheet by the sheet cutting method disclosed in Japanese Laid-Open Patent Publication No. 2007-288010, the cutting blade may contact the wafer and may cause damage to the wafer.

The present invention is directed to solving the aforementioned problems, and is directed to providing a sheet cutting apparatus, a wafer manufacturing apparatus, a sheet cutting method, a wafer manufacturing method, and a sheet cutting program, which are capable of suppressing adhesion of an adhesive attached to a sheet. damage.

According to an exemplary embodiment of the present invention, the sheet cutting apparatus cuts the sheet adhered to the adhesive attachment by a laser beam along the periphery of the adhesive attachment.

According to an exemplary embodiment of the present invention, a sheet cutting method cuts a sheet adhered to the adhesive attachment by a laser beam along a periphery of the adhesive attachment.

According to an exemplary embodiment of the present invention, the sheet cutting program causes the computer to execute the following program: acquiring position information of the alignment mark formed in the adhesive attachment; controlling the laser beam output device, and one of the supporting devices, the support The device supports the adhesive attachment according to the position information of the acquired alignment mark; and the laser beam borrowed from the laser beam output device cuts the sheet adhered to the adhesive attachment along the periphery of the adhesive attachment.

1‧‧‧Sheet cutting equipment

2‧‧‧Support

3‧‧‧Laser beam output

4‧‧‧ Controller

5‧‧‧Sheet

6‧‧‧ Wafer

7‧‧‧ box

10‧‧‧Sheet cutting equipment

11‧‧‧Image Capture Department

12‧‧‧ wafer

13‧‧‧ alignment mark

20‧‧‧Sheet cutting equipment

21‧‧‧Sheet

22‧‧‧Support

23‧‧‧Image Capture Department

L‧‧‧Laser beam

The above and other objects, features and advantages of the present invention will become more fully understood from the description of the appended claims.

1 is a schematic view showing a sheet cutting apparatus according to a first exemplary embodiment of the present invention; FIG. 2 is a schematic view showing the sheet cutting apparatus according to the first exemplary embodiment of the present invention. a support portion; according to a first exemplary embodiment of the present invention, FIG. 3 is a schematic view showing another laser beam cutting portion in the sheet cutting device; according to the first exemplary embodiment of the present invention, Figure 4 is a flow chart showing the operation of the sheet cutting apparatus; Figure 5 is a schematic view showing a preferred cutting position when cutting a sheet; Figure 6 is a schematic view showing a sheet cutting device according to a second exemplary embodiment of the present invention; a second example according to the present invention 7 is a schematic view showing a wafer used in the sheet cutting apparatus; FIG. 8 is a line diagram showing an alignment mark formed on the wafer; a second exemplary embodiment according to the present invention For example, FIG. 9 is a flow chart showing the operation of the sheet cutting apparatus; and FIG. 10 is a schematic view showing a sheet cutting apparatus according to a third exemplary embodiment of the present invention.

A sheet cutting device, a wafer manufacturing apparatus, a sheet cutting method, a wafer manufacturing method, and a sheet cutting program according to each of the exemplary embodiments of the present invention will be described below. However, it should be noted that the present invention is not limited by the following exemplary embodiments. For the sake of clarity of the description, the following description and illustration are appropriately simplified.

<First Exemplary Embodiment>

Although not shown in the drawings, the wafer manufacturing apparatus according to this exemplary embodiment adheres a sheet to a front surface of the wafer to polish the surface of the wafer, and adheres the sheet to the wafer after the sheet is peeled off. The back surface is to cut the wafer. Although the wafer has a shape of a disk such as a general wafer, the shape is not specifically limited thereto.

In summary, the main feature of this exemplary embodiment is an apparatus that cuts a sheet (particularly a surface protection sheet) adhered to a wafer in a wafer manufacturing apparatus. Therefore, in the following description, the sheet cutting device will be described in detail, and the description of other members will be omitted.

More specifically, as shown in FIG. 1, the sheet cutting apparatus 1 includes a support portion 2, a laser beam output portion 3, and a controller 4.

The support portion 2 supports the wafer 6, and the sheet 5 is adhered to the front surface of the wafer 6. The support portion 2 according to this exemplary embodiment supports the wafer 6 to arrange the front surface of the wafer 6 face up. The sheet 5 can be a sheet generally used. Specifically, the sheet 5 is, for example, a sheet member made of a synthetic resin, and is thermally bonded to the surface of the wafer 6.

Preferably, the support portion 2 is movable in, for example, the X-axis direction, the Y-axis direction, and the Z-axis direction, as shown in FIG. 2, and is centered on the substantially center of the wafer 6 on a plane including the X-axis and the Y-axis. (rotation angle θ) and rotate.

The laser beam output unit 3 is disposed above the support unit 2. The laser beam output portion 3, similar to a typical laser beam output portion, includes a laser oscillator, a mirror, a collecting lens, and the like. The laser beam output portion 3 can have any structure. For example, the laser beam output portion 3 can move the irradiation position of the laser beam L according to the movement trajectory of the laser beam output portion 3 as shown in FIG. 1, or can be the laser beam output portion as shown in FIG. 3 Fixing and moving the irradiation position of the laser beam L itself.

The laser beam output portion 3 emits a laser beam L to cut the sheet 5 adhering to the surface of the wafer 6 along the circumference of the wafer 6. In short, the laser beam output portion 3 illuminates the vicinity of the periphery of the wafer 6 with the laser beam L. As shown in Fig. 3, the sheet 5 is adhered to a frame 7 so that when the sheet 5 is cut by the laser beam L, the sheet 5 is held in a tensioned state. The wafer 6 is disposed in the hollow portion of the frame 7.

At this time, the position at which the laser beam L is irradiated on the sheet 5 can be controlled by the fixed support portion 2 and the position at which the laser beam L is emitted from the laser beam output portion 3 by the controller 4. Further, the position on the sheet 5 irradiated with the laser beam L can be controlled by fixing the position at which the laser beam L is emitted in the laser beam output portion 3 and controlling the position of the support portion 2 by the controller 4. .

The output of the laser beam L is controlled by the controller 4. The output of the laser beam L is appropriately set in consideration of, for example, the material, thickness, or the like of the sheet 5. For example, when the output of the laser beam L is large, the sheet 5 has a high melting rate and the cut portion resolidifies, which makes it difficult to cut the sheet 5. Further, when the output of the laser beam is small, the sheet 5 has a low melting rate and it is impossible to cut the sheet 5 quickly. Therefore, the output of the laser beam is set to achieve an appropriate melting rate.

Preferably, even when the laser beam L is transmitted through the sheet 5 and the wafer 6 is illuminated by the laser beam L, the laser beam L does not cause an adverse effect on the wafer 6. For example, since the wafer 6 is generally composed of tantalum, it is preferable to use a CO ₂ laser beam, a green laser beam or the like as the laser beam L.

As described above, the controller 4 controls the support portion 2 or the laser beam output portion 3. The control The controller 4 can perform control of the support portion 2 or the laser beam output portion 3 in accordance with a program stored in the controller 4, or can use hardware resources to perform control.

The sheet cutting device 1 described above operates as shown in Fig. 4. First, the transport mechanism (not shown) places the wafer 6 having the front surface on the support portion 2, which is adhered to the front surface (S1) of the wafer 6 with the sheet 5.

Next, the controller 4 controls the laser beam output portion 3 so that the emitted laser beam L has a predetermined output (S2). At the same time, the position of the support portion 2 or the laser beam output portion 3 is controlled so that the periphery of the wafer 6 is irradiated with the laser beam L (S3). Therefore, the periphery of the wafer 6 is irradiated with the laser beam L emitted from the laser beam output portion 3.

Thereafter, the controller 4 controls the support portion 2 or the laser beam output portion 3 such that the position irradiated with the laser beam L moves around the periphery of the wafer 6 (i.e., the circumferential direction of the wafer 6) (S4) ). Therefore, the position on the sheet 5 irradiated with the laser beam L is melted, and the laser beam L is irradiated to the periphery of the position of the sheet 5 (i.e., the sheet 5 protrudes outward from the periphery of the wafer 6). The portion is cut away from a portion disposed inward from the periphery of the wafer 6.

When the entire periphery of the wafer 6 is irradiated by the laser beam L, the controller 4 stops emitting the laser beam L from the laser beam output portion 3, and terminates the control of the support portion 2 or the laser beam output portion 3 (S5) . Therefore, the portion of the sheet 5 that protrudes outward from the periphery of the wafer 6 is removed.

The sheet 5 is cut by the laser beam L as described above, so that the wafer 6 can be prevented from being damaged when the sheet 5 is cut.

As shown in FIG. 5, the side surface of the general wafer 6 has a curved surface, and when the wafer 6 is polished, stress concentration occurs around the adhesion end of the sheet 5 and the wafer 6. In order to reduce the portion of the sheet 5 that protrudes from the adhesion end of the wafer 6, the sheet 5 is preferably cut around the adhesion end. For example, when viewed in a vertical direction, the sheet 5 is preferably cut at a curved region R in the wafer 6. In this case, unlike the conventional sheet cutting apparatus, the wafer 6 does not have the damage caused by the cutter blade, so that the sheet 5 can be brought into close contact with the wafer 6 in a good state. The position is cut. Therefore, when the wafer 6 is polished, damage to the wafer 6 can be suppressed. Alternatively, the sheet 5 can be cut inside the adhesion end of the sheet 5 and the wafer 6.

<Second exemplary embodiment>

A wafer manufacturing apparatus according to this exemplary embodiment, and according to the first exemplary embodiment The wafer manufacturing apparatus in the embodiment has substantially the same structure. The wafer manufacturing apparatus according to this exemplary embodiment has a structure in which the sheet cutting apparatus is capable of cutting the sheet 5 with high precision. In the following description, the repeated description is omitted, and the same components are denoted by the same reference numerals.

As shown in FIG. 6, according to the present exemplary embodiment, the sheet cutting device 10 includes an image capturing portion 11 in addition to the support portion 2, the laser beam output portion 3, and the controller 4.

As shown in FIG. 7, one or a plurality of alignment marks 13 are formed on the surface of the wafer 12 according to the present exemplary embodiment. The alignment mark 13 is formed so that it can capture an image by the image capturing portion 11, and the alignment mark 13 is formed in a cross shape as in the example shown in FIG. However, the alignment mark is not limited by this.

For example, preferably, the alignment mark 13 is formed on a wafer portion that is not commercially available (for example, a wafer portion to be tested). Further, for example, a mark for cutting may be used as the alignment mark 13.

Since the alignment mark 13 is imaged by the sheet 5, a transparent or translucent sheet is preferably used as the sheet 5.

The image capturing unit 11 is arranged above the support unit 2. The image capturing unit 11 is configured to be capable of capturing at least one image of the alignment mark 13 of the wafer 12. Similar to the general image capturing component, the image capturing portion 11 includes an image capturing component, such as a complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) image sensor, and outputs the obtained image to the controller. 4.

The controller 4 controls the position of the support portion 2 based on the input image. Specifically, the controller 4 determines the position of the alignment mark 13 from the input image, and controls the position of the support portion 2 to position the alignment mark 13 at a predetermined position.

The sheet cutting device 10 is operated as shown in FIG. Specifically, the following procedure is executed between the program S1 and the program S2 in the operation of the sheet cutting apparatus 1 according to the first exemplary embodiment.

First, similar to the sheet cutting apparatus 1 according to the first exemplary embodiment, the S1 program is executed. Next, the controller 4 controls the image capturing unit 11 and causes the image capturing unit 11 to capture the image of the alignment mark 13 of the wafer 6 through the sheet 5 (S11). The image capturing unit 11 outputs the obtained image to the controller 4 (S12).

Next, the controller 4 performs, for example, binarization processing on the input image, and then acquires a plurality of feature points to acquire position information of the alignment mark 13 (S13).

Second, the controller 4 previously contains the normal position information of the alignment mark 13. The controller 4 compares the normal position information of the alignment mark 13 with the position information of the alignment mark 13 captured by the image, and controls the X-axis direction, the Y-axis direction, and the rotation of the support portion 2 as shown in FIG. The angle θ is used to position the alignment mark 13 of the captured image to a normal position (S14).

The following program includes the program S2 to the program S5, which is similar to the one in the sheet cutting device 1 according to the first exemplary embodiment. It is to be noted that the captured image program of the alignment mark 13 for controlling the position of the support portion 2 can be executed at the same place as the program for cutting the sheet 5. Further, as shown in FIG. 6, after capturing the image of the alignment mark 13 and controlling the position of the support portion 2, the support portion 2 can be moved by a transport mechanism (not shown) to cut the sheet 5.

In this manner, the position at which the sheet 5 is to be cut is controlled in accordance with the positional information of the alignment mark 13 formed on the wafer 6. Therefore, as shown in FIG. 5, the laser beam L can be cut along the periphery of the periphery of the adhesion end of the wafer 6 and the sheet 5 accurately.

<Third Exemplary Embodiment>

The sheet cutting device 10 according to the second exemplary embodiment cuts the sheet 5 adhered to the front surface of the wafer 6, and the sheet cutting device 20 according to this exemplary embodiment cuts the sheet adhered to the rear surface of the wafer 6. Material 21. In the following description, the repeated description is omitted, and the same components are denoted by the same reference numerals.

As shown in FIG. 10, according to this exemplary embodiment, the sheet cutting apparatus 20 includes a support portion 22, a laser beam output portion 3, a controller 4, and an image capturing portion 23, which according to the second exemplary embodiment The sheet cutting apparatus 10 is substantially similar.

The support portion 22 supports the wafer 6 such that the rear surface side of the wafer 6 to which the sheet 21 is adhered is disposed upward. At this time, the alignment mark formed on the front surface of the wafer 6 is disposed on the side of the support portion 22. According to the present exemplary embodiment, the support portion 22 has a structure through which the image capturing portion 23 disposed under the support portion 22 can capture an image of the alignment mark through the support portion 22. For example, the support portion 22 is formed of, for example, a member that allows light to pass through the glass. Alternatively, the support portion 22 can have a hollow portion from which an image of the alignment mark can be drawn.

Therefore, according to this exemplary embodiment, the sheet cutting device 20 can be rooted According to the same procedure of the sheet cutting device 10 of the second exemplary embodiment, the sheet 21 adhered to the rear surface of the wafer 6 is cut.

Although the sheet 21 adhered to the rear surface of the wafer 6 according to the present exemplary embodiment is cut in the sheet cutting device 20, a similar operation can be performed in the case where the sheet adhered to the front surface of the wafer 6 The opaque and alignment marks are formed on the rear surface of the wafer 6.

<Fourth Exemplary Embodiment>

Although the position of the support portion 2 (22) is controlled in accordance with the position information of the alignment mark control in the second and third exemplary embodiments, the laser beam L of the laser beam output portion 3 may be irradiated on the sheet. The position of the material 5 (21) is controlled.

In this case, the controller 4 previously includes the position information of the laser beam output portion 3 associated with the alignment mark, and controls the position of the laser beam output portion 3 to align the position information with the image capture. The location information of the tag is consistent.

The present invention is not limited by the foregoing embodiments, but may be modified as appropriate without departing from the spirit of the invention.

Although the sheet 5 described in the embodiment is composed of a synthetic resin, it is not particularly limited as long as it can adhere to the front surface or the rear surface of the wafer 6. For example, a material in which a resin layer for integrally molding the surface of the wafer 6 is integrally formed can be similarly cut.

According to an exemplary embodiment, although a CO ₂ laser beam or a green laser beam is used as the laser beam L, other laser beams may be used.

According to an exemplary embodiment, although the sheet adhered to the wafer is cut, the member to which the sheet is attached is not specifically limited.

While the present invention has been particularly shown and described with respect to the exemplary embodiments, the invention is not limited by the embodiments. Various changes in form and detail may be made without departing from the spirit and scope of the invention as defined by the appended claims.

The program can be stored and provided to a computer that uses any type of non-transitory computer readable media. Non-transitory computers include any kind of tangible storage media. Examples of non-transitory computer readable media include magnetic storage media (such as floppy disks, tapes, hard drives, etc.), optical magnetic storage media (such as magneto-optical disks), CD-ROM (CD-ROM only), CD-R ( Recordable disc), CD-R/W (rewritable disc), and semiconductor memory (such as mask read-only memory (mask ROM), Program-read only memory (PROM), erasable programmable read-only memory (EPROM), flash-only read-only memory (flash ROM), dynamic random access memory (RAM), etc. The program can be provided to a computer that can read media using any kind of temporary computer. Examples of transitory computer readable media include electronic signals, optical signals, and electromagnetic waves. Temporary computer readable media can be provided to a computer via wired communication lines (eg, wires, and fiber optics) or wireless communication.

2‧‧‧Support

3‧‧‧Laser beam output

4‧‧‧ Controller

5‧‧‧Sheet

10‧‧‧Sheet cutting equipment

11‧‧‧Image Capture Department

12‧‧‧ wafer

Claims (11)

A sheet cutting device for cutting a sheet adhered to the adhered attachment by a laser beam along a periphery of the adhesive attachment. The sheet cutting device of claim 1, wherein the sheet cutting device cuts the sheet around an edge of an adhesive portion, the adhesive portion being located between the sheet and the adhered attachment. The sheet cutting device of claim 1, wherein the adhesive attachment is a semiconductor wafer, and the sheet is cut with the laser beam, the laser beam having no thermal influence on the semiconductor wafer. The sheet cutting device of claim 1, wherein the device comprises a laser beam output device; a support device supporting the glued attachment; and an image capture device for capturing an image of the adhered attachment; and controlling a device that controls a position of one of the laser beam output device and the support device, wherein an alignment mark is formed in the adhesive attachment, and the control device is based on the image capture device The position information of the alignment mark controls one of the laser beam output device and the support device. A wafer manufacturing apparatus comprising the sheet cutting apparatus as set forth in claim 1 of the patent application. A method of sheet cutting for cutting a laser beam along a periphery of an adhesive attachment to a sheet of the adhered attachment. A method of sheet cutting according to claim 6, wherein the method comprises cutting the sheet around an edge of an adhesive portion, the adhesive portion being located between the sheet and the adhered attachment. A method for cutting a sheet according to item 6 of the patent application, wherein the adhered attachment is a semiconductor crystal Round, and the sheet is cut with the laser beam, the laser beam having no thermal influence on the semiconductor wafer. The method for cutting a sheet according to item 6 of the patent application, the method comprising: acquiring position information of an alignment mark formed in the adhesive attachment; and controlling the lightning based on the obtained position information of the alignment mark The beam output device and one of the support devices supporting the adhesive attachment. A method of fabricating a wafer, the method comprising the method of sheet cutting as set forth in claim 6 of the patent application. A wafer cutting program for causing a computer to perform the following processing: acquiring position information of an alignment mark formed in a glued attachment; controlling laser beam output according to the acquired position information of the alignment mark And a device for supporting the adhesive attachment; and emitting a laser beam from the laser beam output device to cut and adhere to a sheet of the adhesive attachment along the periphery of the adhesive attachment.