KR20130118777A - Sheet cutting apparatus, chip manufacturing apparatus, sheet cutting method, chip manufacturing method, and sheet cutting program - Google Patents

Abstract

PURPOSE: An apparatus for cutting a sheet, an apparatus for manufacturing a chip, a method for cutting the sheet, a method for manufacturing a chip, and a program for cutting the sheet are provided to prevent the thermal influence on a wafer by using a laser beam. CONSTITUTION: A supporting part (2) supports a wafer. A sheet (5) is formed on the surface of the wafer by a thermocompression process. The sheet is made of a synthetic resin. A laser beam power part (3) is arranged above the supporting part. The laser beam power part includes a laser generator, a back mirror, and a condensing lens. [Reference numerals] (4) Controller

Description

SHEET CUTTING APPARATUS, CHIP MANUFACTURING APPARATUS, SHEET CUTTING METHOD, CHIP MANUFACTURING METHOD, AND SHEET CUTTING PROGRAM}

The present invention relates to a sheet cutting device, a chip manufacturing device, a sheet cutting method, a chip manufacturing method, and a sheet cutting program.

Chip manufacturing includes a process of grinding a semiconductor wafer (hereinafter simply abbreviated as a wafer) and a process of dicing the wafer. When grinding the wafer, a back grind (BG) tape protecting the front surface (circuit surface) of the wafer and a back surface of the wafer to protect the surface of the wafer from being contaminated by the grinding liquid. Protective tape such as LC tape is attached. In addition, during dicing of the wafer after grinding, a dicing tape is attached to the back surface of the wafer in order to prevent the chipped chips from scattering. Hereinafter, a protective tape, an LC tape, a dicing tape, etc. are named generically a sheet.

During grinding of the wafer, the wafer may be displaced and peeled off, causing contamination of the surface of the wafer and damaging the wafer or the sheet to prevent damage such as cracks occurring at the attachment end of the sheet. Cut the sheet protecting the surface. At this time, it is preferable that the sheet is cut at a position very close to the outer circumference of the wafer.

For example, the sheet cutting method disclosed in Japanese Patent Laid-Open No. 2007-288010 takes an image of the outer circumference of the wafer and controls the cutter blade based on the image data to cut the sheet.

In the sheet cutting method disclosed in Japanese Patent Laid-Open No. 2007-288010, since the sheet is cut by using the cutter blade, the cutter blade may contact the wafer, which may cause damage to the wafer.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a sheet cutting device, a chip manufacturing device, a sheet cutting method, a chip manufacturing method, and a sheet cutting program capable of suppressing damage to the adhered member on which a sheet is attached. For the purpose of

A sheet cutting device according to an exemplary aspect of the present invention cuts a sheet attached to the adherend along the outer periphery of the adherend by a laser beam.

The sheet cutting method according to an exemplary aspect of the present invention cuts the sheet attached to the adherent member along the outer circumference of the adherend by a laser beam.

A sheet cutting program according to an exemplary aspect of the present invention supports the laser beam output means and the adherend member based on a process of acquiring position information of the alignment mark formed on the adherend, the position information of the acquired alignment mark. The computer executes a process of controlling one of the supporting means, and a process of cutting the sheet attached to the adherent member along the outer periphery of the adherend by the laser beam emitted from the laser beam output means.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which shows the sheet cutting device which concerns on 1st Embodiment of this invention.
It is a schematic diagram which shows the support part of the sheet cutting device which concerns on 1st Embodiment of this invention.
It is a schematic diagram which shows the other laser beam cutting part of the sheet cutting device which concerns on 1st Embodiment of this invention.
4 is a flowchart showing the operation of the sheet cutting device according to the first embodiment of the present invention.
5 is a schematic diagram showing a preferred position at which a sheet is cut.
It is a schematic diagram which shows the sheet cutting device which concerns on 2nd Embodiment of this invention.
It is a schematic diagram which shows the wafer used by the sheet cutting device which concerns on 2nd Embodiment of this invention.
8 illustrates alignment marks formed on a wafer.
9 is a flowchart showing the operation of the sheet cutting device according to the second embodiment of the present invention.
The schematic diagram which shows the sheet cutting device which concerns on 3rd Embodiment of this invention.

The above and other objects, features and advantages of the present invention will be more fully understood from the following detailed description and the accompanying drawings, which are given by way of illustration only, and therefore should not be considered as limiting the invention.

The sheet cutting device, chip manufacturing device, sheet cutting method, chip manufacturing method, and sheet cutting program according to each embodiment of the present invention will be described. However, it should be noted that the present invention is not limited to the following embodiment. For clarity of explanation, the following description and drawings are appropriately simplified.

≪ First Embodiment >

In the chip manufacturing apparatus according to the first embodiment, although not shown, the sheet is attached to the front surface of the wafer to grind the back surface of the wafer, the sheet is peeled off, and the sheet is attached to the back surface of the wafer to dice the wafer. The wafer has a disk shape like a normal wafer, but the shape is not particularly limited.

In short, one main feature of the first embodiment is an apparatus for cutting a sheet (particularly a surface protective sheet) attached to a wafer in a chip manufacturing apparatus. Therefore, in the following description, the sheet cutting device is described in detail, and description of other components is omitted.

More specifically, as shown in FIG. 1, the sheet cutting device 1 includes a support 2, a laser beam output 3, and a controller 4.

The support 2 supports the wafer 6 with the front surface to which the sheet 5 is attached. The support part 2 which concerns on this embodiment supports the wafer 6 so that the front surface side of the wafer 6 may be upward. The sheet 5 may be a sheet generally used. Specifically, the sheet 5 is a sheet member made of, for example, a synthetic resin, and is thermally press-bonded to the surface of the wafer 6.

As shown in FIG. 2, the support part 2 is movable in an X-axis direction, a Y-axis direction, and a Z-axis direction, for example, and is a wafer as an axis line (rotation angle (theta)) in the plane containing an X-axis and a Y-axis. It is preferable to rotate about the center of (6).

The laser beam output part 3 is disposed above the support part 2. The laser beam output unit 3 includes a laser oscillator, a reflecting mirror, a condenser lens, and the like like a general laser beam output unit. The laser beam output unit 3 may have any structure. For example, as shown in FIG. 1, the laser beam output unit 3 may move the position where the laser beam L is irradiated according to the movement trajectory of the laser beam output unit 3, or as illustrated in FIG. 3. As shown, the laser beam output unit 3 can be fixed and the irradiation position of the laser beam L itself can be moved.

The laser beam output unit 3 emits a laser beam L to cut the sheet 5 attached to the surface of the wafer 6 along the outer circumference of the wafer 6. That is, the laser beam output part 3 irradiates the laser beam L to the outer periphery vicinity of the wafer 6. As shown in FIG. 3, when the sheet 5 is cut by the laser beam L, the sheet 5 is attached to the frame 7 so as to be kept taut. The wafer 6 is disposed in the hollow portion of the frame 7.

At this time, the position on the sheet 5 to which the laser beam L is irradiated fixes the position of the laser beam output part 3 on which the support part 2 is fixed and the laser beam L is emitted by the controller 4. By controlling, it can be controlled. Otherwise, the position on the sheet 5 to which the laser beam L is irradiated fixes the position of the laser beam output portion 3 from which the laser beam L is emitted and is controlled by the controller 4 by the controller 4. By controlling the position, it can be controlled.

The output of the laser beam L is controlled by the controller 4. The output of the laser beam L is appropriately set in consideration of the material, thickness, and the like of the sheet 5, for example. For example, when the output of the laser beam is large, the melting speed of the sheet 5 is high, and the cut portion is solidified again, making it difficult to cut the sheet 5. On the other hand, when the output of the laser beam is small, the melting speed of the sheet 5 is low and it is impossible to cut the sheet 5 quickly. Thus, the output of the laser beam is set to achieve a sufficient melt rate.

Even when the laser beam L is irradiated to the wafer 6 through the sheet 5, it is preferable that the laser beam L does not adversely affect the wafer 6. For example, since the wafer 6 is generally made of silicon, it is preferable to use a CO ₂ laser beam, a green laser beam, or the like as the laser beam L. FIG.

As described above, the controller 4 controls the support 2 and the laser beam output 3. The controller 4 can control the support 2 or the laser beam output unit 3 based on a program stored in the controller 4, or can perform control using hardware resources.

The sheet cutting device 1 described above operates as shown in FIG. First, the transfer mechanism (not shown) positions the wafer 6 having the front surface to which the sheet 5 is attached on the support 2 (S1).

Next, the controller 4 controls the laser beam output unit 3 so that the laser beam L emitted has a predetermined output (S2). At the same time, the position of the support part 2 or the laser beam output part 3 is controlled so that the laser beam L is irradiated to the outer periphery vicinity of the wafer 6 (S3). Therefore, the laser beam L emitted from the laser beam output part 3 is irradiated to the outer periphery vicinity of the wafer 6.

Subsequently, the controller 4 supports the support 2 or the laser beam output 3 so that the position where the laser beam L is irradiated moves along the outer circumference of the wafer 6, that is, in the circumferential direction of the wafer 6. ) Is controlled (S4). Therefore, the position of the sheet 5 to which the laser beam L is irradiated is melted, and the sheet 5 protruding outward from the outer portion of the sheet 5 to which the laser beam L is irradiated, that is, from the outer periphery of the wafer 6. ) Is cut from the portion located inward at the outer circumference of the wafer 6.

When the laser beam L is irradiated to the whole outer periphery vicinity of the wafer 6, the controller 4 stops the emission of the laser beam L by the laser beam output part 3, and the support part 2 or a laser The control of the beam output unit 3 is terminated (S5). Therefore, the part of the sheet | seat 5 which protruded outward from the outer periphery of the wafer 6 is removed.

As described above, the sheet 5 is cut by the laser beam L, so that the wafer 6 can be prevented from being damaged when the sheet 5 is cut.

As shown in FIG. 5, the side surface of the general wafer 6 has a curved surface, and stress concentration occurs in the vicinity of the attachment end of the sheet 5 and the wafer 6 during polishing of the wafer 6. In order to reduce the portion of the sheet 5 protruding from the attachment end with the wafer 6, it is preferable to cut the sheet 5 near the attachment end. For example, it is preferable that the sheet is cut in the curved region R of the wafer 6 when viewed in the vertical direction. In this case, unlike the general sheet cutting apparatus, there is no damage to the wafer 6 caused by the cutter blade, and the sheet 5 can be cut at a position very close to the contact end with the wafer 6 in a good state. Therefore, damage to the wafer 6 during grinding can be suppressed. Alternatively, the sheet 5 can be cut inside the attachment ends of the sheet 5 and the wafer 6.

≪ Second Embodiment >

The chip manufacturing apparatus according to the second embodiment has a structure substantially similar to the chip manufacturing apparatus according to the first embodiment. In the chip manufacturing apparatus according to the second embodiment, the sheet cutting device has a structure capable of cutting the sheet 5 with high accuracy. In the following description, redundant descriptions are omitted, and like reference numerals designate like elements.

As shown in FIG. 6, the sheet cutting device 10 according to the second embodiment includes an imaging section 11 in addition to the support section 2, the laser beam output section 3, and the controller 4.

As shown in FIG. 7, according to the second embodiment, one or a plurality of alignment marks 13 are formed on the surface of the wafer 12. The alignment mark 13 is formed to be imaged by the imaging section 11, and is formed in a cross shape in the example shown in FIG. However, it is not limited thereto.

It is preferable that the alignment mark 13 is formed in the chip part (for example, the chip part used for a test) which is not commercialized. Also, a mark for dicing can be used, for example, as the alignment mark 13.

Since the alignment mark 13 is imaged through the sheet 5, it is preferable to use a transparent or translucent sheet as the sheet 5.

The imaging part 11 is arrange | positioned above the support part 2. This imaging section 11 is arranged to capture at least one alignment mark 13 of the wafer 12. The image capturing unit 11 includes an image capturing device such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device image sensor (CCD), similar to a general image capturing device, and outputs the obtained image to the controller 4.

The controller 4 controls the position of the support 2 based on the input image. Specifically, the controller 4 specifies the position of the alignment mark 13 from the input image, and controls the position of the support 2 so that the alignment mark 13 is positioned at a predetermined position.

The sheet cutting device 10 operates as shown in FIG. Specifically, in the operation of the sheet cutting device 1 according to the first embodiment, the following step is performed between the S1 step and the S2 step.

First, S1 process is performed similarly to the sheet cutting device 1 which concerns on 1st Embodiment. Subsequently, the controller 4 controls the imaging unit 11 to cause the imaging unit 11 to image the alignment mark 13 of the wafer 6 through the sheet 5 (S11). The imaging unit 11 outputs the acquired image to the controller 4 (S12).

Next, the controller 4 performs a binarization process on the input image and extracts the feature points, for example, in order to obtain the positional information of the alignment mark 13 (S13).

Next, the controller 4 includes the normal position information of the alignment mark 13 in advance. The controller 4 compares the normal position information of the alignment mark 13 with the normal position information of the imaged alignment mark 13, and as shown in FIG. 2, the X-axis direction, the Y-axis direction, and The rotation angle θ is controlled so that the imaged alignment mark 13 is positioned at the normal position (S14).

The following process includes the process of S2-S5 similarly to the sheet cutting device 1 which concerns on 1st Embodiment. The process of imaging the alignment mark 13 and the process of cutting the sheet 5 to control the position of the support 2 can be performed at the same position. Otherwise, as shown in FIG. 6, after imaging the alignment mark 13 and controlling the position of the support 2, the support 2 is moved by a transfer mechanism (not shown) for cutting the sheet 5. You can move it.

In this way, the position of the sheet 5 to be cut is controlled based on the positional information of the alignment mark 13 formed on the wafer 6. Therefore, as shown in FIG. 5, the sheet | seat 5 can be cut | disconnected precisely by the laser beam L along the outer periphery vicinity of the attachment end of the wafer 6 and the sheet | seat 5. FIG.

≪ Third Embodiment >

The sheet cutting device 10 according to the second embodiment cuts the sheet 5 attached to the front surface of the wafer 6, but the sheet cutting device 20 according to the third embodiment is placed on the back surface of the wafer 6. The attached sheet 21 is cut off. In the following description, redundant description is omitted, and like reference numerals denote like elements.

As shown in FIG. 10, the sheet | seat cutting apparatus 20 which concerns on 3rd Embodiment is substantially the same as the sheet | seat cutting apparatus 10 which concerns on 2nd Embodiment, The support part 22, the laser beam output part 3, The controller 4 and the imaging unit 23 are included.

The support part 22 supports the wafer 6 so that the back surface side of the wafer 6 to which the sheet 21 is attached is arranged upward. At this time, the alignment mark formed on the front surface of the wafer 6 is disposed on the support 22 side. The support part 22 which concerns on 3rd Embodiment has a structure which can image an alignment mark through the support part 22 by the imaging part 23 arrange | positioned under the support part 22. FIG. For example, the support portion 22 is formed of a member such as glass through which light can pass. Alternatively, the support portion 22 may have a hollow portion capable of imaging the alignment mark.

Therefore, the sheet cutting device 20 according to the third embodiment can cut the sheet 21 attached to the back surface of the wafer 6 in the same process as the sheet cutting device 10 according to the second embodiment.

The sheet 21 attached to the rear surface of the wafer 6 is cut by the sheet cutting device 20 according to the third embodiment, while the sheet attached to the front surface of the wafer 6 is impermeable and the alignment mark is the wafer ( The same operation can be performed even when formed on the back side of 6).

≪ Fourth Embodiment &

In the second and third embodiments, the positions of the support parts 2 and 22 are controlled based on the positional information of the alignment marks, but the sheet 5 to which the laser beam L is irradiated by the laser beam output part 3 is provided. The position on 21 can be controlled.

In this case, the controller 4 includes the positional information of the laser beam output unit 3 previously associated with the alignment mark, and the laser so that the positional information of the laser beam output unit 3 matches the positional information of the alignment mark to be imaged. The position of the beam output unit 3 is controlled.

The present invention is not limited to the above-described embodiment, and may be appropriately changed without departing from the spirit of the present invention.

The sheet 5 described in the embodiment is a sheet made of synthetic resin, but is not particularly limited as long as it can be attached to the front or rear surface of the wafer 6. For example, the member in which the resin layer which forms the surface of the wafer 6 is integrally formed in the sheet | seat can also be cut | disconnected.

Although the CO ₂ laser beam or the green laser beam was used as the laser beam L according to the embodiment, other laser beams can also be used.

According to one embodiment of the present invention, the sheet attached to the wafer is cut, but the member to which the sheet is attached is not particularly limited.

Although this invention was shown and demonstrated especially with reference to embodiment, this invention is not restrict | limited to these embodiment. Those skilled in the art will appreciate that various changes in form and detail may occur therein without departing from the spirit and scope of the invention as defined by the claims.

Using any kind of non-transitory computer readable medium, the program may be stored and provided to a computer. Non-transitory computer readable media includes any type of tangible storage medium. Examples of non-transitory computer readable media include magnetic storage media (floppy disks, magnetic tapes, hard disk drives, etc.), optical magnetic storage media (eg, magnetic-optical disks), CD-ROM (compact disk read-only memories). ), CD-R (Compact Disc Recordable), CD-R / W (Rewritable Compact Disc), Semiconductor Memory ((Mask ROM, PROM (Programmable ROM), EPROM (Erasable PROM), Flash ROM, RAM (random access memory, etc.) A program may be provided to a computer using any kind of temporary computer readable medium Examples of temporary computer readable medium include electrical signals, optical signals, and electromagnetic waves. Transitory computer readable media can provide a program to a computer via a wired communication line (eg, wire and optical fiber) or a wireless communication line.

1: sheet cutting device
2, 22: support
3: laser beam output unit
4: controller
5, 21: Sheet
6, 12: wafer
11: imaging unit
13: alignment mark
L: laser beam
R: curved area

Claims (11)

A sheet cutting device for cutting a sheet attached to the adherend along the outer periphery of the adherend by a laser beam. The method of claim 1,
And a sheet cutting device for cutting the sheet in the vicinity of an edge of an attachment portion between the sheet and the adhesion member. The method of claim 1,
And the adherend member is a semiconductor wafer, and the sheet is cut by a laser beam that does not thermally affect the semiconductor wafer. The method of claim 1,
Laser beam output means,
Support means for supporting the adherend,
Imaging means for imaging the adherend, and
Control means for controlling the position of one of said laser beam output means and said support means,
An alignment mark is formed on the adherend, and the control means controls one of the laser beam output means and the support means based on the positional information of the alignment mark picked up by the imaging means. The chip manufacturing apparatus containing the sheet cutting apparatus of Claim 1. And a sheet attached to the adherent member along the outer periphery of the adherend with a laser beam. The method according to claim 6,
And cutting the sheet in the vicinity of the edge of the attachment portion between the sheet and the adherent member. The method according to claim 6,
And the adherend member is a semiconductor wafer, and the sheet is cut by a laser beam that does not thermally affect the semiconductor wafer. The method according to claim 6,
Acquiring position information of an alignment mark formed on the adherent member, and
Controlling one of laser beam output means and support means for supporting the adherend, based on the obtained positional information of the alignment mark. The chip manufacturing method containing the sheet cutting method of Claim 6. A process of acquiring position information of the alignment mark formed on the adherend member,
A process for controlling one of laser beam output means and support means for supporting the adherend, based on the obtained positional information of the alignment mark, and
A sheet cutting program for causing a computer to execute a process of cutting a sheet attached to the adherent member along the outer periphery of the adherend by a laser beam emitted from the laser beam output means.

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