TW201351067A - Exposure apparatus, exposure method - Google Patents

Exposure apparatus, exposure method Download PDF

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TW201351067A
TW201351067A TW102120332A TW102120332A TW201351067A TW 201351067 A TW201351067 A TW 201351067A TW 102120332 A TW102120332 A TW 102120332A TW 102120332 A TW102120332 A TW 102120332A TW 201351067 A TW201351067 A TW 201351067A
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exposure
substrate
holding portion
substrate holding
unit
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TW102120332A
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TWI603158B (en
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Ken Miyake
Toshihiro Takagi
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Sanei Giken Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/265Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Abstract

PROBLEM TO BE SOLVED: To increase the productivity of exposure technology. SOLUTION: An exposure apparatus includes (1) a first moving part equipped with a first substrate-holding part for holding the substrate, and the first substrate holding part is moved between the first standby position and the first exposure position, when at the first exposure position the substrate is so disposed that its exposure surface is faced toward the first direction; (2) a second moving part equipped with a second substrate holding part for holding substrate, and the second substrate holding part is moved between the second standby position and the second exposure position, and when at the second exposure position, the exposure surface of the substrate held by the second substrate holding part faces toward the first direction, and the substrate held by the second substrate holding part is arranged in the second direction orthogonal to the exposure surface of the first exposure position and the first direction; and (3) an exposure part, which is equipped with a exposure head capable of moving between the first exposure position and the second exposure position along the guidance member disposed along the second direction for selectively exposing the substrate disposed at the first exposure position and the substrate disposed at the second exposure position.

Description

曝光裝置、曝光方法 Exposure device, exposure method

本發明是有關使用曝光裝置之基板的曝光技術。 The present invention relates to an exposure technique for a substrate using an exposure apparatus.

對於在表面具有感光層的基板的曝光面,根據表示電路等的2次元圖案的曝光資料來進行曝光,藉此將該2次元圖案形成於基板上的曝光裝置為人所知。就如此的曝光裝置而言,是藉由在預定的曝光位置配置1個的基板,曝光後,使被曝光的基板從曝光位置移動的同時,將其他的基板配置於曝光位置,進行曝光等的重複製程來進行複數的基板的曝光處理。 An exposure apparatus in which an exposure surface of a substrate having a photosensitive layer on its surface is exposed by exposure data indicating a binary pattern of a circuit or the like, thereby forming the binary pattern on a substrate is known. In such an exposure apparatus, one substrate is placed at a predetermined exposure position, and after exposure, the exposed substrate is moved from the exposure position, and the other substrate is placed at the exposure position to perform exposure or the like. The repetitive process is performed to perform exposure processing of a plurality of substrates.

在如此的製程中,被曝光的基板之自曝光位置的移動、及其他的基板之往曝光位置的配置所要的時間的期間是無法進行曝光,因此生產性低。為此,用以提升生產性的技術被提案。例如,下述專利文獻1是揭示一種曝光裝置,其係具備:裝載基板而可在相同的一次元軌道上往復移動的2個移動平台、及被固定地設置在該軌道上的中央的曝光部。如此的曝光裝置是使一方的移動平台與 曝光部相對移動,在對1個基板進行曝光處理的期間,可在另一方的移動平台進行曝光完成的基板與新的基板的換載。藉此,進行曝光處理的以外的時間會被縮短,生產性會提升。 In such a process, the period of time required for the movement of the exposed substrate from the exposure position and the arrangement of the other substrate to the exposure position is not possible, and thus the productivity is low. To this end, technology to improve productivity has been proposed. For example, Patent Document 1 listed below discloses an exposure apparatus including two moving stages that can reciprocate on the same primary track by loading a substrate, and an exposure part that is fixedly disposed on the track. . Such an exposure device is to make one mobile platform The exposure unit is relatively moved, and during the exposure processing of one substrate, the substrate on which the exposure is completed and the new substrate can be loaded on the other moving platform. Thereby, the time other than the exposure processing is shortened, and the productivity is improved.

[先行技術文獻] [Advanced technical literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開2008-191302號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-191302

然而,就專利文獻1的技術而言,依然除了曝光處理用的時間以外,在移動平台的移動等需要多的時間。並且,無法以一連串的流程來將基板的兩面曝光。為此,被要求可更提升生產性的曝光技術。並且,曝光裝置的一般性的課題,被要求裝置的低成本化或小型化。 However, in the technique of Patent Document 1, in addition to the time for exposure processing, it takes much time to move the mobile platform or the like. Moreover, it is not possible to expose both sides of the substrate in a series of processes. For this reason, it is required to further improve the productivity of the exposure technology. Further, the general problem of the exposure apparatus is required to reduce the cost or size of the apparatus.

本發明是為了解決上述課題的至少一部分而研發者,例如可作為以下的形態實現。 The present invention has been developed in order to solve at least a part of the above problems, and can be realized, for example, as follows.

本發明的第1形態是在於提供一種將基板曝光的曝光裝置。此曝光裝置具備第1移動部,該第1移動部具備保持基板的第1基板保持部。此第1移動部是使第1基板保持部移動於第1待機位置與第1曝光位置之間, 該第1曝光位置是在第1基板保持部所保持的基板的曝光面朝第1方向的狀態下配置基板。並且,曝光裝置具備第2移動部,該第2移動部具備保持基板的第2基板保持部。此第2移動部是使第2基板保持部移動於第2待機位置與第2曝光位置之間,該第2待機位置是與第1待機位置不同,該第2曝光位置是在被第2基板保持部所保持的基板的曝光面朝第1方向的狀態,且在第1曝光位置所配置的基板的曝光面與和第1方向正交的第2方向排列的狀態下配置被第2基板保持部所保持的基板。而且,曝光裝置具備曝光部,該曝光部具備可沿著導件來移動於第1曝光位置與第2曝光位置之間的曝光頭,該導件係沿著第2方向而配置。此曝光部是藉由曝光頭之沿著第2方向的移動來選擇性地將被配置於第1曝光位置的基板及被配置於第2曝光位置的基板予以曝光。 A first aspect of the present invention provides an exposure apparatus for exposing a substrate. This exposure apparatus includes a first moving unit that includes a first substrate holding portion that holds a substrate. The first moving unit moves the first substrate holding unit between the first standby position and the first exposure position. In the first exposure position, the substrate is placed in a state in which the exposure surface of the substrate held by the first substrate holding portion faces the first direction. Further, the exposure device includes a second moving portion that includes a second substrate holding portion that holds the substrate. The second moving unit moves the second substrate holding portion between the second standby position and the second exposure position, and the second standby position is different from the first standby position, and the second exposure position is on the second substrate. The exposure surface of the substrate held by the holding portion is in the first direction, and the second substrate is placed in a state in which the exposure surface of the substrate disposed at the first exposure position is aligned with the second direction orthogonal to the first direction. The substrate held by the part. Further, the exposure apparatus includes an exposure unit including an exposure head that is movable between the first exposure position and the second exposure position along the guide, and the guide is disposed along the second direction. The exposure unit selectively exposes the substrate disposed at the first exposure position and the substrate disposed at the second exposure position by movement of the exposure head in the second direction.

若根據如此的形態的曝光裝置,則可在2個曝光位置交替進行曝光。因此,可將在一方的曝光位置進行曝光的時間分配成:用以將在另一方的曝光位置已被曝光的基板排出,且將新的基板配置於另一方的曝光位置的時間。因此,可提升基板的生產性。並且,藉由將在一方的曝光位置被曝光的基板配置於另一方的曝光位置,可只使用1個曝光部來將基板的兩面曝光。因此,與使用2個曝光裝置來將基板的兩面曝光的情況,有助於裝置的低成本化及小型化。 According to the exposure apparatus of such a form, exposure can be alternately performed at two exposure positions. Therefore, the time at which exposure is performed at one exposure position can be assigned to a time for discharging the substrate that has been exposed at the other exposure position and arranging the new substrate at the other exposure position. Therefore, the productivity of the substrate can be improved. Further, by arranging the substrate exposed at one exposure position to the other exposure position, it is possible to expose both surfaces of the substrate using only one exposure portion. Therefore, the case where both surfaces of the substrate are exposed by using two exposure apparatuses contributes to cost reduction and downsizing of the apparatus.

本發明的第2形態是第1移動部具備被雙重 化的2個基板保持部,其係可移動於沿著第1方向的方向及與第1方向交叉的方向,作為第1基板保持部。同樣,第2移動部具備被雙重化的2個基板保持部,其係可移動於沿著第1方向的方向及與第1方向交叉的方向,作為第2基板保持部。 According to a second aspect of the present invention, the first moving unit is provided with a double The two substrate holding portions are movable in a direction along the first direction and a direction intersecting the first direction as a first substrate holding portion. Similarly, the second moving portion includes two substrate holding portions that are doubled, and are movable in a direction along the first direction and a direction intersecting the first direction as a second substrate holding portion.

藉由如此的形態的曝光裝置,可針對1個的曝光位置同時進行曝光完成的基板之自曝光位置的排出、及新的基板之往曝光位置的配置。因此,可極為縮短曝光以外的動作所要的時間。如此的形態亦可作為例如將2個基板保持部的一方從第1曝光位置或第2曝光位置移動至第1待機位置或第2待機位置時,使另一方從第1待機位置或第2待機位置移動至第1曝光位置或第2曝光位置的構成來實現。或者,亦可另一方是利用其他的曝光位置的曝光時間,預先從第1待機位置或第2待機位置移動至預定的位置。 According to such an exposure apparatus, it is possible to simultaneously discharge the exposure from the exposure position of the substrate and the arrangement of the new substrate to the exposure position for one exposure position. Therefore, the time required for the operation other than the exposure can be extremely shortened. In such a configuration, for example, when one of the two substrate holding units is moved from the first exposure position or the second exposure position to the first standby position or the second standby position, the other may be placed from the first standby position or the second standby position. The configuration is realized by moving the position to the first exposure position or the second exposure position. Alternatively, the other may be moved from the first standby position or the second standby position to a predetermined position in advance by using the exposure time of another exposure position.

本發明的第3形態是第2形態的曝光裝置亦可具備設有導件的基底構件。並且,該曝光裝置是亦可具備基準板,為安裝於基底構件的基準板,具有可將基板插入至作為第1曝光位置及第2曝光位置之基準板的內部的位置之框架形狀。在如此的曝光裝置中,第1基板保持部及第2基板保持部是亦可在基板可變位的狀態下保持基板。亦可在基準板的預定部位、第1基板保持部及第2基板保持部的預定部位接觸於被第1基板保持部及第2基板保持部所保持的各個基板的外周之狀態下,基板被配置於 第1曝光位置及第2曝光位置。 According to a third aspect of the present invention, the exposure apparatus of the second aspect may include a base member provided with a guide. Further, the exposure apparatus may include a reference plate and a reference plate attached to the base member, and has a frame shape in which the substrate can be inserted into a position inside the reference plate as the first exposure position and the second exposure position. In such an exposure apparatus, the first substrate holding portion and the second substrate holding portion can hold the substrate while the substrate is in a variable position. In a state where the predetermined portion of the reference plate, the predetermined portion of the first substrate holding portion, and the second substrate holding portion are in contact with the outer periphery of each of the substrates held by the first substrate holding portion and the second substrate holding portion, the substrate is Configured on The first exposure position and the second exposure position.

若根據如此的形態的曝光裝置,則即使第1移動部及第2移動部分別不是精度佳地使第1基板保持部及第2基板保持部移動的機構,還是可在第1曝光位置及第2曝光位置,對於曝光頭,將保持基板的第1基板保持部及第2基板保持部精度佳配置於預定的位置。其結果,可降低成本。又,由於可使構成可移動的第1基板保持部及第2基板保持部輕量化,因此可使基板的搬送速度增大,生產性會提升。而且,不需要用以確保第1移動部及第2移動部的高度的移動精度之堅固的基礎構造,可使曝光裝置小型化,且可降低成本。 According to the exposure apparatus of the above-described aspect, the first moving unit and the second moving unit can move the first substrate holding unit and the second substrate holding unit without precision, and can be in the first exposure position and the first exposure position. In the exposure position, the first substrate holding portion and the second substrate holding portion of the holding substrate are preferably placed at predetermined positions with respect to the exposure head. As a result, the cost can be reduced. Moreover, since the first substrate holding portion and the second substrate holding portion that are movable can be made lighter, the conveyance speed of the substrate can be increased, and the productivity can be improved. Further, a strong basic structure for ensuring the movement accuracy of the height of the first moving portion and the second moving portion is not required, and the exposure apparatus can be downsized and the cost can be reduced.

本發明的第4形態是第1形態的曝光裝置所具備之第1移動部及第2移動部分別構成第1基板保持部及第2基板保持部可沿著第1方向移動。 According to a fourth aspect of the present invention, the first moving unit and the second moving unit included in the exposure apparatus of the first aspect are configured to be movable in the first direction, respectively, in the first substrate holding unit and the second substrate holding unit.

此情況,作為第4形態的曝光裝置是亦可具備上述的第3形態。如此的曝光裝置是取得與第3形態同樣的效果。 In this case, the exposure apparatus of the fourth aspect may be provided with the third aspect described above. Such an exposure apparatus achieves the same effects as those of the third aspect.

本發明的第5形態是在第3或第4形態的曝光裝置所具備的基準板中亦可形成有互相嵌合的一對的定位構成的一方。亦可在第1基板保持部及第2基板保持部的其中之比分別被第1基板保持部及第2基板保持部所保持的基板更外側的位置形成有定位構成的另一方。被第1基板保持部及第2基板保持部所保持的基板亦可在一對的定位構成嵌合的狀態下,被配置於第1曝光位置及第2曝 光位置。 According to a fifth aspect of the present invention, in the reference plate provided in the exposure apparatus according to the third or fourth aspect, one of the pair of positioning members that are fitted to each other may be formed. The other of the first substrate holding portion and the second substrate holding portion may be formed on the outer side of the substrate held by the first substrate holding portion and the second substrate holding portion. The substrate held by the first substrate holding portion and the second substrate holding portion may be disposed in the first exposure position and the second exposure in a state in which the pair of positioning members are fitted together. Light position.

若根據如此的形態的曝光裝置,則即使第1移動部及第2移動部分別不是精度佳地使第1基板保持部及第2基板保持部移動的機構,與第1方向正交的面的基板的位置還是會被正確地定位。因此,可取得與第3形態及第4形態同樣的效果。 According to the exposure apparatus of the above-described aspect, the first moving unit and the second moving unit do not move the first substrate holding unit and the second substrate holding unit with high precision, and the surface orthogonal to the first direction The position of the substrate will still be correctly positioned. Therefore, the same effects as those of the third embodiment and the fourth embodiment can be obtained.

本發明的第6形態是第1~第5的任一形態的曝光裝置亦可具備檢測部,其係構成可沿著第2方向移動,檢測出被配置於第1曝光位置及第2曝光位置的基板的位置及形狀的至少一方。並且,曝光部亦可根據按照檢測部的檢測結果所被補正的曝光資料來進行曝光。 According to a sixth aspect of the invention, the exposure apparatus according to any one of the first to fifth aspects of the invention may further include a detection unit configured to be movable in the second direction and configured to be disposed at the first exposure position and the second exposure position At least one of the position and shape of the substrate. Further, the exposure unit may perform exposure based on the exposure data corrected in accordance with the detection result of the detection unit.

若根據如此的形態的曝光裝置,則可讀取賦予基板的對位標記,以該資訊為基礎,正確地認識基板的位置或形狀,根據按照基板的位置或形狀而被補正的曝光資料來進行適當的曝光。只要設為在被配置於第1曝光位置及第2曝光位置的一方的基板的曝光中,對於另一方的基板,檢測出其位置或形狀的形態,便不會有生產性降低的情形。 According to the exposure apparatus of such a form, the alignment mark applied to the substrate can be read, and based on the information, the position or shape of the substrate can be accurately recognized, and the exposure data corrected according to the position or shape of the substrate can be used. Proper exposure. When the substrate is placed in the exposure of one of the first exposure position and the second exposure position, the position of the other substrate is detected, and the productivity is not lowered.

本發明的第7形態是第6形態的曝光裝置所具備的導件亦可作為曝光頭之沿著第2方向的移動及檢測部之沿著第2方向的移動雙方兼用的導件而設。 According to a seventh aspect of the present invention, the guide provided in the exposure apparatus of the sixth aspect may be provided as a guide for both the movement of the exposure head in the second direction and the movement of the detection unit along the second direction.

若根據如此的形態的曝光裝置,則可使曝光裝置小型化。 According to the exposure apparatus of such a form, the exposure apparatus can be miniaturized.

本發明的第8形態是第1~第7的任一形態的 曝光裝置亦可具備:第1搬送部,其係搬送基板;第2搬送部,其係於第1搬送部與第1待機位置之間搬送基板;第3搬送部,其係於第1搬送部與第2待機位置之間搬送基板。 According to an eighth aspect of the present invention, in any one of the first to seventh aspects The exposure apparatus may include a first transport unit that transports the substrate, a second transport unit that transports the substrate between the first transport unit and the first standby position, and a third transport unit that is coupled to the first transport unit. The substrate is transferred between the second standby position and the second standby position.

若根據如此的形態的曝光裝置,則可以一連串的流程來有效率地連續處理基板,生產性會提升。 According to the exposure apparatus of such a form, the substrate can be efficiently processed continuously in a series of processes, and the productivity is improved.

本發明的第9形態是第1~第8的任一形態的曝光裝置亦可具備測定部,其係測定曝光頭與被配置於第1曝光位置及第2曝光位置的基板的曝光面的距離。並且,此曝光裝置亦可具備第3移動部,其係使曝光頭沿著第1方向移動。第3移動部亦可按照測定部的測定結果來調節曝光頭與曝光面的距離。 According to a ninth aspect of the present invention, in the exposure apparatus of any one of the first to eighth aspects, the measuring unit may include a measuring unit that measures a distance between the exposure head and an exposure surface of the substrate disposed at the first exposure position and the second exposure position. . Further, the exposure apparatus may further include a third moving unit that moves the exposure head in the first direction. The third moving unit can also adjust the distance between the exposure head and the exposure surface in accordance with the measurement result of the measuring unit.

若根據如此的形態的曝光裝置,則即使對於不是平滑的基板的曝光面,也可經常安定地連結焦點。 According to the exposure apparatus of such a form, the focus can be stably connected even to the exposure surface of the substrate which is not smooth.

本發明的第10形態是第1~第9的任一形態的曝光裝置所具備的曝光頭亦可具有複數的曝光單元。 According to a tenth aspect of the invention, the exposure head provided in the exposure apparatus according to any one of the first to ninth aspects may have a plurality of exposure units.

若根據如此的形態的曝光裝置,則藉由分成複數的曝光單元,各曝光單元的掃描寬度會變小。亦即,可縮小使用於曝光單元的透鏡的直徑,因此可低成本化。 According to the exposure apparatus of such a form, the scanning width of each exposure unit becomes small by dividing into a plurality of exposure units. That is, the diameter of the lens used in the exposure unit can be reduced, so that the cost can be reduced.

本發明的第11形態是提供一種藉由曝光裝置來將基板曝光的曝光方法。如此的曝光方法是具備準備曝光裝置的第1工程。在被準備的曝光裝置是設定有第1曝 光位置及第2曝光位置,該第1曝光位置是在基板的曝光面朝第1方向的狀態下配置基板,該第2曝光位置是在基板的曝光面朝第1方向的狀態,且於第1曝光位置所配置的基板的曝光面與和第1方向正交的第2方向排列的狀態下配置基板。並且,該曝光裝置是具備可沿著第2方向來移動於第1曝光位置與第2曝光位置之間的曝光頭,藉由曝光頭之沿著第2方向的移動來選擇性地將被配置於第1曝光位置的基板及被配置於第2曝光位置的基板予以曝光。 An eleventh aspect of the present invention provides an exposure method for exposing a substrate by an exposure device. Such an exposure method is the first project to prepare an exposure apparatus. The exposed exposure device is set to have the first exposure a light position and a second exposure position in which the substrate is placed in a state in which the exposure surface of the substrate faces the first direction, and the second exposure position is in a state in which the exposure surface of the substrate faces the first direction, and The substrate is placed in a state in which the exposure surface of the substrate disposed at the exposure position and the second direction orthogonal to the first direction are arranged. Further, the exposure apparatus includes an exposure head that is movable between the first exposure position and the second exposure position along the second direction, and is selectively disposed by the movement of the exposure head in the second direction. The substrate at the first exposure position and the substrate disposed at the second exposure position are exposed.

並且,曝光方法是具備:第2工程,其係至對被配置於第1曝光位置的第1基板的曝光處理終了為止,將與第1基板不同的第2基板配置於第2曝光位置;及第3工程,其係至對被配置於第2曝光位置的第2基板的曝光處理終了為止,將與第2基板不同的第3基板配置於第1曝光位置。 Further, the exposure method includes a second process of disposing the second substrate different from the first substrate at the second exposure position until the exposure processing of the first substrate disposed at the first exposure position is completed; In the third process, the third substrate different from the second substrate is placed at the first exposure position until the exposure processing of the second substrate disposed at the second exposure position is completed.

若根據如此的曝光方法,則取得與第1形態的曝光裝置同樣的效果。 According to such an exposure method, the same effect as the exposure apparatus of the first aspect is obtained.

在如此的第11形態中,在第1工程所準備的曝光裝置亦可更具備檢測部,其係檢測出被配置於第1曝光位置及第2曝光位置的基板的位置及形狀的至少一方。並且,曝光裝置亦可根據按照檢測部的檢測結果所被補正的曝光資料來進行曝光。此情況,在第2工程中,亦可至對被配置於第1曝光位置的第1基板的曝光處理終了為 止,將第2基板配置於第2曝光位置,且對被配置於第2曝光位置的第2基板進行檢測部的檢測。而且,不僅該第2基板的檢測,亦可進行至根據該檢測結果之曝光資料的補正。同樣,在第3工程中,亦可至對被配置於第2曝光位置的第2基板的曝光處理終了為止,將第3基板配置於第1曝光位置,且對被配置於第1曝光位置的第3基板進行檢測部的檢測。而且,不僅該第3基板的檢測,亦可進行至根據該檢測結果之曝光資料的補正。 In the eleventh aspect, the exposure apparatus prepared in the first aspect of the invention may further include a detecting unit that detects at least one of a position and a shape of the substrate disposed at the first exposure position and the second exposure position. Further, the exposure device may perform exposure based on the exposure data corrected in accordance with the detection result of the detecting unit. In this case, in the second project, the exposure processing to the first substrate placed at the first exposure position may be ended. Then, the second substrate is placed at the second exposure position, and the detection portion is detected on the second substrate disposed at the second exposure position. Further, not only the detection of the second substrate but also the correction of the exposure data based on the detection result can be performed. Similarly, in the third process, the third substrate may be placed at the first exposure position and the first exposure position may be placed until the exposure processing of the second substrate disposed at the second exposure position is completed. The third substrate is detected by the detecting unit. Further, not only the detection of the third substrate but also the correction of the exposure data based on the detection result can be performed.

上述的形態只不過是一例,上述種種形態的各要素是在可解決本案所記載的課題的至少一部分的範圍或取得本案所記載的效果的至少一部分的範圍中,可適當組合或省略。例如,本發明是亦可作為以下所示的第12~第14形態來提供。第2~第10的任一形態亦可適用在第12~第14形態。 The above-described configuration is merely an example, and each of the above-described various aspects may be appropriately combined or omitted in a range in which at least a part of the problems described in the present invention can be solved or at least a part of the effects described in the present invention can be obtained. For example, the present invention can also be provided as the twelfth to fourteenth aspects shown below. Any of the second to tenth aspects can also be applied to the twelfth to fourteenth aspects.

本發明的第12形態是在於提供曝光裝置。此曝光裝置是具備:第1移動部,其係具備保持基板的第1基板保持部,使第1基板保持部移動於待機位置與曝光位置之間,該曝光位置是在基板的曝光面朝第1方向的狀態下配置基板;第2移動部,其係具備保持基板的第2基板保持部,使第2基板保持部移動於待機位置與曝光位置之間;及曝光部,其係具備曝光頭,一邊使曝光頭沿著與第1方向正交的第2方向移動,一邊將被配置於曝光位置的基板的曝光面曝光。 A twelfth aspect of the present invention provides an exposure apparatus. The exposure apparatus includes a first moving unit that includes a first substrate holding portion that holds the substrate, and moves the first substrate holding portion between the standby position and the exposure position, and the exposure position is on the exposure surface of the substrate. The second substrate is provided with a second substrate holding portion that holds the substrate, and the second substrate holding portion is moved between the standby position and the exposure position; and the exposure portion includes an exposure head. The exposure surface of the substrate placed at the exposure position is exposed while moving the exposure head in the second direction orthogonal to the first direction.

若根據如此的形態的曝光裝置,則可同時進行曝光完成的基板之自曝光位置的排出、及新的基板之往曝光位置的配置。因此,可縮短曝光以外的動作所要的時間,生產性會提升。 According to the exposure apparatus of such a form, the discharge of the substrate from the exposure by the exposure and the arrangement of the new substrate to the exposure position can be simultaneously performed. Therefore, the time required for the operation other than the exposure can be shortened, and the productivity is improved.

本發明的第13形態是在於提供一種曝光裝置。 A thirteenth aspect of the present invention provides an exposure apparatus.

此曝光裝置是具備:移動部,其係具備保持基板的基板保持部,使基板保持部移動至被基板保持部所保持的基板的曝光面朝第1方向的狀態下基板被配置於曝光位置為止;曝光部,其係具備曝光頭,一邊使曝光頭移動於與第1方向正交的第2方向,一邊將被配置於曝光位置的基板的曝光面曝光;基底構件,其係為了使曝光頭沿著第2方向移動,而設有沿著第2方向配置的導件;及基準板,其係被安裝於基底構件的基準板,具有可將基板插入至作為曝光位置之基準板的內部的位置之框架形狀。 In the exposure apparatus, the substrate holding unit is provided with a substrate holding unit that moves the substrate holding unit until the exposure surface of the substrate held by the substrate holding unit faces the first direction, and the substrate is placed at the exposure position. An exposure unit having an exposure head that exposes an exposure surface of a substrate disposed at an exposure position while moving the exposure head in a second direction orthogonal to the first direction; and a base member for exposing the exposure head Moving along the second direction, and providing a guide disposed along the second direction; and a reference plate attached to the reference plate of the base member, having a substrate insertable into the interior of the reference plate as the exposure position The frame shape of the position.

在如此的曝光裝置中,移動部是被構成基板保持部可沿著第1方向移動。基板保持部是在基板可變位的狀態下保持基板。在基準板的預定部位及基板保持部的預定部位接觸於被基板保持部所保持的基板的外周之狀態下,基板被配置於曝光位置。 In such an exposure apparatus, the moving portion is configured to be movable in the first direction by the constituent substrate holding portion. The substrate holding portion holds the substrate in a state where the substrate is variable. The substrate is placed at the exposure position in a state where the predetermined portion of the reference plate and the predetermined portion of the substrate holding portion are in contact with the outer periphery of the substrate held by the substrate holding portion.

若根據如此的形態的曝光裝置,則即使移動 部不是精度佳地使基板保持部移動的機構,還是可在曝光位置,對於曝光頭,將保持基板的基板保持部精度佳配置於預定的位置。其結果,可降低成本。又,由於可使構成可移動的基板保持部輕量化,因此可使基板的搬送速度增大,生產性會提升。而且,不需要用以確保移動部的高度的移動精度之堅固的基礎構造,可使曝光裝置小型化,且可降低成本。 According to the exposure apparatus of such a form, even if moving The portion is not a mechanism for moving the substrate holding portion with high precision, or the substrate holding portion for holding the substrate can be accurately placed at a predetermined position in the exposure position at the exposure position. As a result, the cost can be reduced. Moreover, since the substrate holding portion that can be moved can be made lighter, the conveyance speed of the substrate can be increased, and the productivity can be improved. Moreover, a strong basic structure for ensuring the movement accuracy of the height of the moving portion is not required, and the exposure apparatus can be downsized and the cost can be reduced.

本發明的第14形態是在於提供一種曝光裝置。 A fourteenth aspect of the present invention provides an exposure apparatus.

此曝光裝置是具備:移動部,其係具備保持基板的基板保持部,使基板保持部移動至被基板保持部所保持的基板的曝光面朝第1方向的狀態下基板被配置於曝光位置為止;曝光部,其係具備曝光頭,一邊使曝光頭移動於與第1方向正交的第2方向,一邊將被配置於曝光位置的基板的曝光面曝光;基底構件,其係為了使曝光頭沿著第2方向移動,而設有沿著第2方向配置的導件;及基準板,其係被安裝於基底構件的基準板,具有可將基板插入至作為曝光位置之基準板的內部的位置之框架形狀。 In the exposure apparatus, the substrate holding unit is provided with a substrate holding unit that moves the substrate holding unit until the exposure surface of the substrate held by the substrate holding unit faces the first direction, and the substrate is placed at the exposure position. An exposure unit having an exposure head that exposes an exposure surface of a substrate disposed at an exposure position while moving the exposure head in a second direction orthogonal to the first direction; and a base member for exposing the exposure head Moving along the second direction, and providing a guide disposed along the second direction; and a reference plate attached to the reference plate of the base member, having a substrate insertable into the interior of the reference plate as the exposure position The frame shape of the position.

在如此的曝光裝置中,移動部是被構成基板保持部可沿著第1方向移動。基板保持部是在基板可變位的狀態下保持基板。在基準板中形成有互相嵌合的一對的定位構成 的一方。在基板保持部的其中之比被基板保持部所保持的基板更外側的位置形成有定位構成的另一方。在基準板及基板保持部所形成的一對的定位構成嵌合的狀態下,基板被配置於曝光位置。 In such an exposure apparatus, the moving portion is configured to be movable in the first direction by the constituent substrate holding portion. The substrate holding portion holds the substrate in a state where the substrate is variable. Forming a pair of mutually fitting ones in the reference plate One side. The other of the positioning portions of the substrate holding portion is formed at a position outside the substrate held by the substrate holding portion. The substrate is placed at the exposure position in a state in which the positioning of the pair of the reference plates and the substrate holding portion is formed.

若根據如此的形態的曝光裝置,則即使移動部不是精度佳地使基板保持部移動的機構,與第1方向正交的面的基板的位置還是會被正確地定位。因此,可取得與第13形態同樣的效果。 According to the exposure apparatus of the above aspect, even if the moving portion does not move the substrate holding portion with high precision, the position of the substrate on the surface orthogonal to the first direction is accurately positioned. Therefore, the same effect as the thirteenth aspect can be obtained.

20,220‧‧‧曝光裝置 20,220‧‧‧Exposure device

30‧‧‧第1搬送部 30‧‧‧1st transport department

31~34‧‧‧移動平台 31~34‧‧‧Mobile platform

35‧‧‧反轉裝置 35‧‧‧Reversal device

36‧‧‧導軌 36‧‧‧rails

40a‧‧‧第2搬送部 40a‧‧‧The second transport department

40b‧‧‧第3搬送部 40b‧‧‧3rd Transport Department

41a,41b‧‧‧吸附機構 41a, 41b‧‧‧ adsorption mechanism

42a,42b‧‧‧導軌 42a, 42b‧‧‧ rails

50a,250a‧‧‧第1移動部 50a, 250a‧‧‧1st moving department

50b,250b‧‧‧第2移動部 50b, 250b‧‧‧2nd Moving Department

60a,260a‧‧‧第1移動部第1系列 60a, 260a‧‧‧1st Mobile Division 1st Series

60b,260b‧‧‧第2移動部第1系列 60b, 260b‧‧‧2nd Mobile Division 1st Series

70a,270a‧‧‧第1移動部第2系列 70a, 270a‧‧‧1st Mobile Division 2nd Series

70b,270b‧‧‧第2移動部第2系列 70b, 270b‧‧‧2nd Mobile Division 2nd Series

61a,71a,71b,261a,261b,271a,271b‧‧‧基底構件 61a, 71a, 71b, 261a, 261b, 271a, 271b‧‧‧ base member

62a,72a,72b,262a,262b,272a,272b‧‧‧保持構件 62a, 72a, 72b, 262a, 262b, 272a, 272b‧‧‧ holding components

63a,73a,73b,263a,263b,273a,273b‧‧‧凹部 63a, 73a, 73b, 263a, 263b, 273a, 273b‧‧‧ recess

64a,74a,264a,264b,274a,274b‧‧‧支撐構件 64a, 74a, 264a, 264b, 274a, 274b‧‧‧ support members

65a,75a,265a,265b,275a,275b‧‧‧彈簧 65a, 75a, 265a, 265b, 275a, 275b‧ ‧ spring

66a,76a,266a,266b,276a,276b‧‧‧前後移動機構 66a, 76a, 266a, 266b, 276a, 276b‧‧‧ moving mechanism

67a,77a,267a,267b,277a,277b‧‧‧左右移動機構 67a, 77a, 267a, 267b, 277a, 277b‧‧‧ moving mechanism

68a,78a,78b,268a,278a‧‧‧第1基板保持部 68a, 78a, 78b, 268a, 278a‧‧‧1st substrate holder

268b,278b‧‧‧第2基板保持部 268b, 278b‧‧‧2nd substrate holder

80,280‧‧‧基底構件 80,280‧‧‧base member

81‧‧‧基部 81‧‧‧ base

82‧‧‧引導部 82‧‧‧Guidance

83‧‧‧壁部 83‧‧‧ wall

90a,90b,290a,290b‧‧‧基準板 90a, 90b, 290a, 290b‧‧‧ reference board

91a,91b‧‧‧貫通孔 91a, 91b‧‧‧through holes

92a,92b‧‧‧汽缸 92a, 92b‧‧ ‧ cylinder

93a‧‧‧定位銷 93a‧‧ Locating pin

100a,100b,300a,300b‧‧‧檢測部 100a, 100b, 300a, 300b‧‧‧Detection Department

101a‧‧‧攝影機 101a‧‧‧ camera

102a‧‧‧支撐構件 102a‧‧‧Support members

103a‧‧‧壁部 103a‧‧‧ wall

104a‧‧‧移動體 104a‧‧‧Mobile

110,310‧‧‧曝光部 110,310‧‧‧Exposure Department

111‧‧‧曝光頭 111‧‧‧Exposure head

112‧‧‧支撐部 112‧‧‧Support

113‧‧‧移動體 113‧‧‧Mobile

S1~S6‧‧‧基板 S1~S6‧‧‧Substrate

P11‧‧‧第1待機位置 P11‧‧‧1st standby position

P12‧‧‧第2待機位置 P12‧‧‧2nd standby position

P21‧‧‧第1曝光位置 P21‧‧‧1st exposure position

P22‧‧‧第2曝光位置 P22‧‧‧2nd exposure position

D1‧‧‧第1方向 D1‧‧‧1st direction

D2‧‧‧第2方向 D2‧‧‧2nd direction

D3‧‧‧第3方向 D3‧‧‧3rd direction

D4‧‧‧第4方向 D4‧‧‧4th direction

HP‧‧‧原來位置 HP‧‧‧ original location

圖1是說明作為本發明的實施例的曝光裝置20的全體構成的說明圖。 FIG. 1 is an explanatory view for explaining the overall configuration of an exposure apparatus 20 as an embodiment of the present invention.

圖2是表示曝光裝置20之中的曝光部110的周邊的構成的說明圖。 FIG. 2 is an explanatory view showing a configuration of the periphery of the exposure unit 110 in the exposure device 20.

圖3是表示第1移動部50a的構成的說明圖。 FIG. 3 is an explanatory view showing a configuration of the first moving unit 50a.

圖4是表示將基板配置於第1曝光位置P21的動作的說明圖。 FIG. 4 is an explanatory view showing an operation of arranging the substrate at the first exposure position P21.

圖5是表示曝光裝置20的動作的流程的說明圖。 FIG. 5 is an explanatory diagram showing a flow of an operation of the exposure device 20.

圖6是表示曝光裝置20的動作的流程的說明圖。 FIG. 6 is an explanatory diagram showing a flow of an operation of the exposure device 20.

圖7是表示曝光裝置20的動作的流程的時序圖。 FIG. 7 is a timing chart showing the flow of the operation of the exposure device 20.

圖8是表示作為第2實施例的曝光裝置220的構成的說明圖。 FIG. 8 is an explanatory view showing a configuration of an exposure device 220 as a second embodiment.

圖9是由水平方向來看曝光裝置220的說明圖。 FIG. 9 is an explanatory view of the exposure device 220 as seen from the horizontal direction.

A.第1實施例: A. First embodiment:

圖1是表示作為本發明的實施例之曝光裝置20的全體構成。曝光裝置20是對於表面具有感光層的基板的曝光面,根據顯示電路等的2次元圖案的曝光資料來進行曝光,藉此將該圖案形成於基板上。在本實施例中,曝光裝置20是對於基板的兩面形成圖案。如圖1所示般,曝光裝置20是具備第1搬送部30、第2搬送部40a、第3搬送部40b、第1移動部50a、第2移動部50b、基底構件80、基準板90a,90b、檢測部100a,100b、曝光部110。 Fig. 1 shows the overall configuration of an exposure apparatus 20 as an embodiment of the present invention. The exposure device 20 is an exposure surface of a substrate having a photosensitive layer on its surface, and is exposed on the basis of exposure data of a two-dimensional pattern such as a display circuit, thereby forming the pattern on the substrate. In the present embodiment, the exposure device 20 forms a pattern on both sides of the substrate. As shown in FIG. 1 , the exposure apparatus 20 includes a first transport unit 30 , a second transport unit 40 a , a third transport unit 40 b , a first moving unit 50 a , a second moving unit 50 b , a base member 80 , and a reference plate 90 a. 90b, detection units 100a and 100b, and exposure unit 110.

在本案中,用以將基板的表面曝光的專用的構成是在符號的末尾附上「a」。並且,用以將基板的背面曝光的專用的構成是在符號的末尾附上「b」。另一方面,共通於表面的曝光及背面的曝光的構成是未附上「a」及「b」。亦即,在圖1中,第2搬送部40a、第1移動部50a、基準板90a及檢測部100a是表面的曝光用的構成。第3搬送部40b、第2移動部50b、基準板90b及檢測部100b是背面曝光用的構成。並且,第1搬送部30、基底構件80及曝光部110是共通的構成。以下,亦把用以將表面曝光的專用的構成稱為表面處理系列,把用以將基板的背面曝光的專用的構成稱為背面處理系列。 In the present case, a dedicated configuration for exposing the surface of the substrate is to attach "a" to the end of the symbol. Further, a dedicated configuration for exposing the back surface of the substrate is to attach "b" to the end of the symbol. On the other hand, the composition of the exposure common to the surface and the exposure of the back surface are not accompanied by "a" and "b". In other words, in FIG. 1, the second conveying unit 40a, the first moving unit 50a, the reference plate 90a, and the detecting unit 100a are configured to expose the surface. The third transport unit 40b, the second moving unit 50b, the reference plate 90b, and the detecting unit 100b are configured for back exposure. Further, the first conveying unit 30, the base member 80, and the exposure unit 110 have a common configuration. Hereinafter, a dedicated structure for exposing the surface is also referred to as a surface treatment series, and a dedicated configuration for exposing the back surface of the substrate is referred to as a back surface treatment series.

第1搬送部30是將基板沿著曝光處理的流程,把基板搬送於一定的方向。在本實施例中,第1搬送 部30是具備移動平台31~34及導軌36。移動平台31~34是構成可在載置有基板的狀態下移動於導軌36上。在移動平台31~34之基板的載置面形成有微細的貫通孔。經由此貫通孔來朝載置面的相反側進行吸引,藉此被載置的基板是固定地保持於載置面上。 The first transport unit 30 transports the substrate in a predetermined direction along the flow of the exposure process. In the present embodiment, the first transport The unit 30 is provided with moving platforms 31 to 34 and guide rails 36. The moving platforms 31 to 34 are configured to be movable on the guide rail 36 in a state in which the substrate is placed. Fine through holes are formed in the mounting surface of the substrates of the moving platforms 31 to 34. The through hole is sucked toward the opposite side of the mounting surface, whereby the substrate placed thereon is fixedly held on the mounting surface.

在第1搬送部30的搬送路徑的途中是設有第2搬送部40a及第3搬送部40b。移動平台31是將未處理的基板S1搬送至第2搬送部40a的設置位置。在第2搬送部40a的設置位置是基板S1會從移動平台31換載於第2搬送部40a,且僅表面被曝光的基板S4會從第2搬送部40a換載於移動平台32。 In the middle of the conveyance path of the first conveyance unit 30, the second conveyance unit 40a and the third conveyance unit 40b are provided. The moving platform 31 is an installation position for transporting the unprocessed substrate S1 to the second conveying unit 40a. At the installation position of the second conveyance unit 40a, the substrate S1 is reloaded from the movement stage 31 to the second conveyance unit 40a, and only the substrate S4 whose surface is exposed is reloaded from the second conveyance unit 40a to the movement stage 32.

被載置於移動平台32的基板是在第2搬送部40a的設置位置與第3搬送部40b的設置位置之間換載於移動平台33。此時,基板是背表反轉。具體而言,移動平台32,33的載置面是以彼此相對的方向側為軸,構成相反側可旋轉至上方。移動平台32,33的載置面會90°旋轉,在將基板S4夾於其間而相對接觸的狀態下,在移動平台33中進行吸引,且在移動平台32中解除吸引,藉此基板S4從移動平台32換載於移動平台33。如此的移動平台32及移動平台33是具有作為使基板的表背反轉的反轉裝置35之機能。 The substrate placed on the moving platform 32 is loaded on the moving platform 33 between the installation position of the second conveying unit 40a and the installation position of the third conveying unit 40b. At this time, the substrate is reversed in the back surface. Specifically, the mounting surfaces of the moving platforms 32, 33 are axially opposite to each other, and the opposite sides are rotatable upward. The mounting surfaces of the moving platforms 32, 33 are rotated by 90°, and the suction is performed on the moving platform 33 while the substrate S4 is placed in contact with each other, and the suction is released in the moving platform 32, whereby the substrate S4 is removed. The mobile platform 32 is loaded on the mobile platform 33. Such a moving platform 32 and a moving platform 33 have a function as an inverting device 35 that reverses the front and back of the substrate.

移動平台33是將被反轉的基板S4搬送至第3搬送部40b的設置位置。在第3搬送部40b的設置位置是基板S4會從移動平台33換載於第3搬送部40b,且在表 面之後背面被曝光的基板S6會從第3搬送部40b換載於移動平台34。另外,在圖1中是顯示僅用以將基板S4從移動平台33換載於第3搬送部40b的空間的部分,移動平台34退避至下游側的狀態。 The moving platform 33 is an installation position at which the inverted substrate S4 is transported to the third transport unit 40b. At the installation position of the third conveying unit 40b, the substrate S4 is reloaded from the moving platform 33 to the third conveying unit 40b, and is in the table. The substrate S6 on which the back surface is exposed after the surface is transferred from the third transfer unit 40b to the moving platform 34. In addition, FIG. 1 shows a state in which only the space for reloading the substrate S4 from the moving platform 33 in the third conveying portion 40b is shown, and the moving platform 34 is retracted to the downstream side.

第2搬送部40a及第3搬送部40b是具有同一構成。因此,以下只針對第2搬送部40a進行說明。第2搬送部40a是具備吸附機構41a及導軌42a。吸附機構41a是構成可沿著導軌42a來移動至第1移動部50a的設置位置。並且,吸附機構41a是與導軌42a所延伸的方向正交,以和水平方向平行的方向作為旋轉軸,構成可旋轉。並且,吸附機構41a是構成該旋轉軸可轉動至上方。 The second transport unit 40a and the third transport unit 40b have the same configuration. Therefore, only the second transport unit 40a will be described below. The second conveying unit 40a includes an adsorption mechanism 41a and a guide rail 42a. The suction mechanism 41a is an installation position that is configured to be movable along the guide rail 42a to the first moving portion 50a. Further, the suction mechanism 41a is orthogonal to the direction in which the guide rail 42a extends, and is configured to be rotatable in a direction parallel to the horizontal direction as a rotation axis. Further, the suction mechanism 41a is configured to be rotatable upward.

如此的第2搬送部40a是在移動至最第1搬送部30側的狀態下,吸附停止於吸附機構41a的正下面的移動平台31上的基板S1。其次,第2搬送部40a是一邊將吸附機構41a移動至第1移動部50a的方向,一邊使旋轉軸轉動至上方,以基板S1能夠朝第1移動部50a的方向之方式使吸附機構41a旋轉。然後,第2搬送部40a是在吸附機構41a最接近第1移動部50a的狀態中,將立於鉛直方向的基板S1交接至第1移動部50a。在圖1中是顯示第3搬送部40b將基板S5交接至第2移動部50b的狀態。 In the state in which the second conveyance unit 40a is moved to the first conveyance unit 30 side, the substrate S1 stopped on the movement stage 31 directly below the adsorption mechanism 41a is adsorbed. Then, the second conveying unit 40a rotates the rotating shaft to the upper side while moving the suction mechanism 41a to the first moving unit 50a, and rotates the suction mechanism 41a so that the substrate S1 can move in the direction of the first moving unit 50a. . In the second transport unit 40a, the substrate S1 standing in the vertical direction is transferred to the first moving unit 50a in a state in which the suction mechanism 41a is closest to the first moving unit 50a. FIG. 1 shows a state in which the third transport unit 40b transfers the substrate S5 to the second moving unit 50b.

如此的第2搬送部40a是藉由與上述動作相反的動作來從第1移動部50a交接表面被曝光的基板S1,換載於移動平台32。 In the second transport unit 40a, the substrate S1 on which the surface is exposed is transferred from the first moving unit 50a by the operation opposite to the above operation, and is transferred to the moving platform 32.

第1移動部50a及第2移動部50b是具有同一構成。因此,在以下是主要只針對第1移動部50a進行說明。第1移動部50a是具備第1移動部第1系列60a及第1移動部第2系列70a。第1移動部第1系列60a及第1移動部第2系列70a是被雙重化的構成,具有同一的機能。 The first moving unit 50a and the second moving unit 50b have the same configuration. Therefore, in the following description, only the first moving unit 50a will be mainly described. The first moving unit 50a includes a first moving unit first series 60a and a first moving unit second series 70a. The first moving unit first series 60a and the first moving unit second series 70a are doubled and have the same function.

第1移動部第1系列60a是具備第1基板保持部68a。第1基板保持部68a是具備:直接保持基板的保持構件62a、及用以保持保持構件62a,鉛直方向的兩端側會形成比保持構件62a更大的基底構件61a。基底構件61a及保持構件62a是具有平板形狀。在基底構件61a之中比保持構件62a更外側的部位形成有2個的凹部63a。如此的第1移動部第1系列60a會將在與第2搬送部40a之間進行基板的交接的位置也稱為第1待機位置P11。第1移動部第1系列60a及第1移動部第2系列70a皆是在同一第1待機位置P11進行基板的交接。同樣,第2移動部50b是在第2待機位置P12進行基板的交接。 The first moving unit first series 60a is provided with a first substrate holding portion 68a. The first substrate holding portion 68a includes a holding member 62a that directly holds the substrate, and a holding member 62a that forms a base member 61a that is larger than the holding member 62a at both end sides in the vertical direction. The base member 61a and the holding member 62a have a flat plate shape. Two recessed portions 63a are formed in a portion of the base member 61a that is outside the holding member 62a. The first moving unit first series 60a is also referred to as a first standby position P11 at a position where the substrate is transferred to and from the second transfer unit 40a. The first moving unit first series 60a and the first moving unit second series 70a are all delivered at the same first standby position P11. Similarly, the second moving unit 50b transfers the substrate at the second standby position P12.

第1移動部第1系列60a是在第1待機位置P11與第1曝光位置P21之間使第1基板保持部68a移動。第1曝光位置P21是進行基板的表面的曝光之位置,其詳細會在往後敘述。在本實施例中,第1基板保持部68a的移動方向是沿著第1方向D1的方向(第1方向D1或與第1方向D1相反的方向)及第2方向D2。所謂第1 方向D1是被配置於第1曝光位置P21的基板的曝光面所朝的方向。在本實施例中,基板是以其曝光面能夠朝水平方向(與重力方向正交的方向)的方式配置於第1曝光位置P21。第2方向D2是與第1方向D1正交的方向。第2方向D2在本實施例中是與水平方向平行的方向。有關第1移動部第2系列70a也是可進行與第1移動部第1系列60a同樣的動作。 The first moving unit first series 60a moves the first substrate holding portion 68a between the first standby position P11 and the first exposure position P21. The first exposure position P21 is a position at which the surface of the substrate is exposed, and the details thereof will be described later. In the present embodiment, the moving direction of the first substrate holding portion 68a is a direction along the first direction D1 (a direction opposite to the first direction D1 or the first direction D1) and a second direction D2. The first The direction D1 is a direction in which the exposure surface of the substrate disposed at the first exposure position P21 faces. In the present embodiment, the substrate is disposed at the first exposure position P21 such that the exposure surface thereof can be oriented in the horizontal direction (the direction orthogonal to the gravity direction). The second direction D2 is a direction orthogonal to the first direction D1. The second direction D2 is a direction parallel to the horizontal direction in this embodiment. The first moving unit second series 70a can also perform the same operation as the first moving unit first series 60a.

同樣,第2移動部50b是具備第2移動部第1系列60b(在圖1中是未圖示)及第2移動部第2系列70b。第2移動部第1系列60b是在第2待機位置P12與第2曝光位置P22之間使第2基板保持部68b移動。第2曝光位置P22是進行基板的背面的曝光之位置,其詳細會在往後敘述。同樣,第2移動部第2系列70b是在第2待機位置P12與第2曝光位置P22之間使第2基板保持部68b移動。如此的第2移動部50b是可進行與第1移動部50a左右對稱的動作。 Similarly, the second moving unit 50b includes a second moving unit first series 60b (not shown in FIG. 1) and a second moving unit second series 70b. The second moving unit first series 60b moves the second substrate holding portion 68b between the second standby position P12 and the second exposure position P22. The second exposure position P22 is a position at which the back surface of the substrate is exposed, and the details thereof will be described later. Similarly, the second moving unit second series 70b moves the second substrate holding portion 68b between the second standby position P12 and the second exposure position P22. The second moving unit 50b is symmetrical with respect to the first moving unit 50a.

基底構件80是具備:被形成大致矩形的基部81、及被形成於基部81之中的第1方向D1側的引導部82、及被形成於與第1方向D1相反側的壁部83。引導部82是沿著第2方向D2來延伸形成。在引導部82的上部形成有其兩側會突出至沿著第1方向D1的方向之凸部。此凸部是具有作為用以後述的檢測部100a,100b及曝光部110移動於第2方向D2的導件之機能。壁部83是被形成大致矩形的框架形狀。在壁部83的內部是形成有貫通 於第1方向D1之大致矩形的貫通孔。 The base member 80 includes a base portion 81 that is formed in a substantially rectangular shape, a guide portion 82 that is formed on the first direction D1 side of the base portion 81, and a wall portion 83 that is formed on the side opposite to the first direction D1. The guide portion 82 is formed to extend along the second direction D2. A convex portion whose both sides protrude in a direction along the first direction D1 is formed in an upper portion of the guide portion 82. This convex portion has a function as a guide that moves in the second direction D2 by the detecting portions 100a and 100b and the exposure unit 110 which will be described later. The wall portion 83 is formed into a substantially rectangular frame shape. The inside of the wall portion 83 is formed with a through A substantially rectangular through hole in the first direction D1.

圖2是圖1所示的曝光裝置20之中的曝光部110的周邊的擴大圖。以下,利用圖2來說明有關基準板90a,90b、檢測部100a,100b、及曝光部110。2個的基準板90a,90b是形成大致矩形的框架形狀。在基準板90a,90b的內部是形成有貫通於第1方向D1之大致矩形的貫通孔91a,91b。基準板90a,90b是其高度會被形成與壁部83的貫通孔的高度大致相等。如此的基準板90a,90b是在被嵌入壁部83的貫通孔的狀態下,牢固地固定在壁部83。 FIG. 2 is an enlarged view of the periphery of the exposure unit 110 in the exposure apparatus 20 illustrated in FIG. 1 . Hereinafter, the reference plates 90a and 90b, the detecting portions 100a and 100b, and the exposure unit 110 will be described with reference to Fig. 2. The two reference plates 90a and 90b are formed into a substantially rectangular frame shape. Inside the reference plates 90a and 90b, through-holes 91a and 91b which are formed in a substantially rectangular shape penetrating in the first direction D1 are formed. The reference plates 90a and 90b have a height that is substantially equal to the height of the through hole of the wall portion 83. The reference plates 90a and 90b are firmly fixed to the wall portion 83 in a state in which they are fitted into the through holes of the wall portion 83.

此基準板90a,90b是在與第1方向D1正交的面上,排列配置於第2方向D2。在本實施例中,基準板90a,90b是稍微分開配置。基準板90a與基準板90b的分開距離是被設定成符合貫通孔91a與貫通孔91b之間未被形成貫通孔的區域的寬度會成為後述的曝光部110的寬度以上的條件。在本實施例中,該分開距離是被設定成符合此條件的最小值。只要符合此條件,基準板90a,90b是亦可不分開,彼此連接配置。此情況,基準板是亦可構成為形成有2個貫通孔的1個板。 The reference plates 90a and 90b are arranged side by side in the second direction D2 on a plane orthogonal to the first direction D1. In the present embodiment, the reference plates 90a, 90b are arranged slightly apart. The distance between the reference plate 90a and the reference plate 90b is set such that the width of the region where the through hole is not formed between the through hole 91a and the through hole 91b is equal to or greater than the width of the exposure portion 110 to be described later. In the present embodiment, the separation distance is a minimum value set to meet this condition. As long as the condition is met, the reference plates 90a, 90b may or may not be separated and connected to each other. In this case, the reference plate may be configured as one plate in which two through holes are formed.

基準板90a之中,在與第1方向D1正交的面的下部設有2個的汽缸92a。有關基準板90b也同樣設有2個的汽缸92b。汽缸92a,92b的任務會在往後敘述。 Among the reference plates 90a, two cylinders 92a are provided in the lower portion of the surface orthogonal to the first direction D1. Similarly, the reference plate 90b is provided with two cylinders 92b. The tasks of cylinders 92a, 92b will be described later.

檢測部100a及檢測部100b是具有同一構成。因此,以下是只針對檢測部100a進行說明。檢測部 100a是檢測出第1曝光位置P21的基板之與第1方向D1正交的面上的位置及形狀。此檢測部100a是具備攝影機101a、支撐構件102a、壁部103a及移動體104a。攝影機101a是光學地讀取在基板上的預定位置所附的對位標記或圖案,根據讀取的標記等的座標位置來檢測出被配置於第1曝光位置P21的基板的形狀及配置位置(以下,亦將如此的動作稱為基板計測)。支撐構件102a是支撐攝影機101a。壁部103a是延伸於鉛直方向形成,將支撐構件102a支撐成可移動於鉛直方向。移動體104a是以其上面來支撐壁部103a,沿著引導部82來移動於第2方向D2。亦即,本實施例的檢測部100a是構成可將攝影機101a移動於鉛直方向及水平方向。另外,檢測部100a是亦可為檢測出基板的位置及形狀的至少一方。並且,在本實施例中,攝影機101a是1個,但檢測部100a是亦可具備2個以上的攝影機。而且,曝光裝置20是亦可對於1個的曝光位置具備2個以上的檢測部。如此一來,可同時讀取複數的標記等,根據多數的標記來進行檢測,因此可不損及生產性來提升形狀認識精度。 The detecting unit 100a and the detecting unit 100b have the same configuration. Therefore, the following description will be given only for the detecting unit 100a. Detection department 100a is a position and a shape on a surface of the substrate perpendicular to the first direction D1 at which the first exposure position P21 is detected. The detecting unit 100a includes a camera 101a, a support member 102a, a wall portion 103a, and a moving body 104a. The camera 101a optically reads a registration mark or a pattern attached to a predetermined position on the substrate, and detects the shape and arrangement position of the substrate disposed at the first exposure position P21 based on the coordinate position of the read mark or the like ( Hereinafter, such an operation is also referred to as substrate measurement. The support member 102a is a support camera 101a. The wall portion 103a is formed to extend in the vertical direction, and supports the support member 102a so as to be movable in the vertical direction. The moving body 104a supports the wall portion 103a on the upper surface thereof and moves in the second direction D2 along the guide portion 82. That is, the detecting unit 100a of the present embodiment is configured to move the camera 101a in the vertical direction and the horizontal direction. Further, the detecting unit 100a may be at least one of detecting the position and shape of the substrate. Further, in the present embodiment, the number of the cameras 101a is one, but the detecting unit 100a may be provided with two or more cameras. Further, the exposure device 20 may have two or more detection units for one exposure position. In this way, it is possible to simultaneously read a plurality of marks and the like, and perform detection based on a plurality of marks, so that the shape recognition accuracy can be improved without impairing productivity.

曝光部110是具備曝光頭111、支撐部112及移動體113。曝光頭111是具備複數的曝光單元,該複數的曝光單元是具有雷射光源、及偏向掃描光射束的多邊形鏡。支撐部112是沿著鉛直方向形成,支撐被配置於第1曝光位置P21的基板的曝光面的高度全體所被配列的複數的曝光單元亦即曝光頭111。移動體113是在其上面支撐 支撐部112,沿著引導部82來移動於第2方向D2。亦即,曝光部110是可沿著第2方向D2移動,藉此構成可選擇性對配置於第1曝光位置P21的基板及配置於第2曝光位置P22的基板進行曝光。另外,在曝光處理中,將曝光頭與基板的距離保持於一定是件重要的事,曝光部110最好是在第1方向D1晃動,精度佳地移動。為此,曝光部110是構成沿著作為牢固的構造體之基底構件80的一部分的引導部82來移動。 The exposure unit 110 includes an exposure head 111, a support portion 112, and a moving body 113. The exposure head 111 is a plurality of exposure units having a polygonal light source and a polygonal mirror that deflects the scanning light beam. The support portion 112 is an exposure head 111 which is formed in a vertical direction and supports a plurality of exposure units which are arranged in the entire height of the exposure surface of the substrate disposed at the first exposure position P21. The moving body 113 is supported on it The support portion 112 moves in the second direction D2 along the guide portion 82. In other words, the exposure unit 110 is movable in the second direction D2, whereby the substrate disposed at the first exposure position P21 and the substrate disposed at the second exposure position P22 can be selectively exposed. Further, in the exposure processing, it is important to keep the distance between the exposure head and the substrate constant, and the exposure unit 110 preferably oscillates in the first direction D1 and moves with high precision. Therefore, the exposure unit 110 is moved by the guide portion 82 constituting a part of the base member 80 that is a solid structure.

如此的曝光部110的動作是藉由處理曝光資料的畫像處理單元(圖示省略)來控制。此畫像處理單元是按照檢測部100a,100b的檢測結果來補正曝光資料,根據補正資料來控制曝光部110。然後,曝光部110是依據基準板90a,90b來規定,一邊從第2方向D2的第1曝光位置P21與第2曝光位置P22之間的位置(以下亦稱為原來位置HP)移動至檢測部100a,100b的其中任一方向,一邊根據補正資料對基板上的所要處照射光射束。 The operation of the exposure unit 110 is controlled by an image processing unit (not shown) that processes the exposure data. The image processing unit corrects the exposure data in accordance with the detection results of the detecting units 100a and 100b, and controls the exposure unit 110 based on the correction data. Then, the exposure unit 110 is moved to the detection unit from the position between the first exposure position P21 and the second exposure position P22 in the second direction D2 (hereinafter also referred to as the original position HP) in accordance with the reference plates 90a and 90b. In either direction of 100a, 100b, the desired beam of light on the substrate is illuminated according to the correction data.

由以上的說明亦可明確,在本實施例中,用以使檢測部100a,100b及曝光部110移動的導件(引導部82)會被共通化。因此,可使曝光裝置20小型化。該等的驅動源是例如可利用移動精度高的線性馬達。 As is clear from the above description, in the present embodiment, the guides (guide portions 82) for moving the detecting portions 100a, 100b and the exposure portion 110 are common. Therefore, the exposure device 20 can be miniaturized. These driving sources are, for example, linear motors that can utilize high movement accuracy.

圖3是表示第1移動部50a的構成。在圖3是顯示從第2移動部50b朝第1移動部50a的方向看曝光裝置20的狀態。基底構件80及基準板90a是以剖面顯示。並且,第1搬送部30、第3搬送部40b、第2移動部 50b、檢測部100a,100b是省略圖示。第1移動部50a是具備上述的第1移動部第1系列60a及第1移動部第2系列70a。第1移動部第1系列60a及第1移動部第2系列70a是具有同一構成,被配置成上下對稱。因此,在以下是只針對第1移動部第1系列60a進行說明。 FIG. 3 shows the configuration of the first moving unit 50a. FIG. 3 shows a state in which the exposure device 20 is viewed from the second moving portion 50b toward the first moving portion 50a. The base member 80 and the reference plate 90a are shown in cross section. Further, the first transport unit 30, the third transport unit 40b, and the second moving unit 50b and the detecting units 100a and 100b are not shown. The first moving unit 50a includes the first moving unit first series 60a and the first moving unit second series 70a described above. The first moving unit first series 60a and the first moving unit second series 70a have the same configuration and are arranged to be vertically symmetrical. Therefore, the following description will be given only for the first moving unit first series 60a.

第1移動部第1系列60a是除了上述的第1基板保持部68a(基底構件61a及保持構件62a)以外,還具備支撐構件64a、彈簧65a、前後移動機構66a、左右移動機構67a。支撐構件64a是經由彈性構件(在此是彈簧)來支撐第1基板保持部68a。具體而言,支撐構件64a是經由設在第1基板保持部68a側的面的上側及下側的彈簧65a來將第1基板保持部68a主要支撐於水平方向(與重力方向正交的方向)。彈簧65a的兩端是在鉛直方向的同一位置,被固定於第1基板保持部68a(基底構件61a)及支撐構件64a。並且,雖圖示省略,但實際支撐構件64a是經由吊掛彈簧來將第1基板保持部68a支撐於鉛直方向。吊掛彈簧的一端是被固定於支撐構件64a,另一端是在比一端更下方側被固定於基底構件61a。藉由如此的構成,第1基板保持部68a是在可變位的狀態,亦即在位置具有預定程度的自由度的浮動狀態下,被支撐構件64a支撐。第1基板保持部68a的變位是起因於彈簧的變位,其變位量少許。被保持於第1基板保持部68a的基板當然也是被保持於浮動狀態。 In addition to the above-described first substrate holding portion 68a (base member 61a and holding member 62a), the first moving portion first series 60a further includes a supporting member 64a, a spring 65a, a front and rear moving mechanism 66a, and a right and left moving mechanism 67a. The support member 64a supports the first substrate holding portion 68a via an elastic member (here, a spring). Specifically, the support member 64a mainly supports the first substrate holding portion 68a in the horizontal direction (the direction orthogonal to the gravity direction) via the spring 65a on the upper side and the lower side of the surface provided on the first substrate holding portion 68a side. . Both ends of the spring 65a are fixed to the first substrate holding portion 68a (base member 61a) and the support member 64a at the same position in the vertical direction. Further, although not shown in the drawings, the actual supporting member 64a supports the first substrate holding portion 68a in the vertical direction via the hanging spring. One end of the suspension spring is fixed to the support member 64a, and the other end is fixed to the base member 61a at a lower side than one end. With such a configuration, the first substrate holding portion 68a is supported by the support member 64a in a state of being in a variable position, that is, in a floating state in which the position has a predetermined degree of freedom. The displacement of the first substrate holding portion 68a is caused by the displacement of the spring, and the amount of displacement is small. Of course, the substrate held by the first substrate holding portion 68a is also held in a floating state.

前後移動機構66a是使支撐第1基板保持部 68a的支撐構件64a前後移動於沿著第1方向D1的方向。在本實施例中,前後移動機構66a是具備滾珠螺桿及馬達作為驅動機構。第1基板保持部68a及支撐構件64a的可動範圍是包含可將第1基板保持部68a所保持的基板配置於第1曝光位置P21的位置。並且,該可動範圍是被設定成第1基板保持部68a及支撐構件64a不會干擾第1移動部第2系列70a的第1基板保持部78a及支撐構件74a,可交叉於第2方向D2。在本實施例中,支撐構件64a是被形成大致L字狀。因此,兩者不易干擾,可縮小設定可動範圍。亦即,可使曝光裝置20小型化。左右移動機構67a是沿著延伸於第2方向D2而形成的導件來使支撐第1基板保持部68a的支撐構件64a及前後移動機構66a左右移動於第2方向D2。在本實施例中,左右移動機構67a是具備輪帶、滑輪及馬達作為驅動機構。 The front and rear moving mechanism 66a is configured to support the first substrate holding portion The support member 64a of 68a moves back and forth in the direction along the first direction D1. In the present embodiment, the front and rear moving mechanism 66a is provided with a ball screw and a motor as a drive mechanism. The movable range of the first substrate holding portion 68a and the support member 64a includes a position at which the substrate held by the first substrate holding portion 68a is disposed at the first exposure position P21. In addition, the movable range is the first substrate holding portion 78a and the support member 74a which are set so that the first substrate holding portion 68a and the support member 64a do not interfere with the first moving portion second series 70a, and can intersect in the second direction D2. In the present embodiment, the support member 64a is formed in a substantially L shape. Therefore, the two are not easily interfered, and the set movable range can be reduced. That is, the exposure device 20 can be miniaturized. The right and left moving mechanism 67a moves the support member 64a and the front-rear movement mechanism 66a that support the first substrate holding portion 68a to the left and right in the second direction D2 along the guide extending in the second direction D2. In the present embodiment, the right and left moving mechanism 67a is provided with a belt, a pulley, and a motor as a drive mechanism.

在基準板90a中,在汽缸92a的設置位置的背面,定位銷93a會從該背面的面突出。此定位銷93a是與被構成於基底構件61a的凹部63a一起具有作為定位構成的機能。 In the reference plate 90a, the positioning pin 93a protrudes from the surface of the back surface on the back surface of the installation position of the cylinder 92a. This positioning pin 93a has a function as a positioning structure together with the concave portion 63a formed in the base member 61a.

在本實施例中,定位銷93a是構成可藉由汽缸92a來往復移動於沿著第1方向D1的方向。因此,定位銷93a是可移動至被收容於比基準板90a的背面更表側的位置。在將定位銷93a收容於基準板90a內的狀態下,只要支撐構件64a及支撐構件74a進行交叉於第2方向D2的動作,第1基板保持部68a便會不易干擾定位銷 93a,因此可縮小前後移動機構66a的可動範圍。 In the present embodiment, the positioning pin 93a is configured to be reciprocally movable in the direction along the first direction D1 by the cylinder 92a. Therefore, the positioning pin 93a is movable to a position accommodated on the front side of the back surface of the reference plate 90a. When the positioning pin 93a is housed in the reference plate 90a, the first substrate holding portion 68a does not easily interfere with the positioning pin as long as the support member 64a and the support member 74a cross the second direction D2. 93a, therefore, the movable range of the front and rear moving mechanism 66a can be reduced.

圖4是表示將基板S3配置於第1曝光位置P21的動作。在圖4是說明第1移動部第2系列70a使基板S3移動至第1曝光位置P21。圖4(A)是表示第1基板保持部78a沿著第2方向D2來從第1待機位置P11移動至基準板90a的背面的狀態。此時,基板S3的位置是位於基準板90a的貫通孔91a之朝與第1方向D1相反方向的投射範圍內。另外,在此時間點,對於基板S3的位置,高度的精度是不被要求。 FIG. 4 shows an operation of arranging the substrate S3 at the first exposure position P21. In FIG. 4, the first moving unit second series 70a is described to move the substrate S3 to the first exposure position P21. (A) of FIG. 4 is a state in which the first substrate holding portion 78a is moved from the first standby position P11 to the back surface of the reference plate 90a along the second direction D2. At this time, the position of the substrate S3 is within the projection range of the through hole 91a of the reference plate 90a in the direction opposite to the first direction D1. Further, at this point of time, the accuracy of the height is not required for the position of the substrate S3.

圖4(B)是表示第1基板保持部78a從圖4(A)所示的位置移動至基板被配置於第1曝光位置P21的位置為止的狀態。如圖示般,第1基板保持部78a是至保持構件72a之保持基板的面側的平坦面及基準板90a接觸於被保持構件72a保持的基板S3的外周為止移動至第1方向D1。就本實施例而言,保持構件72a及基準板90b是以能夠將基板S3的外周全部包圍的方式接觸。 (B) of FIG. 4 is a state in which the first substrate holding portion 78a is moved from the position shown in FIG. 4(A) to the position at which the substrate is placed at the first exposure position P21. As shown in the figure, the first substrate holding portion 78a moves to the first direction D1 until the flat surface on the surface side of the holding member 72a that holds the substrate and the reference plate 90a contacts the outer periphery of the substrate S3 held by the holding member 72a. In the present embodiment, the holding member 72a and the reference plate 90b are in contact with each other so as to be able to completely surround the outer periphery of the substrate S3.

但,接觸的形態並非限於本實施例的形態,只要基準板90a的預定部位及第1基板保持部78a接觸於基板S3的外周即可。例如,亦可在基準板90a形成有朝保持構件72a側以同一突出高度突出的複數(例如3個)的突出部,該突出部會接觸於保持構件72a之保持基板的面側的平坦面及基板S3的外周。如此的突出部是亦可取代基準板90a,而形成於保持構件72a。或,亦可在基準板90a及保持構件72a的雙方形成有突出部,該等會互相 接觸。如此,基準板90a及第1基板保持部78a是亦可沿著基板S3的外周來接觸於分離的複數處。如此的情況,接觸處是最好沿著基板S3的外周來分散配置。 However, the form of the contact is not limited to the embodiment of the present embodiment, and the predetermined portion of the reference plate 90a and the first substrate holding portion 78a may be in contact with the outer periphery of the substrate S3. For example, a plurality of (for example, three) protruding portions protruding toward the holding member 72a at the same protruding height may be formed on the reference plate 90a, and the protruding portions may contact the flat surface of the holding member 72a on the surface side of the holding substrate and The outer circumference of the substrate S3. Such a protruding portion may be formed on the holding member 72a instead of the reference plate 90a. Alternatively, protrusions may be formed on both the reference plate 90a and the holding member 72a, and the other may be mutually contact. In this manner, the reference plate 90a and the first substrate holding portion 78a may be in contact with the separated plurality of portions along the outer circumference of the substrate S3. In such a case, the contact portion is preferably dispersedly arranged along the outer circumference of the substrate S3.

在如此的接觸狀態中,基板S3是位於基準板90a的貫通孔91a的內部。配置有基板S3的此位置是第1曝光位置P21。在第1曝光位置P21,由於基準板90a及第1基板保持部68a(更具體而言是保持構件72a)會接觸,因此在第1曝光位置P21,對於曝光頭111,可使保持基板S3的第1基板保持部68a在D1方向精度佳地配置於預定的位置。 In such a contact state, the substrate S3 is located inside the through hole 91a of the reference plate 90a. This position at which the substrate S3 is disposed is the first exposure position P21. At the first exposure position P21, since the reference plate 90a and the first substrate holding portion 68a (more specifically, the holding member 72a) are in contact with each other, the exposure head 111 can be held at the first exposure position P21. The first substrate holding portion 68a is accurately placed in a predetermined position in the direction D1.

並且,在第1基板保持部78a移動於第1方向D1時,定位銷93a會延伸於與第1方向D1相反的方向來與凹部73a嵌合。因此,與第1方向D1正交的面方向的基板S3的位置會被正確地定位。就本實施例而言,凹部73a的外緣是具有倒角形狀。因此,容易將定位銷93a引導至凹部73a的內部。 When the first substrate holding portion 78a moves in the first direction D1, the positioning pin 93a extends in a direction opposite to the first direction D1 to be fitted into the concave portion 73a. Therefore, the position of the substrate S3 in the plane direction orthogonal to the first direction D1 is correctly positioned. In the present embodiment, the outer edge of the recess 73a has a chamfered shape. Therefore, it is easy to guide the positioning pin 93a to the inside of the recessed portion 73a.

若根據如此的構成,則即使第1移動部50a不是精度佳地使第1移動部第1系列60a及第1移動部第2系列70a移動的機構,還是可對於曝光頭111,使在第1曝光位置P21保持基板的第1基板保持部68a(更具體而言保持構件62a,72a)在與D1正交的面方向精度佳地配置於預定的位置。其結果,可降低成本。又,由於可使支撐構件64a,74a及第1基板保持部68a,78a輕量化,因此可使基板的搬送速度增大,生產性會提升。而且,不 需要用以確保第1移動部50a的高度的移動精度之堅固的基礎構造,可使曝光裝置20小型化,且可降低成本。 According to this configuration, even if the first moving unit 50a does not accurately move the first moving unit first series 60a and the first moving unit second series 70a, the exposure head 111 can be made the first The exposure position P21 holds the first substrate holding portion 68a of the substrate (more specifically, the holding members 62a, 72a) at a predetermined position with excellent precision in the plane direction orthogonal to D1. As a result, the cost can be reduced. Moreover, since the support members 64a and 74a and the first substrate holding portions 68a and 78a can be made lighter, the conveyance speed of the substrate can be increased, and the productivity can be improved. And, no A strong basic structure for ensuring the movement accuracy of the height of the first moving portion 50a is required, and the exposure apparatus 20 can be downsized and the cost can be reduced.

圖5及圖6是表示曝光裝置20的動作的流程。圖5(A)是表示初期狀態的曝光裝置20的狀態。在圖5及圖6中,亦將第2方向D2之中從曝光部110往檢測部100a的方向稱為第3方向D3,亦將從檢測部100a往檢測部100b的方向稱為第4方向D4。 5 and 6 are flowcharts showing the operation of the exposure apparatus 20. FIG. 5(A) shows the state of the exposure apparatus 20 in an initial state. In FIG. 5 and FIG. 6, the direction from the exposure unit 110 to the detection unit 100a in the second direction D2 is also referred to as the third direction D3, and the direction from the detection unit 100a to the detection unit 100b is also referred to as the fourth direction. D4.

一旦曝光裝置20的動作開始,則首先如圖5(B)所示般,對於基準板90a,退避至與曝光部110相反側的檢測部100a是移動於第4方向D4。此動作是使檢測部100a事前移動至附在基板的預定處的對位標記的位置之動作。就本實施例而言,對位標記是附在基板的4角落附近。其次,如圖5(C)所示般,經由第2搬送部40a及第1移動部50a,在基準板90a的內部(第1曝光位置P21)配置基板S1。一旦基板S1被配置,則檢測部100a會在圖5(C)所示的位置,亦即在附有基板的4角落附近的位置標記之中的2個的第2方向D2的位置,進行對位標記的檢測。就本實施例而言,檢測部100a是使攝影機101a移動於鉛直方向,藉此進行2個對位標記的檢測。如上述般,檢測部100a會事前移動至基板的對位標記的位置,藉此在基板S1的配置後,可迅速地進行對位標記的檢測。 When the operation of the exposure device 20 is started, first, as shown in FIG. 5(B), the reference plate 90a is retracted so that the detecting portion 100a on the opposite side to the exposure portion 110 moves in the fourth direction D4. This action is an operation of moving the detecting unit 100a to the position of the registration mark attached to the predetermined portion of the substrate. For the present embodiment, the alignment mark is attached near the corners of the 4 corners of the substrate. Then, as shown in FIG. 5(C), the substrate S1 is placed inside the reference plate 90a (first exposure position P21) via the second transfer unit 40a and the first moving unit 50a. When the substrate S1 is placed, the detecting portion 100a is placed at the position shown in FIG. 5(C), that is, at the position of the second direction D2 of the two position marks in the vicinity of the corners of the four corners of the substrate. Detection of bit marks. In the present embodiment, the detecting unit 100a detects the two registration marks by moving the camera 101a in the vertical direction. As described above, the detecting unit 100a moves to the position of the registration mark of the substrate in advance, whereby the alignment mark can be quickly detected after the arrangement of the substrate S1.

其次,如圖5(D)所示般,檢測部100a是移動於第3方向D3,進行被附在基板S1的剩下的2個對 位標記的檢測。根據此檢測結果,曝光資料被補正,生成補正資料。其次,如圖5(E)所示般,曝光部110會從原來位置HP往第3方向D3掃描,根據補正資料來將基板S1的曝光面曝光。曝光時,檢測部100a是退避至圖5(A)所示的初期位置。一旦曝光終了,則曝光部110回到原來位置HP。並且,被曝光的基板S1是移動至第1待機位置P11。此移動動作是與在基板S1的曝光時間中使被配置於第1待機位置P11的基板S2移動至第1曝光位置P21的動作同時進行。亦即,基板S1與基板S2是以能夠交叉於第2方向D2的方式移動。 Next, as shown in FIG. 5(D), the detecting unit 100a moves in the third direction D3, and performs the remaining two pairs attached to the substrate S1. Detection of bit marks. According to the detection result, the exposure data is corrected to generate correction data. Next, as shown in FIG. 5(E), the exposure unit 110 scans from the original position HP to the third direction D3, and exposes the exposure surface of the substrate S1 based on the correction data. At the time of exposure, the detecting unit 100a is evacuated to the initial position shown in FIG. 5(A). Once the exposure is over, the exposure unit 110 returns to the original position HP. Further, the exposed substrate S1 is moved to the first standby position P11. This movement operation is performed simultaneously with the operation of moving the substrate S2 disposed at the first standby position P11 to the first exposure position P21 during the exposure time of the substrate S1. That is, the substrate S1 and the substrate S2 move so as to be able to cross the second direction D2.

如此的圖5(A)~圖5(E)的動作是被重複至表面在第1曝光位置P21被曝光的基板S1經由第2搬送部40a、第1搬送部30及第3搬送部40b來配置於第2待機位置P12為止。本實施例是在第1曝光位置P21的2次曝光動作的期間,基板S1被配置於第2待機位置P12。 The operation of FIG. 5 (A) to FIG. 5 (E) is repeated until the substrate S1 whose surface is exposed at the first exposure position P21 passes through the second transport unit 40a, the first transport unit 30, and the third transport unit 40b. It is placed in the second standby position P12. In the present embodiment, during the second exposure operation of the first exposure position P21, the substrate S1 is placed at the second standby position P12.

圖6(F)是表示在第1曝光位置P21,基板S1,S2的曝光終了,其次,基板S3被配置於第1曝光位置P21的狀態。曝光部110是回到原來位置HP。此時,在第2待機位置P12是最初被曝光的基板S1會被配置於第2待機位置P12。因此,對於基準板90b,位於與曝光部110相反側的檢測部100b是移動於第4方向D4,在原來位置HP的附近待機。如上述般,此待機位置是可檢測出被配置於第2曝光位置P22的基板的2個對位標記的位 置。 (F) of FIG. 6 shows a state in which the exposure of the substrates S1 and S2 is completed at the first exposure position P21, and the substrate S3 is placed in the first exposure position P21. The exposure unit 110 is returned to the original position HP. At this time, the substrate S1 that is first exposed at the second standby position P12 is placed at the second standby position P12. Therefore, in the reference plate 90b, the detecting portion 100b located on the opposite side of the exposure portion 110 moves in the fourth direction D4 and stands by in the vicinity of the original position HP. As described above, the standby position is a position at which two alignment marks of the substrate disposed at the second exposure position P22 can be detected. Set.

其次,如圖6(G)所示般,曝光部110會從原來位置HP往第3方向D3掃描,將基板S3的曝光面曝光。在此曝光動作的期間,配置於第2待機位置P12的基板S1是被配置於第2曝光位置P22。此時,檢測部100b是進行基板S1的2個對位標記的檢測。其次,如圖6(H)所示般,檢測部100b是移動於第4方向D4,針對基板S1來進行剩下的2個對位標記的檢測。此檢測及根據該檢測結果的補正資料的生成是在圖6(G)所示的基板S3的曝光終了為止的期間進行。 Next, as shown in FIG. 6(G), the exposure unit 110 scans from the original position HP in the third direction D3 to expose the exposure surface of the substrate S3. During the exposure operation, the substrate S1 disposed at the second standby position P12 is disposed at the second exposure position P22. At this time, the detecting unit 100b detects the two registration marks of the substrate S1. Next, as shown in FIG. 6(H), the detecting unit 100b moves in the fourth direction D4, and detects the remaining two alignment marks for the substrate S1. This detection and the generation of the correction data based on the detection result are performed until the exposure of the substrate S3 shown in FIG. 6(G) is completed.

一旦基板S3的曝光終了,則如圖6(I)所示般,曝光部110是回到原來位置HP。檢測部100b是退避至圖5(A)所示的位置。並且,被曝光的基板S3是從第1曝光位置P21移動至第1待機位置P11,取而代之,未處理的基板S4會從第1待機位置P11移動至第1曝光位置P21。在圖6(I)是顯示基板S3剛從第1曝光位置P21移動之後的狀態。 When the exposure of the substrate S3 is completed, the exposure portion 110 is returned to the original position HP as shown in Fig. 6(I). The detecting unit 100b is evacuated to the position shown in FIG. 5(A). Then, the exposed substrate S3 is moved from the first exposure position P21 to the first standby position P11, and the unprocessed substrate S4 is moved from the first standby position P11 to the first exposure position P21. FIG. 6(I) shows a state immediately after the display substrate S3 has moved from the first exposure position P21.

其次,如圖6(J)所示般,曝光部110會從原來位置HP往第4方向D4掃描,將基板S1的曝光面(背面)曝光。在此曝光動作的期間,配置於第1待機位置P11的基板S4是被配置於第1曝光位置P21。此時,檢測部100a是進行基板S4的2個對位標記的檢測。然後,如圖6(K)所示般,在至基板S1的曝光終了為止的期間,檢測部100a是移動於第4方向D4,針對基板S4 來完成剩下的2個對位標記的檢測。根據該檢測結果的補正資料的生成也是在至基板S1的曝光終了為止的期間進行。 Next, as shown in FIG. 6(J), the exposure unit 110 scans from the original position HP in the fourth direction D4 to expose the exposure surface (back surface) of the substrate S1. During the exposure operation, the substrate S4 disposed at the first standby position P11 is disposed at the first exposure position P21. At this time, the detecting unit 100a detects the two registration marks of the substrate S4. Then, as shown in FIG. 6(K), the detection unit 100a moves in the fourth direction D4 during the period until the exposure of the substrate S1 is completed, and the substrate S4 is applied. To complete the detection of the remaining two alignment markers. The generation of the correction data based on the detection result is also performed until the exposure of the substrate S1 is completed.

然後,一旦基板S1的曝光終了,則如圖6(L)所示般,曝光部110是回到原來位置HP。並且,配置於第2曝光位置P22的基板S1是從第2曝光位置P22移動至第2待機位置P12。 Then, when the exposure of the substrate S1 is completed, the exposure unit 110 returns to the original position HP as shown in FIG. 6(L). Further, the substrate S1 disposed at the second exposure position P22 is moved from the second exposure position P22 to the second standby position P12.

藉由如此的圖6(F)~圖6(L)的動作被重複,被供給至曝光裝置20的基板是其表面及背面的雙方會在一連串的流程之中,藉由1個的曝光部110來被曝光處理。在如此的1循環的期間,曝光部110是持續往復移動於基準板90a與基準板90b之間。 By repeating the operations of FIGS. 6(F) to 6(L), the substrate supplied to the exposure apparatus 20 has both the front surface and the back surface in a series of processes, and one exposure unit is used. 110 to be exposed. During such a cycle, the exposure unit 110 continuously reciprocates between the reference plate 90a and the reference plate 90b.

圖7是有關圖6(F)~圖6(L)所示的曝光裝置20的動作的1循環的時序圖。如圖示般,曝光裝置20是在表面處理系列的第1曝光位置P21,對於第1移動部第1系列60a所處理的基板進行曝光處理的期間(期間T11,T12),於背面處理系列中,進行從第2待機位置P12往第2曝光位置P22之未處理的基板的移動(期間T11)、及從第2曝光位置P22往第2待機位置P12之處理完成的基板的移動(期間T11)、及有關新設置於第2曝光位置P22的基板亦即在其次的曝光工程被曝光的基板的基板計測(期間T12)。並且,在進行表面處理系列的第1移動部第1系列60a所處理的基板的基板計測(期間T42)、及曝光部110之往原來位置HP的移動(期間 T43)、及曝光(期間T11,12)、以及其次的曝光部110之往原來位置HP的移動(期間T13)的期間內,可進行有關第1移動部第2系列70a所處理的處理完成的基板之從第1待機位置P11往第1搬送部30的移動、及有關未處理的基板之從第1搬送部30往第1待機位置P11的移動之更換動作。檢測部100a,110b的退避動作是在與曝光部110之往原來位置HP的移動動作同一期間內進行(期間T13,T23,T33,T43)。並且,雖圖示省略,但實際根據基板計測之曝光資料的補正是與曝光部110之往原來位置HP的移動動作同一期間內進行。該等的點是著眼於表面處理系列的第2移動部第1系列60b、背面處理系列的第2移動部第1系列60b、第2移動部第2系列70b所分別處理的基板皆同樣。 FIG. 7 is a timing chart of one cycle of the operation of the exposure apparatus 20 shown in FIGS. 6(F) to 6(L). As shown in the figure, the exposure apparatus 20 is in the first exposure position P21 of the surface treatment series, and the exposure processing period (period T11, T12) of the substrate processed by the first moving unit first series 60a is in the back surface processing series. The movement of the unprocessed substrate from the second standby position P12 to the second exposure position P22 (period T11) and the movement of the substrate from the second exposure position P22 to the second standby position P12 (period T11) And the substrate newly placed at the second exposure position P22, that is, the substrate of the substrate exposed in the next exposure process (period T12). In addition, the substrate measurement (period T42) of the substrate processed by the first moving unit first series 60a of the surface treatment series and the movement of the exposure unit 110 to the original position HP (period) In the period of T43) and the exposure (period T11, 12) and the subsequent movement of the exposure unit 110 to the original position HP (period T13), the processing processed by the first moving unit second series 70a can be completed. The movement of the substrate from the first standby position P11 to the first conveying unit 30 and the replacement operation of the unprocessed substrate from the first conveying unit 30 to the first standby position P11. The retracting operation of the detecting units 100a and 110b is performed in the same period as the moving operation of the exposure unit 110 to the original position HP (period T13, T23, T33, T43). Further, although not shown in the drawings, the correction of the exposure data actually measured by the substrate is performed in the same period as the movement operation of the exposure unit 110 to the original position HP. The points are the same for the substrates processed by the second moving portion first series 60b of the surface treatment series, the second moving portion first series 60b of the back surface processing series, and the second moving portion second series 70b.

如此,曝光裝置20是可在曝光處理後需要使曝光部110回到原來位置HP以外的全期間進行曝光處理。對1個基板的曝光處理是例如可設為12秒。曝光部110之往原來位置HP的移動是可設為1次例如2秒。此情況,全工程的時間的曝光處理所佔的時間的比例是達到約86%。 As described above, the exposure device 20 can perform exposure processing for all the periods other than returning the exposure unit 110 to the original position HP after the exposure processing. The exposure processing for one substrate can be, for example, 12 seconds. The movement of the exposure unit 110 to the original position HP can be set to one time, for example, two seconds. In this case, the proportion of time taken for the exposure processing of the entire project is about 86%.

若根據以上說明的曝光裝置20,則可在第1曝光位置P21與第2曝光位置P22之間交替地進行曝光。因此,可將在一方的曝光位置進行曝光的時間分配成:用以將在另一方的曝光位置已被曝光的基板排出,且將新的基板配置於另一方的曝光位置的時間。因此,可提升基板 的生產性。而且,藉由曝光裝置20,可針對第1曝光位置P21同時進行曝光完成的基板之自第1曝光位置P21的排出、及新的基板之往第1曝光位置P21的配置。因此,曝光以外所要的時間會變得極短,可大幅度提升生產性。並且,可藉由1個的曝光部110來將基板的兩面予以自動地曝光,所以有助於裝置的低成本化及小型化。 According to the exposure apparatus 20 described above, exposure can be alternately performed between the first exposure position P21 and the second exposure position P22. Therefore, the time at which exposure is performed at one exposure position can be assigned to a time for discharging the substrate that has been exposed at the other exposure position and arranging the new substrate at the other exposure position. Therefore, the substrate can be lifted Productive. Further, by the exposure device 20, the discharge from the first exposure position P21 of the substrate on which the exposure is completed and the arrangement of the new substrate to the first exposure position P21 can be simultaneously performed for the first exposure position P21. Therefore, the time required for exposure will be extremely short, which will greatly improve productivity. Further, since both surfaces of the substrate can be automatically exposed by one exposure unit 110, it contributes to cost reduction and downsizing of the device.

B.第2實施例: B. Second embodiment:

圖8是表示作為第2實施例的曝光裝置220的構成的立體圖。圖9是由正面來看曝光裝置220的狀態。作為第2實施例的曝光裝置220是基板以其曝光面能夠朝鉛直方向上方的方式配置於第1曝光位置P21及第2曝光位置P22的點及附隨於此的點與第1實施例的曝光裝置20不同。以下是只針對與第1實施例不同的點進行說明。另外,圖8及圖9是在曝光裝置220的各構成要素附上後二位數包含附在作為第1實施例的曝光裝置20的各構成要素的符號之符號,而省略說明或簡略化。 FIG. 8 is a perspective view showing a configuration of an exposure apparatus 220 as a second embodiment. Fig. 9 is a view showing the state of the exposure device 220 from the front. The exposure apparatus 220 of the second embodiment is a point at which the substrate is disposed at the first exposure position P21 and the second exposure position P22 so that the exposure surface thereof can be vertically upward, and the point attached thereto is the same as that of the first embodiment. The exposure device 20 is different. Hereinafter, only differences from the first embodiment will be described. In addition, FIG. 8 and FIG. 9 are symbols in which the respective constituent elements attached to the exposure apparatus 20 of the first embodiment are attached to the respective components of the exposure apparatus 220, and the description thereof is omitted.

如圖8所示般,曝光裝置220是具備沿著基底構件280的上面移動的曝光部310及檢測部300a,300b。在基底構件280的內部,基準板290a,290b是朝第1方向D1(鉛直方向上方的方向)沿著曝光部310的移動方向來排列配置。在基準板290a,290b的下方配置有第1移動部250a及第2移動部250b。第1移動部250a是具備被雙重化的第1移動部第1系列260a及第1移動 部第2系列270a。 As shown in FIG. 8, the exposure apparatus 220 is equipped with the exposure part 310 and the detection parts 300a and 300b which move along the upper surface of the base member 280. Inside the base member 280, the reference plates 290a and 290b are arranged side by side in the first direction D1 (the direction in the vertical direction) along the moving direction of the exposure unit 310. The first moving unit 250a and the second moving unit 250b are disposed below the reference plates 290a and 290b. The first moving unit 250a is provided with a first moving unit first series 260a and a first moving unit that are doubled. Department 2 series 270a.

第1移動部第1系列260a的支撐構件264a是在第1基板保持部268a位於左右移動機構267a,277a的內側之狀態下支撐第1基板保持部268a,該左右移動機構267a,277a是延伸於第2方向D2(與曝光部310的移動方向正交的方向)而形成。第1基板保持部268a是構成藉由左右移動機構267a,使基底構件280的內部與外部之間可經由形成於基底構件280的開口部來移動於第2方向D2。並且,第1基板保持部268a是構成藉由前後移動機構266a,可移動於沿著第1方向D1的方向。藉由如此的構成,第1基板保持部268a是構成可在第1待機位置P11與第1曝光位置P21之間移動。第1移動部第2系列270a是具備與第1移動部第1系列260a同樣的構成。並且,第2移動部250b是具備與第1移動部250a同樣的構成。 The support member 264a of the first moving portion first series 260a supports the first substrate holding portion 268a while the first substrate holding portion 268a is located inside the right and left moving mechanisms 267a, 277a, and the left and right moving mechanisms 267a, 277a extend The second direction D2 (the direction orthogonal to the moving direction of the exposure unit 310) is formed. The first substrate holding portion 268a is configured such that the inside and the outside of the base member 280 can be moved in the second direction D2 via the opening formed in the base member 280 by the right and left moving mechanism 267a. Further, the first substrate holding portion 268a is configured to be movable in the direction along the first direction D1 by the front-rear movement mechanism 266a. With such a configuration, the first substrate holding portion 268a is configured to be movable between the first standby position P11 and the first exposure position P21. The first moving unit second series 270a has the same configuration as the first moving unit first series 260a. Further, the second moving unit 250b has the same configuration as the first moving unit 250a.

如圖9所示般,第1基板保持部268a及第1基板保持部278a是可配置於鉛直方向的不同的位置,因此可以能夠交叉於水平方向的方式同時移動於相反方向。 As shown in FIG. 9 , the first substrate holding portion 268 a and the first substrate holding portion 278 a can be disposed at different positions in the vertical direction, and thus can be simultaneously moved in the opposite direction so as to be able to cross the horizontal direction.

就如此的曝光裝置220而言,是如圖8所示般,藉由吸附機構(圖示省略),以基板S1,S2,S3,S4的位置的順序來換載基板而搬送。亦即,在曝光裝置220中,可省略相當於第1實施例的導軌42a,42b的構成。因此,可使曝光裝置220小型化。 In the exposure apparatus 220 as described above, as shown in FIG. 8, the substrate is reloaded by the adsorption mechanism (not shown) in the order of the positions of the substrates S1, S2, S3, and S4. In other words, in the exposure device 220, the configuration of the guide rails 42a and 42b corresponding to the first embodiment can be omitted. Therefore, the exposure device 220 can be miniaturized.

C.變形例: C. Modifications: C-1.變形例1: C-1. Modification 1:

曝光裝置20是亦可為只將基板的一方的面曝光的裝置。此情況,曝光裝置20是亦可具有將在第1曝光位置P21及第2曝光位置P22所被曝光的基板分別獨立排出的2個搬送路徑。 The exposure device 20 may be a device that exposes only one surface of the substrate. In this case, the exposure device 20 may have two transport paths that independently discharge the substrates exposed at the first exposure position P21 and the second exposure position P22.

C-2.變形例2: C-2. Modification 2:

曝光裝置20的基板的搬送方向是可適當設定。例如,當第1移動部50a未被雙重化時,第1移動部50a是亦可構成可只在沿著第1方向D1的方向搬送基板。此情況,亦可省略第2搬送部40a及第3搬送部40b。例如,沿著與第1方向D1交叉的方向來搬送基板的第1搬送部30會被配置於基準板90a的背面側,藉由吸附機構從第1搬送部30將基板換載至第1搬送部30的近旁,且被設定於基準板90a的背面的第1待機位置P11。若根據如此的構成,則第1移動部50a是只要從第1待機位置P11至第2待機位置P12沿著第1方向D1來搬送基板,便可將基板配置於第1曝光位置P21。 The conveyance direction of the substrate of the exposure device 20 can be appropriately set. For example, when the first moving unit 50a is not doubled, the first moving unit 50a may be configured to transport the substrate only in the direction along the first direction D1. In this case, the second conveying unit 40a and the third conveying unit 40b may be omitted. For example, the first transport unit 30 that transports the substrate in the direction intersecting the first direction D1 is placed on the back side of the reference plate 90a, and the substrate is transferred from the first transport unit 30 to the first transport by the suction mechanism. The vicinity of the portion 30 is set to the first standby position P11 on the back surface of the reference plate 90a. According to such a configuration, the first moving unit 50a can transport the substrate along the first direction D1 from the first standby position P11 to the second standby position P12, and the substrate can be placed at the first exposure position P21.

或,藉由第1移動部50a及第2移動部50b構成可以高度的移動精度移動,在第1曝光位置及第2曝光位置,對於曝光頭111,可將第1基板保持部68a及第2基板保持部68b精度佳地配置於預定的位置時,不僅第2搬送部40a及第3搬送部40b,亦可省略基準板90a, 90b。此情況,藉由使第1基板保持部68a及第2基板保持部68b移動於第1方向D1,並不一定要配置於第1曝光位置P21及第2曝光位置P22。因此,基板是亦可只被搬送於第2方向D2,從第1待機位置P11或第2待機位置P12搬送至被設定於沿著該等的待機位置的第2方向D2的延長線上的第1曝光位置P21或第2曝光位置P22。 Alternatively, the first moving portion 50a and the second moving portion 50b can be moved with a high degree of movement accuracy, and in the first exposure position and the second exposure position, the first substrate holding portion 68a and the second substrate can be provided for the exposure head 111. When the substrate holding portion 68b is accurately placed at a predetermined position, the reference plate 90a may be omitted, not only the second conveying portion 40a and the third conveying portion 40b. 90b. In this case, the first substrate holding portion 68a and the second substrate holding portion 68b are moved in the first direction D1, and are not necessarily disposed in the first exposure position P21 and the second exposure position P22. Therefore, the substrate can be transported only in the second direction D2, and is transported from the first standby position P11 or the second standby position P12 to the first line that is set on the extension line of the second direction D2 along the standby positions. The exposure position P21 or the second exposure position P22.

C-3.變形例3: C-3. Modification 3:

曝光裝置20是亦可具備曝光部110、及測定與被配置於第1曝光位置P21及第2曝光位置P22的基板的曝光面的距離之測定部。如此的測定部是例如亦可具備雷射距離計。並且,曝光裝置20是亦可具備使曝光部110沿著第1方向D1移動的移動部。如此的移動部是例如亦可為線性行進機構。此移動部是亦可按照測定部的測定結果來調節曝光部110與基板的曝光面的距離。 The exposure device 20 may include an exposure unit 110 and a measurement unit that measures a distance from an exposure surface of the substrate disposed at the first exposure position P21 and the second exposure position P22. Such a measuring unit may be, for example, a laser distance meter. Further, the exposure device 20 may include a moving portion that moves the exposure unit 110 in the first direction D1. Such a moving portion may be, for example, a linear traveling mechanism. In the moving portion, the distance between the exposure portion 110 and the exposure surface of the substrate can be adjusted in accordance with the measurement result of the measurement portion.

若根據如此的形態的曝光裝置,則即使對於不是平滑的基板的曝光面,也可經常安定地連結焦點。 According to the exposure apparatus of such a form, the focus can be stably connected even to the exposure surface of the substrate which is not smooth.

C-4.變形例4: C-4. Modification 4:

將來自光源的光選擇性地照射於基板的曝光面的任意的領域之手段並非限於多邊形鏡,亦可以各種的形態實現。例如,該手段亦可為DMD(Digital Mirror Device)。又,光源並非限於雷射光源,亦可利用各種的 發光素子。例如,光源亦可為UV燈或LED等。 The means for selectively irradiating light from the light source to any field of the exposure surface of the substrate is not limited to a polygonal mirror, and may be realized in various forms. For example, the means may also be a DMD (Digital Mirror Device). Moreover, the light source is not limited to a laser light source, and various types of Luminescent element. For example, the light source may also be a UV lamp or an LED or the like.

以上,根據幾個實施例來說明有關本發明的實施形態,但上述發明的實施形態是為了為了容易理解本發明,而不是限定本發明者。當然本發明可不脫離其主旨來實施變更、改良,且本發明為該等價物所包含。並且,在可解決上述課題的至少一部分的範圍或取得效果的至少一部分的範圍中,可組合或省略申請專利範圍及說明書中所記載的各構成要素。 The embodiments of the present invention have been described above based on a few embodiments, but the embodiments of the present invention are intended to facilitate the understanding of the present invention and are not intended to limit the invention. It is a matter of course that the invention can be modified or modified without departing from the spirit and scope of the invention. Further, in the range in which at least a part of the above-mentioned problems or at least a part of the effects can be solved, the respective constituent elements described in the claims and the description can be combined or omitted.

20‧‧‧曝光裝置 20‧‧‧Exposure device

30‧‧‧第1搬送部 30‧‧‧1st transport department

31~34‧‧‧移動平台 31~34‧‧‧Mobile platform

35‧‧‧反轉裝置 35‧‧‧Reversal device

36‧‧‧導軌 36‧‧‧rails

40a‧‧‧第2搬送部 40a‧‧‧The second transport department

40b‧‧‧第3搬送部 40b‧‧‧3rd Transport Department

41a,41b‧‧‧吸附機構 41a, 41b‧‧‧ adsorption mechanism

42a,42b‧‧‧導軌 42a, 42b‧‧‧ rails

50a‧‧‧第1移動部 50a‧‧‧1st mobile department

50b‧‧‧第2移動部 50b‧‧‧2nd Moving Department

60a‧‧‧第1移動部第1系列 60a‧‧‧1st Mobile Division 1st Series

70a‧‧‧第1移動部第2系列 70a‧‧‧1st Mobile Division 2nd Series

70b‧‧‧第2移動部第2系列 70b‧‧‧2nd Mobile Division 2nd Series

61a,71b‧‧‧基底構件 61a, 71b‧‧‧ base member

62a,72b‧‧‧保持構件 62a, 72b‧‧‧ Keeping components

63a,73b‧‧‧凹部 63a, 73b‧‧‧ recess

77a‧‧‧左右移動機構 Mobile agencies around 77a‧‧

68a,78b‧‧‧第1基板保持部 68a, 78b‧‧‧1st substrate holder

80‧‧‧基底構件 80‧‧‧base member

81‧‧‧基部 81‧‧‧ base

82‧‧‧引導部 82‧‧‧Guidance

83‧‧‧壁部 83‧‧‧ wall

90a,90b‧‧‧基準板 90a, 90b‧‧‧ reference board

100a,100b‧‧‧檢測部 100a, 100b‧‧‧Detection Department

110‧‧‧曝光部 110‧‧‧Exposure Department

S1~S6‧‧‧基板 S1~S6‧‧‧Substrate

P11‧‧‧第1待機位置 P11‧‧‧1st standby position

P12‧‧‧第2待機位置 P12‧‧‧2nd standby position

P21‧‧‧第1曝光位置 P21‧‧‧1st exposure position

P22‧‧‧第2曝光位置 P22‧‧‧2nd exposure position

HP‧‧‧原來位置 HP‧‧‧ original location

Claims (11)

一種曝光裝置,係將基板曝光的曝光裝置,係特徵係具備「第1移動部,其係具備保持上述基板的第1基板保持部,使上述第1基板保持部移動於第1待機位置與第1曝光位置之間,該第1曝光位置係於上述第1基板保持部所保持的上述基板的曝光面朝第1方向的狀態下配置該基板;第2移動部,其係具備保持上述基板的第2基板保持部,使上述第2基板保持部移動於第2待機位置與第2曝光位置之間,該第2待機位置係與上述第1待機位置不同,該第2曝光位置係於上述第2基板保持部所保持的上述基板的曝光面朝上述第1方向的狀態,且於上述第1曝光位置所配置的上述基板的上述曝光面與和上述第1方向正交的第2方向排列的狀態下配置被上述第2基板保持部所保持的上述基板;及曝光部,其係具備可沿著導件來移動於上述第1曝光位置與上述第2曝光位置之間的曝光頭,該導件係沿著上述第2方向而配置,藉由上述曝光頭之沿著上述第2方向的移動來選擇性地將被配置於上述第1曝光位置的上述基板及被配置於上述第2曝光位置的上述基板予以曝光。 An exposure apparatus that exposes a substrate is characterized in that: a first moving portion includes a first substrate holding portion that holds the substrate, and the first substrate holding portion is moved to a first standby position and In the first exposure position, the substrate is disposed in a state in which the exposure surface of the substrate held by the first substrate holding portion is in the first direction, and the second moving portion is provided to hold the substrate. The second substrate holding portion moves the second substrate holding portion between the second standby position and the second exposure position, the second standby position being different from the first standby position, wherein the second exposure position is the first (2) a state in which the exposure surface of the substrate held by the substrate holding portion is in the first direction, and the exposure surface of the substrate disposed at the first exposure position is aligned with a second direction orthogonal to the first direction The substrate held by the second substrate holding portion is disposed in a state, and the exposure portion includes an exposure head that is movable between the first exposure position and the second exposure position along the guide. The member is disposed along the second direction, and selectively moves the substrate disposed at the first exposure position and the second exposure position by movement of the exposure head along the second direction The above substrate is exposed. 如申請專利範圍第1項之曝光裝置,其中,上述第1移動部及上述第2移動部係分別具備被雙重化的2個基板保持部,其係可移動於沿著上述第1方向的方向及與該 第1方向交叉的方向,作為上述第1基板保持部或上述第2基板保持部。 The exposure apparatus according to the first aspect of the invention, wherein the first moving unit and the second moving unit respectively include two substrate holding units that are doubled, and are movable in a direction along the first direction And with The direction in which the first direction intersects is the first substrate holding portion or the second substrate holding portion. 如申請專利範圍第2項之曝光裝置,其中,更具備:基底構件,其係設有上述導件;及基準板,其係安裝於上述基底構件的基準板,具有可將上述基板插入至作為上述第1曝光位置及上述第2曝光位置之上述基準板的內部的位置之框架形狀,上述第1基板保持部及上述第2基板保持部係於上述基板可變位的狀態下保持上述基板,在上述基準板的預定部位、上述第1基板保持部及上述第2基板保持部的預定部位接觸於被該第1基板保持部及該第2基板保持部所保持的各個上述基板的外周之狀態下,該基板被配置於上述第1曝光位置及上述第2曝光位置。 The exposure apparatus of claim 2, further comprising: a base member provided with the guide member; and a reference plate attached to the reference plate of the base member, wherein the substrate is insertable In the frame shape of the position of the inside of the reference plate in the first exposure position and the second exposure position, the first substrate holding portion and the second substrate holding portion hold the substrate while the substrate is in a variable position. a predetermined portion of the reference plate, a predetermined portion of the first substrate holding portion and the second substrate holding portion, and a state of the outer periphery of each of the substrates held by the first substrate holding portion and the second substrate holding portion The substrate is placed at the first exposure position and the second exposure position. 如申請專利範圍第1項之曝光裝置,其中,更具備:基底構件,其係設有上述導件;及基準板,其係安裝於上述基底構件的基準板,具有可將上述基板插入至作為上述第1曝光位置及上述第2曝光位置之上述基準板的內部的位置之框架形狀,上述第1移動部及上述第2移動部分別構成上述第1基板保持部及上述第2基板保持部可沿著上述第1方向移動, 上述第1基板保持部及上述第2基板保持部係於上述基板可變位的狀態下保持上述基板,在上述基準板的預定部位、上述第1基板保持部及上述第2基板保持部的預定部位接觸於被該第1基板保持部及該第2基板保持部所保持的各個上述基板的外周之狀態下,該基板被配置於上述第1曝光位置及上述第2曝光位置。 The exposure apparatus of claim 1, further comprising: a base member provided with the guide member; and a reference plate attached to the reference plate of the base member, wherein the substrate is insertable a frame shape of a position of the inside of the reference plate at the first exposure position and the second exposure position, wherein the first moving portion and the second moving portion respectively constitute the first substrate holding portion and the second substrate holding portion Moving along the first direction, The first substrate holding portion and the second substrate holding portion hold the substrate in a state where the substrate is variable, and a predetermined portion of the reference plate, the first substrate holding portion, and the second substrate holding portion are predetermined. The substrate is placed in the first exposure position and the second exposure position in a state where the portion is in contact with the outer periphery of each of the substrates held by the first substrate holding portion and the second substrate holding portion. 如申請專利範圍第3或4項之曝光裝置,其中,在上述基準板形成有互相嵌合的一對的定位構成的一方,在上述第1基板保持部及上述第2基板保持部的其中之比分別被該第1基板保持部及該第2基板保持部所保持的上述基板更外側的位置形成有上述定位構成的另一方,被上述第1基板保持部及上述第2基板保持部所保持的上述基板係於上述一對的定位構成嵌合的狀態下,被配置於上述第1曝光位置及上述第2曝光位置。 The exposure apparatus according to the third or fourth aspect of the invention, wherein the reference plate is formed with a pair of positioning members that are fitted to each other, and the first substrate holding portion and the second substrate holding portion are The other of the positioning structures is formed at a position outside the substrate held by the first substrate holding portion and the second substrate holding portion, and is held by the first substrate holding portion and the second substrate holding portion. The substrate is placed in the first exposure position and the second exposure position in a state in which the pair of positioning members are fitted. 如申請專利範圍第1~4項中的任一項所記載之曝光裝置,其中,更具備:檢測部,其係構成可沿著上述第2方向移動,檢測出被配置於上述第1曝光位置及上述第2曝光位置的上述基板的位置及形狀的至少一方,上述曝光部係根據按照上述檢測部的檢測結果所被補正的曝光資料來進行上述曝光。 The exposure apparatus according to any one of claims 1 to 4, further comprising: a detecting unit configured to be movable in the second direction and configured to be disposed in the first exposure position And at least one of a position and a shape of the substrate at the second exposure position, wherein the exposure unit performs the exposure based on exposure data corrected in accordance with a detection result of the detection unit. 如申請專利範圍第6項之曝光裝置,其中,上述導件係作為上述曝光頭之沿著上述第2方向的移動及上述檢 測部之沿著上述第2方向的移動雙方兼用的導件而設。 The exposure apparatus of claim 6, wherein the guide is used as the movement of the exposure head along the second direction and the inspection The measuring unit is provided along the guide for both the movement in the second direction. 如申請專利範圍第1~4項中的任一項所記載之曝光裝置,其中,更具備:第1搬送部,其係搬送上述基板;第2搬送部,其係於上述第1搬送部與上述第1待機位置之間搬送上述基板;第3搬送部,其係於上述第1搬送部與上述第2待機位置之間搬送上述基板。 The exposure apparatus according to any one of claims 1 to 4, further comprising: a first transport unit that transports the substrate; and a second transport unit that is coupled to the first transport unit The substrate is transported between the first standby positions, and the third transport unit transports the substrate between the first transport unit and the second standby position. 如申請專利範圍第1~4項中的任一項所記載之曝光裝置,其中,更具備:測定部,其係測定上述曝光頭與被配置於上述第1曝光位置及上述第2曝光位置的上述基板的上述曝光面的距離;及第3移動部,其係使上述曝光頭沿著上述第1方向移動,上述第3移動部係按照上述測定部的測定結果來調節上述曝光頭與上述曝光面的距離。 The exposure apparatus according to any one of claims 1 to 4, further comprising: a measuring unit that measures the exposure head and the first exposure position and the second exposure position; a distance between the exposure surface of the substrate; and a third moving portion that moves the exposure head along the first direction, wherein the third moving portion adjusts the exposure head and the exposure according to a measurement result of the measurement unit The distance of the face. 如申請專利範圍第1~4項中的任一項所記載之曝光裝置,其中,上述曝光頭係具有複數的曝光單元。 The exposure apparatus according to any one of claims 1 to 4, wherein the exposure head has a plurality of exposure units. 一種曝光方法,係藉由曝光裝置來將基板曝光的曝光方法,其特徵係具有:第1工程,其係準備曝光裝置,係設定有第1曝光位置及第2曝光位置,該第1曝光位置係於上述基板的曝光面朝第1方向的狀態下配置該基板,該第2曝光位置係於 上述基板的曝光面朝上述第1方向的狀態,且於上述第1曝光位置所配置的上述基板的上述曝光面與和上述第1方向正交的第2方向排列的狀態下配置上述基板之曝光裝置,具備可沿著上述第2方向來移動於上述第1曝光位置與上述第2曝光位置之間的曝光頭,藉由上述曝光頭之沿著上述第2方向的移動來選擇性地將被配置於上述第1曝光位置的上述基板及被配置於上述第2曝光位置的上述基板予以曝光;第2工程,其係至對被配置於上述第1曝光位置的第1基板的曝光處理終了為止,將與第1基板不同的第2基板配置於上述第2曝光位置;及第3工程,其係至對被配置於上述第2曝光位置的上述第2基板的曝光處理終了為止,將與上述第2基板不同的第3基板配置於上述第1曝光位置。 An exposure method is an exposure method for exposing a substrate by an exposure device, characterized in that: a first project for preparing an exposure device, wherein a first exposure position and a second exposure position are set, the first exposure position The substrate is placed in a state in which the exposure surface of the substrate faces the first direction, and the second exposure position is The exposure surface of the substrate is in the first direction, and the exposure of the substrate is arranged in a state in which the exposure surface of the substrate disposed at the first exposure position and the second direction orthogonal to the first direction are arranged. The apparatus includes an exposure head that is movable between the first exposure position and the second exposure position along the second direction, and is selectively selectively moved by the movement of the exposure head along the second direction The substrate disposed at the first exposure position and the substrate disposed at the second exposure position are exposed; and the second project is performed until the exposure processing of the first substrate disposed at the first exposure position is completed a second substrate different from the first substrate is disposed at the second exposure position; and a third project is performed until the exposure process of the second substrate disposed at the second exposure position is completed The third substrate having a different second substrate is disposed at the first exposure position.
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