JP5164069B2 - Scan exposure apparatus and scan exposure method - Google Patents

Description

  The present invention relates to a scan exposure apparatus and a scan exposure method, and more particularly to a scan exposure apparatus suitable for exposing and transferring a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display. The present invention relates to a scanning exposure method.

  Large flat panel displays such as liquid crystal displays and plasma displays used for large thin televisions and the like are manufactured by proximity exposure transfer of a mask pattern onto a substrate by a division sequential exposure method. As this type of divided sequential exposure method, for example, a mask having the same size as the panel is used, the mask is held by a mask stage, the substrate is held by a work stage, and both are placed close to each other. Each time the work stage is moved stepwise relative to the mask, the substrate is irradiated with light for pattern exposure from the mask side, and a plurality of mask patterns are exposed and transferred onto the substrate.

  As another exposure method, a scan exposure method is known in which a mask is subdivided, a plurality of mask holding portions for holding these masks are arranged in a staggered manner, and exposure is performed while moving the substrate in one direction. (For example, refer to Patent Document 1). This exposure method utilizes the fact that a large pattern can be formed by joining together on the premise that there is a portion that is repeated to some extent in the pattern formed on the substrate. In this case, the mask does not need to be large in accordance with the panel, and a relatively inexpensive mask can be used.

In the scan exposure method, the amount of deviation in the direction orthogonal to the substrate transport direction is detected by observing the reference line of the substrate on which the black matrix is formed by the line sensor, and a mask is applied corresponding to this amount of deviation. The correction operation is performed by moving it (see, for example, Patent Document 2).
JP 2007-57991 A JP 2006-292955 A

  By the way, in the scan exposure apparatus described in Patent Document 2, the amount of deviation in the orthogonal direction can be corrected. However, the mask and the substrate in the θ direction around the normal perpendicular to both the transport direction and the orthogonal direction. No correction has been made for the relative deviation amount. For this reason, the shift amount in the θ direction depends on the accuracy as in the substrate transport mechanism, and when the mask pattern is complicated, the shift amount in the θ direction is directly used as the exposure accuracy.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a scan exposure apparatus and a scan exposure method that can improve the exposure accuracy by correcting the shift amount in the θ direction. is there.

The above object of the present invention can be achieved by the following constitution.
(1) a substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
A scanning exposure apparatus that irradiates the substrate to be conveyed with the exposure light through the plurality of masks and exposes the pattern of each mask on the substrate,
A pair of imaging means which are arranged upstream and downstream in the predetermined direction with respect to the pattern of the mask, and which image a reference pattern formed in advance on the substrate to be transported and a reference mark of the mask;
Based on the reference pattern and the reference mark simultaneously imaged by the pair of imaging means, the relative deviation amount between the mask and the substrate in the θ direction around the normal line perpendicular to the predetermined direction and the orthogonal direction is calculated. Θ direction correcting means for correcting;
A scan exposure apparatus, further comprising:
(2) The θ-direction correcting means includes first and second driving units that are arranged in parallel to each other and can be driven independently of each other, can move the substrate in the orthogonal direction, and the θ The scan exposure apparatus according to (1), wherein the scan exposure apparatus is configured by a Y-direction transport mechanism of the substrate transport mechanism capable of swinging in a direction.
(3) The scan exposure apparatus according to (1), wherein the θ-direction correcting unit is configured by a θ-direction drive unit capable of rotationally driving the mask holding unit in the θ direction.
(4) Y direction correcting means for correcting a relative shift amount between the mask and the substrate in the orthogonal direction based on the reference pattern and the reference mark imaged by the downstream imaging means. (1) The scan exposure apparatus according to (1).
(5) a substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
A pair of imaging means which are arranged upstream and downstream in the predetermined direction with respect to the pattern of the mask, and which images a reference pattern formed in advance on the substrate to be conveyed;
Based on the reference pattern imaged simultaneously by the pair of imaging means and the reference mark of the mask, the relative relationship between the mask and the substrate in the θ direction around the normal direction perpendicular to the predetermined direction and the orthogonal direction. Θ direction correction means for correcting the amount of deviation;
A scan exposure method of a scan exposure apparatus comprising:
Irradiating the substrate to be conveyed with the exposure light through the plurality of masks, and exposing the pattern of each mask on the substrate;
Calculating a relative shift amount between the mask and the substrate in the θ direction based on the reference pattern and the reference mark simultaneously imaged by the pair of imaging means;
Driving one of the mask and the substrate in the θ direction by the θ direction correcting means to correct a shift amount in the θ direction;
The scan exposure method is characterized in that the calculation step and the correction step are performed in real time in the exposure step.
(6) The scan exposure apparatus corrects a relative misalignment between the mask and the substrate in the orthogonal direction based on the reference pattern and the reference mark captured by the downstream imaging unit. Means,
The calculation step further calculates a relative shift amount between the mask and the substrate in the orthogonal direction based on a reference pattern and a reference mark imaged by the downstream imaging unit,
(5) The correction step further includes correcting the shift amount in the orthogonal direction by driving either the mask or the substrate in the orthogonal direction by the Y-direction correcting unit. Scan exposure method.

  According to the scan exposure apparatus and the scan exposure method of the present invention, a reference pattern and a mask reference mark that are preliminarily formed on a substrate to be transported are arranged upstream and downstream in a predetermined direction with respect to a mask pattern. Based on a pair of imaging means for imaging and a reference pattern imaged simultaneously by the pair of imaging means, a relative shift amount between the mask and the substrate in the θ direction around the normal line perpendicular to the predetermined direction and the orthogonal direction is determined. Θ direction correcting means for correcting. Therefore, the deviation in the θ direction can be corrected in real time by the θ direction correcting means, and the exposure accuracy can be improved.

  Hereinafter, embodiments of a scanning exposure apparatus and a substrate transport method of the scanning exposure apparatus according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, the configuration of the scan exposure apparatus 1 of the present embodiment will be schematically described. As shown in FIG. 1, the scan exposure apparatus 1 of the present embodiment is located on both sides of the exposure machine main body 2 that exposes the substrate W while the substrate W is levitated and transported, and on both sides of the exposure machine main body 2 in the transport direction. And a pair of substrate transfer robots 5 that carry in and out the substrate W between the pre-alignment tables 3 and 4 and a substrate stocker (not shown). , 6 and the distribution board 7 positioned between the substrate transfer robots 5 and 6 and the exposure apparatus body 2 on the opposite side of the distribution board 7 to operate and control the movement of each operating part of the scanning exposure apparatus 1. A control unit 8 also serving as an operation panel, a mask transfer robot 9, and a mask stocker 10.

  As shown in FIGS. 2 and 3, the exposure machine main body 2 floats and supports the substrate W, and transports the substrate W in the X direction which is a predetermined direction and the Y direction which is a direction orthogonal to the predetermined direction. The transport mechanism 14, a plurality of (six in the embodiment shown in FIG. 1) mask holders 11, which are arranged side by side along the Y direction, respectively, and drive the mask holders 11, respectively. A plurality of mask driving units 12 and a plurality of irradiation units 13 that are respectively disposed on the top of the plurality of mask holding units 11 and irradiate exposure light.

  The substrate transport mechanism 14 holds the floating units 15a and 15b and one side of the substrate W in the Y direction (upper side in FIG. 1), can transport in the X direction, and can move in the Y direction. Drive units 16 and 17 are provided. The levitation units 15a and 15b include a plurality of exhaust air pads 20 and intake / exhaust air pads 21 provided on a plurality of frames 18 and 19, respectively, and are exhausted via a pump (not shown) and a solenoid valve (not shown). Air is exhausted from the air pad 20 or the air intake / exhaust air pad 21 or air is exhausted. Thereby, the substrate W is held in a state of being floated by the air flow on the floating units 15a and 15b, and the substrate W can be transported without resistance.

  As shown in FIG. 2, the first and second substrate driving units 16 and 17 are arranged in the X direction by the X-direction transport mechanisms 50 and 51 that are first feed mechanisms and the X-direction transport mechanisms 50 and 51. Moving bases 52 and 53 that are reciprocally conveyed, Y-direction conveying mechanisms 54 and 55 that are second feeding mechanisms disposed on the respective moving bases 52 and 53, and these Y-direction conveying mechanisms 54 and 55. Are provided with suction pads 56 and 57 which are holding members which are reciprocated along the Y direction and hold the substrate W by suction.

  As shown in FIG. 4, the X-direction transport mechanisms 50, 51 have a slider 58 attached to the back surface of the movable bases 52, 53. The slider 58 includes the exposure machine main body 2 and a pair of pre-alignment stands 3, 4. A pair of guide rails 60 installed in parallel along the X direction are straddled over a base member 59 provided on the sides of the base member 59 via rolling elements (not shown).

  Further, the X-direction transport mechanisms 50 and 51 employ a linear motor 61 as drive means, and the surface polarity is N poles on both side walls of a groove 59a formed in the approximate center of the base member 59 along the X direction. A plurality of permanent magnets 62 arranged so as to be alternately changed by poles, and armatures 63 attached to both side surfaces of the ridges 52a and 53a provided on the back surfaces of the moving bases 52 and 53 along the X direction; The suction pads 56 and 57 are reciprocally conveyed along the X direction via the movable bases 52 and 53 by controlling the current flowing through the armature 63. The driving means may be a ball screw mechanism instead of the linear motor 61.

  As shown in FIG. 5, the Y-direction transport mechanisms 54 and 55 are arranged in parallel to each other and can be driven independently of each other, and first and second ball screw mechanisms 64 that are first and second drive units. , 65 respectively. Each of the ball screw mechanisms 64 and 65 includes drive motors 64b and 65b that rotationally drive the screw shafts of the ball screws 64a and 65a, and the nuts 64c and 65c of the ball screws 64a and 65a are provided with suction pads via bearings 66. A support shaft 67 for rotatably supporting the end portions of 56 and 57 is provided. As a result, the Y-direction transport mechanisms 54 and 55 can move the suction pads 56 and 57 in the Y direction with respect to the moving bases 52 and 53 and in the θ direction around the normal direction perpendicular to the X direction and the Y direction. It can swing.

Further, as shown in FIG. 3, the plurality of frames 18 provided with the first levitation unit 15a are arranged on the main bed 23 installed on the ground via the level block 22 via another level block 24. ing. Further, the other frame 19 provided with the second levitation unit 15b is arranged via the other level block 27 on the sub beds 26a and 26b installed on the ground via the level block 25.
Therefore, on the main bed 23, the substrate W in the first and second substrate holding regions B1 and B2 provided on the upstream side and the downstream side of the exposure region A, which will be described later, and the exposure region A is floated and conveyed. The first levitation unit 15a, the plurality of mask holding units 11, and the plurality of irradiation units 13 are arranged. The first and second sub-beds 26a and 26b constituting the pre-alignment tables 3 and 4 are provided on the opposite side of the exposure area A with respect to the first and second substrate holding areas B1 and B2, respectively. Each second floating unit 15b for floatingly transporting the substrate W in the two substrate exchange areas C1 and C2 is disposed.

  The mask drive unit 12 is attached to a frame (not shown), and is attached to the X direction drive unit 31 that drives the mask holding unit 11 along the X direction, and the tip of the X direction drive unit 31. Is attached to the tip of the Y direction drive unit 32, and the mask holding unit 11 is rotationally driven in the θ direction (around the horizontal plane of the X and Y directions). A θ-direction drive unit 33 and a Z-direction drive unit 34 that is attached to the tip of the θ-direction drive unit 33 and drives the mask holding unit 11 in the Z direction (vertical direction of the horizontal plane composed of the X and Y directions). Accordingly, the mask holding unit 11 attached to the tip of the Z direction driving unit 34 can be driven in the X, Y, Z, and θ directions by the mask driving unit 12. Note that the order of arrangement of the X, Y, θ, and Z direction drive units 31, 32, 33, and 34 can be changed as appropriate.

  Further, as shown in FIG. 2, a plurality of mask holders 11 arranged along the Y direction are provided with mask changers 37 that can simultaneously replace the masks M of the respective mask holders 11. The used or unused mask M conveyed by the mask changer 37 is transferred to and from the mask stocker 10 by the mask loader 9. The mask M is pre-aligned by a mask pre-alignment mechanism (not shown) while the mask stocker 9 and the mask changer 37 are transferred.

  As shown in FIG. 3, a plurality of irradiation units 13 arranged on the upper part of each mask holding unit 11 includes a light source 41 such as a YAG laser or an excimer laser, and a concave mirror that collects the light emitted from the light source 41. 42, an optical integrator 43 having a mechanism movable in the optical path direction near the focal point of the concave mirror 42, a plane mirror 45 and a spherical mirror 46 for changing the direction of the optical path, and the plane mirror 45 and the optical integrator 43 And an exposure control shutter 44 disposed between them to control the opening and closing of the irradiation light path.

  The mask M held by the mask holding unit 11 exposes and transfers the mask pattern to the photoresist on the substrate W by irradiation with the exposure light EL. The mask M of this embodiment has two types of mask patterns 85. , 86 and long windows 87, 88, 89 having reference marks 87a, 88a, 89a for line cameras, which will be described later, located on the same line in the Y direction (see FIG. 6). The two types of mask patterns 85 and 86 are moved within the irradiation area of the exposure light EL from the irradiation unit 13 by moving the mask holding unit 11 by the mask driving unit 12. It is switched by being arranged. That is, at the time of exposure, the two types of mask patterns 85 and 86 are switched, and one of the mask patterns 85 and 86 becomes effective and is transferred to the substrate W by exposure.

  In the plurality of mask holders 11 arranged side by side in the Y direction, the interval G between adjacent mask patterns 85 used in the forward path, which will be described later, reciprocates with the width in the Y direction of the mask pattern 86 used in the backward path. It is set in consideration of the widths on both sides that are overlaid and exposed by the operation. However, the interval G between the mask patterns 85 and the width in the Y direction of the mask pattern 86 are set so as to minimize the amount of movement of the substrate W described later in the Y direction.

  A pair of line cameras 35 and 36, which are imaging means for detecting the relative position of the substrate W and the mask M, are arranged for each of the plurality of mask holding units 11 in the frame 18 arranged below each mask holding unit 11. ing. As shown in FIG. 7, the pair of line cameras 35, 36 are provided with windows 87, 88 or windows of the mask M on the upstream side and downstream side in the X direction with respect to any of the mask patterns 85, 86 of the mask M. The parts 88 and 89 are arranged so as to be observable. A pair of line cameras 35 and 36 having a known configuration is applied, and a reference pattern (in this embodiment, a black matrix reference line 101 shown in FIG. 10) formed in advance on the substrate W to be conveyed. The reference marks 87a, 88a, and 89a formed on the windows 87, 88, and 89 are captured in the same visual field, and a large number of light receiving elements that receive light are arranged in a straight line. In addition, a line CCD as a light receiving surface, and a condenser lens that forms an image of the reference line 101 of the substrate W and the reference marks 87a, 88a, and 89a on the line CCD are provided.

  In such a scanning exposure apparatus 1, the substrate W is levitated by the air flow of the exhaust air pad 20 and the intake / exhaust air pad 21 of the levitating units 15 a and 15 b, and one end of the substrate W is either the first or second substrate driving unit 16, 17. Is sucked and held, and conveyed in the X direction from the first or second substrate holding region B1, B2 to the exposure region A. In the exposure area A, the substrate W positioned below the mask holding unit 11 is irradiated with the exposure light EL from the irradiation unit 13 through the mask M, and the pattern of the mask M is applied to the substrate W. Transfer to the applied photoresist.

  During such a scanning exposure operation, the line cameras 35 and 36 provided for each of the plurality of mask holders 11 include the black matrix reference line 101 and the reference marks 87a and 88a of the mask M facing the line cameras 35 and 36, respectively. 89a is imaged simultaneously. For example, when the mask pattern 85 is an effective pattern, the substrate W is transported while being shifted in the θ direction, and a positional error between the substrate W and the mask M as shown in FIGS. 8A and 8C occurs. When the reference line 101 and the reference marks 87a and 88a are imaged by the two line cameras 35 and 36, the detected signal waveforms are as shown in FIGS. 8B and 8D. 101 is shifted from the reference marks 87a and 88a of the mask M.

  The amount of deviation (deviation) in the Y direction is calculated based on data captured by the downstream line camera 36 with respect to the mask pattern, and the control unit 8 drives each mask so that this amount of deviation is zero. Either the mask M or the substrate W is operated by operating the Y direction driving unit 32 of the unit 12 or by driving the first and second ball screw mechanisms 64 and 65 of the Y direction transport mechanisms 54 and 55 in synchronization. One side is moved in the Y direction, and the amount of deviation in the Y direction is corrected in real time.

  Further, the shift amount (deviation) in the θ direction is calculated based on data captured by the pair of line cameras 35 and 36, and the control unit 8 sets the shift amount to 0 so as to reduce the shift amount to 0 in FIG. As shown in FIG. 9, the θ direction driving unit 33 of each mask driving unit 12 is operated, or as shown in FIG. 9B, the first and second ball screw mechanisms of the Y direction transport mechanisms 54 and 55. By driving one of 64 and 65 relative to the other, either mask M or substrate W is moved in the θ direction, and the amount of deviation in the θ direction is corrected in real time.

  As a result, as shown in FIG. 10, the amount of deviation in the Y direction and the amount of deviation in the θ direction observed by the two line cameras 35 and 36 become substantially zero in the process of exposing the substrate W. On the other hand, when both corrections in the Y direction and the θ direction are not performed, the shift amounts of the line cameras 35 and 36 and the shift amount in the θ direction are large as shown in FIG. Further, when correction is performed only in the Y direction, as shown in FIG. 12, the amount of deviation of the line camera 35 is almost zero, but the amount of deviation of the line camera 36 is large and the amount of deviation in the θ direction is also large. .

  The θ direction correction means of the present invention is configured by the θ direction drive unit 33 of the mask drive unit 12 or the Y direction transport mechanisms 54 and 55, and the Y direction correction unit is the Y direction drive unit 32 of the mask drive unit 12. Alternatively, it is configured by Y-direction transport mechanisms 54 and 55.

  As schematically shown in FIG. 13, in the pair of pre-alignment tables 3 and 4 (FIG. 13 shows only the pre-alignment table 3) where the substrate W is carried in and out and pre-alignment is performed, it is in the Z direction. A plurality of substrate lift pins 70 that can advance and retreat, and a plurality of mechanical types that mechanically adjust the alignment of the substrate W by moving in the X direction or the Y direction while advancing and retreating in the Z direction and contacting the side surface of the substrate W. An alignment pin 71, a pair of optical alignment pins 72 that can move back and forth in the Z direction and suck the substrate W and move in the Y direction, and an optical alignment camera 73 that detects the position of the substrate W from below. Has been placed. The substrate lift pin 70, the mechanical alignment pin 71, the optical alignment pin 72, and the optical alignment camera 73 are disposed on the other frame 19 at positions that do not interfere with the exhaust air pad 20.

  Therefore, when the exposed substrate W is transported to each pre-alignment table 3, 4, first, the substrate W is levitated and supported by the air exhausted from the exhaust air pad 20. In this state, the substrate lift pin 70 is raised to a predetermined suction height, the substrate W is sucked by the substrate lift pin 70, and then the suction by the suction pad 56 of the first substrate driving unit 16 is released. Then, as shown in FIG. 13B, the substrate lift pin 70 is further raised to the substrate delivery position, the exposed substrate W is unloaded by the substrate transfer robot 5, and the unexposed substrate W is loaded. The substrate transfer robot 5 is a handling robot having two arms. The two arms are used simultaneously, and after the substrate W is unloaded from the pre-alignment table 3 by one arm, the other arm is The substrate W is carried into the pre-alignment table 3.

  Thereafter, in a state where exhaust of air by the exhaust air pad 20 is stopped, the substrate lift pin 70 on which the loaded substrate W is placed is lowered to a predetermined suction height, and then the suction of the substrate lift pin 70 is released. The substrate lift pin 70 is lowered with the substrate W placed thereon. In this state, the side surface of the substrate W becomes a height at which the substrate W can come into contact with the mechanical alignment pins 71, and alignment adjustment is performed by these pins 71.

Then, after completing the mechanical alignment adjustment, the alignment pins 71 are retracted from the substrate W, the optical alignment pins 72 are raised, and the optical alignment pins 72 suck the substrate W. Further, the exhaust of the air by the exhaust air pad 20 is started to float the substrate W, and the two optical alignment pins 72 are driven in the Y direction while looking at the substrate W with the optical alignment camera 73 to correct the θ direction. . Thereafter, the substrate W is sucked by the suction pad 56 of the first substrate driving unit 16, the optical alignment pin 72 is lowered, and the suction by the optical alignment pin 72 is released.
The first and second substrate driving units 16 and 17 may use the first and second ball screw mechanisms 64 and 65 instead of providing the optical alignment pins 72.

  Next, the operation of the scan exposure apparatus 1 configured as described above will be described using the flowchart of FIG. 14 and the operation explanatory diagram of FIG. In the flowchart of FIG. 14, the left flow shows a series of exposure operations for the substrate W carried in / out from the first substrate exchange region C1, and the right flow is carried in from the second substrate exchange region C2. A series of exposure operations for the substrate W ′ to be carried out is shown, and the left and right steps partitioned by a two-dot chain line indicate that they are operating within the same time.

  First, with the first substrate driving unit 16 moved to the first substrate exchange region C1 (step S1a), the substrate transfer robot 5 carries the substrate W into the first substrate exchange region C1 (step S2a). ). As described above, after the pre-alignment of the loaded substrate W is performed (step S3a), the substrate W is sucked and held by the suction pad 56 of the first substrate driving unit 16 (step S4a).

  Thereafter, the first substrate driving unit 16 is driven, and the substrate W is transported in the X direction at a constant speed in a state where it is supported by levitation by the air flow from the levitation units 15a and 15b. As shown, it moves to the first substrate holding region B1 (step S5a). At this time, the second substrate driving unit 17 moves to the second substrate replacement region C2 (step S1b).

  Further, the substrate W is transported in the X direction at a constant speed, and enters the exposure area A that is in close proximity to the mask M held by the mask holding unit 11 with the surface on which the mask patterns 85 and 86 are formed facing down. . Here, of the two types of mask patterns 85 and 86, the mask pattern 85 is disposed in the irradiation region of the exposure light EL from the irradiation unit 13, and the mask pattern 85 is effective.

  As shown in FIG. 15B, when the substrate W enters the exposure area A, the exposure light EL is irradiated from the irradiation unit 13 through the respective masks M, and the mask pattern 85 is exposed and transferred. Here, simultaneously with the exposure transfer of the mask pattern 85 to the substrate W, the line cameras 35 and 36 detect the relative positions of the substrate W and the mask M. Then, the mask drive unit 12 moves the mask holding unit 11 or the Y-direction transport mechanism 54 moves the substrate W according to a command signal output from the control unit based on the position data. The position error with the mask M is corrected in real time.

  By this exposure transfer, a plurality of substrates (six in the embodiment shown in FIG. 3) separated by a predetermined interval G in the Y direction are passed through the exposure region A and positioned in the second substrate holding region B2. A first transfer pattern 83 is formed (step S6a). A portion between adjacent first transfer patterns 83 is an unexposed portion.

  Next, after the first transfer pattern 83 is formed, in the second substrate holding region B2 that holds the substrate W beyond the exposure region A, as shown in FIG. The suction pad 56 that holds the substrate W is moved by a predetermined distance L in the Y direction with respect to the mask holding unit 11 by the Y-direction transport mechanism 54 (step S7a). Specifically, in the present embodiment in which the center positions in the Y direction of the mask patterns 85 and 86 coincide with each other, the predetermined distance L is the distance between the centers in the Y direction of the mask patterns 85 and 86 of the adjacent mask M. It is approximately half of D.

  Further, the mask holding unit 11 is moved by the mask driving unit 12 so that the mask pattern 86 is positioned within the irradiation region of the exposure light from the irradiation unit 13, and an effective mask pattern is changed from the mask pattern 85 to the mask pattern 86. Switch.

  In the first substrate driving unit 16, the X-direction transport mechanism 50 switches the transport direction of the substrate W to the direction opposite to the X direction, and the substrate W held in the second substrate holding region B2 is moved in the X direction. Transport in the opposite direction. When the substrate W enters the exposure area A, the line cameras 35 and 36 detect the relative positions of the substrate W and the mask M, and the mask driving unit 12 moves the mask holding unit 11 or the Y-direction transport mechanism 54. Moves the substrate W to correct the positional error between the substrate W and the mask M in real time. At the same time, the exposure light EL from the irradiation unit 13 is irradiated through the respective masks M, and the mask pattern 86 is exposed and transferred to the unexposed portions between the first transfer patterns 83 to be transferred to the second transfer pattern 84. Is formed (step S8a). At this time, since the width of the second transfer pattern 84 is slightly larger than the width of the unexposed portion, an overlapping portion is formed between the first transfer pattern 83 and the second transfer pattern 84, and the substrate W The mask patterns 85 and 86 are exposed and transferred onto the entire surface.

  During the exposure operation of the series of steps S6a to S8a, in the second substrate exchange region C2, the substrate W ′ is carried in (step S2b), the substrate W ′ is pre-aligned (step S3b), and the second substrate driving unit 17 is used. Is sucked and held by the suction pad 57 (step S4b).

  Then, as shown in FIG. 15E, the exposed substrate W held by the first substrate drive unit 16 moves from the first substrate holding region B1 to the first substrate replacement region C1 (step). At the same time, the unexposed substrate W ′ held by the second substrate driving unit 17 is moved to the second substrate holding region B2 at a speed faster than the speed during the exposure operation (step S5b). At the same time, the mask holding unit 11 is moved by the mask driving unit 12 so that the mask pattern 85 is positioned in the irradiation region of the exposure light from the irradiation unit 13, and an effective mask pattern is changed from the mask pattern 86 to the mask pattern 85. Switch.

  The substrate W carried in / out from the first exchange area C1 exposes the second transfer pattern 84 after exposing the first transfer pattern 83, while being carried in / out from the second exchange area C2. When the substrate W ′ exposes the first transfer pattern 83 after exposing the second transfer pattern 84, it is not necessary to perform the mask pattern switching operation.

  In the first substrate exchange region C1, unexposed substrate W is unloaded, unexposed substrate W is loaded (step S2a), unexposed substrate W is pre-aligned (step S3a), and unexposed substrate W is sucked and held. Done. Meanwhile, during this time, the substrate W ′ held by the second drive unit 51 is also exposed to the first transfer pattern 83 by the forward scanning exposure (step S6b) by the same exposure operation described above, and then The substrate W ′ held in the first substrate holding region B1 is moved in the Y direction (step S7b), and the second transfer pattern 84 is exposed by the scanning exposure (step S8b) in the backward path. . Thereafter, the same operation as described above is repeated.

  As described above, according to the scan exposure apparatus 1 and the scan exposure method of the present embodiment, the substrate W is arranged on the upstream side and the downstream side in the X direction with respect to the patterns 85 and 86 of the mask M and is transported. A pair of line cameras 35 and 36 for imaging the reference line 101 of the black matrix formed in advance and the reference marks 87a, 88a and 89a of the mask M, and the reference line 101 and the reference imaged simultaneously by the pair of line cameras 35 and 36 Based on the marks 87a, 88a, and 89a, the θ-direction drive unit 33 of the mask drive unit 12 or the Y-direction transport mechanism 54 as a θ-direction correction unit that corrects the relative shift amount between the mask M and the substrate W in the θ direction. , 55. Accordingly, the deviation in the θ direction can be corrected in real time during exposure by the θ direction drive unit 33 or the Y direction transport mechanisms 54 and 55, thereby improving the exposure accuracy.

  Further, according to the scan exposure apparatus 1 and the scan exposure method, the reference line 101 imaged by the line camera 36 disposed on the downstream side with respect to the mask patterns 85 and 86 and the reference marks 87a and 88a facing the line camera 36. Is provided with the Y-direction drive unit 32 of the mask drive unit 12 or the Y-direction transport mechanisms 54 and 55 as Y-direction correction means for correcting the relative displacement between the mask M and the substrate W in the Y-direction. Therefore, the amount of deviation in the Y direction can be corrected in real time during exposure by the Y direction driving unit 32 or the Y direction transport mechanisms 54 and 55, and the exposure accuracy can be further improved.

  In the present embodiment, the pre-alignment tables 3 and 4 are arranged in the substrate replacement areas C1 and C2, and the loading / unloading of the substrate W and the pre-alignment are performed at the same position, but as shown in FIG. Alternatively, the substrate exchanging units 80 and 81 may be provided separately from the pre-alignment tables 3 and 4, and the substrate loading / unloading and pre-alignment may be performed at different positions.

  Alternatively, a pre-alignment mechanism may be provided in each of the first and second substrate holding regions, and the substrate may be loaded and unloaded while performing the pre-alignment and exposure operations.

  Furthermore, in this embodiment, the predetermined distance L at which the plurality of masks M and the substrate W move in the orthogonal direction when switching from the forward transfer to the return transfer is the Y direction of the mask patterns 85 and 86 of the adjacent mask M. However, it may be approximately ３ or ¼ of the center-to-center distance D as long as the relationship between cost and tact is provided.

(Second Embodiment)
Next, a scan exposure apparatus 1a according to a second embodiment of the present invention will be described with reference to FIG. Note that portions that are the same as or equivalent to those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  In the scan exposure apparatus 1a of the present embodiment, a plurality of mask holders 11 are arranged in a staggered manner in the Y direction. Further, the substrate W is transported and exposed only from one direction in the X direction, and the substrate transport mechanism 14 includes one substrate driving unit 16. In the first embodiment, a linear motor is applied as the X-direction transport mechanism. However, in the drive unit 16 of the present embodiment, a ball screw mechanism is applied as the X-direction transport mechanism 50, and the ball screw 90. Is driven to rotate by the drive motor 91, so that a nut (not shown) provided on the back surface of the moving base 52 is conveyed via a rolling element (not shown).

  Similarly to the first embodiment, the scan exposure apparatus 1a of the present embodiment also includes a pair of line cameras 35 and 36, which are formed on both sides of the reference pattern of the substrate W and the mask patterns 85 and 86 in the X direction. The reference marks 87a and 88a of the window portions 87 and 88 are imaged and corrected by the θ direction correction unit and the Y direction correction unit, thereby correcting the deviation amount in the θ direction and the Y direction in real time during exposure, The exposure accuracy can be improved.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably.

  In the present embodiment, a handling robot having two arms is used as the substrate transfer robot. However, other transfer methods such as a conveyor and a mechanism driven by flying air may be used.

  Further, in the present embodiment, the substrate transport mechanism 14 has been described with respect to the case where the substrate W is floated and held by the floating units 15a and 15b and the first and second substrate drive units 16 and 17, but this is described. However, the substrate W may be held and transported while being placed on the upper surface.

It is a top view of the scanning exposure apparatus which is one Embodiment of this invention. FIG. 2 is an enlarged plan view of the scan exposure apparatus in FIG. 1. FIG. 3 is an enlarged front view of the scanning exposure apparatus in FIG. 2. It is an expanded sectional view of an X direction conveyance mechanism. (A) is a top view of a Y direction conveyance mechanism, (b) is an expanded sectional view of a ball screw mechanism. It is a top view of a mask. It is a side view which shows the state which has imaged the reference value of a mask and a board | substrate with a pair of line camera. (A) is an image schematic diagram of the mask and substrate reference values imaged by the upstream line camera with respect to the pattern, (b) is its signal waveform, and (c) is the pattern. FIG. 5 is a schematic image of mask and substrate reference values captured by a downstream line camera, and FIG. (A) is a top view showing a case where the θ direction driving unit is driven as the θ direction correcting means, and (b) is a top view showing a case where the Y direction transport mechanism is driven as the θ direction correcting means. (A) is a graph which shows the deviation | shift amount of a line camera in the case of performing Y direction and (theta) direction correction | amendment of this embodiment, (b) is a graph which shows the (theta) component calculated from each deviation | shift amount. (A) is a graph which shows the deviation | shift amount with respect to the ideal target value of a line camera when not correcting Y direction and (theta) direction, (b) is a graph which shows the (theta) component calculated from each deviation | shift amount. . (A) is a graph which shows the deviation | shift amount of a line camera in the case of performing only to a Y direction, (b) is a graph which shows the (theta) component calculated from each deviation | shift amount. (A) is a top view which shows typically the 1st pre-alignment stand at the time of board | substrate carrying in / out, (b) is a side view of the pre-alignment stand at the time of board carrying in / out, (c) FIG. 4 is a side view of the pre-alignment table in a state where the substrate is sucked and held. It is a flowchart which shows the exposure operation | movement of the board | substrate carried in / out of a 1st exchange area, and the exposure operation of the board | substrate carried in / out of a 2nd exchange area. It is operation | movement explanatory drawing of the board | substrate carried in from a 1st exchange area, and the board | substrate carried in from a 2nd exchange area. It is a top view of the scanning exposure apparatus which concerns on the modification of 1st Embodiment. It is a top view of the scanning exposure apparatus which concerns on 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a Scan exposure apparatus 3,4 Pre-alignment stand 10 Substrate conveyance mechanism 11 Mask holding part 13 Irradiation part 16 1st board | substrate drive unit 17 2nd board | substrate drive unit 32 Y direction drive part 33 (theta) direction drive parts 35 and 36 Line camera (imaging means)
50, 51 X direction transport mechanism 54, 55 Y direction transport mechanism (θ direction correction means, Y direction correction means)
64 First ball screw mechanism (first drive shaft)
65 Second ball screw mechanism (second drive shaft)
83 First transfer pattern 84 Second transfer pattern 85, 86 Mask patterns 87a, 88a, 89a Reference mark A Exposure area B1 First substrate holding area B2 Second substrate holding area C1 First substrate exchange area C2 2 substrate exchange area L predetermined distance M mask W substrate

Claims (6)

A substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
A scanning exposure apparatus that irradiates the substrate to be conveyed with the exposure light through the plurality of masks and exposes the pattern of each mask on the substrate,
A pair of imaging means which are arranged upstream and downstream in the predetermined direction with respect to the pattern of the mask, and which image a reference pattern formed in advance on the substrate to be transported and a reference mark of the mask;
Based on the reference pattern and the reference mark simultaneously imaged by the pair of imaging means, the relative deviation amount between the mask and the substrate in the θ direction around the normal line perpendicular to the predetermined direction and the orthogonal direction is calculated. Θ direction correcting means for correcting;
A scan exposure apparatus, further comprising:   The θ direction correction means includes first and second driving units that are arranged in parallel to each other and can be driven independently of each other, and can move the substrate in the orthogonal direction and swing in the θ direction. The scan exposure apparatus according to claim 1, comprising a movable Y-direction transport mechanism of the substrate transport mechanism.   The scan exposure apparatus according to claim 1, wherein the θ-direction correcting unit is configured by a θ-direction driving unit capable of rotating the mask holding unit in the θ direction.   Y direction correcting means for correcting a relative shift amount between the mask and the substrate in the orthogonal direction based on the reference pattern and the reference mark imaged by the downstream imaging means, The scan exposure apparatus according to claim 1. A substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
A pair of imaging means which are arranged upstream and downstream in the predetermined direction with respect to the pattern of the mask, and which images a reference pattern formed in advance on the substrate to be conveyed;
Based on the reference pattern imaged simultaneously by the pair of imaging means and the reference mark of the mask, the relative relationship between the mask and the substrate in the θ direction around the normal direction perpendicular to the predetermined direction and the orthogonal direction. Θ direction correction means for correcting the amount of deviation;
A scan exposure method of a scan exposure apparatus comprising:
Irradiating the substrate to be conveyed with the exposure light through the plurality of masks, and exposing the pattern of each mask on the substrate;
Calculating a relative shift amount between the mask and the substrate in the θ direction based on the reference pattern and the reference mark simultaneously imaged by the pair of imaging means;
Driving one of the mask and the substrate in the θ direction by the θ direction correcting means to correct a shift amount in the θ direction;
The scan exposure method is characterized in that the calculation step and the correction step are performed in real time in the exposure step. The scan exposure apparatus includes a Y direction correction unit that corrects a relative shift amount between the mask and the substrate in the orthogonal direction based on a reference pattern and a reference mark imaged by the downstream imaging unit. In addition,
The calculation step further calculates a relative shift amount between the mask and the substrate in the orthogonal direction based on a reference pattern and a reference mark imaged by the downstream imaging unit,
6. The correction process according to claim 5, wherein the correction step further corrects the shift amount in the orthogonal direction by driving one of the mask and the substrate in the orthogonal direction by the Y-direction correction unit. Scan exposure method.

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