JP5254073B2 - Scan exposure apparatus and substrate transfer method for scan exposure apparatus - Google Patents

Description

  The present invention relates to a scan exposure apparatus and a substrate transport method of the scan exposure apparatus. More specifically, the present invention is suitable for exposing and transferring a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display. The present invention relates to a scan exposure apparatus and a substrate transport method of the scan exposure apparatus.

  Large flat panel displays such as liquid crystal displays and plasma displays used for large thin televisions and the like are manufactured by proximity exposure transfer of a mask pattern onto a substrate by a division sequential exposure method. As this type of divided sequential exposure method, for example, a mask having the same size as the panel is used, the mask is held by a mask stage, the substrate is held by a work stage, and both are placed close to each other. Each time the work stage is moved stepwise relative to the mask, the substrate is irradiated with light for pattern exposure from the mask side, and a plurality of mask patterns are exposed and transferred onto the substrate.

  As another exposure method, a scan exposure method is known in which a mask is subdivided, a plurality of mask holding portions for holding these masks are arranged in a staggered manner, and exposure is performed while moving the substrate in one direction. (For example, refer to Patent Document 1). This exposure method utilizes the fact that a large pattern can be formed by joining together on the premise that there is a portion that is repeated to some extent in the pattern formed on the substrate. In this case, the mask does not need to be large in accordance with the panel, and a relatively inexpensive mask can be used.

  In the scan exposure method, the amount of deviation in the direction orthogonal to the substrate transport direction is detected by observing the reference line of the substrate on which the black matrix is formed by the line sensor, and a mask is applied corresponding to this amount of deviation. The correction operation is performed by moving it (see, for example, Patent Document 2).

JP 2007-57991 A JP 2006-292955 A

  By the way, in the scan exposure apparatus described in Patent Document 2, it is possible to correct the shift amount in the orthogonal direction, but the θ direction around the normal line perpendicular to both the transport direction and the orthogonal direction is generated by the substrate transport mechanism. The amount of deviation is not corrected. For this reason, the shift amount in the θ direction depends on the accuracy as in the substrate transport mechanism, and when the mask pattern is complicated, the shift amount in the θ direction is directly used as the exposure accuracy.

  Also, in recent years, due to the increase in size of the substrate accompanying the increase in size of the substrate and the application to twin stages, the transfer distance by the substrate transfer mechanism has become longer, and it is difficult to maintain accuracy through mechanical adjustment alone. is there.

  The present invention has been made in view of the above-described problems, and an object thereof is to improve the exposure accuracy by correcting the shift amount in the θ direction without depending only on the accuracy as the substrate transport mechanism. An object of the present invention is to provide a scan exposure apparatus and a substrate transport method for the scan exposure apparatus.

The above object of the present invention can be achieved by the following constitution.
(1) a substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
A scanning exposure apparatus that irradiates the substrate to be conveyed with the exposure light through the plurality of masks and exposes the pattern of each mask on the substrate,
The substrate transport mechanism includes a holding member that holds the substrate, a first feed mechanism that transports the holding member in the predetermined direction, and a first feed mechanism that is arranged in parallel to each other and can be driven independently of each other. A second feed that includes first and second drive units and is capable of moving the holding member in the orthogonal direction and swingable in the θ direction around the normal direction perpendicular to the predetermined direction and the orthogonal direction; Mechanism,
A scanning exposure apparatus comprising:
(2) When the first feeding mechanism moves in the predetermined direction, the first and second of the second feeding mechanism are offset so as to cancel out the shift amount in the θ direction of the first feeding mechanism. The scan exposure apparatus according to (1), further comprising a control unit that relatively displaces the drive unit.
(3) The second feed mechanism of the substrate transport mechanism includes a linear motion guide unit that guides the movement of the support plate to which the first and second drive units are attached in the orthogonal direction. The scan exposure apparatus according to (1) or (2).
(4) The substrate transport mechanism is provided with a substrate support member that holds the substrate on the substrate side with respect to the moving region of the holding member in the orthogonal direction. (1) to (3) The scan exposure apparatus according to any one of the above.
(5) a substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
The substrate transport mechanism is disposed parallel to each other and driven independently from each other, a holding member that holds the substrate, a first feeding mechanism that transports the holding member in the predetermined direction, and A first and second drive unit capable of moving the holding member in the orthogonal direction and swingable in a θ direction around a normal line perpendicular to the predetermined direction and the orthogonal direction; Substrate transport of a scanning exposure apparatus that has a feed mechanism of 2 and irradiates the substrate to be transported with the exposure light through the plurality of masks to expose the pattern of each mask on the substrate A method,
Measuring the amount of deviation in the θ direction of the first feed mechanism when the first feed mechanism moves in the predetermined direction;
Including a relative positional relationship between the first and second drive units of the second feed mechanism in which the shift amount is less than or equal to an allowable value when the first feed mechanism moves in the predetermined direction. Creating a correction table;
Driving the first and second drive units of the second feed mechanism based on the correction table;
A substrate transport method for a scan exposure apparatus, comprising:
(6) The substrate transport method for a scanning exposure apparatus according to (5), wherein the correction table includes mechanical relative position errors of the first and second driving units.

According to the scanning exposure apparatus of the present invention, the substrate transport mechanism is arranged in parallel with each other, the holding member for holding the substrate, the first feeding mechanism for transporting the holding member in a predetermined direction, and independent of each other. The first and second drive units that can be driven are provided, the holding member can be moved in the orthogonal direction, and can swing in a predetermined direction and a θ direction around a normal line perpendicular to the orthogonal direction. Therefore, the exposure accuracy can be improved by correcting the shift amount in the θ direction without depending only on the accuracy as in the substrate transport mechanism.

  Further, according to the substrate transport method of the scan exposure apparatus of the present invention, the step of measuring the amount of deviation in the θ direction of the first feed mechanism when the first feed mechanism moves in a predetermined direction has the above-described configuration. And a correction table including a relative positional relationship between the first and second drive units of the second feed mechanism, in which the amount of deviation when the first feed mechanism moves in a predetermined direction is equal to or less than an allowable value. And the step of driving the first and second drive portions of the second feed mechanism based on the correction table, so that θ is not dependent on only the accuracy as in the substrate transport mechanism. It is possible to improve the exposure accuracy by correcting the amount of deviation in the direction.

It is a top view of the scanning exposure apparatus which is one Embodiment of this invention. FIG. 2 is an enlarged plan view of the scan exposure apparatus in FIG. 1. FIG. 3 is an enlarged front view of the scanning exposure apparatus in FIG. 2. It is an expanded sectional view of an X direction conveyance mechanism. (A) is a top view of a Y direction conveyance mechanism, (b) is an expanded sectional view of a ball screw mechanism. (A) is a top view which shows typically the 1st pre-alignment stand at the time of board | substrate carrying in / out, (b) is a side view of the pre-alignment stand at the time of board carrying in / out, (c) FIG. 4 is a side view of the pre-alignment table in a state where the substrate is sucked and held. It is a flowchart which shows the exposure operation | movement of the board | substrate carried in / out of a 1st exchange area, and the exposure operation of the board | substrate carried in / out of a 2nd exchange area. It is operation | movement explanatory drawing of the board | substrate carried in from a 1st exchange area, and the board | substrate carried in from a 2nd exchange area. (A) is a graph which shows the yawing component measured with the measuring instrument in each position of a board | substrate conveyance direction, (b) is with respect to the 1st ball screw mechanism in each position of a board | substrate conveyance direction. 6 is a graph showing the relative shift amount of the second ball screw mechanism. It is a graph which shows the positional relationship of the 2nd ball screw mechanism to the stroke of the 1st ball screw mechanism. It is a graph which shows the result of having measured the amount of shift of the Y direction in each position of a substrate conveyance direction. It is a top view of the scanning exposure apparatus which concerns on the modification of 1st Embodiment. It is a top view which shows the board | substrate conveyance mechanism which concerns on 2nd Embodiment. (A) is sectional drawing along the XIV-XIV line of FIG. 13, (b) is sectional drawing along the XIV'-XIV 'line of FIG. FIG. 10 is a top view of the substrate transport mechanism when the substrate W is located near the intake / exhaust air pad, showing the substrate transport mechanism according to the third embodiment. It is sectional drawing along the XVI-XVI line of FIG. It is a top view of the substrate transport mechanism when the substrate W is pulled in the Y direction. It is sectional drawing along the XVIII-XVIII line of FIG. It is a top view of the scan exposure apparatus which concerns on 4th Embodiment of this invention.

  Hereinafter, embodiments of a scanning exposure apparatus and a substrate transport method of the scanning exposure apparatus according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, the configuration of the scan exposure apparatus 1 of the present embodiment will be schematically described. As shown in FIG. 1, the scan exposure apparatus 1 of the present embodiment is located on both sides of the exposure machine main body 2 that exposes the substrate W while the substrate W is levitated and transported, and on both sides of the exposure machine main body 2 in the transport direction. And a pair of substrate transfer robots 5 that carry in and out the substrate W between the pre-alignment tables 3 and 4 and a substrate stocker (not shown). , 6 and the distribution board 7 positioned between the substrate transfer robots 5 and 6 and the exposure apparatus body 2 on the opposite side of the distribution board 7 to operate and control the movement of each operating part of the scanning exposure apparatus 1. A control unit 8 also serving as an operation panel, a mask transfer robot 9, and a mask stocker 10.

  As shown in FIGS. 2 and 3, the exposure machine main body 2 floats and supports the substrate W, and transports the substrate W in the X direction which is a predetermined direction and the Y direction which is a direction orthogonal to the predetermined direction. The transport mechanism 14, a plurality of (six in the embodiment shown in FIG. 1) mask holders 11, which are arranged side by side along the Y direction, respectively, and drive the mask holders 11, respectively. A plurality of mask driving units 12 and a plurality of irradiation units 13 that are respectively disposed on the top of the plurality of mask holding units 11 and irradiate exposure light.

  The substrate transport mechanism 14 holds the floating units 15a and 15b and one side of the substrate W in the Y direction (upper side in FIG. 1), can transport in the X direction, and can move in the Y direction. Drive units 16 and 17 are provided. The levitation units 15a and 15b include a plurality of exhaust air pads 20 and intake / exhaust air pads 21 provided on a plurality of frames 18 and 19, respectively, and are exhausted via a pump (not shown) and a solenoid valve (not shown). Air is exhausted from the air pad 20 or the intake / exhaust air pad 21 or is sucked or exhausted. Thereby, the substrate W is held in a state of being floated by the air flow on the floating units 15a and 15b, and the substrate W can be transported without resistance.

  As shown in FIG. 2, the first and second substrate driving units 16 and 17 are arranged in the X direction by the X-direction transport mechanisms 50 and 51 that are first feed mechanisms and the X-direction transport mechanisms 50 and 51. Moving bases 52 and 53 that are reciprocally conveyed, Y-direction conveying mechanisms 54 and 55 that are second feeding mechanisms disposed on the respective moving bases 52 and 53, and these Y-direction conveying mechanisms 54 and 55. Are provided with suction pads 56 and 57 which are holding members which are reciprocated along the Y direction and hold the substrate W by suction.

  As shown in FIG. 4, the X-direction transport mechanisms 50, 51 have a slider 58 attached to the back surface of the movable bases 52, 53. The slider 58 includes the exposure machine main body 2 and a pair of pre-alignment stands 3, 4. A pair of guide rails 60 installed in parallel along the X direction are straddled over a base member 59 provided on the sides of the base member 59 via rolling elements (not shown).

  Further, the X-direction transport mechanisms 50 and 51 employ a linear motor 61 as drive means, and the surface polarity is N poles on both side walls of a groove 59a formed in the approximate center of the base member 59 along the X direction. A plurality of permanent magnets 62 arranged so as to be alternately changed by poles, and armatures 63 attached to both side surfaces of the ridges 52a and 53a provided on the back surfaces of the moving bases 52 and 53 along the X direction; The suction pads 56 and 57 are reciprocally conveyed along the X direction via the movable bases 52 and 53 by controlling the current flowing through the armature 63. The driving means may be a ball screw mechanism instead of the linear motor 61.

  As shown in FIG. 5, the Y-direction transport mechanisms 54 and 55 are arranged in parallel to each other and can be driven independently of each other, and first and second ball screw mechanisms 64 that are first and second drive units. , 65 respectively. Each of the ball screw mechanisms 64 and 65 includes drive motors 64b and 65b that rotationally drive the screw shafts of the ball screws 64a and 65a, and the nuts 64c and 65c of the ball screws 64a and 65a are provided with suction pads via bearings 66. A support shaft 67 for rotatably supporting the end portions of 56 and 57 is provided. As a result, the Y-direction transport mechanisms 54 and 55 can move the suction pads 56 and 57 in the Y direction with respect to the moving bases 52 and 53 and in the θ direction around the normal direction perpendicular to the X direction and the Y direction. It can swing.

Further, as shown in FIG. 3, the plurality of frames 18 provided with the first levitation unit 15a are arranged on the main bed 23 installed on the ground via the level block 22 via another level block 24. ing. Further, the other frame 19 provided with the second levitation unit 15b is arranged via the other level block 27 on the sub beds 26a and 26b installed on the ground via the level block 25.
Therefore, on the main bed 23, the substrate W in the first and second substrate holding regions B1 and B2 provided on the upstream side and the downstream side of the exposure region A, which will be described later, and the exposure region A is floated and conveyed. The first levitation unit 15a, the plurality of mask holding units 11, and the plurality of irradiation units 13 are arranged. The first and second sub-beds 26a and 26b constituting the pre-alignment tables 3 and 4 are provided on the opposite side of the exposure area A with respect to the first and second substrate holding areas B1 and B2, respectively. Each second floating unit 15b for floatingly transporting the substrate W in the two substrate exchange areas C1 and C2 is disposed.

  The mask drive unit 12 is attached to a frame (not shown), and is attached to the X direction drive unit 31 that drives the mask holding unit 11 along the X direction, and the tip of the X direction drive unit 31. Is attached to the tip of the Y direction drive unit 32, and the mask holding unit 11 is rotationally driven in the θ direction (around the horizontal plane of the X and Y directions). A θ-direction drive unit 33 and a Z-direction drive unit 34 that is attached to the tip of the θ-direction drive unit 33 and drives the mask holding unit 11 in the Z direction (vertical direction of the horizontal plane composed of the X and Y directions). Accordingly, the mask holding unit 11 attached to the tip of the Z direction driving unit 34 can be driven in the X, Y, Z, and θ directions by the mask driving unit 12. Note that the order of arrangement of the X, Y, θ, and Z direction drive units 31, 32, 33, and 34 can be changed as appropriate.

  Further, as shown in FIG. 2, a plurality of mask holders 11 arranged along the Y direction are provided with mask changers 37 that can simultaneously replace the masks M of the respective mask holders 11. The used or unused mask M conveyed by the mask changer 37 is transferred to and from the mask stocker 10 by the mask loader 9. The mask M is pre-aligned by a mask pre-alignment mechanism (not shown) while the mask stocker 9 and the mask changer 37 are transferred.

  As shown in FIG. 3, a plurality of irradiation units 13 arranged on the upper part of each mask holding unit 11 includes a light source 41 such as a YAG laser or an excimer laser, and a concave mirror that collects the light emitted from the light source 41. 42, an optical integrator 43 having a mechanism movable in the optical path direction near the focal point of the concave mirror 42, a plane mirror 45 and a spherical mirror 46 for changing the direction of the optical path, and the plane mirror 45 and the optical integrator 43 And an exposure control shutter 44 disposed between them to control the opening and closing of the irradiation light path.

  The mask M held by the mask holding unit 11 exposes and transfers the mask pattern to the photoresist on the substrate W by irradiation with the exposure light EL. The mask M of this embodiment has two types of mask patterns 85. , 86 (see FIG. 8). The two types of mask patterns 85 and 86 are moved within the irradiation area of the exposure light EL from the irradiation unit 13 by moving the mask holding unit 11 by the mask driving unit 12. It is switched by being arranged. That is, at the time of exposure, the two types of mask patterns 85 and 86 are switched, and one of the mask patterns 85 and 86 becomes effective and is transferred to the substrate W by exposure.

  In the plurality of mask holders 11 arranged side by side in the Y direction, the interval G between adjacent mask patterns 85 used in the forward path, which will be described later, reciprocates with the width in the Y direction of the mask pattern 86 used in the backward path. It is set in consideration of the widths on both sides that are overlaid and exposed by the operation. However, the interval G between the mask patterns 85 and the width in the Y direction of the mask pattern 86 are set so as to minimize the amount of movement of the substrate W described later in the Y direction.

  In the frame 18 disposed below the mask holding unit 11, a plurality of imaging units 35 that are detection units that detect the relative positions of the substrate W and the mask M are arranged for each of the plurality of mask holding units 11. The imaging means 35 is guided by a movement guide shaft 36 disposed along the X direction and is movable in the X direction, and is driven by a driving device (not shown) that operates based on a command from the control unit 8. The mask M moves between the first detection position SP1 on the upstream side in the transport direction of the substrate W and the second detection position SP2 on the downstream side in the transport direction of the substrate W.

  In such a scanning exposure apparatus 1, the substrate W is levitated by the air flow of the exhaust air pad 20 and the intake / exhaust air pad 21 of the levitating units 15 a and 15 b, and one end of the substrate W is either the first or second substrate driving unit 16, 17. Is sucked and held, and conveyed in the X direction from the first or second substrate holding region B1, B2 to the exposure region A. In the exposure area A, the substrate W positioned below the mask holding unit 11 is irradiated with the exposure light EL from the irradiation unit 13 through the mask M, and the pattern of the mask M is applied to the substrate W. Transfer to the applied photoresist. At this time, the position error between the substrate W and the mask M is a command signal output from the control unit based on the position data of the substrate W and the mask M detected by the imaging means 35 provided for each of the plurality of mask holding units 11. Thus, the θ-direction drive unit 33 and the Y-direction drive unit 32 are operated to finely adjust the position of the mask M (correction).

  Further, as schematically shown in FIG. 6, in the pair of pre-alignment tables 3 and 4 (FIG. 6 shows only the pre-alignment table 3) where the substrate W is carried in / out and pre-alignment is performed, the Z-direction. A plurality of substrate lift pins 70 that can advance and retreat, and a plurality of mechanical types that mechanically adjust the alignment of the substrate W by moving in the X direction or the Y direction while advancing and retreating in the Z direction and contacting the side surface of the substrate W. An alignment pin 71, a pair of optical alignment pins 72 that can move back and forth in the Z direction and suck the substrate W and move in the Y direction, and an optical alignment camera 73 that detects the position of the substrate W from below. Has been placed. The substrate lift pin 70, the mechanical alignment pin 71, the optical alignment pin 72, and the optical alignment camera 73 are disposed on the other frame 19 at positions that do not interfere with the exhaust air pad 20.

  Therefore, when the exposed substrate W is transported to each pre-alignment table 3, 4, first, the substrate W is levitated and supported by the air exhausted from the exhaust air pad 20. In this state, the substrate lift pin 70 is raised to a predetermined suction height, the substrate W is sucked by the substrate lift pin 70, and then the suction by the suction pad 56 of the first substrate driving unit 16 is released. Then, as shown in FIG. 6B, the substrate lift pin 70 is further raised to the substrate delivery position, the exposed substrate W is unloaded by the substrate transfer robot 5, and the unexposed substrate W is loaded. The substrate transfer robot 5 is a handling robot having two arms. The two arms are used simultaneously, and after the substrate W is unloaded from the pre-alignment table 3 by one arm, the other arm is The substrate W is carried into the pre-alignment table 3.

  Thereafter, in a state where exhaust of air by the exhaust air pad 20 is stopped, the substrate lift pin 70 on which the loaded substrate W is placed is lowered to a predetermined suction height, and then the suction of the substrate lift pin 70 is released. The substrate lift pin 70 is lowered with the substrate W placed thereon. In this state, the side surface of the substrate W becomes a height at which the substrate W can come into contact with the mechanical alignment pins 71, and alignment adjustment is performed by these pins 71.

Then, after completing the mechanical alignment adjustment, the alignment pins 71 are retracted from the substrate W, the optical alignment pins 72 are raised, and the optical alignment pins 72 suck the substrate W. Further, the exhaust of the air by the exhaust air pad 20 is started to float the substrate W, and the two optical alignment pins 72 are driven in the Y direction while looking at the substrate W with the optical alignment camera 73 to correct the θ direction. . Thereafter, the substrate W is sucked by the suction pad 56 of the first substrate driving unit 16, the optical alignment pin 72 is lowered, and the suction by the optical alignment pin 72 is released.
The first and second substrate driving units 16 and 17 may use the first and second ball screw mechanisms 64 and 65 instead of providing the optical alignment pins 72.

  Next, the operation of the scan exposure apparatus 1 configured as described above will be described with reference to the flowchart of FIG. 7 and the operation explanatory diagram of FIG. In the flowchart of FIG. 7, the left flow shows a series of exposure operations of the substrate W carried in / out from the first substrate exchange region C1, and the right flow is carried in from the second substrate exchange region C2. A series of exposure operations for the substrate W ′ to be carried out is shown, and the left and right steps partitioned by a two-dot chain line indicate that they are operating within the same time.

  First, with the first substrate driving unit 16 moved to the first substrate exchange region C1 (step S1a), the substrate transfer robot 5 carries the substrate W into the first substrate exchange region C1 (step S2a). ). As described above, after the pre-alignment of the loaded substrate W is performed (step S3a), the substrate W is sucked and held by the suction pad 56 of the first substrate driving unit 16 (step S4a).

  Thereafter, the first substrate driving unit 16 is driven, and the substrate W is transported in the X direction at a constant speed in a state where it is supported by levitation by the air flow from the levitation units 15a and 15b. As shown, it moves to the first substrate holding region B1 (step S5a). At this time, the second substrate driving unit 17 moves to the second substrate replacement region C2 (step S1b).

  Further, the substrate W is transported in the X direction at a constant speed, and enters the exposure area A that is in close proximity to the mask M held by the mask holding unit 11 with the surface on which the mask patterns 85 and 86 are formed facing down. . Here, of the two types of mask patterns 85 and 86, the mask pattern 85 is disposed in the irradiation region of the exposure light EL from the irradiation unit 13, and the mask pattern 85 is effective. Further, the imaging unit 35 is located at the first detection position SP1 that is upstream of the mask holding unit 11 in the transport direction of the substrate W.

  As shown in FIG. 8B, when the substrate W transported in the X direction by the first substrate driving unit 16 reaches the first detection position SP1, the imaging means 35 determines the relative position between the substrate W and the mask M. Prior to the exposure transfer of the mask pattern 85 to the substrate W, the mask driving unit 12 is actuated by the command signal output from the control unit based on this position data to move the mask holding unit 11. The position error between the substrate W and the mask M is corrected.

  The substrate W transported with the corrected position error is irradiated with the exposure light EL from the irradiation unit 13 through the respective masks M, and the mask pattern 85 is exposed and transferred. As a result, a plurality (six in the embodiment shown in FIG. 3) of the first W separated by a predetermined interval G in the Y direction is passed through the exposure region A and positioned in the second substrate holding region B2. The transfer pattern 83 is formed (step S6a). A portion between adjacent first transfer patterns 83 is an unexposed portion.

  Next, after the first transfer pattern 83 is formed, in the second substrate holding region B2 that holds the substrate W beyond the exposure region A, as shown in FIG. The suction pad 56 that holds the substrate W is moved by a predetermined distance L in the Y direction with respect to the mask holding unit 11 by the Y-direction transport mechanism 54 (step S7a). Specifically, in the present embodiment in which the center positions in the Y direction of the mask patterns 85 and 86 coincide with each other, the predetermined distance L is the distance between the centers in the Y direction of the mask patterns 85 and 86 of the adjacent mask M. It is approximately half of D.

  At the same time, a driving device (not shown) is operated to move the imaging means 35 from the first detection position SP1 to the second detection position SP2. Thereby, in both the forward transfer and the return transfer of the substrate W, the relative relationship between the substrate W and the mask M before the substrate W is positioned below the mask M, that is, prior to the exposure transfer of the mask pattern. The position error can be corrected by detecting the position.

  Further, the mask holding unit 11 is moved by the mask driving unit 12 so that the mask pattern 86 is positioned within the irradiation region of the exposure light from the irradiation unit 13, and an effective mask pattern is changed from the mask pattern 85 to the mask pattern 86. Switch.

  In the first substrate driving unit 16, the X-direction transport mechanism 50 switches the transport direction of the substrate W to the direction opposite to the X direction, and the substrate W held in the second substrate holding region B2 is moved in the X direction. Transport in the opposite direction. When the substrate W reaches the second detection position SP2, the imaging unit 35 detects the relative position between the substrate W and the mask M, and the mask driving unit 12 moves the mask holding unit 11 to move the substrate W and the mask M. Correct the position error. Then, the exposure light EL from the irradiation unit 13 is irradiated through the respective masks M, and the mask pattern 86 is exposed and transferred to the unexposed portions between the first transfer patterns 83 to be transferred to the second transfer pattern 84. Is formed (step S8a). At this time, since the width of the second transfer pattern 84 is slightly larger than the width of the unexposed portion, an overlapping portion is formed between the first transfer pattern 83 and the second transfer pattern 84, and the substrate W The mask patterns 85 and 86 are exposed and transferred onto the entire surface.

  During the exposure operation of the series of steps S6a to S8a, in the second substrate exchange region C2, the substrate W ′ is carried in (step S2b), the substrate W ′ is pre-aligned (step S3b), and the second substrate driving unit 17 is used. Is sucked and held by the suction pad 57 (step S4b).

  Then, as shown in FIG. 8E, the exposed substrate W held by the first substrate driving unit 16 moves from the first substrate holding region B1 to the first substrate replacement region C1 (Step S1). At the same time, the unexposed substrate W ′ held by the second substrate driving unit 17 is moved to the second substrate holding region B2 at a speed faster than the speed during the exposure operation (step S5b). At the same time, the mask holding unit 11 is moved by the mask driving unit 12 so that the mask pattern 85 is positioned in the irradiation region of the exposure light from the irradiation unit 13, and an effective mask pattern is changed from the mask pattern 86 to the mask pattern 85. Switch.

  The substrate W carried in / out from the first exchange area C1 exposes the second transfer pattern 84 after exposing the first transfer pattern 83, while being carried in / out from the second exchange area C2. When the substrate W ′ exposes the first transfer pattern 83 after exposing the second transfer pattern 84, it is not necessary to perform the mask pattern switching operation.

  In the first substrate exchange region C1, unexposed substrate W is unloaded, unexposed substrate W is loaded (step S2a), unexposed substrate W is pre-aligned (step S3a), and unexposed substrate W is sucked and held. Done. Meanwhile, during this time, the substrate W ′ held by the second drive unit 51 is also exposed to the first transfer pattern 83 by the forward scanning exposure (step S6b) by the same exposure operation described above, and then The substrate W ′ held in the first substrate holding region B1 is moved in the Y direction (step S7b), and the second transfer pattern 84 is exposed by the scanning exposure (step S8b) in the backward path. . Thereafter, the same operation as described above is repeated.

  Here, in the present embodiment, when the X direction transport mechanisms 50 and 51 of the first and second substrate driving units 16 and 17 move in the X direction, that is, in the X direction transport mechanism 50, the first substrate replacement region. In the X-direction transport mechanism 51 from C1 to the second substrate holding area B2, the θ direction (yawing) of each X-direction transport mechanism 50, 51 generated when moving from the first substrate holding area to the second substrate replacement area C2. The controller 8 relatively displaces each of the ball screw mechanisms 64 and 65 of the Y-direction transport mechanisms 54 and 55 by the following substrate transport method so as to cancel out the shift amount in the direction).

(1) First, a reference position (Y-direction position) where the positional relationship between the nuts 64c and 65c of the first and second ball screw mechanisms 64 and 65 of the Y-direction transport mechanisms 54 and 55 is mechanically parallel to the X-direction. Is matched) using a jig.
(2) The servo amplifier and the adjustment gain are the same for the two axes, and the responsiveness of the drive motors 64b and 65b is the same.

  (3) Next, the amount of deviation in the θ direction of each X-direction transport mechanism 50, 51 that occurs when the X-direction transport mechanism 50, 51 moves in the X direction is set to an autocollimator or the like at each position in the movement range. (Refer to FIG. 9A). Then, the second ball screw mechanism 65 is moved back and forth with respect to the first ball screw mechanism 64 with respect to the shift amount in the θ direction, searching for coordinates where the shift amount in the θ direction is less than or equal to an allowable value. Based on the relative positional relationship (shift amount) of the second ball screw mechanism 65 with respect to the one ball screw mechanism 64, a correction table for θ correction is created. That is, the shift amount graph shown in FIG. 9B is a correction table for θ correction.

  (4) Further, in order to correct the shift amount in the θ direction, accurate strokes of the first and second ball screw mechanisms 64 and 65 are required. For this reason, the mechanical relative positional error generated by the lead pitch of the ball screws 64a and 65a and the assembly of the mechanism is grasped from the positional deviations of the first and second ball screw mechanisms 64 and 65, as shown in FIG. A correction table for the relative relationship between the strokes of the ball screw mechanisms 64 and 65 is created.

  (5) Further, after obtaining a correction table for θ correction and a correction table for stroke relative relationship, the amount of deviation in the Y direction is measured based on these, and the correction table shown in FIG. 11 is created. Here, when a measuring means for measuring the amount of deviation in the Y direction, such as a laser length measuring device, is provided, the measured amount of deviation in the Y direction and two correction tables are used, as shown in FIG. Create a correction table. On the other hand, when there is no measurement means, the scanning camera of the present embodiment is used to trace the black matrix line of the substrate W, and the Y direction deviation amount is measured as a Y direction correction table. May be.

  (6) Then, when each X-direction transport mechanism 50, 51 transports the substrate W in the X direction, the correction table obtained in (5) is added to the command pulse theoretically generated in the synchronous control of the drive motors 64b, 65b. Is added to the servo amplifiers of the ball screw mechanisms 64 and 65, and the ball screw mechanisms 64 and 65 are driven.

  (7) The positional deviation between the first ball screw mechanism 64 and the second ball screw mechanism 65 is monitored, and when the deviation is equal to or greater than a specified value (biaxial deviation expansion error amount), the substrate transport mechanism 14 is used as a follow-up alarm. Protect.

  As described above, according to the scan exposure apparatus 1 of the present embodiment, each of the substrate drive units 16 and 17 of the substrate transport mechanism 14 has the suction pads 56 and 57 for sucking and holding the substrate W and the suction pads 56 and 57. A suction pad 56 having X direction transport mechanisms 50 and 51 for transporting the X direction in the X direction and first and second ball screw mechanisms 64 and 65 which are arranged in parallel to each other and can be driven independently of each other. , 57 can be moved in the Y direction and can be swung in the θ direction, and the Y direction transport mechanisms 54 and 55 can be swung in the θ direction, and therefore depends only on the accuracy of the X direction transport mechanisms 50 and 51 of the substrate transport mechanism 14. The exposure accuracy can be improved by correcting the shift amount in the θ direction.

  In particular, in the twin-stage scan exposure apparatus 1 as in the present embodiment, the movement distance of the X-direction transport mechanisms 50 and 51 is long, so correcting the shift amount in the θ direction is extremely effective in improving exposure accuracy. It is effective for.

  In addition, according to the substrate transport method of the scan exposure apparatus 1 of the present invention, the above configuration is provided, and when the X-direction transport mechanisms 50 and 51 move in the X direction, the shift amount in the θ direction of the first feed mechanism is measured. Of the first and second ball screw mechanisms 64 and 65 of the Y-direction transport mechanisms 54 and 55, the amount of deviation when the X-direction transport mechanisms 50 and 51 move in the X direction is less than an allowable value. Since the method includes a step of creating a correction table including a relative positional relationship and a step of driving the ball screw mechanisms 64 and 65 based on the correction table, the X-direction transport mechanisms 50 and 51 of the substrate transport mechanism 14 are included. As described above, the exposure accuracy can be improved by correcting the shift amount in the θ direction without depending only on the accuracy.

  Further, since the correction table includes mechanical relative position errors of the first and second ball screw mechanisms 64 and 65, θ is not affected by errors due to the assembly of the ball screw mechanisms 64 and 65 or the lead pitch. The amount of deviation in the direction can be corrected, and the exposure accuracy can be further improved.

In this embodiment, the pre-alignment tables 3 and 4 are arranged in the substrate exchange areas C1 and C2, and the loading / unloading of the substrate W and the pre-alignment are performed at the same position, but as shown in FIG. Alternatively, the substrate exchanging units 80 and 81 may be provided separately from the pre-alignment tables 3 and 4, and the substrate loading / unloading and pre-alignment may be performed at different positions.
In this case, since the movement distance in the X direction by the substrate transport mechanism 14 is further increased, it is effective to correct the shift amount in the θ direction of the present invention.

  Alternatively, a pre-alignment mechanism may be provided in each of the first and second substrate holding regions, and the substrate may be loaded and unloaded while performing the pre-alignment and exposure operations.

  Furthermore, in this embodiment, the predetermined distance L at which the plurality of masks M and the substrate W move in the orthogonal direction when switching from the forward transfer to the return transfer is the Y direction of the mask patterns 85 and 86 of the adjacent mask M. However, it may be approximately ３ or ¼ of the center-to-center distance D as long as the relationship between cost and tact is provided.

  Further, the image pickup means 35 is configured to move one image pickup means 35 between the first detection position SP1 and the second detection position SP2. However, two image pickup means 35 are prepared and each of the first detection positions is set. You may fix and install in SP1 and 2nd detection position SP2. Alternatively, one imaging unit 35 is fixedly installed at the first detection position SP1, and a movable mirror and a fixed mirror are arranged at the first detection position SP1 and the second detection position SP2, respectively. The relative position between the substrate W and the mask M may be directly detected by the imaging means 35, and the relative position between the substrate W and the mask M may be detected via a mirror at the second detection position SP2.

(Second Embodiment)
Next, a scan exposure apparatus 1 according to the second embodiment of the present invention will be described with reference to FIGS. Note that portions that are the same as or equivalent to those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. The present embodiment is the same as the configuration of the first embodiment except that a pair of guide rails and a pair of linear guides are added to the configurations of the first and second substrate driving units 16 and 17. Is described below.

  As shown in FIGS. 13 and 14, in the first and second substrate driving units 16 and 17, the moving bases 52 and 53 are moved in the X direction by the X direction transport mechanisms 50 and 51, as in the first embodiment. It is reciprocated along. On the other hand, the Y-direction transport mechanisms 54 and 55 of the present embodiment, which are second feed mechanisms disposed on the movable bases 52 and 53, are first and second drive shafts (ball screw mechanisms) 64 and 65, respectively. , A pair of linear guides 93a and 93b as linear motion guides, a support plate 94, a support shaft 95, a rolling bearing 96, and a bearing housing 97 are provided. Further, both end portions of a chuck base 98 having suction pads 56 and 57 are attached to the upper surfaces of the bearing housings 97 of the Y-direction transport mechanisms 54 and 55, respectively.

  The first and second ball screw mechanisms 64 and 65 of the Y-direction transport mechanisms 54 and 55 are arranged in parallel to each other and constitute first and second drive units that can be driven independently of each other. Each of the first and second ball screw mechanisms 64 and 65 has a substantially U-shaped cross section, a base 100 that forms a recess 100a extending along the Y direction, and an outer peripheral surface within the recess 100a of the base 100. A screw shaft 101 having a spiral thread groove 101a formed in the Y direction and extending along the Y direction; a slider 102 attached to the back surface of the flat support plate 94 and movable along the screw shaft 101; Bearing plates 103a and 103b, which are provided on both ends of the screw shaft 101 and to which bearings (not shown) are respectively attached, and a drive motor 104 connected to one end of the screw shaft 101 extending beyond the bearing plate 103a. The slider 102 is provided with a screw groove that forms a spiral passage facing the screw groove 101a of the screw shaft 101, and a rolling element (not shown) circulates in the spiral passage, whereby the slider 102 is screwed into the screw shaft. Move along 101.

  A pair of guide rails 100b extending along the Y direction are formed on both inner surfaces in the width direction that define the recesses 100a of the base 100. Although not shown, a rolling element circulation path through which the rolling elements circulate is formed between the pair of guide rails 100b and the outer surface in the width direction of the slider 102, and in the slider 102. The nut 102 is slidably guided by the pair of guide rails 100b through the movement.

  The pair of linear guides 93a and 93b are disposed on both sides in the X direction of the first and second ball screw mechanisms 64 and 65, and sliders 110a and 110b are attached to the back surface of the support plate 94. The slider 110a 110b is straddled on a pair of guide rails 111a, 111b arranged in parallel along the Y direction on the moving bases 52, 53 via rolling elements (not shown).

  Therefore, when the screw shaft 101 is rotationally driven by the drive motor 104, the support plate 94 to which the slider 102 is attached moves along the Y direction while being guided by the guide rail 100b and the pair of linear guides 93a and 93b.

  A support shaft 95 is erected on the support plate 94, and a rolling bearing 96 is interposed between the support shaft 95 and the bearing housing 97. The support shaft 95, the rolling bearing 96, and the bearing housing 97 are provided between the chuck base 98 and the support plate 94, and an angle adjustment mechanism that allows the chuck base 98 to move in the θ direction with respect to the support plate 94. Configure. As the rolling bearing 96, an arbitrary bearing such as a ball bearing or a roller bearing can be applied.

  As a result, the Y-direction transport mechanisms 54 and 55 drive the first and second ball screw mechanisms 64 and 65 in synchronization with each other so that the suction pads 56 and 57 of the chuck base 98 are moved to the movable bases 52 and 53, respectively. Can move in the Y direction. In addition, the Y-direction transport mechanisms 54 and 55 change the Y-direction position of the support plate 94 by changing the movement amounts of the first and second ball screw mechanisms 64 and 65, so that the chuck base 98 is moved by the rolling bearing 96. The suction pads 56 and 57 can be swung in the θ direction with respect to the movable bases 52 and 53.

Accordingly, the first and second substrate driving units 16 and 17 of the present embodiment can also correct the deviation amount in the θ direction in real time and improve the exposure accuracy by adopting the above configuration. . Further, with such a configuration, the correction after the substrate W is placed on the first and second substrate driving units 16 and 17 without correcting the θ direction by the alignment pin 72 as shown in FIG. It can be performed.
Further, the Y-direction drive by the Y-direction transport mechanisms 54 and 55 can be accurately guided by the guide rails 100b of the first and second ball screw mechanisms 64 and 65 and the pair of linear guides 93a and 93b.

(Third embodiment)
Next, a scan exposure apparatus 1 according to a third embodiment of the present invention will be described with reference to FIGS. Note that parts that are the same as or equivalent to those in the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified. In addition, this embodiment is the same as the structure of 2nd Embodiment except having added the board | substrate support member 21 in the structure of the 1st and 2nd board | substrate drive units 16 and 17, These structures are as follows. explain.

  In the first and second substrate transport units 16 and 17 of this embodiment, in addition to the Y-direction transport mechanisms 54 and 55 of the second embodiment, an L-shape that is bolted to the upper surfaces of the moving bases 52 and 53 is used. A substrate support member 120 is provided. The free end of the substrate support member 120 is formed longer than the width in the X direction of the substrate W, and the upper end surface on the free end side is on the substrate side, that is, the suction pad 56 from the movement region in the Y direction of the suction pads 56 and 57. , 57 are provided at a position closer to the substrate side than the position at which they move to the substrate W side (close to the intake / exhaust air pad 21), and have a height substantially equal to the suction surface of the suction pads 56, 57, Support the lower surface. The shape of the substrate support member is not limited to the L shape as long as it does not interfere with the moving chuck base 98.

  By arranging the substrate support member 120 in this way, as shown in FIGS. 17 and 18, the suction pads 56 and 57 shown in steps S7a and S7b of the exposure process of the first embodiment are moved in the Y direction. When the substrate W is drawn, the substrate W between the intake / exhaust air pad 21 and the suction pads 56 and 57 is supported by the upper end surface 120 a of the substrate support member 120. Therefore, it is possible to prevent the substrate W from being bent between the intake / exhaust air pad 21 and the suction pads 56 and 57.

(Fourth embodiment)
Next, a scan exposure apparatus 1a according to a fourth embodiment of the present invention will be described with reference to FIG. Note that portions that are the same as or equivalent to those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  In the scan exposure apparatus 1a of the present embodiment, a plurality of mask holders 11 are arranged in two rows in a staggered manner in the Y direction. Further, the substrate W is transported and exposed only from one direction in the X direction, and the substrate transport mechanism 14 includes one substrate driving unit 16.

  Also in the scan exposure apparatus 1a of this embodiment, the substrate driving unit 16 has the same configuration as that of the second or third embodiment, and the same substrate transfer method is applied, so that the substrate transfer mechanism 14 The exposure accuracy can be improved by correcting the shift amount in the θ direction without depending only on the accuracy.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably.

  In the present embodiment, a handling robot having two arms is used as the substrate transfer robot. However, other transfer methods such as a conveyor and a mechanism driven by flying air may be used.

  Further, in the present embodiment, the substrate transport mechanism 14 has been described with respect to the case where the substrate W is floated and held by the floating units 15a and 15b and the first and second substrate drive units 16 and 17, but this is described. However, the substrate W may be held and transported while being placed on the upper surface.

DESCRIPTION OF SYMBOLS 1,1a Scan exposure apparatus 3,4 Pre-alignment stand 10 Substrate conveyance mechanism 11 Mask holding part 13 Irradiation part 16 1st board | substrate drive unit 17 2nd board | substrate drive unit 35 Imaging means 50, 51 X direction conveyance mechanism (1st Feed mechanism)
54, 55 Y-direction transport mechanism (second feed mechanism)
64 First ball screw mechanism (first drive shaft)
65 Second ball screw mechanism (second drive shaft)
83 First transfer pattern 84 Second transfer pattern 85, 86 Mask patterns 93a, 93b Linear guide 94 Support plate 95 Support shaft (angle adjustment mechanism)
96 Rolling bearing (angle adjustment mechanism)
97 Bearing housing (angle adjustment mechanism)
A exposure area B1 first substrate holding area B2 second substrate holding area C1 first substrate exchange area C2 second substrate exchange area L predetermined distance M mask W substrate

Claims (6)

A substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
A scanning exposure apparatus that irradiates the substrate to be conveyed with the exposure light through the plurality of masks and exposes the pattern of each mask on the substrate,
The substrate transport mechanism includes a holding member that holds the substrate, a first feed mechanism that transports the holding member in the predetermined direction, and a first feed mechanism that is arranged in parallel to each other and can be driven independently of each other. A second feed that includes first and second drive units and is capable of moving the holding member in the orthogonal direction and swingable in the θ direction around the normal direction perpendicular to the predetermined direction and the orthogonal direction; Mechanism,
A scanning exposure apparatus comprising:   When the first feed mechanism moves in the predetermined direction, the first and second drive units of the second feed mechanism are set so as to cancel out the shift amount in the θ direction of the first feed mechanism. The scan exposure apparatus according to claim 1, further comprising a control unit that relatively displaces.   The second feed mechanism of the substrate transport mechanism includes a linear motion guide portion that guides the movement of the support plate to which the first and second drive portions are attached in the orthogonal direction. The scan exposure apparatus according to 1 or 2.   4. The substrate transport mechanism is provided with a substrate support member that holds the substrate on the substrate side with respect to the movement region of the holding member in the orthogonal direction. 5. Scanning exposure device. A substrate transport mechanism capable of transporting the substrate reciprocally along a predetermined direction and capable of moving the substrate in a direction orthogonal to the predetermined direction;
A plurality of mask holding sections for holding a plurality of masks, respectively;
A plurality of irradiating units disposed above the plurality of mask holding units and irradiating exposure light; and
The substrate transport mechanism is disposed parallel to each other and driven independently from each other, a holding member that holds the substrate, a first feeding mechanism that transports the holding member in the predetermined direction, and A first and second drive unit capable of moving the holding member in the orthogonal direction and swingable in a θ direction around a normal line perpendicular to the predetermined direction and the orthogonal direction; Substrate transport of a scanning exposure apparatus that has a feed mechanism of 2 and irradiates the substrate to be transported with the exposure light through the plurality of masks to expose the pattern of each mask on the substrate A method,
Measuring the amount of deviation in the θ direction of the first feed mechanism when the first feed mechanism moves in the predetermined direction;
Including a relative positional relationship between the first and second drive units of the second feed mechanism in which the shift amount is less than or equal to an allowable value when the first feed mechanism moves in the predetermined direction. Creating a correction table;
Driving the first and second drive units of the second feed mechanism based on the correction table;
A substrate transport method for a scan exposure apparatus, comprising:   6. The substrate conveying method of a scan exposure apparatus according to claim 5, wherein the correction table includes mechanical relative position errors of the first and second driving units.

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