TW201350736A - 雙向發光器件 - Google Patents

雙向發光器件 Download PDF

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Publication number
TW201350736A
TW201350736A TW101120283A TW101120283A TW201350736A TW 201350736 A TW201350736 A TW 201350736A TW 101120283 A TW101120283 A TW 101120283A TW 101120283 A TW101120283 A TW 101120283A TW 201350736 A TW201350736 A TW 201350736A
Authority
TW
Taiwan
Prior art keywords
light
carrier
conductive
emitting device
electrically connected
Prior art date
Application number
TW101120283A
Other languages
English (en)
Chinese (zh)
Other versions
TWI464342B (enExample
Inventor
謝智慶
Original Assignee
優鋼機械股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 優鋼機械股份有限公司 filed Critical 優鋼機械股份有限公司
Priority to TW101120283A priority Critical patent/TW201350736A/zh
Publication of TW201350736A publication Critical patent/TW201350736A/zh
Application granted granted Critical
Publication of TWI464342B publication Critical patent/TWI464342B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW101120283A 2012-06-06 2012-06-06 雙向發光器件 TW201350736A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101120283A TW201350736A (zh) 2012-06-06 2012-06-06 雙向發光器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101120283A TW201350736A (zh) 2012-06-06 2012-06-06 雙向發光器件

Publications (2)

Publication Number Publication Date
TW201350736A true TW201350736A (zh) 2013-12-16
TWI464342B TWI464342B (enExample) 2014-12-11

Family

ID=50157929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101120283A TW201350736A (zh) 2012-06-06 2012-06-06 雙向發光器件

Country Status (1)

Country Link
TW (1) TW201350736A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779837B (zh) * 2020-09-22 2022-10-01 美商施耐寶公司 適於向工件施加扭矩的工具及用於工具的照明光源

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200644271A (en) * 2005-06-03 2006-12-16 Pai-Ling Sung Package structure for compound light emitting diode
TW200800512A (en) * 2006-06-21 2008-01-01 Kabo Tool Co Hand tool warning device
TW200924232A (en) * 2007-11-26 2009-06-01 Lin Pin Ya Light emitting diode capable of radiating light and dissipating heat in dual directions
TWM336121U (en) * 2007-12-28 2008-07-11 Eclatorq Technology Co Ltd Digital tool with light display
TW200941753A (en) * 2008-03-18 2009-10-01 Lin Pin Ya LED light panel structure having a patch bracket
TW201015696A (en) * 2008-10-09 2010-04-16 Helio Optoelectronics Corp Alternative-current (AC) lighting emitting diode (LED) structure
TWM407463U (en) * 2010-10-01 2011-07-11 Cing-Syu Wu Multi-functional advertising LED light base and decoration device
TWM405341U (en) * 2010-12-09 2011-06-11 Sunheng Technology Co Ltd Liquid crystal display module for digital torque wrench

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779837B (zh) * 2020-09-22 2022-10-01 美商施耐寶公司 適於向工件施加扭矩的工具及用於工具的照明光源
US11819984B2 (en) 2020-09-22 2023-11-21 Snap-On Incorporated Tool illumination device

Also Published As

Publication number Publication date
TWI464342B (enExample) 2014-12-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees