TW201346048A - A film forming apparatus and a plate for capturing particles - Google Patents

Abstract

A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. A film forming apparatus comprises a film forming chamber for coating film forming materials on a target film forming member. The film forming chamber has a particle capturing plate. First and second uneven portions (32,34) are formed on the surface of the particle capturing plate. The second uneven portions are formed on the first uneven portions and are minuter than the first uneven portions.

Description

Film forming device and particle trapping plate

The present invention relates to a film forming apparatus for forming a film forming material on a film-forming material, and a particle collecting plate attached to the film forming apparatus.

In a film forming apparatus that forms a thin film such as an ITO (Indium Tin Oxide) film, a film-forming atom (film forming material) may adhere to an inner wall other than the film forming material such as a substrate. On top, coarse particles called particles are deposited on the inner wall. The film in which the particles are deposited may be peeled off from the inner wall of the film forming chamber, may be scattered in the film forming chamber, and may adhere to the substrate, resulting in problems such as a decrease in film forming quality.

Therefore, for example, in the film forming apparatus described in Patent Document 1, a shield member is disposed in the film formation chamber. The shield member is formed with a plasma spray film made of aluminum or an aluminum alloy on its surface, and the surface of the plasma spray film is roughened. Thereby, the peeling of the particles is prevented by the shield member.

Further, for example, in the film forming apparatus described in Patent Document 2, an electrolytic copper foil having an embossed surface having a Vickers hardness of 100 to 130 Hv is placed inside the film forming chamber, and the particles are prevented from being peeled off by the electrolytic copper foil.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-291299

Patent Document 2: Japanese Laid-Open Patent Publication No. 2001-234325

However, in the above-described conventional structure, peeling of the deposited film is inevitable due to insufficient collection function of the film forming material and insufficient retention of the deposited film by the deposition of particles. Therefore, further improvement is desired regarding the peeling of the deposited film.

The present invention has been made to solve the above problems, and an object of the invention is to provide a film forming apparatus and a particle collecting plate which can effectively suppress peeling of a deposited film.

In order to solve the above problems, the inventors of the present invention have conducted intensive studies. As a result, it has been found that the film-forming material can be efficiently collected and held by setting the surface on which the film-forming material adheres to a specific shape, and the present invention has been completed.

In other words, the film forming apparatus of the present invention includes a film forming chamber in which a film forming process for forming a film forming material on the film forming material is performed, and the film forming process is provided in the film forming chamber. In the particle collecting plate, a first unevenness and a second unevenness are formed on a surface of the particle collecting plate, and the second unevenness is provided on the first unevenness and is finer than the first unevenness.

In the film forming apparatus, first unevenness and second unevenness finer than the first unevenness are formed on the surface of the particle collecting plate. In the particle collecting plate, since the surface area is enlarged by the first unevenness and the second unevenness, the adhesion surface of the film forming material can be secured. Further, the film material can be efficiently trapped by the anchoring effect of the fine second unevenness. Moreover, by its unevenness is larger than the second unevenness The first unevenness can deposit and hold the film forming material (particles) trapped by the second unevenness. Therefore, the film forming material can be effectively trapped and held. As a result, peeling of the deposited film can be effectively suppressed.

The first unevenness is formed by the first processing, and the second unevenness is formed by the second processing performed after the first processing. In this manner, the second unevenness is formed throughout the first unevenness by performing the second processing after the first processing.

The first processing is knurling, and the second processing is blasting. By using such a processing method, the first unevenness and the second unevenness can be formed favorably.

The first unevenness is a twill formed by embossing. By forming the first unevenness as a twill, the surface area in the particle collecting plate can be enlarged, and as a result, the surface on which the second unevenness is formed also increases. Therefore, the trapping surface of the film forming material can be more ensured. And by setting the twill, it is possible to capture the film material from multiple directions.

The pitch of the first unevenness was 1.6 mm, and the depth of the groove of the first unevenness was 0.7 mm. Thereby, it is possible to more suitably hold the particles collected and accumulated by the second unevenness, and it is more preferable to suppress the peeling of the deposited film.

The particle trap plate is preferably a copper plate. By using a copper plate, the processing of the first unevenness and the second unevenness can be favorably performed.

The thickness of the particle collecting plate is preferably 3 mm. Thus, the rigidity can be ensured by setting the thickness to 3 mm. Therefore, the removal (cleaning) operation of the film-forming material attached to the particle collecting plate can be performed favorably.

Further, the particle collecting plate of the present invention is a particle collecting plate disposed in a film forming chamber of the film forming apparatus, and is characterized in that a first unevenness and a second unevenness are formed on the surface, and the second unevenness is provided on the first unevenness Above and more than the first bump Fine.

A first unevenness and a second unevenness which is finer than the first unevenness are formed in the particle collecting plate. Thereby, since the surface area is enlarged by the first unevenness and the second unevenness, the adhesion surface of the film formation material is secured. Further, the film material can be efficiently collected by the anchoring effect of the fine second unevenness. Further, the film forming material (particles) collected by the second unevenness can be deposited and held by the first unevenness having a larger unevenness than the second unevenness. Therefore, the film forming material can be effectively trapped and held. As a result, peeling of the deposited film can be suppressed.

Further, in the particle collecting plate, the pitch of the first unevenness was 1.6 mm, and the depth of the groove of the first unevenness was 0.7 mm. Thereby, it is possible to more suitably hold the particles collected and accumulated by the second unevenness, and it is possible to more suitably suppress the peeling of the deposited film.

According to the invention, it is possible to effectively suppress peeling of the deposited film.

In the following, the preferred embodiments of the present invention will be described with reference to the accompanying drawings.

Fig. 1 is a view showing the structure of a film forming apparatus of an embodiment. Fig. 2 is a view of the film forming apparatus shown in Fig. 1 as seen from the lateral direction. The film forming apparatus 1 includes a vacuum vessel 3 as a film forming chamber, a plasma gun 5 as a plasma source for supplying the plasma bundle PB into the vacuum vessel 3, and an anode member 7 disposed in the vacuum chamber. The bottom of the inside of the device 3 is injected with the plasma beam PB. The transport mechanism 10 is disposed at the upper portion of the vacuum container 3 and moves the retainer T above the anode member 7.

Here, the plasma gun 5 is a pressure gradient type plasma gun that generates the plasma beam PB, and between the plasma gun 5 and the vacuum container 3, an intermediate electrode 12 for guiding the plasma beam PB to the vacuum vessel 3 is disposed. The intermediate electrode 14 and the steering coil (not shown) are used. Further, the anode member 7 includes a hearth 16 having a hearth body P18 for guiding the plasma beam PB from the plasma gun 5 and accommodating the film forming material, and an annular auxiliary anode 20 disposed around the anode. The transport mechanism 10 includes a plurality of rollers 24 that are arranged in the horizontal direction in the transport path 22, and a drive device (not shown) that rotates the rollers 24 at an appropriate speed to move the retainer T at a constant speed. A heater 26 that heats a glass substrate (film formation material) W is disposed in the conveyance path 22.

In the film forming apparatus 1, discharge is generated between the cathode (not shown) of the plasma gun 5 and the hearth 16 in the vacuum vessel 3, whereby the plasma bundle PB is generated. The plasma beam PB is directed to the hearth 16 by a magnetic field defined by a steering coil or a permanent magnet or the like within the auxiliary anode 20. A film forming material such as ITO (Indium Tin Oxide) accommodated in the hearth body 18 is heated by the plasma beam PB to be evaporated. The evaporated film-forming material (evaporated particles) is ionized by the plasma beam PB, and adheres to the surface of the glass substrate W exposed by the lower surface of the tray T which is moved at a constant speed by the transport mechanism 10, thereby forming ITO ( Indium tin oxide) film.

In the vacuum container 3 of the film forming apparatus 1 having the above configuration, the film forming material adheres to the inner side surface (inner wall) of the vacuum container 3 to deposit particles (coarse particles). If the particles accumulate to a certain extent, there are accumulated particles (film) from the true The inner side surface of the empty container 3 is peeled off and scattered in the vacuum container 3 and adhered to the glass substrate W. As a result, there is a problem that the glass substrate W is contaminated and the quality is lowered.

Then, the film forming apparatus 1 is provided with the particle collecting plate 30 disposed in the vacuum container 3. The particle collecting plate 30 is disposed along the inner side surface of the vacuum vessel 3 and has a function of trapping and holding a film forming material. The particle collecting plate 30 is, for example, a copper plate member, and has a thickness of, for example, about 3 mm. Hereinafter, the particle collecting plate 30 will be described in detail with reference to FIGS. 3 and 4.

Figure 3 is a view showing the surface of the particle collecting plate. Fig. 4 is an enlarged cross-sectional view showing the surface of the particle collecting plate shown in Fig. 3.

As shown in FIG. 3 and FIG. 4, the first unevenness (first unevenness) 32 and the second unevenness (second unevenness) 34 are formed on the surface 30a of the particle collecting plate 30. The first unevenness 32 is a twill of a embossing formed by embossing. Rolling (English name: Knurling) is defined by JIS B 0951.

The cross section of the convex portion of the first unevenness 32 has a substantially mountain shape. In other words, the first unevenness 32 is composed of a groove and a top portion between the adjacent grooves. The pitch t of the first unevenness 32 is, for example, 1.6 mm. The depth (height from the bottom to the top) h of the groove of the first unevenness 32 is, for example, 0.7 mm. The groove of the first unevenness 32 has a substantially V shape, and the angle at which the other side intersects with the other side is, for example, 90 degrees. The first unevenness 32 is formed by, for example, pressing a embossing tool against a copper plate to flatten the surface of the copper plate to be plastically deformed, or by cutting the surface of the copper plate. Further, the angle t, the depth h, and the angle at which one side of the groove intersects with the other side are not limited to the above numerical values, and may be increased or decreased with respect to the above numerical values, and may be other numerical values.

The second unevenness 34 is formed on the first unevenness 32. The second unevenness 34 is fine unevenness formed by the blasting process, and the unevenness is extremely small as compared with the first unevenness 32. After the first unevenness 32 is formed by embossing, the second unevenness 34 is formed on the surface of the first uneven 32 by blasting. That is, the surface of the first unevenness 32 (the surface 30a of the particle collecting plate 30) becomes a rough surface.

For example, it is preferable that the second unevenness 34 is formed by colliding a projectile having a particle diameter of about 300 to 355 μm (for example, alumina), and the center line average roughness Rz is, for example, about 20 to 40 μm.

The particle collecting plate 30 is disposed in the vacuum vessel 3 so that the surface 30a on which the first unevenness 32 and the second unevenness 34 are formed faces the inside of the vacuum chamber 3. Specifically, the particle collecting plate 30 is disposed along the inner side surface of the vacuum vessel 3 so as to surround the anode member 7.

The back surface 30b of the particle collecting plate 30 on the side opposite to the surface 30a is a shiny surface (raw surface). A cooling plate 40 is provided on the back surface 30b. The cooling plate 40 is, for example, a plate-like member having a thickness of about 5 mm, and is disposed between the inner side surface of the vacuum container 3 and the particle collecting plate 30 in the vacuum container 3.

The cooling plate 40 is attached to the particle collecting plate 30 by a stud 50 and a cap nut 52. Fig. 5 is an enlarged cross-sectional view showing the mounting structure of the particle collecting plate and the cooling plate. As shown in Fig. 5, one surface 40a of the cooling plate 40 is disposed to face the back surface 30b of the particle collecting plate 30 and is in close contact with the back surface 30b. Further, as described above, the back surface 30b of the particle collecting plate 30 may be at least in surface contact with one surface 40a of the cooling plate 40. With this configuration, the cooling plate 40 is integrally provided with the particle collecting plate 30.

When the cooling plate 40 is attached to the particle collecting plate 30, it is assembled from the inner side surface side of the vacuum container 3 to the screw pile 50 in the order of the cooling plate 40, the particle collecting plate 30, the pressing washer 54, and the cap nut 52. The cap nut 52 is fastened to the stud by a wrench. Further, a nut 56 is provided on the stud 50, and a snap fixing screw 58 is attached to the nut 56.

As shown in FIGS. 1 and 2, the cooling plate 40 is provided with a cooling pipe 42 through which a coolant (water) passes. The cooling pipe 42 is disposed on the other surface 40b side of the cooling plate 40. The cooling pipe 42 is disposed over the entire surface of the cooling plate 40. The cooling plate 40 and the cooling pipe 42 constitute a cooling mechanism.

As described above, in the present embodiment, the particle collecting plate 30 is disposed in the vacuum container 3. The first concavities and convexities 32 and the second concavities and convexities 34 are formed on the surface 30a of the particle collecting plate 30, and the second concavities and convexities are finer than the first concavities and convexities 32. In the particle collecting plate 30, the surface area is enlarged by the first unevenness 32 and the second unevenness 34, and the adhesion surface of the film forming material is secured. Further, the film material can be efficiently collected by the anchoring effect of the fine second unevenness 34. In addition, the particles which are collected by the second unevenness 34 can be deposited and held by the first unevenness 32 having a larger unevenness than the second unevenness 34. Therefore, the film forming material can be effectively trapped and held. As a result, peeling of the deposited film can be effectively suppressed.

Further, since the particle collecting plate 30 has a thickness of about 3 mm, rigidity can be ensured. Therefore, the attachment removal operation can be performed favorably. In the particle collecting plate 30, the first unevenness 32 having a depth h of about 0.7 mm is formed. Therefore, the second unevenness 34 may be formed by performing air blow processing on the first unevenness 32 during the regeneration. Therefore, it is easy to carry out Regeneration operation. As a result, operability can be improved and cost can be reduced.

Further, since the first unevenness 32 is a twill formed by embossing, the surface area can be enlarged, and the film material can be collected from multiple directions than when a hole (plain) is formed in one direction. Therefore, an improvement in the trapping property of the film forming material can be achieved.

In addition, when the pitch t of the first unevenness 32 is 1.6 mm and the depth h of the groove of the first unevenness is 0.7 mm, it is possible to more suitably hold the particles collected and accumulated by the second unevenness 34, and it is possible to more suitably suppress Peeling of the deposited film.

Further, since the particle collecting plate 30 and the cooling plate 40 are integrally provided, it is possible to add a cooling function to the particle collecting plate 30 itself. Therefore, simplification of the structure of the cooling mechanism can be achieved to further simplify the structure of the film forming apparatus 1.

In addition, since the particle collecting plate 30 and the cooling plate 40 are attached by the stud 50 and the cap nut 52, even if the plate thickness of the cooling plate 40 is thin (for example, about 5 mm), the cooling plate 40 can be protected. The mounting screws are capable of firmly fixing the particle collecting plate 30 and the cooling plate 40.

The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the first unevenness 32 is formed by embossing, and the second unevenness 34 is formed by blasting, but the first unevenness 32 and the second unevenness 34 can be formed by other processing methods.

Further, in the above-described embodiment, the configuration of the film forming apparatus 1 in which the particle collecting plate 30 is disposed by the ion plating using plasma is described. However, the particle collecting plate 30 may be disposed by sputtering. A device for performing a film formation process such as plating.

Further, in the above-described embodiment, the cooling plate 40 is integrally provided with the particle collecting plate 30. However, the cooling plate 40 may not be provided depending on the temperature environment of the vacuum container 3 in the film forming apparatus 1.

Further, in the above embodiment, the particle collecting plate 30 is made of a copper plate member, but the particle collecting plate 30 may be made of other materials. From the viewpoint of ease of processing, the particle collecting plate 30 is preferably a copper plate.

In the above-described embodiment, the second uneven portion 34 is provided in the concave portion of the first uneven portion 32. However, the second uneven portion 34 may not be provided in the concave portion of the first uneven portion 32. In the particle collecting plate 30, when the finer second concavities and convexities 34 mainly have a function of trapping the film material, and the concave portions of the first concavities and convexities 32 mainly have a function of holding the deposited film forming material, even as described above When the second unevenness 34 is not formed in the concave portion of the first uneven portion 32, peeling of the deposited film can be effectively suppressed.

1‧‧‧ film forming device

3‧‧‧Vacuum container (film forming chamber)

30‧‧‧Particle capture board

30a‧‧‧ surface

30b‧‧‧back

32‧‧‧1st bump (first bump)

34‧‧‧2nd bump (second bump)

40‧‧‧Cooling plate

50‧‧‧Snail pile

52‧‧‧cap nut

Fig. 1 is a view showing the structure of a film forming apparatus of an embodiment.

Fig. 2 is a view of the film forming apparatus shown in Fig. 1 as seen from the lateral direction.

Figure 3 is a view showing the surface of the particle collecting plate.

Fig. 4 is an enlarged cross-sectional view showing the surface of the particle collecting plate shown in Fig. 3.

Fig. 5 is a cross-sectional view showing the mounting structure of the particle collecting plate and the cooling plate.

30‧‧‧Particle capture board

30a‧‧‧ surface

30b‧‧‧back

32‧‧‧1st bump (first bump)

34‧‧‧2nd bump (second bump)

Claims (13)

A film forming apparatus including a film forming chamber, and a film forming process for forming a film forming material on a film formation material, comprising: a particle collecting plate disposed in the film forming chamber; The surface of the particle collecting plate is formed with a first unevenness and a second unevenness, and the second unevenness is provided on the first unevenness and is finer than the first unevenness. The film forming apparatus according to claim 1, wherein the first unevenness is formed by the first processing, and the second unevenness is formed by the second processing performed after the first processing. The film forming apparatus according to claim 2, wherein the first processing is embossing, and the second processing is blasting. The film forming apparatus according to claim 3, wherein the first unevenness is a twill formed by the embossing. The film forming apparatus according to claim 4, wherein a pitch of the first unevenness is 1.6 mm, and a depth of the groove of the first unevenness is 0.7 mm. The film forming apparatus according to any one of claims 1 to 5, wherein a cooling plate is provided on a back surface of the particle collecting plate opposite to the surface. The film-forming device according to any one of claims 1 to 4 The particle collecting plate is a copper plate. The film forming apparatus according to any one of claims 1 to 4, wherein the particle collecting plate has a thickness of 3 mm. The film forming apparatus according to claim 6, wherein the cooling plate is integrally provided to the particle collecting plate by a screw pile and a nut. A particle collecting plate disposed in a film forming chamber of a film forming apparatus, characterized in that a first unevenness and a second unevenness are formed on a surface, and the second unevenness is provided on the first unevenness and is more than the first unevenness Fine. The particle collecting plate according to claim 10, wherein the first unevenness is formed by the first processing, and the second unevenness is formed by the second processing performed after the first processing. The particle collecting plate according to claim 11, wherein the first processing is knurling, and the second processing is blasting. The particle collecting plate according to claim 12, wherein a pitch of the first unevenness is 1.6 mm, and a depth of the groove of the first unevenness is 0.7 mm.