CN101050519A - Evaporation apparatus, evaporation method, method of manufacturing electro-optical device, and film-forming apparatus - Google Patents

Abstract

The invention provides an evaporation apparatus, which can reduce detachment of deposits attached onto a wall inside a vacuum chamber and to improve directivity of a deposited film in a deposition apparatus. The deposition apparatus 10 is equipped with an electron beam system 120 for depositing evaporation substance 110 evaporated from a target 110 onto a substrate 210 and a chamber 100 that defines a space 101 for installing the target 110 and the substrate 210 and is capable of maintaining a vacuum state in the space 101. The apparatus is further equipped with a plurality of eaves 150 formed on at least a portion of a side wall 100a in the chamber 100, wherein each of the eaves protrudes in a direction toward the target 110 relative to the normal direction of the side wall 100a.

Description

The manufacture method of evaporation coating device, method, electro-optical assembly and film deposition system

Technical field

The present invention relates to be suitable for the inorganic alignment film that relates in the electro-optical assemblys such as for example liquid-crystal apparatus is carried out evaporation coating device, the evaporation coating method of oblique evaporation plated film and uses the manufacture method of electro-optical assembly of this evaporation coating device and the technical field of film deposition system.

Background technology

In this evaporation coating device, attached to after on the wall in the vacuum chamber, in order to prevent to peel off from wall and make in the vacuum chamber contaminatedly owing to dirt settling, the wall in the vacuum chamber etc. is provided with anti-deposition plate from the evaporated material in evaporation coating source.For example, in patent documentation 1, thereby the adhesion amount that discloses by reduce the evaporant that adheres on anti-deposition plate at installation well heater on the anti-deposition plate prevents the technology that dirt settling is peeled off.In addition, for example in patent documentation 2, disclose by having peristome and can the refrigerative baffle being arranged on the technology of the direction of controlling evaporated material flight between evaporation coating source and the substrate as the film forming object.

[patent documentation 1] spy opens the 2001-192816 communique

[patent documentation 2] spy opens flat 6-181175 communique

But, in above-mentioned technology, have the technical problem of peeling off abundant minimizing of the dirt settling that adheres on the anti-deposition plate on the wall that is difficult to make in being arranged on vacuum chamber.In addition, also exist evaporated material to make by the technical problem of the directive property of film forming evaporation coating film reduction owing to wall in vacuum chamber or the bounce-back of anti-deposition plate.

Summary of the invention

The present invention proposes in view of for example above-mentioned problem just, and its purpose is to provide the evaporation coating device of peeling off and can improve the directive property of evaporation coating film, the evaporation coating method of the dirt settling that adheres on a kind of wall that can reduce in vacuum chamber and manufacture method and the film deposition system that uses the electro-optical assembly of this evaporation coating device.

The 1st evaporation coating device of the present invention possesses in order to address the above problem: make the evaporation coating unit that carries out evaporation coating from the evaporated material of evaporation coating source evaporation at substrate; Be given for space that above-mentioned evaporation coating source and aforesaid substrate are set and the vacuum tank that this space can be maintained vacuum; At least a portion setting of the wall of above-mentioned vacuum tank, have towards comparing with the normal direction of above-mentioned wall towards outstanding separately a plurality of protuberances of the direction in above-mentioned evaporation coating source and the evaporated material adhesion unit that above-mentioned evaporated material is adhered to.

If adopt the 1st evaporation coating device of the present invention, then utilize the evaporation coating unit that in vacuum tank, is provided with, on substrate, the evaporated material from the evaporation of evaporation coating source is carried out evaporation coating.At this, what is called of the present invention " vacuum tank ", be that expression constitutes the space that is given for the evaporation coating source that is provided with (perhaps being also referred to as target) and becomes the substrate that is evaporated the plated film object and this space can be maintained the notion of the casings such as chamber of vacuum, in guaranteeing the scope of this notion, its shape and material etc. are without any qualification.But,,, preferably use metallic substance, ferrous materials, glass material, pottery or stupalith etc. in view of the stability of machinery, physics and chemistry as constituent material.So-called " vacuum ", it is the notion of the spatial state that comprises that the gas with the pressure that forces down than atmosphere is full of, ideally, refer to not influence the spatial state of the degree of film quality from the normal atmosphere impurity such as the oxygen that when on substrate, evaporated material being carried out evaporation coating, air, comprises and nitrogen that reduce pressure.So-called " being maintained vacuum ", be to comprise the result that the spillage as the gas of the amount of for example sharp exhaust system expellant gas from vacuum tank that comprises rotary pump, mechanical booster pump, oil diffusion pump or turbomolecular pump etc. and vacuum tank offsets, reach the notion that is stabilized in to a certain degree or can regards the state of vacuum tightness to a certain degree as.As " evaporation coating unit " of the present invention, can use for example resistance heating evaporation plating method, electromagnetism heating evaporation plating method etc.So-called " evaporation coating source " of the present invention is to comprise the notion that can pass through to heat the material that evaporates, and in guaranteeing the scope of this notion, its material, shape and other physical property are without any qualification.For example, the evaporation coating source can be inorganic materials such as SiO or SiO2.In addition, also can be the inorganic materials that to use as the inorganic alignment mould material in the electro-optical assembly such as liquid-crystal apparatus.

In the present invention, especially, at least a portion that possesses at the wall of vacuum tank has towards the evaporated material adhesion unit of comparing with the normal direction of this wall towards the outstanding a plurality of protuberances of the direction in evaporation coating source.Promptly, for example, when a side below vacuum tank is provided with the evaporation coating source and a side is provided with substrate up, be provided with at outstanding separately a plurality of protuberances on the direction (that is oblique below) in evaporation coating source in a side above the evaporation coating source on the side wall surface of vacuum tank.A plurality of protuberances are being the eaves shape of only counting about mm with width and the thickness of counting about mm towards giving prominence on the direction in evaporation coating source for example respectively, and are arranged in for example reticulation, striated etc. on the wall of vacuum tank.And a plurality of protuberances also can be arranged on the anti-deposition plate that being used to of possessing adhered to evaporated material on the wall of vacuum tank.That is, " evaporated material adhesion unit " of the present invention is the meaning that comprises the anti-deposition plate that is provided with so a plurality of protuberances.

Utilize such evaporated material adhesion unit, can be when from the wall of evaporated material at vacuum tank of evaporation coating source evaporation, adhering to as dirt settling, increase keeps dirt settling on this wall maintenance dose (promptly, but can be) attached to the energy that adheres to of the evaporated material on this wall, in other words, can prolong the hold-time that on this wall, keeps dirt settling.Therefore, when the evaporation coating unit carried out evaporation coating, the amount of the evaporated material that adheres on the wall of vacuum tank increased, and then can not keep evaporated material on wall, can suppress or prevent that dirt settling from coming off from wall.Therefore, in vacuum tank, can reduce the particulate that causes owing to the dirt settling that comes off from wall and produce.Like this, can improve the film quality of the evaporation coating film that on substrate, carries out evaporation coating.

Further, owing to utilize the evaporated material adhesion unit, but the energy that adheres to that the evaporated material that evaporates from the evaporation coating source can adhere on the wall of vacuum tank increases (promptly, the capture rate of catching evaporated material improves), therefore, can reduce or prevent the rebound (that is bounce-back) of the evaporated material on the wall of vacuum tank.Therefore, can reduce or avoid evaporating that material rebounds and towards substrate on the wall of vacuum tank.That is, can reduce or prevent that the evaporated material different with the direction of stipulating is towards substrate.Therefore, can improve the directive property of the evaporation coating films such as inorganic alignment film that on substrate, carry out pre-tilt angle evaporation coating, that for example have regulation.That is, can form almost in the whole zone of real estate or in or fully uniform evaporation coating film than the scope of broad.

As mentioned above, if adopt the 1st evaporation coating device of the present invention, then owing to utilize the evaporated material adhesion unit that has along towards the outstanding a plurality of protuberances of the direction in evaporation coating source, but the energy that adheres to that the evaporated material that evaporates from the evaporation coating source can adhere on the wall of vacuum tank increases, therefore, in vacuum tank, can reduce the particulate that causes owing to the dirt settling that comes off from wall and produce.Further, can improve the directive property of the evaporation coating film that on substrate, carries out evaporation coating.

In a form of the 1st evaporation coating device of the present invention, above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank, on the side wall surface of above-mentioned a plurality of protuberance in above-mentioned wall, as arranging along a plurality of row of the direction of intersecting with the normal direction of above-mentioned bottom surface.

If adopt this form, then a plurality of protuberances are arranged with predetermined distance along the direction of intersecting with the normal direction of bottom surface on the side wall surface of vacuum tank, with a plurality of row configuration examples such as striated.Therefore, for example by reduce a plurality of protuberances each size or arrangement pitch narrowed down and on side wall surface, form a plurality of protuberances morely, can increase the total surface area of a plurality of protuberances.Therefore, can make evaporated material more attached on a plurality of protuberances.

In another form of the 1st evaporation coating device of the present invention, above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank, on the side wall surface of above-mentioned a plurality of protuberance in above-mentioned wall, with each self-forming of mode of extending along the direction of intersecting with the normal direction of above-mentioned bottom surface.

If adopt this form, then a plurality of protuberances on side wall surface, in the mode of extending along the direction of intersecting with the normal direction of bottom surface, typically, one side with the mode that extends to the other side relative on side wall surface, each self-forming with it from intersecting with the bottom surface.That is, on side wall surface, on the direction of intersecting with the bottom surface, be aligned to a plurality of with the mode protuberance that form, for example eaves shape that extends along the bottom surface.Therefore, can make from the evaporation coating source that disposes in the bottom surface towards the evaporated material of the direction flight that intersects with the bottom surface and almost adhere to reliably.

In the form that above-mentioned a plurality of protuberances form on side wall surface, above-mentioned side wall surface also can with above-mentioned bottom surface adjacency.

In this case, owing to form a plurality of protuberances closerly, therefore, can make evaporated material more attached on a plurality of protuberances with the evaporation coating source.

The 2nd evaporation coating device of the present invention possesses in order to address the above problem: make the evaporation coating unit that carries out evaporation coating from the evaporated material of evaporation coating source evaporation at substrate; Be given for space that aforesaid substrate and above-mentioned evaporation coating source are set and the vacuum tank that this space can be maintained vacuum; On at least a portion of the wall of above-mentioned vacuum tank, be provided with, have along compare a plurality of recesses that cave in separately towards the direction and the relative above-mentioned evaporation coating source in above-mentioned evaporation coating source and the evaporated material adhesion unit that above-mentioned evaporated material is adhered to the normal direction of above-mentioned wall.

If adopt the 2nd evaporation coating device of the present invention, then the 1st evaporation coating device of the present invention with above-mentioned is the same, in vacuum tank, on substrate the evaporated material from the evaporation of evaporation coating source is carried out evaporation coating.

In the present invention, especially, possesses the evaporated material adhesion unit that at least a portion of the wall of vacuum tank, has along compare a plurality of recesses that cave in separately towards the direction and the relative above-mentioned evaporation coating source in evaporation coating source with the normal direction of this wall.Promptly, for example, when a side below vacuum tank is provided with the evaporation coating source and a side is provided with substrate up, a side is provided with a plurality of recesses that cave in separately along towards the direction (that is, tiltedly descending direction) and the relative evaporation coating source in evaporation coating source above evaporation coating source on the side wall surface of vacuum tank.A plurality of recesses for example to count width and the thickness about mm, along only caving in about number mm towards the direction and the relative evaporation coating source in evaporation coating source, are arranged in for example reticulation, striated etc. respectively on the wall of vacuum tank.And, a plurality of recesses also can be arranged on the wall of vacuum tank, possess, be used to anti-deposition plate that the evaporation coating material is adhered to.That is, " evaporated material adhesion unit " of the present invention is the meaning that comprises the anti-deposition plate that is provided with so a plurality of recesses.

If adopt the 2nd evaporation coating device of the present invention, then utilize the evaporated material adhesion unit that has along a plurality of recesses that cave in towards the relative evaporation coating of the direction in evaporation coating source source, the same with above-mentioned the 1st evaporation coating device of the present invention, adhere to energy but can increase from what the evaporated material of evaporation coating source evaporation can adhere on the wall of vacuum tank.Therefore, in vacuum tank, can reduce the particulate that causes owing to the dirt settling that comes off from wall and produce.Further, can improve the directive property of the evaporation coating film that on substrate, carries out evaporation coating.

In a form of the 2nd evaporation coating device of the present invention, has the shape of extending along towards the direction in above-mentioned evaporation coating source by each the space of internal surface regulation of above-mentioned a plurality of recesses.

If adopt this form, then evaporated material enters the inside of a plurality of recesses easily, can adhere to evaporated material on the internal surface of a plurality of recesses more.

In another form of the 2nd evaporation coating device of the present invention, above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank, on the side wall surface of above-mentioned a plurality of recesses in above-mentioned wall, as arranging along a plurality of row along the direction of above-mentioned bottom surface.

If adopt this form, then a plurality of recesses are arranged with predetermined distance along the bottom surface on the side wall surface of vacuum tank, with a plurality of row configuration examples such as striated.Therefore, for example by reduce a plurality of recesses each size or arrangement pitch is narrowed down, and on side wall surface, form a plurality of recesses morely, can increase the total surface area of a plurality of recesses.Therefore, can make evaporated material more attached on a plurality of recesses.

In another form of the 2nd evaporation coating device of the present invention, above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank, on the side wall surface of above-mentioned a plurality of recess in above-mentioned wall, with each self-forming of mode of extending along the direction of intersecting with the normal direction of above-mentioned bottom surface.

If adopt this form, then a plurality of recesses on the side wall surface of vacuum tank, with along the mode of extending along the direction of bottom surface, typically, one side with each self-forming of the mode that extends to the other side relative on side wall surface with it from intersecting with the bottom surface.That is, on side wall surface, the recess that forms in the mode of extending along the bottom surface is arranged in a plurality of on the direction of intersecting with the bottom surface.Therefore, the evaporated material to the direction flight that intersects with the bottom surface is almost adhered to reliably.

In the form that above-mentioned a plurality of protuberances form on side wall surface, above-mentioned side wall surface also can with above-mentioned bottom surface adjacency.

In this case, owing to form a plurality of recesses closerly, therefore, can make evaporated material more attached on a plurality of protuberances with the evaporation coating source.

The 3rd evaporation coating device of the present invention possesses in order to address the above problem: make the evaporation coating unit that carries out evaporation coating from the evaporated material of evaporation coating source evaporation at substrate; Be given for space that aforesaid substrate and above-mentioned evaporation coating source are set and the vacuum tank that this space can be maintained vacuum; Evaporated material adhesion unit that be provided with, that above-mentioned relatively wall has cancellous jog and above-mentioned evaporated material is adhered at least a portion of the wall of above-mentioned vacuum tank.

If adopt the 3rd evaporation coating device of the present invention, then the of the present invention the 1st and the 2nd evaporation coating device with above-mentioned is the same, in vacuum tank, on substrate the evaporated material from the evaporation of evaporation coating source is carried out evaporation coating.

In the present invention, especially, possess at least a portion of the wall of vacuum tank, this wall evaporated material adhesion unit of having cancellous jog and evaporated material being adhered to relatively.That is, for example, when a side below vacuum tank was provided with the evaporation coating source and a side is provided with substrate up, a side was provided with cancellous jog above evaporation coating source on the side wall surface of vacuum tank.Cancellous jog is for example by to arrange on wall and form by having mode that a plurality of metal wires that the metals such as for example aluminium of the diameter about 1mm for example constitute form the square mesh of 2mm for example.Perhaps, the net that also a plurality of metal wires that utilization for example is made of metals such as aluminium can be formed is installed on the wall.And, cancellous jog also can be arranged on the wall of vacuum tank, possess, be used to anti-deposition plate that evaporated material is adhered to.That is, " evaporated material adhesion unit " of the present invention is the meaning that comprises the anti-deposition plate that is provided with so a plurality of cancellous jogs.

If adopt the 3rd evaporation coating device of the present invention, then utilize the relative wall to have the evaporated material adhesion unit of cancellous jog, the same with above-mentioned the 1st evaporation coating device of the present invention, adhere to energy but can increase from what the evaporated material of evaporation coating source evaporation can adhere on the wall of vacuum tank.Therefore, in vacuum tank, can reduce the particulate that causes owing to the dirt settling that comes off from wall and produce.Further, can improve the directive property of the evaporation coating film that on substrate, carries out evaporation coating.

The 4th evaporation coating device of the present invention possesses in order to address the above problem: make the evaporation coating unit that carries out evaporation coating from the evaporated material of evaporation coating source evaporation at substrate; Be given for space that aforesaid substrate and above-mentioned evaporation coating source are set and the vacuum tank that this space can be maintained vacuum; Evaporated material adhesion unit that be provided with, that above-mentioned relatively wall has cancellate protuberance and above-mentioned evaporated material is adhered at least a portion of the wall of above-mentioned vacuum tank.

If adopt the 4th evaporation coating device of the present invention, then the 1st, the 2nd and the 3rd evaporation coating device of the present invention with above-mentioned is the same, in vacuum tank, on substrate the evaporated material from the evaporation of evaporation coating source is carried out evaporation coating.

In the present invention, especially, possesses at least a portion of the wall of vacuum tank the evaporated material adhesion unit that this wall relatively has cancellate protuberance and evaporated material is adhered to.That is, for example, when a side below vacuum tank was provided with the evaporation coating source and a side is provided with substrate up, a side was provided with cancellate protuberance above evaporation coating source on the side wall surface of vacuum tank.Cancellate protuberance will be for example by will for example being arranged on wall that the square reticulation of 2mm forms by having a plurality of metal wires that the metals such as for example aluminium of the diameter about 1mm for example constitute.Perhaps, the net that also a plurality of metal wires that utilization is made of metals such as for example aluminium can be formed is installed on the wall.Perhaps, also can be installed on the wall being combined into cancellate a plurality of metal bar or metal sheet.Perhaps, also can be installed on the wall having the metal sheet that is arranged in cancellate a plurality of peristomes.And, cancellate protuberance also can be arranged on the wall of vacuum tank, possess, be used to anti-deposition plate that evaporated material is adhered to.That is, " evaporated material adhesion unit " of the present invention is the meaning that comprises the anti-deposition plate that is provided with so cancellate protuberance.

If adopt the 4th evaporation coating device of the present invention, then utilize the relative wall to have the evaporated material adhesion unit of cancellate protuberance, the same with above-mentioned the 1st evaporation coating device of the present invention, adhere to energy but can increase from what the evaporated material of evaporation coating source evaporation can adhere on the wall of vacuum tank.Therefore, in vacuum tank, can reduce the particulate that causes owing to the dirt settling that comes off from wall and produce.Further, can improve the directive property of the evaporation coating film that on substrate, carries out evaporation coating.

The of the present invention the 3rd or a form of the 4th evaporation coating device in, above-mentioned evaporated material adhesion unit is configured across predetermined distance from above-mentioned wall at least in part.

If adopt this form, evaporated material is adhered to.Therefore, can improve the capture rate that the evaporated material adhesion unit is caught evaporated material.Therefore, can further reduce the particulate that causes owing to dirt settling and produce, and further improve the directive property of the evaporation coating film that on substrate, carries out evaporation coating.

Evaporation coating method of the present invention is in order to address the above problem, comprise: form operation by utilizing above-mentioned of the present invention the 1st, 2,3 or 4 evaporation coating device (still, comprising various forms) to make above-mentioned evaporated material on aforesaid substrate, carry out the evaporation coating film that evaporation coating forms the evaporation coating film.

If adopt evaporation coating method of the present invention, then form in the operation at the evaporation coating film, reduce the particulate that causes owing to the dirt settling that comes off from wall and produce, and be reduced in the bounce-back of the evaporated material on the wall.Therefore, form in the operation, can carry out evaporation coating equably to the evaporation coating film in the whole zone of real estate or on than the scope of broad at the evaporation coating film.

The manufacture method of electro-optical assembly of the present invention comprises in order to address the above problem: utilize the inorganic alignment film formation operation that inorganic materials is formed the inorganic alignment film that electro-optical assembly uses as above-mentioned of the present invention the 1st, 2,3 or 4 the evaporation coating device in above-mentioned evaporation coating source on aforesaid substrate.

If adopt the manufacture method of electro-optical assembly of the present invention, then can carry out that high quality images shows, at projection display device, televisor, portable phone, electronic notebook, WP, the type or monitor in the manufacturing process of electro-optical assemblys such as operable liquid crystal indicator in the various electronicss such as video cassette recorder, workstation, videophone, POS terminal, touch pad of direct viewing type of finding a view, can carry out evaporation coating equably to inorganic alignment film in the whole zone of real estate or on than the scope of broad.

The 1st film deposition system of the present invention possesses in order to address the above problem: by make the particle that disperses from target piling up on the substrate on aforesaid substrate film forming one-tenth film unit; That between above-mentioned target and aforesaid substrate, be provided with and be formed with the shield member that makes the peristome that the above-mentioned particle that disperses passes through; On at least a portion on the surface of above-mentioned shield member, be provided with, have from above-mentioned surface outstanding separately a plurality of protuberances and a particle adhesion unit of dispersing that the above-mentioned particle that disperses is adhered to.

If adopt the 1st film deposition system of the present invention, then utilize into film unit, for example use sputtering method forms film on substrate.That is, utilize into film unit, on substrate, pile up from target (that is the base material of the film of formation) for example as the particle that disperses of sputtering particle.

Shield member is set between target and the substrate, and is formed with the peristome that makes the particle that disperses.Therefore, pile up from unwanted direction by shield member can suppress the to disperse surface of the relative substrate of particle.And shield member also can extend setting in the mode around for example covered substrate from that be provided with between target and substrate and main part that be formed with peristome.

In the present invention, especially, at least a portion on the surface of shield member possesses the particle adhesion unit of dispersing that has from this surface outstanding separately a plurality of protuberances.A plurality of protuberances for example in the surface of shield member on the part face relative with substrate being provided with in mode outstanding separately on the direction of substrate, in the surface of shield member on the part face relative with target to be provided with in mode outstanding separately on the direction of target.A plurality of protuberances for example to count width and the thickness about mm, outstanding for having only the eaves shape about several mm on the direction of substrate or target, are arranged in for example reticulation, striated etc. respectively on the surface of shield member.

Utilize such particle adhesion unit of dispersing, when can be on adhering to as dirt settling from the surface of particle of dispersing of target at shield member, increase the maintenance dose remain on this lip-deep dirt settling (that is, but can attached to the energy that adheres to of this lip-deep particle that disperses).In other words, can prolong the hold-time that remains on this lip-deep particle that disperses.Therefore, when becoming film unit to be carried out to film, the quantitative change of the particle that disperses that adheres on the surface of shield member is many, then can not keep the particle that disperses on this surface, can suppress or prevent that dirt settling from coming off from the surface of shield member.Therefore, can reduce the particulate that causes owing to the dirt settling that comes off from shield member produces.Like this, can improve the film quality of the film that on substrate, forms.

The 2nd film deposition system of the present invention possesses in order to address the above problem: by make the particle that disperses from target piling up on the substrate on aforesaid substrate film forming one-tenth film unit; That between above-mentioned target and aforesaid substrate, be provided with and be formed with the shield member that makes the peristome that the above-mentioned particle that disperses passes through; The particle adhesion unit of dispersing that be provided with, that have a plurality of recesses that cave in separately from above-mentioned surface and the above-mentioned particle that disperses is adhered at least a portion on the surface of above-mentioned shield member.

If adopt the 2nd film deposition system of the present invention, then the 1st film deposition system with above-mentioned is the same, utilizes into film unit, and for example use sputtering method forms film on substrate.

In the present invention, especially, at least a portion on the surface of shield member, possesses the particle adhesion unit of dispersing with a plurality of recesses that cave in separately from this surface.A plurality of recesses for example are provided with in the mode that caves in separately along the direction towards substrate on the part face relative with substrate in the surface of shield member, are provided with in the mode that caves in separately along the direction towards target on the part face relative with target in the surface of shield member.A plurality of recesses for example to count width and the thickness about mm, only cave in about number mm along the direction towards substrate or target respectively, are arranged in for example reticulation, striated etc. on the surface of shield member.

Utilize such particle adhesion unit of dispersing, the same with above-mentioned the 1st film deposition system of the present invention, when can be on adhering to, increase the maintenance dose that remains on this lip-deep dirt settling as dirt settling from the surface of particle of dispersing of target at shield member.Like this, can improve the film quality of the film that on substrate, forms.

The 3rd film deposition system of the present invention possesses in order to address the above problem: by make the particle that disperses from target piling up on the substrate on aforesaid substrate film forming one-tenth film unit; That between above-mentioned target and aforesaid substrate, be provided with and be formed with the shield member that makes the peristome that the above-mentioned particle that disperses passes through; The particle adhesion unit of dispersing that be provided with, that above-mentioned relatively surface has cancellous jog and the above-mentioned particle that disperses is adhered at least a portion on the surface of above-mentioned shield member.

If adopt the 3rd film deposition system of the present invention, then the 1st film deposition system with above-mentioned is the same, utilizes into film unit, and for example use sputtering method forms film on substrate.

In the present invention, especially, possessing relatively at least a portion on the surface of shield member, this surface has the particle adhesion unit of dispersing of cancellous jog.Utilize such particle adhesion unit of dispersing, the same with above-mentioned the 1st film deposition system of the present invention, when can be on adhering to, increase the maintenance dose that remains on this lip-deep dirt settling as dirt settling from the surface of particle of dispersing of target at shield member.

The 4th film deposition system of the present invention possesses in order to address the above problem: by make the particle that disperses from target piling up on the substrate on aforesaid substrate film forming one-tenth film unit; That between above-mentioned target and aforesaid substrate, be provided with and be formed with the shield member that makes the peristome that the above-mentioned particle that disperses passes through; The particle adhesion unit of dispersing that be provided with, that above-mentioned relatively surface has cancellate protuberance and the above-mentioned particle that disperses is adhered at least a portion on the surface of above-mentioned shield member.

If adopt the 4th film deposition system of the present invention, then the 1st film deposition system with above-mentioned is the same, utilizes into film unit, and for example use sputtering method forms film on substrate.

In the present invention, especially, possessing relatively at least a portion on the surface of shield member, this surface has the particle adhesion unit of dispersing of cancellate protuberance.Utilize such particle adhesion unit of dispersing, the same with above-mentioned the 1st film deposition system of the present invention, when can be on adhering to, increase the maintenance dose that remains on this lip-deep dirt settling as dirt settling from the surface of particle of dispersing of target at shield member.

Effect of the present invention and other advantage can be understood by the optimised form that is used to implement of following explanation.

Description of drawings

Fig. 1 is the side cut away view of medelling of formation that the evaporation coating device of the 1st embodiment is shown.

Fig. 2 is the oblique drawing that a plurality of eaves portion of the 1st embodiment is shown.

Fig. 3 is the orthographic plan that a plurality of eaves portion of the 1st embodiment is shown.

Fig. 4 is the amplification profile shown in the portion C 1 of enlarged view 1.

Fig. 5 is an oblique drawing corresponding with Fig. 2 in the 1st variation.

Fig. 6 is an oblique drawing corresponding with Fig. 2 in the 2nd embodiment.

Fig. 7 is an amplification profile corresponding with Fig. 4 among the 2nd embodiment.

Fig. 8 is an oblique drawing corresponding with Fig. 6 in the 2nd variation.

Fig. 9 is an orthographic plan corresponding with Fig. 3 in the 3rd embodiment.

Figure 10 is A-A ' the line sectional view of Fig. 9.

Figure 11 is the process picture sheet of flow process of manufacture method that the electro-optical assembly of the evaporation coating device that uses the 1st embodiment is shown.

Figure 12 is the side cut away view of medelling of formation that the sputter equipment of present embodiment is shown.

Nomenclature

10: the evaporation coating device; 11: exhaust system; 100: the chamber; 100a: side wall portion; 110: target; 110a: evaporated material; 120: the electron beam irradiation system; 150: eaves portion; 160: the evaporated material lamina affixad; 161: recess; 170: evaporated material adheres to net; 170a, 170b: metal wire; 210: substrate; 900: anchor clamps; 910: the support portion; 30: sputter equipment; 310: target; 410: wafer; 510: shield member; 550: the sputtering particle facies posterior hepatis.

Embodiment

Below, with reference to accompanying drawing embodiments of the present invention are described.

＜the 1 embodiment 〉

The evaporation coating device of the 1st embodiment is described referring to figs. 1 through Fig. 4.

At first, illustrate that with reference to Fig. 1 the integral body of the evaporation coating device of present embodiment constitutes.At this, Fig. 1 is the side cut away view of medelling of formation that the evaporation coating device of present embodiment is shown.And, in Fig. 1, for make each integrant become can be on drawing the size of the degree of identification, can make ratio to each integrant difference.Fig. 2 to Figure 10 afterwards also is the same.

In Fig. 1, evaporation coating device 10 possesses chamber 100.

Chamber 100 is examples of " vacuum tank " of the present invention, constitutes with for example aluminium, stainless steel and other metal materials or ferrous materials.

The inner wall section of chamber 100 in the chamber 100 internal rules space 101, in space 101, be provided with target 110, electron beam irradiation system 120 and substrate 210.And the part of the lateral parts of chamber 100 is constituted as with exhaust system 11 and is connected, and by the gas in the space 101 is discharged to outside the chamber 100, space 101 can be maintained vacuum.And exhaust system 11 is to comprise as the rotary pump of secondary gas barrier (for example, rough pump drainage with) with as the vacuum evacuating system of the turbomolecular pump of main exhaust device (for example, main pump drainage with).

Target 110 is the body pieces (bulk) of inorganic materials that for example become the formation material of inorganic alignment film in electro-optical assemblys such as liquid-crystal apparatus, and is placed in the not shown crucible.And target 110 is examples in " evaporation coating source " of the present invention.

Electron beam irradiation system 120 comprises the part of not shown filament and power-supply system, cooling water system, Controlling System and various wiring parts etc., is constituted as and can produces electron beam from filament.And electron beam irradiation system 120 is examples of " evaporation coating unit " of the present invention.

Substrate 210 is the suitable low temperature polycrystalline silicon substrates that use in electro-optical assemblys such as liquid-crystal apparatus.

In space 101, the side wall surface 100a that substrate 210 utilizes anchor clamps 900 to be retained as relative chamber 100 has certain inclination.Anchor clamps 900 by support portion 910 be fixed on chamber 100 above.

In the present embodiment, especially, 100 side wall surface 100a is provided with a plurality of eaves portion 150 as the example of " a plurality of protuberance " of the present invention in the chamber.A plurality of eaves portion 150 as later detailed description, protrudes the eaves shape respectively along the direction of comparing towards target 110 with the normal direction of side wall surface 100a.

Below, the formation to a plurality of eaves portion of the evaporation coating device of present embodiment except Fig. 1, also is elaborated to Fig. 4 with reference to Fig. 2.At this, Fig. 2 is the oblique drawing that a plurality of eaves portion of present embodiment is shown.Fig. 3 is the orthographic plan that a plurality of eaves portion of present embodiment is shown.Fig. 4 is the amplification profile shown in the portion C 1 of enlarged view 1.

As depicted in figs. 1 and 2, a side above target 110 on the side wall surface 100a of chamber 100 is being provided with a plurality of eaves portion 150 that protrudes the eaves shape respectively towards the direction of target 110 (that is, among Fig. 1 tiltedly direction) down.

A plurality of eaves portion 150 is made of for example metallic substance such as aluminium, stainless steel, copper, and is fixed on the side wall surface 100a respectively.

As shown in Figures 2 and 3, a plurality of eaves portion 150 (that is, along the direction of intersecting with the normal direction (that is Z direction) of bottom surface) forms thickness T 1 and interval D 1 is respectively for example striated about 1～2mm along the bottom surface on side wall surface 100a.That is, a plurality of eaves portion 150 forms as a plurality of row along the bottom surface on side wall surface 100a.

As shown in Figure 4, a plurality of eaves portion 150 forms respectively along the normal direction of the side wall surface 100a of relative chamber 100 (promptly, direction shown in the arrow line N among Fig. 4) downwards only the direction of deviation angle θ 1 (that is, among Fig. 4, the direction shown in the arrow line F) from the only outstanding length L 1 of side wall surface 100a.

A plurality of eaves portion 150 forms for for example mode about 1～2mm with length L 1.

Angle θ 1 is set to by the normal direction of the side wall surface 100a of chamber 100 (that is, among Fig. 4, the direction shown in the arrow line N) and the angle that forms towards the direction of target 110 from side wall surface 100a.In the present embodiment, angle θ 1 is set to the angle that is formed towards the direction of target 110 by the normal direction of the side wall surface 100a of chamber 100 (that is, among Fig. 4, the direction shown in the arrow line N) and the arbitrfary point P from the side wall surface 100a.And angle θ 1 also can be set to the mean value of each angle that is formed towards the direction of target 110 by the normal direction of the side wall surface 100a of chamber 100 (that is, among Fig. 4, the direction shown in the arrow line N) and the each point from the side wall surface 100a.Perhaps, angle θ 1 also can differ from one another to each of a plurality of eaves portion 150.

And when the anti-deposition plate that is provided for making evaporated material 110a to adhere on the side wall surface 100a in chamber 100, a plurality of eaves portion 150 also can be arranged on so anti-deposition plate.In addition, so a plurality of eaves portion also can be arranged on chamber 100 the bottom surface or with at least a portion of its facing surfaces on.

Below, the action of the evaporation coating device of present embodiment suitably is described referring to figs. 1 through Fig. 4.

In Fig. 1, in the evaporation coating process that evaporation coating device 10 carries out,, shine on the target 110 from electron beam system 120 divergent bundles.The target 110 that is shone by electron beam is heated, its part evaporation.Carry out evaporation coating from the evaporated material 110a of target evaporation at the substrate 210 that relative target 110 disposes obliquely relatively.

At this moment, 100 the side wall surface 100a flight or disperse of the part of evaporated material 110a towards the chamber, evaporated material 110a adheres to as dirt settling on side wall surface 100a.

Suppose not take any measure, if the amount of the dirt settling that adheres on side wall surface 100a increases, then dirt settling comes off from side wall surface 100a and also may produce particle.Space 101 in such particle contamination chamber 100 is reduced in the film quality of the evaporation coating film that carries out evaporation coating on the substrate 210.

Further, if the amount of the dirt settling that adheres on side wall surface 100a increases, then on side wall surface 100a, because evaporated material 110a is difficult to adhere to, therefore, the amount from side wall surface 100a bounce-back towards the evaporated material 110a of substrate 210 may increase.That is, the evaporated material 110a that arrives side wall surface 100a rebounds on side wall surface 100a, increases from the amount of the direction different with the direction (that is, from the direction of target 110 towards substrate 210) of regulation towards substrate 210.Therefore, might be reduced in the directive property of film forming evaporation coating film on the substrate 210.

Yet, referring to figs. 1 through Fig. 4, aforesaid, in the present embodiment, especially, the part of the side wall surface 100a of chamber 100 be provided with along with the normal direction of side wall surface 100a (promptly, among Fig. 4, direction shown in the arrow line N) compares a plurality of eaves portion 150 that protrudes the eaves shape towards the direction of target 110 (that is, among Fig. 4, the direction shown in the arrow line F).Therefore, can be when from the side wall surface 100a of evaporated material 110a in chamber 100 of target 110 evaporation, adhering to as dirt settling, increase the maintenance dose remain on the dirt settling on the side wall surface 100a (that is, but can attached to the energy that adheres to of the evaporated material 110a on the side wall surface 100a).

More specifically, utilize a plurality of eaves portion 150 on side wall surface 100a, be provided with, can increase the total surface area that to adhere to evaporated material 110a on the side wall surface 100a.Therefore, on side wall surface 100a, can in a plurality of eaves portion 150, adhere to evaporated material 110a more, that is, can increase the maintenance dose that remains on the dirt settling on the side wall surface 100a.Therefore, can prolong the hold-time that remains on the dirt settling on the side wall surface 100a.Therefore, in the evaporation coating process, the quantitative change of the evaporated material 110a that adheres to as dirt settling on the side wall surface 100a of chamber 100 is many, can suppress or prevent that dirt settling from coming off from side wall surface 100a.Therefore, in chamber 100, can reduce the particulate that causes owing to the dirt settling that comes off from side wall surface 100a and produce.Like this, can improve the film quality of the evaporation coating film that on substrate 210, carries out evaporation coating.

Further, as shown in Figure 4, a plurality of eaves portion 150 is owing to protrude the eaves shape along the direction of comparing towards target 110 with the normal direction of side wall surface 100a, therefore, evaporant enters between each the downside and side wall surface 100a of a plurality of eaves portion 150 easily, and, can make evaporated material 110a attached in a plurality of eaves portion 150 from side wall surface 100a bounce-back towards upside.That is, the material 110a that can reduce or avoid evaporating rebounds towards substrate 210 on the side wall surface 100a of chamber 100.In other words, can reduce or prevent that the evaporated material 110a different with the direction of stipulating is towards substrate 210.Therefore, can improve the directive property of the evaporation coating films such as inorganic alignment film that on substrate 210, carry out pre-tilt angle evaporation coating, that for example have regulation.That is, can form almost in the whole zone of the real estate of substrate 210 or on or evaporation coating film fully uniformly than the scope of broad.

As mentioned above, if adopt evaporation coating device 10, then owing to utilize along towards the outstanding a plurality of eaves portion 150 of the direction of target 110, but can increase from what the evaporated material 110a of target 110 evaporation can adhere on the side wall surface 110a of chamber 100 and adhere to energy, therefore, in chamber 100, can reduce the particulate that causes owing to the dirt settling that comes off from side wall surface 100a and produce.Further, can improve the directive property of the evaporation coating film that on substrate 210, carries out evaporation coating.

And, if adopt evaporation coating device 10, but, therefore, can also reduce the clean frequency of cleaning side wall surface 100a then because the energy that adheres to of the evaporated material 110a on the side wall surface 100a of chamber 100 improves.Perhaps, when a plurality of eaves portion 150 being arranged on the anti-deposition plate, can also reduce the clean frequency of cleaning anti-deposition plate or the replacing frequency of the deposition plate of more relieving a garrison.

As among Fig. 5 as shown in the variation, a plurality of eaves portion 150 also can be used as along a plurality of row along the direction (among Fig. 5, left and right directions) of bottom surface and forms on side wall surface 100a.At this, Fig. 5 is the oblique drawing corresponding with Fig. 2 of the 1st variation of the present invention.

That is, a plurality of eaves portion 150 also can be used as and comprises the row arranging a plurality of eaves 150a of portion and constitute, arranges a plurality of eaves 150b of portion and the row that constitute, arrange a plurality of eaves 150c of portion and a plurality of row of the row that constitute constitute.In this case, by reduce a plurality of eaves portion 150 each size or arrangement pitch narrowed down and on side wall surface 100a, form a plurality of eaves portion 150 morely, can increase the total surface area of a plurality of eaves portion 150.Therefore, can make evaporated material 110a more attached in a plurality of eaves portion 150.And the width W 1 of a plurality of eaves portion 150 can be arranged to for example about 1～2mm.

＜the 2 embodiment 〉

Below, the evaporation coating device of the 2nd embodiment is described with reference to Fig. 6 and Fig. 7.At this, Fig. 6 is the oblique drawing corresponding with Fig. 2 of the 2nd embodiment.Fig. 7 is the amplification profile corresponding with Fig. 4 of the 2nd embodiment.And, in Fig. 6 and Fig. 7,, suitably omit its explanation to giving identical reference symbol to the identical integrant of the integrant of the 1st embodiment shown in Figure 4 with Fig. 1.

As shown in Figure 6 and Figure 7, the evaporation coating device of present embodiment is on the side wall surface 100a of chamber 100, replace a plurality of eaves portion 150 of the 1st embodiment, possesses evaporated material lamina affixad 160, this point is different with the evaporation coating device of above-mentioned the 1st embodiment, for other point, roughly the same with the formation of the evaporation coating device of above-mentioned the 1st embodiment.

As shown in Figure 6 and Figure 7, be formed with a plurality of recesses 161 on evaporated material lamina affixad 160, evaporated material lamina affixad 160 is configured on the side wall surface 100a in the mode of the inboard depression of a plurality of recesses relative chambers 100 161.

As shown in Figure 6 and Figure 7, a plurality of recesses 161 are along the direction (that is, among Fig. 7, tiltedly descending direction) towards target 110, and the mode that caves in separately with relative target 110 forms.

Evaporated material lamina affixad 160 is made of for example metallic substance such as aluminium, stainless steel, copper, and is fixed on the side wall surface 100a.

As shown in Figure 6, a plurality of recesses 161 along the bottom surface (that is, along the direction of intersecting with the Z direction of the normal direction of bottom surface), are respectively with thickness T 2 and interval D 2 and for example form striated about 1～2mm on side wall surface 100a.That is, a plurality of recesses 161 form as a plurality of row along the bottom surface on side wall surface 100a.

As shown in Figure 7, a plurality of recesses 161 respectively along the normal direction of the side wall surface 100a of relative chamber 100 (promptly, among Fig. 7, direction shown in the arrow line N) only the direction of deviation angle θ 2 is (promptly downwards, among Fig. 7, direction shown in the arrow line G), the mode with the length L 2 that only caves in from the relative target 110 of side wall surface 100a forms.

A plurality of recesses 150 form for for example mode about 1～2mm with length L 2.

Angle θ 2 is set to by the normal direction of the side wall surface 100a of chamber 100 (that is, among Fig. 7, the direction shown in the arrow line N) and 110 direction forms from side wall surface 100a towards target angle.In the present embodiment, angle θ 2 is set to the angle that is formed by the normal direction of the side wall surface 100a of chamber 100 (that is, among Fig. 7, the direction shown in the arrow line N) and the direction from the arbitrfary point Q on the side wall surface 100a towards target 110.And angle θ 2 also can be set to the mean value by the normal direction of the side wall surface 100a of chamber 100 (that is, among Fig. 7, the direction shown in the arrow line N) and each angle that 110 direction forms from the each point on the side wall surface 100a towards target.Perhaps, angle θ 2 also can differ from one another for each of a plurality of depressed parts 161.

And, on the side wall surface 100a of chamber 100, also can form a plurality of recesses 161.In addition, as mentioned above, the evaporated material lamina affixad also can be arranged on chamber 100 the bottom surface or with at least a portion of its facing surfaces on.

In the present embodiment, especially, because the evaporated material lamina affixad 160 that constitutes is set on the side wall surface 100a of chamber 100 as mentioned above, therefore, with the roughly the same ground of the evaporation coating device of above-mentioned the 1st embodiment, can be when from the side wall surface 100a of evaporated material 110a in chamber 100 of target 110 evaporation, adhering to as dirt settling, increase the maintenance dose that remains on the dirt settling on the side wall surface 100a (that is, but can attached to the energy that adheres to of the evaporated material 110a on the side wall surface 100a).

More specifically, utilize a plurality of recesses 161 of the evaporated material lamina affixad 160 that is provided with at side wall surface 100a, can increase the total surface area that can adhere to evaporated material 110a of side wall surface 100a.Therefore, in side wall surface 100a, can make evaporated material 110a, that is, can increase the maintenance dose that remains on the dirt settling on the side wall surface 100a more attached on a plurality of recesses 161.

Therefore, can prolong the hold-time that remains on the dirt settling on the side wall surface 100a.Therefore, in the evaporation coating process, the quantitative change of the evaporated material 110a that adheres to as dirt settling on the side wall surface 100a of chamber 100 is many, can suppress or prevent that dirt settling from coming off from side wall surface 100a.Therefore, in chamber 100, can reduce the particulate that causes owing to the dirt settling that comes off from side wall surface 100a and produce.Like this, can improve the film quality of the evaporation coating film that on substrate 210, carries out evaporation coating.

Further, as shown in Figure 7, a plurality of recesses 161 are because along comparing with the normal direction of side wall surface 100a towards relative target 110 depressions of the direction of target 110, therefore, evaporated material 110a enters in a plurality of recesses 161 easily, and the evaporated material 110a that can make bounce-back in a plurality of recesses 161 is attached in a plurality of recesses 161.That is, the material 110a that can reduce or avoid evaporating rebounds towards substrate 210 on the side wall surface 100a of chamber 100.In other words, can reduce or prevent that the evaporated material 110a different with the direction of stipulating is towards substrate 210.Therefore, can improve the directive property of the evaporation coating films such as inorganic alignment film that on substrate 210, carry out pre-tilt angle evaporation coating, that for example have regulation.That is, can form almost in the whole zone of the real estate of substrate 210 or on or evaporation coating film fully uniformly than relative broad range.

As among Fig. 8 as shown in the variation, a plurality of recesses 161 of evaporated material lamina affixad 160 also can be used as along a plurality of row along the direction (among Fig. 8, left and right directions) of bottom surface and form.At this, Fig. 8 is the oblique drawing corresponding with Fig. 6 of the 2nd variation of the present invention.

That is, a plurality of recesses 161 also can be used as and comprise the row arranging a plurality of recess 161a and constitute, arrange a plurality of recess 161b and the row that constitute, arrange a plurality of recess 161c and a plurality of row of the row that constitute constitute.In this case, by reduce a plurality of recesses 161 each size or arrangement pitch narrowed down and on the evaporated material lamina affixad 160 that is configured on the side wall surface 100a, form a plurality of recesses 161 morely, can increase the total surface area of a plurality of recesses 161.Therefore, can make evaporated material 110a more attached to evaporated material lamina affixad 160 (especially in a plurality of recesses 161).And the width W 2 of a plurality of recesses 161 can be arranged to for example about 1～2mm.

＜the 3 embodiment 〉

Below, the evaporation coating device of the 3rd embodiment is described with reference to Fig. 9 and Figure 10.At this, Fig. 9 is the orthographic plan corresponding with Fig. 3 of the 3rd embodiment.Figure 10 is the sectional view of the A-A ' line of Fig. 9.And, in Fig. 9 and Figure 10, to giving identical reference symbol to the identical integrant of the integrant of the 1st embodiment shown in Figure 4, and suitably omit its explanation with Fig. 1.

As Fig. 9 and shown in Figure 10, the evaporation coating device of present embodiment is on the side wall surface 100a of chamber 100, replace a plurality of eaves portion 150 of the 1st embodiment and possess evaporated material and adhere to net 170, this point is different with the evaporation coating device of above-mentioned the 1st embodiment, and other point is roughly the same with the formation of the evaporation coating device of above-mentioned the 1st embodiment.

As Fig. 9 and shown in Figure 10, it is the metal wire 170a that is made of for example metallic substance such as aluminium, stainless steel, copper of braiding and 170b and the wire netting that constitutes that evaporated material adheres to net 170, and is fixed on the side wall surface 100a.The width W 3 of each of metal wire 170a and 170b and W4 are for example about 1mm, and arrange respectively about 2mm for example to be spaced apart.That is, evaporated material adheres to net 170 and forms to stipulate the mesh that 2mm for example is square or the mode braided metal line 170a and the 170b of grid.

As shown in figure 10, evaporated material adheres to net 170 and is fixed on the side wall surface 100a via the support portion 175 to per 1 of metal wire 170a (perhaps, metal wire 170b per 1) configuration, and partly only is configured across interval D 3 from side wall surface 100a.Like this, adhere between net 170 and the side wall surface 100a at evaporated material and partly form space 190.And interval D 3 is set to for example about 1～2mm.

In the present embodiment, especially, evaporated material adheres to net 170 because the side wall surface 100a of chamber 100 is provided with as constituted above, therefore, with the evaporation coating device of above-mentioned the 1st embodiment roughly similarly, can be when from the side wall surface 100a of evaporated material 110a in chamber 100 of target 110 evaporation, adhering to as dirt settling, increase the maintenance dose that remains on the dirt settling on the side wall surface 100a (that is, but can attached to the energy that adheres to of the evaporated material 110a on the side wall surface 100a).

More specifically, utilize by being formed in the last evaporated material that is provided with of side wall surface 100a and adhere to the metal wire 170a of net 170 and the mesh that 170b constitutes, can increase the total surface area that can adhere to evaporated material 110a of side wall surface 100a.Therefore, on side wall surface 100a, can make evaporated material 110a more attached on metal wire 170a and the 170b.That is, can increase the maintenance dose that remains on the dirt settling on the side wall surface 100a.

Therefore, can prolong the hold-time that remains on the dirt settling on the side wall surface 100a.Therefore, in the evaporation coating process, the quantitative change of the evaporated material 110a that adheres to as dirt settling on the side wall surface 100a of chamber 100 is many, can suppress or prevent that dirt settling from coming off from side wall surface 100a.Therefore, in chamber 100, can reduce the particulate that causes owing to the dirt settling that comes off from side wall surface 100a and produce.Like this, can improve the film quality of the evaporation coating film that on substrate 210, carries out evaporation coating.

Further, in Figure 10, in the present embodiment especially, as mentioned above, evaporated material adheres to net 170 and partly only is configured across interval D 3 from side wall surface 100a.Therefore, evaporated material 110a is adhered between net 170 and the side wall surface 100a attached to evaporated material.That is, can also make evaporated material 11a that the mesh that adheres to net 170 by evaporated material arrives space 190 with at the evaporated material 110a that rebounds on the side wall surface 100a attached to adhering on the relative side of the side wall surface 100a of net 170 with evaporated material.Therefore, can improve by evaporated material and adhere to the capture rate that net 170 is caught evaporated material 110a.Therefore, can further reduce the particulate that causes owing to dirt settling and produce, and can further improve the directive property of the evaporation coating film that on substrate, carries out evaporation coating.

And, in the present embodiment,, the evaporated material that the braided metal line is formed is arranged on the side wall surface 100a though adhering to net 170,, also can be arranged on the side wall surface 100a being combined into cancellate a plurality of metal bar or metal sheet.Perhaps, also can be arranged on the side wall surface 100a having the metal sheet that is arranged in cancellate a plurality of peristomes.In these cases, also with evaporated material to be adhered to the situation that net 170 is arranged on the side wall surface 100a the same, utilization is combined into cancellate a plurality of metal bar or metal sheet, perhaps have the metal sheet that is arranged in cancellate a plurality of peristomes, can improve the capture rate of catching evaporated material 110a.

(manufacture method of electro-optical assembly)

Below, use the evaporation coating device of above-mentioned present embodiment, the method for making electro-optical assembly is described with reference to Figure 11.At this, as an example of electro-optical assembly, to be manufactured on as clamping between the device substrate of a pair of substrate and the counter substrate as the liquid crystal of an example of electro-optical substance and the situation of the liquid-crystal apparatus that constitutes describe.Figure 11 is the process picture sheet that this manufacturing process is shown.

In Figure 11, at first, on the one hand, on device substrate, by existing film shaped technology and patterning technique etc., make (step S1) such as various wirings, various electronic component, various electrode, various built-in circuits aptly according to the Machine Type that should make.Then, use the evaporation coating device 10 of above-mentioned embodiment, at the inorganic alignment film (step S2) that forms pre-tilt angle on the device substrate on the surface of a side of counter substrate by the oblique evaporation plated film with regulation.

On the other hand, on counter substrate,, make (step S3) such as various electrodes, various photomask, various chromatic filter, various micro lens aptly according to the Machine Type that should make by existing film shaped technology and graph technology etc.Then, use the evaporation coating device 10 of above-mentioned embodiment, at the inorganic alignment film (step S4) that forms pre-tilt angle on the counter substrate on the surface of device substrate one side by the oblique evaporation plated film with regulation.

Then, use the sealing material that is made of for example ultraviolet hardening resin, thermosetting resin etc., a pair of device substrate and the counter substrate that will be formed with inorganic alignment film in two relative modes of inorganic alignment film are carried out bonding (step S5).Then, through between adherent substrates, for example use vacuum attraction etc. to inject liquid crystal at these, and with sealing materials such as for example caking agent seal, go forward side by side one go on foot clean, inspection etc. (step S6).

By above step, possess evaporation coating device 10 by above-mentioned embodiment and use the manufacturing of the liquid-crystal apparatus of the inorganic alignment film that the oblique evaporation plated films form to finish.Like this, owing to use the evaporation coating device 10 of above-mentioned embodiment to form inorganic alignment film, therefore,, then can carry out evaporation coating equably to inorganic alignment film in the whole zone of real estate or on than the scope of broad if adopt this manufacture method.

＜film deposition system 〉

The film deposition system of present embodiment is described with reference to Figure 12.Below, as an example of film deposition system of the present invention, be that example describes with the sputter equipment.

Figure 12 is the side cut away view of medelling of formation that the sputter equipment of present embodiment is shown.And, in Figure 12, become the size of the degree that on drawing, can recognize in order to make each integrant, each integrant there is different ratios.

In Figure 12, the sputter equipment 30 of present embodiment possesses chamber 300.

In chamber 300, be provided with target 310, power-supply system 320 and wafer 410.And target 310 is examples of " target " of the present invention, and power-supply system 320 constitutes an example of " one-tenth film unit " of the present invention, and wafer 410 is examples of " substrate " of the present invention.In addition, power-supply system 320 also can be arranged on outside the chamber 300.

Target 310 is base materials of the film that forms on as the wafer 410 of silicon wafer for example.Target 310 and interval relative dispose of wafer 410 with regulation.Wafer 410 by support portion 810 be fixed on chamber 300 above.

When sputter equipment 30 work, for example, illustrated vapor pipe never to chamber 300 in after the extracting vacuum, never illustrated gas introduction tube imports for example Ar gas with the flow of regulation, apply voltage by power-supply system 320 at (that is, at the electrode of wafer 410 1 sides setting with between the electrode that target 310 1 sides are provided with) between wafer 410 and the target 310.If like this, the surface of the Ar ion sputtering target 310 that then in the plasma that is generated, quickens, and form film by sputtering particle 310a is piled up on wafer 410.And sputtering particle 310a is an example of " particle disperses " of the present invention.

Further, in chamber 300, be provided with shield member 510.Shield member 510 is provided with in the mode from target 310 1 side cover wafers 410, and can make the sputter example 310a from target 310 form peristome 510a towards wafer 410 progressive modes.Therefore, utilize shield member 510, can suppress the surface of the relative wafer 410 of sputtering particle 310a and pile up from unwanted direction.

In the present embodiment, especially, possesses sputtering particle facies posterior hepatis 550 on the surface of shield member 510 as an example of " the particle adhesion unit of dispersing " of the present invention.Sputtering particle facies posterior hepatis 550 (promptly, sputtering particle facies posterior hepatis 550a and 550b) be to adhere to the wire netting of net 170 identical formations with the evaporated material of the evaporation coating device of above-mentioned the 3rd embodiment of reference Fig. 9 and Figure 10, and be fixed on the surface of shield member 510.Sputtering particle facies posterior hepatis 550a is set in the surface of shield member 510 on the part face relative with wafer 410, and sputtering particle facies posterior hepatis 550b is set in the surface of shield member 510 on the part face relative with target 310.Therefore, can when on the surface of shield member 510, adhering to, increase the maintenance dose that remains on this lip-deep dirt settling as dirt settling from the sputtering particle 310a of target 310.That is, can prolong the hold-time of the lip-deep sputtering particle 310a that remains on shield member 510.Therefore, when sputter equipment 30 carried out film forming, the quantitative change of the sputtering particle 310a that adheres on the surface of shield member 510 was many, can suppress or prevent that dirt settling from coming off from the surface of shield member 510.Therefore, can reduce the particulate that causes owing to the dirt settling that comes off from shield member 510 produces.Like this, can improve the film quality of the film that on wafer 410, forms.In addition, can prolong and remove the 310 needed cycles of sputtering particle of on shield member 510, adhering to, that is, can prolong the maintenance intervals of sputter equipment 30.

At this, sputtering particle facies posterior hepatis 550 also can be and a plurality of eaves portion referring to figs. 1 through a plurality of eaves portion 150 identical formations of the evaporation coating device of the 1st above-mentioned embodiment of Fig. 5.More specifically, for example, the a plurality of eaves portion that sputtering particle facies posterior hepatis 550a also can be used as to be provided with in mode outstanding separately on the direction of wafer 410 is provided with, and a plurality of eaves portion that sputtering particle facies posterior hepatis 550b also can be used as to be provided with in mode outstanding separately on the direction of target 310 is provided with.In this case, also can prolong the hold-time of the lip-deep sputtering particle 310a that remains on shield member 510.

Perhaps, sputtering particle facies posterior hepatis 550 also can be the sputtering particle lamina affixad with the evaporated material lamina affixad 160 identical formations of the evaporation coating device of above-mentioned the 2nd embodiment of reference Fig. 6 and Fig. 7.More specifically, for example sputtering particle facies posterior hepatis 550a also can be used as the sputtering particle lamina affixad setting with a plurality of recesses that are provided with in the mode that caves in separately along the direction towards wafer 410, and sputtering particle facies posterior hepatis 550b also can be used as the sputtering particle lamina affixad setting that has with a plurality of recesses that are provided with in the mode that caves in separately on the direction of target 310.In this case, also can prolong the hold-time of the lip-deep sputtering particle 310a that remains on shield member 510.And, by so a plurality of recesses are formed, also can constitute sputtering particle facies posterior hepatis 550 on shield member 510.

The present invention is not limited to above-mentioned embodiment, change aptly in the main idea of the invention that can in the scope of not violating the Accessory Right requirement and specification sheets integral body, read or the scope of thought, follow evaporation coating device, the evaporation coating method of such change and use the manufacture method and the film deposition system of the electro-optical assembly of this evaporation coating device to be also contained in the technical scope of the present invention.

Claims (18)

1. evaporation coating device is characterized in that possessing:

The evaporation coating unit, it makes from the evaporated material of evaporation coating source evaporation and carries out evaporation coating at substrate;

Vacuum tank, it is given for the space that above-mentioned evaporation coating source and aforesaid substrate are set and this space can be maintained vacuum; And

The evaporated material adhesion unit, it is set at least a portion of wall of above-mentioned vacuum tank, has towards comparing with the normal direction of above-mentioned wall towards the outstanding separately a plurality of protuberances of the direction in above-mentioned evaporation coating source, and above-mentioned evaporated material is adhered to.

2. evaporation coating device as claimed in claim 1 is characterized in that:

Above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank;

On the side wall surface of above-mentioned a plurality of protuberance in above-mentioned wall, as arranging along a plurality of row of the direction of intersecting with the normal direction of above-mentioned bottom surface.

3. evaporation coating device as claimed in claim 1 is characterized in that:

Above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank;

On the side wall surface of above-mentioned a plurality of protuberance in above-mentioned wall, with each self-forming of mode of extending along the direction of intersecting with the normal direction of above-mentioned bottom surface.

4. as claim 2 or 3 described evaporation coating devices, it is characterized in that: above-mentioned side wall surface and above-mentioned bottom surface adjacency.

5. evaporation coating device is characterized in that possessing:

The evaporation coating unit, it makes from the evaporated material of evaporation coating source evaporation and carries out evaporation coating at substrate;

Vacuum tank, it is given for the space that aforesaid substrate and above-mentioned evaporation coating source are set and this space can be maintained vacuum; And

The evaporated material adhesion unit, it is set at least a portion of wall of above-mentioned vacuum tank, have a plurality of recesses that cave in separately towards the direction and the relative above-mentioned evaporation coating source in above-mentioned evaporation coating source along comparing, and above-mentioned evaporated material is adhered to the normal direction of above-mentioned wall.

6. evaporation coating device as claimed in claim 5 is characterized in that: each the space of internal surface regulation by above-mentioned a plurality of recesses has the shape of extending along towards the direction in above-mentioned evaporation coating source.

7. evaporation coating device as claimed in claim 5 is characterized in that:

Above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank;

Above-mentioned a plurality of recess is on the side wall surface of above-mentioned vacuum tank, as arranging along a plurality of row of the direction of intersecting with the normal direction of above-mentioned bottom surface.

8. evaporation coating device as claimed in claim 5 is characterized in that:

Above-mentioned evaporation coating source is configured on the bottom surface of above-mentioned vacuum tank;

Above-mentioned a plurality of recess is on the side wall surface of above-mentioned vacuum tank, with each self-forming of mode of extending along the direction of intersecting with the normal direction of above-mentioned bottom surface.

9. as claim 7 or 8 described evaporation coating devices, it is characterized in that: above-mentioned side wall surface and above-mentioned bottom surface adjacency.

10. evaporation coating device is characterized in that possessing:

The evaporation coating unit, it makes from the evaporated material of evaporation coating source evaporation and carries out evaporation coating at substrate;

Vacuum tank, it is given for the space that aforesaid substrate and above-mentioned evaporation coating source are set and this space can be maintained vacuum; And

The evaporated material adhesion unit, it is set at least a portion of wall of above-mentioned vacuum tank, and above-mentioned relatively wall has cancellous jog, and above-mentioned evaporated material is adhered to.

11. an evaporation coating device is characterized in that possessing:

The evaporation coating unit, it makes from the evaporated material of evaporation coating source evaporation and carries out evaporation coating at substrate;

Vacuum tank, it is given for the space that aforesaid substrate and above-mentioned evaporation coating source are set and this space can be maintained vacuum; And

The evaporated material adhesion unit, it is set at least a portion of wall of above-mentioned vacuum tank, and above-mentioned relatively wall has cancellate protuberance, and above-mentioned evaporated material is adhered to.

12. as claim 10 or 11 described evaporation coating devices, it is characterized in that: above-mentioned evaporation coating material adhesion unit is configured across predetermined distance from above-mentioned wall at least in part.

13. an evaporation coating method is characterized in that: any described evaporation coating device that comprises by utilizing claim 1 to 12 carries out the evaporation coating film formation operation that evaporation coating forms the evaporation coating film to above-mentioned evaporated material on aforesaid substrate.

14. the installation method of an electro-optical assembly is characterized in that: comprise utilization inorganic materials is formed operation as any described evaporation coating device of the claim 1 to 12 in above-mentioned evaporation coating source forms the inorganic alignment film that electro-optical assembly uses on aforesaid substrate inorganic alignment film.

15. a film deposition system is characterized in that possessing:

Become film unit, it forms film by making the particle that disperses from target on aforesaid substrate piling up on the substrate;

Shield member, it is set between above-mentioned target and the aforesaid substrate and is formed with the peristome that the above-mentioned particle that disperses is passed through; And

The particle adhesion unit of dispersing, it is set at least a portion on surface of above-mentioned shield member, has from above-mentioned surface outstanding separately a plurality of protuberances, and the above-mentioned particle that disperses is adhered to.

16. a film deposition system is characterized in that possessing:

Become film unit, it forms film by making the particle that disperses from target on aforesaid substrate piling up on the substrate;

Shield member, it is set between above-mentioned target and the aforesaid substrate and is formed with the peristome that the above-mentioned particle that disperses is passed through; And

The particle adhesion unit of dispersing, it is set at least a portion on surface of above-mentioned shield member, has a plurality of recesses that cave in separately from above-mentioned surface, and the above-mentioned particle that disperses is adhered to.

17. a film deposition system is characterized in that possessing:

Become film unit, it forms film by making the particle that disperses from target on aforesaid substrate piling up on the substrate;

Shield member, it is set between above-mentioned target and the aforesaid substrate and is formed with the peristome that the above-mentioned particle that disperses is passed through; And

The particle adhesion unit of dispersing, it is set at least a portion on surface of above-mentioned shield member, and above-mentioned relatively surface has cancellous jog, and the above-mentioned particle that disperses is adhered to.

18. a film deposition system is characterized in that possessing:

Become film unit, it forms film by making the particle that disperses from target on aforesaid substrate piling up on the substrate;

Shield member, it is set between above-mentioned target and the aforesaid substrate and forms the peristome that the above-mentioned particle that disperses is passed through; And

The particle adhesion unit of dispersing, it is set at least a portion on surface of above-mentioned shield member, and above-mentioned relatively surface has cancellate protuberance, and the above-mentioned particle that disperses is adhered to.

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