CN110453181A - Evaporated device and its prevent plate - Google Patents
Evaporated device and its prevent plate Download PDFInfo
- Publication number
- CN110453181A CN110453181A CN201910728994.1A CN201910728994A CN110453181A CN 110453181 A CN110453181 A CN 110453181A CN 201910728994 A CN201910728994 A CN 201910728994A CN 110453181 A CN110453181 A CN 110453181A
- Authority
- CN
- China
- Prior art keywords
- plate
- rough surface
- radiant heat
- supporting substrate
- evaporated device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of evaporated device, the evaporated device includes: a shell, and a vapor deposition chamber is formed in the shell；One crucible, be set to it is described vapor deposition it is intracavitary, to accommodate an evaporation material；And one prevent plate, it is intracavitary to be set to the vapor deposition, and it is described prevent plate positioned at the shell and the crucible between, described to prevent that plate includes: a supporting substrate, the supporting substrate is with a rough surface；And a radiant heat absorbent layer, it is set on the rough surface.
Description
Technical field
The present invention relates to evaporation coating technique fields, more particularly to a kind of evaporated device and its prevent plate.
Background technique
Make high-res oled panel using evaporation coating technique in existing production technology, and during vapor deposition, substrate with
It defines pixel to be placed in together in the metal cavity of high vacuum at the metal mask plate (mask) of film location, the material in crucible passes through
Evaporation deposition is heated on substrate, in the material meeting cavity wall of most vaporization during this.When accumulating excessive, material can take off
From formation particle contamination product.Current practice be on vacuum cavity inner wall install removably prevent plate periodically to replace,
Reduce the probability that the above problem occurs.
However, evaporation source has been at the condition of high temperature during vapor deposition, it can also pass through radiation while vaporizing material
Mode transmit energy to surrounding, such as substrate, metal mask plate and prevent plate.And radiant heat prevents plate surface by metal
Reflection will affect metal mask plate, causes to generate dislocation between substrate and metal mask plate or oled panel is made to generate part
mura。
Therefore, it is necessary to a kind of evaporated device is provided and its prevents plate, to solve the problems of prior art.
Summary of the invention
The purpose of the present invention is to provide a kind of evaporated device and its prevent plate, inhibits heat radiation to substrate and metal mask
The influence of plate to reduce dislocation caused by thermal expansion and the generation of mura, and then promotes product resolution ratio and yield.
To reach foregoing purpose of the invention, the present invention provides a kind of evaporated device, and the evaporated device includes:
One shell is formed with a vapor deposition chamber in the shell；
One crucible, be set to it is described vapor deposition it is intracavitary, to accommodate an evaporation material；And
One prevents plate, be set to it is described vapor deposition it is intracavitary, and it is described prevent plate between the shell and the crucible,
It is described to prevent that plate includes:
One supporting substrate, the supporting substrate have a rough surface；And
One radiant heat absorbent layer, is set on the rough surface.
An embodiment according to the present invention, the rough surface is towards the crucible.
An embodiment according to the present invention, the rough surface are formed on the supporting substrate by a blasting treatment.
An embodiment according to the present invention, the radiant heat absorbent layer are a black passivation layer or a black Teflon coating.
It is described to prevent that plate includes: the present invention also provides a kind of plate of preventing for evaporated device
One supporting substrate, the supporting substrate have a rough surface；And
One radiant heat absorbent layer, is set on the rough surface.
An embodiment according to the present invention, the radiant heat absorbent layer are black.
An embodiment according to the present invention, the radiant heat absorbent layer are a black passivation layer or a black Teflon coating.
An embodiment according to the present invention, the material of the radiant heat absorbent layer include metal oxide, ceramics, titanium nitride
(TiN), silicon nitride (SiN), graphite, carbon fiber or combinations thereof.
An embodiment according to the present invention, the rough surface are a ripple toothing, a broached-tooth design or an array recess
Structure.
An embodiment according to the present invention, the supporting substrate are a stainless steel plate.
The invention has the benefit that reduced by preventing the radiant heat absorbent layer on plate radiant heat reflex to substrate and
Metal mask plate.Thus, it is possible to reduce the thermal expansion of substrate and metal mask plate, and then promote film-forming accuracy and product point
Resolution.In addition, substrate temperature is inhibited to increase the product yield that can promote organic film.
Detailed description of the invention
For above content of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate institute's accompanying drawings, makees
Detailed description are as follows:
Fig. 1 is an a kind of schematic diagram of evaporated device according to an embodiment of the invention.
Fig. 2 is an a kind of partial enlargement of semi-finished product for preventing plate for evaporated device according to an embodiment of the invention
Schematic diagram.
Fig. 3 is an a kind of partial enlargement diagram of finished goods for preventing plate for evaporated device of embodiment in Fig. 2.
Fig. 4 is a kind of schematic diagram for preventing plate for evaporated device of another embodiment of the present invention.
Specific embodiment
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.Furthermore the direction term that the present invention is previously mentioned, for example, above and below, top, bottom, front, rear, left and right, inside and outside, side, surrounding, in
Centre, it is horizontal, laterally, vertically, longitudinally, axial direction, radial direction, top layer or lowest level etc., be only the direction with reference to annexed drawings.Cause
This, the direction term used is to illustrate and understand the present invention, rather than to limit the present invention.
Please refer to Fig. 1, present embodiments provide a kind of evaporated device 100, the evaporated device 100 include a shell 110,
One crucible 120 and one prevents plate 140.
A vapor deposition chamber 111 is formed in the shell 100, the shell 100 can be enclosed by muti-piece plate body and be constituted.It is described
Shell 100 can be made by metal material, such as stainless steel.In Fig. 1 only schematically illustrate the shell 110 and
The shape of the vapor deposition chamber 111, in actual products, the shape of the shell 110 and the vapor deposition chamber 111 are not limited to this.
During vapor deposition, a metal mask plate 150 and a substrate 160 will be placed in the vapor deposition chamber 111.
The crucible 120 is set in the vapor deposition chamber 111, and the crucible 120 is to accommodate an evaporation material 130.Institute
Stating crucible 120 can be heated for evaporating the evaporation material 130.In order to allow the evaporation material 130 can be with thermally equivalent, institute
Stating crucible 120 can be made of metal material.Preferably, fusing point height and the higher metal material of thermal conductivity, such as titanium,
Tungsten, tantalum, key etc..
It is described to prevent that plate 140 is set in the vapor deposition chamber 111, and it is described prevent plate 111 be located at the shell 110 with
Between the crucible 120.Prevent that plate 140 includes: a supporting substrate 141 and a radiant heat absorbent layer referring to figure 2. and described in Fig. 3
143.The supporting substrate 141 has a rough surface 142, and the radiant heat absorbent layer 143 is set to the rough surface
On 142.
The supporting substrate 141 can be as made by metal material.Such as the supporting substrate 141 can be a stainless steel
Plate.The rough surface 142 is towards the crucible 120, it may also be said to which the rough surface 142 is towards the evaporation material 130.
Referring to figure 2., by taking the supporting substrate 141 is stainless steel plate as an example, the rough surface 142 can pass through a blasting treatment shape
At on the supporting substrate 141.It should be understood that other similarity surface processing also can be used in the rough surface 142
Technology (such as pickling, etching etc.) is formed on the supporting substrate 141.Referring to figure 2. to Fig. 4, the rough surface 142 can
Think a ripple toothing (as shown in Figures 2 and 3), a broached-tooth design (as shown in Figure 4) or an array sunk structure.
The radiant heat absorbent layer 143 can be formed in the supporting substrate 141 according to the fluctuating of the rough surface 142
On.The radiant heat absorbent layer 143 can be black or, such as the color of the dark system such as blue, brown.It should be understood that
It is that the color of dark color system has the effect for absorbing radiant heat, wherein the effect with black is the most significant.The radiant heat absorbent layer
143 can be a black passivation layer or a black Teflon coating.The material of the radiant heat absorbent layer 143 may include metal
Oxide, ceramics, titanium nitride (TiN), silicon nitride (SiN), graphite, carbon fiber or combinations thereof.The radiant heat absorbent layer 143 can
To pass through painting black Teflon coating or the coating containing materials such as graphite, carbon fibers, depositing titanium nitride (TiN) or nitridation
The technologies such as silicon (SiN) film or blackening process are formed on the rough surface 142.The blackening process can be by violent
Oxidation reaction the metal-oxide film of black/dark is formed on the rough surface 142.It should be understood that described
Radiant heat absorbent layer 143 can also be formed using other process for treating surface for forming black/dark.Such as appropriate erosion
Black/dark film layer can also be formed in metal surface by carving.
Therefore, during vapor deposition, the rough surface 142 for preventing plate 140 can be directly anti-to avoid radiant heat
It is mapped to the metal mask plate 150 and the substrate 160, and the radiant heat absorbent layer 143 can be absorbed directly from described
120 radiant heat of crucible or the radiant heat after reflection.
The invention has the benefit that reduced by preventing the radiant heat absorbent layer on plate radiant heat reflex to substrate and
Metal mask plate.Thus, it is possible to reduce the thermal expansion of substrate and metal mask plate, and then promote film-forming accuracy and product point
Resolution.In addition, substrate temperature is inhibited to increase the product yield that can promote organic film.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of evaporated device, it is characterised in that: the evaporated device includes:
One shell is formed with a vapor deposition chamber in the shell；
One crucible, be set to it is described vapor deposition it is intracavitary, to accommodate an evaporation material；And
One prevents plate, be set to it is described vapor deposition it is intracavitary, and it is described prevent plate between the shell and the crucible, it is described
Prevent that plate includes:
One supporting substrate, the supporting substrate have a rough surface；And
One radiant heat absorbent layer, is set on the rough surface.
2. evaporated device as described in claim 1, it is characterised in that: the rough surface is towards the crucible.
3. evaporated device as described in claim 1, it is characterised in that: the rough surface is formed in by a blasting treatment
On the supporting substrate.
4. evaporated device as described in claim 1, it is characterised in that: the radiant heat absorbent layer is a black passivation layer or one
Black Teflon coating.
5. a kind of prevent plate for evaporated device, it is characterised in that: described to prevent that plate includes:
One supporting substrate, the supporting substrate have a rough surface；And
One radiant heat absorbent layer, is set on the rough surface.
6. preventing plate as claimed in claim 5, it is characterised in that: the radiant heat absorbent layer is black.
7. preventing plate as claimed in claim 5, it is characterised in that: the radiant heat absorbent layer is that a black passivation layer or one are black
Color Teflon coating.
8. preventing plate as claimed in claim 5, it is characterised in that: the material of the radiant heat absorbent layer is aoxidized comprising metal
Object, ceramics, titanium nitride (TiN), silicon nitride (SiN), graphite, carbon fiber or combinations thereof.
9. preventing plate as claimed in claim 5, it is characterised in that: the rough surface is a ripple toothing, a sawtooth knot
Structure or an array sunk structure.
10. preventing plate as claimed in claim 5, it is characterised in that: the supporting substrate is a stainless steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910728994.1A CN110453181A (en) | 2019-08-08 | 2019-08-08 | Evaporated device and its prevent plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910728994.1A CN110453181A (en) | 2019-08-08 | 2019-08-08 | Evaporated device and its prevent plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110453181A true CN110453181A (en) | 2019-11-15 |
Family
ID=68485401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910728994.1A Pending CN110453181A (en) | 2019-08-08 | 2019-08-08 | Evaporated device and its prevent plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110453181A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647854A (en) * | 2020-07-02 | 2020-09-11 | Tcl华星光电技术有限公司 | Evaporation heating source device, manufacturing method thereof and evaporation device |
| CN113373421A (en) * | 2021-06-08 | 2021-09-10 | 京东方科技集团股份有限公司 | Anti-sticking plate, preparation method thereof and evaporation equipment |
| CN114086125A (en) * | 2021-11-19 | 2022-02-25 | 乐金显示光电科技(中国)有限公司 | Glass substrate evaporation device |
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| CN1952206A (en) * | 2005-10-21 | 2007-04-25 | 三星Sdi株式会社 | Apparatus and method for depositing thin films |
| CN101050519A (en) * | 2006-04-05 | 2007-10-10 | 精工爱普生株式会社 | Evaporation apparatus, evaporation method, method of manufacturing electro-optical device, and film-forming apparatus |
| CN103249858A (en) * | 2010-12-09 | 2013-08-14 | 株式会社爱发科 | Apparatus for forming organic thin film |
| CN104032259A (en) * | 2013-03-07 | 2014-09-10 | 富士胶片株式会社 | Adhesion-prevention Plate Used For Vacuum Film-forming Device And Applications Thereof |
| CN104508172A (en) * | 2012-11-13 | 2015-04-08 | 三菱重工业株式会社 | Vacuum vapor deposition apparatus |
| CN107287559A (en) * | 2017-06-22 | 2017-10-24 | 深圳市华星光电技术有限公司 | OLED evaporated devices and its Antisticking |
| CN207512253U (en) * | 2017-09-21 | 2018-06-19 | 深圳市柔宇科技有限公司 | Evaporation mask plate and mask plate component |
| CN109983558A (en) * | 2016-12-14 | 2019-07-05 | 株式会社爱发科 | Film formation device and film build method |
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Patent Citations (8)
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| CN1952206A (en) * | 2005-10-21 | 2007-04-25 | 三星Sdi株式会社 | Apparatus and method for depositing thin films |
| CN101050519A (en) * | 2006-04-05 | 2007-10-10 | 精工爱普生株式会社 | Evaporation apparatus, evaporation method, method of manufacturing electro-optical device, and film-forming apparatus |
| CN103249858A (en) * | 2010-12-09 | 2013-08-14 | 株式会社爱发科 | Apparatus for forming organic thin film |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647854A (en) * | 2020-07-02 | 2020-09-11 | Tcl华星光电技术有限公司 | Evaporation heating source device, manufacturing method thereof and evaporation device |
| CN113373421A (en) * | 2021-06-08 | 2021-09-10 | 京东方科技集团股份有限公司 | Anti-sticking plate, preparation method thereof and evaporation equipment |
| CN114086125A (en) * | 2021-11-19 | 2022-02-25 | 乐金显示光电科技(中国)有限公司 | Glass substrate evaporation device |
| CN114086125B (en) * | 2021-11-19 | 2024-03-01 | 乐金显示光电科技(中国)有限公司 | Glass substrate vapor deposition device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191115 |
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| RJ01 | Rejection of invention patent application after publication |