JP2010174344A - Film deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of sufficiently suppressing the peel-off of a film deposited other than a surface to be film-deposited of an object. <P>SOLUTION: In the film deposition apparatus, an object is film-deposited by depositing particles flying from a material source on the object in a chamber of the predetermined atmosphere. A deposition preventive plate 5 having fins 52 arrayed in a plurality of rows is provided in the chamber. Each of the fins 52 is arranged at the position deviated in the array direction with respect to the fins 52 of the adjacent rows. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a film forming apparatus.

  2. Description of the Related Art A film forming apparatus that adheres and deposits particles emitted from a material source such as a target or a vapor deposition material on a substrate is widely used. In such a film forming apparatus, for example, particles are emitted from a material source in a state where the substrate is placed in a vacuum atmosphere chamber, and the emitted particles reach the film formation surface of the target object of the substrate. Then, a film made of the material is formed on the film formation surface. As such a film formation technique, for example, a vapor deposition method, a sputtering method, and the like are known.

  In the film forming apparatus, particles emitted from the material source are emitted not only in the direction of the object but in a wide range. For this reason, a film is also formed on the wall of the chamber. Since the film formed in a place other than the film formation surface of the object such as the wall of the chamber in this way is gradually deposited, and the film grown to a certain thickness is easily peeled off, the particle generation source It becomes. When the separated and scattered particles adhere to the film formation surface, defects such as pinholes are generated in the film, leading to a decrease in device yield.

  On the other hand, a method is generally performed in which a deposition preventing plate that can be taken out is installed in a chamber, and the deposition plate on which a film is formed is replaced or maintained. However, in this method, it is necessary to destroy the environment in the chamber once (for example, to open the chamber to the atmosphere) in order to replace the adhesion prevention plate, resulting in a significant reduction in production operation rate.

  Patent Document 1 discloses a film forming apparatus including an adhesion preventing plate having a plurality of fins. According to Patent Document 1, when the film formed on a portion other than the film formation surface of the target object is divided by the fins of the deposition prevention plate and the film stress can be reduced, peeling of the film can be suppressed. Has been. According to such a technique disclosed in Patent Document 1, it is possible to extend the replacement or maintenance cycle of the protection plate.

JP-A-6-188108

  However, in the technique disclosed in Patent Document 1, the flying particles may pass through the fins and adhere to the deposition preventing plate, and the film may not be sufficiently divided.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a film forming apparatus capable of sufficiently suppressing peeling of a film formed on a surface other than a film formation surface of an object. It is in.

  A film forming apparatus according to the present invention is a film forming apparatus that forms a film on an object by attaching particles flying from a material source to the object in a chamber of a predetermined atmosphere. In addition, an adhesion prevention plate having fins arranged in a plurality of rows is provided, and each of the fins is disposed at a position shifted in the arrangement direction with respect to the fins in the adjacent row. .

  According to the present invention, since each of the plurality of fins provided on the deposition preventing plate is disposed at a position shifted in the arrangement direction with respect to the fins in the adjacent row, the flying particles pass between the fins. Can be suppressed. Thereby, since the film | membrane formed except the film-forming surface of a target object can be parted, peeling of a film | membrane can fully be suppressed.

The film forming apparatus is characterized in that the fins are arranged in an inclined state with respect to a normal direction of a plate surface of the deposition preventing plate.
According to the present invention, since the fin is disposed in a state inclined with respect to the normal direction of the plate surface of the deposition preventing plate, the plate surface of the deposition preventing plate is covered by the fin in plan view. Thereby, it can suppress that the particle | grains which came fly adhere to the board surface of an adhesion prevention board.

The film forming apparatus is characterized in that the fins are arranged in an inclined state with respect to the flying direction of the particles.
According to the present invention, since the fins are arranged in a state inclined with respect to the particle flying direction, the particle flying direction compared to the case where the fins are installed perpendicular to the particle flying direction. A group of particles passing through a unit area of a predetermined plane orthogonal to can be received in a wider area of the fin. Thereby, particles can be reliably captured in the fins.

The film forming apparatus is characterized in that the fin is detachably attached to the deposition preventing plate.
According to the present invention, since the fin is provided so as to be detachable from the deposition preventing plate, maintenance of the deposition preventing plate can be easily performed.

The film forming apparatus is characterized in that the fins are provided so as to be detachable integrally in each row.
According to the present invention, since the fins are provided so as to be detachable integrally for each row, the maintainability of the deposition preventing plate can be further improved.

The film forming apparatus is characterized in that the fins are arranged so that a distribution density in a plan view changes.
According to the present invention, since the fins are arranged so that the distribution density in a plan view changes, the formation of a film on the deposition preventing plate can be efficiently suppressed.

In the film forming apparatus, the distribution density is set according to the density of the particles flying on the deposition preventing plate.
According to the present invention, since the distribution density is set according to the density of the particles flying on the deposition preventing plate, the formation of a film on the deposition preventing plate can be more efficiently suppressed.

1 is a diagram schematically showing a configuration of a film forming apparatus according to an embodiment of the present invention. The perspective view which shows the structure of the adhesion prevention board which concerns on this embodiment. The figure which shows the structure of a part of adhesion prevention board.

  Hereinafter, an embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.

FIG. 1 is a schematic diagram showing a schematic configuration of the film forming apparatus of the present embodiment.
The film forming apparatus APR includes a chamber 1, a substrate holder 2, a target 3 (material source), an ion gun 4, and a deposition preventing plate 5. The film forming apparatus APR is an apparatus for forming a film on an object by setting a predetermined atmosphere in the chamber and attaching particles flying from the target 3 to the object. In the present embodiment, an ion beam sputtering apparatus will be described as an example of the film forming apparatus APR.

  The chamber 1 is a film formation chamber in which film formation is performed on the substrate surface X1 (film formation surface) of the substrate X that is an object of film formation. An exhaust system 11 is connected to the chamber 1, and the inside of the chamber 1 can be depressurized by operating the exhaust system 11.

A substrate holder 2 is installed on the upper portion of the chamber 1. The substrate holder 2 is for supporting the substrate X with the substrate surface X1 facing downward. A target 3 is installed below the substrate holder 2 in the chamber 1. The target 3 is a material source serving as a particle emission source. For example, various inorganic materials (inorganic oxides, inorganic nitrides, metal oxides, metal nitrides) are used. Specifically, for example, SiO ₂ , SiO, Al ₂ O ₃ , ZnO ₂ , Ta ₂ O ₃ , TiO ₂ , Si ₃ N ₄ , ITO (indium tin oxide), or the like is used.

  The ion gun 4 introduces a sputtering gas into an independent ion source, ionizes and accelerates the gas, and extracts the ion beam 42 from the discharge port 41 as a predetermined width. The ion gun 4 is disposed above the target 3. The discharge port 41 of the ion gun 4 is directed to the sputtering surface 31 that is the surface of the target 3 inside the chamber 1.

  As the sputtering gas, for example, Ar, He, Ne, Kr, Xe, and the like, and various other inert gases inert to the target 3 can be used. For example, molecular ions such as nitrogen, neutral particles, cluster ions, and the like may be used. In addition to the ion gun 4, a configuration may be provided that includes an assist mechanism that performs assist ion irradiation or assist laser irradiation on the substrate X before or during film formation.

  The deposition preventing plate 5 is disposed so as to cover the side wall portion 12 and the ceiling portion 13 of the chamber 1. The adhesion prevention board 5 is provided so that attachment or detachment with respect to the side wall part 12 and the ceiling part 13 is possible. The deposition preventing plate 5 includes a base material 51 disposed along the side wall portion 12 and the ceiling portion 13 of the chamber 1 and a plurality of fins 52 arranged with respect to the base material 51.

  FIG. 2 is a perspective view showing a configuration of the deposition preventing plate 5 provided on the side wall portion 12 of the chamber 1. FIG. 3 is a diagram showing a configuration of a part on the adhesion preventing plate 5 shown in FIG. 2, and shows one fin 52.

  As shown in FIG. 2, a plurality of fins 52 are provided on the plate surface 51 a of the substrate 51. The fins 52 are arranged in a plurality of rows in one direction on the plate surface 51a. The row of the fins 52 is provided over almost the entire surface of the plate surface 51a. In FIG. 2, the arrangement direction of the fins 52 is indicated by a broken line, and the correspondence relationship between the positions of the fins 52 in each row is indicated by a one-dot chain line. As shown in the figure, each of the fins 52 is disposed at a position shifted in the arrangement direction with respect to the fins 52 in the adjacent row. More specifically, each fin 52 is arranged so as to be located in the middle of the arrangement direction with respect to two fins 52 in an adjacent row. For this reason, when the said adhesion prevention board 5 is seen from the side surface of the adhesion prevention board 5 in the orthogonal direction of the arrangement direction, it exists in the state by which the fin 52 was arrange | positioned on the adhesion prevention board 5 without gap. Although it arrange | positions so that it may be located in the middle of two fins of an adjacent row | line | column, if it is the structure by which the fin 52 is arrange | positioned in the position shifted in the arrangement direction with respect to the fin 52 of an adjacent row | line | column, this arrangement | positioning It is not limited to.

  The fins 52 are attached to the fin holding member 53 for each row, and the fins 52 are integrally provided for each row via the fin holding member 53. As shown in FIG. 3, the fin holding member 53 is fitted in the recess 51 b of the base material 51. The fin holding member 53 is detachably attached to the base material 51. By attaching and detaching the fin holding member 53, the fins 52 can be attached and detached integrally with the base material 51 for each row. In addition to this configuration, for example, a configuration in which the fins 52 are individually attached to and detached from the fin holding member 53 may be used.

  As shown in FIG.2 and FIG.3, each fin 52 is arrange | positioned in the state inclined with respect to the normal line direction of the surface 51a of the base material 51 (plate surface of an adhesion prevention board). For this reason, the substrate 51 is partially covered with the fins 52 in plan view. The fins 52 are disposed so as to be inclined with respect to the flying direction of the particles R emitted from the surface 51a target 3 of the substrate 51. For this reason, the particles R flying to the deposition preventing plate 5 can be captured more reliably. As for each fin 52, the front-end | tip part 53 by the side of the target 3 is set to the acute angle shape, and the surface is roughened by the blast process. Thereby, it becomes the structure which is easy to capture | acquire the particle | grains R. FIG.

  The length L of the fins 52 and the arrangement pitch of the fins 52 are set so that the flying particles do not reach the base material 51 exposed between the fins 52, that is, between the fins 52. In addition, the interval between the rows of the fins 52 is formed to be wider on the substrate X side than on the target 3 side. For this reason, the distribution density of the fins 52 is higher on the target 3 side of the deposition preventing plate 5 than on the substrate X side.

  The distribution density of the fins 52 is set according to the density of the particles R flying to the deposition preventing plate 5. As shown in FIG. 1, the density at which the particles R fly to the deposition preventing plate 5 is higher as it is closer to the target 3 and lower as it is closer to the substrate X. Corresponding to this, in this embodiment, the distribution density of the fins 52 is set so that the target 3 side of the deposition preventing plate 5 is higher than the substrate X side. By setting the distribution density of the fins 52 in this way, the particles R can be reliably captured by the fins 52.

  In the film forming apparatus APR configured as described above, when the ion beam 42 from the ion gun 4 is incident on the sputtering surface 31 of the target 3, a region having a width corresponding to the beam width is sputtered, and the particles are placed in the chamber 1. It is emitted radially in. The particles that have reached the substrate X are deposited on the substrate surface X1, whereby a film is formed on the substrate surface X1.

  On the other hand, the particles injected in a direction different from the substrate X reach the deposition preventing plate 5. On the deposition preventing plate 5, the particles R are captured by the fins 52 arranged in the above-described manner, and the particles R are deposited on the fins 52. By the fins 52, the particles R flying to the deposition preventing plate 5 are suppressed from being deposited on the substrate 51, and the film formed on the substrate 51 is formed in a state of being divided on the substrate 51. Will be. For this reason, compared with the case where a film | membrane is formed in the whole surface on the base material 51, a film | membrane stress will be reduced. For this reason, peeling of the film | membrane formed on the base material 51 will be suppressed.

  On the other hand, particles R are deposited on the fins 52 to form a film. When a film of a certain level or more is formed on the fins 52 due to the deposition of the particles R, for example, the inside of the chamber 1 is cleaned by removing the fin holding members 53 from the base material 51 and replacing the fins 52 together with the fin holding members 53. Try to keep it in good condition.

  As described above, according to the present embodiment, each of the plurality of fins 52 provided on the deposition preventing plate 5 is disposed at a position shifted in the arrangement direction with respect to the fins 52 of the adjacent row. The particles R can be prevented from slipping through the fins and can be reliably captured by the fins 52. Thereby, since the film | membrane formed except the board | substrate surface X1 of the board | substrate X can be parted, peeling of a film | membrane can fully be suppressed.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the description has been given by taking the adhesion preventing plate 5 provided on the side wall 12 of the chamber 1 as an example. However, the present invention is not limited to this. The configuration described in the above embodiment can be applied.

  In the case of the deposition preventing plate 5 provided on the ceiling portion 13, as shown in FIG. 1, the density of the particles R flying closer to the substrate X is higher, and the density of the particles R flying away from the substrate X is higher. It is getting smaller. Therefore, when setting the distribution density of the fins 52 of the deposition preventing plate 5, it is preferable to arrange the distribution density so as to increase, for example, at a position closer to the substrate X so as to correspond to the density of the particles R.

APR ... Film-forming device X ... Substrate (object) 1 ... Chamber 5 ... Depositing plate 52 ... Fin

Claims (7)

A film forming apparatus for forming a film on the object by attaching particles flying from a material source to the object in a chamber of a predetermined atmosphere,
In the chamber, a deposition plate having fins arranged in a plurality of rows is provided,
Each of the fins is disposed at a position shifted in the arrangement direction with respect to the fins in the adjacent row. The film formation apparatus according to claim 1, wherein the fins are arranged in a state of being inclined with respect to a normal direction of a plate surface of the deposition preventing plate. The film formation apparatus according to claim 1, wherein the fins are arranged in a state of being inclined with respect to a flying direction of the particles. The film formation apparatus according to any one of claims 1 to 3, wherein the fin is detachably attached to the deposition preventing plate. The film formation apparatus according to claim 4, wherein the fins are integrally formed for each row. The film formation apparatus according to any one of claims 1 to 5, wherein the fins are arranged so that a distribution density in a plan view changes. The film forming apparatus according to claim 6, wherein the distribution density is set according to a density of the particles flying on the deposition preventing plate.

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