KR102095101B1 - Patch for Recovery of Valuable Metal - Google Patents

Abstract

The present invention relates to a patch for recovering valuable metals attached to an inner wall of a vacuum chamber for depositing organic substances. According to the present invention, by attaching a patch capable of attaching particles with a surface roughness to the inner wall of the vacuum chamber used in the deposition process and simply removing the patch attached after the deposition process is over, the valuable metal attached to the patch in the deposition process can be easily removed. It is possible to recover and prevent contamination inside the vacuum chamber, thereby reducing the cost and time required to clean the interior of the conventional vacuum chamber.

Description

Patch for Recovery of Valuable Metals

The present invention relates to a patch for recovering valuable metals attached to an inner wall of a vacuum chamber for depositing organic substances.

The deposition process performed in the manufacturing process of a semiconductor device including a display device is usually performed in a sealed vacuum chamber mainly for deposition efficiency and prevention of contamination. The inside of the vacuum chamber must be kept clean at all times, because when chemical contaminants such as impurities or reaction residues introduced from the outside remain adsorbed on the inner surface of the vacuum chamber, deposition due to these contaminants This is because the deposition layer formed on the substrate in the process is contaminated and deposition defects occur.

In recent years, as the display device is enlarged and the circuit is highly integrated, and a fine and precise deposition layer is required, the cleanliness of the vacuum chamber in which the deposition process is performed is most important. In particular, the vacuum chamber used in the manufacturing process of the organic light emitting device (OLED) among the display devices is adsorbed on the inner surface of the vacuum chamber after a certain period of time has elapsed since the coating process uses an organic material instead of an inorganic material as a coating material in the manufacturing process. Since various problems such as discoloration due to the decay of remaining organic matter occur, removal of such contaminants is recognized as a very important problem to determine the success or failure of the organic light emitting device (OLED) industry.

Accordingly, in order to remove contaminants adsorbed on the vacuum chamber used in the deposition process, a cleaning process and a cleaning process are performed on the vacuum chamber before and after the deposition process. The existing washing process mainly consists of high pressure washing and steam washing, and chemical washing using detergent, but these methods are difficult to wash for a long time due to wastewater treatment problems and a lot of manpower input, and general water is used as washing water. The high pressure washing method has a limitation in removing contaminants and has a problem in that alkaline washing is difficult due to mist.

In addition, a separate aluminum plate is inserted into the vacuum chamber used in the deposition process, and the plate is separated after the deposition process to perform a separate washing process. However, this method also has a problem in that it takes a lot of time and money to install, separate, and clean the process.

Accordingly, the present inventor completed a patch for recovering valuable metals that can be easily attached to and detached from the inner wall of the vacuum chamber for deposition, and was able to simply remove the patch attached to the vacuum chamber and after the deposition process was completed.

The object of the present invention is (a) the front surface of the metal thin plate having a surface roughness value of 1 to 1000㎛; (b) the back side of a thin metal plate coated with an aqueous remove adhesive; And (c) to provide a detachable patch to the vacuum chamber for deposition comprising an antistatic film attached to the upper portion of the front.

The present invention (a) the front surface of the metal thin plate having a surface roughness value of 1 to 1000㎛; (b) the back side of a thin metal plate coated with an aqueous remove adhesive; And (c) provides a patch detachable to the vacuum chamber for deposition comprising an antistatic film attached to the top of the front.

In addition, the present invention comprises the steps of (a) hot rolling the metal at a rolling temperature of 120 to 150 ° C. to produce a metal thin plate; (b) surface treating the metal thin plate to have a surface roughness value of 1 to 1000 μm; And (c) provides a method for producing a patch detachable to the vacuum chamber for deposition comprising the step of applying an aqueous remove adhesive on the back of the thin metal plate.

In the present invention, the front surface of the thin metal plate may be characterized by a flat surface or an uneven surface.

In the present invention, the thin metal plate may be selected from the group consisting of aluminum, copper, titanium, molybdenum, nickel and stainless.

In the present invention, the thickness of the thin metal plate may be characterized in that 0.01 to 1mm.

In the present invention, the aqueous remover adhesive may be characterized in that applied to a thickness of 1 to 100㎛, the aqueous remover adhesive PE (polyethylene, polyethylene), PVC (polyvinyl chloride, polyvinyl chloride), PP ( polypropylene, polypropylene) or an acrylic adhesive may be used.

The patch according to the present invention may be characterized in that it is attached around the inner wall of the vacuum chamber for deposition, and the electrode material scattered during the deposition process is attached to the front surface of the patch. In addition, it may be characterized in that for recovering one or more valuable metals selected from the group consisting of aluminum, copper, titanium, molybdenum, nickel and stainless.

The patch according to the present invention may be characterized in that it is dissolved by an acid after recovering valuable metals.

The present invention may be characterized in that it further comprises a release paper on the back side of the thin metal plate.

In the present invention, the patch may be provided in a roll form or a parse form.

In the present invention, a metal thin plate having a surface roughness value is made through polishing, ion plating, and the like. The ion plating process forms a plasma in a vacuum chamber and forms a Ra value of 1 to 10 μm by physical vapor deposition (PVD) of metal ions of a component such as a metal thin plate on a metal thin plate surface. In the polishing process, an alumina (Al ₂ O ₃ ) ball (size 10 to 1000 um) is sprayed onto the surface of a thin metal plate, such as high pressure air, to form a Ra value of 10 to 1000 μm on a thin metal plate by a sand blasting technique. do.

According to the surface roughness value of the patch according to the present invention, if the value is too small or too large, it is difficult to form a uniform roughness value on the patch surface, and as a result, there is a problem that electrode materials scattered during deposition are not properly attached. do.

If the thickness of the patch according to the present invention is too thin, there is a problem in that it is easily peeled off even after the patch is torn or attached in the process of attaching to the chamber, and if the thickness is too thick, the weight increases, making the patch not easy and especially uneven. Shaped patches are not easy to attach to the chamber.

According to the present invention, by attaching a patch capable of attaching particles with a surface roughness to the inner wall of the vacuum chamber used in the deposition process and simply removing the patch attached after the deposition process is finished, the valuable metal attached to the patch in the deposition process can be easily removed. It is possible to recover and prevent contamination inside the vacuum chamber, thereby reducing the cost and time required to clean the interior of the conventional vacuum chamber.

1 shows the surface treatment of a thin metal patch by ion plating.
Figure 2 shows the surface polishing process of the metal thin plate patch.
Figure 3 shows the process of coating an aqueous remove adhesive on the back of the thin metal plate.
4 shows the structure of a patch according to the present invention.
5 is an image of an aluminum thin plate having a thickness of 0.1 mm and a Ra value of 1 μm.
6 is an image of a copper thin plate having a thickness of 0.1 mm and a Ra value of 10 μm.
7 is an aluminum thin plate image after the attachment of the ITO target in the deposition process.
8 is an image of a copper sheet torn after attachment of an ITO target in a deposition process.

Hereinafter, the present invention will be described in more detail through examples. These examples are only intended to illustrate the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples according to the gist of the present invention. .

Preparation of patches for recovery of valuable metals

The aluminum metal ingot was cut and hot rolled (150 ° C. or less) to produce a thin plate having a flat surface with a thickness of 0.007 to 1.1 mm in a size of 1 m ² . In this embodiment, a thin plate was manufactured with aluminum, but in addition to aluminum, copper, titanium, molybdenum, nickel, or stainless steel may be cut and hot rolled to produce a thin plate having a thickness of 0.007 to 1.1 mm in a size of 1 m ² . In addition, in order to produce a metal thin plate having an uneven surface, the metal thin plate was manufactured to pass through an uneven mold or an uneven rolling roller to have an uneven shape on the surface.

To form the surface roughness, an Al ₂ O ₃ ball having a diameter of 0.1 mm was used to spray the aluminum thin plate at a pressure of 2 psi to form a Ra value of 1 μm on the surface of the aluminum thin plate. In this way, an image in which surface roughness is formed on the surface of the aluminum thin plate by the sand blasting method can be confirmed in FIG. 5. In addition, a surface roughness value of 10 µm is obtained through a pattern hole operation at regular intervals on the surface of the copper thin plate at a pressure of 10 psi using a nozzle device (10 * 10 bundles) having a diameter of 8 µm on the surface of a copper thin plate having a thickness of 1 mm. Copper thin plates were prepared (FIG. 6).

Check the effect according to the thickness of the patch

Patches are manufactured with different thicknesses of 0.007mm, 0.01mm, 0.5mm, 1mm, and 1.003mm, and whether the adhesive strength in the chamber is excellent at each thickness, whether the patch is torn after the deposition process, or if the patch production itself is difficult. Confirmed. If the thickness of the patch is too thin (0.01 mm or less), it is not easy to manufacture the patch, and in the process of attaching to the chamber, there is a problem that the patch is easily torn off after being torn or attached. In addition, when the thickness of the patch was manufactured to be 1.5 mm, the weight was increased, and thus the patch was not easy to manufacture. In particular, it was not easy to attach the uneven patch to the chamber. Accordingly, it was confirmed that the patch having a thickness of 0.01 to 1.0 mm has excellent fabrication and adhesion efficiency in the chamber. An evaporation process is performed using an aluminum thin plate having a thickness of 0.1 mm and 1 µm, and an image of the aluminum thin plate after the ITO particles are attached is shown in FIG. 7. It was confirmed that the thin plate was not torn or significantly damaged. On the other hand, after performing the deposition process using a copper thin plate having a thickness of 0.007 mm, as a result of checking the copper thin plate, it was confirmed that the thin plate was torn and damaged in the process of depositing ITO particles because the thickness was too thin (FIG. 8).

Patch thickness (mm) Ease of attaching the chamber In-chamber adhesion strength Ease of patch production 0.007 Difficult (tearing) Weak / 30 minutes after attachment
Peeling difficulty 0.01 ease Good / No peeling Good 0.5 ease Good / No Big Lee Good One ease Good / No peeling Good 1.5 Difficult (curved surface / unevenness) Good / No peeling Difficult (weight increase)

Check the effect according to the shape of the patch

The patch was mounted inside the chamber, and the degree of adhesion of particles was confirmed using an ITO target under conditions of vacuum pressure 10 ^-3 torr, Ar 100sccm, power density 2.0w / cm2 used in a general PVD vacuum deposition process.

Depending on the shape of the patch surface, the degree of adhesion of particles in the deposition process was confirmed. When a patch having an uneven shape was attached compared to a patch having a flat surface, the specific surface area that the particles floating in the chamber could contact and attach was increased by at least several orders of magnitude to several tens of times.

division Contact specific surface area Particle adhesion rate Flat surface patch 100% 100% Uneven patch 200 ~ 2000% 200 ~ 2000%

Check the effect according to the surface roughness of the patch

The surface of the zinc patch produced according to Example 1 had a surface roughness value through an ion plating process. Ra value was variously formed in the range of 0.5 to 1200 μm, and the degree to which particles on the deposition process were attached at each value was confirmed. As a result, it was confirmed that the Ra value was easily formed within the range of 1 to 1000 μm, and the relative adhesion rate of the particles was well adhered to 100 to 120%, but when the Ra value was 0.5 μm or 1200 In the case of µm, it was difficult to form a uniform surface roughness value due to an increase in the deviation of the Ra value, and the relative adhesion rates of particles were as low as 80% and 55%, respectively.

Patch Ra value (um) Ease of Ra processing Particle relative adhesion rate (%) 0.5 Difficult (Ra deviation increase) 80 One Good 105 10 Good 120 100 Good 110 1000 Good 100 1200 Difficult (Ra deviation increase) 55

Post patch recovery

After attaching the patch according to the present invention to the chamber and performing the deposition process, the metal patch to which the valuable metal particles were attached was recovered. The recovered metal patch was washed with ultrasonic waves, dissolved in acid and converted into an aqueous solution. Thereafter, impurities in the aqueous solution of the valuable metal were removed and reduced to regenerate it into a high purity valuable metal ingot.

Claims (21)

It is formed of a thin metal plate selected from the group consisting of aluminum, copper, titanium, molybdenum, nickel and stainless,
The back surface of the thin metal plate in contact with the inner wall of the vacuum chamber is formed to apply an aqueous remove adhesive, and the front surface of the thin metal plate opposite to the rear surface of the thin metal plate is a surface on which irregularities having a surface roughness value of 1 to 1000 μm are formed. The anti-static film is attached to the patch, which is detachable to the vacuum chamber for deposition.
delete delete delete According to claim 1,
The aqueous removable adhesive is a patch that is detachable to the vacuum chamber for deposition, characterized in that applied to a thickness of 1 to 100㎛.
According to claim 1,
The patch is a patch detachable to a vacuum chamber for deposition, characterized in that for recovering one or more valuable metals selected from the group consisting of aluminum, copper, titanium, molybdenum, nickel and stainless.
The method of claim 6,
The patch is a patch that is detachable to a vacuum chamber for deposition, characterized in that it is dissolved by acid after recovering valuable metals.
According to claim 1,
Patch detachable to the vacuum chamber for deposition, characterized in that it comprises a release paper on the back of the thin metal plate.
According to claim 1,
The patch is a patch that can be attached or detached to a vacuum chamber for deposition, characterized in that in the form of a roll or pars.
According to claim 1,
The patch is attached to the circumference of the inner wall of the vacuum chamber for deposition, and the electrode material scattered during the deposition process is detachable and patchable to the vacuum chamber for deposition.
(a) hot-rolling a metal metal selected from the group consisting of aluminum, copper, titanium, molybdenum, nickel, and stainless steel at a rolling temperature of 120 to 150 ° C. to produce a thin metal plate;
(B) surface treatment to have an antistatic film on the surface of the unevenness having a surface roughness value of 1 to 1000㎛ on the front surface of the thin metal plate; And
(c) A method of manufacturing a patch detachable to a vacuum chamber for deposition, comprising the step of applying an aqueous remove adhesive to the back side of the thin metal plate in contact with the inner wall of the vacuum chamber.
delete delete delete The method of claim 11,
The aqueous remover adhesive is a method of manufacturing a patch detachable to the vacuum chamber for deposition, characterized in that applied to a thickness of 1 to 100㎛.
The method of claim 11,
The patch is a method for manufacturing a patch detachable to a vacuum chamber for deposition, characterized in that for recovering one or more valuable metals selected from the group consisting of aluminum, copper, titanium, molybdenum, nickel and stainless.
The method of claim 11,
The patch is a method for manufacturing a patch that can be attached and detached to a vacuum chamber for deposition, characterized in that it is dissolved by acid after recovering valuable metals.
The method of claim 11,
Method for manufacturing a detachable patch in a vacuum chamber for deposition, characterized in that it comprises a release paper on the back of the thin metal plate.
The method of claim 11,
The patch is a method of manufacturing a patch detachable to the vacuum chamber for deposition, characterized in that the roll or pars form.
The method of claim 11,
The patch is attached to the circumference of the inner wall of the vacuum chamber for deposition, and the electrode material scattered during the deposition process is attached to the front surface of the patch.
The method of claim 11,
The method of manufacturing a patch detachable to the vacuum chamber for deposition, characterized in that the surface treatment of step (b) is an ion plating or polishing process.

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