TW201343025A - Printed circuit board assembly and method for making the same - Google Patents

Abstract

The present invention provides a method for making a printed circuit board assembly. The method includes steps below. A first printed circuit board assembly is provided. The first printed circuit board assembly includes a first waste area and a first printed circuit board which is a defected printed circuit board. A second printed circuit board assembly is provided. The second printed circuit board assembly includes a second waste area and a second printed circuit board which is an accepted printed circuit board. The second printed circuit board has a same configuration as the first printed circuit board. A slit is formed in the first waste area to separate the first printed circuit board from the first printed circuit board assembly. A cut part matching with the slit is cutting from the second waste area to separated the second printed circuit board from the second printed circuit board assembly. The cut part is adhered to the slit of the first printed circuit board assembly, thereby obtaining a third printed circuit board assembly. A printed circuit board assembly made by the above method is also provided.

Description

Continuing circuit board and contiguous circuit board manufacturing method

The present invention relates to a circuit board manufacturing technology, and more particularly to a method for fabricating a contiguous circuit board and a contiguous circuit board.

Generally, the manufacturing process of the circuit board includes: fabricating a contiguous circuit board, which is a circuit board that has formed a circuit, the splicing circuit board includes a plurality of circuit board units, a waste area, and a micro connection area, and the circuit board The unit is the area where the circuit function is separated one by one after the completion of the circuit board, and the waste area is the part that needs to be removed after the board is hit. Wherein each of the circuit board units is connected to the scrap area by a micro-connection area, each of the circuit board units includes at least one driving area for mounting components, and each of the circuit board units The solder paste is printed on the printing area; the parts are mounted in the printing area of the printing solder paste; and the circuit board units after the mounting of the parts are separated from each other by the disconnection of the micro connection area to form a finished circuit board. If there is an electrical defective product in each of the circuit board units, it is not necessary to print solder paste and mounted components on the defective product to save solder paste and parts, but depending on the position of the defective product, it is necessary to The position of the defective product on the contiguous circuit board is shielded by the opening of the different positions of the printed steel plate, and the mounting process is also required to be mounted according to the position of the defective product on each contiguous circuit board. Therefore, the above operation greatly reduces the efficiency of printing solder paste and mounted parts. In order to improve printing and mounting efficiency, solder paste and mounted parts are usually printed on the defective product in actual production. Obviously, the defective product It can't be used after placing parts, so it wastes solder paste and parts, and the more the number of defective products, the more waste.

In view of the above, it is necessary to provide a contiguous circuit board which is formed by transplanting a large number of products and a manufacturing method thereof, so as to reduce waste of solder paste and parts caused by defective products at the time of punching.

A manufacturing method of a contiguous circuit board, comprising the steps of: providing a first contiguous circuit board, the first contiguous circuit board comprising a first circuit board unit, a third circuit board unit and a first waste area; The first waste area surrounds the first circuit board unit and the third circuit board unit, and a plurality of first through holes are formed in the first continuous circuit board along a boundary of the first circuit board unit, Forming a first micro connection between the two adjacent first through holes, the first circuit board unit being connected to the first waste area by the plurality of first micro connections, the first circuit The board unit is an electrical test defective product, and the third circuit board unit is an electrical test good product. Providing a second contiguous circuit board, the second slab circuit board including a second circuit board unit and a second waste area surrounding the second circuit board unit, the inner edge of the second contiguous circuit board Forming a plurality of second through holes at a boundary of the second circuit board unit, and forming a second micro connection between the adjacent two second through holes, wherein the second circuit board unit is described by a plurality of The second micro-connection is connected to the second waste area, the second circuit board unit is electrically good, and the shape of the second circuit board unit is the same as the shape of the first circuit board unit. Forming a first slit corresponding to each of the first micro-joins in the first scrap area to form a first cut-out portion interconnected with the corresponding first micro-joint, each of the first slits and the corresponding first Two adjacent first through holes of a micro connection are in communication with each other such that the first circuit board unit, the first micro connection, and the first cutout are separated from the first continuous circuit board. Forming a second slit corresponding to each of the second micro-joins in the second scrap area to form a second cut-out portion interconnected with the corresponding second micro-joint, each of the second slits and the corresponding second micro-cut Connecting two adjacent second through holes to communicate with each other, so that the second circuit board unit, the second micro connection and the second cutout portion are separated from the second splicing circuit board, and the plurality of second cutout portions and the first waste material are formed The plurality of first slits formed in the region are matched one by one. And bonding the plurality of second cutout portions to the plurality of the first slits, thereby bonding the separated second circuit board unit to the first continuous circuit board after the first circuit board unit is separated Forming a third contiguous circuit board.

A contiguous circuit board comprising a circuit board unit, a plurality of through holes, a plurality of micro connections, and a waste area, the waste area surrounding the circuit board unit, the plurality of through holes being spaced apart from each other on the circuit board Between the unit and the waste area, each micro connection is formed between two adjacent through holes, and the plurality of through holes and the plurality of micro connections jointly define a shape of the circuit board unit in the scrap area Corresponding to each of the micro-joins, a slit is formed, and each of the slits is connected to two through-holes adjacent to the corresponding micro-joins, and each micro-join extends a cut-out portion toward the scrap area to form a cutout. The plurality of cut-out portions respectively correspond to the formed plurality of slits and have complementary shapes, and the plurality of cut-off portions are bonded to the plurality of slits correspondingly.

The manufacturing method of the contiguous circuit board of the technical solution has the following advantages: transplanting the electrical circuit component of the second contiguous circuit board into a first contiguous circuit board, so that the first connection The number of good circuit board units in the chip board is increased, which can reduce the waste of solder paste and parts caused by defective products at the time of punching; and the plurality of first slits are disposed on the scrap area to increase the contact area and The function of the plurality of second cutting portions is better fixed, and the bonding force between the plurality of cutting portions is increased to prevent the board unit that is transplanted from falling off during the writing.

The method for manufacturing the contiguous circuit board and the contiguous circuit board provided by the technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

The manufacturing method of the contiguous circuit board comprises the following steps:

In the first step, a first contiguous circuit board 10 is provided.

Please refer to FIG. 1. FIG. 1 is a plan view of the first splicing circuit board 10. The first slab circuit board 10 has a rectangular shape and includes a first circuit board unit 101 and a second circuit board unit 102. A first waste area 103, a second waste area 104, four first micro connections 105, and four second micro connections 106. The first circuit board unit 101 and the second circuit board unit 102 are both square and each side thereof is parallel to each side of the first continuous circuit board 10, and the first circuit board unit 101 and The second circuit board units 102 are arranged in parallel. The first circuit board unit 101 is an electrical good test, and the second circuit board unit 102 is an electrical test defective product. The first waste area 103 surrounds the first circuit board unit 101, the second waste area 104 surrounds the second circuit board unit 102, and the first waste area 103 and the second waste area 104 are both It is a square shape and shares a strip edge 110. There are four first through holes 107 between the first circuit board unit 101 and the first waste area 103 to be spaced apart from each other, and the four first through holes 107 are all L-shaped and surround the first The circuit board unit 101 defines a shape of the first circuit board unit 101 in common, and a first micro connection 105 is formed between the two adjacent first through holes 107, and the four first micro connections 105 are formed. The interconnection between the first circuit board unit 101 and the first waste area 103 is such that the first circuit board unit 101 is integrated with the first waste area 103. There are four second through holes 108 between the second circuit board unit 102 and the second waste area 104 to be spaced apart from each other. The four second vias 108 are each L-shaped and surround the second circuit board unit 102 to collectively define the shape of the second circuit board unit 102. Forming a second micro-connection 106 between the two adjacent second through holes 108, the four second micro-connections 106 for the second circuit board unit 102 and the second waste area The interconnection between 104. In the embodiment, the first continuous circuit board 10 serves as a circuit board that accepts the transplanted circuit board unit.

The first contiguous circuit board 10 can also be a single-layer or multi-layer flexible circuit board, and can also be a single-layer, double-layer or multi-layer rigid circuit board. It should be noted that the number of circuit board units on the first contiguous circuit board 10 is not limited. In this embodiment, only two circuit board units are included, and in fact, the number of contiguous circuit boards is generally two or more. In this embodiment, only two scrap areas surround two circuit board units. In fact, the two scrap areas are also connected, and a waste area can also surround two circuit board units, two circuits. The board units are connected by a micro connection or the like. As the circuit board that accepts the transplanted circuit board unit, the number of electrical defects detected on the first continuous circuit board 10 is not less than one, and the number of electrical products is not less than one. Preferably, the number of electrical products is more than the number of defective products to reduce the number of transplants and improve the efficiency of transplantation. The first circuit board unit 101 and the second circuit board unit 102 may also have other shapes. The number of the micro-connections may be other as long as the circuit board unit and the waste area can be connected.

In the second step, referring to FIG. 2, a second contiguous circuit board 20 is provided. The second contiguous circuit board 20 and the first contiguous circuit board 10 are substantially identical except for the electrical connection measured by the electrical measurement.

The second slab circuit board 20 includes a third circuit board unit 201, a fourth and fourth circuit board unit 202, a third waste area 203 surrounding the third circuit board unit 201, and a fourth surrounding area. a fourth waste area 204 of the circuit board unit 202, four L-shaped third through holes 207 between the third circuit board unit 201 and the third waste area 203, the fourth circuit board unit 202 and the fourth Four L-shaped fourth vias 208 between the scrap regions 204, a third micro-connect 205 formed between two adjacent third vias 207, and two adjacent fourth vias 208 A fourth micro-connection 206 is formed. The third micro-connection 205 connects the third circuit board unit 201 with the third waste area 203, and the fourth micro-connection 206 connects the fourth circuit board unit 202 and the fourth waste area 204 The connection, wherein the third circuit board unit 201 is an electrical faulty product, and the fourth circuit board unit 202 is an electrical test. In the embodiment, the second contiguous circuit board 20 serves as a circuit board for providing a good circuit board unit. The shape of the fourth circuit board unit 202 is the same as the shape of the second circuit board unit 102, and the shape of the plurality of fourth micro-connections 206 is the same as the shape of the plurality of second micro-connections 106, and the positions of the plurality of fourth micro-connections 206 and the plural number The positions of the two micro-connections 106 correspond one-to-one.

The number of circuit board units on the second contiguous circuit board 20 may also be two or more. As a circuit board for providing a good circuit board unit, the number of electrical products measured on the second splicing circuit board 20 is not Less than one, preferably, the number of defective electrical products is greater than the number of electrical good products, making it necessary to provide a circuit board for a good circuit board unit. Of course, the second splicing circuit board 20 may be different from the first slab circuit board 10, and at least one circuit board unit identical to the second circuit board unit 102 may be used.

In the third step, referring to FIG. 3 together, the second circuit board unit 102 is separated from the second waste area 104 to remove the second circuit board unit 102.

A first T-shaped cutout 120 is formed in the second scrap region 104 corresponding to each of the second micro-connects 106 to form a T-shaped first cutout 130 interconnected with the corresponding second micro-connection 106. Each of the first cutouts 130 includes an opposite first end 131 and a second end 132. The first end portion 131 and the corresponding second micro-connection 106 are connected to each other, and the distance D between the two adjacent second through holes 108 is defined as the width of the second micro-connection 106, and the width of the first end portion 131 is The width of the second micro-joins 106 is equal, and the width of the second end portion 132 is greater than the width of the first end portion 131. Each of the first slits 120 and the two second through holes 108 adjacent to the corresponding second micro-connections 106 communicate with each other such that the first cutout portion 130 and the second scrap region 104 are separated from each other. The four first cutouts 130 are connected to the corresponding four second micro connections 106 such that the four first cutouts 130 and the corresponding four second micro connections 106 and the second The circuit board unit 102 forms a first connecting body 13 for removing the first connecting body 13 from the first continuous wiring board 10.

The cutting manner may be laser cutting, milling cutting, punching cutting, etc.; the shape of the first cutout portion 130 may also be other shapes, preferably in the extending direction of the second micro-connection 106, The first end portion 131 of the first cutout portion 130 connected to the second micro-connection 106 has a smaller size than the first cutout portion 130 away from the second end portion 132 of the second micro-connection 106, such as a T-shape. Body, L-shaped body, table-shaped body, petal body, dripping body, and the like. The shape of the first slit 120 is complementary to the shape of the first cutout portion 130, and the shape of the first slit 120 may be other shapes.

In the fourth step, referring to FIG. 4, in the same manner as the third step, the fourth circuit board unit 202 is separated from the fourth waste area 204 to obtain the separated fourth circuit board unit 202.

In the same manner as the third step, a second connecting body 23 is divided from the same position on the second splicing circuit board 20, and the second connecting body 23 includes four T-shaped second cutouts 230, Four fourth micro-connects 206 and one of the fourth circuit board units 202 thereby separating the fourth circuit board unit 202. Each of the second cutouts 230 has the same shape as the corresponding first cutouts 130, and each of the second cutouts 230 also includes an opposite third end 231 and a fourth end 232, and the third end 231 is The fourth micro-connections 206 are connected.

It can be understood that if the second splicing circuit board 20 is not identical to the first slab circuit board 10, as long as the second splicing circuit board 20 has at least one same circuit board as the second circuit board unit 102. For the unit, the same circuit board unit of the second contiguous circuit board 20 as the second circuit board unit 102 can be separated according to the method of step 3.

In the fifth step, referring to FIG. 5, the first connecting body 13 is adhered to the first connecting circuit board 10 by adhesive manner to form a third continuous circuit board of the transplanted good product. 30.

First, the cut surface of the four first slits 120 of the first continuous circuit board 10 is coated with glue; then, the second connecting body separated from the second continuous circuit board 20 The second dicing portion 230 is placed on the first splicing circuit board 10 so that the four second cutout portions 230 are correspondingly received in the four first slits 120, and the cut surfaces thereof are completely matched. Bonding the second connecting body 23 including the fourth circuit board unit 202 to the first connecting circuit board 10; finally, curing the glue to obtain the first circuit board unit 101 and the fourth circuit The third continuous circuit board 30 of the board unit 202, the first circuit board unit 101 and the fourth circuit board unit 202 are all electrically good. That is, the fourth circuit board unit 202 is transplanted to the position of the second circuit board unit 102 in the first contiguous circuit board 10 to form the third contiguous circuit board 30.

The T-shaped design of the four first cutouts 120 and the four second cutouts 230 can respectively engage the four second cutouts 230 in the four first cutouts 120. They can be mutually constrained so that they can be better fixed together, and the four second cutouts 230 are cut away from the fourth scrap area 204. Compared with the micro-joining of the smaller size in the prior art, the area of the cut surface can be made larger, and the bonding strength between each other can be further improved, of course, as long as it is connected to the second micro-connection 106. The maximum width of the first cutout portion 130 is greater than the width of the second micro-connection 106, and both of them can function to be better fixed in the four first cutouts 120.

It can be understood that if the third circuit board unit 201 is good and the fourth circuit board unit 202 is defective, the third circuit board unit 201 can be transplanted to the second circuit board unit 102 as long as The cut surface and the cutting position of the slit may correspond to the cut surface and the cut position of the first slit 120 in the first continuous circuit board 10 after the second circuit board unit 102 is removed.

In addition, the glue may also be applied to the cut surface of the second cutting portion 230. The glue can also be replaced by a solid pressure sensitive adhesive or the like. In addition, if the first contiguous circuit board 10 includes more than two circuit board units with poor electrical measurement, and the second splicing circuit board 20 has only one circuit board unit that is electrically measured, the method may be as follows. Several good circuit board units are then transferred from the other contiguous circuit boards to the first contiguous circuit board 10.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10. . . First contiguous circuit board

101. . . First circuit board unit

102. . . Second circuit board unit

103. . . First waste area

104. . . Second waste area

105. . . First micro connection

106. . . Second micro connection

107. . . First through hole

108. . . Second through hole

20. . . Second contiguous circuit board

201. . . Third circuit board unit

202. . . Fourth circuit board unit

203. . . Third waste area

204. . . Fourth waste area

205. . . Third micro connection

206. . . Fourth micro connection

207. . . Third through hole

208. . . Fourth through hole

120. . . First incision

130. . . First cut

131. . . First end

132. . . Second end

13. . . First connector

twenty three. . . Second connector

230. . . Second resection

231. . . Third end

232. . . Fourth end

30. . . Third contiguous circuit board

1 is a schematic plan view of a first contiguous circuit board provided by an embodiment of the present technical solution.

2 is a schematic plan view of a second contiguous circuit board provided by an embodiment of the present technical solution.

FIG. 3 is a schematic plan view showing the first connector in FIG. 1 after removal.

Figure 4 is a plan view showing the second connector in Figure 2 after separation.

FIG. 5 is a schematic plan view of a third contiguous circuit board after transplantation according to an embodiment of the present technical solution.

101. . . First circuit board unit

103. . . First waste area

104. . . Second waste area

105. . . First micro connection

202. . . Fourth circuit board unit

206. . . Fourth micro connection

120. . . First incision

230. . . Second resection

30. . . Third contiguous circuit board

Claims (10)

A method for manufacturing a contiguous circuit board, comprising the steps of:
Providing a first contiguous circuit board, the first slab circuit board comprising a first circuit board unit, a third circuit board unit and a first waste area, the first waste area surrounding the first circuit board unit And a third circuit board unit having a plurality of first through holes formed along a boundary of the first circuit board unit in the first continuous circuit board, and forming between the adjacent two first through holes a first micro-connection, the first circuit board unit is connected to the first waste area by a plurality of the first micro-connections, the first circuit board unit is an electrical faulty product, and the third circuit board The unit is an electrical test;
Providing a second contiguous circuit board, the second slab circuit board including a second circuit board unit and a second waste area surrounding the second circuit board unit, the inner edge of the second contiguous circuit board Forming a plurality of second through holes at a boundary of the second circuit board unit, and forming a second micro connection between the adjacent two second through holes, wherein the second circuit board unit is described by a plurality of a second micro-connection is connected to the second waste area, the second circuit board unit is electrically good, and the shape of the second circuit board unit is the same as the shape of the first circuit board unit;
Forming a first slit corresponding to each of the first micro-joins in the first scrap area to form a first cut-out portion interconnected with the corresponding first micro-joint, each of the first slits and the corresponding first Two adjacent first through holes of a micro connection are connected to each other, so that the first circuit board unit, the first micro connection and the first cutout are separated from the first continuous circuit board;
Forming a second slit corresponding to each of the second micro-joins in the second scrap area to form a second cut-out portion interconnected with the corresponding second micro-joint, each of the second slits and the corresponding second micro-cut Connecting two adjacent second through holes to communicate with each other, so that the second circuit board unit, the second micro connection and the second cutout portion are separated from the second splicing circuit board, and the plurality of second cutout portions and the first waste material are formed The plurality of first slits formed in the region are matched one by one; and the plurality of second cutout portions are correspondingly bonded in the plurality of the first slits, thereby bonding the separated second circuit board unit to the separated A third contiguous circuit board is formed on the first contiguous circuit board behind the first circuit board unit. The method for fabricating a contiguous circuit board according to claim 1, wherein the plurality of first micro connections and the plurality of second micro connections are strip-shaped. The method for fabricating a contiguous circuit board according to claim 1, wherein a distance between two adjacent first through holes is defined as a width of the first micro connection, and the first The first cutout of the micro-connected connection has a maximum width greater than a width of the first micro-join. The method of fabricating a contiguous circuit board according to claim 3, wherein the first cutout portion includes a first end portion connected to the first micro connection and a first portion remote from the first micro connection The two ends have a width greater than a width of the first end. The method for fabricating a contiguous circuit board according to claim 4, wherein the first cutout portion has a T shape. The method for fabricating a contiguous circuit board according to the first aspect of the invention, wherein the bonding of the plurality of second portions to the plurality of first slits is by glue bonding. The method of fabricating a contiguous circuit board according to claim 1, wherein the number of the first circuit board units in the first contiguous circuit board is greater than the number of the third circuit board units. A contiguous circuit board comprising a circuit board unit, a plurality of through holes, a plurality of micro connections, and a waste area, the waste area surrounding the circuit board unit, the plurality of through holes being spaced apart from each other on the circuit board Between the unit and the waste area, each micro connection is formed between two adjacent through holes, and the plurality of through holes and the plurality of micro connections jointly define a shape of the circuit board unit, and the improvement is that Each of the micro-joins is formed with a slit corresponding to each of the micro-connections, and each of the slits communicates with two adjacent through-holes of the corresponding micro-joins, and each micro-connection extends to the scrap area for excision And forming a plurality of cut-out portions respectively corresponding to the formed plurality of slits and complementary in shape, and the plurality of cut-off portions are bonded to the plurality of slits correspondingly. The contiguous circuit board of claim 8, wherein a distance between two adjacent through holes is defined as a width of the micro connection, and the cut portion is connected to the micro connection The maximum width is greater than the width of the microjoin. The contiguous circuit board of claim 9, wherein the cutout comprises a first end connected to the micro connection and a second end remote from the micro connection, the second end The width of the portion is greater than the width of the first end.