TW201341421A - 環氧樹脂硬化促進劑 - Google Patents

環氧樹脂硬化促進劑 Download PDF

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Publication number
TW201341421A
TW201341421A TW102108693A TW102108693A TW201341421A TW 201341421 A TW201341421 A TW 201341421A TW 102108693 A TW102108693 A TW 102108693A TW 102108693 A TW102108693 A TW 102108693A TW 201341421 A TW201341421 A TW 201341421A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
hardening accelerator
group
resin
phenol
Prior art date
Application number
TW102108693A
Other languages
English (en)
Chinese (zh)
Inventor
Li-Yi Chen
Michiharu Okubo
Takeshi Furuta
Original Assignee
San Apro Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Apro Ltd filed Critical San Apro Ltd
Publication of TW201341421A publication Critical patent/TW201341421A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C08G59/683—Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW102108693A 2012-03-12 2013-03-12 環氧樹脂硬化促進劑 TW201341421A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012053947 2012-03-12

Publications (1)

Publication Number Publication Date
TW201341421A true TW201341421A (zh) 2013-10-16

Family

ID=49160678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102108693A TW201341421A (zh) 2012-03-12 2013-03-12 環氧樹脂硬化促進劑

Country Status (3)

Country Link
JP (1) JP2013216871A (ja)
TW (1) TW201341421A (ja)
WO (1) WO2013136746A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015137346A (ja) * 2014-01-24 2015-07-30 サンアプロ株式会社 エポキシ樹脂硬化促進剤
JP6640120B2 (ja) * 2015-01-30 2020-02-05 サンアプロ株式会社 エポキシ樹脂硬化促進剤
KR102423947B1 (ko) * 2016-02-25 2022-07-21 쇼와덴코머티리얼즈가부시끼가이샤 에폭시 수지 성형 재료, 성형물, 성형 경화물, 및 성형 경화물의 제조 방법
JP7221871B2 (ja) 2017-09-29 2023-02-14 日鉄ケミカル＆マテリアル株式会社 繊維強化複合材料用樹脂組成物及びそれを用いた繊維強化複合材料
CN113451235B (zh) * 2019-03-06 2022-07-19 西安航思半导体有限公司 Qfn封装半导体器件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1147741A (en) * 1979-05-23 1983-06-07 George A. Doorakian Phosphonium phenoxide catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
JPS61190523A (ja) * 1985-01-15 1986-08-25 モ−トン　チオコ−ル　インコ−ポレ−テツド 硬化性エポキシ樹脂成形組成物
WO2003082976A1 (en) * 2002-03-28 2003-10-09 Sumitomo Bakelite Company Limited Thermosetting resin composition and epoxy resin molding material using the composition and semiconductor device
JP4317432B2 (ja) * 2003-12-04 2009-08-19 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2007084702A (ja) * 2005-09-22 2007-04-05 San Apro Kk テトラアルキルホスホニウムのフェノール樹脂塩
JP2008106193A (ja) * 2006-10-27 2008-05-08 San Apro Kk トリアリールアルキルホスホニウムのフェノール樹脂塩

Also Published As

Publication number Publication date
WO2013136746A1 (ja) 2013-09-19
JP2013216871A (ja) 2013-10-24

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