TW201340240A - Substrate processing device and method - Google Patents

Substrate processing device and method Download PDF

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Publication number
TW201340240A
TW201340240A TW102111434A TW102111434A TW201340240A TW 201340240 A TW201340240 A TW 201340240A TW 102111434 A TW102111434 A TW 102111434A TW 102111434 A TW102111434 A TW 102111434A TW 201340240 A TW201340240 A TW 201340240A
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Taiwan
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opening
substrate
door
lateral direction
substrate processing
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TW102111434A
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Chinese (zh)
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TWI503918B (en
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Sung-Hee Lee
Dong-Jin Yoo
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Semes Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention provides a substrate processing device and a method capable of providing a film of processing liquid with uniform thickness on the whole area of a substrate. The device of the present invention provides processing liquid to a substrate for forming a film of the processing liquid on the substrate. The device includes a processing chamber for processing the substrate. The processing chamber includes a casing formed along an opening for movement in the substrate, and a door assembly accessory for adjusting an opening width along a horizontal direction of the opening. The door assembly accessory includes a row of doors arranged along the horizontal direction of the opening, wherein the doors are driven respectively.

Description

基板處理裝置及方法 Substrate processing apparatus and method

本發明係關於一種基板處理裝置及方法,更詳細而言,係關於一種向基板供給處理液對基板進行處理之裝置及方法。 The present invention relates to a substrate processing apparatus and method, and more particularly to an apparatus and method for processing a substrate by supplying a processing liquid to a substrate.

一般而言平板顯示器製造工程要求有蒸鍍工程、照相工程、蝕刻工程及清洗工程等多樣的工程。該等之中照相工程係於蝕刻工程之前於基板上以感光膜形成圖案之工程。照相工程係由較大地於基板上塗佈感光膜之塗佈工程、將以遮罩形成的圖案轉印於感光膜上的曝光工程、以及以感光膜將光照射區域或者相反區域選擇性地除去之顯影工程組成。該等之中重要的是顯影工程中於基板上以均勻的厚度形成顯影液之膜。 In general, flat panel display manufacturing engineering requires various projects such as evaporation engineering, photographic engineering, etching engineering, and cleaning engineering. Among these, the photographic engineering is a process of forming a pattern on a substrate with a photosensitive film before etching. Photographic engineering is a coating process in which a photosensitive film is coated on a substrate, an exposure process in which a pattern formed by a mask is transferred onto a photosensitive film, and a light-irradiated region or an opposite region is selectively removed by a photosensitive film. The development project consists of. Among these, it is important to form a film of the developer on the substrate in a uniform thickness in the development process.

一般而言基板處理裝置與內部具有搬送單元之多數個處理室串聯連接,基板係一面順次移動處理室,一面順次進行如顯影工程及清洗工程等一連串之工程。該等之處理室之中於基板之上供給顯影液的處理室係於內部與基板之搬送方向垂直提供具有與基板之寬相對應之長度的噴嘴(圖2之200)。藉由基板於處理室內移動,而向基板之整體區域供給顯影液。圖1係表示執行顯影工程之處理室100之概略圖。處理室100之前方壁102及後方壁(未圖示)中提供有作為用於各基板10之出入之通路功能的開口120。一般而言開口120以長方形狀提供。 In general, the substrate processing apparatus is connected in series to a plurality of processing chambers having a transfer unit therein, and the substrate is sequentially moved to the processing chamber, and a series of processes such as development engineering and cleaning work are sequentially performed. In the processing chambers of the processing chambers, the processing chamber for supplying the developing solution on the substrate is internally provided with a nozzle having a length corresponding to the width of the substrate perpendicular to the conveying direction of the substrate (200 of FIG. 2). The developer is supplied to the entire area of the substrate by the substrate moving in the processing chamber. Fig. 1 is a schematic view showing a processing chamber 100 for performing a development process. In the front wall 102 and the rear wall (not shown) of the processing chamber 100, an opening 120 as a passage function for the entry and exit of each substrate 10 is provided. Generally, the opening 120 is provided in a rectangular shape.

然而,圖1之處理室100內執行顯影工程之情形時,如圖2開口120之兩側區域122與鄰接之基板10之緣區域12係形成有與其他區域相比相對較薄之顯影液之膜300。因此,基板10之緣區域12中顯影均勻度下降。 However, in the case where the development process is performed in the processing chamber 100 of FIG. 1, the side regions 122 of the opening 120 of FIG. 2 and the edge regions 12 of the adjacent substrate 10 are formed with a relatively thin developing solution as compared with other regions. Film 300. Therefore, the development uniformity in the edge region 12 of the substrate 10 is lowered.

[先行技術文獻] [Advanced technical literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本國特表2010-520621號公報 [Patent Document 1] Japanese National Patent Publication No. 2010-520621

本發明之實施形態係提供一種於基板之整體區域可以均勻之厚度提供處理液之膜的基板處理裝置及方法。 Embodiments of the present invention provide a substrate processing apparatus and method for providing a film of a processing liquid in a uniform thickness over the entire area of the substrate.

此外,本發明之實施形態係提供一種可按處理室內之區域來對藉由基板出入之開口流入之氣流的速度進行控制的基板處理裝置及方法。 Further, an embodiment of the present invention provides a substrate processing apparatus and method capable of controlling the velocity of a gas stream flowing in through an opening and exit of a substrate in a region in the processing chamber.

本發明所欲解決之問題並非限制於此,未言及之其他問題當業者可自以下之記載明確理解。 The problem to be solved by the present invention is not limited thereto, and other problems that are not mentioned may be clearly understood from the following description.

根據本發明之一實施形態,可提供一種基板處理裝置。基板處理裝置包括:一外殼,其具有搬入基板之開口;一噴嘴,其由上述外殼內提供,向基板供給處理液;及一門裝配件,其用以調節上述開口之開放寬度;上述門裝配件具有沿著上述開口之橫方向並排提供之多數個門,及上述門之中至少一個向上下方向移動的驅動器。 According to an embodiment of the present invention, a substrate processing apparatus can be provided. The substrate processing apparatus includes: an outer casing having an opening for loading into the substrate; a nozzle provided by the outer casing to supply the processing liquid to the substrate; and a door fitting for adjusting an opening width of the opening; the door fitting A plurality of doors provided side by side in the lateral direction of the opening, and a driver that moves at least one of the doors in the up and down direction.

上述開口具有長方形狀,上述各門具有長方形狀。此外,上述基板具有長方形之板形狀,上述噴嘴係於上述基板之邊之中與上述開口之橫方向以及平行邊對應,或者進而具有較長的長度,上述噴嘴之橫方向係與上述開口之橫方向平行而提供。於上述處理室內提供搬送基板之搬送單元。 The opening has a rectangular shape, and each of the doors has a rectangular shape. Further, the substrate has a rectangular plate shape, and the nozzle corresponds to a lateral direction and a parallel side of the opening in the side of the substrate, or further has a long length, and a lateral direction of the nozzle is transverse to the opening The directions are provided in parallel. A transfer unit that transports the substrate is provided in the processing chamber.

上述多數個門以可獨立地驅動之方式於各個上述門上個別地結合有上述驅動器。上述多數個門具有:一中央門,其係於上述開口之橫方向上位於中央區域,一第1側部門,其係位於上述開口之一側部,及一第2側部門,其係位於上述開口之他側部。 The plurality of doors are individually coupled to the actuators on the respective doors in an independently driveable manner. The plurality of doors have a central door located in a central region in a lateral direction of the opening, a first side portion located at a side of the opening, and a second side portion located at the The side of the opening.

根據本發明之一實施例,上述驅動器具有:驅動上述中央門之中央驅動器、驅動上述第1側部門之第1側部驅動器,及驅動上述第2側部門之第2側部驅動器。 According to an embodiment of the present invention, the driver includes a central driver that drives the center door, a first side driver that drives the first side, and a second side driver that drives the second side.

根據本發明之其他實施例,上述驅動器具有:驅動上述中央門之中央驅動器、同時驅動上述第1側部門與上述第2側部門之側部驅動器。 According to another embodiment of the present invention, the driver includes a central driver that drives the center door and simultaneously drives the side driver of the first side unit and the second side unit.

根據本發明之其他實施形態,可提供一種基板處理裝置,其包括:一外殼,其具有搬入基板之開口;一噴嘴,其由上述外殼內提供,向基板供給處理液;及調節上述開口之開放寬度之門裝配件;上述門裝配件包括:一門,其係具有與上述開口之長度對應之長度之門,及一驅動器,其係使上述門向上下方向移動之驅動器;上述門具有藉由上述門向上下方向移動,而沿著上述開口之橫方向的上述開口之開放寬度不同之形狀。 According to another embodiment of the present invention, a substrate processing apparatus can be provided, comprising: an outer casing having an opening for loading into the substrate; a nozzle provided by the outer casing to supply the processing liquid to the substrate; and adjusting the opening of the opening a door assembly for width; the door assembly includes: a door having a length corresponding to a length of the opening, and a driver for driving the door to move up and down; the door having the above The door moves in the up-down direction, and the opening width of the opening along the lateral direction of the opening is different.

根據本發明之一實施例,上述開口大致為長方形狀,上述門以其兩側部區域之下端之高度高於其中央區域之下端之高度而提供。 According to an embodiment of the invention, the opening is substantially rectangular, and the door is provided with a height of a lower end of the both side portions being higher than a height of a lower end of the central portion thereof.

根據本發明之其他實施形態,可提供一種基板處理裝置,其包括:一外殼,其具有搬入基板之開口;及一噴嘴,其由上述外殼內提供,向基板供給處理液;上述開口以沿著其橫方向於上下方向上寬度不同之方式而提供。 According to another embodiment of the present invention, a substrate processing apparatus including: an outer casing having an opening into which a substrate is loaded; and a nozzle provided in the outer casing to supply a processing liquid to the substrate; The lateral direction is provided in such a manner that the width in the vertical direction is different.

上述開口以其兩側部區域之上端之高度高於其中央區域之上端之高度而提供。 The opening is provided by the height of the upper end of the both side regions being higher than the height of the upper end of the central portion.

此外,本發明係提供一種基板處理方法。根據上述方法,於具有基板搬入之開口的外殼內向基板供給處理液來處理基板,以沿著上述開口之橫方向上下開口之開放寬度不同之方式提供的狀態下處理上述基板。 Further, the present invention provides a substrate processing method. According to the above method, the processing liquid is supplied to the substrate in the case having the opening into which the substrate is loaded, and the substrate is processed, and the substrate is processed in a state in which the opening width of the upper and lower openings in the lateral direction of the opening is different.

根據本發明之一實施例,上述開口以沿著橫方向其側部區域與其中央區域相比開放寬度更大之方式提供。於上述開口之兩側 部區域開放寬度以相互不同之方式而提供。 According to an embodiment of the invention, the opening is provided in such a manner that the lateral portion thereof has a larger opening width than the central portion thereof in the lateral direction. On both sides of the above opening The opening width of the area is provided in a different way.

根據本發明之一實施例,沿著上述開口之橫方向提供多數個門,對上述門之中至少一個門之高度進行調節,並調節上述開口之開放寬度。 According to an embodiment of the invention, a plurality of doors are provided along the lateral direction of the opening, the height of at least one of the doors is adjusted, and the opening width of the opening is adjusted.

上述處理液係顯影液。 The above treatment liquid developer.

上述基板具有長方形之板形狀,上述噴嘴具有於上述基板之邊之中與上述開口之橫方向平行的邊更長的長度,上述噴嘴之橫方向與上述開口之橫方向相平行。 The substrate has a rectangular plate shape, and the nozzle has a length longer than a side parallel to a lateral direction of the opening among the sides of the substrate, and a lateral direction of the nozzle is parallel to a lateral direction of the opening.

根據本發明之實施形態,於基板之整體區域可以均勻厚度提供處理液之膜。 According to an embodiment of the present invention, a film of the treatment liquid can be provided in a uniform thickness over the entire area of the substrate.

此外,根據本發明之實施形態,可提供一種可按處理室內之區域來對藉由基板出入之開口流入之氣流的速度進行調節。 Further, according to an embodiment of the present invention, it is possible to adjust the speed of the airflow flowing in through the opening and exit of the substrate in the area of the processing chamber.

此外,根據本發明之實施形態,可於基板之整體區域提高顯影均勻度。 Further, according to the embodiment of the present invention, the development uniformity can be improved over the entire area of the substrate.

10‧‧‧基板 10‧‧‧Substrate

12‧‧‧緣區域 12‧‧‧Edge area

14‧‧‧中央區域 14‧‧‧Central area

16‧‧‧橫邊 16‧‧‧Horizontal

18‧‧‧縱邊 18‧‧‧ longitudinal

20‧‧‧基板處理裝置 20‧‧‧Substrate processing unit

100‧‧‧處理室 100‧‧‧Processing room

102‧‧‧前方壁 102‧‧‧ front wall

120‧‧‧開口 120‧‧‧ openings

122‧‧‧兩側區域 122‧‧‧Side areas

300‧‧‧噴嘴 300‧‧‧ nozzle

700‧‧‧控制器 700‧‧‧ Controller

500‧‧‧搬送單元 500‧‧‧Transport unit

520‧‧‧機械軸 520‧‧‧ mechanical shaft

540‧‧‧輥 540‧‧‧roll

560‧‧‧驅動部 560‧‧‧ Drive Department

562‧‧‧輪 562‧‧‧ round

564‧‧‧皮帶 564‧‧‧Land

566‧‧‧馬達 566‧‧‧Motor

1000‧‧‧處理室 1000‧‧‧Processing room

1001‧‧‧處理室 1001‧‧‧Processing Room

1002‧‧‧承載器室 1002‧‧‧Battery room

1200‧‧‧外殼 1200‧‧‧ Shell

1202‧‧‧前方壁 1202‧‧‧ front wall

1204‧‧‧後方壁 1204‧‧‧ Rear wall

1205‧‧‧側壁 1205‧‧‧ side wall

1206‧‧‧側壁 1206‧‧‧ side wall

1207‧‧‧上部壁 1207‧‧‧ upper wall

1208‧‧‧下部壁 1208‧‧‧ lower wall

1212‧‧‧排氣口 1212‧‧‧Exhaust port

1220‧‧‧開口 1220‧‧‧ openings

1222‧‧‧寬邊 1222‧‧‧Broadside

1223‧‧‧長邊 1223‧‧‧Long side

1224‧‧‧中央區域 1224‧‧‧Central area

1230‧‧‧開口 1230‧‧‧ openings

1400‧‧‧噴嘴 1400‧‧‧ nozzle

1600‧‧‧門裝配件 1600‧‧‧door fittings

1620‧‧‧門 1620‧‧‧

1624‧‧‧第1外側門 1624‧‧‧1st outside door

1622‧‧‧內側門 1622‧‧‧ inside door

1626‧‧‧第2外側門 1626‧‧‧2nd outer door

1627‧‧‧寬邊 1627‧‧‧Broadside

1628‧‧‧長邊 1628‧‧‧Long side

1640‧‧‧驅動器 1640‧‧‧ drive

1644‧‧‧驅動器 1644‧‧‧ drive

1642‧‧‧驅動器 1642‧‧‧ drive

1646‧‧‧驅動器 1646‧‧‧ drive

1901‧‧‧排氣線 1901‧‧‧Exhaust line

1903‧‧‧泵 1903‧‧‧ pump

2000‧‧‧處理室 2000‧‧‧Processing room

2600‧‧‧門裝配件 2600‧‧‧door fittings

2620‧‧‧門 2620‧‧‧

3000‧‧‧處理室 3000‧‧‧Processing room

3600‧‧‧門裝配件 3600‧‧‧door fittings

3622‧‧‧內側門 3622‧‧‧ inside door

3624‧‧‧內側驅動器 3624‧‧‧Inside drive

3626‧‧‧第2外側門 3626‧‧‧2nd outer door

3640‧‧‧驅動器 3640‧‧‧ drive

3642‧‧‧內側驅動器 3642‧‧‧Inside drive

3644‧‧‧外側驅動器 3644‧‧‧Outside drive

4000‧‧‧處理室 4000‧‧‧Processing room

4200‧‧‧外殼 4200‧‧‧ Shell

4220‧‧‧開口 4220‧‧‧ openings

4600‧‧‧門裝配件 4600‧‧‧door fittings

4620‧‧‧門 4620‧‧‧

4622‧‧‧固定門 4622‧‧‧Fixed door

4624‧‧‧驅動門 4624‧‧‧Drive door

5000‧‧‧處理室 5000‧‧‧Processing room

5220‧‧‧開口 5220‧‧‧ openings

5600‧‧‧門裝配件 5600‧‧‧door fittings

5620‧‧‧門 5620‧‧‧

5622‧‧‧內側門 5622‧‧‧ inside door

5624‧‧‧第1外側門 5624‧‧‧1st outside door

5626‧‧‧第2外側門 5626‧‧‧2nd outer door

6000‧‧‧處理室 6000‧‧‧Processing room

6220‧‧‧開口 6220‧‧‧ openings

6600‧‧‧門裝配件 6600‧‧‧door fittings

6620‧‧‧門 6620‧‧‧

6640‧‧‧驅動器 6640‧‧‧ drive

7000‧‧‧處理室 7000‧‧‧Processing room

7600‧‧‧門裝配件 7600‧‧‧door fittings

7620‧‧‧門 7620‧‧‧

8000‧‧‧處理室 8000‧‧‧Processing room

8220‧‧‧開口 8220‧‧‧ openings

8600‧‧‧門裝配件 8600‧‧‧door fittings

9000‧‧‧處理室 9000‧‧ ‧ processing room

9220‧‧‧開口 9220‧‧‧ openings

9600‧‧‧門裝配件 9600‧‧‧door fittings

10000‧‧‧處理室 10000‧‧ ‧ processing room

10220‧‧‧開口 10220‧‧‧ openings

圖1係表示一般處理室之一例之立體圖。 Fig. 1 is a perspective view showing an example of a general processing chamber.

圖2係表示圖1之處理室中執行顯影工程之時基板上所形成之處理液之膜厚度的狀態的圖式。 Fig. 2 is a view showing a state of a film thickness of a treatment liquid formed on a substrate at the time of performing a development process in the processing chamber of Fig. 1.

圖3係本發明之一實施形態之基板處理裝置之側面圖及平面圖。 Fig. 3 is a side view and a plan view showing a substrate processing apparatus according to an embodiment of the present invention.

圖4係本發明之一實施形態之基板處理裝置之側面圖及平面圖。 Fig. 4 is a side view and a plan view showing a substrate processing apparatus according to an embodiment of the present invention.

圖5係圖4之噴嘴之立體圖。 Figure 5 is a perspective view of the nozzle of Figure 4.

圖6係圖3中執行顯影工程之處理室之立體圖。 Figure 6 is a perspective view of the processing chamber of Figure 3 performing the development process.

圖7係表示圖6之處理室中沿著開口之橫方向的開口之開放寬度之例的圖式。 Fig. 7 is a view showing an example of an opening width of an opening in the lateral direction of the opening in the processing chamber of Fig. 6.

圖8係表示沿著圖6之處理室開口之橫方向的開口之開放寬 度之例的圖式。 Figure 8 is a view showing the opening width of the opening in the lateral direction of the opening of the processing chamber of Figure 6 The schema of the example of degree.

圖9係表示圖6之門裝配件之變形例的圖式。 Fig. 9 is a view showing a modification of the door fitting of Fig. 6.

圖10係表示圖6之門裝配件之變形例的圖式。 Fig. 10 is a view showing a modification of the door fitting of Fig. 6.

圖11係表示圖6之門裝配件之變形例的圖式。 Fig. 11 is a view showing a modification of the door fitting of Fig. 6.

圖12係表示圖6之門裝配件之變形例的圖式。 Fig. 12 is a view showing a modification of the door fitting of Fig. 6.

圖13係表示圖6之處理室之其他實施形態的圖式。 Fig. 13 is a view showing another embodiment of the processing chamber of Fig. 6.

圖14係表示圖6之處理室之其他實施形態的圖式。 Fig. 14 is a view showing another embodiment of the processing chamber of Fig. 6.

圖15係表示圖6之處理室之其他實施形態的圖式。 Fig. 15 is a view showing another embodiment of the processing chamber of Fig. 6.

圖16係表示圖6之處理室之其他實施形態的圖式。 Fig. 16 is a view showing another embodiment of the processing chamber of Fig. 6.

圖17係表示圖6之處理室之其他實施形態的圖式。 Fig. 17 is a view showing another embodiment of the processing chamber of Fig. 6.

以下,參照所添附之圖式對本發明之較佳實施形態之基板處理裝置進行詳細說明。說明本發明過程中,對於相關的眾所周知之構成或者功能的具體說明係判斷為對本發明之要旨不明確之情形時,省略其詳細說明。 Hereinafter, a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the attached drawings. In the course of the present invention, a detailed description of the related well-known components or functions will be omitted when it is determined that the gist of the present invention is not clear.

本實施形態中,基板處理裝置係於基板10上執行顯影工程。然而,本發明之技術思想並非限定於此,可適用於向基板10上供給處理液形成處理液之膜的多種多樣的工程。 In the present embodiment, the substrate processing apparatus performs development processing on the substrate 10. However, the technical idea of the present invention is not limited to this, and can be applied to various kinds of processes for supplying a film of a treatment liquid forming treatment liquid onto the substrate 10.

此外,本實施形態中基板10係將用於製造顯示裝置所使用的長方形狀之基板10作為例子進行說明。然而,基板10之種類並非限定於此,基板10係如半導體晶圓等具有板形狀之多種多樣的基板10。 Further, in the present embodiment, the substrate 10 is described as an example of a rectangular substrate 10 used for manufacturing a display device. However, the type of the substrate 10 is not limited thereto, and the substrate 10 is a substrate 10 having a variety of plate shapes such as a semiconductor wafer.

圖3與圖4係表示本發明之一實施形態之基板處理裝置20的圖式。圖3係表示基板處理裝置20之側面的圖式,圖4係表示圖1之處理室1000之中執行顯影工程之處理室1000之平面的圖式。 3 and 4 are views showing a substrate processing apparatus 20 according to an embodiment of the present invention. 3 is a view showing a side surface of the substrate processing apparatus 20, and FIG. 4 is a view showing a plane of the processing chamber 1000 in which the development process is performed in the processing chamber 1000 of FIG.

參照圖3與圖4,基板處理裝置具有多數個處理室1000及搬送單元500。多數個處理室1000、1001即使對各基板10亦執行指定之工程。舉例而言,處理室之中一個係執行顯影工程之處理室 1000,處理室之中另外一個係執行清洗工程之處理室1001。清洗工程係即使對於顯影工程完成的基板10亦可執行。此外,處理室1000之前方可提供自外部傳達基板10,將基板10向處理室1000搬送之承載器室1002。 Referring to FIGS. 3 and 4, the substrate processing apparatus has a plurality of processing chambers 1000 and a transport unit 500. A plurality of processing chambers 1000 and 1001 perform a designated project even for each of the substrates 10. For example, one of the processing chambers is a processing chamber that performs development engineering. 1000, another one of the processing chambers is a processing chamber 1001 that performs a cleaning process. The cleaning process can be performed even for the substrate 10 which is completed by the development process. Further, the processing chamber 1000 can provide the carrier chamber 1002 that transports the substrate 10 from the outside and transports the substrate 10 to the processing chamber 1000.

本實施形態中基板10係具有橫邊16與縱邊18。基板10之橫邊16係與基板10之搬送方向平行的邊,縱邊18係與基板10之搬送方向垂直的邊。 In the present embodiment, the substrate 10 has a lateral side 16 and a longitudinal side 18. The lateral side 16 of the substrate 10 is a side parallel to the transport direction of the substrate 10, and the vertical side 18 is a side perpendicular to the transport direction of the substrate 10.

搬送單元500係向承載器室1002與處理室1000之間,及處理室1000、1001之間搬送基板10。舉例而言,搬送單元500具有多數個機械軸520、輥540及驅動部560。機械軸520係向承載器室1002及處理室1000、1001內提供。機械軸520相互平行,並且配置於同一高度。處理室1000、1001內機械軸520係自與基板10搬入開口1220鄰接的位置至基板10搬出開口1230鄰接的位置而提供。各個機械軸520沿著其橫方向固定結合有多數個輥540。機械軸520係以其中心軸為基準藉由驅動部560而旋轉。驅動部560具有輪562、皮帶564及馬達566。輪562係與各個機械軸520之兩端結合。與互不相同的機械軸520結合,並以相互鄰接之方式配置之輪562藉由皮帶564相互連接。輪562之中任一個結合有使其旋轉之馬達566。藉由上述輪562、皮帶564及馬達566之組立體,機械軸520與輥540旋轉,基板10係於其下面與輥540接觸之狀態下藉由機械軸520而進行直線移動。各個機械軸520水平配置基板10向水平狀態移送。 The transport unit 500 transports the substrate 10 between the carrier chamber 1002 and the processing chamber 1000 and between the processing chambers 1000 and 1001. For example, the transport unit 500 has a plurality of mechanical shafts 520, rollers 540, and drive portions 560. The mechanical shaft 520 is provided into the carrier chamber 1002 and the processing chambers 1000, 1001. The mechanical shafts 520 are parallel to each other and are disposed at the same height. The mechanical shaft 520 in the processing chambers 1000 and 1001 is provided from a position adjacent to the substrate 10 into the opening 1220 to a position adjacent to the substrate 10 carrying-out opening 1230. Each of the mechanical shafts 520 is fixedly coupled with a plurality of rollers 540 along its lateral direction. The mechanical shaft 520 is rotated by the drive unit 560 with reference to its central axis. The drive unit 560 has a wheel 562, a belt 564, and a motor 566. The wheel 562 is coupled to both ends of each of the mechanical shafts 520. The wheels 562, which are coupled to the mutually different mechanical shafts 520 and disposed adjacent to each other, are connected to each other by a belt 564. Any one of the wheels 562 incorporates a motor 566 that causes it to rotate. The mechanical shaft 520 and the roller 540 are rotated by the three-dimensional group of the wheel 562, the belt 564, and the motor 566, and the substrate 10 is linearly moved by the mechanical shaft 520 while the lower surface thereof is in contact with the roller 540. Each of the mechanical shafts 520 horizontally disposes the substrate 10 in a horizontal state.

搬送單元500並非限定於上述構造。例如,搬送單元中驅動部係以利用磁力驅動機械軸之構造而提供。此外,搬送單元可具備輸送機皮帶並搬送基板10。此外,搬送單元可於軌道上使基板10磁懸浮(magnetic levitation)進行搬送。 The transport unit 500 is not limited to the above configuration. For example, the drive unit in the transport unit is provided in a structure that drives the mechanical shaft by magnetic force. Further, the transport unit may include a conveyor belt and transport the substrate 10. Further, the transport unit can carry out magnetic levitation of the substrate 10 on the track.

其次,針對基板10對執行顯影工程之處理室1000之構造進行說明。再次參照圖3與圖4,處理室1000具有外殼1200、噴嘴 1400及門裝配件1600。 Next, the structure of the processing chamber 1000 on which the development process is performed will be described with respect to the substrate 10. Referring again to FIGS. 3 and 4, the processing chamber 1000 has a housing 1200 and a nozzle. 1400 and door fittings 1600.

外殼1200具有前方壁1202、後方壁1204、兩個側壁1205、1206、上部壁1207及下部壁1208。前方壁1202與後方壁1204係沿著基板10之搬送方向而相互隔離而提供。兩個之側壁1205、1206係亦可與各前方壁1202垂直提供。前方壁1202、後方壁1204、兩個之側壁1205、1206,及下部壁1208係以相互組合之大致上部開放之長方體之形狀之方式而提供。上部壁1207係如圖6以中央部突出上部之方式具有兩個之傾斜壁。即,與前方壁1202垂直之方向看時上部壁1207為三角形之形狀而提供。該情形下,外殼1200自與前方壁1202垂直之方向看時,具有大致五角形狀。與此不同,上部壁1207係以一個平壁而提供,自與前方壁1202垂直之方向看時,外殼1200具有大致長方形之形狀。 The outer casing 1200 has a front wall 1202, a rear wall 1204, two side walls 1205, 1206, an upper wall 1207, and a lower wall 1208. The front wall 1202 and the rear wall 1204 are provided separately from each other along the conveying direction of the substrate 10. Two side walls 1205, 1206 can also be provided perpendicular to each front wall 1202. The front wall 1202, the rear wall 1204, the two side walls 1205 and 1206, and the lower wall 1208 are provided in a shape in which a substantially upper open rectangular parallelepiped is combined with each other. The upper wall 1207 has two inclined walls as shown in Fig. 6 with the central portion projecting from the upper portion. That is, the upper wall 1207 is provided in a triangular shape when viewed in a direction perpendicular to the front wall 1202. In this case, the outer casing 1200 has a substantially pentagonal shape when viewed in a direction perpendicular to the front wall 1202. In contrast, the upper wall 1207 is provided as a flat wall, and the outer casing 1200 has a substantially rectangular shape when viewed in a direction perpendicular to the front wall 1202.

前方壁1202及後方壁1204形成有各開口1220、1230。前方壁1202上所形成之開口1220係作為向外殼1200內搬入基板10之通路而提供,後方壁1204上所形成之開口1230係作為自外殼1200搬出基板10之通路而提供。前方壁1202上所形成之開口1220與於後方壁1204上所形成之開口1230係以大致同一大小及形狀而提供。舉例而言,開口1220係以大致長方形之形狀而提供。開口1220係具有寬邊(width side,圖6之1222)及長邊(length side,圖6之1223)。開口1220之寬邊1222係上下方向之邊,開口1220之長邊1223係與基板10之搬送方向相垂直之方向之邊。 Openings 1220 and 1230 are formed in the front wall 1202 and the rear wall 1204. The opening 1220 formed in the front wall 1202 is provided as a passage for carrying the substrate 10 into the outer casing 1200, and the opening 1230 formed in the rear wall 1204 is provided as a passage for carrying out the substrate 10 from the outer casing 1200. The opening 1220 formed in the front wall 1202 is provided in substantially the same size and shape as the opening 1230 formed in the rear wall 1204. For example, the opening 1220 is provided in a generally rectangular shape. The opening 1220 has a width side (1222 of FIG. 6) and a length side (1223 of FIG. 6). The wide side 1222 of the opening 1220 is the side in the up and down direction, and the long side 1223 of the opening 1220 is the side perpendicular to the direction in which the substrate 10 is transported.

外殼1200中形成有排氣口1212。排氣口1212係將於外殼1200內發生之煙霧及外殼1200內之大氣向外殼1200之外部進行排氣。排氣口1212上連接有排氣線1901,排氣線1901上設置有用於對外殼1200內之煙霧進行強制性排氣的泵1903。舉例而言,排氣口1212係形成於外殼1200之側壁1205、1206之中任一個。選擇性排氣口1212係向外殼1200之兩側壁1205、1206之每個進行提供,或者向上部壁1207或者下部壁1208。 An exhaust port 1212 is formed in the outer casing 1200. The exhaust port 1212 exhausts the smoke occurring within the outer casing 1200 and the atmosphere within the outer casing 1200 to the exterior of the outer casing 1200. An exhaust line 1901 is connected to the exhaust port 1212, and a pump 1903 for forcibly exhausting the smoke in the outer casing 1200 is disposed on the exhaust line 1901. For example, the exhaust port 1212 is formed in any one of the side walls 1205, 1206 of the outer casing 1200. The selective vent 1212 is provided to each of the two side walls 1205, 1206 of the outer casing 1200, or to the upper wall 1207 or the lower wall 1208.

噴嘴1400係向基板10之上供給顯影液。圖5係表示噴嘴1400之一例的立體圖。參照圖5,噴嘴1400係具有本體1420及供給顯影液路1440。 The nozzle 1400 supplies the developer onto the substrate 10. FIG. 5 is a perspective view showing an example of the nozzle 1400. Referring to FIG. 5, the nozzle 1400 has a body 1420 and a supply developing solution 1440.

本體1420係具有與基板10之橫邊16對應,或者僅比此稍長之長度。本體1420係以其橫方向與基板10之搬送方向呈垂直之方式而配置。本體1420中上部區域1422係具有大致長方體之形狀,下部區域1424係具有自上部區域1422向下方向延長,且越向下行,寬度漸進變得越狹窄之形狀。本體1420之下端形成有吐出口1460。吐出口1460係沿著與本體1420之橫方向較長地提供。例如,吐出口1460係提供裂縫而成。吐出口1460之長度係以與基板10之橫邊16對應,或者僅比此稍長之長度而提供。 The body 1420 has a length that corresponds to the lateral side 16 of the substrate 10 or is only slightly longer than this. The main body 1420 is disposed such that its lateral direction is perpendicular to the conveying direction of the substrate 10. The upper region 1422 of the main body 1420 has a substantially rectangular parallelepiped shape, and the lower region 1424 has a shape that is elongated from the upper region 1422 in the downward direction, and the width gradually becomes narrower as it goes downward. A discharge port 1460 is formed at a lower end of the body 1420. The discharge port 1460 is provided long along the lateral direction of the body 1420. For example, the spout 1460 is provided with a crack. The length of the spout 1460 corresponds to the lateral side 16 of the substrate 10 or is only slightly longer than this.

供給顯影液路1440係向本體1420之內部提供。供給顯影液路1440係具有緩衝器1444、流出通路1446、及流入通路1448。緩衝器1444係向本體1420之內部提供。緩衝器1444係沿著本體1420之橫方向較長地提供。流入通路1448係自緩衝器1444延長至與顯影液供給管1482連接之埠1472。流出通路1446係形成於緩衝器1444之下方向,自緩衝器1444延長至吐出口1460。流出通路1446之長度係以與吐出口1460之長度對應之方式而提供。 The supply developing solution 1440 is provided to the inside of the body 1420. The supply developing solution 1440 has a damper 1444, an outflow passage 1446, and an inflow passage 1448. A bumper 1444 is provided to the interior of the body 1420. The bumper 1444 is provided long along the lateral direction of the body 1420. The inflow passage 1448 is extended from the damper 1444 to the crucible 1472 connected to the developer supply tube 1482. The outflow passage 1446 is formed in a direction below the buffer 1444 and extends from the buffer 1444 to the discharge port 1460. The length of the outflow passage 1446 is provided in a manner corresponding to the length of the discharge port 1460.

噴嘴1400係與基板10大致垂直配置。噴嘴1400係選擇性地以與基板10傾斜之方式而配置。噴嘴係選擇性地提供2個,一個噴嘴係以與基板10傾斜之方式而配置,另一個噴嘴係與基板10垂直而配置。 The nozzle 1400 is disposed substantially perpendicular to the substrate 10. The nozzle 1400 is selectively disposed to be inclined to the substrate 10. Two nozzles are selectively provided, one of which is disposed to be inclined with respect to the substrate 10, and the other of which is disposed perpendicular to the substrate 10.

上述噴嘴1400之構造係作為一個示例而表示者,噴嘴1400係以與此不同之方式提供多樣的形狀及構造。 The structure of the above-described nozzle 1400 is shown as an example, and the nozzle 1400 provides various shapes and configurations in a different manner.

門裝配件1600係對搬入基板10之開口1220進行開關。門裝配件1600係以可沿著開口1220之橫方向按區域對開口1220之開放寬度進行調節之構造而提供。本實施形態中開口1220之開放寬度係指開口1220於上下方向開放的程度。舉例而言,門裝配件 1600係開口1220之側部區域1222及中央區域1224中以開口1220之開放寬度相互不同之方式進行調節而提供。 The door fitting 1600 switches the opening 1220 of the loading substrate 10. The door fitting 1600 is provided in a configuration that can adjust the opening width of the opening 1220 in a lateral direction along the opening 1220. The opening width of the opening 1220 in the present embodiment means the extent to which the opening 1220 is opened in the vertical direction. For example, door fittings The side portion 1222 and the central portion 1224 of the 1600-type opening 1220 are provided to be adjusted so that the opening widths of the openings 1220 are different from each other.

圖6係表示於處理室1000中所設置之門裝配件1600之一個示例的立體圖。參照圖6,門裝配件1600係具有多數個門1620與多數個驅動器1640。門1620係沿著開口1220之橫方向呈一列而提供。因此,開口1220係藉由沿著橫方向按區域相互不同之門1620,而調節其開放率。各個門1620係具有寬邊(width side,1627)與長邊(length side,1628)。門1620之寬邊1627係與開口1220之寬邊1222平行的邊,門1620之長邊係與1628開口1220之長邊1623平行的邊。 FIG. 6 is a perspective view showing an example of the door fitting 1600 provided in the process chamber 1000. Referring to Figure 6, the door fitting 1600 has a plurality of doors 1620 and a plurality of drivers 1640. Doors 1620 are provided in a row along the transverse direction of opening 1220. Therefore, the opening 1220 adjusts the opening ratio by the door 1620 which is different from each other in the lateral direction. Each of the doors 1620 has a width side (1627) and a length side (1628). The wide side 1627 of the door 1620 is the side parallel to the wide side 1222 of the opening 1220, and the long side of the door 1620 is the side parallel to the long side 1623 of the opening 1220 of the 1628.

舉例而言,門1620提供3個而成。以下,將位於中央之門稱為內側門1622,將位於外方之門分別稱為第1外側門1624及第2外側門1626。內側門1622對開口1220之中央區域1224之開放寬度進行調節,第1外側門1624與第2外側門1626對各開口1220之兩側部區域1222之開放寬度進行調節。開口1220之側部區域1222自開口1220之橫方向看時,係開口1220之緣區域。開口1220之側部區域1222中開放寬度係外殼1200內之基板10之緣區域12中對氣流之速度產生影響。 For example, the door 1620 provides three. Hereinafter, the door located at the center is referred to as an inner door 1622, and the door at the outer side is referred to as a first outer door 1624 and a second outer door 1626, respectively. The inner door 1622 adjusts the opening width of the central region 1224 of the opening 1220, and the first outer door 1624 and the second outer door 1626 adjust the opening width of the side portions 1222 of the respective openings 1220. The side region 1222 of the opening 1220 is the edge region of the opening 1220 when viewed in the lateral direction of the opening 1220. The open width in the side region 1222 of the opening 1220 affects the velocity of the airflow in the edge region 12 of the substrate 10 within the outer casing 1200.

第1外側門1624與第2外側門1626以相互對稱之方式呈同一大小而提供。內側門1622與第1外側門1624係各自具有長方形狀。內側門1622係以具有與第1外側門1624相比更長的長邊1627之方式而提供。此外,內側門1622係以與第1外側門1624相同寬邊1228之方式而提供。然而,內側門1622、第1外側門1624及第2外側門1626之長邊1227及寬邊1228之大小並非限定於此,為了對處理室1000內之氣流進行多樣控制而可進行改變。例如,第1外側門1624與第2外側門1626以具有相互不同大小之長邊1227之方式而提供。此外,內側門1622、第1外側門1624及第2外側門1626以具有相互不同大小之寬邊1228之方式而提 供。 The first outer door 1624 and the second outer door 1626 are provided in the same size in a mutually symmetrical manner. The inner door 1622 and the first outer door 1624 each have a rectangular shape. The inner door 1622 is provided to have a longer long side 1627 than the first outer door 1624. Further, the inner door 1622 is provided to be the same wide side 1228 as the first outer door 1624. However, the sizes of the long side 1227 and the wide side 1228 of the inner door 1622, the first outer door 1624, and the second outer door 1626 are not limited thereto, and may be changed in order to variously control the airflow in the processing chamber 1000. For example, the first outer door 1624 and the second outer door 1626 are provided to have long sides 1227 having different sizes from each other. Further, the inner door 1622, the first outer door 1624, and the second outer door 1626 are provided in such a manner as to have wide sides 1228 of different sizes from each other. for.

驅動器1640係使門1620向上下方向移動。各個門1620中驅動器1640以門1620之移動可各自獨立進行之方式個別地提供。因此,開口1220之側部區域1222與中央區域1224中以開放寬度不同之方式而提供。舉例而言,驅動器1640可具有馬達或者氣缸。如上所述,提供3個門1622、1624、1626之情形時,可提供3個驅動器1642、1644、1646。以下將驅動內側門1622、第1外側門1624及第2外側門1626之驅動器1640分別稱為內側驅動器1642、第1外側驅動器1644、及第2外側驅動器1646。 The driver 1640 moves the door 1620 in the up and down direction. Drivers 1640 in each of the doors 1620 are individually provided in a manner that the movement of the doors 1620 can be performed independently of each other. Thus, the side regions 1222 of the opening 1220 are provided in a different manner from the central region 1224 in terms of the open width. For example, the driver 1640 can have a motor or a cylinder. As described above, when three doors 1622, 1624, and 1626 are provided, three drivers 1642, 1644, and 1646 can be provided. Hereinafter, the driver 1640 that drives the inner door 1622, the first outer door 1624, and the second outer door 1626 will be referred to as an inner driver 1642, a first outer driver 1644, and a second outer driver 1646, respectively.

控制器700係對搬送單元500、噴嘴1400及驅動器1640進行控制。具體而言控制器700係為了對基板10之移送速度進行調節,而可對機械軸520之旋轉速度進行調節。此外,控制器700係為了顯影液之吐出時期及吐出量進行調節,而可對噴嘴1400進行控制。此外,控制器700係為了對開口1220之開放寬度進行調節,而可對使門1620移動之驅動器1640進行控制。 The controller 700 controls the transport unit 500, the nozzle 1400, and the driver 1640. Specifically, the controller 700 adjusts the rotational speed of the mechanical shaft 520 in order to adjust the transfer speed of the substrate 10. Further, the controller 700 can control the nozzle 1400 in order to adjust the discharge timing and the discharge amount of the developer. In addition, the controller 700 controls the driver 1640 that moves the door 1620 in order to adjust the open width of the opening 1220.

如圖1所示,於沿著橫方向同一高度上開放開口1220之情形時,處理室1000內藉由開口1220之側部區域搬入之基板10之緣區域中顯影液之膜厚度係如圖2所示與其他區域相比相對較薄。其原因之一係藉由開口1220之側部區域1222向處理室1000流入之氣流的速度比藉由開口1220之中央區域1224向處理室1000流入之氣流的速度快,故藉此,基板10之緣區域12中顯影液與中央區域14相比相對性地更多地飛散。 As shown in FIG. 1, when the opening 1220 is opened at the same height in the lateral direction, the film thickness of the developer in the edge region of the substrate 10 carried in the processing chamber 1000 through the side portion of the opening 1220 is as shown in FIG. The figure is relatively thin compared to other areas. One of the reasons is that the velocity of the airflow flowing into the processing chamber 1000 through the side region 1222 of the opening 1220 is faster than the velocity of the airflow flowing into the processing chamber 1000 through the central region 1224 of the opening 1220, whereby the substrate 10 is The developer in the edge region 12 is relatively more scattered than the central region 14.

根據實驗,開口1220之中央區域1224若以一定寬以上進行開放,氣流於基板10之中央區域14中大致對顯影液之膜之厚度影響較小。與此相反,開口1220之側部區域1222中所開放之開口1220之寬變得較大,則基板10之緣區域12中氣流之速度變慢,且顯影液之膜之厚度變薄之問題會減小。 According to the experiment, if the central region 1224 of the opening 1220 is opened at a certain width or more, the airflow in the central region 14 of the substrate 10 has a small influence on the thickness of the film of the developer. On the contrary, when the width of the opening 1220 opened in the side portion 1222 of the opening 1220 becomes larger, the velocity of the airflow in the edge region 12 of the substrate 10 becomes slow, and the problem that the thickness of the film of the developer becomes thin becomes large. Reduced.

圖7係向基板10供給顯影液時,開口1220之開放寬度之示 例。 FIG. 7 is an illustration showing the opening width of the opening 1220 when the developer is supplied to the substrate 10. example.

根據圖7,控制器(圖3之700)係以開口1220之兩側部區域之開放寬度h1比中央區域之開放寬度H2更大之方式對內側驅動器1642、第1外側驅動器1644及第2外側驅動器1646進行控制。此外,控制器700係以開口1220之兩側部區域之開放寬度h1相互成為同一之方式對第1外側驅動器1644與第2外側驅動器1646進行控制。 According to Fig. 7, the controller (700 of Fig. 3) faces the inner driver 1642, the first outer driver 1644, and the second outer side such that the opening width h1 of the both side portions of the opening 1220 is larger than the opening width H2 of the central portion. The drive 1646 performs control. Further, the controller 700 controls the first outer driver 1644 and the second outer driver 1646 such that the opening widths h1 of the both side regions of the opening 1220 are identical to each other.

控制器(圖3之700)如圖8所示選擇性地以開口1220之兩側部區域之開放寬度h3、h4相互不同之方式對第1外側驅動器1644與第2外側驅動器1646進行控制。舉例而言,排氣口1212於外殼1200之側壁之中提供任一個之情形時,基板10之兩側緣區域12中氣流之速度有時會相互不同。該情形下,控制器700於基板10之緣區域12中為了使顯影液之膜厚度相同,而以開口1220之兩側部區域之開放寬度h3、h4成為相互不同之方式進行調節。 The controller (700 of FIG. 3) selectively controls the first outer driver 1644 and the second outer driver 1646 so that the opening widths h3 and h4 of the both side regions of the opening 1220 are different from each other as shown in FIG. 8. For example, when the exhaust port 1212 is provided in any of the side walls of the outer casing 1200, the speeds of the airflows in the side edge regions 12 of the substrate 10 sometimes differ from each other. In this case, the controller 700 adjusts the opening widths h3 and h4 of the both side portions of the opening 1220 so as to be different from each other in the edge region 12 of the substrate 10 so that the film thickness of the developer is the same.

此外,處理室1000內部中上述搬送單元500及噴嘴1400以外可設置其他多樣的構成要素。藉由該等之構成要素或者其他要因,處理室1000內部之氣流會因區域不同而多樣化。因此,控制器700可根據基板10之各區域之顯影液之膜之厚度,對內側門1622、第1外側門1624、及第2外側門1626之開放寬度進行多樣地調節。 Further, various other components may be provided in the processing chamber 1000 in addition to the transfer unit 500 and the nozzle 1400. With these components or other factors, the airflow inside the processing chamber 1000 may vary depending on the area. Therefore, the controller 700 can variously adjust the opening widths of the inner door 1622, the first outer door 1624, and the second outer door 1626 in accordance with the thickness of the film of the developer in each region of the substrate 10.

其次,參照圖9至圖12針對門裝配件之多樣的變形形態進行說明。圖9至圖12中處理室係將門裝配件除外大致具有與圖6之處理室1000類似之構造。 Next, various modifications of the door fitting will be described with reference to Figs. 9 to 12 . The processing chamber of Figures 9 through 12 excludes the door assembly substantially having a configuration similar to the processing chamber 1000 of Figure 6.

如圖9之處理室2000,門裝配件2600中可提供多種數量之門2620。例如,門2620可提供與圖6之實施形態不同之兩個或者四個以上。例如,門裝配件2600可具有5個門2620。 As with the processing chamber 2000 of FIG. 9, a plurality of numbers of doors 2620 can be provided in the door fitting 2600. For example, the door 2620 can provide two or more different from the embodiment of FIG. For example, the door fitting 2600 can have five doors 2620.

此外,如圖10之處理室3000,門中一部分係藉由一個驅動器同時驅動。例如,門裝配件3600中驅動器3640係具有驅動內側 門3622之內側驅動器3642與同時驅動第1外側門3624及第2外側門3626之外側驅動器3644。 Further, as in the processing chamber 3000 of Fig. 10, a part of the door is simultaneously driven by one driver. For example, the driver 3640 in the door fitting 3600 has a drive inside The inner driver 3642 of the door 3622 drives the first outer door 3624 and the second outer door 3626 to the outer side driver 3644 at the same time.

此外,如圖11之處理室4000,門裝配件4600中,門4620具有固定門4622與驅動門4624。固定門4622係於開口4220之一定區域亦以遮斷開口4220之寬之一部分之方式固定設置有外殼4200,驅動器4640係僅與驅動門4624結合。驅動門4624係藉由驅動器4640上下移動。例如,開口4220之中央區域配置有固定門4622,開口4220之兩側部區域配置有各驅動門4624。固定門4622係開口4220中以將其上部區域一部遮斷之方式而配置。圖11中圖示有於固定門4622之各部分設置有驅動器4640,與此不同兩個固定門4622係藉由一個驅動器驅動。 Further, in the process chamber 4000 of FIG. 11, in the door fitting 4600, the door 4620 has a fixed door 4622 and a drive door 4624. The fixed door 4622 is fixed to a certain area of the opening 4220 and is also fixedly provided with a casing 4200 so as to cover only one of the widths of the opening 4220. The driver 4640 is only coupled to the driving door 4624. The drive door 4624 is moved up and down by the driver 4640. For example, the central portion of the opening 4220 is provided with a fixed door 4622, and the drive door 4624 is disposed at both side portions of the opening 4220. The fixed door 4622 is disposed in the opening 4220 so as to block one of the upper regions thereof. The portion of the fixed door 4622 illustrated in Fig. 11 is provided with a driver 4640, and the two fixed doors 4622 are driven by a single driver.

此外,如圖12之處理室5000,門裝配件5600中門5620之中一部分係以下端傾斜之方式提供。例如,內側門5622之下端係水平提供,第1外側門5624與第2外側門5626之下端係以傾斜之方式提供。該情形下,第1外側門5624與第2外側門5626之下端係離內側門5622越遠,越向上傾斜之方式進行提供。其係開口5220以其中央區域越遠,開放寬度漸進變得越變大之方式而設置。 Further, as shown in the process chamber 5000 of Fig. 12, a part of the door 5620 in the door fitting 5600 is provided in such a manner that the lower end is inclined. For example, the lower end of the inner door 5622 is horizontally provided, and the first outer door 5624 and the lower end of the second outer door 5626 are provided in an inclined manner. In this case, the first outer door 5624 and the lower end of the second outer door 5626 are provided farther from the inner door 5622, and are inclined upward. The opening 5220 is provided in such a manner that the farther the central region is, the more the opening width gradually becomes larger.

於使用圖6及圖9至圖12之門裝配件之情形時,以可多樣地改變開口之開放寬度之方式,按基板10之區域不同根據顯影液之膜之厚度之狀態對不同區域開口之開放寬度進行多樣地改變。 In the case of using the door fitting of FIG. 6 and FIG. 9 to FIG. 12, in different manners, the opening width of the opening can be varied, and depending on the area of the substrate 10, the different areas are opened according to the state of the thickness of the film of the developing solution. The opening width is varied in various ways.

圖13與圖14係表示各處理室之其他實施形態之圖式。圖13與圖14中處理室6000、7000除了具有門裝配件6600、7600外,還具有與圖6之處理室1000大致類似之構造。圖13之處理室6000中外殼6200之開口6220係以大致長方形狀提供。門裝配件6600具有一個門6620及驅動器6640。門6620以沿著其橫方向寬之大小不同之方式提供。例如,門6620之上端係沿著其橫方向以同一高度提供,門6620之下端係以具有階差之方式提供。舉例而言,門6620於兩側部區域中以下端之高度高於中央區域中下端之高度 而提供。門6620係於兩側部區域中下端之高度均相同而提供。與此不同,門6620於兩側部區域以下端之高度相互不同之方式而提供。選擇性地如圖14之處理室7000,門7620於兩側部區域中下端之高度於中央區域越遠,漸進地變得越高之方式提供。 Fig. 13 and Fig. 14 are views showing other embodiments of the respective processing chambers. The processing chambers 6000, 7000 of Figures 13 and 14 have a configuration substantially similar to that of the processing chamber 1000 of Figure 6, in addition to the door fittings 6600, 7600. The opening 6220 of the outer casing 6200 in the processing chamber 6000 of Fig. 13 is provided in a substantially rectangular shape. The door fitting 6600 has a door 6620 and a driver 6640. The door 6620 is provided in a manner that is different in width in the lateral direction thereof. For example, the upper end of the door 6620 is provided at the same height along its lateral direction, and the lower end of the door 6620 is provided in a stepped manner. For example, the height of the lower end of the door 6620 in the two side regions is higher than the height of the lower end of the central region And provide. The door 6620 is provided with the same height at the lower end of the both side regions. Unlike this, the door 6620 is provided in such a manner that the heights of the lower ends of the both side regions are different from each other. Alternatively, as in the processing chamber 7000 of Fig. 14, the door 7620 is provided in such a manner that the higher the height of the lower end of the both side regions is from the central region, the progressively higher.

圖15與圖16係表示各處理室之其他實施形態的立體圖。圖15與圖16中處理室8000、9000係具有除了開口8220、9220之形狀及門裝配件8600、9600之外與圖6之處理室1000大致類似的構造。圖15之處理室8000中開口8220沿著其橫方向寬之大小變得不同而提供。例如,開口8220之下端沿著其橫方向於同一高度提供,開口8220之上端以具有階差之方式提供。舉例而言,開口8220於兩側部區域以上端之高度高於中央區域上端之高度而提供。此外,開口8220係於兩側區域中上端之高度相互不同之方式而提供。選擇性地如圖16之處理室9000,門9620於兩側區域中上端之高度於中央區域中變得越遠,漸進地變得越高而提供。 Fig. 15 and Fig. 16 are perspective views showing other embodiments of the respective processing chambers. The processing chambers 8000, 9000 of Figures 15 and 16 have a configuration substantially similar to the processing chamber 1000 of Figure 6 except for the shape of the openings 8220, 9220 and the door fittings 8600, 9600. The opening 8220 in the processing chamber 8000 of Fig. 15 is provided along the width of the lateral direction to be different. For example, the lower end of the opening 8220 is provided at the same height along its lateral direction, and the upper end of the opening 8220 is provided in a stepped manner. For example, the opening 8220 is provided at a height above the upper end of the both side regions that is higher than the height of the upper end of the central region. Further, the opening 8220 is provided in such a manner that the heights of the upper ends of the both side regions are different from each other. Alternatively, as in the processing chamber 9000 of FIG. 16, the door 9620 is provided as the height of the upper end in the both side regions becomes higher in the central region, gradually becoming higher.

圖13至圖16之處理室係僅利用一個門並可改變開口之開放寬度,因此與其他實施形態之處理室相比,裝置構造簡單。圖13至圖16中於開口之中央區域開放寬度係小於開口之兩側部區域中之開放寬度作為示例進行了說明。然而,根據處理室內之氣流之流向及基板10中不同區域中顯影液之膜厚度,沿著開口之橫方向按區域不同而提供多樣的開放寬度之方式而可多樣地改變門及開口之形狀。 The processing chamber of Figs. 13 to 16 utilizes only one door and can change the opening width of the opening, so that the apparatus is simpler in construction than the processing chambers of other embodiments. In Figs. 13 to 16, the opening width in the central portion of the opening is smaller than the opening width in the region on both sides of the opening as an example. However, depending on the flow direction of the airflow in the processing chamber and the film thickness of the developer in different regions of the substrate 10, the shape of the door and the opening can be variously changed by providing various opening widths depending on the region in the lateral direction of the opening.

圖17係表示處理室之其他實施形態的圖式。圖17中處理室10000係以開口10220如圖15沿著其橫方向於上下方向具有其他開放寬度。但是,圖17之處理室10000中未提供門裝配件,開口10220可經常維持開放之狀態。 Fig. 17 is a view showing another embodiment of the processing chamber. In the processing chamber 10000 of Fig. 17, the opening 10220 has other opening widths in the vertical direction as shown in Fig. 15 along the lateral direction thereof. However, the door fitting is not provided in the processing chamber 10000 of Fig. 17, and the opening 10220 can be constantly maintained in an open state.

上述例中對搬入基板10之開口及調節其開口之開放寬度之門裝配件進行了說明。對搬出基板之開口及其開口之開放寬度進行調節的門裝配件亦可提供與此同一之構造。 In the above example, the opening of the substrate 10 and the door fitting for adjusting the opening width of the opening have been described. The door fitting for adjusting the opening width of the opening of the substrate and the opening thereof can also provide the same configuration.

以上之說明並未脫離對本發明之技術思想進行例示性說明之範圍,因此若為本發明所屬技術領域中具有通常知識者,則可於不脫離本發明之本質的特性之範圍內進行多樣的修正及變形。因此,本發明所開示之實施形態並非限定本發明之技術思想者,僅係用於說明,根據該實施形態,並非限定本發明之技術思想之範圍。本發明之保護範圍必須藉由以下申請專利範圍進行解釋,與其同等之範圍內所有之技術思想係必須作為本發明之權利範圍內所包含者進行解釋。 The above description does not depart from the scope of exemplifying the technical idea of the present invention, and therefore, various modifications can be made without departing from the nature of the invention. And deformation. Therefore, the embodiments of the present invention are not intended to limit the scope of the technical idea of the present invention. The scope of the present invention is to be construed as being limited by the scope of the appended claims.

10‧‧‧基板 10‧‧‧Substrate

12‧‧‧緣區域 12‧‧‧Edge area

14‧‧‧中央區域 14‧‧‧Central area

1000‧‧‧處理室 1000‧‧‧Processing room

1205‧‧‧側壁 1205‧‧‧ side wall

1206‧‧‧側壁 1206‧‧‧ side wall

1220‧‧‧開口 1220‧‧‧ openings

1222‧‧‧寬邊 1222‧‧‧Broadside

1223‧‧‧長邊 1223‧‧‧Long side

1224‧‧‧中央區域 1224‧‧‧Central area

1620‧‧‧門 1620‧‧‧

1624‧‧‧第1外側門 1624‧‧‧1st outside door

1622‧‧‧內側門 1622‧‧‧ inside door

1626‧‧‧第2外側門 1626‧‧‧2nd outer door

1627‧‧‧寬邊 1627‧‧‧Broadside

1628‧‧‧長邊 1628‧‧‧Long side

1640‧‧‧驅動器 1640‧‧‧ drive

1644‧‧‧驅動器 1644‧‧‧ drive

1642‧‧‧驅動器 1642‧‧‧ drive

1646‧‧‧驅動器 1646‧‧‧ drive

Claims (19)

一種基板處理裝置,其係處理基板之裝置,包括:一外殼,其具有搬入基板之開口;一噴嘴,其由上述外殼內提供,向基板供給處理液;及一門裝配件,其用以調節上述開口之開放寬度;上述門裝配件具有:沿著上述開口之橫方向並排提供之多數個門,及上述門之中至少一個向上下方向移動的驅動器。 A substrate processing apparatus for processing a substrate, comprising: an outer casing having an opening for loading into the substrate; a nozzle provided by the outer casing to supply the processing liquid to the substrate; and a door fitting for adjusting the above The opening width of the opening; the door fitting has a plurality of doors provided side by side in the lateral direction of the opening, and a driver for moving at least one of the doors upward and downward. 如申請專利範圍第1項所記載之基板處理裝置,其中,上述開口具有長方形狀,上述各門具有長方形狀。 The substrate processing apparatus according to claim 1, wherein the opening has a rectangular shape, and each of the doors has a rectangular shape. 如申請專利範圍第1項所記載之基板處理裝置,其中,上述基板具有長方形之板形狀,上述噴嘴係於上述基板之邊之中與上述開口之橫方向以及平行邊對應,或者進而具有較長的長度,上述噴嘴之橫方向係與上述開口之橫方向平行而提供。 The substrate processing apparatus according to claim 1, wherein the substrate has a rectangular plate shape, and the nozzle corresponds to a lateral direction and a parallel side of the opening in a side of the substrate, or further has a length The length of the nozzle is provided in parallel with the lateral direction of the opening. 如申請專利範圍第1項所記載之基板處理裝置,進而包括:於上述處理室內提供搬送基板之搬送單元。 The substrate processing apparatus according to claim 1, further comprising: a transport unit that transports the substrate in the processing chamber. 如申請專利範圍第1項至第4項中任一項所記載之基板處理裝置,其中上述多數個門以可獨立地驅動之方式於各個上述門上個別地結合有上述驅動器。 The substrate processing apparatus according to any one of claims 1 to 4, wherein the plurality of gates individually drive the actuators on the respective doors so as to be independently driveable. 如申請專利範圍第1項至第4項中任一項所記載之基板處理裝置,其中上述多數個門具有:一中央門,其係於上述開口之橫方向上位於中央區域,一第1側部門,其係位於上述開口之一側部,及一第2側部門,其係位於上述開口之他側部。 The substrate processing apparatus according to any one of claims 1 to 4, wherein the plurality of doors have a central door which is located in a central portion of the opening in a lateral direction, a first side The department is located at a side of one of the openings and a second side of the door, which is located on the side of the opening. 如申請專利範圍第6項所記載之基板處理裝置,其中,上述驅動器具有:一驅動上述中央門之中央驅動器, 一驅動上述第1側部門之第1側部驅動器,及一驅動上述第2側部門之第2側部驅動器。 The substrate processing apparatus according to claim 6, wherein the driver includes: a central driver that drives the central door; A first side driver for driving the first side unit and a second side driver for driving the second side unit. 如申請專利範圍第6項所記載之基板處理裝置,其中,上述驅動器具有:一驅動上述中央門之中央驅動器,及一同時驅動上述第1側部門與上述第2側部門之側部驅動器。 The substrate processing apparatus according to claim 6, wherein the driver includes a central driver that drives the center door, and a side driver that simultaneously drives the first side unit and the second side unit. 一種基板處理裝置,其係處理基板之裝置,包括:一外殼,其具有搬入基板之開口;一噴嘴,其由上述外殼內提供,向基板供給處理液;及一調節上述開口之開放寬度之門裝配件;其中,上述門裝配件包括:一門,其係具有與上述開口之長度對應之長度之門,及一驅動器,其係使上述門向上下方向移動之驅動器;其中,上述門具有藉由上述門向上下方向移動,而沿著上述開口之橫方向的上述開口之開放寬度不同之形狀。 A substrate processing apparatus for processing a substrate, comprising: an outer casing having an opening for loading the substrate; a nozzle provided by the outer casing to supply the processing liquid to the substrate; and a door for adjusting an open width of the opening The door fitting includes: a door having a door having a length corresponding to the length of the opening, and a driver for driving the door to move up and down; wherein the door has The door moves in the up-and-down direction, and the opening width of the opening along the lateral direction of the opening is different. 如申請專利範圍第9項所記載之基板處理裝置,其中,上述開口大致為長方形狀,上述門以其兩側部區域之下端之高度高於其中央區域之下端之高度而提供。 The substrate processing apparatus according to claim 9, wherein the opening is substantially rectangular, and the door is provided with a height of a lower end of the both side regions being higher than a height of a lower end of the central portion. 一種基板處理裝置,其係處理基板之裝置,包括:一外殼,其具有搬入基板之開口;及一噴嘴,其由上述外殼內提供,向基板供給處理液;其中,上述開口以沿著其橫方向於上下方向上寬度不同之方式而提供。 A substrate processing apparatus for processing a substrate, comprising: an outer casing having an opening for loading into the substrate; and a nozzle provided by the outer casing to supply a processing liquid to the substrate; wherein the opening is along the horizontal direction thereof The direction is provided in a manner that the width is different in the up and down direction. 如申請專利範圍第11項所記載之基板處理裝置,進而包括調節上述開口之開放寬度之門裝配件。 The substrate processing apparatus according to claim 11, further comprising a door assembly for adjusting an opening width of the opening. 如申請專利範圍第11項或第12項所記載之基板處理裝置, 其中上述開口以其兩側部區域之上端之高度高於其中央區域之上端之高度而提供。 The substrate processing apparatus according to claim 11 or 12, The opening is provided by the height of the upper end of the both side regions being higher than the height of the upper end of the central portion. 一種基板處理方法,其係於具有基板搬入之開口的外殼內向基板供給處理液來處理基板,並以沿著上述開口之橫方向上下開口之開放寬度不同之方式提供的狀態下處理上述基板。 A substrate processing method is a method of processing a substrate by supplying a processing liquid to a substrate in an outer casing having an opening into which the substrate is loaded, and processing the substrate in a state in which an opening width of the upper and lower openings in the lateral direction of the opening is different. 如申請專利範圍第14項所記載之基板處理方法,其中上述開口以沿著橫方向其側部區域與其中央區域相比開放寬度更大之方式提供。 The substrate processing method according to claim 14, wherein the opening is provided in such a manner that a side portion thereof in the lateral direction is larger than an opening width of the central portion thereof. 如申請專利範圍第15項所記載之基板處理方法,其中於上述開口之兩側部區域開放寬度以相互不同之方式而提供。 The substrate processing method according to claim 15, wherein the opening widths of the both side portions of the opening are provided differently from each other. 如申請專利範圍第14項至第16項中任一項所記載之基板處理方法,其中沿著上述開口之橫方向提供多數個門,對上述門之中至少一個門之高度進行調節,並調節上述開口之開放寬度。 The substrate processing method according to any one of claims 14 to 16, wherein a plurality of doors are provided along a lateral direction of the opening, and a height of at least one of the doors is adjusted and adjusted The open width of the above opening. 如申請專利範圍第14項至第16項中任一項所記載之基板處理方法,上述處理液係顯影液。 The substrate processing method according to any one of claims 14 to 16, wherein the processing liquid is a developing solution. 如申請專利範圍第16項所記載之基板處理方法,其中,上述基板具有長方形之板形狀,上述噴嘴具有於上述基板之邊之中與上述開口之橫方向平行的邊更長的長度,上述噴嘴之橫方向與上述開口之橫方向相平行。 The substrate processing method according to claim 16, wherein the substrate has a rectangular plate shape, and the nozzle has a length longer than a side parallel to a lateral direction of the opening among the sides of the substrate, and the nozzle The lateral direction is parallel to the lateral direction of the opening.
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