TW201340239A - Substrate processing apparatus - Google Patents

Abstract

The invention is disclosed to relieve the loading laterally imposed on the conveying device for conveying the substrate to the upper side of the processing tank. The substrate processing apparatus according to the invention comprises a processing tank for performing specific treatments on the received substrate; a first conveying unit laterally moved along a specific first channel while maintaining each substrate of a first substrate group laterally arranged in a vertically standing posture so as to convey the first substrate group to the upper side of the processing tank; a second conveying unit laterally moved along a specific second channel while maintaining each substrate of a second substrate group laterally arranged in a vertically standing posture so as to convey the second substrate group to the upper side of the processing tank; and a third conveying unit for performing relatively vertical motion relative to the first conveying unit and the second conveying unit to receive the first substrate group and the second substrate group respectively from the first conveying unit and the second conveying unit and collectively move to the processing tank.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus that collectively performs processing on a plurality of substrates. The substrate to be processed includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for an FED (Field Emission Display), a substrate for a disk, a substrate for a disk, and a substrate for a magneto-optical disk. A substrate, a substrate for a photomask, and the like (hereinafter, simply referred to as "substrate").

In a substrate processing apparatus that performs a treatment using a chemical solution on a substrate, there is a batch type in which a plurality of substrates are collectively processed. One of the batch type substrate processing apparatuses is exemplified in Patent Document 1. In the substrate processing apparatus, the unprocessed first substrate group is taken out from the wafer transfer box (FOUP), and the posture of the substrate group is changed from the horizontal posture to the vertical posture. Thereafter, the substrate group in the vertical posture is held in the first lateral row holding portion so as to be horizontally moved to the delivery position. On the other hand, the substrate processing apparatus takes out the unprocessed second substrate group from another wafer transfer cassette (FOUP) and changes the posture in the same manner. The second substrate group in the vertical posture is held in the second lateral row holding portion so as to be horizontally moved to the delivery position. At this time, the first traverse holding portion and the second traverse holding portion are horizontally wound on two paths that are different from each other. Thereby, the posture changing operation can be independently performed for each of the substrate groups, so that the substrate transfer processing speed can be improved.

Thereafter, the lift holding stages that can collectively hold the first and second substrate groups are raised, and the batch combination is performed on the lift holding table. The substrate processing apparatus is to be batched The substrate is held by the combined substrate cluster to receive the substrate and transported to the upper side of the processing tank.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-93230

However, the substrate processing apparatus of the patent document 1 has a problem that the substrate which is previously combined in batches is transported to the upper side of the processing tank in the horizontal direction, so that the load applied to the transport apparatus increases, and the size of the transport apparatus increases. This problem will become significant in the future as the size of the substrate increases.

The present invention has been made in order to solve such a problem, and an object of the invention is to provide a technique for reducing the load applied to a conveying device above a processing tank for collectively processing a substrate which is batch-assembled by collectively transporting a substrate.

In order to solve the above problems, the substrate processing apparatus according to the first aspect includes a processing tank that performs a specific process on the substrate to be housed, and the first transfer unit that holds the substrates in a vertical direction while maintaining the substrate. The first substrate group formed in the horizontal direction is horizontally along the specific first path, and the first substrate group is transported from the substrate take-out portion to the upper side of the processing tank; the second transport portion is caused by The second substrate group formed by arranging the substrates in the horizontal direction in a vertical direction while traveling along the specific second path is held, and the second substrate group is transported from the substrate take-out portion to the processing tank. And the third transfer unit, wherein the first transfer unit and the second transfer unit are moved upward and downward with respect to the first transfer unit and the second transfer unit over the processing tank. The first substrate group and the second substrate group are respectively received and collectively transported to the processing tank.

The substrate processing apparatus according to the first aspect is the substrate processing apparatus according to the first aspect, wherein the first conveying unit and the second conveying unit are configured to cause the first conveying unit to travel along the first passage The first substrate group and the second substrate group are transported so that the lower end of the substrate group is higher than the lower end of the second substrate group when the second transfer portion runs along the second path.

The substrate processing apparatus according to the third aspect is the substrate processing apparatus according to the second aspect, wherein the first transport unit and the second transport unit are configured to cause the first transport unit to travel along the first path The lower end of the substrate group conveys the first substrate group and the second substrate group so as to be lower than the upper end of the second substrate group when the second transfer portion runs along the second path.

The substrate processing apparatus according to any one of the first to third aspects, wherein the first passage and the second passage sandwich the processing tank when viewed from above.

The substrate processing apparatus according to any one of the first to third aspects, wherein the third transport unit receives the first substrate group and the above by the relative upward movement The second substrate group.

The substrate processing apparatus according to any one of the first to third aspect, wherein the third transporting portion is not higher than the height above the processing tank by the relative upward movement The first substrate group and the second substrate group are respectively received at the same two places.

The substrate processing apparatus according to any one of the first to third aspects of the present invention, wherein at least one of the first conveying unit and the second conveying unit is moved downward. The first substrate group and the second substrate group are respectively received by the third transport unit.

A substrate processing apparatus according to any one of the first to third aspects, further comprising: a first housing portion that arranges the first substrate group in a vertical direction The second storage unit accommodates the second substrate group in a state of being aligned in a vertical direction, and the substrate delivery unit sequentially performs a first transfer operation and a second transfer operation, and the first transfer operation The first substrate group is collectively taken out from the first storage unit, and the posture of the first substrate group is collectively changed so that the first substrate group is arranged in the horizontal direction, and the changed first substrate group is transferred to In the second transfer operation, the second substrate group is collectively taken out from the second storage unit, and the second substrate group is collectively changed in the horizontal direction so that the second substrate group is arranged in the horizontal direction. The second substrate group after the change is transferred to the second transfer unit.

The substrate processing apparatus according to any one of the first to third aspects, wherein the first transport unit and the second transport unit are configured to at least the first substrate group and the second substrate When the substrate group is transferred to the third transfer unit, the arrangement relationship between the first substrate group and the second substrate group is such that each of the first substrate group and the second substrate group does not overlap when viewed from above. In the arrangement relationship, the first substrate group and the second substrate group are respectively held.

The substrate processing apparatus according to any one of the first to third aspects, wherein the first conveying unit includes a pair of first holding members, and the pair of first holding members are driven The pair of first holding members can be selectively set to maintain the state of only the first substrate group of the first substrate group and the second substrate group, and the first substrate group and the second substrate can be The substrate group passes between the pair of first holding members; the second conveying portion includes a pair of second holding members, and the pair of second holding members can be selectively driven by the pair of second holding members The first substrate group and the second substrate group are maintained in a state in which only the second substrate group of the first substrate group and the second substrate group are held, and the first substrate group and the second substrate group are allowed to pass between the pair of second holding members State.

According to the invention of any one of the first to tenth aspects, the first and second conveying units transport the respective substrate groups before the batch combination to the upper side of the processing tank, and the third conveying unit is disposed in the processing tank. The upper portion is moved upward and downward with respect to the first and second conveying portions, and each of the transported substrate groups is received. Then, the third transport unit transports the transferred substrate clusters to the processing tank. Therefore, it is possible to reduce the load applied to the transport device that transports the substrate to the upper side of the processing tank by the horizontal direction.

1‧‧‧Substrate processing unit

2‧‧‧ Wafer transfer box loading department

3‧‧‧Substrate removal unit

5‧‧‧Substrate Processing Department

5a‧‧‧Drug treatment department

5b‧‧‧Washing Department

5c‧‧‧Multifunctional Processing Department

7‧‧‧Substrate storage unit

8‧‧‧ Wafer transfer box removal department

9a‧‧‧Substrate transfer transport mechanism

9b‧‧‧Substrate transfer transport mechanism

11‧‧‧Multi-function processing tank

15‧‧‧ Lift (3rd transport department)

15a‧‧‧ Lift head

15b‧‧‧ Lift head

15c‧‧‧Upper end

16a‧‧‧1st substrate impregnation mechanism

16b‧‧‧1st substrate impregnation mechanism

18‧‧‧ Lifts

18a‧‧‧ Lift head

18b‧‧‧ Lift head

22‧‧‧Substrate support member

24‧‧‧Substrate support member

32‧‧‧Retaining components

34‧‧‧Retaining components

36‧‧‧Retaining components

37‧‧‧Rotary axis

38‧‧‧ Keeping components

52‧‧‧Slots

54‧‧‧ Face

55‧‧‧ Face

62‧‧‧ Face

64‧‧‧ Face

66‧‧‧ Face

68‧‧‧Rotary axis

72‧‧‧ Face

74‧‧‧ Face

76‧‧‧ Face

78‧‧‧Rotary axis

92‧‧‧ gap

96‧‧‧ half-pitch

98‧‧‧Normal spacing

102‧‧‧Bottom

104‧‧‧Upper

106‧‧‧Bottom

108‧‧‧Bottom

112‧‧‧ chuck slot

114‧‧‧through slot

122‧‧‧ chuck slot

124‧‧‧through slot

201‧‧‧1st pathway

202‧‧‧2nd pathway

AM1‧‧‧ wrist

BH1‧‧‧ robot

BH2‧‧‧ robot

CB‧‧‧ drug tank

CR1‧‧‧Substrate Transfer Robot

CR2‧‧‧Substrate Transfer Robot

F1‧‧‧ wafer transfer box

F2‧‧‧ wafer transfer box

F3‧‧‧ wafer transfer box

F4‧‧‧ wafer transfer box

TR1‧‧‧Transport robot (first transport unit)

TR2‧‧‧Transport robot (second transport unit)

W1‧‧‧1st substrate group

W2‧‧‧2nd substrate group

WB‧‧·washing tank

Fig. 1 is a perspective view showing an example of a configuration of a substrate processing apparatus according to an embodiment.

Fig. 2 is a schematic view for explaining the operation of the substrate transfer robot.

Fig. 3 is a view for explaining an example of a holding member of the transfer robot and an operation thereof.

4 is a view for explaining an example of a holding member of a transfer robot and an operation thereof.

Fig. 5 is a view for explaining an example of a holding member of the transfer robot and an operation thereof.

Fig. 6 is a view for explaining the operation of the substrate transfer robot to transfer the substrate.

Fig. 7 is a view for explaining an operation of transferring a substrate by a substrate transfer robot.

Fig. 8 is a view for explaining an operation of transferring a substrate by a substrate transfer robot.

Fig. 9 is a view for explaining an operation of transferring a substrate by a substrate transfer robot.

Fig. 10 is a view for explaining a positional relationship of a substrate conveyed above the processing tank.

Fig. 11 is a view for explaining a positional relationship of a substrate conveyed above the processing tank.

Fig. 12 is a view for explaining an example of an operation of the elevator receiving the substrate.

Fig. 13 is a view for explaining an example of an operation of the elevator receiving the substrate.

Fig. 14 is a view for explaining an example of an operation of the elevator receiving the substrate.

Fig. 15 is a view for explaining an example of an operation of the elevator receiving the substrate.

Fig. 16 is a view for explaining an example of an operation of the elevator receiving the substrate.

Fig. 17 is a view showing a state in which the holding member of Fig. 15 is viewed from above.

Fig. 18 is a view showing a state in which the holding member of Fig. 16 is viewed from above.

Fig. 19 is a view for explaining another example of the holding member of the transfer robot.

Fig. 20 is a view for explaining another example of the holding member of the transfer robot.

Fig. 21 is a view for explaining another example of the holding member of the transfer robot.

Fig. 22 is a view for explaining another example of the holding member of the transfer robot.

Fig. 23 is a view for explaining another example of the operation of the elevator receiving the substrate.

Fig. 24 is a view for explaining another example of the operation of the elevator receiving the substrate.

Fig. 25 is a flow chart showing an example of the operation of the substrate processing apparatus of the embodiment.

Fig. 26 is a flow chart showing an example of the operation of the substrate processing apparatus of the embodiment.

Fig. 27 is a flow chart showing an example of the operation of the substrate processing apparatus of the embodiment.

Hereinafter, an embodiment of the present invention will be described based on the drawings. In the drawings, the same reference numerals are given to the parts having the same configurations and functions, and the repeated description is omitted in the following description. Further, each of the drawings is a model representative, and for example, the size and positional relationship of the representations in the respective drawings are not necessarily accurate. Further, in some drawings, a coordinate axis is attached to explain the direction.

<A. Embodiment> <A-1. Composition of substrate processing apparatus>

Fig. 1 is a perspective view showing an example of a configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. As shown in the figure, the apparatus includes a wafer transfer cassette loading unit 2 that inputs wafer transfer cassettes F1 and F2 in which unprocessed substrates are stored, and a substrate take-out unit 3 that is loaded into the wafer transfer cassette. The plurality of unprocessed substrates are simultaneously taken out from inside the wafer transfer cassettes F1 and F2 of the unit 2; the substrate processing unit 5 sequentially cleans the unprocessed substrates taken out from the wafer transfer cassettes F1 and F2; and the substrate storage unit 7. The plurality of processed substrates after the cleaning process are simultaneously stored in the empty wafer transfer cassettes F3 and F4, and the wafer transfer cassette carry-out unit 8 takes out the wafer transfer cassette F3 in which the processed substrate is stored. And F4. Further, on the front side (-Y side) and the rear side (+Y side) of the apparatus, the substrate transfer conveyance mechanisms 9a and 9b are disposed from the substrate take-out portion 3 to the substrate storage portion 7, and the cleaning process and the cleaning process are performed. The substrate after the cleaning process is transferred or transferred from one place to another.

The wafer transfer cassette loading unit 2 is a wafer transfer cassette storage (buffer), and the inside is housed. The wafer transfer cassette F1 ("first storage unit") of the unprocessed 25-piece substrate ("first substrate group") W1 and the unprocessed 25-piece substrate ("second substrate group") W2 are accommodated therein. The wafer transfer cassette F2 ("second storage unit") is carried in and placed at a specific position on the upper portion of the wafer transfer cassette loading unit 2. The unprocessed substrates are housed in the wafer transfer cassettes F1 and F2, respectively, in a state in which the substrate faces are parallel to the horizontal plane and are arranged at equal intervals in the vertical direction (Z direction). The interval between the substrates is set, for example, to 10 mm. Further, on the front surface (+X side) of each of the wafer transfer cassettes F1 and F2, an unillustrated opening machine for opening and closing each of the front surfaces of the respective front of the wafer transfer cassettes F1 and F2 is disposed. .

The substrate take-out portion 3 includes a multi-joint type substrate transfer robot CR1 ("substrate transfer portion"). The substrate transfer robot CR1 mainly includes a main body portion and a rotating portion that is rotatable about a specific rotation axis, and is attached to the rotation portion, has a joint portion, and is capable of flexing and extending the wrist portion AM1 (FIG. 2), and is attached to the wrist portion. The front end of the robot BH1. The substrate transfer robot CR1 transfers the unprocessed substrate stored in the wafer transfer cassette F1 placed at a specific position on the wafer transfer cassette loading unit 2 to the transfer robot TR1 provided in the substrate transfer/transport mechanism 9a, and The unprocessed substrate accommodated in the wafer transfer cassette F2 is transferred to the transfer robot TR2 provided in the substrate transfer conveyance mechanism 9b. Specifically, the substrate transfer robot CR1 collectively takes out 25 unprocessed substrates from the wafer transfer cassette F1, and collectively changes the posture of each of the removed substrates so as to be arranged at equal intervals in the horizontal direction, and the changed 25 is changed. The sheet unprocessed substrate is transferred to the transfer robot TR1 ("first transfer operation"). In the same manner, the substrate transfer robot CR1 collectively extracts 25 unprocessed substrates from the wafer transfer cassette F2, and collectively changes the posture of each of the removed substrates so as to be arranged at equal intervals in the horizontal direction, and the 25 pieces after the change are changed. The unprocessed substrate is transferred to the transfer robot TR2 ("second transfer operation"). The substrate transfer robot CR1 sequentially performs the transfer operations.

The transport robots TR1 and TR2 are provided with a pair of holding members 32 and 34, respectively. The chuck grooves 112 and 122 (FIG. 9) are engraved on one of the pair of holding members 32 and 34, and the 25 unprocessed substrates transferred from the substrate transfer robot CR1 can be vertically and vertically supported. Transport robot When receiving the substrate from the substrate transfer robot CR1, TR1 and TR2 move horizontally (traverse) along the first path 201 and the second path 202, respectively, and then the received substrate is loaded into the substrate processing unit 5. Specifically, the transport robot TR1 holds the unprocessed first substrate group W1 along the first path while maintaining the vertical direction of each of the substrates taken out from the wafer transfer cassette F1 at equal intervals in the horizontal direction. 201 is horizontally transported, and the substrate group is transported from the substrate take-out portion 3 to the upper side of each processing tank of the substrate processing portion 5. In addition, the transport robot TR2 keeps the unprocessed second substrate group W2 arranged at equal intervals in the horizontal direction while being held in the vertical direction by the respective substrates taken out from the wafer transfer cassette F2, and travels along the second path 202. This substrate group is transported from the substrate take-out portion 3 to the upper side of each processing tank of the substrate processing portion 5. Further, when the first passage 201 and the second passage 202 are viewed from above (+Z side), the respective processing grooves are opposed to each other and opposed to each other.

The substrate processing unit 5 includes a chemical processing unit 5a including a chemical solution tank CB for storing a chemical liquid, a water washing treatment unit 5b including a washing tank WB for storing pure water, and various chemical liquid treatments and water washing treatments in a single tank. Or the multi-function processing unit 5c of the multi-function processing tank 11 such as the substrate drying process. A lid (not shown) is opened and closed in each of the chemical tank CB, the washing tank WB, and the multi-function processing tank 11, and each of the processing tanks is subjected to a specific treatment. The chemical tank CB, the washing tank WB, and the multi-function processing tank 11 correspond to a "treatment tank", respectively.

In the substrate processing unit 5, the first substrate immersing mechanisms 16a and 16b are disposed on the front side and the rear side of the chemical liquid processing unit 5a and the water washing processing unit 5b, respectively, and the elevator 15 (third transport unit) is provided.

The elevator 15 includes a pair of substrate supporting members 22 which are provided between the first substrate immersing mechanisms 16a and 16b, which are vertically movable and horizontally movable, and between the lifting heads 15a and 15b. The elevator 15 receives the first substrate group W1 and the second substrate group W2 from the transport robots TR1 and TR2 by moving up and down with respect to the transport robots TR1 and TR2 above the chemical tank CB, and performs the division. Batch combination. The reception is made by using The grooves provided in the groove portions 52 (FIG. 13) of the pair of substrate supporting members 22 are supported by the substrates received by the transfer robots TR1 and TR2. The elevator 15 conveys the received substrate clusters to the chemical tank CB and the washing tank WB of the water washing treatment unit 5b, and immerses them in the chemical tank CB or immerses in the washing tank WB. Further, the elevator 18 in the multi-function processing unit 5c receives the first substrates received from the transport robots TR1 and TR2 by the lift heads 18a and 18b which are vertically movable between the pair of substrate support members 24, respectively. The group W1 and the second substrate group W2 are supported in the multi-function processing tank 11 of the multi-function processing unit 5c. The opening of the multi-function processing tank 11 is closed by a lid in a state in which the elevator 18 is housed in the multi-function processing tank 11, and various processes including a vacuum drying process of the substrate accommodated together with the elevator 18 are performed.

The substrate housing portion 7 has the same structure as the substrate take-out portion 3, and is provided with a multi-joint type substrate transfer robot CR2. The substrate transfer robot CR2 has the same configuration as the substrate transfer robot CR1, and receives the first substrate group W1 held by the transfer robot TR1 by the robot BH2 and transfers it to the wafer transfer cassette carry-out unit 8 In the empty wafer transfer cassette F3, the second substrate group W2 held by the transfer robot TR2 is received and transferred to the empty wafer transfer cassette F4 placed in the wafer transfer cassette carry-out unit 8. The wafer transfer cassettes F3 and F4, which respectively transfer the processed substrate groups, are removed from the wafer transfer cassette carry-out unit 8.

Each of the substrate transfer transport mechanisms 9a and 9b includes transport robots TR1 and TR2 that can be horizontally moved and moved up and down. The substrate transfer robot CR1 transfers the substrate taken out from the wafer transfer cassettes F1 and F2 to the substrate by holding the substrate on the rotatable holding members 32 and 34, respectively, provided by one of the transfer robots TR1 and TR2. The side of the elevator 15 of the first substrate immersing mechanisms 16a and 16b of the substrate processing unit 5 is transferred from the side of the elevator 15 to the side of the elevator 18 provided in the adjacent multi-function processing unit 5c, or is transferred from the side of the elevator 18 The substrate transfer robot CR2 to the substrate housing portion 7.

<A-2. Action of substrate processing apparatus>

25 to 27 are examples of the operation of the substrate processing apparatus 1 of the embodiment. A flowchart of the action flow S100 is shown. 25 is a flow chart showing an outline of the operation before the substrates taken out from the wafer transfer cassette are batch-assembled above the processing tank, and FIG. 26 is a view showing the operation of transferring the substrate taken out from the wafer transfer cassette F1 to the transfer robot TR1. Detailed action flow. Fig. 27 is a view showing a detailed operational flow of the operation of transferring the substrate to the elevator 15. Hereinafter, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of FIGS. 25 to 27. In this description, a supplementary explanation necessary for the device configuration is also performed while referring to other drawings as appropriate.

<A-2-1. Outline of Action>

As shown in FIG. 25, in the operation flow S100, first, the substrate transfer robot CR1 takes out the substrate (first substrate group W1) from the wafer transfer cassette F1 (step S110), and transfers the extracted first substrate group W1 to the transfer robot. TR1 (step S120).

FIG. 2 is a schematic view for explaining an operation of the substrate transfer robot CR1 taking out the first substrate group W1 from the wafer transfer cassette F1 placed in the wafer transfer cassette loading unit 2 and transferring it to the transfer robot TR1. In FIG. 2, the three states of the substrate transfer robot CR1 during the operation of the substrate transfer robot CR1 are represented by a two-dot chain line, a single-dot chain line, and a solid line.

The substrate transfer robot CR1, which is represented by a two-dot chain line, inserts the first substrate group W1 from the wafer transfer cassette F1 placed on the wafer transfer cassette loading unit 2, and inserts the robot BH1 into the wafer transfer cassette F1. Inside. In the wafer transfer cassette F1, the first substrate group W1 is accommodated in a state in which the substrate surfaces are arranged in parallel with the horizontal plane (the XY plane) at equal intervals in the vertical direction (Z direction). In the robot hand BH1, a plurality of support plates are provided at the same interval as the substrate, and by inserting, the substrates of the first substrate group W1 are inserted one by one into each interval between the adjacent support plates. It is held by the chuck mechanism of the robot BH1. Further, the robot hand BH1 also has a release mechanism for releasing the chuck, and releases the chuck when the substrate held by the robot BH1 is transferred to the transport robot. As such a robot hand BH1, for example, a robot hand of a substrate transfer device disclosed in Japanese Patent No. 3745064 can be used.

The substrate transfer robot CR1 indicated by the single-dot chain line takes out the state of the first substrate group W1 from the wafer transfer cassette F1. The substrate transfer robot CR1 is in a state in which the first substrate group W1 is removed and the first substrate group W1 is placed in the vertical direction, that is, the vertical surface (XZ) by changing the posture of the robot B1. The parallel faces are arranged at equal intervals in the horizontal direction (Y direction). In the present embodiment, the robot hand BH1 of the substrate transfer robot CR1 first changes the substrate from the horizontal posture to the vertical direction in the state in which the substrate group W1 is held, and thereafter, the vertical axis is performed by the robot BH1. The (Z-axis) is rotated by the center and converted to the posture shown by the solid line in Fig. 2 .

The substrate transfer robot CR1 shown by the solid line indicates that the first substrate group W1 held by the robot BH1 passes between one of the holding members 32 and one of the transfer robots TR2 and the holding member 34. And the state of ascending to the top. In the lifting process, the holding members 32 and 34 are set to the following passable state, and the first substrate group W1 is lifted without coming into contact with the holding members 32 and 34. When the lower end of the first substrate group W1 is lifted up toward the holding member 32 until it is not in contact with the holding member 32, one of the transport robots TR1 sets the holding member 32 to the following holdable state. Then, the robot BH1 lowers the first substrate group W1 downward when the first substrate group W1 contacts the holding member 32, and accommodates the first substrate group W1 in the chuck groove 112 (FIG. 7) of the holding member 32. The first substrate group W1 is transferred from the robot BH1 to the transfer robot TR1. At the time of the handover, the chuck mechanism of the robot BH1 is released. Further, the substrate transfer robot CR2 (FIG. 1) has the same configuration as the substrate transfer robot CR1, and the substrate transfer robots TR1 and TR2 are transferred to the wafer transfer cassettes F3 and F4 in contrast to the substrate transfer robot CR1. .

After the transfer of the step S120 (FIG. 25) is completed, the substrate transfer robot CR1 and the first substrate group W1 are transferred to the transfer robot TR1, and the substrate (the second substrate group W2) is taken out from the wafer transfer cassette F2 (step S130). The second substrate group W2 taken out is transferred to the transport robot TR2 (step S140). The transport robots TR1 and TR2 that respectively receive the first substrate group W1 and the second substrate group W2 move above the processing tank (step S150), and perform the first substrate group W1 and The second substrate group W2 is transferred to the elevator 15 (step S160).

FIG. 10 and FIG. 11 are views for explaining an example of the positional relationship of the substrates conveyed above the processing tank by the transfer robots TR1 and TR2. Fig. 10 is a view in which the transport robots TR1 and TR2 are viewed in the +Y direction, and Fig. 11 is a view in which the transport robots TR1 and TR2 of Fig. 10 are viewed in the +X direction.

By causing the transport robot TR1 to traverse along the first path 201, the pair of holding members 32 move along the arrow X1 while maintaining the first substrate group W1. Further, by causing the transport robot TR2 to traverse along the second path 202, the pair of holding members 34 move along the arrow X2 while holding the second substrate group W2.

As shown in FIG. 11 , the first substrate group W1 and the second substrate group W2 are respectively held and transported as follows: when viewed in the moving direction (+X direction) of the substrate, the substrates of the second substrate group W2 are viewed. Each of the gaps between the adjacent substrates of the first substrate group W1 is inserted into the gaps of the first substrate group W1 in a non-contact manner.

In addition, the transport robot TR1 and the transport robot TR2 are the second substrate group W2 when the lower end 106 of the first substrate group W1 when the transport robot TR1 is traveling along the first path 201 and the transport robot TR2 is traveling along the second path 202. The lower end 108 is transported to the first substrate group W1 and the second substrate group W2, respectively. In addition, the lower end 106 of the second substrate group W2 when the transport robot TR2 is traveling along the second path 202 is lower than the lower end 106, and the lower end of the holding member 32 when the transport robot TR1 holds the first substrate group W1 and traverses The first substrate group W1 and the second substrate group W2 are transported by 102 and the upper end 104 are further downward.

Therefore, the lower portion of the first substrate group W1 and the upper portion of the second substrate group W2 are superimposed so as to overlap each other when viewed from the lateral direction. Therefore, the first substrate group W1 and the second substrate group W2 do not overlap each other when viewed from the lateral direction. The height of the substrate processing apparatus 1 can be made lower than in the case of the mode of transportation. This superimposition can be realized by, for example, the observation that the respective substrates of the second substrate group W2 are inserted into the first substrate group W1 one by one in a non-contact manner when viewed in the moving direction (+X direction) of the substrate. Keep and transport the gaps between adjacent substrates The first substrate group W1 and the second substrate group W2.

In addition, the first substrate group W1 and the second substrate group W2 are transported from mutually different paths until they reach the upper side of the processing tank when viewed from above, and then when the respective substrate groups are viewed from above above the processing tank Each of the substrates of the second substrate group W2 is transported so as to be inserted into the gaps between the respective substrates of the first substrate group W1 in a non-contact manner. In other words, the transport robot TR1 and the transport robot TR2 can hold the first substrate group W1 and the second substrate group W2 in such a manner that at least the first substrate group W1 and the second substrate group W2 are respectively transferred to the first substrate group W1 when the elevator 15 is delivered to the elevator 15 The arrangement relationship with the second substrate group W2 is such that each of the substrates of the second substrate group W2 is inserted into the gaps between the adjacent substrates of the first substrate group W1 in a non-contact manner.

<A-2-2. Action of holding member of transport robot>

3 to 5 are views for explaining an example of the configuration of the holding members 32 and 34 of the transport robots TR1 and TR2 and their operations, and FIG. 3 shows a state in which the holding members 32 and 34 are set to be passable. 4 and 5 show a state in which the holding members 32 and 34 are set in a holdable state. 3 to 5 show the positional relationship between the cross-sectional shape of the pair of holding members 32 (34) and the substrate of the first substrate group W1 (second substrate group W2) cut in the XZ plane, and a pair of holdings are shown. The +X side of the member 32 (34) omits the illustration of the other holding member. The cross-sectional shape of the holding member (not shown) is symmetrical with respect to the YZ plane and the cross-sectional shape of the holding member shown.

The transport robot TR1 (TR2) switches the passable state and the maintainable state of the holding member 32 (34) by rotating the holding member 32 (34). More specifically, the transport robot TR1 can selectively hold the holding member 32 so that only the first substrate group W1 of the first substrate group W1 and the second substrate group W2 can be held by driving the pair of holding members 32. The state ("retainable state") and the state in which the first substrate group W1 and the second substrate group W2 pass between the pair of holding members 32 ("passable state"). Further, the transport robot TR2 can selectively set the holding member 34 to hold only the first substrate group by driving the pair of holding members 34. The state (sustainable state) of the second substrate group W2 in the second substrate group W2 and the state in which the first substrate group W1 and the second substrate group W2 pass between the pair of holding members 34 (the passable state) ).

As shown in FIGS. 3 to 5, the holding members 32 and 34 each include, for example, a triangular columnar member elongated in the Y-axis direction. The retaining member 32 has three sides 62, 64, and 66, and the retaining member 34 has three sides 72, 74, and 76. The holding member 32 is driven by the transport robot TR1 and rotates with the rotating shaft 68 as a center of rotation, and the holding member 34 is driven by the transport robot TR2 and rotates with the rotating shaft 78 as a center of rotation.

As shown in FIG. 9 below, the chuck groove 112 and the through groove 114 are alternately provided on the surface 64. The substrate interval (substrate pitch) between the first substrate group W1 and the second substrate group W2 is, for example, a normal pitch 98 of 10 mm, and the interval between the adjacent chuck grooves 112 is set to a normal pitch 98. Further, the center lines of the adjacent chuck grooves 112 and the through grooves 114 are spaced apart from each other by one half of the normal pitch 98, for example, a half pitch 96 of 5 mm. Similarly, a chuck groove 122 and a through groove 124 are alternately provided on the surface 74. Further, the chuck groove 112 (122) and the through groove 114 (124) are alternately provided on the surface 66 (76).

As shown in Fig. 3, in the passable state, the faces 62 (72) of the pair of holding members 32 (34) are parallel to the YZ plane, and the faces 62 are opposed to each other (72). The distance between the surfaces 62 (72) is wider than the diameter of the first substrate W1 (W2), and the first substrate groups W1 and W2 can pass between the pair of holding members 32 (34) up and down (Z-axis direction). Face 62 (72) is also referred to as "passing face". When the first substrate groups W1 and W2 are moved up and down by the central portion between the pair of holding members 32 (34), a gap 92 is formed between the surface 62 (72) and the substrate group.

As shown in FIGS. 4 and 5, in the holdable state, the faces 64 (74) of the pair of holding members 32 (34) or the faces 66 (76) are spaced apart from each other by a diameter smaller than the diameter of the first substrate W1 (W2). Therefore, the pair of holding members 32 (34) can hold the first substrate group W1 (W2). More specifically, the pair of holding members 32 (34) can hold the first substrate group W1 (W2) by the chuck grooves that are formed on the holding surface.

For example, the surface 64 (74) is held on the surface of the untreated substrate before the chemical solution tank CB or the like, and the surface 66 (76) is, for example, a surface of the processed substrate taken out from the water washing tank WB. By switching the surface of the unprocessed substrate and the surface of the substrate to be processed, it is possible to prevent particles or the like adhering to the unprocessed substrate from adhering to the processed substrate. Further, the face 64 (74) and the face 66 (76) are also referred to as "holding faces".

19 to 22 are views for explaining another example of the holding member of the transfer robot. 19 and 20, the positional relationship between the cross-sectional shape of the pair of holding members 36 and the substrate of the first substrate group W1, which is cut in the XZ plane, is shown in FIG. 21 and FIG. The positional relationship between the cross-sectional shape of the holding member 38 and the substrate of the first substrate group W1.

The pair of holding members 36 have a plate-like shape elongated in the Y-axis direction, and are rotatable about the rotation shaft 37. Fig. 19 shows the holdable state of the holding member 36, and Fig. 20 shows the passable state of the holding member 36. In the example shown in Figs. 19 and 20, in the faces 54 and 55 of the holding member 36, the face 54 is a holding face and is also a passing face, but for example, one of the faces 54 and 55 may be a holding face and the other The holding member 36 is operated by a surface.

The pair of holding members 38 have a rectangular columnar shape elongated in the Y-axis direction, and can be opened and closed to the left and right (in the +X direction and the -X direction). Fig. 21 shows the holdable state of the holding member 38, and Fig. 22 shows the passable state of the holding member 38.

As the holding member of the transport robot TR1 and the transport robot TR2, the usability of the present invention is not impaired by using, for example, the holding member 36 or the holding member 38 instead of the holding member 32 (34).

<A-2-3. Transfer of the substrate taken out from the wafer transfer cassette to the substrate of the transfer robot>

6 to 9 are views for explaining the operation of the substrate transfer robot CR1 to transfer the first substrate group W1 to the holding member 32 of the transfer robot TR1 and to transfer the second substrate group W2 to the holding member 34 of the transfer robot TR2. A picture of one example. In FIGS. 6 to 9, the state of the holding member on the +Y side of each of the pair of holding members 32 and 34 is viewed from above, and the other is omitted. The holding members 32 and 34 in the operation examples of FIGS. 6 to 9 are viewed from above. The time is at the same position of the substrate take-out portion 3, but for convenience of explanation, the holding member 32 and the holding member 34 are shown separately in the left-right direction (in the Y-axis direction). Furthermore, the transfer of the substrate by the substrate transfer robot CR1 can be performed in a state in which the holding members 32 and 34 are located at mutually different positions when viewed from above.

In Fig. 6, the holding members 32 and 34 are respectively set to the passable state shown in Fig. 3. In Figs. 7 and 8, the holding member 32 is set to the holdable state shown in Fig. 4, and the holding member 34 is set to the passable state shown in Fig. 3. In Fig. 9, the holding members 32 and 34 are respectively set to the holdable state shown in Fig. 4.

The chuck groove 112 and the through groove 114 are alternately provided on the surface 64 of the holding member 32, and the chuck groove 122 and the through groove 124 are alternately provided on the surface 74 of the holding member 34. The spacing between the adjacent through grooves and the respective chuck grooves is a normal spacing 98, and the center lines of the adjacent through grooves and the chuck grooves are spaced apart from each other by a half pitch 96. Further, the holding member 32 and the holding member 34 are shifted from each other by a half pitch 96 in the X-axis direction. Similarly, the chuck groove 112 and the through groove 114 are alternately provided on the surface 66 of the holding member 32, and the chuck groove 122 and the through groove 124 are alternately provided on the surface 76 of the holding member 34.

Furthermore, the maintainable state of the holding members 32 and 34 can be achieved by the states shown in FIG. 5, respectively. In other words, the first substrate group W1 can be held by the counter surface 66 of one of the pair of holding members 32, and the second substrate group W2 can be held by the counter surface 76 of one of the pair of holding members 34.

Hereinafter, the details of the processing of step S120 (Fig. 25) will be described with reference to Figs. 6 and 7 in accordance with the flowchart of Fig. 26. The transport robot TR1 (TR2) first drives the pair of holding members 32 (34), and sets the pair of holding members 32 (34) to the passable state shown in Figs. 3 and 6 (step S210). In the substrate transfer robot CR1, the position and posture of the robot hand BH1 can be adjusted so that the first substrate group W1 passes between the pair of holding members 32 and between the pair of holding members 34 as shown in FIG. 6 . After this adjustment, the substrate transfer robot CR1 raises the robot hand BH1. As a result of this rise, as shown in FIG. 6, the first substrate group W1 passes between the surfaces 72 of the pair of holding members 34, and passes through the faces 62 of the pair of holding members 32. between. Then, the robot BH1 holds the substrate (the first substrate group W1) above the holding member 32 of the transport robot TR1 (step S220). In this state, the outer edge of the lower side of the first substrate group W1 is held above the holding member 32, and the holding member 32 can be rotated without interfering with the first substrate group W1. Then, the transport robot TR1 sets the holding member 32 to, for example, the holdable state shown in FIG. 4 (step S230). Then, the robot hand BH1 of the substrate transfer robot CR1 moves downward, and as shown in FIG. 7, the substrate (the first substrate group W1) is transferred to the chuck groove 112 of the holding member 32 (step S240). The robot hand BH1 of the substrate transfer robot CR1 is retracted below the pair of holding members 34 (step S250), and the processing of step S120 (Fig. 25) is completed.

Next, the transfer operation of the substrate transfer robot CR1 to the pair of holding members 34 by the second substrate group W2 is performed in the same manner. In this operation, first, when the holding member 34 is set to the passable state shown in FIG. 8, the robot hand BH1 holding the second substrate group W2 is raised. As a result of this rise, as shown in FIG. 8, the second substrate group W2 passes between the surfaces 72 of the pair of holding members 34. Then, the robot BH1 holds the second substrate group W2 above the holding member 34. In this state, the outer edge of the lower side of the second substrate group W2 is held above the holding member 34, and the holding member 34 can be rotated without interfering with the second substrate group W2. Then, the transport robot TR1 sets the holding member 34 to, for example, the holdable state shown in FIG. Then, the robot hand BH1 moves downward, and as shown in FIG. 9, the second substrate group W2 is transferred to the chuck groove 122 of the holding member 32. The robot hand BH1 is retracted below the pair of holding members 34.

<A-2-4. Transfer of substrate to elevator>

12 to 16 are views for explaining an example of an operation of the elevator 15 to receive the substrate (the first substrate group W1 and the second substrate group W2). FIG. 12 is a cross-sectional view showing a state in which the first substrate groups W1 and W2 are transported to the upper side of the chemical solution tank CB by the holding members 32 and 34, respectively, in the +Y direction. Below the first substrate group W1 and the second substrate group W2, there is an elevator 15 having a pair of substrate supporting members 22 that have been lowered into the chemical solution tank CB.

Figure 13 is a cross-sectional view showing the state of Figure 12 in the +X direction. FIG. 14 is a cross-sectional view showing a state in which the elevator 15 of FIGS. 12 and 13 is raised in the direction of the arrow Z1 until the substrate supporting member 22 abuts against the end surface on the lower side of the second substrate group W2. Fig. 15 is a cross-sectional view showing a state in which the elevator 15 of Fig. 14 is further raised in the direction of the arrow Z1 (Fig. 14) until the substrate supporting member 22 abuts against the end surface on the lower side of the first substrate group W1. FIG. 16 is a cross-sectional view showing a state in which the lifter 15 of FIG. 15 is further raised while supporting the first substrate group W1 and the second substrate group W2 by the substrate supporting member 22. After this rise, the holding member 32 and the holding member 34 are changed from the usable state to the passable state.

Fig. 17 is a view showing a state in which the holding members 32 and 34 of Fig. 15 and the first substrate group W1 and the second substrate group W2 are viewed from above. 18 is a view showing the state of the holding members 32 and 34 and the first substrate group W1 and the second substrate group W2 of FIG. 16 as viewed from above.

Hereinafter, details of the processing of step S160 (FIG. 25) will be described with reference to FIG. 27. As shown in FIG. 27, in the state in which the holding members 32 and 34 which are set in the holdable state support the first substrate group W1 and the second substrate group W2, respectively, the substrate supporting member 22 of the lifter 15 becomes the transfer robot TR1. The lifter 15 is moved in such a manner that the holding member 32 is further above (step S310). Then, during the ascending process, the substrate (the first substrate group W1 and the second substrate group W2) is transferred to the substrate supporting member 22 of the elevator 15 (step S320).

In the processing of steps S310 to S320 described above, the elevator 15 is raised in the direction of the arrow Z1 from the state shown in Figs. 12 and 13, and as shown in Fig. 14, one of the lifters 15 is in contact with the substrate supporting member 22 in contact with the second substrate group. Lower end of W2. Further, the second substrate group W2 is delivered to the elevator 15 by being supported by the groove portions 52 of the pair of substrate supporting members 22. The elevator 15 is further raised, and as shown in FIGS. 15 and 17, the pair of substrate supporting members 22 are in contact with the lower end of the first substrate group W1, and the first substrate group W1 is supported by the groove portions 52 of the pair of substrate supporting members 22, whereby the first substrate group W1 is supported by the groove portion 52 of the pair of substrate supporting members 22 Hand over to the lift 15.

At this time, as viewed from above in the -Z direction, as shown in FIG. 17, the chuck grooves 112 and 122 of the faces 64 and 74 appear to be alternately arranged at a half pitch 96 at intervals of the center line. and In this case, each of the substrates of the first substrate group W1 and the second substrate group W2 have an arrangement relationship in which they are not overlapped when viewed from above. Further, the second substrate group W2 supported by the pair of substrate supporting members 22 passes between one of the pair of holding members 32 and the through grooves 114 (FIG. 9). In the groove portion 52 of the substrate supporting member 22, each of the substrates of the second substrate group W2 is inserted into the gap between the substrates of the first substrate group W1 piece by piece. Further, 50 substrates which are formed by arranging the respective substrates at equal intervals at a half pitch 96 in the horizontal direction in the vertical direction are formed, and pitch conversion is performed. As described above, the elevator 15 receives the first substrate group W1 and the two substrates at different heights above the chemical solution tank CB with respect to the relative movement of the first substrate group W1 and the second substrate group W2. The second substrate group W2.

After the processing of step S320 is completed, the lifter 15 does not interfere with the lower side of the first substrate group W1 and the second substrate group W2 as shown in Figs. 16 and 18 from the state shown in Figs. 15 and 17 . The outer edge then rises to the position where it can rotate. Then, the transport robots TR1 and TR2 rotate the holding members 32 and 34 to be in a passable state (step S330).

In the passable state, the first substrate group W1 and the second substrate group W2 are held between the pair of faces 62. When viewed from above, the faces 62 and 72 appear to overlap each other, and a gap 92 is provided between the faces 62 and 72 and the first substrate group W1 and the second substrate group W2 in the Y-axis direction. Further, the pitch-converted first substrate group W1 and the second substrate group W2 can be supported by the substrate supporting member 22, and pass between the pair of surfaces 62 and the pair of surfaces 72 below.

Next, the elevator 15 is moved inside the processing tank below the arrow Z2 as shown in FIG. 16 (step S340), and the first substrate group W1 and the second substrate group W2 are collectively transported into the chemical tank CB. In other words, the elevator 15 receives the first substrate group W1 and the second substrate group W2 by moving up and down with respect to the transfer robots TR1 and TR2 once, and transports them into the chemical solution tank CB. After the lift 15 is lowered, the transfer robots TR1 and TR2 are retracted from above the chemical solution tank CB (step S350), and the process of step S160 (FIG. 25) is completed.

23 and FIG. 24 are diagrams for explaining that the elevator 15 receives the substrate (the first substrate group W1 and the second base). A diagram of another example of the operation of the panel group W2). In the example shown in Fig. 23, not only the elevator 15 indicated by a broken line rises in the direction of the arrow Z1, but also the transport robots TR1 and TR2 descend, and the holding members 32 and 34 indicated by broken lines descend in the direction of the arrow Z2, respectively. The substrate group W1 and the second substrate group W2 are transferred to one of the substrate supporting members 22 of the elevator 15.

Therefore, the lifter 15 can receive the first substrate group W1 and the second substrate group W2 by a shorter movement stroke than when the holding members 32 and 34 are not lowered, and collectively transport them to the processing tank (the chemical tank CB). . In the example shown in FIG. 23 and FIG. 24, both of the transport robots TR1 and TR2 move downward, but the first substrate can be received by the elevator 15 by at least one of the transport robots TR1 and TR2 moving downward. The group W1 and the second substrate group W2.

In the example shown in FIG. 24, the transport robot TR2 that transports the lower side of the second substrate group W2 moves along the second path 202 (FIG. 1) before the transport robot TR1 that transports the upper side of the first substrate group W1. When the holding member 34 of the transfer robot TR2 reaches above the chemical solution tank CB, the lifter 15 starts to rise in the direction of the arrow Z1. When the lifter 15 ends the rise, the upper end portion 15c of the lifter 15 is located below the lower end 102 of the holding member 32 of the transport robot TR1 that is horizontally held by the first substrate group W1. By this positional relationship, the holding member 32 of the transfer robot TR1 can move the first substrate group W1 to the upper side of the elevator 15 without being disturbed by the elevator 15 in the direction of the arrow X3. When the elevator 15 and the first substrate group W1 and the second substrate group W2 are respectively arranged above the elevator 15 and then the elevator 15 is raised, the first substrate group W1 can be waited for in advance, so that the reception can be shortened. The time until the substrate group W1 and the second substrate group W2 are combined in batches. When the first substrate group W1 is held by the holding member 32 and transported to the upper side of the chemical solution tank CB, the lifter 15 restarts to receive the first substrate group W1 and the second substrate group W2, and collectively transports the liquid to the chemical solution tank CB.

Further, when the first substrate group W1 and the second substrate group W2 are collectively transported to the processing tank by the elevator 15, the usefulness of the present invention is not impaired even if the pitch is not converted from the normal pitch 98 to the half pitch 96. For example, the first substrate group W1 and the second substrate group W2 have a normal pitch of 98 or the like. The plurality of substrates arranged at intervals may be collectively transported to the processing tank by the elevator 15.

According to the substrate processing apparatus of the present embodiment configured as described above, the transport robots TR1 and TR2 transport the first substrate group W1 and the second substrate group W2 before the batch combination to the upper side of the processing tank. Then, the lifter 15 moves up and down with respect to the transport robots TR1 and TR2 above the processing tank, and receives each of the transported substrate groups. Then, the elevator 15 transports the transferred substrate clusters to the processing tank. Therefore, it is possible to reduce the load applied to the transport robot TR1 and the transport robot TR2 that transport the substrate to the upper side of the processing tank by the horizontal direction.

Further, according to the substrate processing apparatus of the present embodiment configured as described above, the transport robots TR1 and TR2 are the second substrate group W2 when the lower end of the first substrate group W1 is horizontally moved by the transport robot TR2 when the transport robot TR1 is traveling. The first substrate group W1 and the second substrate group W2 are transported in a manner such that the lower end is higher. Therefore, the movement paths of the respective holding members 32 and 34 can be set so as to overlap each other when viewed from above, so that the installation space of the substrate processing apparatus can be further reduced.

Further, according to the substrate processing apparatus of the present embodiment configured as described above, the transport robots TR1 and TR2 are respectively transported by the lower end of the first substrate group W1 so as to be lower than the upper end of the second substrate group W2. The substrate group W1 and the second substrate group W2. Therefore, the height of the substrate processing apparatus can be suppressed to be lower than when the lower end of the first substrate group W1 is transported higher than the upper end of the second substrate group W2.

Further, according to the substrate processing apparatus of the present embodiment configured as described above, the first passage 201 and the second passage 202 are provided between the processing grooves of the substrate processing apparatus when viewed from above. Therefore, when the first passage 201 and the second passage 202 are provided on one side of the treatment tank, the lengths of the holding member 32 and the holding member 34 can be shortened, so that the application of the holding member 32 and the holding member 34 can be further reduced. The moment.

Further, according to the substrate processing apparatus of the present embodiment configured as described above, the elevator 15 can receive the first vertical movement with respect to the transport robots TR1 and TR2. The substrate group W1 and the second substrate group W2 are transported to the processing tank. Therefore, the batch combination and collective transfer of the first substrate group W1 and the second substrate group W2 to the processing tank can be performed at a higher speed.

Further, according to the substrate processing apparatus of the present embodiment configured as described above, the elevator 15 is separately received at two positions different from each other above the processing tank by the relative movement of the transport robots TR1 and TR2. The first substrate group W1 and the second substrate group W2. Therefore, the first substrate group W1 and the second substrate group W2 can be held in an arrangement relationship in which pitch conversion is possible, and the distance between the batches can be easily changed. Moreover, the holding members of the respective transport robots TR1 and TR2 can be held without interfering with each other.

Further, according to the substrate processing apparatus of the present embodiment configured as described above, at least one of the transport robots TR1 and TR2 moves downward, and the elevator 15 can receive the first substrate group W1 and the second substrate group W2, respectively. Therefore, the movement stroke of the elevator 15 can be further shortened compared to the case where the transfer robot does not move downward.

Further, according to the substrate processing apparatus of the embodiment configured as described above, the substrate transfer robot CR1 sequentially performs the first transfer operation and the second transfer operation, and the first transfer operation is collectively taken out from the wafer transfer cassette F1. The substrate group W1 is transferred to the transfer robot TR1. The second transfer operation collectively takes out the second substrate group W2 from the wafer transfer cassette F2 and delivers it to the transfer robot TR2. Therefore, in the substrate take-out portion, the first substrate group W1 and the second substrate group W2 are temporarily combined in batches on the lift holding table of the pusher having the lift holding table, and then collectively transported to the transfer robots TR1 and TR2. The ratio can be reduced to the step of batch combination of the lifting and holding platform. Further, since the transport robot TR1 and the transport robot TR2 are placed on the first substrate group W1 and the second substrate group W2, respectively, they can be horizontally moved from the substrate take-out portion to the upper side of the processing tank. Therefore, if the lower transfer robot TR2 moves forward and moves above the processing tank, the elevator 15 does not need to wait until the transfer robot TR1 and the transfer robot TR2 are placed above the processing layer, and can rise in advance without disturbing the transport. The height of the holding member 32 of the robot TR2. Therefore, the time required for the batch combination above the processing tank can be further shortened.

Further, in the substrate processing apparatus 1, the first substrate group W1 and the second substrate group W2 which are arranged at equal intervals of the normal pitch 98 are alternately batch-wisely combined at a half pitch 96. However, for example, two transfer robots that move on one side of one of the processing tanks and one transport robot that moves on the other side can transport the substrate group of the normal pitch to the upper side of the processing tank, and The elevator 15 is relatively vertically moved, and the respective substrate groups are combined in batches at a 1/3 pitch. Further, the first substrate group W1 and the second substrate group W2 which are combined in batches can be used as a group of 25 sheets, but it is not necessary to use 25 sheets. For example, even when the number of substrates of less than 25 sheets is accommodated in the wafer transfer cassette F1 as the first substrate group W1, it can be used without any problem. In this case, although the portions of the substrate group which are combined in batches are not equally spaced, there is no problem in substrate transfer.

The present invention has been described in detail and described in detail. Therefore, the present invention can be appropriately modified or omitted within the scope of the invention. For example, in the above-described embodiment, the processed first substrate group W1 and the second substrate group W2 are transferred to the empty wafer transfer cassettes F3 and F4 of the wafer transfer cassette carry-out unit 8 and are taken out, but are not limited thereto. In addition, the processed first substrate group W1 and the second substrate group W2 may be placed in the wafer transfer cassettes F1 and F2, which are originally stored therein, and stored and taken out. Further, the type, number, and arrangement of the processing tanks are not limited. In the above embodiment, the substrate is transferred above the chemical solution tank CB, but it may be transferred at another position. Further, in the above embodiment, the lifters 15 and 18 are sandwiched at both ends supported from both sides of the processing tank, and the transport robots TR1 and TR2 are cantilever type supported only from one side, but may be reversed or all Cantilever type, or all of them are clamped at both ends.

1‧‧‧Substrate processing unit

2‧‧‧ Wafer transfer box loading department

3‧‧‧Substrate removal unit

5‧‧‧Substrate Processing Department

5a‧‧‧Drug treatment department

5b‧‧‧Washing Department

5c‧‧‧Multifunctional Processing Department

7‧‧‧Substrate storage unit

8‧‧‧ Wafer transfer box removal department

9a‧‧‧Substrate transfer transport mechanism

9b‧‧‧Substrate transfer transport mechanism

11‧‧‧Multi-function processing tank

15‧‧‧ Lift (3rd transport department)

15a‧‧‧ Lift head

15b‧‧‧ Lift head

16a‧‧‧1st substrate impregnation mechanism

16b‧‧‧1st substrate impregnation mechanism

18‧‧‧ Lifts

18a‧‧‧ Lift head

18b‧‧‧ Lift head

22‧‧‧Substrate support member

24‧‧‧Substrate support member

32‧‧‧Retaining components

34‧‧‧Retaining components

201‧‧‧1st pathway

202‧‧‧2nd pathway

BH1‧‧‧ robot

BH2‧‧‧ robot

CB‧‧‧ drug tank

CR1‧‧‧Substrate Transfer Robot

CR2‧‧‧Substrate Transfer Robot

F1‧‧‧ wafer transfer box

F2‧‧‧ wafer transfer box

F3‧‧‧ wafer transfer box

F4‧‧‧ wafer transfer box

TR1‧‧‧Transport robot (first transport unit)

TR2‧‧‧Transport robot (second transport unit)

W1‧‧‧1st substrate group

W2‧‧‧2nd substrate group

WB‧‧·washing tank

Claims (10)

A substrate processing apparatus includes: a processing tank that performs a specific process on a substrate to be housed; and a first conveying unit that is formed by arranging the substrates in a horizontal direction while being horizontally arranged The first substrate group is horizontally moved along the specific first path, and the first substrate group is transported from the substrate take-out portion to the upper side of the processing tank; and the second transport portion is held by the substrate. The second substrate group formed in the horizontal direction in the horizontal direction is horizontally arranged along the specific second path, and the second substrate group is transported from the substrate take-out portion to the upper side of the processing tank; and the third transport The first transport unit and the second transport unit receive the first one from the first transport unit and the second transport unit by moving up and down with respect to the first transport unit and the second transport unit over the processing tank. The substrate group and the second substrate group are collectively transferred to the processing tank. The substrate processing apparatus according to claim 1, wherein the first transport unit and the second transport unit are lower than the second end of the first substrate group when the first transport unit runs along the first path The transport unit transports the first substrate group and the second substrate group so as to be higher than the lower end of the second substrate group when the second path is horizontal. The substrate processing apparatus according to claim 2, wherein the first transport unit and the second transport unit are lower than the second end of the first substrate group when the first transport unit is traveling along the first path The transport unit transports the first substrate group and the second substrate group, respectively, so that the upper end of the second substrate group when the second path is horizontal. The substrate processing apparatus according to any one of claims 1 to 3, wherein the first passage and the second passage sandwich the processing tank between each other when viewed from above. The substrate processing apparatus according to any one of claims 1 to 3, wherein the third transport unit receives the first substrate group and the second substrate group by the above-described relative up-and-down movement. The substrate processing apparatus according to any one of claims 1 to 3, wherein the third transport unit receives the first substrate at two different heights above the processing tank by the above-described relative movement. The group and the second substrate group. The substrate processing apparatus according to any one of claims 1 to 3, wherein at least one of the first transport unit and the second transport unit moves downward, and the third transport unit receives the first The substrate group and the second substrate group. The substrate processing apparatus according to any one of claims 1 to 3, further comprising: a first housing portion that accommodates the first substrate group in a state of being aligned in a vertical direction; and a second housing portion that The second substrate group is accommodated in a state of being arranged in a vertical direction, and the substrate delivery portion sequentially performs a first transfer operation and a second transfer operation, wherein the first transfer operation collectively takes out the first substrate from the first storage portion The group collectively changes the posture of the first substrate group such that the first substrate group is arranged in the horizontal direction, and transfers the changed first substrate group to the first transport unit; the second transfer operation is The second storage unit collectively takes out the second substrate group, collectively changes the posture of the second substrate group such that the second substrate group is arranged in the horizontal direction, and transfers the changed second substrate group to the first 2 transport department. The substrate processing apparatus according to any one of claims 1 to 3, wherein the first transport unit and the second transport unit hold the first substrate group and the second substrate group in such a manner that at least the first The arrangement relationship between the first substrate group and the second substrate group when the substrate group and the second substrate group are respectively transferred to the third transfer unit is the respective substrates of the first substrate group and the second substrate group The arrangement relationship in which the substrates do not overlap when viewed from above. The substrate processing apparatus according to any one of claims 1 to 3, wherein the first conveying unit includes a pair of first holding members, and the pair of first holding members can be driven to drive the pair of first holding members. The first substrate group and the second substrate group are maintained in a state in which only the first substrate group can be held, and the first substrate group and the second substrate group can pass through the pair of first holding members. The second transfer unit includes a pair of second holding members, and the pair of second holding members can be selectively driven to hold the first substrate group and the first substrate group The state of only the second substrate group in the second substrate group and the state in which the first substrate group and the second substrate group pass between the pair of second holding members.