JPH11268827A - Substrate processing device - Google Patents

Substrate processing device

Info

Publication number
JPH11268827A
JPH11268827A JP7219398A JP7219398A JPH11268827A JP H11268827 A JPH11268827 A JP H11268827A JP 7219398 A JP7219398 A JP 7219398A JP 7219398 A JP7219398 A JP 7219398A JP H11268827 A JPH11268827 A JP H11268827A
Authority
JP
Japan
Prior art keywords
substrate
holding
substrates
transfer
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7219398A
Other languages
Japanese (ja)
Inventor
Koji Hasegawa
公二 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP7219398A priority Critical patent/JPH11268827A/en
Publication of JPH11268827A publication Critical patent/JPH11268827A/en
Pending legal-status Critical Current

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Landscapes

  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To perform more stable delivering in a substrate conveying system as well as to perform more smooth and accurate adjustment. SOLUTION: Since a lifter device 31 and a conveying mechanism 9 are arranged on the same side, taking-out of a substrate 2 on respective substrate holding parts of the lifter device 31 and the conveying mechanism 9 can be adjusted from the same side by one operator, and maintenance work can be more smoothly and reliably performed. Moreover, since holding arms 32 or a pair of holding plates 29 as base plate holding parts have forward projecting cantilever structures, they are inclined downward by the gaps of their movable root parts or by the length in which they are made flex by holding many heavy substrates 2. However, the relative inclination of the holding arms 32 of the lifter device 31 and a pair of holding plates 28 of the conveying mechanism 9 are not added and drastically canceled in delivering of a plurality of substrates 21.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば薬液また
は、純水などのリンス液(薬液およびリンス液を総称し
て処理液という)を貯留する処理槽に、半導体ウエハや
液晶表示パネル用ガラス基板などの薄板状の基板を浸漬
させて基板に所定の処理を行う基板処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer or a glass substrate for a liquid crystal display panel in a processing tank for storing a rinsing liquid such as a chemical liquid or pure water (a chemical liquid and a rinsing liquid are collectively referred to as a processing liquid). The present invention relates to a substrate processing apparatus that performs a predetermined process on a substrate by immersing a thin substrate such as the substrate.

【0002】[0002]

【従来の技術】従来、半導体ウエハや液晶表示パネル用
ガラス基板などを用いた精密電子基板の製造プロセスに
おいては、基板を処理液に浸漬して種々の表面処理を施
している。このような表面処理においては、エッチング
液などの薬液を貯留した薬液槽とリンス液である純水を
貯留した水洗槽とを有し、薬液槽さらに水洗槽に順次基
板を浸漬して、薬液槽にて基板に薬液処理を施した後
に、さらに、水洗槽にて基板に付着した薬液やパーティ
クルを洗い流すリンス処理を施している。
2. Description of the Related Art Conventionally, in a manufacturing process of a precision electronic substrate using a semiconductor wafer, a glass substrate for a liquid crystal display panel, or the like, various surface treatments are performed by immersing the substrate in a processing liquid. Such a surface treatment has a chemical solution tank storing a chemical solution such as an etching solution, and a washing tank storing pure water as a rinsing solution, and immerses the substrate sequentially in the chemical solution tank and further in the water washing tank. After the substrate is subjected to the chemical treatment, the substrate is further subjected to a rinsing treatment to wash away the chemical and particles adhered to the substrate in a washing tank.

【0003】図6は、従来の基板処理装置における要部
の概略構成を示す模式図である。
FIG. 6 is a schematic diagram showing a schematic configuration of a main part in a conventional substrate processing apparatus.

【0004】図6において、基板処理装置51は、複数
の基板を一括して処理する装置であって、カセットに所
定枚数がセットされた基板を装置外部との間で受渡しを
する搬出入部(図示せず)と、この搬出入部(図示せ
ず)から基板を受け取って搬送すると共に搬出入部(図
示せず)に基板を受渡す搬送部52と、この搬送部52
から基板を受け取って基板に所定の処理を施すと共に、
その処理後の基板を搬送部52に受け渡す各処理ユニッ
ト53とを有している。
[0006] In FIG. 6, a substrate processing apparatus 51 is an apparatus for processing a plurality of substrates at a time, and carries out a loading / unloading section (see FIG. 6) for transferring a predetermined number of substrates set in a cassette to / from the outside of the apparatus. Not-shown), a transport section 52 that receives and transports the substrate from the loading / unloading section (not shown), and transfers the substrate to a loading / unloading section (not shown).
While receiving the substrate from and performing predetermined processing on the substrate,
Each processing unit 53 transfers the processed substrate to the transport unit 52.

【0005】この搬送部52は、上下の各搬送路にそれ
ぞれ配設され各処理ユニット53の配設方向(X方向)
にそれぞれ移動する2つの搬送ロボット52a,52b
を備えている。から構成されており、これらの搬送ロボ
ット52a,52bはそれぞれ、各処理ユニット53の
配設方向(X方向)と図6の紙面に直交する方向(図7
のY方向)に伸びる軸部材54a(図7)を介して取り
付けられた保持板54をそれぞれ一対有し、これらの一
対の保持板54の内側の保持用溝(図示せず)で、起立
姿勢の複数の基板55がY方向に並べられた状態でそれ
らの両側端面を両側からそれぞれ挾み込んで各保持用溝
で受けて保持するようになっている。
[0005] The transport section 52 is disposed on each of the upper and lower transport paths, and the direction in which the processing units 53 are disposed (X direction).
Transfer robots 52a and 52b respectively moving to
It has. Each of these transfer robots 52a and 52b has a direction perpendicular to the plane of FIG.
Each of the holding plates 54 is attached via a shaft member 54a (FIG. 7) extending in the Y direction (see FIG. 7), and the holding grooves (not shown) inside the pair of holding plates 54 stand upright. In a state where the plurality of substrates 55 are arranged in the Y direction, both side end surfaces thereof are sandwiched from both sides, and are received and held by the respective holding grooves.

【0006】また、各処理ユニット53は、エッチィン
グ液などの薬液を貯留した薬液槽56と、この薬液槽5
6による処理済みの基板55に付いた薬液やパーティク
ルなどを水洗する水洗槽57と、薬液を貯留した薬液槽
58と、この薬液槽58による処理済みの基板55に付
いた薬液やパーティクルなどを水洗する水洗槽59と、
この水洗槽59で水洗処理された基板55を乾燥する乾
燥槽60とを有している。これらの薬液槽56、水洗槽
57、薬液槽58さらに水洗槽59にわたって複数の基
板55を一括して順次浸漬させることにより基板55に
薬液処理や水洗処理などの一連の各種処理が施され、さ
らにその処理後の基板55を乾燥させるようになってい
る。
Each processing unit 53 includes a chemical solution tank 56 storing a chemical solution such as an etching solution, and a chemical solution tank 5.
6, a washing tank 57 for washing the chemical solution or particles attached to the substrate 55, a chemical solution tank 58 storing the chemical solution, and a chemical solution or particles attached to the substrate 55 treated by the chemical solution tank 58 for washing. Washing tank 59
A drying tank 60 is provided for drying the substrate 55 that has been subjected to the water washing processing in the washing tank 59. A series of various processes such as a chemical solution treatment and a water washing process are performed on the substrate 55 by immersing a plurality of substrates 55 collectively and sequentially in the chemical solution tank 56, the washing tank 57, the chemical solution tank 58, and the washing tank 59. The substrate 55 after the processing is dried.

【0007】さらに、これらの薬液槽56,58および
水洗槽57,59の各処理槽にはそれぞれリフタ装置6
1が配設されており、各リフタ装置61はそれぞれ複数
の基板55を載置可能であると共に処理槽内と基板受渡
位置の間で上下移動自在に構成されている。また、これ
らの薬液槽56,58および水洗槽57,59の各処理
槽にはそれぞれ外郭部材62がそれぞれ配設されてお
り、これらの外郭部材62と乾燥槽60の上面部にはそ
れぞれ、各処理槽の上部開放口に対向するように基板導
入口を開閉自在な開閉扉63が配設されている。これら
の開閉扉63はそれぞれ通常は閉じており、リフタ装置
61の処理槽内への下降に連動して両側に開くように構
成されていると共に、処理槽内からの上昇に連動して両
側に開くように構成されている。
Further, each of the processing tanks of the chemical tanks 56 and 58 and the washing tanks 57 and 59 has a lifter device 6 respectively.
1, each of the lifter devices 61 is capable of mounting a plurality of substrates 55, and is configured to be vertically movable between the inside of the processing tank and the substrate delivery position. An outer member 62 is provided in each of the processing tanks of the chemical solution tanks 56 and 58 and the washing tanks 57 and 59, and upper surfaces of the outer member 62 and the drying tank 60 are respectively provided. An opening / closing door 63 capable of opening and closing the substrate introduction port is provided so as to face the upper opening port of the processing tank. Each of these opening / closing doors 63 is normally closed, and is configured to open on both sides in conjunction with the lowering of the lifter device 61 into the processing tank. It is configured to open.

【0008】これらの各外郭部材62の適所にはそれぞ
れ排気ダクト64が開口しており、その排気ダクト64
は流量調整バルブ65を介して排気ポンプ66に連通さ
れている。これによる外郭部材62内の排気によって、
外郭部材62の基板導入口の開閉扉63が開いても、こ
の基板導入口から外部空気が流入することで、この基板
導入口を介して薬液槽56,58からのヒューム(酸や
アルカリなどが混ざった雰囲気)の外部への拡散を防止
するようになっている。
An exhaust duct 64 is opened at an appropriate position of each of the outer shell members 62.
Is connected to an exhaust pump 66 via a flow control valve 65. Due to the exhaust in the outer member 62 due to this,
Even if the opening / closing door 63 of the substrate introduction port of the outer member 62 is opened, the external air flows in from the substrate introduction port, so that fumes (acids, alkalis, and the like) from the chemical solution tanks 56 and 58 pass through the substrate introduction port. (Mixed atmosphere) is prevented from diffusing to the outside.

【0009】さらに、図7に示すように、リフタ装置6
1と例えば搬送ロボット52bとは、並んで配設(図7
の紙面に垂直な図6のX方向)された複数の処理槽をそ
れらの幅方向に両側から挾んで対向した状態で配設され
ている。また同様に、リフタ装置61と例えば搬送ロボ
ット52aについても、並んで配設(図7の紙面に垂直
な図6のX方向)された複数の処理槽をそれらの幅方向
に両側から挾んで対向した状態で配設されている。
[0009] Further, as shown in FIG.
1 and, for example, the transfer robot 52b are arranged side by side (FIG. 7).
A plurality of processing tanks arranged perpendicularly to the plane of FIG. 6 (X direction in FIG. 6) are disposed so as to face each other with both processing tanks being sandwiched from both sides in the width direction thereof. Similarly, the lifter device 61 and, for example, the transfer robot 52a are opposed to each other by sandwiching a plurality of processing tanks arranged side by side (in the X direction in FIG. 6 perpendicular to the plane of FIG. 7) from both sides in the width direction thereof. It is arranged in the state where it did.

【0010】上記構成により、まず、搬送ロボット52
bは、搬出入部(図示せず)から基板を受け取って各処
理ユニット53の薬液槽56の上方の基板受渡位置まで
その配設方向(X方向)に沿って搬送する。このとき、
図7に示すように、搬送ロボット52bの一対の保持板
54は、それらの内側の複数の保持用溝で、起立姿勢の
複数の基板55の両側端面を両側からそれぞれ挾み込ん
で受けて保持している。これに対して、薬液槽56のリ
フタ装置61が上昇してきて、その下方部に設けられた
3つの保持アーム61a上側の複数の各保持溝で、搬送
ロボット52bに保持されている複数の基板を下方から
受ける。その後、搬送ロボット52bの一対の保持板5
4をそれぞれ実線で示すような垂直方向になるように回
動させて、搬送ロボット52bの複数の基板55への保
持を解除し、リフタ装置61への複数の基板55の受渡
しを完了する。
With the above configuration, first, the transfer robot 52
b receives a substrate from a carry-in / out section (not shown) and conveys the substrate to the substrate delivery position above the chemical solution tank 56 of each processing unit 53 along the disposition direction (X direction). At this time,
As shown in FIG. 7, the pair of holding plates 54 of the transfer robot 52b hold and hold the two side end surfaces of the plurality of substrates 55 in the upright posture from both sides by a plurality of holding grooves inside them. doing. On the other hand, the lifter device 61 of the chemical solution tank 56 rises, and the plurality of substrates held by the transfer robot 52b are held by the plurality of holding grooves provided above the three holding arms 61a provided below. Receive from below. Thereafter, the pair of holding plates 5 of the transfer robot 52b
By rotating the transfer robots 4 in the vertical direction as indicated by solid lines, the holding of the transfer robot 52b on the plurality of substrates 55 is released, and the transfer of the plurality of substrates 55 to the lifter device 61 is completed.

【0011】次に、リフタ装置61は複数の基板を3つ
の保持アーム61a上側の複数の各保持溝で保持した状
態で薬液槽56内に向けて下降する。この下降に連動し
て外郭部材62の開閉扉63が仮想線のように両側に起
立して開き、薬液槽56の上部開放口から複数の基板5
5を保持した保持アーム61aを薬液中に浸漬させて所
定時間放置することで複数の基板55に所定の薬液処理
を施す。このとき、開閉扉63は閉じられており、この
薬液槽56は外郭部材62で略密閉されている。また、
外郭部材62内は排気ポンプ66によって排気ダクト6
4を介して排気されている。
Next, the lifter device 61 descends into the chemical solution tank 56 with the plurality of substrates held by the plurality of holding grooves above the three holding arms 61a. In conjunction with this downward movement, the open / close door 63 of the outer member 62 rises and opens on both sides as shown by phantom lines, and a plurality of substrates 5 are opened from the upper opening of the chemical solution tank 56.
The plurality of substrates 55 are subjected to a predetermined chemical treatment by immersing the holding arm 61a holding 5 in the chemical solution and leaving it to stand for a predetermined time. At this time, the opening and closing door 63 is closed, and the chemical solution tank 56 is substantially sealed by the outer shell member 62. Also,
The inside of the outer shell member 62 is exhausted by the exhaust
4 is exhausted.

【0012】さらに、リフタ装置61は、所定時間後、
薬液処理後の複数の基板55を上昇させ、それに連動す
るように開閉扉63が仮想線のように両側に起立して開
き、薬液槽56の上部開放口から複数の基板55を保持
した保持アーム61aを薬液槽56の上方の基板受渡位
置まで上昇させる。その基板受渡位置では、搬送ロボッ
ト52bが一対の保持板54をそれぞれ垂直方向にした
状態で待機しており、複数の基板55を保持した保持ア
ーム61aを基板受渡位置に到着させた後に、一対の保
持板54の下部側をそれぞれ内側に回動させて、複数の
基板55の両側端面を両側からそれぞれ挾み込んで一対
の保持板54の各保持用溝で受けて保持する。
Further, after a predetermined time, the lifter device 61
The plurality of substrates 55 after the chemical processing are lifted, and the opening / closing door 63 is raised and opened on both sides as shown by phantom lines in conjunction therewith, and a holding arm holding the plurality of substrates 55 from the upper opening of the chemical solution tank 56. 61 a is raised to the substrate delivery position above the chemical solution tank 56. At the substrate transfer position, the transfer robot 52b is on standby with the pair of holding plates 54 arranged vertically, and after the holding arm 61a holding the plurality of substrates 55 arrives at the substrate transfer position, the pair of paired holding plates 54 By rotating the lower sides of the holding plates 54 inward, the both end surfaces of the plurality of substrates 55 are sandwiched from both sides, respectively, and received and held by the holding grooves of the pair of holding plates 54.

【0013】さらに、リフタ装置61を保持アーム61
aと共に下方に退避させて一対の保持板54に基板55
を移し代えた後に、搬送ロボット52bは複数の基板5
5を、薬液槽56の隣に位置している水洗槽57の上方
の基板受渡位置までその配設方向(X方向)に沿って搬
送する。このとき、搬送ロボット52bの一対の保持板
54はそれぞれ、それらの内側の複数の保持用溝で、起
立姿勢の複数の基板55の両側端面を両側からそれぞれ
挾み込んで受けて保持している。これに対して、水洗槽
57のリフタ装置61が上昇してきて、その下方部に設
けられた3つの保持アーム61aの上側の複数の各保持
溝で、搬送ロボット52bに保持されている複数の基板
55を下方から受ける。その後、搬送ロボット52bの
一対の保持板54をその長手方向が垂直方向になるよう
にそれぞれ回動させて、搬送ロボット52bの複数の基
板55への保持を解除し、水洗槽57のリフタ装置61
への複数の基板55の受渡しが完了する。
Further, the lifter device 61 is connected to the holding arm 61.
a, and the substrate 55 is
After the transfer, the transfer robot 52b moves the plurality of substrates 5
5 is conveyed along the disposition direction (X direction) to the substrate delivery position above the washing tank 57 located next to the chemical tank 56. At this time, the pair of holding plates 54 of the transfer robot 52b respectively hold and hold the both side end surfaces of the plurality of substrates 55 in the upright posture from both sides by the plurality of holding grooves inside them. . On the other hand, the lifter device 61 of the washing tank 57 is raised, and the plurality of substrates held by the transfer robot 52b are held by the plurality of holding grooves on the upper side of the three holding arms 61a provided below. 55 is received from below. Thereafter, the pair of holding plates 54 of the transfer robot 52b are rotated so that their longitudinal directions are vertical, and the holding of the transfer robot 52b on the plurality of substrates 55 is released, and the lifter device 61 of the washing tank 57 is released.
The delivery of the plurality of substrates 55 to is completed.

【0014】さらに、水洗槽57のリフタ装置61は複
数の基板55を3つの保持アーム61a上側の複数の各
保持溝で保持した状態で水洗槽57内に向けて下降す
る。これと同時に、基板55の受渡し後の空状態の搬送
ロボット52bは、搬出入部(図示せず)との基板受渡
位置までその配設方向(X方向)に沿って移動し、その
搬出入部から複数の基板55の受渡しに備える。
Further, the lifter device 61 of the washing tank 57 descends toward the inside of the washing tank 57 while holding the plurality of substrates 55 in the plurality of holding grooves above the three holding arms 61a. At the same time, the transfer robot 52b in an empty state after the transfer of the substrate 55 moves along the disposing direction (X direction) to the substrate transfer position with respect to the carry-in / out portion (not shown), and a plurality of transfer robots 52b move from the carry-in / out portion. In preparation for delivery of the substrate 55.

【0015】このリフタ装置61の下降に連動して外郭
部材62の開閉扉63が開き、水洗槽57の上部開放口
から複数の基板55を保持した保持アーム61aをその
純水中に浸漬させて複数の基板55を水洗処理する。こ
の水洗処理時には、その開閉扉63は閉じられており、
この水洗槽57の外郭部材62内が密閉されている。
The opening and closing door 63 of the outer member 62 is opened in conjunction with the lowering of the lifter device 61, and the holding arm 61a holding the plurality of substrates 55 is immersed in the pure water from the upper opening of the washing tank 57. The plurality of substrates 55 are subjected to a water washing process. At the time of this water washing process, the opening and closing door 63 is closed,
The inside of the outer member 62 of the washing tank 57 is sealed.

【0016】さらに、リフタ装置61は、所定時間後、
水洗処理後の複数の基板55を上昇させ、それに連動す
るように開閉扉63が開き、水洗槽57の上部開放口か
ら複数の基板55を保持した保持アーム61aを水洗槽
57の上方の搬送ロボット52a用の上側の基板受渡位
置まで上昇させる。その基板受渡位置では、搬送ロボッ
ト52aが一対の保持板54の長手方向を垂直方向にし
た状態で待機しており、複数の基板55を保持した保持
アーム61aをその基板受渡位置に到着させた後に、一
対の保持板54の下部側をそれぞれ内側に回動させて、
複数の基板55の両側端面を両側からそれぞれ挾み込ん
で各保持用溝で受けて保持することで、複数の基板55
の受渡しを行う。
Further, after a predetermined time, the lifter device 61
The plurality of substrates 55 after the rinsing process are lifted, and the opening / closing door 63 is opened so as to be interlocked therewith, and the holding robot 61a holding the plurality of substrates 55 from the upper opening of the rinsing tank 57 is transferred to the transfer robot above the rinsing tank 57. It is raised to the upper substrate transfer position for 52a. At the board transfer position, the transfer robot 52a is on standby with the longitudinal direction of the pair of holding plates 54 set to the vertical direction, and after the holding arm 61a holding the plurality of boards 55 arrives at the board transfer position. By rotating the lower sides of the pair of holding plates 54 inward, respectively,
By holding both side end surfaces of the plurality of substrates 55 from both sides and receiving and holding the holding grooves in the respective holding grooves, the plurality of substrates 55 are held.
Delivery.

【0017】その後、搬送ロボット52aは、乾燥槽6
0へ複数の基板55を搬送して乾燥槽60で複数の基板
55に乾燥処理を施す。また、搬送ロボット52bは、
各処理槽のリフタ装置61との複数の基板55の受渡し
を行いつつ、以上と同様の動作を繰り返して薬液槽56
さらに水洗槽57による一連の処理を行うように複数の
基板55を搬送する。
Thereafter, the transfer robot 52a moves the drying tank 6
The plurality of substrates 55 are conveyed to zero and the drying process is performed on the plurality of substrates 55 in the drying tank 60. In addition, the transfer robot 52b
While transferring the plurality of substrates 55 to and from the lifter device 61 of each processing tank, the same operation as described above is repeated to repeat the chemical liquid tank 56.
Further, the plurality of substrates 55 are transported so as to perform a series of processing by the washing tank 57.

【0018】さらに、乾燥処理後の複数の基板55を乾
燥槽60のリフタ装置61から受け取った搬送ロボット
52aは、搬出入部(図示せず)との基板受渡位置まで
その配設方向(X方向)に沿って複数の処理済みの複数
の基板55を搬送して、搬出入部に複数の処理済みの複
数の基板55を受け渡す。
Further, the transfer robot 52a, which has received the plurality of substrates 55 after the drying process from the lifter device 61 of the drying tank 60, moves the substrate 55 to a substrate transfer position with respect to a carry-in / out section (not shown) (X direction). A plurality of processed substrates 55 are conveyed along and the plurality of processed substrates 55 are delivered to the loading / unloading section.

【0019】[0019]

【発明が解決しようとする課題】ところが、上記従来の
構成では、図7に示すように、リフタ装置61と例えば
搬送ロボット52bとは、並んで配設された各処理ユニ
ット53をそれらの幅方向に両側から挾んで対向した状
態で配設されている。このように、これらのリフタ装置
61と搬送ロボット52a,52bとはそれぞれ基板保
持部分(保持板54や保持アーム61a)が前方(搬送
方向に直交する図7のY方向)に突き出た片持ち構造を
しているために、それらの可動根本部分のギャップ分
や、多数の重い基板55を保持して撓む分だけ、図8に
示すように、それらの各基板保持部分である保持板54
や保持アーム61aが互いに対向した状態で下方に傾く
ことになる。これらの保持板54や保持アーム61aの
各基板保持部分の下方への傾きをθ1,θ2とすると、
例えば搬送ロボット52bの一対の保持板54の各保持
溝からリフタ装置61の3つの保持アーム61a上側の
複数の各保持溝への複数の基板55の受渡し時には、保
持板54と保持アーム61aの相対的な傾きがθ1+θ
2と加算されて(重なって)大きくなり、複数の基板の
受渡し時に、受け渡される基板保持溝の配列ピッチと、
保持された基板ピッチとが合わなくなって、複数の基板
55が基板保持溝に確実に保持されないままで搬送され
て、複数の基板55が保持板54や保持アーム61aか
ら落ちたりして損傷する虞があり、不安定な基板受渡し
になるという問題を有していた。
However, in the above-mentioned conventional configuration, as shown in FIG. 7, the lifter device 61 and, for example, the transfer robot 52b move the processing units 53 arranged side by side in their width direction. It is arranged in a state where it is sandwiched from both sides and faces each other. As described above, the lifter device 61 and the transfer robots 52a and 52b each have a cantilever structure in which the substrate holding portions (holding plate 54 and holding arm 61a) protrude forward (Y direction in FIG. 7 orthogonal to the transfer direction). As shown in FIG. 8, the holding plate 54, which is a substrate holding portion of each of the movable base portions, is bent by holding a large number of heavy substrates 55.
And the holding arms 61a are inclined downward in a state where they face each other. Assuming that the downward inclination of each of the substrate holding portions of the holding plate 54 and the holding arm 61a is θ1, θ2,
For example, when the plurality of substrates 55 are transferred from the holding grooves of the pair of holding plates 54 of the transfer robot 52b to the plurality of holding grooves above the three holding arms 61a of the lifter device 61, the relative positions of the holding plate 54 and the holding arms 61a are changed. Inclination is θ1 + θ
When the number of the substrate holding grooves to be transferred is increased when the plurality of substrates are transferred,
The held substrate pitch may not match, and the plurality of substrates 55 may be transported without being securely held in the substrate holding groove, and may be damaged by dropping from the holding plate 54 or the holding arm 61a. However, there is a problem that the delivery of the substrate becomes unstable.

【0020】また、リフタ装置61と搬送ロボット52
a,52bとは、並んで配設された複数の処理槽をそれ
らの幅方向に両側から挾んで対向した状態で配設されて
いるため、リフタ装置61と搬送ロボット52a,52
bの各基板保持部分の基板55の取り合いを調整するメ
ンテナンス作業時などに、二人の作業者が装置の両側か
ら声を掛け合って意志の疎通を図りつつ複数の基板55
の取り合いを調整しなければならず、このことが、より
スムーズで的確なる調整を妨げていた。
A lifter device 61 and a transfer robot 52
The lifters 61a and 52b are arranged in such a manner that a plurality of processing tanks arranged side by side are opposed to each other while sandwiching them from both sides in the width direction.
For example, at the time of a maintenance operation for adjusting the arrangement of the substrates 55 in the respective substrate holding portions b, a plurality of substrates 55 are communicated with each other from both sides of the apparatus while communicating with each other.
This had to be adjusted, which hindered a smoother and more accurate adjustment.

【0021】本発明は、上記従来の問題を解決するもの
で、よりスムーズで的確なる調整を行うと共に、基板搬
送系においてより安定な基板受渡しを行うことができる
基板処理装置を提供することを目的とする。
An object of the present invention is to solve the above-mentioned conventional problems and to provide a substrate processing apparatus capable of performing smoother and more accurate adjustment and performing more stable substrate delivery in a substrate transport system. And

【0022】[0022]

【課題を解決するための手段】請求項1に記載の基板処
理装置は、基板に所定の処理を行う基板処理装置におい
て、所定方向に配列され、かつ各々に基板を浸漬させる
ための処理液が貯溜された複数の処理槽と、前記複数の
処理槽に沿って基板を搬送させる第1搬送手段と、上下
移動可能であって、前記第1搬送手段と前記処理槽内と
の間で基板を搬送させる第2搬送手段とを備え、前記第
1搬送手段および前記第2搬送手段は、各々前記複数の
処理槽に対して同一側に配設されたことを特徴とするも
のである。
According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined processing on a substrate, wherein the processing liquid is arranged in a predetermined direction, and a processing liquid for immersing the substrate in each of the processing liquids. A plurality of stored processing tanks, a first transfer unit that transfers the substrate along the plurality of processing tanks, and a vertically movable unit that moves the substrate between the first transfer unit and the processing tank. And a second transporting means for transporting, wherein the first transporting means and the second transporting means are respectively arranged on the same side with respect to the plurality of processing tanks.

【0023】この構成によれば、第1搬送手段および第
2搬送手段は、各々複数の処理槽に対して同一側に配設
されているので、基板保持部分が前方に突き出た片持ち
の構造になり、第1搬送手段および第2搬送手段の各基
板保持部分の互いの相対的な傾きが従来のように加算さ
れず大幅に相殺される。
According to this configuration, since the first transfer means and the second transfer means are respectively disposed on the same side with respect to the plurality of processing tanks, a cantilever structure in which the substrate holding portion protrudes forward. Therefore, the relative inclinations of the respective substrate holding portions of the first transport means and the second transport means are not added as in the related art, and are largely offset.

【0024】また、請求項2に記載の基板処理装置は、
請求項1に記載の基板処理装置において、前記第1搬送
手段は、基板を保持するための一対の保持部を備え、前
記第2搬送手段は、前記第1搬送手段と第2搬送手段と
の間で基板の受け渡しを行う際に、前記一対の保持部の
間で上下移動可能であって、基板を保持するための可動
保持部を備えたことを特徴とするものである。
Further, the substrate processing apparatus according to claim 2 is
2. The substrate processing apparatus according to claim 1, wherein the first transfer unit includes a pair of holding units for holding the substrate, and wherein the second transfer unit includes a pair of the first transfer unit and the second transfer unit. 3. When a substrate is transferred between the pair of holding units, a movable holding unit that can move up and down between the pair of holding units and holds the substrate is provided.

【0025】この構成によれば、第1搬送手段と第2搬
送手段との間で基板の受け渡しを行う際に、第1搬送手
段の一対の保持部の間で第2搬送手段の可動保持部が上
下移動するので、基板の受け渡しがスムーズに行える。
According to this configuration, when the substrate is transferred between the first transport means and the second transport means, the movable holding part of the second transport means is moved between the pair of holding parts of the first transport means. Moves up and down, so that the substrate can be smoothly transferred.

【0026】[0026]

【発明の実施の形態】以下、本発明に係る基板処理装置
の実施形態について図面を参照して説明するが、本発明
は以下に示す実施形態に限定されるものではない。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the substrate processing apparatus according to the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.

【0027】図1は本発明の一実施形態の基板処理装置
の概略要部構成を示す斜視図であり、図2は図1の基板
処理装置のAA断面部分を背面から見た概略要部構成図
である。
FIG. 1 is a perspective view showing a schematic configuration of a main part of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic configuration of a main part of the substrate processing apparatus of FIG. FIG.

【0028】図1において、基板処理装置1は、ウエハ
などの複数の基板2を一括して処理する装置であって、
カセット3に所定枚数がセットされた基板2を装置外部
との間で受渡しをする搬出入部4と、この搬出入部4か
ら処理前の基板2を受け取って搬送し、基板2に所定の
処理を施すと共に、処理済みの基板2を搬送して搬出入
部4に受渡す基板処理ユニット5とを有している。
In FIG. 1, a substrate processing apparatus 1 is an apparatus that collectively processes a plurality of substrates 2 such as wafers.
A loading / unloading unit 4 for transferring a predetermined number of substrates 2 set in the cassette 3 to / from the outside of the apparatus, receiving and transporting the unprocessed substrates 2 from the loading / unloading unit 4, and performing predetermined processing on the substrates 2 And a substrate processing unit 5 for transporting the processed substrate 2 and transferring it to the carry-in / out unit 4.

【0029】この搬出入部4は、搬入された(または搬
出直前の)複数の基板2をカセット3にセットした状態
で一時的に並べて載置しておくカセット載置台6と、カ
セット3の両上端つば部分3aを下方からそれぞれ受け
て保持する片持ち状に2本突き出たカセット保持アーム
7が、このカセット載置台6のカセット並び方向に移動
自在であると共に、カセット保持アーム7でカセット3
を取り込んで保持したりカセット3を載置したりするた
めに上下方向に昇降自在で、かつその上下方向に平行な
軸(カセット保持アーム7の取付部材を支持する支持
軸)を中心に回動自在に構成されている移載ロボット8
と、この移載ロボット8によってカセット載置台6から
載置されたカセット3内の複数の基板2だけを突き上げ
て搬送機構9に受け渡す突上部10と、移載ロボット8
によって突上部10から載置された空のカセット3を洗
浄するカセット洗浄部11とを有している。この移載ロ
ボット8は、カセット載置台6から突上部10の所定位
置にカセット3を搬送して載置し、突上部10でカセッ
ト3から複数の基板2だけを突き上げて搬送機構9に受
け渡した後の空のカセット3をカセット洗浄部11に移
送すると共に、カセット洗浄部11で洗浄処理された空
のカセット3を、処理済みの複数の基板2が搬送機構9
から突上部10に受け渡されてカセット3内に回収され
るべく、再び突上部10の位置決めされた所定位置に移
送して待機させるようになっている。
The loading / unloading section 4 includes a cassette loading table 6 for temporarily placing a plurality of loaded substrates 2 (or immediately before being loaded) in a state where the substrates 2 are set in the cassette 3, and both upper ends of the cassette 3. Two cantilevered cassette holding arms 7 projecting in a cantilever shape for receiving and holding the flange portions 3a from below, respectively, are movable in the cassette arrangement direction of the cassette mounting table 6, and the cassette holding arms 7
To take up and hold the cassette 3 or to place the cassette 3, and can be moved up and down in a vertical direction, and rotated around an axis parallel to the vertical direction (a support shaft that supports the mounting member of the cassette holding arm 7). Transfer robot 8 freely configured
A projecting portion 10 which pushes up only a plurality of substrates 2 in the cassette 3 placed from the cassette placing table 6 by the transfer robot 8 and transfers it to the transport mechanism 9;
And a cassette cleaning unit 11 for cleaning an empty cassette 3 placed from the protruding portion 10 by the cassette cleaning unit 11. The transfer robot 8 transports and places the cassette 3 from the cassette mounting table 6 to a predetermined position of the protrusion 10, and pushes up only the plurality of substrates 2 from the cassette 3 at the protrusion 10 and transfers it to the transfer mechanism 9. The subsequent empty cassette 3 is transferred to the cassette cleaning unit 11, and the plurality of processed substrates 2 is transferred to the empty cassette 3 cleaned by the cassette cleaning unit 11 by the transport mechanism 9.
Is transferred to a predetermined position where the protruding portion 10 is positioned again and waited for being transferred to the protruding portion 10 and collected in the cassette 3.

【0030】また、基板処理ユニット5には、図2に示
すように、複数の処理槽12〜15をそれぞれ覆う各槽
外郭部材16内(処理部内)の複数の基板処理エリア1
7と、これらの複数の基板処理エリア17の上方に設け
られ各基板処理エリア17間を搬送する第2搬送路を有
する2つの第2基板搬送エリア18,19と、これらの
第2基板搬送エリア18,19に対してそれぞれ基板2
を搬送する第1搬送路を有する第1基板搬送エリア20
と、これらの第2基板搬送エリア18,19と第1基板
搬送エリア20の間をそれぞれ仕切って分離する各分離
部材(雰囲気遮断部材)としての各搬送エリア外郭部材
21とが配設されている。この搬送エリア外郭部材21
の、一の処理槽(本実施形態では水洗槽)の上部開放口
に対応(対向)した上方位置には、第2基板搬送エリア
18と第1基板搬送エリア20との間および、第2基板
搬送エリア19と第1基板搬送エリア20との間を複数
の基板2が搬送可能な各開口22がそれぞれ設けられて
いる。また、各基板処理エリア17内および第2基板搬
送エリア18,19内の雰囲気を共に排気する排気手段
23が設けられている。このように、搬送エリア外郭部
材21によって仕切られた外側のクリーンな第1基板搬
送エリア20と、複数の基板2の薬液からの出し入れで
ヒュームが拡散する搬送エリア外郭部材21の内側の第
2基板搬送エリア18,19と、実際に複数の基板2を
処理する基板処理エリア17との3つのエリアに分ける
と共に、基板処理エリア17内および第2基板搬送エリ
ア18,19内の雰囲気を排気手段23で排気すること
で、第1基板搬送エリア20へのヒュームの拡散をより
確実に防止するようになっている。
As shown in FIG. 2, the substrate processing unit 5 includes a plurality of substrate processing areas 1 in each of the tank outer members 16 (in the processing section) covering the plurality of processing tanks 12 to 15, respectively.
7, two second substrate transfer areas 18 and 19 provided above the plurality of substrate processing areas 17 and having a second transfer path for transferring between the respective substrate processing areas 17, and these second substrate transfer areas Substrates 2 for 18 and 19 respectively
Substrate transport area 20 having a first transport path for transporting
And transfer area outer members 21 as separation members (atmosphere blocking members) for separating and separating the second substrate transfer areas 18 and 19 and the first substrate transfer area 20, respectively. . This transport area outer member 21
In the upper position corresponding to (opposed to) the upper open port of one processing tank (the washing tank in the present embodiment), the space between the second substrate transfer area 18 and the first substrate transfer area 20 and the second substrate Each opening 22 capable of transporting a plurality of substrates 2 between the transport area 19 and the first substrate transport area 20 is provided. Further, an exhaust unit 23 is provided for exhausting the atmosphere in each of the substrate processing areas 17 and the second substrate transfer areas 18 and 19. As described above, the outer clean first substrate transfer area 20 partitioned by the transfer area outer member 21 and the second substrate inside the transfer area outer member 21 in which fumes are diffused by taking the plurality of substrates 2 in and out of the chemical solution. The transfer areas 18 and 19 and a substrate processing area 17 for actually processing a plurality of substrates 2 are divided into three areas, and the atmosphere in the substrate processing area 17 and the second substrate transfer areas 18 and 19 is evacuated by an exhaust unit 23. , The diffusion of fumes into the first substrate transfer area 20 is more reliably prevented.

【0031】つまり、本実施形態では、上記複数の処理
槽12〜15は、エッチィング液などの薬液を貯留した
薬液槽12と、この薬液槽12による処理済みの基板2
に付いた薬液やパーティクルなどを洗い流す水洗槽13
と、薬液を貯留した薬液槽14と、この薬液槽14によ
る処理済みの基板2に付いた薬液やパーティクルなどを
洗い流す水洗槽15とで構成されている。搬送エリア外
郭部材21の一方は、薬液槽12を覆った槽外郭部材1
6と、水洗槽13を覆った槽外郭部材16とを覆うと共
に、それらの各槽外郭部材16の間(各処理部間)を基
板搬送可能な第2基板搬送エリア18をも覆うように構
成されている。また、搬送エリア外郭部材21の他方
は、薬液槽14を覆った槽外郭部材16と、水洗槽15
を覆った槽外郭部材16とを覆うと共に、それらの各槽
外郭部材16間を基板搬送可能な第2基板搬送エリア1
9をも覆うように構成されている。さらに、薬液槽1
2,14および水洗槽13,15の各上部開放口にそれ
ぞれ対応(対向)した各槽外郭部材16の上面にはそれ
ぞれ、複数の基板2を内部に導入可能な各基板導入口2
4がそれぞれ配設されている。これらの各基板導入口2
4のうち、水洗槽13,15側の各基板導入口24にそ
れぞれ対応(対向)する上方の各搬送エリア外郭部材2
1の上面だけに、複数の基板2を内部に導入可能な各開
口22がそれぞれ設けられている。一方、薬液槽12,
14の各上部開放口にそれぞれ対向するようにその各上
方に基板導入口24をそれぞれ配設し、さらにその上方
の各搬送エリア外郭部材21にそれぞれ開口をそれぞれ
設けていない。これは、搬送エリア外郭部材21でエリ
ア間を仕切るだけではなく、第2基板搬送エリア18,
19と第1基板搬送エリア20との連通面積(開口面
積)をより小さくして第1基板搬送エリア20へのヒュ
ームの拡散を抑制すると共に、排気手段23によって第
1基板搬送エリア20へのヒュームの拡散を防止する程
度に、基板処理エリア17内および第2基板搬送エリア
18,19内の雰囲気を排気することから、その排気量
を従来とは大幅に削減可能にするためである。
That is, in the present embodiment, the plurality of processing tanks 12 to 15 include a chemical tank 12 storing a chemical such as an etching liquid, and a substrate 2 processed by the chemical tank 12.
Rinse tank 13 to wash away chemicals and particles attached to
And a chemical tank 14 for storing a chemical, and a washing tank 15 for washing away the chemical and particles attached to the substrate 2 that has been processed by the chemical tank 14. One of the transfer area outer members 21 is a tank outer member 1 covering the chemical solution tank 12.
6 and a tank outer member 16 that covers the washing tank 13 and a second substrate transfer area 18 that can transfer a substrate between the respective tank outer members 16 (between the processing units). Have been. The other of the transfer area outer members 21 is a tank outer member 16 covering the chemical solution tank 14 and a washing tank 15.
And a second substrate transfer area 1 capable of transferring a substrate between the respective tank outer members 16,
9 is also covered. Furthermore, the chemical solution tank 1
Each of the substrate introduction ports 2 into which a plurality of substrates 2 can be introduced, respectively, is provided on the upper surface of each tank outer member 16 corresponding to (opposing to) each of the upper open ports of the washing tanks 13 and 15.
4 are provided respectively. Each of these substrate inlets 2
4, upper transport area outer members 2 corresponding to (facing) the respective substrate introduction ports 24 on the washing tanks 13 and 15 side.
Each of the openings 22 through which the plurality of substrates 2 can be introduced is provided only on the upper surface of the substrate 1. On the other hand, the chemical tank 12,
Substrate introduction ports 24 are respectively disposed above each of the upper open ports 14 so as to face each of the upper open ports, and further, each of the transport area outer members 21 above the substrate inlet ports 21 has no opening. This is not only the partition between the areas by the transfer area outer member 21 but also the second substrate transfer area 18,
The communication area (opening area) between the first substrate transfer area 20 and the first substrate transfer area 20 is made smaller to suppress the diffusion of fume into the first substrate transfer area 20, and the fumes to the first substrate transfer area 20 are exhausted by the exhaust means 23. This is because the atmosphere in the substrate processing area 17 and the second substrate transport areas 18 and 19 is evacuated to such an extent as to prevent the diffusion of the gas.

【0032】また、この水洗槽15の隣側には、水洗槽
15で水洗処理された基板2を乾燥する乾燥槽25が配
設されている。薬液槽12、水洗槽13等で複数の基板
2を一括して順次各処理槽に浸漬させることにより、複
数の基板2に薬液処理や水洗処理などの一連の各種処理
が施され、その処理後の複数の基板2を乾燥槽25で乾
燥させるようになっている。この乾燥槽25は、所定温
度の乾燥用温風(ヒータなどで昇温されていてもよい)
が供給される構成であってもよいし、IPA(イソプロ
ピルアルコール)による減圧乾燥などであってもよい。
Further, a drying tank 25 for drying the substrate 2 that has been subjected to the water-washing treatment in the water-washing tank 15 is provided adjacent to the water-washing tank 15. A plurality of substrates 2 are subjected to a series of various processes such as a chemical solution treatment and a water washing process by sequentially immersing the plurality of substrates 2 in the respective treatment tanks in the chemical solution tank 12, the washing tank 13, and the like. The plurality of substrates 2 are dried in a drying tank 25. The drying tank 25 is a drying hot air having a predetermined temperature (the temperature may be raised by a heater or the like).
May be supplied, or reduced pressure drying using IPA (isopropyl alcohol) may be used.

【0033】さらに、各開口22をそれぞれスライドし
て開閉する板状の開口部開閉扉26と、この開口部開閉
扉26を基板搬送に応じて開閉駆動させる開口部開閉駆
動手段(図示せず)とが搬送エリア外郭部材21の上面
部に配設されている。これらの開口部開閉扉26と開口
部開閉駆動手段によってシャッタ手段が構成されてお
り、基板搬送用の開口22に対して開閉可能である。ま
た、各槽外郭部材16の基板導入口24をそれぞれ開閉
する各導入口開閉扉27と、これらの各導入口開閉扉2
7を基板搬送に応じて開閉駆動させる導入口開閉駆動手
段(図示せず)とが各槽外郭部材16の上面部に配設さ
れている。これらの各槽外郭部材16に各導入口開閉扉
27をそれぞれ設けているのは、単にヒュームの拡散防
止のためだけではなく液中に含まれている揮発成分の蒸
発をできるだけ抑えるためである。また、各開口部開閉
扉26を設けているのは、高クリーン度が要求される第
1基板搬送エリア20側に第2基板搬送エリア18,1
9側からヒュームが拡散するのをできるだけ防止するた
めである。この観点から、これらの各開口部開閉扉26
および各導入口開閉扉27は、複数の基板2の物流時以
外には閉じている。さらに、乾燥槽25の上面にも基板
導入口を開閉する各導入口開閉扉28が配設されてい
る。
Further, a plate-shaped opening / closing door 26 which slides each opening 22 to open and close, and an opening / closing drive means (not shown) for driving the opening / closing door 26 to open and close according to the substrate transport. Are disposed on the upper surface of the transfer area outer member 21. The opening / closing door 26 and the opening / closing drive means constitute shutter means, and can be opened and closed with respect to the substrate transfer opening 22. In addition, each inlet opening / closing door 27 that opens and closes the substrate inlet 24 of each tank outer member 16, and each inlet opening / closing door 2.
Inlet opening / closing driving means (not shown) for driving the opening / closing of the tank 7 in accordance with the transfer of the substrate (not shown) is disposed on the upper surface of each tank outer member 16. The reason why each inlet / outlet door 27 is provided in each of the outer shell members 16 is not only to prevent fume diffusion but also to minimize evaporation of volatile components contained in the liquid. Also, the opening / closing doors 26 are provided because the second substrate transport areas 18 and 1 are located on the first substrate transport area 20 side where high cleanliness is required.
This is to prevent fumes from being diffused from the 9 side as much as possible. From this viewpoint, each of these opening / closing doors 26
In addition, each inlet opening / closing door 27 is closed except during distribution of the plurality of substrates 2. Further, each inlet opening / closing door 28 for opening and closing the substrate inlet is also provided on the upper surface of the drying tank 25.

【0034】本実施形態では、この開口部開閉扉26は
搬送エリア外郭部材21の上面に沿って所定距離だけス
ライドして水平移動することで開口22を開閉するよう
になっており、導入口開閉扉27は両開き状に両側で回
動駆動して基板導入口24を開閉するようになってい
る。これらの開口部開閉駆動手段および導入口開閉駆動
手段は例えばエアーシリンダ(図示せず)などで構成さ
れていてもよい。この場合、開口部開閉扉26にエアー
シリンダのロッド先端が取り付けられてロッドの所定ス
トロークの伸縮によって開口22を開閉する。また、導
入口開閉扉27は2枚の扉で構成され、それぞれの扉に
対して、アーム一端がそれぞれ固定され、アーム中央部
でそれぞれ回動自在に軸支されたアーム(図示せず)の
他端にエアーシリンダのロッド先端が取り付けられてロ
ッドの所定ストロークの伸縮によって導入口開閉扉27
をアーム(図示せず)を介して両開き状に両側で回動駆
動させて基板導入口24を開閉するようになっている。
このように、導入口開閉扉27を両開き用にしてそれぞ
れの扉を開閉する場合、それぞれの扉の駆動用にはエア
ーシリンダを2台設けるようにしてもよい。
In the present embodiment, the opening / closing door 26 slides a predetermined distance along the upper surface of the transfer area outer member 21 and horizontally moves to open / close the opening 22. The door 27 is configured to open and close the substrate introduction port 24 by being rotationally driven on both sides in a double open manner. These opening and closing drive means and inlet opening and closing drive means may be constituted by, for example, an air cylinder (not shown). In this case, the tip of the rod of the air cylinder is attached to the opening / closing door 26, and the opening 22 is opened and closed by the expansion and contraction of the rod by a predetermined stroke. The inlet opening / closing door 27 is composed of two doors. One end of each arm is fixed to each of the doors, and each arm (not shown) is rotatably supported at the center of the arm. At the other end, the rod end of the air cylinder is attached, and the inlet opening / closing door 27 is extended and contracted by a predetermined stroke of the rod.
Is pivotally driven on both sides in an open manner via an arm (not shown) to open and close the substrate introduction port 24.
In this way, when the inlet opening / closing door 27 is opened for both sides to open and close each door, two air cylinders may be provided for driving each door.

【0035】さらに、搬送機構9は搬送ロボットで構成
されており、複数の処理槽12〜15の配設方向(X方
向)に移動可能で複数の基板2を保持可能な一対の保持
板29を有している。この一対の保持板29はそれぞ
れ、図2の紙面に直交する方向(図3のY方向)に伸び
る各軸部材30(図3)にそれぞれ固定されており、こ
れらの各軸部材30の軸芯をそれぞれ回動中心として互
いに逆方向に回動自在に搬送機構本体9aに連結されて
いる。また、この一対の保持板29にはそれぞれ、その
対向した各内側に複数の基板2を所定間隔を空けてそれ
ぞれ起立(垂直)姿勢で保持可能な保持用溝(図示せ
ず)が複数形成されている。一対の保持板29の下端部
を互いに内側に接近させて、複数の基板2をY方向に並
べた状態でそれらの両側端面を両側からそれぞれ挾み込
んで各保持用溝で受けて保持する。
Further, the transfer mechanism 9 is constituted by a transfer robot, and is provided with a pair of holding plates 29 which can move in the direction in which the plurality of processing tanks 12 to 15 are arranged (X direction) and can hold a plurality of substrates 2. Have. The pair of holding plates 29 are respectively fixed to shaft members 30 (FIG. 3) extending in a direction (Y direction in FIG. 3) orthogonal to the paper surface of FIG. Are connected to the transport mechanism main body 9a so as to be rotatable in opposite directions about the respective rotation centers. Further, a plurality of holding grooves (not shown) capable of holding a plurality of substrates 2 in a standing (vertical) posture at predetermined intervals are formed in the opposed inner sides of the pair of holding plates 29, respectively. ing. With the lower end portions of the pair of holding plates 29 approaching each other inside, the plurality of substrates 2 are arranged in the Y direction, and both side end surfaces thereof are sandwiched from both sides, respectively, and received and held by the respective holding grooves.

【0036】さらに、これらの薬液槽12および水洗槽
13と、薬液槽14および水洗槽15のそれぞれに、複
数の基板2を搬送する各リフタ装置31がそれぞれ配設
されている。図3に示すように、これらの各リフタ装置
31は、基板保持用溝32aが複数形成され複数の基板
2を下方から各基板保持用溝32aでそれぞれ受けて起
立姿勢で保持する3本の保持アーム32と、この3本の
保持アーム32が下端部分でL字状に接続された可動保
持板33と、この可動保持板33の上端部分裏面に固定
され上下移動および水平動可能な可動部材34と、この
可動部材34を上下動および水平動させる駆動手段(図
示せず)とがそれぞれ配設されている。また、乾燥槽2
5にも、複数の基板2を搬送する各リフタ装置35が配
設されており、このリフタ装置35はリフタ装置31と
同様の構成をしている。
Further, lifter devices 31 for transporting a plurality of substrates 2 are provided in the chemical bath 12 and the washing bath 13 and in the chemical bath 14 and the washing bath 15, respectively. As shown in FIG. 3, each of the lifter devices 31 has a plurality of substrate holding grooves 32 a formed therein, and a plurality of substrate holding grooves 32 a which receive the plurality of substrates 2 from below in the respective substrate holding grooves 32 a and hold the substrates 2 in a standing posture. An arm 32, a movable holding plate 33 in which the three holding arms 32 are connected in an L-shape at the lower end, and a movable member 34 fixed to the back surface of the upper end of the movable holding plate 33 and capable of moving up and down and moving horizontally. And driving means (not shown) for vertically moving and horizontally moving the movable member 34 are provided, respectively. In addition, drying tank 2
5, each lifter device 35 for transporting a plurality of substrates 2 is provided, and the lifter device 35 has the same configuration as the lifter device 31.

【0037】これらの各リフタ装置31,35の駆動手
段(図示せず)は、レールなどの案内部材(図示せず)
に沿って可動部材34をレールなどの案内部材(図示せ
ず)に沿って上下方向に移動させる垂直駆動ユニットを
有しており、例えばワイヤやベルトなどを駆動するプー
リやロールなどをモータで回転駆動させてワイヤやベル
トなどに取り付けられた可動部材34を上下動させるよ
うにしてもよい。また、ピニオンおよびラックをモータ
で駆動させて可動部材34を上下動させるようにしても
よく、ボールねじとモータによって可動部材34を上下
動させるようにしてもよく、種々の駆動系が考えられ
る。さらに、この各リフタ装置31の駆動手段(図示せ
ず)は、レールなどの案内部材(図示せず)に沿って可
動部材34を上記垂直駆動ユニットと共に水平方向に移
動させる水平駆動ユニットを有しており、上記と同様に
ボールねじなど種々の駆動系が考えられる。
A driving means (not shown) for each of the lifter devices 31 and 35 is provided with a guide member (not shown) such as a rail.
And a vertical drive unit for moving the movable member 34 in the vertical direction along a guide member (not shown) such as a rail. For example, a pulley or a roll for driving a wire or a belt is rotated by a motor. The movable member 34 attached to a wire, a belt, or the like may be driven to move up and down. Further, the pinion and the rack may be driven by a motor to move the movable member 34 up and down, or the ball screw and the motor may be used to move the movable member 34 up and down. Various driving systems are conceivable. Further, the drive means (not shown) of each lifter device 31 has a horizontal drive unit for moving the movable member 34 in a horizontal direction together with the vertical drive unit along a guide member (not shown) such as a rail. Various drive systems such as a ball screw can be considered in the same manner as described above.

【0038】各リフタ装置31の処理槽内への下降に連
動して導入口開閉扉27が開くように構成されていると
共に、処理槽内からの上昇に連動して導入口開閉扉27
が開くように構成されている。また、各リフタ装置31
の第2基板搬送エリア18内または第2基板搬送エリア
19内への下降に連動して開口部開閉扉26が開くよう
に構成されていると共に、第2基板搬送エリア18内ま
たは第2基板搬送エリア19内からの上昇に連動して開
口部開閉扉26が開くように構成されている。さらに、
リフタ装置35の乾燥槽25内への下降に連動して導入
口開閉扉28が開くように構成されていると共に、乾燥
槽25内からの上昇に連動して導入口開閉扉28が開く
ように構成されている。つまり、これらの開口部開閉扉
26および導入口開閉扉27,28はそれぞれ複数の基
板2の通過時のみ開き、他は閉じているようになってい
る。
The inlet opening / closing door 27 is configured to open in conjunction with the lowering of each lifter device 31 into the processing tank, and the inlet opening / closing door 27 is linked in conjunction with the ascent from the processing tank.
Is configured to open. In addition, each lifter device 31
The opening / closing door 26 is configured to open in conjunction with the lowering into the second substrate transfer area 18 or the second substrate transfer area 19, and the second substrate transfer area 18 or the second substrate transfer The opening / closing door 26 is configured to open in conjunction with the rise from the inside of the area 19. further,
The inlet opening / closing door 28 is configured to open in conjunction with the lowering of the lifter device 35 into the drying tank 25, and the inlet opening / closing door 28 is opened in association with the ascent from the drying tank 25. It is configured. In other words, these opening / closing doors 26 and introduction opening / closing doors 27 and 28 are each opened only when a plurality of substrates 2 pass, and the other are closed.

【0039】さらに、各槽外郭部材16の上部側壁(図
2の処理槽開放口の高さ位置)にはそれぞれ各排気ダク
ト37の排気口が処理槽幅方向に渡って長方形状にそれ
ぞれ開口しており、それらの排気ダクト37の排気口は
流量調整バルブ38を介して排気ポンプ39に連通され
ている。また、各第2基板搬送エリア18,19をそれ
ぞれ覆っている各搬送エリア外郭部材21の側壁部には
それぞれ、各排気ダクト37の排気口がリフタ装置31
の幅方向に渡って長方形状にそれぞれ開口しており、そ
れらの排気ダクト37の排気口も流量調整バルブ38を
介して排気ポンプ39に連通されている。これらの各搬
送エリア外郭部材21の排気口は、薬液槽12,14の
上方近傍位置であって各第2基板搬送エリア18の最も
奥側の側壁に配設されている。これらの排気ダクト3
7、流量調整バルブ38および排気ポンプ39によって
排気手段23が構成されており、各槽外郭部材16内
(基板処理エリア17)および各搬送エリア外郭部材2
1内(第2基板搬送エリア18内)の適所に設けられた
この排気手段23による排気口からの排気によって、各
搬送エリア外郭部材21の開口部開閉扉26が開いた
り、各外郭部材16の基板導入口開閉扉27が開いて
も、この開口22や基板導入口24から外部の空気が流
入することで、この開口22や基板導入口24を介して
薬液槽12,14や、薬液の付いた複数の基板2からの
ヒューム(酸やアルカリなどが混ざった雰囲気)の外部
への拡散が防止されるようになっている。
Further, on the upper side wall of each tank outer member 16 (at the height position of the processing tank open port in FIG. 2), the exhaust port of each exhaust duct 37 opens in a rectangular shape across the width of the processing tank. The exhaust ports of the exhaust ducts 37 are connected to an exhaust pump 39 via a flow control valve 38. Further, the exhaust ports of the exhaust ducts 37 are respectively provided on the side walls of the transfer area outer members 21 covering the second substrate transfer areas 18 and 19, respectively.
The exhaust ports of the exhaust ducts 37 are also connected to an exhaust pump 39 via a flow control valve 38. The exhaust port of each of the transfer area outer members 21 is disposed on the innermost side wall of each of the second substrate transfer areas 18 at a position near and above the chemical solution tanks 12 and 14. These exhaust ducts 3
7, the exhaust means 23 is constituted by the flow control valve 38 and the exhaust pump 39, and the inside of each tank outer member 16 (substrate processing area 17) and each transport area outer member 2
1 (inside the second substrate transport area 18), the exhaust opening from the exhaust port provided by the exhaust unit 23 opens the opening / closing door 26 of each transport area outer member 21 or opens or closes the outer member 16 of each transport area outer member 21. Even when the substrate introduction opening / closing door 27 is opened, the outside air flows in through the opening 22 and the substrate introduction opening 24, so that the chemical solution tanks 12 and 14 and the chemical solution are attached through the opening 22 and the substrate introduction opening 24. Further, the diffusion of fumes (atmosphere in which an acid, an alkali, or the like is mixed) from the plurality of substrates 2 to the outside is prevented.

【0040】また、排気手段23は、分離部材としての
各搬送エリア外郭部材21の基板搬送用の開口22に対
して開閉可能なシャッタ手段を構成する開口部開閉扉2
6が開位置と閉位置に応じて排気ポンプ39の出力を高
排気出力と低排気出力に切り換え制御を行う制御手段
(図示せず)を有するようにしてもよい。つまり、この
制御手段は、シャッタ手段が開口22を閉じている場合
には、それをリミットスイッチ(図示せず)などで検出
させて排気ポンプ39の出力を低排気出力とするように
制御して省電力化し、基板搬送時などシャッタ手段が開
口22を開けている場合には、それをリミットスイッチ
などで検出させて排気ポンプ39の出力を高排気出力と
するように制御してヒュームがクリーンな第1基板搬送
エリア20側に拡散しないように構成することもでき
る。
The exhaust means 23 is provided with an opening / closing door 2 which constitutes a shutter means which can be opened / closed with respect to the substrate carrying opening 22 of each carrying area outer member 21 as a separating member.
6 may have a control means (not shown) for controlling the switching of the output of the exhaust pump 39 between the high exhaust output and the low exhaust output in accordance with the open position and the closed position. That is, when the shutter unit closes the opening 22, the control unit controls the output of the exhaust pump 39 to a low exhaust output by detecting the opening with a limit switch (not shown) or the like. When the shutter 22 opens the opening 22 such as when transferring a substrate, such as when transferring a substrate, the opening is detected by a limit switch or the like, and the output of the exhaust pump 39 is controlled to a high exhaust output so that the fume is cleaned. It is also possible to configure so as not to diffuse to the first substrate transfer area 20 side.

【0041】さらに、図3〜図5に示すように、これら
のリフタ装置31と搬送機構9とは、並んで配設された
複数の処理槽12〜15,25に対して同一側にそれぞ
れ配設されている。この場合に、これらのリフタ装置3
1と搬送機構9とはそれぞれ基板保持部分(保持板29
や3本の保持アーム32)が前方(搬送方向に直交する
方向)に突き出た片持ち構造をしているために、それら
の可動根本部分のギャップ分や、多数の重い基板2を保
持して撓む分だけ、図5に示すように、それらの各基板
保持部分である保持板29や保持アーム32が同一方向
に下方に傾くことになる。これらの保持板29や保持ア
ーム32の下方への傾きをそれぞれθ3,θ4とする
と、例えば一対の保持板29の各基板保持溝からリフタ
装置31の3つの保持アーム32の上側の複数の各基板
保持溝への複数の基板2の受渡し時には、一対の保持板
29と保持アーム32の相対的な傾きが、従来の図8の
ようにθ1+θ2と加算されて重なるようなことはな
く、θ3−θ4またはθ4−θ3の絶対値となって大幅
に相殺されて縮小され、複数の基板2の受渡し時に、受
け渡される基板保持溝の配列ピッチと、保持された基板
ピッチとがより一致しやすくなって、複数の基板2が基
板保持溝に確実に保持されて搬送されるようになってい
る。このため、複数の基板2が一対の保持板29や保持
アーム32から落ちて損傷する虞はなくなり、より安定
な基板受渡しとなるようになっている。
Further, as shown in FIGS. 3 to 5, the lifter device 31 and the transport mechanism 9 are arranged on the same side with respect to a plurality of processing tanks 12 to 15, 25 arranged side by side. Has been established. In this case, these lifter devices 3
1 and the transport mechanism 9 are each provided with a substrate holding portion (holding plate 29
And three holding arms 32) have a cantilever structure protruding forward (in a direction perpendicular to the transport direction), so that they can hold gaps between their movable roots and hold a large number of heavy substrates 2. As shown in FIG. 5, the holding plate 29 and the holding arm 32, which are the respective substrate holding portions, are inclined downward in the same direction by the amount of bending. Assuming that the downward inclinations of the holding plate 29 and the holding arm 32 are θ3 and θ4, respectively, for example, a plurality of substrates above the three holding arms 32 of the lifter device 31 from the respective substrate holding grooves of the pair of holding plates 29. When the plurality of substrates 2 are transferred to the holding groove, the relative inclination of the pair of holding plates 29 and the holding arms 32 is not added to θ1 + θ2 and overlapped as shown in FIG. Alternatively, the absolute value of θ4−θ3 is greatly offset and reduced, and when the plurality of substrates 2 are transferred, the arrangement pitch of the transferred substrate holding grooves and the held substrate pitch more easily match. The plurality of substrates 2 are securely held by the substrate holding grooves and transported. For this reason, there is no possibility that the plurality of substrates 2 fall down from the pair of holding plates 29 and the holding arms 32 to be damaged, and more stable substrate delivery is achieved.

【0042】さらに、各搬送エリア外郭部材21の上方
の第1基板搬送エリア20を覆う更なるヒューム拡散防
止用の搬送エリア外郭部材40が設けられており、搬送
エリア外郭部材40内において複数の処理槽12〜1
5,25の配列された方向(X方向)に複数の基板2を
搬送させるための基板搬送ライン(第1搬送路)の空間
部分を構成している。この搬送エリア外郭部材40の側
壁には、搬送機構9の一対の保持板29と共にそれに保
持された複数の基板2の移動を許容するための開口41
が形成されており、この開口41を開閉するための開閉
扉42がには、その搬送エリア外郭部材40の側壁に沿
ってスライド自在に構成されている。この開閉扉42
は、通常は閉状態であり、搬送機構9の開口41に対す
る通過時にのみ開状態となるように開閉駆動手段(図示
せず)で開閉駆動されるようになっている。この開閉駆
動手段は、例えば扉開閉用のシリンダと、搬送機構9を
検出する検出手段と、この検出手段で搬送機構9を検出
したときにシリンダを駆動させるように切り換える電磁
弁とを有している。
Further, a transfer area outer member 40 for preventing fume diffusion, which covers the first substrate transfer area 20 above each transfer area outer member 21, is provided. Vessel 12-1
A space portion of a substrate transport line (first transport path) for transporting a plurality of substrates 2 in the direction (X direction) in which 5, 25 are arranged. An opening 41 for allowing the movement of the plurality of substrates 2 held thereon together with the pair of holding plates 29 of the transfer mechanism 9 is provided on the side wall of the transfer area outer member 40.
The opening / closing door 42 for opening and closing the opening 41 is configured to be slidable along the side wall of the transfer area outer member 40. This door 42
Is normally closed, and is opened and closed by opening and closing drive means (not shown) so that it is opened only when the transport mechanism 9 passes through the opening 41. The opening / closing drive unit includes, for example, a door opening / closing cylinder, a detection unit that detects the transport mechanism 9, and an electromagnetic valve that switches to drive the cylinder when the transport mechanism 9 is detected by the detection unit. I have.

【0043】上記構成により、以下、その動作を説明す
る。
The operation of the above configuration will be described below.

【0044】まず、搬送機構9は、搬出入部(図示せ
ず)から基板2を受け取って第1の処理ユニットのある
第1基板搬送エリア18の開口22の上方の基板受渡位
置まで第1基板搬送エリア20内の搬送路をその搬送路
方向(X方向)に沿って搬送する。この基板受渡位置に
おいて、図2に示すように、搬送機構9の一対の保持板
29はそれぞれ、それらの内側の複数の保持用溝で、起
立姿勢の複数の基板2の両側端面を両側からそれぞれ挾
み込んで受けて保持している。これに対して、リフタ装
置31がその基板受渡位置まで上昇してきて、その下方
部に設けられた3つの保持アーム32の上側の複数の各
保持溝で、搬送機構9に保持されている複数の基板2を
下方から受ける。その後、搬送機構9の一対の保持板2
9をそれぞれ垂直方向になるようにそれぞれ回動させ
て、搬送機構9による複数の基板2への保持を解除し、
リフタ装置31の3つの保持アーム32上への複数の基
板2の受渡しを完了する。
First, the transport mechanism 9 receives the substrate 2 from the loading / unloading section (not shown) and transports the first substrate to the substrate transfer position above the opening 22 of the first substrate transport area 18 where the first processing unit is located. The sheet is transported along the transport path in the area 20 along the transport path direction (X direction). At this board transfer position, as shown in FIG. 2, the pair of holding plates 29 of the transport mechanism 9 are respectively provided with a plurality of holding grooves on their inner sides to respectively hold both side end surfaces of the plurality of boards 2 in the standing posture from both sides. It is sandwiched and received and held. On the other hand, the lifter device 31 rises to the substrate delivery position, and the plurality of holding grooves on the upper side of the three holding arms 32 provided below the lifter device 31 hold the plurality of holding grooves held by the transport mechanism 9. The substrate 2 is received from below. Thereafter, the pair of holding plates 2 of the transport mechanism 9
9 are respectively rotated so as to be in the vertical directions, and the holding of the plurality of substrates 2 by the transport mechanism 9 is released.
The delivery of the plurality of substrates 2 onto the three holding arms 32 of the lifter device 31 is completed.

【0045】次に、リフタ装置31は複数の基板2を3
つの保持アーム32上の複数の各保持溝で保持した状態
で下降し始めると、この下降に連動して搬送エリア外郭
部材21の開口部開閉扉26が開き、その開口22を通
して複数の基板2と共にリフタ装置31が第2基板搬送
エリア18内に入る。この第2基板搬送エリア18内
で、リフタ装置31は複数の基板2と共に、薬液処理部
の上方位置まで横方向に水平移動した後に、薬液槽12
のある薬液処理部内に向けて下降し始める。この下降に
連動して槽外郭部材16の基板導入口開閉扉27が開
き、その基板導入口24を通して複数の基板2を保持し
た3つの保持アーム32が基板処理エリア17内に入っ
て、さらに、薬液槽12の上部開放口から複数の基板2
を保持した保持アーム32をその薬液中に浸漬させ、そ
の状態で所定時間放置して複数の基板2の表面に所定の
薬液処理を施す。
Next, the lifter device 31 converts the plurality of substrates 2 into 3
When the descent is started while being held by the plurality of holding grooves on one holding arm 32, the opening / closing door 26 of the transport area outer member 21 is opened in conjunction with the descent, and the plurality of substrates 2 are passed through the opening 22 together with the plurality of substrates 2. The lifter device 31 enters the second substrate transfer area 18. In the second substrate transfer area 18, the lifter device 31 is horizontally moved with the plurality of substrates 2 to a position above the chemical solution processing section, and then the chemical solution tank 12 is moved.
Begins to descend into the chemical solution processing section with the gas. In conjunction with this lowering, the substrate introduction opening / closing door 27 of the tank outer member 16 opens, and the three holding arms 32 holding the plurality of substrates 2 enter the substrate processing area 17 through the substrate introduction opening 24, and further, A plurality of substrates 2 from the upper opening of the chemical tank 12
The holding arm 32 holding the substrate 2 is immersed in the chemical solution, and is left in that state for a predetermined time to perform a predetermined chemical treatment on the surfaces of the plurality of substrates 2.

【0046】これらの一連の第2基板搬送エリア18内
の基板搬送時や薬液処理時には、搬送エリア外郭部材2
1の開口22は開口部開閉扉26によって閉じられてい
ると共に、この薬液槽12および水洗槽13上の各槽外
郭部材16の基板導入口24もそれぞれ、その基板処理
エリア17内への基板導入時以外は各基板導入口開閉扉
27によってそれぞれ閉じられている。また、排気手段
23は、常に一定の排気能力で排気するようにしてもよ
いが、この場合には、その開口22および各基板導入口
24の開放時(エリア間の基板搬送時)にも外部にヒュ
ーム拡散がないような高排気能力でなければならない。
このため、開口22および各基板導入口24の開放時に
高排気出力で排気ポンプ39を駆動してその内部雰囲気
を排気し、開口22および各基板導入口24のうち何れ
か一方の開放時に、中排気出力で排気ポンプ39を駆動
してその内部雰囲気を排気し、開口22および基板導入
口24の閉止時(エリア内基板搬送時および基板処理
時)には低排気出力で排気して排気ポンプ39を3段階
の省電力駆動としてもよい。また、開口22および各基
板導入口24のうち少なくとも何れかの開放時に、高排
気出力で排気ポンプ39を駆動してその内部雰囲気を排
気し、開口22および基板導入口24の閉止時(エリア
内基板搬送時および基板処理時)には低排気出力で排気
して排気ポンプ39を2段階の省電力駆動としてもよ
い。
When the substrate is transported in the series of second substrate transport areas 18 or when a chemical solution is processed, the transport area outer member 2
The opening 22 is closed by an opening / closing door 26, and the substrate introduction ports 24 of the tank outer members 16 on the chemical solution tank 12 and the washing tank 13 are also provided with the substrate introduction into the substrate processing area 17. At other times, the doors are closed by the respective substrate introduction opening / closing doors 27. In addition, the exhaust means 23 may always exhaust gas with a constant exhaust capacity. In this case, the exhaust means 23 is also externally opened when the opening 22 and the substrate introduction ports 24 are opened (when the substrate is transported between the areas). Must have high exhaust capacity without fume diffusion.
Therefore, when the opening 22 and each of the substrate introduction ports 24 are opened, the exhaust pump 39 is driven at a high exhaust output to exhaust the internal atmosphere, and when one of the opening 22 and each of the substrate introduction ports 24 is opened, the medium is discharged. The exhaust pump 39 is driven by the exhaust output to exhaust the internal atmosphere. When the opening 22 and the substrate introduction port 24 are closed (when the substrate is transported in the area and when the substrate is processed), the exhaust pump 39 is exhausted with a low exhaust output. May be a three-stage power-saving drive. When at least one of the opening 22 and each of the substrate introduction ports 24 is opened, the exhaust pump 39 is driven at a high exhaust output to exhaust the internal atmosphere, and when the opening 22 and the substrate introduction port 24 are closed (in the area). The exhaust pump 39 may be evacuated with a low exhaust output (during substrate transport and substrate processing) to perform two-stage power-saving driving.

【0047】さらに、所定時間後の薬液処理後、リフタ
装置31は、複数の基板2を保持した保持アーム32を
上昇させ、それに連動するように開閉扉27が仮想線で
示すように両側に開き、薬液槽12の上部開放口から基
板導入口24を通して複数の基板2を保持した保持アー
ム32を薬液槽12の上方まで上昇させ、水洗槽13の
ある水洗処理部の上方位置まで横方向に水平移動させ
る。その後、リフタ装置31は、薬液処理を済ませて基
板2の表面に薬液が付いた複数の基板2を保持アーム3
2と共に下降させる、この下降に連動して槽外郭部材1
6の基板導入口開閉扉27が開き、その基板導入口24
を通して複数の基板2を保持した保持アーム32が水洗
槽13の基板処理エリア17内に導入される。この基板
処理エリア17内で、リフタ装置31は、水洗槽13の
上部開放口から複数の基板2をその薬液中に浸漬させ、
複数の基板2の表面に付着した薬液を洗い流す水洗処理
を行う。
Further, after the treatment with the chemical solution after a predetermined time, the lifter device 31 raises the holding arm 32 holding the plurality of substrates 2, and opens and closes the opening and closing door 27 on both sides as shown by the phantom line in conjunction with the lifting arm 32. Then, the holding arm 32 holding the plurality of substrates 2 is lifted from the upper opening of the chemical solution tank 12 through the substrate introduction port 24 to above the chemical solution tank 12, and is horizontally horizontally moved to a position above the washing section having the washing tank 13. Move. After that, the lifter device 31 holds the plurality of substrates 2 having the chemical solution on the surface of the substrate 2 after the chemical solution treatment,
2 is lowered together with the tank outer member 1
6, the substrate inlet opening / closing door 27 opens, and the substrate inlet 24
The holding arm 32 holding the plurality of substrates 2 is introduced into the substrate processing area 17 of the rinsing tank 13. In the substrate processing area 17, the lifter device 31 immerses the plurality of substrates 2 in the chemical solution from the upper opening of the washing tank 13,
A water washing process is performed to wash out the chemicals attached to the surfaces of the plurality of substrates 2.

【0048】これらの一連の第2基板搬送エリア18内
の基板搬送時や水洗処理時には上記と同様に、搬送エリ
ア外郭部材21の開口22は開口部開閉扉26によって
閉じられていると共に、この薬液槽12および水洗槽1
3上の各槽外郭部材16の基板導入口24もそれぞれ、
各基板処理エリア17内への基板導入時以外は各基板導
入口開閉扉27によってそれぞれ閉じられているが、こ
のような場合にも、薬液槽12からの一連の第2基板搬
送エリア18内の基板搬送時には、薬液の付いた複数の
基板2からのヒュームを排気するべく、高排気出力で排
気ポンプ39を駆動してその内部雰囲気を排気するよう
にしてもよい。
As described above, the opening 22 of the transfer area outer member 21 is closed by the opening / closing door 26 during the transfer of the substrate in the series of second substrate transfer areas 18 and the rinsing process. Tank 12 and washing tank 1
The substrate introduction port 24 of each of the outer shell members 16 on the substrate 3 is also
Except when the substrate is introduced into each of the substrate processing areas 17, each of the substrates is closed by each of the substrate introduction opening / closing doors 27. At the time of transporting the substrate, the exhaust atmosphere may be exhausted by driving the exhaust pump 39 at a high exhaust output so as to exhaust the fumes from the plurality of substrates 2 with the chemical solution.

【0049】さらに、所定時間後の水洗処理後、リフタ
装置31は、複数の基板2を保持した保持アーム32を
上昇させ、それに連動するように開閉扉27を両側に開
き、水洗槽13の上部開放口から基板導入口24を通し
て複数の基板2を保持した保持アーム32を上昇させ、
その上昇に連動するように開口部開閉扉26を開き、搬
送エリア外郭部材21の開口22を通して複数の基板2
を保持した保持アーム32を基板受渡位置まで上昇させ
る。
Further, after the rinsing process after a predetermined time, the lifter device 31 raises the holding arm 32 holding the plurality of substrates 2, opens the opening / closing door 27 on both sides in conjunction with the lifting arm 32, and lifts the upper portion of the rinsing tank 13. The holding arm 32 holding the plurality of substrates 2 is raised from the opening through the substrate introduction port 24,
The opening / closing door 26 is opened so as to be linked with the rise, and the plurality of substrates 2 are passed through the opening 22 of the transfer area outer member 21.
Is raised to the substrate delivery position.

【0050】この搬送エリア外郭部材21で覆われた第
1の処理ユニットにおける基板受渡位置では、搬送機構
9の一対の保持板29が垂直方向の姿勢で待機してお
り、複数の基板2を保持した保持アーム32を一対の保
持板29の間に到着させた後に、一対の保持板29の下
部側をそれぞれ内側に回動させて、複数の基板2の両側
端面を両側からそれぞれ挾み込んで各保持用溝でそれぞ
れ受けて保持する。
At the substrate transfer position in the first processing unit covered by the transfer area outer member 21, the pair of holding plates 29 of the transfer mechanism 9 are standing by in a vertical position to hold the plurality of substrates 2. After the holding arms 32 arrive between the pair of holding plates 29, the lower sides of the pair of holding plates 29 are respectively turned inward, and the both end surfaces of the plurality of substrates 2 are sandwiched from both sides. Each holding groove receives and holds it.

【0051】さらに、リフタ装置31を保持アーム32
と共に下方に退避させた後に、搬送機構9の一対の保持
板29は複数の基板2を保持した状態で、次の第2の処
理ユニットのある第2基板搬送エリア19の開口22の
上方の基板受渡位置まで第1基板搬送エリア20内の搬
送路をその搬送路方向(X方向)に沿って搬送する。こ
のとき、搬送機構9の一対の保持板29は、それらの内
側の複数の保持用溝で、起立姿勢の複数の基板2の両側
端面を両側からそれぞれ挾み込んで各保持用溝で受けて
保持している。これに対して、第2の処理ユニットのリ
フタ装置31が上昇してきて、その下方部に設けられた
3つの保持アーム32の上側の複数の各保持溝で、一対
の保持板29に保持されている複数の基板2を下方から
受ける。その後、一対の保持板29をそれぞれ垂直方向
になるように回動させて、一対の保持板29の複数の基
板2への保持を解除し、搬送機構9の一対の保持板29
から第2の処理ユニットのリフタ装置31への複数の基
板2の受渡しが完了する。
Further, the lifter device 31 is connected to the holding arm 32.
After retreating downward, together with the pair of holding plates 29 of the transport mechanism 9 holding the plurality of substrates 2, the substrate above the opening 22 of the second substrate transport area 19 where the next second processing unit is located. The transfer path in the first substrate transfer area 20 is transferred to the delivery position along the transfer path direction (X direction). At this time, the pair of holding plates 29 of the transport mechanism 9 sandwich the both end surfaces of the plurality of substrates 2 in the upright posture from both sides by the plurality of holding grooves on the inner side thereof and receive them by the respective holding grooves. keeping. On the other hand, the lifter device 31 of the second processing unit rises, and is held by the pair of holding plates 29 in the plurality of holding grooves above the three holding arms 32 provided below the lifter device 31. Are received from below. Thereafter, the pair of holding plates 29 are rotated so as to be vertical, respectively, to release the holding of the pair of holding plates 29 to the plurality of substrates 2, and the pair of holding plates 29 of the transport mechanism 9 are released.
Then, the delivery of the plurality of substrates 2 to the lifter device 31 of the second processing unit is completed.

【0052】さらに、第2の処理ユニットのリフタ装置
31に受け渡された複数の基板2は、そのリフタ装置3
1によって第2基板搬送エリア19内に導入されること
になる。また、一方、空の搬送機構9は、搬出入部に戻
って基板2を受け取り、第1の処理ユニットの搬送エリ
ア外郭部材21の開口22の上方の基板受渡位置まで複
数の基板2を搬送して、第2基板搬送エリア19内に導
入するべくリフタ装置31に複数の基板2の受渡しを行
う。
Further, the plurality of substrates 2 transferred to the lifter device 31 of the second processing unit are
By means of 1, it is introduced into the second substrate transfer area 19. On the other hand, the empty transport mechanism 9 returns to the loading / unloading section, receives the substrate 2, and transports the plurality of substrates 2 to the substrate transfer position above the opening 22 of the transport area outer member 21 of the first processing unit. Then, the plurality of substrates 2 are transferred to the lifter device 31 so as to be introduced into the second substrate transfer area 19.

【0053】また、このように、第2基板搬送エリア1
8,19内にそれぞれ導入された複数の基板2はそれぞ
れ、その後の第1の処理ユニットおよび第2の処理ユニ
ットにおける各基板搬送および扉開閉さらに排気などの
各動作は、上記した第1の処理ユニットにおける薬液処
理および水洗処理のための各動作と同様に行われる。
Further, as described above, the second substrate transfer area 1
Each of the plurality of substrates 2 introduced into each of the first and second processing units 8 and 19 performs the operations of the first processing unit and the second processing unit, such as the transfer of each substrate, the opening and closing of the door, and the evacuation. The operations are performed in the same manner as the respective operations for the chemical solution treatment and the water washing treatment in the unit.

【0054】さらに、第2の処理ユニットのリフタ装置
31は、所定時間後の水洗処理後の複数の基板2を上昇
させ、それに連動するように開閉扉27が開き、水洗槽
15の上部開放口からその基板導入口24を通して複数
の基板2を保持した保持アーム32を上昇させ、その上
昇に連動するように開口部開閉扉26を開き、搬送エリ
ア外郭部材21の開口22を通して複数の基板2を保持
した保持アーム32を第2の処理ユニットの基板受渡位
置まで上昇させる。その基板受渡位置では、搬送機構9
が一対の保持板29をそれぞれ垂直方向の姿勢で待機し
ており、複数の基板2を保持した保持アーム32を一対
の保持板29の間の基板受渡位置に到着させた後に、一
対の保持板29の下端側をそれぞれ内側に回動させて、
複数の基板2の両側端面を両側からそれぞれ挾み込んで
各保持用溝で受けて保持することで基板2の搬送機構9
への受渡しを行う。
Further, the lifter device 31 of the second processing unit raises the plurality of substrates 2 after the rinsing process after a predetermined time, opens and closes the opening and closing door 27 in conjunction therewith, and opens the upper opening of the rinsing tank 15. Then, the holding arm 32 holding the plurality of substrates 2 is raised through the substrate introduction port 24, the opening / closing door 26 is opened so as to interlock with the raising, and the plurality of substrates 2 are transferred through the opening 22 of the transfer area outer member 21. The held holding arm 32 is raised to the substrate delivery position of the second processing unit. At the board delivery position, the transport mechanism 9
Waits for the pair of holding plates 29 in the vertical posture, respectively, and after the holding arm 32 holding the plurality of substrates 2 arrives at the substrate transfer position between the pair of holding plates 29, the pair of holding plates 29 By rotating the lower ends of the 29 inward,
The transport mechanism 9 of the substrate 2 is held by sandwiching both end surfaces of the plurality of substrates 2 from both sides and receiving and holding the holding grooves in the respective holding grooves.
Delivery to

【0055】その後、搬送機構9の一対の保持板29
は、乾燥槽25のリフタ装置35に対して第2の処理ユ
ニットの処理が終了した複数の基板2を受け渡す。ま
た、第1の処理ユニットのリフタ装置31から一対の保
持板29に対して第1の処理ユニットの処理が終了した
複数の基板2を受け取ってその一対の保持板29から第
2の処理ユニットのリフタ装置31に複数の基板2を受
け渡す。さらに、第2の処理ユニットのリフタ装置31
に受け渡された複数の基板2は第2基板搬送エリア19
内に導入されると共に、搬送機構9は、搬出入部に戻っ
て基板2を受け取り、第1の処理ユニットの開口22の
上方の基板受渡位置まで基板2を搬送して、第1の処理
ユニットのリフタ装置31に複数の基板2の受渡しを行
う。一方、乾燥処理部のリフタ装置31によって複数の
基板2を保持アーム32と共に下降させ、その下降に連
動させて開閉扉28を開いて乾燥槽25内に複数の基板
2が導入されて乾燥処理が行われる。
Thereafter, the pair of holding plates 29 of the transport mechanism 9
Transfers a plurality of substrates 2 that have been processed by the second processing unit to the lifter device 35 of the drying tank 25. Further, the plurality of substrates 2 on which the processing of the first processing unit has been completed are received from the lifter device 31 of the first processing unit to the pair of holding plates 29, and the pair of holding plates 29 are used to receive the plurality of substrates 2 of the second processing unit. The plurality of substrates 2 are delivered to the lifter device 31. Further, the lifter device 31 of the second processing unit
Are transferred to the second substrate transfer area 19
The transport mechanism 9 returns to the loading / unloading section to receive the substrate 2, and transports the substrate 2 to a substrate transfer position above the opening 22 of the first processing unit. Delivery of the plurality of substrates 2 to the lifter device 31 is performed. On the other hand, the plurality of substrates 2 are lowered together with the holding arm 32 by the lifter device 31 of the drying processing unit, and in conjunction with the lowering, the opening / closing door 28 is opened, and the plurality of substrates 2 are introduced into the drying tank 25 to perform the drying process. Done.

【0056】このようにして、第2基板搬送エリア1
8,19、乾燥処理部内にそれぞれ導入された複数の基
板2はそれぞれ、第1の処理ユニットおよび第2の処理
ユニット、乾燥処理部における各基板搬送および扉開閉
さらに排気などの各動作が行われる。
Thus, the second substrate transfer area 1
8, 19, each of the plurality of substrates 2 introduced into the drying processing unit is subjected to operations such as substrate transport in the first processing unit and the second processing unit, and substrate transport in the drying processing unit, opening and closing of the door, and exhausting. .

【0057】さらに、リフタ装置35によって再び、乾
燥槽25内からその上方の基板受渡位置まで乾燥処理後
の複数の基板2を上昇させて搬送機構9の一対の保持板
29間に受渡し、その搬送機構9によって乾燥処理後の
複数の基板2を搬出入部(図示せず)との基板受渡位置
まで各処理部の配設方向(X方向)に沿って複数の処理
済みの基板2を搬送して、搬出入部にその複数の処理済
みの基板2を受け渡す。
Further, the plurality of substrates 2 after the drying process are again lifted from the inside of the drying tank 25 to the substrate transfer position above the drying tank 25 by the lifter device 35, and are transferred between the pair of holding plates 29 of the transfer mechanism 9 and transferred. The plurality of substrates 2 after the drying process are transported by the mechanism 9 to the substrate delivery position with respect to the loading / unloading unit (not shown) along the arrangement direction (X direction) of each processing unit. Then, the plurality of processed substrates 2 are delivered to the loading / unloading section.

【0058】このように、搬送機構9の一対の保持板2
9は、乾燥槽25のリフタ装置35に対して第2の処理
ユニットの処理が終了した複数の基板2を受け渡すと共
に、第1の処理ユニットのリフタ装置31から第1の処
理ユニットの処理が終了した複数の基板2を受け取って
その一対の保持板29から第2の処理ユニットのリフタ
装置31に複数の基板2を受け渡す。さらに、第2の処
理ユニットのリフタ装置31に受け渡された複数の基板
2は第2基板搬送エリア19内に導入されると共に、搬
送機構9は、搬出入部に戻って複数の基板2を受け取
り、第1の処理ユニットの開口22の上方の基板受渡位
置まで基板2を搬送して、第1の処理ユニットのリフタ
装置31に複数の基板2の受渡しを行う。以上の各動作
が、上記したように順次繰り返されて複数の基板2に対
して所定の処理が行われることになる。
As described above, the pair of holding plates 2 of the transport mechanism 9
9 transfers the plurality of substrates 2 that have been processed by the second processing unit to the lifter device 35 of the drying tank 25, and performs processing of the first processing unit from the lifter device 31 of the first processing unit. The plurality of substrates 2 that have been completed are received, and the plurality of substrates 2 are transferred from the pair of holding plates 29 to the lifter device 31 of the second processing unit. Further, the plurality of substrates 2 delivered to the lifter device 31 of the second processing unit are introduced into the second substrate transport area 19, and the transport mechanism 9 returns to the loading / unloading section to receive the plurality of substrates 2. Then, the substrate 2 is transported to the substrate transfer position above the opening 22 of the first processing unit, and the plurality of substrates 2 are transferred to the lifter device 31 of the first processing unit. The above operations are sequentially repeated as described above, and a predetermined process is performed on the plurality of substrates 2.

【0059】以上のように、リフタ装置31(第2搬送
手段)および搬送機構(第1搬送手段)9を同一側に配
設したため、それらの基板保持部分である保持アーム3
2や一対の保持板29が前方に突き出た片持ち構造をし
ていることから、それらの可動根本部分のギャップ分
や、多数の重い基板2を保持して撓む分だけ下方に傾く
ことになるが、複数の基板2の受渡し時に、リフタ装置
31の保持アーム32および搬送機構9の一対の保持板
29の傾き方向(撓み方向)が同一となる。このため、
それらの互いの相対的な傾きが従来のように加算されず
大幅に相殺され、受け渡される基板保持溝の配列ピッチ
と、保持された基板ピッチとの不一致分も大幅に相殺さ
れて互いにより整合することから、各基板保持部分から
の基板2の脱落を防止することができて、より安定した
基板2の受け渡しとすることができる。
As described above, since the lifter device 31 (second transfer means) and the transfer mechanism (first transfer means) 9 are disposed on the same side, the holding arm 3 serving as a substrate holding portion thereof is provided.
Since the two or a pair of holding plates 29 have a cantilever structure protruding forward, they can be tilted downward by an amount corresponding to the gap between their movable root portions and the amount by which a large number of heavy substrates 2 are held and bent. However, when the plurality of substrates 2 are delivered, the holding arm 32 of the lifter device 31 and the pair of holding plates 29 of the transport mechanism 9 have the same inclination direction (deflection direction). For this reason,
The relative inclination of each other is not added as in the conventional case, but is largely cancelled, and the mismatch between the transferred substrate holding groove arrangement pitch and the held substrate pitch is also largely canceled out, making them more aligned with each other. Therefore, it is possible to prevent the substrate 2 from falling off from each substrate holding portion, and it is possible to more stably transfer the substrate 2.

【0060】また、リフタ装置31および搬送機構9を
同一側に配設したため、同一側から一人の作業者によっ
てリフタ装置31および搬送機構9の各基板保持部分の
基板2の取り合いを共に調整することができて、そのメ
ンテナンス作業をよりスムーズで的確に行うことができ
る。また、リフタ装置31および搬送機構9を同一側に
配設して他方にはリフタ装置31がないため、各処理槽
のメンテナンスを容易に行うことができる。
Further, since the lifter device 31 and the transfer mechanism 9 are disposed on the same side, one operator from the same side can adjust the connection of the substrate 2 of each substrate holding portion of the lifter device 31 and the transfer mechanism 9 together. The maintenance work can be performed more smoothly and accurately. Further, since the lifter device 31 and the transport mechanism 9 are disposed on the same side and the other does not include the lifter device 31, maintenance of each processing tank can be easily performed.

【0061】なお、本実施形態では、基板処理エリア1
7および第2基板搬送エリア18,19内の雰囲気を排
気手段23によって排気ダクト37を介して排気するよ
うに構成し、排気手段23の排気ポンプ39の排気出力
制御は、開口22および各基板導入口24の開閉に応じ
て行うと共に、薬液槽12,14から水洗槽13,15
に至る一連の第2基板搬送エリア18,19内の基板搬
送時に、薬液の付いた複数の基板2からのヒュームを排
気するべく、排気出力を高めるように行ったが、これに
限らず、薬液槽12,14と水洗槽13,15と第2基
板搬送エリア18,19とでそれぞれ異なる排気手段を
設け、それらの排気手段を上記のように排気出力制御し
てもよい。この場合に、薬液槽12,14と水洗槽1
3,15の基板処理エリア17内の排気出力制御ではヒ
ューム自体が異なりそれに応じた排気出力制御(例えば
ヒューム濃度が薄ければ排気出力も低出力でよい)とす
るように、それぞれ異なる各排気手段を制御することが
できる。また、基板処理エリア17内や第2基板搬送エ
リア18,19内の排気出力制御では、開口部開閉扉2
6や基板導入口開閉扉27が開いたときに最も高い排気
出力とし、その後は、ヒューム拡散がない程度に徐々に
出力低下させるようにし、また、第2基板搬送エリア1
8,19での排気出力制御で、薬液槽12,14から第
2基板搬送エリア18,19内に取り出されたときに最
も高い排気出力とし、その後は、ヒューム拡散がない程
度に徐々に出力低下させるように、それぞれ異なる各排
気手段を制御することができる。
In this embodiment, the substrate processing area 1
7 and the atmosphere in the second substrate transfer areas 18 and 19 are exhausted by the exhaust means 23 through the exhaust duct 37. The exhaust output of the exhaust pump 39 of the exhaust means 23 is controlled by the opening 22 and the introduction of each substrate. This is performed according to the opening and closing of the port 24, and the washing tanks 13 and 15 are
During the transfer of the substrate in the series of second substrate transfer areas 18 and 19 leading to the above, the exhaust output was increased in order to exhaust the fumes from the plurality of substrates 2 with the chemical solution, but the present invention is not limited to this. Different exhaust means may be provided for the tanks 12 and 14, the rinsing tanks 13 and 15, and the second substrate transfer areas 18 and 19, and the exhaust outputs may be controlled as described above. In this case, the chemical tanks 12, 14 and the washing tank 1
In the exhaust power control in the substrate processing areas 3 and 15, the fumes themselves are different, and different exhaust means are used so that the exhaust output is controlled accordingly (for example, the exhaust output may be low if the fume concentration is low). Can be controlled. In the exhaust output control in the substrate processing area 17 and the second substrate transfer areas 18 and 19, the opening / closing door 2
6 and the substrate introduction port opening / closing door 27 are opened, the exhaust gas output is set to be the highest, and thereafter, the output is gradually reduced to such an extent that there is no fume diffusion.
In the exhaust gas output control at steps 8 and 19, the exhaust gas output is set to the highest when taken out of the chemical solution tanks 12 and 14 into the second substrate transfer areas 18 and 19, and thereafter, the output gradually decreases to the extent that fume diffusion does not occur. In such a manner, different exhaust means can be controlled.

【0062】また、本実施形態では、複数の基板2を一
括して処理するバッチ式の基板処理装置に、リフタ装置
31および搬送機構9を同一側に配設する本発明を適応
した場合について説明したが、基板2を一枚づつ処理す
る枚様式の基板処理装置にも本発明は適用可能である。
In this embodiment, a case is described in which the present invention in which the lifter device 31 and the transfer mechanism 9 are arranged on the same side is applied to a batch type substrate processing apparatus for processing a plurality of substrates 2 at a time. However, the present invention is also applicable to a substrate processing apparatus of a sheet type for processing the substrates 2 one by one.

【0063】[0063]

【発明の効果】以上のように本発明の請求項1によれ
ば、第1搬送手段および第2搬送手段は、各々複数の処
理槽に対して同一側に配設されているので、それらの基
板保持部分が前方に突き出た片持ち構造をしていること
で、それらの可動根本部分のギャップ分や、多数の重い
基板を保持して撓む分だけ下方に傾くことになるが、複
数の基板の受渡し時に、第1搬送手段および第2搬送手
段の各基板保持部分の互いの相対的な傾きが従来のよう
に加算されず大幅に相殺され、受け渡される基板保持溝
の配列ピッチと、保持された基板ピッチとの不一致分も
大幅に相殺されて互いにより整合することから、各基板
保持部分からの基板の脱落を防止することができて、よ
り安定した基板受け渡しとすることができる。また、同
一側から一人の作業者によって第1搬送手段および第2
搬送手段の各基板保持部分の基板の取り合いを調整する
ことができて、そのメンテナンス作業をよりスムーズで
的確に行うことができる。
As described above, according to the first aspect of the present invention, the first transfer means and the second transfer means are disposed on the same side with respect to the plurality of processing tanks, respectively. Since the substrate holding portion has a cantilever structure that protrudes forward, it is inclined downward by an amount corresponding to the gap between the movable root portions and the amount by which a large number of heavy substrates are held and bent. At the time of delivery of the substrate, the relative inclinations of the respective substrate holding portions of the first transfer means and the second transfer means are not added as in the related art, but are largely offset, and the arrangement pitch of the transferred substrate holding grooves, Since the inconsistency with the held substrate pitch is largely canceled out and the substrates are more aligned with each other, it is possible to prevent the substrate from falling off from each substrate holding portion, and to achieve more stable substrate delivery. Also, the first transport means and the second transport means are operated by one operator from the same side.
The arrangement of the substrates in the substrate holding portions of the transfer means can be adjusted, and the maintenance work can be performed more smoothly and accurately.

【0064】また、本発明の請求項2によれば、第1搬
送手段と第2搬送手段との間で基板の受け渡しを行う際
に、第1搬送手段の一対の保持部の間で第2搬送手段の
可動保持部が上下移動するので、第1搬送手段と第2搬
送手段とが接触するようなこともなく、基板の受け渡し
がスムーズに行うことができる。
According to the second aspect of the present invention, when a substrate is transferred between the first transporting means and the second transporting means, the second transporting means is provided between the pair of holding portions of the first transporting means. Since the movable holding portion of the transfer means moves up and down, the first transfer means and the second transfer means do not come into contact with each other, and the transfer of the substrate can be performed smoothly.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態の基板処理装置の概略要部
構成を示す斜視図である。
FIG. 1 is a perspective view illustrating a schematic main configuration of a substrate processing apparatus according to an embodiment of the present invention.

【図2】図1の基板処理装置のAA断面部分を背面から
見た概略要部構成図である。
FIG. 2 is a schematic main part configuration diagram of a section AA of the substrate processing apparatus of FIG. 1 as viewed from the back.

【図3】図2のリフタ装置と搬送機構との基板受渡し状
態の概略構成を示す斜視図である。
FIG. 3 is a perspective view showing a schematic configuration of a substrate transfer state between the lifter device and a transport mechanism in FIG. 2;

【図4】図2のリフタ装置と搬送機構との基板受渡し状
態の概略構成を示す側面図である。
FIG. 4 is a side view illustrating a schematic configuration of a substrate delivery state between the lifter device and a transport mechanism in FIG. 2;

【図5】図4のリフタ装置の保持アームと搬送機構の保
持板の傾きを示す図である。
FIG. 5 is a view showing the inclination of a holding arm of the lifter device of FIG. 4 and a holding plate of the transport mechanism.

【図6】従来の基板処理装置における要部の概略構成を
示す模式図である。
FIG. 6 is a schematic diagram showing a schematic configuration of a main part in a conventional substrate processing apparatus.

【図7】図5のリフタ装置と搬送ロボットとの基板受渡
し状態の概略構成を示す側面図である。
FIG. 7 is a side view illustrating a schematic configuration of a substrate delivery state between the lifter device and the transfer robot in FIG. 5;

【図8】図7のリフタ装置の保持アームと搬送機構の保
持板の傾きを示す図である。
FIG. 8 is a diagram showing the inclination of a holding arm of the lifter device of FIG. 7 and a holding plate of the transport mechanism.

【符号の説明】[Explanation of symbols]

1 基板処理装置 2 基板 5 基板処理ユニット 9 搬送機構 12,14 薬液槽 13,15 水洗槽 16 槽外郭部材 17 基板処理エリア 18,19 第2基板搬送エリア 20 第1基板搬送エリア 21,40 搬送エリア外郭部材 22,41 開口 23 排気手段 24 基板導入口 25 乾燥槽 26 開口部開閉扉 27,28 導入口開閉扉 29 保持板 31,35 リフタ装置 32 保持アーム 37 排気ダクト 38 流量調整バルブ 39 排気ポンプ 42 開閉扉 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate 5 Substrate processing unit 9 Transport mechanism 12, 14 Chemical solution tank 13, 15 Rinse tank 16 Tank outer member 17 Substrate processing area 18, 19 Second substrate transport area 20 First substrate transport area 21, 40 Transport area Outer shell members 22, 41 Opening 23 Exhaust means 24 Substrate introduction port 25 Drying tank 26 Opening opening / closing door 27, 28 Inlet opening / closing door 29 Holding plate 31, 35 Lifter device 32 Holding arm 37 Exhaust duct 38 Flow control valve 39 Exhaust pump 42 Door

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 基板に所定の処理を行う基板処理装置に
おいて、 所定方向に配列され、かつ各々に基板を浸漬させるため
の処理液が貯溜された複数の処理槽と、 前記複数の処理槽に沿って基板を搬送させる第1搬送手
段と、 上下移動可能であって、前記第1搬送手段と前記処理槽
内との間で基板を搬送させる第2搬送手段とを備え、 前記第1搬送手段および前記第2搬送手段は、各々前記
複数の処理槽に対して同一側に配設されたことを特徴と
する基板処理装置。
1. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a plurality of processing tanks arranged in a predetermined direction and each storing a processing liquid for immersing the substrate therein; A first transfer unit that transfers the substrate along the first transfer unit; and a second transfer unit that is vertically movable and transfers the substrate between the first transfer unit and the processing tank. And the second transfer means is disposed on the same side of each of the plurality of processing tanks.
【請求項2】 請求項1に記載の基板処理装置におい
て、 前記第1搬送手段は、基板を保持するための一対の保持
部を備え、 前記第2搬送手段は、前記第1搬送手段と第2搬送手段
との間で基板の受け渡しを行う際に、前記一対の保持部
の間で上下移動可能であって、基板を保持するための可
動保持部を備えたことを特徴とする基板処理装置。
2. The substrate processing apparatus according to claim 1, wherein the first transfer unit includes a pair of holding units for holding a substrate, and the second transfer unit includes a pair of the first transfer unit and the first transfer unit. 2. A substrate processing apparatus, comprising: a movable holding unit that can move up and down between the pair of holding units when transferring a substrate to and from the two transfer units, and that holds a substrate. .
JP7219398A 1998-03-20 1998-03-20 Substrate processing device Pending JPH11268827A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7219398A JPH11268827A (en) 1998-03-20 1998-03-20 Substrate processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7219398A JPH11268827A (en) 1998-03-20 1998-03-20 Substrate processing device

Publications (1)

Publication Number Publication Date
JPH11268827A true JPH11268827A (en) 1999-10-05

Family

ID=13482146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7219398A Pending JPH11268827A (en) 1998-03-20 1998-03-20 Substrate processing device

Country Status (1)

Country Link
JP (1) JPH11268827A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100359635C (en) * 2003-02-26 2008-01-02 大日本屏影象制造株式会社 Substrate processing apparatus
JP2010073796A (en) * 2008-09-17 2010-04-02 Nippon Electric Glass Co Ltd Device and method for conveying plate-like body
US8293128B2 (en) 2003-09-18 2012-10-23 Nec Corporation Apparatus for processing substrate and method of doing the same
CN103311166A (en) * 2012-03-09 2013-09-18 大日本网屏制造株式会社 Substrate processing apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100359635C (en) * 2003-02-26 2008-01-02 大日本屏影象制造株式会社 Substrate processing apparatus
US8293128B2 (en) 2003-09-18 2012-10-23 Nec Corporation Apparatus for processing substrate and method of doing the same
US8663488B2 (en) 2003-09-18 2014-03-04 Gold Charm Limited Apparatus for processing substrate and method of doing the same
JP2010073796A (en) * 2008-09-17 2010-04-02 Nippon Electric Glass Co Ltd Device and method for conveying plate-like body
CN103311166A (en) * 2012-03-09 2013-09-18 大日本网屏制造株式会社 Substrate processing apparatus
JP2013187463A (en) * 2012-03-09 2013-09-19 Dainippon Screen Mfg Co Ltd Substrate processing apparatus

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