TW201328810A - 玻璃板之切斷方法、及玻璃板之切斷裝置 - Google Patents

玻璃板之切斷方法、及玻璃板之切斷裝置 Download PDF

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Publication number
TW201328810A
TW201328810A TW101141791A TW101141791A TW201328810A TW 201328810 A TW201328810 A TW 201328810A TW 101141791 A TW101141791 A TW 101141791A TW 101141791 A TW101141791 A TW 101141791A TW 201328810 A TW201328810 A TW 201328810A
Authority
TW
Taiwan
Prior art keywords
region
cutting
line
glass sheet
heating light
Prior art date
Application number
TW101141791A
Other languages
English (en)
Chinese (zh)
Inventor
Isao Saito
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201328810A publication Critical patent/TW201328810A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
TW101141791A 2011-11-14 2012-11-09 玻璃板之切斷方法、及玻璃板之切斷裝置 TW201328810A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011249158A JP2015016998A (ja) 2011-11-14 2011-11-14 ガラス板の切断方法、及びガラス板の切断装置

Publications (1)

Publication Number Publication Date
TW201328810A true TW201328810A (zh) 2013-07-16

Family

ID=48429453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101141791A TW201328810A (zh) 2011-11-14 2012-11-09 玻璃板之切斷方法、及玻璃板之切斷裝置

Country Status (3)

Country Link
JP (1) JP2015016998A (ja)
TW (1) TW201328810A (ja)
WO (1) WO2013073386A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2017016396A (es) * 2015-06-22 2018-03-02 Philip Morris Products Sa Conector con una pluralidad de bordes de corte.
DE112020005006T5 (de) * 2019-11-21 2022-07-07 AGC Inc. Glasplattenbearbeitungsverfahren, glasplatte
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统
KR102451414B1 (ko) * 2021-03-11 2022-10-07 주식회사 세린컴퍼니 반도체 완전 절단을 위한 레이저빔 조사 장치 및 그 동작 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54171639U (ja) * 1978-05-22 1979-12-04
JPH1034364A (ja) * 1996-07-25 1998-02-10 Souei Tsusho Kk 複数点熱源による脆性材料の割断加工方法
JP2002178179A (ja) * 2000-12-12 2002-06-25 Sony Corp 割断装置及びその方法
JP2011011972A (ja) * 2009-06-05 2011-01-20 Lemi Ltd 脆性材料割断装置および脆性材料割断方法

Also Published As

Publication number Publication date
WO2013073386A1 (ja) 2013-05-23
JP2015016998A (ja) 2015-01-29

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