TW201327741A - 半導體裝置、光半導體裝置及散熱構件 - Google Patents

半導體裝置、光半導體裝置及散熱構件 Download PDF

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Publication number
TW201327741A
TW201327741A TW101149106A TW101149106A TW201327741A TW 201327741 A TW201327741 A TW 201327741A TW 101149106 A TW101149106 A TW 101149106A TW 101149106 A TW101149106 A TW 101149106A TW 201327741 A TW201327741 A TW 201327741A
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TW
Taiwan
Prior art keywords
meth
adhesive
mounting substrate
semiconductor device
optical semiconductor
Prior art date
Application number
TW101149106A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshio Terada
Yusuke Komoto
Kenji Furuta
Midori Tojo
Junichi Nakayama
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201327741A publication Critical patent/TW201327741A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52—Amides or imides
    • C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/58—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C08F226/08—N-Vinyl-pyrrolidine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW101149106A 2011-12-22 2012-12-21 半導體裝置、光半導體裝置及散熱構件 TW201327741A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011281904 2011-12-22

Publications (1)

Publication Number Publication Date
TW201327741A true TW201327741A (zh) 2013-07-01

Family

ID=48668294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149106A TW201327741A (zh) 2011-12-22 2012-12-21 半導體裝置、光半導體裝置及散熱構件

Country Status (5)

Country Link
JP (1) JP6271122B2 (ja)
KR (1) KR101958049B1 (ja)
CN (1) CN104040712A (ja)
TW (1) TW201327741A (ja)
WO (1) WO2013094395A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103398305A (zh) * 2013-07-25 2013-11-20 宁波市爱使电器有限公司 一种高密封高散热的led灯

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013159760A (ja) * 2012-02-08 2013-08-19 Daio Paper Corp 熱伝導性粘着シート
JP2015050257A (ja) * 2013-08-30 2015-03-16 株式会社東芝 車両用電力変換装置及び鉄道車両
WO2015035575A1 (en) * 2013-09-11 2015-03-19 Dow Global Technologies Llc Multi-phase elastomeric thermally conductive materials
KR102199986B1 (ko) * 2014-02-17 2021-01-08 엘지이노텍 주식회사 발광 장치
TWI646706B (zh) * 2015-09-21 2019-01-01 隆達電子股份有限公司 發光二極體晶片封裝體
US10193030B2 (en) * 2016-08-08 2019-01-29 General Electric Company Composite materials having red emitting phosphors
JP7077526B2 (ja) * 2016-12-16 2022-05-31 東洋インキＳｃホールディングス株式会社 複合部材
JP7024377B2 (ja) * 2017-12-19 2022-02-24 住友金属鉱山株式会社 放熱シートとその製造方法および放熱シートの使用方法
JP7085843B2 (ja) * 2018-01-05 2022-06-17 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性成形体及びその製造方法
CN112180659A (zh) * 2019-07-04 2021-01-05 无锡视美乐激光显示科技有限公司 一种马达、波长转换装置、光源光机系统和激光投影装置
KR102678188B1 (ko) * 2023-12-26 2024-06-25 (주)드림솔 반도체 가스킷용 방열 시트

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217369A (ja) * 2004-02-02 2005-08-11 Three M Innovative Properties Co 発光ダイオード装置用接着シート及び発光ダイオード装置
CN101140915B (zh) * 2006-09-08 2011-03-23 聚鼎科技股份有限公司 散热衬底
JP2010007039A (ja) * 2008-05-26 2010-01-14 Sekisui Chem Co Ltd 熱伝導シート
JP5423455B2 (ja) * 2010-02-09 2014-02-19 日立化成株式会社 熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置
JP2011162706A (ja) * 2010-02-12 2011-08-25 Nitto Denko Corp 熱伝導性粘着シートの製造方法
JP2011199055A (ja) * 2010-03-19 2011-10-06 Toshiba Lighting & Technology Corp 放熱シートおよびこの放熱シートを用いた電子機器
JP2011204495A (ja) 2010-03-26 2011-10-13 Panasonic Corp 光源装置及び画像表示装置
JP5450216B2 (ja) * 2010-04-06 2014-03-26 日本ジッパーチュービング株式会社 薄肉粘着性熱伝導シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103398305A (zh) * 2013-07-25 2013-11-20 宁波市爱使电器有限公司 一种高密封高散热的led灯
CN103398305B (zh) * 2013-07-25 2015-11-25 宁波市爱使电器有限公司 一种高密封高散热的led灯

Also Published As

Publication number Publication date
JP2013149952A (ja) 2013-08-01
CN104040712A (zh) 2014-09-10
JP6271122B2 (ja) 2018-01-31
WO2013094395A1 (ja) 2013-06-27
KR20140108523A (ko) 2014-09-11
KR101958049B1 (ko) 2019-03-13

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