TW201314977A - Method of forming LED heat dissipation substrate - Google Patents

Abstract

A method of forming an LED heat dissipation substrate comprises: (a) forming a plurality of corresponding circuit electrodes on two opposite sides of a substrate by sputtering, wherein a plurality of conductor layers are formed on one side of the substrate, and the conductor layers are respectively located on one side of on circuit electrode; (b) polishing the circuit electrodes and conductor layers on one side of the substrate by chemical mechanical polishing (CMP); and (c) performing chemical coating to attach a layer of silver or gold metal surface on the circuit electrodes and conductor layers on undergoing the CMP process in step (b). As such, this invention increases light extraction efficiency and reduces the resistance of each circuit electrode to lower electrical consumption.

Description

LED heat dissipation substrate forming method

The invention relates to a method for forming a heat dissipation substrate for an LED, in particular to a method for forming a circuit electrode and a conductor layer by sputtering, and then polishing the circuit electrode and the conductor layer by chemical mechanical polishing. A method for forming an LED heat-dissipating substrate having a metal surface such as silver or gold adhered to the circuit electrode and the conductor layer by electroless plating.

Since the light-emitting diode has the characteristics of low power consumption and long life, in recent years, the brightness of the light-emitting diode has been gradually improved, and the application of the high-brightness light-emitting diode has gradually replaced the traditional electric bulb, fluorescent lamp, and the like. It will become the mainstream lighting component in the future.

At present, a solid crystal substrate applied to a light-emitting diode die is printed on a substrate by printing to form a circuit electrode and a reflective layer, and then applied to the light-emitting diode, and then applied to the wire and package. The process is completed to form a finished product of the light-emitting diode.

Since the above-mentioned circuit electrode and reflective layer are printed on the substrate by screen printing, when microscopically, it can be found that the surface of the circuit electrode and the reflective layer is rough, except that the efficiency of the reflected light source is lost, resulting in impairment. In addition to its brightness, the circuit electrodes printed by screen printing have unstable resistance between conductive particles and high impedance, so they are more power-consuming in application, and their shortcomings are obvious, and improvement is necessary.

In view of this, the inventors of the present invention have researched and innovated to disclose the molding method of the LED heat dissipation substrate of the present invention.

The object of the present invention is to provide a method for molding an LED heat dissipation substrate, which comprises:

(a) forming circuit electrodes corresponding to each other in an array on opposite sides of a substrate by sputtering, and forming a plurality of conductor layers on at least one side of the substrate, and each of the conductor layers is located at a One of the group circuit electrodes;

(b) polishing the respective sets of circuit electrodes and conductor layers on one side of the substrate by a chemical mechanical polishing [CMP];

(c) the substrate is subjected to electroless plating (electroplating or autocatalytic plating), and the circuit electrodes and the conductor layers are polished by CMP in the above step (b). A layer of silver or gold metal is plated to enhance the light-emitting efficiency of the present invention and to reduce the resistance of each group of circuit electrodes, and to reduce power consumption.

The LED heat dissipation substrate formed by the method for forming the LED heat dissipation substrate is used to carry, for example, a light emitting diode [LED], an organic light emitting diode [OLED], a polymer light emitting diode [PLED], The invention does not limit the scope of its application.

The method for molding an LED heat dissipation substrate according to the present invention, wherein the substrate is a ceramic substrate, an aluminum nitride substrate, etc., and the present invention does not limit the material of the substrate.

The method for molding an LED heat dissipating substrate according to the present invention, wherein the step (a) is such that the substrate is deposited on the substrate by multiple sputtering to form each of the circuit electrodes and the conductor layer; Since the sputtering method is performed multiple times, each of the circuit electrodes and the conductor layer can be more closely attached to the substrate, and the advantage of being easily detached is obtained.

According to the method for molding an LED heat dissipating substrate disclosed in the present invention, since the finally obtained LED heat dissipating substrate has a metal surface of silver or gold with a light-emitting efficiency attached to the conductor layer, a better projection brightness can be obtained, and each group can be obtained. Since the circuit electrode is adhered to a metal such as gold or silver having high conductivity, the power consumption can be reduced, and the use efficiency of the power can be improved, and the advantages thereof can be exhibited, and the industrial use can be utilized.

The desirable entities of the present invention can be clarified by the following description and the accompanying drawings.

Please refer to the first, second and third figures. The present invention relates to a method for forming an LED heat dissipation substrate, which comprises:

(a) forming circuit electrodes (12a, 12b) corresponding to each other in an array on opposite sides of a substrate (11) by sputtering, and forming a plurality of conductors on at least one side of the substrate (11) a layer (13), wherein each of the conductor layers (13) is located on one side of a group of circuit electrodes (12a, 12b);

(b) polishing the respective sets of circuit electrodes (12a, 12b) and the conductor layer (13) on one side of the substrate (11) by a chemical mechanical polishing (CMP) method;

(c) the substrate (11) is subjected to chemical plating (or electroless plating, or autocatalytic plating), in the above step (b), by CMP polishing The circuit electrodes (12a, 12b) and the conductor layer (13) are plated with a silver or gold metal surface (14) to enhance the light-emitting efficiency of the present invention and reduce the resistance of each set of circuit electrodes (12a, 12b). To reduce power consumption.

The LED heat dissipation substrate formed by the method for forming the LED heat dissipation substrate is used to carry, for example, a light emitting diode [LED], an organic light emitting diode [OLED], a polymer light emitting diode [PLED], The invention does not limit the scope of its application.

The method for molding an LED heat dissipation substrate according to the present invention, wherein the substrate (11) is a ceramic substrate, an aluminum nitride substrate, etc., and the present invention does not limit the material of the substrate (11).

The method for molding an LED heat dissipation substrate according to the present invention, wherein in the step (a), the substrate (11) is deposited on the substrate (11) by multiple sputtering to form each of the circuit electrodes ( 12a, 12b) and conductor layer (13); since the present invention employs multiple sputtering methods, each of the circuit electrodes (12a, 12b) and the conductor layer (13) can be more closely attached to the substrate (11) On the top, the advantage of not easy to fall off is obtained.

According to the method for molding an LED heat dissipating substrate disclosed in the present invention, since the finally obtained LED heat dissipating substrate has a silver or gold metal surface (14) with a light-emitting efficiency better on the conductor layer (13), a better investment can be obtained. The brightness of the circuit, and the circuit electrodes (12a, 12b) of each group adhere to the metal surface (14) such as gold or silver with high conductivity, so that the power loss can be reduced, and the use efficiency of the power can be improved, and the advantages are obtained. And the use of the industry.

The method disclosed in the present invention can be modified and applied without departing from the spirit and scope of the invention, and the invention is not limited.

(11). . . Substrate

(12a) (12b). . . Circuit electrode

(13). . . Conductor layer

(14). . . Metal surface

First Figure: A manufacturing flow diagram of the present invention.

Second: is a plan view of the LED heat sink substrate formed by the present invention.

Third: is a cross-sectional structural view of the present invention when the sputtering step is completed.

Figure 4 is a cross-sectional structural view of the present invention after completion of the final step.

(11). . . Substrate

(12a) (12b). . . Circuit electrode

(13). . . Conductor layer

(14). . . Metal surface

Claims (6)

A method for molding an LED heat dissipating substrate comprises: (a) forming, on a opposite side of a substrate, a circuit electrode corresponding to an array by sputtering, and forming at least one conductor on at least one side of the substrate a layer, wherein each of the conductor layers is located on one side of a set of circuit electrodes; (b) chemically mechanically polishing each set of circuit electrodes and conductor layers on one side of the substrate; and (c) The substrate is electrolessly plated, and in the step (b), the polished circuit electrode and the conductor layer are plated with a metal surface. The method for molding an LED heat dissipating substrate according to claim 1, wherein the substrate is a ceramic substrate. The method for molding an LED heat dissipating substrate according to claim 1, wherein the substrate is obtained by using an aluminum nitride substrate. The method for molding an LED heat dissipating substrate according to claim 1, wherein in the step (a), the substrate is deposited on the substrate by multiple sputtering to form each of the circuit electrodes and the conductor layer. By. The method for molding an LED heat dissipating substrate according to claim 1, wherein in the step (c), a metal surface of a layer of silver is plated on each of the circuit electrodes and the conductor layer by electroless plating. The method for molding an LED heat dissipating substrate according to claim 1, wherein in the step (c), a metal surface of the metal is plated on each of the circuit electrodes and the conductor layer by electroless plating.