CN104347780B - A kind of substrate and its manufacturing process of chip on board - Google Patents
A kind of substrate and its manufacturing process of chip on board Download PDFInfo
- Publication number
- CN104347780B CN104347780B CN201310340146.6A CN201310340146A CN104347780B CN 104347780 B CN104347780 B CN 104347780B CN 201310340146 A CN201310340146 A CN 201310340146A CN 104347780 B CN104347780 B CN 104347780B
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- China
- Prior art keywords
- substrate
- chip
- board
- manufacturing process
- lead wire
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Abstract
The present invention provides a kind of substrate manufacturing process of chip on board comprising following steps: insulating layer being arranged on substrate；Insulating layer is performed etching to form route；Setting includes the electroplate lead wire with coupling part and extension；Electroplating processes are carried out to the substrate；The extension is eliminated using etching technics.The substrate manufacturing process of chip on board provided by the invention, because it is corroded the extension for being located at the electroplate lead wire of base plate bottom adjacent edges, it is eliminated this part, so as to avoid there is a phenomenon where discharge between electroplate lead wire and copper seat, eliminate the limitation to the maximum power-on voltage of chip on board, anti- high pressure characteristics are improved, so that the illuminating effect of LED light is further improved.The present invention also provides utilize a kind of substrate of chip on board made from this manufacturing process.
Description
Technical field
The present invention relates to LED illumination device technical fields, more specifically to a kind of manufacture of the substrate of chip on board
Technique, the invention further relates to utilize a kind of substrate of chip on board made from this manufacturing process.
Background technique
With the continuous development of semiconductor illumination technique, the abbreviation of LED(English Light-Emitting Diode shines
Diode) lamp more and more enters in various lighting areas.
The main luminous component of LED light is the chip on board for being provided with LED, substrate 01(such as Fig. 1 and Fig. 2 of chip on board)
Using aluminium base as substrate, during production, it is necessary first in one layer insulating of aluminium base or copper-based upper bonding, then to insulation
Copper is covered on layer to perform etching, and to form route, then silver-plated operation is carried out on substrate 01 by way of plating, in silver-plated operation
In need that electroplate lead wire 02 is arranged on the insulating layer, the different chips 03 on substrate are connected, as shown in Figure 3.
But in the prior art, electroplate lead wire 02 is in addition to the coupling part 021 being arranged between different chips 03,
Also there are one section of extensions 022, this extension 022 extends near the bottom margin of substrate 01, and is used for LED light
Chip on board be to be arranged on copper seat, when onboard chip is powered on, the plating at 01 bottom margin of substrate is drawn
The extension 022 of line 02 is easy to discharge with base copper seat, to limit plate due to close apart from base copper seat
The maximum power-on voltage of upper chip, anti-high pressure characteristics are poor, and then affect the illuminating effect of LED light.
Therefore, the illuminating effect for how improving LED light, is a problem to be solved by those skilled in the art.
Summary of the invention
In view of this, the present invention provides a kind of substrate manufacturing process of chip on board, can be avoided electroplate lead wire with
It discharges between copper seat, so as to improve the illuminating effect of LED light.
In order to achieve the above object, the invention provides the following technical scheme:
A kind of substrate manufacturing process of chip on board comprising following steps:
1) insulating layer is set on substrate；
2) insulating layer is performed etching to form route；
3) setting includes the electroplate lead wire with coupling part and extension；
4) electroplating processes are carried out to the substrate；
5) extension is eliminated using etching technics.
Preferably, in the substrate manufacturing process of above-mentioned chip on board, the substrate is aluminium base or Copper base material.
Preferably, in the substrate manufacturing process of above-mentioned chip on board, the electroplating processes are that plating sets silver on the substrate
Layer.
The substrate manufacturing process of chip on board based on above-mentioned offer, the present invention also provides a kind of bases of chip on board
Plate, the substrate are fabricated using the substrate manufacturing process of chip on board described above.
In the substrate manufacturing process of chip on board provided by the invention, insulating layer is set on substrate first, then exhausted
Edge layer upward wiring road, i.e., perform etching insulating layer, and extra insulating layer is eroded, to form route, after the completion of etching again
Electroplate lead wire is set on the insulating layer, wherein the coupling part of electroplate lead wire is for connecting different chips, later to substrate into
Row electroplating processes are finally eliminated the extension for being located at base plate bottom adjacent edges using etching technics.
The substrate manufacturing process of chip on board provided by the invention, because of its plating that will be located at base plate bottom adjacent edges
The extension of lead is corroded, this part is eliminated, and is discharged so as to avoid between electroplate lead wire and copper seat
The phenomenon that, the limitation to the maximum power-on voltage of chip on board is eliminated, anti-high pressure characteristics are improved, so that the illumination of LED light
Effect is further improved.The present invention also provides utilize a kind of substrate of chip on board made from this manufacturing process.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the top view (not set electroplate lead wire) of the substrate for the chip on board that the prior art provides；
Fig. 2 is the left view of Fig. 1；
Fig. 3 is the top view (setting electroplate lead wire) of substrate；
Fig. 4 is the flow chart of the substrate manufacturing process of chip on board provided in an embodiment of the present invention；
Fig. 5 is the top view of substrate made from the substrate manufacturing process provided in an embodiment of the present invention using chip on board.
In figure 1 above-Fig. 5:
Substrate 01, electroplate lead wire 02, coupling part 021, extension 022, chip 03；
Substrate 1, electroplate lead wire 2, coupling part 21, chip 3.
Specific embodiment
The present invention provides a kind of substrate manufacturing process of chip on board, can be avoided and send out between electroplate lead wire and copper seat
Raw electric discharge, so as to improve the illuminating effect of LED light.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in figure 4, the substrate manufacturing process of chip on board provided in an embodiment of the present invention comprising following steps:
S101, insulating layer is bonded on substrate；
S102, insulating layer is performed etching to form route；
S103, setting includes the electroplate lead wire 2 with coupling part 21 and extension on the insulating layer；
S104, electroplating processes are carried out to substrate 1；
S105, extension is corroded using etching technics, this extension is eliminated from substrate 1.
In the substrate manufacturing process of chip on board provided in this embodiment, insulating layer is set on substrate first, is then existed
Insulating layer upward wiring road, i.e., perform etching insulating layer, and extra insulating layer is eroded, to form route, after the completion of etching
Electroplate lead wire 2 is set on the insulating layer again, and wherein the coupling part 21 of electroplate lead wire 2 is right later for connecting different chips 3
Substrate 1 carries out electroplating processes, is finally eliminated using etching technics by the extension near 1 bottom margin of substrate is located at.
The substrate manufacturing process of chip on board provided in this embodiment carries out twice etching operation, to will be located at substrate 1
The extension of electroplate lead wire 2 near bottom margin is corroded, and is eliminated this part, so as to avoid electroplate lead wire
There is a phenomenon where discharging between 2 and copper seat, the limitation to the maximum power-on voltage of chip on board 3 is eliminated, anti-high pressure is improved
Characteristic, so that the illuminating effect of LED light is further improved.
Preferably, the substrate of substrate 1 is aluminium base or Copper base material.Aluminium or copper are because aluminium or copper are equal as substrate
With good thermal diffusivity, the heat generated when chip on board 3 can work distributes in time.
Specifically, electroplating processes are that plating sets silver layer on substrate 1.Plating, which sets silver layer, on substrate 1 can be improved the light out of LED
Rate and reliability.
The present embodiment additionally provides a kind of substrate of chip on board, which is the base using chip on board described above
Plate manufacturing process is fabricated.
Since the substrate uses the substrate manufacturing process of chip on board provided by the above embodiment, so substrate is by plate
The substrate manufacturing process bring beneficial effect of chip please refers to corresponding part in above-described embodiment, and details are not described herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (3)
1. a kind of substrate manufacturing process of chip on board, which comprises the following steps:
1) insulating layer is set on substrate；
2) insulating layer is performed etching to form route；
3) setting includes the electroplate lead wire (2) with coupling part (21) and extension, and the coupling part (21) is for connecting
Connect different chips (3)；
4) electroplating processes are carried out to the substrate (1)；
5) extension near substrate (1) bottom margin will be located at using etching technics to eliminate.
2. the substrate manufacturing process of chip on board according to claim 1, which is characterized in that the substrate be aluminium base or
Copper base material.
3. the substrate manufacturing process of chip on board according to claim 1 or 2, which is characterized in that the electroplating processes are
Plating sets silver layer on the substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310340146.6A CN104347780B (en) | 2013-08-06 | 2013-08-06 | A kind of substrate and its manufacturing process of chip on board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310340146.6A CN104347780B (en) | 2013-08-06 | 2013-08-06 | A kind of substrate and its manufacturing process of chip on board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347780A CN104347780A (en) | 2015-02-11 |
| CN104347780B true CN104347780B (en) | 2018-12-04 |
Family
ID=52502954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310340146.6A Active CN104347780B (en) | 2013-08-06 | 2013-08-06 | A kind of substrate and its manufacturing process of chip on board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104347780B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1277458A (en) * | 1999-06-10 | 2000-12-20 | 索尼化学株式会社 | Producing method of relay base plate for installation of semi-conductor elements |
| CN101146403A (en) * | 2006-09-12 | 2008-03-19 | 日月光半导体制造股份有限公司 | Pressing base board bar |
-
2013
- 2013-08-06 CN CN201310340146.6A patent/CN104347780B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1277458A (en) * | 1999-06-10 | 2000-12-20 | 索尼化学株式会社 | Producing method of relay base plate for installation of semi-conductor elements |
| CN101146403A (en) * | 2006-09-12 | 2008-03-19 | 日月光半导体制造股份有限公司 | Pressing base board bar |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104347780A (en) | 2015-02-11 |
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