TW201307504A - 用於拋光之結構元件 - Google Patents

用於拋光之結構元件 Download PDF

Info

Publication number
TW201307504A
TW201307504A TW101121028A TW101121028A TW201307504A TW 201307504 A TW201307504 A TW 201307504A TW 101121028 A TW101121028 A TW 101121028A TW 101121028 A TW101121028 A TW 101121028A TW 201307504 A TW201307504 A TW 201307504A
Authority
TW
Taiwan
Prior art keywords
polishing
adhesive layer
monomer
weight
glass transition
Prior art date
Application number
TW101121028A
Other languages
English (en)
Chinese (zh)
Inventor
Jun Fujita
Yusuke Saito
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201307504A publication Critical patent/TW201307504A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW101121028A 2011-06-13 2012-06-13 用於拋光之結構元件 TW201307504A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011131587A JP5851124B2 (ja) 2011-06-13 2011-06-13 研磨用構造体

Publications (1)

Publication Number Publication Date
TW201307504A true TW201307504A (zh) 2013-02-16

Family

ID=47357676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121028A TW201307504A (zh) 2011-06-13 2012-06-13 用於拋光之結構元件

Country Status (5)

Country Link
JP (1) JP5851124B2 (ru)
KR (1) KR20140051212A (ru)
CN (1) CN103596729B (ru)
TW (1) TW201307504A (ru)
WO (1) WO2012173885A2 (ru)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
CN106470800B (zh) * 2014-07-07 2019-06-18 阪东化学株式会社 研磨膜
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6545261B2 (ja) 2014-10-17 2019-07-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
CN108290267B (zh) 2015-10-30 2021-04-20 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6976048B2 (ja) * 2015-11-30 2021-12-01 日東電工株式会社 研磨パッド固定用粘着シート
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112171532A (zh) * 2020-08-26 2021-01-05 南京航空航天大学 一种自由曲面加工用弹性铣抛工具及其制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220838A (ja) * 1989-02-22 1990-09-04 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
JP3354744B2 (ja) * 1995-04-25 2002-12-09 ニッタ株式会社 研磨布及びその研磨布の研磨機定盤への脱着方法
BR9808152A (pt) * 1997-03-07 2000-03-28 Minnesota Mining & Mfg Artigo abrasivo, sistema para polimento de vidro, processo para o polimento de uma peça e de um artigo de vidro, e, aparelho compreendendo um tubo de raios catódicos
US6077601A (en) * 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
JP2000071170A (ja) * 1998-08-28 2000-03-07 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
WO2001045900A1 (en) * 1999-12-23 2001-06-28 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US6706383B1 (en) * 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
US7169199B2 (en) * 2002-11-25 2007-01-30 3M Innovative Properties Company Curable emulsions and abrasive articles therefrom
JP4351007B2 (ja) * 2003-09-08 2009-10-28 東洋ゴム工業株式会社 研磨パッド
JP4898172B2 (ja) * 2005-09-08 2012-03-14 日本ミクロコーティング株式会社 研磨パッド及びその製造方法並びに研磨方法
JP2007138015A (ja) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd 粘着剤及びそれを用いた粘着シート
JP5702912B2 (ja) * 2008-11-21 2015-04-15 積水化学工業株式会社 粘着剤及び研磨布固定用両面粘着テープ
JP5656379B2 (ja) * 2009-03-03 2015-01-21 日立マクセル株式会社 ダイシング用粘着フィルム、及び半導体素子の製造方法
JP2011044461A (ja) * 2009-08-19 2011-03-03 Nitta Corp レーザーダイシング用粘着テープ
JP2011074308A (ja) * 2009-10-01 2011-04-14 Three M Innovative Properties Co 透明粘着シート及びそれを含む画像表示装置

Also Published As

Publication number Publication date
JP5851124B2 (ja) 2016-02-03
WO2012173885A2 (en) 2012-12-20
CN103596729B (zh) 2017-01-18
WO2012173885A3 (en) 2013-05-02
JP2013000809A (ja) 2013-01-07
KR20140051212A (ko) 2014-04-30
CN103596729A (zh) 2014-02-19

Similar Documents

Publication Publication Date Title
TW201307504A (zh) 用於拋光之結構元件
TWI545170B (zh) Protective sheet for glass etching
CN107267080B (zh) 表面保护片
KR101643798B1 (ko) 구조화된 연마 물품 및 이의 사용 방법
EP0822884B1 (en) A polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine
TWI421934B (zh) 拋光半導體晶圓的方法
US20130059506A1 (en) Fixed abrasive pad with surfactant for chemical mechanical planarization
US20130295821A1 (en) Abrasive article with replicated microstructured backing and method of using same
KR101783406B1 (ko) 연마 패드 및 이의 제조방법
JP6671908B2 (ja) 研磨パッド
US20150217424A1 (en) Incorporating additives into fixed abrasive webs for improved cmp performance
JP6832222B2 (ja) 両面粘着テープ及びその製造方法
JP5328467B2 (ja) 研磨布固定用両面粘着テープ
JP2007245276A (ja) 研磨パッド固定用両面テープ
JP5315678B2 (ja) 研磨パッドの製造方法
JP5575363B2 (ja) 研磨パッド
JP2005056920A (ja) 研磨パッド
JP2018051733A (ja) 研磨パッド及びその製造方法、並びに、研磨加工品の製造方法
JP4535675B2 (ja) 両面粘着シート
JP3220606U (ja) 研磨装置用の定盤及び研磨装置
KR102173453B1 (ko) 디스플레이 연마용 세정 패드 및 이의 제조방법
JP2021008006A (ja) 研磨材
JP2024003595A (ja) 両面粘着シート
JP2019058984A (ja) 保持パッドの製造に用いるための積層体及びその製造方法
JP2012071386A (ja) 研磨パッド