TW201301430A - Placing method of circuit board - Google Patents

Abstract

A placing method of circuit board mainly applied to the package process of the flip chip carrier board, which comprises: providing at least one printed circuit board disposed on an identifiable unit, a plurality of sub-boards, and a plurality of positioning targets. The sub-boards include flawless sub-boards, flawed sub-board, and position target. Detect the mark of the flawed sub-board on the printed circuit board and record the address as well as the position information of each sub-board to separately form the first and second detection information; match the identifiable unit on the printed circuit board to save the two detection information into the numeric database; read the identifiable unit on the printed circuit board to obtain from the numeric database corresponding two detection information, and carrying out, according to two detection information, the subsequent object placement with the grain being exactly positioned and combined. Therefore, the placing machine can quickly acquire the detection information without self-detection of flawed sub-board address and sub-board position information.

Description

Circuit board mounting method

The invention relates to a circuit board mounting method, in particular to a circuit board mounting method for directly reading a data storage library and storing the position information of the board and the position information of each sub board.

The conventional circuit board is a large-area motherboard, but as electronic devices such as PDAs, cell phones, or digital cameras become smaller and smaller, the size of the circuit substrate also shrinks. For the sake of production efficiency, the industry has combined most of the small circuit boards (also known as daughter boards) into a large circuit board (also known as multi-board) to facilitate the subsequent mass production process.

Since the small circuit boards may be inconsistent with the electrical continuity (ie, circuit characteristics such as open circuit and short circuit) due to variations in the process during the manufacturing process, the small circuit boards listed as defective products are artificially The method of setting a bad mark on the small circuit boards, so that the subsequent picking process can obtain the relevant information according to the detection, avoiding the bad circuit board to avoid the component mounting. On the bad sub-boards.

Another consideration is that there must be a fixed spacing between the two sub-boards on the multi-plate, in order to meet the precision requirements of the subsequent surface-adhesive component placement, but there is a difference between manufacturing and material shrinkage between the two sub-boards. Distance error, the accumulated error after the multi-plate combination will cause the placement accuracy of the surface-adhesive component, so the subsequent production machine (such as the pick-up machine, die bonder) need to be additionally targeted The local fiducial mark of each sub-plate is visually recognized to correct the above-mentioned error value to meet the high precision (±10 μm) requirement.

At present, the production process of the entire multi-panel device is first completed by the multi-plate manufacturer, and the defective product mark is produced on the multi-joint board, and then transferred to the packaging manufacturer's pick-up machine for the defective product mark and sub- The board positioning target is tested, and the high-precision package of the die can be performed after the detection is completed. However, after the conventional device is loaded into the multi-plate, the position of the fiducial mark is first performed by using a mobile camera, and the camera is used for analyzing and detecting the defective product or positioning the target. (local fiducial mark) identification detection operation, in order to ensure the subsequent high-precision packaging of the die.

In other words, after the acquisition machine takes multiple boards, it does not directly perform the packaging operation, but must first perform the 瑕疵 and position analysis on each multi-plate. This additional recognition processing time will increase the multi-board entry. When the machine is made, the traditional pick-up machine uses the program to check the bad sub-board. As the number of boards increases, it will inevitably lead to a significant increase in the production time of the machine, resulting in the production line. The rate of utilization is greatly reduced (about 10%-30%).

The main object of the present invention is to provide a circuit board mounting method for detecting the position information of the printed circuit board and the sub-board spacing error position by using an independent detecting device before the printed circuit board performs the placing process. The detection information is stored in the data database, so that the subsequent processing process can read the data database according to the serial number of the printed circuit board, directly obtain the corresponding detection information, and then process, thereby reducing the waiting for the detection before the traditional parting process. It takes time to increase the productivity of the overall production capacity.

To achieve the above object, the circuit board mounting method of the present invention comprises the following steps: (A) providing at least one printed circuit board having an identifiable unit, a plurality of sub-boards, and a plurality of positioning targets, wherein The daughter board includes a scorpion-free board belonging to a good product, a scorpion board belonging to a defective product, and a positioning target, and the scorpion board is provided with a defective product mark; (B) providing a visual detecting and analyzing device for detecting the printed circuit a board address having a defective product mark on the board, and forming a first view information on the address of the board, and storing the first view information corresponding to the identifiable unit of the printed circuit board in a data file (C) detecting and analyzing the positioning target of the printed circuit board and each sub-board by the visual inspection and analysis device, analyzing the position information of each sub-board to form a second viewing information, and displaying the second viewing information And the (D) providing a scanning device for assembling with the subsequent device, wherein The reading device reads the identifiable unit of the printed circuit board, and the corresponding first viewing information and the second viewing information are obtained by the setting machine in the data database, and according to the first viewing information and the second viewing information, A plurality of dies are accurately positioned to bond to each of the scorpion-free boards of the corresponding printed circuit board.

Wherein, the printed circuit board and the plurality of sub-boards respectively have a set of two diagonally opposite positioning targets, and a midpoint coordinate is obtained between the two diagonally opposite positioning targets, and then the printed circuit board and the plurality of sub-boards are obtained. The midpoint coordinates are compared to each other to form positional information for each sub-board.

Before the step (A), further comprising a marking step of setting the identifiable unit to one side of the printed circuit board by using one of laser, attaching or printing, wherein the identifiable unit is set as a one-dimensional barcode Or one of the identification marks of the two-dimensional barcode; the marking step further includes setting a defective product mark on the electronic board belonging to the defective product.

Step (B) further includes scanning the serial number of the printed circuit board by the identification unit.

In the first preferred embodiment, the step (B) and the step (C) are to generate the first view information and the second view information through a visual inspection and analysis device.

In a possible embodiment, the visual inspection and analysis device includes an image detection unit and a control operation unit, and the image detection unit is configured to capture the position of the surface of the printed circuit board and the positioning plate on the daughter board. The control unit is configured to process the fingerprint address on the captured image and analyze each positioning target to obtain position information of each of the sub-boards.

Wherein, the image detecting unit captures a full image of the printed circuit board, and the control computing unit analyzes the color contrast of the defective product mark on the dieboard in the image and the other non-tweezers board to determine the flaw of the printed circuit board. The daughter board address is used to form the first view information described above.

The image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, and the range image includes a printed circuit board and at least one sub-board positioning target, and detects the positioning target in the range image The second position information is formed by analyzing the position information of each of the sub-boards on the printed circuit board to form the second view information; and the range image is another full image of the printed circuit board, and detecting all the positioning targets in the whole image, The position information of each sub-board on the printed circuit board is analyzed to form the second view information.

In another possible embodiment, the visual inspection and analysis device includes a linear scanner, an image detecting unit, and a control computing unit, wherein the linear scanner is configured to capture a surface of the printed circuit board. The image detecting unit is configured to capture a positioning target on the surface image of the printed circuit board, and the control computing unit is configured to process the image of the daughterboard on the captured image and analyze each positioning target to obtain each daughter board. Location information.

Wherein, the linear scanner captures a full image of the printed circuit board, and the control computing unit analyzes the color contrast of the defective product mark on the dieboard in the image with other non-tweezers, to determine the dice of the printed circuit board. The board position is used to form the first view information described above.

The image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, and the range image includes a printed circuit board and at least one sub-board positioning target, and detects the positioning target in the range image And analyzing the position information of each sub-board on the printed circuit board to form the second view information; and the range image may further capture the full image of the printed circuit board, and detecting all the positioning targets in the full image, The position information of each sub-board on the printed circuit board is analyzed to form the second view information.

In the above two possible embodiments, the image detecting unit uses a photosensitive coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) image sensor.

In a preferred embodiment, the image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, and the range image includes a printed circuit board and at least one sub-board positioning target, and the detecting The positioning target in the range image is used to analyze the position information of each sub-board on the printed circuit board to form the second view information.

In another possible embodiment, the image of the range may be a full image of the printed circuit board, and all the positioning targets in the whole image are detected to analyze the position information of each sub-board on the printed circuit board to form The above second viewing information.

In the preferred embodiment, the image detecting unit can also adopt a photosensitive coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) image sensor.

In addition, in the first and second preferred embodiments, the step (C) is to generate the second view information through a visual inspection and analysis device, and the step (D) is to obtain a corresponding first view through a set device. Information and second viewing information, and the precise positioning of a plurality of dies to the corresponding printed circuit board.

In a possible embodiment, the data database is configured as an independent system, and the first inspection information, the second inspection information, and the identifiable unit are transmitted through the network by the visual inspection and analysis device and the device. The network includes at least one regional network and one wide area network.

In another possible embodiment, the data database is installed in the inside of the device, and the visual inspection and analysis device transmits the first view information, the second view information, and the identifiable unit through a network. The road includes at least one regional network and one wide area network.

In a further embodiment, the data database is installed in the visual inspection and analysis device, and the first device, the second view information, and the identifiable unit are transmitted through the network with the device. At least one regional network and one wide area network.

The invention stores the serial number on the printed circuit board by the identification device through the pre-detection operation and stores the detection information in the data database, and cooperates with an identification device assembled on the subsequent device, and then transmits the corresponding data on the printed circuit board. The processing of the printed circuit board must be information to the placing machine, so that the placing machine can directly carry out subsequent precise processing of the parts, thus reducing the time required to wait for the detection before the traditional packaging factory parting process, and improving the overall production capacity. Rate of utilization.

In order to make the reviewer easy to understand other features, contents and advantages of the present invention, the effects of the device and the method thereof are more apparent. The present invention will be described in detail with reference to the accompanying drawings: Please refer to FIG. In a preferred embodiment, the circuit board mounting method of the present invention mainly comprises the following steps: Step (A): providing at least one printed circuit board 11 having an identifiable unit 13 and a plurality of sub-boards 12 and Positioning targets 11a, 11b, 12a, 12b, wherein the sub-board 12 includes a defect-free tweezers plate 122, a tweezers plate 121 belonging to a defective product, and positioning targets 12a, 12b; and step (B): detecting The defective product mark 123 belonging to the die board 121 on the printed circuit board 11 forms a first view information on the address of the die board 121, and corresponds the first view information to the identifiable unit of the printed circuit board 11. 13 is stored in a data database 16; step (C): detecting the positioning target 11a, 11b, 12a, 12b of the printed circuit board 11 and each of the sub-boards 12, and analyzing the position information Y of each sub-board 12 to form a second inspection And storing the second view information corresponding to the identifiable unit 13 of the printed circuit board 11 in the data database 16; and step (D): providing a scanning device to be assembled with the subsequent device, and reading by the scanning device Taking the identifiable unit 13 of the printed circuit board 11 , the first viewing information and the second viewing information are obtained by the setting machine in the data database 16 , and the plurality of viewing information and the second viewing information are obtained according to the first viewing information and the second viewing information. The dies are accurately positioned and bonded to each of the raftless boards 122 of the corresponding printed circuit board 11.

First, regarding the step (A), please refer to the schematic diagram of the printed circuit board 11 shown in FIG. 2, wherein the printed circuit board 11 has a plurality of sub-boards 12 arranged in a matrix matrix arrangement, and has a sequence at one side position. Each of the printed circuit boards 11 has a unique serial number, and the printed circuit board 11 and each of the sub-boards 12 are respectively provided with positioning targets 11a, 11b, 12a for confirming the position. And 12b, and because of the yield problem on the production, there is a good scorpion-free board 122 and a scorpion board 121 belonging to a defective product; wherein the identifiable unit 13 is laser, printed or attached One of the methods is disposed on the sub-board 12, and the serial number can be obtained by scanning the identifiable unit 13, and the identifiable unit 13 is set as one of the one-dimensional barcode or the two-dimensional barcode.

In order to facilitate the detection of the subsequent steps, the printed circuit board 11 provided in the step (A) may further include a defective product mark 123 disposed on the die board 121, wherein the defective product mark 123 has a predetermined size, for example, 1×1. (mm ² ) or 4 × 4 (mm ² ) size, but not limited to any shape, and the above-mentioned defective product mark 123 mainly adopts a high contrast to facilitate the accuracy of image analysis.

The method of the defective product mark 123 is first to determine a plurality of sub-boards 12 on the printed circuit board 11 through an electrical detecting device, and then the sub-board 12 is divided into the dice plate 121 and the tweezers-free board 122 according to the detection result. The above-described scorpion plate 121 can be disposed on the scorpion plate 121 by one of laser, printing or attaching; thus, the detecting machine 10 (as shown in FIG. 3) can be quickly The defective product mark 123 is detected to obtain the forceps plate 121, so that the subsequent setting machine can perform the processing on the non-tweezer plate 122 based on the measured detection data.

Since the dieboard 121 is generated in a random number position, the position of the dieboard 121 on each of the printed circuit boards 11 is different, and therefore, as described in the prior art, the printed circuit board must be detected before the placement process. 11 The address of the upper die board 121. Therefore, the detection of the address of the die board 121 on the printed circuit board 11 which is defective in the step (B) will depend on whether the daughter board 12 of the printed circuit board 11 has The defective product mark 123 is divided into two different detection methods.

Referring to FIG. 3, if the sub-board 12 has the defective product mark 123, the step (B) is to detect the address of the die board 121 belonging to the defective product by a visual inspection and analysis device 15, in the first preferred embodiment. The visual inspection and analysis device 15 includes an image detecting unit 151 for capturing the surface of the printed circuit board 11 and a control unit 152 for processing the defective product mark 123 on the captured image. And form the first view information.

In one embodiment, the image detecting unit 151 is one of a Photocoupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS). The image detecting unit 151 has a predetermined resolution and a predetermined magnification and captures an image of the printed circuit board 11 at a predetermined working distance WD.

For example, the image resolution of the image detecting unit 151 of the present invention may be 768×576 pixels, and the spatial resolution formed by the lens may be 0.25 to 0.5. The mm/pixel is used, and the working distance WD can be 200 to 700 mm (mm); however, this is only for convenience of illustration and does not limit the structure of the image sensor.

Referring to FIG. 2, the present invention mainly utilizes the visual inspection and analysis device 15 of a larger field of view to perform the image capturing operation of the printed circuit board 11 in accordance with the condition of the corresponding predetermined working distance WD, so that the image detecting unit 151 can once The complete full image of the printed circuit board 11 is captured, and the complete full image captured by the control operation unit 152 is used to determine the row and address of the daughter board 121.

In the control arithmetic unit 152, the entire image of the printed circuit board 11 is set in advance to 3×5 rows and columns 111 of the same size, and the control arithmetic unit 152 analyzes whether each of the row and column blocks 111 in the image has The highly contrasting defective product mark 123, and the defective product mark 123 is highly contrasting, and the subsequent setter determines the address of the daughterboard 121 on the printed circuit board 11.

Then, the address of the board 121 is formed into a first view information, and the first view information corresponding to the printed circuit board 11 can be transmitted to the data database 16 by the serial number of the identification unit 13 to facilitate subsequent device functions to the data. The database 16 captures the address of the board 121.

For example, the present invention can sequentially define the horizontal axis direction of the row and column block 11 from left to right as a, b, c, d, ..., and the vertical axis direction from bottom to top as 1, 2, 3, 4 In the embodiment shown in the figure, b2, c3, and d1 on the printed circuit board 11 have the height contrast of the defective product mark 123. Therefore, the control arithmetic unit 152 will rank the row and column data b2, c3, and d1. The address is defined as a block that skips machining, so that the subsequent device can avoid the placement of the dieboard 121, thereby reducing the generation of waste. However, the above-mentioned 3×5 row and column blocks 111 are only used for convenience of description, and are not limited, that is, the row and column block 111 may be provided with a plurality of blocks of the same size.

In the second preferred embodiment, the visual inspection and analysis device 15 includes a linear scanner that captures a surface image of the printed circuit board 11 and a control arithmetic unit 152 that processes the surface image captured by the linear scanner. The daughter board 121 address is formed to form the first view information, and the first view information corresponding to the printed circuit board 11 can be transmitted to the data library 16 by the serial number of the identification unit 13. However, the address analysis program of the die board 121 of this embodiment is the same as the foregoing preferred embodiment, and therefore will not be described again.

In a preferred embodiment, the linear scanner has a working distance WD of 5 to 30 mm, and the image of the printed circuit board 11 is captured, and the image analysis operation of the linear scanner and the image inspection are performed. The unit 151 is the same and will not be described here.

The step (B) of the foregoing various embodiments further includes scanning the serial number of the printed circuit board 11 by the identifiable unit 13 so that the subsequent detection of the first view information can be stored in the serial number corresponding to the printed circuit board 11. The data database 16 facilitates the subsequent processing of the processing information by the subsequent processing machine, thereby reducing the time consuming to wait for the production line waiting for the inspection before the installation.

Please refer to FIG. 2A, and consider the shrinkage of the printed circuit board 11 and the daughter board 12 and the smaller and smaller size, and the line width between the boards has reached the nanometer level. The accuracy of the piece, the error of the distance between the printed circuit board 11 and the daughter board 12 must be considered, so each positioning target 11a, 11b, 12a, 12b (local fiducial mark) is for the detection machine 10 to quickly locate. The positions of the targets 11a, 11b, 12a, 12b are determined to determine the position information Y required by each of the sub-boards 12, so that the setting machine can perform the setting according to the position information Y, that is, the setting machine does not have the factor board 12 The distance is offset and the component is placed on the daughter board 12 in an inaccurate position. To this end, the printed circuit board 11 is provided with a plurality of positioning targets 11a, 11b at opposite diagonal angles, and each of the sub-boards 12 also has a set of two diagonally opposite positioning targets 12a, 12b, respectively. two oblique diagonal positioning target 11a, 11b, 12a, obtains the X coordinate of a midpoint between 12b _1, X _2, the printed circuit board through the midpoint of the coordinates X 11 and _a midpoint coordinate of each sub-plate 12 X _{2 is} compared with each other to form position information Y of each sub-board.

Therefore, with respect to the step (C), the present invention detects each of the positioning targets 11a, 11b, 12a, and 12b of the printed circuit board 11 by a visual inspection and analysis device 15 to analyze the position information Y of each of the sub-boards 12, The visual inspection and analysis device 15 includes an image detecting unit 151 for capturing a plurality of positioning targets 11a, 11b, 12a, and 12b on the printed circuit board 11 and a control computing unit 152 for processing each of the captured images. The positioning targets 12a, 12b of the board 12 are analyzed and the position information Y is obtained.

In a preferred embodiment, the image detecting unit 151 captures a range image of the printed circuit board 11 and the plurality of sub-boards 12 by a predetermined range, and the range of the image includes a printed circuit board 11 and at least one set of sub-boards 12 The positioning targets 12a, 12b are detected, and the positioning targets 12a, 12b in the range image are detected to analyze the position information Y of the sub-boards 12 at each position on the printed circuit board 11 to form a second viewing information, and the second viewing view is performed. The information corresponding to the serial number of the identifiable unit 13 of the printed circuit board 11 is stored in the data database 16.

The image capture unit 11 captures the image of a set of positioning targets 11a and 11b of the printed circuit board 11 through the image detecting unit 151, and the captured image is processed by the control computing unit 152 to obtain two oblique diagonals of the printed circuit board 11. The positioning targets 11a and 11b jointly form an inclination angle θ ₁ , and then obtain a midpoint coordinate X ₁ between the two positioning targets 11 a and 11 b , and then pass through the image detecting unit 151 to extract the upper left corner sub-board 12 again. A range image of the positioning targets 12a, 12b is obtained, and the tilt angle θ ₂ and the midpoint coordinate X _{2 of the} positioning targets 12a, 12b are obtained, and the two midpoint coordinates X ₁ , X ₂ are calculated by the control operation unit 152. The position information Y is formed, and then the control operation unit 152 continues to perform the image of the sub-board 12 in the next predetermined range until the position information Y of all the sub-boards 12 on the printed circuit board 11 is analyzed, and then the sub-boards 12 are obtained. The position information Y and other information (θ ₁ , θ ₂ , X ₁ , X ₂ , ...) are integrated to form the second view information.

Finally, the second viewing information corresponding to the printed circuit board 11 can be transmitted to the data database 16 by the serial number of the identification unit 13, so that the subsequent setting machine can directly capture the position information Y to the data database 16 for setting. Therefore, the subsequent setting machine can accurately place the components on the sub-board 12, thereby achieving the effect of accurate placement. However, the range of images of the predetermined range of sub-boards 12 is only used for convenience of illustration, and is not limited, that is, the predetermined range can capture a range of images of the plurality of sub-boards 12.

In another preferred embodiment, the image of the range may be a full image of the printed circuit board 11, and the positioning targets 11a, 11b, and 12a of all the printed circuit boards 11 and 12 of the whole image are detected. 12b, analyzing the position information Y of each position sub-board 12 on the printed circuit board 11 to form a second view information, and storing the second view information corresponding to the serial number of the identifiable unit 13 of the printed circuit board 11 The above data database 16. In this embodiment, the image detecting unit 151 has a high image resolution sensor and is matched with the working distance WD, and can capture the entire image of the printed circuit board 11 at one time, and analyze all the daughter boards on the full image through the control computing unit 152. The position information Y of the positioning targets 12a and 12b of 12 is integrated to form the second viewing information of each sub-board 12 after analysis, and the second viewing information corresponding to the printed circuit board 11 can be identified. The serial number of the unit 13 is stored in the above data repository 16. However, the position information Y analysis program of this embodiment is the same as the foregoing preferred embodiment, and therefore will not be described again.

Furthermore, please refer to FIG. 3, the first view information and the second view information obtained in the foregoing steps (B) and (C) are stored in a data database 16 of a separate system, and the data database 16 is introduced. The first view information, the second view information, and the serial number of the identifiable unit 13 are received and transmitted through the network between the visual inspection and analysis device 15 and the device.

Referring to another preferred embodiment shown in FIG. 3A, the first view information and the second view information obtained in the foregoing steps (B) and (C) are stored in a data database 16a located inside the set machine. The data database 16a receives the first view information, the second view information, and the serial number of the identifiable unit 13 through a network route visual inspection analyzing device 15.

Referring to the further preferred embodiment shown in FIG. 3B, the first view information and the second view information obtained in the step (B) and the step (C) are stored in a data database located in the visual inspection and analysis device 15. 16b. The data database 16b transmits the first view information, the second view information, and the serial number of the identifiable unit 13 to the setter through a network.

In the foregoing three embodiments, the network includes at least a regional network and a wide area network, and the data database 16, 16a, 16b may also be a subsequent processing machine completed by the network connection.

With respect to the step (D), the present invention provides a scanning device for assembly with a subsequent device, and the identifiable unit 13 of the printed circuit board 11 is read by the scanning device to obtain a serial number corresponding to the printed circuit board 11. The machine picks up the corresponding first view information and the second view information according to the serial number to the data database 16, and the first view information and the second view information of the set machine are provided by the data database 16, then the device will According to the provided first and second viewing information, the address of the dieboard 121 is avoided and the corresponding processing position is fine-tuned, and the plurality of crystal grains are accurately positioned and coupled to each of the non-twisted boards 122 corresponding to the printed circuit board 11. .

In summary, the present invention stores the serial number on the printed circuit board by the identification device by pre-detecting the operation and storing the detection information in the data database, and with an identification device assembled on the subsequent setting machine. Data database transfer corresponds to the processing of the printed circuit board must be information to the machine, so that the machine can directly carry out subsequent precision processing, so as to reduce the time required to wait for the test before the traditional package factory To increase the utilization rate of the overall production capacity.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalents of the present invention and the equivalents thereof are all included in the present invention. Within the scope of protection, it is given to Chen Ming.

10. . . Testing machine

11. . . A printed circuit board

11a. . . Targeting target

11b. . . Targeting target

111. . . Row block

12. . . Daughter board

121. . . Scorpion board

122. . . Tweezers-free board

123. . . Bad product mark

12a. . . Targeting target

12b. . . Targeting target

13. . . Can be identified

15. . . Visual inspection and analysis device

151. . . Image detection unit

152. . . Control arithmetic unit

16. . . Data library

16a. . . Data library

16b. . . Data library

WD. . . Working distance

θ ₁ . . . slope

θ ₂ . . . slope

X ₁ . . . Midpoint coordinates

X ₂ . . . Midpoint coordinates

Y. . . Location information

Figure 1 is a schematic flow chart of the device of the present invention;

Figure 2 is a schematic diagram of the analysis of the defective product of the present invention;

2A is a schematic diagram of location information analysis of the present invention;

Figure 3 is a schematic diagram of a preferred embodiment of the data repository of the present invention;

3A is a schematic diagram of another preferred embodiment of the data repository of the present invention;

Figure 3B is a schematic diagram of still another preferred embodiment of the data repository of the present invention.

Claims (9)

A circuit board mounting method is mainly applied to a packaging process of a flip chip carrier, comprising: (A) providing at least one printed circuit board having an identifiable unit, a plurality of sub-boards, and a plurality of positioning targets The sub-board includes a non-tweezer plate belonging to a good product, a scorpion plate belonging to a defective product, and the above-mentioned positioning target, and the scorpion plate is provided with a defective product mark; (B) providing a visual inspection and analysis device Detecting the address of the board with the defective product mark on the printed circuit board, and forming the first view information of the address of the board, and correspondingly the first view information to the identifiable unit of the printed circuit board Stored in a data database; (C) detecting and analyzing the positioning target of the printed circuit board and each sub-board by the visual inspection and analysis device, analyzing the position information of each sub-board to form a second viewing information, and The second viewing information is stored in the data database corresponding to the identifiable unit of the printed circuit board; and (D) providing a scanning device for subsequent setting The device is assembled, and the identifiable unit of the printed circuit board is read by the scanning device, and the first viewing information and the second viewing information are obtained by the setting machine in the data database, and the first viewing information and the first viewing information are obtained. Second, the information is displayed, and a plurality of crystal grains are accurately positioned and coupled to each of the non-twisted boards corresponding to the printed circuit board. The circuit board mounting method according to claim 1, wherein the printed circuit board and the plurality of sub-boards respectively have a set of two diagonally opposite positioning targets, and between the two diagonally opposite positioning targets A midpoint coordinate is obtained, and the midpoint coordinates of the printed circuit board and the plurality of sub-boards are compared with each other to form position information of each sub-board. The circuit board mounting method according to claim 1, wherein the step (A) further comprises a marking step of setting the identifiable unit to the above by one of laser, attaching or printing. On the side of the printed circuit board, the defective product mark is placed on the sub-board belonging to the defective product. The circuit board mounting method according to claim 1, wherein the visual inspection and analysis device comprises an image detecting unit for capturing a positioning target on the board and the daughter board on the surface of the printed circuit board. And a control computing unit, processing the image of the daughterboard address on the captured image and analyzing each of the positioning targets to obtain the position information of each of the daughter boards. The circuit board mounting method according to claim 4, wherein the image detecting unit captures a full image of the printed circuit board, and the control computing unit analyzes the defective product mark on the dieboard in the image and other The color contrast of the dieboard is used to determine the first board view information by determining the address of the board of the printed circuit board. The method of claim 4, wherein the image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, wherein the range image comprises a printed circuit board and at least A positioning target of the sub-board detects the positioning target in the image in the range to analyze the position information of each sub-board on the printed circuit board to form the second viewing information. The method of claim 1, wherein the visual inspection and analysis device uses a linear scanner to capture a surface image of the printed circuit board, and the control unit processes the defective product on the captured image. Marking, the image detecting unit captures the surface image of the printed circuit board, and the control computing unit processes the positioning target of the printed circuit board and the plurality of sub-boards. The circuit board mounting method according to claim 7, wherein the linear scanner captures a full image of the printed circuit board, and the control unit analyzes the defective product mark and other flaws on the dieboard in the image. The color contrast of the daughter board is used to determine the first board view information by determining the board address of the printed circuit board. The method of claim 7, wherein the image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, wherein the range image comprises a printed circuit board and at least A positioning target of the sub-board detects the positioning target in the image in the range to analyze the position information of each sub-board on the printed circuit board to form the second viewing information.