201247365 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種加工由硬脆性結晶材料所形成之塊 體即柱狀體之外周面之裝置。再者，所謂「硬跪性」係指 雖具有非常高之硬度但不耐衝擊而易開裂之性質。 【先前技術】 成為各種半導體基板之由硬脆性結晶材料所形# 圓，一般係利用線鋸或帶鋸等將該結 ‘ 切斷，立後，姆η4 aa材抖之塊體較薄地 ^触或精研磨而獲得。此時，若於 塊體之表層存在微小龜裂，則於上述之切斷或去角加: 時微小龜裂成為基點而產生開裂或碎屑，良 即便於晶圓形成後之後步驟中，微小龜其， 龜裂》作為藉由研磨”0材=::體之表層不存在微小 時之開裂切外周部而防止切斷 公報中裂切肩的方法’例如提出於日本專利第3973⑷ 於曰本專利第3973843公報中，例矛 塊。結晶材料之塊體有多角柱狀、圓柱狀：柱狀之石夕 等各種各樣之形狀，且大小亦為多樣，：、其他不同形狀 用於所有feta## 7 要求一種能夠適 ，…日日材枓之加工、廉價且高性 發明之目的在於提供一種用以除去 °工裝置。本 小龜裂，並且獲得尺寸精度較高之I:::之外周部之微 裝置》 ，、口日日材科之塊體的加工 3 201247365 【發明内容】 為解决上述問題’本發明之加工裝置’係對被加工物 形狀為柱狀之硬脆性之結晶材料之外周面進行加工者具 備丄夹持手段，其具備前後移動之夾持軸，該夾持軸於前 端安裝有加工上述被加工物時夾持其兩端面並於加工結束 後解除上述夾持狀態之夹持部；被加卫物用㈣Μ ^ 係連結於上述央招：丰恐，Ε ^、t μ i 述死符乎奴，用於以該夾持手段之軸心為中心 而使被加工物旋轉；加工單元，其配置有一面以前端接觸 ''述被加工物而旋轉’一面對上述被加工物進行加工的 加工手段；高度位置檢測手段，其用以檢測加工前之上述 被加工物之加工面之高度位置；控制手段，其輸入有上述 加工前之被加工物之高度位置、加工後之被加工物的高度 置（即加工目標之尚度位置）及加工條件，對該等進 行運：而輸出用以控制上述加工裝置之加工步驟之訊號； 及判疋手段’其判定上述被加工物是否為可加工之形狀； 且上述運算係加工前與加工後之被加工物之高度位置之差 的運算:或用以根據所輸入之加工條件而設定其他加工條 件之運算、或者該等之組合運算中之任一者（第！發明）。 又，第1發明所記載之上述加工後之被加工物之尺寸 即高度位置亦可藉由檢測具有加工後之被加工物之尺寸的 主工件之外周面之高度位置而輸入至控制手段(第2發明)。 又，第1或第2發明所記載之上述判定亦可藉由運算 加工前與加工後（加工目標）之被加工物之高度位置之差 201247365 而進行（第3發明）。 又’第1發明所記載之上述加工手段係研磨刷，且該 研磨刷亦可具有於該研磨刷之底部呈環狀植入複數根含有 研磨粒之毛材的構造（第4發明）。 又’第1發明所記載之上述加工手段係研磨刷，且該 研磨刷亦可具有於轉盤植入複數根將含有研磨粒之毛材以 複數根捆束而成之研磨具之基部的構造（第5發明）。 又，第1發明所記載之上述加工手段係研磨刷，且該 研磨刷亦可具有於該研磨刷之底部呈環狀配置含有研磨粒 之彈性體的構造（第6發明）。 八，罘1發明所 ------ 丁人 VJ、Μ Ί'Π1 々，且 $磨石係設為利用結合劑結合研磨粒彼此而成之塊狀體固 定於圓盤狀之轉盤之1平面側且該塊狀體之表面接觸於上 述被加工物之加工面而旋轉（第7發明）。 ，第1發明所記載之加工單元亦可將第4至第6發 月所β載之加手段以複數台水平地連接（第8發明）。 又第1發明所記載之加工單元亦可將第4至第6發 明所記載之研磨刷、及第7發 赞月所6己載之磨石至少分別以1 個以上水平地連接（第9發明）。 又’第1發明所記載之加工梦 工物之同-剖面上之第i知裝置亦可具備配置於被加 ,, 之第1加工手段及第2加工手段，第i 加工手段與第2加工车扔+ ± 弟 向一致之方式配置，第又力之轴芯係以與被加工物之半徑方 之軸芯於被加工物之：二：手段之軸⑽第2加工手段 U相交配置，而構成既定之角 201247365 度θ (第1 〇發明）。 又第8發明所記載之加工裝置亦可具備配置於被加 工物，同-剖面上之第i加工單元…加工單元，第^ 加工早7C與第 2加工® - .y A, *如J么 單兀之軸心係以與被加工物之半徑方 向*一致之方式配晋，笛1 J； τ α 、 罝第1加工手奴之軸芯與第2加工手段 之軸於被加工物之A,|而士、、hf 之。J面中心相交配置，而構成既定之角 度0 (第11發明）β 第發明所5己載之加工裝置亦可具備配置於被加 工物之同一剖面之第1加工單元與第2加工單元，第^ 工單元與帛2加工單元之軸芯係以與被加工物之半徑方向 致之方式配置，第！加卫手段之轴芯與第2加工手段之 軸芯於被加工物之剖面中心相交配置， 0 (第12發明）。 而構成既定之角度 又帛8發明所記載之加工裝置亦可選擇2種以上混 合於上述毛材之研磨粒之粒度為F18〇〜#2〇〇〇,即，其粒度 不同之加工手段，並將該加工手段以其粒度由「粗」至「細」 之順序進行研磨加卫之方式連設。（第U發明）。 又，第9發明所記載之加工裝置中之加工單元亦可具 備構成上述磨石之研磨粒之粒度（根據jis (201247365 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a device for processing a peripheral surface of a columnar body which is a block formed of a hard brittle crystalline material. Further, the term "hard sturdy" refers to a property which has a very high hardness but is not resistant to impact and is easily cracked. [Prior Art] The shape of the hard-brittle crystalline material which is used for various semiconductor substrates is round. Generally, the knot is cut by a wire saw or a band saw, and the block of the η4 aa material is thinned. Or obtained by fine grinding. At this time, if there is a microcrack in the surface layer of the block, the crack is formed as a base point and cracking or chipping occurs when the above-mentioned cutting or chamfering is added: even after the wafer is formed, the step is small. Tortoise, cracked as a method of preventing the cutting of the split shoulder in the bulletin by grinding the "0 material =:: the surface layer of the body does not exist for micro-hours to crack the outer peripheral portion", for example, as disclosed in Japanese Patent No. 3973(4) in Sakamoto Patent No. 3973843 discloses an example of a spear. The block of the crystal material has a polygonal columnar shape, a cylindrical shape, a columnar stone, and the like, and has various sizes, and other shapes are used for all feta. ## 7 Requires a kind of processing, low-cost and high-efficiency invention of the Japanese material, which aims to provide a device for removing the workpiece. This small crack and obtain a high dimensional accuracy I::: The micro-device of the outer peripheral portion, and the processing of the block of the Japanese-Japanese medical department 3 201247365 [Summary of the Invention] In order to solve the above problem, the processing device of the present invention is a hard-brittle crystalline material having a column shape in a workpiece shape. Outside the perimeter The processor includes a gripping means having a gripping shaft that moves forward and backward, and the gripping shaft has a gripping portion that grips both end faces when the workpiece is processed, and releases the gripping state after the machining is completed. The Guardian uses (4) Μ ^ to link to the above-mentioned central tactics: phobia, Ε ^, t μ i to describe the slaves, for rotating the workpiece with the axis of the clamping means; The unit is provided with a processing means for processing the workpiece to be processed by the front end contacting the workpiece, and a height position detecting means for detecting the processing surface of the workpiece before processing. a height position; a control means for inputting the height position of the workpiece before the processing, the height of the workpiece after processing (that is, the position of the processing target), and the processing conditions, and the processing is performed: Outputting a signal for controlling the processing steps of the processing device; and determining means for determining whether the workpiece is a processable shape; and the operation system is higher before and after processing The calculation of the difference in the degree of the position: the calculation of the other processing conditions based on the input processing conditions, or the combination of the calculations (the invention). The height of the outer surface of the main workpiece having the size of the workpiece to be processed can be input to the control means (second invention) by detecting the height position of the workpiece. The above-described determination described in the second aspect of the invention can be performed by calculating the difference between the height positions of the workpieces before and after the processing (processing target) 201247365 (third invention). The method is a polishing brush, and the polishing brush may have a structure in which a plurality of abrasive materials containing abrasive grains are annularly implanted at the bottom of the polishing brush (fourth invention). The above-described processing method according to the first invention The polishing brush may have a structure in which a plurality of bases of a polishing tool in which a plurality of base materials containing abrasive grains are bundled in a plurality of rounds are placed on a turntable (the fifth invention). Further, the processing means according to the first aspect of the invention is a polishing brush, and the polishing brush may have a structure in which an elastic body containing abrasive grains is disposed in a ring shape at the bottom of the polishing brush (the sixth invention). Eight, 罘 1 invention ------ Ding VJ, Μ Ί 'Π 1 々, and $ grindstone is a block made of a bonding agent combined with abrasive grains and fixed to a disc-shaped turntable The surface of the 1st plane is rotated by the surface of the said block contact with the process surface of the said workpiece (7th invention). In the processing unit according to the first aspect of the invention, the means for adding the β-carriers in the fourth to sixth months may be horizontally connected in a plurality of stages (the eighth invention). Further, the processing unit according to the first aspect of the invention may be connected to at least one of the polishing brushes of the fourth to sixth inventions and the grinding stones of the seventh commemorative commemorative system. ). Further, the i-th known device in the same section of the processing dream of the first invention may be provided with the first processing means and the second processing means, the i-th processing means and the second processing which are disposed to be added. The car throws + ± the younger brother is arranged in a consistent manner, and the axis of the force of the second force is arranged with the axis of the radius of the workpiece to be intersected by the workpiece: 2: the axis of the means (10), the second processing means U, and It constitutes the established angle 201247365 degrees θ (the first invention). Further, the processing apparatus according to the eighth aspect of the present invention may further include a processing unit arranged in the workpiece, the i-th processing unit in the same cross section, the processing unit 7C, the second processing, and the second processing, -.y A, * The axis of the single cymbal is matched in the same way as the radial direction of the workpiece, and the flute 1 J; τ α, 罝 the first axis of the processing slave and the axis of the second processing means are the A of the workpiece ,|And the gentleman, hf. The J-plane center is arranged to intersect with each other to form a predetermined angle 0 (11th invention). The processing device of the fifth invention may include a first processing unit and a second processing unit disposed in the same cross section of the workpiece. ^ The axis of the unit and the 加工2 machining unit is configured in such a way as to be in the radial direction of the workpiece. The axis of the reinforcing means and the axis of the second processing means are arranged to intersect at the center of the section of the workpiece, 0 (12th invention). Further, in the processing apparatus described in the eighth aspect of the invention, it is also possible to select two or more types of abrasive grains mixed with the above-mentioned wool material to have a particle size of F18〇 to #2〇〇〇, that is, a processing method having different particle sizes, and The processing means is connected in such a manner that the particle size is polished from "thick" to "fine". (U invention). Further, the processing unit in the processing apparatus according to the ninth invention may have the particle size of the abrasive grains constituting the grindstone (according to jis (
Industrial Standards’ 曰本工業標準）R6〇〇1 : 1998 )為 ρ9〇 F220或者#240〜#500之磨石、粗研磨用研磨刷、及精研 磨用研磨^ ’上述粗研磨用研磨刷之毛材或者彈性體所含 之研磨粒之粒度為#24〇〜#5〇〇，上述精研磨用毛刷之研磨 粒所含的粒度為#8〇〇〜#12〇〇 (第Μ發明）。 6 201247365 、，藉由第1發明所記載之加工裝置，可除去存在於自上 述柱狀構件之表層至200 μηι以下之微小龜裂，且將研磨加 工面之表面粗糙度Ry(根據mB〇6()1 :編）加工為 以下（第15發明）。 第1發明所記載之柱狀構件亦可為石夕、陶竟、水晶、 藍寶石、料鎵、磷化鎵、氮化錄、碳切單晶、姐酸鐘、 铌酸鐘、碟化姻等硬脆性結晶材料（第16發明）。 第1發明所記載之柱狀構件係水晶，上述加工裝置可 用於水晶製材之外周面之微小龜裂之除去、或者貼合自上 述水晶製材切下之薄板而形成塊狀體後之該塊狀體之外周 面之微小龜裂的除去中之至少任一者（第17發明）。 藉由使加工裝置具備之加工手段接觸於被加工物 ==旋轉：而可研磨被加工物之表層部，除去微小 "、無法根據被加工物之形狀而加工為既定之尺 寸’故可H由上❹丨定手段敎U可研磨（帛卜 發明）。 3 之产^加:物之尺寸接近目標尺寸、且僅表層研磨即可 月、，可將上述加工手段設為第4至第6發明中任— 發明所記載之研磨刷。於將研磨刷如帛8發明 連接之情形時，於配置具有相同加工能力之研磨又… n± _ 77义研磨刷之惜犯 ’可‘短研磨時間。如第13發明所示般配置 不相同之研磨刷之情形時，可藉 ：力各 直至精研磨為正。 人動作而進仃粗研磨 於被加工物之尺寸及形狀與目標尺寸存在差之情形 7 201247365 時既可將上述加工手段言史為如帛7 #明所記載之磨石， 且亦可如第9發明所示般使其與研磨刷組合。此時，藉由 自第14發明之範圍選擇構成磨石之研磨粒及研磨刷所含之 研磨粒之粒度並適當配置，而可以一次動作進行磨石研削 之尺寸調整、及研磨刷之粗研磨與精研磨。 藉由將加工手段或加工單元如第1 〇至第丨2發明所示 般配置’而可縮短加工時間。 本發明中之加工裝置可較佳地用於所有硬脆性之材料 之加工。例如，可較佳地用於形成矽、陶兗、玻璃、水晶、 藍寶石、神化鎵、破化鎵、氮化鎵、碳化石夕單晶、组酸經、 銳西九鐘、磷化銦等結晶材料之晶圓之步驟。藉由除去存在 於自該等材料之表層至 μηια下之微小龜裂，且將研磨 加工面之表面粗糙度Ry加工為3，以下，而可防止切片 加工時及切片加工後之步驟（例如，形成基板之步驟或將 基板搭載於裝置之步驟等）中之因開裂、碎屬所致之不良 品的產生。又，於水晶晶圓之製造步驟t，藉由加工水晶 製材之外周面、或對貼合將水晶製材較薄切斷者而成之塊 狀體之外周面進行，可防止後步驟令之開裂、碎屑所致之 不良品的產生（第i 5、16、17發明）。 5月31日所申請 本申請案之内容而 該申請案係根據在曰本國於2〇 u年 之曰本特願201 1-121646號，其内容作為 形成其一部分。 然而 又，本發明根據以下之詳細說明當 ’詳細說明及既定之實施例係本發 可更完全地理解。 明之較理想之實施 8 201247365 形態’僅係用於說明之目的而記載者。本領域技術人員應 明瞭，自該詳細之說明可進行各種變更、改變。 申請人無意將所記載之實施形態之任何部分公佈於 眾，所揭示之改變、代替案之中字面上可能不包含於申請 專利範圍内之内容，依據等同原則亦屬於本發明之一部分二 於本說明書或申請專利範圍之記載中，名詞及相同77之 指示語之使用只要未特別指示’或根據前後文並未明確否 定，則應理解為包含單數及複數之兩者。本說明書中所提 供之所有例示或例示性用語（例如「等」）的使用，亦僅 意圖易於說明本發明，只垂_去&由j至击i丨μ 要禾於申睛專利範圍中特別古己 載，則並非對本發明之範圍添加限制者。 °Industrial Standards' R6〇〇1: 1998) is a grindstone of ρ9〇F220 or #240~#500, a grindstone for rough grinding, and a grind for fine grinding. The particle size of the abrasive grains contained in the material or the elastomer is #24〇~#5〇〇, and the particle size of the abrasive grains of the fine polishing brush is #8〇〇~#12〇〇 (the third invention). According to the processing apparatus of the first aspect of the invention, the surface crack from the surface layer of the columnar member to 200 μm or less can be removed, and the surface roughness Ry of the polished surface can be removed (according to mB〇6) (1: 编) is processed as follows (15th invention). The columnar member described in the first invention may be Shi Xi, Tao Jing, crystal, sapphire, gallium gallium, gallium phosphide, nitrided carbon, carbon cut single crystal, sister acid clock, tannic acid clock, dish, and the like. Hard brittle crystalline material (16th invention). In the columnar member crystal according to the first aspect of the invention, the processing apparatus can be used for removing a minute crack on a peripheral surface of a crystal material or by bonding a thin plate cut from the crystal material to form a block. At least one of the removal of the micro cracks on the outer peripheral surface of the body (17th invention). By contacting the processing means provided in the processing apparatus with the workpiece == rotation: the surface layer portion of the workpiece can be polished to remove the microscopic ", and the workpiece cannot be processed to a predetermined size according to the shape of the workpiece." U can be ground by the above-mentioned means (the invention). The production of the material is as follows: the size of the object is close to the target size, and only the surface layer is polished, and the processing means can be used as the polishing brush described in the fourth to sixth inventions. In the case where the abrasive brush is connected as in the case of the 帛8, the grinding with the same processing ability is set again... The n± _ 77-like abrasive brush can be used as a 'short grinding time'. When the polishing brushes of different configurations are arranged as shown in the thirteenth invention, the force can be increased until the fine grinding is positive. When the person moves and the rough grinding is performed, the size and shape of the workpiece are inferior to the target size. 7 201247365, the above processing means can be used as a grindstone as described in 帛7 #明, and can also be as 9 is combined with an abrasive brush as shown in the invention. In this case, by selecting the size of the abrasive grains constituting the grindstone and the abrasive grains contained in the polishing brush from the range of the fourteenth invention and appropriately arranging them, the size adjustment of the grindstone grinding and the rough grinding of the polishing brush can be performed in one operation. With fine grinding. The processing time can be shortened by arranging the processing means or the processing unit as shown in the first to fourth inventions. The processing apparatus of the present invention can be preferably used for the processing of all hard and brittle materials. For example, it can be preferably used to form tantalum, pottery, glass, crystal, sapphire, gallium, gallium gallium, gallium nitride, carbonized stone single crystal, group acid, ruthenium, indium phosphide, etc. The step of wafer of crystalline material. By removing minute cracks existing from the surface layer of the material to μηια, and processing the surface roughness Ry of the polished surface to 3 or less, steps during slicing and after slicing can be prevented (for example, The occurrence of defective products due to cracking or fragmentation in the step of forming a substrate or the step of mounting the substrate on the device. Further, in the manufacturing step t of the crystal wafer, it is possible to prevent the cracking of the subsequent step by processing the outer peripheral surface of the crystal material or the outer peripheral surface of the block which is formed by thinning the crystal material. Production of defective products due to debris (Inventions 5, 16, and 17). The content of this application was filed on May 31. The application is based on the Japanese Patent Application No. 201 1-121646, which is part of the country. However, the present invention will be more fully understood from the following detailed description and appended claims. The preferred implementation of the description 8 201247365 The form 'is only for the purpose of illustration. It is apparent to those skilled in the art that various changes and modifications can be made in the details. The Applicant does not intend to disclose any part of the described embodiments to the public. The changes and substitutions disclosed may not be included in the scope of the patent application, and the equivalent principle is also part of the present invention. In the description of the specification or the scope of the claims, the use of the singular and plural referents to the terms of the singular and plural are used unless otherwise specified. The use of all exemplified or exemplary terms (such as "etc") in this specification is only intended to be illustrative of the invention, and is only intended to be used in the scope of the patent application. In particular, it is not intended to limit the scope of the invention. °
L貫孢万式J 作為本發明之加工裝置之第i實施㈣1㈣ ==同之3個研磨刷平行地連接(3連)作為加 之/ 工裝置而將被加工物加工為圓柱狀 ,情形為例1用圖式對加工褒置之構成 ^行說明。再者’以下之說明中之上下：： 未特別指明則指圖中之方向。 Π /、要 圖1係表示停止於圖中六 單元2。、於載置於台加:開始前位置之加工 W之圖中左右藉由夾持手：之破加工物 之失持軸-之前端的夾持部 之前端之夾持告"讣分別後、ρ 及從動側之夹持軸13Β 刀別後退而未失持被加工物…之開放 9 201247365 研磨用 厂 狀態：力:工裝置之前視圖’於上述加工單元20中，將具備 選=。又疋3種研磨粒之粒度不同之研磨刷所形成的各加工 手段21自圖中右側向左側連設而作為「粗研磨用」、「中 精研磨用 並於上述「粗研磨用」之加工 〜仰纖巾」〈刀口丄 又21之圖中右側配置有用以於加工開始前檢測被加工物 之加工面P之高度位置的高度位置檢測手段15。 、汉4之加工手段21中之「粗研磨用」之研磨能力 大，且用以削掉存在於表層部之微小龜裂的大半，「中研 磨用」係用於利用帶鋸或者線雜切斷時產生之表面之凹凸 除去、及使因上述「粗研磨」而粗化之表面微細化，「精 研磨用」係用於對表面粗縫度進行最終調整。再者，若於 述中研磨」之階段完成表面之凹凸除去及表面粗糖度 之微細化調替，目丨丨+ π # , 豎則亦可將加工手段21設為2連。 :被加工物冒之加工前，為藉由高度位置檢測手段Η 而δ又疋開始加工手段9丨+ m t 仙 予焱21之研磨加工之高度位置，而使用主 工件0 為設定上述高度位置，首先利用夾持手段㈣持主工 之兩端。利用夾持手段13夾持主工件時，例如較佳如圖 示般載置於支承構件上具有Μ狀之槽（切口v:m) $行。藉由於該槽内配置主工件，而調整該主 之於圖5(B)中之紙面垂直方向之中心。進而更佳 =台座係連結於用以調整® ”之上下方向之設置位置 降手& 12。將主卫件載置於該台座，並使上述夾持手 之夾持軸13 A前進至位於圖中右方之基準端面位置b 10 201247365L Petrulorius J is the i-th embodiment of the processing apparatus of the present invention. (4) 1 (4) == Three abrasive brushes are connected in parallel (3). 1 Use the diagram to describe the composition of the processing device. Furthermore, the above descriptions are as follows:: The direction in the figure is not specified. Π /, Figure 1 shows that it stops at Unit 6 in the figure. In the drawing of the table in the position before the start of the position: the left and right sides of the drawing by the gripping hand: the missing shaft of the broken workpiece - the grip of the front end of the gripping portion of the front end is smashed, ρ and the clamping side of the driven side 13 Β The knife is not retracted and the workpiece is not lost. 9 201247365 The state of the grinding plant: force: the front view of the working device 'in the above processing unit 20, will have the option =. Further, each of the processing means 21 formed by the polishing brush having three different types of abrasive grains is connected from the right side to the left side in the drawing, and is used for "rough polishing" and "medium fine polishing" for the above-mentioned "rough polishing". The height position detecting means 15 for detecting the height position of the processed surface P of the workpiece before the start of the machining is disposed on the right side of the image of the blade. In the processing method 21 of the Han 4, the "grinding" has a large grinding ability and is used to cut off most of the micro cracks present in the surface layer. The "intermediate grinding" is used to use a band saw or a wire cutter. The surface unevenness generated at the time of the breakage is removed, and the surface roughened by the "rough polishing" is made fine, and the "fine polishing" is used to finally adjust the surface roughness. Further, if the unevenness of the surface and the fineness of the surface roughness are completed at the stage of polishing, the target 丨丨 + π # , and the processing means 21 can be set to two. : Before the processing of the processed object, the height position of the processing means 9丨+ mt 仙 焱 21 is started by the height position detecting means δ, and the height position of the processing is performed using the main workpiece 0, First, use the clamping means (four) to hold the two ends of the main work. When the main workpiece is held by the holding means 13, for example, it is preferably placed on the support member with a groove (cut v: m) $ row. The center of the main direction of the paper in Fig. 5(B) is adjusted by arranging the main workpiece in the groove. Further preferably, the pedestal is coupled to the set position drop & 12 for adjusting the upper and lower directions of the "". The main guard is placed on the pedestal, and the gripping shaft 13 A of the gripping hand is advanced to the position The reference end position on the right in the figure b 10 201247365
之後’使夹持站1 q D / 利用夹持部13a及13b炎持主 •工物w之向心 ㈣心座。於本實施例中，被加 ^ 〇 〇上11之配置及卸除係藉由利用上述升降手 12使台座"於圖1中之上下方向移動而進行。升… &持手段13具備以夹持抽 旋轉之手俨B &待軸13A及13B之軸芯為中心而 紅轉之手& ’且必須進行對準調整，以使自主 側觀察之失持軸13八为1i2D 件之鈿面 芯、與主 +八及13B之前端夾持部…及13b的轴 夾 < 軸心"致。於本實施形態中，利用夹持手 二t件後，使加工單元2。向左方移動，利用配 置於❹工單元2G之高度位置檢測手段15測定主工件之 外周面同度位置H1 ’其後，使該主工件旋轉(例如1 8〇度）， 測疋於疑轉後之狀態下之高度位置H2。運算⑴與η:之 差/於H1與H2並非為大致相同之情形時，使上述台座上 升後使失持軸13Α & 13Β分別後退而解^主I件之。 根據上述運算結果利用升降手段12調整上述台座之高度位 置(供夾持手段13夾持主工件之上下方向停止位置）之後， 再次制夾持手段13夾持主m定所夹持之主工件之 H1及H2。右H1肖H2成為大致相同則完成主< 步驟。 干 對準步驟完成後之HUH2係表示主工件之外周面之 尚度位置H°主卫件之對準步驟完成後，加卫單元20向圖 1中之右端移動。然後，使上述台座上升，使上述央持軸 13A及13B分別後退而解除主工件之夾持，並且將主工件 載置於台座U之V字狀槽之上。其後，將主工件與被加工 201247365 物w更換’藉由與主 W之兩端。 工件之情形相同之步驟夾持被加工物 其-人，進行被加工物β , w疋否為可加工之形狀之判定。 例如，被加工物w相 ^ Λ/ . t於加工目標之尺寸而存在較小之部 位之情形、存在因過夬 不適用於利用磨石或研磨刷之加 工之位置的情形時，剌 — 、疋為不5格品而中止加工。形狀之 判疋可自3維測疋儀等周知之技術中適當地選擇，於本實 ，形態中’係藉由高度位置檢測手段15測定被加卫物^之 高度位置’並利用運算而逸 — 丹叩進仃判疋。例如，可於被加工物w 之右端附近、左右方向中央、左端附近之位置分別每45。 地方疋轉測定合计24點之高度位置，並藉由運算該等與主 工件之高度位置之差進行判定。 於上述判定中合格之被加工物w係與主工件時同樣地 進行對準步驟。完成上述對準步驟之後，使該加工單元2〇 向圖1中之左端移動。再者，將利用上述主工件之對準步 驟所測量之主工件之外周面咼度位置H '與利用上述被加工 物w之對準步驟所測量的被加工物w之外周面高度位置h 分別儲存至控制手段16。 根據預先由作業者手動輸入至控制手段16而儲存之加 工條件（加工手段2 1之加工能力、前製程中之被加工物w 之切斷條件、加工手段2 1之旋轉速度、被加工物w之旋轉 速度 '加工單元20之移動速度等）及自動地儲存至控制手 段16之主工件及加工前之被加工物的上述高度位置H'h 而進行運算處理，決定加工手段21之對於被加工物w之加 12 201247365 工面之切入量，並自控制手 „„ 一 手奴16輪出切入量之訊號。加工 早7L 20根據該訊號而向 ^ D 门上下方向、即加工單元20與加工 面P之距離方向移動。再去 砂勒丹者，所谓「切入量」係加工手段 2」之向被加工物方向之進給量，其係由被加工物之加工 里、加工手段之種類、加工手段之加工能力、被 物性等而決定。 ^ …其次’根據由控制手段16根據上述加工條件所輸出之 '使力工手奴2卜被加工物w以既定之旋轉速度旋轉， 且使加工單元20以既定之移動速度向圖"之右方向移 動。：移動係向夾持軸13A & 13B之軸方向之移動亦稱 為「前後移動」。藉由該移動，正在旋轉之加工手段。之 前端部與被加工物W之被加工面p接觸，而進行加工（研 磨）如上述般，因加工手段2 j係自圖】之右向左依序地 按加工手段所含之研磨粒之粒度為「粗」-「細」之順序 排列，故藉由該移動，而進行「粗研磨」_「中研磨」— 精研磨」。加工單元2〇移動至既定之位置（最右端）後 停止加工手段21及被加工物W之旋轉。其後，上述台座 11上升而載置被加工物w之後，夾持軸13A及13B後退， 解除該被加工物W之夾持，並取出該被加工物W，藉此完 成加工。 於加工複數個被加工物w之情形時，係於上述台座上 重新設置被加工物W之後，同樣地經由被加工物之夾持步 驟、被加工物之對準步驟而進行加工。即，藉由最初測定 主工件之向度位置’其後可進行複數個被加工物W之加工β 13 201247365 於本實施形態中，伤蚀4 ^四一 係使加工単兀20向圖中左右 動，但既可使被加工物w # & + _ & J移 初W移動，亦可使加工單元2〇 工物W之雙方移動， 興破加 於本實施形態十，係手動地將加工條件輸入至控制手 段16,但亦可根據手動輸入之加工條件與自動輸入（ 之外周面高度位置’藉由控制手& 16運算未輸入之加’ 件而進行加工。例如，瓦於 ’、 了輸入加工手段2 1之前端對於被加 工物之加工面P的切入县相丄 刀入量與加工手段21之旋轉速度， 利用控制手段16運算被加工物w之移動速度，亦可利用控 制手段16根據其他加工條件或高度位置而運算切入量。而 且，可根據該等運算結果而進行加工。 所輸入之加工條件並不限定於本實施形態之項目。例 如亦可輸入加工手段2 1之種類、被加工物w之材質 '加 工刖之被加工物W之形狀、設為加工目標之被加工物％之 形狀、加工部位等。 圖2 (A)及（B)係表示作為上述加工手段21的研磨 刷之-例者’因此將由混合研磨粒之尼龍等之合成樹脂所 形成之毛材24a捆束而作為研磨具24，將其裝卸自如地安 裝於使該研磨具24之基部24b連結於加工用旋轉手段22 而水平旋轉的研磨具安裝板23Λ，下端接觸於被加工物W 之加工面P並旋轉，從而進行研磨，若研磨具24磨損則可 自研磨具安裝板23上卸除該研磨具24並更換為新的研磨 具24 ^再者，作為加工手段21的研磨刷並不限於圖2所示 者，可為將由混合研磨粒之毛材24a所形成之研磨具24直 14 201247365 接女裝於研磨具安裝板23而固定，若該研磨具24磨損則 與研磨具安裝板23 -併進行更換者，且亦可不使用研磨具 24 ’將由含有研磨粒之尼龍等之合成樹脂所形成之毛材2乜 呈環狀地植入於加工手段21之底部（參照圖3( A),上圖 表示前視圖，下圖表示仰視圖）。又，例如，於加工時加 工：段21與成為大致90。之角度之柱狀體之角部接觸的情 形等於因加工手段21與被加工4勿ψ之接觸而產生碎屑（碎 片）成為問題之情形時，亦可將由含有研磨粒之合成樹脂 所形成之彈性體24d呈環狀地配置於加工手& 21之底部 (參照圖3(B)，上圖表示前視圖’下圖表示仰視圖）。 所謂該情形之彈性體24d，例如亦可為硬度相對柔軟之樹脂 之塊體，或以内部具有多個氣泡之聚胺基甲酸醋或胺基甲 酸酯為首之樹脂之塊體’或將纖維狀之彈性體相互纏繞而 成者。於硬度相對柔軟之樹脂之塊體中，樹脂本身作為緩 衝材而發揮作用。於具有氣泡之樹脂之塊體中内部之氣泡 作為緩衝材而發揮作用。於含有研磨粒並相互缠繞之彈性 體中，藉由該彈性體相互纏繞，成為於該等之集合體之内 部包括有空氣，該空氣層作為緩衝材而發揮作用。任一之 情形均以該彈性體24d與被加工物接觸時保持適度之彈力 之方式，適當選擇合成樹脂之種類及研磨粒之含有率等。 =者，較理想的是混合於上述毛材或彈性體之研磨粒之粒 度自咖〜議〇(研磨粒之粒度之定義係根據m規格 〇〇1: 1998 )之範圍選擇，以獲得目標加工能力。 又’亦可相對於1個研磨刷21而配置至少2種以上之 15 201247365 毛材或者彈性體。此時，於靠近研磨刷2 1底部之外周面之 側配置研磨粒較小之毛材或彈性體，且於内側配置研磨粒 較大之毛材或彈性體。可利用配置於内側之研磨粒較大之 毛材或彈性體進行粗研磨，利用配置於外周面側之研磨粒 較小之毛材及彈性體進行中研磨或精研磨。即，可藉由工 個研磨刷2 1而獲得2種以上之效果，故可減少配置於加工 單元20之研磨刷2 1之個數。 八人將無需如上述之「粗」—「細」之多段加工， 而以1階段之加工即可獲得所需表面之情形作為第2實施 形態進行說明。再者’於此，僅對其與第1實施形態不同 之方面進行說明。 例如，於加工前之被加工物W之表面之微小龜裂微 小，且加工前之表面粗糙度對於要求值並無較大差異之情 形時，加工手段21 (研磨刷）可僅利用上述「中研磨用」 或精研磨用」進行加工。於此種情形時，亦可將具備含 有對應研磨目的之粒度之研磨粒的毛材或彈性體之加工手 段21僅配置1個而進行加工。 於如第1實施形態般將複數台加工手段2 1平行地 連接之情形時’藉由配置具有相同加工能力之加工手段 2 1，可縮短加工時間。 其次，於精加工前之被加工物w與精加工目標尺寸相 比過大之*陪犯Π* 月小時，或加工前之被加工物w為多角柱狀之情 形等’利用研磨刷之研磨中加工量不足之情形作為帛3實 施？態進杆却gg -r-. 仃次明。再者，於此，僅對其與第丨實施形態不 16 201247365 同之方面進行說明。 一隋形時’亦可將上述加工手段21之至少1個變更為 ^石。「於配置磨石之情形時，例如於圖！中自右依序按「磨 」*研磨用毛刷」「精研磨用毛刷」之順序配置。 _二將利用’。合劑結合研磨粒彼此而成之塊狀體 (未圖示）固定於轉盤（未圖示）之被加工物W側平面上。 該轉盤連接有用於使該轉盤以其轴心為中心進行旋轉之加 用方疋轉手& 22，上述經固定之研磨粒之表面與被加工物 W接觸進仃水平旋轉’藉此進行磨石之加工。再者， 研磨粒彼此之結合係藉由例如使將研磨粒、盼樹脂（結合 劑）及填充劑混合後所成型者以既定溫度烺燒而進行又， 於結合力較弱之情形時於成型時可混入玻璃纖維等作為強 化材，亦可對應磨石所要求之研磨力或強度而變更結合劑。 加工單元20具備能夠使各加工手段21單獨地於圆i 中之上下方向移動之手段。使加工單元2〇向圖i中之左方 移動後’使僅磨石向同圖之下方移動並且使其旋轉，如上 述般經由被加工物W之旋轉及加工單元20之向右方之移動 而完成磨石之加工（研削）^其次，使磨石上升後使加工 單元20向同圖之左方移動，使研磨刷向下方移動而同樣地 進行加工’藉此完成研磨刷之加工（研磨）。根據以上之 步驟，可進行利用磨石之尺寸及形狀之調整、及利用研磨 用毛刷之微小龜裂之除去。 為了可良好地加工硬脆性之材料，且不產生新的微小 龜裂’較理想的是構成該磨石之粒度自F90〜F220或#240 17 201247365 〜#500之範圍内適當地選擇。又 俘又此時’較理想的是粗研 磨用毛刷之毛材或彈性體所含之 吓3之研磨粒之粒度自#24〇〜 ㈣〇、精研磨用毛刷之毛材或彈性體所含之研磨粒之粒产 自#800〜#1200的範圍選擇，以獲得目標加工能力。又 其次，一面參照圖4，一面對第4香 丁弟4實施形態之加工裝置 進行說明。於本實施形態之加工裝置 衣苴T，裝置構成為配置 有加工手段2 1 ’以縮短加工時間。爯去 T ' J 丹者，於此，僅對其與 第1實施形態不同之方面進行說明。 於第4實施形態之加工裝置中，係於被加工物w之同 剖面（圓形）上、即於剖面之延長上配置有第i加工手 段25與第2加工手段26 » 第1加工手& 25與第2加工手段26之抽芯係以與被 加工物w之半徑方向一致之方式而配置，為了使第1加工 手段25與第2加工手段26不相互干擾，將第}加工手段 25之軸芯與第2加工手段26之軸芯於被加工物w之剖面 中心相交配置以構成既定之角度0 (參照圖4 (B)，同圖 之右圖表示前面，左圖表示左側面）。只要第1加工手段 25與第2加工手段26不相互干擾，該角度0可任意地設 疋’亦可將角度Θ設定為180。，以第1加工手段25之轴站 與第2加工手段26之軸芯完全一致而相對向之方式配置 (參照圖4( A ) ’同圖之右圖表示前面，左圖表示左側面）。 藉由設為此種構成’被加工物W係一面於圓周方向旋 轉—面被加工’故被加工物之加工面係於第1加工手段25 與第2加工手段26之2部位同時被加工，從而可縮短加工 18 201247365 時間。 又，於本實施形態之加工裝置中，亦可配置將第1加 工手段2 5及第2加工手段2 6分別於被加工物w之長度方 向設為2連、或3連而配置的第1加工單元2〇a及第2加工 單元20b 。 於此情形時’係沿被加工物W之長度方向自右依序配 置有第1行之第1加工手段25a與第2加工手段26a、第2 行之第1加工手段25b與第2加工手段26b、及第3行之第 1加工手段25c與第2加工手段26c。 此時，各加工手段具備之毛材或彈性體中所含之研磨 粒的粒度，係使第1加工手段25a與第2加工手段26a、第 1加工手段25b與第2加工手段26b、第1加工手段2 5c與 第2加工手段26c分別大致相同，即具有大致相同之加工能 力。 又，與第2實施形態同樣地，可利用具有一種加工能 力之加工手段進行加工時，可將所有加工手段所具備之毛 材或彈性體中所含的研磨粒之粒度設為大致相同，可將所 有之加工手段之加工能力設為大致相同。 又’與第3實施形態同樣地，可將第丨加工單元2〇& 與第2加工單元20b中之加工手段分別至少、！個以上變更 為磨石。 ’已對上述第4實施形態之加工裝置中，於被加工 物W之圓周方向設置第i加工手段乃與第2加工手段％ 之2個加工手段的構成進行了說明’但並不限於此，只要 19 201247365 各加工手段不相互干擾，則亦可配合設* 工间或目標加工 時間等而配置任意個數之加工手段，例如 、 加工手段（未圖示卜 ”進而配置第3 中A其2使被加工物η工為多角权狀（於本實施例 中為四角柱狀）之情形作為第5實施形態進行說明。 於此，僅對其與第1實施形態不同之方面進行說明。 圖二先)::二件以平面部成為上面之方式载置於例如 圖5 (A)所不之台座u之後’利用夾持手 (參照圖5(C)，利用切口 L: llc載置）广持兩： 度位置測定手段測定高度位置之後，解 利用门 物W更換，夾持該被加 使、並與被加工 奶 傻使台座1 1下降。 進行被加工物w是否為可加工之形狀之判定。 列如，备破加工物W存在對於預先所輸入 〇 情形、或存在因過大而不適用於rf* 刷之加工之位置的情形時，判定為不合格或研磨 形狀之判定可利用3維測定儀 加工 擇而於本實施形態，’例如可於被加工物W之右端：近、 左右方向中央、左端附近之位 ,ar ^ j母-人45地使其旌轉， ’則疋s計24點之高度位置，廿.g曾 、 要々生 纟運鼻料件之高度位 置之差’藉此進行判定。於本實施形態中 叙情形同樣地藉由高度位置檢測手段_定被加 之高度位置，並制運算而進行料 °工 之情形時係考慮平面部 再者’於四角稜柱 算。 角#之-度位置不同而進行運 20 201247365 於上述判定中合格之被加工物w以加工後成為平面部 之面朝上之方式利用被加工物旋轉手段使其旋轉而調整之 後，配置於台座1 1。此處，於該被加工物w較目標之尺寸 大，僅利用研磨刷之加工難以獲得目標尺寸之情形時，係 如第3實施形態般將加工手段之一設為磨石，首先利用藉 由磨石之研削進行尺寸之調整。 使加工單元20向圖1中之左方移動之後，運算所測定 之间度位置與預先輸入之加工手段之切入量，根據其結果 使加工單元2 〇向同圖下方移動之後，使磨石下降並且使該 磨石旋轉，其後，藉由使加工單元2〇向同圖右方移動，利 用磨石之研削而調整第丨平面部之形狀及尺寸。其次，停 止4磨石之旋轉並且使其上升之後，使加工單元同樣地 =左方移動。移動後，使研磨刷下降並且使該研磨刷旋轉， /、後使加工單元2〇同樣地向同圖右方移動，藉此完成第^ 平面部之加工。 ,/、後使升降手段12下降而解除被加工物w之載置 ^】用被加工物旋轉手段使被加工物W旋轉9 〇。之後， 降手"k 12上升並再次將被加工物％向台座載置。盆 後，經由相同之步驟而完成第2平面部之加工。藉由重複 以上之步驟，完成4邊之平面部之加工。 ,其-人，使升降手段12下降而解除被加工物W之載置之 後利用破加工物旋轉手段使被加工物w旋轉 使升降手段〗 疋将4)之设 升並再次將被加工物w載置於台座。（參 照圖5 ( D )，刹田丄 ⑺用切口 V: lib載置）。其後，經由與第1 21 201247365 平面4之加工相同之步驟而完成第1稜角部之加工。其後， 使升降手焱12下降而解除被加工物w之載置之後，利用被 加工物旋轉手段使被加卫物W旋轉9G。之後，使升降手段 升並再人將被加工物w向台座載置。其後，經由相同 之步驟成第2稜角部之加工。藉由重複以上之步驟，完 成4個稜角部之加工。 、灸使夾持軸13 A及13 B後退而解除被加工物w之 夾持並自0座U却除，藉此可獲得完成4邊之平面部及 4個稜角部之加工的被加工物W。 於加工前之被加工物w之尺寸與目標尺寸無較大差異 之隋形時’將加工手段21全部設為研磨刷，可省略調整上 述之形狀及尺寸之步驟。又，利用其他裝置進行調整上述 形狀及尺寸之步驟之情形的加卫亦同樣地可將加卫手段2 ^ 全部設為研磨刷而進行加工。 ^ 於四角知柱开》狀之情形時，例如利用線鑛或帶: 等將圓柱形狀之被加工物w加卫為四角柱狀之情形等（ 照圖6)，當於角部為曲線之情形之角部之加工時，係於) 示向D座11之載置之狀態下，一面使被加工物W往復旋^ 4 5 —面進行加工。 又，於利用1階段之加工而可獲得目標表面之情形時 藉由如第2實施形態般配置具有相同加工能力之研磨刷 可縮短加工時間。 加 又’與第4實施形態之情形 工單元2 0。例如，於將第丨加 同樣地，亦可配置複數個 工單元20a與第2加工單 22 201247365 7〇 20b相對於被加工物 卞稱配置而加工四角柱狀之被加工 物w的情形時，第1伞 , 千面。p與第3平面部、第2平面部與 第平面P第1稜角部與第3棱角部、第m角部與第4 棱角部係分別同時被加工，故可使加工時間減半。 [實施例1 ] 同之圓柱狀及四角柱狀之 進行與加工目標尺寸大致相 於加工則之上述被加工物W之表層部，存在 矽塊之加工 深度為80〜100㈣之微小龜裂且其表面粗糙度Ry為9〜η μηι利用線錫切斷（切片加工）該石夕塊而形成#晶圓時之 開裂、碎屑等所致之不良品之產生率為5〜6%。 針對如下結果進行敍述：使用第1實施形態所記載之 加工裝置作為本實施例所用之加II置，對作為上述被加 物（W )之石夕塊進行加工而除去微小龜裂及凹凸，使表面 粗糙度微小化之後，降低利用線鋸切片加工該矽塊而形成 矽晶圓時之開裂、碎屑等所致之不良品的產生率。 將本實施例中之加工條件設為表丨，將其輸入至控制手 段16之後，分別進行3塊矽塊之加工。其結果為，圓柱狀 及四角柱狀之矽塊均如表2所示，可大幅度減小存在於矽 塊之表層部之微小龜裂之深度及外周面的凹凸，其結果 為’微小龜裂之最大深度為〇.9 μηι，表面粗糙度為平面部 Ry〇.7〜1.0 μηι (平均：Ry0.9 μιη)，而可除去微小龜裂及 凹凸以及使表面粗糙度微小化，且可將此3個矽塊均利用 線鋸進行切片加工而形成矽晶圓時之開裂、碎屬等所致之 不良品的產生率降低2%左右。較理想的是微小龜裂之最大 23 201247365 深度為3.0 μιη以下，更理想的是2.3 μηι以下。若上述最大 深度為3.0 μηι以上則上述不良品之產生率增大。又，若上 述最大深度為2.3 μηι以下，則對切片加工為數十μηι之厚度 而形成矽晶圓時之開裂、碎屑等所致之不良品的產生率所 造成之影響較少。於本實施例中，上述最大深度為0.9 μηι， 大幅低於對上述不良品之產生率造成影響之2.3 μηι。 [表1] 項目 條件 圓柱狀 四角柱狀 加工手段之研磨粒之粒度 粗研磨用：#240 中研磨用：#500 精研磨用：#800 粗研磨用：#240 中研磨用：#500 精研磨用：#800 加工手段之直徑（mm) 沴210 沴210 加工手段之旋轉速度（min_1) 1,400 1,400 被加工物之旋轉速度（min_1) 100 - 加工單元之輸送速度（mm/sec) 3 20 切入量（mm) 粗研磨用：1.0 中研磨用：1.0 精研磨用：1.0 粗研磨用：1.0 中研磨用：1.0 精研磨用：1.0 [表2] 項目 結果 加工前 加工後 微小龜裂之最大深度（μηι) 80 〜100 0_7 〜0.9 表面粗縫度Ry (μιη) 9〜11 0.7-1.0 不良品之產生率（％) 5〜6 3〜4 24 201247365 [實施例2] 於較加工目標尺寸大，僅利用研磨刷難以進行加工之 情形時，係組合1個磨石與2個研磨刷作為加工手段，將 圓柱狀及四角柱狀之矽塊之加工於表3之條件下與實施例1 同樣地分別進行3塊矽塊之加工。運算加工前之矽塊之高 度位置與加工目標尺寸之差，以僅較加工目標尺寸大出研 磨刷之加工量大小之方式設定磨石之進給量而進行加工之 後，將研磨刷之進給量作為表3之條件而進行加工。其結 果為，圓柱狀及四角柱狀之矽塊均可使矽塊之外周面之凹 凸大幅減小，表面粗糙度為Ry0.7〜1.0 μπι (平均：Ry0.9 μηι )。可獲得此3個矽塊均利用線鋸進行切片加工而形成 矽晶圓時之開裂、碎屑等所致之不良品的產生率變成1〜2% 的良好結果。 [表3] 項目 條件 圓柱狀 四角柱狀 加工手段之研磨粒之粒度 磨石·· F180 粗研磨用：#240 精研磨用：#800 磨石：F180 粗研磨用：#240 精研磨用：#800 加工手段之直徑（mm) 磨石：沴250 研磨刷：0210 磨石：沴250 研磨刷：多210 加工手段之旋轉速度（min_1) 磨石：2,700 研磨刷：1,400 磨石：2,700 研磨刷：1，400 被加工物之旋轉速度（min'1) 100 - 加工單元之輸送速度（mm/sec) 磨石：3 研磨刷：3 磨石：20 研磨刷：20 切入量（mm) 粗研磨用：1.0 精研磨用：1.0 粗研磨用：1.0 精研磨用：1.0 25 201247365 [實施例3] 作為其他結晶材料之一例，進行與加工目標尺寸大致 相同之圓柱狀及四角柱狀之水晶塊體的加工。於表4之條 件下與實施例1同樣地分別進行3塊水晶塊體之加工。其 結果為，可使圓柱狀及四角柱狀之水晶塊體之外周面之凹 凸大幅減小，表面粗糙度成為Ry〇.3〜0.5 μηι (平均：Ry: 0.4 μιη )。將此3個水晶塊體分別利用線鋸進行切片加工而 形成水晶晶圓時之開裂、碎屑等所致不良品的產生率亦降 低2%左右。 [表4] 項目 條件 圓柱狀 四角柱狀 加工手段之研磨粒之粒度 粗研磨用：#240 中研磨用：#500 精研磨用：#800 粗研磨用：#240 中研磨用：#500 精研磨用：#800 加工手段之直徑（mm) ¢170 φ\Ί0 加工手段之旋轉速度（min'1) 1,700 1,700 被加工物之旋轉速度（min'1) 100 - 加工單元之輸送速度（mm/sec) 0.2 1.2 切入量（mm) 粗研磨用：1.0 中研磨用：1.0 精研磨用：1.0 粗研磨用：1.0 中研磨用：1.0 精研磨用：1.0 [實施例4] 作為除四角稜柱形狀或圓柱形狀以外之形狀之加工 例，對水晶晶圓之製造進行說明。如圖7所示，水晶晶圓 係經過利用水熱合成法等使水晶成長而獲得人造水晶之水 晶育成步驟（參照圖7 ( A ));為明確上述人造水晶之軸 26 201247365 方向，研削表面而獲得水晶塊體（以下，稱為「水晶製材」） 之製材加工（參照圖7 (B));將經製材加工之人造水」晶 對應頻率特性而以既定角度較薄地切片之切斷步驟（參照 圖7(C));藉由石壌等貼合經切片之人造水晶彼此而： 成塊狀體（例如50〜70塊）之固定步驟（參照圖7 ( d ; 用以將上述塊狀體之外形調整為作為晶圓之外形之尺寸而 進行研磨的外形研磨步驟、除掉上述石㈣之_步驟（參 照圖7 ( E ));而獲得水晶晶圓（參照圖7 ( f ))。 水晶製材有時如例如圖8所示般兩端面並非水平。如 此，於加工兩端面並非水平之形狀之被加工物時係於炎 13b之前端，連結對應上述被加卫物之前端形狀 之夾持辅助構件13c及13d’經由該失持輔助構件…、⑶ 並利用夾持手段13而失持被加玉物w。其後，藉由如上述 般加工水晶製材之外周® ’而可抑制於其後之切斷步驟之 開裂、碎屑等之不良品的產生率。 上料形研❹驟t，藉㈣用本發明之加工 裝置進订加工，而可將於上述切斷步驟等中所產 龜裂之深度及外周面之凹凸大幅減小。加 _ 剝離步驟所得之水晶晶圓因外周面之微小龜'裂已：：：述 ==後步驟中龜裂以微小龜裂為基點:成長二大 例如於使用水晶晶圓而製造水晶振盈器後步驟’ 利用研磨調整為對應頻率之厚度之步驟 日’ ’：列舉 貼合之步驟、將其㈣為既定石蠛等將其 了之步驟、為使振動 27 201247365 集中於水晶片之中央而研削 峨專之步驟、除去加工變質 利用蒸鍍法等形成電極之步 入套管之步驟。 邊緣之斜面加工、除掉上述石 而提高頻率精度之蝕刻步驟、 驟、頻率之最終調整後將其封 [產業上之可利用性] 藉由本發明而經加工之硬脆性結晶材料之塊體，利用 線鑛或帶難薄地切斷之後，對切斷面進行磨削研磨，藉 此可獲得晶圓，，可適用於用於薄膜太陽電池板等各 種半導體基板之矽晶圓、用於電子元件或光學基板之石英 晶圓、用於LED ( Light Emitting Diode，發光二極體）基 板等之藍寶石晶圓、砷化鎵晶圓、磷化鎵晶圓或氮化鎵晶 圓、用於功率元件等之碳化矽單晶晶圓；用於SAW( Surface Acoustic Wave，表面聲波）濾波器之钽酸鋰晶圓或鈮酸鋰 晶圓、用於超高速半導體元件之磷化銦晶圓等所有晶圓之 製造。 【圖式簡單說明】 圖1係說明本實施形態中之加工裝置之說明圖。 圖2(A)、（B)係表示第1實施形態中之研磨刷之一例之 說明圖。 圖3(A)、（B)係表示第1實施形態中之加工手段之變更 例之說明圖。 圖4(A)、（B)係說明第4實施形態中之加工手段之配置 之說明圖。 28 201247365 Λ 圖5(A)〜（D)係說明本實施形態中之台座之說明圖。 圖6係說明將被加工物自圓柱狀加工為四角柱狀之例 之說明圖。 圖7(A)〜（F)係用以說明水晶晶圓之製造步驟之一例之 說明圖。 圖8(A)、（B)係用以說明實施例4之說明圖。 【主要元件符號說明】 01 加工裝置 11 台座 1 la 支承構件 lib 切口 V 11c 切口 L 12 升降手段 13 夾持手段 13A、 13B 夾持軸 13a、 13b 夾持部 15 高度位置檢測手段 16 控制手段 20 加工單元 20a 第1加工單元 20b 第2加工單元 21 加工手段 22 加工用旋轉手段 29 201247365 23 24 24a、 24b 24d 研磨具安裝板 研磨具 24c 毛材 基部 彈性體 30Then, the clamping station 1 q D / the holding portions 13a and 13b are used to hold the main body w (the center of the heart). In the present embodiment, the arrangement and the unloading of the upper portion 11 are performed by moving the pedestal in the upper and lower directions in Fig. 1 by the above-described lifting hand 12. The holding means 13 has a hand that is red-turned around the axis of the hand-held shafts B and the shafts 13A and 13B, and must be adjusted in alignment so that the autonomous side observes The lost axis 13 is the face core of the 1i2D piece, and the shaft clamps of the main +8 and 13B front end clamping portions... and 13b<axis" In the present embodiment, the machining unit 2 is machined by holding two hands. Moving to the left, the height position detecting means 15 disposed in the completion unit 2G is used to measure the outer circumferential surface of the main workpiece H1', and then the main workpiece is rotated (for example, 18 degrees). The height position H2 in the latter state. When the difference between the operation (1) and the η: is not substantially the same between H1 and H2, the pedestal is raised and the lost axes 13 Α & 13 后 are respectively retracted to solve the main I piece. According to the calculation result, the height position of the pedestal is adjusted by the lifting and lowering means 12 (the holding means 13 holds the upper and lower stop positions of the main workpiece), and the clamping means 13 is again clamped to hold the main workpiece H1 and the main workpiece. H2. When the right H1 Xiao H2 becomes substantially the same, the main <step is completed. The HUH2 system after the completion of the dry alignment step indicates the peripheral position of the outer surface of the main workpiece. H. After the alignment step of the main guard is completed, the cleaning unit 20 moves to the right end in Fig. 1. Then, the pedestal is raised, the holding shafts 13A and 13B are respectively retracted, the nip of the main workpiece is released, and the main workpiece is placed on the V-shaped groove of the pedestal U. Thereafter, the main workpiece is replaced with the processed 201247365 w by both ends of the main W. In the case where the workpiece is the same, the workpiece is held by the workpiece, and the determination of whether the workpiece β, w疋 is a processable shape is performed. For example, when the workpiece w is ^ Λ / . t in the case of the size of the processing target and there is a small portion, there is a case where it is not suitable for the processing position using the grindstone or the abrasive brush, 剌 - ,中We do not process 5 products and stop processing. The shape determination can be appropriately selected from well-known techniques such as a three-dimensional measuring instrument, and in the present embodiment, the height position of the object to be cured is measured by the height position detecting means 15 and the operation is utilized. — Tanjong entered the judgment. For example, it can be placed at a position near the right end of the workpiece w, in the center in the left-right direction, and in the vicinity of the left end. The local twist measurement measures the height position of 24 points in total, and judges by calculating the difference between the height positions of the main workpieces and the main workpiece. The workpiece w that has passed the above determination is aligned in the same manner as in the case of the main workpiece. After the above alignment step is completed, the processing unit 2 is moved to the left end in Fig. 1. Further, the peripheral surface roughness position H' of the main workpiece measured by the alignment step of the main workpiece and the circumferential height position h of the workpiece w measured by the alignment step of the workpiece w are respectively Stored to control means 16. The processing conditions stored in advance by the operator manually input to the control means 16 (the processing capability of the processing means 21, the cutting condition of the workpiece w in the pre-process, the rotation speed of the processing means 21, and the workpiece w The rotation speed 'moving speed of the machining unit 20, etc.' is automatically stored in the main workpiece of the control unit 16 and the height position H'h of the workpiece before machining, and the arithmetic processing is performed to determine the processing means 21 to be processed. Add w 12 Add the amount of 201247365 work face, and control the hand „„ One hand slave 16 rounds out the amount of cut signal. The processing 7L 20 is moved in the up-and-down direction of the ^ D gate, that is, the distance between the machining unit 20 and the machining plane P in accordance with the signal. In the case of the Shaledan, the amount of feed in the direction of the workpiece by the "cutting amount" is the processing capacity of the workpiece, the type of processing means, the processing capability of the processing means, and the Physical properties are determined. ^ ... secondly, 'the workpiece w is rotated at a predetermined rotational speed according to the output of the control means 16 according to the above-described processing conditions, and the processing unit 20 is rotated at a predetermined moving speed. Move in the right direction. The movement of the moving mechanism in the axial direction of the gripping shafts 13A & 13B is also referred to as "moving back and forth". With this movement, the processing means is being rotated. The front end portion is in contact with the processed surface p of the workpiece W, and is processed (polished). As described above, the processing means 2 j is sequentially arranged from the right to the left of the workpiece to the abrasive grains contained in the processing means. Since the particle size is arranged in the order of "rough" - "fine", "rough grinding" - "medium grinding" - fine grinding is performed by this movement. After the machining unit 2 moves to a predetermined position (the rightmost end), the rotation of the machining means 21 and the workpiece W is stopped. Then, after the pedestal 11 is raised and the workpiece w is placed, the nips 13A and 13B are retracted, the nip of the workpiece W is released, and the workpiece W is taken out, thereby completing the processing. In the case where a plurality of workpieces w are processed, the workpiece W is newly placed on the pedestal, and then processed in the same manner by the step of holding the workpiece and the step of aligning the workpiece. That is, by first measuring the position of the main workpiece, the position of the workpiece can be processed by a plurality of workpieces W. In the present embodiment, the damage is 4^4, and the processing is performed in the figure. Move, but the workpiece w # & + _ & J can be moved to the beginning W, or the processing unit 2 can move both sides of the workpiece W, and it is added to the tenth embodiment, which is manually The machining condition is input to the control means 16, but it can also be processed according to the machining condition of the manual input and the automatic input (the outer circumferential height position 'by the control hand & 16 operation is not input". For example, The cutting edge of the machined surface P of the workpiece and the rotational speed of the processing means 21 are calculated by the control means 16 at the front end of the input processing means 2 1 , and the moving speed of the workpiece w is calculated by the control means 16 The means 16 calculates the amount of cut in accordance with other processing conditions or height positions. Further, the processing can be performed based on the results of the calculation. The processing conditions to be input are not limited to the items of the embodiment. For example, a processing hand can be input. 2 (1) and the material of the workpiece w. In the example of the polishing brush of the processing means 21, the raw material 24a formed of a synthetic resin such as nylon mixed with abrasive grains is bundled as a polishing tool 24, and the polishing tool 24 is detachably attached thereto. The base portion 24b is connected to the polishing tool mounting plate 23A that is horizontally rotated by the processing rotation means 22, and the lower end is in contact with the processing surface P of the workpiece W to be rotated, and is polished. If the polishing tool 24 is worn, the polishing tool mounting plate 23 can be self-welding. The polishing tool 24 is removed and replaced with a new one. Further, the polishing brush as the processing means 21 is not limited to the one shown in Fig. 2, and may be a polishing tool formed by mixing the abrasive grains 24a. 24 straight 14 201247365 The women's clothing is fixed on the polishing tool mounting plate 23, and if the polishing tool 24 is worn, it is replaced with the polishing tool mounting plate 23 - and the polishing tool 24' may not be used. Synthetic resin The bristles 2 are implanted in a ring shape at the bottom of the processing means 21 (refer to Fig. 3 (A), the upper view shows a front view, and the lower view shows a bottom view). Also, for example, processing at the time of processing: segment 21 and When the corner contact of the columnar body at an angle of approximately 90 is equal to the case where the chip (fragment) is caused by the contact between the processing means 21 and the workpiece 4, the synthesis of the abrasive particles may be used. The elastic body 24d formed of the resin is disposed in a ring shape at the bottom of the processing hand & 21 (refer to Fig. 3(B), and the upper view shows a front view 'bottom view of the bottom view.) The elastic body 24d in this case is, for example, It may also be a block of a resin having a relatively soft hardness, or a block of a resin such as a polyurethane having a plurality of bubbles or a urethane or a urethane, or a fiber-like elastomer intertwined with each other. . In the block of the resin having a relatively soft hardness, the resin itself functions as a buffer. The bubbles inside the block of the resin having bubbles act as a cushioning material. In the elastomer containing the abrasive grains and intertwined with each other, the elastic bodies are entangled with each other, and air is contained inside the aggregates, and the air layer functions as a cushioning material. In either case, the type of the synthetic resin, the content of the abrasive grains, and the like are appropriately selected so that the elastic body 24d maintains an appropriate elastic force when it comes into contact with the workpiece. = Preferably, the particle size of the abrasive particles mixed with the above-mentioned wool material or elastomer is selected from the range of the coffee grains (the definition of the particle size of the abrasive grains is based on the m specification 〇〇1: 1998) to obtain the target processing. ability. Further, at least two or more of the 2012 2012 365 materials or elastomers may be disposed with respect to one of the polishing brushes 21 . At this time, a bristle or an elastic body having a small amount of abrasive grains is disposed on the side closer to the outer peripheral surface of the bottom of the polishing brush 2, and a large amount of the abrasive or elastomer having a large amount of abrasive grains is disposed inside. The material may be coarsely ground by using a large amount of abrasive grains or elastomers disposed on the inner side, and may be ground or finely ground by using a small amount of abrasive grains and an elastic body disposed on the outer peripheral surface side. In other words, two or more effects can be obtained by the polishing brush 21, so that the number of the polishing brushes 21 disposed in the processing unit 20 can be reduced. The eight people will not need to perform the multi-stage processing of "thickness" - "fine" as described above, and the case where the desired surface can be obtained by one-stage processing will be described as the second embodiment. Further, only the aspects different from the first embodiment will be described. For example, when the surface of the workpiece W before the processing has a small micro crack and the surface roughness before the processing does not greatly differ from the required value, the processing means 21 (abrasive brush) can use only the above For polishing or fine polishing. In this case, it is also possible to process only one of the processing means 21 having the raw material or the elastic body containing the abrasive grains having the particle size corresponding to the polishing purpose. When a plurality of processing means 2 1 are connected in parallel as in the first embodiment, the processing time can be shortened by arranging the processing means 21 having the same processing capability. Secondly, the workpiece w before the finishing is too large compared with the size of the finishing target*, or the case where the workpiece w before processing is a polygonal column, etc. Is the situation of insufficient processing implemented as 帛3? The state enters the pole but gg -r-. Further, here, only the same as the third embodiment will be described. At least one of the processing means 21 may be changed to "stone". "In the case of arranging the grindstone, for example, in the figure!, the order of "grinding" * polishing brush and "finishing brush" is arranged in order from the right. _2 will use '. A block (not shown) in which the mixture is bonded to the abrasive grains is fixed to a flat surface of the workpiece W (not shown) on the side of the workpiece W. The turntable is connected with a rotating handle & 22 for rotating the turntable around its axis, and the surface of the fixed abrasive grain is in contact with the workpiece W to rotate horizontally. Processing. Further, the bonding of the abrasive grains to each other is carried out by, for example, mixing the abrasive grains, the resin (bonding agent), and the filler, and then molding them at a predetermined temperature, and forming them in a weak bonding state. In this case, glass fiber or the like may be mixed as a reinforcing material, and the bonding agent may be changed in accordance with the polishing force or strength required for the grinding stone. The machining unit 20 is provided with means capable of moving the respective machining means 21 individually in the up and down direction of the circle i. After the machining unit 2 is moved to the left in FIG. i, the grinding stone is moved to the lower side of the same figure and rotated, and the rotation of the workpiece W and the movement of the machining unit 20 to the right are performed as described above. When the grinding stone is finished (grinding), the grinding unit is moved to the left of the same figure, and the polishing brush is moved downward to be processed in the same manner. ). According to the above steps, the adjustment of the size and shape of the grindstone and the removal of the micro crack by the brush for polishing can be performed. In order to process the hard brittle material well, and no new minute cracks are produced, it is preferable that the particle size constituting the grindstone is appropriately selected from the range of F90 to F220 or #240 17 201247365 to #500. At the same time, it is more desirable to use the coarse-grained brush or the size of the abrasive grains contained in the elastomer. #24〇~ (4) 〇, finely ground brush or elastomer The particles of the abrasive grains contained are selected from the range of #800 to #1200 to obtain the target processing ability. Next, a processing apparatus of the fourth embodiment of the fourth embodiment will be described with reference to Fig. 4 . In the processing apparatus of the present embodiment, the apparatus T is configured such that the processing means 2 1 ' is disposed to shorten the processing time. In the case of T'J Dan, here, only the differences from the first embodiment will be described. In the processing apparatus according to the fourth embodiment, the i-th processing means 25 and the second processing means 26 are arranged on the same cross section (circular shape) of the workpiece w, that is, on the extension of the cross section. » First processing hand & 25 and the core processing of the second processing means 26 are arranged so as to coincide with the radial direction of the workpiece w, and the first processing means 25 is not interfered with each other so that the first processing means 25 and the second processing means 26 do not interfere with each other. The axial core and the axial core of the second processing means 26 are arranged to intersect at the center of the section of the workpiece w to form a predetermined angle 0 (see FIG. 4(B), the right figure of the same figure shows the front side, and the left figure shows the left side surface) . As long as the first processing means 25 and the second processing means 26 do not interfere with each other, the angle 0 can be arbitrarily set to 疋', and the angle Θ can be set to 180. The axis of the first processing means 25 and the axis of the second processing means 26 are completely aligned with each other (see Fig. 4(A)', and the right side of the figure shows the front side, and the left side shows the left side). In this configuration, the workpiece W is rotated in the circumferential direction, and the surface is processed. Therefore, the processed surface of the workpiece is processed simultaneously with the second processing means 25 and the second processing means 26. This can shorten the processing time of 18 201247365. Further, in the processing apparatus of the present embodiment, the first processing means 25 and the second processing means 26 may be arranged in the first direction of the workpiece w in two or three. The processing unit 2A and the second processing unit 20b. In this case, the first processing means 25a and the second processing means 26a of the first row, the first processing means 25b of the second row, and the second processing means are arranged in order from the right in the longitudinal direction of the workpiece W. 26b and the first processing means 25c and the second processing means 26c of the third row. In this case, the first processing means 25a and the second processing means 26a, the first processing means 25b, the second processing means 26b, and the first processing means 25a and the second processing means 26a, the first processing means 25a, the second processing means 26b, and the first processing means 25a The processing means 2 5c and the second processing means 26c are substantially identical, that is, have substantially the same processing capability. Further, in the same manner as in the second embodiment, when the processing is performed by a processing means having a processing capability, the particle size of the abrasive grains contained in the raw material or the elastic body of all the processing means can be made substantially the same. The processing capabilities of all processing methods are set to be approximately the same. Further, in the same manner as in the third embodiment, the processing means in the second processing unit 2 〇 & and the second processing unit 20b can be at least! More than one change to grindstone. In the processing apparatus according to the fourth embodiment, the configuration in which the i-th processing means and the second processing means % are provided in the circumferential direction of the workpiece W has been described, but the present invention is not limited thereto. As long as 19 201247365 each processing means does not interfere with each other, it is also possible to arrange any number of processing means in accordance with the setting of the *work or the target processing time, for example, processing means (not shown) and then arranging the third and second The case where the workpiece η is a multi-angled weight (in the present embodiment, a square column shape) will be described as a fifth embodiment. Here, only the difference from the first embodiment will be described. ): Two pieces are placed on the pedestal u, such as the one shown in Fig. 5 (A), in the case where the plane portion is the upper surface. 'With the gripping hand (see Fig. 5(C), the slit L: llc is placed) Two: After the height position is measured by the degree position measuring means, the door W is replaced by the door, and the shank 11 is lowered and the pedestal 11 is lowered with the processed milk. The determination of whether the workpiece w is a machinable shape is determined. Column, prepared for processing W In the case of the case where the enthalpy is input in advance or the position where the processing is too large and is not applicable to the processing of the rf* brush, the determination of the failure or the shape of the polishing can be determined by the three-dimensional measuring instrument. 'For example, at the right end of the workpiece W: near, in the center of the left and right direction, near the left end, ar ^ j mother - person 45 to make it twirling, 'then 疋 s count 24 points height position, 廿.g Zeng The determination is made by the difference between the height positions of the nose pieces. In the present embodiment, the height position is determined by the height position detecting means, and the calculation is performed. In the case of the case, the plane portion is considered to be calculated by the four-corner prism. The angle # is different from the position of the angle. 20 201247365 The workpiece w that is qualified in the above determination is used in such a manner that the surface of the plane becomes face up after processing. After the workpiece rotating means is rotated and adjusted, it is placed on the pedestal 1 1. Here, when the workpiece w is larger than the target size, and it is difficult to obtain the target size only by the processing of the polishing brush, 3 One of the processing means is a grindstone, and the size is first adjusted by grinding with a grindstone. After the machining unit 20 is moved to the left in FIG. 1, the measured position and the pre-input are calculated. The cutting amount of the processing means, according to the result, the machining unit 2 is moved to the lower side of the same figure, the grinding stone is lowered and the grinding stone is rotated, and then, by moving the processing unit 2 to the right of the same figure, The shape and size of the second plane portion are adjusted by the grinding of the grindstone. Secondly, after the rotation of the 4 grindstone is stopped and raised, the processing unit is similarly moved to the left. After the movement, the grinding brush is lowered and the After the polishing brush is rotated, the processing unit 2 is similarly moved to the right in the same figure, thereby completing the processing of the first planar portion. After that, the lifting means 12 is lowered to release the workpiece w. ^ The workpiece W is rotated by 9 用 by the workpiece rotating means. After that, the drop hand "k 12 rises and the workpiece % is placed on the pedestal again. After the pot, the processing of the second flat portion is completed through the same steps. By repeating the above steps, the processing of the flat portion of the four sides is completed. After the lifting means 12 is lowered to release the workpiece W, the workpiece w is rotated by the workpiece rotating means to raise the lifting means 疋 4 4) and the workpiece w is again lifted Placed on the pedestal. (Refer to Figure 5 (D), Sha Tin (7) is placed with a slit V: lib). Thereafter, the processing of the first corner portion is completed by the same procedure as the processing of the first 21 201247365 plane 4. Thereafter, the lifter 12 is lowered to release the workpiece w, and then the object W is rotated by 9G by the workpiece rotating means. After that, the lifting means is raised and the workpiece w is placed on the pedestal. Thereafter, the processing of the second corner portion is performed through the same steps. By repeating the above steps, the processing of the four corner portions is completed. Moxibustion causes the clamping shafts 13 A and 13 B to retreat to release the workpiece w and remove it from the 0 seat U, thereby obtaining a workpiece that is processed by the flat portion and the four corner portions of the four sides. W. When the size of the workpiece w before processing is not significantly different from the target size, the processing means 21 is entirely a polishing brush, and the step of adjusting the shape and size described above can be omitted. Further, in the case where the steps of adjusting the shape and the size of the above-described steps are performed by other devices, the cleaning means 2 ^ can be processed as a grinding brush in the same manner. ^ In the case of the four corners of the column, for example, using a line ore or belt: etc., the case where the cylindrical shape of the workpiece w is added to the square column shape (see Fig. 6), when the corner is a curve In the case where the corner portion is processed, the workpiece W is reciprocated and processed while being placed on the D-seat 11. Further, when the target surface is obtained by the one-stage processing, the processing time can be shortened by arranging the polishing brushes having the same processing ability as in the second embodiment. In addition, in the case of the fourth embodiment, the unit 20 is provided. For example, when the plurality of units 20a and the second processing sheet 22 201247365 7〇20b are disposed in the same manner as the workpieces, and the workpieces w in the square column shape are processed, The first umbrella, thousand faces. The p and the third plane portion, the second plane portion, and the first plane P, the first corner portion, the third corner portion, the mth corner portion, and the fourth corner portion are simultaneously processed, so that the processing time can be halved. [Embodiment 1] The surface layer portion of the workpiece W which is substantially in the same shape as the processing target size in the cylindrical shape and the quadrangular prism shape has a micro crack which has a processing depth of 80 to 100 (d). The surface roughness Ry is 9 to η μηι. The rate of occurrence of defective products due to cracking, chipping, etc. during the formation of the # wafer by the cutting of the tin wire (slicing) is 5 to 6%. In the following description, the processing apparatus according to the first embodiment is used as the addition of the second embodiment, and the stone block as the additive (W) is processed to remove minute cracks and irregularities. After the surface roughness is miniaturized, the rate of occurrence of defective products due to cracking, chipping, and the like at the time of forming the tantalum wafer by the wire sawing is reduced. The processing conditions in this embodiment are set to the table, and after inputting them to the control section 16, three blocks are processed. As a result, as shown in Table 2, both the columnar and square columnar blocks can greatly reduce the depth of the microcracks present in the surface layer portion of the block and the unevenness of the outer peripheral surface, and the result is a 'micro turtle. The maximum depth of the crack is 〇.9 μηι, and the surface roughness is the plane portion Ry〇.7~1.0 μηι (average: Ry0.9 μιη), and the micro cracks and irregularities can be removed and the surface roughness can be miniaturized. When the three slabs are sliced by a wire saw to form a ruthenium wafer, the rate of occurrence of defective products due to cracking or smashing is reduced by about 2%. It is desirable that the maximum crack size is 23 201247365, the depth is 3.0 μιη or less, and more preferably 2.3 μηι or less. When the maximum depth is 3.0 μηι or more, the generation rate of the defective product increases. In addition, when the maximum depth is 2.3 μηι or less, the influence of the rate of occurrence of defective products due to cracking or chipping when the wafer is formed into a thickness of several tens of μm is small. In the present embodiment, the maximum depth is 0.9 μηι, which is substantially lower than 2.3 μηι which affects the rate of occurrence of the above defective product. [Table 1] Item conditions Cylindrical columnar processing method: Particle size coarse grinding: #240 Medium grinding: #500 Fine grinding: #800 Grinding: #240 Grinding: #500 Fine grinding Use: #800 The diameter of the machining method (mm) 沴210 沴210 The rotation speed of the machining means (min_1) 1,400 1,400 The rotation speed of the workpiece (min_1) 100 - The conveying speed of the machining unit (mm/sec) 3 20 Cut amount (mm) For rough grinding: 1.0 For polishing: 1.0 For fine polishing: 1.0 For coarse grinding: 1.0 For polishing: 1.0 For fine polishing: 1.0 [Table 2] Item The maximum depth of micro cracks after processing before processing ( Ηηι) 80 ～100 0_7 ～0.9 Surface roughness Ry (μιη) 9~11 0.7-1.0 Production rate of defective product (%) 5~6 3~4 24 201247365 [Example 2] Larger than the processing target size, In the case where it is difficult to perform processing by using only the polishing brush, one stone and two polishing brushes are combined as a processing means, and the cylindrical and quadrangular column-shaped blocks are processed under the conditions of Table 3 in the same manner as in the first embodiment. The processing of three blocks is performed separately. The difference between the height position of the block before the calculation and the size of the machining target, and the feed of the grinding brush is set after the machining amount of the grinding stone is set to be larger than the machining target size. The amount was processed as the conditions of Table 3. As a result, the cylindrical and quadrangular columnar blocks can greatly reduce the convexity of the outer peripheral surface of the block, and the surface roughness is Ry0.7 to 1.0 μm (average: Ry0.9 μηι). It is possible to obtain a good result that the rate of occurrence of defective products due to cracking, chipping, and the like in the case where the three dies are sliced by a wire saw to form a ruthenium wafer becomes 1 to 2%. [Table 3] Item conditions Cylindrical cylindrical processing method of abrasive grain size Grinding stone · F180 Grinding: #240 Fine grinding: #800 Grinding stone: F180 Grinding: #240 Fine grinding: # 800 Diameter of processing means (mm) Grinding stone: 沴250 Grinding brush: 0210 Grinding stone: 沴250 Grinding brush: Multi-210 Rotating speed of processing means (min_1) Grinding stone: 2,700 Grinding brush: 1,400 Grinding stone: 2,700 Grinding brush: 1,400 Rotation speed of workpiece (min'1) 100 - Conveying speed of processing unit (mm/sec) Grinding stone: 3 Abrasive brush: 3 Grinding stone: 20 Abrasive brush: 20 Cutting amount (mm) For rough grinding :1.0 For fine polishing: 1.0 For coarse polishing: 1.0 For fine polishing: 1.0 25 201247365 [Example 3] As an example of another crystal material, a cylindrical or quadrangular prismatic crystal block having substantially the same size as the processing target is used. machining. The processing of three crystal blocks was carried out in the same manner as in Example 1 under the conditions of Table 4. As a result, the convexities on the outer peripheral surface of the cylindrical and quadrangular prism-shaped crystal blocks can be greatly reduced, and the surface roughness becomes Ry 3 3 to 0.5 μη (average: Ry: 0.4 μιη). When the three crystal blocks are sliced by a wire saw to form a crystal wafer, the rate of occurrence of defective products such as cracks and chips is reduced by about 2%. [Table 4] Item conditions Cylindrical cylindrical processing method of abrasive grain size coarse grinding: #240 Grinding: #500 Fine grinding: #800 Grinding: #240 Grinding: #500 Fine grinding Use: #800 The diameter of the machining method (mm) ¢170 φ\Ί0 The rotation speed of the machining means (min'1) 1,700 1,700 The rotation speed of the workpiece (min'1) 100 - The conveying speed of the machining unit (mm/sec 0.2 1.2 Cut-in amount (mm) For rough grinding: 1.0 For grinding: 1.0 For fine grinding: 1.0 For coarse grinding: 1.0 For polishing: 1.0 For fine grinding: 1.0 [Example 4] As a prismatic shape or a cylinder The manufacturing of the crystal wafer will be described in the processing example of the shape other than the shape. As shown in Fig. 7, the crystal wafer is obtained by growing a crystal by a hydrothermal synthesis method or the like to obtain a crystal growth step of artificial crystal (see Fig. 7 (A)); to clarify the direction of the artificial crystal shaft 26 201247365, the surface is ground. In the case of obtaining a crystal block (hereinafter referred to as "crystal material") (see Fig. 7 (B)), the step of cutting the thin film at a predetermined angle corresponding to the frequency characteristic of the artificial water processed by the material processing is obtained. (Refer to Fig. 7(C)); a step of fixing the sliced artificial crystals by stone or the like: forming a block (for example, 50 to 70 pieces) (refer to Fig. 7 (d; for the above block) The outer shape of the shape is adjusted to an outer shape polishing step of polishing the outer shape of the wafer, and the step of removing the stone (four) (see FIG. 7 (E)); and the crystal wafer is obtained (refer to FIG. 7 (f) As for the crystal material, for example, as shown in Fig. 8, the end faces are not horizontal. Thus, when the workpieces whose both end faces are not horizontally shaped are attached to the front end of the flame 13b, the joints correspond to the front end shape of the above-mentioned object to be affixed. The clamping auxiliary members 13c and 13d' The lost holding auxiliary member..., (3) is lost by the holding means 13 and the jade material w is lost. Thereafter, the outer periphery of the crystal material is processed as described above, and the cracking of the subsequent cutting step can be suppressed. The rate of occurrence of defective products such as crumbs. The upper part of the material is subjected to the processing of the processing apparatus of the present invention, and the depth and outer peripheral surface of the crack which can be produced in the cutting step or the like can be obtained. The embossing is greatly reduced. The crystal wafer obtained by the _ stripping step is cracked by the tiny turtle on the outer peripheral surface::: == The crack in the subsequent step is based on the micro crack: the growth of the second is, for example, the use of crystal After the manufacture of the crystal vibrator, the step of 'adjusting the thickness to the corresponding frequency by the grinding step' ': List the steps of the bonding, set the step (4) as the established stone, and so on, to concentrate the vibration 27 201247365 The step of grinding the concrete step in the center of the crystal wafer, removing the processing deterioration, and forming the electrode into the sleeve by vapor deposition, etc. The etching step of the edge, the removal of the stone, the etching step, the frequency, and the frequency for improving the frequency accuracy Final tune After that, it is sealed [Industrial Applicability] The block of the hard and brittle crystalline material processed by the present invention is cut by a wire ore or a strip, and then the cut surface is ground and polished. The wafer can be used for a silicon wafer for various semiconductor substrates such as a thin film solar panel, a quartz wafer for an electronic component or an optical substrate, or an LED (Light Emitting Diode) substrate. Sapphire wafer, gallium arsenide wafer, gallium phosphide wafer or gallium nitride wafer, silicon carbide single crystal wafer for power components, etc.; for SAW (Surface Acoustic Wave) filter Manufacture of all wafers such as lithium niobate wafers or lithium niobate wafers, indium phosphide wafers for ultra-high-speed semiconductor components. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view for explaining a processing apparatus in the embodiment. 2(A) and 2(B) are explanatory views showing an example of the polishing brush in the first embodiment. 3(A) and 3(B) are explanatory views showing a modified example of the processing means in the first embodiment. 4(A) and 4(B) are explanatory views for explaining the arrangement of processing means in the fourth embodiment. 28 201247365 Λ FIGS. 5(A) to 5(D) are explanatory views for explaining the pedestal in the embodiment. Fig. 6 is an explanatory view showing an example in which a workpiece is processed from a cylindrical shape into a rectangular column shape. 7(A) to (F) are explanatory views for explaining an example of a manufacturing process of a crystal wafer. 8(A) and 8(B) are explanatory views for explaining the fourth embodiment. [Description of main component symbols] 01 Processing apparatus 11 Base 1 la Supporting member lib Cutting V 11c Cutting L 12 Lifting means 13 Holding means 13A, 13B Holding shafts 13a, 13b Holding section 15 Height position detecting means 16 Control means 20 Processing Unit 20a First processing unit 20b Second processing unit 21 Processing means 22 Processing rotation means 29 201247365 23 24 24a, 24b 24d Abrasive tool mounting plate grinding tool 24c Wool material base elastic body 30