CN103282173A - Device for machining columnar member - Google Patents

Device for machining columnar member Download PDF

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Publication number
CN103282173A
CN103282173A CN2011800642741A CN201180064274A CN103282173A CN 103282173 A CN103282173 A CN 103282173A CN 2011800642741 A CN2011800642741 A CN 2011800642741A CN 201180064274 A CN201180064274 A CN 201180064274A CN 103282173 A CN103282173 A CN 103282173A
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CN
China
Prior art keywords
machined object
plant
processing unit
tool member
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800642741A
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Chinese (zh)
Inventor
泽井将太
樋口将雄
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Sintokogio Ltd
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Sintokogio Ltd
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Publication date
Application filed by Sintokogio Ltd filed Critical Sintokogio Ltd
Publication of CN103282173A publication Critical patent/CN103282173A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B24B5/045Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally with the grinding wheel axis perpendicular to the workpiece axis
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B13/00Brushes with driven brush bodies or carriers
    • A46B13/008Disc-shaped brush bodies
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B9/00Arrangements of the bristles in the brush body
    • A46B9/08Supports or guides for bristles
    • A46B9/10Adjustable supports
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/06Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for elongated workpieces having uniform cross-section in one main direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/50Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/142Wheels of special form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/145Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Provided is a device for preventing cracks and defects when a substrate composed of a hard brittle crystal material is manufactured. A holding means holds both ends of a workpiece, and the distal end of a polishing brush, which is a machining means, is brought into contact with the workpiece and rotated to thereby remove very small cracks present in the surface layer of the workpiece. Grindstone and polishing-brush machining are used in combination in accordance with the shape and dimensions of the workpiece prior to machining, whereby the shape and dimensions can be adjusted and very small cracks can be removed.

Description

The processing unit (plant) of columnar part
Technical field
The present invention relates to process that crystalline material by hard fragility constitutes as the device of the outer peripheral face of the column of crystal block.In addition, " hard fragility " refers to have very high hardness but at the patience difference of impacting and crackly character.
Background technology
Becoming wafer that the crystalline material by hard fragility of various semiconductor substrates constitutes makes usually with the following method and obtains: cut off thinly with the crystal block with this crystalline material such as scroll saw, band saw, carry out chamfer machining, smooth grinding then.At this moment, if having minute crack on the top layer of this crystal block, then when above-mentioned cut-out, chamfer machining minute crack become basic point and produce break, damaged, yield rate reduces.And, in the subsequent handling after wafer forms, minute crack also become basic point and produce break, damaged.Therefore, preferably there is not minute crack on the top layer of this crystal block.Breaking when preventing from cutting off as the peripheral part of the crystal block by grinding crystalline material, damaged method for example propose to have No. 3973843 communique of Japan's special permission.
Summary of the invention
In Japan speciallys permit No. 3973843 communique, illustration the silicon wafer piece of quadrangular shape.There are different shapes such as polygon prism shape, cylindric and other different forms in the crystal block of crystalline material, and size is also varied, therefore needs to be applied to the cheap and high performance processing unit (plant) of the processing of all crystalline materials.The object of the present invention is to provide the processing unit (plant) of the crystal block of the high crystalline material of a kind of minute crack be used to the peripheral part of removing crystalline material and acquisition dimensional accuracy.
In order to solve above-mentioned problem, processing unit (plant) of the present invention relates to the processing unit (plant) that a kind of outer peripheral face of crystalline material of the hard fragility that is shaped as column to machined object is processed, it is characterized in that, possess: clamping components, this clamping components possesses clamp axis, this clamp axis is equipped with clamping part and moves forward and backward at front end, the both ends of the surface of the above-mentioned machined object of above-mentioned clamping part clamping when the above-mentioned machined object of processing, and after process finishing, remove above-mentioned clamp position; The machined object rotating member, this machined object rotating member and above-mentioned clamping components link, and are used for above-mentioned machined object is rotated centered by the axle center of above-mentioned clamping components; Machining cell disposes tool member at this machining cell, and this tool member is processed above-mentioned machined object front end contacts rotation with above-mentioned machined object when; The height and position detection means, this height and position detection means is for detection of the height and position of the machined surface of the preceding above-mentioned machined object of processing; Control member, above-mentioned control member is imported the height and position of the machined object before the above-mentioned processing, the height and position height and position of editing objective (namely as) and the processing conditions of machined object after the processing, and above-mentioned control member carries out computing to them and exports signal for the manufacturing procedure of the above-mentioned processing unit (plant) of control; And determination means, above-mentioned determination means judges whether above-mentioned machined object is the shape that can process, above-mentioned computing be the machined object after height and position and the processing of the machined object before the processing height and position difference computing, be used for setting any one of the computing of the processing conditions of input not or computing that above-mentioned two kinds of computings combine based on the processing conditions of importing.(technical scheme 1)
And, also can form: have by detection the machined object after the processing size standard component outer peripheral face height and position and size that is the height and position of machined object after the above-mentioned processing that technical scheme 1 is put down in writing input to control member.(technical scheme 2)
And the above-mentioned judgement that technical scheme 1 or 2 is put down in writing is to be undertaken by the difference of the height and position of the machined object of the height and position of the machined object before the computing processing and processing back (editing objective).(technical scheme 3)
And also can form: the above-mentioned tool member that technical scheme 1 is put down in writing is abrasive brush, and this abrasive brush has to implant in the form of a ring in the bottom of this abrasive brush and is provided with the many structures that contain the bristle material of abrasive particle.(technical scheme 4)
And also can form: the above-mentioned tool member that technical scheme 1 is put down in writing is abrasive brush, and this abrasive brush has a plurality of implanted structures that are arranged at rotating disk of base portion of tying up the lap that the many bristle materials that contain abrasive particle form.(technical scheme 5)
And, also can form, the above-mentioned tool member that technical scheme 1 is put down in writing is abrasive brush, this abrasive brush has in the bottom of this abrasive brush and disposes the elastomeric structure that contains abrasive particle in the form of a ring.(technical scheme 6)
And, also can form, the above-mentioned tool member that technical scheme 1 is put down in writing is grinding stone, this grinding stone is by abrasive particle is formed by the planar side that the blocks of bond be combined into is fixed in discoid rotating disk each other, and the surface of this blocks contacts with the machined surface of above-mentioned machined object and rotates.(technical scheme 7)
And also can form: the machining cell that technical scheme 1 is put down in writing is to form by the tool member that many technical schemes of level connection 4~6 are put down in writing.(technical scheme 8)
And also can form: in the machining cell that technical scheme 1 is put down in writing, the grinding stone of the abrasive brush of technical scheme 4~6 records and technical scheme 7 records possesses at least respectively more than one, and their levels are connected.(technical scheme 9)
And, also can form: the processing unit (plant) that technical scheme 1 is put down in writing possesses first tool member and second tool member on the same cross section that is disposed at machined object, the axle center of first tool member and second tool member is configured to consistent with the radial direction of machined object, and the axle center of the axle center of first tool member and second tool member is configured to constitute the angle θ of regulation and intersects at the kernel of section of machined object.(technical scheme 10)
And, also can form: the processing unit (plant) that technical scheme 8 is put down in writing possesses first machining cell and second machining cell on the same cross section that is disposed at machined object, the axle center of first machining cell and second machining cell is configured to consistent with the radial direction of machined object, and the axle center of the axle center of first tool member and second tool member is configured to constitute the angle θ of regulation and intersects at the kernel of section of machined object.(technical scheme 11)
And, also can form: the processing unit (plant) that technical scheme 9 is put down in writing possesses first machining cell and second machining cell on the same cross section that is disposed at machined object, the axle center of first machining cell and second machining cell is configured to consistent with the radial direction of machined object, and the axle center of the axle center of first tool member and second tool member is configured to constitute the angle θ of regulation and intersects at the kernel of section of machined object.(technical scheme 12)
And, also can form: the processing unit (plant) of putting down in writing for technical scheme 8, the granularity that is mixed in the abrasive particle of above-mentioned bristle material is F180~#2000, select the different tool member of granularity of two or more abrasive particles, and this tool member is arranged continuously in the mode of carrying out attrition process according to the order of granularity from " slightly " to " carefully " of abrasive particle.(technical scheme 13)
And, also can form: the machining cell in the processing unit (plant) that technical scheme 9 is put down in writing possesses the granularity (based on JIS R6001:1998) of the abrasive particle that constitutes above-mentioned grinding stone and is grinding stone, rough lapping abrasive brush and the smooth grinding abrasive brush of F90~F220 or #240~#500, above-mentioned rough lapping is #240~#500 with the granularity of the abrasive particle that bristle material or the elastomer of abrasive brush contains, and above-mentioned smooth grinding is #800~#1200 with the granularity of the abrasive particle that brush contains.(technical scheme 14)
The processing unit (plant) that utilizes technical scheme 1 to put down in writing is removed the minute crack of distance below 200 μ m that is present in apart from the top layer of above-mentioned columnar part, and with the surface roughness Ry(of machined surface based on JIS B0601:2001) be machined to below the 3 μ m.(technical scheme 15)
The columnar part that technical scheme 1 is put down in writing can be the crystalline material of hard fragility such as silicon, pottery, crystal, sapphire, GaAs, gallium phosphide, gallium nitride, single-crystal silicon carbide, lithium tantalate, lithium niobate, indium phosphide.(technical scheme 16)
The columnar part that technical scheme 1 is put down in writing is for quartzy, above-mentioned processing unit (plant) be used for quartzy base outer peripheral face minute crack remove and pastes the thin plate that gets from above-mentioned quartzy base section and form this blocks behind the blocks outer peripheral face minute crack remove at least any one.(technical scheme 17)
Contact with the outer peripheral face of machined object and rotate by the tool member that processing unit (plant) is possessed, the skin section of machined object is ground, and minute crack is removed.At this moment, according to the shape difference of machined object, might can't be machined to the size of regulation, therefore can judge by above-mentioned determination means and can grind (technical scheme 1,2,3).
, only rely on and only grind under the situation that the top layer gets final product near target size in the size of machined object, above-mentioned tool member can be formed any one abrasive brush of putting down in writing of technical scheme 4~6.As technical scheme 8 with abrasive brush under the situation connected horizontally, have in configuration under the situation of abrasive brush of identical working ability, can shorten milling time.As technical scheme 13, disposing respectively under the situation of the different abrasive brush of working ability, can rely on once action to carry out processing from the rough lapping to the smooth grinding.
Under the situation that the size of machined object and shape and target size there are differences, above-mentioned tool member can be formed as technical scheme 7 described grinding stones, perhaps also can as technical scheme 9, be used in combination with abrasive brush.At this moment, by from the scope of technical scheme 14, selecting to constitute the granularity of the abrasive particle of grinding stone and abrasive particle that abrasive brush contains and suitably configuration, can rely on once action to carry out the adjusted size of being undertaken by the grinding that utilizes grinding stone to carry out and utilize abrasive brush to carry out rough lapping and smooth grinding.
By as technical scheme 10~12, disposing tool member or machining cell, process time can be shortened.
Processing unit (plant) of the present invention can be applicable to the processing of all hard fragile materials.For example can be applicable to the operation of the wafer of crystalline materials such as forming silicon, pottery, glass, crystal, sapphire, GaAs, gallium phosphide, gallium nitride, single-crystal silicon carbide, lithium tantalate, lithium niobate, indium phosphide.By remove be present in these materials apart from the distance on top layer below 200 μ m minute crack and the surface roughness Ry of attrition process face is machined to below the 3 μ m, in the time of can preventing slice processing and in the operation after the slice processing (for example form the operation of substrate, substrate be equipped on the operation of device etc.) owing to breaking/the damaged situation that causes producing defective products.And, in the manufacturing process of quartzy wafer, process, the outer peripheral face that quartzy base is cut off the blocks that the parts that form get thinly of fitting processed by the outer peripheral face to quartzy base, can prevent in the subsequent handling owing to break/damagedly cause producing defective products.(the 15~17 invention).
This application requires Japanese Patent Application 2011-121646 number the priority of filing an application in Japan on May 31st, 2011, and its content constitutes the application's a part as the application's content.
And, can understand the present invention more completely according to following detailed description.Yet detailed description and certain embodiments are preferred embodiment of the present invention, are only to put down in writing for illustrative purposes.According to this detailed description, those skilled in the art can know various changes, change.
The applicant do not plan will record any of embodiment be dedicated to the public, even if the scheme that is not contained in claims on language in the disclosed change, replacement scheme is under the jurisdiction of the part of invention at the theory of identity nextpage.
In the record of this specification or claims, as long as no special instructions or need only and by context relation not negated clearly, then the use of noun and identical deictic word should be interpreted as comprising odd number and plural both sides.The use of any one illustration that provides in this manual or exemplary term (for example " etc. ") is only the present invention for convenience of description also, as long as specially do not put down in writing in claims, just scope of the present invention is not applied restriction.
Description of drawings
Fig. 1 is the key diagram that the processing unit (plant) to present embodiment describes.
Fig. 2 is the key diagram of an example that the abrasive brush of first embodiment is shown.
Fig. 3 is the key diagram of modification that the tool member of first embodiment is shown.
Fig. 4 is the key diagram that the configuration to the tool member of the 4th embodiment describes.
Fig. 5 is the key diagram that the pallet to present embodiment describes.
Fig. 6 is the key diagram that describes from the cylindric example that is processed into the machined object of quadrangular shape.
Fig. 7 is the key diagram that describes for the example to the manufacturing process of quartzy wafer.
Fig. 8 is the key diagram that describes for to embodiment 4.
The specific embodiment
First embodiment as processing unit (plant) of the present invention, be example in order to the processing unit (plant) that possesses the machining cell that will form as three different parallel connections of abrasive brush of the grinding roughness of tool member (three connect) machined object being processed into columned situation, use accompanying drawing that the constitution content of processing unit (plant) and the details of action are described.In addition, for the direction up and down in the following description, as long as specially do not explain, then refer to the direction among the figure.
Fig. 1 is the front view of processing unit (plant), illustrate and stop the machining cell 20 that the processing of right-hand member in the drawings begins the front position, and clamping components 13 by cylinder body drive and the clamping part 13b of the clamp axis 13B front end of the clamping part 13a of the clamp axis 13A front end of the reference side of sliding and slave end respectively towards by mounting retreating and the release conditions of not clamping machined object W with right and left among the figure of the machined object W shown in the double dot dash line on pallet 11, in above-mentioned machining cell 20, as " rough lapping is used ", " middle grinding is used ", " smooth grinding is used ", be provided with the granularity of three kinds of abrasive particles continuously to the left side different and be selected each tool member 21 that is made of abrasive brush of setting on the right side from figure, the right side disposes height and position detection means 15 in the figure of the tool member 21 of above-mentioned " rough lapping with ", and this height and position detection means 15 is used for the height and position of the machined surface P of detection machined object W before the processing beginning.
The grainding capacity of " rough lapping is used " in above-mentioned three tool member 21 that connect is bigger, the purpose of most of minute crack of being present in skin section of pruning arranges, " middle grinding with " is to remove the concavo-convex of the surface that produces and the purpose because of the surperficial microminiaturization of above-mentioned " rough lapping " roughening is arranged when utilizing band saw or scroll saw to cut off, and " smooth grinding with " is that the purpose that finally is adjusted into surface roughness arranges.In addition, if the concavo-convex microminiaturization adjustment of removing with surface roughness that finishes the surface in stage of above-mentioned " middle grinding " then also can be made as tool member 21 two and connect.
In order before processing machined object W, to utilize height and position detection means 15 to set the height and position of the attrition process of beginning tool member 21, use standard component.
In order to set above-mentioned height and position, at first use the two ends of clamping components 13 clamping standard components.When utilizing clamping components 13 clamping standard components, the pallet 11 that preference carries standard component the groove (otch V:11b) that is placed at the support parts and has the V font as shown in Figure 5 carries out.Adjust center on the paper vertical direction in (B) of Fig. 5 of this standard component by standard component being disposed at this groove.In addition, this pallet also the preferred lift component that the position is set 12 with the above-below direction that is used for adjusting Fig. 1 link.With the standard component mounting in this pallet and after the clamp axis 13A of above-mentioned clamping components 13 being advanced to be arranged in right-hand datum end face position B of figure, clamp axis 13B is advanced, utilize the both ends of clamping part 13a and 13b clamping standard component.Then, unload this pallet.In the present embodiment, machined object W is with respect to the configuration of pallet 11 and unload all and undertaken by utilizing above-mentioned lift component 12 that the above-below direction of pallet 11 in Fig. 1 moved.
Clamping components 13 possesses the mechanism of rotating centered by the axle center of clamp axis 13A and 13B, and need feel relieved and adjust to observe the axle center of the clamping part 13a of clamp axis 13A and 13B front end and 13b from the end face side of standard component consistent with the axle center of standard component.In the present embodiment, after with clamping components 13 clamping standard components, machining cell 20 is moved towards left, and utilization is disposed at the outer peripheral face height and position H1 of the height and position detection means 15 bioassay standard spares of this machining cell 20, make this standard component rotation (for example 180 degree) then, measure the height and position H2 under the postrotational state.Computing H1 and H2's is poor, under the not roughly the same situation of H1 and H2, above-mentioned pallet is risen, and clamp axis 13A and 13B are retreated respectively and removes clamping to standard component.Utilize lift component 12 to adjust the height and position of above-mentioned pallet (being used for utilizing the above-below direction stop position of clamping components 13 clamping standard components) based on above-mentioned operation result after, use clamping components 13 clamping standard components again, and measure H1 and the H2 of the standard component after being held.If H1 and H2 are roughly the same, then the centering operation of standard component finishes.
The height and position H of the outer peripheral face that the H1 after the centering operation finishes and H2 represent standard component.After the centering operation of standard component finished, machining cell 20 moved to the right-hand member among Fig. 1.And then, above-mentioned pallet is risen, above-mentioned clamp axis 13A and 13B retreated respectively and remove clamping to standard component, and with the standard component mounting on the groove of the V of pallet 11 font.Then, standard component is replaced by machined object W, and with the situation of standard component under the two ends of identical operation clamping machined object W.
Secondly, whether be the judgement of machinable shape if carrying out machined object W.For example, under machined object W has less than the situation at the position of editing objective size or have under the situation that excessively is unsuitable for the position that processes with grinding stone or abrasive brush greater than the editing objective size, think defective work and end processing.For the judgement of shape, though can utilize technique known such as three-dimensional measurement device suitably to select, in the present embodiment, utilize height and position detection means 15 to measure the height and position of machined object W, and judge by computing.For example, can judge in the following manner: make 45 ° of the each rotations of machined object, measure respectively near near the position the right-hand member of machined object W, the left and right directions central authorities, left end, measure 24 place's height and positions altogether, the height and position of these height and positions of union and standard component poor.
Be judged to be qualified machined object W for above-mentioned, the same mode operation of feeling relieved with standard component the time.After above-mentioned centering operation finishes, this machining cell 20 is moved towards the left end among Fig. 1.In addition, by the centering operation of above-mentioned standard component instrumentation to standard component outer peripheral face height and position H, with the outer peripheral face height and position h of the machined object W that instrumentation arrives by the centering operation of above-mentioned machined object W, be stored in control member 16 respectively.
Manually import in advance and be stored in the processing conditions (the cut-out condition of the machined object W in the working ability of tool member 21, the last operation, the rotating speed of tool member 21, the rotating speed of machined object W and the translational speed of machining cell 20 etc.) of control member 16 and automatically be stored in the standard component of control member 16 and above-mentioned height and position H, the h of machined object before the processing carries out calculation process based on the operator, determine tool member 21 with respect to the depth of cut of the machined surface of machined object W, and utilize the signal of the control member 16 output depths of cut.Based on this signal, machining cell 20 at above-below direction, to be machining cell 20 move with the range direction of machined surface P.In addition, " depth of cut " refers to the amount of feeding that tool member 21 is advanced towards the machined object direction, is that the allowance according to machined object, the kind of tool member, the working ability of tool member, the rerum natura of machined object etc. determine.
Secondly, based on above-mentioned processing conditions, make tool member 21, machined object W with the rotating speed rotation of regulation by the signal by control member 16 outputs, and make machining cell 20 with the right-hand movement in Fig. 1 of the translational speed of regulation.This moves is axial movement along clamp axis 13A and 13B, is also referred to as " moving forward and backward ".Move by this, the machined surface P of machined object W contacts with the leading section of the tool member 21 of rotation, thereby processes (grinding).As previously mentioned, tool member 21 is arranged for the order of " slightly " → " carefully " with the granularity of the abrasive particle that tool member was contained successively from the right-hand left to Fig. 1 of Fig. 1, therefore, moves by this, carries out " rough lapping " → " middle grinding " → " smooth grinding ".Move to the position (low order end) of regulation at machining cell 20 after, stop the rotation of tool member 21 and machined object W.Then, behind above-mentioned pallet 11 risings and mounting machined object W, clamp axis 13A and 13B retreat, and remove the clamping to this machined object W, and take out this machined object W, process finishing.
Under the situation of a plurality of machined object W of processing, after above-mentioned pallet newly arranges machined object W, process through the clamping operation of machined object, the centering operation of machined object equally.That is, the height and position by at initial bioassay standard spare can carry out the processing of a plurality of machined object W subsequently.
Machining cell 20 is moved along left and right directions among the figure, but machined object W is moved, machining cell 20 and machined object W both sides are moved.
In the present embodiment processing conditions is manually inputed to control member 16, but also can utilize the processing conditions that control member 16 do not import according to the outer peripheral face height and position computing of the processing conditions of manually input and input (storage) automatically and process.For example, can pass through the front end of input tool member 21 with respect to the rotating speed of the depth of cut and the tool member 21 of the machined surface P of machined object, utilize the translational speed of control member 16 computing machined object W, also can utilize the control member 16 computing depths of cut according to other processing conditions, height and position.And then, can process according to these operation results.
The processing conditions of input is not limited to the project of present embodiment.For example, also can import the shape of material, the machined object W before the processing of kind, the machined object W of tool member 21, as the shape of the machined object W of processing purpose, working position etc.
(A) of Fig. 2 and (B) a example as the abrasive brush of above-mentioned tool member 21 is shown, tie up the bristle material 24a that constituted by the synthetic resin such as nylon that are mixed with abrasive particle as lap 24, and the base portion 24b of this lap 24 loading and unloading are installed on and process the lap installing plate 23 that can horizontally rotate with rotating member 22 bindings freely, these lap 24 lower ends contact rotation and grind with the machined surface P of machined object W, after lap 24 wearing and tearing, this lap 24 can be unloaded and be replaced by new lap 24 from lap installing plate 23.In addition, abrasive brush as tool member 21 is not limited to parts shown in Figure 2, the lap 24 that is made of the bristle material 24a that is mixed with abrasive particle directly can be mounted on lap installing plate 23, change together with lap installing plate 23 in these lap 24 wearing and tearing backs, also can not use lap 24, and will be implanted in the form of a ring by the bristle material 24c that the synthetic resin such as nylon that contain abrasive particle constitute be arranged at tool member 21 the bottom (with reference to (A) of Fig. 3.Top illustrate front view, the bottom illustrate upward view).And, for example, when adding man-hour tool member 21 inferior with the situation that the bight of column that roughly is 90 ° angle contacts, exist owing to tool member 21 contacts under the situation of the problem that produces damaged (chip) with machined object W, also the elastomer 24d that is made of the synthetic resin that contains abrasive particle can be disposed in the form of a ring the bottom of tool member 21 (with reference to (B) of Fig. 3.Top illustrate front view, the bottom illustrate upward view).Elastomer 24d under this situation for example can be the loose media of the softer resin of hardness, with the poly-amino that has a plurality of bubbles in inside, the loose media of resin headed by the urethanes and the elastomer that fibrous elastomer is entwined mutually.In the loose media of the softer resin of hardness, self plays a role resin as padded coaming.In the resin with bubble loose, inner bubble plays a role as padded coaming.In containing the elastomer that twines mutually of abrasive particle, because therefore this elastomer tangle up includes air in the inside of these aggregates, this air layer plays a role as padded coaming.In either case, all suitably select the kind of synthetic resin and the containing ratio of abrasive particle etc., in order to when this elastomer 24d contacts with machined object, keep the elastic force of appropriateness.In addition, the granularity that is mixed in the abrasive particle in above-mentioned bristle material or the elastomer preferably from the definition of the granularity of F180~#2000(abrasive particle based on JIS standard R6001:1998) scope select with the mode of the corresponding working ability of target can obtaining.
And, also can be at two or more at least bristle material or the elastomers of an abrasive brush 21 configurations.At this moment, little bristle material or the elastomer of side configuration abrasive particle near periphery in abrasive brush 21 bottoms is at big bristle material or the elastomer of inboard configuration abrasive particle.Can utilize big bristle material or the elastomer of abrasive particle that is disposed at the inboard to carry out rough lapping, utilize little bristle material and the elastomer of abrasive particle that is disposed at outer circumferential side to carry out middle the grinding or smooth grinding.That is, owing to can utilize an abrasive brush 21 to obtain two or more effects, therefore can reduce the number of the abrasive brush 21 that is disposed at machining cell 20.
Secondly, as second embodiment, to not needing the multistage processing of aforesaid " slightly " → " carefully ", only the situation that just can obtain desired surface with the processing in a stage describes.In addition, herein only to describing with the first embodiment difference.
For example, surface roughness before the more small and processing of the minute crack on the machined object W surface before processing there is no under the situation of big-difference too tool member 21(abrasive brush with respect to required value) can only rely on above-mentioned " middle grinding with " or " smooth grinding with " to process.In this case, also can only dispose bristle material or an elastomeric tool member 21 that possesses the abrasive particle that contains the granularity that is complementary with the purpose of grinding processes.
And, as first embodiment with many tool member 21 parallel connected situations under, have the tool member 21 of identical working ability by configuration, can shorten process time.
Secondly, as the 3rd embodiment, the situation that machined object W before the fine finishining and fine finishining target size are had big difference, the machined object W before the processing are the situation of polygon prism shape etc., and the situation of processing capacity deficiency describes in the grinding that utilizes abrasive brush to carry out.In addition,, only the difference with first embodiment is described herein.
In this case, also at least one above-mentioned tool member 21 can be changed to grinding stone.Under the situation of configuration grinding stone, for example the right side from Fig. 1 begins to dispose successively " grinding stone " " rough lapping is with brushing " " smooth grinding is with brushing ".
For grinding stone, utilize bond that the abrasive particle blocks (not shown) that forms that is bonded to each other is fixed on the machined object W side plane of rotating disk (not shown).This rotating disk be used for that its processing of rotating is connected with rotating member 22 centered by its axle center, the surface of the abrasive particle of the grinding stone of said fixing contacts and horizontally rotates with machined object W, utilizes grinding stone to process thus.In addition, abrasive particle combination each other for example is to fire in the temperature of regulation by the mixture that will be mixed with abrasive particle, phenolic resins (bond) and filler aftershaping to carry out.And, under the situation a little less than the adhesion, can when moulding, sneak into glass fibre etc. as reinforcement material, also can change bond according to the desired abrasive power of grinding stone, intensity.
Machining cell 20 possesses each tool member 21 mechanism of moving of the above-below direction in Fig. 1 individually.After machining cell 20 is moved towards the left among Fig. 1, only make grinding stone towards this figure below movement and make its rotation, and finish the processing (grinding) that utilizes grinding stone to carry out through the rotation of machined object W and the movement towards right-hand of machining cell 20 as mentioned above.Secondly, after grinding stone is risen, machining cell 20 is moved towards this figure left, and make abrasive brush move and similarly process towards the below, finish the processing (grinding) that utilizes abrasive brush to carry out thus.By above operation, can utilize the adjustment of size that grinding stone carries out and shape and utilize removing of smile crack that abrasive brush carries out.
In order to process hard fragile materials well, and do not produce new minute crack, the granularity that preferably constitutes this grinding stone is suitably selected from the scope of F90~F220 or #240~#500.And, at this moment, rough lapping is preferably selected from the scope of #240~#500 with the granularity of the abrasive particle that the bristle material of brushing or elastomer contain, smooth grinding is preferably selected from the scope of #800~#1200 with the granularity of the abrasive particle that the bristle material of brushing or elastomer contain, in order to obtain the target working ability.
Secondly, with reference to Fig. 4 the related processing unit (plant) of the 4th embodiment is described.In the processing unit (plant) of present embodiment, the mode that forms to shorten process time disposes the apparatus structure of tool member 21.In addition,, only the difference with first embodiment is described herein.
In the processing unit (plant) of the 4th embodiment, go up in the same cross section of machined object W (circle), be on the extension in cross section, dispose first tool member 25 and second tool member 26.
The axle center of first tool member 25 and second tool member 26 is configured to consistent with the radial direction of machined object W, in order to make win tool member 25 and the interference mutually of second tool member 26, the axle center of the axle center of first tool member 25 and second tool member 26 constitutes the angle θ of regulation, and is configured to intersect (with reference to (B) of Fig. 4 at the kernel of section of machined object W.The right side of this figure illustrates the front, and a left side illustrates left surface).For this angle θ, as long as first tool member 25 and second tool member 26 are not interfered mutually, can set arbitrarily, also angle θ can be set at 180 °, thereby the axle center that can be configured to the axle center of first tool member 25 and second tool member 26 is in full accord and opposed (with reference to (A) of Fig. 4.The right side of this figure illustrates the front, and a left side illustrates left surface).
By forming this structure, because machined object W is processed in rotation along the circumferential direction, so the machined surface of machined object is simultaneously processed at two positions of first tool member 25 and second tool member 26, so shortens process time.
And, in the processing unit (plant) of present embodiment, also can dispose the first following machining cell 20a and the second machining cell 20b, wherein, the first machining cell 20a and the second machining cell 20b are by first tool member 25 and second tool member 26 are even formed along long side direction configuration two companies or three of machined object W respectively.
In this case, begin to dispose successively the first tool member 25b and the second tool member 26b and the tertial first tool member 25c and the second tool member 26c of the first tool member 25a of first row and the second tool member 26a, secondary series from the right side along the long side direction of machined object W.
At this moment, the granularity of the abrasive particle that the bristle material that possesses for each tool member or elastomer contain, roughly the same each other in the first tool member 25a and the second tool member 26a, the first tool member 25b and the second tool member 26b, the first tool member 25c and tool member 26c, namely have roughly the same working ability.
And, identical with second embodiment, can utilize the tool member with a kind of working ability to add man-hour, can make the granularity of the abrasive particle that bristle material that all tool member possess or elastomer contain roughly the same, thereby can make the working ability of all tool member roughly the same.
And, identical with the 3rd embodiment, at least one of the tool member among the first machining cell 20a and the second machining cell 20b can be changed to grinding stone respectively.
And, in the related processing unit (plant) of above-mentioned the 4th embodiment to the circumferencial direction along machined object W two tool member are set, namely the structure of first tool member 25 and second tool member 26 is illustrated, but be not limited thereto, as long as each tool member is not interfered mutually, then also can according to arrange the space, as process time of target etc. further the tool member of configuration any number as the 3rd tool member (not shown).
Secondly, as the 5th embodiment, the situation that machined object W is processed into polygon prism shape (being the quadrangular shape in the present embodiment) is described.In addition, only the difference with first embodiment is described herein.
At first, behind for example Fig. 5 (A) such pallet 11, utilize clamping components 13 clamping two ends (with reference to (C) of Fig. 5 in the mode mounting that standard component is become upper surface with planar portions.Utilize otch L:11c to carry out mounting).Then, after utilizing height and position to measure member mensuration height and position, remove clamping and standard component is replaced by machined object W, and this machined object of clamping W.Pallet 11 is descended.
Secondly, whether be the judgement of machinable shape if carrying out machined object W.For example, under machined object W has less than the situation at position of the finishing size of input in advance or have under the situation that excessively is unsuitable for the position that processes with grinding stone or abrasive brush greater than the finishing size of input in advance, think defective work and end processing.Judgement for shape, though can utilize technique known such as three-dimensional measurement device suitably selects, but in the present embodiment, for example, can judge in the following manner: make 45 ° of the each rotations of machined object, measure respectively near near the position the right-hand member of machined object W, the left and right directions central authorities, left end, measure 24 place's height and positions altogether, the height and position of these height and positions of union and standard component poor.In the present embodiment, identical with the situation of first embodiment, utilize height and position detection means 15 to measure the height and position of machined object W, and judge by computing.In addition, machined object W is being processed under the situation of quadrangular, is considering to carry out computing in the planar portions situation different with place, bight height and position.
Be judged to be the rotation of qualified machined object and so that after becoming the supine mode of planar portions after the processing and adjusting, machined object W be disposed at pallet 11 above-mentioned utilizing the machined object rotating member to make.Herein, at this machined object W greater than target size, only with the difficult processing of utilizing abrasive brush to carry out with under the situation that obtains target size, as the 3rd embodiment, a tool member is replaced by grinding stone, and at first carries out the adjustment of size by the grinding of grinding stone.
After machining cell 20 is moved towards the left among Fig. 1, the height and position that computing determines and the depth of cut of tool member of input in advance, and make machining cell 20 mobile towards this figure below based on this result, then, make grinding stone decline and make this grinding stone rotation, then by making machining cell 20 towards the right-hand movement of this figure, thereby adjust shape and the size of first planar portions by the grinding that utilizes grinding stone to carry out.Secondly, in the rotation that stops this grinding stone and after making it to rise, machining cell 20 is moved equally towards left.After movement, make abrasive brush decline and make this abrasive brush rotation, make machining cell 20 equally towards the right-hand movement of this figure then, thus the process finishing of first planar portions.
Then, remove the mounting to machined object W in that lift component 12 is descended after, utilize the machined object rotating member to make machined object W half-twist, lift component 12 is risen and again with machined object W mounting in pallet.Then, finish the processing of second planar portions through identical operation.By carrying out above operation repeatedly, finish the processing of the planar portions on four limits.
Secondly, remove the mounting to machined object W in that lift component 12 is descended after, utilize the machined object rotating member to make 45 ° of machined object W rotations, lift component 12 is risen and again with machined object W mounting in (D) of pallet 11(with reference to Fig. 5.Utilize otch V:11b to carry out mounting).Then, through the operation identical with the processing of first planar portions, finish the processing of the first corner angle portion.Then, remove in that lift component 12 is descended to machined object W in trade-after, utilize the machined object rotating member to make machined object W half-twist, lift component 12 is risen and again with machined object W mounting in pallet.Then, finish the processing of the second corner angle portion through identical operation.By carrying out the processing that above operation is finished four corner angle portions repeatedly.
Then, clamp axis 13A and 13B are retreated and remove clamping to machined object W, and unload machined object W from pallet 11, can obtain to finish the machined object W of the processing of the planar portions on four limits and four corner angle portions thus.
The size of machined object W before processing and target size do not have under the situation of big difference too, and making tool member 21 all is abrasive brush, can omit above-mentioned adjustment shape and the operation of size.And, carry out at the device that utilizes other under situation of operation of above-mentioned adjustment shape and size processing too, can make tool member 21 all is that abrasive brush is processed.
And, under the situation of quadrangular shape, for example utilizing scroll saw, band saw etc. the machined object W of cylindrical shape to be processed into the situation inferior (with reference to Fig. 6) of quadrangular shape, be that across corner adds man-hour under the situation of curve in across corner, under the state of releasing with respect to the mounting of pallet 11, the limit back and forth processes on 45 ° of limits of rotation machined object W.
And, obtain in the processing that can utilize a stage can shorten process time by as second embodiment, disposing the abrasive brush that possesses identical working ability under the situation of target surface.
And, identical with the situation of the 4th embodiment, also can dispose a plurality of machining cells 20.For example, disposing as object with respect to machined object under the situation of machined object W that the first machining cell 20a and the second machining cell 20b process the quadrangular shape, owing to process first planar portions and the 3rd planar portions, second planar portions and Siping City's face, the first corner angle portion and triangular bight, the second corner angle portion and the 4th corner angle portion simultaneously respectively, so can be reduced by half process time.
Embodiment 1
Carry out the processing with the silicon wafer piece of the roughly the same cylindric and quadrangular shape of editing objective size.The skin section of above-mentioned machined object W before processing, have the minute crack that the degree of depth is 80~100 μ m, and its surface roughness Ry is 9~11 μ m, when with scroll saw this silicon wafer piece being cut off (slice processing) for silicon wafer, can produce break/damaged etc., be 5~6% by the incidence of above-mentioned breaking/defective products that damaged grade causes.
To use the related processing unit (plant) of first embodiment as the processing unit (plant) that uses in the present embodiment remove processing as the silicon wafer piece of above-mentioned machined object (W) minute crack and concavo-convex and make the surface roughness microminiaturization after, be reduced in utilize scroll saw that this silicon wafer piece is carried out slice processing and when forming silicon wafer owing to break/result of the incidence of the defective products that damaged grade causes narrates.
Processing conditions in the present embodiment is tabulated 1, after above-mentioned processing conditions is inputed to control member 16, carry out the processing of three silicon wafer pieces respectively.The result, silicon wafer piece cylindric and the quadrangular shape is all as shown in table 2 such, can reduce the concavo-convex of the degree of depth of minute crack of the skin section that is present in the silicon wafer piece and outer peripheral face significantly, the result, the depth capacity of minute crack is 0.9 μ m, surface roughness is that planar portions Ry0.7~1.0 μ m(are average: Ry0.9 μ m), can remove minute crack and concavo-convex and make the surface roughness microminiaturization, can be when utilizing scroll saw slice processing become silicon wafer respectively with three these silicon wafer pieces owing to break/incidence of the defective products that damaged grade causes reduces about 2%.The depth capacity of minute crack is below the 3.0 μ m, is preferably below the 2.3 μ m.If above-mentioned depth capacity is more than 3.0 μ m, then the incidence of above-mentioned defective products raises.And, if above-mentioned depth capacity is below the 2.3 μ m, when then forming silicon wafer to this silicon wafer piece slice processing is become the thickness of tens μ m because of break/influence that the incidence of the defective products that damaged grade causes causes is less.In the present embodiment, above-mentioned depth capacity is 0.9 μ m, can be lower than the 2.3 μ m that above-mentioned incidence to defective products impacts significantly.
Table 1
Figure BDA00003468217900161
Table 2
Figure BDA00003468217900162
Embodiment 2
As than editing objective size greatly and only with the unmanageable situation of the processing that utilizes abrasive brush to carry out, utilize the condition of table 3 to carry out the processing of the silicon wafer piece of cylindric and quadrangular shape in mode similarly to Example 1 as a grinding stone of tool member combination and two abrasive brush, carry out the processing of three silicon wafer pieces respectively.The height and position of the silicon wafer piece before the computing processing and editing objective size poor, and after the amount of feeding of grinding stone being set for the size that makes after the processing only the big mode of utilizing the amount of the allowance that abrasive brush processes is processed than editing objective size, the amount of feeding of abrasive brush is set at the condition of table 3 and processes.As a result, can both reduce outer peripheral face concavo-convex of silicon wafer piece significantly for the silicon wafer piece of cylindric and quadrangular shape, surface roughness is that Ry0.7~1.0 μ m(are average: Ry0.9 μ m).In three silicon wafer pieces, all can obtain when utilizing scroll saw that this silicon wafer piece slice processing is become silicon wafer because of break/incidence of the defective products that damaged grade causes is 1~2% good result.
Table 3
Figure BDA00003468217900171
Embodiment 3
As other a example of crystalline material, carry out the processing with the quartzy crystal block of the roughly the same cylindric and quadrangular shape of editing objective size.Utilize the condition of table 4 to carry out the processing of three quartzy crystal blocks respectively in mode similarly to Example 1.As a result, can reduce outer peripheral face concavo-convex of the quartzy crystal block of cylindric and quadrangular shape significantly, can make surface roughness is that Ry0.3~0.5 μ m(is average: Ry:0.4 μ m).In three quartzy crystal blocks, when utilizing scroll saw should crystal crystal block slice processing to become quartzy wafer because of break/incidence of the defective products that damaged grade causes reduces about 2%.
Table 4
Figure BDA00003468217900181
Embodiment 4
As the processing example of the shape beyond the quadrangular shape, cylindrical shape, describe at the manufacturing of quartzy wafer.For quartzy wafer as shown in Figure 7, can obtain quartzy wafer (with reference to (F) of Fig. 7) through following operation: breed operation (with reference to (A) of Fig. 7) by the crystallization that hydro-thermal breeding process etc. makes crystalline growth obtain synthetic quartz; Thereby for clear and definite above-mentioned synthetic quartz axially and to carrying out blank (lumbered) processing (with reference to (B) of Fig. 7) that grinding obtains quartzy crystal block (below be designated as " quartzy base ") in the surface; The cut-out operation (with reference to the 7(C of figure) of the synthetic quartz after the blank processing being cut into slices thinly according to frequency characteristic angle in accordance with regulations); With paraffin etc. will cut into slices and synthetic quartz stick together each other and form blocks (for example 50~70) fixedly operation (with reference to (D) of Fig. 7); For the profile with above-mentioned blocks is adjusted to as the size of the profile of wafer and the profile grinding step that grinds, the stripping process (with reference to (E) of Fig. 7) of removing above-mentioned paraffin etc.
For example, as shown in Figure 8, there is the out-of-level situation of both ends of the surface in quartzy base.Like this, when the machined object of the out-of-level shape of processing both ends of the surface, front end at clamping part 13a and 13b, clamping accessory 13c and 13d that the shape of the front end of binding and above-mentioned machined object is complementary utilize clamping components 13 clamping machined object W via this clamping accessory 13c, 13d.Then, by the outer peripheral face of processing crystal base as previously mentioned, in the cut-out operation after can suppressing because breaking/incidence of the defective products that damaged grade causes.
And, in above-mentioned profile grinding step, process by utilizing processing unit (plant) of the present invention, can reduce the concavo-convex of the degree of depth of the minute crack that produces in the above-mentioned cut-out operation etc. and outer peripheral face significantly.After processing, for the quartzy wafer that obtains through above-mentioned stripping process, because the minute crack of outer peripheral face is removed, can be suppressed at therefore that to produce with the minute crack in the subsequent handling be basic point and the situation in thick crack is grown in the crack, can reduce the incidence of defective products.Subsequent handling for example can be enumerated: using quartzy wafer to make under the situation of quartz crystal, by grinding it is adjusted to the operation of the thickness of frequency match, by paraffin etc. with its operation that is bonded, with its be cut to the design size of regulation operation, for make vibration concentrate on quartz plate central authorities and to the edge carry out grinding taper processing, remove above-mentioned paraffin etc. operation, remove processing rotten and improve the etching work procedure of the precision of frequency, by the operation of formation electrodes such as vapour deposition method and after final frequency adjustment, enclose operation in shell.
Industrial utilizability
For the crystal block of the crystalline material of the hard fragility that processes by the present invention, after utilizing scroll saw, band saw to cut off thinly, can obtain wafer by section being polished grind.For example, can be applicable to the lithium tantalate wafer, lithium niobate crystal chip of the silicon wafer that uses in the various semiconductor substrates such as being manufactured on the thin film solar cell plate, the quartz wafer that in electronic device or optical substrate, uses, the sapphire wafer that in LED substrate etc., uses, gallium arsenide wafer, gallium phosphide crystal, gallium nitride wafer, the single-crystal silicon carbide wafer that in power device etc., uses, use in surface acoustic wave filter (SAW filter), all wafers such as inp wafer that in the ultrahigh speed semiconductor element, use.
Below, concentrate the main label in the label that uses in the notebook specification.
01: processing unit (plant); 11: pallet; 11a: support parts; 11b: otch V; 11c: otch L; 12: lift component; 13: clamping components; 13A, 13B: clamp axis; 13a, 13b: clamping part; 15: the height and position detection means; 16: control member; 20: machining cell; 21: tool member; 22: the processing rotating member; 23: the lap installing plate; 24: lap; 24a, 24c: bristle material; 24b: base portion; 24d: elastomer.

Claims (17)

1. the processing unit (plant) of a columnar part, the processing unit (plant) of this columnar part is the processing unit (plant) that the outer peripheral face of the crystalline material of the hard fragility that is shaped as column of machined object is processed, and it is characterized in that possessing:
Clamping components, this clamping components possesses clamp axis, and this clamp axis is equipped with clamping part and moves forward and backward at front end, the both ends of the surface of the described machined object of described clamping part clamping when the described machined object of processing, and after process finishing, remove described clamp position;
The machined object rotating member, this machined object rotating member and described clamping components link, and are used for described machined object is rotated centered by the axle center of described clamping components;
Machining cell disposes tool member at this machining cell, and this tool member is processed described machined object front end contacts rotation with described machined object when;
The height and position detection means, this height and position detection means is for detection of the height and position of the machined surface of the preceding described machined object of processing;
Control member, described control member is imported the height and position of the machined object before the described processing, height and position and the processing conditions of machined object after the processing, and described control member carries out computing to them and exports signal for the manufacturing procedure of the described processing unit (plant) of control; And
Determination means, described determination means judge whether described machined object is the shape that can process,
Described computing be the machined object after height and position and the processing of the machined object before the processing height and position difference computing and be used for based on the processing conditions of importing set the processing conditions of input not computing at least any one.
2. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Have by detection the machined object after the processing size standard component outer peripheral face height and position and size that is the height and position of the machined object after the described processing inputed to control member.
3. the processing unit (plant) of columnar part according to claim 1 and 2 is characterized in that,
Described judgement is to be undertaken by the difference of the height and position of the height and position of the machined object before the computing processing and the machined object after the processing.
4. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described tool member is abrasive brush, and this abrasive brush has to implant in the form of a ring in the bottom of this abrasive brush and is provided with the many structures that contain the bristle material of abrasive particle.
5. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described tool member is abrasive brush, and this abrasive brush has a plurality of implanted structures that are arranged at rotating disk of base portion of tying up the lap that the many bristle materials that contain abrasive particle form.
6. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described tool member is abrasive brush, and this abrasive brush has in the bottom of this abrasive brush and disposes the elastomeric structure that contains abrasive particle in the form of a ring.
7. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described tool member is grinding stone, and this grinding stone is by abrasive particle is formed by the planar side that the blocks of bond be combined into is fixed in discoid rotating disk each other, and the surface of this blocks contacts with the machined surface of described machined object and rotates.
8. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described machining cell is to connect the tool member of putting down in writing in the invention of many claims 4~6 by level to form.
9. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
In described machining cell, the grinding stone of putting down in writing in the abrasive brush of putting down in writing in the invention of claim 4~6 and the invention of claim 7 possesses at least respectively more than one, and their levels are connected.
10. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described processing unit (plant) possesses first tool member and second tool member on the same cross section that is disposed at machined object, the axle center of first tool member and second tool member is configured to consistent with the radial direction of machined object, and the axle center of the axle center of first tool member and second tool member is configured to constitute the angle θ of regulation and intersects at the kernel of section of machined object.
11. the processing unit (plant) of columnar part according to claim 8 is characterized in that,
Described processing unit (plant) possesses first machining cell and second machining cell on the same cross section that is disposed at machined object, the axle center of first machining cell and second machining cell is configured to consistent with the radial direction of machined object, and the axle center of the axle center of first tool member and second tool member is configured to constitute the angle θ of regulation and intersects at the kernel of section of machined object.
12. the processing unit (plant) of columnar part according to claim 9 is characterized in that,
Described processing unit (plant) possesses first machining cell and second machining cell on the same cross section that is disposed at machined object, the axle center of first machining cell and second machining cell is configured to consistent with the radial direction of machined object, and the axle center of the axle center of first tool member and second tool member is configured to constitute the angle θ of regulation and intersects at the kernel of section of machined object.
13. the processing unit (plant) of columnar part according to claim 8 is characterized in that,
For described processing unit (plant), the granularity that is mixed in the abrasive particle of described bristle material is F180~#2000, select the different tool member of granularity of two or more abrasive particles, and this tool member is arranged continuously in the mode of carrying out attrition process according to the order of granularity from " slightly " to " carefully " of abrasive particle.
14. the processing unit (plant) of columnar part according to claim 9 is characterized in that,
The granularity that described machining cell possesses the abrasive particle that constitutes described grinding stone is grinding stone, rough lapping abrasive brush and the smooth grinding abrasive brush of F90~F220 or #240~#500, described rough lapping is #240~#500 with the granularity of the abrasive particle that bristle material or the elastomer of abrasive brush contains, and described smooth grinding is #800~#1200 with the granularity of the abrasive particle that brush contains.
15. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Remove the minute crack of distance below 200 μ m that is present in apart from the top layer of described columnar part, and the surface roughness Ry of machined surface is machined to below the 3 μ m.
16. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described columnar part is the crystalline material of hard fragility such as silicon, pottery, crystal, sapphire, GaAs, gallium phosphide, gallium nitride, single-crystal silicon carbide, lithium tantalate, lithium niobate, indium phosphide.
17. the processing unit (plant) of columnar part according to claim 1 is characterized in that,
Described columnar part is quartzy, described processing unit (plant) be used for quartzy base outer peripheral face minute crack remove and pastes from described quartzy base section and must thin plate and form this blocks behind the blocks outer peripheral face minute crack remove at least any one.
CN2011800642741A 2011-05-31 2011-07-21 Device for machining columnar member Pending CN103282173A (en)

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CN103722480A (en) * 2013-12-30 2014-04-16 天津英利新能源有限公司 Silicon block polishing device and method
CN103722480B (en) * 2013-12-30 2016-04-13 天津英利新能源有限公司 A kind of silico briquette burnishing device and silico briquette finishing method
CN105033784A (en) * 2015-08-26 2015-11-11 成都超迈光电科技有限公司 Full-automatic grinder for outer circle grinding of ultra-hard and ultra-crisp artificial lens material
CN107139075A (en) * 2017-06-20 2017-09-08 同济大学 A kind of processing unit (plant) for quartz glass cylinder mirror polish
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CN107571106A (en) * 2017-10-18 2018-01-12 衡山同远机械有限公司 Axle processes on-line checking grinding machine
CN111015489A (en) * 2019-11-22 2020-04-17 山西迪迈沃科光电工业有限公司 Polishing device for outer surface of revolving body
CN111015489B (en) * 2019-11-22 2021-05-18 山西迪迈沃科光电工业有限公司 Polishing device for outer surface of revolving body
CN113547408A (en) * 2020-04-23 2021-10-26 内蒙古中环协鑫光伏材料有限公司 Cylindrical grinding method for monocrystalline silicon square rod
CN114083409A (en) * 2021-11-24 2022-02-25 广东日钢机械有限公司 Polishing mechanism with coarse and fine polishing integrated design

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