TW201242455A - Method for manufacturing substrate for light emitting element and substrate for light emitting element - Google Patents
Method for manufacturing substrate for light emitting element and substrate for light emitting element Download PDFInfo
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- TW201242455A TW201242455A TW101104495A TW101104495A TW201242455A TW 201242455 A TW201242455 A TW 201242455A TW 101104495 A TW101104495 A TW 101104495A TW 101104495 A TW101104495 A TW 101104495A TW 201242455 A TW201242455 A TW 201242455A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
201242455 六、發明說明： c發明所屬技術領域;j 發明領域 本發明係有關於一種發光元件用基板之製造方法及發 光元件用基板’特別是有關於一種具有錐狀側面之孔腔的 陶瓷發光元件用基板之製造方法及陶竞發光元件用基板。 c先前技術3 發明背景 習知，用以搭載發光二極體元件等發光元件之發光元 件用基板（以下有時僅稱為元件基板）由在絕緣基板之表面 或内部配設有配線導體層之構造構成。此發光元件用基板 之代表例有由陶瓷構成之陶瓷絕緣基板，其一例有由氧化 鋁陶瓷構成之絕緣基板（以下稱為氧化鋁基板）。有為下述結 構者’前述結構係於此氧化鋁基板之上部形成用以收容發 光元件之孔腔，又’於氧化鋁基板之表面及内部配設由鎢、 鉬等高熔點金屬構成之複數個配線導體層，而與收容於孔 腔底面之發光元件電性連接。 又，絕緣基板除了氧化鋁基板以外，由於低溫燒成化、 低介電常數化及可進行高導電性之銅、銀配線等，提出了 以低熔點玻璃及陶瓷構成之稱為低溫共燒陶瓷（L〇w201242455 VI. Description of the Invention: The present invention relates to a method for manufacturing a substrate for a light-emitting element and a substrate for a light-emitting element, and more particularly to a ceramic light-emitting device having a cavity having a tapered side surface A substrate manufacturing method and a substrate for a ceramic light-emitting element. C. Prior Art 3 BACKGROUND OF THE INVENTION A light-emitting element substrate (hereinafter sometimes referred to simply as an element substrate) for mounting a light-emitting element such as a light-emitting diode element is provided with a wiring conductor layer on the surface or inside of an insulating substrate. Construction composition. A representative example of the substrate for a light-emitting element is a ceramic insulating substrate made of ceramic, and an insulating substrate made of an alumina ceramic (hereinafter referred to as an alumina substrate) is exemplified. There is a structure in which the above structure is formed by forming a cavity for accommodating a light-emitting element on the upper surface of the alumina substrate, and a plurality of high-melting-point metals such as tungsten or molybdenum are disposed on the surface and inside of the alumina substrate. The wiring conductor layers are electrically connected to the light-emitting elements housed in the bottom surface of the cavity. In addition to the alumina substrate, the insulating substrate is low-temperature calcination, low dielectric constant, copper or silver wiring capable of high conductivity, and low-melting glass and ceramics are called low-temperature co-fired ceramics. (L〇w
Temperature Co-fired Ceramics。以下表示為 LTCC。）之玻璃 陶瓷基板。在本說明書中，上述陶瓷絕緣基板或玻璃陶瓷 基板總稱為陶瓷基板。 對上述發光元件用基板要求之特性可舉耐候性、取光 S. 201242455 效率、熱傳導性等為例。在該等特性中，用以使取光效率 提高，或增強光之指向性之結構，迄今一般所進行者係以 於收容上述發光元件之孔腔之表面施行銀反射膜等金屬 層，並且，將孔腔之側面朝上部擴展成錐狀之結構等。 在此，具有孔腔之陶瓷基板通常係藉使具有開口部之 框體接合於平板狀基體上而製作。形成具有上述錐狀側面 之孔腔之方法，一般係於基體用生胚薄片上積層開口部之 大小不同之複數片框體用生胚薄片，形成為孔腔具有階梯 狀内壁面之生胚薄片積層體後，去除階梯之角。去除階梯 之角之方法，已知有藉使用模具之單轴加壓而將角壓碎之 方法、以研磨機等削除角之方法等。然而，模具高價，以 研磨機所行之方法生產性差而為問題。 另一方面，於孔腔之側面設均一之金屬層之方法已知 有積層複數片孔腔用生胚薄片，於最上層配置表面具有金 屬層之開口部最小之生胚薄片，接著，將最上詹之生胚薄 片於内側變形加工成其一部份形成孔腔之側面者（例如參 照專利文獻1〜3)。 在該等之方法中，於以最上層生胚薄片形成孔腔之側 面之變形加工之際，藉調整其角度，或在專利文獻3中，將 最上層以外之框體生胚薄片積層多層且形成階梯狀，可形 成具有錐狀側面之孔腔。然而，在該等方法中，當欲取得 錐狀側面時，有在孔腔側面，於最上層之生胚薄片與其以 外之框體用生胚薄片間產生空隙，或錐狀之傾斜無法形成 均一等之問題。 201242455 先行技術文獻 專利文獻 專利文獻1:日本專利公開公報2006-181779號 專利文獻2 :日本專利公開公報2007-235129號 專利文獻3 :曰本專利公開公報2007-251154號 C發明内容3 發明概要 發明欲解決之課題 本發明之目的在於提供以經濟且簡便之方法，將具有 錐狀側面之孔腔之陶瓷基板製造成精確度佳且錐之傾斜& 一之方法及錐狀側面具有具特徵之孔腔之陶瓷基板。 用以欲解決課題之手段 本發明之元件基板之製造方法係一種發光元件用基板 之製造方法，係製造元件基板者；該元件基板具有主面平 坦之板狀之陶瓷基體、及形成於前述基體之上側主面且具 有實質上朝上部擴展之錐狀内壁面之陶瓷框體，並於以前 述基體之上側主面之一部份為底面、以前述框體之内壁面 為侧面而形成之孔腔的底面具有發光元件之搭載部；該發 光元件用基板之製造方法的特徵在於以下述生胚薄片製作 前述陶瓷基體及陶瓷框體，且包含下述(A)步驟至(F)步驟： (A)使用含有陶瓷粉末及黏合劑樹脂之陶瓷組成物，製作具 有主面平坦之板狀之基體用生胚薄片、及於中央部具有相 互為相似形狀，面積各不相同之開口部的複數片板狀之框 體積層用生胚薄片，將前述複數片框體積層用生胚薄片從 5Temperature Co-fired Ceramics. The following is expressed as LTCC. ) Glass ceramic substrate. In the present specification, the above ceramic insulating substrate or glass ceramic substrate is collectively referred to as a ceramic substrate. The characteristics required for the substrate for a light-emitting element are, for example, weather resistance and light extraction. S example 201242455 Efficiency, thermal conductivity, and the like are exemplified. Among these characteristics, a structure for improving the light extraction efficiency or enhancing the directivity of light has been conventionally performed by applying a metal layer such as a silver reflective film to the surface of the cavity in which the light-emitting element is housed. A structure in which the side of the cavity is expanded toward the upper portion into a tapered shape. Here, the ceramic substrate having the cavities is usually produced by bonding a frame having an opening to a flat substrate. The method for forming the cavity having the tapered side surface is generally formed by stacking the raw piece of the frame body with different sizes of the opening portions on the base sheet, and forming the green sheet having the stepped inner wall surface of the cavity After laminating the body, remove the corner of the step. As a method of removing the corner of the step, a method of crushing the corner by uniaxial pressing using a mold, a method of removing the corner by a grinder or the like, and the like are known. However, the high cost of the mold is a problem in that the productivity of the grinder is poor. On the other hand, in the method of providing a uniform metal layer on the side of the cavity, it is known to laminate a plurality of sheets of the cavity for the green sheet, and the uppermost layer has the smallest green sheet of the opening of the metal layer, and then the uppermost layer The Zhan Zhisheng embryo sheet is deformed on the inner side to form a side surface of the cavity (see, for example, Patent Documents 1 to 3). In the above method, when the deformation processing of the side surface of the uppermost raw sheet is formed, the angle is adjusted, or in Patent Document 3, the shell embryo sheet other than the uppermost layer is laminated and Formed in a stepped shape, a cavity having a tapered side surface can be formed. However, in these methods, when the tapered side surface is to be obtained, there is a gap between the raw sheet of the uppermost layer and the frame of the outer layer, and the inclination of the cone is not uniform. Waiting for the problem. Japanese Patent Publication No. 2006-181779 Patent Document 2: Japanese Patent Publication No. 2007-235129 Patent Document 3: Japanese Patent Publication No. 2007-251154 C SUMMARY OF THE INVENTION 3 SUMMARY OF THE INVENTION Problem to be Solved The object of the present invention is to provide an economical and simple method for manufacturing a ceramic substrate having a cavity having a tapered side surface with a high precision and a tilting of a cone and a tapered side having a characteristic Ceramic substrate for the cavity. Means for Solving the Problem A method for producing a device substrate according to the present invention is a method for producing a substrate for a light-emitting device, wherein the device substrate has a plate-shaped ceramic substrate having a flat main surface, and is formed on the substrate a ceramic frame body having a tapered inner wall surface extending substantially upward toward the upper main surface, and a hole formed by one of the upper main surface of the base body as a bottom surface and the inner wall surface of the frame body as a side surface The bottom surface of the cavity has a mounting portion for the light-emitting element, and the method for manufacturing the substrate for a light-emitting element is characterized in that the ceramic substrate and the ceramic frame are produced by the following green sheet, and the steps (A) to (F) are included: A) Using a ceramic composition containing a ceramic powder and a binder resin, a green sheet for a base having a flat main surface and a plurality of openings having mutually similar shapes and different areas at the center portion are produced. The plate-shaped frame volume layer is formed by the green sheet, and the plurality of frame volume layers are formed from the raw sheet.
S 201242455 下側以開口部之面積由小至大之順序積層於前述基體用生 胚薄片上側主面’而使該框體積層用生胚薄片之積層部内 壁面形成階梯狀，而獲得第1積層體；（B)將在前述(A)步驟 所得之第1積層體均力加壓，而將前述框體積層用生胚薄片 之積層部於内壁面具有之階梯狀角圓化；（c)使用含有陶瓷 粉末及黏合劑樹脂之陶瓷組成物，製作於中央部具有開口 部之板狀之框體最外層用生胚薄片，該板狀之框體最外層 用生胚薄片的開口部係與前述框體積層用生胚薄片之開口 部形狀相似且面積小於前述積層於最下部之框體積層用生 胚薄片之開口部的面積者；（D)將在前述(〇步驟所得之框體 最外層用生胚薄片於前述(B)步驟後之第1積層體之最上部 進一步積層成前述開口部之中心與前述積層於最下部之框 體積層用生胚薄片之前述開口部之中心約略一致，而獲得 第2積層體；（E)將在前述(p)步驟所得之第2積層體均力加 壓’而加工成形成為前述框體最外層用生胚薄片從前述框 體積層用生胚薄片積層部之最上面覆蓋内壁面之結構，而 獲得未燒結發光元件用基板；（F)將前述未燒結發光元件用 基板燒成。 在上述元件基板之製造方法中，上述(A)步驟至(F)步驟 以上述順序進行為典型。然而，（C)步驟只要於(D)步驟前進 行即可’舉例言之，可在(A)步驟及/或(B)步驟前進行(c)步 驟’又，亦可在同一步驟中進行(C)步驟與(A)步驟及/或⑼ 步驟’或者與(A)步騾及/或(B)步驟同時進行(C)步驟。 又，本發明之元件基板之製造方法係一種發光元件用S 201242455, the lower side of the opening is laminated on the upper main surface of the raw green sheet for the base body, and the inner wall surface of the laminated portion of the green sheet is formed in a stepped shape to obtain the first laminate. (B) uniformly pressurizing the first layered body obtained in the step (A), and rounding the stepped corner of the laminated portion of the raw layer of the raw layer of the frame volume layer on the inner wall surface; (c) Using a ceramic composition containing a ceramic powder and a binder resin, a green sheet of the outermost layer of the frame having an opening at the center portion is formed, and the opening of the outermost layer of the plate-shaped frame is formed by the opening of the green sheet. The opening of the green sheet of the frame volume layer is similar in shape and the area is smaller than the area of the opening of the raw sheet of the frame volume layer which is laminated on the lowermost portion; (D) will be the most in the frame obtained in the above step. The outer layer of the green sheet is further laminated on the uppermost portion of the first layered body after the step (B), and the center of the opening is approximately the same as the center of the opening of the raw sheet of the frame volume layer laminated on the lowermost portion. And get The second layered body is obtained; (E) the second layered body obtained in the above step (p) is uniformly pressed and formed into a green sheet for the outermost layer of the frame, and the raw sheet is laminated from the frame layer. The uppermost portion of the portion covers the inner wall surface to obtain the substrate for the unsintered light-emitting element, and (F) the substrate for the unsintered light-emitting element is fired. In the method for manufacturing the element substrate, the above steps (A) to (F) The steps are typically performed in the above order. However, the (C) step may be performed as long as it is performed before the step (D). For example, the step (c) may be performed before the step (A) and/or the step (B). Alternatively, the step (C) may be carried out in the same step as the step (A) and/or the step (9) or the step (C) may be carried out simultaneously with the step (A) and/or the step (B). The manufacturing method of the element substrate is a light-emitting element
S 6 201242455 基板之製造方法，係製造元件基板者；該元件基板具有主 平一之板狀之陶瓷基體、及形成於前述基體之上側主面 且具有實質上朝上部擴展之錐狀内壁面之陶聽體，並於 以前述基體之上魅面之-部份為底面、以前述框體之内 壁面為側面而形成之孔腔的底面具有發光元件之搭載部； 該發光元件用基板之製造方法的特徵在於以下述生胚薄片 製作前述陶瓷基體及陶瓷框體，且包含下述(a)步驟至步 驟：（a)使用含有陶瓷粉末及黏合劑樹脂之陶瓷組成物，製 作具有主面平坦之板狀之基體用生胚薄片、及於中央部具 有相互為相似形狀且面積各不相同.之開口部的複數片板狀 之框體積層用生胚薄片，將前述複數片框體積層用生胚薄 片從下側以開口部之面積由小至大之順序積層於前述基體 用生胚薄片上側主面’以使該框體積層用生胚薄片之積層 部内壁面形成階梯狀’而獲得第1積層體；（b)將在前述(a) 步驟所得之第1積層體均力加壓，而將前述框體積層用生胚 薄片之積層部於内壁面具有之階梯狀角圓化；（c)使用含有 陶瓷粉末及黏合劑樹脂之陶瓷組成物，製作於中央部具有 開口部之板狀之框體最外層用生胚薄片，該板狀之框體最 外層用生胚薄片的開口部係與前述框體積層用生胚薄片之 開口部形狀相似，面積小於前述積層於最下部之框體積層 用生胚薄片之開口部的面積者，然後，將前述框體最外層 用生胚薄片於前述(b)步驟後之第1積層體之最上部進 積層成開口部之中心與前述積層於最下部之框體積層用生 胚薄片之開口部之中心約略一致，而獲得第1積層體； 7 f. 201242455 =前_步驟所得之第2積層體均力加壓，而加工成形成 為則述框體最外層用生胚薄歧前述框體積層社胚薄片 積層部之最上面覆蓋内壁面之結構，而獲得未燒結發光元 件用基板；⑷將前述未燒結發光元件用基板燒成。 在此，約略一致係指可以目視確認為一致。 又’貫質上朝上部擴展之錐狀内壁面係指可具有一部 份垂直之部份或朝下部為錐狀之部份，而在框體之高度約 观以上之部份具有内壁面朝上部擴展之形狀。 在本發明之製造方法之前述（B)步驟及前述（b)步驟 中’且進行均力加壓’俾使經圓化之階梯狀角之曲率半徑R 係依具有前述經圓化之角之各個框體積層用生胚薄片，於 凜生胚溥片之燒成後之厚度(mm)乘上〇 7〜15之值。 在本發明之製造方法之前述(B)步驟及前述(b)步驟之 則述第1積層體之均力加壓宜於前述第丨積層體之至少上側 加壓面上配設第1樹脂薄臈而進行，在前述步驟或(❼步 驟之岫述第2積層體之均力加壓宜於前述第2積層體之至少 上側加壓面上配设第2樹脂薄膜而進行。 再者’在前述(B)及前述(b)步驟之均力加壓宜在超過前 述框體積層用生胚薄片含有之前述黏合劑樹脂之玻璃轉移 溫度、且較玻璃轉移溫度高2〇°c之溫度以下之溫度範圍， 並在10〜30MPa之壓力範圍進行，在前述(E)步驟或前述(d) 步驟之均力加壓宜在超過前述框體最外層用生胚薄片含有 之前述黏合劑樹脂之玻璃轉移溫度、且較玻璃轉移溫度高 20°C之溫度以下之溫度範圍，並在10〜3〇MPa之壓力範圍 201242455 進行。 在本發明之製造方法中，用於前述步驟及<S 6 201242455 A method of manufacturing a substrate, comprising: a ceramic substrate having a main flat plate shape; and a ceramic base formed on an upper main surface of the base body and having a tapered inner wall surface extending substantially upward. a body having a light-emitting element on a bottom surface of the cavity formed by the inner surface of the frame as a side surface, and a substrate for the light-emitting element; The present invention is characterized in that the ceramic substrate and the ceramic frame are produced from the following green sheet, and comprises the following steps (a) to: (a) using a ceramic composition containing a ceramic powder and a binder resin to produce a flat surface having a main surface. a plate-shaped base body using a green sheet and a plurality of sheet-shaped frame-volume layers for the opening portions having different shapes and different areas at the center portion, and the plurality of sheet-shaped volume layers are used for the raw sheet The embryonic sheet is laminated from the lower side in the order of the area of the opening from the upper side to the upper side of the base sheet for the base sheet so that the inner layer of the layer of the raw sheet is used for the frame layer The surface is formed in a stepped shape to obtain a first layered body; (b) the first layered body obtained in the step (a) is uniformly pressurized, and the laminated portion of the framed layer for the raw sheet is provided on the inner wall surface. The stepped corner is rounded; (c) using a ceramic composition containing a ceramic powder and a binder resin, the outermost layer of the frame body having the opening at the center has a green sheet, and the plate-shaped frame is the most The opening of the raw sheet for the outer layer is similar to the shape of the opening of the raw sheet of the frame volume layer, and the area is smaller than the area of the opening of the raw sheet of the frame volume layer which is laminated on the lowermost portion, and then the The outermost layer of the frame is formed by the green sheet at the center of the opening of the first layered body after the step (b), and the center of the opening of the raw sheet of the frame layer which is laminated at the lowermost portion. Consistently, the first laminate is obtained; 7 f. 201242455 = the second laminate obtained in the previous step is uniformly pressurized, and is formed into the outermost layer of the frame by the raw embryo. The top of the layer is covered The surface structure, to obtain a non-sintered substrate for light-emitting element; ⑷ the aforesaid non-sintered substrate for light-emitting element is fired. Here, the approximate agreement means that it can be visually confirmed to be consistent. Further, the tapered inner wall surface extending toward the upper portion means a portion having a vertical portion or a tapered portion toward the lower portion, and the portion above the height of the frame body has an inner wall facing The shape of the upper extension. In the above-mentioned (B) step and the aforementioned step (b) of the manufacturing method of the present invention, 'and uniformly pressurizing' is performed so that the radius of curvature R of the rounded stepped angle is based on the rounded corner. Each frame volume layer is made of a green sheet, and the thickness (mm) after firing of the green sheet is multiplied by a value of 〇7-15. In the above-described (B) step and the (b) step of the manufacturing method of the present invention, it is preferable that the first laminated body is provided with a first resin thinner on at least the upper pressing surface of the second layered product. In the above-mentioned step, the second resin film is disposed on at least the upper pressure surface of the second layered body, and the second pressure film is applied to the second layered body. The pressure equalization of the steps (B) and (b) above is preferably higher than the glass transition temperature of the binder resin contained in the raw sheet of the frame volume layer and lower than the glass transition temperature by 2 ° C. The temperature range is carried out in a pressure range of 10 to 30 MPa, and the pressure of the above-mentioned (E) step or the above-mentioned (d) step is preferably carried out in excess of the above-mentioned binder resin contained in the outermost layer of the frame. The glass transition temperature and the temperature range below the temperature of 20 ° C higher than the glass transition temperature are carried out in a pressure range of 2012 to 4 MPa of 10 to 3 MPa. In the manufacturing method of the present invention, the above steps and <
步驟之前述第1樹脂薄膜之膜厚宜為5G〜8Gpm，/述⑻ 2^1 δ.'θ,ι ^ 'Η'以 JIS C 8利疋之斷裂強度為15〇〜210MPa，用於前述来 ⑷步驟之前述第2樹脂薄膜之膜厚宜為30〜5〇_，f Μ C 2318測定之斷裂強度為23〇〜3〇〇Mpa。又，前迷^JIS 缚膜及第2樹脂薄膜之材質皆宜為聚對峨乙二^第1樹脂 為PET)。再者，在前述(b)步驟、前述(B)步驟、前述下稱 驟、及觔述(d)步驟之均力加壓皆宜以水壓機進行。步 在本發明之製造方法中，前述框體積層用生极 刖述框體最外層用生胚薄片之厚度，各自燒成房片及 為50〜2〇〇μιη。又’在本發明之製造方法中，在前迷= 驟，之前述框體積層用生胚薄片積層部之階梯狀内辟 步 依則述階梯之各階，燒錢之雜之與前述基體用生肢” 片之主面保持水平之面的寬度宜為該階之高度之：广 0 •上.2 本發明之元件基板係以上述本發明之製造方法而得之 =基板，前述框體之内壁面在從與前述基體之交界部至 ”月_』述框體最外層用生胚薄片之燒錢之厚度約略同等之 而度的位置，射射部擴展之錐狀，較前述位置上部係 朝上部擴展之錐狀。 从下’在本說明書中，生胚薄片之厚度及尺寸只要未 特別限制，便係指燒錢之厚度及尺寸。 本發明之另一態樣之元件基板（以下稱為第2態樣之元 9 S: 201242455 平坦之板狀之㈣基體、及形成於前述 Γ=_，並於以前述基體之上側主面 ==面、以前述框體之内壁面為側面而形成之孔 元件之搭載部，又，前述框體之内壁面 f腔底面附近之區域，具有朝孔腔底面擴展之錐狀，在 “孔腔底面附近之外之區域具有朝上部擴展之錐狀。 上速第2態樣之元件基板可舉下述元件基板為例，前述 讀基板係前述陶魅體係將巾央料有相互為相似形狀 且面積各不相同之開口部的複數片板狀之生胚薄片，除了 開口部之面積最小之生胚薄片外，從下側以開口部之面積 由小至大之順序積層’再將開口部之面積最小之生胚薄片 積層於最上部後’將前述最上部之生胚薄片彎曲加工成其 開口部側之-部份覆蓋其以外之生胚薄片積層體之内壁 ,且其開口部側之端面到達前述孔腔之底面的結構，然 後燒成而得者；在前述孔腔底_近之區域具有朝孔腔底 面擴展之錐狀之部份係以燒成後之前述端面構成。 又，在上述苐2態樣之元件基板中，前述框體内壁面之 >、有朝孔腔底面擴展之錐狀之區域宜為從該孔腔底面至前 迷樞體之高度之1/1〇〜3/1〇之高度之位置的區域。 顯示上述數值範圍之「〜」只要無特殊之規定，係使 用為包含記載於其前後之數值而作為下限值及上限值之涵 義’以下’在本發明書中，「〜」以同樣之涵義使用。 發明致果 根據本發明’可以經濟且簡便之方法，將具有錐狀側The film thickness of the first resin film in the step is preferably 5 G to 8 Gpm, /(8) 2^1 δ.'θ, ι ^ 'Η' is a rupture strength of 15 〇 to 210 MPa in JIS C 8 for use in the foregoing The film thickness of the second resin film in the step (4) is preferably 30 to 5 Å, and the breaking strength measured by f Μ C 2318 is 23 〇 to 3 〇〇 Mpa. Further, it is preferable that the materials of the first JIS film and the second resin film are poly(p-butylene) and the first resin (PET). Further, the pressure equalization in the steps (b), (B), the lower step, and the step (d) is preferably carried out by a hydraulic press. In the manufacturing method of the present invention, the frame volume layer is formed by using the thickness of the green sheet of the outermost layer of the frame, and each of the frame sheets is fired into a room piece and is 50 to 2 μm. Further, in the manufacturing method of the present invention, in the preceding step, the frame volume layer is stepped by the step of the green sheet laminate portion, and the steps of the step are described. The width of the surface of the main surface of the limb is preferably the height of the step: wide 0. upper. 2 The component substrate of the present invention is obtained by the above-described manufacturing method of the present invention = the substrate, within the frame The wall surface is approximately equal to the thickness of the burnt money of the outermost layer of the frame from the boundary portion with the base body to the "month", and the projection portion expands in a tapered shape. The upper part is tapered. From the following, in the present specification, the thickness and size of the green sheet are not particularly limited, and refer to the thickness and size of the burnt money. Another aspect of the present invention is an element substrate (hereinafter referred to as a second aspect element 9 S: 201242455 flat plate-shaped (four) substrate, and formed on the above-mentioned Γ=_, and on the upper side of the substrate: = a surface, a mounting portion of the hole member formed by the inner wall surface of the frame as a side surface, and a region in the vicinity of the bottom surface of the inner wall surface f of the frame body has a tapered shape extending toward the bottom surface of the cavity, and the "cavity" The region other than the vicinity of the bottom surface has a tapered shape that expands toward the upper portion. The element substrate of the second aspect of the upper speed is exemplified by the following element substrate, and the read substrate is a similar shape to the glazed system. The plurality of plate-shaped green sheets of the openings having different areas have the smallest area of the opening, and the layers are opened from the lower side in the order of the area of the opening. The smallest area of the green sheet is laminated on the uppermost portion, and the uppermost green sheet is bent into the opening side thereof to partially cover the inner wall of the raw sheet laminate, and the end face of the opening side Reach the bottom surface of the aforementioned cavity The structure is then fired; the tapered portion extending toward the bottom surface of the cavity in the vicinity of the bottom of the cavity is formed by the aforementioned end face after firing. In the element substrate, the inner wall surface of the frame and the tapered region extending toward the bottom surface of the cavity are preferably 1/1 〇 to 3/1 高度 from the bottom surface of the cavity to the height of the front cavity. In the present invention, the term "~" is used in the present invention as long as it has no special provisions. It is used as the lower and upper limit values. ~" is used in the same sense. According to the invention, it can be economical and simple, and will have a tapered side
S 10 201242455 面之孔腔之陶瓷基板製造成精確度佳且錐之傾斜均一。 又，可提供錐狀側面具有具特徵之孔腔之陶瓷基板。 圖式簡單說明 第1(a)圖-第1(b)圖係顯示使用以本發明之製造方法而 得之元件基板之發光裝置之一例的平面圖及截面圖。 第2(a)圖-第2(b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的（A)步驟後、或（a)步驟後之第1積層體 之平面圖及截面圖。 第3(1)圖-第3(2)圖係示意顯示本發明元件基板之製造 方法之(B)步驟或(b)步驟的截面圖。 第4(a)圖-第4(b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的(B)步驟後、或(b)步驟後之第1積層體 之平面圖及截面圖。 第5(a)圖-第5(b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的(D)步驟後、或（c)步驟後之第2積層體 之平面圖及截面圖。 第6(1)圖-第6(2)圖係示意顯示本發明元件基板之製造 方法之(E)步驟或(d)步驟的截面圖。 第7 (a)圖-第7 (b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的(E)步驟後、或(d)步驟後之第2積層體 (未燒結元件基板)之平面圖及截面圖。 I：實施方式3 用以實施發明之形態 以下，一面參照圖，一面說明本發明之實施形態。此The ceramic substrate of the S 10 201242455 surface cavity is made with good precision and the slope of the cone is uniform. Further, a ceramic substrate having a tapered cavity having a tapered side surface can be provided. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(a) to Fig. 1(b) are a plan view and a cross-sectional view showing an example of a light-emitting device using an element substrate obtained by the manufacturing method of the present invention. 2(a) to 2(b) are plan views and cross-sectional views showing the first laminate after the step (A) or after the step (a), which is an example of the embodiment of the method for producing the element substrate of the present invention. . Fig. 3(1) to Fig. 3(2) are schematic cross-sectional views showing the step (B) or the step (b) of the method of manufacturing the element substrate of the present invention. 4(a) to 4(b) are plan and cross-sectional views showing the first laminate after the step (B) or the step (b), which is an example of the embodiment of the method for producing the element substrate of the present invention. . 5(a) to 5(b) are plan and cross-sectional views showing the second laminate after the step (D) or after the step (c), which is an example of the embodiment of the method for producing the element substrate of the present invention. . Fig. 6(1) to Fig. 6(2) are schematic cross-sectional views showing the (E) step or the (d) step of the method of manufacturing the element substrate of the present invention. 7(a) to 7(b) are diagrams showing the second laminated body (unsintered element substrate) after the step (E) or after the step (d), which is an example of the embodiment of the method for manufacturing the element substrate of the present invention. Plan and section view. I. Embodiment 3 Mode for Carrying Out the Invention Hereinafter, an embodiment of the present invention will be described with reference to the drawings. this
S 11 201242455 外，本發明非限定於下述說明來解釋者。 第1圖係顯示使用以本發明之製造方法而得之元件基 板之發光裝置之一例的平面圖（a)及其X-X線截面圖（b)。 本發明之製造方法係適用於如第1圖所示之元件基板1 之製造，該元件基板具有主面平坦之板狀之陶瓷基體2(以 下有時亦僅稱為基體）、及形成於前述基體2之上側主面21 且具有實質上朝上部擴展之錐狀内壁面25之陶瓷框體3，並 於以前述基體2之上側主面之一部份為底面24、以前述框體 之内壁面為側面而形成之孔腔4的底面24，具有發光元件之 搭載部22。 在本說明書中，主面平坦之板狀之基體係指上側 '下 側之主面皆具有以目視標準可辨識為平板形狀之標準的平 坦面之基體，以下，「約略平板狀之基體」係指上下主面由 此種平坦面構成之基體。又，以下將基體之上側主面僅稱 為主面，將下側主面稱為背面。再者，以下省略之標記與 上述同樣地，只要未特別限制，便係指可以目視標準如此 辨識之標準。 在元件基板1中，於以基體2之主面21之—部份構成之 孔腔4之底面24上，分職發光元件具有之〜對電極電性連 接的元件_料5,⑽料紐光辑”抑 之周邊部、具體為兩㈣向之狀態， 七& 對且呈約略長 於基體2之背面23設有與外部電路電性連 一 部連接端子6，於基體2之内部，設有__ 之一到 '上迷元件The present invention is not limited to the following description, except for S 11 201242455. Fig. 1 is a plan view (a) showing an example of a light-emitting device using the element substrate obtained by the manufacturing method of the present invention, and an X-X line sectional view (b) thereof. The manufacturing method of the present invention is applied to the production of the element substrate 1 as shown in Fig. 1, which has a plate-shaped ceramic substrate 2 having a flat main surface (hereinafter sometimes referred to simply as a substrate), and is formed in the foregoing a ceramic frame body 3 having a main surface 21 on the upper side of the base body 2 and having a tapered inner wall surface 25 extending substantially toward the upper portion, and a portion of the upper main surface of the base body 2 as a bottom surface 24, and the inside of the frame body The bottom surface 24 of the cavity 4 formed by the side surface of the wall has a mounting portion 22 of the light-emitting element. In the present specification, the base system in which the main surface is flat is referred to as a base having a flat surface which can be recognized as a flat plate shape by a visual standard on the upper side of the lower side, and the "approximate flat base" is hereinafter. Refers to the base body whose upper and lower main faces are composed of such flat faces. Further, in the following, the upper main surface of the substrate is referred to as a main surface, and the lower main surface is referred to as a rear surface. Incidentally, the same reference numerals as hereinafter omitted, unless otherwise specified, refer to standards that can be visually recognized by the standard. In the element substrate 1, on the bottom surface 24 of the cavity 4 formed by the portion of the main surface 21 of the substrate 2, the component of the light-emitting element having the opposite electrode is electrically connected to the electrode 5, (10) In the peripheral portion, specifically in the state of two (four) directions, the seventh and the opposite side of the base body 2 are provided with a connecting terminal 6 electrically connected to the external circuit, and are provided inside the base body 2, __ one to the 'on the component
S 12 201242455 而子5.'外。卩連接端子6電性連接之貫穿導體7。以下，亦有 將元件連接端子1、外部連接端子6及貫穿導體7統稱為「配 線導體」之情形。 在第1圖所示之發光裝置10中，於上述元件基板1之搭 載部22搭載發光元件丨丨，該圖中未示之發光元件u之電極 以金屬線12電性連接於元件連接端子5。發光裝置1〇更構成 為藉由設置密封層13，以覆蓋如上述配設於孔腔4之底面24 之發光元件11或金屬線12，並且，填充孔腔4。 以下’以第1圖所示之發光裝置10之元件基板丨為例， 面參照第2圖〜第7圖，一面就具有(A)步驟至(F)步驟之本 發明製造方法及具有下述(a)步驟至（e)步驟之本發明之製 造方法作說明。 此外’以下’在本發明之製造方法之說明中，（A)步驟 及（a)步驟以（A)步驟說明，（B)步驟及(b)步驟以（B)步驟說 明，（E)步驟及⑷步驟以(E)步驟說明，（F)步驟及⑷步驟以 (F)步驟說明。又，關於(c)步驟之說明，準用（〇步驟及(D) 少·驟之說明。 (A)步驟 該步驟係使用含有陶瓷粉末及黏合劑樹脂之陶究組成 物，製作具有主面平坦之板狀之基體用生胚薄片、及於中 夹部具有相互為相似形狀且面積各不相同之開口部的複數 片板狀之框體積層用生胚薄片，而製作積層體，該積屛體 係將前述複數片框體積層用生胚薄片，從下側以開口部之 面積由小至大之順序積層於前述基體用生胚薄片上側主 13 1 201242455 面，而使該框體積層用生胚薄片之積層部内壁面形成階梯 狀者（以下稱為第1積層體)(以下，稱為第1積層步驟。）。 (B) 步驟 該步驟係將在前述(A)步驟所得之第1積層體均力加 壓，而將前述框體積層用生胚薄片之積層部於内壁面具有 之階梯狀角圓化（以下稱為第1均力加壓步驟。）。 (C) 步驟 該步驟係使用含有陶瓷粉末及黏合劑樹脂之陶瓷組成 物，製作於中央部具有開口部之板狀之框體最外層用生胚 薄片，該板狀之框體最外層用生胚薄片的開口部係與前述 框體積層用生胚薄片之開口部形狀相似，且面積小於前述 積層於最下部之框體積層用生胚薄片之開口部的面積。 (D) 步驟 該步驟係將在前述(C)步驟所得之框體最外層用生胚 薄片，於前述(B)步驟後之第1積層體之最上部，進一步積 層成前述開口部之中心與前述積層於最下部之框體積層用 生胚薄片之前述開口部之中心約略一致，而獲得第2積層體 (以下稱為第2積層步驟。）。 (E) 步驟 該步驟係將在前述(D)步驟所得之第2積層體均力加 壓，而加工成形成為前述框體最外層用生胚薄片從前述框 體積層用生胚薄片積層部之最上面覆蓋内壁面之結構，而 獲得作為發光元件用基板之未燒結元件基板（以下稱為第2 均力加壓步驟。）。S 12 201242455 and sub. 5.' outside. The connecting terminal 6 is electrically connected to the through conductor 7. Hereinafter, the element connection terminal 1, the external connection terminal 6, and the through conductor 7 are collectively referred to as a "wiring conductor". In the light-emitting device 10 shown in FIG. 1 , a light-emitting element 搭载 is mounted on the mounting portion 22 of the element substrate 1 , and an electrode of the light-emitting element u (not shown) is electrically connected to the element connection terminal 5 by a metal wire 12 . . The light-emitting device 1 is further configured to cover the light-emitting element 11 or the metal wire 12 disposed on the bottom surface 24 of the cavity 4 as described above by providing the sealing layer 13, and to fill the cavity 4. In the following, the element substrate 发光 of the light-emitting device 10 shown in Fig. 1 is taken as an example, and the manufacturing method of the present invention having the steps (A) to (F) is described with reference to Figs. 2 to 7 and has the following The manufacturing method of the present invention in the steps (a) to (e) is explained. Further, 'below' in the description of the manufacturing method of the present invention, the steps (A) and (a) are explained by the step (A), the steps (B) and (b) are explained by the step (B), and the step (E) And (4) the steps are explained by the step (E), and the steps (F) and (4) are explained by the step (F). Further, regarding the description of the step (c), the quasi-use (〇 step and (D) is small and the step is explained. (A) Step This step is to use a ceramic composition containing a ceramic powder and a binder resin to produce a flat surface having a main surface. The plate-shaped base body is made of a green sheet, and a plurality of plate-shaped frame-volume layer green sheets are formed in the intermediate portion having the openings having different shapes and different areas, and a laminated body is produced, and the laminate is produced. The system uses the green sheet of the plurality of frame volume layers to be laminated on the upper side of the base sheet 131 201242455 from the lower side in the order of the area of the opening portion, and the frame volume layer is used. The inner wall surface of the laminated portion of the embryo sheet is stepped (hereinafter referred to as a first layered body) (hereinafter referred to as a first layering step). (B) Step This step is the first layer obtained in the above step (A). The volume of the frame volume layer is rounded by a stepped angle on the inner wall surface of the laminated layer of the green sheet (hereinafter referred to as a first uniform force pressurizing step). (C) Step This step is performed. Use ceramics containing ceramic powder and binder resin The opening is formed in the outermost layer of the frame-shaped frame having the opening portion in the center portion, and the opening portion of the outermost layer of the plate-shaped frame is opened to the opening of the raw sheet of the frame volume layer The shape of the portion is similar, and the area is smaller than the area of the opening of the green sheet for the frame volume layer which is laminated on the lowermost portion. (D) Step This step is to use the green sheet of the outermost layer of the frame obtained in the above step (C). Further, the center of the opening is further laminated on the uppermost portion of the first layered body after the step (B), and the center of the opening portion of the raw sheet of the frame volume layer laminated on the lowermost portion is approximately aligned with the center of the opening portion The second layered product (hereinafter referred to as the second layering step). (E) Step This step is to uniformly pressurize the second layered body obtained in the above step (D), and to form the outermost layer of the frame. The green sheet is covered with the inner wall surface from the uppermost surface of the green sheet laminate portion of the frame volume layer, and an unsintered element substrate (hereinafter referred to as a second uniform force pressurizing step) is obtained as a substrate for a light-emitting element.
S 14 201242455 该少驟係將前述未燒結元件基板燒成（以下，稱為燒成 步鄉）。 第2圖〜第7圖係依各步驟示意顯示本發明元件基板之 製造方法之實施形態之一例的平面圖及截面圖。以下，關 於用於製造之構件’附上與完成品之構件相同之標號而進 行説明。舉例言之，陶瓷基體與陶瓷基體用生胚薄片以相 同之楳號2來標示’又，元件連接端子與元件連接端子用膏 声以相同之標5虎5來標不’其他亦相同。 驟：第1積層步驟 第2圖係顯示在本發明製造方法之一例中，以第1積層 少驟((A)之步驟）所得之第1積層體丨八之平面圖⑷及其Χ-Χ 線截面圖（b)的圖。 關於前述(A)步驟，以使用含有陶瓷粉末及黏合劑樹脂 之陶瓷組成物來製作約略平板狀之基體用生胚薄片2之步 驟((A-1)之步驟）、製作於中央部具有相互為相似形狀且面 積各不相同之開口部的複數片（在第2圖為3片）板狀之框體 積層用生胚薄片（3a、3b、3c)之步驟((A-2)之步驟）、及將在 上述（A-1)及(A-2)之步驟所得之各生胚薄片以預定順序積 層之步驟((A-3)之步驟）的順序，在以下說明。 (A-1)基體用生胚薄片2之製作 用於製作基體用生胚薄片2之含有陶瓷粉末與黏合劑 樹脂之陶免組成物，可舉製造元件基板時通常所使用之陶 篆組成物為例。此種陶瓷組成物具體言之，根據主要含有S 14 201242455 This is a small number of steps in which the unsintered element substrate is fired (hereinafter referred to as "sintering step"). Fig. 2 to Fig. 7 are plan views and cross-sectional views showing an example of an embodiment of a method of manufacturing the element substrate of the present invention, in accordance with each step. Hereinafter, the description will be made with respect to the member for manufacturing 'attached to the same reference numerals as the members of the finished product. For example, the ceramic substrate and the ceramic substrate are indicated by the same nickname 2 as the green sheet. In addition, the component connection terminal and the component connection terminal are labeled with the same standard 5 tiger 5, and the others are the same. Step 1: The first layering step Fig. 2 is a plan view (4) of the first layered body obtained by the first step of the first layer (step (A)) and its Χ-Χ line in an example of the manufacturing method of the present invention. Figure (b) of the cross-sectional view. In the step (A), the step of preparing the raw green sheet 2 for a base sheet (step (A-1)) using a ceramic composition containing a ceramic powder and a binder resin is carried out at the center portion. Steps of (A-2) for a plurality of sheets (three sheets in FIG. 2) of a plate-shaped frame volume layer having similar shapes and different sizes of openings ((A2)) And the step of laminating the respective green sheets obtained in the steps (A-1) and (A-2) in the predetermined order (step of (A-3)) will be described below. (A-1) Preparation of the base sheet 2 for the production of the base material for the base sheet 2 The ceramic composition containing the ceramic powder and the binder resin is used, and the ceramic composition generally used for the production of the element substrate is exemplified. For example. Specifically, such a ceramic composition is mainly contained
S 15 201242455 4 ^ 同’可舉出以氧化銘粉末為主成分之氧化 呂^結體用料組成物、以氮化銘粉末為主成分之氮化 心物m紅柱石粉末為主成分之 4 A結體用陶究粉末組成物、除了陶究粉末外 還含有玻璃粉末之LTCC用玻璃陶&成物等陶竞組成 物。關於陶瓷組成物含有之黏合劑樹脂及其他任意成分， 如後所述，在上述各陶究組成物t使用同樣者。 在此構成生胚薄片之陶究組成物最後在⑺步驟燒成 而形成為㈣，由於上述喊組成物各燒成溫度不同，故 通常基體2及以下說明之框體3包含框體最外層在内，由同 種陶£構成。構成各生胚薄片之_組成物只要由同種陶 繼’可依需要，依各生胚薄片改變原料組成，通常， 關於原料組成’亦使用在生胚薄片間無差異者。本發明之 製造方法使用LTCC用玻璃陶竟組成物作為陶曼組成物 時，因其具有製造容易性、易加I性，故特別是關於在框 體之内壁面㈣之錐之傾斜，可明顯地㈣角度之精確度 或均一性之效果。 a 此外，在本發明之製造方法中，若在上述各陶究組成 物中，使㈣散反射性高之㈣組成物，可無須在孔腔之 底面或側面特別設置料反料，而製造Μ之指向性及 取光效率皆高之元件基板。此外，評價擴散反射性之指行 係使用以JIS Κ 7腕収之霧度值，該值以95%以上為佳: 以98%以上為較佳。 又，選擇LTCC用玻璃陶曼組成物作為陶究組成物時， 16 201242455 因可低温燒成’故可依需要，以1之燒成，製造於孔腔 之底面或側面具有銀等反射層之元件基板。選擇ltcc材料 作為陶_，《卩祕髓光元件時、之後制時之損傷 等之觀點，例如宜將原料組成調整成抗料度為謂他以 上。 以下，以LTCC用玻璃㈣組成物為例，說明基體用生 胚薄片之製作方法。 玻璃陶瓷組成物之調製 LTCC用玻賴纽錢含有麵粉末、喊粉末及黏 合劑樹脂’且可依需要，添加塑化劑、分散劑、溶劑等而 調製。 用於上述玻璃陶瓷組成物之玻璃粉末雖未必限定，但 以玻璃轉移溫度為550°C以上、700°C以下為佳。當玻璃轉 移>jbl度不到550 C時’有脫脂困難之虞，當超過7〇〇。〇時， 有收縮開始溫度增高、尺寸精確度降低之虞。 又，以於80(TC以上、930。(：以下燒成時，析出結晶為 佳。未析出結晶時’有無法獲得足夠之機械強度之虞。再 者，以DTA(示差熱分析）測定之結晶化峰值溫度丁£以88〇。〇 以下為佳。當Tc超過880°C時’有尺寸精確度降低之虞。 此種玻璃粉末以下述氧化物換算之mol%表示，宜含有 Si02為 57mol°/〇 以上、65mol%以下，B2〇3 為 I3mol°/〇 以上、 18111〇1%以下，〇3〇為9111〇1%以上、23111〇1%以下，八12〇3為 3mol°/〇以上、8mol°/〇以下，從K20及Na20選擇之至少一者總 計0.5mol%以上、6mol%以下者。藉此，易使所得之基體或 3； 17 201242455 框體之表面之平坦度提高。 在此，Si〇2為玻璃之網狀形成劑。當Si〇2之含有量不 到57mol%時，不易獲得穩定之玻璃，且有化學耐久性亦降 低之虞。另一方面，當Si02之含有量超過65mol°/。時，有玻 璃熔融溫度或玻璃轉移溫度過高之虞。Si02之含有量以 58mol%以上為佳，以59%以上為較佳，以60mol%以上為特 佳。又，8丨〇2之含有量以64!11〇1%以下為佳，以63111〇1%以下 為較佳。 B2〇3為玻璃之網狀形成劑。當B2〇3之含有量不到 13mol%時，有玻璃熔融溫度或玻璃轉移溫度過高之虞。另 一方面，當B2〇3之含有量超過18mol%時，有不易獲得穩定 之玻璃、且化學耐久性亦降低之虞。B2〇3之含有量以 14mol%以上為佳，以15mol°/〇以上為較佳。又，B2〇3之含有 量以17mol%以下為佳，以16mol%以下為較佳。 ai2o3係為了提高玻璃之穩定性、化學耐久性及強度而 添加。當Α1ζ〇3之含有量不到3mol%時，有玻璃不穩定之虞。 另一方面’當Al2〇3之含有量超過8mol%時，有玻璃炼融溫 度或玻璃轉移溫度過南之虞。AI2O3之含有量以4mol%以上 為佳，以5mol%以上為較佳。又，Al2〇3之含有量以7m〇i〇/0 以下為佳，以6mol%以下為較佳。S 15 201242455 4 ^ The same as the main components of the oxidized Lu powder as the main component, and the nitrided powder m-alumina powder containing nitriding powder as the main component The A-junction uses a ceramic powder composition, and in addition to the ceramic powder, it also contains a ceramic powder composition such as glass pottery & The binder resin and other optional components contained in the ceramic composition are the same as those described above for each of the ceramic compositions t. Here, the ceramic composition constituting the green sheet is finally formed into (4) by the step (7), and since the firing temperature of each of the above-mentioned shouting compositions is different, the substrate 2 and the frame 3 described below generally include the outermost layer of the frame. Inside, consists of the same kind of pottery. The composition constituting each of the green sheets is changed by the same type of pottery as needed, and the raw material composition is changed according to each raw sheet. Generally, the raw material composition is also used in the raw sheet. When the glass-ceramic composition for LTCC is used as the Tauman composition in the production method of the present invention, since it is easy to manufacture and easy to add I, it is particularly remarkable that the inclination of the cone on the inner wall surface (four) of the frame body is remarkable. The accuracy of the ground (4) angle or the effect of uniformity. In addition, in the manufacturing method of the present invention, if the (four) composition having a high degree of diffuse reflectivity is provided in each of the above-described ceramic compositions, it is possible to manufacture a crucible without disposing a material on the bottom surface or the side surface of the cavity. A component substrate with high directivity and light extraction efficiency. Further, the index for evaluating the diffuse reflectance is a haze value of JIS 腕 7, and the value is preferably 95% or more: preferably 98% or more. In addition, when the glass ceramics composition of LTCC is selected as the ceramic composition, 16 201242455 can be fired at a low temperature, so that it can be fired at 1 as needed, and a reflective layer such as silver is formed on the bottom surface or the side surface of the cavity. Component substrate. The ltcc material is selected as the ceramic _, "when the medlar element is damaged, and the damage during the subsequent process, for example, it is preferable to adjust the raw material composition to the degree of resistance." Hereinafter, a method for producing a substrate for a green sheet will be described by taking a glass (four) composition for LTCC as an example. Modification of the glass-ceramic composition LTCC uses a glass powder, a shout powder, and a binder resin, and can be prepared by adding a plasticizer, a dispersant, a solvent, or the like as needed. The glass powder used for the above glass-ceramic composition is not necessarily limited, but the glass transition temperature is preferably 550 ° C or more and 700 ° C or less. When the glass transfer >jbl degree is less than 550 C, it is difficult to degrease when it exceeds 7 〇〇. When 〇, there is a tendency for the shrinkage start temperature to increase and the dimensional accuracy to decrease. In addition, it is 80 (TC or more, 930. ((In the case of the following baking, it is preferable to precipitate a crystal. When the crystal is not precipitated], sufficient mechanical strength cannot be obtained. Further, it is measured by DTA (differential thermal analysis). The crystallization peak temperature is preferably 88 〇. The following is preferred. When the Tc exceeds 880 ° C, the size accuracy is reduced. The glass powder is expressed in terms of mol% of the following oxides, and preferably contains SiO 2 of 57 mol. ° / 〇 or more, 65 mol% or less, B2 〇 3 is I3 mol ° / 〇 or more, 18111 〇 1% or less, 〇 3 〇 is 9111 〇 1% or more, 23111 〇 1% or less, and 8 12 〇 3 is 3 mol ° / 〇 The above-mentioned, 8 mol / 〇 or less, at least one selected from K20 and Na20 is 0.5 mol% or more and 6 mol% or less. Thereby, the flatness of the surface of the obtained substrate or the frame of 3; 17 201242455 is easily improved. Here, Si〇2 is a network forming agent for glass. When the content of Si〇2 is less than 57 mol%, stable glass is not easily obtained, and chemical durability is also lowered. On the other hand, when Si02 is used When the content exceeds 65 mol ° /, the glass melting temperature or the glass transition temperature is too high. The content is preferably 58 mol% or more, more preferably 59% or more, and particularly preferably 60 mol% or more. Further, the content of 8 丨〇 2 is preferably 64.11 〇 1% or less, and is 63111 〇 1%. The following is preferable. B2〇3 is a network forming agent for glass. When the content of B2〇3 is less than 13 mol%, there is a problem that the glass melting temperature or the glass transition temperature is too high. On the other hand, when B2〇3 When the content is more than 18 mol%, it is difficult to obtain a stable glass and the chemical durability is also lowered. The content of B2〇3 is preferably 14 mol% or more, more preferably 15 mol%/〇 or more. Further, B2 The content of cerium 3 is preferably 17 mol% or less, preferably 16 mol% or less. ai2o3 is added to improve the stability, chemical durability and strength of the glass. When the content of Α1ζ〇3 is less than 3 mol%, On the other hand, when the content of Al2〇3 exceeds 8 mol%, the glass melting temperature or the glass transition temperature is too high. The content of AI2O3 is preferably 4 mol% or more, and 5 mol%. The content of Al2〇3 is preferably 7 m〇i〇/0 or less, and preferably 6 mol% or less.
CaO係為了提高玻璃之穩定性或結晶之析出性，並且 使玻璃熔融溫度或玻璃轉移溫度降低而添加。當Ca〇之含 有量不到9mol%時，有玻璃熔融溫度過高之虞。另一方面， 當CaO之含有量超過23mol°/〇時’有玻璃不穩定之虞。CaOThe CaO is added in order to increase the stability of the glass or the precipitation of crystals, and to lower the glass melting temperature or the glass transition temperature. When the content of Ca 〇 is less than 9 mol%, there is a problem that the glass melting temperature is too high. On the other hand, when the content of CaO exceeds 23 mol / 〇, there is a glass instability. CaO
S 18 201242455 之含有量以12mol%以上為佳，以13mol%以上為較佳，以 14mol%以上為特佳。又，ca〇之含有量以22m〇l%以下為 佳，以21 mol%以下為較佳，以20mol%以下為特佳。 K2〇、Na2〇係為了使玻璃轉移溫度降低而添加。當Κ2〇 及NaaO之總合含有量不到〇 5m〇1%時，有玻璃熔融溫度或 玻璃轉移溫度過高之虞。另一方面，當K2〇及Na20之總合 芑有里超過6mol%時，有化學而才久性、特別是耐酸性降低 之虞，且有電絕緣性亦降低之虞β K2〇及Na2〇之總合含有 畺以0,8m〇l%以上、5m〇l%以下為佳。 此外，玻璃粉末未必限於僅由上述成分構成者，在滿 足玻璃轉移溫度等諸特性之範圍，可含有其他成分。含有 八他成为時，其總合之含有量以lOmol%以下為佳。 藉由熔融摻合成如上述之玻璃組成之玻璃原料而製造 玻璃，以乾式粉碎法或濕式粉碎法粉碎所得之玻璃而獲得 玻璃粕末。為濕式粉碎法時，溶媒以水為佳。粉碎係使用 例如較磨機、球磨機、仙磨财科機來進行。 =璃粉末之5〇%粒徑（ho)以〇.5μπι以上、2μιη以下為 佳。當玻璃粉末之50%粒徑不到〇 5卿時，玻璃粉末易凝 聚不易處理，並且，不易均一地分散。另一方面，當玻 。4末之5G雄;^超過2μιη時，有產生玻璃軟化溫度之上升 或燒結不足之虞粒徑之調整藉由例如於料後依需要分 進仃此外，在本說明書中，粒徑係指以雷射繞射散 射法之粒子徑測定裝置而得之值。 另方面，陶瓷粉末可無特別限制地使用迄今用於 19 S, 201242455 LTCC基板之製造者，可適當地使用例如氧化鋁粉末、氧化 锆粉末、或氧化鋁粉末與氧化锆粉末之混合物。又，在本 發明製作依需要而使用之具擴散反射性之LTCC時，上述陶 瓷粉末宜使用氧化鋁粉末與氧化鍅粉末之混合物。氧化鋁 粉末與氧化錯粉末之混合物以（氧化鋁粉末：氧化錯粉末） 之混合比例為質量比90 : 1〇〜60 : 40之混合物為佳。陶瓷 粉末之50%粒技(d5Q)為上述任一情形時，皆以例如〇_5μηι以 上、4μηι以下為佳。 藉將此種玻璃粉末與陶瓷粉末摻合、混合成例如玻璃 粉末為30質量％以上、50質量％以下，陶瓷粉末為50質量％ 以上、70質量。/❶以下，可獲得玻璃陶瓷混合物。 於此玻璃陶瓷混合物添加黏合劑樹脂，並依需要添加 塑化劑、分散劑、溶劑等而充分混合，藉此，可獲得漿狀 玻璃陶瓷組成物。黏合劑樹脂適合使用例如聚乙烯丁酸、 丙烯酸樹脂等。又，玻璃陶瓷組成物中之黏合劑樹脂之摻 合量係對玻璃陶瓷混合物1〇〇質量份，以5〜15質量份為 佳。塑化劑可使用例如酞酸二丁酯、酞酸二異壬酯、敗酸 丁基苄基酯等。又，溶劑可適當地使用曱苯、二甲笨、2、 丙醇、2-丁醇等有機溶劑。 此外，使用氧化鋁質燒結體用陶瓷組成物或氮化鋁質 燒結體用陶瓷組成物等來取代LTCC用玻璃陶瓷組成物 時，使用以氧化铭粉末或氮化紹為主成分之習知眾所皆知 之陶瓷粉末，取代上述玻璃陶瓷混合物，其他成分與上述 相同，調製漿狀之上述各陶瓷組成物。 201242455 基體用生胚薄片之製作 藉以刮刀法等，將上述所得之漿狀之玻璃陶瓷組成 物，成形為燒成後之形狀、厚度在所期之範圍内之預定形 狀、厚度的薄片，使其乾燥，而製作基體用生胚薄片2。 通常，積層複數陶瓷生胚薄片來製作元件基板時，將 各生胚薄片成形為在作為元件基板之區域之周邊具有剩餘 部。然後，使用此剩餘部，固定於依各步驟準備之支撐體 等，而可防止積層偏移或以下之配線導體用膏等之印刷偏 移。生胚薄片之剩餘部以分割溝等區分為作為元件基板之 區域，燒成後，從元件基板切開。 又，製作尺寸小之元件基板時，通常採取下述方法： 製作連結並具有複數個製作諸如元件基板之配線基板時所 用之可取多個之元件基板單元的連結基板（以下稱為連結 基板）’藉由分割此連結基板之步驟，以製作各元件基板。 此時，生胚薄片成形為排列有作為複數個元件基板之區域 之大小，更宜成形為更具有上述剩餘部。此剩餘部不僅適 用於上述基體用生胚薄片，亦適用於後述框體積層用生胚 薄片及框體最外層用生胚薄片。 以下以元件基板1個為單位進行說明，不論是具有上述 剩餘部時、或在製造連結基板時，對元件基板進行之配線 導體層之形成或貫穿導體之形成等處理本身皆無特別改 變。此外，上述切開或分割之時間點只要為燒成後，可為 將發光元件搭載於元件基板之前，亦可為搭載發光元件 後，以焊接固定、安裝於印刷配線基板等之前。 21 201242455 在此，如第2圖所示，基體用生胚薄片2具有配線導體 用膏層（包含元件連接端子用膏廣5、外部連接端子用膏層 6、及貫穿導體用膏層7，亦稱為配線導體用膏層。），該等 配線導體用膏層通常在進行框體積層用生胚薄片之積層前 之階段，形成於基體用生胚薄片2。 要於基體用生胚薄片2形成配線導體用膏層，係於基體 用生胚薄片2之上述預定位置製作用以配設一對貫穿導體7 且攸主面21貫穿至背面23之一對貫穿孔，並形成貫穿導體 用膏層7，以填充此貫穿孔。又，於主面21將元件連接端子 用膏層5形成為約略長方形，以覆蓋貫穿導體用膏層7 ,並 且，於背面23形成與貫穿導體用膏層7電性連接之外部連接 端子用膏層6。 用於形成配線導體用膏層之導體膏可使用例如於以 銅、銀、金等為主成分之金屬粉末，添加乙基纖維素等媒 液，並依需要添加溶劑等而呈膏狀者。此外，上述金屬粉 末宜使用由銀構成之金屬粉末、由銀及白金構成之金屬粉 末、或由銀及鈀構成之金屬粉末。 此外’使用氧化铭質燒結體用陶究組成物或氮化紹質 燒結體用陶竟組成物等來取代LT C C用玻璃陶瓷組成物 時，用於形成上述配線導體用膏層之導體膏的金屬粉末， 可使用以鎮或銦等高溶點金屬為主成分之金屬粉末來取代 以上述銅、銀、金等為主成分之金屬粉末。 元件連接端子用膏層5、外部連接端子用膏如及貫穿 導體用嘗層7之形射法，可舉以印概塗佈或填充上The content of S 18 201242455 is preferably 12 mol% or more, more preferably 13 mol% or more, and particularly preferably 14 mol% or more. Further, the content of ca〇 is preferably 22 m〇l% or less, preferably 21 mol% or less, and particularly preferably 20 mol% or less. K2〇 and Na2〇 are added in order to lower the glass transition temperature. When the total content of Κ2〇 and NaaO is less than 〇5m〇1%, there is a problem that the glass melting temperature or the glass transition temperature is too high. On the other hand, when the total amount of K2〇 and Na20 is more than 6 mol%, there are chemistries, especially acid resistance, and 电β K2〇 and Na2〇 which have reduced electrical insulation. The total amount of yttrium is preferably 0,8 m〇l% or more and 5 m〇l% or less. Further, the glass powder is not necessarily limited to those composed only of the above components, and may contain other components insofar as it satisfies the characteristics such as the glass transition temperature. When it is included, the total content of the mixture is preferably 10 mol% or less. The glass is produced by melt-mixing a glass raw material having a glass composition as described above, and the resulting glass is pulverized by a dry pulverization method or a wet pulverization method to obtain a glass ruthenium. In the case of the wet pulverization method, the solvent is preferably water. The pulverization system is carried out using, for example, a grinding machine, a ball mill, or a smashing machine. = 5% of the particle diameter (ho) of the glass powder is preferably 55 μπι or more and 2 μιη or less. When the 50% particle diameter of the glass powder is less than 〇 5 qing, the glass powder is easily aggregated and difficult to handle, and it is difficult to uniformly disperse. On the other hand, when glassy. 4 at the end of 5G male; ^ when more than 2μηη, there is an increase in the glass softening temperature or insufficient sintering, the particle size is adjusted by, for example, after the material is added as needed. In addition, in the present specification, the particle size refers to The value obtained by the particle diameter measuring device of the laser diffraction scattering method. On the other hand, the ceramic powder can be used without any particular limitation for the manufacturer of the LTCC substrate of the 19 S, 201242455, and for example, an alumina powder, a zirconia powder, or a mixture of an alumina powder and a zirconia powder can be suitably used. Further, in the case of producing the LTCC having diffuse reflectivity which is used as needed, the ceramic powder is preferably a mixture of alumina powder and cerium oxide powder. The mixture of the alumina powder and the oxidized powder is preferably a mixture of (aluminum powder: oxidized powder) in a mass ratio of 90:1 〇 to 60:40. When the 50% particle technique (d5Q) of the ceramic powder is any of the above, it is preferably, for example, 〇_5μηι or more, and 4μηι or less. By mixing and mixing such a glass powder with a ceramic powder, for example, the glass powder is 30% by mass or more and 50% by mass or less, and the ceramic powder is 50% by mass or more and 70% by mass. /❶ below, a glass-ceramic mixture is available. A binder resin is added to the glass-ceramic mixture, and a plasticizer, a dispersant, a solvent, or the like is added as needed to sufficiently mix, whereby a slurry-like glass-ceramic composition can be obtained. As the binder resin, for example, polyvinyl butyric acid, acrylic resin or the like is used. Further, the blending amount of the binder resin in the glass ceramic composition is preferably 5 to 15 parts by mass based on 1 part by mass of the glass ceramic mixture. As the plasticizer, for example, dibutyl phthalate, diisononyl phthalate, butyl benzyl acrylate or the like can be used. Further, as the solvent, an organic solvent such as toluene, dimethyl benzene, 2, propanol or 2-butanol can be suitably used. In addition, when a ceramic composition for an alumina sintered body or a ceramic composition for an aluminum nitride sintered body is used in place of the glass ceramic composition for LTCC, a conventional one using oxidized powder or nitriding as a main component is used. The ceramic powder known in the art is substituted for the above-mentioned glass-ceramic mixture, and the other components are the same as described above, and the above-mentioned ceramic compositions in the form of a slurry are prepared. 201242455 Preparation of raw embryonic sheet for base material The slurry-form glass ceramic composition obtained above is formed into a sheet having a shape and thickness of a predetermined shape and a thickness within a predetermined range by a doctor blade method or the like. Drying is performed to prepare a green sheet 2 for the substrate. In general, when a plurality of ceramic green sheets are laminated to form an element substrate, each green sheet is formed to have a remaining portion around a region as an element substrate. Then, by using the remaining portion, it is fixed to a support or the like prepared in each step, and it is possible to prevent the offset of the laminate or the printing offset of the wiring conductor paste or the like below. The remaining portion of the green sheet is divided into regions serving as element substrates by dividing grooves or the like, and is cut from the element substrate after firing. In addition, when a device substrate having a small size is produced, a method of forming a connection substrate (hereinafter referred to as a connection substrate) in which a plurality of element substrate units are used for fabricating a wiring board such as an element substrate is prepared. Each element substrate is fabricated by the step of dividing the connection substrate. At this time, the green sheet is formed into a size in which a plurality of element substrates are arranged, and it is more preferable to form the remaining portion. This remaining portion is suitable not only for the above-mentioned raw body green sheet, but also for the green sheet for the frame volume layer described later and the green sheet for the outermost layer of the frame. In the following, the unit substrate will be described as a unit, and the processing itself such as the formation of the wiring conductor layer or the formation of the through conductor on the element substrate will not be changed in any case when the remaining portion is provided or when the connecting substrate is manufactured. In addition, the time of the above-mentioned cutting or dividing may be before the mounting of the light-emitting element on the element substrate, or after the light-emitting element is mounted, and then soldered and fixed to the printed wiring board or the like. 21 201242455 Here, as shown in FIG. 2, the base raw sheet 2 has a wiring conductor paste layer (including a component connection terminal paste 5, an external connection terminal paste layer 6, and a through conductor paste layer 7). Also known as a paste layer for wiring conductors, the wiring layer for wiring conductors is formed in the base green sheet 2 at a stage before the layering of the green sheets of the frame volume layer. A paste layer for a wiring conductor is formed on the base raw sheet 2, and a pair of through conductors 7 are formed at the predetermined position of the base raw sheet 2, and a pair of the main surface 21 penetrates to the back surface 23 The hole is formed and a through-conductor paste layer 7 is formed to fill the through hole. Moreover, the element connection terminal paste layer 5 is formed in a substantially rectangular shape on the main surface 21 so as to cover the through conductor paste layer 7, and the external connection terminal paste which is electrically connected to the through conductor paste layer 7 is formed on the back surface 23 Layer 6. For the conductor paste for forming the wiring layer for a wiring conductor, for example, a metal powder containing copper, silver, gold or the like as a main component, a medium such as ethyl cellulose, and a solvent or the like may be added to form a paste. Further, as the metal powder, a metal powder composed of silver, a metal powder composed of silver or platinum, or a metal powder composed of silver and palladium is preferably used. In addition, when the glass ceramic composition for LT CC is replaced with a ceramic composition using an oxidized crystal sintered body or a ceramic composition for nitriding, the conductor paste for forming the wiring conductor paste layer is used. As the metal powder, a metal powder containing a high melting point metal such as a town or indium as a main component can be used instead of the metal powder containing copper, silver, gold or the like as a main component. The paste layer 5 for the element connection terminal, the paste for the external connection terminal, and the patterning method for the through conductor layer 7 can be coated or filled with a stamp.
22 201242455 述導體膏之方法為例。所形成之元件連接端子用膏層5及外 部連接端子用膏層6之膜厚，調整成最後所得之元件連接端 子及外部連接端子之膜厚為預定膜厚、較佳為5〜15μη1。 再者’雖未於第1圖顯示，但若依需要，於基體2之作 為孔腔底面24之區域之發光元件搭載部22或元件連接端子 5形成部之外之部份設置反射層時，或者，為了減低熱阻， 而在基體2之内部於與基體2之主面21垂直相交之方向埋設 導熱孔，或於平行於主面21之方向配設散熱層時，在此階 段與开》成上述配線導體用膏層同樣地，於基體用生胚薄 片2之所期位置形成用以形成該等之金屬膏層。金屬膏可依 陶瓷組成物之種類，使用與上述導體膏相同者。 以上，就基體用生胚薄片2作了說明，基體用生胚薄片 2未必須以單—之生胚薄片制，亦可為積層複數片生胚薄 韦'。又，關於各部之形成方法等，亦可在可製造元件基 板之限度適宜變更。 (Α_2)框體積層用生胚薄片（3a、3b、3c)之製作 第2圖所示之3片框體積層用生胚薄片（3a、儿、3c)使用 與上述基體用生胚薄片同種之陶瓷組成物，通常原料組成 亦使用同樣之陶瓷組成物，以與上述基體用生胚薄片2相同 方法，首先，成形為以下說明之厚度之薄片。 用於本發明製造方法之框體積層用生胚薄片之厚度， X所用之框體積層用生胚薄片之片數來決定。關於框體積 層用生胚薄片之片數，為了使所得之框體3之内璧面呈錐 狀，必須使用複數片，其片數只要為2片以上，並未特別限22 201242455 The method of the conductor paste is taken as an example. The film thickness of the formed element connection terminal paste layer 5 and the external connection terminal paste layer 6 is adjusted so that the film thickness of the finally obtained element connection terminal and external connection terminal is a predetermined film thickness, preferably 5 to 15 μm. In addition, although it is not shown in FIG. 1 , if a reflective layer is provided in a portion other than the light-emitting element mounting portion 22 or the component connecting terminal 5 forming portion in the region of the bottom surface 24 of the substrate 2 as needed, Alternatively, in order to reduce the thermal resistance, a heat-conducting hole is buried in a direction perpendicular to the main surface 21 of the base 2 in the interior of the base 2, or a heat-dissipating layer is disposed in a direction parallel to the main surface 21, at this stage. Similarly to the above-mentioned wiring conductor paste layer, a metal paste layer for forming the metal foil layer is formed at the desired position of the base raw green sheet 2. The metal paste may be the same as the above-mentioned conductor paste depending on the type of the ceramic composition. The above description has been made on the base sheet 2, and the base sheet 2 is not necessarily made of a single embryo sheet, and may be a plurality of sheets of raw embryos. Further, the method of forming each part or the like may be appropriately changed at the limit of the substrate on which the element can be manufactured. (Α_2) Production of the green sheet (3a, 3b, 3c) for the frame volume layer The three-frame volume layer for the three-frame volume layer (3a, 3c, 3c) shown in Fig. 2 is used in the same manner as the above-mentioned substrate for the raw embryo sheet. In the ceramic composition, usually, the same ceramic composition is used as the raw material composition, and in the same manner as the above-described base raw green sheet 2, first, a sheet having a thickness as described below is formed. The thickness of the green sheet for the frame volume layer used in the production method of the present invention, and the frame volume layer used for X is determined by the number of green sheets. Regarding the number of the green sheets of the frame volume layer, in order to make the inner surface of the obtained frame 3 tapered, it is necessary to use a plurality of sheets, and the number of the sheets is not limited to two or more.
S 23 201242455 制。所用之框體積層用生胚薄片之片數及厚度具體言之， 根據最後所得之元件基板1之框體3之高度或内壁面25之錐 之角度等，進行適宜調整。所用之框體積層用生胚薄片之 片數以2〜6片為佳。 舉例言之，在第1圖所示之元件基板1中，框體3之高 度、即從孔腔4之底面24至框體3之最高位為止的距離及框 體3之内壁面25之錐角度，係設計成可將來自所搭載之發光 元件之光朝取光方向充分反射。 具體言之，關於框體3之高度，從搭載發光裝置之製品 之形狀、或以良好效率填充含有用以轉換波長之螢光體之 密封材等觀點，以較搭載有發光元件時之發光元件之最高 部之高度高出100〜500μιη為佳。此外，框體3之高度以發 光元件之最高部之高度加上450μιη之高度以下為較佳，以 加上400μπι之高度以下為更佳。又，框體3之内壁面25之錐 角度為以基體2之主面21與框體3之内壁面25所夾之角之角 度（在第1圖以α顯示）而為20〜80。。為了使朝向與孔腔4之 底面24垂直之方向的光度變大（換言之，使指向性高），以3〇 〜70。為佳，以40〜60。為較佳。 上述框體3之高度係將框體積層用生胚薄片與後述之 框體最外層社胚薄片積層並燒成而得之積層體的總合厚 度。在本發明之製造方法中，上述框體積層用生胚薄片及 框體最外層用生㈣片之厚度，各自燒成後之厚度以5〇〜 200μπι為佳’以50〜綱叫為較佳。若此厚度不雜哗， 易產生積層偏移等，當超過細_時，在⑹步驟以框體最S 23 201242455. The number and thickness of the green sheet for the frame volume layer to be used are specifically adjusted according to the height of the frame 3 of the element substrate 1 finally obtained or the angle of the taper of the inner wall surface 25. The number of sheets of the green sheet to be used for the frame volume layer is preferably 2 to 6 pieces. For example, in the element substrate 1 shown in FIG. 1, the height of the frame 3, that is, the distance from the bottom surface 24 of the cavity 4 to the highest position of the frame 3 and the inner wall surface 25 of the frame 3 are tapered. The angle is designed to sufficiently reflect light from the mounted light-emitting element toward the light extraction direction. Specifically, the height of the casing 3 is higher than the shape of the product on which the light-emitting device is mounted, or the sealing material containing the phosphor for converting the wavelength is filled with good efficiency, and the light-emitting element is mounted on the light-emitting element. The height of the highest part is preferably 100 to 500 μm. Further, the height of the frame 3 is preferably the height of the highest portion of the light-emitting element plus the height of 450 μm or less, and more preferably 400 μm or less. Further, the taper angle of the inner wall surface 25 of the casing 3 is an angle of 20 to 80 which is an angle between the main surface 21 of the base 2 and the inner wall surface 25 of the casing 3 (indicated by α in Fig. 1). . In order to make the illuminance in a direction perpendicular to the bottom surface 24 of the cavity 4 large (in other words, the directivity is made high), it is 3 〜 to 70. For better, take 40~60. It is better. The height of the frame 3 is a total thickness of the laminate obtained by laminating and firing the green sheet of the frame volume layer with the outermost layer of the frame of the frame. In the manufacturing method of the present invention, the thickness of the green sheet and the outermost layer of the frame body layer are the thickness of the raw (four) sheet, and the thickness after firing is preferably 5 〇 to 200 μπι. . If the thickness is not hodge, it is easy to produce a laminate offset, etc., when it exceeds the fine _, the frame is the most in the step (6)
S 24 201242455 外層用生胚薄片被覆時，有與框體積層用生胚薄片0多 空隙之虞。再者，關於框體最外層用生胚薄#，薛於沪載 ,、於戶斤 等 後，端部到達孔腔之底面，故燒成後之厚度以小〜 麥脖 之發光元件之高度為佳。此外，用以形成框體3么该缘 薄片之厚度在各生胚薄片間可不同，亦可為相同 、 在以上述預定厚度成形之3片各薄膜，接著於中夹J、 通常之方法形成與孔腔4之底面24之形狀相似之開口部。在 第2圖之例中，底面24之形狀為圓形。開口部之大小’關於 構成最下層之框體積層用生胚薄片3a，為與孔腔4之底面24 相同之大小，積層於該生胚薄片3a上之框體積層用生胚薄 片3b、再積層於該生胚薄片3b上之框體積層用生胚薄片3c 形成為開口部面積依序增大。 藉由將框體積層用生胚薄片3a、3b、3c形成為上述結 構，於將框體積層用生胚薄片3a、3b、3c依序積層時，可 獲得具有階梯狀内壁面之框體之積層部。在此，最後所得 之框體3之内壁面25之錐的角度’係根據框體積層用生胚薄 片3a、3b、3c之厚度(在第2圖中，分別atl、t2、t3表示）、 與該等開口部之大小之不同來調整。 具體言之，令框體積層用生胚薄片3a、3b、3c具有之 開口部之半徑分別為rl、r2、r3時，rl<r2<r3之關係成立， 在框體積層用生胚薄片3a之上面之未積層框體積層用生胚 薄片3b之部份的寬度為-rl(在第2圖中，以χΐ表示），在框 體積層用生胚薄片3b之上面之未積層框體積層用生胚薄片 3c之部份之寬度為r3~r2(在第2圖中，以χ2表示）。在此’例S 24 201242455 When the outer layer is covered with the green sheet, there is a gap between the outer layer and the green sheet of the frame volume. Furthermore, regarding the outermost layer of the frame, the raw embryonic thin #, Xue Yuhu, and Yu Hujin, the end reaches the bottom of the cavity, so the thickness after firing is small ~ the height of the light-emitting component of the wheat neck It is better. Further, the thickness of the edge sheet may be different between the respective green sheets, or may be the same, and each of the three sheets formed at the predetermined thickness may be formed in the middle of the sandwich J. An opening portion similar in shape to the bottom surface 24 of the cavity 4. In the example of Fig. 2, the shape of the bottom surface 24 is circular. The size of the opening portion is the same as the size of the bottom surface 24 of the cavity 4 with respect to the bottom layer 24 of the frame volume layer constituting the lowermost layer, and the green sheet 3b for the frame volume layer laminated on the green sheet 3a, The frame volume layer laminated on the green sheet 3b is formed by the green sheet 3c so that the opening area is sequentially increased. When the frame volume layer green sheets 3a, 3b, and 3c are formed into the above-described structure, when the frame volume layers are sequentially laminated with the green sheets 3a, 3b, and 3c, a frame having a stepped inner wall surface can be obtained. Laminar department. Here, the angle "the angle of the taper of the inner wall surface 25 of the frame 3 finally obtained" is based on the thickness of the green sheet 3a, 3b, 3c for the frame volume layer (indicated by atl, t2, and t3 in Fig. 2, respectively). It is adjusted differently from the size of the openings. Specifically, when the radius of the opening portion of the green sheet 3a, 3b, and 3c of the frame volume layer is rl, r2, and r3, respectively, the relationship of rl < r2 < r3 is established, and the green sheet 3a is used in the frame volume layer. The width of the portion of the raw laminated sheet 3b on the upper unstacked frame volume layer is -rl (indicated by χΐ in Fig. 2), and the unstacked frame volume layer above the green sheet 3b is used in the frame volume layer. The width of the portion of the green sheet 3c is r3 to r2 (in Fig. 2, indicated by χ2). Here
S 25 201242455 如，令框體3之内壁面25之錐之角度為45。而作為上述(1值 時，將開口部之大小調整成xl/tl及x2/t2為1。 即’在本發明之製造方法中’關於積層框體積層用生 胚薄片而得之框體之積層部之階梯狀的内壁面，依該等階 梯各階，與該階之基體用生胚薄片之主面保持水平之面之 寬度(相當於上述xl、x2)與該階之高度（相當於上述tl、t2) 相等時’可令最後所得之框體3之内壁面25之錐之角度為 45°而作為上述α值。欲令上述角度α為例如7〇〜30。之範 圍’係將開口部之大小調整成階梯之各階之上述寬度為該 階之高度之0.6〜1.4倍。上述階梯之各階之寬度與高度之關 係以0.8〜1.2倍為佳，此時，所得之角度α之值為6〇〜4〇。。 此外’若將框體積層用生胚薄片之厚度與開口部之大 小，調整成在前述階梯之各階上述寬度與高度之關係為不 同之值時，亦可使框體3之内壁面25之錐之角度為部份不同 的結構。 (Α-3)各生胚薄片之積層 於具有在上述(Α-1)步驟所製作之配線導體用膏層之基 體用生胚薄片2之主面21上，將在上述(Α·2)步驟所製作之3 片框體積層用生胚薄片3a、3b、3e從基體用生胚薄片2之主 面側依序積層而獲得第1積層體1A。 在此，為了在接著進行之(B)步驟之第丨均力加壓， 止第1積層體1A之各生胚薄片產生積層偏移等，積層之方 以單軸加祕來歷捿諸生胚薄片而形成為積層體之方法 佳0 防 法 為 26 201242455 舉例言之’以單軸加壓來積層各生 層體1A時，將以上述順序 #獲付第積 ,,„ 韦谷生胚溥片者夾進PET薄 f間隔件，較佳為在生胚薄片之剩餘部等區域，固定包 含間Μ牛之全體，以單轴加壓機來壓接並積層之。積層時 之條件雖因根據積層之生胚薄片之片數、厚度、陶竟組成 物之種類、原料組成等而異，但以6〇〜，c、丄〜释、^ 〜3分鐘左右之條件為佳。 單轴加壓後，去除上述間隔件，將第i積層體lA供至下 個(B)步驟，亦可依需要，在夾進上述間隔件之狀態下，將 第1積層體1A供至下個(B)步驟。此外，在(B)步驟，使用第 1¼¾薄膜，進行均力加壓時，於進行上述單軸加壓之際， 亦可於重疊有各生胚薄片者之上，事先配設第丨樹脂薄膜， 於單軸加壓後，不將此去除而直接與第1積層體1A—同供至 下個（B)步驟。此時，第1樹脂薄膜充分發揮作為上述間隔 件之功能時，不需另外使用間隔件，而當第1樹脂薄膜不足 以作為間隔件時’進一步於此上方配設間隔件’進行單軸 加壓。 (B)步驟：第1均力加壓步驟 接著，將在上述所得之第1積層體1八在(3)步驟均力加 壓。第3圖係示意顯示本發明元件基板之製造方法之(B)步 驟的截面圖。第4圖係顯示以本發明之製造方法之一例’（B) 步驟結束後之第1積層體1B之平面圖（a)及其X-X線截面圖 ⑼。 在此，均力加壓係一般作為將陶瓷生肚薄片積層而一 jr- 27 201242455 體化之方法所使用之方法。通常為了將加壓對象物從全方 向以均一之壓力（均力壓力）加壓，而可呈將諸生胚薄片穩固 地接合之狀態，乃使用均力加壓。又，因與上述相同之理 由，較佳為使用溫均力加壓（WIP : warm isostatic press)方 式。溫均力加壓方式（以下亦稱為WIP方式）具體為以溫水等 經加溫之流體乃至液體作為壓力媒體，藉由此壓力媒體， 對生胚薄片積層體施加高壓之均力壓力，藉此，可從全方 位以相等之壓力使已積層之諸生胚薄片壓接。 在本發明之製造方法中，第1均力加壓步驟係為了在上 述(A)步驟所得之第1積層體1A中，將上述框體積層用生胚 薄片3a、3b、3c之積層部3’於内壁面具有之階梯狀角圓化而 執行。因而，第1均力加壓係選擇可達成此目的之條件而進 行者。在本發明製造方法之(B)步驟中，宜進行均力加壓， 以使在上述經圓化之階梯狀角之曲率半徑R為依具有此經 圓化之角之各框體積層用生胚薄片，於該生胚薄片之厚度 乘上0.7〜1.5之值。以此(B)步驟經圓化之階梯狀之角的曲 率半徑R更宜為依具有此經圓化之階段狀角之各個框體積 層用生胚薄片，於該生胚薄片之厚度乘上0.85〜1.2之值。 在此，厚度之單位為mm。 舉例言之，在第4圖所示之(B)步驟後之第1積層體1B 中，框體積層用生胚薄片3a、3b、3c之開口部側之上側端 緣之角被圓化，各曲率半徑為IU、R2、R3。從上述生胚薄 片之厚度與曲率半徑之關係，R1以tlx〇.7〜tlxl_5(mm)為 佳，以tlx〇.85〜tlxl.2(mm)為較佳。同樣地，R2為t2x〇.7S 25 201242455 For example, the angle of the taper of the inner wall surface 25 of the frame 3 is 45. In the case of the above-mentioned value, the size of the opening is adjusted to be xl/tl and x2/t2 is 1. That is, in the manufacturing method of the present invention, the frame of the green sheet for the laminated frame volume layer is obtained. a stepped inner wall surface of the laminated portion, according to the steps of the steps, a width of the horizontal surface (corresponding to the above x1, x2) and a height of the step (corresponding to the above) When tl and t2) are equal, the angle of the taper of the inner wall surface 25 of the frame 3 obtained last may be 45° as the above α value. The angle α is to be, for example, 7 〇 to 30. The width of the portion is adjusted to be 0.6 to 1.4 times the height of the step. The relationship between the width and the height of each step of the step is preferably 0.8 to 1.2 times. In this case, the value of the angle α obtained is 6〇〜4〇. In addition, if the thickness of the green sheet and the size of the opening are adjusted to have different values of the width and height of each step of the step, the frame may be made. The angle of the cone of the inner wall surface 25 is a part of a different structure. (Α-3) The stack of the embryonic sheet is laminated on the main surface 21 of the base sheet 2 for the wiring for the wiring conductor layer produced in the above (Α-1) step, and the three frames produced in the above step (Α·2) are laminated. The first layer layer 1A is obtained by sequentially stacking the green sheets 3a, 3b, and 3e of the volume layer from the main surface side of the base sheet 2 for the base sheet. Here, in order to carry out the second step of the step (B) Pressurization, the first layer of the first layer body 1A, each of the green sheets to produce a stacking offset, etc., the method of forming a layered body by uniaxially adding the secrets to the raw sheet to form a layered body is better. When the stratified layer 1A is laminated by uniaxial pressing, the first product is obtained in the above order, „ 韦谷生胚溥 is sandwiched into the PET thin f spacer, preferably in the remaining of the green sheet In the area, etc., the entire yak is fixed, and is laminated and laminated by a uniaxial pressing machine. The conditions for laminating are due to the number of sheets of the raw lamella according to the lamination, the thickness of the slab, and the type of the terracotta composition. The composition of raw materials varies, but it is better to use 6〇~, c, 丄~release, ^~3 minutes. After that, the spacer is removed, and the i-th layered body 1A is supplied to the next step (B), and the first layered body 1A is supplied to the next (B) in a state where the spacer is sandwiched as needed. In addition, in the step (B), when the film is subjected to the uniform pressurization using the 11th film, when the uniaxial pressurization is performed, the third layer may be placed in advance on each of the green sheets. After the uniaxial pressing, the resin film is directly supplied to the next step (B) without being removed, and the first resin film sufficiently functions as the spacer. It is not necessary to additionally use a spacer, and when the first resin film is insufficient as a spacer, the uniaxial pressurization is performed 'further with the spacer disposed above. (B) Step: First uniform pressurization step Next, the first layered body 1 obtained as described above is uniformly pressed in the step (3). Fig. 3 is a cross-sectional view schematically showing the step (B) of the method of manufacturing the element substrate of the present invention. Fig. 4 is a plan view (a) of the first layered body 1B after the end of the step (B) of the manufacturing method of the present invention, and a cross-sectional view (9) thereof taken along the line X-X. Here, the uniform pressure system is generally used as a method of laminating a ceramic green sheet and forming a jr- 27 201242455. Usually, in order to pressurize the object to be pressed from the entire direction with a uniform pressure (uniform pressure), it is possible to firmly bond the green sheets, and use uniform pressure. Further, for the same reason as described above, it is preferable to use a warm isostatic press (WIP) method. The temperature uniform pressure press method (hereinafter also referred to as WIP method) specifically uses a heated fluid such as warm water or a liquid as a pressure medium, thereby applying a high pressure uniform pressure to the green sheet laminate by the pressure medium. The laminated green sheets can be crimped from all directions with equal pressure. In the manufacturing method of the present invention, the first uniform force pressurizing step is for forming the laminated portion 3 of the green sheet 3a, 3b, and 3c for the frame volume layer in the first layered body 1A obtained in the above step (A). 'The stepped corners on the inner wall surface are rounded and executed. Therefore, the first uniform pressurization system is selected to meet the conditions for achieving the object. In the step (B) of the manufacturing method of the present invention, it is preferred to perform uniform pressure pressurization so that the radius of curvature R of the rounded stepped angle is used for each frame volume layer having the rounded angle The embryonic sheet is multiplied by a thickness of 0.7 to 1.5 in the thickness of the green sheet. The radius of curvature R of the rounded stepped angle of the step (B) is preferably a green sheet of each frame volume layer having the rounded step angle, multiplied by the thickness of the green sheet The value of 0.85~1.2. Here, the unit of thickness is mm. For example, in the first layered body 1B after the step (B) shown in FIG. 4, the corners of the upper edge of the opening side of the green sheets 3a, 3b, and 3c of the frame volume layer are rounded. Each radius of curvature is IU, R2, R3. From the relationship between the thickness of the green sheet and the radius of curvature, R1 is preferably tlx 〇.7~tlxl_5(mm), and preferably tlx 〇.85~tlxl.2 (mm). Similarly, R2 is t2x〇.7
S 28 201242455 〜t2xl.5(mm) ’ R2以t3x〇.7〜t3xl.5(mm)為佳，尺2為必〇 85 〜t2xl.2(mm)，R3以t3x〇.85〜t3xl_2(mm)為較佳。 本發明之製造方法之第1均力加壓，例如，可無特別限 制地使用習知用於將以上所說明之陶瓷生胚薄片積層體— 體化之均力加壓襄置。又，為了將上述框體積層用生胚薄 片3a、3b、3c之積層部3’於内壁面具有之階梯狀角圓化，宜 將該均力加壓之條件設定為令曲率半徑R1、r2、R3在上述 較佳之範圍之條件而執行。此外，如以下所說明，因第“句 力加壓宜在加溫條件下進行，故均力加壓裝置宜使用對應 於WIP方式之裝置。再者，在本發明中，由於為了使各層 接著，而需以高於生胚薄片所含之黏合劑樹脂之軟化點之 溫度進行加壓，故以使用WIP方式之水壓機為佳。 第3圖係以使用WIP方式之水壓機作為均力加壓裝置 之情形為例，示意顯示本發明製造方法之第丨均力加壓步驟 之圖。以下，參照第3圖，就第丨均力加壓步驟之具體條件 作說明。 第3(1)圖係顯示為了將第1積層體丨八供至水壓機而進 仃之初步準備之圖。第3(2)圖係顯示將根據第3(1)圖已初步 準備之第1積層體均力加壓之狀態的圖。 如第3(1)圖所示，於進行均力加壓之際，通常，第1積 層體1A載置於支撐板32(例如不鏽鋼等金屬製支撐板)上。 此時’為使第1積層體丨八與支撐板32不直接接觸，而將例如 PET薄膜等間隔件33夾在兩者間。藉由夾著此間隔件，可防 止外部連接端子用膏層6對支撐板32之附著。此間隔件33亦 29 201242455 可直接使用用於上述單轴加壓機所作之壓著之巴之 件。又，為了將框體積層用生胚薄片3a、3b、v& 積層部3, 積層 於内壁面具有之階梯狀角’圓化成上述範圍，而於第工 體1A之上側加壓面上配設第1樹脂薄骐31。 如此’如第3(1)圖所示，將於第1積層體1八卜τ 下積層有 各種構件者，放入真空包裝用樹脂袋34。此外， 於第1積屏 體1A上下積層各種構件之際，例如，宜利用生 ^ 餘部等，將該等全體固定成第1積層體1A或各種構件不 j 由移動。接著，從樹脂袋34抽出空氣35，谁 "自 疋灯具a包裝， 將各樹脂袋放入壓力容器（圖中未示），密閉壓力容器，纟士束 初步準備。 1 藉由將上述已後閉之壓力谷器進行水壓加壓，而對第t 積層體1A施行均力加壓。具體言之，將壓力容器浸潰於充 滿了加熱至以下之較佳之溫度條件之水的熱水槽中。在此 狀態下，使壓力容器之内部壓力增加，以以下之較佳之壓 力條件，維持數分至數10分鐘後，解除壓力容器之内部加 壓。第3(2)圖顯示以水36(溫水)之壓力均力加壓中之第1積 層體1A的狀態。 從熱水槽回收壓力容器，從其中取出樹脂袋34，進一 步，從樹脂袋34取出上下積層有各種構件之均力加壓後之 第1積層體1B。進一步，藉由卸除支撐板32、間隔件33、第 1樹脂薄膜31，結束第1均力加壓。 在此，作為用以使曲率半徑(R1、R2、R3)在上述較佳 之範圍之第1均力加壓之條件，關於溫度條件，以超過框體S 28 201242455 ~t2xl.5(mm) ' R2 is better than t3x〇.7~t3xl.5(mm), ruler 2 is required to be 85~t2xl.2(mm), and R3 is t3x〇.85~t3xl_2( Mm) is preferred. In the first method of the production method of the present invention, the pressurization of the above-described ceramic green sheet laminate can be carried out without any particular limitation. Further, in order to round the stepped corners of the laminated portion 3' of the green sheet 3a, 3b, and 3c on the inner wall surface, it is preferable to set the conditions of the uniform pressure to the radius of curvature R1, r2. R3 is carried out under the conditions of the above preferred range. Further, as explained below, since the "sentence force pressurization is preferably performed under heating conditions, it is preferable to use a device corresponding to the WIP method for the uniform force pressurizing device. Further, in the present invention, It is necessary to pressurize at a temperature higher than the softening point of the binder resin contained in the green sheet, so it is preferable to use a WIP type hydraulic press. Fig. 3 is a hydraulic press using a WIP method as a uniform press device The case of the second embodiment of the manufacturing method of the present invention is schematically illustrated. Hereinafter, the specific conditions of the ninth uniform pressure pressing step will be described with reference to Fig. 3. Fig. 3(1) A preliminary plan for the first laminate to be supplied to the hydraulic press is shown. Fig. 3(2) shows the uniform pressure of the first laminate which has been initially prepared according to the third (1) diagram. As shown in the third figure (1), when the uniform pressure is applied, the first layered body 1A is usually placed on the support plate 32 (for example, a metal support plate such as stainless steel). In order to prevent the first laminate body from being in direct contact with the support plate 32, for example, a PET film or the like is used. The member 33 is sandwiched between the two. By sandwiching the spacer, the adhesion of the external connection terminal paste layer 6 to the support plate 32 can be prevented. The spacer member 33 can also be directly used for the above-mentioned single-axis press machine. In order to use the green sheet 3a, 3b, v& laminated layer 3, the stepped corners of the inner wall surface are rounded into the above range, and the first working body is used. The first resin sheet 31 is disposed on the upper side of the pressure-receiving surface of the 1A. As shown in the third (1), the various layers of the first layered body 1 are placed under vacuum. In addition, when the first laminate body 1A is stacked with each other, for example, it is preferable to fix the entire laminate into the first laminate 1A or various members without using a raw portion or the like. The air 35 is taken out from the resin bag 34, and whoever "packs the lamp a, puts each resin bag into a pressure vessel (not shown), seals the pressure vessel, and prepares the gentleman's bundle. 1 By closing the above The pressure barn is pressurized by water pressure, and the t-th laminated body 1A is uniformly pressurized. Specifically, the pressure vessel is immersed in a hot water tank filled with water heated to a preferred temperature condition. In this state, the internal pressure of the pressure vessel is increased, and the number of pressures is maintained under the following preferred pressure conditions. After 10 minutes, the internal pressure of the pressure vessel is released. The third (2) diagram shows the state of the first layered body 1A which is uniformly pressurized by the pressure of water 36 (warm water). The pressure is recovered from the hot water tank. The container is taken out from the resin bag 34, and the first layered body 1B in which the various members are laminated under pressure is removed from the resin bag 34. Further, the support plate 32, the spacer 33, and the first member are removed. The resin film 31 is finished with the first uniform pressure. Here, as a condition for pressurizing the first uniform force of the radius of curvature (R1, R2, R3) in the above preferred range, the temperature condition is exceeded by the frame. body
S 30 201242455 積層用生胚薄片含有之黏合劑樹脂之玻璃轉移溫度、較玻 璃轉移溫度高20°C之溫度以下的溫度範圍為佳。舉例言 之，在上述陶瓷組成物之調製中，使用聚乙烯丁醛或丙烯 酸樹脂等作為黏合劑樹脂時，較佳之溫度範圍大約在6〇〜 80°C間。第1均力加壓之壓力條件以5〜30MPa之壓力範圍 為佳，以10〜20MPa為較佳。均力加壓時間以大約3〜2〇分 鐘為佳。 又，對配設於上述第1積層體iA之上側加壓面上之第1 樹脂薄膜31，如第3(2)圖所示，要求如下述之性質：壓力作 用成於第1均力加壓之際，充分密合於框體積層用生胚薄片 3a、3b、3c之積層部3’具有之階梯狀内壁面至孔腔之底面， 進一步，以上述溫度、壓力條件下之均力加壓，適度地壓 碎階梯狀之角。 為了如上述般作用’第1樹脂薄膜31以膜厚50〜80μιη 且具有以JIS C 2318測定之斷裂強度為15〇〜21〇1^?&之性 質的樹脂薄膜為佳。以下’只要無特別之限制，斷裂強度 係指以JIS C 2318測定之斷裂強度。 樹脂薄膜之膜厚以65〜75μηι為較佳。若樹脂薄膜之膜 厚不到50μιη時’會有上述階段之角無法充分圓化之情形， 當超過80μπι時，如第3(2)圖所示之、對框體積層用生胚薄 片3a、3b、3c之積層部3’之下層部，即框體積層用生胚薄片 3a構成之内壁部，會有第1樹脂薄膜31的密合性不足之情形 第1樹脂薄膜31之斷裂強度進而以16〇〜19〇MPa為更 佳。若第1樹脂薄膜31之斷裂強度不到上述15〇MPa，則有 31 201242455 上述階梯之角無法充分圓化之情形，當超過210MPa時，有 將上述階梯之角過度壓碎，而無法獲得所期之錐角度之情 形。 在本發明使用之第1樹脂薄膜只要為具有上述較佳之 膜厚與斷裂強度之關係之樹脂薄膜，材質未特別限制，具 體之材質可舉PET為例。 (C)步驟：製作框體最外層用生胚薄片之步驟 框體最外層用生胚薄片3d與在上述(A-1)步驟及（A-2) 步驟所說明之各生胚薄片同樣地使用含有陶瓷粉末與黏合 劑樹脂之陶瓷組成物來製作。使用之陶莞組成物如在上述 (A-1)步驟所說明，為與基體用生胚薄片2、框體積層用生胚 薄片3a、3b、3c同種之陶瓷組成物。原料組成可適宜調整， 通常原料組成亦使用與基體用生胚薄片2、框體積層用生胚 薄片3a、3b、3c同樣之陶瓷組成物。 框體最外層用生胚薄片3d係藉以與上述基體用生胚薄 片2同樣之方法，首先，成形成燒成後之厚度為在上述(A-2) 步驟所說明之預定厚度之薄片狀成形物後，以通常之方法 於中央部形成以下形狀、大小之開口部之貫穿孔而進行製 作。框體最外層用生胚薄片3d具有之開口部，形成為與上 述框體積層用生胚薄片3a、3b、3c之開口部形狀相似、即 在本例為圓形，且面積小於上述積層於最下部之框體積層 用生胚薄片3a之開口部之面積。 框體最外層用生胚薄片3d具有之開口部之大小，具體 而言，只要為積層後，框體最外層用生胚薄片3d以後述(E)S 30 201242455 It is preferred that the glass transition temperature of the binder resin contained in the laminated green sheet is higher than the temperature at which the glass transition temperature is 20 ° C or higher. For example, in the preparation of the above ceramic composition, when polyvinyl butyral or an acrylic resin or the like is used as the binder resin, a preferred temperature range is about 6 Torr to 80 °C. The pressure condition of the first uniform pressure is preferably in the range of 5 to 30 MPa, preferably 10 to 20 MPa. The uniform pressurization time is preferably about 3 to 2 minutes. Further, as shown in the third (2) diagram, the first resin film 31 disposed on the upper pressing surface of the first layered body iA is required to have the following properties: the pressure is applied to the first uniform force plus When the pressure is applied, the stepped inner wall surface of the laminated portion 3' of the green sheet 3a, 3b, and 3c of the frame volume layer is sufficiently adhered to the bottom surface of the cavity, and further, the uniform force under the above temperature and pressure conditions is applied. Press, moderately crush the stepped corner. In order to function as described above, the first resin film 31 is preferably a resin film having a film thickness of 50 to 80 μm and having a breaking strength measured by JIS C 2318 of 15 Å to 21 Å. Hereinafter, the breaking strength means the breaking strength measured by JIS C 2318 unless otherwise specified. The film thickness of the resin film is preferably 65 to 75 μm. When the film thickness of the resin film is less than 50 μm, the angle of the above-mentioned stage may not be sufficiently rounded. When it exceeds 80 μm, the green sheet 3a for the frame volume layer as shown in Fig. 3 (2), The lower portion of the laminated portion 3' of the 3b and 3c, that is, the inner wall portion formed by the green sheet 3a of the frame volume layer, the adhesion of the first resin film 31 is insufficient, and the breaking strength of the first resin film 31 is further 16〇~19〇MPa is better. When the breaking strength of the first resin film 31 is less than the above-mentioned 15 MPa, there is a case where the angle of the step is not fully rounded at 31 201242455, and when it exceeds 210 MPa, the angle of the step is excessively crushed, and the angle cannot be obtained. The case of the cone angle of the period. The first resin film to be used in the present invention is not particularly limited as long as it is a resin film having the above-mentioned preferable film thickness and breaking strength, and a specific material may be exemplified by PET. (C) Step: Step of producing a green sheet for the outermost layer of the frame; the outermost layer of the green sheet 3d is the same as each of the green sheets described in the steps (A-1) and (A-2) above. It is produced using a ceramic composition containing a ceramic powder and a binder resin. The ceramic composition to be used is the ceramic composition of the same type as the raw green sheet 2 for the base and the green sheets 3a, 3b and 3c for the frame volume layer, as described in the above step (A-1). The composition of the raw material can be appropriately adjusted. Usually, the same raw material composition is used as the ceramic composition similar to the green raw sheet 2 for the substrate and the green sheets 3a, 3b and 3c for the frame volume layer. The outermost layer of the frame is formed by the green sheet 3d in the same manner as the above-described base sheet 2, and first, the sheet is formed into a sheet having a predetermined thickness as described in the above step (A-2). After the object, a through hole having an opening of the following shape and size is formed in the center portion by a usual method. The opening of the green sheet 3d of the outermost layer of the frame is formed to be similar to the shape of the opening of the green sheets 3a, 3b, and 3c for the frame volume layer, that is, circular in this example, and the area is smaller than the above layer. The area of the opening of the green sheet 3a for the lowermost frame volume layer. The outermost layer of the frame has the size of the opening of the green sheet 3d. Specifically, the outermost layer of the frame is formed by the green sheet 3d (E).
S 32 201242455 步驟之第2均力加壓進行彎曲加工之際，從框體積層用生胚 薄片積層部3’最上面覆蓋内壁面，進而，不到達基體用生 胚薄片2之主面上之元件連接端子用膏層5之大小，便未特 別限制。框體最外層用生胚薄片3d之開口部之大小較佳為 如本例所示，於積層之際，構成其開口部之端面8位於從上 述框體積層用生胚薄片積層部3’之内壁之最上部之位置、 亦即在第5(b)圖中以E顯示之位置，往内側可覆蓋上述積層 部3’之内壁面之長度、亦即在第5圖中以L顯示之長度之處 者。 此外，當令在框體最外層用生胚薄片3d之上述長度L 長於覆蓋框體積層用生胚薄片積層部3’之内壁面之長度 時，框體最外層用生胚薄片3d之一部份會覆蓋孔腔4之底面 24。亦有依需要，使用此種結構之框體最外層用生胚薄片 3d之情形，通常上述長度L為等於覆蓋框體積層用生胚薄片 積層部3’之内壁面之長度的長度。 惟，由於以（E)步驟之第2等力加壓進行彎曲加工之 際，框體最外層用生胚薄片3d在覆蓋框體積層用生胚薄片 積層部3’之内壁面之部份於圓周方向延伸，而有引起在長 度方向之變化之情形。因而，更宜為在框體最外層用生胚 薄片3d之製作中，將上述長度L調整為下述長度，前述長度 係以（E)步驟之第2均力加壓將框體最外層用生胚薄片3d彎 曲加工之際，從框體積層用生胚薄片積層部3’最上面覆蓋 内壁面，其開口部端面8到達基體用生胚薄片2之主面21之 程度者。S 32 201242455 Step 2: When the bending process is performed, the inner wall surface is covered from the uppermost surface of the green sheet laminate portion 3' of the frame volume layer, and further, the main surface of the base sheet 2 is not reached. The size of the paste layer 5 for the component connection terminal is not particularly limited. The size of the opening of the green sheet 3d for the outermost layer of the frame is preferably as shown in the present example. When the layer is laminated, the end surface 8 constituting the opening portion is located at the raw sheet laminate portion 3' from the frame volume layer. The position of the uppermost portion of the inner wall, that is, the position indicated by E in Fig. 5(b), may cover the inner wall surface of the laminated portion 3', that is, the length shown by L in Fig. 5 on the inner side. Where. Further, when the length L of the green sheet 3d at the outermost layer of the frame is longer than the length of the inner wall surface of the green sheet laminate portion 3' for the cover frame volume layer, the outermost layer of the frame is made of a part of the green sheet 3d. The bottom surface 24 of the cavity 4 is covered. In the case where the green sheet 3d is used for the outermost layer of the frame having such a structure, the length L is usually equal to the length of the inner wall surface of the green sheet laminate portion 3' for covering the frame volume layer. However, when the bending process is performed by the second force of the (E) step, the outermost layer of the frame body 3d is on the inner wall surface of the green sheet laminate portion 3' covering the frame volume layer. It extends in the circumferential direction and causes a change in the length direction. Therefore, it is more preferable to adjust the length L to a length in which the length L is adjusted to the outermost layer of the frame by the second uniform force in the step (E). When the green sheet 3d is bent, the inner wall surface is covered from the uppermost surface of the green sheet laminate portion 3' of the frame volume layer, and the opening end surface 8 reaches the main surface 21 of the base raw sheet 2 .
S 33 201242455 又，框體最外層用生胚薄片3d之製作可預先於在例如 (A)步驟中，製作其他生胚薄片之際，同時進行，亦可於(B) 步驟後，第2積層步驟前單獨進行。 再者，框體最外層用生胚薄片3d亦可依需要，於積層 之際，在作為上側之面具有反射層用金屬膏層。金屬膏層 可以與於基體用生胚薄片2形成反射層用金屬膏層相同之 方法形成。又，金屬膏可按陶瓷組成物之種類，使用與在 上述(A-1)步驟之基體用生胚薄片2之製作所記載之導體膏 同樣者。 (D) 步驟：第2積層步驟 第5圖係顯示在本發明之製造方法之一例中，以（D)之 第2積層步驟所得之第2積層體1C之平面圖（a)及其之X-X線 截面圖（b)的圖。 在(D)步驟中，於在上述(B)步驟所得之第1積層體1B上 積層構成以上述(C)步驟所製作之框體3之最外層的板狀之 框體最外層用生胚薄片3d。 即，將以上述(C)步驟所製作之框體最外層用生胚薄片 3d，於在上述(B)步驟所得之第1積層體1B之最上部，積層 為開口部位於上述積層於最下部之框體積層用生胚薄片3a 之開口部的内側，而獲得第2積層體1C。為了在接著進行之 (E) 步驟之第2均力加壓中，防止第2積層體1C之框體最外層 用生胚薄片3d之積層偏移等的產生，積層之方法以藉由單 軸加壓等將框體最外層用生胚薄片3d壓接於第1積層體1B 而形成為積層體之方法為佳。S 33 201242455 Further, the production of the green sheet 3d for the outermost layer of the casing may be carried out in advance, for example, in the step (A), and the second layer may be formed after the step (B). Perform separately before the steps. Further, the green sheet 3d for the outermost layer of the frame may have a metal paste layer for a reflective layer on the upper side as needed when laminated. The metal paste layer can be formed in the same manner as the metal foil layer for forming a reflective layer on the substrate using the green sheet 2 . Further, the metal paste may be the same as the conductor paste described in the production of the base green sheet 2 in the above step (A-1), depending on the type of the ceramic composition. (D) Step: Step 2 of the second lamination step is a plan view (a) of the second layered body 1C obtained by the second lamination step of (D), and an XX line thereof, in an example of the manufacturing method of the present invention. Figure (b) of the cross-sectional view. In the step (D), the outermost layer of the frame-like frame constituting the outermost layer of the frame 3 produced in the above step (C) is laminated on the first layered body 1B obtained in the above step (B). Sheet 3d. In other words, the green sheet 3d for the outermost layer of the frame produced in the above step (C) is placed on the uppermost portion of the first layered body 1B obtained in the above step (B), and the layered portion is located at the lowermost portion of the layer. The frame volume layer is used inside the opening of the green sheet 3a to obtain the second layered body 1C. In order to prevent the occurrence of a layer shift or the like of the green sheet 3d of the outermost layer of the frame of the second layered body 1C in the second uniform pressure press of the step (E), the method of stacking is performed by a single axis. It is preferable to press the outermost layer of the frame with the green sheet 3d by pressure bonding to the first layered body 1B to form a layered body.
S 34 201242455 舉例言之，以單軸加壓將框體最外層用生胚薄片3(1積 層於第1積層體1B，而獲得第2積層體1C時，將於第1積層 體1B重疊有框體最外層用生胚薄片3d者夾進PET薄膜等間 隔件，較佳為在生胚薄片之剩餘部等之區域，將包含間隔 件之全體固定，以單軸加壓機將此壓接而積層。積層時之 條件根據積層之生胚薄片之厚度、陶瓷組成物之種類、原 料組成等而異，但以60〜8CTC ' 1〜4Mpa、1〜3分鐘左右 之條件為佳。 單軸加壓後，去除上述間隔件，將第2積層體ic供至下 個(E)步驟，亦可依需要’在夾進上述間隔件之狀態下，將 第2積層體1C供至下個(E)步驟。此外，在(E)步驟，使用第2 樹脂薄膜，進行均力加壓時，於進行上述單轴加壓之際， 亦可於第1積層體1B重疊有框體最外層用生胚薄片3d者上 配設第2樹脂薄膜，於單軸加壓後，不將此去除而直接與第 2積層體1C一同供至下個(E)步驟。此時，第2樹脂薄膜充分 發揮作為上述間隔件之功能時’不需另外使用間隔件；而 當第2树脂薄片不足以作為間隔件時，則進一步於此上方配 設間隔件，進行單軸加壓。 (E)步驟：第2均力加壓步驟 接著，在(E)步驟中，將在上述(〇)步驟所得之第2積層 體均力加壓。第6圖係示意顯示本發明元件基板之製造方法 之(E)步驟的截面圖。第7圖係顯示以本發明之製造方法之 一例結束(E)步驟後之第2積層體1C、即作為本發明之發光 元件用基板之未燒結元件基板1的平面圖（a)及其χ_χ線截 35 201242455 面圖（b)。 在本發明之製造方法中，如第7圖特別是截面圖⑻所 不，第2均力加壓係為了加工成在上述⑼步驟所得之第增 層體1C中，上述框體最外層用生胚薄片3攸上述框體積層 用生胚薄片積層部3’之最上面覆蓋内壁面之結構而進行: 因而’第2均力加壓係選擇可達成此目的之條件而進行者。 藉第2均力加壓，框體最外層用生胚薄片％加工成為下 述形狀，該形狀係從上述框體積層用生胚薄片積層部3，之 内壁之最上部之位置、亦即在第7(b)圖中以E顯示之位置彎 折’從該位置找構成開口部之端面8之長度L之部份覆蓋框 體積層时胚薄>1積層部3,之㈣㈣面，而形成為未燒 結元件基板丨。又，在第7_中，加工後之框體最外層用 生胚薄㈣之端面8-部份到達以基體用生胚薄片2之主面 21之一部份構成之孔腔4的底面24。 此外，如上述，在本例中，框體最外層用生胚薄片3d 之上述長度L為與覆蓋框體積層用生㈣片積層㈣，之内 壁面之長度相等的長度。又，此框體最外制生胚薄片％ 之端面8通常於第2均力加壓後錢乎維持原本之形狀。因 而’如第7帽所示，在所得之未繞結元件基板丨之框體之 内壁面之結構雜框體最外制生㈣㈣與基體用生胚 薄片2之接合點起’首先以框體最外μ生胚薄㈣之端面 8構成之最下部位於該接合點上方，而實質地構成以框體最 外層用生胚薄片之上側主面所構成之框體内壁面的部份位 於此上方。S 34 201242455 For example, when the second laminate 1C is laminated on the outermost layer of the casing by the uniaxial pressing, the first laminate 1B is superimposed on the first laminate 1B. The outermost layer of the frame is sandwiched between the PET film and the like by the raw sheet 3d, preferably in the region of the remaining portion of the green sheet, etc., and the entire spacer is fixed, and the crimp is pressed by a uniaxial press. The conditions for laminating may vary depending on the thickness of the laminated green sheet, the type of the ceramic composition, the composition of the raw material, etc., but it is preferably 60 to 8 CTC '1 to 4 Mpa, and about 1 to 3 minutes. After the pressurization, the spacer is removed, and the second layered body ic is supplied to the next step (E), and the second layered body 1C is supplied to the next one in a state where the spacer is sandwiched as needed ( In the step (E), when the second resin film is used and the uniform pressure is applied, when the uniaxial pressing is performed, the outermost layer of the frame may be overlapped on the first layered body 1B. The second resin film is placed on the green sheet 3d, and after the uniaxial pressing, the second laminate 1C is directly removed without removing this. In the same manner as in the next step (E), when the second resin film sufficiently functions as the spacer, "the spacer is not required to be used separately; and when the second resin sheet is insufficient as a spacer, it is further A spacer is disposed on the upper side to perform uniaxial pressing. (E) Step: 2nd uniform pressure pressurization step Next, in step (E), the second laminate body obtained in the above (〇) step is uniformly applied Fig. 6 is a cross-sectional view showing the step (E) of the method of manufacturing the element substrate of the present invention. Fig. 7 is a view showing the second layered body 1C after the step (E) is completed by an example of the manufacturing method of the present invention. That is, a plan view (a) of the unsintered element substrate 1 as the substrate for a light-emitting element of the present invention and a plan view (b) thereof in the manufacturing method of the present invention, as shown in Fig. 7, particularly a sectional view (8) In the first layered body 1C obtained in the above step (9), the outermost layer of the frame body is made of the green sheet 3, and the green sheet laminate portion 3' for the frame volume layer is used. The top cover is covered by the structure of the inner wall surface: thus the 'secondary force pressurization By selecting the conditions for achieving the object, the outermost layer of the frame is processed by the green sheet % to a shape obtained from the green sheet laminate portion 3 of the frame volume layer. The position of the uppermost portion of the inner wall, that is, the position shown by E in Fig. 7(b) is bent, and the length L of the end face 8 constituting the opening portion is found from the position to cover the frame volume layer. 1 laminate layer 3, (4) (four) plane, and formed as an unsintered component substrate 又. Also, in the 7th, the outermost layer of the processed frame is covered with the end face of the raw embryonic thin (4). A part of the main surface 21 of the embryo sheet 2 constitutes the bottom surface 24 of the cavity 4. Further, as described above, in the present example, the length L of the outermost layer of the frame is the same as the length L of the green sheet 3d. The (four) sheet layer (four), the length of the inner wall surface is equal. Further, the end face 8 of the outermost green sheet of the frame body is usually maintained in the original shape after the second uniform pressure is applied. Therefore, as shown in the seventh cap, the outermost frame of the inner wall surface of the frame of the obtained unconsolidated element substrate 最 is produced at the outermost position (4) (4) and the joint of the base body with the green sheet 2 is 'first framed' The lowermost portion of the outermost surface of the outermost micro-embryo (4) is located above the joint, and the portion of the inner wall of the frame which is formed by the upper main surface of the raw sheet of the outermost layer of the outer frame is substantially above .
S 36 201242455 即’在此未燒結元件基板1之階段，形成本發明元件基 板之結構，該本發明元件基板之結構係框體之内壁面具有 從與基體之，界部至與框體最外層用生胚薄片之燒成後之 厚度約略同等之高度的位置朝下部擴展之錐狀比前述位 置上部為朝上部擴展之錐狀者。再者，此框體最外層用生 胚薄片3d之端面8之形狀於下個⑺步驟之燒成步驟後亦幾 乎維持原狀。 在此’在最後所得之燒成後之元件基板中，具有實質 構成框體内壁面且朝上部擴展之錐狀的部份，該部分較佳 的錐角度如上述。另一方面，在以框體最外層用生胚薄片 3d之端面8構成之框體内壁面之最下部，最後所得之燒成後 之元件基板之狀態係朝下部擴展之錐狀之錐角度(在第瑁 以β顯示）以大約60。以上、不到9〇。為佳，以7〇以上、8〇〇以 内為較佳。藉由在8〇。以内，填充於孔腔内且含有螢光體之 在封材不致因與孔腔之弱接著性而脫落之次要效果更顯 著，又，藉在70。以上，可更無間隙地填充密封劑。 此外，此角度可根據從在框體最外層用生胚薄片％之 框體積層用生胚薄片積層部3,之内壁之最上部的位置E至 構成開口部之端面8之長度l來調整。藉由框體内壁面之最 下部具有此種形狀，使用此來作為發光裝置之際，可提高 由填充孔腔4之矽樹脂或環氧樹脂等填充劑構成之密封層 13之對元件基板的剝離強度。 用以獲得上述結構之未燒結元件基板丨之第2均力加壓 在上述第1均力加壓中，除了將配設於加壓之積層體之上側S 36 201242455, that is, the structure of the element substrate of the present invention is formed at the stage of the unsintered element substrate 1, and the inner wall surface of the frame of the element substrate of the present invention has the outermost layer from the boundary with the substrate to the outermost layer of the frame The taper shape which expands toward the lower portion at a position where the thickness of the green sheet is approximately equal to the height of the lower portion is a taper which expands toward the upper portion. Further, the shape of the end face 8 of the outermost layer of the green sheet 3d of the frame is almost maintained as it is after the firing step in the next step (7). Here, in the element substrate after the firing which is finally obtained, there is a tapered portion which substantially constitutes the inner wall surface of the frame and expands toward the upper portion, and the preferred taper angle of the portion is as described above. On the other hand, in the lowermost portion of the inner wall surface of the frame which is formed by the end surface 8 of the green sheet 3d of the outermost layer of the frame, the state of the element substrate after the firing is finally a cone-shaped taper angle which expands toward the lower portion ( In the third step, it is shown as β) at about 60. Above, less than 9〇. Preferably, it is preferably 7 inches or more and 8 inches or less. With 8 〇. Within the inside, the secondary effect of filling the cavity and containing the phosphor in the sealing material without falling off due to the weak adhesion of the cavity is more significant. In the above, the sealant can be filled with no gaps. Further, the angle can be adjusted from the position E of the uppermost portion of the inner wall of the green sheet laminate portion 3 to the frame volume layer of the outermost layer of the frame, and the length l of the end surface 8 constituting the opening. By having such a shape at the lowermost portion of the inner wall surface of the casing, when the light-emitting device is used as the light-emitting device, the component substrate of the sealing layer 13 composed of a filler such as a resin or an epoxy resin filling the cavity 4 can be improved. Peel strength. The second uniform force pressurization of the unsintered element substrate 以获得 having the above structure is performed, and the first uniform pressure press is disposed on the upper side of the laminated body which is pressurized
37 S 201242455 加壓面上的第1樹脂薄膜換成第2樹脂薄膜以外，其餘可同 樣地執行。因而，使用之均力加壓裝置宜使用對應於WIP 方式之裝置"再者，在本發明中，由於為了使各層接合， 須以高於生胚薄片所含之黏合劑樹脂之軟化點之溫度加 壓，故以使用WIP方式之水壓機為佳。第6圖係以使用WIP 方式之水壓機作為均力加壓裝置之情形為例，示意地顯示 本發明製造方法之第2均力加壓步驟之圖。以下，參照第6 圖，就第2均力加壓步驟之具體條件作說明。 第6(1)圖係顯示為將第2積層體1C供至水壓機而進行 之初步準備之圖。第6(2)圖係顯示將根據第6(1)圖已初步準 備好之第2積層體1C均力加壓之狀態的圖。 如第6(1)圖所示，於進行均力加壓之際，通常第2積層 體1C載置於支撐板32、例如不鏽鋼等金屬製支撐板上。此 時，為使第2積層體1C與支撐板32不直接接觸，而將例如 PET薄膜等間隔件33夾在兩者間。此間隔件33亦可直接使用 用於上述單軸加壓機所作之壓著之際之間隔件。又，於第2 積層體1C之上側加壓面上，將第2樹脂薄膜37配設成可加工 成框體最外層用生胚薄片3d從框體積層用生胚薄片積層部 3’之内壁之最上部的位置彎折，上述長度L之部份覆蓋該積 層部3’之内壁面整面之形狀。 如此，如第6(1)圖所示，將於第2積層體1C之上下積層 有各種構件者放入真空包裝用樹脂袋34。此外，於第2積層 體1C之上下積層各種構件之際，例如，宜利用生胚薄片之 剩餘部份等，將該等全體固定成第2積層體1C或各種構件不37 S 201242455 The first resin film on the pressurizing surface is replaced with the second resin film, and the rest can be performed in the same manner. Therefore, it is preferable to use a device corresponding to the WIP method for the uniform force pressurizing device. Further, in the present invention, in order to join the layers, it is necessary to have a softening point higher than that of the binder resin contained in the green sheet. The temperature is pressurized, so it is preferable to use a WIP type hydraulic press. Fig. 6 is a view schematically showing a second uniform pressure pressurizing step of the manufacturing method of the present invention, taking a hydraulic press using a WIP method as a uniform pressurizing device as an example. Hereinafter, specific conditions of the second equalizing force pressurizing step will be described with reference to Fig. 6. Fig. 6(1) is a view showing preliminary preparation for supplying the second layered body 1C to the hydraulic press. Fig. 6(2) is a view showing a state in which the second layered body 1C which has been initially prepared according to Fig. 6(1) is uniformly pressurized. As shown in Fig. 6(1), when the uniform pressure is applied, the second laminated body 1C is usually placed on a support plate 32, for example, a metal support plate such as stainless steel. At this time, in order to prevent the second laminated body 1C from coming into direct contact with the support plate 32, a spacer 33 such as a PET film is interposed therebetween. This spacer 33 can also directly use the spacer for the pressing of the above-mentioned uniaxial press. Further, the second resin film 37 is disposed on the upper pressing surface of the second laminated body 1C so as to be machined into the innermost layer of the frame outer layer 3d from the inner wall of the green sheet laminated portion 3' for the frame volume layer. The uppermost position is bent, and the portion of the length L covers the entire surface of the inner wall surface of the laminated portion 3'. As shown in Fig. 6 (1), the resin packaging bag 34 for vacuum packaging is placed in a state in which various members are laminated on the second layered body 1C. In addition, when various members are laminated on the second laminate 1C, for example, it is preferable to use the remaining portion of the green sheet to fix the entire laminate to the second laminate 1C or various members.
S 38 201242455 二，移動。接著’從樹脂袋34抽出空氣35而進行真空包 :、各樹脂袋放人圖中未示之壓力容器， 結束初步準備。 刀令益 声體:由將上述已密閉之壓力容器進行水壓加壓，對第2積 了加熱施行均力加壓。具體言之，將壓力容器浸潰於充滿 態下 X下之較佳之溫度條件之水的熱水槽中。在此狀 條件，力容器之内部壓力增加，以以下之較佳之壓力 —、·師數分至數1G分鐘後，解除壓力容器之内部加壓。 第6(2)圖顯示以溫水之水36之壓力均力加塵中之&積層體 1C的狀態。 從熱水槽回收壓力容器，從其中取出樹脂袋34，進一 步，從樹脂袋34取出上下積層有各種構件之均力加壓後之 第2積層體1C、即作為發光元件用基板之未燒結元件基板 1 進一步，藉卸除支撐板32、間隔件33、第2樹脂薄膜37， 結束第2均力加壓。 在此’作為第2均力加壓之條件，關於溫度條件，以超 過框體最外層用生胚薄片含有之黏合劑樹脂之玻璃轉移溫 度、較玻璃轉移溫度高2(TC之溫度以下之溫度範圍為佳。 舉例言之’在上述喊組成物之調製巾，使用聚乙稀丁越 或丙烯酸樹脂等作為黏合劑樹脂時，較佳之溫度範圍大約 為60〜8G°C間。通常由於使用之料組成物在元件基板内 為相同之組成，故溫度條件可為與上述第丨均力加壓之條件 相同。第2均力加壓之壓力條件以5〜3〇Mpa之壓力範圍為 佳，以10〜2GMPa為較佳。均力加壓時間以大約3〜2〇分鐘 r^·· 2 39 201242455 為佳’壓力條件、加壓時間皆與上述第1均力加壓之條件相 同。 對配設於上述第2積層體1C之上側加壓面上之第2樹脂 薄膜37要求下述性質，前述性質係如第6(2)圖所示，壓力作 用成於第2均力加壓之際，以上述溫度、壓力條件，框體最 外層用生胚薄片3d從框體積層用生胚薄片3,之内壁之最上 部之位置彎折，上述長度L之部份充分密合成覆蓋該積層部 3’之内壁面全面之形狀。 為了如上述般作用，第2樹脂薄膜37以膜厚30〜50μϊη 且具有斷裂強度為230〜300MPa之性質的樹脂薄膜為佳。 樹月9薄膜之膜厚更以35〜4〇μιΏ為較佳。若樹脂薄膜之膜厚 不到3〇μηι時，框體積層用生胚薄片積層部3,之内壁面之階 梯狀形狀可能無法在框體最外層用生胚薄片3d之表面顯現 於上方，當超過5(^^時，在上述框體最外層用生胚薄片兇 考折之部份之角易壓碎。 第2樹脂薄膜37之斷裂強度進而以250〜28〇Mpa為較 佳。若第2樹脂薄膜37之斷裂強度不到上述23〇Mpa，有無 法充分獲得對框體最外層用生胚薄片3d之框體積層用生胚 溥片積層部3’的密合性之情形，當超過川⑴^匕時，在上述 框體最外層用生胚薄片3d彎折之部份之角易壓碎。 在本發明使用之第2樹脂薄膜只要為具有上述較佳之 膜厚與斷裂強度之關係之樹脂薄膜，材質未特別限制，具 體之材質可舉PET為例。 (F)步驟：燒成步驟S 38 201242455 Second, move. Then, the air bag 35 is taken out from the resin bag 34 to carry out a vacuum bag: each of the resin bags is placed in a pressure vessel (not shown), and the preliminary preparation is completed. Knife-sounding effect: The pressure-pressing of the above-mentioned sealed pressure vessel is performed, and the second accumulated heating is applied to the uniform pressure. Specifically, the pressure vessel is immersed in a hot water bath of water at a preferred temperature condition under full X. Under this condition, the internal pressure of the force vessel is increased, and the internal pressure of the pressure vessel is released after the following preferred pressure - the number of divisions is divided into several 1 minute. Fig. 6(2) shows the state of the laminated body 1C in the dust by the pressure of the warm water 36. The pressure vessel is recovered from the hot water tank, and the resin bag 34 is taken out from the resin bag 34. Further, the second laminate body 1C in which the various members are laminated and pressure-received, and the unsintered element substrate as the substrate for the light-emitting element are taken out from the resin bag 34. 1 Further, the support plate 32, the spacer 33, and the second resin film 37 are removed, and the second equalizing pressurization is ended. Here, as a condition of the second uniform pressurization, the glass transition temperature of the binder resin contained in the raw sheet for the outermost layer of the frame is higher than the glass transition temperature by 2 (the temperature below the temperature of TC). The range is preferably. In the case of the above-mentioned shuffling composition, when using polyethylene butyl or acrylic resin as the binder resin, the preferred temperature range is about 60 to 8 G ° C. Usually due to use. The material composition has the same composition in the element substrate, so the temperature condition may be the same as the above-mentioned uniform pressure pressurization condition. The pressure condition of the second uniform pressure is preferably 5 to 3 〇Mpa. It is preferable to use 10~2 GMPa. The uniform pressurization time is about 3~2〇 minutes, r^·· 2 39 201242455 is preferable, and the pressure conditions and pressurization time are the same as those of the first equal pressure press. The second resin film 37 disposed on the upper pressing surface of the second layered body 1C is required to have the following properties. The above properties are as shown in Fig. 6(2), and the pressure acts as the second uniform pressure. At the above temperature and pressure conditions, the outermost layer of the frame The green sheet 3d is bent from the position of the uppermost portion of the inner wall of the raw sheet 3, and the portion of the length L is sufficiently densely combined to cover the entire inner wall surface of the laminated portion 3'. The second resin film 37 is preferably a resin film having a film thickness of 30 to 50 μm and having a breaking strength of 230 to 300 MPa. The film thickness of the tree 9 film is preferably 35 to 4 Å μm. When the film thickness is less than 3 〇μηι, the stepped shape of the inner wall surface of the green sheet laminate portion 3 may not be displayed on the outermost surface of the frame with the surface of the green sheet 3d, when it exceeds 5 ( In the case of ^^, the outermost layer of the frame is easily crushed by the corner of the portion of the raw sheet. The second resin film 37 preferably has a breaking strength of 250 to 28 Å Mpa. When the breaking strength of 37 is less than the above-mentioned 23 〇Mpa, there is a case where the adhesion of the raw enamel laminated portion 3' to the frame volume layer of the outermost layer of the green sheet 3d cannot be sufficiently obtained, and when it exceeds Chuan (1) ^ At the corner of the portion where the outermost layer of the above-mentioned frame is bent by the green sheet 3d The second resin film to be used in the present invention is not particularly limited as long as it is a resin film having the above-described preferable film thickness and breaking strength, and a specific material is exemplified by PET. (F) Step: Burning Step into
S 40 201242455 於上述(E)步驟後，對所得之未燒結元件基板1，依需 要，進行用以去除黏合劑樹脂等之脫脂，且進行用以燒結 陶瓷組成物等之燒成。燒成溫度因所使用之陶瓷組成物而 不同。 使用LTCC用玻璃陶瓷組成物作為陶瓷組成物時，以令 燒成溫度為800°C〜930°C為佳。於燒成前進行脫脂時，例 如，藉將未燒結元件基板1以500°C以上、600°C以下之溫度 保持1小時以上、10小時以下來進行。當脫脂溫度不到 500°C，或脫脂時間不到1小時時，有無法充分去除黏合劑 等之虞。另一方面，脫脂溫度為600°C左右，脫脂時間為1〇 小時左右時，可充分去除黏合劑等，當超過此時，反而有 生產性等降低之虞。 考慮基體2及框體3之緻密構造的獲得與生產性，藉由 在800°C〜930°C之溫度範圍適宜調整時間而進行燒成。具 體言之，宜以850°C以上、900°C以下之溫度保持20分鐘以 上、60分鐘以下，特別是以860°C以上、880°C以下之溫度 進行為佳。若燒成溫度不到800°C，有燒結不充足，無法形 成為基體2及框體3緻密之構造之虞。另一方面，當燒成溫 度超過930°C時，有基體變形等生產性等降低之虞。又，使 用含有以銀為主成份之金屬粉末之金屬膏，作為上述配線 導體用導體膏或其他反射層或導熱孔等金屬層用金屬膏 時，當燒成溫度超過880°C，因過度軟化，有無法維持預定 形狀之虞。 使用氧化鋁陶瓷用組成物作為陶瓷組成物時，用以燒S 40 201242455 After the above-mentioned (E) step, the obtained unsintered element substrate 1 is subjected to degreasing for removing the binder resin or the like, and baking for sintering the ceramic composition or the like. The firing temperature varies depending on the ceramic composition used. When the glass ceramic composition for LTCC is used as the ceramic composition, the firing temperature is preferably 800 ° C to 930 ° C. In the case of degreasing, the unsintered element substrate 1 is maintained at a temperature of 500 ° C or more and 600 ° C or less for 1 hour or more and 10 hours or less. When the degreasing temperature is less than 500 ° C or the degreasing time is less than 1 hour, the binder may not be sufficiently removed. On the other hand, when the degreasing temperature is about 600 ° C and the degreasing time is about 1 〇, the binder can be sufficiently removed, and when it exceeds this time, productivity is lowered. Considering the availability and productivity of the dense structure of the substrate 2 and the frame 3, the firing is carried out by appropriately adjusting the temperature in the temperature range of 800 ° C to 930 ° C. Specifically, it is preferable to maintain the temperature at 850 ° C or higher and 900 ° C or lower for 20 minutes or more, 60 minutes or shorter, and particularly preferably at a temperature of 860 ° C or higher and 880 ° C or lower. When the firing temperature is less than 800 °C, sintering is insufficient, and the structure in which the substrate 2 and the frame 3 are dense cannot be formed. On the other hand, when the firing temperature exceeds 930 ° C, productivity such as deformation of the matrix is lowered. In addition, when a metal paste containing a metal powder containing silver as a main component is used as the conductive paste for a wiring conductor or a metal paste for a metal layer such as a reflective layer or a heat conductive hole, the firing temperature exceeds 880 ° C due to excessive softening. There is no way to maintain the shape of the reservation. When using a composition of alumina ceramics as a ceramic composition, it is used for burning
S 41 201242455 、-。l k結元件基板丨之燒成溫度以丄4〇〇〜工7〇〇(>c為佳。於燒 成前進行脫脂時，，如以20(TC 以上、500°C以下之溫度 保持約1小時以上' 1G小時以下之條件為佳。燒成則以例如 以1400 C以上、17〇〇〇C以下之溫度保持數小時之條件為 佳。惟，加熱時、特別是燒成時，為不使導體氧化，必須 在保持還原氣體環境(例如氫氣環境）中、惰性氣體環境中或 真空中等之非氧化性氣體環境之狀態下，進行加熱。 以上’以LTCC基板、氧化鋁基板為例，就燒成條件作 了说明’上述燒成條件係在該等陶瓷基板之製造中習知眾 所砻知之條件’使用此以外之陶瓷材料時，也以在該材料 通常適用之燒成條件進行燒成即可。 如此進行’燒成未燒結元件基板1，而獲得發光元件用 基板1 ’燒成後，為了依需要而被覆元件連接端子5及外部 連接端子6全體，亦可分別施行鍍鎳、鍍鉻、鍍銀、鍍鎳/ 銀、鑛金、鑛鎳/金等通常在元件基板甲用於導體保護用之 導電性保護層。在該等中，以使用於鍍鎳上施行鍍金之鍍 錄/金為佳，舉例言之’鍍鎳層可使用胺基磺酸鎳浴等，鍍 金層可使用氰化金鉀浴等，分別以電鍍形成。 又’若為LTCC基板以外之陶瓷基板，則由於上述燒成 溫度高’故無法形成以反射性佳之銀等為主成份之金屬膏 層來作為在未燒結元件基板1中依需要而形成之反射層。在 LTCC基板以外之陶瓷基板中，使銀反射層等形成時，於上 述(F)步驟之燒成步驟後，組合網版印刷法、濺鍍沉積法或 噴墨塗佈法等方法而形成即可。S 41 201242455 , -. The firing temperature of the lk junction device substrate is preferably 丄4〇〇~工7〇〇(>c. When degreasing is performed before firing, if it is 20 (TC or more, 500 ° C or lower) The condition of 1 hour or more and 1 G hour or less is preferable, and the firing is preferably carried out at a temperature of, for example, 1400 C or more and 17 〇〇〇C or less for several hours. However, when heating, particularly when firing, In order to prevent the conductor from being oxidized, it is necessary to perform heating in a state of maintaining a reducing gas atmosphere (for example, a hydrogen atmosphere), an inert gas atmosphere, or a vacuum in a non-oxidizing gas atmosphere. The above is an example of using an LTCC substrate or an alumina substrate. The firing conditions are described. 'The above-mentioned firing conditions are well-known conditions in the manufacture of such ceramic substrates.' When using other ceramic materials, the firing conditions are also performed under the firing conditions generally applicable to the materials. After the firing of the unsintered device substrate 1 and the firing of the substrate 1 for the light-emitting device are performed, the device connection terminal 5 and the external connection terminal 6 may be coated as needed, and nickel plating may be performed. chrome Silver plating, nickel plating/silver, gold ore, ore nickel/gold, etc. are usually used for the conductive protective layer for conductor protection on the element substrate. In these, plating/gold plating is performed on nickel plating. For example, the nickel plating layer may be a nickel hydride sulfonic acid bath or the like, and the gold plating layer may be formed by electroplating using a potassium cyanide bath or the like. If the ceramic substrate other than the LTCC substrate is used, Since the firing temperature is high, it is impossible to form a metal paste layer containing silver or the like as a main component as a reflective layer which is formed as needed in the unsintered element substrate 1. In the ceramic substrate other than the LTCC substrate, silver is reflected. When the layer or the like is formed, it may be formed by a combination of a screen printing method, a sputter deposition method, or an inkjet coating method after the firing step in the above step (F).
S 42 201242455 以上，就本發明元件基板之製造方法之實施形態舉了 例說明，但本發明之製造方法非限定於該等者。在不違反 本發明之旨趣之限度下，且依需要，可適宜變更其結構。 在以本發明製造方法所得之具有錐狀側面之孔腔之陶 免元件基板中，實質上錐之傾斜均一而作為發光裝置之 際，取光效率或光之指向性良好。再者，根據本發明之製 造方法，因可以良好精確度控制孔腔側面之錐之傾斜角 度，故亦可獲得使光學裝置之設計之自由度增大之效果。 再者，因不需與製造有關之模具等高價之機械材料，故在 經濟方面有利。又，生產性亦較以研磨機等所作之方法佳。 又’在本發明之製造方法中，可製造本發明之陶究元 件基板，該本發明之陶瓷元件基板係孔腔之錐狀側面在孔 腔底面附近之外之大部份之侧面具有朝上部擴展之錐狀， 並且在孔腔底面附近之一小部份具有朝孔腔底面擴展之錐 狀0 本發明之元件基板係具有主面平坦之板狀之陶究基 體、及形成於前述基體之上側主面之陶瓷框體，並於以前 述基體之上側主面之一部份為底面、以前述框體之内壁面 為側面而形成之孔腔的底面具有發光元件之搭載部者， 又’刖述框體之内壁面在孔腔底面附近之區域’具有朝孔 腔底面擴展之錐狀，在前述孔腔底面附近之外之區域具有 朝上部擴展之錐狀。 此種元件基板可舉下述元件基板為例，前述元件基板 係：前述陶究框體係將中央部具有相互為相似形狀且面積 43 201242455 各不相同之開口部的複數片板狀之生胚薄片，除了開口部 之面積最小之生胚薄片外，從下側以開口部之面積由小至 大之順序積層於基板用生胚薄片之上側主面，再將開口部 之面積最小之生胚薄片積層於最上部後，將前述最上部之 生胚薄片彎曲加工成其開口部側之一部份覆蓋其以外之生 胚薄片積層體之内壁面'且其開口部側之端面到達前述孔 腔之底面的結構，然後燒成而得者；在前述孔腔底面附近 之區域具有朝孔腔底面擴展之錐狀之部份，係以燒成後之 前述最上部之生胚薄片之開口部側的端面構成。 又，在前述框體之内壁面中，具有朝孔腔底面擴展之 錐狀之區域，以至少從該孔腔底面至前述框體之高度之 1/10之同度之位置為止的區域為佳，上限以從該孔腔底面 至前述框體之高度之3/10之高度的位置為止之區域為佳。 此區域之下限以從孔腔底面至前述框體之高度之1.5/10之 冋度的位置為止之區域為較佳，上限以從孔腔底面至前述 框體之冋度之2/1〇之高度的位置為止之區域為較佳。又， 在本發明之元件基板卜如第i圖所示之元件基板般，在上 述孔腔底面附近之區域之外之區域之框體的内壁面，具有 朝上部擴展之錐狀。 在此，關於構成本發明元件基板之陶瓷之種類及框體 内壁面之孔腔底_近之區域中之錐角度、及孔腔底面附 近之區域以外的區域中之錐角度等未特別限定，具體言 之’可與在上述本發日月之製造方法中所說明之態樣相同。 此種本發明之陶究元件基板如上逃，例如可以上述本Although the embodiment of the method of manufacturing the element substrate of the present invention is described above, the method of the present invention is not limited to these. The structure may be appropriately changed without departing from the scope of the present invention. In the ceramic-free component substrate having the tapered side cavity obtained by the production method of the present invention, the inclination of the cone is uniform and the light-emitting efficiency or the directivity of light is good. Further, according to the manufacturing method of the present invention, since the inclination angle of the taper on the side of the cavity can be controlled with good precision, the effect of increasing the degree of freedom in designing the optical device can also be obtained. Furthermore, it is economically advantageous because it does not require high-priced mechanical materials such as molds related to manufacturing. Moreover, the productivity is better than that of a method such as a grinder. Further, in the manufacturing method of the present invention, the ceramic element substrate of the present invention can be manufactured. The ceramic element substrate of the present invention has a tapered side surface of the cavity having a large portion on the side other than the vicinity of the bottom surface of the cavity. Expanded tapered shape, and a small portion near the bottom surface of the cavity has a tapered shape extending toward the bottom surface of the cavity. The component substrate of the present invention has a plate-like ceramic substrate having a flat main surface, and is formed on the substrate. The ceramic frame body of the upper main surface has a bottom surface of the upper surface of the base body, and a bottom surface of the cavity formed by the inner wall surface of the frame body has a light-emitting element mounting portion, and The region of the inner wall surface of the frame in the vicinity of the bottom surface of the cavity has a tapered shape that expands toward the bottom surface of the cavity, and a region outside the vicinity of the bottom surface of the cavity has a tapered shape that expands toward the upper portion. In the above-mentioned element substrate, the element substrate is a plurality of plate-shaped green sheets having openings having different shapes in the center portion and having different areas 43 201242455 in the center portion. In addition to the raw sheet of the smallest area of the opening, the area of the opening is laminated from the lower side to the upper main surface of the raw sheet for the substrate, and the area of the opening is minimized. After the uppermost layer is laminated, the uppermost green sheet is bent into an inner wall surface of the green sheet laminate body portion of the opening portion side of the opening portion side, and the end surface of the opening portion side reaches the cavity The structure of the bottom surface is then fired; the region near the bottom surface of the cavity has a tapered portion extending toward the bottom surface of the cavity, and is formed on the opening side of the uppermost green sheet after firing. End face composition. Further, in the inner wall surface of the casing, a tapered region extending toward the bottom surface of the cavity is preferably at least a region from the bottom surface of the cavity to a position equal to 1/10 of the height of the frame. The upper limit is preferably a region from the bottom surface of the cavity to a height of 3/10 of the height of the frame. Preferably, the lower limit of the region is from a position from the bottom surface of the cavity to a height of 1.5/10 of the height of the frame, and the upper limit is 2/1 of the width from the bottom surface of the cavity to the frame. The area up to the height is preferred. Further, in the element substrate of the present invention, as in the element substrate shown in Fig. i, the inner wall surface of the frame outside the region near the bottom surface of the cavity has a tapered shape which expands toward the upper portion. Here, the type of the ceramic constituting the element substrate of the present invention, the taper angle in the vicinity of the hole bottom surface of the inner wall surface of the frame, and the taper angle in the region other than the region near the bottom surface of the cavity are not particularly limited, and the like. Specifically, it can be the same as that described in the above-described manufacturing method of the present invention. Such a ceramic element substrate of the present invention escapes as above, for example, the above
S 44 201242455 發明之製造方法製造，只要具有上述結構，製造方法不限 於此。又，在具有上述錐狀側面具特徵之孔腔之本發明之 陶瓷基板中，除了取光效率或光之指向性之特性外，於使 用此來製造發光裝置之際，可提高與由填充於孔腔内之填 充劑所構成之密封層的密合性。 使用本發明之元件基板、例如具有以本發明之製造方 法而得之均一傾斜之錐狀側面之孔腔的元件基板之發光裝 置，例如可適合使用作為行動電話、個人電腦或平面電視 之液晶顯示器等之背光源、汽車用或裝飾用照明、一般照 明、其他光源。 實施例 以下，說明本發明之實施例。此外，本發明非限定於 δ亥專實施例者。 [實施例] 以以下說明之示意顯示於第2圖〜第7圖之方法，製作 與第1圖所示之發光裝置10之元件基板1同樣之構造的元件 基板。此外’與上述同樣地，在燒成之前後用於構件之標 號使用相同者。 (Α)第1積層步驟(獲得第丨積層體之步驟） 首先，製作了用以製作元件基板1之基體2及框體3的基 體用生胚薄片2、框體用生胚薄片（框體積層用生胚薄片及 框體最外層用生胚薄片）。 各生胚薄片將原料摻合、混合成各生胚薄片以氧化物 換算之mol%顯示，Si02係60.4mol%、Β2〇3係 15.6mol%、 3 45 201242455S 44 201242455 The manufacturing method of the invention is manufactured, and the manufacturing method is not limited thereto as long as it has the above configuration. Further, in the ceramic substrate of the present invention having the above-described tapered side mask-shaped cavity, in addition to the characteristics of light extraction efficiency and light directivity, when the light-emitting device is manufactured using the above, the filling can be improved and filled. Adhesion of the sealing layer formed by the filler in the cavity. A light-emitting device using the element substrate of the present invention, for example, an element substrate having a uniformly inclined tapered side surface cavity obtained by the manufacturing method of the present invention, for example, can be suitably used as a liquid crystal display for a mobile phone, a personal computer, or a flat-panel television. Such as backlight, automotive or decorative lighting, general lighting, other light sources. EXAMPLES Hereinafter, examples of the invention will be described. Further, the present invention is not limited to those of the specific embodiment. [Embodiment] An element substrate having the same structure as that of the element substrate 1 of the light-emitting device 10 shown in Fig. 1 was produced by the method shown in Figs. 2 to 7 in the following description. Further, in the same manner as described above, the same reference numerals are used for the members before the firing. (Α) First lamination step (step of obtaining the second layer) First, the base sheet 2 for producing the base 2 and the frame 3 of the element substrate 1 and the green sheet for the frame (frame) The raw layer of the laminated layer and the outermost layer of the frame are made of the raw sheet. Each of the green sheets was blended and mixed into each of the green sheets to show the mol% in terms of oxide, and the SiO 2 system was 60.4 mol%, Β2〇3 system, 15.6 mol%, and 3 45 201242455.
Al2〇3 係 6mol°/〇、Ca◦係 15mol%、κ20 係 lmol%、Na20 係 2mol%之組成之玻璃’將此原料混合物放入白金坩鍋，以 160°C熔融60分鐘後’將此熔融狀態之玻璃流出而予以冷 卻。以氧化銘製球磨機將此玻璃粉碎4〇小時，而製造了玻 璃粉末。此外’粉末時之溶媒使用了乙醇。 藉由摻合、混合成此玻璃粉末為35質量％，氧化鋁粉 末（昭和電工公司製、商品名：AL-45H)為40質量❶/。，氧化 錯粉末（第一稀元素化學工業公司製、商品名：HSY-3F-J) 為25質量％，製造了玻璃陶瓷混合物。於此玻璃陶瓷組成 物50g摻合、混合有機溶劑（將甲苯、二曱苯、2-丙醇、2-丁醇以質量比4 : 2 : 2 : 1混合者）15g、塑化劑（鄰苯二甲酸 二(2-乙基已基）酯）2.5g、作為黏合劑樹脂之聚乙烯丁醛（電 氣化學工業公司製、商品名：pVK#3000K)5g、還有分散劑 (BYK-Chemie公司製、商品名：BYK180)0.5g，而調製了漿 狀玻璃陶瓷組成物。 將此玻璃陶瓷組成物以到刀法塗佈於P E T薄膜上，製作 生胚薄片，使其乾燥，積層所得之生胚薄片，而製作了約 略平板狀且燒成後之厚度為0.5mm之基體用生胚薄片2。以 同樣之方法，製作了燒成後之厚度分別為0.10mm、 0‘〇9mm、0.〇6mm3種框體用生胚薄片。 使用該等框體用生胚薄片，製作了框外之形狀與基體 用生胚薄片2相同並於中央部具有燒成後之直徑為 之約略圓形開口部且燒成後之厚度為0.06mm 的框體積層用生胚薄片3a、於中央部具有燒成後之直徑為Al2〇3 is a glass having a composition of 6 mol°/〇, Ca◦ 15 mol%, κ20 system 1 mol%, and Na20 system 2 mol%. This raw material mixture is placed in a white gold crucible and melted at 160 ° C for 60 minutes. The molten glass flows out and is cooled. The glass powder was produced by pulverizing the glass for 4 hours in an oxidized Ming ball mill. Further, ethanol was used as the solvent in the powder. The glass powder was blended and mixed to a mass ratio of 35 mass%, and the alumina powder (manufactured by Showa Denko Co., Ltd., trade name: AL-45H) was 40 mass%. The oxidized powder (manufactured by First Least Element Chemical Co., Ltd., trade name: HSY-3F-J) was 25% by mass, and a glass-ceramic mixture was produced. 50 g of this glass-ceramic composition was blended and mixed with an organic solvent (toluene, diphenylbenzene, 2-propanol, 2-butanol in a mass ratio of 4:2:2:1) 15 g, plasticizer (near) 2.5 g of bis(2-ethylhexyl) phthalate, 5 g of polyvinyl butyral (manufactured by Electric Chemical Industry Co., Ltd., trade name: pVK #3000K) as a binder resin, and a dispersing agent (BYK-Chemie) The company's system, trade name: BYK180) 0.5g, and the slurry glass ceramic composition was prepared. The glass ceramic composition was applied to a PET film by a knife method to prepare a green sheet, which was dried, and the resulting green sheet was laminated to prepare a substrate having a thickness of about 0.5 mm after being fired. Use the raw embryo sheet 2. In the same manner, three kinds of green embryo sheets for the frame were prepared to have thicknesses of 0.10 mm, 0'〇9 mm, and 0.〇6 mm after firing. Using the green sheet of the frame, the shape of the outer frame was the same as that of the base sheet 2, and the diameter of the base was approximately circular opening after firing, and the thickness after firing was 0.06 mm. The frame volume layer is formed by the green sheet 3a and has a diameter after firing in the central portion.
S 46 201242455 ㈣之約略圓形開口部且燒成後之厚度為〇的晒 的忙體積層用生胚薄片％、於中央部具有燒成後之直徑為 4.74ηιΜ=：2ϊ·3)之約略圓形開口部且燒成後之厚度為u 〇_ •王體知層用生胚薄片3e。此外，在上述框體用生胚薄片 之開口部之製作使用打孔機而形成。 ，在此’在本實施例中，將元件基板1製造為連結基板， 於後述燒成後’逐個分割，作為5mmx5mm之外侧尺寸之約 略正方形的疋件基板卜以下之記載係就連結基板中之分割 後作為1個元件基板1之-區塊說明者。 另—方面，將導電性粉末(銀粉末：大研化學工業公司 製、商品名：S550)、作為媒液之乙基纖維素以質量比85 : 匕例摻&，分散於作為溶劑之α松脂醇，而使固態部份 形成為85質量％後’在竟器研砵中進行拌合1小時，進一 步，以二軋輥進行3次分散，而製造了配線導體用膏。 又，金屬層用膏係將銀粉末(大研化學工業公司製、商 品名：S400-2)、作為媒液之乙基纖維素以質量比9〇 :⑺之 比例摻合，分散於作為溶劑之α松脂醇，而使固態部份形成 為87質量。/。後’在瓷器研缽中進行拌合丨小時，進—步，以 三軋輥進行3次分散而製造。 於基體用生胚薄片2之相當於一對貫穿導體7之部份使 用打孔機，形成直徑〇.3mm之貫穿孔，以網版印刷法填充 藉由上述所得之配線導體用膏，形成貫穿導體用膏層7,並 且於背面23形成了一對外部連接端子用膏層6»進_步，於 基體用生胚薄片2之主面21上，以網版印刷法將—對元件連S 46 201242455 (4) The approximately circular opening portion and the thickness of the busy volume layer after the firing is %, the diameter of the green sheet for the busy volume layer, and the diameter of the central portion after firing is 4.74ηιΜ=:2ϊ·3) The thickness of the circular opening and after firing is u 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ Further, the opening of the green sheet of the frame body is formed by using a puncher. Here, in the present embodiment, the element substrate 1 is manufactured as a connection substrate, and is divided one by one after firing, and is approximately a square substrate having a size of 5 mm x 5 mm and the like. After division, it is described as a block of one element substrate 1. On the other hand, a conductive powder (silver powder: manufactured by Dayan Chemical Co., Ltd., trade name: S550) and ethyl cellulose as a vehicle liquid are mixed in a mass ratio of 85: 匕, and dispersed in a solvent as a solvent. After the rosin was formed into a mass fraction of 85% by mass, the mixture was mixed for 1 hour in a mortar, and further dispersed three times with two rolls to produce a wiring conductor paste. Further, the metal layer paste is prepared by blending silver powder (manufactured by Daikin Chemical Co., Ltd., trade name: S400-2) and ethyl cellulose as a vehicle liquid at a mass ratio of 9 〇:(7), and dispersing as a solvent. The alpha rosin alcohol forms a solid portion of 87 mass. /. Thereafter, the mixture was kneaded in a porcelain mortar for a few hours, and the mixture was further processed by three-time dispersion. A puncher having a diameter of 〇3 mm is formed in a portion corresponding to the pair of through conductors 7 of the green sheet 2 for the base body, and a through hole having a diameter of 〇3 mm is formed, and the wiring conductor paste obtained by the above is filled by screen printing to form a through-hole. The conductor layer 7 is formed on the back surface 23, and a pair of external connection terminal paste layers 6» are formed on the back surface 23, and the main surface 21 of the substrate is formed on the main surface 21 of the green sheet 2 by screen printing.
S 47 201242455 接端子用膏層5形成為約略長方形而覆蓋貫穿導體用膏層 7’而獲得了具有配線導體膏層之基體用生胚薄片2。 於藉由上述所得之具有配線導體用膏層之基體用生胚 薄片2之主面21上，將藉由上述所製作之3片框體積層用生 胚薄片3a、儿、允從基體用生胚薄片2之主面側依序重疊， 將此以以下之方法藉由單軸加壓進行積層壓著，而獲得了 於第2圖顯示其平面圖及載面圖之第丨積層體丨八。 即，於以上述順序重疊有各生胚薄片者之上側及下側 分別配設了重疊有各2片之PET薄膜A(PET薄膜A :厚户 75μιη、斷裂強度以⑴^以)之間隔件，在生胚薄片之剩餘= 之區域將包含間隔件之全體固定，將此夾於積層夾具，然 後以單軸加壓機以8(rc、4MPa加壓丨分鐘。此外，單軸: 麼係於3分鐘之預熱後進行。 在此，在本實施例中，使用將貫穿孔設成位於作為元 件基板之各區塊之四角者作為連結基板。對應於此，關於 作為上述間隔件之上下各2片之pET薄膜A中接觸積層體之 側的PET薄膜A ’使用於位於連結基板具有之上述各區塊之 四角的貝牙孔之位置形成有與此相同之貫穿孔者。藉由亦 於PET薄膜A，於與形成於連結基板之貫穿孔相同之位置形 成貝穿孔可防止加壓時之貫穿孔之變形，而可將孔形狀 保持良好。 (B)第1均力加壓之步驟(將框體積層用生胚薄片之積層部於 内壁面具有之階梯狀角圓化之步驟） 於單轴加壓後’將配设於第1積層體丨八之上下之間隔件S 47 201242455 The terminal-use paste layer 5 is formed in a substantially rectangular shape so as to cover the through-conductor paste layer 7', and the base body green sheet 2 having the wiring conductor paste layer is obtained. On the main surface 21 of the base green sheet 2 having the wiring conductor paste layer obtained as described above, the raw sheet 3a for the frame volume layer produced by the above is used, and the substrate is used for the substrate. The main surface side of the embryo sheet 2 was sequentially superposed, and this was laminated by uniaxial pressing in the following manner, and the second layer of the plan view and the plan view of Fig. 2 was obtained. In other words, spacers in which PET film A (PET film A: thick household 75 μm, breaking strength is (1)) is superposed on each of the upper side and the lower side of each of the raw green sheets are stacked in the above-described order. In the remaining area of the green sheet, the entire spacer is fixed, and this is clamped to the stacking jig, and then pressed by a uniaxial press at 8 (rc, 4 MPa for 丨 minutes. In addition, the single axis: Here, in the present embodiment, a four-corner having a through-hole located at each of the blocks as the element substrate is used as the connection substrate. Accordingly, the above-mentioned spacer is used as the above-mentioned spacer. The PET film A' on the side of the two pET films A that are in contact with the laminate is formed in the same position as the through hole at the four corners of the respective blocks of the connection substrate. In the PET film A, the formation of the perforation at the same position as the through hole formed in the connection substrate prevents the deformation of the through hole during pressurization, and the shape of the hole can be kept good. (B) Step of the first uniform pressurization (The frame volume layer is formed by the layer of the raw embryo sheet The inner wall surface has a stepped angle rounded step) after the uniaxial pressing, the spacer which is disposed above the first laminated body
S 48 201242455 令僅對上側去除了PET薄膜A之外側之丨片者，載置固定於 支撐板32上。將此放入真空包裝用之樹脂袋料(於第3(丨）圖 顯不該狀態），於真空包裝後，將各樹脂袋放入壓力容器， 將塵力容器密閉。在此，在第3⑴圖顯示作為第靖脂薄膜 Μ之樹脂薄膜係、上述1>ίΡΕΤ_Α，顯示為間隔件幻者則 係重疊有上述2片PET薄膜a者。 上述已密閉之壓力容器架於水壓機，料i積層體Μ 、C lGMPa進行5分鐘之均力加壓。水壓機使用日機 裝公司製體4-26_50,壓力容器使用024〇麵、水量 260m卜此外，於均力加壓前進行1()分鐘之預熱。從壓力容 ^取出樹脂袋34 ’進—步從樹脂袋％取出上下積層有各種 構件之均力力顧積層魏，進而，卸除支撐板32 及上下之PET薄膜A。 固 進行而得之第1積層體1B之平面圖及截面圖如第4 3圖所示’在此第1積層體1B中，框體積層用生胚薄片積層部 以 之内壁面具有之階梯各階之曲率半徑（在第4圖中， =、R2、R3顯示）從下段開始依序分別為㈣％職 幻=0.〇9麵、R3=〇,1()mm。 (C)製作框體最外層生胚薄片之步驟 框體最外層用生胚薄片做用與上述框體積層用生胚 ，片同種之喊組成物，通常原料組成亦使用同樣之陶究 、、且成物，讀上述框體積層用生胚薄⑽目同之方法’製作 了於中央部具有與前述框體積相生胚薄片之開口部形狀 目似、且面積小於前述積層於最下部之框體積層用生胚薄S 48 201242455 Let the sputum on the outer side of the PET film A removed from the upper side be placed and fixed on the support plate 32. This was placed in a resin bag for vacuum packaging (not shown in the third figure), and after vacuum packaging, each resin bag was placed in a pressure vessel to seal the dust container. Here, in the third (1) diagram, the resin film system as the yoke film, and the above-mentioned 1> ΡΕΤ ΡΕΤ Α Α Α Α Α Α 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The sealed pressure vessel is placed on a hydraulic press, and the material is laminated and C lGMPa is pressed for 5 minutes. The hydraulic press uses the machine body of the company 4-26_50, the pressure vessel uses 024 〇, and the water volume is 260 m. In addition, it is preheated for 1 () minutes before the pressure is applied. The resin bag 34' is taken out from the pressure capacity, and the resin layer is taken out from the resin bag, and various members are placed on the upper and lower layers to force the laminate. Further, the support plate 32 and the upper and lower PET films A are removed. A plan view and a cross-sectional view of the first layered body 1B obtained by solidification are shown in Fig. 4'. In the first layered body 1B, the inner layer of the frame layer layer has a stepped step on the inner wall surface. The radius of curvature (in Fig. 4, =, R2, and R3 are displayed) from the bottom of the following paragraphs are (4)% job illusion=0.〇9 faces, R3=〇, 1() mm. (C) The step of making the outermost layer of the embryonic sheet of the frame body The outermost layer of the frame body is made of the raw embryonic sheet and the shattering composition of the same type of raw embryo and the sheet of the above-mentioned frame volume layer, and the same raw material composition is also used for the same ceramics, And the object is read, and the frame volume layer is read by the method of the raw embryo thin (10). The frame having the opening portion shape of the embryo sheet at the center portion and having a smaller area than the laminate layer is formed at the center portion. Thin layer of raw embryo
S 49 201242455 片之開口部之面積的開口部之板狀框體最外層生胚薄片β 又’前述中央部之開口部呈約略圓形，其燒成後之直徑為 3.80mm，又，其燒成後之厚度為〇 1〇mm。 (D)第2積層步驟(獲得第2積層體之步驟） 在(D)步驟’把在上述(c)步驟所得之框體最外層用生胚 薄片3d，於在上述(B)步驟所得之第1積層體1B之最上部， 積層成前述開口部之_心與前述積層於最下部之框體積層 用生胚薄片之前述開口部之中心约略一致，將此以以下之 方法藉由單軸加壓進行積層壓著，而獲得於第5圖顯示其平 面圖及截面圖之第2積層體lc。框體最外層用生胚薄片3cj 長度L係等於覆蓋框體積層用生胚薄片積層部3’之内壁面 之長度者。 即’將於第1積層體1B之最上部重疊有框體最外層用生 胚薄片3d者之下侧重疊有2片pet薄膜A的間隔件及於上側 重疊有PET薄膜B(PET薄膜b :厚度36μιη、斷裂強度 270MPa)、PET薄膜Α之間隔件，配設成在上側為ρΕΤ薄膜Β 接觸積層體之側，在生胚薄片之剩餘部之區域，將包含間 隔件之全體固定，將此夾在積層夾具，然後以單軸加壓機 以80°C ' 4MPa，加壓1分鐘。此外，單軸加壓於3分鐘之預 熱後進行》 在此，關於作為上述間隔件之上下各2片pET薄獏中接 觸積層體之側之PET薄膜，具體為在上側接觸積層體之 薄膜Β與在下側接觸積層體之pet薄膜A，係使用了在位於 連結基板具有之上述各區塊之四角的貫穿孔之位置形成有 201242455 與此相同之貫穿孔者。 (E)第2均力加壓步驟(獲得未燒結連結基板之步驟） 於單轴加壓後，將配設於第2積層體1C之上下之間隔件 中僅對上側去除了 PET薄膜A者載置固定於支撐板32上。將 此放入真空包裝用之樹脂袋34(於第6(1)圖顯示該狀態），於 真空包裝後，將各樹脂袋放入壓力容器，將壓力容器密閉。 在此’在第6(1)圖顯示為第2樹脂薄膜37之樹脂薄膜係上述i 片PET薄膜B，顯示為間隔件33者係重疊有上述2片PET薄膜 A者。 將上述已密閉之壓力容器架於水壓機，對第2積層體1C 以60°C ' lOMPa，進行5分鐘之均力加壓。此外，於均力加 壓前，進行ίο分鐘之預熱。從壓力容器取出樹脂袋34，進 -步從樹脂袋34取出上下積層有各種構件之均力加壓後之 第2積層體，進而’卸除支稽板32及上下之ρΕτ薄膜A、B， 而獲得了未燒結連結基板i。 (F)未燒結連結基板之燒成步驟 於藉由上述所得之未燒成連結基板，加入如使未燒結 兀件基板1之各區塊於燒成後形成為5mmx5_之外侧尺寸 的分割用切割線後’以55(rc保持5小時，進行脫脂，進一 步’以8贼保_分鐘，進行燒成，而製造了連結基板。 將所得連結基板沿著切割線分割，而製造了元件基板卜 評價 1 所得之元件基板1之孔腔側 射位移計（COMS公司製 面之錐傾斜(α)為45。，以雷 二維形狀測定系統 51 201242455 EMS2002AD-3D)，評價其均一性，結果，確認了均一性良 好。 又，在所得之元件基板1之孔腔底面附近，從該底面至 90μιη之高度為止的孔腔側面如第1圖所示，朝孔腔底面擴 展成錐狀，將該錐傾斜、即孔腔底面與側面所夾之角之角 度（β)與上述同樣地進行測定，結果，為75° 。 產業上之可利用性 以本發明之製造方法所得之元件基板係具有具均一傾 斜之錐狀側面的孔腔之元件基板。使用此之發光裝置例如 可適合使用作為行動電話、個人電腦、平面電視之液晶顯 示器等的背光源、汽車用或裝飾用照明、一般照明、其他 光源。 此外，於此引用於2011年2月10日提申之曰本專利申請 案2011-027527號之說明書、申請專利範圍、圖式及摘要之 所有内容，將之納入作為本發明之揭示。 【圖式簡單說明】 第1(a)圖-第1(b)圖係顯示使用以本發明之製造方法而 得之元件基板之發光裝置之一例的平面圖及截面圖。 第2(a)圖-第2(b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的(Α)步驟後、或(a)步驟後之第1積層體 之平面圖及截面圖。 第3(1)圖-第3(2)圖係示意顯示本發明元件基板之製造 方法之(B)步驟或(b)步驟的截面圖。 第4(a)圖-第4(b)圖係顯示本發明元件基板之製造方法S 49 201242455 The plate-shaped frame of the opening of the opening area of the sheet is the outermost layer of the embryonic sheet β. The opening of the central portion is approximately circular, and the diameter after firing is 3.80 mm. The thickness after the formation is 〇1〇mm. (D) Second lamination step (step of obtaining the second laminate) In the step (D), the raw sheet 3d is used for the outermost layer of the frame obtained in the above step (c), and is obtained in the above step (B). The uppermost portion of the first layered body 1B is formed so that the center of the opening portion is approximately coincident with the center of the opening portion of the raw sheet of the frame volume layer laminated on the lowermost portion, and the uniaxial direction is obtained by the following method. The second laminate lc is shown in plan view and cross-sectional view in Fig. 5 by pressure lamination. The length L of the green sheet 3cj for the outermost layer of the frame is equal to the length of the inner wall surface of the green sheet laminate portion 3' for covering the frame volume layer. In other words, a spacer in which two pet films A are superposed on the lower side of the outermost layer of the green sheet 3d and a PET film B (PET film b is superposed on the upper side) is stacked on the uppermost layer of the first laminate 1B. a spacer having a thickness of 36 μm and a breaking strength of 270 MPa) and a PET film is disposed on the side of the upper side of the film Β contact laminated body, and the entire portion including the spacer is fixed in the region of the remaining portion of the green sheet. The sheet was clamped, and then pressurized at 80 ° C ' 4 MPa with a uniaxial press for 1 minute. In addition, the uniaxial pressing is performed after preheating for 3 minutes. Here, the PET film which is the side of the two pET sheets which are in contact with the laminated body in the upper and lower sides of the spacer, specifically, the film which contacts the laminated body on the upper side The pet film A which is in contact with the laminate on the lower side is formed by using the same through hole as the 201242455 at the position of the through hole at the four corners of the respective blocks of the connection substrate. (E) second uniform force pressurization step (step of obtaining an unsintered connecting substrate), after the uniaxial pressing, the spacer which is disposed above the second laminated body 1C, only the PET film A is removed from the upper side The mounting is fixed to the support plate 32. This was placed in a resin bag 34 for vacuum packaging (this state is shown in Fig. 6 (1)), and after vacuum packaging, each resin bag was placed in a pressure vessel, and the pressure vessel was sealed. Here, the resin film of the second resin film 37 shown in Fig. 6(1) is the above-mentioned i piece PET film B, and the two sheets of the PET film A are superimposed on the separator 33. The sealed pressure vessel was placed on a hydraulic press, and the second layered body 1C was pressurized at 60 ° C '10 MPa for 5 minutes. In addition, pre-heating is performed for ί minutes before the pressure is applied. The resin bag 34 is taken out from the pressure vessel, and the second layered body in which the various components are laminated under pressure and pressure is removed from the resin bag 34, and the branching plate 32 and the upper and lower ρΕτ films A and B are removed. The unsintered bonded substrate i was obtained. (F) The firing step of the unsintered connecting substrate is carried out by dividing the unfired connecting substrate obtained as described above, and dividing the respective blocks of the unsintered element substrate 1 into a size of 5 mm x 5 _ after the firing. After the dicing line, the slab was held at 55 rc for 5 hours, and degreased, and further baked at 8 thieves for 1 minute to produce a bonded substrate. The obtained connecting substrate was divided along the dicing line to fabricate the element substrate. The cavity side displacement meter (the cone tilt (α) of the surface of the COMS company obtained by the COMS company was evaluated as 45. The two-dimensional shape measuring system 51 201242455 EMS2002AD-3D) was evaluated, and the uniformity was evaluated. Further, in the vicinity of the bottom surface of the cavity of the obtained element substrate 1, the side surface of the cavity from the bottom surface to the height of 90 μm is expanded to a tapered shape toward the bottom surface of the cavity as shown in Fig. 1 . The angle of the taper, that is, the angle (β) of the angle between the bottom surface of the cavity and the side surface is measured in the same manner as described above, and is 75°. INDUSTRIAL APPLICABILITY The component substrate obtained by the manufacturing method of the present invention has Uniform tilt The element substrate of the cavity having the tapered side surface. For the light-emitting device using the above, for example, a backlight for a mobile phone such as a mobile phone, a personal computer, or a flat-panel television, illumination for automobiles or decoration, general illumination, and other light sources can be suitably used. In addition, all the contents of the specification, the scope of the patent, the drawings and the abstract of the patent application 2011-027527, which is hereby incorporated by reference in its entirety in its entirety in its entirety in BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(a) to Fig. 1(b) are plan views and cross-sectional views showing an example of a light-emitting device using an element substrate obtained by the production method of the present invention. Fig. 2(a) - 2(b) is a plan view and a cross-sectional view showing the first laminate after the step (()) or the step (a) of the embodiment of the method for producing the element substrate of the present invention. Fig. 3(1) - Fig. 3(2) is a cross-sectional view schematically showing the step (B) or the step (b) of the method of manufacturing the element substrate of the present invention. Fig. 4(a) to Fig. 4(b) show the substrate of the element of the present invention. Production method
S 52 201242455 之實施形態之一例的(B)步驟後、或(b)步驟後之第1積層體 之平面圖及截面圖。 第5(a)圖-第5(b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的（D)步驟後、或(c)步驟後之第2積層體 之平面圖及截面圖。 第6(1)圖-第6(2)圖係示意顯示本發明元件基板之製造 方法之(E)步驟或(d)步驟的截面圖。 第7(a)圖-第7(b)圖係顯示本發明元件基板之製造方法 之實施形態之一例的(E)步驟後、或(d)步驟後之第2積層體 (未燒結元件基板)之平面圖及截面圖。 【主要元件符號說明：: 1 1...發光元件用基板（元件基 6...外部連接端子(外部連接端 板、未燒結發光元件用基 子用膏層） 板、未燒結元件基板） 7...貫穿導體(貫穿導體用膏層） ΙΑ，1B...第1積層體 8...端面 1C...第2積層體 10...發光裝置 2…基體(基體用生胚薄片） 11…發光元件 3...框體 12...金屬線 3’...積層部 13...密封層 3a-3c...框體積層用生胚薄片 21...基體之主面 3d...框體最外層用生胚薄片 22...搭載部 4...孔腔 23…基體之背面 5...元件連接端子（元件連接端 24...孔腔之底面 子用膏層） 25...孔腔之側面A plan view and a cross-sectional view of the first layered body after step (B) or after step (b) of an embodiment of S 52 201242455. 5(a) to 5(b) are plan and cross-sectional views showing the second laminate after the step (D) or after the step (c), which is an example of the embodiment of the method for producing the element substrate of the present invention. . Fig. 6(1) to Fig. 6(2) are schematic cross-sectional views showing the (E) step or the (d) step of the method of manufacturing the element substrate of the present invention. 7(a) to 7(b) are diagrams showing the second laminated body (unsintered element substrate) after the step (E) or after the step (d), which is an example of the embodiment of the method for producing the element substrate of the present invention. Plan and section view. [Description of main component symbols: 1 1] Substrate for light-emitting elements (component base 6: external connection terminal (external connection end plate, base paste layer for unsintered light-emitting element) plate, unsintered element substrate) 7 ...through conductor (penetrating conductor paste layer) ΙΑ, 1B...first laminate body 8...end surface 1C...second laminate body 10...light-emitting device 2...base body (base body green sheet 11...light-emitting element 3...frame 12...metal wire 3'...laminated portion 13...sealing layer 3a-3c...frame-volume layer green foil 21...main body Surface 3d... frame outermost layer of raw sheet 22... mounting part 4... cavity 23... back side of base 5... element connection terminal (element connection end 24... bottom surface of cavity) With a paste layer) 25... the side of the cavity
S 53 201242455 31...第1樹脂薄膜 rl...框體積層用生胚薄片3a之 32...支撐板 開口部之半徑 33...間隔件 r2...框體積層用生胚薄片3b之 34...樹脂袋 開口部之半徑 35...空氣 r3...框體積層用生胚薄片3c之 36…水 開口部之半徑 37…第2樹脂薄膜 xl...框體積層用生胚薄片3a之 α，β…角度 上面之未積層框體積層用 Ε...積層部3’之内壁之最上部的 生胚薄片3b之部份的寬度 位置 x2…框體積層用生胚薄片3b之 L...長度 上面之未積層框體積層用 tl...框體積層用生胚薄片3a之 生胚薄片3c之部份的寬度 厚度 t2...框體積層用生胚薄片3b之 厚度 t3…框體積層用生^薄片度 R1-R3…曲率半徑 · s 54S 53 201242455 31...first resin film rl...32 of the green sheet 3a for the frame volume layer...the radius 33 of the opening of the support plate...the spacer r2...the green layer of the frame volume layer 34 of the sheet 3b...the radius of the opening of the resin bag 35...air r3...the green sheet 3c of the frame volume layer 36...the radius of the water opening portion 37...the second resin film xl...frame The layer of the raw layer 3a of the green sheet 3a, the angle of the uncomplexed frame volume layer on the upper side of the layer 3a, the width position x2 of the portion of the uppermost green sheet 3b of the inner wall of the laminated portion 3' is used for the frame volume layer The length of the green sheet 3b is L...the length of the unstacked frame volume layer is tl...the volume of the frame layer is the thickness of the portion of the green sheet 3c of the green sheet 3a. The thickness of the embryo sheet 3b is t3...the volume of the frame volume layer is the radius of the surface R1-R3...the radius of curvature·s 54
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| JP (1) | JP5835237B2 (en) |
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| JP6253918B2 (en) * | 2013-08-06 | 2017-12-27 | 日機装株式会社 | Manufacturing method and manufacturing apparatus for ceramic plate with curved surface |
| JP6624626B1 (en) * | 2019-07-29 | 2019-12-25 | アサヒ・エンジニアリング株式会社 | Electronic component sintering device |
| CN114258183A (en) * | 2020-09-21 | 2022-03-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
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| JPH07193163A (en) * | 1993-12-27 | 1995-07-28 | Murata Mfg Co Ltd | Method for pressing multilayered block having cavity |
| JP2003289119A (en) * | 2002-03-28 | 2003-10-10 | Sanyo Electric Co Ltd | Method for manufacturing ceramics multilayer wiring board |
| JP4070208B2 (en) * | 2003-04-21 | 2008-04-02 | 京セラ株式会社 | Light emitting element storage package and light emitting device |
| JP4387160B2 (en) * | 2003-10-29 | 2009-12-16 | 株式会社住友金属エレクトロデバイス | Manufacturing method of light emitting element storage package |
| JP4484554B2 (en) * | 2004-03-23 | 2010-06-16 | 京セラ株式会社 | Lighting device |
| JP2006303351A (en) * | 2005-04-25 | 2006-11-02 | Sumitomo Metal Electronics Devices Inc | Package for storing light emitting element |
| JP4889267B2 (en) * | 2005-09-07 | 2012-03-07 | 共立エレックス株式会社 | Manufacturing method of light emitting diode package |
| JP4958509B2 (en) * | 2006-09-28 | 2012-06-20 | コーア株式会社 | Ceramic multilayer substrate with cavity and method for manufacturing the same |
| JP5224802B2 (en) * | 2007-09-29 | 2013-07-03 | 京セラ株式会社 | Light emitting element storage package, light emitting device, light emitting element storage package, and light emitting device manufacturing method |
| JP5422906B2 (en) * | 2008-04-09 | 2014-02-19 | 日亜化学工業株式会社 | Light emitting device |
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| JPWO2012108533A1 (en) | 2014-07-03 |
| JP5835237B2 (en) | 2015-12-24 |
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