TW201241453A - Burn-in board and burn-in system - Google Patents
Burn-in board and burn-in system Download PDFInfo
- Publication number
- TW201241453A TW201241453A TW100104946A TW100104946A TW201241453A TW 201241453 A TW201241453 A TW 201241453A TW 100104946 A TW100104946 A TW 100104946A TW 100104946 A TW100104946 A TW 100104946A TW 201241453 A TW201241453 A TW 201241453A
- Authority
- TW
- Taiwan
- Prior art keywords
- burn
- connector
- board
- edge
- burning
- Prior art date
Links
- 238000003780 insertion Methods 0.000 claims abstract description 114
- 230000037431 insertion Effects 0.000 claims abstract description 114
- 238000012360 testing method Methods 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 238000001354 calcination Methods 0.000 description 24
- 230000007246 mechanism Effects 0.000 description 19
- 230000008859 change Effects 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010266673A JP2012117881A (ja) | 2010-11-30 | 2010-11-30 | バーンインボード及びバーンインシステム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201241453A true TW201241453A (en) | 2012-10-16 |
Family
ID=46384624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100104946A TW201241453A (en) | 2010-11-30 | 2011-02-15 | Burn-in board and burn-in system |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2012117881A (https=) |
| SG (1) | SG181207A1 (https=) |
| TW (1) | TW201241453A (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI550287B (zh) * | 2015-10-30 | 2016-09-21 | Hon Tech Inc | Electronic components preheating unit and its application test classification equipment |
| TWI560789B (https=) * | 2014-09-03 | 2016-12-01 | ||
| TWI570419B (zh) * | 2015-07-31 | 2017-02-11 | 陽榮科技股份有限公司 | Ic升溫裝置及方法 |
| TWI749690B (zh) * | 2020-08-10 | 2021-12-11 | 京元電子股份有限公司 | 半導體元件預燒測試模組及其預燒測試裝置 |
| CN114078718A (zh) * | 2020-08-13 | 2022-02-22 | 京元电子股份有限公司 | 半导体元件预烧测试模块及其预烧测试装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6666713B2 (ja) * | 2015-12-25 | 2020-03-18 | 株式会社アドバンテスト | デバイス測定用治具 |
| KR102115378B1 (ko) * | 2019-05-31 | 2020-05-27 | (주)대성이앤티 | 카드형 엣지 커넥터 및 번인 보드 테스트 장치 |
| TWI890510B (zh) * | 2024-07-03 | 2025-07-11 | 閎康科技股份有限公司 | 測試設備及預燒裝置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0189486U (https=) * | 1987-12-04 | 1989-06-13 | ||
| JPH0299585U (https=) * | 1989-01-26 | 1990-08-08 | ||
| JPH09320684A (ja) * | 1996-05-30 | 1997-12-12 | Japan Aviation Electron Ind Ltd | 嵌合ガイド付きコネクタ |
| JP2000091002A (ja) * | 1998-09-16 | 2000-03-31 | Harness Syst Tech Res Ltd | プリント基板用コネクタ |
| JP3446643B2 (ja) * | 1998-12-28 | 2003-09-16 | 安藤電気株式会社 | バーンインボード及びバーンインテスト装置 |
| US6815966B1 (en) * | 2002-06-27 | 2004-11-09 | Aehr Test Systems | System for burn-in testing of electronic devices |
| JP2006164757A (ja) * | 2004-12-07 | 2006-06-22 | Jst Mfg Co Ltd | 複合コネクタ |
| JP4343138B2 (ja) * | 2005-05-02 | 2009-10-14 | 日本エンジニアリング株式会社 | バーンインボード及びバーンインシステム |
| JP4912961B2 (ja) * | 2007-06-06 | 2012-04-11 | 日本エンジニアリング株式会社 | エッジコネクタ及びバーンインシステム |
| JP2009300330A (ja) * | 2008-06-16 | 2009-12-24 | Nippon Eng Kk | バーンインボード、エッジコネクタ及びバーンインシステム |
-
2010
- 2010-11-30 JP JP2010266673A patent/JP2012117881A/ja active Pending
-
2011
- 2011-02-15 TW TW100104946A patent/TW201241453A/zh unknown
- 2011-02-15 SG SG2011010642A patent/SG181207A1/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI560789B (https=) * | 2014-09-03 | 2016-12-01 | ||
| TWI570419B (zh) * | 2015-07-31 | 2017-02-11 | 陽榮科技股份有限公司 | Ic升溫裝置及方法 |
| TWI550287B (zh) * | 2015-10-30 | 2016-09-21 | Hon Tech Inc | Electronic components preheating unit and its application test classification equipment |
| TWI749690B (zh) * | 2020-08-10 | 2021-12-11 | 京元電子股份有限公司 | 半導體元件預燒測試模組及其預燒測試裝置 |
| US11500012B2 (en) | 2020-08-10 | 2022-11-15 | King Yuan Electronics Co., Ltd. | Semiconductor component burn-in test module and burn-in test equipment |
| CN114078718A (zh) * | 2020-08-13 | 2022-02-22 | 京元电子股份有限公司 | 半导体元件预烧测试模块及其预烧测试装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG181207A1 (en) | 2012-06-28 |
| JP2012117881A (ja) | 2012-06-21 |
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