201240751 六、發明說明： 【發明所屬之技術領域】 尤指—種應 [_ι] 本發明係關於—種金屬粉末喷塗技術 用於金屬基板之噴塗方法。 【先前技術】201240751 VI. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a metal powder coating technique for spraying a metal substrate. [Prior Art]
[0003][0003]
按’科技日新月異，電子元件均以輕薄短小為開發 重點，隨著電子7L件之高密集度，散熱性是現階段需要 克服的重要課題，而通常在電子元件中均設有發光二極 體，由於發光二極體具有發光效率高、體積小、耗電量 少、使用壽命長、不易破損及色域豐富等優點，廣泛: 用在發光光源上’但卻存在有散熱性不佳之缺點，所以 現有之發光二極體均會設置有散熱板進行散熱。、 散熱板上通常錢覆有—層薄膜，藉以增加其 性，習知之健板金屬賴製作方法如我國專利公^ 第麵砸，其係為-種「微量粉狀金屬薄媒之^ 佈製程」’係將粉狀金屬與-溶劑混合成金屬粉混合液 ’金屬粉混合液攪拌均句後填充至工作區，蒸發金屬混 合液之液體後留下沉積於内底面之金屬沉積膜。 _ Μ ’在此習知技術中，金屬粉混合㈣—種濕式 塗佈法，不但較為費時費力且不易控制塗佈之均勻度， 也相對耗費生產原料成本亦較不環保。 W] 有鑑於此，本發明係針對上述之問題，提出一種金 屬粉末噴塗方法，以克服習知之缺點。 【發明内容】 100111961 表單編號Α0101 第3頁/共12頁 1002019981-0 201240751 [0006] [0007] [0008] [0009] [0010] [0011] [0012] 100111961 本發明之目的在於提供一種「金屬粉末喷塗方法」 ’係將作業過程藉由電腦控制，即可準確控制喷塗膜厚 及喷塗速度，使其更加便捷。 本發明所運用的目的及解決其技術問題是採用以下 的技術方案來實現的。依據本發明提出一種金屬粉末喷 塗方法’提供一清潔後之金屬基板，並使金屬基板表面 保持乾燥、清潔’再將金屬粉末透過高壓空氣喷灑在金 屬基板一表面’使金屬基板形成一金屬粉末薄膜層，且 ’金屬基板可與一接地裝置接觸使金屬基板之表面帶有 負電荷’更可在噴塗設備設有一靜電產生器，使欲喷灑 出之金屬粉末經過靜電產生器帶有正電荷，運用正負相 吸之原理’帶負電荷之金屬基板吸引帶正電荷之金屬粉 末’使金屬粉末薄膜層更穩固吸附在金屬基板表面，接 續以60(M〇〇〇t高溫燒結將金屬基板與金屬粉末薄膜層 進行燒結10~20分鐘。 又’噴塗設備係採用微電腦控制系統，用以控制金 屬粉末的噴塗量與噴塗速度，達到自動化控制. 綜以上所述，本發明具有以下的優點： 1·本發明噴塗之塗料為金屬粉末，金屬粉末屬固體原 料，在作業過程中可回收循環再利用，達到環保效益。 2. 本發明之金屬粉末屬於乾性喷塗，故不須使用溶劑 ，無大氣污染及廢水、汙水問題，有效減低環境污染。 3. 本發明採用電腦控制定量噴塗系統，來控制金屬粉 末的喷塗量與噴塗速度，可準確控制噴塗膜厚及噴塗速 表單編號A0101 第4頁/共12頁 1002019981-0 201240751 度’使其更加便捷。 [0013] [0014] [0015] ❹ [0016] Q [0017] 4·本發明可藉由噴塗與燒結將金屬基板表面凹凸不平 處覆蓋’提升金屬基板表面平整度利於後續加工製程。 【實施方式】 以下藉由具體實施例配合所附的圖式詳加說明，當 更容易瞭解補作之目的、技術内容、特點及其所達成 之功效。 請參閱第1圖所*，本發明金屬粉末喷塗方法，包含 以下步驟： 首先，步驟S10，提供一金屬基板10並加以清潔使金 屬基板10表面並保持乾燥與清潔：金屬基板1〇進一步為 四導熱銅材質之均熱板，在喷塗之前，必須除去工件上 的油脂及雜物，故以阻抗值極大之純水或超純水清洗金 屬基板10，進而將附帶水分去除，使金屬基板1〇表面保 持乾燥、清潔； 接續，步驟S20，將金屬粉末20藉由高壓空氣喷灑至 金屬基板10—表面，使金屬基板1〇形成一金屬粉末薄膜 層120 :步驟S20係將金屬粉末20藉由一高壓空氣喷灑而 非先前技術中之金屬粉末仍需額外透過溶劑混合成金屬 溶液後再塗佈於金屬基板1〇上；相較於先前技術本發明 不僅能將金屬粉末回收再利用，更省略了溶劑的使用及 其造成的環境汙染》高壓空氣進一步係可為一喷塗設備 30(圖中未示）’喷塗設備30具有一喷搶31，藉由喷塗設 備30之喷搶31將金屬粉末20均勻喷灑在金屬基板1〇之表 100111961 表單編號A0101 第5頁/共12頁 1002019981-0 201240751 面，使金屬基板10 —表面形成一金屬粉末薄膜層120，而 金屬粉末20為銅粉，金屬粉末20係採用顆粒大小為 20~30#ηι的極細小微量粉狀銅顆粒，故在喷塗過程中金 屬粉末20不會卡滯於喷搶31 口中，得以順利進行乾性喷 塗而不阻塞； [0018] [0019] [0020] 步驟S30，對金屬基板10與金屬粉末薄膜層120進行 燒結：步驟S30係以600〜1 000°C高溫將金屬基板10與金 屬粉末薄膜層120進行燒結10〜20分鐘，使金屬粉末薄膜 層120成型附著於金屬基板10之一表面； 最後，步驟S40，經由S30步驟與金屬粉末薄膜層 120燒結後之金屬基板10表面即形成一毛細結構。 接續，請再參閱第2圖所示，為本發明之操作示意圖 ，係以高壓空氣連接至喷塗設備30，藉由喷塗設備30將 金屬粉末20均勻喷麗至金屬基板10—表面，使金屬基板 10形成一金屬粉末薄膜層120 ;又，金屬基板10可與一接 地裝置（圖中未示）接觸使金屬基板10帶有負電荷，而喷 塗設備30可設有一靜電產生器（圖中未示），使欲喷灑出 之金屬粉末20經過靜電產生器而帶有正電荷，透過正負 相吸之原理，故帶負電荷之金屬基板10吸引帶正電荷之 金屬粉末20，確保金屬粉末薄膜層120更穩固附著在金屬 基板10表面，令金屬薄粉末膜層120不易在運作過程中隨 作動震盪而至金屬基板10掉落或滾動，最後將金屬基板 10與金屬粉末薄膜層120進行燒結，使金屬粉末薄膜層 120成型於金屬基板10—表面，進而令金屬基板10形成 毛細結構。 100111961 表單編號A0101 第6頁/共12頁 1002019981-0 201240751 [0021] 再者，喷塗設備30係透過微電腦控制噴塗，係採用According to the ever-changing technology, electronic components are focused on lightness and thinness. With the high density of electronic 7L parts, heat dissipation is an important issue that needs to be overcome at this stage. Usually, LEDs are provided with LEDs. Because the light-emitting diode has the advantages of high luminous efficiency, small volume, low power consumption, long service life, not easy to break, and rich color gamut, it is widely used in the illuminating light source, but it has the disadvantage of poor heat dissipation. The existing light-emitting diodes are provided with a heat dissipation plate for heat dissipation. The heat sink is usually covered with a layer of film to increase its properties. The traditional method of making the metal plate is as follows: the Chinese patent is the first one, which is a kind of "micro-powder metal thin media ^ cloth process 'The powder metal and the solvent are mixed into a metal powder mixture'. The metal powder mixture is stirred and filled into the working area, and the liquid of the metal mixture is evaporated to leave a metal deposition film deposited on the inner bottom surface. _ Μ ‘In this prior art, the metal powder mixing (4)—the wet coating method is not only time-consuming and laborious, but also difficult to control the uniformity of coating, and is also relatively environmentally friendly. In view of the above, the present invention is directed to the above problems, and proposes a metal powder coating method to overcome the disadvantages of the prior art. SUMMARY OF THE INVENTION 100111961 Form No. 101 0101 Page 3 / Total 12 Page 1002019981-0 201240751 [0007] [0008] [0009] [0011] [0012] 100111961 The object of the present invention is to provide a "metal The powder coating method "" controls the operation process by computer to accurately control the thickness of the spray film and the spray speed, making it more convenient. The object of the present invention and the technical problems thereof are solved by the following technical solutions. According to the present invention, a metal powder spraying method is provided to provide a cleaned metal substrate, and the surface of the metal substrate is kept dry and cleaned, and then the metal powder is sprayed on the surface of the metal substrate through high-pressure air to form a metal substrate. a powder film layer, and the 'metal substrate can be in contact with a grounding device to make the surface of the metal substrate have a negative charge'. Further, an electrostatic generator can be disposed in the spraying device, so that the metal powder to be sprayed passes through the static electricity generator with positive Charge, using the principle of positive and negative phase absorption 'negatively charged metal substrate to attract positively charged metal powder' to make the metal powder film layer more firmly adsorbed on the surface of the metal substrate, followed by 60 (M〇〇〇t high temperature sintering of the metal substrate The metal powder film layer is sintered for 10 to 20 minutes. The 'spraying equipment system uses a microcomputer control system to control the spraying amount and spraying speed of the metal powder to achieve automatic control. In summary, the present invention has the following advantages: 1. The coating of the invention is a metal powder, and the metal powder is a solid raw material during the operation process. It can be recycled and reused to achieve environmental benefits. 2. The metal powder of the invention belongs to dry spraying, so it does not need to use solvent, no air pollution, waste water and sewage problem, and effectively reduces environmental pollution. 3. The invention adopts computer control Quantitative spray system to control the amount of metal powder sprayed and spray speed, can accurately control the spray film thickness and spray speed form number A0101 Page 4 / 12 pages 1002019981-0 201240751 degrees 'to make it more convenient. [0013] [ [0015] [0016] Q [0017] 4. The present invention can cover the surface of the metal substrate by spraying and sintering to improve the surface flatness of the metal substrate to facilitate subsequent processing. [Embodiment] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT With reference to the accompanying drawings, it is easier to understand the purpose of the supplement, the technical content, the features, and the effects achieved. Referring to Figure 1, the metal powder coating method of the present invention includes the following Steps: First, in step S10, a metal substrate 10 is provided and cleaned to keep the surface of the metal substrate 10 dry and clean: the metal substrate 1 further is four In the hot copper plate, the grease and impurities on the workpiece must be removed before spraying. Therefore, the metal substrate 10 is cleaned with pure water or ultrapure water having a large impedance value, and the moisture is removed to make the metal substrate 1 The surface of the crucible is kept dry and clean; and then, in step S20, the metal powder 20 is sprayed onto the surface of the metal substrate 10 by high-pressure air to form a metal powder film layer 120. Step S20 is to borrow the metal powder 20. Spraying from a high-pressure air instead of the metal powder of the prior art still needs to be additionally mixed with a solvent to form a metal solution, and then coated on the metal substrate 1; compared with the prior art, the invention can not only recycle the metal powder, The use of the solvent and the environmental pollution caused by it are omitted. The high-pressure air can further be a spraying device 30 (not shown). The spraying device 30 has a spray 31, which is sprayed by the spraying device 30. 31, the metal powder 20 is evenly sprayed on the metal substrate 1 Table 100111961 Form No. A0101 Page 5 / Total 12 pages 1002019981-0 201240751 Surface, the metal substrate 10 - surface forms a metal powder The film layer 120, and the metal powder 20 is copper powder, and the metal powder 20 is a very fine powdery copper particle having a particle size of 20~30#ηι, so the metal powder 20 does not stick to the spray during the spraying process. In the 31 port, the dry spraying is smoothly performed without blocking; [0020] [0020] Step S30, the metal substrate 10 and the metal powder film layer 120 are sintered: step S30 is performed at a temperature of 600 to 1 000 ° C. The metal substrate 10 and the metal powder film layer 120 are sintered for 10 to 20 minutes to form and adhere the metal powder film layer 120 to one surface of the metal substrate 10; finally, in step S40, the metal sintered with the metal powder film layer 120 via the S30 step. The surface of the substrate 10 forms a capillary structure. Next, please refer to FIG. 2 again, which is a schematic diagram of the operation of the present invention. The high-pressure air is connected to the spraying device 30, and the metal powder 20 is evenly sprayed onto the surface of the metal substrate 10 by the spraying device 30. The metal substrate 10 forms a metal powder film layer 120; further, the metal substrate 10 can be in contact with a grounding device (not shown) to make the metal substrate 10 negatively charged, and the spraying device 30 can be provided with an electrostatic generator (Fig. The metal powder 20 to be sprayed is subjected to a positive charge by the electrostatic generator, and the negatively charged metal substrate 10 attracts the positively charged metal powder 20 to ensure the metal. The powder film layer 120 is more firmly adhered to the surface of the metal substrate 10, so that the metal thin powder film layer 120 is not easily oscillated during operation to the metal substrate 10 to fall or roll, and finally the metal substrate 10 and the metal powder film layer 120 are subjected to Sintering causes the metal powder film layer 120 to be molded on the surface of the metal substrate 10, thereby forming the metal substrate 10 into a capillary structure. 100111961 Form No. A0101 Page 6 of 12 1002019981-0 201240751 [0021] Furthermore, the spraying device 30 is controlled by a microcomputer to control spraying.
I 可編程序控制器Programmable Logic Controller ( PLC)全自動控制，操作者可依需求自行設定金屬粉末20 的喷塗量與喷塗速度，用以對應所需膜厚之變化的各種 需求性，具有精確控制膜厚之效果。 [0022] 綜上所述，僅為本發明之較佳實施例而已，在不離 ' 本發明精神之範圍，熟習此項技藝者憑之而作之各種變 化、修飾與應用，皆應涵蓋於本發明中，因此本發明的 保護範圍當視後附的申請專利範圍所界定者為準。 〇 【圖式簡單說明】 [0023] 第1圖：係本發明步驟之流程圖。 [0024] 第2圖：係本發明之操作示意圖。 【主要元件符號說明】 [0025] S10.清潔金屬基板並保持乾燥與清潔 [0026] S20.將金屬粉末藉由高壓空氣喷灑至金屬基板一表面， 使金屬基板形成金屬粉末薄膜層 ❹ [0027] S30.對金屬基板與金屬粉末薄膜層進行燒結 [0028] S40.金屬基板表面形成毛細結構 [0029] 10.金屬基板 [0030] 120.金屬粉末薄膜層 ， [0031] 20.金屬粉末 [0032] 30.喷塗設備 100111961 表單編號A0101 第7頁/共12頁 1002019981-0 201240751 [0033] 31.喷搶 100111961 表單編號A0101 第8頁/共12頁 1002019981-0I Programmable Logic Controller (PLC) is fully automatic control, the operator can set the spraying amount and spraying speed of metal powder 20 according to the requirements, to meet the various needs of the required film thickness change, Precise control of film thickness. In the above, it is only the preferred embodiments of the present invention, and various changes, modifications, and applications made by those skilled in the art should be included in the scope of the present invention. In the invention, the scope of the invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0023] Fig. 1 is a flow chart showing the steps of the present invention. 2 is a schematic view showing the operation of the present invention. [Description of main component symbols] [0025] S10. Cleaning the metal substrate and keeping it dry and clean [0026] S20. Spraying metal powder onto a surface of the metal substrate by high-pressure air to form a metal powder film layer on the metal substrate [0027] S30. Sintering the metal substrate and the metal powder film layer [0028] S40. Forming a capillary structure on the surface of the metal substrate [0029] 10. Metal substrate [0030] 120. Metal powder film layer, [0031] 20. Metal powder [0032] 30. Spraying equipment 100111961 Form No. A0101 Page 7 / Total 12 pages 1002019981-0 201240751 [0033] 31. Spraying 100111961 Form No. A0101 Page 8 / Total 12 Page 1002019981-0