201029753 六、發明說明：· 【發明所屬之技術領域】 本發明係有關一種薄膜塗佈喷塗技術，特別是關於一種用於散熱板上 之一種金屬薄膜塗佈設備及塗佈方法。 【先前技術】 隨著科技曰新月異，電子元件均以輕薄短小為開發重點，隨著電子元 件之高密集度’散熱性是現階段需要克服的重要課題，而通常在電子元件 中均設有發光二極艘，由於發光二極體具有發光效率高、體積小、耗電量 • 少、使用壽命長、不易破損及色域豐富等優點，廣泛使用在發光光源上， 但卻存在有散熱性不佳之缺點，所以現有之發光二極體均會設置有散熱板 進行散熱。 散熱板上通常會被覆有一層薄膜，藉以增加其散熱性，習知之散熱板 金屬薄膜製作方法如我國專利公告號第1247048號，其係為一種「微量粉 狀金屬薄膜之均勻塗佈製程」，係將粉狀金屬混合成金屬粉混合液金屬粉 混合賴拌均勻後填充至工作區，蒸發金屬混合液之紐後留下沉積於内 ❹底面之金屬沉積膜，使金屬沉積膜之厚度達到〇1醒以下以簡易的步称 達到金屬塗層之效果。然而，在習知技術中，以人r塗佈方法其薄膜之膜 厚不易控制’容易塗佈不均，且該金驗混合液為—種濕式塗佈法，之後 再進行燒結’不但較為費時費力，也相對耗費生產原料成本。 有鑑於此’本發明係針對上述之問題，提出一種金屬薄膜塗佈設備及 塗佈方法，以克服習知之缺點。 【發明内容】 本發明之主要目的，係在提供—種金屬薄膜塗佈設備及塗佈方法，其 3 201029753 係可提供帶有正電荷之金屬粉末，並使一金屬基材表面帶負電荷，並利用 靜電力吸附效應’使金屬粉末被覆於金屬基材上並形成薄膜，相較於傳統 之人工塗佈方式，不但較為快速便捷，也更易控制膜厚。 為達上述之目的’本發明為一種金屬薄膜塗佈設備，用於散熱板金屬 基材上之薄膜塗佈作業’金屬薄膜塗佈設備包括一輸送裝置，可輸送金屬 基材；一塗佈裝置’可提供金屬粉末並使金屬粉末帶正電荷，並將金屬粉 末塗佈於金屬基材上形成一薄膜層；以及一接地裝置，位於塗佈裝置之塗 φ 佈範圍内’並與金屬基材連結，可導引金屬基材之正電荷至地表，使金屬 基材呈現帶負電荷’整體塗佈環境係保持乾燥；當金屬基材藉由輸送裝置 輸送並通過塗佈裝置’塗佈裝置將帶正電荷之金屬粉末塗佈於帶負電荷之 金屬基材上，由於靜電力吸附效應，使金屬粉末被覆金屬基材上，本發明 更具有一回收裝置，位於塗佈裝置之下方，可承接散逸之金屬粉末，並加 以回收利用。本發明並揭露一種金屬薄膜塗佈方法，包括以下步驟：首先 清潔金屬基材，並使金屬基材表面保持乾燥；接著利用輸送裝置將金屬基 φ材輸送至一塗佈裝置之塗佈範圍下；使金屬基材與一接地裝置接觸並使金 屬基材表面帶負電荷；利用塗佈裝置將帶正電之金屬粉末塗佈於帶負電之 該金屬基材表面，形成40-80//m之薄膜；然後以及以60(TC-l〇〇〇°c對該金 屬基材之薄膜層進行燒結動作，使薄膜層附著。 底下藉由具體實施例配合所附的圖式詳加說明，當更容易瞭解本發明 之目的、技術内容、特點及其所達成之功效。 【實施方式】 第一圖為本發明之金屬薄膜塗佈設備結構示意圖，如圖所示，一金屬 201029753 薄膜塗佈設備10，主要用於散熱板金屬基材12之薄膜塗佈作業，金屬基材 12係為銅材質’當金屬基材12於塗佈前須經過一表面清潔步驟，表面清潔 步驟係使用純水等級或超純水等級’使塗佈環境中之粒子及雜質降到最 低，並將整體塗佈環境保持乾燥。本發明之金屬薄膜塗佈設備1〇包括一輸 送裝置14，可輸送金屬基材12 ’輸送裝置14係為輸送帶；一塗佈裝置16， 可提供金屬粉末18 ’本實施例中金屬粉末18係為銅粉，塗佈裝置16之出 口端可使金屬粉末18帶正電荷’並將金屬粉末18塗佈於金屬基材12上， φ 形成一薄膜層·，一接地裝置20位於塗佈裝置16之塗佈範圍内，當輸送裝 置14將金屬基材12輸送至喷塗範圍下，接地裝置2〇會與金屬基材丨2連 結接觸，並導引金屬基材12之正電荷至地表，使金屬基材12呈現帶負電 荷，金屬基材12藉由輸送裝置14輸送並通過塗佈裝置16，塗佈裝置π將 帶正電荷之金屬粉末塗佈於帶負電荷之金屬基材12上，由於靜電力吸附效 應，會使金屬粉末18被覆於金屬基材12上。當塗佈裝置之塗佈量為定量， 薄膜之厚度與輸送裝置14的輸送速率有W，當輸送速率越快，形成之薄膜 ©越薄’反之則薄膜越厚，通常薄膜層厚度為4〇_8〇仰，當薄膜層形成後， 以6〇〇〇1〇〇〇。(；對金屬基材12之薄膜層進行燒結動作，使金屬基材12上 之薄膜層附著牢固；本發明更具有一回收裝置22，回收裝置22位於塗佈裝 置16之下方，可承接塗佈製程中散逸之金屬粉末18，並加以回收循環及利 用。 第二圖為本發明之金屬薄膜塗佈方法，請同時參照第—圖，如圖所示， 包括以下步驟：首先進行步驟sn，清潔金屬基材12,並使金屬基材12表 保持乾燥，金屬基材12係為銅材質，由於本發明為湘靜電力附著之乾 5 .201029753 式塗佈，須保持塗佈環境及金屬基材12表面之乾燥，同時並以阻抗值 (Resistivity)極大之純水或超純水清洗金屬基材12;接著進行步驟S12, 利用輸送裝置14將金屬基材12輸送至塗佈裝置16之塗佈範圍下，輸送裝 置14為輸送帶；接著進行步驟S13 ’輸送裝置14以等速率輸送金屬基材 12 ’使金屬基材12與接地裝置20接觸’並使金屬基材12之正電荷導引至 地表，使金屬基材12表面帶負電荷；接著進行步驟，利用塗佈裝置π 將帶正電之金屬粉末18塗佈於帶負電之金屬基材12表面，由於靜電力吸 φ 附效應’金屬粉末18被覆於金屬基材12上，形成40-80//in之薄膜層；最 後進行步驟S15，以及以60(TC-100(rc之高溫對金屬基材12之薄膜層進行 燒結動作，本發明更具有一回收裝置22，位於塗佈裝置16之下方，可承接 散逸之金屬粉末18，並加以回收。 本發明之主要提供一種金屬薄膜塗佈設備及塗佈方法，其係具有塗佈 裝置’塗佈裝置可提供帶正電荷之金屬粉末並利用靜電吸附力，使其附著 於帶負電荷之金>1基材表面’金屬基材由於與—接地裝置接觸，可使該金 ❹屬基材上之正電荷導引至地表，並使金屬基材表面帶負電，利用靜電吸附 力，使金屬粉末附著於金屬基材表面上。 惟以上所述者，僅林個之較佳實關而已，其目的錢熟習該項 技藝者能夠瞭解本發明之内容而據以實施，並非用來限定本發明實施之範 圍；故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之 均等變化與侧i ’均應涵蓋在本發明之巾請專利範圍内。 【圖式簡單說明】 第一圖為本發明之金屬薄膜塗佈設備結構示意圖。 6 201029753 第二圖為本發明之金屬薄膜塗佈流程圖。 【主要元件符號說明】 ίο金屬薄膜塗佈設備 12金屬基材 14輸送裝置 16塗佈裝置 18金屬粉末 20接地裝置 22回收裝置201029753 VI. Description of the Invention: · Technical Field of the Invention The present invention relates to a film coating spray technique, and more particularly to a metal film coating apparatus and a coating method for a heat dissipation plate. [Prior Art] With the rapid development of technology, electronic components are focused on lightness and thinness. With the high density of electronic components, heat dissipation is an important issue that needs to be overcome at this stage, and is usually set in electronic components. There are light-emitting diodes. Because the light-emitting diodes have the advantages of high luminous efficiency, small size, low power consumption, long service life, easy to break, and rich color gamut, they are widely used in illuminating light sources, but there are heat dissipation. The shortcomings of poor performance, so the existing light-emitting diodes will be equipped with a heat sink for heat dissipation. The heat dissipation plate is usually covered with a film to increase its heat dissipation. The conventional heat dissipation plate metal film production method is, for example, China Patent Publication No. 1247048, which is a "uniform coating process for a small amount of powder metal film". The powder metal is mixed into a metal powder mixture, and the metal powder is mixed and mixed, and then filled into the working area. After evaporating the metal mixture, the metal deposition film deposited on the bottom surface of the inner crucible is left, so that the thickness of the metal deposition film reaches 〇. 1 wake up below to achieve the effect of the metal coating in a simple step. However, in the prior art, the film thickness of the film by the human r coating method is not easy to control 'easy coating unevenness, and the gold test mixture is a wet coating method, and then sintering is performed. It takes time and effort, and it also costs the production raw materials. In view of the above, the present invention has been made in view of the above problems, and a metal film coating apparatus and a coating method are proposed to overcome the disadvantages of the prior art. SUMMARY OF THE INVENTION The main object of the present invention is to provide a metal thin film coating apparatus and a coating method thereof, wherein 3 201029753 can provide a positively charged metal powder and make a metal substrate surface negatively charged. And using the electrostatic force adsorption effect to make the metal powder coated on the metal substrate and form a film, compared with the traditional manual coating method, not only faster and more convenient, but also easier to control the film thickness. For the purpose of the above, the present invention is a metal film coating apparatus for film coating operation on a heat sink metal substrate. The metal film coating apparatus includes a conveying device capable of conveying a metal substrate; a coating device 'Metal powder can be supplied and the metal powder is positively charged, and the metal powder is coated on the metal substrate to form a film layer; and a grounding device is located within the coating material of the coating device' and the metal substrate The connection can guide the positive charge of the metal substrate to the surface, so that the metal substrate exhibits a negative charge. The overall coating environment remains dry; when the metal substrate is transported by the transport device and passed through the coating device, the coating device will The positively charged metal powder is coated on the negatively charged metal substrate, and the metal powder is coated on the metal substrate due to the electrostatic force adsorption effect. The present invention further has a recovery device located below the coating device to receive Dissipated metal powder and recycled. The invention also discloses a metal film coating method, comprising the steps of: first cleaning the metal substrate and keeping the surface of the metal substrate dry; and then conveying the metal-based material to the coating range of a coating device by using a conveying device; The metal substrate is brought into contact with a grounding device and the surface of the metal substrate is negatively charged; the positively charged metal powder is coated on the surface of the negatively charged metal substrate by a coating device to form 40-80/m a film; then, and 60 (TC-l〇〇〇°c) the film layer of the metal substrate is sintered to adhere the film layer. The following is a detailed description of the specific embodiment with the accompanying drawings. It is easier to understand the object, technical content, characteristics and the effect achieved by the present invention. [Embodiment] The first figure is a schematic structural view of a metal film coating device of the present invention, as shown in the figure, a metal 201029753 film coating device 10, mainly used for the film coating operation of the heat sink metal substrate 12, the metal substrate 12 is made of copper material 'When the metal substrate 12 is subjected to a surface cleaning step before coating, the surface cleaning step The pure water grade or ultrapure water grade ' is used to minimize the particles and impurities in the coating environment, and the overall coating environment is kept dry. The metal thin film coating apparatus 1 of the present invention includes a conveying device 14 for conveying The metal substrate 12' transport device 14 is a conveyor belt; a coating device 16 can provide metal powder 18'. In this embodiment, the metal powder 18 is copper powder, and the outlet end of the coating device 16 can be used to carry the metal powder 18 The positive charge 'and the metal powder 18 is coated on the metal substrate 12, φ forms a thin film layer ·, a grounding device 20 is located within the coating range of the coating device 16, and when the conveying device 14 transports the metal substrate 12 to In the spraying range, the grounding device 2〇 is in contact with the metal substrate 丨2, and guides the positive charge of the metal substrate 12 to the surface, so that the metal substrate 12 exhibits a negative charge, and the metal substrate 12 is transported by the conveying device. 14 is transported and passed through a coating device 16, which applies a positively charged metal powder to the negatively charged metal substrate 12, and the metal powder 18 is coated on the metal substrate 12 due to the electrostatic force adsorption effect. Upper. When the coating device The coating amount is quantitative, and the thickness of the film and the conveying rate of the conveying device 14 are W. When the conveying rate is faster, the thinner the film is formed, the thinner the film is, the thicker the film is, and the thickness of the film layer is usually 4 〇 8 angstroms. After the film layer is formed, it is 6 〇〇〇 1 〇〇〇. (; the film layer of the metal substrate 12 is sintered to make the film layer on the metal substrate 12 adhere firmly; the invention further has a recovery device 22 The recovery device 22 is located below the coating device 16, and can receive the metal powder 18 which is dissipated in the coating process, and is recycled and utilized. The second figure is the metal film coating method of the present invention, please refer to the same figure. As shown in the figure, the method includes the following steps: first, step Sn is performed to clean the metal substrate 12, and the metal substrate 12 is kept dry. The metal substrate 12 is made of copper, and the present invention is dried by the electrostatic force of the present invention. 5 .201029753 coating, the coating environment and the surface of the metal substrate 12 should be kept dry, and the metal substrate 12 is cleaned with pure water or ultrapure water with a maximum resistance value; then step S12 is used to transport Device 14 will gold The substrate 12 is conveyed to the coating range of the coating device 16, and the conveying device 14 is a conveyor belt; then the step S13 is performed. The conveying device 14 conveys the metal substrate 12' at an equal rate to bring the metal substrate 12 into contact with the grounding device 20. And the positive charge of the metal substrate 12 is guided to the surface to make the surface of the metal substrate 12 negatively charged; then, the step of coating the positively charged metal powder 18 on the negatively charged metal substrate by the coating device π 12 surface, due to electrostatic force absorption φ attached effect 'metal powder 18 is coated on the metal substrate 12 to form a 40-80 / / in thin film layer; finally step S15, and 60 (TC-100 (rc high temperature pair The film layer of the metal substrate 12 is subjected to a sintering operation. The present invention further has a recovery device 22 located below the coating device 16 for receiving and dissipating the dissipated metal powder 18. The present invention mainly provides a metal thin film coating apparatus and a coating method thereof, which have a coating device 'coating device which can supply a positively charged metal powder and attach it to a negatively charged gold by electrostatic adsorption force. ; 1 substrate surface 'metal substrate due to contact with the grounding device, the positive charge on the metal substrate can be guided to the surface, and the surface of the metal substrate is negatively charged, using the electrostatic adsorption force to make the metal powder Attached to the surface of the metal substrate. However, the above is only a preferred embodiment of the present invention, and the person skilled in the art can understand the contents of the present invention and implement it, and is not intended to limit the scope of the practice of the present invention; The changes in shape, configuration, characteristics and spirit of the scope of the patent application are to be construed as being within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of the structure of a metal thin film coating apparatus of the present invention. 6 201029753 The second figure is a flow chart of the coating of the metal film of the present invention. [Description of main component symbols] ίο Metal film coating equipment 12 Metal substrate 14 Conveying device 16 Coating device 18 Metal powder 20 Grounding device 22 Recycling device