CN101831650A - Metal copper powder film coating equipment and coating method - Google Patents
Metal copper powder film coating equipment and coating method Download PDFInfo
- Publication number
- CN101831650A CN101831650A CN200910128419A CN200910128419A CN101831650A CN 101831650 A CN101831650 A CN 101831650A CN 200910128419 A CN200910128419 A CN 200910128419A CN 200910128419 A CN200910128419 A CN 200910128419A CN 101831650 A CN101831650 A CN 101831650A
- Authority
- CN
- China
- Prior art keywords
- copper powder
- metal base
- coating
- metal
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses metal copper powder film coating equipment and a coating method. The metal copper powder film coating equipment comprises a transporter, a coating device and an earthing device, wherein the coating device can provide metal copper powder and causes the metal copper powder to have positive charges, and the earthing device is connected with metal base material and guides the positive charge of the metal base material to the earth surface, so that the metal base material is charged negatively. When the metal base material is transported by the transporter and passes through the coating device, the coating device coats metal powder with the positive charges on the metal base material with negative charges; and because of the electrostatic force adsorption effect, metal copper power is coated on the metal base material. Compared with the manual coating mode, the invention is quick and convenient and is easy to control the thickness of the film.
Description
Technical field
The present invention relates to a kind of film coated spraying technology, particularly a kind of metal copper powder film coating equipment and coating process that is used on the heating panel.
Background technology
Along with science and technology is maked rapid progress, electronic component all is developing focus with compact, highly dense intensity along with electronic component, thermal diffusivity is the important topic that need overcome present stage, and in electronic component, be equipped with photodiode usually, because advantages such as photodiode has the luminous efficiency height, volume is little, current consumption is few, long service life, cracky and colour gamut be not abundant, be widely used on the illuminating source, but have the not good shortcoming of thermal diffusivity, dispel the heat so existing photodiode all can be provided with heating panel.
Usually can be coated with thin film on the heating panel; so as to increasing its thermal diffusivity; existing heating panel metallic film making method such as Taiwan patent announcement number I247048 number; it is a kind of even coating process of micro-granulated metal film; be that granulated metal is mixed into the metal powder mixed solution; after stirring, the metal powder mixed solution is filled to workspace; stay the metal deposition film that is deposited on inner bottom surface behind the liquid of evaporated metal mixed solution; the thickness of metal deposition film is reached below the 0.1mm, reach the effect of metallic coating with easy step.Yet wayward with the thickness of artificial its film of coating process in the prior art, crawling, and this metal powder mixed solution easily is a kind of wet type coating method, carries out sintering afterwards again, not only comparatively wastes time and energy, and also expends the raw materials for production cost relatively.
In view of this, the present invention is directed to above-mentioned problem, propose a kind of metal copper powder film coating equipment and coating process, to overcome the shortcoming of prior art.
Summary of the invention
Main purpose of the present invention, be to provide a kind of metal copper powder film coating equipment and coating process, it can provide the copper powder that has positive charge powder, and make metallic substrate surface electronegative, and utilize the electrostatic force adsorption effect, make the copper powder powder be coated on the metal base and form film, compared to traditional artificial coating method, rapid and convenient comparatively not only, thickness also more easy to control.
In order to achieve the above object, the invention provides a kind of metal copper powder film coating equipment, be used for the film coated operation on the heating panel metal base, metal copper powder film coating equipment comprises an e Foerderanlage, but the transferring metal base material; One apparatus for coating can provide the copper powder powder and make copper powder powder belt positive charge, and with the powder coated thin film layer that on metal base, forms of copper powder; And a grounding device, being positioned at the coating scope of apparatus for coating, and linking with metal base, the positive charge that can guide metal base is to the face of land, and it is electronegative that metal base is presented, and whole coating environment keeps dry; When metal base is carried and during by apparatus for coating, apparatus for coating is powder coated on electronegative metal base with positively charged copper powder, owing to the electrostatic force adsorption effect, makes on the copper powder powder coating metal base by e Foerderanlage.The present invention also has a retrieving arrangement, is positioned at the below of apparatus for coating, can accept the copper powder powder of dissipation, and be recycled.
The present invention also provides a kind of metal copper powder film coating process, may further comprise the steps: clean metal base material at first, and metallic substrate surface is kept dry; Then utilize e Foerderanlage metal base to be delivered under the coating scope of apparatus for coating; Metal base is contacted with a grounding device and make metallic substrate surface electronegative; Utilize apparatus for coating that the copper powder of positively charged is powder coated in electronegative this metallic substrate surface, form the film of 40-80 μ m; Carry out sintering operation with 600 ℃ of-1000 ℃ of thin film layers then, make the thin film layer adhere firmly this metal base.
Description of drawings
Fig. 1 is a metal copper powder film coating equipment structural representation of the present invention;
Fig. 2 is metal copper powder film coating flow figure of the present invention.
Description of reference numerals: 10-metal copper powder film coating equipment; The 12-metal base; The 14-e Foerderanlage; The 16-apparatus for coating; 18-copper powder powder; The 20-grounding device; The 22-retrieving arrangement.
Embodiment
Below in conjunction with accompanying drawing, be described in more detail with other technical characterictic and advantage the present invention is above-mentioned.
Fig. 1 is a metal copper powder film coating equipment structural representation of the present invention, as shown in the figure, one metal copper powder film coating equipment 10, be mainly used in the film coated operation of heating panel metal base 12, metal base 12 is a copper material, and metal base 12 needs before coating through surface cleaning, and surface cleaning uses pure water grade or ultrapure water grade, make particle and the impurity of coating in the environment drop to minimumly, and integral body is coated with environment keeps dry.Metal copper powder film coating equipment 10 of the present invention comprises an e Foerderanlage 14, but transferring metal base material 12, and e Foerderanlage 14 is a conveying belt; One apparatus for coating 16, apparatus for coating 16 can be selected a coating machine for use, coating machine has spout, coating machine can make by the metal-powder of spout positively charged or negative charge (adhere to get final product according to the principle that there is a natural attraction between the sexes), apparatus for coating 16 can provide copper powder powder 18 in the present embodiment, and make by the copper powder powder 18 of apparatus for coating 16 exit end positively chargedly, and and copper powder powder 18 coated on the metal base 12, form a thin film layer; One grounding device 20 is positioned at the coating scope of apparatus for coating 16, when e Foerderanlage 14 is delivered to metal base 12 under the spraying scope, grounding device 20 can contact with metal base 12 bindings, and the positive charge of guiding metal base 12 is to the face of land, it is electronegative that metal base 12 is presented, metal base 12 is by e Foerderanlage 14 conveyings and by apparatus for coating 16, apparatus for coating 16 is powder coated on electronegative metal base 12 with positively charged copper powder, because the electrostatic force adsorption effect can make copper powder powder 18 be coated on the metal base 12.When the glue spread of apparatus for coating is quantitative, the thickness of film is relevant with the transfer rate of e Foerderanlage 14, when transfer rate fast more, the film that forms is thin more, otherwise then film is thick more, and thin film layer thickness is 40-80 μ m usually, after thin film layer forms, carry out sintering operation with 600 ℃ of-1000 ℃ of thin film layers, make the thin film layer adhere firmly on the metal base 12 metal base 12; The present invention also has a retrieving arrangement 22, and retrieving arrangement 22 is positioned at the below of apparatus for coating 16, can accept the copper powder powder 18 of dissipation in the coating process, and is reclaimed circulation and utilization.
Fig. 2 is a metal copper powder film coating process of the present invention, simultaneously with reference to Fig. 1, as shown in the figure, may further comprise the steps: at first carry out step S11, clean metal base material 12, and metal base 12 surfaces are kept dry, metal base 12 is a copper material, because the present invention utilizes the dry type coating that electrostatic force adheres to, and needs to keep the drying on coating environment and metal base 12 surfaces, simultaneously and with resistivity (Resistivity) pure water or ultrapure water clean metal base material 12 greatly; Then carry out step S12, utilize e Foerderanlage 14 metal base 12 to be delivered under the coating scope of apparatus for coating 16, e Foerderanlage 14 is a conveying belt; Then carry out step S13, e Foerderanlage 14 with etc. speed transferring metal base material 12, metal base 12 is contacted with grounding device 20, and makes the positive charge of metal base 12 be directed to the face of land, make metal base 12 surface electronegative; Then carry out step S14, utilize apparatus for coating 16 that the copper powder powder 18 of positively charged is coated electronegative metal base 12 surfaces, because the electrostatic force adsorption effect, copper powder powder 18 is coated on the metal base 12, forms the thin film layer of 40-80 μ m; Carry out step S15 at last, with 600 ℃-1000 ℃ high temperature the thin film layer of metal base 12 is carried out sintering operation, the present invention also has a retrieving arrangement 22, is positioned at the below of apparatus for coating 16, can accept the copper powder powder 18 of dissipation, and be reclaimed.
The present invention mainly provides a kind of metal copper powder film coating equipment and coating process, it has apparatus for coating, apparatus for coating can provide positively charged copper powder powder and utilize electrostatic adhesion power, make it be attached to electronegative metallic substrate surface, metal base can make the positive charge on this metal base be directed to the face of land, and make metallic substrate surface electronegative owing to contact with a grounding device, utilize electrostatic adhesion power, the copper powder powder is attached on the metallic substrate surface.
The above only is preferred embodiment of the present invention, only is illustrative for the purpose of the present invention, and nonrestrictive.Those skilled in the art is understood, and can carry out many changes to it in the spirit and scope that claim of the present invention limited, revise, even equivalence, but all will fall within the scope of protection of the present invention.
Claims (10)
1. a metal copper powder film coating equipment is used for the film coated operation on the heating panel metal base, it is characterized in that described metal copper powder film coating equipment comprises:
One e Foerderanlage can be carried described metal base;
One apparatus for coating can provide the copper powder powder, and makes described copper powder powder belt positive charge, and is again that described copper powder is powder coated on described metal base, forms a thin film layer; And
One grounding device is positioned at the coating scope of described apparatus for coating, and links with described metal base, and the positive charge that can guide metal base is to the face of land, and it is electronegative that described metal base is presented.
2. metal copper powder film coating equipment as claimed in claim 1 is characterized in that also having a retrieving arrangement, is positioned at the below of described apparatus for coating, can accept the copper powder powder of dissipation, and be reclaimed.
3. metal copper powder film coating process is characterized in that may further comprise the steps:
Clean a metal base, and described metallic substrate surface is kept dry;
Described metal base is delivered under the coating scope of an apparatus for coating;
Described metal base is contacted with a grounding device and make described metallic substrate surface electronegative;
Utilize described apparatus for coating that the copper powder of positively charged is powder coated in electronegative described metallic substrate surface, form thin film layer; And
With high temperature sintering the thin film layer of described metal base is carried out sintering operation.
4. metal copper powder film coating process as claimed in claim 3, when it is characterized in that described metal base by described e Foerderanlage conveying and by described apparatus for coating, described apparatus for coating is powder coated on described electronegative metal base with described positively charged copper powder.
5. metal copper powder film coating process as claimed in claim 3 is characterized in that because the electrostatic force adsorption effect is coated on the described metal base described copper powder powder.
6. metal copper powder film coating process as claimed in claim 3 is characterized in that its whole coating environment keeps dry.
7. metal copper powder film coating process as claimed in claim 3 is characterized in that described thin film layer sintering operation temperature is 600 ℃-1000 ℃.
8. metal copper powder film coating process as claimed in claim 3 is characterized in that described thin film layer thickness is 40-80 μ m.
9. metal copper powder film coating process as claimed in claim 3 is characterized in that described metal base need utilize pure water or ultrapure water before coating, carry out surface cleaning.
10. metal copper powder film coating process as claimed in claim 3 is characterized in that described metal base is a copper material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910128419A CN101831650A (en) | 2009-03-12 | 2009-03-12 | Metal copper powder film coating equipment and coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910128419A CN101831650A (en) | 2009-03-12 | 2009-03-12 | Metal copper powder film coating equipment and coating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101831650A true CN101831650A (en) | 2010-09-15 |
Family
ID=42715867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910128419A Pending CN101831650A (en) | 2009-03-12 | 2009-03-12 | Metal copper powder film coating equipment and coating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101831650A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106807947A (en) * | 2015-11-30 | 2017-06-09 | 胡立荣 | The continuous producing method of heat sink |
| CN108247814A (en) * | 2018-01-08 | 2018-07-06 | 广东新秀新材料股份有限公司 | The making module of the production method of ceramic rear cover and ceramic rear cover |
| CN114308589A (en) * | 2021-12-22 | 2022-04-12 | 容创友 | Electrostatic powder spraying process for aluminum profile |
-
2009
- 2009-03-12 CN CN200910128419A patent/CN101831650A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106807947A (en) * | 2015-11-30 | 2017-06-09 | 胡立荣 | The continuous producing method of heat sink |
| CN108247814A (en) * | 2018-01-08 | 2018-07-06 | 广东新秀新材料股份有限公司 | The making module of the production method of ceramic rear cover and ceramic rear cover |
| CN114308589A (en) * | 2021-12-22 | 2022-04-12 | 容创友 | Electrostatic powder spraying process for aluminum profile |
| CN114308589B (en) * | 2021-12-22 | 2024-04-19 | 容创友 | Electrostatic powder spraying process for aluminum profile |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1934910B (en) | Highly efficient organic light-emitting device using substrate or electrode having nanosized half-spherical convex and method for preparing same | |
| CN101513139B (en) | Method and apparatuses for printing and printed product | |
| TW201101544A (en) | Methods and apparatus for forming uniform particle layers of phosphor material on a surface | |
| CN101831650A (en) | Metal copper powder film coating equipment and coating method | |
| CN102765239A (en) | Releasing film with light releasing force and manufacture method of releasing film | |
| CN110767956B (en) | Method for stripping lithium ion battery electrode plate material and current collector | |
| CN103943790B (en) | A kind of Graphene composite and flexible transparency electrode and preparation method thereof | |
| CN206741996U (en) | A kind of electrostatic Laser Desorption graphene technology prepares carbon-coated aluminum foils device | |
| CN112951486B (en) | Embedded polymer/metal grid flexible transparent electrode and preparation method and application thereof | |
| CN103332031A (en) | Printing plate, scattering film layer, display device, and production methods of printing plate and scattering film layer | |
| CN106531906A (en) | Transfer printing method of quantum dot solid-state film and quantum dot transfer printing system | |
| CN104477894B (en) | A kind of method for shifting Graphene | |
| TW459413B (en) | Manufacturing apparatus of battery component and its manufacturing method | |
| CN107039123A (en) | A kind of electrostatic Laser Desorption graphene technology prepares carbon-coated aluminum foils device and method | |
| CN211305119U (en) | Electronic component soldering tin recycling device | |
| CN102744185A (en) | Metal powder spraying method | |
| CN104851523B (en) | Manufacture method of flexible transparent conductive membrane, and flexible transparent conductive membrane | |
| CN110948076A (en) | Electronic component soldering tin recycling device | |
| TW201029753A (en) | A metal thin film coating apparatus and a coating method | |
| CN104308968A (en) | Colored ceramic tile laser printing distributing method and laser printing device thereof | |
| CN221010630U (en) | Semitransparent organic solar cell composite film production equipment | |
| CN204183703U (en) | A kind of for the discharge of fine material device in laser printing cloth | |
| CN204183692U (en) | A kind of for the powder distribution device in ceramic laser cloth | |
| CN203165395U (en) | Device for producing exciter lamp (EL) luminescence scutcheons through running water type array jet printing | |
| JP2014051017A (en) | Laminating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100915 |