TW201239519A - Two-liquid mixing first and second liquids and method for producing printed circuit board - Google Patents

Two-liquid mixing first and second liquids and method for producing printed circuit board Download PDF

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TW201239519A
TW201239519A TW101100839A TW101100839A TW201239519A TW 201239519 A TW201239519 A TW 201239519A TW 101100839 A TW101100839 A TW 101100839A TW 101100839 A TW101100839 A TW 101100839A TW 201239519 A TW201239519 A TW 201239519A
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liquid
boiling point
group
organic solvent
naphtha
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TW101100839A
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Chinese (zh)
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TWI506358B (en
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Shigeru Nakamura
Michihisa Ueda
Shuuji Kage
Toshio Takahashi
Takashi Watanabe
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Sekisui Chemical Co Ltd
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Priority claimed from JP2011092713A external-priority patent/JP4850313B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)

Abstract

Provided are a first and second liquid that are two-liquid mixing type and that have superior miscibility of the first and second liquid. The two-liquid mixing first and second liquids are liquids for obtaining a photosensitive composition that is a mixture. The photosensitive composition contains at least two selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a naphtha having, in the distillation characteristics thereof, a first drop point of at least 150 DEG C and a last point of no greater than 290 DEG C. The first liquid contains a polymeric polymer. The second liquid contains a compound having a cyclic ether group. The first and second liquids contain at least one selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a naphtha having, in the distillation characteristics thereof, a first drop point of at least 150 DEG C and a last point of no greater than 290 DEG C.

Description

201239519 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種用以獲得作為混合物之感光性組合物 的二液混合型之第…第m細而t，本發明係關 於一種能夠較佳地用於在基板上形成阻焊劑臈、或在搭载 有發光二極體晶片之基板上形成反射光之光阻膜的二液混 合型之第一、第二液，以及使用該二液混合型之第一第 二液之印刷佈線板之製造方法。 【先前技術】 作為用以保護印刷佈線板以免受高溫焊錫損傷之保護 膜，廣泛使用有阻焊劑膜。 又’於各種電子機器用途中，在印刷佈線板之上表面搭 載有發光二極體（以下簡稱為LED, Light Emitting趴叫 晶片。為使自LED發出之光中，到達上述印刷佈線板之上 表面側之光亦得以利用，有時於印刷佈線板之上表面形成 白色阻焊劑膜。於該情形時，不僅可利用自led晶片之表 面直接照射至與印刷佈線板相反之側之光，亦可利用到達 印刷佈線板之上表面側’藉由白色阻焊劑膜而反射之反射 光。因此，可提高自LED產生之光之利用效率。 作為用以形成上述白色阻焊劑膜之材料之一例，下述專 利文獻1中揭示有如下光阻材料，其含有藉由環氧樹脂與水 解性院氧石夕炫之脱醇化反應而獲得的含院氧基之石夕炫改質 ，，樹知且進而含有含不飽和基之聚羧酸樹脂、稀釋劑、 光聚合起始劑及硬化密接性賦予劑。 161370.doc 201239519 下述專利文獻2揭示有如下白色阻焊劑材料，其含有不具 有芳香環之含羧基樹脂、光聚合起始劑、環氧化合物、金 紅石型氧化鈦及稀釋劑。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2007-249148號公報 [專利文獻2]曰本專利特開2〇〇7_322546號公報 【發明内容】 [發明所欲解決之問題] 為於基板上形成光阻膜，於將如專利文獻丨〜2中記载之先 前之光阻材料塗敷於基板上之情形時，有時無法均勻塗敷 光阻材料而產生塗敷不均。於例如藉由絲網印刷於基板上 塗敷先前之光阻材料之情形時，在所塗敷之光阻材料層 中’有時能看到條狀之不均。 本發明之目的在於提供一種二液混合型之第一、第二 液，以及使用該二液混合型之第_、第二液的印刷佈線板 之製造方法，1¾第一、第二液之混合性優異，且於將由第 一、第二液混合而成之混合物即感光性組合物塗敷於塗敷 對象構件上時，可抑制不均而均勻地塗敷。 [解決問題之技術手段] 根據本發明之廣泛態樣，可以提供如下二液混合型之第 第液’其係用以獲得作為混合物之感光性組合物者， 該二液混合型之第一、第二液為混合該第一第二液之前 之液體’由上述第一、第二液混合而成之混合物即感光性 161370.doc 201239519 組合物整體含有具有羧基之聚合性聚合物、光聚合起始 劑、具有環狀醚基之化合物、氧化鈦及有機溶劑，上述感 光性組合物含有選自由二丙二醇單曱醚、二乙二醇單乙醚 乙酸酿、及處於蒸餾性狀之初沸點&15(rc以上、處於蒸館 性狀之終沸點為290。(：以下的石腦油所組成之群中之至少 兩種作為上述有機溶劑，上述第一液含有上述聚合性聚合 物’且含有選自由二丙二醇單曱醚、二乙二醇單乙醚乙酸 S旨、及處於蒸餾性狀之初沸點為1 5〇〇c以上、處於蒸館性狀 之終碑點為2 9 0 C以下的石腦油所組成之群中之至少一種 作為上述有機溶劑之一部分，上述第二液含有上述具有環 狀醚基之化合物，且含有選自由二乙二醇單乙醚乙酸酯、 一丙一醇單甲醚、及處於蒸餾性狀之初沸點為1 5 0 °C以上、 處於蒸餾性狀之終沸點為220°C以下的石腦油所組成之群 中之至少一種作為上述有機溶劑之一部分，上述第一液含 有上述光聚合起始劑或含有上述氧化鈦，或者含有上述光 聚合起始劑與上述氧化鈦兩者，於上述第一液不含上述光 聚合起始劑之情形時上述第二液含有上述光聚合起始劑， 於上述第一液不含上述氧化鈦之情形時，上述第二液含有 上述氧化鈦。 本發明之印刷佈線板之製造方法係製造包含於表面具有 電路之印刷佈線板本體、及積層於該印刷佈線板本體之設 置有電路之表面的阻焊劑膜之印刷佈線板之方法，該製造 方法包括下述步驟：混合第一、第二液，獲得由上述第一、 第二液混合而成之阻焊劑組合物即感光性組合物；在於表 161370.doc 201239519 面具有電路之印刷佈線板本體之設置有電路的表面上塗敷 由上述第一、第二液混合而成之阻焊劑組合物即感光性組 合物’形成積層於上述印刷佈線板本體之設置有上述電路 之表面的阻焊劑膜’由上述第一、第二液混合而成之阻焊 劑組合物即感光性組合物整體包含具有羧基之聚合性聚合 物、光聚合起始劑、具有環狀醚基之化合物、氧化鈦及有 機溶劑’上述感光性組合物含有選自由二丙二醇單甲醚、 二乙二醇單乙醚乙酸酯、及處於蒸餾性狀之初沸點為i5(rc 以上、處於蒸餾性狀之終沸點為29〇〇c以下的石腦油所組成 之群中之至少兩種作為上述有機溶劑，上述第一液含有上 述聚合性聚合物，且含有選自由二丙二醇單曱醚、二乙二 醇單乙乙酸酯、及處於蒸餘性狀之初沸點為J 5〇{>C以上、 處於蒸餾性狀之終沸點為29(rc以下的石腦油所組成之群 中之至少一種作為上述有機溶劑之一部分，上述第二液含 有上述具有環狀醚基之化合物，且含有選自由二乙二醇單 乙醚乙酸酯、=丙二帛單甲_、及處於蒸餾性狀之初沸點 為150 c以上、處於蒸餾性狀之終沸點為22(rc以下的石腦 油所組成之群中之至少一種作為上述有機溶劑之一部分， 上述第一液含有上述光聚合起始劑或含有上述氧化鈦，或 者含有上述光聚合起始劑與上述氧化鈦兩者，於上述第一 液不含上述光聚合起始劑之情形時上述第二液含有上述光 聚合起始劑’於上述第一液不含上述氧化鈦之情形時，上 述第二液含有上述氧化鈦。 於本發明之二液混合型之第一、笫一汸 ^ 弟一及及本發明之印刷 161370.doc -6 · 201239519 佈線板之製造方法的某特定態樣中，上述第一液含有選自 由二丙二醇單甲越、二乙二醇單乙_乙酸s旨、及處於蒸顧 性狀之初沸點為i5(rc以上、處於蒸餾性狀之終沸點為 290°C以下的石腦油所組成之群中之至少兩種作為上述有 機溶劑之一部分。 於本發明之二液混合型之第一、第二液及本發明之印刷 佈線板之製造方法的其他特定態樣中，上述第一液至少含 有二丙二醇單甲醚與二乙二醇單乙醚乙酸酯，或者至少含 有二乙二醇單乙醚乙酸酯與處於蒸餾性狀之初沸點為 150°C以上、處於蒸餾性狀之終沸點為29〇t>c以下的石腦油 作為上述有機溶劑之一部分。 於本發明之二液混合型之第一、第二液及本發明之印刷 佈線板之製造方法的其他特定態樣中，上述第一液至少含 有二丙二醇單甲醚與處於蒸餾性狀之初沸點為150°C以 上、處於蒸餾性狀之終沸點為2 9 〇 t以下的石腦油作為上述 有機溶劑之一部分。 於本發明之二液混合型之第一、第二液及本發明之印刷 佈線板之製造方法的其他特定態樣中，上述感光性組合物 含有選自由二丙二醇單甲醚、二乙二醇單乙醚乙酸酯、及 處於蒸館性狀之初彿點❸邮以上、處於蒸㈣狀之終沸 點為220 C以下的石腦油所組成之群中之至少兩種作為上 述有機溶劑’上述第一液中之上述處於蒸餾性狀之初沸點 為1 50 C以上、處於蒸餾性狀之終沸點為29〇。〇以下的石腦 油為處於蒸顧性狀之初沸點為15G〇c以上、處於蒸顧性狀之 161370.doc 201239519 終沸點為220°C以下之石腦油β 於本發明之二液混合型之第一、第二液及本發明之印刷 佈線板之製造方法的其他特定態樣中，上述第一液含有上 述光聚合起始劑。 於本發明之二液混合型之第―、第二液及本發明之印刷 佈線板之製造方法的其他特定態樣中，上述第一液含有上 述氧化欽。 於本發明之二液混合型之第一、第二液及本發明之印刷 佈線板之製造方法的進而其他之特定態樣中，上述第一液 含有上述光聚合起始劑與上述氧化鈦兩者。 於本發明之二液混合型之第一、第二液中，由上述第一、 第二液混合而成之感光性組合物可較佳地用作阻焊劑組合 物。於本發明之二液混合型之第一、第二液中，較佳為由 上述第一、第二液混合而成之感光性組合物為阻焊劑組合 物0 [發明之效果] 本發明之二液混合型之第一、第二液係用以獲得作為混 合物之感光性組合物的二液混合型之第一、第二液，該二 液混合型之第一、第二液係混合該第一、第二液之前之液 體’由上述第一、第二液混合而成之混合物即感光性組合 物整體包含具有敌基之聚合性聚合物、光聚合起始劑、具 有環狀醚基之化合物、氧化鈦及有機溶劑，上述感光性組 合物含有選自由二丙二醇單甲醚、二乙二醇單乙醚乙酸 酉曰、及處於蒸館性狀之初沸點為15 〇 °C以上、處於蒸館性狀 161370.doc 201239519 之終沸點為290。(：以下的石腦油所組成之群中之至少兩種 作為上述有機溶劑’上述第一液含有上述聚合性聚合物， 且含有選自由二丙二醇單甲醚、二乙二醇單乙醚乙酸酿、 及處於蒸餾性狀之初沸點為150°C以上、處於蒸館性狀之终 沸點為290°C以下的石腦油所組成之群中之至少一種作為 上述有機溶劑之一部分’上述第二液含有上述具有環狀喊 基之化合物，且含有選自由二乙二醇單乙醚乙酸醋、二丙 二醇單曱醚、及處於蒸餾性狀之初沸點為15〇<>(：以上、處於 蒸餾性狀之終沸點為220°C以下的石腦油所組成之群中之 至少一種作為上述有機溶劑之一部分，上述第一液含有上 述光聚合起始劑或含有上述氧化鈦，或者含有上述光聚合 起始劑與上述氧化鈦兩者，因此上述第一、第二液之混合 性優異，且於將混合後之感光性組合物塗敷於塗敷對象構 件上時，可抑制不均而均勻地塗敷。 【實施方式】 以下對本發明進行詳細說明。 本發明之二液混合型之第一、第二液可用於獲得作為混 合物之感光性組合物。本發明之二液混合型之第一、第二 液係用於獲得作為混合物之感光性組合物之套組。本發明 之二液混合型之第一、第二液係混合而使用。本發明之二 液混合型之第一、第二液為混合該第一、第二液之前之液 體。混合之前之第一、第二液為混合前之感光性組合物。 由本發明之二液混合型之第一、第二液混合而成的混合物 即感光性組合物整體包含具有羧基之聚合性聚合物、光 161370.doc 201239519 聚合起始劑（B)、具有環狀醚基之化合物（C)、氧化鈦（D)及 有機/合劑（E)(以下有時將感光性組合物整體包含之有機溶 劑記作有機溶劑（Ε))β上述由第一、第二液混合而成之混合 物為感光性組合物，所混合之該感光性組合物整體包含具 有缓基之聚合性聚合物（Α)、光聚合起始劑（Β)、具有環狀 醚基之化合物（C)、氧化鈦（D)及有機溶劑（Ε)。 上述感光性組合物含有選自由二丙二醇單曱醚' 二乙二 醇單乙醚乙酸酯、及處於蒸餾性狀之初沸點為150°C以上、 處於蒸餾性狀之終沸點為29〇t以下的石腦油所組成之群 中之至少兩種作為上述有機溶劑（E)。 上述第一液含有上述聚合性聚合物（A),且含有選自由二 丙一醇單甲醚 '二乙二醇單乙醚乙酸酯、及處於蒸餾性狀 之初沸點為150°C以上、處於蒸餾性狀之終沸點為29〇8(：以 下的石腦油所組成之群中之至少一種作為上述有機溶劑 (E)之部分。上述第二液含有上述具有環狀醚基之化合物 ()且3有選自由一乙一醇单乙謎乙酸醋、二丙二醇單甲 醚、及處於蒸餾性狀之初沸點為！ 50〇c以上、處於蒸餾性狀 之終沸點為220°C以下的石腦油所組成之群中之至少一種 作為上述有機溶劑（E)之一部分。 上述第一液含有上述光聚合起始劑（8)或含有上述氧化 鈦（D) ’或者含有上述光聚合起始劑（B)與上述氧化鈦⑴）兩 者。於上述第一液不含上述光聚合起始劑（B)之情形時，上 述第二液含有上述光聚合起始劑（B)。於上述第一液不含上 述氧化鈦（D)之情形時，上述第二液含有上述氧化鈦（D)。 I61370.doc 201239519 上述光聚合起始劑（B)及上 液，亦可&人·风⑴）分別可包含於第一 夜才了包含於第二液，亦 之中。 於第一液與第二液兩者 又，於本發明之二液混合 合性單體、或者含有…：之第一、第二液含有下述聚 及抗氧化劑分別可包含於第一 【皁體 收亦可包含於第二液，亦 可匕a於第一液與第二液兩者之中。 成藉=采：本發明之二液混合型之第-、第二液之上述構 ㈤上述第一、第二液之混合性。進而，於基板等 塗敷對象構件上塗敷混合後之感光性組合物時，可抑制主 要由於氧化欽而產生之不均，從而可均句地塗敷。尤其是 藉由絲網印刷塗敷混合後之感光性組合物時，可抑制條狀 之不均。本發明之二液混合型之第一、第二液較佳為藉由 絲網印刷所塗敷之二液混合型之第一、第二液。 上述光聚合起始劑（Β)較佳為包含於第—液中而非包含 於第二液中。此時’上述第一、第二液之混合性變得更高， 且可更加均勻地塗敷感光性組合物。 上述氧化鈦（D)較佳為包含於第一液中而非包含於第二 液中。此時，氧化鈦（D)之分散性變高，進而上述第一、第 二液之混合性變得更高，且可更加均勻地塗敷感光性組合 物。 較佳為上述光聚合起始劑（Β)與上述氧化鈦（D)之兩者包 含於第一液中而非包含於第二液中。此時，氧化鈦（D)之分 散性變得更高，進而上述第一、第二液之混合性變得更高， 161370.doc -II- 201239519 且可更加均勻地塗敷感光性組合物。 以下’對本發明之二液混合型之第―、第二液、以及包 含於混合後之感光性組合物中之各成分進行詳細說明。 (聚合性聚合物（A)) 上述聚合性聚合物（A)具有羧基。具有羧基之聚合性聚合 物（A)具有聚合性，可進行聚合。藉由使上述聚合性聚合物 (A)具有羧基，可使感光性組合物之顯影性變得良好。作為 上述聚合性聚合物（A)，例如可列舉具有羧基之丙烯酸系樹 月曰、具有羧基之環氧樹脂及具有羧基之烯烴樹脂。再者，「樹 脂」並不限定於固形樹脂，亦包括液狀樹脂及低聚物。 上述聚合性聚合物（A)較佳為下述含羧基樹脂（a)〜(e” (a) 由不飽和羧酸與具有聚合性不飽和雙鍵之化合物進 行共聚合所得之含羧基樹脂； (b) 由含羧基之（甲酸）丙烯酸系共聚樹脂（bl)與1分子中 具有環氧乙烷環及乙烯性聚合性不飽和雙鍵之化合物（b2) 反應所得之含羧基樹脂； (c) 使不飽和一元叛酸、和1分子中分別具有1個環氧基 及聚合性不飽和雙鍵之化合物與具有聚合性不飽和雙鍵之 化合物的共聚物反應之後，使飽和或不飽和多元酸酐與所 生成之反應物的二級羥基反應所得之含羧基樹脂； (d) 使飽和或不飽和多元酸酎與含羥基聚合物反應後， 使1分子中分別具有1個環氧基及聚合性不飽和雙鍵之化合 物與所生成之具有羧基之聚合物反應而得的含羥基及羧基 之樹脂； 161370.doc .12- 201239519 (e)使具有芳㈣之環氧化合物與飽和多元酸酐或不飽 和多元酸酐反應所得之樹脂，或使具有芳香環之環氧化合 物與具有至少一個不飽和雙鍵之含羧基化合物反應之後， 進而與飽和多元酸肝或不飽和多元酸軒反應而得之樹脂。 . 丨述感光性組合物⑽重量％中，上述具有m基之聚合性 聚合物（A)之含量較佳為3重量％以上，更佳為5重量％以 上，較佳為50重量％以下，更佳為4〇重量％以下。若上述具 有羧基之聚合性聚合物（A)之含量為上述下限以上及上述 上限以下，則感光性組合物之硬化性良好。 (光聚合起始劑（B)) 由於上述感光性組合物含有光聚合起始劑（B)，因此可藉 由光之照射使感光性組合物硬化^光聚合起始劑（B)並無特 別限定。光聚合起始劑（B)可僅使用—種，亦可併用兩種以 上。 作為上述光聚合起始劑（B)，例如可列舉：醯基膦氧化 物鹵甲基化二畊、由曱基化嘮二唑、咪唑、安息香、安 息香院基峻、蒽酿、苯并葱嗣、二苯甲明、苯乙嗣、9_氧 硫咄口星、苯甲酸酯、吖啶、啡畊 '二茂鈦、α·胺烷基苯酮、 . 肟以及該等之衍生物。上述光聚合起始劑（Β)可僅使用一 種’亦可併用兩種以上。 才十於上述具有叛基之聚合性聚合物（Α) 100重量份，上 述光聚σ起始劑（Β)之含量較佳為〇丨重量份以上更佳為:1 重量伤以上，較佳為3 0重量份以下，更佳為1 5重量份以下。 若上述光聚合起始劑（Β)之含量為上述下限以上及上述上 161370.doc • 13· 201239519 限以下’則可進一步提高感光性紕合物之感光性。 (具有環狀醚基之化合物（c)) 以提高光阻膜之切割加工性等為目的，上述感光性組合 物含有具有環狀醚骨架之化合物（c)e又，藉由使用上述具 有環狀醚骨架之化合物（c)，亦可使感光性組合物之硬化性 良好。 作為上述具有環狀醚骨架之化合物（C)，例如可列舉：雙 酚S型環氧樹脂、鄰苯二曱酸二縮水甘油酯樹脂、異氰尿酸 二縮水甘油酯等雜環式環氧樹脂、聯二曱苯酚型環氧樹 脂'聯苯酚型環氧樹脂、四縮水甘油基二曱苯醯基乙烷樹 脂、雙酚A型環氧樹脂 '氫化雙酚A型環氧樹脂、雙酚F型 環氧樹脂、溴化雙酚A型環氧樹脂、苯酚酚醛清漆型環氧樹201239519 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a two-liquid mixing type of a photosensitive composition as a mixture, which is the m-th mixed type, and the present invention relates to a Preferably, the first and second liquids for forming a solder resist crucible on the substrate or forming a photoresist film for reflecting light on the substrate on which the light emitting diode wafer is mounted, and using the two liquid mixture A method of manufacturing a printed wiring board of a first and second liquid type. [Prior Art] As a protective film for protecting a printed wiring board from high-temperature solder damage, a solder resist film is widely used. Further, in various electronic device applications, a light-emitting diode (hereinafter referred to as an LED, Light Emitting squeaking chip) is mounted on the upper surface of the printed wiring board, and the light emitted from the LED reaches the printed wiring board. The light on the surface side is also utilized, and a white solder resist film is sometimes formed on the upper surface of the printed wiring board. In this case, not only the light from the surface of the led wafer is directly irradiated to the side opposite to the printed wiring board, but also It is possible to use the reflected light reflected by the white solder resist film on the upper surface side of the printed wiring board. Therefore, the utilization efficiency of light generated from the LED can be improved. As an example of a material for forming the white solder resist film, Patent Document 1 listed below discloses a photoresist material containing a oxy-containing sulphate which is obtained by a dealcoholization reaction of an epoxy resin and a hydrolyzable oxazet, and is known as Further, it contains a polycarboxylic acid resin containing an unsaturated group, a diluent, a photopolymerization initiator, and a hardening adhesion imparting agent. 161370.doc 201239519 Patent Document 2 below discloses the following white solder resist A material containing a carboxyl group-containing resin having no aromatic ring, a photopolymerization initiator, an epoxy compound, a rutile-type titanium oxide, and a diluent. [Prior Art Document] [Patent Document] [Patent Document 1] JP-A-2007-249148 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. When the prior photoresist material described in 2 is applied to a substrate, the photoresist may not be uniformly applied to cause coating unevenness. For example, the prior photoresist is applied by screen printing on the substrate. In the case of a material, a strip-like unevenness is sometimes seen in the applied photoresist material layer. It is an object of the present invention to provide a two-liquid mixing type first and second liquid, and to use the same In the method for producing a printed wiring board of the first and second liquids of the liquid mixing type, the first and second liquids are excellent in miscibility, and the photosensitive composition which is a mixture obtained by mixing the first and second liquids is coated. Can be suppressed when applied to a member to be coated [Unevenly and uniformly applied] [Technical means for solving the problem] According to a broad aspect of the present invention, it is possible to provide a liquid-liquid mixture of the following two-liquid mixing type, which is used for obtaining a photosensitive composition as a mixture, The first liquid and the second liquid of the two-liquid mixing type are the liquid before mixing the first and second liquids. The mixture of the first and second liquids is photosensitive. 161370.doc 201239519 The composition as a whole contains a carboxyl group. a polymerizable polymer, a photopolymerization initiator, a compound having a cyclic ether group, titanium oxide, and an organic solvent, wherein the photosensitive composition is selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, and The initial boiling point of the distillation property & 15 (rc or more, the final boiling point of the steaming property is 290). (: at least two of the group consisting of the following naphtha as the organic solvent, the first liquid containing the above polymerizable polymer' and containing a solvent selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate S And at least one of the group consisting of naphtha having a boiling point of 15 〇〇 c or more at the beginning of the distillation property and having a final score of 290 C or less in the steaming property is a part of the organic solvent. The second liquid contains the above-mentioned compound having a cyclic ether group, and contains a compound selected from the group consisting of diethylene glycol monoethyl ether acetate, monopropanol monomethyl ether, and an initial boiling point of 150 ° C or higher in a distillation property. And at least one of the group consisting of naphtha having a boiling point of 220 ° C or less as a part of the organic solvent, wherein the first liquid contains the photopolymerization initiator or contains the titanium oxide or contains In the case where the photopolymerization initiator and the titanium oxide do not contain the photopolymerization initiator, the second liquid contains the photopolymerization initiator, and the first liquid does not contain the oxygen. In the case of titanium, the second liquid contains the titanium oxide. The method for producing a printed wiring board according to the present invention is to manufacture a printed wiring board main body having a circuit on a surface thereof and a circuit-provided surface laminated on the main body of the printed wiring board. A method of printing a wiring board of a solder resist film, the manufacturing method comprising the steps of: mixing the first and second liquids to obtain a photosensitive composition which is a solder resist composition obtained by mixing the first and second liquids; A photosensitive composition which is a solder resist composition obtained by mixing the first and second liquids is coated on the surface of the printed wiring board body having the circuit on the surface of the circuit 161370.doc 201239519, and a laminated layer is formed on the printed wiring. The solder resist film of the surface of the above-mentioned circuit is provided with a solder resist composition which is a mixture of the first and second liquids, and the photosensitive composition as a whole contains a polymerizable polymer having a carboxyl group and a photopolymerization initiator. a compound having a cyclic ether group, titanium oxide, and an organic solvent. The photosensitive composition described above contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethyl ether. The alcohol monoethyl ether acetate and at least two of the group consisting of naphtha having a boiling point of i5 (rc or more and a boiling point of 29 〇〇c or less) are used as the organic solvent. The first liquid contains the polymerizable polymer and is selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoacetate, and the initial boiling point of the steaming property is J 5 〇 {> C or more, at At least one of the group consisting of naphtha having a final boiling point of 29 (rc or less) is a part of the organic solvent, and the second liquid contains the compound having a cyclic ether group and containing a selected from the group consisting of Alcohol monoethyl ether acetate, = propylene dioxime _, and at least one of the group consisting of naphtha having a boiling point of 150 c or more and a boiling point of 22 (rc or less) As a part of the organic solvent, the first liquid contains the photopolymerization initiator or contains the titanium oxide, or both the photopolymerization initiator and the titanium oxide, and the first liquid does not contain the photopolymerization. In the case of the starter, the second liquid contains the photopolymerization initiator. When the first liquid does not contain the titanium oxide, the second liquid contains the titanium oxide. In a specific aspect of the method for manufacturing a wiring board according to the first aspect of the present invention, the first liquid, and the printing method of the present invention, the first liquid contains the selected one selected from the group consisting of a group consisting of dipropylene glycol monomethyl phthalate, diethylene glycol monoethyl acetonitrile, and naphtha having a boiling point of i5 (rc or more and a boiling point of 290 ° C or less) At least two of them are part of the above-mentioned organic solvent. In other specific aspects of the first and second liquids of the two-liquid mixing type of the present invention and the method for producing a printed wiring board of the present invention, the first liquid contains at least Dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether acetate, or at least diethylene glycol monoethyl ether acetate, having a boiling point of 150 ° C or higher at the beginning of the distillation property and a final boiling point of 29 处于 in a distillation property The naphtha of t>c or less is part of the above organic solvent. In the other first aspect of the two-liquid mixing type of the present invention and the method of manufacturing the printed wiring board of the present invention, the first Liquid contains at least two The diol monomethyl ether and the naphtha having a boiling point of 150 ° C or higher and a boiling point of the final boiling point of 2 9 〇t or less are part of the organic solvent. In another specific aspect of the first and second liquids and the method for producing a printed wiring board of the present invention, the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and steamed. At least two of the group consisting of naphtha having a boiling point of 220 C or less at the beginning of the trait of the museum are used as the organic solvent. The above-mentioned first liquid is in a distillation state. The initial boiling point is 1 50 C or more, and the final boiling point of the distillation property is 29 〇. The naphtha below 〇 is the initial boiling point of the steaming property of 15 G〇c or more, and is in the trait of steaming. 161370.doc 201239519 The final boiling point is The naphtha of at least 220 ° C is in the first and second liquids of the two-liquid mixing type of the present invention and other specific aspects of the method for producing a printed wiring board of the present invention, wherein the first liquid contains the photopolymerization Starting agent. In another specific aspect of the method for producing a two-liquid mixing type of the present invention, the second liquid, and the printed wiring board of the present invention, the first liquid contains the oxidized oxime. The two-liquid mixing type of the present invention In still another specific aspect of the first and second liquids and the method of producing a printed wiring board of the present invention, the first liquid contains both the photopolymerization initiator and the titanium oxide. In the first and second liquids of the type, the photosensitive composition obtained by mixing the first and second liquids can be preferably used as a solder resist composition. In the first and second types of the two-liquid mixing type of the present invention In the two liquids, it is preferred that the photosensitive composition obtained by mixing the first and second liquids is a solder resist composition 0. [Effect of the Invention] The first liquid and the second liquid system of the two-liquid mixing type of the present invention Obtaining a first liquid and a second liquid of a two-liquid mixing type as a photosensitive composition of the mixture, wherein the first liquid and the second liquid are mixed with the liquid before the first and second liquids First, the mixture of the second liquid is a photosensitive combination The whole material includes a polymerizable polymer having an enemy group, a photopolymerization initiator, a compound having a cyclic ether group, titanium oxide, and an organic solvent, and the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol. Monoethyl ether acetate, and the initial boiling point of the steaming property is 15 〇 ° C or more, and the boiling point of the steaming property is 161370.doc 201239519 is 290. (: at least two of the group consisting of the following naphtha as the organic solvent. The first liquid contains the polymerizable polymer, and contains a selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether acetate. And at least one of the group consisting of naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or less at the beginning of the distillation property is a part of the organic solvent. The compound having a cyclic ring group and containing a selected from the group consisting of diethylene glycol monoethyl acetate acetate, dipropylene glycol monoterpene ether, and an initial boiling point of a distillation property of 15 〇 <> (: above, in a distillation state At least one of the group consisting of naphtha having a final boiling point of 220 ° C or less is a part of the organic solvent, and the first liquid contains the photopolymerization initiator or contains the titanium oxide or contains the photopolymerization initiation. The agent and the titanium oxide are both excellent in the miscibility of the first and second liquids, and the unevenness can be suppressed when the photosensitive composition after mixing is applied to the member to be coated. The present invention will be described in detail below. The first and second liquids of the two-liquid mixing type of the present invention can be used to obtain a photosensitive composition as a mixture. The two-liquid mixing type of the present invention The first and second liquids are used to obtain a kit of photosensitive compositions as a mixture. The first and second liquids of the two-liquid mixing type of the present invention are used in combination, and the first of the two-liquid mixing type of the present invention. The second liquid is a liquid before mixing the first and second liquids, and the first and second liquids before mixing are photosensitive compositions before mixing. The first liquid and the second liquid mixed by the two-liquid mixing type of the present invention. The photosensitive composition as a whole contains a polymerizable polymer having a carboxyl group, a light 161370.doc 201239519 polymerization initiator (B), a compound having a cyclic ether group (C), titanium oxide (D), and organic / Mixture (E) (hereinafter, the organic solvent contained in the entire photosensitive composition may be referred to as an organic solvent (Ε)). The mixture obtained by mixing the first and second liquids is a photosensitive composition, and is mixed. Photosensitive composition The body comprises a polymerizable polymer (Α) having a slow group, a photopolymerization initiator (Β), a compound (C) having a cyclic ether group, titanium oxide (D), and an organic solvent (Ε). The composition comprises a naphtha selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, and a naphtha having a boiling point of 150 ° C or higher and a distillation boiling point of 29 〇t or less. At least two of the above groups are used as the above organic solvent (E). The first liquid contains the above polymerizable polymer (A) and contains a solvent selected from the group consisting of dipropylene alcohol monomethyl ether 'diethylene glycol monoethyl ether acetate And at least one of the group consisting of naphtha having a boiling point of 150 ° C or higher and a boiling point of 29 ° 8 (the following naphtha is used as a part of the organic solvent (E)). The second liquid contains the above-mentioned compound having a cyclic ether group () and 3 is selected from the group consisting of monoethyl alcohol monoacetic acid vinegar, dipropylene glycol monomethyl ether, and the boiling point at the beginning of the distillation property! At least one of the group consisting of naphtha having a boiling point of 220 ° C or less and having a boiling point of 50 〇 c or more is a part of the organic solvent (E). The first liquid contains the photopolymerization initiator (8) or the titanium oxide (D)' or the photopolymerization initiator (B) and the titanium oxide (1). In the case where the first liquid does not contain the photopolymerization initiator (B), the second liquid contains the photopolymerization initiator (B). In the case where the first liquid does not contain the titanium oxide (D), the second liquid contains the titanium oxide (D). I61370.doc 201239519 The above photopolymerization initiator (B) and the supernatant, and also the & human wind (1) can be included in the second liquid, respectively, in the first night. Further, in the first liquid and the second liquid, the two-liquid mixed monomer of the present invention, or the first and second liquids containing:: the following poly-and antioxidants may be respectively included in the first [soap The body collection may also be included in the second liquid, or may be in both the first liquid and the second liquid. The structure of the first and second liquids of the two-liquid mixing type of the present invention (5) the mixing property of the first and second liquids. Further, when the photosensitive composition after the application is applied to a member to be coated such as a substrate, it is possible to suppress unevenness due to oxidation, and it is possible to apply it uniformly. In particular, when the photosensitive composition after mixing is applied by screen printing, unevenness in strip shape can be suppressed. Preferably, the first and second liquids of the two-liquid mixing type of the present invention are the first and second liquids of the two-liquid mixing type applied by screen printing. The above photopolymerization initiator (Β) is preferably contained in the first liquid instead of being contained in the second liquid. At this time, the mixing property of the first and second liquids described above becomes higher, and the photosensitive composition can be applied more uniformly. The above titanium oxide (D) is preferably contained in the first liquid and not contained in the second liquid. At this time, the dispersibility of the titanium oxide (D) is increased, and the miscibility of the first and second liquids is further increased, and the photosensitive composition can be applied more uniformly. It is preferred that both of the above photopolymerization initiator (Β) and the above titanium oxide (D) are contained in the first liquid instead of being contained in the second liquid. At this time, the dispersibility of the titanium oxide (D) is higher, and the miscibility of the first and second liquids is further increased, and the photosensitive composition can be more uniformly applied to 161370.doc -II-201239519. . Hereinafter, the components of the two-liquid mixing type of the present invention, the second liquid, and the components contained in the photosensitive composition after mixing will be described in detail. (Polymerizable Polymer (A)) The above polymerizable polymer (A) has a carboxyl group. The polymerizable polymer (A) having a carboxyl group has polymerizability and can be polymerized. When the polymerizable polymer (A) has a carboxyl group, the developability of the photosensitive composition can be improved. Examples of the polymerizable polymer (A) include an acrylic resin having a carboxyl group, an epoxy resin having a carboxyl group, and an olefin resin having a carboxyl group. Further, the "resin" is not limited to a solid resin, and includes a liquid resin and an oligomer. The polymerizable polymer (A) is preferably a carboxyl group-containing resin (a) to (e" (a) a carboxyl group-containing resin obtained by copolymerizing an unsaturated carboxylic acid and a compound having a polymerizable unsaturated double bond; (b) a carboxyl group-containing resin obtained by reacting a carboxyl group-containing (formic acid) acrylic copolymer resin (b1) with a compound (b2) having an oxirane ring and an ethylenically polymerizable unsaturated double bond in one molecule; a saturated or unsaturated monobasic compound obtained by reacting a compound having one epoxy group and a polymerizable unsaturated double bond in one molecule with a copolymer having a polymerizable unsaturated double bond in one molecule; a carboxyl group-containing resin obtained by reacting an acid anhydride with a secondary hydroxyl group of the resulting reactant; (d) reacting a saturated or unsaturated polybasic acid with a hydroxyl group-containing polymer to have one epoxy group and polymerization in one molecule a resin containing a hydroxyl group and a carboxyl group obtained by reacting a compound of a unsaturated double bond with a polymer having a carboxyl group; 161370.doc .12 - 201239519 (e) an epoxy compound having a aryl group (tetra) and a saturated polybasic acid anhydride or Unsaturated polybasic acid a resin obtained by the reaction, or a resin obtained by reacting an epoxy compound having an aromatic ring with a carboxyl group-containing compound having at least one unsaturated double bond, and further reacting with a saturated polybasic acid liver or an unsaturated polybasic acid. The content of the polymerizable polymer (A) having the m group in the photosensitive composition (10% by weight) is preferably 3% by weight or more, more preferably 5% by weight or more, and most preferably 50% by weight or less, more preferably When the content of the polymerizable polymer (A) having a carboxyl group is at least the above lower limit and not more than the above upper limit, the curability of the photosensitive composition is good. (Photopolymerization initiator (B)) Since the photosensitive composition contains the photopolymerization initiator (B), the photosensitive composition can be cured by light irradiation, and the photopolymerization initiator (B) is not particularly limited. Photopolymerization initiator (B) The photopolymerization initiator (B) may, for example, be a hafnylphosphine oxide, a halomethylated diplune, a thiolated oxadiazole, an imidazole, or the like. Benzoin, benzoin, Ji Jun, Stuffed, benzoic acid, diphenylmethylamine, phenelzine, 9-oxosulfonyl sulphate, benzoic acid ester, acridine, porphyrin, ferrocene, α-aminoalkyl benzophenone, . The above-mentioned photopolymerization initiator (Β) may be used alone or in combination of two or more kinds. The above photopolymerizable polymer (Α) is 100 parts by weight of the above-mentioned polymerizable polymer (Α). The content of the initiator (Β) is preferably 〇丨 by weight or more, more preferably: 1 part by weight or more, preferably 30 parts by weight or less, more preferably 15 parts by weight or less. When the content of (Β) is at least the above lower limit and above the above limit of 161370.doc • 13·201239519, the photosensitivity of the photosensitive composition can be further improved. (The compound (c) having a cyclic ether group) The photosensitive composition contains a compound (c)e having a cyclic ether skeleton for the purpose of improving the cutting processability of the photoresist film, etc., by using the above-mentioned ring The compound (c) having an ether skeleton can also have good curability of the photosensitive composition. Examples of the compound (C) having a cyclic ether skeleton include heterocyclic epoxy resins such as bisphenol S-type epoxy resin, phthalic acid diglycidyl ester resin, and isocyanuric acid diglycidyl ester. , bisphenol phenol type epoxy resin 'biphenol type epoxy resin, tetraglycidyl dinonyl phenyl hydrazine ethane resin, bisphenol A type epoxy resin 'hydrogenated bisphenol A type epoxy resin, bisphenol F Type epoxy resin, brominated bisphenol A type epoxy resin, phenol novolac type epoxy tree

脂、曱酚酚醛清漆型環氧樹脂、脂環式環氧樹脂、雙酚A 之酚醛清漆型環氧樹脂、螯合型環氧樹脂、乙二醛型環氧 樹脂、含胺基環氧樹脂、橡膠改質環氧樹脂、雙環戊二烯 酚型環氧樹脂'聚矽氧改質環氧樹脂及卜己内酯改質環氧 樹脂。上述具有環狀醚骨架之化合物（C)可僅使用一種，亦 可併用兩種以上。 上述具有環狀醚骨架之化合物（c)以如下方式發揮作 用·與上述具錢基之聚合性聚合物（A)所具有之叛基進行 反應’使感光性組合物硬化。 相對於上述具有羧基之聚合性聚合物（A) 1〇〇重量份，上 述具有環狀㈣骨架之化合物（C)之含量較佳為0.1重量份以 上，更佳為1重量份以上，較佳為50重量份以下，更佳為30 I61370.doc 201239519 重量伤以下。右上述具有環狀醚骨架之化合物（c)之含量為 上述下限以上及上述上限以下，則可進一步提高光阻膜之 電氣絕緣性。 (氧化欽（D)) 由於上述感光性組合物含有氧化鈦（D)，因此可形成反射 率較高之光阻膜等硬化物膜。上述感光性組合物中所含之 氧化鈦（D)並無特別限定。氧化鈦（D)可僅使用一種亦可 併用兩種以上。 與使用氧化鈦（D)以外之其他無機填充劑之情形相比，藉 由使用上述氧化鈦（D)，可形成反射率較高之光阻膜。 上过·氧化鈦（D)較佳為金紅石型氧化敛或銳欽礦型氧化 鈦。藉由使用金紅石型氧化鈦，可形成耐熱黃變性更加優 異之光阻膜。與金紅石型氧化鈦相比’上.述銳鈦礦型氧化 欽之硬度較低。因此，藉由使用銳鈦礦型氧化鈦，可提高 光阻膜之加工性。 上述氧化鈦（D)較佳為含有利用矽氧化物或矽酮化合物 。進行表面處理之金紅石型氧化鈦。上述氧化鈦（d)⑽重量 %中，上述利用矽氧化物或矽酮化合物進行表面處理之金 紅石型氧化鈦之含量較佳為1()重量％以上，更佳為3g重量％ 以上，且為100重量％以下。上述氧化鈦（D)亦可全部為上述 利用石夕氧化物或石夕酮化合物進行表面處理之金紅石型氧化 鈦。藉由使用上述利用矽氧化物或矽酮化合物進行表面處 理之金紅石型氧化欽’可進—步提高光阻膜之耐熱黃變性: 作為利用矽氧化物或矽酮化合物進行表面處理之金紅石 161370.doc 15 201239519 型氧化欽，例如可列舉氣化法金紅石型氧化欽即石原產業 公司製造之產品編號：CR-90 ’或硫酸法金紅石型氧化鈦即 石原產業公司製造之產品編號：R_550等。 上述感光性組合物100重量％中’氧化鈦（D)之含量較佳為 3重量％以上，更佳為10重量％以上，進而更佳為15重量％以 上，較佳為80重量％以下，更佳為75重量。/。以下，進而更佳 為7〇重量。/。以下。若氧化鈦（D)之含量為上述下限以上及上述 上限以下，則當光阻膜曝露於高溫下時難以發生黃變。進 而’可容易地製備具有適於塗敷之黏度的感光性組合物。 (有機溶劑（E)) 逖埶光性組。物含有有機溶劑（E)。由上述第一、第二 液混合而成之感光性組合物含有有機溶劑（E)。上述感光性 組。物含有至少兩種有機溶劑。較佳為上述第一液中所含 之有機溶劑㈢(以下有時將第一液中所含之有 ： 有機溶劑㈣與上述第二液中所含之有機溶細)(以； 有時將第二液中所含之有機溶劑記為有機溶劑(E2))不同。 作為眾所周知之有機溶劑，可列舉：甲基乙基_ 酮等鲷類，甲婪、- to·»* ^ ^ —甲本、四甲基苯等芳香族烴類，溶纖 甲基’合纖劑、丁基溶纖劑、卡必醇'甲基卡必醇、丁 基卡必醇、丙二醇單甲趟、二丙二醇單甲趟、二二 乙醚、二丙二醇單甲醚等二醇醚類，乙酸乙酯'乙酸 :酸丁醋、溶纖劑乙酸醋、丁基溶纖劑乙酸 曰乙 酸醋、丁基卡必醇乙酸醋、丙二醇單甲趟乙酸醋、二2 醇單乙驗乙酸醋、二丙二醇單甲趟乙酸醋、碳酸丙二醋等 161370.doc 201239519 知類’辛烷、癸烷等脂肪族烴類，以及石油醚、石腦油等 石油系溶劑等。 上述有機溶劑中’上述第一液必需含有選自由二丙二醇 單曱醚、一乙二醇單乙醚乙酸酯、及處於蒸餾性狀之初沸 點為150 C以上、處於蒸餾性狀之終沸點為2901以下的石 腦油所組成之群中之至少一種作為上述有機溶劑（E)之一 部分。二丙二醇單甲醚、二乙二醇單乙醚乙酸酯、及處於 蒸餾性狀之初沸點為15(rc以上、處於蒸餾性狀之終沸點為 290°C以下的石腦油中之至少一種為有機溶劑（El)。 又，上述有機溶劑中，上述第二液含有選自由二乙二醇 單乙越乙酸自旨、二丙二醇單甲_、及處於蒸顧性狀之初彿 點為150 C以上、處於蒸餾性狀之終沸點為22〇(>c以下的石 腦油所組成之群中之至少一種作為上述有機溶劑（E)之一 邛刀。選自由一乙二醇單乙醚乙酸酯、二丙二醇單曱醚、 及處於蒸餾性狀之初沸點為150t以上、處於蒸餾性狀之終 沸點為220°C以下的石腦油所組成之群中之至少一種為有 機溶劑（E2)。 藉由使上述有機溶劑（El)、（E2)分別含於第一、第二液 中，可使上述第一、第二液之混合性明顯變得良好。使用 特定之上述有機溶劑（E1)、（E2)，進而使特定之上述有機溶 劑分別含於第一液與第二液中非常有助於提高上 述第-、第H混合性’#制所混合之感光性組合物塗 敷後之不均。 上述「處於蒸餾性狀之初沸點」及上述「處於蒸餾性狀 161370.doc •17· 201239519Grease, indophenol novolak type epoxy resin, alicyclic epoxy resin, phenolic varnish type epoxy resin of bisphenol A, chelating epoxy resin, glyoxal type epoxy resin, amine-containing epoxy resin , rubber modified epoxy resin, dicyclopentadiene phenol type epoxy resin 'polyoxy modified epoxy resin and buccolide modified epoxy resin. The compound (C) having a cyclic ether skeleton may be used singly or in combination of two or more. The compound (c) having a cyclic ether skeleton functions in the following manner and reacts with the thiol group of the above-mentioned hydroxyl group-containing polymer (A) to cure the photosensitive composition. The content of the compound (C) having a cyclic (tetra) skeleton is preferably 0.1 part by weight or more, more preferably 1 part by weight or more, more preferably 1 part by weight or more based on 1 part by weight of the carboxyl group-containing polymerizable polymer (A). It is 50 parts by weight or less, more preferably 30 I61370.doc 201239519. When the content of the compound (c) having a cyclic ether skeleton on the right is at least the above lower limit and not more than the above upper limit, the electrical insulating properties of the resist film can be further improved. (Oxidation (D)) Since the photosensitive composition contains titanium oxide (D), a cured film such as a photoresist film having a high reflectance can be formed. The titanium oxide (D) contained in the photosensitive composition is not particularly limited. The titanium oxide (D) may be used alone or in combination of two or more. A photoresist film having a high reflectance can be formed by using the above titanium oxide (D) as compared with the case of using an inorganic filler other than titanium oxide (D). The titanium oxide (D) is preferably rutile-type oxidized or arsenic-type titanium oxide. By using rutile-type titanium oxide, a photoresist film having more excellent heat-resistant yellowing properties can be formed. Compared with the rutile-type titanium oxide, the hardness of the anatase-type oxidizing agent is low. Therefore, the workability of the photoresist film can be improved by using anatase type titanium oxide. The titanium oxide (D) preferably contains a ruthenium oxide or an oxime compound. A rutile type titanium oxide surface-treated. In the titanium oxide (d) (10% by weight), the content of the rutile-type titanium oxide surface-treated with the cerium oxide or the fluorenone compound is preferably 1% by weight or more, more preferably 3% by weight or more, and It is 100% by weight or less. The titanium oxide (D) may be all of the rutile-type titanium oxide surface-treated by the above-mentioned stone oxide or linaloxone compound. The heat-resistant yellowing of the photoresist film can be further improved by using the above-mentioned rutile-type oxidized surface which is surface-treated with a cerium oxide or an anthrone compound: as a rutile for surface treatment using a cerium oxide or an anthrone compound 161370.doc 15 201239519 type oxidized chin, for example, the product number of CR-90' manufactured by the gasification method rutile type oxidized cisplatin, or the rutile type titanium oxide which is manufactured by Ishihara Sangyo Co., Ltd. R_550 and so on. The content of the titanium oxide (D) in 100% by weight of the photosensitive composition is preferably 3% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, and most preferably 80% by weight or less. More preferably, it is 75 weight. /. Hereinafter, it is more preferably 7 〇 by weight. /. the following. When the content of the titanium oxide (D) is at least the above lower limit and not more than the above upper limit, yellowing is less likely to occur when the photoresist film is exposed to a high temperature. Further, a photosensitive composition having a viscosity suitable for coating can be easily prepared. (Organic solvent (E)) Photometric group. The material contains an organic solvent (E). The photosensitive composition obtained by mixing the first and second liquids contains an organic solvent (E). The above photosensitive group. The material contains at least two organic solvents. It is preferably an organic solvent (III) contained in the first liquid (hereinafter, the first liquid may be included in the first liquid: an organic solvent (tetra) and an organic solvent contained in the second liquid); The organic solvent contained in the second liquid is referred to as an organic solvent (E2). Examples of the well-known organic solvent include anthracene such as methyl ethyl ketone, formazan, - to·»* ^ ^ - an aromatic hydrocarbon such as a methyl or tetramethylbenzene, and a lyophilized methyl group. , butyl cellosolve, carbitol 'methyl carbitol, butyl carbitol, propylene glycol monomethyl hydrazine, dipropylene glycol monomethyl hydrazine, di diethyl ether, dipropylene glycol monomethyl ether and other glycol ethers, acetic acid B Ester' acetic acid: acid butyl vinegar, cellosolve acetate vinegar, butyl cellosolve acetate acetoacetate vinegar, butyl carbitol acetate vinegar, propylene glycol monomethyl hydrazine acetate vinegar, di-2-ol acetonitrile acetate, dipropylene glycol monomethyl趟acetic acid vinegar, propylene carbonate, etc. 161370.doc 201239519 Known as 'aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha. In the above organic solvent, the first liquid must contain a solvent selected from the group consisting of dipropylene glycol monoterpene ether and monoethylene glycol monoethyl ether acetate, and has a boiling point of 150 C or more and a distillation boiling point of 2901 or less. At least one of the group consisting of naphtha is part of the above organic solvent (E). Dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and at least one of naphtha having a boiling point of 15 (rc or more and a boiling point of 290 ° C or less) is organic. Further, in the organic solvent, the second liquid contains a solvent selected from the group consisting of diethylene glycol monoacetic acid, dipropylene glycol monomethyl ketone, and a steaming property of 150 C or more. At least one of the group consisting of naphtha having a boiling point of 22 〇 (> c or less) is one of the above organic solvents (E). It is selected from the group consisting of monoethylene glycol monoethyl ether acetate, At least one of dipropylene glycol monoterpene ether and a group of naphtha having a boiling point of 150 t or more and a boiling point of 220 ° C or less at the end of the distillation property is an organic solvent (E2). The organic solvents (El) and (E2) are contained in the first and second liquids, respectively, and the mixing property of the first and second liquids is remarkably improved. The specific organic solvents (E1) and (E2) are used. ), and then the specific organic solvent is contained in the first In the liquid and the second liquid, it is very advantageous to improve the unevenness after application of the photosensitive composition mixed by the above-mentioned first and second H's. The above-mentioned "initial boiling point of the distillation property" and the above "in distillation" Traits 161370.doc •17· 201239519

測定所得之值。 上述第一液亦較佳為含有二丙二醇單甲The value obtained was measured. The first liquid is also preferably containing dipropylene glycol monomethyl

上述第一液可含有二丙二醇單甲醚， 甲喊，亦可含有二乙二醇 單乙醚乙酸酯’亦可含有處於蒸餾性狀之初沸點為15〇。。以 上、處於蒸餾性狀之終沸點為29(rc以下的石腦油，亦可含 有處於蒸餾性狀之初沸點為i5〇它以上、處於蒸镏性狀之終 沸點為220 C以下的石腦油作為上述有機溶劑（E)之一部 又，上述第二液可含有二乙二醇單乙_乙酸酯，亦可含 有一丙二醇單甲喊，亦可含有處於蒸餾性狀之初沸點為 1 50 C以上、處於蒸餾性狀之終沸點為2201：以下的石腦油 作為上述有機溶劑（E)之一部分。 上述感光性組合物含有選自由二丙二醇單甲醚' 二乙二 醇單乙鱗乙酸酯' 及處於蒸餾性狀之初沸點為150°C以上、 處於蒸餾性狀之終沸點為29〇°C以下的石腦油所組成之群 中之至少兩種》 上述感光性組合物亦可含有二丙二醇單甲醚、二乙二醇 161370.doc 201239519 單乙醚乙酸酯、及處於蒸餾性狀之初沸點為150°C以上、處 於蒸餾性狀之終沸點為290。〇以下的石腦油三種。 就更加均勻地塗敷感光性組合物之觀點而言，上述感光 性組合物較佳為至少含有二丙二醇單曱醚、及二乙二醇單 乙醚乙酸酯，或者至少含有二乙二醇單乙醚乙酸酯、及處 於蒸餾性狀之初沸點為15〇。(：以上、處於蒸餾性狀之終沸點 為290°C以下的石腦油。 就更加均勻地塗敷感光性組合物之觀點而言，上述感光 性組合物較佳為至少含有二丙二醇單曱醚、及二乙二醇單 乙醚乙酸酯。此時，上述感光性組合物亦可含有處於蒸館 性狀之初彿點為15 0 °C以上、處於蒸館性狀之終彿點為 29〇t：以下的石腦油。 就更加均勻地塗敷感光性組合物之觀點而言，上述感光 性組合物較佳為至少含有二乙二醇單乙醚乙酸酯、及處於 蒸館性狀之初彿點為15 0 C以上、處於蒸館性狀之終沸點為 290°C以下的石腦油。此時，上述第一液較佳為含有二丙二 醇單曱醚。 就更加均勻地塗敷感光性組合物之觀點而言，上述感光 性組合物較佳為至少含有二丙二醇單曱醚、及處於蒸餾性 狀之初沸點為15〇t:以上、處於蒸餾性狀之終沸點為29〇〇c 以下的石腦油。此時’上述第一液亦可含有二乙二醇單乙 醚乙酸酯。 就更加均勻地塗敷感光性組合物之觀點而言，上述感光 性組合物中之處於蒸館性狀之初彿點為_以上處於蒸 161370.doc •19· 201239519 餾性狀之終沸點為290°C以下的石腦油較佳為處於蒸餾性 狀之初沸點為150°C以上、處於蒸餾性狀之終沸點為22〇〇c 以下的石腦油。 上述第一液較佳為含有選自由二丙二醇單曱醚、二乙二 醇單乙喊乙酸酯、及處於蒸镏性狀之初沸點為l5(rc以上、 處於蒸餾性狀之終沸點為29〇。〇以下的石腦油所組成之群 中之至少兩種作為上述有機溶劑（E)之一部分。此時，可進 一步提高上述第一、第二液之混合性，且可更加均勻地塗 敷感光性組合物。 上述第一液亦可含有二丙二醇單甲謎、二乙二醇單乙醚 乙酸酯、及處於蒸餾性狀之初沸點為i 50«*C以上、處於蒸餾 性狀之終沸點為290°C以下的石腦油三種作為上述有機溶 劑（E)之一部分。 上述第一液較佳為至少含有二丙二醇單曱醚、及二乙二 醇單乙醚乙酸酯，或至少含有二乙二醇單乙醚乙酸酯、及 處於蒸餾性狀之初沸點為15(TC以上、處於蒸餾性狀之終沸 點為290°C以下的石腦油作為上述有機溶劑（E)之一部分。 此時’可進一步提高上述第一、第二液之混合性，且可更 加均勻地塗敷感光性組合物。 就進一步提高上述第一、第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言，上述第一液較佳為至少 含有二丙二醇單曱醚、二乙二醇單乙醚乙酸酯作為上述有 機溶劑（E)之一部分。此時，上述第一液亦可含有處於蒸餾 性狀之初沸點為150°C以上、處於蒸餾性狀之終沸點為 161370.doc -20- 201239519 290°C以下的石腦油。 就進一步提高上述第一、第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言，上述第一液較佳為至少 含有二乙二醇單乙醚乙酸酯、及處於蒸餾性狀之初沸點為 15(TC以上、處於蒸餾性狀之終沸點為29〇它以下的石腦油 作為上述有機溶劑（E)之一部分。此時，上述第一液較佳為 含有丙二醇單甲謎。 就進一步提高上述第一、第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言’上述第一液較佳為至少 含有一丙二醇單甲醚、及處於蒸餾性狀之初沸點為i 5〇<>c以 上、處於蒸餾性狀之終沸點為290。(：以下的石腦油作為上述 有機溶劑（E)之一部分。此時，上述第一液亦可含有二乙二 醇单乙鱗乙酸醋。 就進一步提高上述第一、第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言，上述感光性組合物較佳 為含有選自由二丙二醇單曱醚'二乙二醇單乙醚乙酸酯、 及處於蒸餾性狀之初沸點為150eC以上、處於蒸餾性狀之終 沸點為220°C以下的石腦油所組成之群中之至少兩種作為 上述有機溶劑，且上述第一液中之處於蒸餾性狀之初沸點 為1 50 C以上、處於蒸館性狀之終沸點為29〇它以下的石腦 油較佳為處於蒸餾性狀之初沸點為15(TC以上、處於蒸餾性 狀之終沸點為220。(：以下的石腦油。 上述第一液亦可不含二乙二醇單乙醚乙酸酯。 上述第二液亦可含有選自由二丙二醇單曱趟、二乙二醇 161370.doc -21 · 201239519 單乙峻乙酸酯、及處於蒸餾性狀之初沸點為15(TC以上 '處 於蒸飽性狀之終沸點為220°C以下的石腦油所組成之群中 之至少兩種作為上述有機溶劑（E)之一部分。 上述第二液亦可含有二乙二醇單乙醚乙酸酯、二丙二醇 單甲越、及處於蒸餾性狀之初沸點為i 50«c以上、處於蒸潑 性狀之終沸點為22(rc以下的石腦油三種作為上述有機溶 劑（E)之一部分。 就進一步提高上述第一 '第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言，上述第二液較佳為至少 含有二乙二醇單乙醚乙酸酯、及二丙二醇單甲醚作為上述 有機溶劑（E)之一部分 '此時，上述第二液亦可含有處於蒸 餾性狀之初沸點為15〇乞以上、處於蒸餾性狀之終沸點為 220°C以下的石腦油。 就進一步提高上述第一、第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言，上述第二液較佳為至少 含有二乙二醇單乙醚乙酸酯、及處於蒸餾性狀之初沸點為 150 c以上、處於蒸餾性狀之終沸點為22〇π以下的石腦油 作為上述有機溶劑（Ε)之一部分。此時，上述第二液較佳為 含有二丙二醇單甲醚。 就進一步提高上述第一、第二液之混合性，且更加均勻 地塗敷感光性組合物之觀點而言，上述第二液較佳為至少 含有二丙二醇單甲醚、及處於蒸餾性狀之初沸點為i 5〇<>c以 上、處於蒸餾性狀之終沸點為22〇°C以下的石腦油作為上述 有機溶劑（E)之一部分。此時，上述第二液亦可含有二乙二 161370.doc •22- 201239519 醇單乙醚乙酸酯。 上述第二液亦可不含二乙二醇單乙醚乙酸酯。 有機溶劑（E)之含量並無特別限定。考慮到感光性組合物 之塗敷性，有機溶劑（E)可以適當之含量使用。混合後之感 光性組合物100重量％中，上述有機溶劑（E)之總含量（上述 有機溶劑（E1)與上述有機溶劑（E2)之合計含量）較佳為1〇重 里/◦以上，更佳為15重量％以上，較佳為6〇重量。以下更 佳為5 0重量％以下。 就使上述第一、第二液之混合性更加良好，且更加均句 地塗敷感光性組合物之觀點而言，在二液混合型之第一、 第一液整體中，包含於上述第一液中之有機溶劑（E1)之含 量與包含於上述第二液中之有機溶劑（E2)之含量以重量比 计較佳為1:99〜99]，更佳為1:9〜9:1，進而更佳為2:8〜8:2， 特佳為3:7〜7:3。換言之’於藏合後之感光性組合物中包 含於該感光性組合物中之上述有機溶劑（幻之總含量1〇〇重 量％中，包含於上述第一液中之有機溶劑（E1)之含量與包含 於上述第二液中之上述有機溶劑（E2)之含量以重量比計較 佳為1:99〜99:卜更佳為1:9〜9:卜進而更佳為2:8〜8:2，特佳 為 3:7〜7:3。 一液混&型之第一、第二液整體丨〇〇重量0/。中及混合後之 感光性組合物100重量％_，二乙二醇單乙醚乙酸酯之含量 亦可為30重量％以上。上述第一液丨〇〇重量％中二乙二醇 單乙醚乙酸酯之含量可為5〇重量％以下，亦可為“重量％以 上0 I61370.doc -23· 201239519 於上述第一液含有兩種有機溶劑之情形、以及上述第二 液含有兩種有機溶劑之情形時’在上述第一液及上述第二 液中，含量較多一方之有機溶劑之含量與含量較少一方之 有機溶劑之含量以重量比計較佳為1:99〜99:1，更佳為 1:9〜9:1，進而更佳為2:8〜8:2，特佳為3:7〜7:3。 於上述第一液含有三種有機溶劑之情形、以及上述第二 液含有三種有機溶劑之情形時，在上述第一液及上述第二 液中，含量最多之有機溶劑之含量與含量其次之有機溶劑 之含量以重量比計較佳為1:99〜99..1，更佳為1:9〜9:1，進而 更佳為2:8〜8:2 ’特佳為3:7〜7:3。此時，含量最少之有機溶 劑之含量的下限並無特別限定。 (其他成分） 為進一步提高硬化性’上述感光性組合物較佳為含有聚 合性單體作為與具有羧基之聚合性聚合物（A)不同之成 分°上述感光性組合物較佳為含有具有羧基之聚合性聚合 物（A)與聚合性單體兩者。上述聚合性單體具有聚合性可 進行聚合。上述聚合性單體並無特別限定。上述聚合性單 體可僅使用一種，亦可併用兩種以上。 上述聚合性單體較佳為含聚合性不飽和基之單體。作為 上述聚合性單體中之聚合性不飽和基，例如可列舉（甲基） 丙稀酿基及乙稀_基等具有聚合性不飽和雙鍵之官能基。 其中，為了能夠提高光阻膜之交聯密度，較佳為（曱基）丙烯 酿基》 上述含有聚合性不飽和基之單體較佳為具有（甲基）丙烯 16l370.doc • 24 · 201239519 醯基之化合物。作為上述具有（甲基）丙烯醯基之化合物，可 列舉：乙二醇、甲氧基四乙二醇、聚乙二醇或丙二醇等二 醇之二（甲基）丙烯酸酯改質物，或者多元醇、多元醇之環氧 乙烷加成物或多元醇之環氧丙烷加成物的多元（甲基）丙埽 酸酯改質物，或者苯酚、苯酚之環氧乙烷加成物或苯酚之 環氧丙烷加成物的（甲基）丙烯酸酯改質物，或者甘油二縮水 甘油鍵或二羥甲基丙炫三縮水甘油趟等縮水甘油醚之（甲 基）丙烯酸酯改質物，或者三聚氰胺（甲基）丙烯酸酯。 作為上述多元醇，例如可列舉：己二醇、三羥甲基丙烷、 季戊四醇、二季戊四醇及三-羥乙基異氰尿酸酯。作為上述 苯酚之（甲基）丙稀酸酯，例如♦可列舉苯氧基（甲基）丙烯酸酯 及雙紛A之一（甲基）丙烯酸醋改質物。 「（曱基）丙烯醯基」係指丙烯醯基與曱基丙烯醯基。「（甲 基）丙烯酸」係指丙烯酸與甲基丙烯酸。「（甲基）丙烯酸酯」 係指丙烯酸酯與甲基丙烯酸g旨。 於含有上述聚合性單體之情形時，該聚合性單體與上述 具有羧基之聚合性聚合物（A)之合計丨〇〇重量 性單體之含量較佳為5重量%以上，較佳為5。重中量= 若上述聚合性單體之含量為上述下限以上及上述上限以 下，則可使感光性組合物充分硬化。進而，光阻膜之交聯 密度達到適度，可獲得充分之解析度，且光阻膜變得難以 發生黃變。 為降低曝露於高溫時阻焊劑膜發生黃變之虞，上述感光 性組合物較佳為含有抗氧化劑。上述抗氧化劑較佳為具有 161370.doc -25- 201239519 路易斯鹼性部位。就進一步抑制光阻膜之黃變之觀點而 言，上述抗氧化劑較佳為選自由酚系抗氧化劑、磷系抗氧 化劑及胺系抗氧化劑所組成之群中之至少一種。就進一步 抑制光阻膜之黃變之觀點而言，上述抗氧化劑較佳為酚系 抗氧化劑。即，上述感光性組合物較佳為含有酚系抗氧化 劑。 作為上述酚系抗氧化劑之市售品，可列舉：IRGANOX 1010、IRGANOX 1035、IRGANOX 1076、IRGANOX 1135、 IRGANOX 245、IRGANOX 259、及 IRGANOX 295(以上均 為 Ciba Japan公司製造）、A^ekastab AO-30、Adekastab AO 40、Adekastab AO-50、Adekastab AO-60、Adekastab AO-70、 Adekastab AO-80 、 Adekastab AO-90 、及 Adekastab AO-330(以上均為 ADEKA 公司製造）、Sumilizer GA-80、 Sumilizer MDP-S、Sumilizer BBM-S、Sumilizer GM、 Sumilizer GS(F)'及Sumilizer GP(以上均為住友化學工業公 司製造）、HOSTANOX O10 ' HOSTANOX 016、HOSTANOX 014、及HOSTANOX 03(以上均為Clariant公司製造）、 Antage ΒΗΤ、Antage W-300、Antage W-400、及 Antage W-500(以上均為川口化學工業公司製造）、以及SEENOX 224M、及SEENOX 326M(以上均為 Shipro Kasei公司製造） 等。 作為上述磷系抗氧化劑，可列舉環己基膦及三苯基膦 等。作為上述磷系抗氧化劑之市售品，可列舉：Adekastab PEP-4C ' Adekastab PEP-8 ' Adekastab PEP-24G ' Adekastab 161370.doc -26- 201239519 PEP-3 6、Adekastab HP -1 0、Adekastab 2112、Adekastab 260、The first liquid may contain dipropylene glycol monomethyl ether, and may also contain diethylene glycol monoethyl ether acetate, or may have a boiling point of 15 Torr in the distillation state. . The above-mentioned naphtha having a boiling point of 29 (rc or less) may also contain naphtha having a boiling point of i5 〇 or more and a boiling point of 220 C or less. In one part of the organic solvent (E), the second liquid may contain diethylene glycol monoethyl acetate, or may contain a propylene glycol monomethyl group, or may have a boiling point of 1 50 C or more at the beginning of the distillation property. The naphtha having a boiling point of 2201: or less is one part of the organic solvent (E). The photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether 'diethylene glycol monoethyl sulphate acetate' And at least two of the group consisting of naphtha having a boiling point of 150 ° C or higher and a boiling point of 29 ° C or less at the beginning of the distillation property. The photosensitive composition may also contain dipropylene glycol. Methyl ether, diethylene glycol 161370.doc 201239519 Monoethyl ether acetate, and the boiling point at the beginning of the distillation property is 150 ° C or higher, and the final boiling point in the distillation property is 290. The naphtha below 〇 is more uniform. Ground coating From the viewpoint of the composition, the photosensitive composition preferably contains at least dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, or at least diethylene glycol monoethyl ether acetate, and The boiling point of the distillation property is 15 〇. (: The above-mentioned naphtha having a boiling point of 290 ° C or less. The photosensitive composition is more uniform from the viewpoint of uniformly applying the photosensitive composition. It is preferable to contain at least dipropylene glycol monoterpene ether and diethylene glycol monoethyl ether acetate. In this case, the photosensitive composition may contain a vaporization property of at least 150 ° C or higher, and is in a steaming hall. The final point of the character is 29 〇t: the following naphtha. The photosensitive composition preferably contains at least diethylene glycol monoethyl ether acetate from the viewpoint of more uniformly applying the photosensitive composition. And the naphtha at the beginning of the steaming property is 15 0 C or more, and the boiling point of the steaming property is 290 ° C or lower. In this case, the first liquid preferably contains dipropylene glycol monoterpene ether. More uniform application of the photosensitive composition In view of the above, the photosensitive composition preferably contains at least dipropylene glycol monoterpene ether and a naphtha having a boiling point of 15 〇t or more and a distillation boiling point of 29 〇〇c or less. In this case, the first liquid may also contain diethylene glycol monoethyl ether acetate. In view of more uniform application of the photosensitive composition, the photosensitive composition is in the early stage of the steaming property. The naphtha having a boiling point of 161370.doc •19·201239519 and having a final boiling point of 290° C. or less is preferably at a boiling point of 150° C. or higher at a boiling point of 22° C.石c The following naphtha. The first liquid preferably contains a solvent selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl acetate, and the initial boiling point of the steaming property is l5 (rc or more, The final boiling point in the distillation state is 29 〇. At least two of the group consisting of the following naphtha are part of the above organic solvent (E). At this time, the mixing property of the first and second liquids described above can be further improved, and the photosensitive composition can be applied more uniformly. The first liquid may further contain dipropylene glycol monomethyl mystery, diethylene glycol monoethyl ether acetate, and the boiling point of the distillation property is i 50 «*C or more, and the final boiling point of the distillation property is 290 ° C or less. Three kinds of naphtha are part of the above organic solvent (E). Preferably, the first liquid contains at least dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, or at least diethylene glycol monoethyl ether acetate, and has a boiling point of 15 (TC) The above-mentioned naphtha having a boiling point of 290 ° C or less is a part of the organic solvent (E). In this case, the mixing property of the first and second liquids can be further improved, and the coating can be more uniformly applied. The photosensitive composition is applied. The first liquid preferably further contains at least dipropylene glycol monoterpene ether, from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. Diethylene glycol monoethyl ether acetate is part of the above organic solvent (E). In this case, the first liquid may also contain a boiling point of 150 ° C or more, and a distillation boiling point of 161,370. Doc -20- 201239519 Naphtha of 290 ° C or less. From the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly, the first liquid is preferably Contains at least two Ethylene glycol monoethyl ether acetate and naphtha having a boiling point of 15 (TC or more and a boiling point of 29 〇 or less) as a part of the organic solvent (E). Preferably, the first liquid contains a propylene glycol monomethyl puzzle. The first liquid is preferably at least from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. It contains a propylene glycol monomethyl ether and has a boiling point of i 5 〇 <>c or more in the distillation property, and has a final boiling point of 290 in a distillation property. (: The following naphtha is used as a part of the above organic solvent (E) In this case, the first liquid may further contain diethylene glycol monoacetate vinegar. From the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly, The photosensitive composition preferably contains a solvent selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, and an initial boiling point of 150 eC or more in a distillation property and a boiling point of 220 ° C or less in a distillation property. Naphtha At least two of the formed groups are used as the organic solvent, and the naphtha having a boiling point of 1 50 C or more in the first liquid and having a final boiling point of 29 〇 or less in the steaming property is preferably The boiling point at the beginning of the distillation property is 15 (TC or more, and the final boiling point of the distillation property is 220. (: the following naphtha. The first liquid may not contain diethylene glycol monoethyl ether acetate. The second The liquid may also contain a solvent selected from the group consisting of dipropylene glycol monoterpene, diethylene glycol 161370.doc -21 · 201239519 monoethyl acetate, and the boiling point of the distillation character is 15 (TC above 'the final boiling point of the saturated character) At least two of the group consisting of naphtha of 220 ° C or less are used as a part of the above organic solvent (E). The second liquid may also contain diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl, and the boiling point of the distillation property is i 50 «c or more, and the final boiling point of the steaming property is 22 (rc or less). Three kinds of naphtha are part of the above organic solvent (E). The second liquid is preferably a viewpoint of further improving the miscibility of the first 'second liquid and applying the photosensitive composition more uniformly. At least diethylene glycol monoethyl ether acetate and dipropylene glycol monomethyl ether are included as part of the organic solvent (E). In this case, the second liquid may contain a boiling point of 15 〇乞 or more at the beginning of the distillation property. a naphtha having a boiling point of 220 ° C or less. The second liquid is further improved from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. It is preferably a part of the above organic solvent (Ε) which contains at least diethylene glycol monoethyl ether acetate and a naphtha having a boiling point of 150 c or more and a boiling point of 22 〇 π or less. .at this time The second liquid preferably contains dipropylene glycol monomethyl ether. From the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly, the second liquid is preferably a naphtha containing at least dipropylene glycol monomethyl ether and having a boiling point of i 5 〇 <>c or higher and having a boiling point of 22 〇 ° C or less as the organic solvent (E) In this case, the second liquid may also contain diethyl 161370.doc • 22-201239519 alcohol monoethyl ether acetate. The second liquid may also be free of diethylene glycol monoethyl ether acetate. The content of the organic solvent (E) may be appropriately used in consideration of the coating property of the photosensitive composition. The total amount of the above organic solvent (E) in 100% by weight of the photosensitive composition after mixing. The content (the total content of the above organic solvent (E1) and the above organic solvent (E2)) is preferably 1 Torr or more, more preferably 15% by weight or more, more preferably 6 Å by weight. More preferably 5 0 or less. Less than or equal to the weight. The organic solvent contained in the first liquid in the first and first liquids of the two-liquid mixing type is preferable from the viewpoint of more excellent mixing property of the two liquids and more uniform application of the photosensitive composition ( The content of E1) and the content of the organic solvent (E2) contained in the second liquid are preferably 1:99 to 99], more preferably 1:9 to 9:1, and still more preferably 2 by weight. : 8 to 8:2, particularly preferably 3:7 to 7:3. In other words, the above-mentioned organic solvent (the total content of the magical substance) contained in the photosensitive composition in the photosensitive composition after the collection. In the % by weight, the content of the organic solvent (E1) contained in the first liquid and the content of the organic solvent (E2) contained in the second liquid are preferably 1:99 to 99 by weight: Good for 1:9~9: Bu and then better for 2:8~8:2, especially good for 3:7~7:3. The first and second liquids of one liquid mixture & type have a total weight of 0/. The content of the photosensitive composition after mixing and mixing may be 30% by weight or more, and the content of diethylene glycol monoethyl ether acetate may be 30% by weight or more. The content of diethylene glycol monoethyl ether acetate in the first liquid helium weight% may be 5% by weight or less, or may be "% by weight or more. 0 I61370.doc -23 · 201239519 in the first liquid contained above In the case of two kinds of organic solvents, and in the case where the second liquid contains two kinds of organic solvents, 'the organic solvent having a smaller content of the organic solvent in the first liquid and the second liquid The content is preferably from 1:99 to 99:1, more preferably from 1:9 to 9:1, still more preferably from 2:8 to 8:2, particularly preferably from 3:7 to 7:3, by weight. In the case where the first liquid contains three kinds of organic solvents, and the second liquid contains three kinds of organic solvents, the content of the organic solvent having the highest content in the first liquid and the second liquid is the next organic solvent. The content is preferably 1:99 to 99..1, more preferably 1:9 to 9:1, and still more preferably 2:8 to 8:2 by weight ratio: particularly preferably 3:7 to 7:3. In this case, the lower limit of the content of the organic solvent having the lowest content is not particularly limited. (Other components) To further improve the curability, the above-mentioned photosensitivity The polymerizable monomer preferably contains a polymerizable monomer as a component different from the polymerizable polymer (A) having a carboxyl group. The photosensitive composition preferably contains a polymerizable polymer (A) having a carboxyl group and a polymerizable monomer. The polymerizable monomer is polymerizable and can be polymerized. The polymerizable monomer is not particularly limited, and the polymerizable monomer may be used alone or in combination of two or more. The monomer having a polymerizable unsaturated group. Examples of the polymerizable unsaturated group in the polymerizable monomer include a functional group having a polymerizable unsaturated double bond such as a (meth) acrylonitrile group and a vinyl group. In order to increase the crosslinking density of the photoresist film, it is preferred that the monomer having a polymerizable unsaturated group has a (meth) propylene group of 16l370.doc • 24 · 201239519 A compound of a mercapto group. Examples of the compound having a (meth)acrylinyl group include a di(methyl) group of a glycol such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol or propylene glycol. Acrylate modification Or a poly(meth)propionate modification of a polyol, an ethylene oxide adduct of a polyol or a propylene oxide adduct of a polyhydric alcohol, or an ethylene oxide adduct of phenol or phenol Or a (meth) acrylate modification of a propylene oxide adduct of phenol, or a (meth) acrylate modification of a glycidyl ether such as glycerol diglycidyl bond or dimethylol propyl triglycidyl hydrazine, Or melamine (meth) acrylate. Examples of the polyhydric alcohol include hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, and tris-hydroxyethyl isocyanurate. The acrylic acid ester, for example, ♦ may be exemplified by phenoxy (meth) acrylate and bis(A) methacrylate acrylate. "(Indenyl) propylene sulfhydryl" means propylene fluorenyl and fluorenyl fluorenyl. "(Meth)acrylic acid" means acrylic acid and methacrylic acid. "(Meth)acrylate" means acrylate and methacrylic acid. In the case where the polymerizable monomer is contained, the content of the polymerizable monomer and the polymerizable polymer having a carboxyl group (A) is preferably 5% by weight or more, preferably 5. Heavy medium amount = When the content of the above polymerizable monomer is at least the above lower limit and not more than the above upper limit, the photosensitive composition can be sufficiently cured. Further, the crosslink density of the photoresist film is moderate, and sufficient resolution can be obtained, and the photoresist film becomes less likely to cause yellowing. In order to reduce yellowing of the solder resist film when exposed to high temperatures, the above photosensitive composition preferably contains an antioxidant. The above antioxidant preferably has a Lewis basic moiety of 161370.doc -25 - 201239519. In view of further suppressing the yellowing of the photoresist film, the antioxidant is preferably at least one selected from the group consisting of a phenolic antioxidant, a phosphorus antioxidant, and an amine antioxidant. The antioxidant is preferably a phenolic antioxidant from the viewpoint of further suppressing yellowing of the photoresist film. That is, the photosensitive composition preferably contains a phenolic antioxidant. As a commercial item of the above-mentioned phenolic antioxidant, IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, IRGANOX 245, IRGANOX 259, and IRGANOX 295 (all of which are manufactured by Ciba Japan Co., Ltd.), A^ekastab AO- 30. Adekastab AO 40, Adekastab AO-50, Adekastab AO-60, Adekastab AO-70, Adekastab AO-80, Adekastab AO-90, and Adekastab AO-330 (all of which are manufactured by ADEKA), Sumilizer GA-80, Sumilizer MDP-S, Sumilizer BBM-S, Sumilizer GM, Sumilizer GS(F)' and Sumilizer GP (all manufactured by Sumitomo Chemical Industries, Ltd.), HOSTANOX O10 'HOSTANOX 016, HOSTANOX 014, and HOSTANOX 03 (all of which are Clariant Manufactured by the company, Antage ΒΗΤ, Antage W-300, Antage W-400, and Antage W-500 (all manufactured by Kawaguchi Chemical Industry Co., Ltd.), and SEENOX 224M, and SEENOX 326M (all manufactured by Shipro Kasei Co., Ltd.) . Examples of the phosphorus-based antioxidant include cyclohexylphosphine and triphenylphosphine. As a commercial item of the above-mentioned phosphorus-based antioxidant, Adekastab PEP-4C 'Adekastab PEP-8 ' Adekastab PEP-24G ' Adekastab 161370.doc -26- 201239519 PEP-3 6. Adekastab HP -1 0, Adekastab 2112 Adekastab 260,

Adekastab 522A、Adekastab 1178、Adekastab 1500、 Adekastab C、Adekastab 135A、Adekastab 3010、及 Adekastab TPP(以上均為ADEKA公司製造）、Sandostab P-EPQ、及 Hostanox PAR24(以上均為ciariant公司製造）、以及 JP-312L、JP-318-0、JPM-3 08、JPM-313、JPP-613M、JPP-3 卜 JPP-2000PT、及JPH-3800(以上均為城北化學工業公司製造） 等。 作為上述胺系抗氧化劑’可列舉：三乙胺、雙氰胺、三 聚氰胺、乙基二胺基-均三，井、2,4_二胺基_均三p井、2,4-二 胺基-6-甲笨基-均三畊、2,4_二胺基_6•二甲苯基-均三畊及 四級銨鹽衍生物等。 '返，、有羧基之聚合性聚合物（A) 100重量份，上 述抗氧化劑之含量較佳為〇1重量份以上更佳為5重量份 以上，較佳為30重量份以下，更佳為15重量份以下。若上 述抗氧化劑之含量為上述下限以上及上限以下，則可形成 耐熱黃變性更加優異之光阻膜。 又’上述感光性組合物亦可含㈣色劑、填充劑、消泡 斑疮更^硬化加速劑、脫模劑、表面處理劑、阻燃劑、 黏度調節劑、分散劑、分啬 刀散助劑、表面改質劑、塑化劑、 抗菌劑、防黴劑、調平劑、 ^^ 構疋劑、偶合劑、防流掛劑或 , 舐尤性組合物例如可藉由在攪抖 後’利用三輥研磨機均勻地混合而製備 161370.doc •27- 201239519 作為用以使上述感光性組合物硬化之光源，可列舉發出 紫外線或可見光線等活性能量射線之照射裝置。作為上述 光源’例如可列舉.：超高壓水銀燈、Deep UV燈（Deep Ultraviolet lamp ’深紫外線燈）、高壓水銀燈、低壓水銀燈、 金屬齒化物燈及準分子雷射器《該等光源可根據感光性組 合物之構成成分的感光波長進行適當選擇。光之照射能量 可根據所需膜厚或感光性組合物之構成成分進行適當選 擇。光之照射能量一般在10〜3〇〇〇 mJ/cm2之範圍内。 (LED裝置） 本發明之二液混合型之第一、第二液適宜用於形成led 裝置之光阻膜，更適宜用於形成阻焊劑膜。本發明之二液 混合型之第一、.第二液較佳為光阻組合物，更佳為阻焊劑 組合物。 本發明之印刷佈線板之製造方法係如下印刷佈線板之製 造方法，該印刷佈線板包含表面具有電路之印刷佈線板本 體、及積層於該印刷佈線板本體之設置有上述電路之表面 的光阻膜。該光阻膜係藉由本發明之二液混合型之第一、 第一液所形成。 圖1係模式地表示包含阻焊劑膜之LED裝置之一例的部 分切缺正面剖面圓，該阻焊劑膜係使用本發明之一實施形 態的二液混合型之第一、第二液而形成。 於如圖1所示之LED裝置1中，於基板2之上表面2a積層有 光阻膜3，該光阻膜3係藉由二液混合型之第一、第二液所 形成。光阻膜3為圖案膜。因此，基板2之上表面2&之一部 161370.doc -28- 201239519 ft域中未形成有光阻膜3。於未形成有光阻膜3之部分的 之上表面2a上设置有電極4a、4b。基板2較佳為印刷 佈線板本體。 於光阻膜3之上表面33上積層有LED晶片7。led晶片7介 隔光阻膜3而積層於基板2上。於LED晶片7之下表面？3之外 周緣設置有端^a、8b。藉由焊錫9a、9b，使端仏、此 電性連接於電極4a、4b。藉由該電性連接，可向LED晶片7 供給電力。 、下藉由列舉本發明之具體的實施例及比.較例，令本發 明簡明易懂。本發明不限定於以下實施例。 實施例及比較例中使用以下材料丨）〜〗8): 1)丙烯酸系聚合物1(具有羧基之聚合性聚合物，藉由下 述合成例1所得之丙烯酸系聚合物” (合成例1) 向具有溫度計、攪拌機、滴液漏斗及回流冷凝器之燒瓶 内加入作為溶劑之乙基卡必醇乙酸酯、及作為觸媒之偶氮 二異丁腈，於氮氣環境下加熱至80t，花兩小時滴加以莫 耳比30:70混合甲基丙烯酸與甲基丙烯酸甲酯所得之單 體。滴加之後’攪拌一小時，升溫至12(TC ^其後，將其冷 卻。以相對於所得樹脂之全部單體單元之總莫耳量之莫耳 比成為10的量添加丙烯酸縮水甘油酯，使用漠化四丁基錢 作為觸媒，於100 C下加熱3 0小時’使丙稀酸縮水甘油酯與 羧基進行加成反應。冷卻後，自燒瓶取出，得到含有固形 物成分酸值為60 mg KOH/g、重量平均分子量為15〇〇〇、雙 161370.doc •29- 201239519 鍵當量為1000之含叛基樹脂50重量％(不揮發分）之溶液。以 下將該溶液稱作丙稀酸系聚合物1。 2) 丙烯酸系聚合物2(具有羧基之聚合性聚合物，藉由下 述合成例2所得之丙烯酸系聚合物2) (合成例2) 於乙基卡必醇乙酸酯139重量份中，使用作為觸媒之二甲 基节胺0.5重量份、及作為聚合抑制劑之對苯二酚〇1重量 份，使環氧當量為210、軟化點為80eC之甲酚酚醛清漆型環 氧樹脂（「Epotohto YDCN-704」，新曰鐵化學公司製造）21〇 重量份與丙烯酸50重量份及乙酸18重量份反應，獲得環氧 丙稀酸醋。使所得之環氧丙烯酸酯278重量份與四氫鄰苯二 甲酸肝46重量份（相對於環氧丙烯酸酯之羥基莫耳，為 0.3莫耳）反應’得到含有固形物成分酸值為52 mg K〇H/g之 具有芳香環之含羧基樹脂65重量。/〇(不揮發分）的溶液。以下 將該溶液稱作丙烯酸系聚合物2。 3) DPHA(丙烯酸系單體’二季戊四醇六丙稀酸酯，比重 1.1) 4) TMPTA(丙烯酸系單體，三羥曱基丙烷三丙烯酸酯’比 重 1.1) 5) TPO(光自由基產生劑即光聚合起始劑，basF Japan公 司製造） 6) Irgacure 819(光自由基產生劑即光聚合起始劑，BASF Japan公司製造） 7) 828(雙酚A型環氧樹脂，三菱化學公司製造，比重丨2) 161370.doc 201239519 8) 806(雙酚F型環氧樹脂’三菱化學公司製造，比重1.2) 9) CR-50(氧化鈦，石原產業公司製造，藉由氣化法所製 造之金紅石型氧化鈦） 10) R-830(氧化鈦，石原產業公司製造，藉由硫酸法所製 造之金紅石型氧化鈦） 11) 乙基卡必醇乙酸酯（二乙二醇單乙醚乙酸酯，Daicel Chemical公司製造，偶極矩1 Debye(德拜）以上，比重1.0) 12) Solvesso 150(石腦油，Exxon Mobil公司製造，處於 蒸餾性狀之初沸點189°C、處於蒸餾性狀之終沸點210。〇 13) Solvesso 100(石腦油，Exxon Mobil公司製造，處於 蒸餾性狀之初沸點165°C、處於蒸餾性狀之終沸點174°C) 14) 二丙二醇單甲醚（日本乳化劑公司製造）； 15) 二丙二醇二甲醚（日本乳化劑公司製造） 16) 二乙二醇二乙醚（日本乳化劑公司製造） 17) Solvesso 200(石腦油，Exxon Mobil公司製造，處於 蒸餾性狀之初沸點230乞、處於蒸餾性狀之終沸點283。(：） 18) 甲苯（Exxon Mobil公司製造）。 (實施例1) 調配由合成例1所得之丙烯酸系聚合物1、DPHA(二季戊 四醇六丙稀酸酯）5 g、TPO(光自由基產生劑即光聚合起始 劑，BASF Japan公司製造）2 g、CR-50(氧化鈦，石原產業公 司製造）40 g、及Solvesso 150(石腦油，Exxon Mobil公司製 造）25 g，於混合機（練太郎SP-500，Thinky公司製造）中混 合3分鐘之後，在三輥研磨機中混合，得到混合物。其後， 161370.doc •31 - 201239519 使用S P - 5 0 0，對所借3»、β人 吓传之混合物進行3分鐘消泡處理，藉此得 到第一液。 調配828(雙紛A型環氧樹脂，三菱化學公司製造）8 g、及 乙基卡必醇乙酸酿（二乙二醇單乙醚乙酸酯，Daicel Chemical么司製造）5 g，於混合機（練太郎sp 5〇〇，Thinky 公司製造）中混合3分鐘之後，在三輥研磨機中混合，得到 混。物《其後，使用Sp_5〇〇，對所得之混合物進行3分鐘消 泡處理’藉此得到第二液。 以如上所述之方法’準備含有第一、第二液之二液混合 型之感光性組合物。 (實施例2〜49、參考例丨〜丨丨及比較例丨〜19) 對第一液及第二液中所使用之材料之種類及調配量作如 下述表1〜8所示之變更，除此以外，以與實施例1相同之方 法得到含有第一、第二液之二液混合型之第一、第二液（混 合前之感光性組合物）。 (評價） 二液之混合性： 將第一液與第二液加入1 L之圓形塑膠容器（近畿容器公 司製造’ BHS-1200)中，藉由Mesh公司製造之自動油墨授 拌器’製備以50rpm攪拌10秒而成之光阻材料（混合後之感 光性組合物）。將第一液與第二液加入1 L之圓形塑膠容器 (近畿容器公司製造，BHS-1200)中，藉由Mesh公司製造之 自動油墨攪拌器，製備以50 rpm攪拌20秒而成之光阻材料 (混合後之感光性組合物）。將第一液與第二液加入1 L之圓 161370.doc -32· 201239519 形塑膠容器（近畿容器公司製造，bhs_1200)中，藉由Mesh 公司製造之自動油墨攪拌器，製備W50rpm攪拌^分鐘而成 之光阻材料（混合後之感光性組合物）。進而，將第一液與第 二液加入1 L之圓形塑膠容器（近畿容器公司製造， BHS-1200)中，藉由Mesh公司製造之自動油墨攪拌器，製 備以50 rpm攪拌5分鐘而成之光阻材料（混合後之感光性組 合物）。 又，準備於表面貼附有銅箔之1〇〇xl〇〇 mm之FR 4基板。 藉由絲網印刷，將剛完成攪拌後之光阻材料塗佈於上述 FR-4基板之貼附有銅箔之面，從而形成光阻材料層。以肉 眼觀察基板上之光阻材料層之外觀。 以下述判定標準判定第一、第二液之混合性。 [第一 '第二液之混合性之判定標準] A :於使用攪拌10秒而成之光阻材料、攪拌2〇秒而成之光 阻材料、㈣！分鐘而成之光阻材料及麟5分鐘而成之光 阻材料中任一種之情形時，光阻材料層都均勻 B.於使用攪拌1〇秒而成之光阻材料之情形時在光阻材 料層上見到少量條狀之不均，但於使用攪拌2〇秒而成之光 阻材料、搜拌1分鐘而成之光阻材料及㈣5分鐘而成之光 阻材料之情形時，光阻材料層均勻 C於使用攪拌丨〇秒而成之光阻材料及攪拌秒而成之光 阻材料之情科，在光阻材料層上見到少量條狀之不均， 但於使用授拌i分鐘而成之光阻材料及攪拌5分鐘而成之光 阻材料之情形時，光阻材料層均勻 161370.doc -33· 201239519 D··於使用攪拌ίο秒而成之光阻材料、攪拌2〇秒而成之光 阻材料及攪拌1分鐘而成之光阻材料之情形時，在光阻材料 層上見到少量條狀之不均，於使用攪拌5分鐘而成之光阻材 料之情形時，光阻材料層均勻 E .於使用攪拌10秒而成之光阻材料、攪拌2〇秒而成之光 阻材料、攪拌1分鐘而成之光阻材料及攪拌5分鐘而成之光 阻材料中任一種之情形時，均於光阻材料層上見到條狀之 不均 將結果示於下述表1〜8。下述表1〜8中，所調配之液體之 類別中之「（1)」表示第一液，「（2)」表示第二液。再者， 對上述第一、第二液之混合性進行評價後，藉由使基板上 之光阻材料層硬化，可獲得光阻膜。 I61370.doc 34· 201239519 實施例8 V» <s oo ο ΙΓί m <s CQ 痪 /•"S «w* S i<-s s /—S δ >··<·> 參考例3 申4 «Λ rs 00 ο »η CN «/> CQ 賅 /—N /"S /-N δ S 實施例7 •1 ΙΛ *rt fN oo ο «η CS \η CQ 联 'w· S s δ Β <·—Ν δ I實施例6 | W <4〇 V» »Λ <S 00 ο ·〇 »Γ» <Ν QQ 联 y—\ /-s δ **->· δ 實施例5 申（ *n «M u-» <s 00 ο Ο «η ν> < 联 s δ tmm i^S δ 1參考例2 1 W W> m <N 00 ο ν> (S »η CQ 联 /—s <—V 3 S 1實施例4 »r> ^m4 *rt <N 00 ο »η (Ν QQ 联 /—S 3 S 3 X—Ν |實施例3 v> w-> fS 00 ο \η V"> <Ν QQ 联 /••s v·^ y—1 3 δ /-Ν 參考例1 1 m V*> «Λ <N 00 ο «Λ fS *Γ> m 联 B ε S <—Ν δ 實施例2 I Μ W> rs 00 ο »Λ CS ν> CQ 联 «s <—✓ *-s /—s δ <«—S /—s, S—/ S 實施例1 | W w> V> fS 00 ο *Λ ν> <Ν OQ 寂 s»/ /—s 3 «—S δ 類別：所調配之液體之類別 I丙烯酸系聚合物丨 1 DPHA I 〇 S 00 CR-50 I 二乙二酵單乙醚乙酸酯 Solvesso 150 Solvesso 100 二丙二醇單甲醚 二丙二酵二甲醚 二乙二酵二乙醚 Solvesso 200 6- l两烯酸系聚合物| 丙烯酸系單體 先聚合起始剤 環氧化合物 氧化鈦 效 二液之混合性 踩运噠Φ 3 St ¢5 161370.doc ·35· 201239519 16l370.doc 比較例6 Φ4 ♦ m (N 00 ο CN ω 黩 Ν Ν—✓ /—S /—N S δ /—S 比較例5 Φ4 <(r〇 ^Τ) »™Η 的 (N 00 Ο iT) <N w 戡 /-—S S—✓ /—N /—S δ /—Ν δ /*™S 比較例4 ♦1 <n CN 00 Ο in (Ν <η ω »κτ> /—Ν N /*-S /—S f-H Ν δ 比較例3 ♦1 <η … CS 00 Ο (Ν m ω 英 m •Rr\ /—ν /—S S /—S /—Ν δ (Ν φ4 1〇 (N 00 Ο m CN iTi ω 窥 英 m mr> /—Ν Nw^ /—N /—N δ /—s >w^ δ r-H Φ4 *4〇 in to CS 00 Ο ir> (Ν in ω 窥 戡 »·Η Sw/ /^s /—S R /—S Nw^ /—S δ 類別：所調配之液體之類別 丙烯酸系聚合物1 DPHA 〇 Η 00 CN 00 CR-50 二乙二醇單乙醚乙酸酯 Solvesso 150 Solvesso 100 二丙二醇單曱醚 二丙二醇二甲醚 二乙二醇二乙謎 Solvesso 200 Β- 丙烯酸系聚合物 丙烯酸系單體 光聚合起始劑 環氧化合物 氧化钦 二液之混合性 踩揾噠Φ 3 t ^ ·36· 201239519 1實施例16 I 1〇 CN 00 § in *rt fS U 联 S δ 3 S 5 1參考例6 1 ΦΊ <N 〇0 ο »r> <N *n υ 联 ^-Ν δ δ ι-'s »*-s δ 1實施例丨5 Μ *n w-> fS 00 ο v> <N •Λ U 联 (»—S P^H 'W* N δ 3 δ |實施例14 ! IBM »Λ (N 00 ο «η V> iN υ 媒 S ί—s s δ S 3 |實施例13 ! «W *n ν*> <N 00 ο o *n in QQ 鞣 N»/ δ δ /*s δ |參考例5 | »4 CS 00 ο <s *η U 联 δ g S |實施例12 | m w-i CN 00 ο v> (N υ 英 媒 •M /-S δ δ δ J·^ |實施例11 | •W v> m <S 00 ο *Ti v> <N ο 联 ·—* \ 3 δ s <<—s V-»» 1參考例4 1 m *r> W1 <N 00 ο *n fS in υ 联 /*N <*-s s δ /—s δ 1實施例ίο! *w V) m PM 00 ο *rt fS W) υ 寂 <»*s δ 3 -·*·>· SmC δ 1實施例9 1 «Λ *η fS 00 ο v> rs υ 联 /—s WM Β δ S /~s s 類別：所調配之液體之類別 |丙烯酸系聚合物l l |dpha 1 o CU 00 [CR-50 1 二乙二醇單乙醚乙酸酯 Solvesso ISO Solvesso 100 二丙二酵單甲醚 1二丙二醇二甲醚 1 1二乙二酵二乙醚 | I Solvesso 200 | $4 &- tv l丙烯酸系聚合物1 1丙烯酸系單體 1 |先聚合起始剤 1 1環氧化合物 1 1氧化鈦 1 Έ 效 二液之混合性 st esAdekastab 522A, Adekastab 1178, Adekastab 1500, Adekastab C, Adekastab 135A, Adekastab 3010, and Adekastab TPP (all manufactured by ADEKA), Sandostab P-EPQ, and Hostanox PAR24 (all manufactured by ciariant), and JP- 312L, JP-318-0, JPM-3 08, JPM-313, JPP-613M, JPP-3, JPP-2000PT, and JPH-3800 (all of which are manufactured by Chengbei Chemical Industry Co., Ltd.). Examples of the above-mentioned amine-based antioxidants include triethylamine, dicyandiamide, melamine, ethyldiamine-s-tri-, well, 2,4-diamino-s-tri-p, 2,4-diamine. Base-6-methyl stupid-average three-till, 2,4-diamino- 6-xylyl--three-till and quaternary ammonium salt derivatives. The content of the antioxidant is preferably 〇1 part by weight or more, more preferably 5 parts by weight or more, more preferably 30 parts by weight or less, more preferably 30 parts by weight or more. 15 parts by weight or less. When the content of the above antioxidant is not less than the above lower limit and not more than the upper limit, a photoresist film which is more excellent in heat yellow resistance can be formed. Further, the above photosensitive composition may further comprise (four) coloring agent, filler, antifoam plaque, hardening accelerator, mold release agent, surface treatment agent, flame retardant, viscosity modifier, dispersant, and splitting knife Auxiliaries, surface modifiers, plasticizers, antibacterial agents, antifungal agents, leveling agents, emollients, coupling agents, anti-sagging agents, or sputum compositions, for example, can be stirred Then, the mixture is uniformly mixed by a three-roll mill to prepare 161370.doc. 27-201239519 As a light source for curing the photosensitive composition, an irradiation device that emits an active energy ray such as ultraviolet rays or visible rays is exemplified. As the light source, for example, an ultrahigh pressure mercury lamp, a Deep UV lamp (Deep Ultraviolet lamp), a high pressure mercury lamp, a low pressure mercury lamp, a metal toothed lamp, and a quasi-molecular laser can be cited. The photosensitive wavelength of the constituent components of the composition is appropriately selected. The irradiation energy of light can be appropriately selected depending on the desired film thickness or the constituent components of the photosensitive composition. The irradiation energy of light is generally in the range of 10 to 3 〇〇〇 mJ/cm 2 . (LED device) The first liquid and the second liquid of the two-liquid mixing type of the present invention are suitably used for forming a photoresist film of a LED device, and are more suitably used for forming a solder resist film. The first liquid and the second liquid of the two-liquid mixing type of the present invention are preferably a photoresist composition, more preferably a solder resist composition. A method of manufacturing a printed wiring board according to the present invention is a method of manufacturing a printed wiring board comprising a printed wiring board body having a circuit on a surface thereof, and a photoresist laminated on a surface of the printed wiring board main body on which the circuit is provided membrane. The photoresist film is formed by the first liquid and the first liquid of the two-liquid mixing type of the present invention. Fig. 1 is a view schematically showing a partially cut front cross-sectional circle of an example of an LED device including a solder resist film formed by using a first liquid and a second liquid of a two-liquid mixing type according to one embodiment of the present invention. In the LED device 1 shown in Fig. 1, a photoresist film 3 is formed on the upper surface 2a of the substrate 2, and the photoresist film 3 is formed by a first liquid and a second liquid of a two-liquid mixing type. The photoresist film 3 is a pattern film. Therefore, the photoresist film 3 is not formed in one of the upper surface 2 & 161370.doc -28 - 201239519 ft domain of the substrate 2. Electrodes 4a, 4b are provided on the upper surface 2a of the portion where the photoresist film 3 is not formed. The substrate 2 is preferably a printed wiring board body. An LED wafer 7 is laminated on the upper surface 33 of the photoresist film 3. The led wafer 7 is laminated on the substrate 2 via the photoresist film 3. On the lower surface of the LED chip 7? Outside the 3, there are terminals ^a, 8b. The ends 9 and 9b are electrically connected to the electrodes 4a and 4b by solders 9a and 9b. By this electrical connection, electric power can be supplied to the LED chip 7. The present invention will be understood by the following detailed description of the embodiments of the invention and the preferred embodiments. The invention is not limited to the following examples. In the examples and the comparative examples, the following materials were used: 〗) 8): 1) Acrylic polymer 1 (polymerizable polymer having a carboxyl group, the acrylic polymer obtained in the following Synthesis Example 1) (Synthesis Example 1) To a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, ethyl carbitol acetate as a solvent and azobisisobutyronitrile as a catalyst were heated to 80 t under a nitrogen atmosphere. The monomer obtained by mixing methacrylic acid with methyl methacrylate at a molar ratio of 30:70 was added for two hours. After the addition, the mixture was stirred for one hour and heated to 12 (TC ^ thereafter, which was cooled. The molar ratio of the total molar amount of all the monomer units of the obtained resin to 10 was added to the amount of glycidyl acrylate, and the use of desertified tetrabutyl hydride as a catalyst was heated at 100 C for 30 hours to make acrylic acid. The glycidyl ester is subjected to an addition reaction with a carboxyl group, and after cooling, it is taken out from the flask to obtain an acid value of a solid content of 60 mg KOH/g, a weight average molecular weight of 15 Å, and a double 161370.doc •29-201239519 bond equivalent. 50 weight of recalcitrant resin containing 1000 A solution of % (non-volatile). Hereinafter, this solution is referred to as an acrylic polymer 1. 2) Acrylic polymer 2 (a polymerizable polymer having a carboxyl group, the acrylic acid obtained by the following Synthesis Example 2) Polymer 2) (Synthesis Example 2) 139 parts by weight of ethyl carbitol acetate, 0.5 parts by weight of dimethyl ketamine as a catalyst, and weight of hydroquinone hydrazine 1 as a polymerization inhibitor A cresol novolac type epoxy resin ("Epotohto YDCN-704", manufactured by Shinkai Iron Chemical Co., Ltd.) having an epoxy equivalent of 210 and a softening point of 80 eC, 21 parts by weight and 50 parts by weight of acrylic acid and 18 parts by weight of acetic acid. The reaction was carried out to obtain a propylene glycol acrylate, and 278 parts by weight of the obtained epoxy acrylate was reacted with 46 parts by weight of tetrahydrophthalic acid liver (0.3 mol relative to hydroxymole of epoxy acrylate). 'A solution containing 65 wt./〇 (nonvolatile) of a carboxyl group-containing resin having an aromatic component having an acid value of 52 mg K〇H/g. This solution is hereinafter referred to as an acrylic polymer 2. 3 DPHA (acrylic monomer 'dipentaerythritol hexaacrylate, specific gravity 1.1) 4) TMPTA (acrylic monomer, trihydroxymethane propane triacrylate 'specific gravity 1.1) 5) TPO (photopolymerization initiator, photopolymerization initiator, manufactured by basF Japan) 6) Irgacure 819 (light) A free radical generator, a photopolymerization initiator, manufactured by BASF Japan) 7) 828 (bisphenol A epoxy resin, manufactured by Mitsubishi Chemical Corporation, specific gravity 丨 2) 161370.doc 201239519 8) 806 (bisphenol F ring Oxygen resin 'Mitsubishi Chemical Co., Ltd., specific gravity 1.2) 9) CR-50 (titanium oxide, rutile-type titanium oxide manufactured by Ishihara Sangyo Co., Ltd., manufactured by gasification method) 10) R-830 (titanium oxide, Ishihara industry) Made of rutile type titanium oxide manufactured by the sulfuric acid method) 11) Ethyl carbitol acetate (diethylene glycol monoethyl ether acetate, manufactured by Daicel Chemical Co., Ltd., Dipole moment 1 Debye (Debye) Above, the specific gravity is 1.0) 12) Solvesso 150 (naphtha, manufactured by Exxon Mobil Co., Ltd., has a boiling point of 189 ° C at the beginning of the distillation property and a final boiling point 210 of the distillation property. 〇13) Solvesso 100 (naphtha, manufactured by Exxon Mobil, at a boiling point of 165 ° C at the beginning of the distillation state, at a final boiling point of 174 ° C in the form of distillation) 14) Dipropylene glycol monomethyl ether (manufactured by Nippon Emulsifier Co., Ltd.); 15) Dipropylene glycol dimethyl ether (manufactured by Nippon Emulsifier Co., Ltd.) 16) Diethylene glycol diethyl ether (manufactured by Nippon Emulsifier Co., Ltd.) 17) Solvesso 200 (naphtha, manufactured by Exxon Mobil Co., Ltd., at the initial boiling point of the distillation property 230乞, at the final boiling point of the distillation property 283. (:) 18) Toluene (manufactured by Exxon Mobil Co., Ltd.). (Example 1) 5 g of DPMA (dipentaerythritol hexaacrylate) obtained by Synthesis Example 1 and TPO (photopolymerization initiator which is a photoradical generator, manufactured by BASF Japan Co., Ltd.) were prepared. 2 g, CR-50 (titanium oxide, manufactured by Ishihara Sangyo Co., Ltd.) 40 g, and Solvesso 150 (naphtha, manufactured by Exxon Mobil Co., Ltd.) 25 g, mixed in a mixer (Kyotaro SP-500, manufactured by Thinky Co., Ltd.) After 3 minutes, it was mixed in a three-roll mill to obtain a mixture. Thereafter, 161370.doc •31 - 201239519 Using S P - 500, the mixture of the borrowed 3» and β people was defoamed for 3 minutes to obtain the first liquid. 828 (double-type A-type epoxy resin, manufactured by Mitsubishi Chemical Corporation) 8 g, and ethyl carbitol acetic acid (diethylene glycol monoethyl ether acetate, manufactured by Daicel Chemical Co., Ltd.) 5 g, in a mixer (Lintaro sp 5〇〇, manufactured by Thinky Co., Ltd.) was mixed for 3 minutes, and then mixed in a three-roll mill to obtain a mixture. "Subsequently, the resulting mixture was subjected to a 3 minute defoaming treatment using Sp_5 ’" to thereby obtain a second liquid. The photosensitive composition containing the two-liquid mixing type of the first and second liquids was prepared in the same manner as described above. (Examples 2 to 49, Reference Example 丨丨 丨丨 and Comparative Example 丨 19) The types and the amounts of the materials used in the first liquid and the second liquid were changed as shown in the following Tables 1 to 8. Otherwise, the first and second liquids (photosensitive compositions before mixing) containing the two-liquid mixing type of the first and second liquids were obtained in the same manner as in Example 1. (Evaluation) Mixing of two liquids: The first liquid and the second liquid were added to a 1 L round plastic container (manufactured by Kinki Container Co., Ltd. 'BHS-1200), and prepared by an automatic ink agitator manufactured by Mesh Corporation. A photoresist (mixed photosensitive composition) obtained by stirring at 50 rpm for 10 seconds. The first liquid and the second liquid were placed in a 1 L round plastic container (manufactured by Kinki Container Co., Ltd., BHS-1200), and the light was stirred at 50 rpm for 20 seconds by an automatic ink agitator manufactured by Mesh Corporation. Resistive material (photosensitive composition after mixing). The first liquid and the second liquid were added to a 1 L round 161370.doc -32·201239519 plastic container (manufactured by Kinki Container Co., Ltd., bhs_1200), and the W50 rpm was stirred for 2 minutes by an automatic ink agitator manufactured by Mesh Corporation. A photoresist material (a photosensitive composition after mixing). Further, the first liquid and the second liquid were placed in a 1 L round plastic container (manufactured by Kinki Container Co., Ltd., BHS-1200), and prepared by stirring at 50 rpm for 5 minutes by an automatic ink agitator manufactured by Mesh Corporation. Photoresist material (photosensitive composition after mixing). Further, an FR 4 substrate of 1 〇〇 x 10 mm was attached to the surface of the copper foil. The photoresist material immediately after the completion of the agitation was applied to the surface of the FR-4 substrate to which the copper foil was attached by screen printing to form a photoresist layer. The appearance of the photoresist layer on the substrate was visually observed. The miscibility of the first and second liquids was determined by the following criteria. [Criteria for judging the miscibility of the first 'second liquid' A: A photoresist material obtained by stirring for 10 seconds, a photoresist material obtained by stirring for 2 sec., (4)! In the case of any one of the photoresist material and the photoresist material of 5 minutes, the photoresist layer is uniform. B. In the case of using a photoresist material which is stirred for 1 second, the photoresist is used. A small amount of unevenness is seen on the material layer, but when using a photoresist material which is stirred for 2 seconds, a photoresist material which is mixed for 1 minute, and (4) a photoresist material which is made of 5 minutes, light The resistive layer is evenly C. The photoresist is made of a photoresist material which is stirred for a few seconds and a photoresist material which is stirred for a second. A small amount of strips is unevenly observed on the photoresist layer, but the use of the blender is used. When the photoresist material is made of i minutes and the photoresist material is stirred for 5 minutes, the photoresist layer is uniform. 161370.doc -33· 201239519 D··The photoresist material is stirred and stirred using ίο sec. In the case of a photoresist material of 2 sec. and a photoresist material which is stirred for 1 minute, a small amount of unevenness is observed on the photoresist layer, and the photoresist material is formed by stirring for 5 minutes. In the case, the photoresist layer is uniform E. The photoresist is made by stirring for 10 seconds, stirring 2〇 When the photoresist material is formed, the photoresist material is stirred for 1 minute, and the photoresist material is stirred for 5 minutes, the unevenness of the strip is observed on the photoresist layer. In the following Tables 1 to 8. In the following Tables 1 to 8, "(1)" in the category of the liquid to be formulated indicates the first liquid, and "(2)" indicates the second liquid. Further, after evaluating the miscibility of the first and second liquids, a photoresist film can be obtained by curing the photoresist layer on the substrate. I61370.doc 34· 201239519 Embodiment 8 V» <s oo ο ΙΓί m <s CQ 痪/•"S «w* S i<-ss /-S δ >··<·> Example 3 Shen 4 «Λ rs 00 ο »η CN «/> CQ 赅/—N /"S /-N δ S Example 7 •1 ΙΛ *rt fN oo ο «η CS \η CQ 联'w · S s δ Β <·-Ν δ I Example 6 | W <4〇V» »Λ <S 00 ο ·〇»Γ» <Ν QQ y_\ /-s δ **- >· δ Example 5 申( *n «M u-» <s 00 ο Ο «η ν>< s δ δ tmm i^S δ 1 Reference Example 2 1 W W> m <N 00 ο ν> (S » η CQ 联 / - s < - V 3 S 1 Embodiment 4 » r > ^m4 * rt < N 00 ο » η (Ν QQ 联 / - S 3 S 3 X Ν | implementation Example 3 v>w-> fS 00 ο \η V"><Ν QQ 联/••sv·^ y-1 1 δ /-Ν Reference Example 1 1 m V*> «Λ <N 00 ο «Λ fS *Γ> m 联B ε S < —Ν δ Example 2 I Μ W> rs 00 ο »Λ CS ν> CQ 联«s <-✓ *-s /-s δ <«-S /-s, S_/ S Example 1 | W w >V> fS 00 ο *Λ ν><Ν OQ Silence s»/ /—s 3 «—S δ Category: Type of liquid to be formulated I Acrylic polymer 丨1 DPHA I 〇S 00 CR- 50 I Diethylene glycol monoethyl acetate Solvesso 150 Solvesso 100 Dipropylene glycol monomethyl ether Dipropylene glycol dimethyl ether Diethylene glycol diacetate Solvesso 200 6- l two olefinic polymer | Acrylic monomer first Mixing start 剤Epoxy compound TiO 2 effect mixed treading 哒Φ 3 St ¢5 161370.doc ·35· 201239519 16l370.doc Comparative example 6 Φ4 ♦ m (N 00 ο CN ω 黩Ν Ν—✓ /—S /—NS δ /—S Comparative Example 5 Φ4 <(r〇^Τ) »TMΗ (N 00 Ο iT) <N w 戡/--SS—✓ /—N /—S δ /—Ν δ /*TMS Comparative Example 4 ♦1 <n CN 00 Ο in (Ν <η ω »κτ> /—Ν N /*-S /—S fH Ν δ Comparative Example 3 ♦1 <η ... CS 00 Ο (Ν m ω 英 m •Rr\ /—ν /—SS /—S /—Ν δ (Ν φ4 1〇(N 00 Ο m CN iTi ω m mr> /—Ν Nw^ /—N /—N δ /—s >w^ δ rH Φ4 *4〇in to CS 00 Ο ir> (Ν in ω 戡 戡 »·Η Sw/ /^s / —SR /—S Nw^ /—S δ Category: Liquids to be formulated Acrylic Polymer 1 DPHA 〇Η 00 CN 00 CR-50 Diethylene glycol monoethyl ether acetate Solvesso 150 Solvesso 100 Dipropylene glycol monoterpene Ether dipropylene glycol dimethyl ether diethylene glycol diethylene glycol Solvesso 200 Β - acrylic polymer acrylic monomer photopolymerization initiator epoxy compound oxidized two liquid mixed helium Φ 3 t ^ · 36 · 201239519 1 Embodiment 16 I 1〇CN 00 § in *rt fS U Union S δ 3 S 5 1 Reference Example 6 1 Φ Ί <N 〇0 ο »r><N *n υ 联^-Ν δ δ ι -'s »*-s δ 1 embodiment 丨5 Μ *n w-> fS 00 ο v><N •Λ U 联 (»—SP^H 'W* N δ 3 δ | Example 14 ! IBM »Λ (N 00 ο «η V> iN S Media S ί ss δ S 3 | Example 13 ! «W *n ν*><N 00 ο o *n in QQ 鞣N»/ δ δ /*s δ |Reference Example 5 | »4 CS 00 ο <s *η U 联δ g S |Example 12 | m wi CN 00 ο v> (N英英媒•M /-S δ δ δ J·^ |Example 11 | •W v> m <S 00 ο *Ti v><N ο 联··· \ 3 δ s <<- s V-»» 1 Reference Example 4 1 m *r> W1 <N 00 ο *n fS in υ 联 /*N <*-ss δ /−s δ 1 Example ίο! *w V) m PM 00 ο *rt fS W) 寂 Silence <»*s δ 3 -·*·>· SmC δ 1 Example 9 1 «Λ *η fS 00 ο v> rs υ 联/-s WM Β δ S / ~ss Category: Liquids to be formulated | Acrylic Polymers ll |dpha 1 o CU 00 [CR-50 1 Diethylene glycol monoethyl ether acetate Solvesso ISO Solvesso 100 Dipropylene glycol monomethyl ether 1 dipropyl Diol dimethyl ether 1 1 diethylene glycol diethyl ether | I Solvesso 200 | $4 &- tv l Acrylic polymer 1 1 Acrylic monomer 1 | First polymerization starting 剤 1 1 Epoxy compound 1 1 Titanium oxide 1 Έ effect two liquid mixture st es

161370.doc 37- 201239519 1實施例24 1 Φ4 伞 VT) m fN 00 ο *n rs U 联 S /*-V /·—\ δ 3 δ y—> 1參考例9 | in μ •Λ (N 00 ο m «Ν w*» U 联 V /—-s /—s δ S ·«—s Q I實施例23 1 >N φ »n (N 00 ο V> fS w-> U 應 s /—V 3 S --"s 3 1實施例22 | *Ti <N οο ο m v> iN U /<—S δ δ δ s I實施例21 | «Η <4〇 •ΛΙ in (N 00 ο ο W) tn CQ 菝 /—s 3 δ y«s δ 1參考例8 | <n W*i fS 00 ο W) fS CJ 联 /—s y\ 3 δ y~s δ I實施例20 | vn »Λ fS 00 ο IT) »n <N υ 联 /•N δ 3 s z-s 1實施例19 | •N v> »n (N 00 ο W> (N υ 菝 /*~N S 3 δ /·—> 1參考例7 1 Φ4 »n «/*> <N 00 ο w-> (Ν vn u 联 s /—S /~N S S δ 實施例18 Φ4 in V> rs 00 ο v> <Ν V) u 联 /*S /—s S S ·<*« s 1實施例17 | m •Λ m (N 00 ο W"> fS u /—s /·-s δ δ δ 類別：所調配之液«之類別 1丙烯酸系聚合物丨 1 |DPHA | o & S 00 |CR-50 1 二乙二酵單乙瞇乙酸酯 Solvesso 150 Solvesso 100 二丙二酵單甲醚 1二丙二酵二甲踺 1 |二乙二酵二乙醚 I I Solvesso 200 | l丙烯酸系聚合物 | |丙烯酸系單體 I |光聚合起始射 1 1環氡化合物 1 1氡化鈦 丨 I 二液之混合性 S ^ ^ Φ s St «5 161370.doc 38- 201239519 1比較例π 1 V» v> (Ν 00 ο m W) CS Q 联 δ δ δ δ 1比較例16 *Λ <Ν 00 ο *Λ fS Q 鞔 s s δ δ δ ί—V δ |比較例15 ! Μ V> «μ *n <Ν 00 ο «Λ> <Ν «Γί Q 賅 wmm S S δ δ |比較例14 «η «η ίΝ 00 ο u-> fS Ο S /—s δ δ 3 δ |比較例13 I *4 *Ti »Λ <Ν 00 ο Ο »η «η Q 菝 y*S S δ S Ν δ |比較例12 I m *Λ »Γ» (Ν 00 ο m (Ν ν> Q 痪 /—V w /—S δ δ δ S |比較例11! «η »Λ <Ν 00 ο »Λ »η CS Q 睡 ys S δ 3 δ s y-> |比較例10 in ν> CS 00 ο w> ν-ί <S Q 联 8 ε δ δ δ δ * |比較例9 Φ4 Vi V% fS 00 ο »Λ (S •rt Q 駭 \ S δ 3 ί—Ν δ |比較例8 H *n *η η 00 Ο W» fS «Λ α 联 8 δ 3 3 /--V 3 |比較例71 Μ «η iS 00 Ο »η m <Ν Q 堞 ε δ δ 3 δ 8 類別：所調配之液體之類別 l丙烯酸系聚合物丨 l |DPHA 1 Ο & S 00 |CR-50 1 二乙二醇單乙醚乙酸酯 Solvesso 150 Solvesso 100 二丙二酵單甲醚 1二丙二醇二甲6| 1 ι二乙二酵二乙醚 1 I Solvesso 200 | ¢4 故 X 1丙烯酸系聚合物 | 1丙烯酸系單體 ι 1光聚合起始剤 1 1環氧化合物 1 1氡化鈦 1 1 二液之混合性 郓《哒Φ3 St S? I61370.doc 39- 201239519 比較例19 φϊ 'Λ <N 00 ο ο Q 騷 S /—S 3 δ δ S^/ ^™s δ 比較例18 ΚΤί <N 00 ο … CS Q 駿 /·—S N δ δ δ 0 |參考例11 | … CM 00 Ο wn in Ο CQ 戡 /—Ν /*"~S S δ δ /—V I參考例ι〇| φ| φ» V) (N οο ο *Ti CN in U 媒 /—«V Nw/ ^™s V 3 δ /-~N 3 |實施例28 I φ! yn CN 00 ο in ο 0Q 媒 /—Ν /<—-V y—N δ 3 /—N /-"S δ |實施例27 | 的 CS 00 ο 的 CN W-i U 駿 /—Ν >*«✓ /—N /*N δ 3 g |實施例26 | Φ4 V» CS 00 ο Ο 0Q 媒 /—Ν >w^ δ δ /—V /—N /-^ \m0/ δ |實施例25 | 咖 in cs 00 Ο KTi (N U 媒 /—S /"s δ δ /-'Ν /-*N δ 類別：所調配之液體之類別 丙烯酸系聚合物1 DPHA o 00 (S 00 CR-50 二乙二醇單乙醚乙酸酯 Solvesso 150 Solvesso 100 二丙二醇單甲醚 二丙二醇二甲醚 二乙二醇二乙謎 Solvesso 200 $4 6- 丙烯酸系聚合物 丙烯酸系單體 光聚合起始劑 環氧化合物 氧化鈦 w 二液之混合性 st ^ 161370.doc -40- 201239519 1實施例39 1 %r> v*> <N 00 ο ο «Λ (Ν tr> «Λ ri < <<-N /—s s y—v ε δ S S 1實施例38 m 如 «Λ »Λ (N 00 Ο Ο w» (Ν *n ri < 睡 s /—s 8 δ ε S /·—> δ 實施例37 j νι·Ν *rt fN 00 ο «λ <Ν Ο Wi w*> fS < 联 S s i*S s δ /-ν /«— S |實施例36 | ir> <N 00 ο V) Ψ-Λ Ο «η <S w> (S < 鞔 /"κ ^•s δ S δ δ |實施例35 | Μ *〇 «Λ CS 00 ο *η »r> <Ν ο «/> (N < 媒 <—s £ 3 £ S δ 實施例34 m *n in fN 00 ο ο Vi «Λ < 嵌 s y~s s V S 丨實施例33 1 Φ4 •n r4 00 ο ο V> V) < 联 s i»*"S 3 ί<—S g 丨實施例32 | m *n *n <s 00 ο ο »Λ < 鞔 y—s S s |實施例31 Ψ1 w·) m fS 00 ο Ο in < «—· s s ί-'· Κ—V δ 1實施例30 m w> »n fS 00 ο \η ο »Γ> < 联 /"K MM >W^ y—s /—s δ ί—S /-> ί—V 3 I實施例29 | •W 如 v> *n CS oo ο ο < 联 y—\ i—v 8 /—S <«—Ν Sm^1 s 類別：所調配之液體之類別 |丙烯酸系聚合物l 1 |DPHA | 〇 s 00 |CR-50 1 二乙二醇單乙醚6酸酯 Solvesso 150 Solvesso 100 二丙二醇單甲醚 |二丙二酵二甲醚 i 1二乙二醇二乙醚 | 1 Solvesso 200 I ¢4 ¢- tv w 1丙烯酸系聚合物 | I丙烯酸系單體 1 |光聚合起始剤 _J 1環氧化合物 1 1氧化鈦 1 s 二液之混合性 踩运够Φ s29 5t «5 161370.doc • 41 · 201239519 161370.doc 1實施例49 1 W 咖 <s 00 ο »Λ 〇 •η < 联 /»—V >w/ /—S Sm/ /*N s /—s /—* s_«> δ 1實施例48 1 <4〇 vn u-> <N 00 ο Ο < 联 s /"S /*·«· «Μ s /—> >w< δ 1實施例47 | to W> fs 00 ο »n o < 賅 /—s /—> /—s s /*Ν /^1 /·—« >w> S 1實施例46 | in *Ti 00 ο *n o ν-> < 賅 s >w/ /-N /"s s Νμ»1 'W S 丨實施例45 | Μ •φι *Tt m (N oo ο o νΊ < 媒 /—"N s /«—**, VH δ 實施例44 •W *〇 <N 00 ο o v> < 菝 S»/ '•w/ /—N «Μ Nw»1 δ s /*S S_>> s δ I實施例43 | Μ »Τΐ u-> ΓΊ 00 ο i〇 o \r\ iTi < 联 Sm·* /—«> N»/ δ δ /—» /"s δ 實施例42 «Λ <N 00 ο *n o *n \η < 联 /~\ >W> i»"S s /*>. >w δ /—s δ 1實施例41 1 «W w-> CM 00 ο ir> o »n < 寂 /«—V s_</ /*v δ /"* >»/ S δ 1實施例401 »Λ <N oo ο «Λ o V~i «λ < 联 s δ δ /•"s S 類別：所调配之液體之類別 丙烯酸系聚合物1 丙烯酸系聚合物2 iDPHA | Itmpta I o On S 3 00 <N 00 若 00 ICR-50 1 [R-830 I 二乙二醇單乙鍵乙酸酯 Solvesso 150 Solvesso 100 二丙二酵單甲醚 二丙二醇二甲鍵 二乙二醇二乙醚 Solvesso 200 | δ- 丙烯酸系聚合物 丙烯酸系單體 光聚合起始劑 環氧化合物 氧化鈦 钕 二液之混合性 踩超嗜令3 t s? • 42· 201239519 再者，雖然實施例5、實施例29及實施例33之二液混合性 之s平價結果均為「A」，但與實施例3 3相比，實施例5及實施 例2 9於更短之時間内均勻地混合感光性組合物。雖然實施 例3 0、實施例3 1及實施例3 4之二液混合性之評價結果均為 「A」，但與實施例34相比，實施例3〇及實施例31於更短之 時間内均勻地混合感光性組合物。雖然實施例3 5、實施例 37及實施例39之二液混合性之評價結果均為「a」，但與實 施例39相比’實施例35及實施例37於更短之時間内均句灿 混合感光性組合物。 【圖式簡單說明】 圖1係模式地表示包含阻焊劑膜之LED裝置之一例的部 分切缺正面剖面圖，該阻焊劑膜使用本發明之一實施形一 的二液混合型之第一、第二液。 4 【主要元件符號說明】 1 LED裝置 2 基板 2a 上表面 3 光阻膜 3a 上表面 4a、4b 電極 7 LED晶片 7a 下表面 8a、8b 端子 9a、9b 焊錫 161370.doc • 43·161370.doc 37- 201239519 1Example 24 1 Φ4 Umbrella VT) m fN 00 ο *n rs U Union S /*-V /·-\ δ 3 δ y—> 1 Reference Example 9 | in μ •Λ ( N 00 ο m «Ν w*» U 联 V / - s / - s δ S · « - s QI embodiment 23 1 > N φ » n (N 00 ο V > fS w-> U should s /—V 3 S --"s 3 1 Embodiment 22 | *Ti <N οο ο m v> iN U /<-S δ δ δ s I Example 21 | «Η <4〇•ΛΙ In (N 00 ο ο W) tn CQ 菝/—s 3 δ y«s δ 1 Reference Example 8 | <n W*i fS 00 ο W) fS CJ 联 /—sy\ 3 δ y~s δ I Example 20 | vn »Λ fS 00 ο IT) »n <N υ 联/•N δ 3 s zs 1 Example 19 | •N v> »n (N 00 ο W> (N υ 菝/*~ NS 3 δ /·-> 1 Reference Example 7 1 Φ4 »n «/*><N 00 ο w-> (Ν vn u s / -S /~NSS δ Example 18 Φ4 in V> Rs 00 ο v><Ν V) u联/*S / -s SS ·<*« s 1 Example 17 | m •Λ m (N 00 ο W"> fS u /—s /·-s δ δ δ Category: formulated liquid « Category 1 Acrylic Polymer 丨1 | DPHA | o & S 00 |CR-50 1 Diethylene glycolate monoacetate Solvesso 150 Solvesso 100 Dipropylene glycol monomethyl ether 1 dipropylene dialdehyde踺1 | Diethylenediamine diethyl ether II Solvesso 200 | l Acrylic polymer | | Acrylic monomer I | Photopolymerization initiation 1 1 氡 氡 compound 1 1 氡 丨 丨 二 I mixed solution S ^ ^ Φ s St «5 161370.doc 38- 201239519 1Comparative example π 1 V» v> (Ν 00 ο m W) CS Q δ δ δ δ 1 Comparative Example 16 *Λ <Ν 00 ο *Λ fS Q鞔ss δ δ δ ί—V δ |Comparative Example 15 ! Μ V> «μ *n <Ν 00 ο «Λ><Ν «Γί Q 赅wmm SS δ δ |Comparative Example 14 «η «η ίΝ 00 ο u-> fS Ο S /—s δ δ 3 δ | Comparative Example 13 I *4 *Ti »Λ <Ν 00 ο Ο »η «η Q y*SS δ S Ν δ |Comparative Example 12 I m *Λ »Γ» (Ν 00 ο m (Ν ν> Q 痪/—V w /−S δ δ δ S |Comparative Example 11! «η »Λ <;Ν 00 ο »Λ »η CS Q sleepys S δ 3 δ s y-> |Comparative example 10 in ν> CS 00 ο w> ν-ί <SQ joint 8 ε δ δ δ δ * | 9 Φ4 Vi V% fS 00 ο »Λ (S •rt Q 骇\ S δ 3 ί—Ν δ |Comparative Example 8 H *n *η η 00 Ο W» fS «Λ α 联8 δ 3 3 /-- V 3 |Comparative Example 71 Μ «η iS 00 Ο »η m <Ν Q 堞ε δ δ 3 δ 8 Category: Class of liquid to be formulated l Acrylic polymer 丨l |DPHA 1 Ο & S 00 | CR-50 1 Diethylene glycol monoethyl ether acetate Solvesso 150 Solvesso 100 Dipropylene glycol monomethyl ether 1 dipropylene glycol dimethyl 6 | 1 ι diethylene glycol diethyl ether 1 I Solvesso 200 | ¢ 4 Therefore X 1 acrylic acid Polymer | 1 Acrylic monomer ι 1 Photopolymerization start 剤 1 1 Epoxy compound 1 1 Titanium telluride 1 1 Mixed solution of two liquids 哒 "哒Φ3 St S? I61370.doc 39- 201239519 Comparative Example 19 φϊ 'Λ <N 00 ο ο Q Sa S / - S 3 δ δ S^/ ^TMs δ Comparative Example 18 ΚΤί <N 00 ο ... CS Q Jun / · SN δ δ δ 0 |Reference Example 11 | ... CM 00 Ο wn in Ο CQ 戡/—Ν /*"~SS δ δ /—VI Reference example ι〇| φ| φ» V) (N οο ο *Ti CN in U medium/—«V Nw/ ^TMs V 3 δ /-~N 3 |Example 28 I φ! yn CN 00 ο in ο 0Q Medium / Ν /<--V y-N δ 3 /—N /-"S δ | Example 27 | CS 00 ο CN Wi U Jun / - Ν > * «✓ / - N / * N δ 3 g | Example 26 | Φ4 V» CS 00 ο Ο 0Q medium / - Ν > w ^ δ δ / -V / - N / - ^ \m0 / δ | Example 25 | coffee in cs 00 Ο KTi (NU media / -S /"s δ δ /-'Ν /-*N δ Category: The type of liquid to be formulated Acrylic polymer 1 DPHA o 00 (S 00 CR-50 Diethylene glycol monoethyl ether acetate Solvesso 150 Solvesso 100 II Glycol monomethyl ether dipropylene glycol dimethyl ether diethylene glycol diacetal Solvesso 200 $4 6- Acrylic polymer acrylic monomer photopolymerization initiator epoxy compound titanium oxide w two liquid mixture st ^ 161370. Doc -40- 201239519 1 Embodiment 39 1 %r>v*><N 00 ο ο «Λ (Ν tr> «Λ ri <<<-N /-ssy_v ε δ SS 1 implementation Example 38 m such as «Λ »Λ (N 00 Ο Ο w» (Ν *n ri < sleep s / -s 8 δ ε S /·-> δ Example 37 j νι·Ν *rt fN 00 ο « λ <Ν Ο Wi w*> fS < 联 S si*S s δ /-ν /«− S | Example 36 | ir><N 00 ο V) Ψ-Λ Ο «η <S w> (S <鞔/"κ ^•s δ S δ δ |Example 35 | Μ *〇«Λ CS 00 ο *η »r><Ν ο «/> (N < media &lt ;s £ 3 £ S δ Example 34 m *n in fN 00 ο ο Vi «Λ < embedded sy~ss VS 丨Example 33 1 Φ4 •n r4 00 ο ο V> V) < union si» *"S 3 ί<-S g 丨Example 32 | m *n *n <s 00 ο ο »Λ < 鞔y_s S s |Example 31 Ψ1 w·) m fS 00 ο Ο in < «- · ss ί-'· Κ-V δ 1 embodiment 30 m w> »n fS 00 ο \η ο »Γ><union/"K MM >W^ y-s /-s δ ί-S /-> ί—V 3 I Example 29 | •W as v> *n CS oo ο ο < y y—\ i—v 8 /—S <«—Ν Sm^1 s Category: Provisioned Type of liquid | Acrylic polymer l 1 |DPHA | 〇s 00 |CR-50 1 Diethylene glycol monoethyl ether 6 ester Solvesso 150 Solvesso 100 Dipropylene glycol monomethyl ether | Dipropylene glycol dimethyl ether i 1 Diethylene glycol diethyl ether | 1 Solvesso 200 I ¢4 ¢- tv w 1 acrylic polymer | I acrylic monomer 1 | photopolymerization starting 剤_J 1 epoxy compound 1 1 titanium oxide 1 s two liquid Mixed treading enough Φ s29 5t «5 161370.doc • 41 · 201239519 161370.doc 1 Example 49 1 W Coffee <s 00 ο »Λ 〇•η < 联/»—V >w/ /— S Sm / / * N s / - s / - * s_« > δ 1 embodiment 48 1 <4〇vn u-><N 00 ο Ο < s s /"S /*·«· «Μ s /—>>w< δ 1 Embodiment 47 | to W> fs 00 ο »no < 赅/—s /—> /—ss /*Ν /^1 /·—« >w> S 1 Embodiment 46 | in *Ti 00 ο *no ν->< 赅s >w/ /-N /"ss Νμ»1 'WS 丨Example 45 | Μ •φι *Tt m (N oo ο o νΊ < media / -"N s /«—**, VH δ Example 44 •W *〇<N 00 ο o v>< 菝S»/ '•w/ /- N «Μ Nw»1 δ s /*S S_>> s δ I Example 43 | Μ »Τΐ u-> ΓΊ 00 ο i〇o \r\ iTi < 联Sm·* /—«> N»/ δ δ /—» /"s δ Example 42 «Λ <N 00 ο *no *n \η < 联/~\ >W>i»"S s /*>. >w δ /−s δ 1 Example 41 1 «W W-> CM 00 ο ir> o »n < silence/«—V s_</ /*v δ /"* >»/ S δ 1 embodiment 401 »Λ <N oo ο «Λ o V~i «λ < s s δ δ /•"s S Category: Liquids to be formulated Acrylic polymer 1 Acrylic polymer 2 iDPHA | Itmpta I o On S 3 00 <N 00 If 00 ICR-50 1 [R-830 I diethylene glycol monoethyl acetate acetate Solvesso 150 Solvesso 100 dipropylene glycol monomethyl ether dipropylene glycol dimethyl glycol diethylene glycol diethyl ether Solvesso 200 | δ- acrylic polymer Acrylic Monomer Photopolymerization Initiator Epoxy Compound Titanium Oxide Two Liquid Mixing Treading Super Fungus 3 ts? • 42· 201239519 Furthermore, although the two liquid mixtures of Example 5, Example 29 and Example 33 were mixed The results of the parity of the properties were all "A", but in comparison with Example 3, the photosensitive compositions were uniformly mixed in a shorter period of time than in Example 5 and Example 29. Although the evaluation results of the two liquid mixtures of Example 30, Example 31 and Example 34 were "A", Example 3 and Example 31 were compared in a shorter time than Example 34. The photosensitive composition was uniformly mixed inside. Although the evaluation results of the two liquid mixtures of Example 35, Example 37 and Example 39 were all "a", compared with Example 39, 'Example 35 and Example 37 were in a shorter period of time. Can mix the photosensitive composition. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially cutaway front cross-sectional view showing an example of an LED device including a solder resist film, which uses the first two-liquid mixing type of the first embodiment of the present invention. The second liquid. 4 [Description of main component symbols] 1 LED device 2 Substrate 2a Upper surface 3 Photoresist film 3a Upper surface 4a, 4b Electrode 7 LED chip 7a Lower surface 8a, 8b Terminal 9a, 9b Solder 161370.doc • 43·

Claims (1)

201239519 七、申請專利範圍： 1. 一種一液混合型之第一、第二液，其係用以獲得作為混 合物之感光性組合物者，該二液混合型之第一第二液 係混合該第一、第二液之前之液體， . 由上述第一、第二液混合而成之混合物即感光性組合 物整體包含具有羧基之聚合性聚合物、光聚合起始劑、 具有環狀醚基之化合物、氧化鈦及有機溶劑， 上述感光性組合物含有選自由二丙二醇單甲謎、二乙 二醇單乙喊乙酸醋、及處於蒸餾性狀之初沸點為15〇<)(：以 上、處於蒸餾性狀之終沸點為29〇。〇以下的石腦油所組成 之群中之至少兩種作為上述有機溶劑， 上述第一液含有上述聚合性聚合物，且含有選自由二 丙二醇單甲醚、二乙二醇單乙醚乙酸酯、及處於蒸餾性 狀之初沸點為1 50°C以上、處於蒸餾性狀之終沸點為 290 C以下的石腦油所組成之群中之至少一種作為上述 有機溶劑之一部分， 上述第二液含有上述具有環狀醚基之化合物，且含有 選自由一乙二醇單乙驗乙酸酿、二丙二醇單甲趟、及處 . 於蒸館性狀之初沸點為15 〇 °c以上、處於蒸銷性狀之終彿 點為220°c以下的石腦油所組成之群中之至少一種作為 上述有機溶劑之一部分， 上述第一液含有上述光聚合起始劑或含有上述氧化 欽’或者含有上述光聚合起始劑與上述氧化鈦兩者， 於上述第一液不含上述光聚合起始劑之情形時，上述 161370.doc 201239519 第二液含有上述光聚合起始劑，於上述第一液不含上述 氧化鈦之情形時，上述第二液含有上述氧化鈦。 2.如請求項1之二液混合型之第一、第二液，其令上述第一 液含有選自由二丙二醇單曱醚、二乙二醇單乙醚乙酸 及處於蒸顧性狀之初沸點為15 0。〇以上、處於蒸趨性 狀之終沸點為290t以下的石腦油所組成之群中之至少 兩種作為上述有機溶劑之一部分。 3·如請求項1之二液混合型之第一、第二液，其中上述第一 液至少含有二丙二醇單甲醚與二乙二醇單乙醚乙酸酯， 或者至〉'含有二乙二醇單乙謎乙酸酯與處於蒸銷性狀之 初沸點為15〇t以上、處於蒸餾性狀之終沸點為29(rc以 下的石腦油作為上述有機溶劑之一部分。 4.如請求項1之二液混合型之第一、第二液，其中上述第一 液至3有一丙一醇單甲崎與處於蒸潑性狀之初彿點為 150 c以上、處於蒸餾性狀之終沸點為29〇〇c以下的石腦 油作為上述有機溶劑之一部分。 5·如凊求項1之二液混合型之第一、第二液，其中上述感光 性組合物含有選自由二丙二醇單曱醚、二乙二醇單乙趟 乙酸醋、及處於蒸餾性狀之初沸點為l5〇〇c以上、處於蒸 德性狀之終沸點為22〇〇c以下的石腦油所組成之群中之 至少兩種作為上述有機溶劑， 上述第一液含有選自由二丙二醇單甲醚、二乙二醇單 乙謎乙酸醋、及處於蒸餾性狀之初沸點為150eC以上、處 於蒸館性狀之終沸點為22〇〇c以下的石腦油所組成之群 161370.doc -2 - 201239519 中之至少兩種作為上述有機溶劑之一部分。 6. 如請求項1之二液混合型之第一、第二液，其中上述感光 性組合物含有選自由二丙二醇單曱醚、二乙二醇單乙醚 乙酸自θ、及處於蒸顧性狀之初彿點為15〇°c以上、處於蒸 館性狀之終沸點為220°C以下的石腦油所組成之群中之 至夕兩種作為上述有機溶劑， 上述第一液含有二丙二醇單甲醚與二乙二醇單乙峻乙 酸醋’或者至少含有二乙二醇單乙醚乙酸酯與處於蒸铜 性狀之初沸點為150°C以上、處於蒸餾性狀之終沸點為 220 C以下的石腦油作為上述有機溶劑之一部分。 7. 如請求項1之二液混合型之第一、第二液，其中上述感光 性組合物含有選自由二丙二酵單曱醚、二乙二醇單乙鱗 乙酸醋、及處於蒸餾性狀之初沸點為15〇«c以上、處於蒸 顧性狀之終沸點為22(rc以下的石腦油所組成之群中之 至少兩種作為上述有機溶劑， 上述第一液至少含有二丙二醇單甲醚與處於蒸餾性狀 之初沸點為150°C以上、處於蒸餾性狀之終沸點為22〇。〇 以下的石腦油作為上述有機溶劑之一部分。 8. 如請求項1至7中任一項之二液混合型之第一、第二液’ 其中上述第一液含有上述光聚合起始劑。 9·如請求項1至7申任一項之二液混合型之第一、第二液， 其中上述第一液含有上述氧化鈦。 10.如請求項1至7中任一項之二液混合型之第一、第二液， 其中上述第一液含有上述光聚合起始劑與上述氧化鈦兩 161370.doc 201239519 者。 項之二液混合型之第一、第二液， 二液混合而成之感光性組合物為阻 11.如請求項1至7中任一 其中由上述第一、第 焊劑組合物。 12. -種印刷佈線板之製造方法，其係製造包含於表面具有 電路之印刷佈線板本體、及積層於該印刷佈線板本體之 設置有電路之表面的阻焊劑膜之印刷佈線板之方法，該 製造方法包括下述步驟： 混合第一、第二液，獲得由上述第一、第二液混合而 成之阻焊劑組合物即感光性組合物， 在於表面具有電路《印刷佈線板本體之設置有電路的 表面上塗敷由上述第—、第二液混合而成之阻焊劑組合 :即感光性組合物’形成積層於上述印刷佈線板本體之 °又置有上述電路之表面的阻焊劑膜，且 由上述第一、第二液混合而成之阻焊劑組合物即感光 性組合物整體包含具錢基之聚合性聚合物、光聚合起 始劑、具有環狀醚基之化合物、氧化鈦及有機溶劑， 上述感光性組合物含有選自由二丙二醇單甲醚、二乙 一醇單乙醚乙酸酯、及處於蒸餾性狀之初沸點為15〇1以 上、處於蒸餾性狀之終沸點為29〇〇c以下的石腦油所組成 之群中之至少兩種作為上述有機溶劑， 上述第一液含有上述聚合性聚合物，且含有選自由二 丙二醇單甲⑽、二乙二醇單㈣乙酸醋、及處於蒸顧性 狀之初沸點為150°C以上、處於蒸餾性狀之終沸點為 161370.doc 201239519 290 C以下的石腦油所組成之群中之至少一種作為上述 有機溶劑之一部分， 上述第二液含有上述具有環狀醚基之化合物，且含有 選自由二乙二醇單乙醚乙酸酯、二丙二醇單甲醚、及二 於蒸館性狀之初沸點以上、處於蒸餾性狀之終彿 點為220°C以下的石腦油所組成之群中之至少一種作為 上述有機溶劑之一部分， 上述第一液含有上述光聚合起始劑或含有上述氧化 鈦，或者含有上述光聚合起始劑與上述氧化鈦兩者， 於上述第一液不含上述光聚合起始劑之情形時，上述 第二液含有上述光聚合起始劑，於上述第一液不含上述 氧化鈦之情形時’上述第二液含有上述氧化鈦。 方法，其中上述第一液 乙二醇單乙醚乙酸酯、 13.如請求項12之印刷佈線板之製造 含有選自由二丙二醇單甲醚、二 及處於蒸餾性狀之初沸點為1501以上、處於蒸德性狀之 終沸點為290°C以下的石腦油所組成之群中之至少兩種 作為上述有機溶劑之一部分。 14. 如請求項12之印刷佈線板之製造方法，其中上述第一液 至少含有二丙二醇單曱謎與二乙二醇單乙醚乙酸酯，或 者至少含有二乙二醇單乙乙酸醋與處於蒸餾性狀之初 彿點為15 0 C以上、處於蒸德性狀之終彿點為2 9 〇 以下 的石腦油作為上述有機溶劑之一部分。 15. 如請求項12之印刷佈線板之製造方法，其中上述第一液 至少含有二丙二醇單曱鱗與處於蒸館性狀之初沸點為 161370.doc 201239519 150°C以上、處於蒸餾性狀之終沸點為29〇。〇以下的石腦 油作為上述有機溶劑之一部分。 16. 如請求項12之印刷佈線板之製造方法，其中上述感光性 組合物含有選自由二丙二醇單甲喊、二乙二醇單乙趟乙 酸酯、及處於蒸餾性狀之初沸點為150°c以上、處於蒸顧 性狀之終ί弗點為220 C以下的石腦油所組成之群中之至 少兩種作為上述有機溶劑， 上述第一液含有選自由二丙二醇單甲醚、二乙二醇單 乙醚乙酸酯、及處於蒸餾性狀之初沸點為15〇艺以上處 於蒸餾性狀之終沸點為220。(：以下的石腦油所組成之群 中之至少兩種作為上述有機溶劑之一部分。 17. 如請求項12之印刷佈線板之製造方法，其中上述感光性 組合物含有選自由二丙二醇單甲醚、二乙二醇單乙趟乙 酸酯、及處於蒸餾性狀之初沸點為15〇。(：以上、處於蒸儲 性狀之終沸點為220eC以下的石腦油所組成之群中之至 少兩種作為上述有機溶劑， 上述第一液至少含有二丙二醇單甲醚與二乙二醇單乙 趟乙酸酯’或者至少含有二乙二醇單乙醚乙酸酯與處於 蒸館性狀之初沸點為l5〇t;以上、處於蒸餾性狀之終滞點 為22〇t以下的石腦油作為上述有機溶劑之一部分。 18. 如請求項12之印刷佈線板之製造方法，其中上述感光性 組合物含有選自由二丙二醇單甲醚、二乙二醇單乙喊乙 酸酯、及處於蒸餾性狀之初沸點為15〇t以上、處於蒸顧 性狀之終沸點為220°C以下的石腦油所組成之群中之至 161370.doc -6 - 201239519 少兩種作為上述有機溶劑， 上述第一液至少含有二丙二醇單甲醚與處於蒸餾性狀 之初沸點為15〇°C以上、處於蒸館性狀之終沸點為22〇。(〕 以下的石腦油作為上述有機溶劑之一部分。 19.如請求項12至18中任一項之印刷佈線板之製造方法，其 中上述第一液含有上述光聚合起始劑。 20·如請求項12至18中任一項之印刷佈線板之製造方法，其 中上述第一液含有上述氧化鈦。 21.如請求項12至18中任一項之印刷佈線板之製造方法，其 中上述第一液含有上述光聚合起始劑及上述氧化鈦兩 者。 161370.doc201239519 VII. Patent application scope: 1. A first liquid and a second liquid of a one-liquid mixing type, which are used to obtain a photosensitive composition as a mixture, and the first liquid mixture of the two-liquid mixing type is mixed. The liquid before the first and second liquids, the photosensitive composition comprising the mixture of the first and second liquids as a whole comprises a polymerizable polymer having a carboxyl group, a photopolymerization initiator, and a cyclic ether group. a compound, titanium oxide, and an organic solvent, wherein the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl mystery, diethylene glycol monoethyl acetate, and a boiling point of 15 〇 in the distillation property (: above, The final boiling point of the distillation property is 29 〇. At least two of the group consisting of naphtha and less are used as the organic solvent, and the first liquid contains the polymerizable polymer and contains dipropylene glycol monomethyl ether. And diethylene glycol monoethyl ether acetate, and at least one of the group consisting of naphtha having a boiling point of at least 50 ° C and a boiling point of 290 C or less; a part of the organic solvent, wherein the second liquid contains the above compound having a cyclic ether group, and contains a selected from the group consisting of monoethylene glycol monoacetic acid, dipropylene glycol monomethyl hydrazine, and the initial boiling point of the steaming property. At least one of the group consisting of naphtha having a peak of 15 ° C or more and having a steaming property of 220 ° C or less is one of the organic solvents, and the first liquid contains the photopolymerization initiator Or the above-mentioned oxidizing agent or containing both the photopolymerization initiator and the titanium oxide, wherein the first liquid does not contain the photopolymerization initiator, the 161370.doc 201239519 second liquid contains the photopolymerization described above. And a second liquid containing the titanium oxide when the first liquid does not contain the titanium oxide. 2. The first liquid and the second liquid of the second liquid mixing type according to claim 1 The first liquid comprises a naphtha selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, and a naphtha having an initial boiling point of 150% in the steaming property and a boiling point of 290t or less. At least two of the group are part of the above organic solvent. 3. The first and second liquids of the two-liquid mixing type of claim 1, wherein the first liquid contains at least dipropylene glycol monomethyl ether and diethylene glycol single Ethyl acetate, or as a naphtha containing diethylene glycol mono-acetic acid acetate and having a boiling point of 15 〇t or more, and a boiling point of 29 (rc or less) A part of the above organic solvent. 4. The first and second liquids of the first liquid mixture of claim 1, wherein the first liquid to the third liquid has a propanol monomethyl sulphate and the initial point of the steaming property is 150 c The above-mentioned naphtha having a boiling point of not less than 29 〇〇c is a part of the organic solvent. 5. The first and second liquids of the two-liquid mixing type of the first aspect, wherein the photosensitive combination The material contains a stone brain selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoacetic acid vinegar, and a boiling point of less than 15 〇〇c at the initial boiling point and a final boiling point of 22 〇〇c or less in the steaming trait. At least two of the groups consisting of oil The first solvent contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol mono-acetic acid vinegar, and an initial boiling point of 150 eC or more in a distillation property, and a final boiling point of 22 〇〇c or less in a steaming property. At least two of the group 161370.doc -2 - 201239519 composed of naphtha are part of the above organic solvent. 6. The first and second liquids of claim 1, wherein the photosensitive composition comprises a solvent selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl ether acetate, and the like. The above-mentioned first liquid contains dipropylene glycol monomethyl as the above-mentioned organic solvent, in which the first point is 15 〇 ° C or more, and the group consisting of naphtha having a boiling point of 220 ° C or less at the end of the steaming property is used as the organic solvent. Ether and diethylene glycol monoethyl acetate vinegar' or at least diethylene glycol monoethyl ether acetate and a stone having a boiling point of 150 ° C or higher and a boiling point of 220 C or less Brain oil is part of the above organic solvent. 7. The first and second liquids of claim 1, wherein the photosensitive composition comprises a solvent selected from the group consisting of dipropylene glycol monoterpene ether, diethylene glycol monoethyl acetate, and a distillation property. At least two of the group consisting of naphtha having a boiling point of 15 〇 «c or more and having a boiling point of 22 (rc or less) are used as the organic solvent, and the first liquid contains at least dipropylene glycol monomethyl The ether has a boiling point of 150 ° C or higher at the beginning of the distillation property and a boiling point of 22 〇. The naphtha below 〇 is part of the organic solvent. 8. The method of any one of claims 1 to 7 The first liquid and the second liquid of the two-liquid mixing type, wherein the first liquid contains the photopolymerization initiator. 9. The first and second liquids of the two-liquid mixing type according to any one of claims 1 to 7, The first liquid contains the above-mentioned titanium oxide. The first liquid and the second liquid of the two-liquid mixing type according to any one of claims 1 to 7, wherein the first liquid contains the photopolymerization initiator and the oxidation. Titanium two 161370.doc 201239519. The photosensitive liquid composition obtained by mixing the second liquid and the two liquids is a resistor. The first and the second flux composition according to any one of claims 1 to 7. The method for producing a printed wiring board, A method of manufacturing a printed wiring board including a printed wiring board body having a circuit on a surface thereof and a solder resist film laminated on a circuit surface of the printed wiring board body, the manufacturing method comprising the steps of: mixing first And a second liquid obtained as a photosensitive composition which is a solder resist composition obtained by mixing the first and second liquids, wherein the surface has a circuit "the surface on which the circuit of the printed wiring board body is provided is coated with the above-mentioned - a solder resist combination in which a second liquid is mixed: a photosensitive composition 'forming a solder resist film laminated on the surface of the printed wiring board body and having the surface of the circuit, and the first and second liquids are mixed The solder resist composition, that is, the photosensitive composition as a whole, comprises a polymerizable polymer having a hydroxyl group, a photopolymerization initiator, a compound having a cyclic ether group, titanium oxide, and an organic solvent. The photosensitive composition contains a stone selected from the group consisting of dipropylene glycol monomethyl ether, diethyl ether monoethyl ether acetate, and a boiling point of 15 〇 1 or more in a distillation property and a final boiling point of 29 〇〇 c or less in a distillation property. At least two of the group consisting of brain oils are the organic solvent, and the first liquid contains the polymerizable polymer and is selected from the group consisting of dipropylene glycol monomethyl (10), diethylene glycol mono (tetra) acetic acid vinegar, and is steamed. At least one of the group consisting of naphtha having a boiling point of 150 ° C or higher and a boiling point of 161370.doc 201239519 290 C or less as a part of the organic solvent, the second liquid containing the above-mentioned a cyclic ether group-containing compound having a terminal point selected from the group consisting of diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and disulfide, and having a distillation property of 220 ° C or less At least one of the group consisting of naphtha as part of the organic solvent, the first liquid containing the photopolymerization initiator or containing the titanium oxide, or In the case where the photopolymerization initiator and the titanium oxide do not contain the photopolymerization initiator, the second liquid contains the photopolymerization initiator, and the first liquid does not contain the above In the case of titanium oxide, the above second liquid contains the above titanium oxide. The method wherein the first liquid ethylene glycol monoethyl ether acetate, 13. The printed wiring board according to claim 12 is produced by selecting from the group consisting of dipropylene glycol monomethyl ether, and the initial boiling point of the distillation property is 1501 or more. At least two of the group consisting of naphtha having a final boiling point of 290 ° C or less as a part of the above organic solvent. 14. The method of manufacturing a printed wiring board according to claim 12, wherein the first liquid contains at least dipropylene glycol monoterpene and diethylene glycol monoethyl ether acetate, or at least diethylene glycol monoacetic acid vinegar and The naphtha of the first point of the distillation property is 15 0 C or more, and the naphtha at the end of the steaming character is 2 9 〇 or less as part of the above organic solvent. 15. The method of manufacturing a printed wiring board according to claim 12, wherein the first liquid contains at least dipropylene glycol monoterpene scale and the initial boiling point of the steaming property is 161370.doc 201239519 150 ° C or more, and is in the final boiling point of the distillation property. It is 29 baht. The following naphtha is used as part of the above organic solvent. 16. The method of producing a printed wiring board according to claim 12, wherein the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethicone, diethylene glycol monoacetic acid acetate, and an initial boiling point of 150° in a distillation property. At least two of the group consisting of naphtha having a vaporization property of 220 C or less as the above-mentioned organic solvent, the first liquid containing the selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol The alcohol monoethyl ether acetate and the boiling point of the distillation property are 15 liters or more and the final boiling point of the distillation property is 220. (a) A method of producing a printed wiring board according to claim 12, wherein the photosensitive composition contains a monomer selected from the group consisting of dipropylene glycol Ether, diethylene glycol monoacetic acid acetate, and the initial boiling point of the distillation property is 15 〇. (: Above, at least two of the group consisting of naphtha having a final boiling point of 220 eC or less. As the organic solvent, the first liquid contains at least dipropylene glycol monomethyl ether and diethylene glycol monoacetic acid acetate or at least diethylene glycol monoethyl ether acetate and has an initial boiling point of steaming property In the above method, the method of producing a printed wiring board according to claim 12, wherein the photosensitive composition contains the above-mentioned photosensitive composition. It is composed of dipropylene glycol monomethyl ether, diethylene glycol monoethyl acetate, and naphtha which has a boiling point of 15 〇t or more and a boiling point of 220 ° C or less. Group To 161370.doc -6 - 201239519 two kinds of the above organic solvent, the first liquid contains at least dipropylene glycol monomethyl ether and the boiling point of the distillation property is 15 〇 ° C or more, and the final boiling point of the steaming property is The method for producing a printed wiring board according to any one of claims 12 to 18, wherein the first liquid contains the photopolymerization initiator. The method of manufacturing a printed wiring board according to any one of claims 12 to 18, wherein the first liquid contains the titanium oxide. The method of manufacturing the printed wiring board according to any one of claims 12 to 18, Wherein the first liquid contains both the photopolymerization initiator and the titanium oxide. 161370.doc
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