TWI363931B

TWI363931B -

Info

Publication number: TWI363931B
Application number: TW99112235A
Authority: TW
Inventors: Shigeru Nakamura; Takashi Nishimura; Shuuji Kage; Takashi Watanabe; Toshio Takahashi
Original assignee: Sekisui Chemical Co Ltd
Priority date: 2009-08-10
Filing date: 2010-04-19
Publication date: 2012-05-11
Also published as: TW201106097A; WO2011018907A1

Description

1363931·. 六、發明說明：【發明所屬之技術領域】本發明係關於一種適宜用於在基板上形成防焊膜，或者在裝載有發光二極體晶片之基板上形成防反射膜之感光性組合物及防焊組合物。【先前技術】作為保護印刷配線基板不受高溫之焊錫之影響的保護膜’係廣泛使用防焊膜。1363931·. 6. Description of the Invention: TECHNICAL FIELD The present invention relates to a photosensitive property suitable for forming a solder resist film on a substrate or forming an anti-reflection film on a substrate on which a light-emitting diode wafer is mounted. Composition and solder resist composition. [Prior Art] As a protective film which protects a printed wiring board from high-temperature solder, a solder resist film is widely used.

作為用以形成上述防焊膜之材料之一例，於下述專利文獻1中揭示有如下防焊材料，其含有作為丙烯酸酯化合物之1外線硬化型預聚物及顏料，且進而含有紫外線硬化型預聚物、有機聚矽氧烷與鋁螯合化合物之反應產物。又，於裝載有發光二極體（以下將發光二極體簡稱為 LEDdight-emiuing diode))晶片之印刷配線基板之表面，為效率良好地射出由LED發出之光而形成光之反射率高之白色防焊膜。上述白色防焊膜由於效率良好地反射對基板表面照射之 LED之光，故可提高由LED產生之光之利用率。作為用以形成上述白色防焊膜之材料之—例，於下述專利文獻2中揭示有如下阻劑材料，其含有藉由環氧樹脂虚水解性炫氧基錢之脫醇反應而得之含有絲基之錢改質環氧樹月旨，且進而含有包含不餘和基之聚幾酸樹腊、稀釋劑、光聚合起始劑、及硬化密著性賦予劑。於下述專敎獻3中揭示有如下白色料材料，其含有 147625.doc 931 不具有芳香環之含羧基之樹脂、光聚合起始劑、環氧化合物、金紅石型氧化鈦'及稀釋劑。先前技術文獻專利文獻 [專利文獻1]曰本專利特開昭58-25374號公報 [專利文獻2]曰本專利特開2007-249148號公報 [專利文獻3]日本專利特開2007-322546號公報【發明内容】 [發明所欲解決之問題] 上述專利文獻丨中記載之防焊材料含有丙烯酸醋化合物作為主成分。上述專利文獻2中記载之阻劑材料含有將環氧樹脂以烷氧基矽烷進行改質而成之含有烷氧基之矽烷改質環氧樹脂作為主成分。上述專利文獻3中記載之防焊材料含有環氧化合物。於使用含有該等成分之阻劑材料來形成保護膜之情形時，若暴露於如回流焊時約2〇〇°c以上之尚溫下’則存在保護膜黃變之情形。又，最上層之保護膜必需於可見光區域具有高反射率。為此，必需於阻劑材料中大量添加填充料。例如，假設大量使用硬度〶之氧化鈦作料充料，則存在利用模具等纪行切割加工時，於保護膜上產生裂痕或缺損之情形。本發明之目的在於提供一種可獲得即便暴露於如回流太時約200。。以上之高溫下亦不易產生黃變等變色之保護用的感光性組合物。本發明之限定性目的在於提供一種可獲得切割加工性優 147625.doc 異之保護膜的感光性組合物。 [解決問題之技術手段] 很搽本發明，可提供如下感綠組合物，其含有聚合性煙早體⑷及聚合性烴聚合物（B)中之至少—者與無機As an example of the material for forming the above-mentioned solder resist film, the following Patent Document 1 discloses a solder resist material containing an external curable prepolymer and a pigment as an acrylate compound, and further containing an ultraviolet curable type. The reaction product of a prepolymer, an organopolyoxane and an aluminum chelate compound. Further, on the surface of the printed wiring board on which the light-emitting diode (hereinafter referred to as LED dight-emiuing diode) is mounted, the light emitted from the LED is efficiently emitted to form a high reflectance of light. White solder mask. Since the white solder resist film efficiently reflects the light of the LED irradiated to the surface of the substrate, the utilization of light generated by the LED can be improved. As an example of the material for forming the white solder resist film, Patent Document 2 listed below discloses a resist material which is obtained by a dealcoholization reaction of an epoxy resin with a dehydratable methoxy group. The fiber containing a silk base is modified to have an epoxy resin, and further contains a polyamic acid wax containing a non-heavy group, a diluent, a photopolymerization initiator, and a hardening adhesion imparting agent. The following white material is disclosed in the following special article 3, which contains 147625.doc 931 carboxyl group-containing resin having no aromatic ring, photopolymerization initiator, epoxy compound, rutile type titanium oxide' and diluent . [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-249546 (Patent Document 3) Japanese Patent Laid-Open No. 2007-322546 [Problem to be Solved by the Invention] The solder resist material described in the above Patent Document contains an acrylic vinegar compound as a main component. The resist material described in the above Patent Document 2 contains, as a main component, an alkoxy-containing decane-modified epoxy resin obtained by modifying an epoxy resin with an alkoxysilane. The solder resist material described in the above Patent Document 3 contains an epoxy compound. When a resist film containing such a component is used to form a protective film, if it is exposed to a temperature of about 2 ° C or more, such as reflow soldering, there is a case where the protective film is yellowed. Further, the protective film of the uppermost layer must have high reflectance in the visible light region. For this reason, it is necessary to add a large amount of the filler to the resist material. For example, assuming that a large amount of titanium oxide is used as the material charge, there is a case where cracks or defects are formed on the protective film when the cutting process is performed by a mold or the like. It is an object of the present invention to provide an approx. 200 that can be obtained even if exposed to reflux, for example. . At the above high temperature, it is also difficult to produce a photosensitive composition for protection against discoloration such as yellowing. A limited object of the present invention is to provide a photosensitive composition which can obtain a protective film having a cutting workability of 147,625. [Technical means for solving the problem] The present invention provides a green sensitive composition containing at least one of a polymerizable tobacco precursor (4) and a polymerizable hydrocarbon polymer (B).

科⑹，且無機填充料(c)為如下者：對將該無機填充料 (C)5 g添加至純水i⑽机中而獲得之溶液進行加熱使复彿騰5分鐘後，靜置至相抑為止，獲得錢處理液了繼而於所得之濟騰處理液中加人㈣騰而蒸發之水量之水，使水量成為100 mL，測定所得溶液之pH值時呈6.8以上、11以下之值。、再者’本中請案說明書中’有時將如下方法稱為煮沸法：對將無機填充料（C)5 g加至純水100 mL中而獲得之溶液進仃加熱，使其沸騰5分鐘後，靜置至達到23艺為止，獲仵沸騰處理液，繼而於所得之沸騰處理液中加入因沸騰Section (6), and the inorganic filler (c) is as follows: a solution obtained by adding 5 g of the inorganic filler (C) to a pure water i (10) machine is heated to make the complex stalk for 5 minutes, and then allowed to stand until the phase Therefore, the money treatment liquid is obtained, and then the water of the amount of water evaporated by the person (4) is added to the obtained Jiteng treatment liquid to make the water amount 100 mL, and the pH value of the obtained solution is 6.8 or more and 11 or less. In addition, 'in the present specification', the following method is sometimes referred to as the boiling method: the solution obtained by adding 5 g of the inorganic filler (C) to 100 mL of pure water is heated to make it boil 5 After a minute, let stand until it reaches 23 art, get the boiling treatment liquid, and then add it to the boiling treatment liquid.

發之水里之水，使水量成為丨〇〇，測定所得溶液之 pH值。上述無機填充料（C)之能帶隙較好的是2.5 eV以上、7 eV 以下。較好的是上述無機填充料（C)之465 nm下之折射率為1.8 X上且無機填充料（C)為白色填充料。又，上述無機填充料（C)更好的是金紅石型氡化鈇。上述無機填充料（c)之含量較好的是3重量％以上、80重量°/。以下。車乂好的是至少1種無機填充料（C)係由鹼性金屬氧化物或 147625.doc 1363931 鹼性金屬氫氧化物所被覆。構成上述驗性金屬氧化物或驗性金屬氫氧化物之金屬元素較好的是選自由鎂、锆、鈽、鏍、銻、鋇及鈣所組成之群中之至少1種。上述無機填充料（C)較好的是由含有氧化錯之被覆材料所被覆。本發明之感光性組合物較好的是進而含有可與無機填充料（C)之酸性部位反應之化合物。上述無機填充料（C)較好的是由可與該無機填充料（c)之酸性部位反應之化合物進行表面處理。可與上述無機填充料（C)之酸性部位反應之化合物較好的是鹼性化合物。又，上述鹼性化合物更好的是選自由多元醇、烷醇胺及烷氧基矽烷所組成之群中之至少丨種。上述聚合性烴單體（Α)較好的是具有2個以上聚合性不飽和基’並且於乙腈：水=1 : 1(體積比）溶液中，利用附質譜分析之液相層析法（LC/MS，liquid ehr。細。㈣咖/麵s SPeCtr〇meter)測定上述聚合性烴單體（A)時，由質譜分析之碎片峰為500以下之成分所構成之波峰面積為總料之30%以上。 @ 上述聚合性烴單體⑷之重量平均分子量較好的是以明之感光性組合物較好的是進而含有具有環狀醚骨 ^化合物⑼，並且相對於聚合性烴聚合物（b)i⑼重量伤’具有環狀趟骨架之化合物⑼之含量為〇1 147625.doc 1363931 上、5 0重量份以下。 ^述具有環狀趟骨架之化合物⑼較好的是具有環_ 月架且不具有直鏈醚骨架之環氧化合物。上述環狀醚骨架較好的是環氧環己烷骨架。本發明之感光性組合物較好的是進而含有具有路易斯驗性部位之抗氧化劑。上述抗氧化劑較好的是選自由齡系抗乳化劑、磷系抗氧化劑及胺系抗氧化劑所組成之少1種。The water in the water is made into water, and the pH of the obtained solution is measured. The energy gap of the inorganic filler (C) is preferably 2.5 eV or more and 7 eV or less. It is preferred that the inorganic filler (C) has a refractive index of 1.8 X at 465 nm and the inorganic filler (C) is a white filler. Further, the above inorganic filler (C) is more preferably rutile-type antimony telluride. The content of the above inorganic filler (c) is preferably 3% by weight or more and 80% by weight. the following. Preferably, at least one inorganic filler (C) is coated with an alkali metal oxide or 147625.doc 1363931 alkaline metal hydroxide. The metal element constituting the above-mentioned test metal oxide or the metal hydroxide is preferably at least one selected from the group consisting of magnesium, zirconium, hafnium, tantalum, niobium, tantalum and calcium. The inorganic filler (C) is preferably coated with a coating material containing an oxidizing error. The photosensitive composition of the present invention preferably further contains a compound which can react with an acidic site of the inorganic filler (C). The above inorganic filler (C) is preferably subjected to surface treatment with a compound which can react with the acidic portion of the inorganic filler (c). The compound which can react with the acidic portion of the above inorganic filler (C) is preferably a basic compound. Further, the above basic compound is more preferably at least one selected from the group consisting of a polyhydric alcohol, an alkanolamine and an alkoxydecane. The above polymerizable hydrocarbon monomer (Α) preferably has two or more polymerizable unsaturated groups ' and is subjected to liquid chromatography using mass spectrometry in an acetonitrile:water = 1:1 (volume ratio) solution ( LC/MS, liquid ehr. Fine. (4) Coffee/surface s SPeCtr〇meter) When the above polymerizable hydrocarbon monomer (A) is measured, the peak area composed of the component having a fragmentation peak of 500 or less by mass spectrometry is the total material. More than 30%. @ The weight average molecular weight of the above polymerizable hydrocarbon monomer (4) is preferably such that the photosensitive composition preferably further contains a compound having a cyclic ether compound (9) and a weight relative to the polymerizable hydrocarbon polymer (b) i (9) The content of the compound (9) having a cyclic anthracene skeleton is 〇1 147625.doc 1363931, and 50 parts by weight or less. The compound (9) having a cyclic anthracene skeleton is preferably an epoxy compound having a cyclic skeleton and having no linear ether skeleton. The above cyclic ether skeleton is preferably an epoxycyclohexane skeleton. The photosensitive composition of the present invention preferably further contains an antioxidant having a Lewis test site. The above antioxidant is preferably one selected from the group consisting of an age-based anti-emulsifier, a phosphorus-based antioxidant, and an amine-based antioxidant.

較好的是上述聚合性烴單體⑷及聚合性烴聚合_)中之至少-者含有Hg)以上聚合性不飽和基及2個以上缓基，並且作為聚合性烴單體⑷及聚合性烴聚合物⑻之整體，重量平均分子量為5，_〜50，_，固體成分酸值為3〇〜15〇 mg KOH/g，且雙鍵當量為5〇〜2 〇〇〇 g/eq。於上述4合性烴單體（A)及聚合性烴聚合物（B)之人呀It is preferred that at least one of the polymerizable hydrocarbon monomer (4) and the polymerizable hydrocarbon polymerization_) contains Hg) or more polymerizable unsaturated group and two or more retarding groups, and is a polymerizable hydrocarbon monomer (4) and polymerizability. The hydrocarbon polymer (8) as a whole has a weight average molecular weight of 5, _ 50, _, a solid content acid value of 3 〇 15 15 mg KOH / g, and a double bond equivalent of 5 〇 2 〇〇〇 g / eq. The above-mentioned 4-synthetic hydrocarbon monomer (A) and the polymerizable hydrocarbon polymer (B)

_重量。/。中，較好的是聚合性烴單體⑷之含量為5重；：以上、5 0重量％以下。於上述聚合性烴單體⑷1〇〇重量％中，較好的是具有醇性羥基之聚合性烴單體之含量為15重量％以下。上述無機填充料（C)較好的是滿足下述式（χ)。 [((第1無機填充料之莫氏硬度Μ硬化後之感光性組合物 100體積％中之第!無機填充料之含量(體積％)”+ {(第2無機填充料之莫氏硬度)χ(硬化後之感光性組合物1〇〇體積：中之第2無機填充料之含量（體積％))}+ {(第心機填充_weight. /. Preferably, the content of the polymerizable hydrocarbon monomer (4) is 5 weights; or more, 50% by weight or less. The content of the polymerizable hydrocarbon monomer having an alcoholic hydroxyl group is preferably 15% by weight or less based on 1% by weight of the polymerizable hydrocarbon monomer (4). The above inorganic filler (C) preferably satisfies the following formula (χ). [((The Mohs hardness of the first inorganic filler, the first of 100% by volume of the photosensitive composition after curing; the content of the inorganic filler (% by volume)) + {(the Mohs hardness of the second inorganic filler) χ (photosensitive composition after hardening 1 〇〇 volume: content of the second inorganic filler (vol%))} + {(first filling)

料之莫氏硬度）χ(硬化後之感光性組合物1 〇〇體積％中之第〇 147625.doc 1363931 無機填充料之含量（體積。/。)）}]^4 (χ) 、本發明之感光性組合物較好的是進而含有溶劑，且溶劑之偶極矩為1 Debye以上。本發明之防焊組合物係依據本發明而構成之感光性組合物。本發明之感光性組合物適宜用作防焊組合物。 [發明之效果] 本發明之感光性組合物含有聚合性烴單體（A)及聚合性烴聚合物（B)中之至少一者、與無機填充料（〇,且無機填充料（c)之利用煮沸法而得之pH值為6 8以上、丨丨以下故 "Τ獲付即便暴露於兩溫下亦不易變色之保護膜。於上述無機填充料（C)之465 mn下之折射率為K8以上，且上述無機填充料（C)為白色填充料之情形時，可獲得反射性能更高之白色防焊膜。於至J 1種上述無機填充料（C)係由驗性金屬氧化物或驗性金屬氫氧化物所被覆之情形時，幾乎與無機填充料（c) 之種類無關，而形成在高溫下更不易變色之保護膜。又，由於可提高樹脂之硬化性，故可提高保護膜之切割加工性。進而’由於可抑制具有光氧化作用之無機填充料之表面活性’故可形成即便照射光亦難使樹脂劣化之保護膜。於感光性組合物含有可與無機填充料（c)之酸性部位反應之化合物之情形時，可獲得即便暴露於高溫下亦更不易變色之保護膜。於如下情形時可確實地抑制保護膜之黃變：上述聚合性 147625.doc 1363931, 煙單體⑷具有2個以上之聚合性不餘和基 ==1 * \ f , 且於乙膀·次溶液中，利用附質譜分析之液相層析法 ^⑽跑上述聚合性烴單體（A)時，由質譜分析峰為500以下之成分所構成之片 30%以上。 ’面積為總波峰面積之【實施方式】以下’對本發明進行詳細說明β =月之感光性組合物含有聚合性煙單體㈧及聚合性物（Β)中之至少一者。可僅使用聚合性煙單體⑷及聚合性烴聚合物（…令之一者，使用I合性烴皁體（Α) 2 聚合物⑻之兩者。又，聚合性烴單體⑷及聚 S性煙聚合物⑻可分別僅使用傻，亦可併用靖以上。 (聚合性煙單體（A)) 作為上述聚合性烴單體⑷，例如可列舉含有聚合性不飽和基之單體或含有聚合性環狀㈣基之單體。乍為上述來合性不飽和基，例如可列舉(甲基)丙烯醯基烯趣基等具有聚合性不飽和雙鍵之官能基。其令，由於可提南保護膜之办1好它# * 、又如达、度，故較好的是（曱基）丙烯醯基。 X上述3有聚合性不飽和基之單體較好的是具有(曱基)丙細酿基之化合物。作為上述具有（甲基）丙烯醯基之化合可列舉··乙二醇、f氧基四乙二醇、聚乙二醇或丙二醇等醇之_(，基）丙稀酸醋改質物；多元醇、多元醇之環氧乙烷加成物或多元醇之環氧丙烷加成物之多元(尹基） 147625.doc 1363931 丙烯酸酯改質物；酚、酚之環氧乙烷加成物或苯酚之環氧丙烷加成物之（甲基）丙烯酸酯改質物；甘油二縮水甘油醚或三羥曱基丙烷三縮水甘油醚等縮水甘油醚之（甲基）丙烯酸酿改質物；或者三聚氰胺（曱基）丙烯酸酯。作為上述多元醇，例如可列舉己二醇、三羥甲基丙烷、季戊四醇、二季戊四醇及三_羥基乙基異氰尿酸酯。作為上述酚之（曱基）丙烯酸酯，例如可列舉笨氧基（曱基）丙烯酸酯及雙酚A之二（甲基）丙烯酸酯改質物。「（甲基）丙烯醯基」係指丙烯醯基與甲基丙烯醯基。「（甲基）丙烯酸」係指丙烯酸與甲基丙烯酸。「（曱基）丙烯酸酯」係指丙烯酸酯與曱基丙烯酸醋。 (聚合性烴聚合物（B)) 作為上述聚合性烴聚合物（B)，例如可列舉丙烯酸系樹脂、環氧樹脂及烯烴樹脂。再者，「樹脂」並不限定於固形樹脂，亦包括液狀樹脂及寡聚物。上述聚合性烴聚合物（B)較好的是下述含敌基之樹脂 (a)〜⑷。 (a)藉由不飽和羧酸與具有聚合性不飽和雙鍵之化合物之共聚合而獲得之含叛基之樹脂 (b)藉由含羧基之（甲基）丙烯酸共聚合樹脂與丨分子中具有環氧乙烷環及乙烯性聚合性之反應而獲得之含羧基之樹脂 (c)使不飽和單幾酸，與1分子中不餘和雙鍵之化合物（b2) 具有各為1個之環氧基及聚合性不飽和雙鍵之化合物和具有聚合性不飽和雙鍵之化 147625.doc 1363931. 合物的共聚物進行反應後’使飽和或不飽和多元酸酐與所生成之反應物之二級羥基進行反應而獲得之含羧基之樹脂 (d)使飽和或不飽和多元酸酐與含羥基之聚合物反應後’使1分子中具有各為1個之環氧基及聚合性不飽和雙鍵之化合物與所生成之羧酸進行反應而獲得之含羥基及缓基之樹脂由於可進一步提高保護膜之耐熱性，故聚合性烴聚合物 (B)較好的是上述（b)含羧基樹脂。上述含羧基之（甲基）丙烯酸共聚合樹脂（bl)例如可藉由使（曱基）丙浠酸酯（bbl)、與1分子中具有1個不飽和基及至少1個羧基之化合物（bb2)共聚合而獲得。作為上述（曱基）丙烯酸酯（bbl)，可列舉：（曱基）丙烯酸甲酯、（曱基）丙烯酸乙酯、（曱基）丙烯酸丙酯、（曱基）丙烯酸丁酯、（曱基）丙烯酸戊酯及（甲基）丙烯酸己酯。進而，作為上述（甲基）丙烯酸酯（bb 1)’可列舉含羥基之（甲基）丙稀酸酯及二醇改質（甲基）丙烯酸酯。上述（甲基）丙稀酸醋 (bb 1)可僅使用1種，亦可併用2種以上。作為上述含羥基之（曱基）丙烯酸酯，可列舉：（曱基）丙烯酸2-羥基乙酯、（曱基）丙烯酸羥基丙酯、（曱基）丙稀酸羥基丁酯及己内酯改質（甲基）丙烯酸2-羥基乙酯等。作為上述二醇改質（曱基）丙烯酸酯，可列舉：曱氧基二乙二醇 (曱基）丙烯酸酯、乙氧基二乙二醇（甲基）丙烯酸醋、異辛氧基二乙二醇（曱基）丙烯酸酯、苯氧基三乙二醇（甲基）丙烯酸酯、甲氡基三乙二醇（甲基）丙烯酸酯、及曱氧基聚乙 147625.doc • 11 - 1363931 二醇（甲基）丙烯酸酯。作為上述1分子中具有丨個聚合性不飽和基及至少丨個羧基之化合物_)’可列舉：（甲基）丙缔酸、不飽和基與叛酸之間經鏈延長之改質不飽和單羧酸、（曱基)丙烯酸卜羧基乙酿、2-丙烯酿氧基乙基琥㈣、2_丙烯醯氧基乙基六風鄰苯二甲酸、藉由内自旨改質等而具有S旨鍵之不飽和單叛酸、具有醚鍵之改質不飽和單缓酸、及順丁稀二酸等丄分子中具有2個以上幾基之化合物。上述化合物胂2)可僅使用1種’亦可併用2種以上。作為上述1分子中具有環氧乙烧環及乙烯性不飽和基之化合物(b2)’例如可列舉：（甲基)丙烯酸縮水甘油醋、（曱基）丙稀酸α-甲基縮水甘油醋、（甲基）丙稀酸3，心環氧環己基甲，、（曱基）丙婦酸3,4_環氧環己基乙醋、（曱基）丙稀酸 3’4-壤氧環己基丁自旨、及丙烯酸3,4•環氧環己基甲基胺基 f其中’較好的是（甲基）㈣酸3,4.環氧環己基甲醋。上述化合物⑽可僅使用1種，亦可併用2種以上。上述聚合性煙單體⑷較好的是具有2個以上聚合性不飽 :基’並且於乙腈：水=1 : U體積比)溶液中，利用附質譜分析之液相層析法（LC/MS)敎上述聚合性烴單體⑷ 時’由質瑨分析之碎片峰為5〇〇以下之成分所構成之波峰面積為總波峰面積之30%以上。 :為由質譜分析之碎片峰為則以下之成分所構成 =面積為總波峰面積之鳩以上的聚合性煙可列舉：乙二醇、f氧基四乙二醇、聚乙一醇二如吁水G —醇或丙二醇等 M7625.doc -12· 二醇之二(甲基)丙稀酸酿改質物；多元醇、多元醇之環氧乙烷加成物或多元醇之環氧丙烷加成物之多元(甲基)丙烯酸醋改質物；紛、齡之擇衣乳乙烧加成物或酚之環氧丙烷加成物之（甲基）丙稀酸酷改質物；甘油二縮水甘油謎或三經甲基丙院三縮水甘油趟等縮水甘油趟之(甲基)丙烯酸酷改質物；或者三聚氰胺(甲基)丙烯酸醋。作為上述多元醇’例如可列舉：己二醇、三羥甲基丙烧、季戊四醇、二季戊四醇及三·隸乙基異氰尿酸醋。作為上述酚之（甲基）丙烯酸醋，例如可列舉苯氧基（甲基）丙烯酸醋及㈣A之二（甲基）丙烯酸醋改質物。上述聚合性烴單體（A)之藉由GPC(gel permeation chromatography，凝膠渗透層析法）測定所求出之以聚苯乙烯換算之重量平均分子量較好的是7〇〇以下。藉由該重量平均分子量為700以下，可更確實地抑制保護膜之黃變。上述重量平均分子量係使聚合性烴單體（A)l5 mg溶解於 THF(tetrahydrofuran，四氫呋喃η m]L中而進行GPC測定時，作為以聚苯乙烯換算所得之分子量而測定。較好的疋上述聚合性烴單體及聚合性烴聚合物中之至J/ 一者含有1個以上聚合性不飽和雙鍵及2個以上羧基，並且作為聚合性烴單體（A)及聚合性烴聚合物之整體，重量平均分子量為5,〇〇〇〜5〇,〇〇〇 ,且固體成分酸值為 30〜150 mg KOH/g，且雙鍵當量為5〇〜2 〇〇〇 g/eq。若上述重量平均分子量為5〇〇〇〜5〇〇〇〇，固體成分酸值為30-150 mg KOH/g，且雙鍵當量為5〇〜2 〇〇〇 g/eq ’則感 147625.doc •13· 1363931 優光性組合物之顯影性更優異，並且保護膜之切割加工性異。於上述聚合性烴單體（A)及聚合性烴聚合物之合計 100重量’聚合性烴單體⑷之含量較好的是5重量％以上、50重量％以下。若聚合性烴單體⑷之含量在上述範圍内，則可使感光性組合物充分硬化，且可進—步提高保蠖膜之切割加工性。進而，保護膜之交聯密度變得適度，可獲得充分之解像度，且保護膜不易黃變。於上述聚合性烴單體（A)1⑽重量％中，具有醇性經基之聚合性烴單體之含量較好的是15重量％以下。於此情形時’容易保持無機填⑽（c)之驗性，容易對保護膜進行切割加工。作為上述聚合性烴單體⑷，可列舉季戍四醇三（甲基）丙婦酸酯。 (無機填充料（C)) 本發明之感光性組合物中所含之無機填充料⑹藉由者彿法所測定之PH值為6.8以上、11以下。於PH值低於6: 時’保護膜黃變’且難以對保護膜進行切割加工。又，於 PH值高於11時，存在感光性纽合物之適用期變差之情形。、由於可進一步抑制保護膜之黃變，故上述無機填充料(C) 之利用煮滞法所敎之阳值較好的是7(^上，1 β 7.4以上，進而好的是8 1以κ 山从、疋疋.1 U上。由於可使感光性組合物之適用期變得更良好’故上述無機填充料(c)之利用考彿法所測定之pH值較好的是1〇.〇以下，更好的是9 〇以下。所謂上述煮沸法’係指如下方法：對將上述無機填充料 147625.doc (C)5 g加至純水1〇〇 mL*所得溶液進行加熱使其沸騰5 刀鐘後靜置直至達到23°c為止，獲得沸騰處理液，繼而於所得之滞騰處理液中加入因料而蒸發之水量之水，使水量成為100 mL，測定所得溶液2pH值。上述煮/弗法中，具體而言係於具有開口之容器内放入將上述無機填充料（C)5 g加至純水1〇〇 mL中而獲得之溶液。藉由加熱上述容器而加熱容器内之溶液’使容器内之溶液 ’’弗騰弗騰後’使;^騰狀態維持5分鐘4後，於容器之開口安裝塞體’靜置至達到23t:為止，獲得彿騰處理液。自容器之開口卸除塞體，於所得之沸騰處理液中加入因沸騰而蒸發之水量之水，使水量成為100 mLe於容器之，口安裝塞體’振盪混合i分鐘後，靜置5分鐘。如此而獲得測定溶液。所得之測定溶液之pH值可依據JIS Z88〇2之7· 中記載之操作而測定。上述無機填充料（C)之能帶隙較好的是25 eV以上、7 eV 、於上述此帶隙低於2.5 eV時，存在防焊膜之絕緣性，低^情形。於上述能帶隙高於7 eV時存在防谭膜若暴露於高溫下則容易黃變之傾向。較好的是上述無機填充料（(：）之465 nm下之折射率為i 8 X上，且上述無機填充料（C)為白色填充料。於此情形時’可獲得適合於LED用印刷配線基板等之白色防焊膜的感光陡組合物。再者，若上述折射率為I』以上則可獲于對用於裝載有LED之基板的白色防焊膜所要求之高反射 147625.doc 15· 丄作為上述白色填充料战J n羋.氧化鈦、氧化锆、氧化銻、氧化辞'鉛白、栌扎 /丨I·化辞 '鈦酸鉀及鈦酸鉛等。其中，由於可進一步抑击丨丨古、，σ τ 问/皿下之保護膜之黃變，故較好的是氧化鈦。上述白色填充料之數量平均粒純好的是請七㈣之範圍内，更好的是〇.卜0.5㈣之範圍内。上述無機填充料(C)較好的是金紅石型氧化鈦。於金紅石型氧化鈦之情形時’防焊膜暴露於高溫下時更不易黃變0 f光性曰組合物100重量％中之無機填充料⑹之含量㈣，是3重量^上' 8G重量％以下。於無機填充料⑹之令曰未達重畺/。時，存在防焊膜暴露於高溫下時容易黃變之傾向。於無機填充料（C)之含量超出80重量％之情形時，存在難以製備具有適合塗佈之黏度的感光性組合物之惰形。感光性組合物⑽重量％中之無機填充料⑹之含量之更佳下限為1 〇重量。/。，更佳上限為75重量。。為了使表面呈鹼性，較好的是至h種上述無機填充料 (C)係由鹼性金屬氧化物或鹼性金屬氫氧化物所被覆。於此It形時，防焊膜暴露於咼溫下時，可使防焊膜更不易黃變。上述鹼性金屬氧化物或鹼性金屬氫氧化物可僅使用工種，亦可併用2種以上。作為上述鹼性金屬氧化物或鹼性金屬氫氧化物可列舉含有鎂、鍅、鈽、锶、銻、鋇或鈣等之金屬化合物。由於可進一步抑制高溫下之防焊膜之黃變，故構成上述鹼性金 147625.doc 屬氧化物或鹼性金屬氫氧化物之金屬元素較好的是選自由鎮、錯、鈽、鳃、銻、鋇及鈣所組成之群中之至少1種。由於可進一步抑制高溫下之防焊膜之黃變，故上述無機填充料（C)較好的是由含有氧化锆之被覆材料所被覆。作為上述驗性金屬氧化物或驗性金屬氫氧化物，適宜使用氧化錯。由上述鹼性金屬氧化物或鹼性金屬氫氧化物所被覆之無機填充料（C)例如可以下述方式而獲得。使無機填充料（c)分散於水中或以水為主成分之溶液中，獲得漿料。視需要藉由砂磨機或球磨機等將無機填充料（C)粉碎《繼而，使漿料之？]9值為中性或鹼性，視情況為k丨生其後，將成為被覆材料之原料之水溶性鹽添加至漿料中，被覆無機填充料(C)之表面。其後，中和漿料，回收無機填充料（Cp經回收之無機填充料（C)可進行乾燥或乾式粉碎》又，於本發明之感光性組合物中，除上述無機填充料 ⑷）以外，視需要亦可含有碳酸鈣、氧化鋁、氫氧化鋁、氫氧化辞、氧化辞、氮㈣、氮切、氮化蝴、金剛石粉末、石夕酸鍅、氧化鍅、滑石、硫酸鋇、鈦酸鋇、氧化欽: 黏土：碳酸鎂、氫氧化鎂、雲母、雲母粉、硫酸紹、硫化鋅、氧化銻、氮化鈦、氟化鈽及氧化上述無機填充料(C)較好的是具有酸性部位真充為抖提高驗性，上述無機填充料（c)較好的是由可與無機填充料之酸性部位反應之化合物進行表面處理。 147625.doc 1363931 作為可與上述無機填充料（c)之酸性部位反應之化合物，可列舉：三羥曱基丙烷、三羥曱基乙烷、二-三羥曱基丙烧、三經曱基丙炫乙氧化物或季戊四醇等多元醇；單乙醇胺、單丙醇胺'二乙醇胺、二丙醇胺、三乙醇胺或三丙醇胺等烷醇胺；氣矽烷及烷氧基矽烷等。由於可進一步抑制高溫下之保護膜之黃變，故可與上述無機填充料（C)之酸性部位反應之化合物較好的是鹼性化合物。於驗性化合物之情形時，可進一步提高無機填充料 (C)之鹼性。由於可進一步抑制高溫下之保護膜之黃變，故上述驗性化合物較好的是選自由多元醇、烧醇胺及院氧基石夕燒所組成之群中之至少丨種，特別好的是烷醇胺。於烧醇胺之情形時’保護膜於高溫下極不易黃變。作為使無機填充料（C)、與可與無機填充料（c)之酸性部位反應之化合物進行反應之方法，可列舉以下方法等：於流體能量粉碎機或衝擊粉碎機等乾式粉碎射放入上述化合物與無機填純（c)，將無機填充料（c)粉碎；⑺使用亨舍爾混合機或快速混合機等高速攪拌機，將上述化合物與經乾式粉碎之無機填充料（〇搜拌、混合；以及（3)於益機填充料（C)之水性漿料中添加上述化合物，加以搜拌。再者’本發明之感光性組合物除藉由煮沸法而測定之PH 值為6.8以上、11以下之無機填充料⑹以外，亦可含有藉由煮沸法而測定之pH值夫技機填充^ 達6.8,或者該PH值超出11之無 (其他成分） 147625.doc 1363931 為提高上述無機填充料（c)之鹼性，感光性組合物較好的是含有可與無機填充料（c)之酸·性部位反應之化合物。作為可與上述無機填充料（c)之酸性部位反應之化合物，適宜使用用以對無機填充料（c)進行表面處理之可與上述無機填充料（C)之酸性部位反應之化合物。可與上述無機填充料（C)之酸性部位反應之化合物可僅使用丨種，亦可併用2種以上。可與上述無機填充料（c)之酸性部位反應之化合物較好的是鹼性化合物。又，上述鹼性化合物更好的是選自由多疋醇、烷醇胺及烷氧基矽烷所組成之群中之至少丨種。於感光性組合物含有可與無機填充料（c)之酸性部位反應之化合物之情形時，於感光性組合物100重量％中，可與上述無機填充料（C)之酸性部位反應之化合物之含量較好的是(M重量。/。以上、10重量％以下。可與上述無機填充料（C)之酸性部位反應之化合物之含量在上述較佳範圍内之情形時，可進一步抑制高溫下之保護膜之黃變。為了提高保護膜之切割加工性，感光性組合物較好的是含有具有環狀醚骨架之化合物（D)。作為上述具有環狀醚骨架之化合物（D)，例如可列舉：雙酚S型環氧樹脂、鄰苯二甲酸二縮水甘油酯樹脂、異氰尿酸三縮水甘油®旨等雜環式環氧樹脂、聯二f苯紛型環氧樹脂、聯苯酚型環氧樹脂、四縮水甘油基二曱苯酚乙烷樹脂、雙朌A型環氧樹脂、氫化雙盼a型環氧樹脂、雙齡F型樹脂、漠化雙龄八型玉裒氧樹脂、苯㈣搭型玉裒氧樹脂、甲 147625.doc -19- 1363931 ㈣駿型環氧樹脂 '脂環式環氧樹脂、雙齡A之齡搭型環氧樹月曰、螯合物型環氧樹脂、乙二兹型環氧樹脂、含胺基之環氧樹脂、橡膠改質環氧樹脂、二環戊二稀紛型環氧樹月曰、聚石夕氧改質環氧樹脂及ε己内醋改質環氧樹脂。上述具有環狀醚骨架之化合物⑼可僅使用！種，亦可併用2種以上。本發明之感光性組合物亦可含有具有環狀謎骨架且不具有直㈣骨架之環氧化合物（Dl)。作為上述環氧化合物 (D1)，可列舉環氧化聚烯烴、二幾酸之縮水甘油醋、鄰苯 t甲，二縮水甘油醋樹脂、及異氰尿酸三縮水甘油醋等雜壤式環氧樹脂等。作為上述二幾酸，可列舉己二酸、鄰笨 H㈣«二甲酸及六氮鄰苯二甲酸等。上述環氧化合物（D1)可僅使用！種，亦可併用2種以上。其中，與不 :用該等化合物之情形相比較’於使用該等化合物之情形時，存在保護膜之切割加工性降低之情形。又壤氧化合物（D1)較好的是且古加奸的疋具有2個以上環狀醚骨迷具有環狀_骨架之化合物（D)之環狀㈣骨架較好的 ⑽架。上述環氧化合物(Dl)之環_骨架較 =骨架。作為具有環氧環己燒骨架且不呈骨架之環氧化合物’可列舉:3，，4，，_環氧環己基 Γ’4·"氧環己基…己二酸雙从環氧環己基甲基) 二氧乙基-3,4-環氧環己烧、檸檬稀二環氧化物及二、戍-烯二環氧化物》作為該環氧化合物之市售品 147625.doc •20- 舉 Celloxide 2021P(Daicel 公司製造）。具有環狀醚骨架之化合物（D)與聚合性烴聚合物（B)所具有之羧基等官能基反應而發揮作用，以使感光性組合物硬化。相對於上述聚合性烴聚合物（B)100重量份，上述具有環狀醚骨架之化合物（D)之含量之較佳下限為0.1重量份，更佳下限為1重量份，較佳上限為50重量份，更佳上限為30 重量份。當上述具有環狀醚骨架之化合物（D)之含量在上述較佳範圍内時，可進一步抑制保護膜之黃變。為減少暴露於高溫下時防焊膜黃變之擔憂，本發明之感光性組合物較好的是含有抗氧化劑。上述抗氧化劑較好的是具有路易斯鹼性部位。就進一步抑制保護膜之黃變之觀點而言，上述抗氧化劑較好的是選自由酚系抗氧化劑、磷系抗氧化劑及胺系抗氧化劑所組成之群中之至少1種。作為上述盼系抗氧化劑之市售品，可列舉：Irganox 1010、Irganox 1035、Irganox 1076、Irganox 1135、 Irganox 245、Irganox 259、及 Irganox 295(以上均由 Ciba Japan公司製造）；Adekastab AO-30、Adekastab AO-40、 Adekastab AO-50、Adekastab AO-60、Adekastab AO-70、 Adekastab AO-80、Adekastab AO-90、及 Adekastab AO-330(以上均由 Adeka 公司製造）；Sumilizer GA-80、 Sumilizer MDP-S、Sumilizer BBM-S、Sumilizer GM、 Sumilizer GS(F)、及Sumilizer GP(以上均由住友化學工業公司製造）；Hostanox O10、Hostanox 016、Hostanox 147625.doc -21 - 014、及 Hostanox 03(以上均由 Clariant公司製造）；Antage BHT ' Antage W-300 > Antage W-400 ' 及 Antage W500(以上均由川口化學工業公司製造）；以及Seenox 224M、及 Seenox 326M(以上均由Shipro Kasei公司製造）等。作為上述磷系抗氧化劑，可列舉環己基膦及三苯基膦等。作為上述磷系抗氧化劑之市售品，可列舉：ADK Stab PEP-4C、ADK Stab PEP-8、ADK Stab PEP-24G、ADK Stab PEP-36、ADK Stab HP-10、ADK Stab 2112、ADK Stab 260、ADK Stab 522A、ADK Stab 1178、ADK Stab 1500、ADK Stab C、ADK Stab 135A、ADK Stab 3010、及 ADK Stab TPP(以上均由 Adeka公司製造）；Sandostab P-EPQ及Hostanox PAR24(以上均由Clariant公司製造）；以及 JP_312L、JP-318-0、JPM-308、JPM-313、JPP-613M、 JPP-31、JPP-2000PT及JPH-3 800(以上均由城北化學工業公司製造）等。作為上述胺系抗氧化劑，可列舉：三乙胺、二氰二胺、三聚氰胺、乙基二胺基-均三11井、2,4-二胺基-均三畊、2,4-二胺基-6-曱苯基-均三畊、2,4-二胺基-6-二曱苯基-均三畊及四級銨鹽衍生物等。本發明之感光性組合物可含有溶劑。溶劑之偶極矩較好的是1 Debye以上。藉由使用偶極矩為1 Debye以上之溶劑，可提供適用期優異之感光組合物。上述無機填充料（C)較好的是滿足下述式（X卜於此情形時，可進一步提高保護膜之切割加工性。 147625.doc -22· 1363931 . [{(第1無機填充料之莫氏硬度）x(硬化後之感光性組合物 100體積％中之第丨無機填充料之含量(體積。/。川+ {(第2無機填充料之莫氏硬度）x(硬化後之感光性組合物_體積％中之第2無機填充料之含量（體積％))}+ {⑷無機填充料之莫氏硬度）x(硬化後之感光性組合物1 體積％中之第η 無機填充料之含量（體積。/〇))}]$ 4 ......(X) 為進一步提高感光性，本發明之感光性組合物較好的是 ^ 含有光聚合起始劑。作為上述光聚合起始劑，例如可列舉：醯基氧化膦、鹵曱基化三畊、函甲基化咩二唑、咪唑、安息香、安息香烷基醚、恩醌、笨并蒽酮、二苯甲酮、苯乙酮、9_氧硫口山口星、笨甲酸酯、吖咬、啡畊、二茂鈦、α—胺基烷基苯酮、肟、以及該等之衍生物。上述光聚合起始劑可僅使用】種，亦可併用2種以上。於含有上述光聚合起始劑之情形時，相對於上述聚合性 • 烴單體（A)及上述聚合性烴聚合物（B)之合計ι〇〇重量份，上述光聚合起始劑之含量之較佳下限為〇1重量份，更佳下限為1重量份，較佳上限為30重量份，更佳上限為丨5重里伤。於上述光聚合起始劑之含量在上述較佳範圍内之情形時，可進一步提高感光性組合物之感光性。又’本發明之感光性組合物亦可含有著色劑、填充劑、消泡劑、硬化劑、硬化促進劑、脫模劑、表面處理劑、阻燃劑、黏度調節劑、分散劑、分散助劑、表面改質劑、塑化劑、抗菌劑、防黴劑、調平劑 '穩定劑、偶合劑、防流 147625. doc -23- 掛劑或螢光體等。本發明之感光性組合物例如可藉由將各調配成分攪拌混合後’利用三輥機均勻地混合而製備。作為用以使感光性組合物硬化之光源，可列舉發出紫外線或可見光線等活性能量線之照射裝置。作為上述光源，例如可列舉：超高壓水銀燈 '深紫外線（Deep uv)燈、高壓水銀燈、低壓水銀燈、金屬鹵化物燈及準分子雷射。該等光源係根據感光性組合物之構成成分之感光波長而適當選擇。光之照射能量係根據所需膜厚或感光性組合物之構鲁成成分而適當選擇。光之照射能量通常在1〇〜3,〇〇〇 mj/cm2 之範圍内。 (LED元件）本發明之感光性組合物適宜用於形成led元件之保護膜’更適宜用於形成防焊膜。圖1以部分切口正面剖面圖’示意性地表示包括使用本發月之貫細形態之感光性組合物而形成之防焊膜的元件。鲁於圖1所示之LED元件！中，於基板2之上表面以積層有由感光性組合物形成之保護膜3。保護膜3為圖案膜。因此，於基板2之上表面以之一部分區域未形成保護膜3。於未形成保護膜3之部分之基板2之上表面2a設置有電極4a、 4b。基板2較好的是印刷配線板。於保護膜3之上表面33積層有lEd晶片7。於基板2上，隔著保護膜3而積層有LED晶片7。於LED晶片7之下表面73 147625.doc •24- ⑧ 之外周緣設置有端子8a、8b。藉由焊錫9a、9b，端子ι 8b與電極4a、4b電性連接》藉由該電性.連接，可對LED晶片7供給電力。 ' 藉由列舉本發明之具體實施例及比較例而闡明本發明。本發明並不限定於以下實施例。準備X下之丙烯酸聚合物1〜6、與無機填充料1〜Η。 (合成例1)丙烯酸聚合物1 φ 於具備溫度計、攪拌機、滴液漏斗及回流冷凝器之燒瓶中，添加作為溶劑之乙基卡必醇乙酸酯、及作為觸媒之偶氮又異丁腈，於氮氣環境下加熱至8〇t，以2小時滴加將甲基丙烯酸與甲基丙烯酸甲酯以30: 70之莫耳比混合而成之單體。滴加後攪拌丨小時，將溫度升至12(rc。其後進行冷卻添加相對於所得樹脂之所有單體單元之總莫耳量的莫耳比成為10之量之丙烯酸縮水甘油酯，使用溴化四丁基銨作為觸媒，於loot：下加熱30小時，使丙烯酸縮水甘油泰酯與羧基進行加成反應。冷卻後’自燒瓶中取出，獲得含有固體成分酸值為60 mg KOH/g、重量平均分子量為 15,000、雙鍵當量為〗，〇〇〇之含羧基之樹脂5〇重量％(不揮發成分）的溶液。以下，將該溶液稱為丙烯酸聚合物1。 (合成例2)丙烯酸聚合物2 於具備溫度計、攪拌機、滴液漏斗及回流冷凝器之燒瓶中，添加作為溶劑之乙基卡必醇乙酸酯、及作為觸媒之偶氮雙異丁腈，於氮氣環境下加熱至80°C，以2小時滴加將曱基丙烯酸、甲基丙烯酸甲酯及甲基丙烯酸苄酯以30: I47625.doc -25- 30 . 40之莫耳比混合而成之單體。滴加後，攪拌卜】、時，將溫度升至12G°C。其後，進行冷卻。添加相對於所得樹月:之所有單體單元之總莫耳量的莫耳比成為ι〇之量之丙婦駄縮尺甘油g曰，使用溴化四丁基銨作為觸媒，於1 〇〇。。下加熱30小時’使丙稀酸縮水甘㈣與叛基進行加成反声。冷卻後，自燒组中取出，獲得含有固體成分酸值為6〇叫 KOH/g、重量平均分子量為15 〇〇〇、雙鍵當量為工，_之含Mohs hardness of the material χ (the photosensitive composition after curing 1 〇〇 vol% of the first 〇 147625. doc 1363931 content of the inorganic filler (volume / /))}] ^ 4 (χ), the present invention The photosensitive composition preferably further contains a solvent, and the dipole moment of the solvent is 1 Debye or more. The solder resist composition of the present invention is a photosensitive composition constructed in accordance with the present invention. The photosensitive composition of the present invention is suitably used as a solder resist composition. [Effects of the Invention] The photosensitive composition of the present invention contains at least one of a polymerizable hydrocarbon monomer (A) and a polymerizable hydrocarbon polymer (B), and an inorganic filler (〇, and an inorganic filler (c) The pH value obtained by the boiling method is 6 8 or more, and the following is a treatment film which is not easily discolored even when exposed to two temperatures. Refraction at 465 mn of the above inorganic filler (C) When the rate is K8 or more and the inorganic filler (C) is a white filler, a white solder resist film having higher reflectance can be obtained. The above-mentioned inorganic filler (C) is made of an organic metal. When the oxide or the metal hydroxide is coated, it is almost independent of the type of the inorganic filler (c), and forms a protective film which is less likely to be discolored at a high temperature. Further, since the hardenability of the resin can be improved, The cutting processability of the protective film can be improved. Further, since the surface activity of the inorganic filler having photooxidation can be suppressed, it is possible to form a protective film which is difficult to deteriorate the resin even when irradiated with light. Acidity of filler (c) In the case of a compound which reacts at a site, a protective film which is less likely to be discolored even when exposed to a high temperature can be obtained. The yellowing of the protective film can be surely suppressed in the following cases: the above-mentioned polymerizable property 147625.doc 1363931, the tobacco monomer (4) has When the polymerizable hydrocarbon monomer (A) is run by liquid chromatography with mass spectrometry (10) in the bladder solution, 30% or more of the sheet composed of a component having a mass spectrometry peak of 500 or less. 'Area is the total peak area. [Embodiment] Hereinafter, the present invention will be described in detail. The photosensitive composition of β = month contains a polymerizable tobacco monomer (8) And at least one of a polymerizable substance (Β), which can be used only by using a polymerizable tobacco monomer (4) and a polymerizable hydrocarbon polymer (..., using an I-combined hydrocarbon soap (Α) 2 polymer (8) Further, the polymerizable hydrocarbon monomer (4) and the poly-S-smoke polymer (8) may be used only in silly or in combination with each other. (Polymerizable tobacco monomer (A)) is used as the above-mentioned polymerizable hydrocarbon monomer (4). For example, a monomer containing a polymerizable unsaturated group or a poly-containing polymer The monomer having a cyclic (tetra) group. The hydrazine is a functional group having a polymerizable unsaturated double bond such as a (meth) propylene fluorenyl group, and the like. The South Protective Film Office 1 is good, it is better, and it is preferably a fluorenyl group. The above 3 monomers having a polymerizable unsaturated group preferably have a fluorenyl group. The compound of the acrylonitrile group. The compound having a (meth) acrylonitrile group may, for example, be an alcohol such as ethylene glycol, f-oxytetraethylene glycol, polyethylene glycol or propylene glycol. Aromatic vinegar modified material; polyol, polyol ethylene oxide adduct or polyol propylene oxide adduct multi-component (Yinji) 147625.doc 1363931 acrylate modified substance; phenol, phenol ring (meth) acrylate modification of oxyethylene adduct or propylene oxide adduct of phenol; (meth)acrylic acid of glycidyl ether such as glycerol diglycidyl ether or trishydroxypropyl propane triglycidyl ether Brewing modified material; or melamine (mercapto) acrylate. Examples of the polyhydric alcohol include hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, and tris-hydroxyethyl isocyanurate. Examples of the phenolic (mercapto) acrylate include styrene (mercapto) acrylate and bisphenol A bis(meth) acrylate modified product. "(Meth)acryloyl fluorenyl" means propylene fluorenyl and methacryl fluorenyl. "(Meth)acrylic acid" means acrylic acid and methacrylic acid. "(Indenyl) acrylate" means acrylate and methacrylate. (Polymerizable hydrocarbon polymer (B)) Examples of the polymerizable hydrocarbon polymer (B) include an acrylic resin, an epoxy resin, and an olefin resin. Further, the "resin" is not limited to a solid resin, and includes a liquid resin and an oligomer. The above polymerizable hydrocarbon polymer (B) is preferably the following group-containing resin (a) to (4). (a) a base-containing resin obtained by copolymerization of an unsaturated carboxylic acid with a compound having a polymerizable unsaturated double bond (b) by a carboxyl group-containing (meth)acrylic copolymer resin and a ruthenium molecule The carboxyl group-containing resin (c) obtained by the reaction of an oxirane ring and an ethylene polymerizable property has one unsaturated compound and one compound (b2) having one double bond and one double bond. After reacting a compound of an epoxy group and a polymerizable unsaturated double bond with a copolymer having a polymerizable unsaturated double bond, 147625.doc 1363931., 'saturated or unsaturated polybasic acid anhydride and the resulting reactant The carboxyl group-containing resin (d) obtained by the reaction of the secondary hydroxyl group reacts the saturated or unsaturated polybasic acid anhydride with the hydroxyl group-containing polymer to 'have one epoxy group and one polymerizable unsaturated double in one molecule. Since the resin containing a hydroxyl group and a slow group obtained by reacting the compound of the bond with the produced carboxylic acid can further improve the heat resistance of the protective film, the polymerizable hydrocarbon polymer (B) is preferably the above (b) carboxyl group. Resin. The above-mentioned carboxyl group-containing (meth)acrylic copolymer resin (b1) can be, for example, a compound having (indenyl) propionate (bbl) and one unsaturated group and at least one carboxyl group in one molecule ( Bb2) obtained by copolymerization. Examples of the above (fluorenyl) acrylate (bbl) include methyl (meth) acrylate, ethyl (mercapto) acrylate, propyl (mercapto) acrylate, and butyl (meth) acrylate. Ethyl acrylate and hexyl (meth) acrylate. Further, examples of the (meth) acrylate (bb 1)' include a hydroxyl group-containing (meth) acrylate and a diol-modified (meth) acrylate. The above (meth)acrylic acid vinegar (bb 1) may be used alone or in combination of two or more. Examples of the hydroxyl group-containing (fluorenyl) acrylate include 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, and caprolactone. 2-hydroxyethyl (meth)acrylate or the like. Examples of the diol-modified (mercapto) acrylate include decyloxy diethylene glycol (mercapto) acrylate, ethoxy diethylene glycol (meth) acrylate vinegar, and isooctyloxy diacetate. Glycol (mercapto) acrylate, phenoxy triethylene glycol (meth) acrylate, formazan triethylene glycol (meth) acrylate, and decyl poly polyethylene 147625.doc • 11 - 1363931 Glycol (meth) acrylate. The compound _)' having one polymerizable unsaturated group and at least one carboxy group in the above-mentioned one molecule may be exemplified by a chain-extension-modified unsaturation between (meth)propionic acid, an unsaturated group and a tickic acid. Monocarboxylic acid, (mercapto)acrylic acid, carboxyethyl styrene, 2-propene oxyethyl succinyl (tetra), 2- propylene oxiranyloxyhexafluorophthalic acid, modified by internal modification, etc. S is a compound having two or more substituents in an anthracene molecule such as an unsaturated mono-repulsive acid having an ether bond, a modified unsaturated monobasic acid having an ether bond, and a cis-succinic acid. The above compound 胂2) may be used alone or in combination of two or more. Examples of the compound (b2) having an epoxy group and an ethylenically unsaturated group in the above-mentioned one molecule include (meth)acrylic acid glycidyl vinegar and (mercapto)acrylic acid α-methyl glycidol vinegar. , (Meth)acrylic acid 3, heart epoxy cyclohexyl, ((mercapto)-propionic acid 3,4_epoxycyclohexylacetic acid, (mercapto)acrylic acid 3'4-alkaline ring Hexyl butyl, and 3,4 epoxycyclohexylmethylamino group f, of which 'preferably (meth)(tetra) acid 3,4. epoxycyclohexyl ketone. The above-mentioned compound (10) may be used alone or in combination of two or more. The above polymerizable tobacco monomer (4) is preferably a liquid chromatography method (LC/ with mass spectrometry analysis) in a solution having two or more polymerizable unsaturated groups: and in an acetonitrile:water = 1: U volume ratio. MS) In the case of the above polymerizable hydrocarbon monomer (4), the peak area composed of a component having a fragment peak of 5 Å or less by mass enthalpy analysis is 30% or more of the total peak area. : It is composed of the following components of the fragmentation peak by mass spectrometry = the polymerizable smoke having an area of more than or equal to the total peak area: ethylene glycol, f-oxytetraethylene glycol, and polyethylene glycol. G-alcohol or propylene glycol, etc. M7625.doc -12· diol di(meth)acrylic acid brewing modified material; polyol, polyol ethylene oxide adduct or polyol propylene oxide adduct Poly (meth) acrylate vinegar modified; glycerol hexahydrate adduct of pentylene oxide adduct or phenol propylene oxide adduct; glycerol diglycidol puzzle or A modified (meth)acrylic acid modified product of triglycidyl triglycidyl or the like; or melamine (meth)acrylic acid vinegar. The polyhydric alcohol' may, for example, be hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol or tri-ethylidene isocyanurate. Examples of the phenolic (meth)acrylic acid vinegar include phenoxy (meth)acrylic acid vinegar and (iv) A bis(meth)acrylic acid vinegar modified product. The weight average molecular weight in terms of polystyrene obtained by GPC (gel permeation chromatography) measurement of the polymerizable hydrocarbon monomer (A) is preferably 7 Å or less. By the weight average molecular weight of 700 or less, the yellowing of the protective film can be more reliably suppressed. When the weight average molecular weight is 15 mg of the polymerizable hydrocarbon monomer (A) dissolved in THF (tetrahydrofuran, tetrahydrofuran η m) L and measured by GPC, it is measured as a molecular weight obtained in terms of polystyrene. Among the above-mentioned polymerizable hydrocarbon monomer and polymerizable hydrocarbon polymer, J/one contains one or more polymerizable unsaturated double bonds and two or more carboxyl groups, and is polymerized as a polymerizable hydrocarbon monomer (A) and a polymerizable hydrocarbon. The whole body has a weight average molecular weight of 5, 〇〇〇~5〇, 〇〇〇, and a solid component acid value of 30 to 150 mg KOH/g, and a double bond equivalent of 5 〇 2 〇〇〇 g / eq If the above weight average molecular weight is 5〇〇〇~5〇〇〇〇, the solid component acid value is 30-150 mg KOH/g, and the double bond equivalent is 5〇~2 〇〇〇g/eq 'the sense 147625 .doc •13· 1363931 The excellent photo-developing composition is more excellent in developability, and the processability of the protective film is different. The total amount of the polymerizable hydrocarbon monomer (A) and the polymerizable hydrocarbon polymer is 100 wt% of a polymerizable hydrocarbon. The content of the monomer (4) is preferably 5% by weight or more and 50% by weight or less. When the content of (4) is within the above range, the photosensitive composition can be sufficiently cured, and the cutting processability of the film can be further improved. Further, the crosslinking density of the protective film is moderate, and sufficient resolution can be obtained. In the case of the above-mentioned polymerizable hydrocarbon monomer (A) 1 (10% by weight), the content of the polymerizable hydrocarbon monomer having an alcoholic group is preferably 15% by weight or less. In this case, it is easy. The inorganic film (10) and (c) are inspected, and the protective film is easily subjected to a dicing process. Examples of the polymerizable hydrocarbon monomer (4) include quaternary tetraol tris(methyl)propanate (Inorganic filler (C). )) The inorganic filler (6) contained in the photosensitive composition of the present invention has a PH value of 6.8 or more and 11 or less as measured by Dharma. When the pH is lower than 6: 'protective film yellowing' and it is difficult to The protective film is subjected to a cutting process. Further, when the pH is higher than 11, the application period of the photosensitive conjugate is deteriorated. Since the yellowing of the protective film can be further suppressed, the inorganic filler (C) is The positive value of the stagnation method is 7 (^, 1 β 7.4 or more, and further preferably 8 1 is obtained from Kappa Mountain and 疋疋.1 U. Since the application period of the photosensitive composition can be made better, the inorganic filler (c) is determined by the Kaofo method. The pH value is preferably 1 〇.〇 or less, more preferably 9 〇 or less. The above-mentioned boiling method refers to a method of adding 5 g of the above inorganic filler 147625.doc (C) to pure water 1 The solution obtained by 〇〇mL* is heated to be boiled for 5 knives and then allowed to stand until it reaches 23° C. The boiling treatment liquid is obtained, and then the water of the amount of water evaporated by the material is added to the obtained stagnation treatment liquid to make the amount of water The pH of the obtained solution 2 was measured to be 100 mL. In the above-mentioned boiling/family method, specifically, a solution obtained by adding 5 g of the above inorganic filler (C) to 1 〇〇 mL of pure water is placed in a container having an opening. By heating the above container to heat the solution in the container 'to make the solution in the container' 'Feng Tengfu' after the state; after the state of the state is maintained for 5 minutes 4, the plug body is installed in the opening of the container to stand until 23t: So far, the Fo Teng treatment liquid was obtained. The plug body is removed from the opening of the container, and the amount of water evaporated by boiling is added to the obtained boiling treatment liquid, so that the amount of water becomes 100 mLe in the container, and the mouth-mounted plug body is shaken and mixed for 1 minute, and then allowed to stand for 5 minutes. . Thus, the measurement solution was obtained. The pH of the obtained measurement solution can be measured in accordance with the procedure described in JIS Z88-2. The energy gap of the inorganic filler (C) is preferably 25 eV or more and 7 eV, and when the band gap is less than 2.5 eV, the insulation of the solder resist film is low. When the above band gap is higher than 7 eV, there is a tendency that the anti-tan film is liable to yellow when exposed to high temperatures. Preferably, the inorganic filler ((:) has a refractive index of 465 nm on i 8 X, and the inorganic filler (C) is a white filler. In this case, it is suitable for printing for LEDs. A photosensitive composition of a white solder resist film such as a wiring board. Further, if the refractive index is 1" or more, a high reflection required for a white solder resist film for a substrate on which an LED is mounted can be obtained. 15· 丄 as the above-mentioned white filler, J n芈. titanium oxide, zirconium oxide, cerium oxide, oxidized word 'lead white, 栌丨 / 丨 I · 辞 ' 'potassium titanate and lead titanate, etc. Further suppressing the aging, σ τ ask / the yellowing of the protective film under the dish, so it is better to be titanium oxide. The average amount of the above white filler is pure, please be in the range of seven (four), better The above inorganic filler (C) is preferably rutile-type titanium oxide. In the case of rutile-type titanium oxide, the solder resist film is less susceptible to yellowing when exposed to high temperatures. The content of the inorganic filler (6) in the 100% by weight of the 0 f photo-tanning composition (4) is 3 weights ^ 8G weight When the amount of the inorganic filler (C) exceeds 80% by weight, the amount of the inorganic filler (C) is more than 80% by weight when the inorganic filler (C) is more than 80% by weight. It is difficult to prepare an inert form of a photosensitive composition having a viscosity suitable for coating. A lower limit of the content of the inorganic filler (6) in the weight percent of the photosensitive composition (10) is 1 〇 by weight. 75 parts by weight. In order to make the surface alkaline, it is preferred that the above inorganic filler (C) is coated with an alkali metal oxide or an alkali metal hydroxide. When the film is exposed to the enthalpy temperature, the solder resist film is less likely to be yellowed. The above-mentioned basic metal oxide or alkali metal hydroxide may be used alone or in combination of two or more. Or a basic metal hydroxide may be a metal compound containing magnesium, lanthanum, cerium, lanthanum, cerium, lanthanum or calcium, etc. Since the yellowing of the solder resist film at a high temperature can be further suppressed, the above-mentioned basic gold 147625 is formed. Doc is an oxide or alkaline metal hydroxide The metal element is preferably at least one selected from the group consisting of town, erbium, yttrium, lanthanum, cerium, lanthanum, and calcium. The inorganic filler is further suppressed because the yellowing of the solder resist film at a high temperature can be further suppressed. The material (C) is preferably coated with a coating material containing zirconia. As the above-mentioned test metal oxide or organic metal hydroxide, it is preferable to use an oxidation error. From the above basic metal oxide or alkaline metal hydrogen The inorganic filler (C) coated with the oxide can be obtained, for example, by dispersing the inorganic filler (c) in water or a solution containing water as a main component to obtain a slurry, if necessary, by a sand mill. Or the ball mill or the like pulverizes the inorganic filler (C), and then the value of the slurry is 9 or neutral, and if necessary, k is added, and then the water-soluble salt which becomes the raw material of the coating material is added to In the slurry, the surface of the inorganic filler (C) is coated. Thereafter, the slurry is neutralized, and the inorganic filler is recovered (the Cp-recovered inorganic filler (C) can be dried or dry-pulverized). Further, in the photosensitive composition of the present invention, in addition to the above inorganic filler (4)) , if necessary, may also contain calcium carbonate, aluminum oxide, aluminum hydroxide, hydroxide, oxidized, nitrogen (tetra), nitrogen cut, nitrided butterfly, diamond powder, strontium sulfate, strontium oxide, talc, barium sulfate, titanium Acid bismuth, oxidized chin: clay: magnesium carbonate, magnesium hydroxide, mica, mica powder, sulfuric acid, zinc sulfide, cerium oxide, titanium nitride, barium fluoride and oxidation of the above inorganic filler (C) preferably have The acidic portion is satisfactorily improved, and the inorganic filler (c) is preferably subjected to surface treatment by a compound reactive with an acidic portion of the inorganic filler. 147625.doc 1363931 As a compound which can react with the acidic site of the above-mentioned inorganic filler (c), trihydroxy hydrazinopropane, trihydroxy decyl ethane, di-trihydroxy fluorenyl propyl hydride, and triterpene sulfhydryl group are mentioned. Polyhydric alcohols such as propylene oxide or pentaerythritol; alkanolamines such as monoethanolamine, monopropanolamine 'diethanolamine, dipropanolamine, triethanolamine or tripropanolamine; gas decane and alkoxydecane. Since the yellowing of the protective film at a high temperature can be further suppressed, the compound which can react with the acidic portion of the above inorganic filler (C) is preferably a basic compound. In the case of the test compound, the alkalinity of the inorganic filler (C) can be further improved. Since the yellowing of the protective film at a high temperature can be further suppressed, the above-mentioned test compound is preferably at least one selected from the group consisting of a polyhydric alcohol, an alkoxylamine, and a oxysulphate, and particularly preferably Alkanolamine. In the case of burning an alcohol amine, the protective film is extremely resistant to yellowing at high temperatures. As a method of reacting the inorganic filler (C) and a compound which can react with the acidic site of the inorganic filler (c), the following methods and the like are used: dry pulverization or the like is applied to a fluid energy pulverizer or an impact pulverizer. The above compound and inorganic filler (c), the inorganic filler (c) is pulverized; (7) using a high-speed mixer such as a Henschel mixer or a fast mixer, the above compound and the dry-pulverized inorganic filler (〇, And (3) adding the above compound to the aqueous slurry of the filler (C) and mixing it. Further, the photosensitive composition of the present invention has a pH of 6.8 or more as measured by boiling. In addition to the inorganic filler (6) of 11 or less, the pH value measured by the boiling method may be filled to 6.8, or the pH value exceeds 11 (other components). 147625.doc 1363931 To improve the above inorganic The alkali of the filler (c), the photosensitive composition preferably contains a compound which can react with the acid moiety of the inorganic filler (c). It reacts with the acidic portion of the inorganic filler (c). Chemical a compound which can be used for surface treatment of the inorganic filler (c) and which can react with the acidic portion of the above inorganic filler (C), and a compound which can react with the acidic portion of the above inorganic filler (C) can be used. Only two kinds of hydrazines may be used in combination. The compound which can react with the acidic site of the above-mentioned inorganic filler (c) is preferably a basic compound. Further, the above basic compound is more preferably selected from the group consisting of polyterpene alcohol. And at least one of a group consisting of an alkanolamine and an alkoxydecane. When the photosensitive composition contains a compound reactive with an acidic portion of the inorganic filler (c), the photosensitive composition is 100% by weight. The content of the compound which can react with the acidic site of the above-mentioned inorganic filler (C) is preferably (M by weight or more and 10% by weight or less. It can react with the acidic site of the above inorganic filler (C). When the content of the compound is within the above preferred range, the yellowing of the protective film at a high temperature can be further suppressed. In order to improve the cutting processability of the protective film, the photosensitive composition preferably contains the device. The compound (D) having a cyclic ether skeleton. Examples of the compound (D) having a cyclic ether skeleton include a bisphenol S type epoxy resin, a diglycidyl phthalate resin, and a isocyanuric acid tricondensate. Glycerol® equivalent heterocyclic epoxy resin, bi-f-phenylene epoxy resin, biphenol-based epoxy resin, tetraglycidyl dinonylphenol ethane resin, double-fluorene type A epoxy resin, hydrogenated double expectation A type epoxy resin, double age F type resin, desertified double age eight type jade oxygen resin, benzene (four) lap type jade oxygen resin, A 147625.doc -19- 1363931 (four) Chun type epoxy resin 'alicyclic type Epoxy Resin, Double Age A Ageing Epoxy Tree Moonch, Chelate Type Epoxy Resin, Ethylene Diene Epoxy Resin, Amine Based Epoxy Resin, Rubber Modified Epoxy Resin, Second Ring Ethylene pentoxide type epoxy tree moon 曰, poly stone oxime modified epoxy resin and ε hexamethylene vinegar modified epoxy resin. The above compound (9) having a cyclic ether skeleton can be used only! Two or more kinds may be used in combination. The photosensitive composition of the present invention may also contain an epoxy compound (D1) having a cyclic mystery skeleton and having no straight (tetra) skeleton. Examples of the epoxy compound (D1) include an epoxidized polyolefin, a glycidol of a diacid, a phthalic acid, a diglycidyl vinegar resin, and a heteropolyethylene epoxy resin such as isocyanuric acid triglycidyl vinegar. Wait. Examples of the above diacids include adipic acid, o-branched H(tetra)«dicarboxylic acid, and hexanitrophthalic acid. The above epoxy compound (D1) can be used only! Two or more kinds may be used in combination. However, in the case of using these compounds, there is a case where the cutting processability of the protective film is lowered in comparison with the case of using these compounds. Further, the soil oxygen compound (D1) is preferably an anthraquinone having two or more cyclic ether bones having a ring-shaped skeleton (d) having a ring-shaped (four) skeleton (10). The ring-skeleton of the above epoxy compound (Dl) is more than the skeleton. As the epoxy compound having an epoxy ring-fired skeleton and not being a skeleton, it can be exemplified by: 3, 4, _epoxycyclohexyl Γ '4·" oxycyclohexyl... adipic acid bis-epoxycyclohexyl Methyl) Dioxyethyl-3,4-epoxycyclohexane, lemon dibasic epoxide and di-p-alkenyl epoxide as a commercial product of the epoxy compound 147625.doc • 20- Celloxide 2021P (manufactured by Daicel). The compound (D) having a cyclic ether skeleton reacts with a functional group such as a carboxyl group which is contained in the polymerizable hydrocarbon polymer (B) to cause the photosensitive composition to be hardened. The preferred lower limit of the content of the compound (D) having a cyclic ether skeleton is 0.1 part by weight, more preferably 1 part by weight, and still more preferably 50% by weight based on 100 parts by weight of the polymerizable hydrocarbon polymer (B). The upper limit is preferably 30 parts by weight. When the content of the compound (D) having a cyclic ether skeleton is within the above preferred range, the yellowing of the protective film can be further suppressed. In order to reduce the fear of yellowing of the solder resist film when exposed to high temperatures, the photosensitive composition of the present invention preferably contains an antioxidant. The above antioxidant preferably has a Lewis basic moiety. In view of further suppressing the yellowing of the protective film, the antioxidant is preferably at least one selected from the group consisting of a phenolic antioxidant, a phosphorus antioxidant, and an amine antioxidant. As a commercially available product of the above-mentioned anti-oxidant, Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1135, Irganox 245, Irganox 259, and Irganox 295 (all of which are manufactured by Ciba Japan Co., Ltd.); Adekastab AO-30, Adekastab AO-40, Adekastab AO-50, Adekastab AO-60, Adekastab AO-70, Adekastab AO-80, Adekastab AO-90, and Adekastab AO-330 (all manufactured by Adeka); Sumilizer GA-80, Sumilizer MDP-S, Sumilizer BBM-S, Sumilizer GM, Sumilizer GS (F), and Sumilizer GP (all manufactured by Sumitomo Chemical Industries); Hostanox O10, Hostanox 016, Hostanox 147625.doc -21 - 014, and Hostanox 03 (The above are all manufactured by Clariant); Antage BHT ' Antage W-300 > Antage W-400 ' and Antage W500 (all manufactured by Kawaguchi Chemical Industry Co., Ltd.); and Seenox 224M, and Seenox 326M (all above by Shipro Kasei) Company manufacturing) and so on. Examples of the phosphorus-based antioxidant include cyclohexylphosphine and triphenylphosphine. As a commercial item of the above-mentioned phosphorus-based antioxidant, ADK Stab PEP-4C, ADK Stab PEP-8, ADK Stab PEP-24G, ADK Stab PEP-36, ADK Stab HP-10, ADK Stab 2112, ADK Stab 260, ADK Stab 522A, ADK Stab 1178, ADK Stab 1500, ADK Stab C, ADK Stab 135A, ADK Stab 3010, and ADK Stab TPP (all manufactured by Adeka); Sandostab P-EPQ and Hostanox PAR24 (all of which are ; manufactured by Clariant Co., Ltd.; and JP_312L, JP-318-0, JPM-308, JPM-313, JPP-613M, JPP-31, JPP-2000PT, and JPH-3 800 (all manufactured by Seongbuk Chemical Industry Co., Ltd.). Examples of the amine-based antioxidant include triethylamine, dicyandiamide, melamine, ethyldiamine-all-3, 2,4-diamino-average, and 2,4-diamine. -6-indole phenyl-average three-till, 2,4-diamino-6-diphenylene-average three-till and quaternary ammonium salt derivatives. The photosensitive composition of the present invention may contain a solvent. The dipole moment of the solvent is preferably 1 Debye or more. By using a solvent having a dipole moment of 1 or more, a photosensitive composition excellent in pot life can be provided. The inorganic filler (C) preferably satisfies the following formula (X), in this case, the cutting processability of the protective film can be further improved. 147625.doc -22· 1363931 . [{(1st inorganic filler Mohs hardness) x (content of the ninth inorganic filler in 100% by volume of the photosensitive composition after hardening (volume: / chuan + { (Mohs hardness of the second inorganic filler) x (sensitization after hardening) Content (% by volume) of the second inorganic filler in the composition _% by volume)}+ {(4) Mohs hardness of the inorganic filler) x (the ηth inorganic filler in 1% by volume of the photosensitive composition after curing) Content of the material (volume/〇))}]$4 (X) In order to further improve the photosensitivity, the photosensitive composition of the present invention preferably contains a photopolymerization initiator. The photopolymerization initiator may, for example, be a fluorenylphosphine oxide, a trihalogenated tri-negative, a methylated oxadiazole, an imidazole, a benzoin, a benzoin alkyl ether, an enema, a benzophenone, or a diphenyl group. Ketones, acetophenones, 9-oxosulfanyl Yamaguchi, benzoate, biting, cultivating, ferrocene, α-aminoalkylphenone, anthraquinone, and The photopolymerization initiator may be used alone or in combination of two or more. In the case of containing the photopolymerization initiator, the polymerizable hydrocarbon monomer (A) and The total lower limit of the content of the photopolymerization initiator is 〇1 part by weight, more preferably 1 part by weight, and still more preferably 30 parts by weight, based on the total weight of the polymerizable hydrocarbon polymer (B). More preferably, the upper limit is 丨5 weight loss. When the content of the photopolymerization initiator is within the above preferred range, the photosensitivity of the photosensitive composition can be further improved. Further, the photosensitive composition of the present invention is also It may contain coloring agent, filler, defoaming agent, hardener, hardening accelerator, mold release agent, surface treatment agent, flame retardant, viscosity modifier, dispersant, dispersing aid, surface modifier, plasticizer , antibacterial agent, antifungal agent, leveling agent 'stabilizer, coupling agent, anti-flow 147625. doc -23- Hanging agent or phosphor, etc. The photosensitive composition of the present invention can be stirred, for example, by mixing the ingredients After mixing, it was prepared by uniformly mixing using a three-roller. Examples of the light source for curing the photosensitive composition include an irradiation device that emits an active energy ray such as an ultraviolet ray or a visible ray. Examples of the light source include an ultrahigh pressure mercury lamp, a deep uv lamp, and a high pressure mercury lamp. a low-pressure mercury lamp, a metal halide lamp, and an excimer laser. These light sources are appropriately selected depending on the photosensitive wavelength of the constituent components of the photosensitive composition. The irradiation energy of the light is based on the desired film thickness or the composition of the photosensitive composition. It is suitably selected as a component. The irradiation energy of light is usually in the range of 1 〇 3 to 〇〇〇 mj/cm 2 (LED element) The photosensitive composition of the present invention is suitably used for forming a protective film of a LED element. Used to form a solder mask. Fig. 1 is a view schematically showing a solder resist film formed by using a photosensitive composition of a fine form of the present invention in a partially cut-away front cross-sectional view. Lu the LED components shown in Figure 1! In the upper surface of the substrate 2, a protective film 3 formed of a photosensitive composition is laminated. The protective film 3 is a pattern film. Therefore, the protective film 3 is not formed on a portion of the upper surface of the substrate 2 in a partial portion. Electrodes 4a, 4b are provided on the upper surface 2a of the substrate 2 where the protective film 3 is not formed. The substrate 2 is preferably a printed wiring board. An lEd wafer 7 is laminated on the upper surface 33 of the protective film 3. On the substrate 2, an LED wafer 7 is laminated via a protective film 3. Terminals 8a, 8b are provided on the outer periphery of the lower surface 73 147625.doc • 24-8 of the LED chip 7. By the solder 9a, 9b, the terminal ι 8b is electrically connected to the electrodes 4a, 4b". By this electrical connection, the LED wafer 7 can be supplied with electric power. The invention will be elucidated by enumerating specific embodiments and comparative examples of the invention. The invention is not limited to the following examples. Prepare acrylic polymer 1 to 6 under X and inorganic filler 1 to Η. (Synthesis Example 1) Acrylic Polymer 1 φ In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, ethyl carbitol acetate as a solvent and azo and isobutylene as a catalyst were added. The nitrile was heated to 8 Torr under a nitrogen atmosphere, and a monomer obtained by mixing methacrylic acid with methyl methacrylate at a molar ratio of 30:70 was added dropwise over 2 hours. After the dropwise addition, the mixture was stirred for a few hours, and the temperature was raised to 12 (rc. Thereafter, cooling was carried out to add a molar ratio of the molar amount of the total molar amount of all the monomer units of the obtained resin to 10, and bromine was used. Tetrabutylammonium was used as a catalyst and heated under a loot: for 30 hours to carry out an addition reaction of glycidyl acrylate with a carboxyl group. After cooling, it was taken out from the flask to obtain a solid content of 60 mg KOH/g. A solution having a weight average molecular weight of 15,000, a double bond equivalent of 〇, and a carboxyl group-containing resin of 5% by weight (nonvolatile content). Hereinafter, this solution is referred to as acrylic polymer 1. (Synthesis Example 2) Acrylic polymer 2 is added to a flask equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser, and ethyl carbitol acetate as a solvent and azobisisobutyronitrile as a catalyst are added under a nitrogen atmosphere. The mixture was heated to 80 ° C, and a monomer obtained by mixing methacrylic acid, methyl methacrylate and benzyl methacrylate at a molar ratio of 30:I47625.doc -25 to 30.40 was added dropwise over 2 hours. After the addition, after mixing, The temperature is raised to 12 G ° C. Thereafter, cooling is carried out. The molar ratio of the total molar amount of all the monomer units to the obtained tree month is added to become the amount of gamma 駄甘油 glycerin g 曰, using bromine Tetrabutylammonium was used as a catalyst at 1 〇〇. Heating for 30 hours to make the acrylic acid condensed (4) and the ruthenium base added anti-sound. After cooling, it was taken out from the burning group to obtain a solid component acid. The value is 6 KOH KOH / g, the weight average molecular weight is 15 〇〇〇, the double bond equivalent is for work, _ contains

緩基之樹脂50重量％(不揮發成分）的溶液。以下，將該溶液稱為丙烯酸聚合物2。 (合成例3 )丙烯酸聚合物3A solution of 50% by weight (nonvolatile component) of the slow-acting resin. Hereinafter, this solution is referred to as acrylic polymer 2. (Synthesis Example 3) Acrylic Polymer 3

於具備溫度計、攪拌機、滴液漏斗及回流冷凝器之燒瓶中添加作為/谷劑之乙基卡必醇乙酸酯、及作為觸媒之偶氮雙異丁腈’於氮氣環境下加熱至贼，以2小時滴加將甲基丙烯酸、甲基丙烯酸甲酯及甲基丙烯酸苄酯以3〇: 30 : 40之莫耳比混合而成之單體。滴加後，攪拌$小時，將溫度升至120 C。其後，進行冷卻。添加相對於所得樹脂之所有單體單元之總莫耳量的莫耳比成為1〇之量之丙烯酸縮水甘油酯，使用溴化四丁基銨作為觸媒，於】〇(rc下加熱30小時’使丙烯酸縮水甘油酯與羧基進行加成反應。冷卻後，自燒瓶中取出，獲得含有固體成分酸值為 60 mg KOH/g、重量平均分子量為10〇〇〇〇、雙鍵當量為1〇〇〇之含羧基之樹脂50重量％(不揮發成分）的溶液。以下，將該溶液稱為丙烯酸聚合物3。 (合成例4)丙烯酸聚合物4 147625.doc -26- ⑧ 。、備恤度。f、搜拌機、滴液漏斗及回流冷凝器之燒瓶中，添加作為溶劑之乙基卡必醇乙酸自旨、及作為觸媒之偶氮又異丁腈’於虱氣環境下加熱至80。。，以2小時滴加將曱基丙烯酸、甲基丙烯酸曱酯及甲基丙烯酸节酯以15: 35、： 5〇之莫耳比混合而成之單體。滴加後，搜拌i小時，將皿度升至12〇 c。其後，進行冷卻。添加相對於所得樹月曰之所有單體單兀之總莫耳量的莫耳比成為⑺之量之丙烯酸縮水甘油酯’使用溴化四丁基銨作為觸媒下加熱3〇小時’使㈣酸縮水甘油§旨與祕進行加成反應。冷部後’自燒瓶中取出，獲得含有固體成分酸值為Η叫 KOH/g、重量平均分子量為i4，麵、雙鍵當量為i，_之含缓基之树月a 50重1 %(不揮發成分）的溶液。以下將該溶液稱為丙烯酸聚合物4。 (合成例5)丙烯酸聚合物5 於八備酿度°十、攪拌機、滴液漏斗及回流冷凝器之燒瓶中添加作為/合劑之乙基卡必醇乙酸醋及作為觸媒之偶氮雙八丁腈於氮軋環境下加熱至8〇°c，以2小時滴加將甲基丙稀I、甲基丙烯酸甲酯及甲基丙烯酸苄酯以Μ : 5 · 10之莫耳比混合而成之單體。滴加後，授拌1小時，將 /皿度升至12G C ° #後’進行冷卻。添加相對於所得樹脂之所有單體單元之總莫耳量的莫耳比成為ig之量之丙烤酸縮水甘油知，使用溴化四丁基銨作為觸媒，於loot下加熱30小時’使丙烯酸縮水甘㈣與m基進行加成反應。冷卻後自k瓶中取出，獲得含有固體成分酸值為220呵 I47625.doc -27· KOH/g、重量平均分子量為17 〇〇〇、雙鍵當量為1〇〇〇之含羧基之樹脂50重量％(不揮發成分）的溶液。以下，將該溶液稱為丙烯酸聚合物5» (合成例6)丙烯酸聚合物6 於具備溫度計、槐拌機、滴液漏斗及回流冷凝器之燒瓶中，添加作為溶劑之乙基卡必醇乙酸酯、及作為觸媒之偶氮雙異丁腈，於氮氣環境下加熱至8〇〇c，以2小時滴加將曱基丙烯酸、曱基丙烯酸甲酯及甲基丙烯酸苄酯以22 5 : 37·5 : 40之莫耳比混合而成之單體。滴加後，攪拌丄小時，將溫度升至12〇°C。其後，進行冷卻。添加相對於所得樹脂之所有單體單元之總莫耳量的莫耳比成為2.5之量之丙稀酸縮水甘油醋’使用演化四丁基錄作為觸媒，於下加熱30小時，使丙烯酸縮水甘油自旨與減進行加成反應。冷卻後’自燒瓶中取出，獲得含有固體成分酸值為60 mg KOH/g、重量平均分早 Ί刀子$為18，_、雙鍵當量為 4,000之含羧基之樹脂50重量％( ·-’ 、小輝發成分）的溶液。以下’將該溶液稱為丙稀酸聚合物6。 (無機填充料（〇) 中將無機填充料丨之詳細情況示於下述表1 147625.doc 28· 1363931Adding ethyl carbitol acetate as a solvent and a azobisisobutyronitrile as a catalyst to a flask equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser to heat the thief under a nitrogen atmosphere A monomer obtained by mixing methacrylic acid, methyl methacrylate and benzyl methacrylate in a molar ratio of 3:30:40 was added dropwise over 2 hours. After the dropwise addition, the mixture was stirred for $hour, and the temperature was raised to 120 C. Thereafter, cooling is performed. Adding a molar ratio of the total molar amount of all the monomer units of the obtained resin to a molar ratio of 1 Torr of glycidyl acrylate, using tetrabutylammonium bromide as a catalyst, heating under rc for 30 hours. 'The addition reaction of glycidyl acrylate with a carboxyl group. After cooling, it was taken out from the flask to obtain a solid content of 60 mg KOH/g, a weight average molecular weight of 10 Å, and a double bond equivalent of 1 〇. A solution of 50% by weight (nonvolatile content) of a carboxyl group-containing resin. Hereinafter, this solution is referred to as an acrylic polymer 3. (Synthesis Example 4) Acrylic polymer 4 147625.doc -26- 8 . Adding f, the mixer, the dropping funnel and the reflux condenser to the flask, adding ethyl carbitol acetic acid as a solvent and heating the azo and isobutyronitrile as a catalyst in a helium atmosphere To 80%, the monomer obtained by mixing methacrylic acid, methacrylic acid methacrylate and methacrylic acid ester with 15:35, 5 莫 molar ratio was added dropwise over 2 hours. After mixing for 1 hour, raise the dish to 12 ° C. Then, cool it. Add The molar ratio of the total molar amount of all monomeric monoterpenes to the obtained tree sap is (7) The amount of glycidyl acrylate is heated by using tetrabutylammonium bromide as a catalyst for 3 hrs. The glycidol § is added to the secret reaction. After the cold part, it is taken out from the flask, and the acid value of the solid content is Η KOH/g, the weight average molecular weight is i4, and the surface and double bond equivalents are i, _ A solution of the slow-acting tree month a 50 weight 1% (non-volatile component). Hereinafter, this solution is referred to as acrylic polymer 4. (Synthesis Example 5) Acrylic polymer 5 in eight preparation degree °, mixer, drip To the flask of the funnel and the reflux condenser, ethyl carbitol acetate vinegar as a solvent and a azobisoctabutyronitrile as a catalyst were heated to 8 ° C in a nitrogen rolling environment, and the methyl group was added dropwise over 2 hours. A monomer obtained by mixing propylene I, methyl methacrylate and benzyl methacrylate with a molar ratio of Μ : 5 · 10 . After the addition, the mixture is stirred for 1 hour, and the degree of the dish is raised to 12 G C ° . Cooling after #后'. Adding the molar ratio of the total moles of all the monomer units of the obtained resin becomes ig The amount of propylene carbonate is known, using tetrabutylammonium bromide as a catalyst, heating at loot for 30 hours' to make the addition reaction of glycidyl acrylate (4) with m group. After cooling, it is taken out from the k bottle to obtain a solution containing 50% by weight (nonvolatile content) of a carboxyl group-containing resin having a solid content of 220 Å I47625.doc -27· KOH/g, a weight average molecular weight of 17 Å, and a double bond equivalent of 1 Å. Hereinafter, this solution is referred to as an acrylic polymer 5» (Synthesis Example 6) acrylic polymer 6 in a flask equipped with a thermometer, a chopper, a dropping funnel, and a reflux condenser, and ethyl carbitol as a solvent is added. The acetate and the azobisisobutyronitrile as a catalyst were heated to 8 〇〇c under a nitrogen atmosphere, and thioglycolic acid, methyl methacrylate and benzyl methacrylate were added dropwise at 22 hours over 2 hours. 5 : 37·5 : 40 moles of monomer mixed. After the dropwise addition, the temperature was raised to 12 ° C after stirring for a while. Thereafter, cooling is performed. Adding the molar amount of the total molar amount of all the monomer units of the obtained resin to 2.5 parts of the amount of acrylic acid glycidol vinegar using the evolved tetrabutyl group as a catalyst, heating under 30 hours to shrink the acrylic acid Glycerin reacts with the addition and subtraction. After cooling, it was taken out from the flask to obtain 50% by weight of a carboxyl group-containing resin having a solid content of 60 mg KOH/g, a weight average of knives of $18, and a double bond equivalent of 4,000 (--' , Xiaohui hair ingredients) solution. This solution is referred to as acrylic acid polymer 6. (Inorganic Filler (〇) The details of the inorganic filler 丨 are shown in Table 1 below. 147625.doc 28· 1363931

Η ^ 卜卜卜卜卜卜卜卜 ΟΟ 卜 CN CN CN — CN CN (Ν (Ν (Ν 卜 U-1 in ^3 寸 — 寸寸 — ^J- — CN — (N 实〇5? VS3 ©- ®- 喊朝朝澈 »1 'Ί »1 'Ί taj nV 杯奪瑞碡 m.l ^ 2 e N ΰ5 Ν ΰ5 « 5 ^ z A1 > Si ， Ψ 1 < ， • * , ψ 4 f 1 t 1 蛛1 v〇 ν〇 VO ν〇 VO VO VO Os CN CN CN CN oi (Ν CN CN <Ν 帶隙能 (eV) Ο rn 乏〇 cn ο cn 〇 CO Ο rn vd l〇 Os 煮沸法 pH值 Ξ 〇〇6 〇\ 寸〇 VO vd (Ν \ό 1—^ iT) m 寧學 ±i ±i ±i jJ 键 1 1 1 sd 1 枇龚 Me与 Η(与 nnjc -4〇喊·φ* Μ επ|； -4〇 Β~ 命 θ~命衾衾¥ 屮卑屮寒屮寒 <〇B ^ <00 ^ 田 <〇ffi ^/ 4潜芻韹 jra 琳棘 m m 麵 ο S eg CJ 謝' 娜! λ 蝴j a α, m υ 噼 -4 B 珐 νς m < CN (N OO 卜〇 v〇 R-102 ON m U 〇\ ώ ώ ώ ώ γπ pL cu 〇 Q 口 U U u Ο U ω 00 6 Z r-H (N cn 寸卜〇〇 ΟΝ ο 填 jj Jj Ί 147625.doc -29- 1363931 於上述表1中’無機填充料1〜8相當於由鹼性金屬化合物或驗性金屬氫氧化物所被覆之無機填充料。對無機填充料進行表面處理時，當金屬種為A1之情形時，可使用氫氧化铭或氧化铭’當金屬種為Si之情形時，可使用氧化妙，當金屬種為Zr之情形時，可使用氧化锆。又’於上述表1中’無機填充料丨〜5係由有機材料進行表面處理。 (其他成分及成分之比重）下述實施例、比較例及參考例中適宜使用下述表2所示 _ 之成分。於表2中，將各成分之比重一併表示》Η ^ 卜卜卜卜卜卜卜ΟΟ Bu CN CN CN — CN CN (Ν (Ν (Ν U U-1 in ^3 inch — inch inch — ^J- — CN — (N 实〇5? VS3 ©- ®- shouting towards the clear»1 'Ί »1 'Ί taj nV cup 碡碡 ml ^ 2 e N ΰ 5 Ν ΰ 5 « 5 ^ z A1 > Si , Ψ 1 < , • * , ψ 4 f 1 t 1 spider 1 v〇ν〇VO ν〇VO VO VO Os CN CN CN oi (Ν CN CN <Ν band gap energy (eV) Ο rn 〇 ο cn 〇CO Ο rn vd l〇Os boiling method pH Value Ξ 〇6 〇\ inch 〇 VO vd (Ν \ό 1—^ iT) m 宁学±i ±i ±i jJ key 1 1 1 sd 1 枇 Gong Me and Η (with nnjc -4 · · φ * ε επ|; -4〇Β~ 命θ~命衾衾¥ 屮屮寒屮寒<〇B ^ <00 ^ 田<〇ffi ^/ 4 刍韹刍韹 jra 琳棘 mm face ο S Eg CJ 谢' 娜! λ jaα α, m υ 噼-4 B 珐νς m < CN (N OO 〇〇 v〇R-102 ON m U 〇 ώ ώ ώ ώ γπ pL cu 〇Q mouth UU u Ο U ω 00 6 Z rH (N cn inch 〇〇ΟΝ ο 填 fill jj Jj Ί 147625. Doc -29- 1363931 In the above Table 1, 'inorganic fillers 1 to 8 correspond to inorganic fillers coated with an alkali metal compound or an organic metal hydroxide. When the inorganic filler is subjected to surface treatment, when the metal species is A1, it may be used when the metal species is Si, when the metal species is Si, when the metal species is Zr, Zirconium oxide can be used. Further, in the above Table 1, the inorganic fillers 丨 5 were surface-treated with an organic material. (Specific Gravity of Other Components and Components) In the following examples, comparative examples and reference examples, the components shown in Table 2 below were suitably used. In Table 2, the proportion of each component is expressed together.

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〔3屯〕比泣寸寸· Τ—· CN 〇〇 MMA/MAA/GMA 聚合物 MM A/B zMA/MAA/GMA 聚合物 Mw 為 100,000 酸值為20以下酸值為20以下雙鍵當量為1,000以上 -M 〇 m 嚭 v8 舍蹵怒 §命贫2 M W 罗W ^ 〇 (J CU J 〇阳阳 Μ 〇 m 箔佰 Μ 髮嫠 «韜 φ- 5^- §伞 VII ^ ^ 〇J ^ -J 11 给成 Έ i>k ^ m 今U u j α W. W 利用LC-MS測定之MS之碎片峰S 500之面積為30%以下利用GPC測定之Mw為700以上之聚合性烴單體偶極矩為1 Debye以上偶極矩為0.38 Debye 丙烯酸聚合物-1 丙烯酸聚合物-2 丙烯酸聚合物-3 丙歸酸聚合物_4 丙烯酸聚合物-5 丙稀酸聚合物-6 二季戊四醇六丙烯酸酯(DPHA) 三經曱基丙坑三丙稀酸酯季戊四醇三丙烯酸酯二季戊四醇四丙烯酸酯 ΤΪ7 <5 ΧΛ C •e 0< iim gi ?S §_韧 λ七殳窗塯 &- 娜 rO 13 rn •1备 β ®- 亡硪 S r〇 2齡〇龄 =3 4 U /—S w盟 <ί溲齋ψ 碉塄 m w\ 在键 0碜 ε ^ H ^ y << $蛛 if 5¾ 〇影 E 5 乙基卡必醇乙酸酯甲苯丙烯酸聚合物丙烯酸單體環氧化合物溶劑 -31 - 147625.doc 1363931 (實施例1) 將15重量份之丙烯酸聚合物1、5重量份之DPHA(二季戊四醇六丙烯酸酯）、40重量份之D-918(金紅石型氧化鈦，得化學公司製造）、2重量份之光聚合起始劑（TPO，光自由基產生劑，日本Siber Hegner公司製造）、8重量份之828(雙驗A型環氧樹脂’ japarl Epoxy Resins公司製造）、及3〇重量份之乙基卡必醇乙酸酯進行調配’利用混合機（練太郎 SP-500 ’ Thinky公司製造）混合3分鐘後，以三報機進行混合’從而獲得混合物。其後，使用SP-500，將所得之混合 _ 物消泡3分鐘，藉此獲得作為感光性組合物之阻劑材料。 (實施例2〜47、比較例1〜8及參考例1、2) 除將所使用材料之種類及調配量變更為下述表3〜表9所示以外，以與實施例1相同之方式獲得阻劑材料。 (評價） (1)測定樣品之製作準備80 mmx90 mm、厚度為0.8 mm之FR-4之基板。於該基板上’藉由絲網印刷法，使用1 〇〇網眼之聚酯斜裁製鳙版’以整體圖案印刷阻劑材料。印刷後，於8 之烘箱内乾燥20分鐘’於基板上形成阻劑材料層。繼而，經由具有特定圖案之光罩，使用紫外線照射裝置，以照射能量成為 400 mJ/cm2之方式，以100 mW/cm2之紫外線照度，對阻劑材料層照射4秒鐘波長為365 nm之紫外線。其後，為去除未曝光部之阻劑材料層以形成圖案，而將阻劑材料層浸潰於碳酸鈉之1重量％水溶液中，進行顯影，從而於基板上 147625.doc ⑧ •32· 形成保護膜。其後，於15(TC之烘箱内加熱丨小時，使保護膜進行後硬化，藉此獲得作為測定樣品之保護膜。所得保 5蒦膜之厚度為2 0 μιη 〇 (2) 耐熱性將測定樣品放入加熱烘箱内，於27〇〇c下加熱5分鐘。使用色彩·色差計（Konica Minolta公司製造，CR-400)，測定經熱處理前之評價樣品之以、a*、b* ^又，測定經熱處理後之評價樣品之L*、a*、b*，由該等2個測定值求出 △ E ab。將經熱處理後之評價樣品之ΔΕ*α為2以下之情形評價為「〇〇」，超出2且為3以下之情形評價為「〇」，超出 3且為3.5以下之情形評價為r △」，超出3 5之情形評價為「χ」’將結果示於下述表3〜表9中。 (3) 耐光性使用uv照射機，以照射能量成為100 J/cm2之方式，對測疋樣品照射365 nm之波長之光。使用色彩色差計（Konica Minolta公司製造，CR-4〇0)，測定經UV照射前之評價樣品之L*、a*、b*。又，測定經 UV照射後之評價樣品之L*、a*、b*，由該等2個測定值求出△E*ab。將經UV照射後之評價樣品之AE*ab為1以下之情形評價為「〇〇」，超出！且為2以下之情形評價為「〇」，超出2且為3以下之情形評價為「△」，超出3之情形評價為」’將結果不於下述表3〜表9中0 (4) 切割加工性使用剪切機，對上述中製作之測定樣品（保護膜）進行 147625.doc 1363931 切割後，於270°C下加熱5分鐘。以目視確認加熱後之測定樣品之邊緣之裂痕及缺損狀態。以下述評價基準判定切割加工性。 [切割加工性之評價基準] 〇：以目視完全未確認到裂痕及缺損 △.以目視於切割部確認到部分裂痕或缺損 χ .以目視於切割部之整個範圍確認到裂痕或缺損 (5) 適用期利用v型黏度計測定剛製作之阻劑材料、與放置1日後之阻Θ]材料之黏度（25 C )’求出黏度之變化比。根據變化比’以下述評價基準判定適用期。 [適用期之評價基準] 〇：變化比未達1.1 △:變化比為1 · 1以上、未達i 5 x :變化比為1.5以上 (6) 顯影性以目視確認測定樣品之顯影圖案，以下述評價基準判定顯影性。 [顯影性之評價基準] 〇：以目視確認到圖案 x :以目視未確認到圖案將結果示於下述表3〜9中。 147625.doc 1363931[3屯] Weeping inch Τ·· CN 〇〇MMA/MAA/GMA Polymer MM A/B zMA/MAA/GMA Polymer Mw is 100,000 Acid value is 20 or less Acid value is 20 or less Double bond equivalent is 1,000 Above -M 〇m 嚭v8 House anger § life poor 2 MW Luo W ^ 〇 (J CU J 〇阳阳Μ 〇m foil 佰Μ hair 嫠«韬φ- 5^- § umbrella VII ^ ^ 〇J ^ - J 11 Έ Έ i>k ^ m Current U uj α W. W The area of the fragment peak S 500 of MS measured by LC-MS is 30% or less. The polymerizable hydrocarbon monomer couple having a Mw of 700 or more as measured by GPC The moment is 1 Debye and the dipole moment is 0.38 Debye Acrylic Polymer-1 Acrylic Polymer-2 Acrylic Polymer-3 Acryl Polymer _4 Acrylic Polymer-5 Acrylic Polymer-6 Dipentaerythritol Hexa Acrylic Acid Ester (DPHA) triterpene thiophene propyl triacrylate pentaerythritol triacrylate dipentaerythritol tetraacrylate ΤΪ7 <5 ΧΛ C •e 0< iim gi ?S §_tough λ 殳殳塯 &- na rO 13 rn •1备β®- 硪S r〇2 Age ==3 4 U /—S w 盟<ί溲斋ψ 碉塄mw\ at key 0碜ε ^ H ^ y << $ If 53⁄4 E E E Ethyl carbitol acetate toluene acrylic acid polymer acrylic monomer epoxy compound solvent - 31 - 147625.doc 1363931 (Example 1) 15 parts by weight of acrylic polymer 1, 5 parts by weight DPHA (dipentaerythritol hexaacrylate), 40 parts by weight of D-918 (rutile-type titanium oxide, manufactured by Chemical Co., Ltd.), and 2 parts by weight of photopolymerization initiator (TPO, photoradical generator, Siber, Japan) Manufactured by Hegner Co., Ltd., 8 parts by weight of 828 (double-type A-type epoxy resin 'made by japarl Epoxy Resins Co., Ltd.), and 3 parts by weight of ethyl carbitol acetate to prepare 'utilizing a mixer (Lantaro SP -500 'manufactured by Thinky Co., Ltd.) After mixing for 3 minutes, mixing was carried out in a three-machine machine to obtain a mixture. Thereafter, the resulting mixture was defoamed for 3 minutes using SP-500, whereby a photosensitive composition was obtained. Resistant materials (Examples 2 to 47, Comparative Examples 1 to 8 and Reference Examples 1 and 2) Except that the types and amounts of materials used were changed to those shown in Tables 3 to 9 below, The resist material was obtained in the same manner as in Example 1. (Evaluation) (1) Preparation of measurement sample A substrate of FR-4 of 80 mm x 90 mm and a thickness of 0.8 mm was prepared. On the substrate, the resist material was printed in a unitary pattern by a screen printing method using a 1 〇〇 mesh polyester slanted stencil. After printing, it was dried in an oven at 8 for 20 minutes to form a layer of a resist material on the substrate. Then, the resist material layer was irradiated with ultraviolet rays having a wavelength of 365 nm for 4 seconds by irradiation with an ultraviolet ray illumination of 100 mW/cm 2 through a photomask having a specific pattern with an irradiation energy of 400 mJ/cm 2 . . Thereafter, in order to remove the resist material layer of the unexposed portion to form a pattern, the resist material layer is immersed in a 1% by weight aqueous solution of sodium carbonate, and developed to form 147625.doc 8 •32· on the substrate. Protective film. Thereafter, the protective film was post-hardened in an oven of 15 (TC) for a post-hardening, thereby obtaining a protective film as a measurement sample. The thickness of the obtained film was 20 μm 〇 (2) heat resistance was measured. The sample was placed in a heating oven and heated at 27 ° C for 5 minutes. Using a color and color difference meter (manufactured by Konica Minolta Co., Ltd., CR-400), the evaluation sample before heat treatment was measured, a*, b*^ The L*, a*, and b* of the evaluation sample after the heat treatment were measured, and Δ E ab was obtained from the two measured values. The case where the ΔΕ*α of the evaluated sample after the heat treatment was 2 or less was evaluated as “ 〇〇", the case where the value exceeds 2 and is 3 or less is evaluated as "〇", and the case where the value exceeds 3 and is 3.5 or less is evaluated as r △", and the case where the value exceeds 3 5 is evaluated as "χ". The results are shown in the following table. 3 to Table 9. (3) Light resistance Using a uv irradiator, the illuminating sample is irradiated with light of a wavelength of 365 nm so that the irradiation energy is 100 J/cm2. Using a color difference meter (manufactured by Konica Minolta, CR) -4〇0), the L*, a*, b* of the evaluation sample before the UV irradiation was measured. Further, the UV was measured. ΔE*ab was obtained from the two measured values of L*, a*, and b* of the evaluation sample after the irradiation. The case where the AE*ab of the evaluation sample after the UV irradiation was 1 or less was evaluated as "〇" 〇", exceeds! The case of 2 or less is evaluated as "〇", and the case where it exceeds 2 and is 3 or less is evaluated as "△", and the case where it exceeds 3 is evaluated as "'. The result is not as shown in Table 3 to Table 9 below. Medium 0 (4) Cutting processability The measurement sample (protective film) prepared above was cut by 147625.doc 1363931, and then heated at 270 ° C for 5 minutes. The sample after heating was visually confirmed. Cracking and defect state of the edge. The cutting workability was determined by the following evaluation criteria. [Evaluation criteria for cutting workability] 〇: Cracks and defects were not observed at all by visual observation. Δ. Partial cracks or defects were visually observed in the cutting portion. Visually identify the crack or defect in the entire range of the cutting part. (5) Applicable period. Determine the viscosity of the newly formed resist material by using a v-type viscometer and the viscosity of the material after 1 day of placement (25 C ). Change ratio. According to the change ratio, the following evaluation base [Applicable period of evaluation] 〇: The change ratio is less than 1.1 △: The change ratio is 1 · 1 or more, and the change ratio is less than 1.5. In the development pattern, the developability was judged by the following evaluation criteria. [Evaluation criteria of developability] 〇: The pattern x was visually confirmed: The pattern was not visually confirmed. The results are shown in Tables 3 to 9 below. 147625.doc 1363931

【εϊ 實施例11 vn <N oo CO ο GO oi 〇 oo 〇 < 〇〇實施例丨ο | 的 KT) (N oo 〇 cn m oi 〇 oo ο 〇〇 X 〇〇實施例9 w-i w-i (N 00 〇 On 00 〇〇〇\ ο 〇〇 < 〇〇實施例8 U~) <N oo 〇 On as (N 〇〇 < 〇〇實施例7 U~) (N oo r〇 cs 〇 ON 〇 0 〇〇實施例6 | κη CN oo 〇 00 (N 〇〇 <1 〇〇實施例5 | κη (N 00 〇 (N 寸 <N 〇 (N 〇 <3 〇〇實施例4 yr) fN oo 〇 oi (N 〇〇 < 〇〇實施例3 yn ^Τ) (N oo 〇 (N <N 〇〇 < 〇〇實施例2 yr^ ψ · (N oo 〇 CN 〇 cs 〇〇 os o 〇〇 <] 〇〇實施例1 | vn r-^ tn CN oo 〇 oi OS 〇〇 Os o 〇〇 < 〇〇丙烯酸聚合物-1 DPHA o H 00 cs oo 乙基卡必醇乙酸酯 D-918 UT771 CR-50-2 R-102 CR-90-2 CR-97 CR-50 CR-90 r*j cL CU UJ SO-C3 式(X)之左邊之值 △E*ab △E*ab 丙烯酸聚合物丙烯酸單體起始劑環氧化合物 1 氧化鈦氧化锆二氧化矽莫氏硬度指標时熱性而ί光性切割加工性適用期顯影性驿齧嗜Φ〇ΝΦ1牟） -35- 147625.doc 1363931 [表4][εϊ Example 11 vn <N oo CO ο GO oi 〇oo 〇< 〇〇 Example 丨ο | KT) (N oo 〇cn m oi 〇oo ο 〇〇X 〇〇Example 9 wi wi ( N 00 〇On 00 〇〇〇\ ο 〇〇< 〇〇Example 8 U~) <N oo 〇On as (N 〇〇< 〇〇Example 7 U~) (N oo r〇cs 〇 ON 〇0 〇〇Example 6 | κη CN oo 〇00 (N 〇〇<1 〇〇Example 5 | κη (N 00 〇(N 寸<N 〇(N 〇<3 〇〇Example 4 Yr) fN oo 〇oi (N 〇〇< 〇〇Example 3 yn ^Τ) (N oo 〇(N <N 〇〇< 〇〇Example 2 yr^ ψ · (N oo 〇CN 〇cs 〇〇os o 〇〇<] 〇〇Example 1 | vn r-^ tn CN oo 〇oi OS 〇〇Os o 〇〇< 〇〇Acrylic polymer-1 DPHA o H 00 cs oo Ethyl card Alcohol acetate D-918 UT771 CR-50-2 R-102 CR-90-2 CR-97 CR-50 CR-90 r*j cL CU UJ SO-C3 Left side of formula (X) Value △E*ab △E*ab Acrylic polymer Acrylic monomer Starting agent Epoxy compound 1 Titanium oxide zirconia cerium dioxide Mohs hardness index Thermal and ί optical cutting processability Applicability Developing 驿嗜 Φ 〇ΝΦ1牟) -35- 147625.doc 1363931 [Table 4]

比較例1 比較例2 比較例3 參考例1 調酉己成分 ί 量丙烯酸聚合物丙烯酸聚合物-1 15 15 15 15 丙烯酸單體 DPHA 5 5 5 5 起始劑 ΤΡΟ 2 2 2 2 環氧化合物 828 8 8 8 8 溶劑乙基卡必醇乙酸酯 30 30 30 30 氧化鈦 CR-50 40 CR-90 40 二氧化矽 S0-C3 20 莫氏硬度指標式(X)之左邊之值 2.1 2.1 1.9 - 評價财熱性 AE*ab 3.7 3.7 4.1 3.1 判定 X X X Δ 财光性 △E*ab 1.1 1.1 1.1 2.2 判定〇〇〇 △ 切割加工性判定 X X X △ 適用期判定〇〇〇〇顯影性判定〇〇〇〇Comparative Example 1 Comparative Example 2 Comparative Example 3 Reference Example 1 酉酉成分 ί 丙烯酸 Acrylic Polymer Polymer Acrylic Polymer-1 15 15 15 15 Acrylic Monomer DPHA 5 5 5 5 Starting Agent ΤΡΟ 2 2 2 2 Epoxy Compound 828 8 8 8 8 Solvent ethyl carbitol acetate 30 30 30 30 Titanium oxide CR-50 40 CR-90 40 Strontium oxide S0-C3 20 Mohs hardness index (X) to the left of the value 2.1 2.1 1.9 - Evaluation of the heat AE*ab 3.7 3.7 4.1 3.1 Judgment XXX Δ Photometric △ E*ab 1.1 1.1 1.1 2.2 Judgment 〇〇〇 △ Cutting processability judgment XXX △ Applicable period judgment 〇〇〇〇 developability judgment 〇〇〇〇

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實施例22 1 CN oo m 〇 Ό <N 〇 O) 〇〇〇〇 1實施例21 1 VI 00 〇 CO oi 〇 oo o 〇〇 < 〇〇實施例20 KTi tr> CN oo 〇 Ο) Ο) 〇〇 o 〇〇〇〇〇實施例19 vn <N oo 〇〇\ y-^ \〇 oi 〇 cn «-— 〇〇〇〇實施例18 | CN oo 寸 CN 〇 ON 〇〇〇〇實施例17 ^Τ) CN oo 〇 <Ν v〇 Cn) 〇 1— 〇〇〇〇實施例16 | (N oo 〇 ri CO CN 〇〇〇〇〇實施例15 (N oo 〇 CN m c-i 〇卜〇〇〇〇實施例14 | CN oo 〇 (N cs CN 〇 OO 〇〇〇〇實施例13 Γ—^ iT) <N oo 〇 CN o CN 〇〇 q 〇〇〇〇〇實施例12 CN oo 〇 <N o CN 〇〇 o 〇〇〇〇〇丙烯酸聚合物-2 DPHA o H oo (N oo 乙基卡必醇乙酸酯 D-918 UT771 CR-50-2 R-102 CR-90-2 CR-97 CR-50 CR-90 CU CU ρα SO-C3 式(X)之左邊之值 △E*ab △E*ab *=» 丙烯酸聚合物丙烯酸單體起始劑環氧化合物姨氧化鈦氧化锆二氧化矽莫氏硬度指標而才熱性耐光性切割加工性適用期顯影性踩ra嗜Φ〇Μ_拿） -37- 147625.doc 1363931 [表6]Example 22 1 CN oo m 〇Ό <N 〇O) 〇〇〇〇1 Example 21 1 VI 00 〇CO oi 〇oo o 〇〇< 〇〇Example 20 KTi tr> CN oo 〇Ο) Ο 〇〇o 〇〇〇〇〇Example 19 vn <N oo 〇〇\ y-^ \〇oi 〇cn «-- 〇〇〇〇Example 18 | CN oo 寸CN 〇ON 〇〇〇〇Implementation Example 17 ^Τ) CN oo 〇<Ν v〇Cn) 〇1—〇〇〇〇Example 16 | (N oo 〇ri CO CN 〇〇〇〇〇Example 15 (N oo 〇CN m ci 〇〇〇〇〇Example 14 | CN oo 〇(N cs CN 〇OO 〇〇〇〇Example 13 Γ—^ iT) <N oo 〇CN o CN 〇〇q 〇〇〇〇〇Example 12 CN oo 〇<N o CN 〇〇o 〇〇〇〇〇Acrylic Polymer-2 DPHA o H oo (N oo Ethyl carbitol acetate D-918 UT771 CR-50-2 R-102 CR-90- 2 CR-97 CR-50 CR-90 CU CU ρα SO-C3 The value of the left side of the formula (X) △ E*ab △E*ab *=» Acrylic polymer Acrylic monomer Starting agent Epoxy compound 姨TiO 2 zirconia 二矽 Mohs hardness index and heat resistance Light resistance cutting processability Applicability development step t 嗜〇Μ 〇Μ Take) -37- 147625.doc 1363931 [Table 6]

比較例4 比較例5 比較例6 參考例2 調西己成分 1 量丙烯酸聚合物丙烯酸聚合物-2 15 15 15 15 丙烯酸單體 DPHA 5 5 5 5 起始劑 ΤΡΟ 2 2 2 2 環氧化合物 828 8 8 8 8 溶劑乙基卡必醇乙酸酯 30 30 30 30 氧化鈦 CR-50 40 CR-90 40 二氧化矽 S0-C3 20 莫氏硬度指標式(X)之左邊之值 2.1 2.1 1.9 - 評價对熱性 △E*ab 4.0 4.1 4.5 3.3 判定 X X X △ 耐光性 △E*ab 1.3 1.3 1.3 2.3 判定〇〇〇 △ 切割加工性判定 Δ X X 〇適用期判定〇〇〇〇顯影性判定〇〇〇〇Comparative Example 4 Comparative Example 5 Comparative Example 6 Reference Example 2 Hydrazine component 1 Amount acrylic polymer Acrylic polymer-2 15 15 15 15 Acrylic monomer DPHA 5 5 5 5 Starting agent ΤΡΟ 2 2 2 2 Epoxy compound 828 8 8 8 8 Solvent ethyl carbitol acetate 30 30 30 30 Titanium oxide CR-50 40 CR-90 40 Strontium oxide S0-C3 20 Mohs hardness index (X) to the left of the value 2.1 2.1 1.9 - Evaluation of thermal △ E*ab 4.0 4.1 4.5 3.3 Determination XXX △ Light resistance △ E*ab 1.3 1.3 1.3 2.3 Determination 〇〇〇 △ Cutting processability judgment Δ XX 〇 Applicable period judgment 〇〇〇〇 developability determination 〇〇〇〇

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實施例47 (N OO O Ο) 〇〇 Ο) O 〇〇 X 〇 1實施例46 | m V) CN oo 5 o 〇〇〇 Ο r- 〇〇〇〇〇實施例45 W) ΙΛ 60 5 o 口〇〇 ν〇 ο 〇〇〇〇〇實施例44 ts OO 5 s o w-ϊ 〇〇 w-ί 〇〇〇 ο ο 實施例43 Vi 〇i 一 in o <N tJ· «r> rs 〇 ts 〇 X 〇〇實施例42 v〇 fS r- rs Q\ 〇〇 oo 〇〇 X 〇〇實施例41 (N CO o 〇\ 〇〇〇\ 〇〇 <] 〇〇實施例40 ITJ <N 00 o 口 S 〇〇 00 〇〇〇〇 χ(溶解）實施例39 w-> (N 00 o Os 〇 Ο oo o 〇〇〇〇 χ(不溶解）實施例38 (N 00 o 〇 r4 〇〇 <> 〇〇 < 〇〇實施例37 s <N 00 s o (N <N 口〇 (N 〇 X 〇〇實施例36 s (N 00 o O) m oi 〇 VI 〇 X 〇〇丙烯酸聚合物-2 丙烯酸聚合物-3 丙烯酸聚合物-4 丙烯酸聚合物-5 丙稀酸聚合物-6 DPHA 〇 H 00 (N oo Irganox 1010 Ο 三環己基膦乙基卡必醇乙酸酯 a- D-918 式(X)之左邊之伹 △E*ab τ AH*ab W 丙烯酸聚合物 |丙烯酸單體起始劑 |環氧化合物 i 抗氡化劑 ί 氧化鈦莫氏硬度指標耐熱性耐光性切割加工性適用期顯影性 •41 · 147625.doc 1363931 與不含無機填充料之參考例1之感光性組合物之情形相比較’含有上述藉由煮沸法所測定之pH值為6.8以上、u 以下之驗性無機填充料的實施例丨〜丨〇之感光性組合物幾乎未兴變’耐熱性良好。進而可知，於含有由表1所示之有機材料進行表面處理之無機填充料的實施例之感光性組合物之情形時，可進一步改善黃變。並且可知，於含有表面處理時使用鹼性烷醇胺之無機填充料的實施例1之感光性組合物之情形時，可進一步改善黃變。可知’含有上述藉由煮沸法所測定之pH值未達6.8之酸性無機填充料的比較例1〜3之感光性組合物之情形較參考例1之感光性組合物之情形更易黃變。進而可知，實施例11 ~47之感光性组合物中，保護膜亦幾乎未黃變，对熱性良好。【圖式簡單說明】圖1係示意地表示包括使用本發明之一實施形態之感光性組合物而形成之保護膜之led元件的部分切口正面剖面圖。【主要元件符號說明】 1 LED元件 2 基板 2a 上表面 3 保護膜 3a 上表面 4a、4b 電極 147625.doc • 42- 1363931 7 7a 8a、8b 9a、9b LED晶片下表面端子焊錫Example 47 (N OO O Ο) 〇〇Ο) O 〇〇X 〇1 Example 46 | m V) CN oo 5 o 〇〇〇Ο r- 〇〇〇〇〇 Example 45 W) ΙΛ 60 5 o 〇〇 OO 〇〇〇〇〇〇〇〇〇〇〇 44 44 44 44 44 OO OO OO OO OO OO OO OO OO 实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施实施Ts 〇X 〇〇Example 42 v〇fS r- rs Q\ 〇〇oo 〇〇X 〇〇Example 41 (N CO o 〇\ 〇〇〇\ 〇〇<] 〇〇 Example 40 ITJ < N 00 o S S 〇〇 00 〇〇〇〇χ (dissolved) Example 39 w-> (N 00 o Os 〇Ο oo o 〇〇〇〇χ (insoluble) Example 38 (N 00 o 〇r4 〇〇<>〇〇< 〇〇Example 37 s <N 00 so (N <N 〇(N 〇X 〇〇Example 36 s (N 00 o O) m oi 〇VI 〇X 〇〇Acrylic Polymer-2 Acrylic Polymer-3 Acrylic Polymer-4 Acrylic Polymer-5 Acrylic Polymerization -6 DPHA 〇H 00 (N oo Irganox 1010 Ο tricyclohexylphosphine ethyl carbitol acetate a- D-918 左边E*ab τ AH*ab W acrylic polymer on the left side of formula (X) |Acrylic monomer starter|Epoxy compound i Anti-tantalizing agent ί Titanium oxide Mohs hardness index Heat resistance Light resistance Cutting processability Applicability developability•41 · 147625.doc 1363931 Reference example without inorganic filler In the case of the photosensitive composition of 1, the photosensitive composition containing the above-mentioned inorganic inorganic filler having a pH value of 6.8 or more and less than u measured by the boiling method is hardly changed. The heat resistance was good. Further, in the case of the photosensitive composition of the example containing the inorganic filler surface-treated by the organic material shown in Table 1, the yellowing was further improved. Further, it is understood that the yellowing can be further improved in the case of the photosensitive composition of Example 1 which uses an inorganic filler of a basic alkanolamine in the surface treatment. It is understood that the photosensitive compositions of Comparative Examples 1 to 3 containing the above-mentioned acidic inorganic filler having a pH of less than 6.8 as measured by the boiling method are more yellowish than the photosensitive composition of Reference Example 1. Further, it was found that in the photosensitive compositions of Examples 11 to 47, the protective film was hardly yellowed, and the heat resistance was good. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially cutaway front cross-sectional view schematically showing a LED element including a protective film formed using a photosensitive composition according to an embodiment of the present invention. [Main component symbol description] 1 LED component 2 Substrate 2a Upper surface 3 Protective film 3a Upper surface 4a, 4b Electrode 147625.doc • 42- 1363931 7 7a 8a, 8b 9a, 9b LED wafer Lower surface Terminal Solder

147625.doc -43-147625.doc -43-

Claims

1363931 ——_ Announcement, VII, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ At least one of the polymerizable hydrocarbon polymer and the inorganic filler, and the inorganic filler is as follows: a solution obtained by adding 5 g of the inorganic filler to 100 mL of pure water is heated to boil 5 After a minute, it is allowed to stand until it reaches 231, and a boiling treatment liquid is obtained. Then, water which is evaporated by boiling is added to the obtained boiling treatment liquid to make the amount of water 100 mL, and the pH value of the obtained solution is measured. A value of 6 8 or more and 11 or less; and the content of the inorganic filler is 3% by weight or more and 8% by weight or less. 2. The photosensitive composition of claim 1, wherein the inorganic filler has an energy band gap of 2.5 eV or more and 7 eV or less. 3. The photosensitive composition according to claim 1 or 2, wherein the inorganic filler has a refractive index of 1 > 8 or more at 465 nm, and the inorganic filler is a white filler. 4. The photosensitive composition of claim 3, wherein the inorganic filler is rutile-type titanium oxide. 5. The photosensitive composition of claim 1 or 2, wherein at least one of the above inorganic fillers is coated with an alkali metal oxide or an alkali metal hydroxide. 6. The photosensitive composition of claim 5, wherein the metal element constituting the basic metal oxide or the alkali metal hydroxide is selected from the group consisting of town, error, decoration, recording, recording, enthalpy, and skill. At least one of them. 147625-1001020.doc 1363931. The photosensitive composition of claim 5, wherein the inorganic filler is coated with a coating material containing oxidation #. The photosensitive composition of claim 1 or 2, which further comprises a compound which is reactive with an acidic site of the above inorganic filler. The photosensitive composition of claim 8 wherein the compound reactive with the acidic portion of the above inorganic filler is a basic compound. The photosensitive composition of claim 9, wherein the basic compound is at least one selected from the group consisting of a polyhydric alcohol, an alkanolamine, and an alkoxyline. The photosensitive composition according to claim 1 or 2, wherein the inorganic filler is surface-treated by a compound reactive with an acidic portion of the inorganic filler. The photosensitive composition of claim 11 wherein the compound reactive with the acidic portion of the above inorganic filler is a basic compound. 13. The photosensitive composition according to claim 12, wherein the basic compound is at least one selected from the group consisting of a free polyol, an alkoxylated amine, and an alkoxylate. 14. The photosensitive composition according to claim 1 or 2, wherein the polymerizable hydrocarbon monomer has two or more polymerizable unsaturated groups, and is used in an acetonitrile:water=1:1 (volume ratio) solution. When the polymerizable hydrocarbon monomer was measured by liquid chromatography (LC/MS) for analysis, the peak area of the component having a fragmentation peak of 500 or less by mass spectrometry was 30% or more of the total peak area. 15. The photosensitive composition of claim 1 or 2 wherein the above polymerizable hydrocarbon monomer is 147625-1001020.doc 16. 16. The above has a weight of 50 parts by weight to 17.18 19 20. 21. 22. The average molecular weight is 700 or less. The photosensitive composition according to claim 1 or 2, which further contains the above-mentioned compound having an @-form ether skeleton, and the content of the compound of the above-mentioned polymerizable hydrocarbon polymer in an amount of 1 part by weight of the ether skeleton is 〇1 Parts by weight or more. The photosensitive composition of claim 16 wherein the compound having a cyclic ether skeleton is a cyclic compound having a oxime ether skeleton and having no linear ether skeleton. The photosensitive composition of claim 16, wherein the ring (four) skeleton is an oxocyclohexane skeleton. The photosensitive composition of claim 1 or 2, which further comprises an antioxidant having a Lewis basic moiety, such as the photosensitive composition of claim 19, wherein the antioxidant is selected from the group consisting of phenolic antioxidants, At least one of a group consisting of a phosphorus-based antioxidant and an amine-based antioxidant. The photosensitive composition of the item 1 or 2, wherein at least one of the polymerizable hydrocarbon monomer and the polymerizable hydrocarbon polymer contains one or more polymerizable unsaturated groups and two or more carboxyl groups, and The polymerizable hydrocarbon monomer and the polymerizable hydrocarbon polymer as a whole are as follows: a weight average molecular weight of 5,000 to 5 Å, _, a solid content of an acid value of 30 to 150 mg KOH/g, and a double bond equivalent of 5 〇~2 〇〇〇g/eq. The photosensitive composition of claim 1 or 2, wherein the polymerization of 147625-1001020.doc 1363931 hydrocarbon monomer is in a total of 1% by weight of the above polymerizable tobacco monomer and the above polymerizable hydrocarbon polymer. The content is 5% by weight or more and 50% by weight or less. The photosensitive composition of claim 1 or 2, wherein the content of the polymerizable hydrocarbon monomer having an alcoholic hydroxyl group in 100% by weight of the above polymerizable hydrocarbon monomer It is 15% by weight or less. The photosensitive composition according to claim 1 or 2, wherein the inorganic filler satisfies the following formula (X): [{(Mohs hardness of the first inorganic filler) x (photosensitive composition after curing) Content (% by volume) of the first inorganic filler in the volume %)}+ {(Mohs hardness of the second inorganic filler) x (the second inorganic filler in the photosensitive composition after curing 1% by volume) Content (% by volume) of the material) + (or the Mohs hardness of the 11th inorganic filler) x (content of the n-th inorganic filler in the photosensitive composition after curing 1% by volume) ))]$ 4 ......(χ). The photosensitive composition according to claim 2 or 2, further comprising a solvent, wherein the solvent has a dipole moment of 1 Debye or more. The photosensitive composition according to claim 1 or 2, wherein the inorganic filler is as follows: a solution obtained by adding 5 g of the inorganic filler to 1 mL of pure water is heated to boil 5 After a minute, let stand until it reaches 23.匸获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得获得 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The following values. The photosensitive composition of claim 26, wherein the inorganic filler is rutile titanium oxide having a refractive index of 1.8 or more at 465 nm. A solder resist composition according to any one of claims 1 to 27, which is a photosensitive composition. 147625-100iQ20.doc S